tx-i/o getting started guide

TX-I/O Getting Started Guide 553-636 Rev. 1.1, November, 2007

Rev. BA, November, 2007 Siemens Building Technologies, Inc.

TX-I/O Getting Started Guide

2 Siemens Building Technologies, Inc

Table of Contents

Rev. 1.1, November, 2007

NOTICE

The information contained within this document is subject to change without notice and should not be construed as a commitment by Siemens Building Technologies, Inc. Siemens Building Technologies, Inc. assumes no responsibility for any errors that may appear in this document.

All software described in this document is furnished under a license and may be used or copied only in accordance with the terms of such license.

WARNING

This equipment generates, uses, and can radiate radio frequency energy and if not installed and used in accordance with the instructions manual, may cause interference to radio communications. It has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against such interference when operated in a commercial environment. Operation of this equipment in a residential area is likely to cause interference in which case users at their own expense will be required to take whatever measures may be required to correct the interference.

SERVICE STATEMENT

Control devices are combined to make a system. Each control device is mechanical in nature and all mechanical components must be regularly serviced to optimize their operation. All Siemens Building Technologies, Inc.branch offices and authorized distributors offer Technical Support Programs that will ensure your continuous, trouble-free system performance.

For further information, contact your nearest Siemens Building Technologies, Inc. representative.

COMMENTS

Your feedback is important to us. If you have comments about this manual, please submit them to [email protected]

CREDITS

APOGEEand Insight are registered trademarks of Siemens Building Technologies, Inc. Insight for Personal Computers is a registered trademark of Siemens Building Technologies, Inc. LONMARK, Neuron, and LONWORKS are trademarks of Echelon Corporation registered in the United States and other countries. Other product or company names mentioned herein may be the trademarks of their respective owners.

Copyright 2007 by Siemens Building Technologies, Inc.

Country of Origin: US

Siemens Building Technologies, Inc 3

mailto:[email protected]


Table of Contents Table of Contents ..............................................................................................................4 How to Use This Manual ...................................................................................................6

About This Manual..................................................................................................6 Prerequisites...........................................................................................................6 Manual Conventions...............................................................................................7 Manual Symbols .....................................................................................................7 Getting Help............................................................................................................7

Overview.............................................................................................................................8 General TX-I/O Features ........................................................................................9 Compatibility .........................................................................................................10

APOGEE or pre-APOGEE Product Compatibility..........................................10 TX-I/O Network Architecture.................................................................................11 TX-I/O Module Assembly......................................................................................12

Separating a Module from Its Terminal Base ................................................13 To Park A Module....................................................................................13 To Remove A Module..............................................................................13

Point Addressing ..................................................................................................13 TX-I/O Module Placement and Orientation ..........................................................14 Enclosure and Mounting Options .........................................................................16

Power and Communications Modules ..........................................................................17 P1 Bus Interface Module ......................................................................................18 Bus Connection Module .......................................................................................19 TX-I/O Power Supply............................................................................................19 P1 Bus Interface Module, TX-I/O Power Supply, and

Bus Connection Module Indicators .........................................20 Power and Communication Connections.......................................................20

I/O Modules ......................................................................................................................22 Digital Input Modules (TXM1.8D and TXM1.16D)................................................23 Digital Output Modules (TXM1.6R and TXM1.6R - M).........................................24 Universal Modules (TXM1.8U and TXM1.8U - ML)..............................................24 Super Universal Modules (TXM1.8X and TXM1.8X- ML) ....................................26 I/O Module Indicators ...........................................................................................27 LCD Symbol Chart................................................................................................29

TX-I/O Startup Procedure................................................................................................30 Before You Begin .................................................................................................30

At the Branch Office.......................................................................................30 Select Addresses and Order Address Keys............................................30 Loading the USB Driver...........................................................................30

At the Insight Workstation ..............................................................................30 At the Site.......................................................................................................31

Common Grounding Requirement ..........................................................31 Verifying the Field Panel Firmware .........................................................31

Required Tools .....................................................................................................31


Table of Contents

Installation and Startup.........................................................................................32 Extending TX-I/O Bus Communication ..........................................................32 Wiring the FLN Connector .............................................................................32 Wiring the module bases ...............................................................................32 Mounting the Power, Communication, and I/O Modules ...............................32 Inserting the Address Keys ............................................................................33 Set the P1 BIM Baud Rate.............................................................................34 Creating the Field Panel Database................................................................35 Verifying the Configuration.............................................................................35

TX-I/O Slope/Intercept Calculations ..............................................................................36 PXC Compact and TX-I/O Slope/Intercept Calculations ...............................37

TX-I/O 1000-ohm RTD Wire Resistance and Intercept Adjustments ..........................38



How to Use This Manual About This Manual

This manual is written for the owner and user of TX-I/O™ products. It is designed to help you become familiar with TX-I/O Technology and its applications. TX-I/O is a line of I/O modules with associated power and communication modules for use within the APOGEE system.

This section covers conventions and symbols used in the manual, how to access help, related publications, and other information that will help you use this manual.

Prerequisites

In addition to reading this owner's manual, you should also become familiar with the following Siemens Building Technologies technical documentation. Each document has been written to help you get the most out of your APOGEE products.

• APOGEE Field Panel User's Manual (125-3000). This manual describes the operator interface program you use to communicate with the MEC and other APOGEE field panels.

• APOGEE Powers Process Control Language (PPCL) User's Manual (125-1896). This manual describes Powers Process Control Language (PPCL), the language used to write control programs for APOGEE field panels.

• APOGEE Wiring Guidelines for Field Panels and Equipment Controllers (125-3002). This manual provides cable specifications, conduit sharing guidelines, and diagrams for wiring various devices to APOGEE devices, including TX-I/O modules.

For Smoke Control Applications:

• Smoke Control Systems Application Guide (125-1816). This manual provides both commonly used heating, ventilating, and air conditioning (non-dedicated) system configurations for smoke as well as dedicated smoke control system configurations.

• NFPA and UL Standards Relevant to Smoke Control Systems (125-1817). This manual provides the requirements of national standards that apply to building control systems and associated components that are part of smoke control systems.

• Smoke Control User’s Manual (125-1842). This manual provides complete instructions for activating, monitoring and testing the smoke control functions of a building control system.

When Using Insight:

• Insight 3.x Documentation. To view Insight 3.x documentation, see the Insight Online Documentation window, which you can access from the Insight Main Menu or the Insight program group.

These manuals, along with information about other Siemens Building Technologies products, technical training classes, and services can be obtained from your local Siemens Building Technologies representative.


How to Use This Manual

Manual Conventions

The following 3 tables list conventions to help you use this manual in a quick and efficient manner.

Convention Example

Numbered Lists (1,2,3…) indicate a procedure with sequential steps.

1. Turn OFF power to the field panel. 2. Turn ON power to the field panel. 3. Contact your local Siemens Building Technologies representative.

Actions that you should perform are specified in boldface font.

Type F for Field panels. Click OK to save changes and close the dialog box.

Error and system messages are displayed in Courier New font.

The message Report Definition successfully renamed appears in the status bar.

New terms appearing for the first time are italicized.

The Open Processor continuously executes a user-defined set of instructions called the control program.

Manual Symbols

The following table lists the symbols used in this Owner’s Manual to draw your attention to important information.

Notation Symbol Meaning

Warning:

Indicates that personal injury or loss of life may occur to the user if a procedure is not performed as specified.

Caution:

Indicates that equipment damage, or loss of data may occur if the user does not follow a procedure as specified.

Getting Help

For more information about TX-I/O, contact your local Siemens Building Technologies representative.



Overview TX-I/O™ is a line of I/O modules with associated power and communication modules for use within the APOGEE Automation System. TX-I/O products include eight types of I/O modules, modular TX-I/O Power Supplies, Bus Connection Modules, and Bus Interface Modules.

TX-I/O Modules provide I/O points for the APOGEE Automation System based upon TX-I/O Technology. TX-I/O Technology provides flexibility of point types, tremendous flexibility of signal types and support for manual operation.

There are eight types of TX-I/O modules:

• 8 point DI module (TXM1.8D)

• 16 point DI module (TXM1.16D)

• 6 point DO with Relay module (TXM1.6R)

• 6 point DO with Relay and Manual Override module (TXM1.6R-M)

• 8 point Universal module (TXM1.8U)

• 8 point Universal with local override/identification device (LOID) module (TXM1.8U-ML)

• 8 point Super Universal module (TXM1.8X)

• 8 point Super Universal with LOID module (TXM1.8X-ML)

Individual module features are described later in this document.


Overview

General TX-I/O Features

The self-forming TX-I/O bus transmits power as well as communication signals. The TX-I/O bus can be extended a maximum of 164 feet (50 meters).

Hot-swappable electronic components allow powered electronics to be disconnected and even replaced without removing terminal wiring or disturbing the self-forming bus.

The removable label holder allows for customized point labels.

LEDs provide status indication and diagnostic information for the I/O module, as well as for each point on the module.

The I/O module terminal bases provide the connection terminals for wiring on the field device side; there is no need for separate terminal strips.

All TX-I/O modules are also:

• DIN rail mounted

• High density (point count to physical dimensions)

• Hardware addressed with address keys

• Separable into terminal base and plug-in I/O module electronics for:

• Improved installation workflow, allowing field wiring to be terminated prior to installation of electronics.

• Optimum diagnostics - connected peripheral devices can be measured without affecting or being affected by the I/O module.

• Quick replacement of electronics for service.



Compatibility

CAUTION:

When working on a network with multiple firmware revisions, always connect to the MMI port at the field panel with the newest firmware revision. Otherwise, you will not be able to view features in newer firmware revisions, or you may coldstart the field panel.

APOGEE or pre-APOGEE Product Compatibility TX-I/O modules are compatible with:

• Firmware revisions 2.8, 2.8.1, 2.8.2, and 3.0.1

• Insight 3.8

NOTE: BACnet Firmware Revision 3.0 does not support TX-I/O.

Firmware 2.8, 2.8.1, 2.8.2, and 3.0.1 are fully compatible with and will communicate with the following APOGEE or pre-APOGEE products in your facility:

• Insight® software Revision 3.8 or later

• PXC Modular (with Firmware Revision 2.8.1 or 2.8.2)

• APOGEE field panels with Firmware Revision 2.8:

• Modular Building Controller (MBC)

• Modular Equipment Controller (MEC)

• Floor Level Network Controller (FLNC)

• Stand-alone Control Unit (SCU V5)

• Pre-APOGEE field panels and APOGEE field panels with Firmware Revision 2.7 or earlier can not directly communicate with TX-I/O modules, but can see the TX-I/O points elsewhere on the network.

NOTE: For more information on these or other products, contact your Siemens Building Technologies representative.


Overview

TX-I/O Network Architecture

TX-I/O devices may reside on an APOGEE field panel P1 FLN or MEC Expansion Bus. See Figure 1.

Figure 1. TX-I/O Network Architecture Example.



TX-I/O Module Assembly

Figure 2 shows the general TX-I/O Module components and hardware features.

1

2

3

4

5

6

7

8

9

10

11

12

13

1415

16

17

18

TXIO

0028

R1

Figure 2. TX-I/O Module Components.

1 Standard DIN mounting rail (not included)

2 Terminal base (plug-in base for the I/O module)

3 Plug-in module (the functioning component of the I/O module assembly)

4 Local override facility (not applicable to all types)

5 LCD display (not applicable to all types)

6 Detachable label holder

7 Module label (not included – print module labels from System Profile)

8 Address key with mechanically encoded module address


Overview

9 Plug-in contacts between the terminal base and the plug-in module

10 Electrical contact between terminal base and plug-in module

11 Terminal screws

12 Test pickups (test points)

13 Slide fitting to lock assembly into position on standard mounting rail

14 TX-I/O bus connector

15 TX-I/O bus connector cover (provided with P1 BIM, Power Supply, and Bus Connection Module)

16 Module lock

17 Module disengage catch

18 Module release catch

Separating a Module from Its Terminal Base NOTE: Swing the address key away from the I/O module before disengaging an I/O

module from its terminal base. For more information on address key insertion and removal, see

NOTE: Inserting the Address Keys in this document.

To Park A Module Squeeze module sides above the disengage catch (See item 17 in Figure 2) and

pull up slightly to disengage the I/O module from the terminal base.

The I/O module is retained in the terminal base (‘parked’), but all wiring connections are now floating.

To Remove A Module Squeeze module sides above the release catch (See item 18 in Figure 2) and

pull up to remove the I/O module from the terminal base.

Point Addressing

Points on TX-I/O modules are addressed similarly to points on other FLN devices. These point addresses include Field Panel, FLN, Drop, and Point components, as follows:

• The Field Panel portion of the point address is determined by the ALN address of the field panel.

• The FLN portion of the point address is determined by the field panel FLN number or MEC expansion port number (0).

• The Drop portion of the point address is determined by the keyed address of the I/O module containing the point (1 through 8 only for MEC Expansion Bus).

• The Point portion of the point address is the physical point number on the I/O module.



NOTES: P1 BIMs and TX-I/O modules are addressed using a TX-I/O address key. The keys are available in sets of 24, up to a maximum value of 72 (sets of 1-24, 25-48, 49-72, and doubles of 1-12). Addresses must be unique on the FLN. If you expect to add devices to an FLN in the future, use addresses above 32 for all TX-I/O modules so they do not conflict with other FLN devices.

TX-I/O Module Placement and Orientation

NOTE: All DIN rails must start with a P1-BIM, a TX-I/O Power Supply or a Bus Connection Module. See Figure 3 for examples.

CAUTION:

Do not install TX-I/O components on aluminum DIN rail. Use steel DIN rail only.

TX-IO component rows can be mounted vertically or horizontally. Figure 3 is an example of component orientation and spacing. See Figure 4 for an example of module placement.

Figure 3. TX-I/O Component Orientation and Spacing.

NOTE: DIN rails must be centered a minimum of 4.5 inches from obstructions on either side (or above and below for horizontal mounting) in order to provide a 2.5 inch clearance on both sides of the TX-I/O components for wires to ports and connectors. Components can also be temporarily removed from the DIN rail for easier wiring.


Overview

1076

2J00

5

1

2

3

4

4

5

6

Figure 4. TX-I/O Module Placement.

1 Standard DIN mounting rail

2 P1 Bus Interface Module (P1 BIM)

3 Bus Connection Module

4 I/O module

5 Address key location

6 Bus cover (optional; provided with P1 BIM, Power Supply, and Bus Connection Module)



Enclosure and Mounting Options

TX-I/O components can be mounted to steel DIN rail installed in the following ways:

• Directly on a surface

• Within a PX Series enclosure

• Within an MEC Large or Small Enclosure

For smoke control applications, mount the TX-I/O components inside a 19”, 34”, or 18” PX series enclosure.

For any application requiring a secure enclosure, mount the TX-I/O components inside a listed enclosure along with a Service Box and Sidewall Kit, if needed.

Regardless of installation option, all TX-I/O components must be mounted on steel DIN rail.


Power and Communications Modules

Power and Communications Modules The P1 Bus Interface Module, TX-I/O Power Supply, and Bus Connection Module provide power and communications for the TX-I/O modules. See Table 1 for module functions.

Table 1. P1 BIM, TX-I/O Power Supply, and Bus Connection Module Functions.

Module Name and Part Number

TXB

1.P1

TXS1

.12F

4

TXS1

.12F

10

TXS1

.EF4

TXS1

.EF1

0

Function P1 Bus Interface Module

TX-I/O Power Supply

Bus Connection Module

P1 to TX-I/O Bus Communication

Protocol translation

Signal pass-thru Signal pass-thru

24 Vdc power 14.4 W at .6 A 28.8 W at 1.2 A Pass-thru

24 Vac power Fused at 4A Fused at 4A

Fused at 10A

Fused at 4A

Fused at 10A

NOTE: All installations with more than one DIN rail require either a Bus Connection Module or TX-I/O Power Supply for each additional DIN rail.



P1 Bus Interface Module

The P1 Bus Interface Module (P1 BIM) enables communication between a P1 Field Level Network (P1 FLN) or MEC Expansion Bus and TX-I/O modules. It also provides 24 Vdc at 14.4W to power the TX-I/O modules and external devices. External devices draw power from the 24 Vdc and ground terminals on the TX-I/O modules.

P1 BIMs reside at the top of a TX-I/O self-forming bus, which might also contain TX-I/O modules, TX-I/O power supplies, or bus connection modules. Because I/O modules and additional power supplies can be added behind the P1 BIM as needed, it can support up to 80 points on a maximum of 10 modules. See the power sizing tables in APOGEE Wiring Guidelines for Field Panels and Equipment Controllers (125-3002).

A controller with FLN ports and Firmware Revision 2.8 or later (for example, an MEC 1200EFB) can therefore control and communicate with points on a TX-I/O bus that begins with a P1 BIM.

Figure 5 shows a P1 BIM. See Table 2 and Table 3 for explanations of device symbols and LEDs.

NOTE: The P1 BIM is required to connect a TX-I/O module row to a P1 FLN or MEC Expansion Bus. TX-I/O modules connected to a PXC Modular controller self-forming bus do not require a P1 BIM.

24VRUN FLT

24V

1 2 3

5 4 6

7

CS

CD

S-

+

24V

T

TXRX

TXIO

0044

R1

Figure 5. P1 Bus Interface Module TXB1.P1.



Bus Connection Module

The Bus Connection Module bridges communication and power from one DIN rail to another, and can also provide 24 Vac. 24 Vdc is passed from terminals one and four (ground) to both ends of the TX-I/O bus connector for distribution to connected TX-I/O modules and external devices (see Table 3). 24 Vac is passed through an internal fuse from terminals three and four (ground) to the bottom or right TX-I/O bus connector. External devices draw power from the 24 Vdc, 24 Vac, and ground terminals on the TX-I/O modules.

Figure 6 shows a Bus Connection Module. See Figure 2 for TX-I/O module components. See Table 2 and Table 3 for explanations of device symbols and LEDs.

24V

1 2 3

45 6

CS

CD

24V

TCS

CD

TXIO

0045

R1

Figure 6. Bus Connection Module TXS1.EF4.

TX-I/O Power Supply

The TX-I/O Power Supply has the same functions as the Bus Connection Module, and also provides 24 Vdc at 28.8W to the TX-I/O modules. Power is shared (added) between all TX-I/O Power Supplies and P1 BIMs connected on the same DIN rail or externally wired to the CS, CD, and ground terminals from a previous DIN rail.

A TX-I/O Power Supply can be added to an existing DIN rail to provide additional 24 Vdc power to the modules in that row, or added as the first module on a new DIN rail to bridge the communication bus from one DIN rail to another and provide 24 Vdc power to the additional modules on that DIN rail. All installations with more than one DIN rail require either a Bus Connection Module or TX-I/O Power Supply at the start of each additional DIN rail.

Figure 7 shows a TX-I/O Power Supply. See Figure 2 for TX-I/O module components. See Table 2 and Table 3 for explanations of device symbols and LEDs.

24V24V1

2 3 45 6

CS

CD

24V

TCS

CD

TXIO

0046

R1

Figure 7. TX-I/O Power Supply TXS1.12F4.



P1 Bus Interface Module, TX-I/O Power Supply, and Bus Connection Module Indicators

24VRUN FLT

TXRX

24V

CS CDS - +

24V

T

1

2

3

5

4LAN

Connection + 24 VdcData

24 Vac InCommon

TXIO

0029

R1

Figure 8. P1 Bus Interface Module Power and Communications.

Power and Communication Connections Table 2. P1 BIM, TX-I/O Power Supply, and Bus Connection Module Connections.

Symbol Device Description

All 24 Vac IN (from transformer)

⊥ All Common Ground

CS All (originates on P1 BIM and TX-I/O Power Supply, feed-thru on Bus Connection Module)

24 Vdc Communication Supply (24 Vdc)

CD All (originates on P1 BIM, feed-thru on TX-I/O Power Supply and Bus Connection Module)

Communication Data (Signal)

S - + P1 BIM LAN connection



24V24V24V

CS CDCS CD

24V

TCS CD24V

TCS CD

4

5,6

24 Vac InCommon

+ 24 VdcData

+ 24 VdcData

+ 24 VdcData

24 Vac InCommon

+ 24 VdcData

5

TXIO

0030

R1

Figure 9. Bus Connection Module

Power and Communications. Figure 10. TX-I/O Power Supply Power

and Communications.

Table 3. P1 BIM, TX-I/O Power Supply, and Bus Connection Module Indicators.

LED Indication

1 RUN (green) The LED lights after power-up tests OK and the BIM operating system is running. Flashing (P1 BIM only) indicates that the address key is not inserted or is not being read correctly.

2 FLT (red) For future use.

3 TX, RX (yellow) Light up at an irregular rate to indicate communication on the bus.

4 Module supply/field supply voltage (green) 24 Vdc (conductor CS, measured on bus)

ON 24 Vac bus voltage is in the acceptable range.

OFF 24 Vac bus voltage is outside the acceptable range, indicating insufficient or shorted supply of the I/O bus, or one of the AC/DV converters is faulty.

5 Fuse LED for 24 Vac supply peripheral devices – TXS1.EF4 , TXS1.12F4, and TXB1.P1

ON 24 Vac (supply voltage) input present; fuse is intact.

OFF No 24 Vac (supply voltage) input, or fuse is blown.

6 Fuse-LED for field supply voltage (V ) – TXS1.EF10 and TXS1.12F10

ON V (field supply voltage) input present; fuse is intact.

OFF No V (field supply voltage) input, or fuse is blown.



I/O Modules The I/O modules act as signal converters. They communicate between the field panel (via the P1 BIM or MEC Expansion Bus) and the related devices in the building services plant.

See Table 4 for a list of modules and their functions. Table 4. TX-I/O Module Functions.

Module Name and Part Number

TXM

1.8D

TXM

1.16

D

TXM

1.8U

TXM

1.8U

-ML

TXM

1.8X

TXM

1.8X

-ML

TXM

1.6R

TXM

1.6R

-M

Function 8 DI 16 DI 8 Universal 8 Super Universal

6 DO Relay

With Local Override X X X

Gen

eral

With LCD Display X X

Static Contact (NC/NO)

X X X X X X

25 Hz pulse accumulator (with debouncing)

X X X X

DI

10 Hz pulse accumulator (with debouncing)

X 1-8

NI 1000 LS X X X X

PT 1000 385 X X X X

PT 1000 375 X X X X

NTC 10K (w/out diode)

X X X X

NTC 100K X X X X

0-10 Vdc X X X X

AI

4-20 mA X X

0-10 Vdc X X X X

AO

4-20 mA 5-8 5-8

ON/OFF X X

DO

Pulse X X

The I/O module terminal bases provide the connection terminals for wiring on the field device side; there is no need for separate terminal strips.

The I/O modules on a DIN rail row receive their power from a power supply module, a bus interface module, or a bus connection module.


I/O Modules

Digital Input Modules (TXM1.8D and TXM1.16D)

The TXM1.8D and TXM1.16D are dedicated to monitoring, respectively, 8 and 16 digital input points. They monitor status signals from normally open (NO) or normally closed (NC), latched voltage free/dry contacts. All 8 points on the TXM1.8D module as well as 8 of the 16 points on the TXM1.16D module may be used as pulse counters up to 10 Hz. Each input point has a green LED for status indication. See Figure 11.

TXIO

0022

R1

TXM1.8D

2

31 5 7 9 11 13 15

(1)

(1)

(2) (3) (4) (5) (6) (7) (8)

4

(2)

6

(3)

8

(4)

10

(5)

12

(6)

14

(7)

16

(8)

TXIO

0020

R1

TXM1.16D

2

31 5 7 9 11 13 15

(2)

(1)

(4) (6) (8) (10) (12) (14) (16)

(9) (10) (12)(11) (13) (14) (15) (16)

4

(2)

6

(3)

8

(4)

10

(5)

12

(6)

14

(7)

16

18

19 21 23 25 27 29 31 33

20 22 24 26 28 30 32

(8)

Figure 11. Digital Input Modules (TXM1.8D and TXM1.16D).



Digital Output Modules (TXM1.6R and TXM1.6R - M)

The Digital Output Modules provide six NO or NC (form C), maintained or pulsed, voltage free/dry contacts. Common terminals are not internally connected. The contacts are rated for a maximum of 250 Vac at 4A resistive or 3A inductive. Each I/O point has a green LED for status indication.

The TXM1.6R-M module is also equipped with manual override switches. An orange LED per override switch indicates override status individually per point. See Figure 12.

TXIO

0018

R1

TXM1.6R24V ...250V

2

3 9 15

19 21 25 27 31 33

(1) (2) (3) (4) (5) (6)

(4) (5) (6)

4

(1)

8 10

(2)

14

20 26 32

16

(3)

TXIO

0021

R1

TXM1.6R-M

2

3 9 15

19 21 25 27 31 33

(4) (5) (6)

(1) (2) (3) (4) (5) (6)

4

(1)

8 10

(2)

14

20 26 32

16

(3)

24V ...250V

+

Figure 12. Digital Output Modules (TXM1.6R and TXM1.6R-M).

NOTE: Digital Output contacts are not internally current limited or protected against transients. If needed, externally install an NEC approved current limiting device, Metal Oxide Varistor (MOV), or both. See MOV table in APOGEE Wiring Guidelines for Field Panels and Equipment Controllers (125-3002).

Universal Modules (TXM1.8U and TXM1.8U - ML)

The TXM1.8U and TXM1.8U-ML are universal modules, allowing each of their 8 points to be individually software configured as digital input, analog input, or analog output to best meet the specific application needs. See Figure 13.

All Universal modules provide:

• AC supply voltage for peripheral devices such as valves and actuators

• Green LED status per I/O point that varies in intensity according to the voltage and current (directly proportional)

Digital input support includes voltage free/dry contacts and pulse counters up to 25 Hz.


I/O Modules

Analog input sensor support includes:

• 1k Nickel – Landis & Gyr curve

• 1k Platinum – 375 and 385 coefficient

• 10k and 100k Thermistor – Type II Curve

Active input and output support includes analog input and output (0-10 Vdc).

NOTE: Active inputs and outputs are permitted on the same module when connected sensors are powered from that module. When sensors are externally powered, active inputs and outputs should be on separate modules.

TXM1.8U-ML modules are also equipped with a local override/identification device (LOID), which includes an LCD signal display. The LCD displays the following information for each IO point:

• Configured signal type

• Symbolic display of process value

• Notification of faulty operation, short circuit, or sensor open circuit

Orange LEDs indicate override status individually per point.

TXIO

0047

R1

TXM1.8U

2

7V V

V V

15

19 21 25 2723 29 31 33

(1)

(5) (6) (7) (8)

(1) (2) (3) (4) (5) (6) (7) (8)

4 6 8

(2)

10 12

(3)

14

24 32

16

(4)

TXIO

0023

R1

TXM1.8U-ML

2

7V V

V V

15

19 21 25 2723 29 31 33

(1)

(5) (6) (7) (8)

(1) (2) (3) (4) (5) (6) (7) (8)

4 6 8

(2)

10 12

(3)

14

24 32

16

(4)

+

Figure 13. Universal Modules (TXM1.8U and TXM1.8U-ML).



Super Universal Modules (TXM1.8X and TXM1.8X- ML)

TXM1.8X and TXM1.8X-ML Super Universal modules share all of the Universal module features, and also provide:

• Analog input current 4-20 mA

• Analog output current 4-20 mA (four current outputs maximum per module on Points 5 through 8)

• 24 Vdc supply voltage for sensors at a maximum of 200 mA per module. Power consumption of analog points is included in the power consumption of the 8X module. Power consumption of other approved uses of supply voltage (for example, 1000 series RTS supply) must also be subtracted from the available 24 Vdc power provided by the TX-I/O Power Supply or P1 BIM.

NOTE: Active inputs and outputs are permitted on the same module when connected sensors are powered from that module. When sensors are externally powered, active inputs and outputs should be on separate modules.

See Figure 14.

TXIO

0024

R1

TXM1.8X

2

3 7 1511

19 21 23 25 27 29 31 33

(5) (7)(6) (8)

(1) (2) (3) (4) (5) (6) (7) (8)

4

(1)

6 8

(2)

10 12

(3)

14

20 24 28 32

16

(6)

(4)

V V V V

V V V V

TXIO

0025

R1

TXM1.8X-ML

2

3V V V V

V V V V

7 1511

19 21 23 25 27 29 31 33

(5) (6) (7) (8)

(1) (2) (3) (4) (5) (6) (7) (8)

4

(1)

6 8

(2)

10 12

(3)

14

20 24 28 32

16

(4)

+

Figure 14. Super Universal Modules (TXM1.8X and TXM1.8X-ML).


I/O Modules

I/O Module Indicators

12

24

19 21 23

(5)

1076

2z05

4

V

(6)

25

(1)

V

(2)

2 4 6 8

7

(1) (2) (3) (4)

32

27 29 31

(7)

V

(8)

33

(5) (6) (7) (8)

(3) (4)

10 12 14 16

V15

20V

28V

V3

V11

Module status LED

Override status LEDs (yellow)

LCD display (if present)

I/O status LEDs

Figure 15. I/O Module LEDs.

Table 5. I/O Module Indications.

LED Indication

Module Status LED The module status LED (green) is located on the I/O module under the transparent address key. It shows the module status as a whole (as opposed to the I/O points). This LED is also used for diagnostics.

I/O Status LEDs The I/O status LEDs (green) indicate the status of the inputs and outputs (peripheral devices). The LEDs are labeled with the I/O point number. These LEDs are also used for diagnostics (see below).

The orange status LEDs indicate that local override is active. Override Status LED



Table 6. LED Flash Patterns.

LED flashing patterns

(faults, information)

Cause

Mod

ule

stat

us L

ED

I/O s

tatu

s LE

D

Ove

rrid

e st

atus

LED

Flashing or Pulsing

• Fault indication

• No Address key

• Remote override

X X

Dual pulse Module configured, no address key

X

Short pulse Information: Local override is off; operation is not possible (output) Operation is not possible (input)

X


I/O Modules

LCD Symbol Chart

The Configured Signal Type is displayed with either a Signal Value that matches the signal type, or any one of the Errors, Reminders indicators.

Examples: ?V A Ni

1056

1D20

6



TX-I/O Startup Procedure Before You Begin

The following tasks must be completed far enough in advance of the installation to allow ordered parts to arrive.

At the Branch Office Select Addresses and Order Address Keys Pre-select the key addresses for your installation as follows:

1. Establish a shut-down procedure with the building owner.

2. Select a unique address for every P1 BIM and TX-I/O module on the FLN.

NOTE: Addresses must be unique on the FLN. If you expect to add legacy devices (for example, TECs) to an FLN in the future, use addresses above 32 for all TX-I/O modules. Legacy devices can not be addressed above 32.

3. Order the address keys.

Loading the USB Driver NOTE: The USB driver is only necessary if you want to change the P1 BIM baud

rate from 4800 to 38400 (for the MEC Expansion Bus).

You will need a P1 BIM with address key, a 24 Vac power source, a USB cable, and the midiserial.inf and usbser.sys files.

Load the USB Driver on your laptop as follows:

1. Copy the mdiserial.inf file to the directory of your choice.

2. Copy the usbser.sys file into your WINDOWS\system32\drivers directory.

3. Apply power to the P1 BIM.

The P1 BIM run light should turn on as solid green. If the run light has a double blink, the address key is not properly seated.

4. Connect one end of a standard USB device cable to the USB port of the P1 BIM, and the other end to a USB port on your laptop.

Your computer should display a Found New Hardware dialog box within a few seconds.

5. Click on the dialog box to launch the installation wizard. If the wizard does not automatically start, select Control Panel – Add Hardware.

6. Select Install from a list or specific location (Advanced) and then click Next.

7. Select Don’t search. I will choose the driver to install and then click Next.

8. Select Have Disk and then browse to where you stored midiserial.inf.

9. Click OK. The driver is installed.

At the Insight Workstation If you are replacing existing devices with TX-I/O modules, run a Failed Point Report for the devices you plan to convert.


TX-I/O Startup Procedure

At the Site If you are replacing existing devices with TX-I/O modules, measure the point cabling for slack. If you do not have 12” of slack in your cabling, see Options for Terminating Wires in this chapter. You will also need wire to match the gauge of the present installation, if any.

Common Grounding Requirement If you are powering the TX-I/O bus from an MEC Service Box, jumper the E and N terminals on the service box to create a common ground between TX-I/O components in separate enclosures, or when any device connected to the TX-I/O bus is not floating. See Figure 16.

Figure 16. MEC Service Box Grounding.

If you are powering the TX-I/O bus from a third-party transformer, earth ground the neutral to the same point for all panels powered by that transformer.

Depending on the type of installation, other prerequisites may have to be completed.

CAUTION:

TX-I/O components require a system neutral with single point earth ground. Do not connect these components to a floating system neutral. All devices not isolated by a TIE or isolation transformer must be connected to the same grounding point.

Verifying the Field Panel Firmware Check the field panel revstring to make sure it is at Firmware Revision 2.8, 2.8.1, 2.8.2, or 3.0.1.


Required Tools

• Laptop

• USB device cable

• Wire ties

• 1/8” straight-blade screwdriver (for module terminals)



Installation and Startup

Extending TX-I/O Bus Communication If an installation requires more than one DIN rail, connect the Communication Supply (CS) and Communication Data (CD) terminals from the P1 BIM to the same terminals on the first device of every additional DIN rail (a TX-I/O Power Supply or Bus Connection Module). TX-I/O Power Supplies and Bus Connection Modules include a second set of CS and CD contacts to simplify connection of additional DIN rails. Ensure that the system neutral is installed.

NOTE: Maximum extension of the TX-I/O bus is 164 feet (50 meters) total for all devices. Shielded communication cable must be used and terminated on one end only. Common ground must be connected through the same or bonded earth ground system.

Wiring the FLN Connector 1. Remove the FLN connector (S - +, terminals 1, 2 and 3) from the P1 BIM.

2. Connect the LAN connector trunk wires to the P1 BIM FLN connector as follows: S (shield) to 1, - (minus) to 2, and + (plus) to 3.

Wiring the module bases 1. Pull at least 12” of slack cable into the cabinet. If you do not have 12” of slack,

see Options for Terminating Wires in this document.

2. If necessary, cut the wire ties inside the cabinet to separate the wire.

3. Remove the first module from its terminal base. See To Remove a Module in this document. The base is labeled to match the module (the base label is underneath the module).

4. Following the wiring template, wire one lead at a time to the correct module base.

For point wiring information, see the TX-I/O Quick Start (553-632), included in the P1 BIM shipping box, or the APOGEE Wiring Guidelines for Field Panels and Equipment Controllers (125-3002).

5. Repeat Steps 3 and 4 for all module bases.

Mounting the Power, Communication, and I/O Modules See Figure 17 during this procedure.

1. Pull the P1 BIM side mounting tabs out, and then position the P1 BIM over the top of the DIN rail. Close the mounting tabs.

2. Mount the module bases in order. Slide the bases onto the previous module.



1076

2J01

7

1

2

3 54

Figure 17. Adding Modules to A Communication Bus Row.

3. Leaving the power source OFF, reconnect the power connectors to the P1 BIM (and Bus Connection Module or TX-I/O Power Supply, if used).

4. Install tie bars to the backplane as needed.

5. Fasten the cables to the tie bars (if used).

6. Insert the modules into their bases.

Inserting the Address Keys The TX-I/O address keys must be inserted, seated, and closed correctly in order to function.

1. Remove the address key from the strip.

1076

2J01

5

2. Align the slot in the base of the key with the module.

3. Push key in until it ‘click’s in place.



1TX

IO00

39R

1

4. Rotate the key into position on the module.

2

TXIO

0040

R1

Set the P1 BIM Baud Rate NOTE: The default P1 BIM baud rate is 4800 bps.

If necessary, load the USB Driver on your laptop. See Loading the USB Driver in this chapter.

1. Apply power to the P1 BIM.

The P1 BIM run light should turn on as solid green. If the run light has a double blink, the address key is not properly seated.

The I/O Module LEDs (the LEDs that illuminate the address keys) should blink, which indicates that the modules are unconfigured.

2. Connect one end of a standard USB device cable to the USB port of the P1 BIM, and the other end to a USB port on your laptop.

3. From the Windows Desktop, right-click on My Computer and select Manage.

The Computer Management window appears.

4. In the left-hand pane, click on Device Manager.

5. In the right-hand pane, click on Ports (COM & LPT). Note which COM port was assigned to the USB Device.

6. Start Hyperterminal and select the USB COM port.



7. Press ENTER to display the P1 BIM menu.

8. Select a baud rate for the P1 BIM and press ENTER. P1 BIM Revision BX11, Build number 00128, Feb 02 2007, 08:25:21 (C) Copyright Siemens Building Technologies, Inc. 2006 BIM Mode: BIM Address Key: 5 Baud rate: 4800 1:BIM 2:4800 FLN 3:38400 FLN Enter number to select option:

Creating the Field Panel Database 1. If necessary, upgrade the field panel firmware to Rev. 2.8 or later.


2. From the upgraded field panel, create the new points to match the I/O module address they reside on. Points residing on TX-I/O modules are addressed as follows:

• Field panel—The ALN/BLN address number or device instance number of the field panel.

• FLN—The number of the FLN connection on the field panel. A point on an FLN device will always have an FLN number of 1, 2, or 3. A point on the MEC Expansion Bus will always have an FLN number of zero.

• Drop—The I/O module address key number.

• Point—The number of the point on the TX-I/O module.

Verifying the Configuration Make sure the I/O module LEDs are solid green, which indicates that the TX-I/O

modules have been configured.



TX-I/O Slope/Intercept Calculations The physical values in the TX-I/O modules vary based on how the point was configured. See Table 7 for a list of commonly used TX-I/O slopes and intercepts. Table 8 contains the slope/intercept formulas for the PXC Compact and TX-I/O modules.

Table 7. Commonly Used TX-I/O Slopes/Intercepts.

Point type Slope Intercept ao(v) 0.0003255208 0.0V ao(i) 0.0006510417 0.0 mA ai(v) 0.000390625 -1.4V ai(i) 0.0006510417 0.0 mA ai(1k nickel) 1.0 0.0 F Ai (1k platinum) 1.0°F 0.0 F ai (1k platinum385) 1.0°F 0.0 F ai (10k thermistor) 1.0°F 0.0 F ai (100k thermistor) 1.0°F 0.0 F


TX-I/O Slope/Intercept Calculations

PXC Compact and TX-I/O Slope/Intercept Calculations The following table contains the slope/intercept formulas for the PXC Compact Series Controllers (PXC16, PXC24) and TX-I/O Modules (TXM1.8U, TXM1.8U -ML, TXM1.8X, and TXM1.8X-ML) used with PXC Modular Series Controllers or P1 (BIM) Bus Interface Modules:

Table 8. PXC Compact and TX-I/O Slopes/Intercepts.

Signal Range Slope1 Intercept 1 Sensor or Actuator Type

Modules

AI-E (0 to 10 Vdc) 25,600

VV 12 − V1 – (Slope × 3584)

V (Voltage) All

AI-I (4 to 20 mA) 24,576

VV 12 − V1 – (Slope × 6144)

I (Current) TXM1.8X TXM1.8X-ML

PXC Compacts

AI-RTD 1000 Ω 375 Platinum RTD 2

1.0°F 0.5556°C

0°F -17.7778°C

M (RTD 1K Platinum tc375)

All

AI-RTD 1000 Ω 385 Platinum RTD 2

1.0°F 0.5556°C

0°F -17.7778°C

R (RTD 1K Platinum tc385)

All

AI-RTD 1000 Ω 500-LG Nickel RTD2

1.0°F 0.5556°C

0°F -17.7778°C

N (RTD 1K Nickel tc500-LG)

All

AI-NTC 10KΩ Thermistor

1.0°F 0.5556°C

0°F -17.7778°C

O (Thermistor 10K)

All

AI-NTC 100KΩ Thermistor

1.0°F 0.5556°C

0°F -17.7778°C

T (Thermistor 100K)

All

AO-V (0 to 10 Vdc)3

30,720VV 12 − V1 V (Voltage) All

AO-I (4 to 20 mA)3

24,576VV 12 − V1 – (Slope

× 6144) I (Current) TXM1.8X

TXM1.8X-ML

Series 1000 sensor 1.0°F 0.5556°C

0.6°F4

-17.4445°C M (RTD 1K

Platinum tc375) All

Series 1000 sensor setpoint dial

0.1981473 61.2 M (RTD 1K Platinum tc375)

All

1. V1 is the low analog value of the signal range. V2 is the high analog value of the signal range. 2. The temperature range is fixed. If this type of device is used, adjust the intercept for wire length and

wire gauge using the RTD Intercept Adjustments tables. 3. At start-up, the output of the AOs is 0V or 4mA until commanded to a different value by the firmware. 4. Compensation for sensor's self-heating effect.



TX-I/O 1000-ohm RTD Wire Resistance and Intercept Adjustments

Table 9 and Table 10 contain resistivity of copper wire and intercept adjustments for 1000-ohm Nickel, 375 platinum, and 385 platinum RTDs.

Table 9. Typical 2-conductor Wire Resistances.

Resistance (R)1

Wire Size (AWG) Ω/ft. Ω/m

14 0.005 0.0164

16 0.008 0.0262

18 0.012 0.0394

20 0.020 0.0656

22 0.030 0.0984

242 0.056 0.1837

1. Resistance (R) is for 2-conductor cable (Ω/ft. or Ω/m). 2. Installed as part of Structured Cabling system; average resistance

shown will vary depending which pair used.

Table 10. Intercept Adjustments.

RTD Type and temperature coefficient1

Intercept Formula for Fahrenheit2,3

Intercept Formula for Celsius2,4

1000-ohm Platinum tc375 I - (R × ft)/2.117 I - (R × m)/3.8102

1000-ohm Platinum tc385 I - (R × ft)/2.171 I - (R × m)/3.9080

1000-ohm Nickel tc500-LG I - (R × ft)/2.459 I - (R × m)/4.427

1. Intercept Formula uses average temperature coefficient for the sensor connected. 2. Resistance (R) is from the wire specification or the typical wire resistance table. 3. I is for the intercept from the field panel Slope/Intercept table and ft is the wire length in feet.

4. I is for the intercept from the field panel Slope/Intercept table and m is the wire length in meters.


tx-i/o getting started guide

Documents