voltage switchable dielectric material offers novel ......the output of each nand gate drives an...

Voltage Switchable Dielectric Material Offers Novel Approach to

More Comprehensive ESD Protection

R. Fleming, D. Vasquez, M. Glickman, J. Wu, F. Razavi, P. Pande

1 Shocking Technologies 2013 APEC Conference

We are an ESD Solutions Company

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ESD represents a major failure mode during semiconductor assembly and during actual system use

Destroys chips and passive elements

Example: “Zapped” Bond Wire Example: “Zapped” Integrated Circuit

8kV ESD pulse (defined by International Standard, IEC)

2

First major application is cell phones

Example: 0201 Resistor Pulsed with 8kV IEC Contact

Shocking Technologies 2013 APEC Conference

Shocking Corporate Overview

Founded July 2006

Production facility & Nanotech laboratory in Aug 2008- Sales Offices in US & Singapore

Industry Partners- Certified Manufacturers:

- PCB Electrical Test:

- Design Software:

University partners: Company has over 230 patents and applications on polymer,

applications and structures3 Shocking Technologies 2013 APEC Conference

http://www.unimicron.com/en/index.htm

http://www.multek.com/default.aspx

http://www.sanmina.com/index.php

http://www.cadence.com/us/pages/default.aspx

4

How Does VSD™ Material Work? Shocking’s Voltage Switchable Dielectric material allows for the creation of embedded ESD protection At operating voltages, VSDM is a standard dielectric At high voltages, VSDM turns into a conductor shunting dangerous ESD currents to the GND plane

L1

VSD™ Layer (All other dielectrics are standard materials)

Connector I/O

L2

L3

L4

PassiveActive

XStaticVSDM

Plated thru Via

Control Gap

GND Plane4 Shocking Technologies 2013 APEC Conference

XStatic incorporation into PCB/Substrate

Liquid Polymer

Polymer Coating on Foil

Sheet to Size Inventory & Distribution

Finished PCB/Flex

Warehousing/ Asia

Simple integration XStatic fits seamlessly into existing PCB/Flex ecosystemWe sell sheets of VSDM coated on copper foil to the PCB/Flex manufacturer

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2nd Sourcing in Certification


http://carestreamhealth.com/

http://www.unimicron.com/en/index.htm

http://www.multek.com/default.aspx

XStatic: A Voltage Switchable Dielectric™ (VSD™) “ Polymer Diode”

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A Voltage Switchable Dielectric™ (VSD™) behaves like an insulator (dielectric) during normal circuit operation (low voltage) and becomes conductive under high voltage event (i.e. ESD discharge). Material is a polymer composite analog to a varistor (variable resistor).

During conduction, the resistance changes so as to maintain a constant clamp voltage. Vclamp = Von + IRon The material becomes an insulator (high resistance) again after the voltage drops

back below the threshold to normal operating levels. The clamp is bi-directional – working equally well with both positive and negative pulsed

events. The sub-nanosecond response time is fast enough to clamp ESD transients to a safe

level.

Insulator

Conductor

ESD Transient Voltage+100 V +200 V +300 V +30 KV

Clamp Voltage“Adjustable”

-100 V-200 V-300 V-30 KV

Clamp Voltage“Adjustable”

“Normal”Operation


Xstatic™ Compared to other low capacitance DevicesVI Curve with Stepped TLP (100ns square wave pulse)

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Shocking’s VSDM turns on with a lower trigger than existing polymer surface Mount device and lower on state impedance than a Multi-layer varistor device

Vclamp = Von + IRon


XStatic Response to 8kV IEC Waveform

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8kV IEC pulse into 500 Ω load

XStatic Response

XStatic activation within1ns


Designing in XStatic

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Simulate

Modify schematic Layout

Input product schematic and run simulation. Identify

ESD vulnerable locations

Add XStatic switching structures to schematic in locations

recommended by simulation

Drop shapes into layout from Cadence/Mentor

Library

Step 1 Step 2 Step 3

No change to Design flow at OEM/ODM


STUDIES ON MODEL SYSTEMShocking Technologies, Inc.


Step 1: Protect Passive Components0201 Resistors Pulsed with 8kV IEC Contact


Step 2: Protect ICModel System Level Test on Active IC

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System Level Test Boardw/ Embedded VSDM

555 Timer

Vc

Zapping Pads

Embedded VSD Structures

R1

R2

1K

1K

Simplified Design SchematicIEC ESD Test

NAND Gate


Experimental Design

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Top view of the board (control) Bottom view of the board (control/VSD)

NAND Gate Chip

555 Timer

A QUAD NAND gate is selected for this experiment due to its simplicity which allows for easy functionality debugging

Each NAND gate has two inputs which are both tested (this will add up to 4×2 test pads).

All tests are based on direct Contact Discharge. The output of each NAND gate drives an LED. The 555 Timer output is also connected to an LED. The tests are carried at 2K, 4K, 6K, 8K, 10K, 12K, 15K,

20K, 25K and 30K volts using an HAEFELY IEC Gun.

Ground Pads

columns

Zapping Pads

columns

Timer LED

NAND gates LEDs


Comparing Control and Embedded VSDM – Brand A NAND

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Con

trol

VS

D

Hard fail

Soft fail

OK

NM: Not Measured

Contact IEC Pre zap 2K 4K 6K 8K 10K 12K 15K 20K 25K 30KNAND1 BD1 OK OK OK SOFT HARD NM NM NM NM NM NM

BD2 OK OK OK OK HARD NM NM NM NM NM NMBD3 OK OK OK OK HARD NM NM NM NM NM NMBD4 OK OK OK OK HARD NM NM NM NM NM NM

NAND2 BD1 OK OK OK SOFT HARD NM NM NM NM NM NMBD2 OK OK OK OK HARD NM NM NM NM NM NMBD3 OK OK OK OK HARD NM NM NM NM NM NMBD4 OK OK OK OK HARD NM NM NM NM NM NM

NAND3 BD1 OK OK OK OK HARD NM NM NM NM NM NMBD2 OK OK OK OK HARD NM NM NM NM NM NMBD3 OK OK OK OK HARD NM NM NM NM NM NMBD4 OK OK OK OK HARD NM NM NM NM NM NM

NAND4 BD1 OK OK OK HARD NM NM NM NM NM NM NMBD2 OK OK OK SOFT HARD NM NM NM NM NM NMBD3 OK OK OK HARD NM NM NM NM NM NM NMBD4 OK OK OK OK HARD NM NM NM NM NM NM

Contact IEC Pre zap 2K 4K 6K 8K 10K 12K 15K 20K 25K 30KNAND1 BD1 OK OK OK OK OK OK OK OK OK HARD NM

BD2 OK OK OK OK OK OK OK OK OK HARD NMBD3 OK OK OK OK OK OK OK OK OK OK HARDBD4 OK OK OK OK OK OK OK OK OK OK OK

NAND2 BD1 OK OK OK OK OK OK OK OK OK HARD NMBD2 OK OK OK OK OK OK OK OK HARD NM NMBD3 OK OK OK OK OK OK OK OK OK HARD NMBD4 OK OK OK OK OK OK OK OK OK HARD NM

NAND3 BD1 OK OK OK OK OK OK OK HARD NM NM NMBD2 OK OK OK OK OK OK OK OK HARD NM NMBD3 OK OK OK OK OK OK OK OK HARD NM NMBD4 OK OK OK OK OK OK OK OK OK HARD NM

NAND4 BD1 OK OK OK OK OK OK OK OK HARD NM NMBD2 OK OK OK OK OK OK OK OK HARD NM NMBD3 OK OK OK OK OK OK OK OK HARD NM NMBD4 OK OK OK OK OK OK OK OK OK OK OK


Comparing Control and Embedded VSDM – Brand B NAND

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Contact IEC Pre zap 2K 4K 6K 8K 10K 12K 15K 20K 25K 30K

NAND1 BD1 OK OK OK OK SOFT SOFT OK HARD NM NM NM

BD2 OK OK OK OK SOFT SOFT OK HARD NM NM NM

BD3 OK OK OK OK SOFT SOFT OK HARD NM NM NM

NAND2 BD1 OK OK OK OK SOFT OK OK HARD NM NM NM

BD2 OK OK OK OK OK SOFT OK HARD NM NM NM

BD3 OK OK OK OK SOFT OK OK HARD NM NM NM

NAND3 BD1 OK OK OK OK OK OK OK HARD NM NM NM

BD2 OK OK OK OK OK OK OK HARD NM NM NM

BD3 OK OK OK OK OK HARD NM NM NM NM NM

NAND4 BD1 OK OK OK OK SOFT OK OK HARD NM NM NM


BD3 OK OK OK OK SOFT HARD NM NM NM NM NM


NAND1 BD1 OK OK OK OK OK OK OK OK OK OK OK

BD2 OK OK OK OK OK OK OK OK OK OK HARD

BD3 OK OK OK OK OK OK OK OK OK HARD NM


BD2 OK OK OK OK OK OK OK OK OK OK HARD

BD3 OK OK OK OK OK OK OK OK OK OK OK

NAND3 BD1 OK OK OK OK OK OK OK OK OK HARD NM


BD3 OK OK OK OK OK OK OK OK HARD NM NM

NAND4 BD1 OK OK OK OK OK OK OK OK OK OK HARD

BD2 OK OK OK OK OK OK OK OK OK HARD NM

BD3 OK OK OK OK OK OK OK OK HARD NM NM

Con

trol

VS

D

Hard fail

Soft fail

OK

NM: Not Measured


Flex Demo Test Vehicle

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NAND IC inside



NAND1 BD1 OK OK OK OK HARD NM NM NM NM NM NM

BD2 OK OK OK OK SOFT SOFT HARD HARD NM NM NM

BD3 OK OK OK OK OK OK SOFT HARD NM NM NM

NAND2 BD1 OK OK OK OK HARD NM NM NM NM NM NM

BD2 OK OK OK SOFT OK OK OK HARD NM NM NM


NAND3 BD1 OK OK OK SOFT HARD NM NM NM NM NM NM



NAND4 BD1 OK OK OK SOFT HARD NM NM NM NM NM NM

BD2 OK OK OK SOFT OK OK OK HARD NM NM NM

BD3 OK OK OK OK OK SOFT OK HARD NM NM NM

ESD Test Results – Control vs. VSDM

17

Con

trol

VS

D

Hard fail

Soft fail

OK

NM: Not Measured











ESD Protection of Capacitance Touch Panel– In Development

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-Partnered with Multek (New Vision Display) to incorporate VSDM in FlexFirst prototype was to demonstrate VSDM could protect Atmel Controller ICESD protection from touch panel and from main PCB (per customer request)

Capacitance Touch Panel controller is Protected with Embedded VSDM

Test with interface boardTo check functionality


Capacitance Touch Display(powered off)

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pin Type Zap Location* Pre zap 2K 4K 6K 8K 10K 12K 15K 20K 25K 30KPin 1 VSDM Small Flex Tail OK OK OK OK OK OK OK OK OK OK FailedPin 2 VSDM Small Flex Tail OK OK OK OK OK OK OK OK OK OK FailedPin 3 VSDM Small Flex Tail OK OK OK OK OK OK OK OK OK OK FailedPin 4 VSDM Small Flex Tail OK OK OK OK OK OK OK OK OK OK FailedPin 5 VSDM Small Flex Tail OK OK OK OK OK OK OK OK OK OK FailedPin 6 VSDM Small Flex Tail OK OK OK OK OK OK OK OK OK OK FailedPin 7 VSDM Small Flex Tail OK OK OK OK OK OK OK OK OK OK FailedPin 8 VSDM Small Flex Tail OK OK OK OK OK OK OK OK OK OK FailedPin 1 Control Small Flex Tail OK OK OK OK OK FailedPin 2 Control Small Flex Tail OK OK OK OK OK FailedPin 3 Control Small Flex Tail OK OK OK OK OK FailedPin 4 Control Small Flex Tail OK OK OK OK OK FailedPin 5 Control Small Flex Tail OK OK OK OK OK FailedPin 6 Control Small Flex Tail OK OK OK OK OK FailedPin 7 Control Small Flex Tail OK OK OK OK OK FailedPin 8 Control Small Flex Tail OK OK OK OK OK Failed

*Test was run unpowered

ESD Pule = IEC Contact Discharge

Pulse contact to connector


Capacitance Touch Display -Powered On (Very Preliminary data)

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ControlPoint Zapped Prezap 2K 4K 6K 8K 10K 12K 15K 20K 25K 30KTop Left OK OK OK OK OK OK OK OK NM NM NMTop Right OK OK OK OK OK OK OK OK NM NM NMClose to Flex OK OK OK NO* OK OK OK NO NM NM NMCenter OK OK OK OK OK OK OK NM NM NM NMLower Left OK OK OK OK OK OK OK NM NM NM NMLower Right OK OK OK OK OK OK OK NM NM NM NM

VSDMPoint Zapped Prezap 2K 4K 6K 8K 10K 12K 15K 20K 25K 30KTop Left OK OK OK OK OK OK OK OK OK** OK* OK**Top Right OK OK OK OK OK OK OK OK OK OK* OK*Close to Flex OK OK OK OK* OK OK* OK* OK** OK OK* OK**Center OK OK OK OK OK OK OK OK OK OK OK*Lower Left OK OK OK OK OK OK OK OK OK OK OK*Lower Right OK OK OK OK OK OK OK OK OK* OK NM

IEC Air Discharge

IEC Air Discharge

No protection in interface boardTest was run powered

Yellow = soft failures

Likely due to pulseGetting in to interfaceboard


Rigid Flex Test Vehicle

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Cu 12 umVSDM 25 um

Acrylic Adhesive 25 um

PI 25 umCu 12 um

Flex Region Stack up


Preliminary Reliability Test Results

Flex Testing- Bending Diameter, R=8.6mm (R=L/2 π)- Bending degree: ~90°- Multimeter is used to detect the continuity after bending test.- Conclusions:

- Flex board with Embedded VSDM can survive greater than 1000 cycles.- Traces on VSDM side of copper (ED) may fail easier than non-VSDM side

of copper (RA).- Better performance can likely be achieved using VSDM coated onto RA

copper

Solder Reflow Testing- Lead Free Solder Reflow Profile (260C peak, >10sec above 255C)- Passes >8 cycles

Electrical Testing- Switching and electrical properties are comparable to results expected

from rigid PCB


Conclusions

Shocking Technologies embedded XStaticmaterial improves ESD performance- VSD™ can have significantly better performance

than discrete devices - Implemented globally for higher reliability- Protect active and passive components- Predictable ESD performance from system level

ESD modelingRigid PCB Product in production Flex Application Commercialization 2013

- Improved ESD performance demonstrated on Touch panel display

voltage switchable dielectric material offers novel ......the output of each nand gate drives an...

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