Ver ： GC-2.4

Company LocationCompany Location

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• Company GIANTA CO., LTD • Address No.130, Sec. 2, Yangsin Rd., Yangmei

Township, Taoyuan County 326, Taiwan (R.O.C.)• Inauguration Date July 4, 2000

• Capital Investment NT$21,224,900

• Board Of Directors C.E.O. H.C.Yen Director Y.M.Yang Director S.J.Huang Director C.H. Lin Director J.W.Chia Supervisor C.H. Hsiao

• Associated Bank 1.Cooperative Bank of Taiwan SHING-SHEN BRANCH 2.E.SUN Bank YANG MEI BRANCH

• Factory Area 7,000sq.m

• Workforce 240Workers (2013/02) • Principal Manufacturing SMT LINE X5 DIP LINE X3 (For PB Free)

ASSembly conveyor X2 ASSembly-Free Flow X1 AOI (SMT) X8

AOI (DIP) X1 X-RAY X2 Other Solder paste thickness analyzer High Resolution Digital Microscope Solder paste viscostiy tester Humidity & Temperature control ovens etc.

Company ProfileCompany Profile

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CEO President

Admin Division

Manufacturing Division

SMT Sec.

SMT Division

SMT PE Sec.

Quality Control Division.

Production Sec.

Admin Sec.

Purchasing Sec.

Quality Control Sec.

Technical Division

Manufacturing Sec.

OrganizationOrganization

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ISO 9001 2008 Ver

ISO 14000 2004 Ver.

SONY Certificate of Green Partner

Supervisor level with over 12yrs.

Manufacturing experience

AOI, X-RAY, Solder paste

Thickness analyzer,

High resolution digital

Microscope 3D analyzer,

CSP Repair Equipment

Etc.

*PCBA LCD Monitor、 Wireless(802.11) 、 BLUE TOOTH、 MFP、 DSC、 PDA 、 VGA、 GPS、 GSM、 LCDLCD TV、 IPC、DVBT TUNER MODULE etc.*FPCA CCD IMAGE BOARD(DSC) IMAGE MODULE(MOBILE PHONE) etc.*SET STB、 STORAGE PROD、 ADSL、 ROUTER 、 GPS etc.E-BooK， Game Capture. Optical Tx.Rx Module

Highest level industry equipment

SONY Medium speed mounter,

AOI inspection

Panasonic solder paste printer,

High Speed Mounters

UNIVERSAL General surface mounter

ETC N2 Reflow

Manufacturing Tooling

Design & SMT Technology

0201(0603) ，Micro BGA Chip

Pb free Prod.

maunfacturing

Quality

Cost

Delivery

Service

Environment

Customer satisfaction

NO.1

New equipment

latest

Development

SMT equipment

Highly qualified & trained management Skilled engineers to make a unique team

Most complete

Equipment for

Quality Assurance

Quality Assurance

and Environmental Protection System

Hi-grade

Manufacture

Technology

Varied products Manufacturing Ability

Company StrengthsCompany Strengths

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Production

Pilot Run Manufacture

Design Review & Setup

‧Manufacture scheduling‧Manufacturing control‧Product quality control‧Inventory control‧Delivery scheduling control

‧Design Review Results confirmation‧Pilot Run report‧Manufacturing tool design & production

‧Board design review & recommendation‧Prototype‧Prototype assessment report

Full manufacturing service SMT DIP assembly Function Test Packing delivery Full engineering support. meets customer’s total requirements.PCBA pilot run services Evaluate SMT、 DIP pilot run production, improve production efficiencies. Suitable for local design house using mainland production sources.Procurement service Components sourcing/purchase service,reduce customer’s logistical load, manpower + warehousing consideration

Professional Services & Support ServicesProfessional Services & Support Services

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Middle SpeedPlacer

Middle SpeedPlacer

Whole Process Auto-Optical Inspection

A Line M:330*250

B Line M:330*250

C Line

L:460*360

D Line

M:330*250

E Line

M:330*250

SolderPrinter

High Speed

Placer

LOADERSolderPrinter

AOIMiddle Speed

PlacerN2

RefolwMulti-Function

Placer

LOADERSolderPrinter

AOIHgh Speed

PlacerMiddle Speed

PlacerN2

RefolwMulti-Function

Placer

LOADERSolderPrinter

AOIHgh Speed

PlacerMiddle Speed

PlacerN2

RefolwMulti-Function

Placer

Middle SpeedPlacer

Middle SpeedPlacer

Multi-FunctionPlacer

N2Reflow

AOIInspector

SMT Manufacturing ResourceSMT Manufacturing Resource

LOADERSolderPrinter

Middle SpeedPlacer AOI

Middle SpeedPlacer

N2Refolw

Multi-Function

Placer

Middle SpeedPlacer

Capacity:3.5 Mil Shoots/22hrs

Capability:1.Chip:0201

2.Micro BGA: pitch 0.4mm ball 0.25mm

3.POP

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and others ----------

175X Video magnifier

KEYENCE VH6300

25X-40X LCD magnifier

SONY TW-TL1S

Paste viscosity tester

MALCOM PC-1TLBGA Repair Station

Oventemp,Porfile recorder

KIC Slim 2000X-Ray Inspection machine

MACRO SCIENCE MSX-2000

Paste thickness analyser

HS-2000 PackageIQFLex

WLAN2.4/5GHZShielding BOX

QA ResourceQA Resource

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Manufacturer Model SET Model Year Print Capability Tolerance

PANA SPP-V 4

00.1001.0201.0301.03

0.3 mm PITCH ±0.025 mm

SONY SI-P950 1 02.12 0.3 mm PITCH ±0.012 mm

Manufacturer Model SET Model Year Mount Capability Tolerance

PANA MSR 3

00.1001.0203.08

0.08 SEC/Chips ±0.10 mm

1Solder Paste Screen Printer

2 High Speed Chip Mounter

Equipment SpecificationEquipment Specification

EquipmentEquipment SpecificationSpecification

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Manufacturer Model SET Model Year Mount Capability Tolerance

SONY SI-E1000 7 00.10 0.198 SEC/Chips ±0.10 mm

SONY SI-E1100 1 03.09 0.17 SEC/Chips ±0.06 mm

SONY SI-F130 1 04.10 0.139 SEC/Chips ± 0.05 mm

SONY SI-F130 1 07.10 0.139 SEC/Chips ± 0.05 mm

SONY SI-G200MK3 2 10.12 0.139 SEC/Chips ± 0.05 mm

3 Mediun Speed Chip Mounter

Manufacturer Model SET Model Year Tolerance

UNIVERSALGSM-1 2 00.10

01.02 ±0.0127 mm

GSM-2 2 02.1203.09

SONY SI-G200 1 10.12 ±0.025 mm

4 General Surface Mounter

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Manufacturer Model SET Model Year Additioual Compatability

ETC NE06-81M40 2 08.02 Heat W/N2 & Pb free Solder Possible

ETC NIS-208 2 01.0803.07

Heat W/N2 & Pb free Solder Possible

ETC NIS2O-102C 1 02.12 Heat W/N2 & Pb free Solder Possible

Manufacturer

Model SET Model Year

Resolution Detectable conditions

PWB visual

inspectorMIRTEC SONY

MV-2HTL CPC-1500

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310.0903.09

25umMissing parts, off-center,

standing,bridging,

PWB visual

inspectorMIRTEC MV-2HTL 1 07.08 15.9um

Missing parts, off-center,

standing,bridging,

5 Reflow Oven

6 CHIP Visual Optical Inspection

Equipment SpecificationEquipment Specification

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Manufacturer Model SET

25X→40X LCD magnifier SONY TW-TL1S 1

X-RAY Inspection Machine TECHNO TE-X2000MD 1

Paste thickness analyser MALCOM TD-3 1

Paste viscosity tester MALCOM PC-1TL 1

Oven temp. profile recorder MALCOM RC9 2

Paste blender GENITEC GAM-60 1

175X video magnifier KEYENCE VH6300 1

100X mcroscope inspection station HOZAN 1

SMD machine lang.Converter software SWIN SWIN-1000 1

MSD Ultra Low Humidity Cabinet ACE Dragon SDE-315 2

BGA/CSP repair work station FONTON RD-200 1

Humidify & temperature

Control ovens W/N2

COUN SMO-5 1

PCB “V” cut TME TB150-90 1

Router ELI ELI-5400 1

Ultrasonic welder IYEN W-22-F15C 1

Miscellaneous Numerous others

7 Additional Support Testing Equipment

Equipment SpecificationEquipment Specification

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Reflow profile each LOT

Product quality control-daily monthly Report【 All mounted parts are inspected 】

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Solder paste control-stock rotationSolder paste printing quality control All printed pads AOI inspected for sufficient coverage

Solder paste control-stock rotation

Reflow profile each LOT

Product quality control-daily

Solder paste printing quality control All printed pads AOI inspected for sufficient coverage

【 All mounted parts are inspected 】

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REFLOW

AOI

Complete product

OK

NGRepair

F / B

Chip mounting

OK

PCB loading

Chip mounting

REFLOW

AOI

PCB loading

Solder paste printing

OK

OK

NGRepair

F / B

Solder paste printing

SMT Flow ChartSMT Flow Chart

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Hand mount

Board loading

Touch up

DIP (Wave soldering)

F / B

QC random Inspec.

Delivery

OKNG

Repair, analyze, measure

Finished product

Rework

Elec.Testing

Assembly

Testing &inspection

Packaging

OK

OK

NG

NGRepair

Repair

F/B

AOI

OK

NG

‧Visual inspection-1st board part confirmation

‧Repair report‧Prod.Report-daily+monthly

‧Visual inspection-1st board part confirmation

‧Prod. Report-daily+monthly

‧Visual inspection-1st board part confirmation‧Defective product counter measure report‧Prod. Report-daily+monthly

‧QC report‧Delivery report

Mount & Assembly Flow ChartMount & Assembly Flow Chart

QC Engineer Diagram

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PROCEDURE

PROCESS /ITEM

CONTROL ITEM

CONTROL CONDITION

CONTROL FREQUENCY

EQUIPMENT, INSTRUMENT,

FIXTURE / USING RULERECORDS

OP or Auditor

DOCUMENT for OPERATION

1 IQC Incoming Material ControlAQL According to MIL-STD 105E

Item & Q'ty check by invoice

Vendor approval and major / minor defect definition

FW-0802-03-01-02 Inspection Record

IQC Op.WI-0704-01-03 Incoming inspection procedure.

　 　 　 Ma=0.4 Mi=0.65 　 　 　 　 　2 Baking PCB Baking 4hrs/125 Every Lot Oven Baking record. OP Customer request.　 　 IC Baking 4hrs/125 Every Lot Oven Baking record. OP Customer request.

3Preparation for material

Working order for apply material Product and Qty Customer order 　 Customer order SALES/PP Customer order

　 　 Programming Model, Product, Qty Every time in new line MC Dept. filing 　 Operator BOM　 　 Stencil Part number, edition Every time in new line 　 　 Operator 　4

To print solder paste at top side

Solder paste Leadfree Type(Customer spec) Every lot Solder paste machine. Daily report EngineerWI-3002A Solder paste instruction

　 　 Plane of knifeSet an angle at 60°, non-transparent area

Daily inspection Visual inspection 　 Operator 　

　 　 Clean parameter for stencilWipe by manual Automatic wipe

Manual: once per hour Auto: 10 pcs. / each run

Dustless paper/ cleaner/ air gun

　 Operator 　

　 　 Mix rate for solder pastestirred solder paste 3 minutes before using

Every bottleSolder paste shaking machine

　 Operator 　

　 　 The thickness of paste 7 ± 1mil.Once per 2 hrs or change line

LSM 　 Operator 　

　 　 Expiry of paste confirmation According to vendor's instruction Every bottleSolder paste inspection report

FM16-09 Expiry confirmation record.

Engineer 　

　 　 Storage temperature confirmation 0 ~ 10℃ Every bottleRefrigerator & thermometer

　 Engineer 　

　 　 Warm up time2 hours ， 20 ~30℃ ℃， RH40 ~ 60%

Every bottle Dry box & humidity meter　 Operator 　　 　 Validation after opening cap 24 hours Every bottle Dry box & humidity meter　 Operator 　

　 　 Printing quality inspection smooth, mis-position, poor soldering, short

Change line after, mass production before once per 2 hrs

Visual & paste thickness analyser

　 SMT's members

　

　 　 Inspection first article inspection Thickness of paste, position 　 magnifying glass 　 Operator 　　 　 Sampling inspect 2pcs/ per 30minsThickness of paste, position 　 magnifying glass 　 Operator 　

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QC Engineer Diagram5 Pick and Place Parts database & update To ensure parts specs P/R, new parts add upBOM FM16-02 Engineer BOM

　 　 Properly feeding & dispensingTo ensure station & parts while change line

Daily production/ prepare parts before change line

Visual inspectionFM16-03 CHIP confirmation sheet

OperatorWI-3004A, WI-3005A, WI-3006A

　 　 Properly on Ca & Cp of X-Y position

To avoid damage, reversed polarity, EC

Daily production/ change line first article inspection

Visual inspection & BOM

　 SMT's members

　

6 IR Reflow Temperature at each zonePre-heating area : average 0~4 /sec. Below℃

Every timeSlim-KIC Profiling recorder

FM16-06 Temperature records

Technician

WI-D080 IR reflow instruction

　 　 Speed of chainconstant temperature :150-190 time:60-120sec.℃

Ensure temp. & speed for stopping one month's product

IR- reflowFM16-05 IR reflow records

Engineer 　

　 　 　 IR Reflow: OVER 220 ℃above ， 30 ~ 75sec

　 　 Daily report 　 　

　 　 　 peak temp.:230-250℃ 　 　 　 　 　

　 　 　 Speed: 60-120 cm/m. Ref. Profile

　 　 　 　 　

7Inspection/ Touch up

Soldering spot & parts inspection

PCBA inspection criteria 100% inspection AOIDaily inspection report

Visual inspector

WI-3024B

　 　 Soldering spot, short, mis-soldering, wetless soldering

BOM 、 SOP, first article 100% inspection Visual inspection 　 　 　

　 　 Polarity, position, specs. 　 　 　 　 　 　

　 　 Short, duplicate, stand up 　 　 　 　 　 　

　 　 damaged parts, reversed polarity

　 　 　 　 　 　

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QC Engineer Diagram8

To print solder paste on reverse side

Solder paste Leadfree type(Customer specified) Every lotSolder paste thickness analyser.

Daily report EngineerWI3002A Solder paste instruction

　 　 Plane of knifeSet an angle at 60°, non-transparent area

Daily inspection Visual inspection 　 Operator 　

　 　 Clean parameter for stencilWipe by manual Automatic wipe

Manual: once per hour Auto: 10 pcs. / each run

Dustless paper/ cleaner/ air gun

　 Operator 　

　 　 Mix rate for solder pastestirred solder paste 3 minutes before using

Every bottleSolder paste shaking machine

　 Operator 　

　 　 The thickness of paste 7 ± 1mil.Once per 2 hrs or change line

LSM 　 Operator 　

　 　 Expiry of paste confirmation According to vendor's instruction Every bottleSolder paste inspection report

FM16-09 Expiry reservation record.

Engineer 　

　 　 Storage temperature confirmation 0 ~ 10℃ Every bottle Refrigerator & themometer　 Engineer 　

　 　 Warm up time2 hours ， 20 ~30℃ ℃， RH40 ~ 60%

Every bottle Dry box & humidity meter　 Operator 　

　 　 Validation after opening cap 24 hours Every bottle Dry box & humidity meter　 Operator 　

　 　 Printing quality inspection smooth, mis-position, poor soldering, short

Change line after, mass production before once per 2 hrs

Visual & paste thickness analyser

　 SMT's members

　

　 　 Visual inspection Thickness of paste, positionInspection first article inspection

magnifying glass 　 Operator 　

　 　 Visual inspection Thickness of paste, positionSampling inspect 2pcs/ per 30mins

magnifying glass 　 Operator 　

9 Pick and Place Parts database & update To ensure parts specs P/R, new parts add up BOM FM16-02 Engineer BOM

　 　 Properly feeding & dispensingTo ensure station & parts while change line

Daily production/ prepare parts before change line

Visual inspectionFM16-03 CHIP confirmation sheet

OperatorWI-3004A, WI-3005A, WI-3006A

　 　 Properly on Ca & Cp of X-Y position

To avoid damage, reversed polarity, EC

Daily production/ change line first article inspection

Visual inspection & BOM 　 SMT's members

　

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QC Engineer Diagram10 IR Reflow Temperature at each zone

Pre-heating area : average 0~4 /sec. Below℃

Every timeSlim-KIC Profiling recorder

profile records TechnicianWI-D080 IR reflow instruction

　 　 Speed of conveyorconstant temperature :150-190 ℃time:60-120sec.

Ensure temp. & speed for stopping one month's product

IR- reflow IR reflow records Engineer 　

　 　 　 IR Reflow: OVER 220 ℃above ， 30 ~ 75sec 　 　 　 　 　

　 　 　 peak temp.:230-250℃ 　 　 　 　 　　 　 　 Speed: 60-120 cm/m. Ref. Profile 　 　 　 　 　

11 InspectionSoldering spot, short, mis-soldering, wetless soldering

PCBA inspection criteria 100% inspection Visual inspection SMTVisual inspector

WI-C004 PCBA inspection criteria

　 　 Polarity, position, specs. BOM 、 SOP, first article 　 AOIdaily inspection report

　 　

　 　 Short, duplicate, stand up 　 　 　 　 　 　　 　 damaged parts, reversed parity 　 　 　 　 　 　　 　 Wave solder and repair 　 　 　 　 　 　

12 Singulation PCB type/Version V-Cut speed 1st. Art. Insp rec V-Cut Machine FM17-08C Operator 　

　 　 　 　 　 　 　 　 　

13Mount shield case

Preparation for shield case Part number Every piece Wave soldering,template 　 Operator 　

13Throughhole component

part number polarity of part insertion 　 Dip carrier jig 　 　 　

　 Wave solder Pot Temp. 260+/-5C start of ea. Lot temp. probe FM17-02A Operator WI3453D

　 　 velocity 1-1.1 m./min. 1st. Art. Insp rec elec. Display FM17-09F 　 　

　 　 pre-heat temp. >70 　 temp.probe 　 　 　

　 Touchup solder condition 1. poor solder each pc temp.control soldering iron　 Operator SOP

　 　 solder iron temprature 2.bridge 1pcs/ per 4 hrs solder iron temp.rec 　 　 　

14 InspectionSoldering spot, short, mis-soldering, wetless soldering

PCBA inspection criteria 100% inspection Visual inspection SMT use formVisual inspector

WI-C004 PCBA inspection criteria

　 　 Polarity, position, specs. BOM 、 SOP, first article 　 AOI 　 　 　

QC Engineer Diagram15 Function test Function test program,version

Function test fixture and result display

100% test 　 Daily report Operator Follow Customer SOP

16 FQC Sample test, According to Process inspection specification

MIL-STD-105E , Level ⅡAcc/Rej=0/1

　

FM24-04 QC record

Quality inspector

FM24-05 PCB Inspection SOP.

　 　 Appearance inspection Reference test specificationFM25-01 Inspection report.

Operator 　

　 　 Avoid scrach on surfaceAccording PCBA inspection specification

　 　 　

17 Packing Packing materials According to SOP procedure Each box. 　Daily production report

Operator Packing SOP.

　 　 S/N controlScan barcode for S/N(optional)

　 　 　 Foreman 　

　 　 Uniform on accessories 　 　 　 　 　 　

18 OQC Label, BOX, Module Q'tyShipping document.Customer Packing Spec.

Each box.Label printer.Packing machine.

OQC record. Operator QC Document

19 Stock inQty of finish goods & management

According to SOP for delivering procedure

Every lotImplement according to SOP

　 Operator 　

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