wrap up xband accelerating structures review 24-25.11 · • describe/put together existing...
TRANSCRIPT
Wrap up Xband accelerating structures review 24-25.11.2014
N. Catalan Lasheras,
https://indico.cern.ch/event/346988/
Background
• A number of the collaborators have participated in the assembly of X-band structures
– KEK/SLAC< CEA, Tsinghua University have successfully manufactured/assembled structures
– PSI, CIEMAT, SINAP, Lancaster university are joining the effort
• Ultimately, the whole manufacturing and assembly process should be accomplished by a commercial company
– To have a real estimate of the CLIC structure costs
– Needs an effort towards cost-driven design
• Document all manufacturing procedures currently used for putting together CLIC AS
– With references, scientific or historical background
– Defining a quality assurance program in parallel
• Extract procedures for off-site manufacturing
– Which steps can be let to the different establishments?
– What measurement will ensure a uniform quality?
• Write specifications for an industry built structure
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Goals of the review
• Describe/put together existing manufacturing steps
– Conditions, procedures, tests, etc.
• Verify and agree on the procedures
• Bring short term modifications
– To be implemented already in 2015
• Propose longer term modifications, studies or R&D efforts
– There will not be time for discussing all in detail but it will be most useful to have a list of potential directions to explore
– In coordination with other CLIC-RF work packages
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Participants
31 participants including outside laboratories
D. Schulte, CERN/ABP
PH. Lebrun, S. Stapnes, CERN/DG
S. Atieh, A. Cherif, G. Favre, M. Garlache, A. Perez Fontenla, CERN/MME
M. Aicheler, O. Brunner, N. Catalan Lasheras, M. Filippova, A. Grudjev, D. Gudkov, S. Lebet, A. Olyudnin, C. Rossi, A. Solodko, I. Syratchev, J. Vainola, A. Xydou, B. Woolley,
W. Wuensch, CERN/RF
M. Taborelli, M. Thiebert, CERN/VSC
F. Toral, L. Sanchez. Ciemat, Spain
T. Higo, T. Abe, KEK, Japan
M. Franzi, J. Weng, SLAC, USA
23 talks plus discussions
2 long days
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Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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7 31-January-2013 X-band Accelerating structure Review 24-25 NOVEMBER 2014
RF DESIGN ENGINEERING
DESIGN (3D models, 2D drawings)
QUALITY CONTROL AT FACTORY
CONFORM NOT CONFORM
QUALITY CONTROL AT CERN
PRELIMINARY RF CHECK
LEAK TIGHTNESS TEST RF CHECK AND
TUNING
INSTALLATION
PACKAGING AND SHIPPING
BRAZING OF COUPLERS, TUNING
STUDS, COOLING CIRCUITS
7
Baseline manufacturing flow
ULTRA PRECISION MACHINING
ASSEMBLY OF COUPLERS (brazing,
machining)
DIFFUSION BONDING OF DISC STACK
BAKING (vacuum 650 °C,
10 days)
RF DESIGN ENGINEERING
DESIGN (3D models, 2D drawings)
QUALITY CONTROL AT FACTORY
CONFORM NOT CONFORM
QUALITY CONTROL AT CERN
PRELIMINARY RF CHECK
LEAK TIGHTNESS TEST RF CHECK AND
TUNING
INSTALLATION
PACKAGING AND SHIPPING
CLEANING (LIGHT ETCHING)
Add a final dimensional control
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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Emittance preservation N
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• Emittance budget Dey=5nm
Pre-alignment
Beam based alignment
Remittance growth after structure alignment
Requirements from luminosity N
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Not measured. Need more points
Subject 4.2 of the PACMAN network
To be shared between pre-alignment and fiducialization. PACMAN 4.2
To be systematically measured and model fed-back
Applies to PETS to AS. TBM-WG
Dynamic imperfections to be studied in the TBM-WG
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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Tolerances coming from RF. A. Grudjev N
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a
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• Sensitivity study for undamped cell. • Riccardo Zennaro, “Study of the machining
and assembly tolerances for the CLIC accelerating structures”, EUROTeV-Report-2008-081, (2008)
• Jiaru Shi, Alexej Grudiev, Walter Wuensch, “Tuning of X-band traveling-wave accelerating structures”, NIMA 704 (2013)
Sub micron precision is required if no tuning is applied and no temperature correction is allowed Only systematic errors considered. Random errors to be studied
Conclusions from RF tolerances
• Sensitivity studies hints to sub-micron accuracy
– Only systematic errors
– Damping waveguides to be considered
• 2B is the parameter most critical for input couplers
• Tuning could correct 10 MHz but is not the baseline of CLIC.
– Prototypes need to be produced according to the baseline aiming at no tuning.
– Tuning will be used as a measure of accumulated errors and assembly quality
– eventual feedback to RF design and beam dynamics if not achievable.
• We should try to correlate tuning to disk geometry. Action?
– Not all data available for all disks
– One attempt was done in the past without success. (EDMS1291907)
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Stay at submicron tolerance in the shape
Study random manufacturing errors. Systematic deformations?
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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Manufacturing for high Gradient. W. Wuensch
“Many of the procedures we have in structure production have an effect on high-gradient performance - target 100 MV/m loaded accelerating gradient.
• Copper purity, diamond machining, handling, chemistry, 1040 °C, hydrogen, vacuum bake, storage, rf conditioning, etc.
But the relationship between a specific procedure and its effect on high-gradient performance is very difficult to establish experimentally - expensive and time consuming.”
Thanks Walter!!
Increase the gradient is as important as decreasing the conditioning time.
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Taking shortcuts N
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• High power breakdown behaviour of a pair of electrodes seems to be similar to that of a n accelerating structure once the “appropriate” scaling laws are applied… work in progress
We could “judge” changes or improvements in the current procedure using sample electrodes. • surface treatment, cleaning, etching,
degassing, etc
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh How do we measure/accept the disks, shape. Roughness. A. Cherif
…..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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UP machining. S. Atieh
• Material. CU OFE C-1010. CERN standard. Centrally procured
• Rough machining + stress relief @<245 plus UP machining (turning and milling)
• Metrology done only on spare disks not included in the structures
• Probing marks disappear after etching
• Damage under the surface will be seen by FIB-SEM and electrodes
• SEM analysis done on 4 SOI for burrs, iris transition, turning/milling transition/CMM indents
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What if we abandon etching?
Others work above 450 degrees
Shape accuracy N
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Not a problem. Well within reach in critical areas!
Achieved Flatness
• Seems to be ok for closed waveguide but not for open waveguide.
• Disks are saddle-shaped for open waveguides
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2008
2009
2010
2011-2012
Achieved Flatness II
• Outliers are measured in free state for damping waveguides • Could come from the free-state requirement
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0
0.005
0.01
0.015
0.02
0 20 40 60 80 100 120 140
Clo
sed
WG
1
.4u
m
No
WG
0
.7u
m
Op
en W
G
1.4
um
*
Co
up
lers
Need to compare between free state and vacuum chuck and change specifications if necessary
Feedback from firms
Firm 1 – Increase and uniform Ra in the wall.
– Sharp edge.
– Increase of RR
Firm 2 – Flatness 1->3 um,
– waveguide shape 5->10um (RR),
– Roughness 25->15nm
Firm 3 – Sharp edge.
– Increase of RR,
– Ra of the walls
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We should address RR and either increase it or justify it Consensus on sharp edge Roughness does not find a consensus
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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How do we measure/accept the disks? A. Cherif
Metrology and SEM analysis done only on spare disks
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• Parts arrival • Cleaning by TE/VSC • Temperature stabilization inside
the laboratory • Program construction • Measuring setup • Tool calibration • Measurements
• Characteristics on the drawing
• Iris • Cavity • Flatness • Concentricity
• Roughness • Mitutoyo • Veeco
• Results on EDMS Cleaning is not necessary. Dry, clean air blowing should be sufficient
How do we measure/accept the disks? A. Cherif
• Lost of effort on reducing dimples by CMM
– Probe marks
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From 4.7 to 0.08 um!
Discussion on machining and acceptance
• Some metrology needs to be done for all pieces including reference outside surface and shape. – Included in the acceptance tests besides visual inspection and made if
necessary in b.169 lab. Action: Nuria, Anastasiya, Andrej, Ahmed
• Sharp edge. Machining sequence to be stated in the technical specs to chose the orientation of burrs. Action: Said.
• Can we accept a larger roughness in the cell wall? Action: Alexej • Burrs, scratches, contamination and indents to be accepted if not
visually detected 10-100um? Action: Andrej. • Need to define acceptable burrs, scratches, contamination and
indents – accepted if not visually detected 10-100um? Action: Andrej – Bonding tests on scratched disks. Action Serge
• Flatness should be not relaxed but measurements checked. – Measurements with the vacuum chuck to be compared with the “free
state” Action Ahmed
• Changing R05 to 1.0 or 2.5 to be studied Action: Alexej • Shall we tight the tolerance for OD to +/1um? And the shape?
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Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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Surface issues for RF structures in SLAC. J. Wang
• Surface roughness after etching
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Etch
ing
for
rem
ovin
g sl
ight
con
tam
inat
ion
and
flui
ds
Not
just
ified
for
dia
mon
d-tu
rned
pie
ces
Etching for 5 seconds N
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Not justified for diamond-turned pieces
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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Current cleaning and etching at CERN. M. Taborelli
• Degreasing: • immersion in Topklean MC20 (cosolvent: hydrocarbons), which is a pre-degreasing agent with
antioxidant effect • Immersion with ultrasound and in vapour phase of HFE 71IPA (hydrofloroether C4F9OCH3 and
isopropyl alcohol) which is a volatile degreasing agent.
• Drying: nitrogen • Packaging: in plastic boxes
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M.Malabaila, EDMS 1108069 measured by weight
Y.Higashi :30+-3 nm/s = 1.8 um/60s J.Wang : 0.75 um/60s
Removal rate of etching :
Present proc. Results not compatible with SLAC and KEK experience. But stress relief temperature 450-500 degrees
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla Role of oxidation in bonding . M. Taborelli
…..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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• Study of the different heat treatments on the copper parts and the effect o etching
• Decided on 245 based on micro-hardness
Study of heat and chemical treatments effects on the surface of ultra-precision machined discs for CLIC. A. Perez Fontenla
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Disc nr 1 2 3 4 5
T (°C) - 185 245 250 500
t (h) - 2 2 4 2
Sector –I Radius 0,02
Sector –II Chamfer 0,02x0,02
Sector –III Sharp edge
Turned area
Milled area
5 discs with ≠ annealing cycle
Are we sure about this? Not much statistics…
– The presence of steps (µm) was confirmed in all discs, before and after etching;The discontinuity before etching is smaller on discs annealed for a longer time or higher T (nr 4 & 5);
• Etching increases drastically roughness and is worse in low temperature samples
• Burrs are removed by etching.
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Study of heat and chemical treatments effects on the surface of ultra-precision machined discs for CLIC. A. Perez Fontenla
Higher temperature annealing seems to do copper harder. Is this bad? Machining is not less precise
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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Role of oxidation on bonding. M. Taborelli
• Surface diffusion more important than bulk diffusion. H2 may speed up the process.
• Oxidation reduces adhesion force.
• Oxidation appears in less than an hour.
• Unlike vacuum, heating in H2 will reduce oxidation
• Beware of carbon contamination which will not be removed
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1040 degrees will eliminate oxide in open surfaces. What about bonding surfaces?
Discussion on surface treatment
• No etching should be done on disks anymore.
– Only solvent cleaning.
– Thus no dimples should be allowed in the RF part larger than? Ra?
– Burrs and machining steps need to be under control
• Test on oxide to be prepared. XPS measurements of oxide layer growth.
– Bonding cycle on oxidised samples to assess the bonding quality and the “deoxidising” capacity of the heating cycle. Action: Mauro, Serge.
• Handling from the reception of the disks needs to be reviewed. Action Nuria
– Beware of Carbon contamination
• Stress relieve temperature much lower than in SLAC, KEK and CIEMAT. Is this a concern? Action Said
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Can we spot them?
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
N. C
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Assembly and alignment procedure. M. Aicheler
• Manual stacking made against a UP machined V-block using tuning holes or machined line
• Manual stacking against automatic stacking
• Measured before and after bonding
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Data measured for all structures N
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alan
Las
her
as
After bonding the
misalignment increases by an
average of 2.5μm
2 exceptions in which the after bonding is better than the pre-
bonding. This may be due to fact that might not be measured the same generatrix before and after
bonding
In general extended, more systematic measurements to be done Data exists to be re-analysed for bow
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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Cell to cell alignment on GLC structures. T. Higo
• OD is the key for measurements need to be fully measured.
• Stacked manually against a V-block.
• Hold during transport to the oven.
• Later used pre-bonding at low temperature ~150 degrees before releasing fixture
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Some (really) typical results
Cell to cell alignment < 1um
Smooth shape. Large bow
Bonding slippage < 1um
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atal
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eras
Very
goo
d ce
ll to
cel
l alig
nmen
t.
Lots
of
mea
sure
men
t po
ints
B
ow c
an b
e ea
sily
cor
rect
ed
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
N. C
atal
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ash
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Brazing and bonding. S. Lebet, A. Solodko
• Detailed description of procedures, tooling and issues
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atal
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eras
Avoid using graphite pads in contact with diamond-machined parts
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou H2 diffusion bonding against vacuum brazing. T. Higo
…..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
N. C
atal
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ash
eras
• Trends on deformation are good but real data give negative deformations
• All sample disks bonded correctly independently of weight
• RF disks results are not all ok but do not correlate with pressure. – Looking into flatness
Bonding dependence from weight and Ra. A. Xydou N
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alan
Las
her
as
No pressure
0.1 MPa 0.28 MPa
0.28 MPa
0.06 MPa
0.04 MPa
0.1 MPa
0.06 MPa
0.04 MPa
Measurements to be better understood
Last bonding tests last week
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
N. C
atal
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ash
eras
Discussion on bonding/brazing
• Avoid using graphite pads in contact with diamond-machined parts
• Bonding dependence on weight studies
– Better understanding of the measurements is required
– not conclusive for real disks. Investigating flatness. Action Anastassia
• Vacuum brazing used at lower frequency. Single cell study In KEK. Waiting for the results
• No big changes in the procedure in the short term
– Could be worth to study different atmosphere in electrodes?
• New smaller tooling to avoid leaving the cleanroom. Action Serge
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Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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RF X-band previous projects @ CIEMAT N
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alan
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as
TBL PETS
Buncher
Microtron
Precision machining Precision joining Vacuum brazing
Precision assembly Low power RF tests
Bead pull and tuning
Plans for CLIC structures: TD26CC
Tuning at CERN
Disc machining
Parts machining
Bonding
Brazing
Leak testing
Assembly
CIEMAT will manufacture a TD26CC structure according CERN procedures
Scope of the collaboration
CIEMAT facilities
Equipment for assembly Clean room
Granites
Measuring machines
Equipment for testing Network analyzers
Leak detectors
Materials division at CIEMAT Optical microscopy
Electronic microscopy
Atomic force microscopy
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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CDD repositoy M
TF. M
aria
Fili
pp
ova
Project (product) structure M
TF. M
aria
Fili
pp
ova
Item structure in EDMS
57
• Item structure is created in EDMS by using Agile E6 application based on BOM.
• In items can be attached technical characteristics and documents related to the assemblies and corresponding components.
• For each AS top item assembly we usually ask EDMS/MTF support to create five (5) equipment sets where the links on MTF page with corresponding equipment structure could be found.
EDMS - Engineering and Equipment Data Management
assembly item sub-assembly item
sub-assembly item sub-assembly item
component item
MTF
. Mar
ia F
ilip
po
va
Equipment management folder M
TF. M
aria
Fili
pp
ova
New workflow steps № AS Workflow Steps Applicable Standard Result file Manufacturing step catalogue data
1 Discs and coupler manufacturing at factory Technical Specification for UP parts yes
2 Discs and coupler inspection at factory EDMS #1207881 yes
3 Discs and couplers acceptance EDMS #1207881 yes
4 Sample discs dimensional control EDMS #823316 yes CMM used
5 Sample discs SEM EDMS #887717 yes
6 Assembly of couplers EDMS #1421001 yes
7 RF check before diffusion bonding EDMS # 1257643 yes
8 Discs and couplers surface treatment
EDMS# 1440603 (disc-etching --
>EDMS #1242352
couplers, manifolds, waveguides -
degreasing-->EDMS #1072247) yes
9 Alignment control before diffusion bonding EDMS #1237642 yes
10 Diffusion bonding of disc stacks EDMS #1237642 yes oven, atmosphere, pressure
11 Alignment control after diffusion bonding EDMS #1237642 yes
12 Brazing of disc stack with couplers and tuning studs EDMS #1421002 yes oven, atmosphere
13 Brazing of manifolds EDMS #1421004 yes oven, atmosphere
14 Brazing of cooling circuits EDMS #1421006 yes oven, atmosphere
15 Leak tightness test EDMS #1278313 yes
16 RF check and tuning EDMS #1257643 yes
17 Vacuum Baking EDMS #1421007 yes oven
18 Installation EDMS #1421009 no facility name
19 Power test EDMS #1421012 yes test bench, max. archived gradient, breakdown
Manufacturing Step Main Catalogue Data: • Applicable Standard EDMS document № where the
corresponding step procedure is attached • Results EDMS document № of the corresponding result
report Some step data fields to be implemented individually for some steps according to table 3, column “Manufacturing step catalogue data”.
Dimensional control
MTF
. Mar
ia F
ilip
po
va
Responsibilities M
TF. M
aria
Fili
pp
ova
№ AS Workflow Step Responsible(s) for procedures and workflow step
People allowed to close the step
1 Discs and coupler manufacturing at factory Said ATIEH Said, Andrey, Anastasiya, Nuria, Maria
2 Discs and coupler inspection at factory Said ATIEH, Andrey OLYUNINAndrey, Said, Anastasiya, Nuria, Maria
3 Discs and couplers acceptance Andrey OLYUNIN Andrey, Anastasiya, Nuria, Maria
4 Sample discs dimensional control Ahmed CHERIFDidier, Ahmed, Anastasiya, Nuria, Maria
5 Sample discs SEM Ana Teresa PEREZ FONTENLAAnitè, Anastasiya, Nuria, Gonzalo, Maria
6 Assembly of couplers Anastasiya SOLODKO, Serge LEBET Anastasiya, Serge, Nuria, Maria
7 RF check before diffusion bonding Rolf WEGNERRolf, Andrey, Anastasiya, Nuria, Maria
8 Discs and couplers surface treatment Marc THIEBERT Marc, Anastasiya, Nuria, Maria9 Alignment control before diffusion bonding Anastasiya SOLODKO, Serge LEBET Anastasiya, Nuria, Serge, Maria
10 Diffusion bonding of disc stacks Anastasiya SOLODKO, Serge LEBET Anastasiya, Nuria, Serge, Maria11 Alignment control after diffusion bonding Anastasiya SOLODKO, Serge LEBET Anastasiya, Serge, Nuria, Maria
12Brazing of disc stack with couplers and tuning studs Anastasiya SOLODKO, Serge LEBET Anastasiya, Serge, Nuria, Maria
13 Brazing of manifolds Anastasiya SOLODKO, Serge LEBET Anastasiya, Serge, Nuria, Maria14 Brazing of cooling circuits Anastasiya SOLODKO, Serge LEBET Anastasiya, Serge, Nuria, Maria
15 Leak tightness test Cedric GARION, Esa Antero PAJUCedric, Esa, Andrey, Philipp G., Anastasiya, Nuria , Maria
16 RF check and tuning Rolf WEGNERRolf, Andrey, Alexej, Anastasiya, Nuria, Maria
17 Vacuum Baking Anastasiya SOLODKO, Serge LEBETSerge, Anastasiya, Nuria, Markus, Mauro, Cedric, Maria
18 Installation Nuria CATALAN LASHERASSerge, Andrey, Philipp de S., Philipp G., Anastasiya, Nuria, Maria
19 Power test Nuria CATALAN LASHERAS Anastasiya, Nuria, Maria
Write procedure After each manufacturing step:
Close the MTF step Attach result file
Open Non conformity in not ok
Define manufacturing sequence Approve procedures
Coordinate between steps Discuss and decide on NC actions
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Woolley Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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4 Port VNA
TWS input ports
contact thermometer
TWS output ports
V-block
discs clamped together
62
clamping device
high-quality measurement cables
1/12/2015
X-band Accelerating Structure Review
RF measurements before bonding R
F M
easu
rem
ents
an
d T
un
nin
g. A
. Oly
un
in,
R. W
egn
er, B
. Wo
olle
y
Expected vs measured reflexion R
F M
easu
rem
ents
an
d T
un
nin
g. A
. Oly
un
in,
R. W
egn
er, B
. Wo
olle
y
Ok for Bonding
2. RF measurements before tuning
64
note:
strong standing wave caused by detuned output coupler detuning
1/12/2015
RF
Mea
sure
men
ts a
nd
Tu
nn
ing.
A. O
lyu
nin
, R
. Weg
ner
, B. W
oo
lley
Tuned structure and tuning record R
F M
easu
rem
ents
an
d T
un
nin
g. A
. Oly
un
in,
R. W
egn
er, B
. Wo
olle
y
Discusion and Conclusions
• Use the same pins for all structures.
• Verify that tuning is preserved after baking
– Next structure TD26_CC to be re-measured after baking
• Need statistical study of tuning for all structures up to know
– To validate the CLIC baseline (no tuning)
– To evaluate the assembly quality,
• No correlation found between tuning records and disks/cells geometry errors.
– Possibly most errors are produced by assembly
– TBC. Only one structure has been done.
RF
Mea
sure
men
ts a
nd
Tu
nn
ing.
A. O
lyu
nin
, R
. Weg
ner
, B. W
oo
lley
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli Systematic analysis done on existing samples. A. Perez Fontenla
…..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
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Baking requirements B
akin
g re
qu
irem
ents
. M. T
abo
relli
H2 H2
-0.5 0.0 0.51.194x10
-4
1.196x10-4
1.198x10-4
1.200x10-4
C (
% w
t)
x (cm)
1309 K
1305 K
1301 K
1297 K
1293 K
1289 K
1285 K
1281 K
1277 K
1273 K
1269 K
Ramp down, 4K/min
-0.5 0.0 0.51.40x10
-9
1.45x10-9
1.50x10-9
1.55x10-9
1.60x10-9
C (
% w
t)
x (cm)
10 d
5 d
2 d
1 d
10 h
8 h
Heat treatment after bonding
Changes after 8h are only in 1e-10 of concentration!
Degassing data from PSI structure N
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alan
Las
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as
Discussion on baking
• According to simulations work 10 hours would be sufficient to eliminate H2 in the copper bulk.
– Sample is thin (1cm) and may not be representative?
• Data from PSI structure seems to indicate that degassing is not that fast.
– Significant reduction after 12 hours
• Refurbished degassing oven in building 101 has been equipped with gas analyser. Action Ivo
– Data to be taken on the next cycles. TD26CC on January
– With and without structure
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Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov SiC to copper brazing. A. Solodko
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Manifolds assembly. D. Gudkov M
anif
old
s as
sem
bly
. D. G
ud
kov
Serge Lebet, Vadim Soldatov
Brazing tests M
anif
old
s as
sem
bly
. D. G
ud
kov
Samples cut from the quarters M
anif
old
s as
sem
bly
. D. G
ud
kov
Alternatives to manifolds. Discussion
• First of this kind in CLEX now.
• TD24_SiC being manufactured slightly differently
• Putting manifolds and SiC in vacuum tank could also be a possibility
• Integrated disks
– Very accurate shape of the external reference is a bigger problem for these disks.
– First samples arrived
Study is under way
Man
ifo
lds
asse
mb
ly. D
. Gu
dko
v
Waiting for TD24_SiC experience
Program of the review Introduction to the review. N. Catalan Lasheras
Manufacturing workflow and status of the procedures. A. Solodko …..
Tolerances coming from alignment. D. Schulte
Tolerances coming from RF. A. Grudjev
Manufacturing for High-Gradient. W. Wuensch
Ultra precision machining and built to cost disk optimization. S. Atieh
How do we measure/accept the disks, shape. Roughness. A. Cherif …..
Review of SLAC and KEK etching procedures. J. Wang
Current cleaning and etching procedures followed at CERN. M. Taborelli
Heat treatment study results, burrs and roughness. A. Perez Fontenla
Role of oxidation in bonding . M. Taborelli …..
Assembly and alignment procedure. M. Aicheler
Cell to cell alignment on GLC structures. T. Higo
Brazing/bonding sequence. S. Lebet, A. Solodko
Bonding dependence from weight and roughness. A. Xydou
H2 diffusion bonding against vacuum brazing. T. Higo …..
TD26CC plans from CIEMAT. L. Sanchez
MTF. M. Filippova
RF measurements and tuning. R. Wolf, B. Wooley
Baking requirements. M. Taborelli
Systematic analysis done on existing samples. A. Perez Fontenla …..
Manifolds assembly. D. Gudkov
SiC to copper brazing. A. Solodko
N. C
atal
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ash
eras
Needs for SiC to Cu joining Si
C t
o C
u b
razi
ng.
A. S
olo
dko
AS with damping material
RF GATE VALVE
Crack
Undergoing study by Igor and Anastasiya
Conclusions
• Procedures are now fully known and justified. Ongoing with the authors. – Need to make the point in January
• Industry-ready specs need to define a clear QA • Some slides from Anastasiya
– Immediate changes, to be implemented from next year – Follow-up items to be defined during the following months – Long term studies
• We make prototypes to prove CLIC baseline – No compromises – Conditioning is as important as hig gradient
• Faster feedbak – Changes that may impact bonding quality will be tested in simple disks
in the oven. – Changes that may impact high gradient will be first tested on
electrodes
• Larger and faster interaction with other work packages
N. C
atal
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Thanks!
N. C
atal
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A
S re
view
24
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