October 4, 2016

Santa Clara Convention Center

Mission City Ballroom

Smart Industry

Natale Testa

Smart Industry 2

ST is enabling smarter, safer and more efficient factories and workplaces

Product

• Factories that produce in a more efficient manner

• More flexibility and customization possibilities in

the supply chain

• More sustainable production with less waste and

less energy used

• Safer working environments for people

• Better man-machine cooperation in the work place

• Optimized usage of machines and tools

What Smart Industry means

Industrial

robots

Factory

automation

Industrial

lighting

Motion

control

Power

Management

Smart

manufacturing

How does ST enable this? 3Power Discretes &

Modules

Smart power

Connectivity &

Communication

Microcontrollers

& Secure solutions

Sensors & actuators

Analog &

Signal conditioning

What are the enablers for Smart Industry? 4

More ConnectedMore Intelligent

& AwareMore efficient

Machines are connected inside the factory,

to the larger supply chain and to the cloud

• Real-time communication down to the

lowest level (sensor & actuator)

• All communications must be secure

Sensors collect information about every

machine and distributed local processing

allows data to be turned into information

• Safe & Secure real-time processing

• Products contain the instructions for

their manufacturing

• Machines are aware of the humans

around them and provide easier and

safer interactions

Higher efficiency at all points in power

usage

• Power conversion & energy harvesting

• Power Management

• Power storage

• Motion Control

Enabling TechnologiesMore Efficient

5

Motor drivers Gate drivers

AC-DC

Conversion

IGBTs &

Power

MOSFETs

Power

management

Power &

Discrete

Modules

SiC

MOSFETs &

Rectifiers

Display and

LED controllers

More efficient

Motor DriversICs for Motion Control across power ratings and motor types

6

Leading integration, performance, efficiency

Ideal for

Factory Automation, Motion Control, Office Automation, 3D-Printer, Stage Lighting,

Medical, Security, ATM, Vending, POS, 3D Printers, Portable, Battery Powered

• Monolithic Drivers

• Controllers

• System-in-Package Drivers

A Complete offering

Motor Drivers 7

Leading integration, performance, efficiency

System-in-package drivers:

POWERSTEP01

L6470, L6472

L6474

L622x

L620x

Monolithic drivers

50 W 100 W10 W 350 W

Portable, Battery Powered Medical, Security, ATM, Vending,

3D Printers, Domotics

Industrial, Factory AutomationStage Lighting

Monolithic low voltage drivers

STSPIN220, STSPIN230,

STSPIN240Controllers:

L6480, L6482

8

powerSTEPFirst System-in-package for Stepper motor applications

• System in package integrating 8x 10 A

MOSFETs for stepper applications up to 85 V

• Dual H-Bridge with RDS(ON) 16 mΩ for 10 A

• Fully digital programmable microstepping

controller with smoothness and precision up

to 1/128 micro-steps

• Motion profiles with acceleration/

deceleration/ ramps/ velocity and position

programmable through SPI

• Extensive set of diagnostic features and

protections, including thermal, low bus

voltage, non-dissipative overcurrent and

motor stall

ApplicationsHigh-power bipolar stepper motors

Compact, Powerful, Accurate

X-NUCLEO-IHM03A1

Using the powerSTEP up to 67% in

space saving thanks to its integrated

circuitry like microsdtepping controller

and N-channel power MOSFETs

EVLPOWERSTEP01

Galvanically isolated

STGAP

Low and high voltage, single and multiple channel:

L649 family

L639 family

L638 family

TD35 family

MOSFET / IGBT Gate Drivers 9

A future-proof portfolio for a wide range of applications

1 kW 4 kW

≈

50 W 200 W

Factory

automation

Compressors

Electric/ Hybrid

vehicles

1200 V inverters

Solar

Server, UPS

White goods

Auto HEV/EV

E-bikes

Galvanically Isolated 10

Outstanding robustness, noise immunity and design flexibility

Up to 1500 V high voltage rail

5 A sink / source driver current capability

Negative gate driving

Output 2-level turn-off

Active Miller and VCE clamping

IGBT Desaturation detection

± 50 V / ns transient immunity

100 ns in-out propagation delay

SPI programmability and digital diagnostics

+

+

+

+

+

+

+

+

+

M series IGBTs650 V and 1200 V IGBTs for Motor Control

11

650 V – “M series”

• TJmax = 175 °C

• Current capability 4 ÷ 120 A

• Short-circuit withstand time of 10 µs

• VCE(sat) = 1.55 V (typ.)

• Low switching losses

• Tight parameters distribution

• Low thermal resistance

• Soft and fast recovery antiparallel diode

• Positive VCE(sat) derating to easy paralleling

• Switching frequency up to 20 kHz

Up to 200 A current rating available

as bare die option

MAX-247 LL

TO-247/TO-247 (LL)

TO-220

TO-220FP

DPAK/D2PAK

1200 V – “M series”

• TJmax = 175 °C

• Short-circuit withstand time of 10 µs

• VCE(sat) = 1.85 V (typ.)

• Low switching losses

• Soft switching waveforms for excellent

EMI behavior

• Soft and very fast recovery antiparallel

diode

• Positive VCE(sat) derating to easy

paralleling

• Switching frequency up to 20 kHz

650 V 2nd Generation SiC MOSFETs 12

ST SiC MOSFET shows lowest RDS(on) increase at high temperatures

ST is the only supplier to

guarantee Tjmax as high as 200 °C

• RDS(on) @ 25 °C: 20 mΩ

• RDS(on) @ 200 °C: 26 mΩ

Device VDSS (V) / RDS(on) typ. (mΩ) Package Remark

SCTW100N65G2 650 / 20 HiP247 Best RDS(on) Option for Inverter

SCTW90N65G2V

SCTH9065G2V-7650 / 25

HiP247

H2PAK-7L rated 175 °C

Low Qg Option for Charger /

HF Converters

SCTH35N65G2V-7

SCTW35N65G2V650 / 65

H2PAK-7 @ 175 °C

HiP247 @ 200 °C

Low Qg Option for Charger / HF

Converters

SiC diodesLow VF and High surge (H series) diodes

13

High reliable products with high

performances and robustness

Many part numbers in the low VF and in the high IFSM diodes’ range

Up to 40 A / 650 V SiC diodes

t- +

Bypass diode

SiC Boost diode

6 ÷ 20 A / 1200 V SiC diodes

• 1200 V High voltage SiC technology

• Negligible reverse recovery characteristics

• Based on new design to improve VF / IFSM

trade-off

New Technology

• Specification of Peak surge forward

over pulse time duration in the

datasheet

• High forward and reverse surge

robustness

• Low leakage current for higher reliability

Designer’s corner

• For higher power density and

efficiency performances

• Reduction of case temperature in the

application, for increased life time

expectations.

Low VF

High IFSM SiC diodes survive to Lightning tests (IEC61000-

4-5), Line drop out event (EN 61000-4-11), and fast start-up

/ inrush current.

Ideal in PFC for applications connected to mains

Designer’s corner

SLLIMM-nano 2nd series BV ICN (25 °C)

STGIPQ3H60T-HZ/L(S)600

V

3 A

STGIPQ5C60T-HZ/L(S) 5 A

STGIPQ8C60T-HZ 8 A

SLLIMM 2nd series DBC(B)

Small Industrial

Inverter and Pumps

Package A/C

Room A/C

Washing machines

Refrigerators

300 W 1 kW 2 kW 3 kW

Small Pumps

Power Tools

SLLIMM 2nd series

Full Molded (F)

SLLIMM nano

2nd series

SLLIMM 2nd series BV ICN (25 °C)

STGIF5CH60TS-L

600 V

8 A

STGIF7CH60TS-L 10 A

STGIF10CH60TS-L 15 A

STGIB8CH60TS-L 12 A

STGIB10CH60TS-L 15 A

STGIB15CH60TS-L 20 A

STGIB20M60TS-L 25 A

STGIB30M60TS-L 35 A

SLLIMM nano BV ICN

(25 °C)

Max

RDS(on)

IGBT

based

STGIPN3H60

(A)(T)-(H)600 V 3 A -

MOSFET

based

STIPN2M50T-

H(L) 500 V2 A 1.7 Ω

STIPN1M50T-H 1 A 3.8 Ω

SLLIMMTM Product PortfolioIntelligent Power Modules

14

ACEPACK™Adaptable Compact Easier plastic Power Modules

15

Part Number Topology BVCES IC rating Lead optionMass

Production

A2C25S12M3

CIB 1200 V

25 A Solder wk 36 ’16

A2C35S12M3 35 A

A2C25S12M3-F 25 A Press-fit wk 41 ‘16

A2C35S12M3-F 35 A

ACEPACK™ 1

Part Number Topology BVCES IC rating Lead optionMass

Production

A1P25S12M3

Six-pack 1200 V

25 A Solder wk 36 ’16

A1P35S12M3 35 A

A1P25S12M3-F 25 A Press-fit wk 41 ‘16

A1P35S12M3-F 35 A

ACEPACK™ 2

body 33.8 x 48 mm

body 48 x 56.7 mm

PIM / CIB + NTC

Six-Pack + NTC

Distributed Control SolutionsSPIMD20 2 kW shuttle module

16

• Minimizing cabling systems and installation cost

• Control panel optimization from rack to the

equipment

• Flexibility of automation architecture

• Works mounted on motor up to 100 °C and 800 VDCbus

• RT connectivity with Industrial Ethernet, Ethercat® and CANopen® DS402

• Safe Torque Off

• Dual microcontroller architecture

• 2-Mbit Flash memory

• IGBT technology (1200 V, 40 A)

• Logic customizable on board

• Ready for safety standards

• Compact dimensions (165 x 60 x 26 mm, <0.5 kg)

• Customizable solution

SPIMD20 – 2 kW drive with industrial Ethernet connectivity for electric motors

Key Features

STEVAL-SPIMD20V1

DC-DC Conversion ICs 17

The 61 V series (L7987/L) has been designed to provide

maximum reliability in fail-safe applications.

ST’s DC-DC converters for industrial buses offer a wide choice of input voltage ranges

(VIN(max) 38 ÷ 61 V) and features

Synchronous and Asynchronous buck-converter ICs are available

L7987L and L7987High input voltage for fail-safe systems

18

• Wide input voltage range 4.5 ÷ 61 V to fit a wide variety of applications

• High switching frequency up to 1.5 MHz and adjustable current limitation to minimize

the size of external components

• Pulse-by-pulse current sensing with digital frequency fold-back provide excellent

protection in a wide range of load conditions

• Output voltage sequencing and synchronization improve noise reduction when using

multiple ICs

• 61 V input voltage range buck regulators

• 2 A - L7987L

• 3 A - L7987

• Designed to meet Fail Safe requirements

• Ideal for 24 and 48 VDCBUS applications, like PLCs

STEVAL-ISA152V1

More Intelligent

& Aware

Enabling TechnologiesMore Intelligent and Aware

19

MCUsSecure

MCUs

Environmental

sensors

Motion

MEMS

Ranging

sensors

Signal

Conditioning

Analog

& Digital

inputs

Isolation

Intelligent

Power

Switches

STM32 PlatformKey Benefits

20

600+ compatible devices and high portfolio granularitypowered by ARM® Cortex®-M cores

9 series

Low Cost

High-performance

Ultra-low-power16k to 2M Flash

20 to 216 pin

packagesTest & Benchmark MCUs

STM32F7 Product Lines 21

Note: * Only STM32F756, STM32F777 and STM32F779 are the Hardware Crypto / hash devices

AR

M®

Co

rtex

®-M

7 –

21

6 M

Hz

ACCELERATION

• ART Accelerator™

• L1 cache: data and instruction

cache

• Chrom-ART Accelerator™

• Floating Point Unit

CONNECTIVITY

• 2 x USB2.0 OTG FS/HS

• SDIO (x2 on F76x & F779*)

• USART, UART, SPI, I²C

• CAN2.0

• HDMI-CEC

• Ethernet IEEE 1588

• FMC

• MDIO slave (on F76x and F77x)

• Camera I/F

• Dual mode Quad-SPI

AUDIO

• I²S + audio PLL

• 2 x SAI

• 2 x 12-bit DAC

• SPDIF-RX

OTHERS

• 16- and 32-bit timers

• 3 x 12-bit ADC (2.4Msps)

• Low voltage 1.7 to 3.6V

• 85 °C and 105 °C range

Product

line

FCPU

[MHz]

L1 cache

[I/D]FPU

FLASH

[bytes]

RAM

[KB]

JPEG

codecCAN DFSDM

TFT LCD

controllerMIPI®-DSI

STM32F7x9* 216 16K+16KDouble

Precision

1M to 2M

(RWW)

512K (incl.128K DTCM) +

16K ITCM + 4K backup 3

STM32F7x7* 216 16K+16KDouble

Precision

1M to 2M

(RWW)

512K (incl.128K DTCM) +

16K ITCM + 4K backup 3

STM32F7x6* 216 4K+4KSingle

Precision512K to 1M

320K (incl.64K DTCM) +

16K ITCM + 4K backup2

STM32F7x5

765216 16K+16K

Double

Precision

1M to 2M

(RWW)

512K (incl.128K DTCM) +

16K ITCM + 4K backup3

745 2164K+4K

Single

Precision512K to 1M

320K (incl.64K DTCM) +

16K ITCM + 4K backup2

STM32 Hardware Toolsfrom ST

22

Feature highlight, prototyping

Discovery Kits

Full features evaluation

Evaluation BoardsSTM32 Nucleo Boards

Fast agile prototyping

SIL Safety Design PackageFor STM32

23

STM32 Built-in Safety Features 24

Cortex-M cores also have built-in safety enabling features (dual stack pointer,

fault exceptions and debug module)

*: Depending on device

MEMS and SensorsPortfolio overview

25

Gyroscope

Magnetometer

Accelerometer

6-axis & 9-axis

inertial module

Optical image

stabilization

Temperature

Pressure

UV index

Humidity

Microphone

Gyroscope

Accelerometer

6-axis inertial

module

Hi-g

Accelerometer

Hi-g

WFR Wafer Foundry For Medical

IIS328DQ12-bit

±2/±4/±8g

T = -40 to 105 °C

24-lead 4x4x1.8mm QFN package

IIS2DH12-bit

±2/±4/±8/±16g

T = -40 to 85 °CFIFO

12-lead 2x2x1mm LGA package

I3G4250D16-bit

±245/±500/±2000 dps

T = -40 to 85 °CFIFO

16-lead 4x4x1mm LGA package

STM32 ODE Tools for sensingBLUEMICROSYSTEM

26

Rapid and flexible prototyping environment for any applications

Sensors

BLE

STM32

NFC

Proximity

& Light

Carrying Position Activity Recognition

Sensor Fusion

Bluetooth SMART BlueNRG

X-NUCLEO-IDB04A1

Proximity/ ALS VL6180X

X-NUCLEO-6180XA1

Motion + Environmental

X-NUCLEO-IKS01A1

M24SR expansion board

X-NUCLEO-NFC01A1

Signal ConditioningAnalog products are everywhere 27

MCU

Analog

Sensor

ADC

Temp

Sensor

ResetSupervisor

RTC

AUDIO

amplification

RS232

RS485

SMARTCARD

INTERFACE

USB

CONNECTIVITY

SUPERVISORS

RESETS

WATCHDOGS

OP-AMP

COMPARATORS

ANALOG

SWITCHES

CURRENT SENSE

GPIO

INTERFACES

Analog

SensorOP-AMP

Shunt

SIGNAL CONDITIONING

CLT Product Family Key Advantages

28

Power Dissipation is

significantly reduced

Input current is precisely limited thanks

to the embedded current generators

Extremely robust and

protected against EMC

Large TransilTM protection diodes

integrated at each process pin

Flexibility and high speed

data rates

Sharp thresholds & high integration

with digital filtering, LED driving, SPI

To interface the signals from industrial sensors matching input characteristic according to IEC61131-2

CLT Product Family Family portrait

29

* Through LEDx outputs

SCLT3-8B

• Input datarate @ 400kbps

• Scalable (daisy chain)

• Thermal Alarm

• OverVoltage Alarm

• Under Voltage Alarm

• SPI interface

• CMOS interface

• (Opto-)Coupler interface

• Programmable current

• Digital filter

• Reverse polarity

• Surge & ESD protection

• Current limiter

• Number of channels

• Characteristic, IEC61131-2

• Type 1

• Type 2

• Type 3

CLT3-4B

PCLT-2A

24 8

HTSSOP38

CLT01-38S4

8

Quad Quad

*

QFN 7x7 QFN 7x7

New New

*

HTSSOP38

TSSOP14

TSSOP20

Output

Immunity

Diagnostics

CLT Evaluation Boards 30

Product # Channels Input type Documentation Evalboard order code

CLT3-4BT6 4 1 & 3 AN1608 STEVAL-IFP008V1

PCLT-2A 2 1, 2 & 3 AN2482 STEVAL-IFP004V1

SCLT3-8BT8 8 1, 2 & 3AN2846

AN3031STEVAL-IFP007V1

SCLT3-8BQ7 8 1, 2 & 3 DB2782 STEVAL-IFP030V1

CLT01-38S4 8 1, 2 & 3 AN4625 STEVAL-IFP023V1

CLT01-38SQ7 8 1, 2 & 3 DB2777 STEVAL-IFP031V1

CLT01 + VNI8200XP 8 1, 2 & 3DB2622

UM1918X-NUCLEO-PLC01A1

STEVAL-IFP008V1

STEVAL-IFP004V1 STEVAL-IFP007V1

X-NUCLEO-PLC01A1

Intelligent Power SwitchesCore Products

31

Single Channel Dual Channel Quad Channel Octal Channel

< 0.7A

L6362A L6360

VNQ860

0.7A

IPS161H VNI4140K VN808(CM)

VNI8200XP

ISO8200B

ISO8200BQ

1A

VNI2140J VNI4140K-32 VN808(CM)-32

VNI8200XP-32

> 2A

VN540

VN751

IPS160H

IPS4260L(Low-Side)

Development

Low RDSON 80 mΩ typ.

Qualification

New

New

New

IPS160H: Highest Supply Voltage 32

New single channel IPS

for safe outputs

Supply voltage range

up to 65 V

CONTROL

LOGIC

UNDERVOLTAGE

LOCKOUT

IN

DIAG

VCC

GND

OUT

CURRENT LIMITATION

& CUT-OFF

OPEN-LOAD

DIAGNOSTICS

OVER-TEMPERATURE

CUT-OFF

DELAY

OUTPUT CLAMP

VCC CLAMP

CCOD

Low RDSON = 60 mΩtyp

High output current

up to 2.5A*

High demagnetization

energy capabilities

~1J at 1A

Rich diagnostics:

open load in off state,

thermal and cut-off

CUT-OFF function with

adjustable delay

Compact package: PowerSSO-12

* 0.7A option with

IPS161H coming soon

Single high-side switch with protections and diagnostics for SIL2 and SIL3 compliant systems

STEVAL-IFP028V1

System Benefits

• Reduced component count• Higher reliability• Reduce System Level Losses• Safe Operation

ISO8200B Octal HSD (110mΩ) 33

New package ISO8200BQ

9 x 11 mm

only!

New

PowerSO36

pin compatible

with VN808

STEVAL-IFP015V2

8-channel IPS with embedded galvanic isolation

VNI8200XP(-32) Octal HSD (110mΩ)With selectable interface SPI / Parallel

34

System Benefits

• Reduced component count

• Reduced amount (&cost) of isolators

• Reduced power losses

• Safe Operation

• Less amount of control signals

Current capabilities: 0.7A and 1A (-32) per channel

PowerSSO-36

10x10 mm New

Amount of isolated channels is reduced rapidly thanks to the SPI bus

Octal High Side Switch with SPI

Build Your Own PLC With STPLC programming has never been so easy

35

What you need:

1) Nucleo-L053/F401RE: microcontroller board based on STM32L053R8 (STM32F401RE)

2) X-NUCLEO-IDW01M1: expansion board with SWPF01SA WiFi module

3) X-NUCLEO-PLC01A1: PLC expansion board integrating CLT01-38SQ7 for Digital Input and

VNI8200XP for Digital Output

Nucleo-L053R8/F401RE X-NUCLEO-IDW01M1

X-NUCLEO-PLC01A1

Plug all these parts in

stacked configuration

Build Your Own PLCPLC programming has never been so easy

36

• The easiest way to evaluate the ST industrial I/Os

• Build your stacked PLC prototype

• Get the X-CUBE-PLC1 software from st.com

• Download the app for your Android device

• Run the nice Ladder programming tool to set-up IO

configurations or get ICs diagnostics

Wi-Fi

moduleSub-GHzBluetooth

IO-Link Fieldbus

NFC

Enabling TechnologiesMore Connected

37

ESD & EMI

Protection

More Connected

RFID

MCU

companion

chips

IO-LinkPoint-to-point communication

38

Example of system architecture with IO-Link

• Universal

• IO-Link corresponds to the international standard IEC 61131-9

• Smart

• IO-Link offers digital data communication to the last meter

between field devices and the machine control

• Easy

• IO-Link is Plug & Play – compatible with existing machinery

and systems

Three reasons why IO-Link is simple

IO-Link get your system ready for Smart Industry communication

Industry 4.0 utilizes

Ad-hoc-communication

Predictive maintenance

Data analytics

IO-LinkPoint-to-point communication

39

IO-Link uses industry’s standard communication plugs

ST covers the complete value chain with the L6360 (Master), L6362A (Device) and MCUs hosting the stack

Three transmission rates (baud rates) are

specified in IO-Link Specification v. 1.1:

• COM 1 = 4.8 kbaud

• COM 2 = 38.4 kbaud

• COM 3 = 230.4 kbaud (optional

according to Specification v. 1.0)

Pin assignment is specified

according to IEC 60974-5-2:

• 1: 24 V

• 3: 0 V

• 4: Switching and

communication line (C/Q)

L6360Single port Master PHY for IO-Link and SIO mode

40

LINEAR

REGULATOR

I2C

INTERFACE

CONFIGURATION

CONTROL and DIAGNOSTIC

LED

CONTROL

BIAS

Config.

Digital

Filter

VCC

L+

C/QI

C/QO

L-

I/QUNDER

VOLTAGE

VDD SELVH Rbias

Config.

Digital

Filter

OVER-TEMP

PROTECTION

DIGITAL

INTERFACE

LED2

LED1

SA1

SA0

SA2

IRQ

RST

SCL

SDA

OUTI/Q

OUTC/Q

INC/Q

ENC/Q

ENL+

Miniaturized package: QFN

3.5 x 5 x 1 mm 26L

Digital interface to

9 internal register

for chip

programmability

& diagnostics

Direct access to

line drivers /

receivers for

transparent

operation

LED Drivers +

sequence

generators

embedded

Additional digital

input with digitlal

filter & current sink

Configurable line

driver with very low

RDSON=2 Ω max

Configurable power

switch

with very low

RDSON=2 Ω max

Receiver with

digital filter and

very precise

configurable

current sink

Tiny package:

STEVAL-IFP016V2

L6362ATransceiver Device for IO-Link and SIO mode

41

DFN 3x3 – 12L

Reverse Polarity and Surge

protections on chip

+

+

+

+

Up to 400 mA output Current with

Overload and Cut-OFF protections

5 V or 3.3 V / 8 mA selectable

Linear Regulator

Configurable Output stage : High

Side, Low Side, Push-Pull

STEVAL-IFP017V2

Fieldbus Offering at STIndustrial communication solutions with STM32 MCUs

42

Solutions are also available with the 8-bit STM8

family MCUs

Interface ProtectionsOverview

43

A-

A+

SMM4F33AESD with +/- 30kV contact

ASI InterfaceActuator & Sensor Interface

DATACLKV+COMSHIELD

Seriplex Interface

ESDA14/25xxESD protection in SOT666/ 323/ 23

RxD

TxD

GND

CTS

RTS

RS232 Interface

ESDA6V1/ 14/ 25xxESD protection in SOT666/ 323/ 23

RS422 / RS485 Interface

ESDA6V1/ 14/ 25xxESD protection in SOT666/ 323/ 23

RxD+TxD+

GND

RTS-

CTS+

RTS+

RxD-TxD-

CTS-

CAN Interface

ESDA5V1L/ 6V1L/

ESDALC6V1ESD protection in SOT663 / SOT23

CAN_H

CAN_L

Driving Circuits

Sensing Circuits

Cable

STM8x TDE1707/08,

L6362A

Control

PartDriver

Pro-

tection

SPT01-335

Protection for

Proximity Sensor

QFN (3x3)

SPT01-335Triple Transil

SPT02-236DDBDual transil with Vbr >36V

Sensor standard EN60947-5-2

Connectivity Modules for Smart Industry

• Machine to Machine communication

• Plug & Play solution

• Easy to use

• RF Certified solution

• Robust design

• Evaluation tools and documentation on web

• Wi-Fi modules

• Bluetooth 3.0 Class II and Class I modules

• Sub-GHz modules

All ST modules are FCC and CE certified.

44

Sub-GHz Modules

• SPI host interface

• Output power up to +11.6 dBm

• Rx: 9 mA, Tx: 21 mA @ +11 dBm

• CE compliant and FCC certified

• Air data rate up to 500 kbps

• Receiver sensitivity: -118 dBm

• Shut Down: 2.5 nA

• Operating temperature: -40 ÷ 85 °C

SPIRIT1 transceiver and BALF-SPI-01D3 balun/filter

SP1ML-868 (868 MHz)

SP1ML-915 (915 MHz) • AT Command

• Output power up to +11.6 dBm

• CE compliant and FCC certified

• Air data rate up to 500 kbps

• Modulation schemes: 2-FSK, GFSK, MSK, GMSK, OOK,

• 1.8 ÷ 3.6 V supply

• Operating temperature: -40 ÷ 85 °C

SPIRIT1 transceiver, STM32L1 MCU and BALF-SPI balun/filter

11,5 x 13,5 mm

SPSGRF-868 (868MHz)

SPSGRF-915 (915MHz)

SPIRIT1 is a sub-GHz transceiver intended for RF wireless-sensor node applications

45

Wi-Fi Modules

• 2.4 GHz IEEE 802.11 b/g/n transceiver

• STM32 ARM Cortex-M3 microcontroller

• Integrated antenna or U FL connector

• Pre-Certified RF (FCC, IC, CE)

• 1.5 MB or 512 kB Integrated Flash memory

• Integrated TC/IP and Application Layer Functions

• Easy interface to host Microcontroller through UART and AT commands set

• System Modes: Mini-AP and Station

• Built-in Application: Sockets, Web Server, Rest API

• TLS/SSL for End to End security

• Over The Air firmware update

• Easy provisioning (SSID, PWD) in miniAP

• Up to +18 dBm output power

• Small form factor: 26.92 x 15.24 x 2.35 mm

Main features

SPWF01Sx: Plug&Play solutions for IoT and Smart Industry applications

SPWF01SA Integrated antenna

SPWF01SC Integrated U.FL connector

Wi-Fi is based on the IEEE 802.11 family of

standards operating in the 2.4 GHz (IEEE

802.11b/g/n) and 5 GHz (IEEE 802.11a/n/ac)

unlicensed bands available worldwide

46

Bluetooth Modules

Bluetooth Low Energy

SPBT2632

B3 SPP/iAP

Bluetooth Classic Modules

BLE 4.1

BlueNRGSPBTLE-RF

11.5 mm x 13.5 mm

x 2.0 mm

BALF-CC25-02D3

Offer of Bluetooth Classic and Bluetooth Low Energy Modules

• Compliant with latest Bluetooth Classic 3.0 version

• Embedded FW, including BT stack and profile, SPP and iAP*

and a simple, easy to use interface AT command set

• RF certified according to:

• CE, FCC, IC, TELEC

• Low-power mode supported

• Smart cable and remote mode supported

• Based on BlueNRG-MS (without MCU)

• Host interface: SPI

• BlueNRG-MS embeds all the Bluetooth Smart 4.1

protocol stack

• CE, FCC, IC certified

• Output power +4 dBm (up to + 8dBm)

• Receiver sensitivity -88 dBm

• Supply voltage from 1.7 ÷ 3.6 V

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Evaluation tools for Connectivity Modules

Connectivity ModulesEvaluation Boards

Evaluation tools for Connectivity modules

STEVAL-SPBT3ATV3

STEVAL-SPBT4ATV3USB dongle for Bluetooth V3.0 classic modules

STEVAL-SPBT3DP USB dongle for new Bluetooth V3.0 classic modules

X-NUCLEO-IDB05A1

STEVAL-IDB006V1MExpansion board and USB dongle for SPBTLE-RF module

STEVAL-IDW001V1

STEVAL-PCC018V1Daughter Board for WiFi modules usable with STEVAL-PCC018V1 or with the STM32F0-Discovery

STEVAL-SP1ML915

STEVAL-SP1ML868 USB dongle for SP1ML modules

X-NUCLEO-IDS01A5 (4)

STEVAL-IDS01V5M (4M)STM32 Nucleo Expansion board and USB dongle for SPSGRF modules

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NFC and RFID in Smart IndustryST Contactless technologies

49

Dynamic NFC/RFID Tag use cases

Dynamic NFC / RFID tags with ST25, M24SR, M24LR and ST95HF

ST25TA

SRi / LRi

EEPROM

NFC phone

RFID reader

EEPROM

M24SR

M24LR

I2C and

Interrupt

Dynamic NFC/RFID tagsST25 NFC / RFID tags

NFC and RFID for AutomationEvaluation boards

50

X-NUCLEO-NFC01A1

STM32 Nucleo Expansion board

based on M24SR

M24SR64-Y Dynamic NFC/RFID tag IC

31 x 30 mm, 13.56 MHz 2-layer inductive

NFC antenna etched on the PCB

(ANT14)

Compatible with STM32 Nucleo

Arduino UNO R3 connector

M24LR-DISCOVERY

Discovery kit for M24LR04E

Dual Interface EEPROM with

energy harvesting

M24LR04E-RMN6T/2 Dual

Interface EEPROM with I2C and

ISO/IEC 15693 RF interfaces, 4

Kbits EEPROM and password

protection in SO8N package

STM8L152C6T6 8-bit MCU, with 8

Kbytes of Flash memory

STTS751-0WB3F, low-voltage

digital temperature sensor

20 x 40 mm inductive antenna

etched on the PCB

M24SR-DISCOVERY

Discovery kit for the M24SR

series - Dynamic NFC/RFID tag

31 x 30 mm 13.56 MHz 2-layer

inductive antenna etched on the PCB

(ANT14)

STM32F103RGT6 64LQFP 32-bit

MCU, with 1Mbytes Flash memory

LCD Color Screen (320x200 pixels)

Joystick for menu selection

X-NUCLEO-NFC02A1

STM32 Nucleo Dynamic NFC tag

expansion board based on M24LR

STM32 expansion board based on

the M24LR04E-RMN6T/2 Dynamic

NFC/RFID tag

Up to 4 Kbit memory with NDEF

support

30 x 30 mm 13.56 MHz double layer

inductive antenna etched on the PCB

Thank You