tps65090evm user's guide (rev. a) - ti.com

User's GuideSLVU778A–October 2012–Revised January 2013

TPS65090EVM User's Guide

This guide details the use of the TPS65090 evaluation module, TPS65090EVM (referred to as EVM forthe remainder of this document).

The TPS65090, front-end power management unit (PMU), is an integrated high-input voltage (6 V–17 V)charger and power path management device including 3 step-down converters, 2 low-dropout regulators(LDO), 7 load-switches, 16-channel 10-bit A/D converter and I2C™ interface.

The EVM facilitates evaluation of the integrated circuit (IC) and serves as a reference design. For moreinformation on the TPS65090, refer to the datasheet: TPS65090 High Input Voltage Frontend PMU forMobile Computer, (SLVSAU3).

Contents1 Requirements ................................................................................................................ 22 Setup and Operation ....................................................................................................... 2

2.1 Power Connections ................................................................................................ 23 Headers and Jumpers ...................................................................................................... 34 Graphical User Interface (GUI) ............................................................................................ 45 Schematic Diagram ......................................................................................................... 46 Board Layout ................................................................................................................ 97 Bill of Materials ............................................................................................................. 168 References ................................................................................................................. 18

List of Figures

1 TPS65090EVM GUI ........................................................................................................ 4

2 TPS65090EVM Schematic Charger or Power Path and Configuration.............................................. 5

3 TPS65090EVM Schematic Converters and Load Switches........................................................... 6

4 TPS65090EVM Schematic USB to I2C Interface ....................................................................... 7

5 TPS65090EVM Schematic Test Pads ................................................................................... 8

6 TPS65090EVM Board Layout, Top Assembly .......................................................................... 9

7 TPS65090EVM Board Layout, Bottom Assembly (mirrored) ........................................................ 10

8 TPS65090EVM Board Layout, Top ..................................................................................... 11

9 TPS65090EVM Board Layout, Internal 2............................................................................... 12

10 TPS65090EVM Board Layout, Internal 3............................................................................... 13

11 TPS65090EVM Board Layout, Bottom (mirrored)..................................................................... 14

12 TPS65090EVM Board Layout, Top Silkscreen ........................................................................ 15

List of Tables

1 EVM Header and Jumper Descriptions .................................................................................. 3

2 TPS65090 Solution, Required Components ........................................................................... 16

3 TPS65090EVM Evaluation Components ............................................................................... 17

Windows is a registered trademark of Microsoft Corporation.I2C is a trademark of NXP.

1SLVU778A–October 2012–Revised January 2013 TPS65090EVM User's GuideSubmit Documentation Feedback

Copyright © 2012–2013, Texas Instruments Incorporated

http://www.ti.com/lit/pdf/SLVSAU3

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLVU778A

Requirements www.ti.com

WARNINGEXPORT NOTICE:

Recipient agrees to not knowingly export or re-export, directly orindirectly, any product or technical data (as defined by the U.S.,EU, and other Export Administration Regulations) includingsoftware, or any controlled product restricted by other applicablenational regulations, received from Disclosing party under thisAgreement, or any direct product of such technology, to anydestination to which such export or re-export is restricted orprohibited by U.S. or other applicable laws, without obtaining priorauthorization from U.S. Department of Commerce and othercompetent Government authorities to the extent required by thoselaws. This provision shall survive termination or expiration of thisAgreement. According to our best knowledge of the state and end-use of this product or technology, and in compliance with theexport control regulations of dual-use goods in force in the originand exporting countries, this technology is classified as follows:

US ECCN: 3E991

EU ECCN: EAR99

And may require export or re-export license for shipping it incompliance with the applicable regulations of certain countries.

1 Requirements

In order to use the EVM, a lab power supply capable of supplying at least the TPS65090 output power ata voltage between 6 V and 17 V and/or a rechargeable multi-cell lithium battery is required. Additionally, acomputer running Windows® 7 or Windows XP loaded with the TPS65090EVM-SW graphical userinterface (GUI) and a mini-USB cable are recommended.

2 Setup and Operation

2.1 Power Connections

Connect the lab power supply to the input labeled AC (AC adapter), J1; pin 1 positive lead and pin 6negative lead.

Connect the rechargeable Li-Ion battery to J3; pin 1 positive lead and pin 6 negative lead.

By default, the charger and converters are enabled and disabled by external pins. The LDOs are alwayson, since they additionally provide power to internal blocks.

2 TPS65090EVM User's Guide SLVU778A–October 2012–Revised January 2013Submit Documentation Feedback


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www.ti.com Headers and Jumpers

3 Headers and Jumpers

Many of the 6-pin headers provide Kelvin sense lines, S+ and S– (pins 3 and 4), for sensing the voltagedirectly at the input or output capacitors.

Table 1. EVM Header and Jumper Descriptions

Reference Name DescriptionDesignator

J1 V_AC Input connection for AC adapter

J2 VSYS Header for power path output system voltage

J3 V_BAT Header for Li-Ion battery connection

J4 DCDC1 Header for output voltage of switching converter, DCDC1



J7 Digital Header for open drain outputs, each pulled up to J14

J8 VIO Jumper to select pull-up for I2C bus, default: USB_3P3

J9 USB_3P3 Header for output of U4, 5-V to 3.3-V LDO

J10 I2C Header for I2C bus

J11 J11 Mini-USB connection to PC for GUI

J12 SCL pull-Up Jumper to pull–up SCL to J8, default: installed

J13 SDA pull-Up Jumper to pull–up SDA to J8, default: installed

J14 Output pull-up Jumper to select pull-up for open-drain outputs

J15 ENC Jumper to externally enable or disable charger

J16 TS1 Header connection to pin TS1 network

J17 TS2 Header connection to pin TS2 network

J18 EN_DCDC1 Jumper to externally enable or disable DCDC1



J21 LDO1 Header to output voltage of LDO1

J22 LDO2 Header to output voltage of LDO2

J23 FET Out Header to FET outputs

J24 FET In Header to FET inputs

J25 Factory Use Jumper used for firmware install only

JP1 I_VSYS Solder bridge to optionally measure VSYS current

JP2 I_VBAT Solder bridge to optionally measure V_BAT inductor current

JP3 I1 Solder bridge to optionally measure DCDC1 inductor current





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Graphical User Interface (GUI) www.ti.com

4 Graphical User Interface (GUI)

The GUI design allows the TPS65090 to easily interface with a PC. The GUI gives the capability to readand write the contents of the I2C registers and simplifies use with radio check boxes, drop-down menusand pushbuttons.

Figure 1. TPS65090EVM GUI

5 Schematic Diagram

The schematic diagram illustrates the circuit connections of the EVM.

This EVM contains many components that are not necessary for an end-product. These additionalcomponents are added to simplify evaluation of the IC. In Section 7, the Bill of Materials (BOM), there aretwo tables; the first table includes the required materials for functionality of the TPS65090 and the secondtable contains the additional materials added for evaluation.



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SCL

SDA

GND

GND

I²C Pull Up

Sense to C1

Sense to C5

GND

ENC

IRQ

VACG

VBATG

VSYSG

STAT

GND

PGND

PGND

USB_3P3

VIO_LDO2

VIO

LDO2

LDO1

LDO2

V_AC

V_AC

VSYS

VSYS

SENSE +

SENSE -

PGND

PGND

V_BAT

V_BAT

SENSE +

SENSE -

PGND

PGND

TS1

AGND

TS2

AGND

sense at R16

Op. 3 cell

R3 = 1100k

R4 = 220k

single

optionsensor

I_VSYS

I_VBAT

4A 4A

4A 10A

10A

10A4A/6Apk

VSYS

V_BAT

pla

ce p

art

sclo

se t

o Q

1

clo

se t

o I

C

All ground is connected at PowerPad

GN

D 0

GN

D 1

GN

D 0

GN

D 1

USB_3P3

GND

the option to split VCTRL and VPROGOTP using R44 is only required to connect higher OTP programming voltage

1 Components without a value are not installed

Batt

ery

Charg

er

CN

TRL

A50 ACN

B47 ACP

B48 ACS

A51 ACG

A14 VACS

A13 VAC

B13 STAT

B36 VSYSG

A38 VBATG

A39 VACG

A41 ENC

A27 SDATB25 SCLK

B12 IRQ

B35 VREF

B39 VCTRL

B26 VREFADC

A28 VPROGOTP

A33 AGNDA40 GND 105PWPD

C4PGND

C3PGND

C2PGND

C1PGND

B6PGNDC

A6PGNDC

B23TS2

A24TS1

A25VREFT

A52FBC

B1SRN

A1SRP

B5LC

A5LC

B4LC

B2CBC

A15VBAT

A2BATG

A4VSYSC

B3VSYSC

A3VSYSC

U1-A

TPS65090RVN

TPS65090RVN

L1

2.2 uH

G

S D

Q2CSD17304Q3

G

SD

Q1CSD17304Q3

C1

1uF

C2

10uF

C3

10uF

C44700pF

C5

1uF

C6

10uF

C7

10uF

R2

0.01

R52.2k R6

2.2k

R76.8k

R86.8k

4

5

1 2 3

Q3CSD25401Q3

R1

0.01

1

2

3

4

5

6

J1

1

2

3

4

5

6

J2

1

2

3

4

5

6

J3

Q4BSS138W-7-FD1

1N

4148W

-7-F

1

2

3

4

J10

1

2

3

J8

J12 J13

1

2

3

J14

C35

2.2uF

C37

100nF

1

2

3

J15

R2010k

R2110k

1

2

J16

1

2

J17

R38

1M

C54

1uF

R39

JP2

R42

R43

JP1

TP1 TP2

TP3

TP4

TP5 TP6

TP7

TP8

TP10

TP11TP12

TP13

TP14

TP15TP16TP17

1

2

3

4

5

6

J7

J9

SH1 SH2

C36

2.2uF

R9

10k

R10

10k

R11

10k

R12

10k

R4

110k

R15

1M

R18

1k

R19

1k

R14

3M

R3

330k

R44 0

R17

10k

R13

0.002

C55

100nF

C56

100nF

C57

100nF

C58

100nFC59

100nF

C60

100nF

C61

100nF

C62

100nF

C63

100nF

C64

1uF

C65

100nF

C66

100nF

R47 4.7k

R48 4.7k

C67

100nF

R49

470k

TP9

R45

3.9

R46

3.9

R5010

R16

10k

1

1

1

1

SDASCL

SCL

SDA

VOUT_LDO2

VOUT_LDO1

VOUT_LDO2

VOUT_LDO2

VSYS

VSYSC

VCTRL

VPROGOTP

IRQ

VIO

VACG

VBATG

VSYSG

STAT

V_AC

VIO_PUP

SDA_PUP

SCL_PUP

ENC

TS1

TS2

VSYS

USB_3P3

V_BAT

www.ti.com Schematic Diagram

Figure 2. TPS65090EVM Schematic Charger or Power Path and Configuration



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Sense to C11

Sense to C17

Sense to C23

Sense to C26

Sense to C27

DCD

C1 5

VD

CD

C2 3

.3V

DCD

C3 1

.35V

LD

O1 5

V

LD

O2 3

.3V

FET1_OUT

FET2_OUT

FET3_OUT

FET4_OUT

FET5_OUT

FET6_OUT

FET7_OUT

FET3_OUT

3A

1A

1A

1A

1A

FET1_IN

FET2_IN

FET3_IN

FET3_IN

FET4_IN

FET5_IN

FET6_IN

FET7_IN

EN_DCDC1

EN_DCDC2

EN_DCDC3

GND

V_LDO2

GND

V_LDO2

GND

V_LDO2

DCDC1

DCDC1

SENSE +

SENSE -

PGND

PGND

DCDC2

DCDC2

SENSE +

SENSE -

PGND

PGND

DCDC3

DCDC3

SENSE +

SENSE -

PGND

PGND

V_LDO1

V_LDO1

SENSE +

SENSE -

PGND

PGND

V_LDO2

V_LDO2

SENSE +

SENSE -

PGND

PGND

5A/6Apk

5A/6Apk

5A/6Apk

100mA

100mA

1A

200mA

5A/6Apk

5A/6Apk

100mA

100mA

5A/6Apk

17V

17V

3.3VI1

I2

I3

5.0V

3.3V

all 2.2uF close

to the IC

GN

D 2

GN

D 2

GN

D 3

GN

D 3

GN

D 4

GN

D 4

LD

O2

DCD

C1

LD

O1

DCD

C3

DCD

C2

A46 VSYS1B43 VSYS1A47 VSYS1

B38 EN1

A19 VSYS2B18 VSYS2A20 VSYS2

A42 EN2

A10 VSYS3A11 VSYS3B10 VSYS3B11 VSYS3

A26 EN3

A49 VSYS_L1

A17 VSYS_L2

B15FB_L2

B16VLDO2

B46FB_L1

B45VLDO1

A8PGND3

B7PGND3

A7PGND3

B14FB3

A16VDCDC3

B9L3

A9L3

B8L3

A12CB3

B22PGND2

B21PGND2

A22PGND2

A23PGND2

B24FB2

A18VDCDC2

B20L2

A21L2

B19L2

B17CB2

A44PGND1

B40PGND1

A43PGND1

B37FB1

A48VDCDC1

B42L1

A45L1

B41L1

B44CB1

U1-B

TPS65090RVN

TPS65090RVN

B28 INFET1

B29 INFET2

B31 INFET3

A34 INFET3

B34 INFET4

B33 INFET5

B32 INFET6

B27 INFET7 A29VEFT7

A35VFET6

A36VFET5

A37VFET4

A32VFET3

B30VFET3

A31VFET2

A30VFET1

U1-C

TPS65090RVN

TPS65090RVN

L2

2.2 uH

L3

2.2 uH

L4

2.2 uH

C8

1uF

C9

10uF

C104700pF

C11

2.2uF

C12

10uF

C13

10uF

C14

1uF

C15

10uF

C164700pF

C17

2.2uF

C18

10uF

C19

10uF

C20

1uF

C21

10uF

C224700pF

C23

2.2uF

C24

10uF

C25

10uF

C28

10uF25V

C29

10uF

C30

10uF

C31

10uF

C32

10uF

C33

10uF

C34

10uF

1

2

3

4

5

6

J4

1

2

3

4

5

6

J5

1

2

3

4

5

6

J6

1

2

3

J18

1

2

3

J19

1

2

3

J20

R22

1M

R23

1M

R24

1M

C38

1uF

C39

1uF

1

2

3

4

5

6

J21

1

2

3

4

5

6

J22

C46

10uF

C471uF

C482.2uF

C492.2uF

C502.2uF

C512.2uF

C522.2uF

C532.2uF

123456789

10111213141516

J23

R25 0

R26

R27

R28 0

R29

R30 0

R31

R32 0

R33

R34 0

R35

R36 0

12345678910111213141516

J24

R37 0

JP3

JP4

JP5

C26

10uF

C40

10uF

C41

10uF

C42

10uF

C43

10uF

C44

10uF

C45

10uF

R41

470k

R40

330k

C27

10uF

1

EN1

EN2

EN3

VSYSVOUT_LDO2

EN1

EN2

EN3

VOUT_LDO2 VOUT_LDO2

VSYS

VOUT_DCDC1

VOUT_DCDC2

VOUT_DCDC1

VOUT_DCDC2

VOUT_LDO1

INFET1

INFET2

INFET3

INFET4

INFET5

INFET6

INFET7

VFET1

VFET2

VFET3

VFET4

VFET5

VFET6

VFET7

VOUT_DCDC3

Schematic Diagram www.ti.com

Figure 3. TPS65090EVM Schematic Converters and Load Switches



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USB2I2C Interface

1P6.4/CB4/A4

2P6.5/CB5/A5

3P6.6/CB6/A6

4P6.7/CB7/A7

5P7.0/CB8/A12

6P7.1/CB9/A13

7P7.2/CB10/A14

8P7.3/CB11/A15

9P5.0/VREF+/VEREF+

10P5.1/VREF-/VEREF-

11AVCC1

12P5.4/XIN

13P5.5/XOUT

14AVSS1

15P8.0

16P8.1

17P8.2

18DVCC1

19DVSS1

20VCORE

21

P1.0

/TA0CLK/A

CLK

22

P1.1

/TA0.0

23

P1.2

/TA0.1

24

P1.3

/TA0.2

25

P1.4

/TA0.3

26

P1.5

/TA0.4

27

P1.6

/TA1CLK/C

BO

UT

28

P1.7

/TA1.0

29

P2.0

/TA1.1

30

P2.1

/TA1.2

31

P2.2

/TA2CLK/S

MCLK

32

P2.3

/TA2.0

33

P2.4

/TA2.1

34

P2.5

/TA2.2

35

P2.6

/RTCCLK/D

MAE0

36

P2.7

/UCB0/S

TEU

CA0CLK

37

P3.0

/UCB0SIM

O/U

CB0SD

38

P3.1

/UCB0SO

MI/

UCB0SC

39

P3.2

/UCB0CLK/U

CA0STE

40

P3,3

/UCA0TXD

/UCA0SIM

41P3.4/UCA0RXD/UCA0SOM

42P3.5/TB0.5

43P3.6/TB0.6

44P3.7/TB0OUTH/SVMOUT

45P4.0/PM_UCB1STE/PM_U

46P4.1/PM_UCB1SIMO

47P4.2/PM_UCB1SOMI

48P4.3/PM_UCB1CLK

49DVSS2

50DVCC2

51P4.4/PM_UCA1TXD

52P4.5/PM_UCA1RXD

53P4.6/PM_NONE

54P4.7/PM_NONE

55P5.6/TB0.0

56P5.7/TB0.1

57P7.4/TB0.2

58P7.5/TB0.3

59P7.6/TB0.4

60P7.7/TB0CLK/MCLK

61

VSSU

62

PU

.0/D

P

63

PU

R

64

PU

.1/D

M

65

VBU

S

66

VU

SB

67

V18

68

AVSS2

69

P5.2

/XT2IN

70

P5.3

/XT2O

UT

71

TEST/S

BW

TCK

72

PJ.

0/T

DO

73

PJ.

1/T

DI/

TCLK

74

PJ.

2/T

MS

75

PJ.

3/T

CK

76

NM

I/SBW

TD

IO/R

ST

77

P6.0

/CB0/A

0

78

P6.1

/CB1/A

1

79

P6.2

/CB2/A

2

80

P6.3

/CB3/A

3

U2

MSP430F552XIPN

MSP430F5529IPN

1IO

1

2IO

2

3G

ND

4IO

3

5IO

4

6VCC

U3

TPD

4E004D

RY

1OUT

2NC

3NR/FB

4GND

5EN

6NC

7NC

8IN

9

PWPD

U4

TPS73533DRB

V+

DM

DP

NC

V-

CASE

CASE

J11

L5

MI1206K900R-10

D2

1SMB5922BT3G

1 2

R51 33

1 2

R52

33

12

Y1

24.0

MH

z12

C6830pF

12

C6930pF

1 2

R53

33k

12

C70

C0603

0.1uF

12

C71

0.1uF

12

C72

C0603

0.1uF

C73

1uF 12

C74

0.01uF

1 2

R54

1.5k

1

2

R55

1.2M

J25

12

C75

220pF

12

C76

220pF

+

C77

22uF1

2

C78

470nF

1

2

R59

33k

12

C79

2.2

nF

12

C80

2.2uF

1 2

R57

0

1

USB_3P3

USB_3P3

USB_3P3

SDA

SCL

GND1PGND

www.ti.com Schematic Diagram

Figure 4. TPS65090EVM Schematic USB to I2C Interface



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1

2

3

4

5

6

7

8

9

10

X1

1

2

3

4

5

6

7

8

9

10

X2

1

2

3

4

5

6

7

8

9

10

X3

1

2

3

4

5

6

7

8

9

10

X4

1

2

3

4

5

6

7

8

9

10

X5

1

2

3

4

5

6

7

8

9

10

X6

1

2

3

4

5

6

7

8

9

10

X7

1

2

3

4

5

6

7

8

9

10

X8

1

2

3

4

5

6

7

8

9

10

X10

1

2

3

4

5

6

7

8

9

10

X11

1

2

3

4

5

6

7

8

9

10

X9

AGND

EN1

EN2

EN3

ENC

GND1

GND1

GND1

GND1

INFET1

INFET2

INFET3

INFET3

INFET4

INFET5

INFET6

INFET7

IRQ

PWRGNDPWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGND

PWRGNDPWRGND

PWRGND

PWRGNDPWRGND

PWRGND

PWRGNDPWRGND

PWRGND

PWRGND

STAT

TS2

VACG

PWRGND

VBATG

VFET1

VFET2

VFET3

VFET3

VFET4

VFET5

VFET6

VFET7

VIO

USB_3P3

USB_3P3

VIO_PUP

VOUT_DCDC1

VOUT_DCDC1

VOUT_DCDC1

VOUT_DCDC2

VOUT_DCDC2

VOUT_DCDC2

VOUT_DCDC3

VOUT_DCDC3

VOUT_DCDC3

VOUT_LDO1

VOUT_LDO1

VOUT_LDO1

VOUT_LDO1

VOUT_LDO2

VOUT_LDO2

VOUT_LDO2

VOUT_LDO2

VOUT_LDO2

VOUT_LDO2

VOUT_LDO2

VSYS

VSYS

VSYSC

VSYSG

V_AC

V_AC

V_AC

V_BAT

V_BAT

V_BAT

AGND

GND1

SCL

SCL_PUP

SDA

SDA_PUP

TS1

VIO_PUP

VIO_PUP

VPROGOTP

VCTRL

Schematic Diagram www.ti.com

Figure 5. TPS65090EVM Schematic Test Pads



http://www.ti.com


1

1

1

1

+

1

1

1

C1

C10

C11

C14

C16 C17

C20

C22

C23

C35

C36

C37

C38

C39

C4

C47

C48

C49

C5

C50

C51

C52

C53

C8

C12

C13

C15

C18

C19

C2 C21

C24

C25

C28

C29

C3

C30

C31

C32

C33

C34

C46

C6

C7

C9

D1

J16

J17

J8

J14

J15

J18

J19

J20

J10

J1

J2

J21

J22

J3

J4

J5

J6

J23 J24

L1

L2 L3

L4

JP

1

JP

2

JP3 JP4

JP

5

J12

J13

R42

R43

R22

R23

R24

R38

R5

R6

R7

R8

R39

R1

R13

R2

R20

R21

Q4

Q1

Q2

Q3

AVT1

AVT2 AVT3

R25

R27

R29

R31

R33

R35

R37

R26

R28

R30

R32

R34

R36

C54

TP10

TP11

TP12

TP13

TP14TP2

TP3

TP4

TP5

TP6

TP8

TP9

TP16

TP17

TP1

TP15

J7

J9

U1

C26

C40

C41

C42

C43

C44

C45

R10

R11

R12

R15

R14

R17

R18

R19

R9

R4

R3 R

41

R40

R44

C64

R45

R46

R50

R16

C27

L5

C6

8

C69

C70

C71

C72

C7

4

C75

C76

C78

C79

C80

C73

C77

J11

Y1

D2

U2

R51

R52

R53

R54R55

R57

R59

U3

U4

J25

www.ti.com Board Layout

6 Board Layout

This section provides the EVM board layout and illustrations.

Board layout is critical for all high-frequency, switch-mode power supplies. The following figures show theboard layout for the EVM printed-circuit board. The nodes with high-switching frequencies and currentsare kept as short as possible to minimize trace inductance.

Careful attention has been given to the routing of high-frequency current loops and a single-pointgrounding scheme is used. See the data sheet for specific layout guidelines.

Figure 6. TPS65090EVM Board Layout, Top Assembly



http://www.ti.com


8X1 1 X7 6 X1

X5

1X

41

X3

1

X211 X1

X9

11

X10

1X

11

Board Layout www.ti.com

Figure 7. TPS65090EVM Board Layout, Bottom Assembly (mirrored)



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Figure 8. TPS65090EVM Board Layout, Top



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Figure 9. TPS65090EVM Board Layout, Internal 2



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Figure 10. TPS65090EVM Board Layout, Internal 3



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Figure 11. TPS65090EVM Board Layout, Bottom (mirrored)



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1

1

1

1

+1

1

1

+

1

VSYS PWRGNDSense

V_BAT PWRGNDSense

DCDC3 PWRGNDSense

PW

RG

ND

LD

O2

Sense

PW

RG

ND

DC

DC

2

Sense

PW

RG

ND

V_A

CS

ense

PW

RG

ND

LD

O1

Sense

DC

DC

1P

WR

GN

D

Sense

SD

A

SC

L

GN

D1

GN

D1

BO

X

VIO

LD

O2

EN

2

LD

O

GN

D

EN

3

GN

D

LD

O

EN

1

LD

O

GN

D

EN

C

GN

D

LD

O1

LD

O2

VIO

STAT

VSYSG

VBATG

VACG

IRQ

GND1

1234567 3 1234567 3

FE

TO

UT

FE

TIN

LD

O2

C1

C10

C11

C1

4

C16

C1

7

C20C22

C23

C3

5

C36

C3

7C

38

C3

9

C4

C4

7

C4

8

C4

9

C5

C5

0

C5

1

C5

2

C5

3

C8C12

C13

C15

C18

C19

C2C21

C24C25

C28

C29

C3

C30

C31

C32

C33

C34

C46

C6C7

C9

D1

J16

J17

J8

J14

J15

J18

J19

J20

J10

J1

J2

J21

J22

J3

J4

J5

J6

J23 J24

L1

L2L3

L4

JP1

JP2

JP3JP4

JP5

J12

J13

R42

R43

R22

R23

R2

4

R38

R5

R6

R7

R8

R39

R1

R13

R2

R20

R21

Q4

Q1

Q2

Q3

R25

R27

R29

R31

R33

R35

R37

R26

R28

R30

R32

R34

R36

C54

TP10

TP11

TP12

TP13

TP14

TP2

TP3

TP4

TP

5

TP6

TP7

TP

8

TP9

TP16

TP17

TP1

TP15

J7

J9

U1

C2

6

C40

C41

C42

C43

C44

C45

R10

R11

R12

R15

R14

R17

R9

R4

R3

R41

R40

R44

C55

C56

C57

C58

C59

C60

C61

C62

C63

C65 C66

C64

C67

R47

R48

R49

R45 R46 R50

R16

C2

7

L5

C73

C77

J11

Y1

D2

U2

U3

U4

J25


Figure 12. TPS65090EVM Board Layout, Top Silkscreen



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Bill of Materials www.ti.com

7 Bill of Materials

This EVM contains many components that are not necessary for an end-product. These additional components are added to simplify evaluation ofthe IC. The first table includes required materials for functionality of the TPS65090 and the second table contains the additional materials addedfor evaluation.

Table 2. TPS65090 Solution, Required Components

Count RefDes Value Description Size Part Number MFR

8 C1, C5, C8, C14, C20, C38, C39, 1 µF Capacitor, ceramic,X5R, 25 V, 20% 0402 GRM155R61E105MA12 MurataC47

11 C11, C17, C23, C35, C36, C48, C49, 2.2 µF Capacitor, ceramic, X5R, 6.3 V, 10% 0402 GRM155R61A225KE95 MurataC50, C51, C52, C53

29 C2, C3, C6, C7, C9, C12, C13, C15, 10 µF Capacitor, ceramic, X5R, 25 V,10% 0603 GRM188R61E106MA73 MurataC18, C19, C21, C24, C25, C26, C27,C28, C29, C30, C31, C32, C33, C34,C40, C41, C42, C43, C44, C45, C46

13 C37, C55, C56, C57, C58, C59, C60, 100 nF Capacitor, ceramic, 25 V, X5R, 20% 0402 STD STDC61, C62, C63, C65, C66, C67

4 C4, C10, C16, C22 4700 pF Capacitor, ceramic, 50 V, X5R, 10% 0402 STD STD

2 C54, C64 1 µF Capacitor, ceramic, 25 V, X5R, 10% 0603 GRM188R61E105KA12D Murata

1 D1 1N4148W-7-F Diode, signal, 300 mA, 75 V, 350 mW SOD-123 1N4148W-7-F Diodes

4 L1, L2, L3, L4 2.2 µH Inductor, power, 9.2 A, ±20% 5 x 5 mm XAL5030-222ME Coilcraft

2 Q1, Q2 CSD17304Q3 MOSFET, NChannel, 30 V, 56 A, 9.8 mΩ QFN3.3x3.3 mm CSD17304Q3 TI

1 Q3 CSD25401Q3 MOSFET, PChannel, -20 V, 60 A, 8.7 mΩ QFN3.3X3.3mm CSD25401Q3 TI

1 Q4 BSS138W-7-F MOSFET, NChannel, 50 V, 200 mA SOT323 BSS138W-7-F Diodes

2 R1, R2 0.01 Ω Resistor, chip, 1/4 watt, 1% 1206 WSL1206R0100FEA Vishay

1 R13 0.002 Ω Resistor, chip, 3/4 watt, 1% 1206 PMR18EZPFV2L00 Rohm

1 R14 3 mΩ Resistor, chip, 1/16W, 1% 0402 STD STD

1 R15 1M Resistor, chip, 1/16W, 1% 0402 STD STD

2 R18, R19 1 kΩ Resistor, chip, 1/16W, 1% 0402 STD STD

2 R20, R21 10 kΩ Thermistor, NTC, 10 kΩ, 1% 0603 NTCS0603E3103FLT Vishay


1 R4 110 kΩ Resistor, chip, 1/16W, 1% 0402 STD STD


2 R45, R46 3.9 Ω Resistor, chip, 1/4 watt, ± 1% 1206 STD STD

2 R47, R48 4.7 kΩ Resistor, chip, 1/16W, 1% 0402 STD STD


1 R50 10 Ω Resistor, chip, 1/4 watt, ±1% 1206 STD STD


6 R9, R10, R11, R12, R16, R17 10 kΩ Resistor, chip, 1/16W, 1% 0402 STD STD

1 U1 TPS65090RVN IC, Multi output power management with ADC and battery charger QFN TPS65090RVN TI



http://www.ti.com


www.ti.com Bill of Materials

Table 3. TPS65090EVM Evaluation Components

Count RefDes Value Description Size Part Number MFR

2 C68, C69 30 pF Capacitor, ceramic, 50 V, C0G, 10% 0603 STD STD

3 C70, C71, C72 0.1 µF Capacitor, ceramic, 16 V, X7R, 10% 0603 STD STD

1 C73 1 µF Capacitor, ceramic chip, 10 V, ±10% 0805 STD STD

1 C74 0.01 µF Capacitor, ceramic, 16 V, X7R, 10% 0603 STD STD

2 C75, C76 220 pF Capacitor, ceramic, 50 V, C0G, 5% 0603 STD STD

1 C77 22 µF Capacitor, alum. 10 VDC, ±20% 6032 EEE-1AA220WR Panasonic

1 C78 470 nF Capacitor, ceramic, 16 V, X7R, 10% 0603 STD STD

1 C79 2.2 nF Capacitor, ceramic, 25 V, X7R, 20% 0603 STD STD

1 C80 2.2 µF Capacitor, ceramic, 10 V, X7R, 10% 0603 STD STD

1 D2 1SMB5922BT3G Diode, Zener, 7.5 V, 50 mA, 3 W SMB 1SMB5922BT3G On Semi

9 J1–J6, J21, J22, J7 PEC06SAAN Header, male 6 pin, 100-mil spacing, 0.100 in × 6 PEC06SAAN Sullins

1 J10 PEC04SAAN Header, male 4 pin, 100-mil spacing, 0.100 in × 4 PEC04SAAN Sullins

1 J11 1734035-2 Connector, recpt, USB-B, mini, 5 pins, SMT 0.354 × 0.400 in 1734035-2

2 J23, J24 PEC08DAAN Header, male 2x8 pin, 100-mil spacing 0.100 in × 2 × 8 PEC08DAAN Sullins

6 J8, J14, J15, J18–J20 PEC03SAAN Header, male 3-pin, 100-mil spacing, 0.100 in × 3 PEC03SAAN Sullins

6 J9, J12, J13, J16, J17, J25 PEC02SAAN Header, male 2 pin, 100-mil spacing 0.100 in × 2 PEC02SAAN Sullins

1 L5 MI1206K900R-10 Bead, ferrite, SMT, 90 Ω, 1.5A 1206 MI1206K900R-10 Laird

4 R22, R23, R24, R38 1M Resistor, chip, 1/16W, 1% 0402 STD STD

2 R20, R21 10 kΩ Thermistor, NTC, 10 kΩ, 1% 0603 NTCS0603E3103FLT Vishay

9 R25, R28, R30, R32, R34, 0 Ω Resistor, chip, 1/16W, 1% 0603 STD STDR36, R37, R44, R57

0 R26, R27, R29, R31, R33, R35 0 Ω Resistor, chip, 1/16W, 1% 0603 STD STD

0 R39 0 Ω Resistor, chip, 1/16W, 0.1% 0603 STD STD

0 R42, R43 50 kΩ Potentiometer, single slide, 50 kΩ, 0.1 W, 20% 0.378 × 0.217 in Copal

2 R51, R52 33 Ω Resistor, chip, 1/16W, 1% 0603 Std Std

2 R53, R59 33 kΩ Resistor, chip, 1/16W, 1% 0603 Std Std

1 R54 1.5 kΩ Resistor, chip, 1/16W, 1% 0603 Std Std

1 R55 1.2 MΩ Resistor, chip, 1/16W, 1% 0603 Std Std

1 U2 MSP430F5529IPN IC, mixed signal microcontroller TQFP-80 MSP430F5529IPN TI

1 U3 TPD4E004DRY IC, 4-chan ESD-protection array SON-6 TPD4E004DRY TI

1 U4 TPS73533DRB IC, 500 mA, low quiescent current, ultra-low noise, high PSRR LDO, 3.3 SON-8 TPS73533DRB TIV

1 Y1 24.0 MHz Crystal, SMT quartz crystal 0.484 × 0.190 in ECS-240-20-5PX-TR CTS

1 -- PCB, 4.2 in × 4.2 in × 0.062 in PWR108 Any



http://www.ti.com


References www.ti.com

8 References1. TPS65090 High Input Voltage Frontend PMU for Mobile Computer, (SLVSAU3)



http://www.ti.com

http://www.ti.com/lit/pdf/SLVSAU3


EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS

Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods.

Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TOBUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTHABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIALDAMAGES.

Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safetyprograms, please visit www.ti.com/esh or contact TI.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, andtherefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,software performance, or infringement of patents or services described herein.

REGULATORY COMPLIANCE INFORMATION

As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the FederalCommunications Commission (FCC) and Industry Canada (IC) rules.

For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumeruse. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computingdevices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequencyinterference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense willbe required to take whatever measures may be required to correct this interference.

General Statement for EVMs including a radio

User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency andpower limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with locallaws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate thisradio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited andunauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatoryauthorities, which is responsibility of user including its acceptable authorization.

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant

Caution

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not causeharmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate theequipment.

FCC Interference Statement for Class A EVM devices

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercialenvironment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with theinstruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely tocause harmful interference in which case the user will be required to correct the interference at his own expense.

http://www.ti.com/corp/docs/csr/environment/ESHPolicyandPrinciples.shtml

FCC Interference Statement for Class B EVM devices

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipmentgenerates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may causeharmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. Ifthis equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off andon, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

For EVMs annotated as IC – INDUSTRY CANADA Compliant

This Class A or B digital apparatus complies with Canadian ICES-003.

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate theequipment.

Concerning EVMs including radio transmitters

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) thisdevice may not cause interference, and (2) this device must accept any interference, including interference that may cause undesiredoperation of the device.

Concerning EVMs including detachable antennas

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gainapproved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain shouldbe so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.

This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximumpermissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gaingreater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.

Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité del'utilisateur pour actionner l'équipement.

Concernant les EVMs avec appareils radio

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation estautorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter toutbrouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gainmaximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique àl'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manueld’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus danscette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

SPACER

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【【Important Notice for Users of this Product in Japan】】This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan

If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:

1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs andCommunications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law ofJapan,

2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to thisproduct, or

3. Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan withrespect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please notethat if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.

Texas Instruments Japan Limited(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan

http://www.tij.co.jp

【ご使用にあたっての注】

本開発キットは技術基準適合証明を受けておりません。

本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

　　　上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。

日本テキサス・インスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビルhttp://www.tij.co.jp

SPACER

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EVALUATION BOARD/KIT/MODULE (EVM)WARNINGS, RESTRICTIONS AND DISCLAIMERS

For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finishedelectrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation inlaboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risksassociated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished endproduct.

Your Sole Responsibility and Risk. You acknowledge, represent and agree that:

1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and DrugAdministration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.

2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicableregulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents tominimize the risk of electrical shock hazard.

3. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, evenif the EVM should fail to perform as described or expected.

4. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.

Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per theuser guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, andenvironmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contacta TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of thespecified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/orinterface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to theload specification, please contact a TI field representative. During normal operation, some circuit components may have case temperaturesgreater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components includebut are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using theEVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, pleasebe aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeablein electronic measurement and diagnostics normally found in development environments should use these EVMs.

Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representativesharmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or inconnection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claimsarise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.

Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (suchas life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as deviceswhich are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separateAssurance and Indemnity Agreement.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2013, Texas Instruments Incorporated

STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or

documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

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FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page


【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

SPACER4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.

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SPACER6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.


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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity


http://www.ti.com/audio

http://www.ti.com/automotive

http://amplifier.ti.com

http://www.ti.com/communications

http://dataconverter.ti.com

http://www.ti.com/computers

http://www.dlp.com

http://www.ti.com/consumer-apps

http://dsp.ti.com

http://www.ti.com/energy

http://www.ti.com/clocks

http://www.ti.com/industrial

http://interface.ti.com

http://www.ti.com/medical

http://logic.ti.com

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http://power.ti.com

http://www.ti.com/space-avionics-defense

http://microcontroller.ti.com

http://www.ti.com/video

http://www.ti-rfid.com

http://www.ti.com/omap

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http://www.ti.com/wirelessconnectivity

tps65090evm user's guide (rev. a) - ti.com

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