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Webcast - From Technologies to Market
Welcome to the webcast
“3D Imaging and Sensing Update”
September 2017 will be a big milestone concerning the introduction of 3D
imaging & sensing into every day consumer products.
Yole Développement proposes to share its analysis of the situation on the 26th
of September with a dedicated webcast!
© 2017
Powered by
2
SPEAKERS
©2017 | www.yole.fr | Microfluidics for Diagnostic Applications Webcast
Pierre Cambou, Imaging Activity Leader , Yole Développement
In 1999 Pierre Cambou joined the imaging industry. He had earned an Engineering degree from Université de Technologie de
Compiègne in parallel to a Master of Science from Virginia Tech in 1998. More recently he graduated from Grenoble Ecole de
Management’s MBA. Pierre took several positions at Thomson TCS which became Atmel Grenoble in 2001 and e2v Semiconductors in
2006. In 2012 he founded the start-up Vence Innovation (now called Irlynx) in order to bring to market a disruptive Man to Machine
interaction technology. He joined Yole Développement, the "More than Moore" market research and strategy consulting company, as
Imaging Activity Leader in 2014.
Stéphane Elisabeth, Imaging, RF and Advanced Packaging Cost Engineer, System Plus Consulting
Dr. Stéphane Elisabeth has joined System Plus Consulting team this year to provided his deep knowledge in RF application, material
characterization and Electronic systems. He holds an Engineering degree in RF and Digital Technology, and a PhD in Materials for
Microelectronics.
3
PRESENTATIONS ARE EXTRACTED FROM THE FOLLOWING REPORTS:
YOLE DEVELOPPEMENT
• 3D Imaging and Sensing
SYSTEM PLUS CONSULTING
• Intel RealSense 3D Camera & STMicroelectronics IR Laser Projector
• Melexis Time of Flight Imager for Automotive Applications
• Texas Instruments’ Time of Flight Image Sensor for Industrial Applications
• STMicroelectronics Time of Flight Proximity Sensor in the Apple iPhone 7 Plus
• Lenovo Phab2Pro 3D ToF Camera
• Apple iPhone 7 Plus: Rear-Facing Dual Camera Module
• iPhone 6s Plus Rear Camera Module
Discover the complete Imaging bundle
©2017 | www.yole.fr | Microfluidics for Diagnostic Applications Webcast
From Technologies to Markets
Webcast
© 2017
3D Imaging & Sensing update26 September 2017
5
UNLOCKING THE NEXT DECADE : 3D CAMERA AS A USER INTERFACE
@2017 | www.yole.fr | iPhone X Analysis
Dual camera rear
No addition of laser ranging for
surface detection.
3D camera
technology choice
• High resolution
• Simple cameras
• Complex system
• High computational needs
handled by A11 Bionic APU
Structured Light camera front
+ ToF Proximity detection
Facial recognition
Easy unlocking
Avatar
Morphing/Animojis
Social medias
Lighting control
Automated
Photo editing
6
ER
RO
R
SUCCESS
DATACENTER OFF THE SHELF
AI TRAINING VS INFERENCE
Training requires much
more computing
resources than inference software
@2017 | www.yole.fr | iPhone X Analysis
7
3D CAMERA - FRONT 3D CAMERA: AN OPPORTUNITY FOR APPLE
Many opportunities compared to multi-rear camera module
“Wow effect”, technology
leadership, and numerous business
opportunities for multiple
products
@2017 | www.yole.fr | iPhone X Analysis
Enhanced video call
Morphing
Security(Facial recognition)
Gaming (Avatar)
Easy unlocking
Background removal, direct eye-contact
Morphing: real-time
filters (AR, face-swap)
on Facebook,
Snapchat, Instagram
Structured light approach not fully compatible with long
lasting application for now (High power consumption)
8
IPHONE X – TRUEDEPTH MODULE ANALYSIS – WORKFLOW HYPOTHESIS
@2017 | www.yole.fr | iPhone X Analysis
3 Stepsfor unlocking
1- ToF Proximity sensor + Inertial sensor
Activity/Human detection + valid distance
2- Flood illuminator + IR camera:
Face + Eyes detection (day and night conditions)
3- Dot projector + IR camera:
Face Recognition (FR)
High-contrast IR dot projector
30K dot density (DOE) VCSEL 850 nm
VCSEL + ToF detector
VCSEL + Diffuser 7Mp RGB CIS camera
1
3
1.4Mp IR CIS camera
2
9
IPHONE X – FRONT IMAGING MODULE ANALYSIS – PLAYERS
@2017 | www.yole.fr | iPhone X Analysis
1.4Mp Global Shutter IR camera
VCSEL SPAD
VCSEL Illumination + Diffuser 7Mp CMOS camera
ALS+RGB Color sensor (True tone display)
High-contrast IR dot projector
30K dot density (DOE) VCSEL 850 nm
10
DEPTH-SENSING TECHNOLOGIES
Depth-sensing technologies in mobile devices(Source: Yole Développement, 2015)
Stereo vision Structured light Time of Flight
Image resolution Several Mpix Max. 1–3 Mpix Max. VGA
HardwareSimple cameras
Complex system
Demanding illumination
Complex system
Simple illumination
Complex sensors
Computation power High Medium Low
LimitationsMay require illumination
in low light
Best indoors
Need power
Best indoors
Low resolution
Picture
(example)
Best suited forCombination of depth-sensing
and imaging
Medium to long range
depth-sensing
Short-range face and gesture
capture
Players
Courtesy of AMS Courtesy of PMD Tech
©2017 | www.yole.fr | 3D imaging and sensing
Courtesy of Intel
~
11
TECHNOLOGY FOR THE NEXT DECADE
@2017 | www.yole.fr | iPhone X Analysis
Embedded 3D
computationalPhotography
and video
Number of sensors
1 sensor
2 sensors
3 sensors
3+ sensors
20202012 2014 2017 2018 2022
• Main and
sub-camera
• LED flash
Catching up with
DSLR and video
cameras
New embedded 3D imaging
Courtesy of Panono
Courtesy of Sony
Embedded 3D
interactiveThe world becomes interactive
• Dual main and
sub-camera
• 3D mapping
• VR localization
Courtesy of Microsoft
From 1 sensor /
camera
To 3+ per
smartphone
Apple leverages
computation
capability
to jump into the
next era 2 years
ahead of schedule
• Dual main or
sub-camera
• 3D mapping
• LED illuminator
• Main and
sub camera
• Range finder
• LED flash
12
IPHONE X – TRUEDEPTH MODULE ANALYSIS
@2017 | www.yole.fr | iPhone X Analysis
True Depth Module Yole guess Cost ($)
Proximity sensor VCSEL Philips $0.2
Proximity/ranger receiver STM $0.8
Proximity sensor ~ $1.5
VCSEL Lumentum / Finisar $0.5
Diffuser Himax $0.3
Flood illuminator ~ $1.0
IR image sensor STM $2.0
Lens + IR filter Largan / Viavi $1.0
Module mfg $1.5
1.4Mp IR receiver module ~ $4.5
VCSEL Lumentum / Finisar $0.5
WL Lens Heptagon ams $0.3
DOE Heptagon ams $0.6
DOT pattern Projector ~ $2.5
Total Truedepth Camera $9.5
ALS/RGB sensor ams $0.3
7Mp Color camera Cowell / Sony $6.2
Total Front Imaging Module ~ $16.0
Apple TrueDepth ModuleStructured Light + Proximity Sensing
3D Imaging Module Previous Yole model
3D ToF camera Yole guess Cost ($)
VCSEL Lumentum / Finisar $0.5
Diffuser Himax $0.3
IR Illumination ~ $1.0
ToF Array (320x160) STM $3.0
Lens + IR filter Largan / Viavi $1.0
Module mfg LG Innotek $1.5
Total 3D Imaging camera ~ $6.0
Total 3D camera ~ $7
ALS/RGB sensor ams $0.3
8Mp CMOS imagerLG Innotek /
Foxconn Sharp / Cowell$6.7
Total Front Imaging Module ~ $14.0
13
3D SENSING : LEVERAGING AI COMPUTING
AI is gamechanging
@2017 | www.yole.fr | iPhone X Analysis
• 3D sensing is not a new approach to biometric authentication
• Major attributes of AI
• Reasoning : capacity of consciously make sense of things
• Communication : Interaction processing between computer language and natural language processing
• Perception : Interpretation of sensing information in order to understand and recognize the environment
• Learning : acquiring new knowledge or modifying and even reinforcing the existing system
• Decision-making : developed to solve problems based on acquired information.
Decision making
Reasoning
CommunicationPerception
Learning
AI
3D sensing
starts here
Mobile Computing
14
3D SENSING : LEVERAGING AI COMPUTING
>5 years in the making
@2017 | www.yole.fr | iPhone X Analysis
• Apple has been investing in AI since 2013 and has been aggressively acquiring related companies
• The adoption of 3D sensing could be the starting point for Apple to develop complete AI functions in smartphones
• Apple AI related acquisition list
• 2011 Polar Rose Facial recognition system
• 2013 Primesense 3D Sensing and motion detector
• 2013 WiFiSLAM Indoor location
• 2015 LinX Computational imaging
• 2015 Metaio AR environment setup
• 2015 Faceshift 3D virtual sensing of human face
• 2015 Perceptio Machine learning, image recognition
• 2015 VocalIQ Speech technology
• 2016 Emotient AI facial recognition system
• 2016 Flyby Media VR/AR communication
• 2016 Turi Machine learning
• 2017 Real Face Facial recognition system
15
• IR receiver module
ST Microelectronics
TENTATIVE SUPPLY CHAIN FOR IR RECEIVER
Standard CCM
approach withspeccific
850nm (?) IR pass filter
@2017 | www.yole.fr | iPhone X Analysis
Glass panel
SoI
waferCIS
Injection Resin Injection molding
IR notch filter
Module
Zeon Largan
Viavi
CMOS
Image
Sensor
Lens
module
IR filter
STM
16
• Proximity / ranger ToF module + Flood Illuminator
ST Microelectronics
• Reverse engineering needed, linked to the IR receiver?
• Supply chain linked to ST but how?
• To be updated…
TENTATIVE SUPPLY CHAIN FOR TOF MODULE
New component
@2017 | www.yole.fr | iPhone X Analysis
STM
17
• Dot pattern illuminator module, scenario1
Heptagon (ams group)
TENTATIVE SUPPLY CHAIN FOR DOT ILLUMINATOR
High end approach withmultiple players
@2017 | www.yole.fr | iPhone X Analysis
HPFS
glass wafer
Gaas
epitaxial waferVCSEL
Transparent Resin
Patterning
WL lens
WL packaging
18
• Dot pattern illuminator module , scenario1
Himax
TENTATIVE SUPPLY CHAIN FOR DOT ILLUMINATOR
Double sourcing
@2017 | www.yole.fr | iPhone X Analysis
HPFS
glass wafer
Gaas
epitaxial waferVCSEL
Transparent Resin
Patterning
WL lens
WL packaging
19
UNLOCKING THE NEXT DECADE
@2017 | www.yole.fr | iPhone X Analysis2027
2017Beginning of the
3D imaging era
1.4Mp IR CameraToF Proximity sensor
Flood IR Illuminator
Dot pattern IR Projector
FRONT Side
FRONT Side
Structured Light approach has been chosen as a
starting point for the 3D imaging era. The front 3D module
could evolve toward ToF technology in the future, showing
more reliability in direct sunlight and lower computation
need.
REAR Side
3D Camera
+2D CameraDual camera
x2 AF-OIS
Yole’s expectations
Enhanced video call
Morphing
Security(Facial
recognition)
Gaming (Avatar)
Easy unlocking
20
UNLOCKING THE NEXT HMI
@2017 | www.yole.fr | iPhone X Analysis2017
2007Touch Era
Perceptual Era
The move to perceptual era signals a new era for computing
and sensing that are driving major changes to the way sensing,
APUs and neural networks are combined and works together.
21
Apple Watch embedding a unique 3D ToF camera to
authenticate and communicate through avatar/Animojis (Saving
bandwidth/data, power consumption) appears more realistic
3D IMAGING INTEGRATION LINE-UP?
@2017 | www.yole.fr | iPhone X Analysis
2020
iPhone X
2018
Front 3D camerastructured light
Front: 3D ToF sensing
QVGA
(Outdoor usage)
Front 3D camera structured light / time of flight
Rear 3D camera stereo / structured light
Front 3D camerastructured light
iPad 2018
iPhone 11
iPhone 12
New Apple Watch
2017
Reliability x Power Consumption
2019
Structured Light approach
seems difficult to fit into
the Apple Watch
Front 3D camera
Rear 3D camera
22
3D IMAGING & SENSING FUTURES
@2017 | www.yole.fr | iPhone X Analysis
• 3D imaging & sensing is at a starting point in mobile and consumer electronics in general
• $6B to be generated at module level by 2022 in the mobile space
• Renewed competition and emergence of new players serving these technologies / applications
• Different technologies will coexist for different applications
• Time will tell who will choose which technology
TECHNOLOGY REVIEW ON
3D IMAGING & SENSING
3D Imaging & Sensing, Free Webcast, September 26th
Stéphane ELISABETHProject Manager – RF, Imaging & Advanced Packaging
Electronic Costing & Technology Experts
Power electronics – MEMS & Sensors – LED & Optoelectronics – Advanced Packaging – System
25Webcast 3D Imaging & Sensing September 26th, 2017
3D Imaging & Sensing
2015 2016 2017 2018
Apple iPhone 6S Plus Rear Camera (from Apple iPhone 6S Plus Rear Camera Reverse Costing Report – Link)
Apple iPhone 7 Plus Dual Camera (from Apple iPhone 7 Plus Dual Camera Reverse Costing Report – Link)
Source: Apple
26Webcast 3D Imaging & Sensing September 26th, 2017
3D Imaging & Sensing
One player increases its 3D imaging & Sensing market share in 2018 and have its preferred customers
Infineon/pmd
Omnivision
STMicroelectronics
3D Imaging & Sensing Market
2017-2018
2015
27Webcast 3D Imaging & Sensing September 26th, 2017
3D sensing Technology
Two ways to sense the environment for different purposesAugmented RealitySecurityProximity Sensing
Time-of-FlightSTMicroelectronics Proximity Sensor (from STMicroelectronics ToF
Sensor Reverse Costing Report – Link)
2.8 x 2.8 x 1.14 mm
Structured Light
Intel RealSense Module (from Intel RealSense Reverse Costing Report – Link)
110 x 12.5 x 3.8 mm
Poor resolutionHigh AccuracyLow Complexity
High resolutionMedium AccuracyHigh Complexity
28Webcast 3D Imaging & Sensing September 26th, 2017
3D Imaging
Time-of-flight technology
Photodiode based pixel Analog response
SPAD based pixel Geiger mode avalanche
STMicroelectronics ToF Sensor Reverse Costing Report – Link
Lenovo Phab2Pro ToF Reverse Costing Report – Link
Melexis MLX75023 ToFReverse Costing Report – Link
Texas Instruments OPT8241 ToFReverse Costing Report – Link
29Webcast 3D Imaging & Sensing September 26th, 2017
Structured Light Devices
Lenovo Phab2Pro Disassembly (from Lenovo Phab2Pro – Time of Flight Reverse Costing Report – Link)
Global Shutter
Infrared Camera
Illumination
16 MP Camera
IlluminationInfrared Camera
2.1 MP Camera
Intel RealSense Disassembly (from Intel RealSense Reverse Costing Report – Link)
30Webcast 3D Imaging & Sensing September 26th, 2017
3D Imaging & Sensing Module Technology Modules description Toward iPhone X and beyond?
31Webcast 3D Imaging & Sensing September 26th, 2017
Intel Solution – Micro Mirror System
Intel Realsense technology 2.1MP Stripe scanning
The module integrates the infraredcamera, the high resolution camera on thesame board. The illumination componenthas its own board.
High frequency stripe scanning doesn’trequire motion tracking.
Intel RealSense Module (from Intel RealSense Reverse Costing Report – Link)
Intel RealSense Module Disassembly (from Intel RealSense Reverse Costing Report – Link)
32Webcast 3D Imaging & Sensing September 26th, 2017
Intel Solution – Micro Mirror System
STMicroelectronics Micromirror component (from Intel RealSense Reverse Costing Report – Link)
Intel Realsense technology
Illumination deviceProviding Depth Sensing
IR sensor
High resolution camera to supply the scene with high details
Intel RealSense Camera Module Board (from Intel RealSense Reverse Costing Report – Link)
STMicroelectronics Micromirror component (from Intel RealSense Reverse Costing Report – Link)
Source: STMicroelectronics
33Webcast 3D Imaging & Sensing September 26th, 2017
Intel Solution – Micro Mirror System
Intel Realsense technology
Pixel array: ~4 mm²CIS resolution: ~2Mp
Pixel size: 1.4 µm
Pixel array: ~4 mm²CIS resolution: ~300k pixel
Pixel size: 3.5 µm
Intel RealSense Disassembly (from Intel RealSense Reverse Costing Report – Link)
Intel RealSense Disassembly (from Intel RealSense Reverse Costing Report – Link)
34Webcast 3D Imaging & Sensing September 26th, 2017
Intel Solution – Micro Mirror System
12%
11%
17%
46%
10%
4%
Component Cost Breakdown (Medium Yield)
IR sensor cost High Res. camera cost IR Laser Projector cost
Other Components Added Value PCB Cost
Other component like passive, memory, Controller, … represents 46 % of the module cost.
23%
64%
3%
10%
Component Cost Breakdown (Medium Yield)
Component Die Cost Package Cost Final Test Cost Yield losses
~$1
~$13
Intel RealSense Breakdown (from Intel RealSense Reverse Costing Report – Link)
35Webcast 3D Imaging & Sensing September 26th, 2017
Lenovo/Asus Solution – TriCam System®
Infineon/pmd technologyAsus Integration
23 MPLenovo Integration
16 MP
16MP or 23MP OIS + EIS TriTech AF
Lenovo Phab2Pro Disassembly (from Lenovo Phab2Pro – Time of Flight Reverse Costing Report – Link)
The modules integrating the infrared camera and the illumination component are the same
In the TriCam system only the High resolution camera change
Source: Asus
36Webcast 3D Imaging & Sensing September 26th, 2017
Lenovo/Asus Solution – TriCam System®
Infineon/pmd technology
Global Shutter For motion tracking
IR sensor + Illumination deviceProviding Depth sensing
High resolution camera to supply the scene with high details
Lenovo Phab2Pro Disassembly (from Lenovo Phab2Pro – Time of Flight Reverse Costing Report – Link)
IR sensor
Illumination deviceVCSEL + Diffuser
37Webcast 3D Imaging & Sensing September 26th, 2017
Lenovo/Asus Solution – TriCam System®
Infineon/pmd technology
Pixel array: ~3 mm²CIS resolution: VGA
Pixel size: 3 µm
Global Shutter
VCSELInfrared Sensor
High resolution
Pixel array: ~12 mm²CIS resolution: ~40k pixel
Pixel size: 17.5 µm
Pixel array: ~21 mm²CIS resolution: ~16 Mp
Pixel size: 1.12 µm
Lenovo Phab2Pro Disassembly (from Lenovo Phab2Pro – Time of Flight Reverse Costing Report – Link)
38Webcast 3D Imaging & Sensing September 26th, 2017
Lenovo/Asus Solution – TriCam System®
54%
31%
15%
3D Tri-Camera System Cost Breakdown(Medium Yield)
3D ToF Module Price High Resolution Camera Price Motion Detector Camera Price
39%
9%
2%
13%
23%
14%
3D ToF Module Cost Breakdown(Medium Yield)
BOM : 3D ToF Sensor + Lens Cost BOM : Metal Cover BOM : Rigid Flex PCB
BOM : NIR VCSEL BOM : Other Components Added Value
Lenovo Phab2Pro Disassembly (from Lenovo Phab2Pro – Time of Flight Reverse Costing Report – Link)
~$11
~$40
39Webcast 3D Imaging & Sensing September 26th, 2017
Toward iPhone X and beyond?
Lenovo Phab2Pro Disassembly (from Lenovo Phab2Pro – Time of Flight Reverse Costing Report – Link)
Very Small footprintStructured light component:Flood illumination + dot projector
Intel RealSense (from Intel RealSense Reverse Costing Report – Link)
Pictures at scale
Structured light component:Laser + Micromirror
Structured light component:Flood illumination
Source: Apple
40Webcast 3D Imaging & Sensing September 26th, 2017
Toward iPhone X and beyond?
Imager Number
Total Size(mm²)
IR Camera Size
(mm²)
IR sensorDie Size(mm²)
Pixel Size(µm)
Illumination Size(mm²)
RGB CameraCost
GS Camera Cost
ToFCamera
Cost
2(RGB CameraGS Camera)
82 x 11.6(951)
9.3 x 9.3(86.5)
5.5 x 4.9(27.0)
3.511.7 x 8.4
(98.3)~$2 - ~$13
3(RGB CameraToF CameraGS camera)
57.3 x 17.6(1,008)
8.9 x 8.9(79.2)
5.6 x 5.2(29.1)
17.53.3 x 3.3
(10.9)~$6 ~$4 ~$11
2(RGB Camera
IR CameraToF detector)
32.0 x 5.0(160)
5.0 x 5.0(25)
~7.9
Dot Projector3.8 x 3.0
(11.4)Flood illumination
2.5 x 1.3(3.25)
~$6 ~$4.5~$9.5
(detector)
Based on Apple’s presentation
41
PRESENTATIONS ARE EXTRACTED FROM THE FOLLOWING REPORTS:
YOLE DEVELOPPEMENT
• 3D Imaging and Sensing
SYSTEM PLUS CONSULTING
• Intel RealSense 3D Camera & STMicroelectronics IR Laser Projector
• Melexis Time of Flight Imager for Automotive Applications
• Texas Instruments’ Time of Flight Image Sensor for Industrial Applications
• STMicroelectronics Time of Flight Proximity Sensor in the Apple iPhone 7 Plus
• Lenovo Phab2Pro 3D ToF Camera
• Apple iPhone 7 Plus: Rear-Facing Dual Camera Module
• iPhone 6s Plus Rear Camera Module
Discover the complete Imaging bundle
©2017 | www.yole.fr | Microfluidics for Diagnostic Applications Webcast
42
CONTACT US
• Pierre Cambou – [email protected]
Imaging Activity Leader | Yole Développement
• Stéphane Elisabeth – [email protected]
Imaging, RF and Advanced Packaging Cost Engineer | System Plus Consulting
• For media services: Julie Robert – [email protected]
Media and Communication Assistant
To stay updated on the latest news and
reports of your semiconductor industries
and markets, visit www.i-micronews.com
©2017 | www.yole.fr | Microfluidics for Diagnostic Applications Webcast
We are open for
discussions
43
Yole Group presentation
©2017 | www.yole.fr | Microfluidics for Diagnostic Applications Webcast
44©2017 | www.yole.fr | About Yole Développement
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
©2017 | www.yole.fr | Microfluidics for Diagnostic Applications Webcast
MEMS & Sensors
Compound
Semi.
Imaging
Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy Management
Power Electronics
Displays
RF
Devices &
Techno.
Advanced
Substrates
Solid State
Lighting(LED, OLED, …)
45
4 BUSINESS MODELS
• Consulting and Analysis• Market data & research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
www.yole.fr
• Reports• Market & Technology reports
• Patent Investigation and patent infringement risk analysis
• Teardowns & Reverse Costing Analysis
• Cost Simulation Tool
www.i-Micronews.com/reports
• Financial services• M&A (buying and selling)
• Due diligence
• Funding
• Maturation of companies
• IP portfolio management & optimization
www.yolefinance.com
• Media• i-Micronews.com website
• @Micronews e-newsletter
• Technology magazines
• Communication & webcast services
• Events
www.i-Micronews.com
©2017 | www.yole.fr | Microfluidics for Diagnostic Applications Webcast
46
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligenceswww.yolefinance.com
Maturation of companies
Funding
IP portfolio management & optimization
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
©2017 | www.yole.fr | Microfluidics for Diagnostic Applications Webcast
47
CONTACT US
• Pierre Cambou – [email protected]
Imaging Activity Leader | Yole Développement
• Stéphane Elisabeth – [email protected]
Imaging, RF and Advanced Packaging Cost Engineer | System Plus Consulting
• For media services: Julie Robert – [email protected]
Media and Communication Assistant
To stay updated on the latest news and
reports of your semiconductor industries
and markets, visit www.i-micronews.com
©2017 | www.yole.fr | Microfluidics for Diagnostic Applications Webcast
We are open for
discussions