welcome to m&p tc meeting materials & processes technical committee meeting may 27, 2015,...
TRANSCRIPT
WELCOME TO M&P TC MEETING
Materials & Processes Technical Committee Meeting May 27, 2015, Wednesday
7:00 - 8:00 AM
Room 511, Sheraton San Diego Hotel & Marinna
Agenda• Introduction All• CPMT M&P TC Chair/vice-chair M J Yim• TC Activities 2015-2016 & Monthly newsletters M J Yim• ECTC M&P Subcommittee Diptarka Majumdar/Bing Dang• IEEE CPMT Advanced Packaging Materials (APM) Symp. 2016• Other Conferences and activities• Open for anything else
Attendees (in random order): Eric Perfecto, Diptarka Majumdar, Bing Dang, Kwang-Lung Lin, C.R. Kao, Tanja Braun, Yoichi Taira, M. J. Yim (chair), Jim Morris, Bill Chen, Chin C. Lee (past Chair), Rama & Kimberly (visit from Brewer Science).
http://cpmt.ieee.org/technology/105-tc-materials-a-processes-.html
2015-16 CPMT TC Chair/Vice ChairChair MJ Yim (Intel)Vice-chair Dongwook Kim (Qualcomm)
TC – M&P chair/vice-chair webpage updated by Marsha
Past Chair CC Lee (UC Irvine)Past Vice-chair Daniel Lu (Henkel China)
2015-16 CPMT M&P Committee• CPMT M&P TC Member list (as of 2015)
Member E-mail Expertise RegionTim Chen [email protected] Adhesives, underfill ChinaDaniel Lu [email protected] Adhesives, electronic and display materials, processing ChinaSheng Liu [email protected] Tthermomechanical and reliability China
Tanja Braun [email protected] assembly processes, polymers Germany
Masazumi Amagai [email protected] Wafer Fab, Package Mechnical Modeling JapanAkitsu Shigetou [email protected] Hybrid materials & interconnect Japan
Yoichi Taira [email protected] JapanKyung-Wook Paik [email protected] Adhesives, 3-D Korea
K. S. Chiang [email protected] SingaporeC. Robert Kao [email protected] Solders, 3-D Taiwan
Kwang-Lung Lin [email protected] Solders, interconnect, advanced packaging, EM TaiwanYu-Hua Chen [email protected] Taiwan
Rajen Chanchani [email protected] 3-D, substrates USAWilliam Chen [email protected] Electronic packaging & manufacturing USA
Bing Dang [email protected] 3D, interconnect and packaging, laser processing USAPhil Garrou [email protected] USA
Dong Wook Kim [email protected] Solders, 3-D, interconnect USAChin C. Lee, past-Chair [email protected] Bonding and solders USA
Ning-Cheng Lee [email protected] Solders and soldering processes USAYi Li [email protected] Substrates, adhesives, materials USA
HongTao Ma [email protected] Semiconductor and LED packaging and relaiblity USADiptarka Majumdar [email protected] USA
Mikel R. Miller [email protected] materials, mechanics, reliability USAJames E. Morris [email protected] ECAs; nanotechnologies USA
Govindarajan Muralidharan [email protected] USAEric Perfecto [email protected] Solders, 3-D, interconnect USA
Mark D. Poliks [email protected] materials, processing, flexible electronics USA
Dwayne Shirley [email protected] Packaging, EMC, Substrates,
Solder, ReliabilityUSA
Ivan Shubin [email protected] 3D, Materials, interconnects USAEphraim Suhir [email protected] Materials physics, modeling USA
Quinn Tong [email protected] USALejun Wang [email protected] Assembly processing and materials USA
Paul Wesling [email protected] USAC. P. Wong [email protected] USA
Myung Jin Yim, chair [email protected], flip chip, 3D TSV and optical
interconnectUSA
Tieyu Zheng [email protected] Mechanics, reliability, thermal USAHongxia Lu [email protected] USA
USA: 25Taiwan: 3China: 3Japan: 3Germany:1Korea: 1Singapore: 1Total: 37
By 2015: >45By 2016: >50
Increase committee member
Increase more Asia/Europe member
Communications:•A newsletter that covers all the news related to Materials. •The Chair, Vice Chair, and Executive Committee members routinely communicate through e-mail and telephone. •General membership receives announcements for conferences, workshops and symposia. •The highlights of the Materials Conference are summarized in the CPMT newsletter.
Meetings:•TC-5 Committee meets every year during the ECTC Annual Meeting. •TC-5 Committee will try to meet once a year outside of US. •The committee chair communicates with the Board of Governor. •The TC chair attends special meetings called by the TC Vice President to determine the future roadmap of the society. •A teleconference call or material webinar will be conducted when warranted.
Web Assets:•http://sites.ieee.org/cpmt-tc5/ The site is primarily used for general announcements, committee newsletters and conference details.
Conferences:•Materials-related sessions during ECTC (TC-5 sponsors) •International Materials Conference (IEEE-CPMT (TC-5) co-sponsors) held every alternate year •International conferences on specific Materials (from time to time) (TC-5 sponsors) •International Conference on Electronic Materials and Packaging – every year in Asia (rotates between Singapore, South Korea, Japan)
Publications:•The Proceedings of Electronic Components and Technology Conference •The Proceedings of Materials Conference (TC-5 co-sponsors) •The Transactions of CPMT – TC-5 contributes the technical papers, reviews potential papers for publication and acts as associate editors •The proceedings of Electronic Materials and Packaging (TC-5 co-sponsors)
Collaborative Efforts:•Actively collaborating with IMAPS, American Ceramic Society, American Society of Metals, Society of Plastic Engineers and Materials Research Society •There is a new push to start new collaborative international events.
Volunteers:•TC-5 has approximately 50 volunteers each year (37 as of 2015 list), consisting of the Executive Committee, the conference officers, the session chairs, paper reviewers and associate editors. TC-5 will try to reach out to international members by holding the technical committee meeting once outside of US.
2015-16 M&P TC Committee Activities
Current activities/formats written in TC-5 webpage
2015--- (To be uploaded from Ning Cheng Lee @Indium)
2014•October 2014 News LetterMicrostructure variation – electric current (Kwang-Lung Lin @ National Cheng Kung Univ.)•Sept 2014 News LetterCPMT MP TC Newsletter Sept 2014-Micro pillar compression 2014 (C. R. Kao @ National Taiwan Univ.)•May 2014 News LetterCPMT MP TC Newsletter May 2014 DW KIM – Final (DW Kim @ Qualcomm)
2013•December 2013 News LetterSilver flip-chip technology poster (CC Lee @UC Irvine)•November 2013 News Letter2013_Saint-Venant_CPMT_Materials_TC_120613 (E. Suhr @Portland State Univ.)•October 2013 News LetterIEEE CPMT-TC5 Materials and Process-MJ Yim-Oct-Newsletter-2013 (MJ Yim @Intel)•August 2013 News LetterCMPT MP TC Newsletter Aug 2013 (Paik) (KW Paik@KAIST)
• Need more contribution from M&P members on monthly newsletter to facilitate networking and sharing. => Bimonthly or Quarterly newsletter
• Need volunteer for web administrator from members.
Uploaded Newsletter and Contributors
2015 ECTC: M&P Subcommittee
• Chair Diptarka Majumdar/Bing Dang Number of abstract submissions received Primary 89
Secondary 82Number of abstracts accepted for presentation Oral 35
Poster 15
Sessions Chair DateTime
Adhesives, Underfills, TIMs Lejun Wang May 27 8:00 AM
Tieyu ZhengNovel Materials & Processes Ivan Shubin May 29 1:30
PMMikel Miller
3D Materials & Processing Myung Jin Yim May 28 1:30 PM
Bing DangSolders & Bonding Kwang-Lung Lin May 29 8:00
AMDwayne Shirley
Substrates Dong Wook Kim May 27 1:30 PM
Frank Wei
IEEE CPMT Advanced Packaging Materials (APM) Symp. 2016
• Conflict in 2015 with major packaging events in China• Decided to push out to 2016.• Time/date is TBD, but Shenzhen or Suzhou is recommended for hosting place.• Tim Chen will be general chair.
17th Int’l Conference on Electronic Materials and Packaging (EMAP) 2015
• Sept 1, Sept. 4, 2015• Portland State Univ., Portland, OR,
USA.• Prof. Sung Yi is general chair.