uppermidwest vendorexpo new and emerging technologies 051811
TRANSCRIPT
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New and Emerging Technologiesin Electronics
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Daniel F. Baldwin, Ph.D.PresidentEngent, Inc.3140 Northwoods ParkwaySuite 300ANorcross Georgia [email protected]
Overview
The Next Paradigm
Snap Shot of Emerging Technologies
Semiconductor Technology
Automotive Electronics MEMS and Microsensor Technology
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Biomedical and Molecular Electronics
104
108
102
106
1010
Calculations Per
Second Per $1000
Moores Law The Fifth Paradigm
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
1900
Electromechanical Relay Transistor IntegratedCircuit
VacuumTube
10-8
10-2
10-4
100
1910 1920 1930 1940 1950 1960 1970 1980 1990 2000
WY93.280bes-paradigm
Whats Next? 3D versus 2D device structures Nanotechnology
Molecular/optical/quantum computing
Smart/Intelligent ElectronicsSource: Wikipedia
Prismark
Adapted fromKurzweil
Innovation in Electronics
Ray Kurzweil: The Law of Accelerating Returns
Most long range forecasts of technical feasibility dramaticallyunderestimate the power of future technology because they arebased on an intuitive linear view rather then a historical exponentialview
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
We often overestimate what can be done in the short-termandunderestimate the long-term
A specific paradigm (a method or approach to solving a problem,e.g., shrinking transistors on an integrated circuit as an approach tomaking more powerful computers) provides exponential growthuntil the method exhausts its potential. When this happens, a
paradigm shift (i.e., a fundamental change in the approach)occurs, which enables exponential growth to continue.
Snap-ShotEmerging Technology Around the World
Oxford analogue event to look at bio-inspired electronics IMEC develops artificial skin technology Liquid lenses focus under software control Intel looks at shape-shifting materials based on tiny robots Materials bend visible and infra-red light backwards
Surrey University unveils nanotransistortheory Bucky gel enables stretchable conductors MIT turns to hotos nthesis for unlimite solar ower
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Intel inside DNA sequencing SMIC claims 0.11-micron CMOS image sensorprocess IMEC moves 3D chips closer to commercial market Researchers efficiently slice germanium wafers for solar power cells Scottish group works on photonic microelectronics project IMEC raises hopes of high efficiencyorganic solar cells MIT team makes step towardhuman cell-sized battery IBM works with AMD and Freescale to build first 22nm SRAM Stanford, Korean nanofab centre, semi startup claim 3D IC breakthrough Sematech engineers advance EUV resist technology to 22nm
Source: Electronics Weekly
Beyond Moores Law
Nanowire Computing Made Practical IBM has developed a process for making speedier and more energy-efficientchips. One of the leading candidates for a technology that
could make computers smaller and more powerful is based on transistors made from semiconducting nanowires. Read More
Nanotube Ink Printable carbon nanotube patterns could find uses in flexible displays and RFID tags.
Small, Cheaper Flash Memory Freescale Semiconductor is using nanoscale materials to halve the size of flas h memory and make it much less expensive.
Trying for a Terahertz Transistor A new transistor design aims to smash speed records.
A New Spin onComputing Researchers have found a material thatcould allow the use ofspintronicsto make more-powerful computers.
A Universal Chip for Cell Phones'
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
, , .
Holograms Break Storage Record New technology has almost twice the storage density of a magnetic hard drive.
CarbonNanotube Computers IBM resea rchers have made an importantbreakthrough: arranging nanotube transistors for complex circuits.
A Breakthrough in Nanotube Transistors High-currenttransistors made fromperfectly aligned carbon nanotubes show promise for use in flexible and high-speed nanoelectronics.
Bringing Light to Silicon Intel has announced a newsilicon laserthatcan transfer data on a beam of light--and could makecomputers many times faster.
A Laser Technique Could Improve Electronics This novel process mightlead to purer silicon --and faster chips.
How to Burn a Three Terabyte CD A newnano-optical device can focus laser lighttighter than traditional optics, which could lead to higher-density data storage.
An Enhanced Hard Drive for Your Media Hardware manufacturers are staving off storage limits by making bits stand rather than recline.
Nanowire Transistors Faster than Silicon Advances in nanowires show they can be fast enough to use as ultrasmall transistors in cheap, high-performance electronics.
Source: Technology Review
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Silicon Fabrication Technology Nodes
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: Intel
Vacuum Dielectrics
A main source of the signal lag is not so much the metalinterconnects themselves but rather the insulation between thewires. So the question is, what can you put between those wiresto prevent the signal from
leaking? Vacuumis thebest insulator
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
known.
IBMs Air-gap technologycarves nanoscale holes intothe insulation between achips copper wires, as seenin this electron micrograph.
Source: I EEE Spectrum
Semiconductor Nanowires
New strategies, including the use ofnovel materials andone-dimensional (1D) device concepts, innovative devicearchitectures, and smart integration schemes are being exploredand are crucial to extending current capabilities the post CMOS era.
Functional nanostructures, particularly one-dimensionalsemiconductor nanowires have been demonstrated.
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: IBM
Demonstration of firstvertical surround-gateSi-nanowire transistor,see image at right. Asurround-gate allows the
optimal electrostaticcontrol over the channel
Nonvolatile Molecular Memory
Researchers have discovered a new way to switchcurrent on and off in graphene, pointing the way tothe possibility of molecule-size memory.
Graphene is a 1-atom-thick carbon molecule in whichelectrons flow 100 times as fast as they do in silicon.In theory, a graphene transistor would be 100 timesas fast as the same device made of silicon. Onechallenge, though, is that graphene is so conductivethat its hard to stop current from flowing, and such
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
-transistor.
It is believed that with graphene, a device could, inprinciple, be scaled down to a 1-nanometer-by-1-nanometer size.
The switching is not fast enough to be used in a logiccircuit, and researchers have not yet shown that itwill work for the millions of cycles a memory devicewould require.
Graphene is presently one of the most expensive
materials on Earth. It is the strongestsubstanceknown to man and can be made into a conformalsurface.
Source: IEE E SpectrumWikipedia
Memristor
Fourth basic element in integrated circuits that could make it possible todevelop computers that turn on and off like an electric light.
Short for memory resistor
A class of passive two-terminal circuit elements that maintain a functional
relationship between the time integrals of current and voltage. Results in resistance varying according to
'
wires are 50 nm -about 150 atoms -wide
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
.
Specifically engineered memristors providecontrollable resistance useful for switchingcurrent.
Could make it possible for memories thatretain information even after the power is off,so there's no wait for the system to boot up
after turning the computer on.
May even be possible to create systems withsome of the pattern-matching abilities of thehuman brain.
Source: HP
Electronics - Communications Tablet
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Source: Prismark PartnersCore production rate 1 million units/week, 37 variants
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Communication Surface
Digital communicationplatform
Touch screen interactive
Table top work surface
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: Microsoft
Power Delivery
93.280/222/151/249/311bes
SOLAR PANELFUEL CELL
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Thin Film Solar Cells
The cells are manufactured on 0.6-by-1.2-meter sheets of glass, which are cleaned andcut on an angle to produce the strong, defect-free edges required for processing. The glasshas already been coated with a transparent tinoxide that provides electrical contact to thedevice.
This starting platform is radically different fromthat for silicon cells, which are made from farsmaller monocrystalline and polycrystalline
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
. An elemental vapor deposition process takes
place in four chambers. Glass is placed onrollers and fed into the first chamber, where itis heated to 600 C. Then it is transferred intothe second chamber, which is full of cadmiumsulfide vapor, formed by heating solid CdS to700 C. The vapor forms a submicrometerdeposit on the glass as it moves through thiscloud, after which a similar process in a thirdchamber adds a layer of micrometers-thickCdTe in about 40 seconds. Then a gust of
nitrogen gas rapidly cools the panels to 300 Cin a fourth chamber, strengthening the materialso that it can withstand hail and high winds.
Source: First Solar
Organic Electronics
Organic semiconductors are strongcandidates for creating flexible, full-color displays and circuits on plastic.
Using organic light-emitting devices(OLEDs), organic full-color displaysmay eventually replace liquid-crystaldisplays (LCDs) for use with laptop andeven desktop computers. Suchdisplays can be deposited on flexibleplastic foils
Currently, efficiencies of the bestdoped polymer and molecular OLEDsexceed that of incandescent light bulbs.Efficiencies of 20 lumens per watt havebeen reported for yellow-green-emittingpolymer devices, and 40 lm/W attainedfor phosphorescent molecular OLEDs,compared to less than 20 lm/W for atypical incandescent light bulb. It isreasonable to predict that soon,efficiencies of 80lm Wa value
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
comparable to that of fluorescent roomlightingwill be achieved usingphosphorescent OLEDs.
It is reasonable to assume that within10 years, the square footage of organiccircuitry might exceed that of siliconelectronics
Source: I EEESpectrum
An organic passive-matrix display on asubstrateof PE T, a l ightweight plastic, wil lbend around a diameter of less than acentimeter.
Organic Transistor
A transistor that emits light and is made fromorganic materials could lead to cheaper digitaldisplays and fast-switching light sources oncomputer chips, according to the researchers.
The new organic light-emitting transistor (OLET) ismuch more efficient than previous designs. It hasan external quantum efficiency of 5% (0.6% forprevious designs), compared to an OLED based on
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
e same maera o .
A transistor-based light source would switch muchfaster than a diode, and more easily integratedonto ICs providing faster data transmission acrosschips than copper wire.
The unique three-layer structure leads to higherefficiency. Current flows horizontally through thetop and bottom layersone carrying electrons andthe other holeswhile carriers that wander into thecentral layer recombine and emit photons.
Source: IEEE Spectrum
Printed Organic Electronics
Electronics companies are looking at ways to graduate fromsilicon electronics to printed organic electronics, with the hopeof a 100X cost reduction, driven by roll-to-roll direct printing onflexible plastic substrates.
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Source: Xerox
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Printed Displays
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+
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Source: E Ink
Kindle WirelessReadingDevice
This microprocessor is made from organic materials. It is puny compared tomost silicon processors, but is flexible and cheap
Fabricated on 25 mil Flexible Film
4000 Organic Transistors
Collaboration between: IMEC in Leuven, Belgium
Plastic Computer Processor
Source: Technology Review, IM EC
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
TNO research organization, Netherlands
Polymer Vision display company,Netherlands
Can run only one 16 instruction program.Commands are hardcoded on 2nd foiletched with plastic circuits. P rocessorcalculates running average of an incomingsignal, a simple operation for conventionalmicroprocessors. The chip runs at six hertz-on order of a million times slower than a modern desktop machine-andcan only process information in 8 bits, compared todays128 bits processors
~2cm
Tactile Displays
Images at your fingertips
Tactile displays made from awatery gel that changes shapeto show objects on its surface.
Use a hydrogel, the type ofmaterial used to make soft
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
contact lenses, which consistsmainly of water bound up withina polymer.
These smart hydrogels cansignificantly change theirvolume and mechanicalstrength.
Source: New Scientist
3D Integration/IC Market and Roadmap
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Embedded Chip or Chips First Technology
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: Fraunhofer IZM
3D Wafer Level Integration Concept
3D integration represents a system-level integration schemewherein multiple layers of planar devices are stacked andinterconnected using through-wafer vias in the Z direction.
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: RIT & IBM
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3D Wafer Level Packaging Technologies
RTI
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: Semiconductor International
Semiconductor International
3D Wafer Level Integration Strategies
Primary interconnection strategies
Wafer-to-wafer (W2W)
Die-to-wafer (D2W)
Some believe W2W bonding is being supplanted by D2W
bonding because of D2W's ability to: Assemble onl KGD
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Easier alignment tolerances
Ability to interconnect die of dissimilar sizes
Ability to interconnect die from dissimilar size wafers for heterogeneousintegration
Source: Phil Garrou -RTI &
Semiconductor International
3D WLCSP Wafer Level FC/SMT
New package technology that leverages existing infrastructures forwafer level packaging technology including wafer level redistributionand wafer level ball drop and high speed flip chip assemblytechnology.
Package architecture consists of a base silicon wafer having IOredistribution at the wafer level that includes flip chip interconnect
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
pa s or a ma ng e an so er a s or eve nerconnec. edie is mounted using conventional flip chip techniques and is thinnedto prevent 2nd level assembly interference.
Flip Chips
TSVRDLSolder Balls Solder BallsACT
PA
Source: ENGENT, INC.
3D WLCSP Wafer Level FC/SMT
Leverages D2W process technology
Leverages existing manufacturing infrastructure
Low cost 3D wafer level integration technology
Limited in 3D stack height Source: ENGENT, INC.
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Driver ChipASIC
Cap Die
MEMS
Die
ThroughDieVias
3D Wafer Level Package Assembly
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: ENGENT, INC.
3D WLCSP 2nd GenerationSilicon Through Vias
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: Flip Chip International
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Automotive Electronics
Sensor Rich Environment
Electro Mechanical Replacement
Networked Subsystems
Telematics
Wire Harness Elimination Auto Driveand Systems for Platooning Adaptive Cruise Control
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
a ar arnng
Collision Avoidance
Electric Steering
Higher Voltage Power Systems
Intelligent Transportation advise or warn the driver (collision warning),
partially control the vehicle, either for steady-state driver assistance or as an emergencyintervention to avoid a collision (collisionavoidance), or
fully control the vehicle (vehicle automation).
Automotive Electronics
Smart junction box Single set of wires to route commands to different parts of the car
Network of inter-connected systems Microprocessors Micro-electromechanical systems
Voice-activated technology
Sensors Multiplex to make intelligentvehicles
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
platforms Voice- interface
Touch-screen-based interfaces Entertainment Navigation Control subsystems
Safety and Fuel conservation Control valves
Electronic clutches/steering Electronic braking systems Radar systems
Air quality improvement Control heated catalysts
Optoelectronic Circuit Board
Optoelectronics - Emerging IntegrationTechnology
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Opto Electronic Multichip Module(Low Cost)
Source: Georgia Tech
High Speed Optical T/R Module
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
MEMS Enabled Products
Micro-electro-mechanical Systems(MEMS) or Microsystems
RF Devices Tuning Tunable Capacitors ActivePassives
Sensors Accelerometers
Pressure/Temperature
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Gyroscopes Proximity IR Detectors
Chemical
Actuators Optoelectronics
High Speed Switches Micro Projection Displays Holographic Displays Detectors Multiplexers Active Signal Alignment Active Fiber Alignment
Source: Prismark Partners
Laser/Detector
Lens
Sili conOpitcal BenchSubstrate
Guides
Micromirror
Fiber
Al ignmentV-Groove
AlignmentGroove
Optical Cross Connect Switch
16 Flip Chips
Die Attach
Wirebonding
Multiple Materials Silicon
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Flex
Solder
Epoxy
Gold Wire
Source: ENGENT, INC.
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SMT on Flex - IMU
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: ENGENT, INC.
3D Wafer Level Fabrication of MEMS Sensors
WLCSP Flip Chip
Wafer Wafer
SphereDrop/
Reflow
PastePrint/
Reflow
Wafer
RepassivationRedistribution
FCI Proces
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Thinning
Placement
Underfill/Test
WLCSP Flip Chip
Dicing/
TapeandReel
Fluxing/
Placement
Reflow
WL CSP Test Vehicle Wafer
ENGENT Process
Waffle Packed 1st Level PackagesSource: ENGENT, INC.
3D Wafer Level Fabrication of MEMS Sensors
Conceptual Image
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Q1 2ndLevel Assembly Q3 2ndLevel Assembly
Source: ENGENT, INC.
Bioelectronics
Bioelectronics is concerned with the study of the interface betweenbiological and electronic systems, particularly at or below the m scale.Three major application areas: Biological sensing
Biological microcircuits
Biological information storage
Low Cost Disposable Lab on a Chip
Im lanted CardiovascularSensors
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Implanted Drug Delivery Systems
Biomechanical Actuators
Micro Surgical Devices withSensors/Detectors
Vision implants
Key Issues Protection of Body and Device
Common Interface Materials
Device Communication Mechanical Support
Thermal Management
Cleanliness Management
93.280/293bes
Bioelectronics
Bio-sensing/Drug Delivery
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
1000 resevoirs on 10 x 10mm device Preprogrammed drug, reagent, other chemical release
Bioelectronics - Muscle Control Stimulator-Telemeter
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Source: NeuroControl Corp.
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Bioelectronics- Artificial Vision
Degenerative retinaldiseases Age-related Macular
Degeneration
Retinitis P igmentosa
Devices electrically
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
s mu a e e ea yganglion cells in theretina corresponding towirelessly transmittedvideo data from outsidethe body, thuseffectively bypassingthe dying photoreceptorcells
Bioelectronics - Implantable Retina Prosthesis
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: ENGENT, INC.
Bioelectronics
Electronic Pills
Designed to treat gastrointestinal disorders, goes a step further,dispensing medication at a location and rate programmed by aphysician. The disposable capsule, which is about the same size asan ordinary pill, contains a tiny computer, a wireless transmitter, and aseries of sensors; it passes naturally through the digestive system
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
food or water.
A. Microprocessor
B. pH Sensor
C. Temperature Sensor
D. Fluid Pump
E. Wireless Transceiver
F. Battery
Source: Technology Review
Bioelectronics
Electrotransport technology enablespatient-controlled, pulsatile andmacromolecule delivery through intact skin.
Systems use low-level electrical energy totransport drugs through intact skin,addressin harmaceuticalchallen es such
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
as: Compounds that cannot be delivered by passive
transdermal systems
Potent drugs that must be delivered in small, precisely
controlled doses
Therapy that demands pulsatile or patient-controlleddelivery
Complex delivery patterns, including ascending,descending, variable or circadian delivery
Molecular Electronics
Molecular Electronics has two main strands: Use of organic materials in macroscopic combinations to form
electronic and optoelectronic devices (typicallymicrometer scales)
Use of functionality in individual molecules to providemolecular-scale electronic device (typically
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
.
Potential Devices
Low Cost Disposable Lab on a Chip
DNA Detectors
DNA Manipulation
Molecular Synthesis Platforms
DNA Sequencing
Walking Molecules
This tiny machine made of just onemolecule can carry other molecules ona surface. The technique can be usedto move atoms or molecules close toeach other, controlling when they react.
The new "molecule carrier" couldeventually lead to more-efficientcatalysts and new methods for
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
assem ng moecuar eecroncs. Anthraquinone molecules move in a
straight line on a copper surface, whilecarbon dioxide moves randomly. Butwhen the two molecules get closetogether, the anthraquinone picks upthe carbon dioxide and keeps walking.The molecule carrier is able to carrytwo carbon dioxides.
Source: Technology Review
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Molecular Electronics - Microfluidic Lab on aChip
Biochemical microanalysissystems
Biochemical microprocessorsranging from gelelectrophoresis chips to
comprehensive property-characterization devices (e.g.refractive index, viscosity,
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
turbidity). Genetic assays Fluidic microprocessor
performs two thermal-controlled biochemicalreactions in series, followedby an electrophoreticseparation, enabling it toperform complete geneticanalyses in minutesSource: Engent, Inc. & Univ. Of Michigan
Molecular Electronics - DNA SampleAnalysis
Nanogens technology focuses on analysisof unknown charged biological moleculeswhich are capable of binding specifically toknown capture molecules on a microchipfocusing on DNA-based sample analysis.
The system consists of both a disposable
cartridge containing a proprietarysemiconductor microchip and a fully
Disposable Cartridge
ASIC Microchip
Permeation Layer
Capture Probes
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
.
Electronic Addressing Placement of charged molecules at specific
test sites
Leverages strong negative charge of DNA
Electronic manipulation
Solution of DNA probesis introduced andchemically bound todesigned site
An array of specificallybound DNA probes canbe assembled oraddressed on themicrochip.
Source: Nanogen & EPOCH Biosciences
Summary
Exciting time for electronics
Advances in electronics technology will continue to drive theindustry.
Notable advances Molecular electronics
Bio-electronics
Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10
Automotive electronics
Smart electronics
Display technology
Telecommunication electronics
Military electronics