x4-2b_hw_toi_aug_2013_rev_02
DESCRIPTION
oracleTRANSCRIPT
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Sun Confidential: Need to Know
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X4-2B Services TOI Architecture and features Revision 0.2
Wei Lu
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2012 Oracle Corporation. - Proprietary and Confidential 3
NDA Notification This presentation contains information related to projects that are currently in planning and/or development stages. This information represents the current intentions of Oracle, Inc. However, all aspects of these projects, including, but not limited to funding, availability, shipping dates, configurations, capacities, performance, and all other characteristics are subject to change and/or cancellation without notice.
This material is confidential to Oracle and should be disclosed to non-employees only under the terms of an executed confidential-disclosure agreement.
Distribution of this material to Oracle Field Representatives should be done through the GSO CDA process. Under no circumstances should these roadmaps be given directly to a Oracle Field Representative.
The information contained herein is considered privileged, confidential and protected from disclosure. If you are not the intended recipient or their employee/agent responsible for its delivery, you are requested to refrain from any duplication or distribution of this message or its contents, in respect of the rights of the designated recipient and sender, and to delete it from your computer.
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2012 Oracle Corporation. - Proprietary and Confidential 4
Note
The following is intended to outline our general product direction. It is intended for information purposes only, and may not be incorporated into any contract. It is not a commitment to deliver any material, code, or functionality, and should not be relied upon in making purchasing decisions. The development, release, and timing of any features or functionality described for Oracles products remains at the sole discretion of Oracle.
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Agenda
Mensa Overview
Intel Romley Platform
Mensa Architecture
Mensa Components
Mensa Remote Management
Appendix
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Mensa Overview
X4-2Bserver module (Mensa+) for
the Sun Blade 6000 chassis:
A90-B-N (aka C10+)
A90-D (aka C10 M2)
Sun Blade 6000 chassis can hold
up to ten server modules
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Oracle X4-2B Blade Server
Compute
2x Intel Ivy Bridge-EP CPUs
1x PCH southbridge
24x DDR3 RDIMMs
Up to 768 GB of memory
I/O
2x PCIe 2.0 EM slots (8x lane per EM)
2x PCIe 2.0 FEM slots (8x Lane per FEM)
2x GbE ports (Powerville)
1x REM Slot (8x lane/slot)
4x USB 2.0 (two front, two internal)
2x USB 2.0 dongle
1x VGA
AST2300 BMC with remote KVMS
1x Serial Port
4x hot swap 2.5 SAS/SSD drive bays
4x SAS ports (REM)
2-Socket, 24DIMM Enterprise-Class System Blade
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Mensa Board Layout
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Mensa vs Mensa+
Mensa
Sandy Bridge-EP CPU
Socket R
Max N of cores - 8
24 DDR3 DIMMs, 384GB Max
Mensa+
Ivy Bridge-EP CPU
Socket R
Max N of cores - 12
24 DDR3 DIMMs, 768GB Max
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Intel Product Name Decoder
Before Launch Date After Launch Date
Ivy Bridge-EP Socket R
Intel(R) Xeon(R) E5-2697 v2 12-core 2.7GHz 130W Intel(R) Xeon(R) E5-2690 v2 10-core 3.0GHz 130W Intel(R) Xeon(R) E5-2650 v2 8-core 2.6 GHz 95W Intel(R) Xeon(R) E5-2630 v2 6-core 2.6GHz 60W Intel(R) Xeon(R) E5-2609 v2 4-core 2.5GHz 60W
Patsburg - J Intel(R) C600 series chipset
Powerville I350-AM2
Romley-EP Platform Intel(R) Xeon(R) processor E5-2600 v2 product family
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Mensa+ Architecture
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Mensa Block Diagram 2 Socket Configuration
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Mensa Front View
1 Locate Button and LEDWhite
2 Ready to Remove LEDBlue
3 Fault- Service Action Required LEDAmber
4 PowerOK LEDGreen
5 On/Standby Power button
6 NMI Reset button (Service only)
7 RFID tag (with serial number)
8 USB ports (2)
9 Universal Connector Port (UCP)
10 Hard Disk Drive (HDD0) *
11 Hard Disk Drive (HDD1) *
12 Hard Disk Drive (HDD3) *
13 Hard Disk Drive (HDD2) *
14 Ejector levers
* HDDs are optional
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Mensa Rear View
1 Power connector
2 I/O Connector
3 Rear cover (remove before
inserting into chassis)
4 USB flash drives 2, 3
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Mensa - Top View
REM
Powerville
PCH
USB (Internal)
FEM Slots
CPU1
CPU0
FPGA REM
SAS
Disk
Bays
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Mensa+ Components
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Mensa Components
1 HDD/SSD
2 REM
3 CPU
4,6 Heatsink
5 FEM
7 USB stick
8 DIMM
9 Battery
10 Enclosure
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CRU vs. FRU, Hot vs. Cold
Hot service CRUs: Drives
EMs
Cold service CRUs DIMMs or fillers
REM
FEMs
System Battery
SAS Cable
Internal USB sticks
FRUs Motherboard
Processor and heat sink
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Memory Architecture
Each processor has 4 DDR3 memory channels (A,B,C,D)
Each DDR3 memory channel supports up to 3 DIMMs for a total of 12 DIMMs per processor
X4-2B supports 1 DIMM per channel, 2 DIMMs per channel, and 3 DIMMs per channel across both sockets.
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Mensa Memory Bank Layout
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Supported DIMMs
DDR3 LVDIMMs (1.35V)
8 GB DDR3-1600 DIMM
16 GB DDR3-1600 DIMM
DIMM slot filler panels
32 GB DDR3-1600 LRDIMM (Post RR)
(1DPC:1600 2DPC:1600 3DPC:1066)
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Memory Population
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Memory Fillers (No Need in X4-2B)
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REMs
Niwot REM (LSI) (SG-SAS6-R-REM-Z)
SAS Eight Port (2 X4) 6Gb RAID PCI-E Gen2 HBA, Coyote Replacement (RAID 0, 1, 10, 5, 6)
Erie REM (LSI) (SG-SAS6-REM-Z)
SAS Eight Port (2 X4) 6Gb RAID PCI-E Gen2 HBA.
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FEMs
Dual 10Gb Ethernet, PCIe 2.0 (Intel Niantic - X4871A-Z)
Required to support OPUS
Passthru FEM: (aka Hunter - X4263A-N)
Nalia FEM (7100283- ATO, 7100633 - PTO)
For SOL_NEM
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PEMs PEMs
Combo GbE/FC Emulex 2-port 8Gb FC, 2-port GbE
Qlogic 2-port 8Gb FC, 2-port GbE
10GbE/1GbE Quad GbE Copper / Fiber PCIe 2.0 (Intel, Powerville)
Intel 2-port SFP+ 10GbE NIC
Intel Niantic Copper: Dual port 10GbE Twinville
SAS2 Erie-EM (No RAID. Uses IT fw)
IB PCI-E QDR IB-HCA PCI-E Gen2 Mellanox ConnectX-2
Based
FC/FcoE (Ganymede) Emulex 2 Port 16Gb FC or 10Gb FcoE
Qlogic 2 Port 16Gb FC or 10Gb FcoE
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NEMs
Sun Blade 6000 10-Port GbE Pass-Thru NEM (X4250A-N)
Sun Blade 6000 Ethernet Switched NEM 24p 10GE (OPUS - X2073A-N)
Sun Blade 6000 Virtualized 40GbE NEM (SOL_NEM - 7100090)
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Internal Storage - HDDs
Mensa supports up to 4 Internal HDDs
300GB/600GB/1.2TB 10000 rpm 2.5-inch SAS2 HDDs with Marlin bracket
400GB 2.5-inch SATA Solid State Disks (SSDs) with Marlin bracket
HDD Filler should be used in case when HDD is not installed
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Internal Drives Mixing Rules
Mixing of hard disk technologies (e.g., SAS HDD and SATA SSD) is allowed within the 4 internal drive slots as long as they are in separate RAID volumes, or if treated as JBOD.
Within the RAID volume, the drives must be identical (capacity and type)
For example, a RAID volume with two 300GB/10K SAS HDDs is supported, but a RAID volume with a 300GB/10K SAS HDD and a 600 GB/10K SAS HDDs is not supported.
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Cabling (Not support)
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USB
2 Front USB2 slots
2 Internal USB2 slots
Supplied USB Drive USB Thumbdrive (USB 2.0
compliant) 4GB, MLC, USB-2, SBC, RoHS-6 Compliant
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UCP Dongle
1 Video cable
2 Serial console
3 USB (x2)
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Mensa Front Panel LEDs & BUTTONS
N Name Color
1 Locate LED/button White
2 Ready to Remove LED Blue
3 Service Action Required LED Amber
4 Power/OK LED Green
5 Power button None
6 NMI button None
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Fault Tracing
Fault Remind button helps identify or locate a faulty component even after the blade has been removed from chassis
Amber fault LED of these components will be lit by Fault Remind button
Processors
DIMMs
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Blade cooling
No fans are used on the Mensa blade, cooling is provided by the C10 chassis.
Airflow is front to back, in at the front panel, through the DIMM memory arrays and CPUs, and out the back
The following blade components have heatsinks:
Processors
Patsburg
Powerville
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Mensa Remote Management
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Service Processor
Based upon the Aspeed AST-2300 integrated processor
BMC provides industry standard IPMI feature set
Remote KVMS over IP
Serial port
Ethernet access to SP through a dedicated C10 10/100BaseT management port,
and optionally through one of the host GbE ports through NCSI interface
Front side KVM with Dongle
Support for in-system upgrade (BIOS, CPLD, HPC, etc.)
256MB DDR3 Memory
32MB Flash
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Oracle ILOM Key Functions
Management Interfaces CLI, IPMI
Firmware Updates
Remote Host Management
Inventory and Component Management
System Monitoring and Alert/Fault Management
Thermal and Fan Control
User Account Management
Power Consumption Management
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Appendix
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Mensa SMBUS BLOCK
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Memory Population Rules
Rule1: Always populate the channels as follows
* Fill up all Blue Sockets
* Next, fill up all White sockets
* Finally, fill up the Black sockets
This is known as the "fill farthest" approach to DIMM install. Always populate the DIMMs furthest from the processor (blue sockets) first.
Example: A processor with 4 DIMMs. Install 4 DIMMs in Blue sockets D0, D3, D6 and D9.
Example: A processor with 8 DIMMs. Install 4 DIMMs in Blue sockets D0, D3, D6 and D9, and 4 more DIMMs in the WHITE sockets D1, D4, D7 and D10.
Example: A processor with 12 DIMMs. Install DIMMs in all the sockets
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Memory Population Rules, 2
Rule 2: Memory symmetry across processors is required. Processor #1 memory must match processor #0 memory, in placement, type, size, capacity, frequency and voltage.
Rule 3: Each processor can support single DIMM, two DIMMs, three DIMMs or four DIMMs per color socket set
Rule 4: Within every set of 4 DIMMs (e.g., blue socket set, white socket set, black socket set), mixing/matching of different size, memory speed and voltage is NOT ALLOWED Memories in D0, D3, D6 and D9 must be all the same.
Next, memories in D1, D4, D7 and D10 must be all the same, etc. While doing this, Rule 2 must be maintained.
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Memory Population Rules, 3
Rule 5: Mixing and matching of different size, voltage and speed across different 4 DIMM sets is allowed. For example, memories in D0, D3, D6, D9 (blue sockets) must have the same size. But, they do not have to match memory size/voltage/speed in D1, D4, D7, D10 (white sockets). Note: When mixing speed across different 4 DIMM sets, all memory will be tuned to the slower speed.
Rule 6: Mixing of different DIMM technology is not supported. The blade must be all RDIMMs.
Rule 7: Each processor can support a maximum of: * 12 single-rank (SR) or dual-rank (DR) DIMMs; or * 12 Load Reduced (LR) DIMMs;
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Memory Population Rules, 4
Rule 8: For maximum performance, apply the following rules:
* DIMMs can run in one of the 2 speeds: 1600 and 1067MHz.
DIMM speed rules are: (SR=single rank; DR=dual rank; LR=Loading reduced)
* Memory bus speed also depends on processor SKU.
1. 1DPC or 2DPC (SR/DR/LR) = 1600 MHz
2. 3DPC (SR/DR/LR) = 1067 MHz
Rule 9: Mixing different size DIMMs:
Farthest socket on a channel gets highest density DIMM,
second socket gets the next highest density, etc
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Sun Confidential: Need to Know