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A.
B.
C.
D.

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A.
B.
C.
D.

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(C, 106 37)
A.
A.
B.
C.
D.
A.aliasing artifact
B.truncation artifact
C.zipper artifact
D.shadowing artifact
(C, 102 48)


A.
B.
C.
D.
A.RF
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A.RF
(C, 97 39)

(B, 97 45)
A.GE
B.FSE
A.
B.
C.
A.
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A.aliased frequencyactual frequency
B.high-pass filter
A.3D imaging
B.fast scanning
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(C, 109 45)
A.
B.
C.
D.
C. NEX
D. FOV
A.
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C.gradient echo pulse sequence
D.echo planar pulse sequence
(B, 107 50)
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C. FOV
C.TR
D.TE
A.eddy current
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(D, 107 52)
A.aliasing
B.truncation
C.motion artifactin phase
D.truncation artifactout phase

A.2
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A.
B.
A. TR
A.
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A.
B.
C.
D.
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A. RF shielding
A. FOV
A.oversampling
B.undersampling

D.metallic foreign body
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A.truncation artifact
B.flow artifact
C.aliasing artifact
D.motion artifact
(D, 103 43)
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A.partial volume
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boundary effectartifact
A.aliasing artifact
B.cross-talk artifact
A.image processing
D.over-sampling
A.fat-suppression techniques
(C, 101 42)
62. MRI
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A.truncation artifact
B.cross-talk artifact
C.aliasing artifact
D.flow artifact
(D, 101 47)
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A.wraparound artifact
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A.
B.
C.
D.
C.TR
D.TE
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A.chemical-shift artifact
B.truncation artifact
A.chemical shift
B.motion artifacts

A.
B.
C.
D.
A.chemical-shift artifact
B.motion artifact
C.aliasing artifact
D.RF noise
(C, 97 51)
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A.
B.
C.
D.
A. shimming
A.
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D.cross-talk effect
A. FOV
D. sampling time
A.
B.
C.
D.