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USER MANUAL

VIA Mobile360 L900 Fanless ultra-compact in-vehicle system

1.00-04122020

Copyright

Copyright © 2019-2020 VIA Technologies Incorporated. All rights reserved.

No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise without the prior written permission of VIA Technologies, Incorporated.

Trademarks

All trademarks are the property of their respective holders.

Disclaimer

No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no warranties, implied or otherwise, in regard to this document and to the products described in this document. The information provided in this document is believed to be accurate and reliable as of the publication date of this document. However, VIA Technologies assumes no responsibility for the use or misuse of the information (including use or connection of extra device/equipment/add-on card) in this document and for any patent infringements that may arise from the use of this document. The information and product specifications within this document are subject to change at any time, without notice and without obligation to notify any person of such change.

VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any time without prior notice.

Regulatory Compliance

FCC-A Radio Frequency Interference Statement

This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at his personal expense.

Notice 1

The changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

Notice 2

Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.

Notice 3

The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conflicts or damages arising from incompatibility of the product. Check compatibility issue with your local sales representatives before placing an order.

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Battery Recycling and Disposal• Only use the appropriate battery specified for this product.

• Do not re-use, recharge, or reheat an old battery.

• Do not attempt to force open the battery.

• Do not discard used batteries with regular trash.

• Discard used batteries according to local regulations.

Safety Precautions• Always read the safety instructions carefully.

• Keep this User’s Manual for future reference.

• All cautions and warnings on the equipment should be noted.

• Keep this equipment away from humidity.

• Put this equipment on a reliable flat surface before setting it up.

• Check the voltage of the power source and adjust to 110/220V before connecting the equipment to the power inlet.

• Do not place the power cord where people will step on it.

• Always unplug the power cord before inserting any add-on card or module.

• If any of the following situations arise, get the equipment checked by authorized service personnel:

− The power cord or plug is damaged.

− Liquid has entered into the equipment.

− The equipment has been exposed to moisture.

− The equipment is faulty or you cannot get it work according to User’s Manual.

− The equipment has been dropped and damaged.

− The equipment has an obvious sign of breakage.

• Do not leave this equipment in extreme temperatures or in a storage temperature above 70°C (158°F). The equipment may be damaged.

• Do not leave this equipment in direct sunlight.

• Never pour any liquid into the opening. Liquid can cause damage or electrical shock.

• Do not place anything over the power cord.

• Do not cover the ventilation holes. The openings on the enclosure protect the equipment from overheating.

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VIA Mobile360 L900 User Manual

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Box Contents• 1 x VIA Mobile360 L900 system

• 2 x Phoenix plug to DC jacks (DC-in & DC-out)

• 1 x COM cable (for debugging)

• 1 x GPS antenna

• 2 x Wi-Fi/BT antennas

Ordering InformationPart Number Description

M360-900-1Q20A1

Fanless mobile system with NVIDIA Dual-Core Denver 2 and Quad-Core ARM A57 Processor, 8GB LPDDR4 RAM, HDMI, 2 USB 3.0, Micro USB 2.0 (debugging), DIO, COM, CAN bus, Gigabit Ethernet, 9 FAKRA connectors for camera-in, Wi-Fi, Bluetooth 4.1, GPS, SIM card slot, Micro SD card slot, 2 M.2 slots, 2 2.5" SSD/HDD bays ,12V DC-out, 9V~36V DC-in with IGN

Optional AccessoriesCameras and Accessories

Part Number Description99G40-08121Z 1.0MP FOV-40 720p CMOS automotive-grade camera99G40-08140Z 1.0MP FOV-190 720p CMOS automotive-grade camera99G33-230396 10M FAKRA cable99G33-230406 15M FAKRA cable

Mounting Options

Part Number DescriptionM360-SBKT-00A1 Mounting bracket kit (337.2mm x 185mm x 62mm)

Display Accessories

Part Number Description99G73-01030C 7” Resistive touch monitor (1280 x 800)99G73-01034C 10.1" Resistive touch monitor (1280 x 800)

Wireless Modules

Part Number Description

M360-LTE2-Q1USA1 4G LTE/DC-HSPA+/EGPRS Mobile broadband full-size miniPCIe module

(For North America Regions)


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Table of Contents

1. Product Overview ........................................................................................................................................... 1

1.1 Key Features ......................................................................................................................................... 11.1.1 High-Performance .......................................................................................................................... 11.1.2 Fanless, Compact, Ruggedized Chassis .......................................................................................... 11.1.3 Optimized Integration with Multiple I/O Access ........................................................................... 11.1.4 Camera Support ............................................................................................................................. 11.1.5 Support for a Wide Range of Power Sources ................................................................................ 21.1.6 Storage Expansion .......................................................................................................................... 21.1.7 Networking Support ...................................................................................................................... 21.1.8 Multiple Mounting Solution ........................................................................................................... 21.1.9 Operating System ........................................................................................................................... 2

1.2 Product Specifications ......................................................................................................................... 21.3 Layout Diagram ..................................................................................................................................... 41.4 Product Dimensions ............................................................................................................................. 5

2. External I/O Pin Descriptions and Functionality ............................................................................................. 7

2.1 HDMI® Port ........................................................................................................................................... 72.2 USB 3.0 Port .......................................................................................................................................... 72.3 Micro USB 2.0 Port ............................................................................................................................... 82.4 Gigabit Ethernet Port ............................................................................................................................ 82.5 Micro SD Card Slot ................................................................................................................................ 92.6 SIM Card Slot ........................................................................................................................................ 92.7 DIO Port .............................................................................................................................................. 102.8 Headphone and Mic-in Port ............................................................................................................... 102.9 COM Port ............................................................................................................................................ 102.10 CAN Bus Port ...................................................................................................................................... 112.11 FAKRA Connectors .............................................................................................................................. 112.12 Power Button ...................................................................................................................................... 112.13 DC-In Jack ........................................................................................................................................... 122.14 DC-Out Jack ........................................................................................................................................ 122.15 Antenna Connectors ........................................................................................................................... 12

3. Onboard I/O ................................................................................................................................................ 14

3.1 MiniPCIe Slot ...................................................................................................................................... 14

4. Hardware Installation ................................................................................................................................... 15

4.1 Installing the 2.5" SATA HDD/SSD ....................................................................................................... 154.2 Installing the Wi-Fi/BT Antennas ........................................................................................................ 174.3 Installing the GPS Antenna ................................................................................................................. 174.4 Installing the FOV Cameras and FAKRA Cables ................................................................................... 184.5 Unplugging the FAKRA Cable .............................................................................................................. 194.6 Connecting VIA Mobile360 L900 to the Vehicle's Ignition (IGN) ........................................................ 204.7 Installing the Phoenix Plug to DC Jack ................................................................................................ 21

5. Software and Technical Support ................................................................................................................... 22

5.1 Linux Support...................................................................................................................................... 225.2 Technical Support and Assistance ....................................................................................................... 22


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Appendix A Installing Wireless Accessories ..................................................................................................... 23

A.1 Installing the Mobile Broadband MiniPCIe Module ........................................................................... 23

Appendix B Installing Mounting Bracket .......................................................................................................... 26

Appendix C Wi-Fi Support Channel Maps ........................................................................................................ 29

C.1 Jetson TX1 ........................................................................................................................................... 29C.2 Jetson TX2 ........................................................................................................................................... 30

Appendix D CAN/COM Conversion Cable ......................................................................................................... 31


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List of Figures Figure 01: Front panel I/O layout ......................................................................................................................... 4Figure 02: Back panel I/O layout .......................................................................................................................... 4Figure 03: Dimensions of the VIA Mobile360 L900 (front view) .......................................................................... 5Figure 04: Dimensions of the VIA Mobile360 L900 (side view) ............................................................................ 5Figure 05: Dimensions of the VIA Mobile360 L900 (bottom view) ...................................................................... 5Figure 06: USB 3.0 port diagram .......................................................................................................................... 6Figure 07: Micro USB 2.0 port ............................................................................................................................. 7Figure 08: Gigabit Ethernet port diagram ............................................................................................................ 7Figure 09: Micro SD card slot diagram ................................................................................................................. 8Figure 10: SIM card slot diagram .......................................................................................................................... 8Figure 11: SDIO port diagram ............................................................................................................................... 9Figure 12: Headphone and Mic-in port diagram .................................................................................................. 9Figure 13: COM port diagram ............................................................................................................................... 9Figure 16: Power button diagram ....................................................................................................................... 10Figure 14: CAN bus port diagram ....................................................................................................................... 10Figure 15: FAKRA connector diagram ................................................................................................................. 10Figure 19: Wi-Fi /BT antenna connectors diagram ............................................................................................. 11Figure 17: DC-in jack diagram ............................................................................................................................. 11Figure 18: DC-out jack diagram .......................................................................................................................... 11Figure 20: 4G and GPS antenna connectors diagram ......................................................................................... 12Figure 21: MiniPCIe slot diagram ....................................................................................................................... 13Figure 22: Unlocking the SATA HDD/SSD bay .................................................................................................... 14Figure 23: Removing the SATA HDD/SSD bays .................................................................................................... 14Figure 24: Installing the 2.5" SATA HDD/SSD ..................................................................................................... 15Figure 25: Reinstalling the SATA HDD/SSD bays ................................................................................................. 15Figure 26: Installing the Wi-Fi/BT antennas ....................................................................................................... 16Figure 27: Installing the GPS antenna ................................................................................................................ 16Figure 28: Connecting the FOV camera to the FAKRA cable ............................................................................... 17Figure 29: Connecting the FAKRA cable to the FAKRA connector ...................................................................... 17Figure 30: Uplugging the FAKRA cable ............................................................................................................... 18Figure 31: DIO port's pin 8 ................................................................................................................................. 19Figure 32: VIA Mobile360 L900 and IGN connection method diagram .............................................................. 19Figure 33: Connecting the battery cables onto the Phoenix plug to DC jack ..................................................... 20Figure 34: Connecting the Phoenix plug to DC jack............................................................................................ 20Figure 35: Unscrewing the bottom plate cover .................................................................................................. 22Figure 36: Removing the bottom plate cover ..................................................................................................... 23Figure 37: Installing the mobile broadband module .......................................................................................... 23Figure 38: Connecting the 4G antenna cable to the micro-RF connector on the module .................................. 24Figure 39: Installing the 4G antenna .................................................................................................................. 24Figure 40: Installing the rubber dampers ........................................................................................................... 25Figure 41: Installing the mounting bracket ......................................................................................................... 26Figure 42: Securing the mounting bracket ......................................................................................................... 27Figure 43: Mounting the VIA Mobile360 L900 ................................................................................................... 28Figure 44: CAN/COM conversion cable diagram ................................................................................................ 31


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List of TablesTable 01: HDMI port pinouts .............................................................................................................................. 6Table 02: USB 3.0 ports pinouts .......................................................................................................................... 6Table 03: Micro USB 2.0 port pinouts ................................................................................................................. 7Table 04: Gigabit Ethernet port pinouts ............................................................................................................. 7Table 05: Gigabit Ethernet port LED color definition .......................................................................................... 7Table 06: Micro SD card slot pinouts .................................................................................................................. 8Table 07: SIM card slot pinouts ........................................................................................................................... 8Table 08: DIO port pinouts .................................................................................................................................. 9Table 09: Headphone and Mic-in port pinouts ................................................................................................... 9Table 10: COM port pinouts ................................................................................................................................ 9Table 11: CAN bus port pinouts ........................................................................................................................ 10Table 12: FAKRA connector pinouts .................................................................................................................. 10Table 13: Power button behavior description ................................................................................................... 11Table 14: DC-in jack pinouts .............................................................................................................................. 11Table 15: DC-out jack pinouts ........................................................................................................................... 11Table 16: MiniPCIe slot pinouts ........................................................................................................................ 13Table 17: Jetson TX1 World Wide safe channel map ........................................................................................ 29Table 18: Jetson TX2 World Wide safe channel map ........................................................................................ 30Table 19: P2 (COM debug port) pinouts ........................................................................................................... 31Table 20: P3 (CAN bus port) pinouts ................................................................................................................. 31


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1. Product OverviewAccelerate time-to-market for cutting-edge autonomous vehicle and driver assistance systems with the VIA Mobile360 L900. Featuring a compact ruggedized form factor, advanced real-time video capture and processing capabilities, and support for up to nine automotive-grade cameras, this powerful and scalable system provides the ultimate solution for the most demanding on-road and off-road use cases and environments.

Powered by the NVIDIA Dual-Core Denver 2 64-bit CPU, ARM® Cortex®-A57 MPCore, and 256-core NVIDA Pascal™ GPU architecture with 256 NVIDIA CUDA cores, the VIA Mobile360 L900 delivers advanced compute, graphics, and AI processing performance.

Measuring just 240mm (W) x 53mm (H) x 180mm (D), this ultra-compact fanless system integrates a rich set of I/O features through the front and back panels of its chassis, including nine FAKRA connectors for camera-in, one HDMI port, two USB 3.0 ports, one CAN bus port, DIO and COM ports, and a Micro SD card slot. With integrated Wi-Fi, GPS, and BT 4.1, plus a Gigabit Ethernet port, SIM card slot, and optional 4G LTE module, the system delivers extensive connectivity options. Other features include 8GB LPDDR4 memory onboard, 32GB eMMC flash memory, two 2.5” SATA HDD/SSD bays, anda Headphone & Mic-in port.

The VIA Mobile360 L900 supports high computing power operation with low power consumption, and it has a built-in power management system that protects from power surges. With its power management system, it is capable of handling a wide range of DC power inputs from 9V~36V.

1.1 Key Features

1.1.1 High-PerformanceThe VIA Mobile360 L900 features a power-efficient NVIDIA TX2 embedded module powered by the NVIDIA Dual-Core Denver 2 64-bit CPU, ARM® Cortex®-A57 MPCore, and 256-core NVIDA Pascal™ GPU architecture with 256 NVIDIA CUDA cores. In addition to a rich feature set, the system delivers superb multi-tasking performance for a host of demanding in-vehicle safety applications.

1.1.2 Fanless, Compact, Ruggedized ChassisThe VIA Mobile360 L900 delivers fanless operation in a sealed aluminum alloy chassis that also acts as a thermal solution. The compact chassis design makes it suitable for installations in space-critical environments, while also ensuring maximum reliability.

1.1.3 Optimized Integration with Multiple I/O Access With front and back panel I/O access, the VIA Mobile360 L900 can be easily configured to support a wide variety of applications with easy integration and quick setup.

1.1.4 Camera SupportThe VIA Mobile360 L900 supports up to nine automotive-grade cameras through its FAKRA connectors. IP cams can also be supported.


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1.1.5 Support for a Wide Range of Power Sources The VIA Mobile360 L900 supports a wide range of power inputs from 9V to 36V DC. The system's flexible power input enables deployment in a broad variety of in-vehicle environments.

1.1.6 Storage ExpansionThe VIA Mobile360 L900 has 32GB of eMMC flash storage onboard, two M.2 slots for optional extra storage of up to 512MB each. In addition, it features a Micro SD card slot supporting an additional 32GB as well as two HDD/SSD bays for 2.5" SATA HDD/SSD.

1.1.7 Networking SupportThe VIA Mobile360 L900 is equipped with Wi-Fi/BT, GPS, and an RJ-45 port that provides high-speed Gigabit Ethernet. 4G connectivity can be added through the miniPCIe slot using the optional mobile broadband miniPCIe module. Please note that this option is available for the North America reigion only.

1.1.8 Multiple Mounting SolutionThe VIA Mobile360 L900 supports multiple methods for secure chassis mounting. The rugged VIA Mobile360 L900 can be mounted on the side-panel of a vehicle, floor bed, or any flat surface.

1.1.9 Operating SystemThe VIA Mobile360 L900 features a complete software evaluation image based on Linux kernel 4.9.

1.2 Product Specifications Processor

• NVIDIA Dual-Core Denver 2 64-bit CPU and ARM® Cortex®-A57 MPCore

System Memory

• 8GB LPDDR4 SDRAM

Storage

• 32GB eMMC flash memory

• 2 x M.2 slots (PCIe NVMe)

• 2 x 2.5 SATA HDD/SSD storage bays

Graphics

• NVIDIA Pascal™ GPU with 256 NVIDIA CUDA Cores

Camera-in Interface

• 3 x DS90UB964-Q1 Quad FPD-Link III deserializer hub

Wireless Connectivity

• Wi-Fi 802.11a/b/g/n/ac + BT 4.1 combo LGA GPS module

• MAX-7C-0 u-blox 7 GNSS module


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Audio

• Realtek ALC5658 Audio Codec

HDMI

• Integrated HDMI 2.0 transmitter supports 4K display

Expansion I/O

• 1 miniPCIe slot (USB only)

Front Panel I/O

• 2 USB 3.0 ports

• 1 Micro USB 2.0 port (for debugging)

• 1 Micro SD card slot

• 1 SIM card slot

• 2 2.5" HDD/SSD bays

• 1 Power button

Back Panel I/O

• 1 HDMI port

• 1 DIO port

• 1 COM port

• 1 CAN bus port

• 1 Gigabit Ethernet port

• 9 FAKRA connectors for camera-in

• 1 Headphone and Mic-in

• 4 Antenna connectors for Wi-Fi/BT, 4G, GPS

• 1 4-pole Phoenix 9V~36V DC-in

• 1 2-pole Phoenix 12V DC-out

Power Supply

• 9V~36V DC-in with IGN

• 12V DC-out

Operating System

• Linux kernel 4.9

Operating Temperature

• -20°C ~ 60°C

Storage Temperature

• -40°C ~ 85°C

Operating Humidity

• 40°C @ 0% ~ 95% (non-condensing)

Mechanical Construction

• Aluminum top cover

• Metal chassis housing


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Dimensions

• 240mm (W) x 53mm (H) x 180mm (D) (9.45" x 2.09" x 7.09")

Weight

• 3.0kg (6.61lbs)

Compliance

• FCC

Notes:1. As the operating temperature provided in the specifications is a result of testing performed in a testing chamber, a number of variables can influence this result. Please note that the working temperature may vary depending on the actual situation and environment. It is highly recommended to execute a solid testing program and take all variables into consideration when building the system. Please ensure that the system is stable at the required operating temperature in terms of application.

2. Please note that the lifespan of the onboard eMMC/UFS memory chip may vary depending on the amount of access. More frequent and larger data access on the eMMC memory will shorten lifespan. Therefore, it is highly recommended to use replaceable external storage (e.g., SD card) for large data access.

1.3 Layout Diagram

Figure 01: Front panel I/O layout


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Figure 02: Back panel I/O layout

1.4 Product Dimensions

Figure 03: Dimensions of the VIA Mobile360 L900 (front view)

Figure 04: Dimensions of the VIA Mobile360 L900 (side view)


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Figure 05: Dimensions of the VIA Mobile360 L900 (bottom view)


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2. External I/O Pin Descriptions and FunctionalityThe VIA Mobile360 L900 has a wide selection of interfaces, and includes a selection of frequently-used ports as part of the external I/O coastline.

2.1 HDMI® PortThe VIA Mobile360 L900 is equipped with one HDMI port on the back panel. An HDMI port Type A receptacle connector provides a connection to High Definition video and digital audio using a single cable. The pinouts of the HDMI port are shown below.

Pin Signal Pin Signal1 D2+ 11 GND2 GND 12 CLK-3 D2- 13 CEC4 D1+ 14 NC5 GND 15 DDC_CLK6 D1- 16 DDC_DATA7 D0+ 17 GND8 GND 18 HDMI_5V9 D0- 19 PLUG_DET10 CLK+

Figure 06: HDMI port diagram

Table 01: HDMI port pinouts

2.2 USB 3.0 PortThe VIA Mobile360 L900 is equipped with two USB 3.0 ports on the front panel. Each USB 3.0 port has a maximum data transfer rate of up to 5Gbps and is backwards compatible with the USB 2.0 specification. The USB ports provides complete Plug and Play and hot swap capabilities for external devices. The pinouts of the USB 3.0 ports are shown below.

Pin Signal1 VBUS2 D-3 D+4 GND5 RX-6 RX+7 GND8 TX-9 TX+

Figure 07: USB 3.0 port diagram

Table 02: USB 3.0 port pinouts


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2.3 Micro USB 2.0 PortThe VIA Mobile360 L900 is equipped with one Micro USB 2.0 port located on the front panel. The Micro USB 2.0 port supports OTG (On-The-Go) for debugging. The pinouts of the Micro USB 2.0 port are shown below.

Pin Signal1 VBUS2 D-3 D+4 ID5 GND

Figure 08: Micro USB 2.0 port

Table 03: Micro USB 2.0 port pinouts

2.4 Gigabit Ethernet PortThe VIA Mobile360 L900 comes with one Gigabit Ethernet port on the back panel which uses an 8 Position and 8 Contact (8P8C) receptacle connector commonly known as RJ-45. It is fully compliant with the IEEE 802.3 (10BASE-T), 802.3u (100BASE-TX), and 802.3ab (1000BASE-T) standards. The pinouts of the Gigabit Ethernet port are shown below.

Pin Signal1 TX1+ 2 TX1-3 TX2+4 TX2-5 TX3+6 TX3-7 TX4+8 TX4- Figure 09: Gigabit Ethernet port diagram

Table 04: Gigabit Ethernet port pinouts

The Gigabit Ethernet port (RJ-45) is equipped with two LED indicators on the front side to show its Active/Link status and Speed status.

Orange

(Left LED)

Green

(Right LED)Link off LED is off LED is offSpeed_100Mbit LED is on LED is offSpeed_1000Mbit LED is off LED is on

Table 05: Gigabit Ethernet port LED color definition


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2.5 Micro SD Card SlotThe VIA Mobile360 L900 comes with a Micro SD card slot located on the front panel with support for a maximum storage capacity of 32GB. The pinouts of the Micro SD card slot are shown below.

Pin Signal 1 SD_DAT22 SD_DAT33 SD_CMD4 VDD5 SD_CLK6 GND7 SD_DAT08 SD_DAT19 SD_CD-

Figure 10: Micro SD card slot diagram

Table 06: Micro SD card slot pinouts

2.6 SIM Card SlotThe VIA Mobile360 L900 comes with a SIM card slot located on the front panel that supports 4G SIM cards. SIM card usage on the VIA Mobile360 L900 requires that a 4G module is installed in the miniPCIe slot, enabling the 4G functionality, otherwise the SIM card slot will be disabled. The SIM card slot is designed for use with 4G modules that do not support built-in SIM card slots. The pinouts of the SIM card slot are shown below.

Pin Signal 1 USIM_VCC2 GND3 USIM_RST_ESD4 GND5 USIM_CLK_ESD6 USIM_DATA_ESD7 GND8 SIM_DET

Figure 11: SIM card slot diagram

Table 07: SIM card slot pinouts


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2.7 DIO PortThe VIA Mobile360 L900 is equipped with a DIO port located on the back panel. The DIO port offers a Digital I/O communication interface to support 8-bit GPIO. The pinouts of the DIO port are shown below.

Pin Signal 1 GPO02 GPO13 GPO24 GPO35 GPI06 GPI17 GPI28 INPUT_IGN9 GND

Figure 12: SDIO port diagram

Table 08: DIO port pinouts

2.8 Headphone and Mic-in PortThe VIA Mobile360 L900 is equipped with a Headphone and Mic-in port located on the back panel. The Headphone and Mic-in port is for connecting external speakers such as a headphone or a microphone. The pinouts of the Headphone and Mic-in port are shown below.

Pin Signal 1 IN1P2 IN2P (optional)3 CPVREF4 HPOR5 HPOL

Figure 13: Headphone and Mic-in port diagram

Table 09: Headphone and Mic-in port pinouts

2.9 COM PortThe VIA Mobile360 L900 is equipped with a COM port located on the back panel which supports TX/RX for RS-232. The pinouts of the COM port are shown below.

Pin Signal 1 TX2 RX3 GND4 +5V5 +12V

Figure 14: COM port diagram

Table 10: COM port pinouts


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2.10 CAN Bus PortThe VIA Mobile360 L900 is equipped with a CAN bus port located on the back panel. The CAN bus port supports one CAN bus and one debug COM (TX/RX) using a CAN/COM conversion cable. The CAN bus supports protocol specification Version 2.0 B. The pinouts of the CAN bus port are show below.

Pin Signal 1 TXD2 CANL3 GND4 GND5 GND6 GND7 CANH8 RXD9 VDD12V1_CAN

Figure 15: CAN bus port diagram

Table 11: CAN bus port pinouts

Note:For the pinouts of the CAN/COM conversion cable, please refer to Appendix E.

2.11 FAKRA ConnectorsThe VIA Mobile360 L900 is equipped with nine FAKRA connectors located on the back panel. The FAKRA connectors are for automotive-grade cameras. The pinouts of the FAKRA connectors are shown below.

Pin Signal 1 RIN_P2 GND

Figure 16: FAKRA connector diagram

Table 12: FAKRA connector pinouts

2.12 Power ButtonThe VIA Mobile360 L900 comes with a power button that supports Power On/Off. The diagram of the power button is shown below.

Figure 17: Power button diagram


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Power Button behavior

Power On/Off Occurs when the power button is pressed for longer than 3 seconds.

Table 13: Power button behavior description

2.13 DC-In JackThe VIA Mobile360 L900 integrates a 4-pole Phoenix DC-in jack that carries a 9V~36V DC external power input. The pinouts of the 4-pole Phoenix DC-in jack are shown below.

Pin Signal 1 DC_IN2 DC_IN3 GND4 GND Figure 18: DC-in jack diagram

Table 14: DC-in jack pinouts

2.14 DC-Out JackThe VIA Mobile360 L900 integrates a 2-pole Phoenix DC-out jack that provides 12V DC power output. The pinouts of the 2-pole Phoenix DC-out jack are shown below.

Pin Signal 1 DC_OUT12 GND

Figure 19: DC-out jack diagram

Table 15: DC-out jack pinouts

2.15 Antenna ConnectorsThe VIA Mobile360 L900 is equipped with four antenna connectors located on the back panel. Two antenna connectors are for Wi-Fi/BT antennas, while the other two antenna connectors are for 4G and GPS antennas. The Wi-Fi/BT, 4G and GPS antenna connectors diagrams are shown below.

Figure 20: Wi-Fi /BT antenna connectors diagram


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Figure 21: 4G and GPS antenna connectors diagram


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3. Onboard I/O This chapter provides information about the onboard I/O connector on the VIA Mobile360 L900.

3.1 MiniPCIe SlotThe VIA Mobile360 L900 is equipped with a miniPCIe slot for wireless networking options such as a 4G module. The pinouts of the miniPCIe slot are shown below.

Figure 22: MiniPCIe slot diagram

Pin Signal Pin Signal1 MPCIE_WAKE 2 VDD3V3_MPCIE3 NC 4 GND5 NC 6 VDD1V57 MPCIE_CLKREQ 8 USIM_VCC9 GND 10 USIM_DATA11 NC 12 USIM_CLK13 NC 14 USIM_RST15 GND 16 USIM_VPP17 Reserved 18 MPCIE_DET19 Reserved 20 MPCIE_W_DISABLE21 GND 22 MPCIE_RST_N23 NC 24 VDD3V3_MPCIE25 NC 26 GND

Pin Signal Pin Signal27 GND 28 VDD1V529 GND 30 SMB_CLK_I2C31 NC 32 SMB_DAT_I2C33 NC 34 GND35 GND 36 HUB_USBDN_DM1_CONN37 GND 38 HUB_USBDN_DP1_CONN39 VDD3V3_MPCIE 40 GND41 VDD3V3_MPCIE 42 LED_WWAN-43 GND 44 LED_WLAN-45 NC 46 LED_WPAN-47 NC 48 VDD1V549 NC 50 GND51 NC 52 VDD3V3_MPCIE

Table 16: MiniPCIe slot pinouts


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4. Hardware InstallationThis chapter provides information about the hardware installation procedures.

4.1 Installing the 2.5" SATA HDD/SSDStep 1

Insert the key and turn it in a counter clockwise direction to unlock the SATA HDD/SSD bay. Then unscrew the two thumbscrews.

Figure 23: Unlocking the SATA HDD/SSD bay

Step 2

Gently pull out the SATA HDD/SSD bays to disengage it from the chassis completely.

Figure 24: Removing the SATA HDD/SSD bays


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Step 3

Slide the 2.5" SATA HDD/SSD into the SATA HDD/SSD bay. Then secure it with four screws.

Figure 25: Installing the 2.5" SATA HDD/SSD

Step 4

Reinstall the SATA HDD/SSD bays.

Figure 26: Reinstalling the SATA HDD/SSD bays


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4.2 Installing the Wi-Fi/BT AntennasStep 1

Locate the two Wi-Fi/BT antenna connectors on the back panel of the VIA Mobile360 L900.

Step 2

Install the two provided Wi-Fi/BT antennas.

Figure 27: Installing the Wi-Fi/BT antennas

4.3 Installing the GPS AntennaStep 1

Locate the GPS antenna connector on the back panel of the VIA Mobile360 L900.

Step 2

Install the provided GPS antenna.

Figure 28: Installing the GPS antenna


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4.4 Installing the FOV Cameras and FAKRA CablesStep 1

Align the FOV camera's connector with the FAKRA cable's connector. Then insert the camera connector until the locking clips lock the connector in place.

Figure 29: Connecting the FOV camera to the FAKRA cable

Step 2

Connect the FAKRA cable to the FAKRA connector for camera-in on the VIA Mobile360 L900.

Figure 30: Connecting the FAKRA cable to the FAKRA connector


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4.5 Unplugging the FAKRA CableStep 1

Firmly press and hold the locking clip on the FAKRA cable's connector.

Step 2

Then pull the FAKRA cable's connector to unplug it.

Figure 31: Uplugging the FAKRA cable


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4.6 Connecting VIA Mobile360 L900 to the Vehicle's Ignition (IGN)Step 1

Locate pin no. 8 on the DIO port located on the back panel I/O.

Figure 32: DIO port's pin 8Step 2

Connect a wire to pin no. 8 on the DIO port. Then connect the other end of the wire into the Ignition (IGN) signal of the vehicle. For details of where to find the IGN on your vehicle, please refer to the car manufacturer.

Figure 33: VIA Mobile360 L900 and IGN connection method diagram


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4.7 Installing the Phoenix Plug to DC JackStep 1

Install four wires to the Phoenix plug to DC jack from the vehicle's battery. To install the wires, first loosen the respective screws on the Phoenix plug to DC jack before inserting each wire.

Figure 34: Connecting the battery cables onto the Phoenix plug to DC jack

Step 2

Connect the Phoenix plug to DC jack into the DC-in jack on the VIA Mobile360 L900, and then secure it with its two screws.

Figure 35: Connecting the Phoenix plug to DC jack


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5. Software and Technical Support

5.1 Linux SupportThe VIA Mobile360 L900 features a complete software evaluation image featuring the Linux kernel 4.9 operating system.

5.2 Technical Support and Assistance• For technical support and additional assistance, contact your local sales representative or board

distributor, or go to https://www.viatech.com/en/support/driver-support-fag/technical-support/ for technical support.

• For OEM clients and system integrators developing a product for long term production, other code and resources may also be made available. Please visit our website at https://www.viatech.com/en/about/contact/ to submit a request.

https://www.viatech.com/en/support/driver-support-fag/technical-support/

https://www.viatech.com/en/about/contact/ about/contact/

https://www.viatech.com/en/about/contact/ about/contact/


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Appendix A Installing Wireless AccessoriesThis chapter provides information on how to install the mobile broadband miniPCIe module in the VIA Mobile360 L900.

A.1 Installing the Mobile Broadband MiniPCIe ModuleStep 1

First, remove the two SATA HDD/SSD bays. Refer to steps 1 & 2 of section 4.1 for complete instructions.

Step 2

Remove the two screws on the front and back panel. Then remove the nineteen screws on the bottom plate cover as shown in the figure below.

Figure 36: Unscrewing the bottom plate cover


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Step 3

Remove the bottom plate cover.

Figure 37: Removing the bottom plate cover

Step 4

Align the notch on the mobile broadband module (4G module) with its counterpart on the miniPCIe slot, then insert the module at a 30° angle. Push down the module until the screw holes align with the mounting hole on the standoff and then secure the module with two screws.

Figure 38: Installing the mobile broadband module


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Step 5

Gently connect the 4G antenna cable to the micro-RF connector labeled "MAIN" on the mobile broadband module. Then, reinstall the bottom plate cover.

Figure 39: Connecting the 4G antenna cable to the micro-RF connector on the module

Step 6

Install the 4G antenna into the 4G antenna connector.

Figure 40: Installing the 4G antenna


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Appendix B Installing Mounting BracketThis chapter provides information on how to install the mounting bracket for the VIA Mobile360 L900. The mounting bracket is composed of a top casing, a base cover, and four M6 nuts.

Using the mounting bracket, the VIA Mobile360 L900 can be installed on the side panel of a vehicle, floor bed, or any flat surface suitable for mounting.

Figure 41: Mounting bracket parts

Step 1

Flip over the VIA Mobile360 L900. Install it onto the top casing of the bracket as shown in the figure below.

Figure 42: Installing the VIA Mobile360 L900 onto the top casing


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Step 2

Flip over the base cover. Align the four screws on the base cover with the screw holes on the top casing, and then gently install the base cover.

Figure 43: Installing the base cover

Step 3

Secure the top casing and base cover together with the four M6 nuts as shown in the figure below.

Figure 44: Securing the top casing and base cover together


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Step 4

Find a suitable surface to mount the VIA Mobile360 L900. Drill four holes and make sure the distance between the holes are perfectly matched with the mounting bracket's holes.

Step 5

Install the VIA Mobile360 L900 and secure it with M8 four screws.

Figure 45: Mounting the VIA Mobile360 L900


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Appendix C Wi-Fi Support Channel MapsThe VIA Mobile360 L900 comes with two World Wide safe Wi-Fi support channel maps for the Jetson TX1 and Jetson TX2. The two tables below shows the World Wide safe channel maps.

C.1 Jetson TX1Channel Number Frequency (MHz) 11b/g/n20

1 2412 A 2 2417 A 3 2422 A 4 2427 A 5 2432 A 6 2437 A 7 2442 A 8 2447 A 9 2452 A 10 2457 A 11 2462 A Channel Number Frequency (MHz) 11a/n20/ac20

36 5180 A 40 5200 A 44 5220 A 48 5240 A 52 5260 DFS - P 56 5280 DFS - P 60 5300 DFS - P 64 5320 DFS - P Channel Number Frequency (MHz) n40/ac40

38 5190 A 46 5230 A 54 5270 DFS - P 62 5310 DFS - P Channel Number Frequency (MHz) ac80

42 5210 A 58 5290 DFS - P Legend:

A = Active

P = Passive

DFS = Dynamic frequency selection

Table 17: Jetson TX1 World Wide safe channel map


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C.2 Jetson TX2Channel Number Frequency (MHz) 11b/g/n20

1 2412 A 2 2417 A 3 2422 A 4 2427 A 5 2432 A 6 2437 A 7 2442 A 8 2447 A 9 2452 A 10 2457 A 11 2462 A 12 2467 A 13 2472 A Channel Number Frequency (MHz) 11a/n20/ac20

36 5180 A 40 5200 A 44 5220 A 48 5240 A 52 5260 DFS - P 56 5280 DFS - P 60 5300 DFS - P 64 5320 DFS - P Channel Number Frequency (MHz) n40/ac40

38 5190 A 46 5230 A 54 5270 DFS - P 62 5310 DFS - P Channel Number Frequency (MHz) ac80

42 5210 A 58 5290 DFS - P Legend:

A = Active

P = Passive

DFS = Dynamic frequency selection

Table 18: Jetson TX2 World Wide safe channel map


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Appendix D CAN/COM Conversion CableThe VIA Mobile360 L900 comes with a CAN/COM conversion cable. The CAN/COM conversion cable supports one CAN bus port and one COM debug port (TX/RX). The pinouts of CAN bus and COM debug ports are shown below.

Figure 46: CAN/COM conversion cable diagram

P2 (COM debug port)Pin Signal Pin Signal

1 NC 6 NC2 RXD 7 NC3 TXD 8 NC4 NC 9 NC5 GND

Table 19: P2 (COM debug port) pinouts

P3 (CAN bus port)Pin Signal Pin Signal

1 NC 6 NC2 CAN GND 7 NC3 CANH 8 NC4 NC 9 NC5 CANL

Table 20: P3 (CAN bus port) pinouts

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