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NOKIA 12 GSM MODULE HARDWARE INTEGRATION MANUAL

Contents

ACRONYMS AND TERMS ......................................................................................................1 1. ABOUT THIS DOCUMENT ................................................................................................3 2. INTRODUCTION ................................................................................................................4 3. MECHANICAL INTEGRATION...........................................................................................5

3.1 DIMENSIONS...............................................................................................................5 4. ELECTRICAL INTEGRATION ............................................................................................7

4.1 M2M SYSTEM CONNECTOR......................................................................................7 4.1.1 Electrical characteristics ........................................................................................8 4.1.2 Connector pin-out ..................................................................................................9

4.2 GROUNDING .............................................................................................................16 4.3 POWER SUPPLY.......................................................................................................16 4.4 SERIAL COMMUNICATION.......................................................................................17

4.4.1 PORT1.................................................................................................................17 4.4.2 PORT2.................................................................................................................18 4.4.3 PORT3.................................................................................................................18

4.5 SIM INTERFACE........................................................................................................18 4.6 AUDIO INTERFACE...................................................................................................19

4.6.1 Analog audio........................................................................................................19

4.6.1.1 Analog audio example ..................................................................................21 4.6.1.2 Acoustic echo ...............................................................................................23

4.6.2 Digital audio .........................................................................................................23

4.6.2.1 Sign-extended linear code ............................................................................24 5. RF AND ANTENNA INTEGRATION.................................................................................26

5.1 ANTENNA INSTALLATION ........................................................................................26 6. TEST BOARD FOR THE NOKIA 12 GSM MODULE .......................................................28

6.1 POWERING................................................................................................................28 6.2 SIM CARD READER ..................................................................................................28 6.3 RS-232 CONVERTERS..............................................................................................28 6.4 AUDIO ........................................................................................................................29

7. CERTIFICATIONS............................................................................................................32

7.1.1 RX-2.....................................................................................................................32 7.1.2 RX-9.....................................................................................................................32

7.2 TECHNICAL REQUIREMENTS .................................................................................33 7.2.1 SIM testing...........................................................................................................33 7.2.2 Power supply .......................................................................................................33 7.2.3 EMC/ESD and safety tests ..................................................................................33 7.2.4 RF testing ............................................................................................................33 7.2.5 RF exposure ........................................................................................................34 7.2.6 Additional type approval notes.............................................................................34

REFERENCES.......................................................................................................................35 APPENDIX: NOKIA 12 TEST BOARD PART LIST, ASSEMBLY DRAWING AND

SCHEMATICS ..................................................................................................................36

Legal Notice

Copyright © 2003-2004 Nokia. All rights reserved.

Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form without the prior written permission of Nokia is prohibited.

Nokia and Nokia Connecting People are registered trademarks of Nokia Corporation. Java and all Java-based marks are trademarks or registered trademarks of Sun Microsystems, Inc. Other product and company names mentioned herein may be trademarks or trade names of their respective owners.

Nokia operates a policy of continuous development. Nokia reserves the right to make changes and improvements to any of the products described in this document without prior notice.

Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental, consequential or indirect damages howsoever caused.

The contents of this document are provided "as is". Except as required by applicable law, no warranties of any kind, either express or implied, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this document. Nokia reserves the right to revise this document or withdraw it at any time without prior notice.

RX-9:

FCC/INDUSTRY CANADA NOTICE

Your device may cause TV or radio interference (for example, when using a telephone in close proximity to receiving equipment). The FCC or Industry Canada can require you to stop using your telephone if such interference cannot be eliminated. If you require assistance, contact your local service facility. This device complies with part 15 of the FCC rules. Operation is subject to the condition that this device does not cause harmful interference.

ACRONYMS AND TERMS

Acronym/term Description

A Ampere

AC Alternating Current

A/D Analog-to-Digital

API Application Programming Interface

AT ATtention (command language)

°C Celcius

CE Mark for a product that fulfils the EU safety and R&TTE requirements

CORBA Common Object Request Broker Architecture

CMOS Complementary Metal-Oxide Semiconductor

CSD Circuit Switched Data

CTS Clear To Send

dB Decibel

dBi Antenna Gain

DC Direct Current

DCD Data Carrier Detect

DCE Data Circuit Terminating Equipment

DSR Data Set Ready

DTE Data Terminal Equipment

DTR Data Terminal Ready

EARN Earphone Amplifier Inverting Input Pin

EARP Earphone Amplifier Non-Inverting Input Pin

EDGE Enhanced Data Rates for Global Evolution

EGSM Extended GSM

EMC Electromagnetic Compatibility

ESD Electrostatic Discharge

F Farad

°F Fahrenheit

FCC Federal Communications Commission

GGSN Gateway GPRS Support Node

GPRS General Packet Radio Service

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Acronym/term Description

GPS Global Positioning System

GSM Global System for Mobile Communication

HBM Human Body Model

Hi-Z High Impedance

HSCSD High Speed Circuit Switched Data

HW Hardware

Hz Hertz

IC Integrated Circuit

IP Internet Protocol

M2M Machine-to-machine

MICN Microphone amplifier inverting input pin

MICP Microphone amplifier non-inverting input pin

MMCX Miniature Microax

PCB Printed Circuit Board

PCM Pulse Code Modulation

RF Radio Frequency

RI Ring Indicator

RS-232 Interface, standardised by the Electronic Industries Alliance (EIA), for communication between computers, terminals, and modems

RTS Request to Send

RX-2 Type designation for the Nokia 12 GSM module (EGSM 900/GSM 1800 MHz bands)

RX-9 Type designation for the Nokia 12 GSM module (GSM 850/GSM 1900 MHZ bands)

SIM Subscriber Identity Module

SMS Short Message Service

SW Software

TCP Transmission Control Protocol

UART Universal Asynchronous Receiver/Transmitter

UDP User Datagram Protocol

V Volt

W Watt

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1. ABOUT THIS DOCUMENT

This document provides instructions for the Nokia 12 GSM module (hereafter Nokia 12 module) hardware integration. The document is intended to help the system integrator to integrate the Nokia 12 module into a remote end hardware application and to gain the necessary type approvals.

The document describes the mechanical, electrical and radio frequency (RF) integration as well as antenna installation. In addition the document describes the technical characteristics of the Nokia 12 test board, and lists the certifications and technical requirements needed for type approval.

Note: For more information on the Nokia 12 module usage and software integration, see the Nokia 12 GSM Module Product Specification, Nokia M2M Platform Software Developer’s Guide and Nokia M2M Platform Nokia 12 GSM Module IMlet Programming Guide.

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2. INTRODUCTION

The Nokia 12 module has been designed for M2M (machine-to-machine) applications and other wireless solutions. There are two versions of the Nokia 12 module:

• RX-2 dual-band GSM device supporting EDGE, GPRS, HSCSD, CSD, and SMS in EGSM 900/GSM 1800 MHz bands

• RX-9 dual band GSM device supporting EDGE, GPRS, CSD, SMS in GSM 850/GSM 1900 MHZ bands.

The Nokia 12 module can be used in several applications due to its three different operating modes. Simple I/O applications can be easily implemented by using the Nokia 12 module in the User control mode that offers message personalising, secure messaging, and timing functionality for SMS controlled I/O applications. In the AT command mode, the Nokia 12 module can be used as a GSM modem. In modem use, all supported bearers are available. The Nokia 12 module is Nokia M2M Platform compatible. In the M2M system mode, the Nokia 12 module communicates with the server application through the Nokia M2M Gateway, and all the compatible features of the Nokia 12 module are available for developing a wide range of M2M applications.

In addition to the different operating modes, the Nokia 12 module has an integrated TCP/IP stack which enables direct GPRS or GSM data connection between a remote end application and a server application. Due to the integrated TCP/IP stack, the HTTP and Socket APIs of the Nokia 12 are available for application development.

In addition to the bearers and operating modes listed above, the Nokia 12 supports several Java™ APIs, location service for external GPS module integration, reliability features like AutoPIN, GSM encryption and security codes, reset mechanism and Nokia M2M Platform authentication. Java technology support enables upgrading the application software over-the-air, and smart messaging makes the installation flexible. GSM phase 2+ supplementary services enable voice application development.

Note: All data bearers as well as TCP/IP are dependent on network support.

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3. MECHANICAL INTEGRATION

The Nokia 12 module contains two holes for mounting screws. The screws can be used in mounting, but are not compulsory. The Nokia 12 module has been tested according to the automotive standard DIN 72300-3 (although not in various temperatures), and it can be integrated into various applications without the screws.

3.1 DIMENSIONS The general dimensions and overall area of the Nokia 12 module are listed in Table 1 and Table 2.

Table 1. General dimensions of the Nokia 12 GSM module (in millimetres and inches)

Height 36 mm 1.41 inch

Width 45 mm 1.77 inch

Thickness 9 mm 0.35 inch

Table 2. Overall area of the Nokia 12 GSM module (in square centimetres and square inches)

Area 16.2 cm2 2.48 inch2

The detailed physical dimensions (in millimeters) of the Nokia 12 module are shown in Figure 1.

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Figure 1. Detailed physical dimensions of the Nokia 12 GSM module (in millimetres)

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4. ELECTRICAL INTEGRATION

4.1 M2M SYSTEM CONNECTOR All signals are routed through the M2M System Connector, except the antenna, which is routed through the miniature microax (MMCX) RF connector.

The M2M System Connector is a 60-pin (2 rows, 30 pins per row), 1.27 mm/0.05 inch pitch pin header connector. It has a frame that helps in the physical integration and also holds the Nokia 12 module firmly in position.

The possible mating connector is described in Table 3.

Table 3. Possible mating connectors for the Nokia 12 module

Supplier Part number Description

SAMTEC SFMC-130-02-S-D Female connector. Board-to-board

SAMTEC SFM-130-02-S-D Female connector. Board-to-board. With alignment mark.

Table 4 defines the recommended operating conditions for the actual device and/or interface operation, and Table 5 defines the absolute maximum ratings.

Table 4. Recommended operating conditions

Parameter Value Note

Supply Voltage (VBB) 3.6…4.0 V (3.8 V typical) Voltage must never drop below the low limit.

Logic voltage (I/O voltage)

1.8…5.0 V

DC output source or sink current (any I/O pin, user adjustable)

0…5 V Upper limit depending on I/O voltage.

Operating temperature range

-10…+55 °C

+14…+131 °F

Table 5. Absolute maximum ratings

Parameter Value

Supply voltage +4.2 V

DC input voltage (any signal pin) -0.5…5.5 V

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Parameter Value

Operating temperature range -25…+55 °C

-13…+131 °F

Storage temperature range -40…+85 °C

-40…+185 °F

4.1.1 Electrical characteristics All digital outputs (1-9) are open drain outputs, and all pins have a 10 kohm pull-up resistor to I/O voltage.

Table 6. Digital output characteristics

Parameter Value

Application load resistance >100 kohm

Application load capacitance <100 pF

High level output voltage minimum (Io=-20µA) 0.67*I/O voltage

Low level output voltage maximum (Io=1mA) 0.4 V

The analog inputs (AD1-3) have an input range of 2.7 V. All analog inputs have a 100 kohm pull-down resistor inside the Nokia 12 module. The AD channels are calibrated in production and the calibrated range is from 0.03 V to 2.77 V.

Note: Accuracy is not guaranteed outside the calibrated range.

Table 7. Analog input characteristics

Parameter Nominal

Input impedance 100 kohm

Input voltage range 0 - 2.8 V

Resolution 10 bits

Integral non-linearity +/-6 mV

Differential non-linearity +/-9 mV

Temperature drift < 5 mV

All digital inputs (4-11) are complementary metal-oxide semiconductor (CMOS) inputs, and all pins have a 10 kohm pull-up resistor to I/O voltage.

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Table 8. Digital input characteristics

Parameter Value

Application driving impedance <100 ohm

Low level input voltage (IO VOLTAGE/pin 52 1.8 - 5V)

0.15 V maximum

High level input voltage ((IO VOLTAGE/pin 52 1.8 - 5V)

1.6 V minimum

Table 9. Microphone input characteristics

Parameter Nominal Note

Differential input voltage range for microphone input (MICP & MICN)

0.316 VPP 2.0 VPP maximum

Microphone amplifier input resistor

50 kohm 30 kohm minimum

Table 10. Earphone output characteristics

Parameter Nominal Note

Differential output voltage for earphone output (EARP&EARN)

0.316 VPP 2.0 VPP maximum

Load resistance 1 kohm 30 ohm minimum

The IO VOLTAGE (pin 52) selects the logic level of all digital outputs/inputs. The specifications of the digital audio interface are the same as the digital inputs and outputs specifications.

All the M2M System Connector pins can handle 4 kV electrostatic discharge (ESD), classified according to the human body model (HBM).

4.1.2 Connector pin-out The odd number pins (1, 3, 5, 7…) are on one side of the connector and the even number pins (2, 4, 6, 8…) on the other side. Figure 2 illustrates the pin numbering of the M2M System Connector.

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Figure 2. Pin numbering of the Nokia 12 M2M System Connector The pin-out of the M2M System Connector in shown in Table 11.

Table 11. M2M System Connector pin-out

Pin Name Pin Name

1 VBB 2 GND

3 VBB 4 GND

5 VBB 6 GND

7 VBB 8 GND

9 VBB 10 GND

11 NC 12 NC

13 NC 14 NC

15 MICP 16 EARP

17 MICN 18 EARN

19 AD3 20 AD2

21 PCMDCLK 22 PCMSCLK

23 PCMTX 24 PCMRX

25 RESET T 26 RESET A

27 PORT1RX 28 NC

29 PORT1TX 30 OUTPUT2

31 OUTPUT3

32 OUTPUT4

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Pin Name Pin Name

33 OUTPUT5 34 INPUT6

35 INPUT5 36 AD1

37 BSI 38 PORT2RX

39 PORT2TX 40 PORT2RTS

41 PORT2CTS 42 OUTPUT8

43 INPUT8 44 OUTPUT9

45 SLEEPX 46 INPUT11

47 VSIM 48 SIMRST

49 SIMCLK 50 SIMDATA

51 SIMDET 52 IO VOLTAGE

53 OUTPUT1/P3RX 54 INPUT4/P3TX

55 INPUT10 56 INPUT7

57 OUTPUT6 58 OUTPUT7

59 INPUT9 60 NC

The pin functions are described in Table 12.

Table 12. M2M System Connector pin descriptions

Pin Name Description

1 VBB Device power. Voltage nominal 3.8 V, 3.6 V – 4.0 V, maximum current 2A peak. Regulated power input for the Nokia 12 module.

All VBB pins must be connected together at the application end. The device end is not fuse-protected, so the application should provide sufficient overload protection.

Current consumption can be as high as 2 A when transmitting at full power. When the Nokia 12 module is transmitting data, there is a current peak (max. 2A ) at 4.6 ms intervals that lasts 0.577ms (1 TX slot) or 1.154 ms (2 TX slots). Average power consumption is about 500 mA. The power supply should be designed according to this.

If the operating voltage falls below 3.4 V, the Nokia 12 module automatically shuts down. For more information on the power supply, see Chapter 4.3.

2 GND Return ground for device power. These pins are used for device power (VBB) return ground. Connect to common ground. All GND pins must be connected at

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Pin Name Description the application end. For more information on grounding, see Chapter 4.2.

3 VBB See PIN 1

4 GND See PIN 2

5 VBB See PIN 1

6 GND See PIN 2

7 VBB See PIN 1

8 GND See PIN 2

9 VBB See PIN 1

10 GND See PIN 2

11 NC Not used

12 NC Not used

13 NC Not used

14 NC Not used

15 MICP MICP is used with analog audio as differential positive input. The line is AC coupled at the device end. Frequency response is 300 - 3400 Hz. For more information on the analog audio, see chapter 4.6.1.

16 EARP EARP is used with analog audio as differential positive output. Frequency response is 300 - 3400 Hz. For more information on the analog audio, see Chapter 4.6.1.

17 MICN MICN is used with analog audio as differential negative input. The line is AC coupled at the device end. Frequency response is 300 - 3400 Hz. For more information on the analog audio, see chapter 4.6.1.

18 EARN EARN is used with analog audio as differential negative output. Frequency response is 300 - 3400 Hz. For more information on the analog audio, see chapter 4.6.1.

19 AD3 Input for 10 bit analog-to-digital (A/D) converter. The application end must scale voltage level between 0 -2.8 V.

20 AD2 See PIN 19

21 PCMDCLK PCMDCLK is a 512 kHz digital audio clock from the application module. Logic level is set by the IO VOLTAGE pin (pin 52). For more information on the digital audio, see Chapter 4.6.2.

22 PCMSCLK PCMSCLK is one PCMDCLK cycle that repeats itself every 64 PCMDCLK cycles. Frame sync frequency is thus is 8 kHz. The logic level is set by the IO

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Pin Name Description VOLTAGE pin (pin 52). For more information on the digital audio, see Chapter 4.6.2.

23 PCMTX Digital audio, transmits data from the device to the application. Logic level is set by the IO VOLTAGE pin (pin 52). For more information on the digital audio, see Chapter 4.6.2.

24 PCMRX Digital audio, receives data from the application to the device. Logic level is set by the IO VOLTAGE pin (pin 52). For more information on the digital audio, see Chapter 4.6.2.

25 RESET T Reset input for the Nokia 12 module, active low. The Nokia 12 module is reset when this line is low. Logic level is set by the IO VOLTAGE pin (pin 52). Minimum duration is approximately 500 ms.

26 RESET A Reset output for the application, active low. Reset goes high after approximately 170 ms of power-up. Logic level is set by the IO VOLTAGE pin (pin 52).

27 PORT1RX PORT1 receive. PORT1RX is an asynchronous serial channel receive pin. Functionality otherwise as in pin 29, PORT1TX. Logic level is set by the IO VOLTAGE pin (pin 52).

28 NC Not used

29 PORT1TX PORT1 transmit. PORT1TX is an asynchronous serial channel transmit pin that can be used with pin 27 (PORT1RX) to form a full duplex serial link. Pins 30-35 can be used to provide handshaking functions. Logic level is set by the IO VOLTAGE pin (pin52)

30 OUTPUT2 Digital output from device. Logic level is set by the IO VOLTAGE pin (pin 52). If the AT command mode is active, this pin is used as a Data Carrier Detect (DCD) output for Port 1.

31 OUTPUT3 Digital output from module. Logic level is set by the IO VOLTAGE pin (pin 52). If the AT command mode is active, this pin is used as Data Set Ready (DSR) output for Port 1.

32 OUTPUT4 Digital output from module. Logic level is set by the I/O voltage pin (pin 52). If the AT command mode is active, this pin is used as Clear To Send (CTS) output for Port 1.

33 OUTPUT5 Digital output from module. Logic level is set by the IO VOLTAGE pin (pin 52). If the AT command mode is active, this pin is used as Ring Indicator (RI) output for Port 1.

34 INPUT6 Digital input to module. Logic level is set by the IO VOLTAGE pin (pin 52). If the AT command mode is active, this pin is used as Request To Send (RTS)

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Pin Name Description input for Port 1.

35 INPUT5 Digital input to module. Logic level is set by the IO VOLTAGE pin (pin 52). If the AT command mode is active, this pin is used as Data Terminal Ready (DTR) input for Port 1

36 AD1 Input for 10 bit A/D converter. The application end must scale voltage level between 0 to 2.8 V.

37 BSI Input for 10 bit A/D converter. The application end must scale voltage level between 0 to 2.8 V.

38 PORT2RX PORT2 receive. PORT2RX is an asynchronous serial channel receive pin and it is used with pin 39. Logic level is set by the IO VOLTAGE pin (pin 52).

39 PORT2TX PORT2 Transmit. PORT2RX is an asynchronous serial channel transmit pin that is used with pin 38. Logic level is set by the IO VOLTAGE pin (pin 52).

40 PORT2RTS RTS for PORT2. PORT2RTS provides handshaking signal for asynchronous communication between the Nokia 12 module and the application when using PORT2. Works together with pin 41. Logic level is set by the IO VOLTAGE pin (pin 52).

41 PORT2CTS CTS for PORT2. PORT2CTS provides handshaking signal for asynchronous communication between the Nokia 12 module and the application when using PORT2. Works together with pin 40. Logic level is set by the IO VOLTAGE pin (pin 52).

42 OUTPUT8 Digital output from the Nokia 12 module. Logic level is set by the IO VOLTAGE pin (pin 52).

43 INPUT8 Digital input to the Nokia 12 module. Logic level is set by the IO VOLTAGE pin (pin 52).


45 SLEEPX Sleep indicator of the Nokia 12 module. When the Nokia 12 module is in the sleep mode, the level of this output pin is low, otherwise high. The sleep mode is automatic. Logic level is set by the IO VOLTAGE pin (pin 52).


47 VSIM Operating voltage for the SIM card, generated by the Nokia 12 module. For more information on the SIM interface, see Chapter 4.5.

48 SIMRST Reset signal for the SIM card, generated by the Nokia 12 module. For more information on the SIM interface, see Chapter 4.5.

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Pin Name Description

49 SIMCLK Clock signal for the SIM card, generated by the Nokia 12 module. For more information on the SIM interface, see Chapter 4.5.

50 SIMDATA Data line between the SIM card and the Nokia 12 module. For more information on the SIM interface, see Chapter 4.5.

51 SIMDET SIM card detection signal. For more information on the SIM interface, see Chapter 4.5.

52 IO VOLTAGE This pin sets logic level for the application. Voltage must be 1.8 V - 5.0 V. For more information on the power supply, see Chapter 4.3.

53 OUTPUT1 /

PORT3RX

Digital output from the Nokia 12 module. Logic level is set by the IO VOLTAGE pin (pin 52). If PORT3 is configured for serial communication, this is a receive (input) signal.

Note! Direction changes if pin 53 is configured for serial communication.

54 INPUT4 /

PORT3TX

Digital input to the Nokia 12 module. Logic level is set by the IO VOLTAGE pin (pin 52). If PORT3 is configured for serial communication, this is a transmitter (output) signal.

Note! Direction changes if pin 54 is configured for serial communication.






60 NC Not used

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4.2 GROUNDING There is only one common ground for the power supply and I/Os in the Nokia 12 module. That is, there are no separate analog/digital ground pins in the M2M System Connector.

All ground pins must be connected together at the application end. Grounding through screws is not allowed. The mounting screws must be isolated from the application ground.

4.3 POWER SUPPLY The Nokia 12 module is powered by the hardware application to which it is integrated. The operating voltage must not fall below the specification limit under any circumstances. The recommended operation conditions are shown in Table 4. For example, at full power, the TX can be up to 2 A, when current is drawn from the power supply. There are no capacitors on the power supply line of the Nokia 12 module, so the application must provide sufficient filtering.

The power supply must be capable of supplying at least 3 W average power, but it is recommended that the power supply also provides the peak current. Otherwise a large capacitor bank is needed to compensate the voltage drop during transmit bursts.

The Nokia 12 module does not have protection for over-voltage of current, so the hardware application must be equipped with one if there is a possibility for over-voltage. The hardware application should at least include a fuse.

The ripple on the operating voltage must not exceed 100 mV and the voltage must never drop below 3.6 V during operation.

The application must also produce I/O voltage. The logic levels of digital inputs and outputs correspond to this I/O voltage. I/O voltage can be supplied from a linear regulator.

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Figure 3. Example powering with simple DC/DC converter and linear regulator

4.4 SERIAL COMMUNICATION The Nokia 12 module is accessible through three different asynchronous serial interfaces with different protocols. The pins provide one asynchronous channel with a simple handshaking capability. The usage of the 3 ports can be configured with the Nokia 12 Configurator software. The Nokia 12 Configurator is downloadable at www.forum.nokia.com/m2m free of charge.

The Nokia 12 module supports the industry standard DB9 RS-232C connection, but an external level converter is required. For more information on the available handshake signals for different ports, see Chapters 4.4.1, 4.4.2 and 4.4.3.

The Nokia 12 module is a DCE (Data Communication Equipment) and the hardware application to which it is integrated is a DTE (Data Terminal Equipment). One possible method of implementing the level conversions is to use a MAX3237 transceiver or an equivalent integrated circuit (IC) level converter.

Note: When port settings are changed, the new settings will not become valid until the Nokia 12 module is restarted.

4.4.1 PORT1 PORT1 provides the first asynchronous channel. This port can be used with full 8 signal RS-232 handshaking signals. The baud rate for PORT1 can be between 1200 and 230400 bit/s.

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http://www.forum.nokia.com/m2m

Note: Baud rate 230400 bit/s can be used only with AT command mode and autobauding.

There are several settings for PORT1. The default setting for PORT1 is ‘HW Detection’. This means that when a 68 kohm resistor is set between the BSI (pin 37) and the ground, the Nokia 12 module enters the AT command mode when it is started. It is also possible to set the AT command mode on by using the Nokia 12 Configurator (the connection type is set to ‘AT’).

The Nokia 12 module provides all signals for the industry standard DB9 RS-232C connection, but an external level converter is required.

4.4.2 PORT2 PORT2 provides the second asynchronous channel with a simple handshaking capability (only RTS and CTS). The baud rate for PORT2 can be set to 9600, 19200, 38400, 57600 or 115200 bit/s. PORT2 is the default port for using the M2M System Protocol. However, if PORT1 is configured to use the M2M System Protocol, PORT2 cannot be used.

4.4.3 PORT3 PORT3 provides the third asynchronous channel with no hardware handshakes. The baud rate for PORT3 can be set between 1200 and 115200 bit/s.

4.5 SIM INTERFACE All leads from the M2M System Connector to the SIM card reader must be shorter than 15 cm/5.9 inches, because the voltage drop and increasing capacitance will affect timing. Furthermore, it is recommended that a 100 nF bypass capacitor is placed as close as possible to the SIM reader on the VSIM (pin47) line.

The leads between the M2M System Connector and the SIM card reader must be protected against interferences, and that is why the striplines must always be placed within the interlayers of the printed circuit board (PCB).

Note: The striplines must never be placed to the overlayer of the PCB.

A possible SIM card reader supplier is listed in Table 13.

Table 13. Possible SIM card reader supplier

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Supplier Part Number Description

Amphenol M-C707_10M006_522_2 SIM reader with a lid open indication switch.

7 5 5

3 2 1

DATA N C G ND

CLK RST VS IM

Figure 4. SIM card connections (using Amphenol) The Nokia 12 module supports 1.8 V and 3 V SIM cards, and it automatically sets the correct voltage according to the SIM card that is used.

Note: The SIM card reader must have a switch that indicates when the SIM card is being removed, so that the Nokia 12 module can shut it down correctly. The switch must open when the card is removed or the lid is open. The Nokia 12 module has a pull-up in the SIM detection line, so the hardware application must connect the other end of the switch to the ground.

4.6 AUDIO INTERFACE

4.6.1 Analog audio The M2M System Connector provides possibilities to build different kind of audio applications around the Nokia 12 module.

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The analog TX path (from the external application to the Nokia 12 module) has a DC isolation inside the Nokia 12 module with 100 nF capacitors, and these capacitors together with the microphone preamplifier input impedance form a 1st order high pass filter with 32 Hz roll-off (-3 dB).

Table 14. Microphone audio characteristics

Name Symbol Min Type Max Units

Differential input voltage range for microphone input (MICP & MICN)

0.316 2.0 VPP

Microphone amplifier input resistor

RMIC 30 50 kohm

Common mode voltage level

VCM 1.3 1.35 1.4 V

The earphone lines from the Nokia 12 module are driven differentially to achieve the best possible audio quality, free of radio frequency noise. In the differential mode, positive output is driven from EARP and negative signal from EARN output.

Table 15. Earphone audio characteristics

Name Test condition Min Type Max Units

Output voltage swing in fully differential mode

EARP to EARN 0.316 2 VPP

Output resistance 1 ohm

Load resistance EARP to EARN (with dynamic transducer)

30 45 ohm

Load resistance EARP to EARN (with external audio circuitry)

1 kohm

Load capacitance EARP to EARN (with external audio circuitry)

10 nF

Common voltage level for Earphone output

VCMEar 0.75 0.8 0.85 V

Offset voltage -50 50 mV

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The following chapter gives an example of using the audio properties of the Nokia 12 module for voice communication purposes. The circuits presented in the example illustrate the connection methods.

There are also other possibilities for using the Nokia 12 audio interface. The presented component values are examples only; the customer can adjust the application-specific values to achieve the best performance for the application in question.

4.6.1.1 Analog audio example

Analog TX path: Due to the small audio signal level of the electret microphone, it is recommended to use a preamplifier for the microphone before connecting it to the Nokia 12 module. It is strongly recommended to protect the differential connection against RF noise. A microphone preamplifier with 20 dB input gain is recommended for reasonable uplink audio levels.

Microphone input: See Figure 5.

MicP

MicN

VANA

VANA

VANA

R1

R2

R3

R4

R6R7

+

-

+

-

C1

C2

C3

VANA

R5

Figure 5. Single-ended microphone pre-amplifier Analog RX path: In voice applications, the Nokia 12 module is able to drive an earphone application without external electronics. However, it is also possible to build a high-volume loudspeaker application by using an external power amplifier with a high sensitivity loudspeaker. The following paragraphs show example circuits for both cases.

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Earphone application: An earphone can be connected to the Nokia 12 module without external components. In Figure 6 external components are used for EMC purposes to optimise audio quality and reliability.

R1

R2

L1

C1 C2 J1 J2

Figure 6. Earphone application circuit The recommended earphone type is dynamic. The maximum allowed load for this application is 32 ohm. In the example circuit, L1 is the common mode choke for the suppression of common mode disturbance in the earphone lines.

J1 and J2 are surge protector gaps for ESD protection. These can be replaced with varistor or any other state-of-the-art ESD protection component. C1 and C2 are used for RF noise filtering.

R1 and R2 are used as an attenuator if the signal level from the Nokia 12 module is too high for the application. These resistors can be replaced with linear potentiometers and thus get adjustable volume control for the earphone application. The following component list gives example values for the circuit:

• L1= 1000ohm@100MHz

• C1=C2=27pF

• R1=R2= Must be defined together with the sensitivity of the earphone External Audio Power amplifier: External audio power must be used if there is a need to drive low impedance load as loudspeaker. Figure 7 shows an example connection circuit for differential audio boomer. In this application only the connection interface to the Nokia 12 module is presented. For more detailed information on the boomer connections and specification, see the boomer manufacturer application note.

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Shutdown control

C1

C2

R1

R3

R6

R5

R2

R4

C4

Bias

Differential AudioBoomer

C3

EarP

EarN+

-

+

-Bypass

VDD

VDD

VDD

Figure 7. Differential external power amplifier connection Refer to the audio boomer manufacturer and loudspeaker application notes for information on maximum safe ratings for the selected components. Also keep in mind the limitation of VDD to avoid overdriving the audio boomer and thus distorting the output signal unnecessarily.

4.6.1.2 Acoustic echo Because in a GSM voice call the uplink and downlink audios are activated at the same time, it is recommended to use common sense when evaluating a suitable distance between the loudspeaker and the microphone. The acoustic echo canceller inside the Nokia 12 module is tuned so that the optimum result is achieved with 20 cm or longer distance between the microphone and the speaker. It is also advisable to locate the microphone and the loudspeaker so that they are pointed away from each other to achieve the best possible double-talk performance.

4.6.2 Digital audio There is a pulse code modulation (PCM) codec interface in the Nokia 12 module for digital audio support. The digital audio interface supports sign-extended 13-bit linear code (total 16 bits are transmitted).

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4.6.2.1 Sign-extended linear code PCM digital audio data transmission between the Nokia 12 module and the application is handled with four signals: PCMDCLK, PCMSCLK, PCMTX, and PCMRX. The format of the data transmission is sign-extended 13-bit linear code. A total of 16 bits are transmitted, and higher order bits must be sign-extended. Transmission of data commences after frame sync (PCMSCLK) rises high for one PCMDCLK clock cycle. After returning low, each data bit is transmitted on the falling edge of PCMDCLK.

PCMRxData

PCMDClk

PCMTxDataSign extended

Sign extendedMSB LSB

015 14 13 12 11 10

PCMSClk

LSBMSB015 14 13 12 11 10

Figure 8. Timing of clock and transmission signals The application must provide both the PCMDCLK and PCMSCLK. PCMDCLK frequency is 512 kHz and PCMSCLK is repeated at 8 kHz, that is, at every 64th clock cycle. All bits but the 16 data bits following the frame sync are discarded. PCMDCLK has a typical 50 % duty-cycle; a variation of 5 % can be tolerated. For detailed timing, refer to Figure 9 and Table 16. Tcyc is the cycle time (1.953 microseconds) of the 512 kHz clock. The PCMSCLK rising edge must occur at the maximum of 8 ns after the PCMSCLK rising edge.

The pulse width of the frame sync pulse should be one data clock cycle.

PCMRxData

PCMDClk

PCMTxData

PCMSClkTd(SCL)

Td(PCMTxData)

Th(PCMRxData)

Tsu(PCMRxData)

MSB

MSB

Figure 9. PCM timing diagram

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PCM timing characteristics are described in Table 16. The coding format presented in Table 16 is supported, for example, by the Motorola type MC145483 codec.

Table 16. PCM timing characteristics

Parameter Symbol Min Max Unit

Delay time (PCMSClk valid after PCMDClk rising)

Td(SClk) 0 8 ns

Delay time (PCMTxData valid after PCMDClk rising)

Td(TxData) 5 25 ns

PCMRxData setup time before PCMDClk falling edge

Tsu(RxData) 20 Tcyc-20 ns

PCMRxData hold time after PCMDClk falling edge

Th(RxData) 20 Tcyc-20 ns

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5. RF AND ANTENNA INTEGRATION

The RF requirements for the Nokia 12 module are type-dependent:

• RF requirements for the RX-2 type follow the ETSI EGSM900/GSM1800 phase2+ specifications.

• RF requirements for the RX-9 type follow the ETSI GSM850/GSM1900 phase2+ specifications.

Table 17. RF specifications for the Nokia 12 GSM module

Parameter Value Description

RF impedance 50 ohm

RF power 2W (class 4) EGSM900 & GSM 850

1W (class 1) GSM1800 & GSM 1900

The RF signal from the Nokia 12 module to an external antenna goes trough the MMCX connector.

An adapter cable between the MMCX connector and the antenna may be needed. Suitable connectors and cables are available, for example, from Amphenol, TYCO, and IMS Connector Systems.

The Nokia 12 module is certified with a Smarteq dual-band antenna (art no: 1140.26 for 900/1800MHz and 1140.27 for 850/1900MHz). Suitable antennas are available, for example, from Smarteq and Hirschmann.

For more information on the RF exposure, see Chapter 7.2.5.

5.1 ANTENNA INSTALLATION The antenna must be placed within a good RF field; a location where the signal strength is adequate. A hand-portable phone can be used to check the best location for the antenna.

Note: Electronic devices can cause interference, which affects the performance of the Nokia 12 module. Do not place the antenna close to electronic devices or other antennas.

If an additional cable is needed between the antenna and the Nokia 12 module, use low-loss cables (for example RG-58. Amphenol, Suhner, etc.) and connectors. Every additional cable, adapter, and connector increases the loss of signal power.

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When designing the hardware application to which the Nokia 12 module is integrated into, it is important to take care of RF emissions. Do not place any sensitive components or striplines near the antenna or the antenna connector.

For more information on the RF exposure, see Chapter 7.2.5.

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6. TEST BOARD FOR THE NOKIA 12 GSM MODULE

The Nokia 12 test board is a hardware development tool for application developers and system integrators. It manages DC voltages, SIM card, I/O’s, and audios. You can measure several interfaces by pin headers, and the software interfaces of the D9 connectors can be seen and handled. The device can be reset with the reset button on the test board PCB.

The Nokia 12 module has been type approved with the Nokia 12 test board. For more information on the Nokia 12 test board, see Appendix: Nokia 12 test board part list, assembly drawing and schematics.

6.1 POWERING A 3A step down converter is used to produce module VCC. Low ESR capacitors are used.

Table 18. Powering for the Nokia 12 test board

6.2 SIM CARD READER The SIM card reader is directly connected to the M2M System Connector. The VSIM (pin47) decoupling capacitor must be present in all designs. To see the connections between the SIM card reader and the M2M System Connector, see Figure 4.

6.3 RS-232 CONVERTERS All three serial ports of the Nokia 12 module are equipped with RS-232 level translators and D9 connector in the test board. If they are not used, there is a switch that can be used to set the converters in the Hi-Z mode.

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6.4 AUDIO For testing analog audio, the test board includes a connector for the Nokia HSU-3 handset. The HSU-3 handset can be purchased from Nokia dealers.

Figure 10. Nokia 12 test board microphone amplifier The Nokia 12 test board and its key components are shown in Figure 11.

Figure 11. Nokia 12 test board components The Nokia 12 test board includes the following switches:

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• RS-232 translator switches for PORT1 and PORT2/PORT3

− When the RS-232 translators are on, PORT1 and PORT2/PORT3 are connected the Nokia 12 module via the M2M System Connector.

− When the RS-232 translators are off, PORT1 and PORT2/PORT3 are not connected the Nokia 12 module via the M2M System Connector. When the RS-232 translators are off, it is possible to establish a connection to the Nokia 12 module by using the pin headers (1-4).

• Microphone input selection switches

− MIC FROM HSU-3 means that microphone signals are routed from the HSU- 3 connector on the testboard to the Nokia 12 module.

− MIC FROM PIN HEADER means that microphone signals are routed to pins 10 and 11 in pin header X100 on testboard edge.

• Communication mode switches

− When the switches are in the normal mode position, the BSI line of the Nokia 12 module is floating.

− When the switches are in the AT mode position, a 68 kohm resistor is connected between the Nokia 12 module BSI line and ground.

Note: To use the normal mode/AT mode settings on the test board, the connection type setting on the Nokia 12 Configurator must be set to ‘HW Detection’. If the connection type setting on the Nokia 12 Configurator is set to ‘AT’, the communication mode switch settings on the Nokia 12 test board are overridden.

The use of the switches on the Nokia 12 test board is illustrated in Figure 12.

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Figure 12. Nokia 12 test board switch usage

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7. CERTIFICATIONS

The test house requires the following documentation from the application integrator for type approval tests:

• Hardware description

• Schematics

• Block diagram

• PWB/component layout

• Bill of materials

• HW/SW versions used in tests.

• Summary of application

• User’s guide

If the application HW or SW changes, the integrator is responsible for verifying the effect, and if needed, to perform all required tests again in an accredited laboratory.

7.1.1 RX-2 The Nokia 12 module (RX-2) is a CE marked device. In order to show compliance to R&TTE requirements, the integrator has to show that all the instructions in this document have been followed in the integration, and a declaration of conformity has been written.

The final product must carry CE marking to show compliance with all the directives that are applicable to it. The numbers of all the Notified Bodies involved in every aspect of the conformity assessment must be shown next to the CE marking with any additional markings that can be needed (for example, Alert symbol for WLAN). The technical documentation explains the role of each Notified Body. If external elements are designed according to this document, only the following tests must be carried out in an accredited laboratory:

• EMC tests in all working modes (EN 301 489-1/7, 3GPP TS 51.010)

• Safety (Europe: EN/IEC 60950)

7.1.2 RX-9 The Nokia 12 module (RX-9) is an FCC equipment authorized device (47CFR 15, 22, 24). If external elements are designed according to this document, only the following tests must be carried out in an accredited laboratory:

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• FCC equipment authorization (all applicable parts of 47CFR15)

7.2 TECHNICAL REQUIREMENTS

7.2.1 SIM testing SIM testing is not needed, because the SIM card reader is a passive component. In the implementation, SIM presence must follow the type approval conditions of the Nokia 12 module. 6- or 8-pin SIM card readers can be used. For more information on the SIM interface, see Chapter 4.5.

7.2.2 Power supply The power supply must be designed as advised in Chapter 4.3. If this specification is exactly followed and fulfilled, the number of required RF tests is minimized in the type approval process.

Note: If the power supply specification is not followed, the Nokia 12 module type approval is not valid.

7.2.3 EMC/ESD and safety tests EMC and safety tests according to GSM standards (EN 301 489-1/7, 3GPP TS 51.010 and EN 60 950) are mandatory and must be completed by the application integrator. The integrator should guarantee overall ESD protection in the integrated application (EN 301 489).

Note: The Nokia 12 test board is an ESD supersensitive device.

7.2.4 RF testing The antenna must be connected to the Nokia 12 module as this document instructs. The antenna impedance has to be as specified in Chapter 5. Further passive RF testing for the type approval is not required. Radiation performance is always the responsibility of the integrator.

Note: If the antenna specification is not followed, the Nokia 12 type approval is not valid.

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7.2.5 RF exposure In order to comply with the RF exposure requirements, install the antenna so that a minimum separation distance of 20 cm/7.9 inch can be maintained between the antenna and all persons.

If some other antenna than the one in the sales package is used, it must be ensured that the maximum antenna gain of 3 dBi is not exceeded.

RX-2 If the application does not provide a separation distance of at least 20 cm/7.9 inch, the integrator must carry out all needed certifications.

RX-9 The Nokia 12 module cannot be used in applications that allow the separation distance between antenna and all persons to be less than 20 cm/7.9 inch.

7.2.6 Additional type approval notes Changes in the application software have no effect on type approval issues.

If the Nokia 12 module software is updated, no type approval actions are required from the application integrator. All Nokia products are officially type approved.

Any changes to the RF path are not allowed. Power supply instructions must be followed.

RX-9 The Nokia 12 module (RX-9) type label has the FCC ID number to indicate that it is FCC equipment authorized. If the application prevents the label from being visible, the application must be labeled so that it contains the text: “Contains FCC ID LJPRX-9”.

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REFERENCES

Nokia M2M customer documents The following Nokia M2M customer documents are available at http://www.forum.nokia.com/m2m or http://www.americas.forum.nokia.com.

/1/ Nokia M2M Platform Software Developer’s Guide

/2/ Nokia M2M Platform Nokia 12 GSM Module IMlet Programming Guide

/3/ Nokia 12 GSM Module Product Specification

General standards and specifications /1/ 3GPP TS 51.010, Digital cellular telecommunication system (Phase 2+) Mobile Station (MS) conformance specification / 3rd Generation Partnership Project (3GPP)

/2/ 47CFR 15, 22, 24,Code of Federal Regulations, 47: Telecommunication Part 15: Radio frequency devides Part 22: Public mobile services Part 24: Personal communications services / Federal Communications Commission (FCC) /3/ DIN 72300-3 Electrical and electronic equipment for road vehicles - Environmental condititons - Part 3: Mechanical loads / Deutsches Institut fur Normung (DIN) /4/ EN 301 489-1/7 Electromagnetic compatibity and Radio spectrum Matters (ERM); Electro-Magnetic Compatibility (EMC) standard for radio equiment and services Part 1: Common tecnical requirements Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS) / European Telecommunications Standards Institute (ETSI) /5/ EN/IEC 60950 Safety of Information technology equipment / European Committee for Electrotecnical Standardization (Cenelec)

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http://www.forum.nokia.com/m2m

http://www.americas.forum.nokia.com/

APPENDIX: NOKIA 12 TEST BOARD PART LIST, ASSEMBLY DRAWING AND SCHEMATICS

This appendix includes the Nokia 12 test board part list, assembly drawing and schematics. The reference numbers and x/y axis indicators on the part list can be used to locate the Nokia 12 test board parts on the assembly drawing.

Table 19. Nokia 12 test board part list

Ref. X Y Component Component value Voltage

C100 J 13 Chipcap X7R 10% 50V 0402 1n0 50V

C101 J 14 Cer. cap 10uF 16V Z 1210 10u 16V

C102 I 14 Tantal cap 20% 35V 100n_35V 35V

C103 I 14 Tantal cap 20% 35V 100n_35V 35V

C104 K 13 CHIPCAP X5R 100N K 10V 0402 100n 10V

C105 K 13 Chipcap 5% NP0 22p 50V


C107 K 13 CHIPCAP X5R 100N K 10V 0402 100n 10V


C109 K 14 CHIPCAP NP0 180P J 25V 0402 180p 25V


C111 K 13 CHIPCAP NP0 180P J 25V 0402 180p 25V


C113 M 14 CHIPCAP X5R 1U0 10V 0805 1u0 10V

C114 M 13 CHIPCAP X5R 1U0 10V 0805 1u0 10V

C115 M 13 Chipcap 5% NP0 150p 50V

C116 M 13 CHIPCAP X7R 18N J 25V 0603 18n 25V

C117 M 12 Chipcap X7R 10% 16V 0402 10n 16V

C118 K 13 CHIPCAP X5R 1U0 10V 0805 1u0 10V

C119 J 12 Chipcap 5% NP0 22p 50V

C120 J 12 chipcap x7r 47n k 10v 0402 47n 10V

C121 J 12 CHIPCAP X5R 4U7 K 6V3 0805 4u7 6V3

C122 I 13 CHIPCAP X5R 1U K 6V3 0603 1u0 6.3V

C123 J 12 Chipcap X7R 5% 16V 0402 10n 16V

C124 I 13 Chipcap 5% NP0 22p 50V

C125 G 14 Cer. cap 10uF 16V Z 1210 10u 16V

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C126 H 14 Cer. cap 10uF 16V Z 1210 10u 16V

C400 P 11 CHIPCAP X5R 4U7 K 6V3 0805 4u7 6V3

C401 O 11 CHIPCAP X5R 1U K 6V3 0603 1u0 6.3V

C402 M 10 CHIPTCAP 470U M 10V L7.3X4.3X4.1 470u_10V 10V

C403 L 10 CHIPTCAP 470U M 10V L7.3X4.3X4.1 470u_10V 10V

C404 K 10 CHIPTCAP 470U M 10V L7.3X4.3X4.1 470u_10V 10V

C405 J 10 CHIPTCAP 470U M 10V L7.3X4.3X4.1 470u_10V 10V

C406 H 10 CHIPTCAP 470U M 10V L7.3X4.3X4.1 470u_10V 10V

C412 P 14 CHIPCAP X7R 100N K 25V 0805 100n 25V


C414 O 13 CHIPCAP X7R 100N K 25V 0805 100n 25V



C417 J 15 Chipcap X7R 10% 50V 0402 220p 50V

C418 J 15 Chipcap X7R 10% 50V 0402 220p 50V

C419 K 15 Chipcap X7R 10% 50V 0402 220p 50V

C420 J 15 Chipcap X7R 10% 50V 0402 220p 50V

C421 P 14 Chipcap X7R 10% 50V 0402 220p 50V

C422 P 15 Chipcap X7R 10% 50V 0402 220p 50V

C423 Q 14 Chipcap X7R 10% 50V 0402 220p 50V

C424 Q 15 Chipcap X7R 10% 50V 0402 220p 50V

C425 Q 14 Chipcap X7R 10% 50V 0402 220p 50V

C426 Q 15 Chipcap X7R 10% 50V 0402 220p 50V

C427 Q 14 Chipcap X7R 10% 50V 0402 220p 50V

C428 Q 15 Chipcap X7R 10% 50V 0402 220p 50V

C429 S 12 CHIPCAP X5R 1U K 6V3 0603 1u0 6.3V

C430 Z 8 CHIPCAP X5R 100N K 10V 0402 100n 10V

C431 J 11 Chipcap 5% NP0 22p 50V

C432 U 11 Chipcap 5% NP0 22p 50V



C435 T 11 Chipcap 5% NP0 22p 50V

C436 V 11 CHIPCAP X7R 100N K 25V 0805 100n 25V

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C437 U 14 CHIPCAP X7R 100N K 25V 0805 100n 25V






C443 W 14 Chipcap X7R 10% 50V 0402 220p 50V

C444 W 15 Chipcap X7R 10% 50V 0402 220p 50V

C445 W 14 Chipcap X7R 10% 50V 0402 220p 50V

C446 W 15 Chipcap X7R 10% 50V 0402 220p 50V

C447 W 14 Chipcap X7R 10% 50V 0402 220p 50V

C448 W 15 Chipcap X7R 10% 50V 0402 220p 50V

C449 X 14 Chipcap X7R 10% 50V 0402 220p 50V

C450 X 15 Chipcap X7R 10% 50V 0402 220p 50V

C451 Y 14 Chipcap X7R 10% 50V 0402 220p 50V

C452 Y 15 Chipcap X7R 10% 50V 0402 220p 50V

C453 X 14 Chipcap X7R 10% 50V 0402 220p 50V

C454 X 15 Chipcap X7R 10% 50V 0402 220p 50V

C455 X 14 Chipcap X7R 10% 50V 0402 220p 50V

C456 X 15 Chipcap X7R 10% 50V 0402 220p 50V

C457 X 14 Chipcap X7R 10% 50V 0402 220p 50V

C458 X 15 Chipcap X7R 10% 50V 0402 220p 50V

C459 A 6 Chipcap 5% NP0 56p 50V

C461 A 8 CHIPTCAP 68U M 25V 7.3X4.3X4.1 68u_25V 25V

C462 B 7 Chipcap X7R 10% 50V 0402 1n0 50V

C463 C 7 Chipcap 5% NP0 56p 50V

C464 C 7 CHIPCAP X7R 100N K 16V 0603 100n 16V

C465 D 7 CHIPTCAP 68U M 25V 7.3X4.3X4.1 68u_25V 25V

C466 I 6 POSCAP 100UF+-20M 100u 6.3V

C467 H 7 CHIPCAP X7R 100N K 16V 0603 100n 16V

C468 H 7 Chipcap X7R 10% 50V 0402 220p 50V

C469 H 8 CHIPTCAP 68UF M 6V3 68u 6.3V

C470 H 8 CHIPCAP X7R 100N K 16V 0603 100n 16V

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C490 D 6 Chipcap X7R 10% 16V 0402 10n 16V

C491 G 5 ELCAP 470U M 6V3 0R025 105C 8X10 470u_6V3 6.3V

C492 I 5 ELCAP 470U M 6V3 0R025 105C 8X10 470u_6V3 6.3V

C493 P 11 Chipcap X7R 5% 16V 0402 10n 16V

F400 A 4 SM FUSE F2A 63V 1206 2.0A ~

L100 I 13 FERRITE BEAD 0R6 600R/100M 0402 600R/100MHz ~

L101 I 13 FERRITE BEAD 0R6 600R/100M 0402 600R/100MHz ~

L400 J 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~

L401 K 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~

L402 P 14 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~

L403 Q 14 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~



L406 W 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~



L409 X 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~

L410 Y 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~


L412 Y 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~


L414 A 4 FERR.BEAD 0R03 42R/100MHZ 3A 0805 42R/100MHz ~

L415 B 8 FERR.BEAD 0R03 42R/100MHZ 3A 0805 42R/100MHz ~

L416 B 7 FERR.BEAD 0R03 42R/100MHZ 3A 0805 42R/100MHz ~

L418 H 7 FERR.BEAD 0R03 42R/100MHZ 3A 0805 42R/100MHz ~

L490 F 7 CHOKE 33U M 3.0A 65MR 12X12X8 33uH ~

N100 L 13 4XOPAMP 2.7-12V TS974 SO14 ~ ~

N101 I 13 REG 3.3V/150MA LP2985A-3.3 SOT23-5 ~ 3.3V

N400 P 11 REG 3.3V/150MA LP2985A-3.3 SOT23-5 ~ 3.3V

N401 C 5 SW REG 1.2-37V 3A LM2676 TO263-7 ~ ADJ

N402 P 13 MAX3237EAI RS323 5TX3RX SSOP28 ~ ~

N403 U 13 MAX3237EAI RS323 5TX3RX SSOP28 ~ ~

R100 Y 6 Resistor 5% 63mW 560R ~

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R101 L 8 Resistor 5% 63mW 560R ~































R132 P Chipres 0W06 jumper 0402 0R ~

R133 P 8 Chipres 0W06 jumper 0402 0R ~

8

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R140 F 14 VARISTOR ARRAY 2XVWM16V VC50 0405 2XVWM16V ~

R141 E 14 VARISTOR ARRAY 2XVWM16V VC50 0405 2XVWM16V ~

R142 J 13 Resistor 5% 63mW 1k0 ~






R148 J 14 Resistor 5% 63mW 330R ~

R149 K 14 Resistor 5% 63mW 330k ~

R150 K 13 Resistor 5% 63mW 330k ~

R151 K 14 Resistor 5% 63mW 1k0 ~

R152 M 14 Resistor 5% 63mW 4k7 ~

R153 K 12 Resistor 5% 63mW 1k0 ~


R155 M 13 Resistor 5% 63mW 47R ~

R156 N 13 Resistor 5% 63mW 47R ~




R160 J 13 Resistor 5% 63mW 10k ~

R161 J 13 Resistor 5% 63mW 10k ~

R400 F 12 Resistor 5% 63mW 100R ~

R401 F 12 Resistor 5% 63mW 100R ~

R402 G 11 Resistor 5% 63mW 68k ~

R403 G 11 Resistor 5% 63mW 1k0 ~

R406 Q 11 Chipres 0W06 jumper 0402 0R ~

R410 B 7 Resistor 5% 63mW 47k ~

R413 Q 12 Resistor 5% 63mW 47k ~


R416 R 12 Resistor 5% 63mW 10k ~

R417 T 13 Resistor 5% 63mW 47k ~

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R418 T 12 Resistor 5% 63mW 10k ~

R419 A 6 CHIP VARISTOR VWM18V VC50 0603 18V ~

R420 B 6 Resistor 1% 63mW 12k ~

R421 B 6 CHIPRES 0W06 10K F 0402 10k ~

R422 B 7 CHIPRES 0W06 10K F 0402 10k ~

S100 M 11 Slide Switch 1-pole 2-pos ~ ~

S101 M 12 Slide Switch 1-pole 2-pos ~ ~

S400 G 13 Slide Switch 1-pole 2-pos ~ ~

S401 G 12 Slide Switch 1-pole 2-pos ~ ~

S402 I 11 SM SW TACT SPST 12V 50MA ~ ~

S403 R 13 Slide Switch 1-pole 2-pos ~ ~

S404 T 13 Slide Switch 1-pole 2-pos ~ ~

V100 Y 6 LED CL190HR RED>5MCD 20MA 0603 ~ ~

V101 M 8 LED CL190HR RED>5MCD 20MA 0603 ~ ~




















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V132 X 6 TRX2+RX4 UMH2N N 50V 0.03A SOT363 ~ ~

V133 M 8 TRX2+RX4 UMH2N N 50V 0.03A SOT363 ~ ~












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V400 A 5 SCH DI 40V 3A SOD6 ~ ~

V490 E 5 SCH DI 40V 3A DO214AB ~ ~

X100 L 2 SM CONN 2X10M P2.54 3A 90DEG ~ ~

X101 F 2 SM CONN 2X10M P2.54 3A 90DEG ~ ~

X102 R 2 SM CONN 2X10M P2.54 3A 90DEG ~ ~

X103 X 2 SM CONN 2X10M P2.54 3A 90DEG ~ ~

X150 F 16 CONN MOD JACK 6POL 125V 1.5A 90DEG ~ ~

X400 B 16 PC MODULAR JACK 10POL P1.27 90DEG ~ ~

X401 R 10 SM SOCKET STRIP 2X30F P1.27MM ~ ~

X402 C 10 CONN F 90DEG PCB RED BANANA SOCK ~ ~

X403 C 12 CONN F 90DEG PCB BLACK BANANA SOC ~ ~

X404 Q 11 SINGLE ROW STRAIGHT PIN HEADER 2X1 ~ ~

X406 J 17 CONN D9 F 90DEG B/LOCK 4-40UNC AU ~ ~

X407 Q 17 CONN D9 F 90DEG B/LOCK 4-40UNC AU ~ ~

X408 X 17 CONN D9 F 90DEG B/LOCK 4-40UNC AU ~ ~

X409 B 2 SMD JACK 3.0MM F DC 20V 2A ~ ~

X410 Y 11 SM SIM CARD READER 2X3POL P2.54 ~ ~

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

3

1

2

3

1

2

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

3

1

2

2

1

3

1

2

2

1

2

1

2

1

2

1

2

4

1

3

2

1

2

1

INPUT10

OUTPUT6OUTPUT7

INPUT9

OUTPUT9

PORT1TX

5

(SCK/MBUS)

2

2

1

C

D9 FEMALE

8=CTS

PORT2CTS

SERVICE

1=DCD

9=RI

6=DSR

9=RI

B

A

AD3

INPUT11

7=RTS6=DSR5=GND4=DTR

(TXD/FBUSTXO)

3

AD2

2=RxD3=TxD

D

7=RTS8=CTS

A

RESET_TRESET_A

OUTPUT8

3=TxD

OUTPUT4

INPUT4/P3TX

1

INPUT5INPUT6

1 3 6

MICP

PCMDCLK

PORT2RTS

B

5=GND

1=DCD2=RxD

VSIM

(BSI)

4=DTR5=GND

NCNC

A

C

D

2

9=RI

D9 FEMALE

SIMRST

4=DTR

4

PORT2RX

NC

MBUS

BSI

NC

OUPUT2

8=CTS

4

PCMTX

EARP

SIMDET

PORT2TX

PORT1RX

OUTPUT1/P3RX

3=TxD

1=DCD

INPUT8

OUTPUT3

(RXD/FBUSRXO)

6=DSR7=RTS

D9 FEMALE

6

INPUT7

PCMRX

EARN

PCMSCLK

SIMDATA

AD1

IO_VOLTAGE

SLEEPX

SIMCLK

MICN

2=RxD

OUTPUT5

5

STPS340U

V400

36

NC

XAUD(3:0)121314

34

470u_10VC406

ANA_AUDIO(3:0)

E42

5

5678S2

S1 9

L413

240R/100MHz

VBB

M-C707_10M006_522_2X410

123

220p

C468

9

X408

123456789

VCC

27C1+ 28

C2- 34 V-

T1OUT5

T2OUT6

T3OUT7

R1IN 8

R2IN18

19T4IN

R2OUT20R1OUT21

T3IN 22T2IN 23T1IN 24

C1- 25V+

10 T4OUT

R3IN 11

12 T5OUT

_EN 1314 _SHDN15 MBAUD

16 R1OUTB

17T5IN

R3OUT

E42

2

MAX3237EAI

GND 2=3V3 26=

N403

C2+ 1

C4011u0

C492

2517865470u_6V3470u_6V3

2517865

GNDGNDGND GND

C491

GND

C463

56p

42R/100MHz

L416

240R/100MHz

L405

GND

220pC454

27

R41

6

38

29

GND

10k

220pC456

GND

L412

240R/100MHz

C414

100n

232425

GND

GND

GNDGND

GND

GND

R42

1

10k

10k

R42

2

470u_10VC405

470u_10VC404

470u_10VC403

12k

R42

0

26

17

C466100u

47k

R41

7

10nC493

59

C421220p

37

GND

45

48

GND

E42

1

20

VCC

R419

18V

C432

4243

GND

C43322p

220pC458

22p220pC452

2611689

C402

L410

240R/100MHz

470u_10V

GNDGNDL401

240R/100MHz

100R

R401

GND

GND

GND

GND

GND GND

R400

100R

9 3V3

60

GND

GND

49

5

50515253545556575859

6

60

789

343536373839

4

404142434445464748

20212223242526272829

3

30313233

X401

1

10111213141516171819

2

C434

GND

C43522p22p

E42

4

GNDGND

68u_25V

E42

3

4341603

SW_OUTINCBOOST

G

FB

ON/_OFF

GC461

GNDGND

321

0

LM2676S-ADJ

N401

C44122p

GND

C44222p

3V3

44

47k

C455220p

GND

3V3

R41

3

220pC445

GND

C446220p

GND

GND

C464

100n

GND

GND

C428220p

1k0

R40

3

L411

240R/100MHz

220pC423

C419220p

220pC450

GND

L409

240R/100MHz

C457220p

GND

GNDGND GND

GND GND

E41

1

GND

GNDGND

L402

240R/100MHz

100n

C467

GND

GND

GND

49

22

4

C46968u

2.0A

F400X409

2

3

220pC422

E40

0

GND

GND

GND

21

C412

100n 100n

C413

E42

0

240R/100MHz

L403 C424220p

GND

E41

5

GND

GND GND

15

GND

GND

E41

0

16

GND

X407

123456789

E40

9

4u7GND

LP2985AIM5X-3.3_NOPB

BYPASS

GND

ON_OFFVIN

VOUT

GND

C400

100n

S404

1

23

N400

1

23

GND

C430

50

E41

9

X403

S400

GNDGND

GND

3V3

53

220pC420

GNDGND GNDGND

220pC417

E40

8

100nC438

220pC426

240R/100MHz

GND

GND

L404

C431

220pC427

R41

5

22p

3233

GND

4k7

51

X402

GND

220p

1110

0RR40

6

C443

GND

S401

1

23

GND

3V3

L4903640155

33uH

GND

GND

L406

240R/100MHz

GND

C425220p

GND

E41

8

E41

7

GND

57

C470

100n

GND

E41

6

R40

2

GND

GND

E41

3

E41

4

GND

68k

68u_25V

C465

S403

1

23

V49

0M

BR

S34

0T3

4110

032

C418220p

GND

240R/100MHz

L400

1u0C429

10k

GND

X404

12

R41

8

100n

GND

GND

E41

2

C416

T1OUT6 T2OUT7 T3OUT

8R1IN9R2IN

C415100n

T3IN

23T2IN

24T1IN

25C1-27 V+

28C1+

3C2-V-4

5

MBAUD15

R1OUTB16

T5IN 17

18 R3OUT

T4IN 19

20 R2OUT

21 R1OUT

22

2=GND

MAX3237EAI

1C2+

T4OUT10

11R3IN

T5OUT12

13_EN_SHDN14

3V3

GND

N402

26=3V3

220p

100n

C440

6789

35

C453

GND

X400

1

10

2345

3456789

E40

1

E40

2

GNDGND

X406

12

C449220p

L415

42R/100MHz

GND

C462

1n0

E40

5

E40

6

E40

7

4041

GND

GNDL414

C451220p

3V3

42R/100MHz

47

240R/100MHz

L407

GND

B400

-+

GND

56p

C459

S402

12

34

5556

46

52

E40

4

54

31

C49010n

1819

28

3V3

30

47k

GND

42R/100MHzL418

GND

R41

0

220p 220pC448C447 L408

240R/100MHz

100n

C436

58

E40

3

C437

100n

220pC444

100nC439

39

AIF(60:1)XAUD(3:0)AIF(60:1)

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

11

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2 2

1

2

1

2

1

2

1

2

1

2

1

GENIO13

GENIO22

PORT1RTSPORT1DTR

PCMRX_G16

BSI

MICP

A

D

C

PORT1CTS

SIMDATASIMDET

SLEEPX

B

AD1

AD2

5

Reset_TReset_A

GENIO10

PORT2RX

PORT1RI

VSIMSIMRST

PCMDCLK_G14

MICN

PCMTX_G15

EARP

SIMCLK

1 2 3

IO_VOLTAGE

GENIO4GENIO8

PORT1TX

AD3

GENIO28

PORT1DCDPORT1DSR

A

D

C

EARN

PORT1RX

6

PORT3RXPORT3TXGENIO21

B

4 5 6

1 2 3 4

GENIO12

UMH2N-TN

47k

4219953

V135

47k

3

4

5

PORT2TX

GENIO11

PORT2RTSPORT2CTS

BUZZO

MBUS

PCMSCLK_G1724252627

36

1011

2223

GND

560R

R12

7

R11

6

560R

47k

V158

4219953

47k

UMH2N-TN 3

4

5

UMH2N-TN

47k

4219953

V145

47k

3

4

5

3435

VCC

GND

V11

4

CL-

190H

R-C

D-T

CL-

190H

R-C

D-T

V12

3

V12

2

CL-

190H

R-C

D-T

31

UMH2N-TN

47k

4219953

V139

47k

3

4

5

5253

V10

8

CL-

190H

R-C

D-T

1

2

R10

1

560R

GND

VCC

UMH2N-TN

47k

4219953

V133

47k

6

560R

R12

9

GND

454647

55

4041424344

GND

UMH2N-TN

47k

4219953

V148

47k

6

1

2

R10

2

560R

R10

8

560R

GND

GND

VCC

R12

6

560R

UMH2N-TN

47k

4219953

V145

47k

6

1

2

R11

3

560R

282930

VCC

GND

VCC

V12

5

CL-

190H

R-C

D-T

6

1

2

560R

R12

4

CL-

190H

R-C

D-T

V12

4

47k

V156

4219953

47k

UMH2N-TN

UMH2N-TN 3

4

5

GN

D

GND

VCC

47k

V141

4219953

47k

UMH2N-TN 3

4

5

47k

V154

4219953

47k

GND

VCC

CL-

190H

R-C

D-T

V11

0

1

2

560R

R10

9

CL-

190H

R-C

D-T

V10

9

47k

V141

4219953

47k

UMH2N-TN 6

E42

6

E42

7

VCC

560R

GND

UMH2N-TN

47k

4219953

V153

47k

6

1

2

R13

1

CL-

190H

R-C

D-T

V10

6

V13

1

CL-

190H

R-C

D-T

CL-

190H

R-C

D-T

V10

5

V10

7

CL-

190H

R-C

D-T

560R

R10

6

GND

CL-

190H

R-C

D-T

V10

3

5

4849

CL-

190H

R-C

D-T

V13

0

47k

V161

4219953

47k

UMH2N-TN 3

4

GND

GND

VCC

GND

VCC

560R

R11

7

VCC

47k

V161

4219953

47k

UMH2N-TN 6

1

2

GND

VCC

CL-

190H

R-C

D-T

V12

9

3

4

5

R12

8

560R

CL-

190H

R-C

D-T

UMH2N-TN

47k

4219953

V147

47k

E46

5

GND

VCC

V12

8

E46

2

E46

3

E46

4

560R

R11

5

E45

4

E45

5

4219953

47k

UMH2N-TN 6

1

2

CL-

190H

R-C

D-T

V12

7

CL-

190H

R-C

D-T

V11

7

47k

V147

R11

2

GND

GND

VCC

V156

47k

3

4

5

560R

6 7 8 9

GN

D

UMH2N-TN

47k

4219953

14 15 16 17 18 192 203 4 5 9

GN

D

X10

0

1 10 11 12 13 18 192 203 4 5 6 7 81 10 11 12 13 14 15 16 17192 203 4 5 6 7 8 9 X10

3

1 10 11 12 13 14 15 16 17 18 4 5 6 7 8 9

GN

D

X10

1

13 14 15 16 17 18 192 203

E43

7

X10

2

1 10 11 12

GND

VCC

CL-

190H

R-C

D-T

V11

5

6

1

2

R12

2

560R

GND

VCC

VCC

UMH2N-TN

47k

4219953

V154

47k

R12

1

560R

E45

9

E46

0

E46

1

E45

7

E45

8 VCC

V11

6

CL-

190H

R-C

D-T

VCC

E45

6

47k

V132

4219953

47k

UMH2N-TN 3

4

5

GND

560R

R13

0

560R

R12

0

GND

12

47k

V137

4219953

47k

UMH2N-TN 3

4

5

560R

R11

8

GND

CL-

190H

R-C

D-T

V10

0

47k

V150

4219953

47k

UMH2N-TN 6

1

2

E44

6

GND

VCCVCC VCC

47k

V148

4219953

47k

UMH2N-TN 3

4

5

560R

R10

3

GND

VCC

47k

UMH2N-TN 6

1

2

GND

VCC

VCC

13

47k

V135

4219953

21

560R

R11

0

17181920

3

4

5

V10

1

CL-

190H

R-C

D-T

16

47k

4219953

V158

47k

6

1

2

UMH2N-TN

47k

4219953

V133

47k

V12

6

CL-

190H

R-C

D-T

UMH2N-TN

E44

5

R12

5

560R

E44

2

E44

3

E44

4

E43

9

E44

0

E44

1

E43

8

E43

6

R11

4

560R

E43

2

E43

3

E43

4

E43

5

E43

0

E43

1

E42

8

E42

9

0RR13

2

R13

3

0R

3

4

5

32

CL-

190H

R-C

D-T

V11

2

47k

V143

4219953

47k

UMH2N-TN

GND

VCC

UMH2N-TN

47k

4219953

V143

47k

6

1

2

R11

1

560R

VCC

V11

1

CL-

190H

R-C

D-T

3

4

5

R11

9

560R

32

UMH2N-TN

47k

4219953

V150

47k

E45

0

E45

1

E45

2

E45

3

E44

8

E44

9

V10

4

CL-

190H

R-C

D-T

1415

E44

7

10

33

V10

2

CL-

190H

R-C

D-T

3839

5657

560R

R10

0

GND

VCC

47k

V132

4219953

47k

UMH2N-TN 6

1

2

560R

R12

3

585960

9

VCC

UMH2N-TN

47k

4219953

V153

47k

3

4

5

V12

1

CL-

190H

R-C

D-T

CL-

190H

R-C

D-T

V12

0

V11

9

CL-

190H

R-C

D-T

CL-

190H

R-C

D-T

V11

8

2

R10

7

560R

5051

UMH2N-TN

47k

4219953

V139

47k

6

1

V11

3

CL-

190H

R-C

D-T

37

GND

560R

R10

5

GND

VCC

VCC

47k

UMH2N-TN 6

1

2

GND

VCC

54

47k

V137

4219953

XAUD(3:0)

R10

4

560R

AIF(60:1)

312

312

43 61 2

1 2 3 4 5 6

D

C

B

A

330k

D

C

B

A

5

1k8 R149

10u

R14

6

L102

C12

5C

126

100n_35VC102

GND

VA

10u

GND

GND

C12422p

10nC123

GND

X150

VCC 1

HOOK 2

GND 3

EAR 4

MIC- 5

MIC+ 6

10

GND

HANDSET_CONNECTOR

100n

C10

7

C119

32

22pC112

10k

22p

R16

1

R156

47R

R158

47RVA_2

150pC115

R157

47R+5

C11710n

VA4=

N100TS974ID

GND11=

7-6

GND

C11618n

R16

0

10k

1u0C122

4k7

R15

4

C1001n0

GND

C101

GND

R14

0

/2 V

WM

16V

2

10u

1k0

R142

22pC108

180p

C11

1

2k2

R144

VA

12

-

3+

S10

0

1

23

GND

11= GND

TS974IDN100

4=

L100

600R/100MHz

/2 V

WM

16V

1R148

330R

R14

0R

141

GND1/2

VW

M16

V

1k8

R14

3

R155

47R

R15

9

2k2

GND

FRAME

DTE-1

A101

W2

RF-SHIELD

C103

100n_35V

47nC120

GND

GND GND

GND

C1181u0

GND

VCC

VA

4u7

R145

1k0

321

0

C121

2/2

VW

M16

V

R14

1

GND

1u0

330k

R150

C11

4

1k0

R153

BYPASS

GND

ON_OFFVIN

VOUT

VA_2

S10

1

1

23

GND

VA_2

GND

N101

-3.3_NOPBLP2985AIM5X

1u0

C11

3

GND

600R/100MHz

L101

C10

918

0p

C10522p

C11022p

C10622p

C10

410

0n2k2

GND

R15

2

4k7

R147R151

1k0

ANA_AUDIO(3:0)

XAUD(3:0)

v nokia 12 gsm module -...

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