zierick smt headers · a manual screen printer with an 0.008" thick stainless steel stencil...

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Need custom pin headers? Zierick headers are available with pins missing at positions you specify. We can also provide pins of differing lengths on a single header. Now that’s flexibility. It gets better. These headers promote capillary action of the reflowing solder to correctly position even misplaced or off center headers on the PCB. There is no other header we know of that can correct an assembly mistake during reflow. You’re familiar with the benefits of using capillary action: stronger solder joints, assured co-planarity, and greater locational accuracy on the solder pad. The header assembly is designed to allow it to move with the PCB it’s placed onto, significantly reducing header warpage. This results in proper individual pin soldering position and high reliability connections. The result, of course, is not only less rework, but also more reliable connections and higher quality assemblies. The pin header is one more innovative product in the Zierick SMT connection line. Zierick SMT Headers Custom engineered with your process in mind IN THIS ISSUE Cover: • Header Flexibility • Challenge Us! Page 2: • New Zierick Website • JST Connects with Zierick • Events & Shows Page 3: • Technical Report: Placement of Surface Mount Terminals Page 4: • Zierick Challenge Manufacturing Corporation www.zierick.com 800•882•8020 Winter 2001-2002 Challenge Us! Challenge Us! Challenge Us! What's your biggest design challenge? Too many parts out of tolerance? Bottleneck in production? Too much rework? Zierick's specialty is designing connectors that answer your product requirements, while accommodating your production needs. Many of our connector designs have become industry standards, and our assembly equipment offers high performance for relatively small capital investment. What can we do for you? Challenge us and let the next innovation be yours. Please call 800 882 8020 or e-mail [email protected] with your technical question. Our R&D Department will provide the answer. Then look for success stories in future issues of InterConnections. The next one could be yours. Challenge Us!

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Page 1: Zierick SMT Headers · A manual screen printer with an 0.008" thick stainless steel stencil was used. Two resin-based, no-clean, solder creams were used for pitches as small as 0.025"

Need custom pin headers?Zierick headers are available with pins missing at positions you specify. We canalso provide pins of differing lengths on asingle header. Now that’s flexibility.

It gets better. These headerspromote capillary action of the reflowingsolder to correctly position even misplacedor off center headers on the PCB. There isno other header we know of that can

correct an assembly mistake during reflow.You’re familiar with the benefits of usingcapillary action: stronger solder joints,assured co-planarity, and greaterlocational accuracy on the solder pad.

The headerassembly isdesigned to allow itto move with thePCB it’s placedonto, significantlyreducing headerwarpage. Thisresults in properindividual pinsoldering positionand high reliabilityconnections. Theresult, of course, isnot only less rework,

but also more reliable connections andhigher quality assemblies.

The pin header is one moreinnovative product in the Zierick SMT connection line.

Zierick SMT HeadersCustom engineered with your process in mind

IN THIS ISSUE

Cover:

• Header Flexibility

• Challenge Us!

Page 2:

• New ZierickWebsite

• JST Connectswith Zierick

• Events & Shows

Page 3:

• Technical Report:Placement ofSurface MountTerminals

Page 4:

• Zierick Challenge

Manufacturing Corporationwww.zierick.com800•882•8020

Winter 2001-2002

Challenge Us!Challenge Us!

Challenge Us!What's your biggest design challenge? Too many parts out of tolerance? Bottleneckin production? Too much rework? Zierick's specialty is designing connectors thatanswer your product requirements, while accommodating your production needs.Many of our connector designs have become industry standards, and our assemblyequipment offers high performance for relatively small capital investment. What canwe do for you? Challenge us and let the next innovation be yours.

Please call 800 882 8020 or e-mail [email protected] with your technicalquestion. Our R&D Department will provide the answer. Then look for success storiesin future issues of InterConnections. The next one could be yours.

Challenge Us!

Page 2: Zierick SMT Headers · A manual screen printer with an 0.008" thick stainless steel stencil was used. Two resin-based, no-clean, solder creams were used for pitches as small as 0.025"

131 Radio Circle • Mount Kisco, NY 10549 • www.zierick.com • 800•882•8020

Contact Us

Manufacturing Corporation131 Radio Circle

Mt. Kisco, New York 10549(914) 666 2911800 882 8020

Fax (914) 666 0216Email: [email protected]

www.zierick.com

Reach for Your MouseZierick Has Built a Better Website

Zierick has entirely redesigned and expandedwww.zierick.com, making it easier to navigate andricher in content. Compare our website with anyother site for convenience, content and design."Drop down" menus along with "jump" menus let yougo from any page to any other page without havingto scroll in search of a link. Each page contains apowerful search engine in thesame position at

the top right so you don’t have to return to the homeor previous page to enter a part number orcomponent type. Reference pages from our on-linecatalogs are now available in PDF format so youcan easily print files.

We've also posted Catalog 38, Surface Mount &Through Hole Interconnection & Assembly Solutionsand Catalog 35, Interconnection Hardware alongwith datasheets, brochures, and other usefulinformation. The complete product offering is fullydescribed includingdrawings, specs,and orderinginformation.

Visit us atwww.zierick.comtoday and tell uswhat you think.

JST Connectswith Zierick for high qualityJapanese manufacturerJST, maker of cableassemblies, contacts,and other interconnec-tion parts, is using (andcrediting) Zierick com-ponents on its sampleboards. Quality sellsquality, and JST hasfound a willing partnerin Zierick.Connect with us

at these showsAPEX, Stand # 5049San Diego, CA, January 20 - 24, 2002web link: www.goapex.org

SMT/HYBRID/PACKAGING, Booth 1-123MESAGO Messe & Kongress GmbH Nuremberg Germany, June 18 - 20, 2002web link: www.mesago.de

Assembly Tech ExpoDonald E. Stephens Convention Center, Booth #54050Rosemont, IL, September 24-26, 2002Visit www.zierick.com for a guest pass to the showweb link: www.atexpo.com

Page 3: Zierick SMT Headers · A manual screen printer with an 0.008" thick stainless steel stencil was used. Two resin-based, no-clean, solder creams were used for pitches as small as 0.025"

131 Radio Circle • Mount Kisco, NY 10549 • www.zierick.com • 800•882•8020

In response to the considerable interest generated byZierick’s "capillary-action" SMT terminals, we presenthere a description of one of the conclusive experimentsperformed during development of these SMT parts.

The intent of the experiment was to identifywhich variables had the most significant effect on

component placement location and solder jointreliability. Therefore, it was imperative to test a variety ofPCB land sizes with aligned and offset stencil and withaligned and offset terminal placement. Both solderpaste location and terminal location were measuredbefore and after solder reflow.

A 3" x 3", 1/16" thick, FR-4 board with 1-ounce copperpads was used with a variety of pad sizes andpitches. Figure 1 shows the test board layout. Thehighlighted pad sizes were the test pads. Thirtyboards were tested with 3,000 components placed.A manual screen printer with an 0.008" thick stainlesssteel stencil was used. Tworesin-based, no-clean, soldercreams were used for pitchesas small as 0.025" and 0.015".Solder paste thickness beforereflow ranged from 0.006" to0.010".

A vacuum componentplacement system placedsome components on centerand some components offseton the pads. The offset padshad three combinations: 1)both component and solderpaste were offset 0.015" insame direction so thecomponent was lined upexactly with the paste but notthe pad, 2) solder paste andcomponent were offset 0.015"in both X and Y directions butin opposite directions relative to the pad so that total component/paste offset was 0.030", and 3)terminals lined up exactly with solder pad, but solderpaste was offset 0.015" in both directions.

The terminals were reflowed using aconvection conveyor oven. A temperature profilewas taken by attaching a thermocouple near thesolder joints. The PCB pads, stenciled solder paste,solder paste thickness, and pin location before andafter reflow were measured with an optical

coordinate measuring system. Pin/solder jointstrength was determined by pushing with a forceparallel and also perpendicular to the pin. Thequality of the fillet was visually inspected.

After reflow, the pins with capillary action (with padsize close to the pin base size) stay exactly wherethey were placed before reflow. These pins alsoremained perfectly perpendicular to the PCB, unliketheir non-capillary action counterparts, while solder

joint pull strength was above 30Lbs in all cases.If you would like the technical data and

analysis, contact us and ask for the paper SurfaceMount Posts, IDCs, Receptacles, with related Testand Design Considerations.

.000

.200

.400

.600

.800

1.000

1.200

1.400

1.600

1.800

2.000

2.200

2.400

2.600

2.800

.000

.200

.350

.500

.650

.800

.950

1.118

1.318

1.516

1.725

2.025

2.400

.000

.200

.300

.400

.500

.600

.700

.800

.900

1.00

0

1.10

0

1.20

0

1.30

0

1.40

0

1.60

0

1.75

0

1.90

0

2.05

0

2.20

0

2.36

0

2.50

0

2.65

0

2.80

0

(27) .085 x.085 Pads.150 Center

(27) .125 x.125 Pads.150 Center

(18) .150 x.150 Pads.200 Center

(9) .150 x.250 Pads.325 Center

(8) .250 x.300 Pads.325 Center

(39) .060 x.060 Pads.100 Center

(39) .070 x.070 Pads.100 Center

(39) .080 x.080 Pads.100 Center

(39) .080 x.080 Pads.100 Center

(39) .085 Qis Pads.100 Center

(39) .085 01s Pads w/ .032 Qis

Plated Thru Hole.100 Center

(39) .080 x .080 Pads w/ .045 Qis

Plated Thru Hole.100 Center

Placement of Surface Mount Terminals

Data Analysis

Figure 1

The Experiment

Page 4: Zierick SMT Headers · A manual screen printer with an 0.008" thick stainless steel stencil was used. Two resin-based, no-clean, solder creams were used for pitches as small as 0.025"

131 Radio CircleMount Kisco, NY 10549www.zierick.com

Check your mail box to win an XBox!The Zierick Challenge is coming soon—and, with itis your chance to win! You’ve seen Zierick solvecustomers’ challenges for year, and now it’s yourturn. Meet the challenge by answering five excitingbrain teasers—one with every mailing we send(Or you can visit www.zierick.com/challenge to enter.)Answer correctly and you could win one of theseexciting prizes: the computer simulation game

Sim City 3000 Unlimited, a high-tech and practicalturbometer, an electronic tape measure, a BruntonSherpa environmental data gatherer, or a hand-heldglobal positioning system.

The more teasers you answer (limit one entry perperson/per puzzle), the greater your chances ofwinning the Grand Prize—one of three Microsoft XBoxgame consoles.

So, visit www.zierick.com, and be looking for yourchance to win. Amaze your friends, stump your col-leagues, and accept the Zierick Challenge!

Limit one entry per person, per puzzle.

PresortedStandard

U.S. PostagePAID

Chicago, ILPermit No. 3193