visio-standards org chart march 3 -2014 org chart... · c chapter c: w. bergholz -jacobs university...

Organizational Chart● China

● Europe

● Japan

● Korea

● North America

● Taiwan

Last updated: March 3, 2014

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SEMI China Photovoltaic TC Chapter

Photovoltaic

TC ChapterC: Guangchun Zhang -

CanadianSolar

C: Jun Liu - China Electronics

Standardization Institute

Crystalline Silicon PV

Module TF

L: Wei Zhou - Trina Solar

L: Qiang Huang - Trina Solar

L: Cheng Zhu - Suntech

L: Binglin Lu - ISTA-China

PV Silicon Wafer TF

L: Yuepeng Wan - LDK

L: Xiaoyong Wang - JAsolar

L: Jingang Lu - Suntech

Metal Paste for Crystalline

Silicon Solar Cells TFL: Rulong Chen - Suntech

L: Weiming Zhang - Heraeus

L: Mao Wang - DuPont

L: Shan Xu - Rutech

PV Diffusion Furnace Test

Methods TFL: Liangyu Liu - CETC-48th

L: Xianwu Cai - CETC-48th

L: Yu Si - Sevenstar

Polysilicon Packaging

Materials TFL: Lv Jinbiao - GCL Poly

L: Liu Xiaoxia - GCL

L: Binglin Lu - ISTA-China

Anti-Reflective Coated

Glass TF

L: Xiaogang Zhu - CPVT

L: Bing Yin - Suntech

Thin Film Silicon PV

Module TFL: Yaohua Mai - Baoding

Tianwei Solarfilms

L: Xinwei Niu - Chint Solar

L: Zhenyu Wu - Hanergy

PV Silicon Raw Materials

TF

L: Yan Dazhou - SINOSICO

L: Xiaoxia Liu - GCL

L: Dongxu Chu - SINOSICO

L: He Li - CPVT

PV Power Station Equipment

Integrated Performance TFL: Xiexiang Wu - GD Solar

L: Jie Miao - GD Solar

Crystalline Silicon PV Back

Contact Technology TF

L: Ton Schless - SIBCO

L: Fengming Zhang - Sunport

Crystalline Silicon Solar Cell TF

L: Dengyuan Song - YingLi Energy

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Gas & Liquid Chemicals

TC ChapterC: J-M Collard - Solvay Chemicals

C: G. Ferrier - Air Products

VC: G. De Vos - FFEM

Photovoltaic Automation

TC ChapterC: E. Teichmann - PEER Group

Equipment Automation

TC ChapterC: A. Honold - InReCon (I&C, PIC,

Metrics)

C: L. Pfitzner - FhG IISB (Metrics)

C: F. Petzold - Trustsec (I&C, PIC)

Silicon Wafer T

C ChapterC: W. Bergholz - Jacobs University of

Bremen

C: P. Wagner - Consultant

C: F. Passek - Siltronic

Compound Semiconductor

Materials TC ChapterC: A. Weber - SiCrystal

Photovoltaic Materials

TC ChapterC: P. Wagner - Consultant

C: H. Aulich - Solar Valley

SEMI Europe Regional Standards OrganizationCo-chairs: Bert Planting - ASML, Werner Bergholz - Jacobs University of Bremen

Vice-chair: Frank Petzold - Trustsec

3 / 33

SEMI Europe PV, PV Automation, Compound

Semiconductor and Silicon Wafer TC Chapters


TC ChapterC: P. Wagner - Consultant

C: H. Aulich - Solar Valley

Silicon Wafer

TC ChapterC: W. Bergholz - Jacobs University of

Bremen

C: P. Wagner - Consultant

C: F. Passek - Siltronic

International Terminology

TFL: P. Wagner - Consultant

L: M. Bullis - Materials &

Metrology

L: T. Nakai - SUMCO

International Advanced

Wafer Geometry TFL: J. Sinha - KLA-Tencor

L: S. Akiyama - Raytex

L: F. Passek - Siltronic

L: F. Riedel - Siltronic

PV Silicon Materials TF

L: Peter Wagner - Consultant

Int’l PV Analytical Test

Methods TFL: Hugh Gotts - Air Liquide

Electronics US

PV Wafer Traceability TF

L: TBD


Materials TC ChapterC: A. Weber - SiCrystal

Contactless Resistivity

and Mobility Mapping TFL: W. Jantz - Semimap

SiC TF

L: A. Weber - SiCrystal


TC ChapterC: E. Teichmann - PEER Group

International Test

Methods TFL: P. Wagner - Consultant


Metrology

L: R. Takeda - GlobalWafers


Surface Inspection TFL: F. Riedel - Siltronic

L: K. Haller - KLA-Tencor

L: M. Ikota - Hitachi High

Technologies

International Polished

Wafers TFL: F. Riedel - Siltronic


Metrology

L: T. Nakai - SUMCO

Int’l PV Equipment Interface

Specification (EIS) TFL: C. Born - VITRONIC GmbH

4 / 33

Precursor Specifications

TFL: P. Williams - SAFC Hitech

Gas & Liquid Chemicals

TC ChapterC: J-M Collard - Solvay Chemicals

C: G. Ferrier - Air Products

VC: G. De Vos - FFEM

Equipment Automation

TC ChapterC: A. Honold - InReCon (I&C, PIC,

Metrics)

C: L. Pfitzner - FhG IISB (Metrics)

C: F. Petzold - Trustsec (I&C)

Process Control Systems

TFL: M. Schellenberger - FhG

IISB

SEMI Europe Equipment Automation,

and Gas & Liquid Chemicals TC Chapters

Solvents in Advanced

Processes TFL: G. De Vos - FFEM

International Reticle SMIF Pod

& Loadport Interoperability TFL: Astrid Gettel-GLOBALFOUNDRIES

L: Koji Ohyama - Dainichi Shoji

Permeation Tubes for Trace

Moisture Calibration TFL: J-M Collard - Solvay Chemicals

L: Jim Mc Kinley - KIN-TEK

5 / 33

Information & Control

TC ChapterC: Takayuki Nishimura -

SCREEN

C: Mitsuhiro Matsuda - Hitachi

Kokusai Electric

Physical Interfaces &

Carriers TC ChapterC: Tsuyoshi Nagashima -

Miraial

C: Tsutomu Okabe - TDK

C: Keni Yamagata - DAIFUKU

Traceability

TC ChapterC: Yoichi Iga - Renesas

Electronics

C: Hirokazu Tsunobuchi -

Keyence


Materials TC ChapterC: Masayoshi Obara - Shin-Etsu

Handotai

Silicon Wafer

TC ChapterC: Naoyuki Kawai - The

University of Tokyo

C: Tetsuya Nakai - SUMCO

Packaging

TC ChapterC: Kazunori Kato - AiT

C: Masahiro Tsuriya - iNEMI

C: Yutaka Koma - Koma

Consulting

Micropatterning

TC ChapterC: Morihisa Hoga - Dainippon

Printing

SEMI Japan Regional Standards OrganizationCo-Chair: Mitsuhiro Matsuda - Hitachi Kokusai Electric Co-Chair: Naoyuki Kawai - The University of Tokyo

Vice Chair: Supika Mashiro - TEL


TC ChapterC: Takashi Ishihara -

Mitsubishi Electric

C: Kazuhiko Kashima -

GlobalWafers Japan

C: Tetsuo Fukuda - AIST

Special Groups

Reporting to the JRSC

Gases & Facilities

TC ChapterC: Hiromichi Enami - Hitachi

High-Technologies

C: Isao Suzuki - MKS Japan

Environmental Health &

Safety TC ChapterC: Hidetoshi Sakura - Intel

C: Supika Mashiro - TEL

C: Moray Crawford - Hatsuta

Seisakusho

Liquid Chemicals

TC ChapterC: Hiroshi Tomita - Toshiba

C: Hiroyuki Araki - SCREEN

FPD Materials & Components

TC ChapterC: Hisashi Aruga - Seiko Epson

C: Tadahiro Furukawa - Yamagata

University

C: Yoshihiko Shibahara - FUJIFILM

FPD Metrology

TC ChapterC: Ryoichi Watanabe - Japan

Display Central

C: Akira Kawaguchi - Otsuka

Electronics

FPD Coordination Group

L: Yoshitada Nogami - SK

Electronics

L: Makoto Yamamoto - Muratec

Standardization Process

Integration (SPI)L: Supika Mahiro -TEL


TC ChapterC: Terry Asakawa -TEL

C: Emi Ishikawa - Atelier

Ishikawa

C: Makoto Ishikawa - Nisshinbo

Mechatronics

Test

TC ChapterC: Hirofumi Kaga - Renesas

Electronics

C: Takashi Umenaga -

Teradyne

Photovoltaic

TC ChapterC: Hiromu Takatsuka -

Mitsubishi Heavy Industries


GlobalWafers Japan

C: Masaaki Yamamichi - AIST

C: Terry Asakawa - TEL

Metrics

TC ChapterC: Toshio Murakami -Murakami

Corporation

6 / 33

Micropatterning

TC ChapterC: Morihisa Hoga - Dainippon

Printing

C: open

SEMI Japan Compound and Micropatterning TC Chapters

5 Year Review TF

L: Morihisa Hoga - Dainippon

Printing


Materials TC ChapterC: Masayoshi Obara - Shin-Etsu

Handotai

C: open

5 Year Review TF

L: TBD

Global 200 mm GaAs

Wafer Specification TFL: TBD

Sapphire Substrate TF

L: Toshiro Kotaki - Namiki

Precision Jewel

Mask Data Format for

Mask Tools TFL: Toshio Suzuki - Dainippon

Printing

International SiC TF

L: Taizo Hoshino - Nippon Steel & Sumikin Materials

7 / 33

Environmental, Health &

Safety TC ChapterC: Hidetoshi Sakura - Intel

C: Supika Mashiro - TEL

C: Moray Crawford - Hatsuta

Seisakusho

S23 Revision TF

L: George Hoshi - TEL

L: Lauren Crane – KLA-Tencor

SEMI Japan EHS TC Chapter

STEP Planning WG

L: Kenji Sugihara - Panasonic

GHG Emission

Characterization TFL: George Hoshi - TELL: Tetsuya Kitagawa - Sony

Seismic Protection

TFL: Eiji Nakatani - Sokudo

FPD System Safety TF

L: Ikuo Goto - Muratec

Automation

L: Naokatsu Nishiguchi -

SCREEN

8 / 33

SEMI Japan FPD Materials & Components

and Metrology TC Chapters

FPD Materials & Components

TC ChapterC: Hisashi Aruga -

C: Tadahiro Furukawa - Yamagata

University

C: Yoshihiko Shibahara - Fujifilm

Backlight TF

L: Satoshi Kanazawa - Stanley

L: Masami Takagi - Harison

Toshiba Lighting

L: Kazuyoshi Yamaguchi -

Panasonic Photo & Lighting

Polarizing Film TF

L: Toshihito Otsuka - Sanritz

L: Yoshihiko Shibahara -

Fujifilm

L: Shigeo Kobayashi - Nitto

Denko

Flexible Display TF

L: Takashi Shiro - Teijin

L: Tadahiro Furukawa -

Yamagata University

FPD Metrology

TC ChapterC: Ryoichi Watanabe - Japan

Display Central

C: Akira Kawaguchi - Otsuka

Electronics

D31 Revision TF

L: Kose Tanahashi - Samsung

Electronics

L: Masao Kochi - Highland

L: Keizo Ochi - Konica Minolta

Optics

FPD Color Filter TF

L: Hisashi Aruga -

9 / 33

SEMI Japan Gases & Facilities and

Liquid Chemicals TC Chapters

Gases and Facilities

TC ChapterC: Hiromichi Enami - Hitachi High

Technologies

C: Isao Suzuki - MKS Japan

F1 Revision TF

L: Shuji Moriya - Tokyo Electron

Yamanashi

L: Yoshifumi Machii - Fujikin

Gas Panel Test Method TF


L: Shuji Moriya - Tokyo Electron

Yamanashi

Liquid Chemicals

TC ChapterC: Hiroshi Tomita - Toshiba

C: Hiroyuki Araki - SCREEN

Diaphragm Valve TF

L: Shigeru Ohsugi - CKD

L: Kimihito Sasao - Advance

Electric

Welding Fitting TF

L: Kimihito Sasao - Advance

Electric

L: Takashi Hasegawa - KITZ

SCT

5-year Review TF

L: Koichi Ishikawa - ACE

Liquid Filter TF

L: Takuya Nagafuchi - Nihon

Entegris

L: Takehito Mizuno - Nihon Pall

5-year Review TF


Liquid-Borne Particle

Counter TFL: Kaoru Kondo - RION

L: Kazutoshi Kato - PMS

Standardization of live Gas

Flow Rate Study GroupL: Shuji Moriya - Tokyo Electron

Yamanashi

10 / 33

Metrics

TC ChapterC: Toshio Murakami - Murakami

Corporation

Physical Interfaces & Carriers

TC ChapterC: Tsuyoshi Nagashima - Miraial

C: Tsutomu Okabe - TDK

C: Keni Yamagata - DAIFUKU

TA: Takao Nojima - Intel

SEMI Japan PI&C and Metrics TC Chapters

Int'l Environmental

Contamination Control TFL: Mikio Furukawa - Shin-Etsu

Polymer

ESD/ESC TF

L: Toshio Murakami -

Murakumi Corporation

Global PI&C Standards

Maintenance TFL: Shoji Komatsu - ActeonEMC Study Group

L: Koji Ochi - Noise Laboratory

450 mm International

PI&C TFL: Shoji Komatsu - Acteon

(PIC-Si) Int’l 450 mm

Shipping Box TFL: Yasuhiro Shimizu -

Consultant

Cycle Time Metrics TF

L: Kenichiro Mukai - Applied

Materials Japan

L: Supika Mashiro - TEL


& Loadport Interoperability TFL: Koji Oyama - Dainichi Shoji

450 mm AMHS

TFL: Yoichi Motoori - Muratec

L: Kenji Yamagata - DAIFUKU

International Process Module

Physical Interface TFL: Supika Mashiro - TEL

Fiducial Mark Interoperability

TFL: Supika Mashiro - TEL

11 / 33

SEMI Japan PV, PV Materials,

and PV Automation TC Chapters


TC ChapterC: Takashi Ishihara - Mitsubishi

Electric


GlobalWafers Japan

C: Tetsuo Fukuda - AIST

Japan PV Materials TF

L: Tetsuo Fukuda - AIST

L: Takashi Ishihara - Mitsubishi

Electronic


TC ChapterC: Emi Ishikawa - Atelier Ishikawa


C: Makoto Ishikawa - Nisshinbo

Mechatronics

Photovoltaic

TC ChapterC: Hiromu Takatsuka - Mitsubishi

Heavy Industries


GlobalWafers Japan

C: Masaaki Yamamichi - AIST


Global PV Equipment Interface

Specification (PV-EIS) TFL: Takashi Murakami - TEL

L: Makoto Ishikawa - Nisshinbo

Mechatronics

12 / 33

Traceability

TC ChapterC: Yoichi Iga - Renesas Electronics

C: Hirokazu Tsunobuchi - Keyence

SEMI Japan Information & Control

and Traceability TC Chapters

5 Year Review

TFL: Hirokazu Tsunobuchi -

Keyence

Information and Control

TC ChapterC: Takayuki Nishimura - SCREEN

C: Mitsuhiro Matsuda - Hitachi

Kokusai Electric

Adviser: Mitch Sakamoto - TELTA

Hiroshi Kondo - Murata

Machinery

Tadashi Mochizuki - TEL

GEM300 TF

L: Yoshihisa Takasaki -

SCREEN

Japan PV Traceability TF

L: Yoichi Iga - Renesas

Electronics

L: Hirokazu Tsunobuchi -

Keyence

Equipment Information

System Security TFL: Mitch Sakamoto - TEL

Sensor Bus TF

L: Hideaki Ogihara - ALGO

System

Predictive Carrier

Logistics (PCL) TFL: Yuko Toyoshima - Hitachi

High-Technologies

L: Terry Asakawa - TEL

Japan I&CC Maintenance

TFL: Hideaki Ogihara - ALGO

System

L: Mitsuhiro Matsuda - Hitachi

Kokusai Electric


TFL: Mitsuhiro Matsuda - Hitachi

Kokusai Electric


TFL: Hirokazu Tsunobuchi - Keyence

13 / 33

Silicon Wafer

TC ChapterC: Naoyuki Kawai - The University of

Tokyo

C: Tetsuya Nakai - SUMCO

International Annealed

Wafers TFL: Koji Araki - GlobalWafers

Japan

SEMI Japan Silicon Wafer TC Chapter


TFL: Tetsuya Nakai - SUMCO


Wafer Geometry TFL: Satoshi Akiyama - Raytex

Japan JWG TF

L: Masanori Yoshise -

Freelance

L: Satoshi Akiyama - Raytex

International Test Method

TFL: Ryuji Takeda -

GlobalWafers Japan

International SOI Wafers

TFL: Atsushi Ogura - Meiji

University

L: Tetsuya Nakai - SUMCO


Surface Inspection TFL: Yusuke Tamaki - ATMI

Japan

L: Masami Ikota - Hitachi High

Technologies

JA Shipping Box TF

L: Shoji Komatsu - Acteon

L: Yasuhiro Shimizu - Shimizu

Consultant

International 450 mm

Wafer TFL: Masaharu Watanabe -

Semilab

L: Naoyuki Kawai - The

University of Tokyo


Shipping Box TFL: Yasuhiro Shimizu - Shimizu

Consultant

GOI WG

L: Tsuyoshi Otsuki - Shin-Etsu

Handotai

Surface Organic

Contaminant Analysis WGL: Yoshimi Shiramizu -

Renesas Electronics

Surface Metal Chemical

Analysis WGL: Ryuji Takeda - GlobalWafers

Japan

L: Hitoshi Torayama -

KOBELCO

BMD DZ WG

L: Satoshi Akiyama - Raytex

L: Kazuo Moriya - Raytex

Bulk Heavy Metal Analysis

by Electrical Measurement

WGL: Shingo Sumie - KOBELCO

L: Kei Matsumoto - SUMCO

International Epitaxial

Wafers TFL: Takao Takenaka - Takenaka

Consultant


Wafers TFL: Koji Izunome - GlobalWafers

Japan

Japan Test Method TF

L: Ryuji Takeda - GlobalWafers

Japan

L: Tsuyoshi Otsuki Shin-Etsu

Handotai

L: Mikako Omata - SCAS


TFL: Tetsuya Nakai - SUMCO

14 / 33

Test

TC ChapterC: Hirofumi Kaga - Renesas

Electronics

C: Takashi Umenaga -Teradyne

Packaging

TC ChapterC: Kazunori Kato - AiT

C: Masahiro Tsuriya - iNEMI

C: Yutaka Koma - Koma Consulting

Electromagnetic

Characterization SGL: Mikio Kiyono - AET

SEMI Japan Test and Packaging TC Chapters

Wafer Shipping Container for

Assembly &Packaging TF L:Yasuhiro Shimizu - Shimizu

Consultant

L: Kazuhiko Nakamura - Consultant

L: Tatsuya Yanagawa - Achilles

Packages & Packaging Materials

Eco-efficiency TFL: Shoichi Suzuki - Sumitomo Metal Mining

L: Kazuhiko Nakamura - Consultant

450 mm ATDP TF

L: Akihito Kawai - DISCO

L: Sumio Masuchi - DISCO

L: Kiyofumi Tanaka - SEP

L: Kenichi Watanabe - Lintec

DFM SG

L: Ichiro Anjo - Jisso Partners

3D-IC SG

L: Masahiro Tsuriya - iNEMIL: Haruo Shimamoto - AIST

Thin Chip (Die) Bending

Strength Measurement TF L: Haruo Shimamoto

L: Morihiro Kada - ASET

L: Shoji Yasunaga - Rohm


TFL: Sumio Masuchi - Disco

15 / 33

SEMI Korea Regional Standards Organization


TC ChapterC: Hyungsu Kim - Samsung SDS

C: Chul Hong Ahn - SK Hynix

C: Gun Woo Lee - Miracom Inc.

Facilities

TC ChapterC: Kwang Sun Kim - KUT

FPD Metrology

TC ChapterC: JongSeo Lee - Samsung

Display

C: II-Ho (William) Kim - Light

Measurement Solution

FPD


Display



EHS WG

L: Seung Jong Ko - SK Hynix

L: Hyunsuk Kim - Samsung

Electronics

HB-LED WG

L: HyeongSoo Park - SEMES

L: Jong Hyeob Baek - KOPTI

16 / 33

SEMI Korea FPD and FPD Metrology TC Chapters

FPD


Display



PDP Subcommittee

L: SeKwang Park - Kyungpook

Univ.

LCD Subcommittee

L: JongSeo Lee - Samsung

Display

OLED Subcommittee

L: Choonghoon Yi -

MODISTECH

FPD Metrology


Display



Tone and Color TF

L: Kyung Jin Kang - LG

Electronics

Perceptual Image Quality

TFL: Jongho Chong - Samsung

Display

Perceptual Viewing Angle

TFL: Myongyoung Lee - LG

Electronics

Transparent Display TF

L:JongSeo Lee - Samsung

Display

17 / 33

SEMI Korea Information & Control,

Facilities TC Chapters, EHS and HB-LED WGs


TC ChapterC: Hyungsu Kim - Samsung SDS

C: Chul Hong Ahn - SK Hynix

C: Gun Woo Lee - Miracom Inc.

EHS WG

L: Seung Jong Ko - SK Hynix

L: Hyunsuk Kim - Samsung

Electronics

S2 Sub-WG

L: Deok Seop Shim - TUV

Rheinland

S23 Sub-WG

L: Sangyun Jung - Samsung

Electronics

GEM 300 TF

L: Jong Sub Shim - ASM

L: Chang Yul Cho - SEMES

L: Byoung Min Im - TEL Korea

DDA TF

L: Hyungsu Kim - Samsung

SDS

Facilities

TC ChapterC: Kwang Sun Kim - KUT

Equipment Cleanness TF

L: Insoo Cho - Shinsung ENG

HB-LED WG

L: HyeongSoo Park - SEMES

L: Jong Hyeob Baek - KOPTI

18 / 33


TC ChapterC: Jack Ghiselli - Ghiselli Consulting

C: Brian Rubow - Cimetrix

C: Lance Rist - Industry Consultant


TC ChapterC: Matt Fuller - Entegris

C: Mutaz Haddadin - Intel

Metrics

TC ChapterC: David Bouldin - Fab Consulting

C: Mark Frankfurth - Cymer

Microlithography

TC ChapterC: Wes Erck - Wes Erck &

Associates

C: Rick Silver - NIST


Materials TC ChapterC: Russ Kremer - Freiberger

Compound Materials

C: James Oliver - Northrop Grumman

Silicon Wafer

TC ChapterC: Dinesh Gupta - STA

C: Noel Poduje - SMS

VC: Mike Goldstein - Intel

Traceability

TC ChapterC: Win Baylies - BayTech Group

C: Yaw Obeng - NIST

Facilities

TC ChapterC: Steve Lewis - DPS Engineering

Gases

TC ChapterC: Tim Volin - Parker Hannifin

C: Mohamed Saleem - Fujikin

Liquid Chemicals

TC ChapterC: Frank Flowers - FMC

C: Frank Parker - ICL

MEMS/NEMS


C: Janet Cassard - NIST

Environmental Health & Safety

TC ChapterC: Chris Evanston - Salus

Engineering

C: Sean Larsen - Lam Research AG

C: Bert Planting - ASML

Flat Panel Display

TC ChapterC: Bill Colbran - Engenuity Systems

SEMI N.A. Regional Standards OrganizationCo-Chairs: Jackie Ferrell - Sematech & Sean Larsen - Lam Research AG

NA RSC Technical Architect

BoardC: James Moyne - University of

Michigan

C: Yaw Obeng - NIST

Photovoltaic


C: James Moyne - University of

Michigan

3DS-IC

TC ChapterC: Richard Allen - NIST

C: Urmi Ray - Qualcomm

C: Sesh Ramaswami - Applied

Materials

C: Chris Moore

HB-LED

TC ChapterC: Iain Black - Philips

C: Mike Feng - Silian

C: Bill Quinn - WEQ Consulting

C: Chris Moore

Automated Test Equipment

TC ChapterC: Ajay Khoche - Khoche Consulting


TC ChapterC: Lori Nye - Brewer Science

C: John Valley - Sun Edison

19 / 33

Facilities

TC ChapterC: Steve Lewis - DPS Engineering

Analytical Methods TF

L: Frank Flowers - FMC

SEMI F57 Rewrite TF

L: James Henry - Arkema

Group

L: Ian Francisco - Lam

Research

Liquid Chemicals

TC ChapterC: Frank Flowers - FMC


SEMI N.A. Facilities & Liquid Chemicals TC Chapters

F51 Revision TF

L: Dalia Vernikovsky - Applied

Seals North America

Building Information Modeling (BIM) for

Semiconductor Capital Equipment TFL: Ben Bruce - Applied Materials

Determining Roughness

of Polymer Surfaces TFL: Marty Burkhart - Hi Pure

Tech

L: Gunter Moeller - Arkema

Group

SEMI IX Resin TF

L: Slava Libman - Air Liquide

UPW Filter Performance

TFL: Slava Libman - Air Liquide

SEMI F63 Rewrite TF

L: Slava Libman - Air Liquide

SEMI F31, F39 & F41

Rewrite TFL: David Kandiyeli - Mega Fluid

Systems

L: Koh Murai - Mega Fluid

Systems

SEMI F40 Rewrite TF

L: Marty Burkhart -Hi Pure Tech

Liquid Chemicals

SubcommitteeC: Frank Flowers - FMC


Liquid Chemical Distribution

SubcommitteeC: open

20 / 33

SEMI N.A. Compound Semiconductor

& Silicon Wafer TC Chapters

International Annealed

Wafers TFL: Dinesh Gupta - STA

International Epitaxial

Wafers TFL: Dinesh Gupta - STA


Wafers (Substrate) TFL: Murray Bullis - Materials &

Metrology

International SOI Wafers

TFL: Bich-Yen Nguyen - SOITEC


Wafer Geometry TFL: Noel Poduje - SMS

L: Jaydeep Sinha - KLA-Tencor


Surface Inspection TFL: Kurt Haller - KLA Tencor


TFL: Murray Bullis - Materials &

Metrology

Specifications Metrology Committee


Wafer TFL: Mike Goldstein - Intel


Materials TC ChapterC: Russ Kremer - Freiberger

Compound Materials

C: James Oliver - Northrop

Grumman

Electrical Properties TF

L: Austin Blew - LEI

SEMI M55 5-Yr Review TF

L: Judy Kronwasser - NOVASiC

Silicon Carbide TF

L: Open

GaN TF

L: Judy Kronwasser - NOVASiC

Silicon Wafer

TC ChapterC: Dinesh Gupta - STA

C: Noel Poduje - SMS

VC: Mike Goldstein - Intel

TE: Murray Bullis - Materials &

Metrology

International Test

Methods TFL: Dinesh Gupta - STA

21 / 33

S2 Interlock Reliability TF

L: Bert Planting - ASML

L: Tom Pilz - Pilz GmbH

Ergonomics TF

L: Ron Macklin - Macklin &

Associates

L: Paul Schwab - Texas

Instruments


TC ChapterC: Chris Evanston - Salus Engineering

C: Sean Larsen - Lam Research AG

C: Bert Planting - ASML

SEMI N.A. Environmental, Health & Safety TC Chapter

S2 Ladders & Steps TF


Associates

L: Carl Wong - AKT

L: Lindy Austin - Salus

Engineering

International Fire

Protection TFL: Matt Wyman - Koetter Fire

Protection

Lifting Equipment TF


Associates

S2 Chemical Exposure TF

L: John Visty - Salus

Engineering

S2 Machinery Directive

Mapping TFL: Lauren Crane - KLA-Tencor

S22 Revision TF

L: Chris Evanston - Salus

Engineering

L: Sean Larsen - Lam Research

AG

S6 Revision TF


Engineering

L: Glenn Holbrook - TUV SUD

S2 Non-Ionizing Radiation

TFL: Sean Larsen - Lam Research

AG


Engineering

S10 Revision TF

L: Bert Planting - ASML

L: Tom Pilz - Pilz GmbH

Manufacturing Equipment Safety

SubcommitteeC: Cliff Greenberg - Nikon Precision

C: Andrew Giles - ESTEC

C: Lauren Crane - KLA-Tencor

Hazardous Energy Control

Isolation Devices TFL: Andrew Giles - ESTEC

L: Sean Larsen - Lam Research AG

L: Mark Fessler - Tokyo Electron

S1 Revision TF

L: Lauren Crane - KLA-Tencor

L: Edward Karl - Applied

Materials

Seismic Liaison TF

L: Lauren Crane - KLA-Tencor

Fail-Safe/Fault-Tolerant

TFL: Lauren Crane - KLA-Tencor

L: Chris Evanston - Salus

Engineering

22 / 33

Microlithography

TC ChapterC: Wes Erck - Wes Erck &

Associates

C: Rick Silver - NIST

Terminology of Metrology

TFL: Jim Potzick - NIST

Extreme Ultraviolet (EUV)

Mask TFL: David Chan - SEMATECH

Mask Orders (P10) TF

L: Wes Erck - Wes Erck &

Associates

Data Path TF

L: Thomas Grebinski - OASIS

Tooling

L: Kurt Wampler - ASML

Traceability


C: Yaw Obeng - NIST

SEMI N.A. FPD, Microlithography

& Traceability TC Chapters

Standards for

Scatterometry TFL: Thomas Germer - NIST

Extreme Ultraviolet (EUV)

Fiducial Mark TFL: Long He - SEMATECH

Flat Panel Display

TC ChapterC:Bill Colbran - Engenuity Systems

5 Year Review TF

L: Win Baylies - BayTech

Group

23 / 33

Gases

TC ChapterC: Tim Volin - Parker Hannifin

C: Mohamed Saleem - Fujikin

Mass Flow TF

L: Mohamed Saleem - Fujikin

Pressure Measurement TF

L: Justin Hough - Applied

Materials

L: David Colquhoun - BriskHeat

Filters & Purifiers TF

L: Mohamed Saleem - Fujikin

Materials of Construction

Gas Delivery Systems TFL: Tim Volin - Parker

Hannifin

L: Bill Kiikvee - AP TECH

SEMI N.A. Gases TC Chapter

Heater Jacket TF

L: David Colquhoun - BriskHeat

Gas Specifications TF

L: Mark Ripkowski - CONSCI

Surface Mount Sandwich

Component Dimensions TFL: Matt Milburn - UCT

24 / 33


TC ChapterC: Brian Rubow - Cimetrix

C: Jack Ghiselli - Ghiselli Consulting

C: Lance Rist - Industry Consultant

GEM300 TF

L: Brian Rubow- Cimetrix

L: Gino Crispieri - Consultant

Diagnostic Data

Acquisition (DDA) TFL: Brian Rubow - Cimetrix

L: Gino Crispieri - Consultant

Sensor Bus TF


Michigan

Process Control System

Architecture (PCS) TFL: James Moyne - University of

Michigan

L: Chris Maloney - Intel

Automated Test Equipment

TC ChapterC: Ajay Khoche - Khoche Consulting

Standard Test Data

Format (STDF) TFL: Ajay Khoche - Khoche

Consulting

SEMI N.A. Information & Control

and Automated Test Equipment TC Chapters

Test Cell Communcations

TFL: Len Van Eck - LTX-

Credence

L: Mark Roos - Roos

InstrumentsEnergy Saving Equipment

Communication TFL: Gino Crispieri - Consultant

L: Mike Czerniak - Edwards

Vacuum

25 / 33

SEMI N.A. 3DS-IC & MEMS/NEMS TC Chapters

MEMS/NEMS


C: Janet Cassard - NIST

Packaging TF

L: Steve Martell - Sonoscan

Wafer Bond TF

L: Win Baylies - BayTech

Group

L: Richard Allen - NIST

Material Characterization

TFL: Janet Cassard - NIST

L: Kevin Turner - University of

Pennsylvania

International MEMS

Terminology TFL: Steven Martell - Sonoscan

Reliability TF

L: Open

3DS-IC

TC ChapterC: Richard Allen - NIST

C: Urmi Ray - Qualcomm

C: Sesh Ramaswami - Applied

Materials

C: Chris Moore

3DS-IC Bonded Wafer TF


3DS-IC Inspection and

Metrology TFL: Victor Vartanian -

SEMATECH

L: David Read - NIST

3DS-IC Thin Wafer

Handling TFL: Urmi Ray - Qualcomm

L: Raghunandan Chaware -

Xilinx


Microfluidics TF

L: Mark Tondra - Diagnostic

Biosensors

26 / 33

SEMI N.A. HB-LED TC Chapter

HB-LED

TC ChapterC: Iain Black - Philips

C: Bill Quinn - WEQ Consulting

C: Mike Feng - Silian

C: Chris Moore

HB-LED Equipment

Automation Interfaces TFL: Daniel Babbs - Brooks

Automation

L: Jeff Felipe - Entegris

HB-LED Assembly TF

L: Paul Reid - Kulicke & Soffa

HB-LED Wafer TF

L: Win Bayles - BayTech Group

HB-LED Impurities and Defects

in Sapphire Wafers TFL: Luke Glinski - GT Advanced

Technologies

HB-LED Equipment

Communication Interfaces TFL: Brian Rubow - Cimetrix

Patterned Sapphire

Substrate (PSS) TFL: Win Bayles - BayTech Group

27 / 33

Metrics

TC ChapterC: David Bouldin - Fab Consulting

C: Mark Frankfurth - Cymer

TE: Carolyn Busing - Self

TE: Chona Shumate - Cymer

TA: Greg Francis - Cymer

SEMI N.A. Physical Interfaces & Carriers

and Metrics TC Chapters


TC ChapterC: Matt Fuller - Entegris

C: Mutaz Haddadin - Intel

Global PIC Maintenance

TFL: Larry Hartsough - UA

Associates

Metrics Education & Adoption

(MEA) Subc (inactive)C: TBD

EMC TF

L: Vladimir Kraz - BestESD

Technical Services

L: Mark Frankfurth - Cymer

ESD/ESC TF

L: Arnold Steinman - Electronics

Workshop

L: open

Factory Level Productivity

Metrics TF (inactive)L: Ron Billings - Georgia Tech/

FABQ

L: Jim Irwin - I/C Irwin Consulting

EUV Reticle Handling TF

L: Long He - SEMATECH

L: David Chan - SEMATECH

L: John Zimmerman - ASML

L: David Halbmaier - Entegris

L: Kazuya Ota - Nikon

International 450 mm PIC

TFL: Mutaz Haddadin - Intel

L: Shoji Komatsu - Acteon

NA 450mm Shipping Box

TFL: Tom Quinn - Intel

Equipment Training &

Documentation TFL: Mark Cohran - Intel

L: Malthi Venkat - Nikon Precision


Shipping Box TFL: Tom Quinn - Intel

L: Yasuhiro Shimizu -

Consultant

450mm ATDP TF

L: Stefan Radloff - Intel

Wait Time Waste Metrics

and Methods TFL: Jackie Ferrell - Sematech

L: Lance Rist - Industry

Consultant

Equipment RAMP Metrics

TFL: David Busing - Consultant

L: Steven Meyer - Intel


& Loadport Interoperability TFL: Astrid Gettel-GLOBALFOUNDRIES

L: Koji Oyama - Dainichi Shoji

International Process Module

Physical Interface TFL: Supika Mashiro - TEL

L: Richard Oechsner - Fraunhofer

Equipment Cost of

Ownership TF (inactive)L: Daren Dance - WWK

L: David Bouldin - Fab Consulting

28 / 33

SEMI N.A. Photovoltaic

& Photovoltaic Materials TC Chapters


TC ChapterC: Lori Nye - Brewer Science

C: John Valley - Sun Edison

PV Electrical & Optical

Properties Measurements TFL: Austin Blew - LEI

L: Chris Moore

International PV Analytical

Test Methods TFL: Hugh Gotts - Air Liquide

Electronics US

Photovoltaic



Michigan

29 / 33

SEMI Taiwan Regional Standards Organization

Information and Control

TC ChapterC:Robert Chien - TSMC


TC ChapterC:Shuh-Woei Yu - SAHTECH

C: Fang-Ming Hsu - TSMC

Flat Panel Display

TC ChapterC: Tzeng-Yow Lin - CMS/ITRI

C: Jia-Ming Liu - TDMDA

Photovoltaic

TC ChapterC : B. N. Chuang - CMS/ITRI

C : J.S. Chen - TeraSolar

C : Ray Sung - UL Taiwan

ISC Taiwan Advisor

Tzeng-Yow Lin - CMS/ITRI

3DS-IC

TC ChapterC: Tzu-Kun Ku - ITRI

C: Wendy Chen - King Yuan

Electronics

C: Yi-Shao Lai - ASE

30 / 33

SEMI Taiwan 3DS-IC & Environmental, Health & Safety TC

Chapters


TC ChapterC: S. W. Yu - SAHTECH

C: F. M. Hsu - TSMC

IC Equipment Safety TF

L: Colin Shen - MXIC

L: C. C. Huang - SAHTECH

Gas and Chemical Safety

TFL: Benny Chen - AUO

L: Heng-Li Sue - SAHTECH

L: Moony Lee - UMC

Seismic TF

L: K. C. Tsai - NCREE

L: J. S. Hwang - NCREE

L: D. W. Sun - TSMC

FPD Safety Subcommittee

L: C. C. Huang - SAHTECH

Equipment Safety TF

L: Benny Chen - AUO

L: Juo Cho - AUO

L: Alice Lin - CMO

EHS TC Chapter

AdvisorRoger Wu - UMC

Environmental

Sustainability TFL: Tony C. H. Lu - ITRI

L: C Y Huang - TSMC

3DS-IC

TC ChapterC: Tzu-Kun Ku - ITRI

C: Wendy Chen - King Yuan

Electronics

C: Yi-Shao Lai - ASE

Test TF

L: Tzong-Tsong Miau - ITRI

L: Roger Hwang - ASE

L: Ming-Chin Tsai - KYEC

PV Safety

TFL: Eddie Wu - Nexpower

LED Safety

TFL: Eric Lin - Epistar

Middle End Process TF

L: Arthur Chen - NTUST

L: Erh Hao Chen - ITRI

L: Jerry Yang - SEMATECH

31 / 33

SEMI Taiwan Flat Panel Display TC Chapter

Flat Panel Display

TC ChapterC: Tzeng-Yow Lin - CMS/ITRI

C: Jia-Ming Liu-TDMDA

Liaison TF

L: YP Lan - ITRI

L:DA Chang - Kingbird

L:RJ Chuang - TDMDA

L:Tony Chiu - CIPO

ACG TF

L: S.P. Wang - DTC/ITRI

L: Garfield Pan - AUO

Flexible Display TF

L: WangWen - Tung-ITRI

LCD Subcommittee

L: Kerson Wang - AUO

3D Display Metrology TF

L: Wen-Chuan Tsai - AUO

L: Bao-Jen Pong - CMS/ITRI

L: Kuen Lee - EOL/ITRI

E-Paper Display TF

L: Fang Hui - Mei

L: Bor-Jiunn Wen - CMS/ITRI

Touch Screen Panel TF

L: Yen-Wen Fang - AUO

L: S.Y. Chou - CMS/ITRI

32 / 33

SEMI Taiwan Information & Control and

Photovoltaic TC Chapters

Photovoltaic

TC ChapterC : B. N. Chuang - CMS/ITRI

C : J.S. Chen - TeraSolar

C : Ray Sung - UL Taiwan

Organic & Dye Sensitized

Solar Cell TFL : Der-Ray Huang - NDHU

L: T.C. Wu - CMS/ITRI

PV Wafer Measurement

Method TFL : Samunine Chen - Chunson


TC Chapter

C: Robert Chien - TSMC

Equipment Engineering

System (EES) TFL : Ivan Chen - TSMC

L: Jack Huang - MKS

Factory Integration TF

L : MT Yeh - PSC

L: Robert Weng - TEL

L: H. S You - Energywell

Liaison - TSIA

Celia Shih - TSIA

Information & Control TC

Chapter AdvisorThomas W.Y Chen - TSMC

PV Package Performance

TFL: C.C.Lin - PV Guider

L: Bor -Tsuen Wang - National

Pingtung Unviersity


L: Ivan Chou - Delsolar

L: K.T.Lee - King Design

Automated Material Handling

System (AMHS) TFL :William Liu - UMC

L: Hu Szn Fan - UMC

Building Integrated

Photovoltaic (BIPV) TFL: C.C.Lin - PV Guider

L: Der-Ray Huang - NDHU


L: Ivan Chou - Delsolar

L: K.T.Lee - King Design

L: K. Han Ke - Gran System

33 / 33

visio-standards org chart march 3 -2014 org chart... · c chapter c: w. bergholz -jacobs university...

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