vdv
DESCRIPTION
parastic extractionTRANSCRIPT
Slide: 3
Physical Verification• Need for physical verification.
• Tools
DRC - verifies the physical integrity of the design.
ERC - verifies electrical integrity of IC designs.
LVS - Match the layout to the schematic design.
• How it works ?
Inputs :
• Layout – GDSII/Cif/Database
• Schematic – Spice/Database
Designer needs to write rules - DRC /ERC checks and LVS checks.
Major Tool Vendors. :
• Mentor – Calibre
• Cadence – Diva/Assura
Slide: 4
The Flow
Layer processing
DRC
Connectivity Extraction
Device Extraction.
ERC
LVS
•Design Flow•Design Flow
Slide: 5
Physical Verification
•Checks the design for fabrication feasibility and physical defects that could result in the design to not function properly 3 checks (DRC, ERC, and LVS)
•Design Rule Checks (DRC) Verifies that design does not violate any fabrication rules
associated with the target process technology (metal width/space, antenna ratio, etc)
•Electrical Rules Checks (ERC) Verifies that there are no short or open circuits with
power and ground as well as resistors/capacitors/transistors with floating nodes (part of LVS)
•Layout Versus Schematic (LVS) Final physical design matches the logical (schematic)
version in terms of correct connectivity and number of electrical devices •Hercules™ is the Sign-Oysical Verification•Hercules™ is the Sign-Oysical Verification
Slide: 6
ERC• Internal operations
Operates on the connectivity netlist.
Path tracing.
Property verifications.
• Related rule file contents
Pathchk , ( Calibre rule)
ERC SELECT CHECK X
X {PATHCHK !POWER PRINT POLYGONS file1}
Slide: 7
Physical Verification•Checks the design for fabrication feasibility and
physical defects that could result in the design to not function properly 3 checks (DRC, ERC, and LVS)
•Layout Versus Schematic (LVS) Final physical design matches the logical (schematic) version
in terms of correct connectivity and number of electrical devices
•Electrical Rules Checks (ERC) Verifies that there are no short or open circuits with power and
ground as well as resistors/capacitors/transistors with floating nodes (part of LVS)
•Design Rule Checks (DRC) Verifies that design does not violate any fabrication rules
associated with the target process technology (metal width/space, antenna ratio, etc)
•Hercules™ is the Sign-Off Tool for Physical Verification•Hercules™ is the Sign-Off Tool for Physical Verification
Slide: 8
Parasitic extraction
• Custom design “FLOW."
Schematic Entry
Layout Entry
Physical design verification• LVS
• DRC
• ERC
Parasitic extraction
Simulation
Slide: 9
Parasitic extraction Parasitic Extraction
Extracts the parasitic values of each interconnect and contact that will be on the silicon wafer
Parasitic Formats: SPF, RPF and DSPF
The standard parasitic format ( SPF ) describes interconnect delay and loading due to parasitic resistance and capacitance.
RSPF– Reduced SPF.
DSPF--- Detailed SPF , describes the actual parasitic
resistance and capacitance components of a net.
Slide: 10
Parasitic extraction: RC extraction
• After doing physical verification – LVS & DRC – parasitic capacitance, Resistance, and Devices are extracted. It extract PMOS and NMOS with real value of stray/parasitic capacitance
It extract RC of routes
It extract coupling capacitance
The standard parasitic format ( SPF ) describes interconnect delay and loading due to parasitic resistance and capacitance.
It extract DSPF (Detailed Standard Parasitic Format) which could be used as spice file
DSPF--- Detailed SPF , describes the actual parasitic resistance and capacitance components of a net
• Tool used Xcalibre (Mentor)
Assura (Cadence)
Simplex
Slide: 11
Run parasitic extraction
•To run parasitic extraction in open the layout view and go to StarRC | Parasitic Generation Cockpit. The setting should be automatically loaded for you as shown in Figure 14, but some options are useful to understand