toshiba’s reference designs for ara module...

SEMICONDUCTORS

Copyright 2015, Toshiba Corporation.

Toshiba’s Reference designs for Ara Module Developers

Shardul Kazi

Senior Vice President

Toshiba America Electronic Components, Inc. DevCon2, Jan. 2015

2 Copyright 2015, Toshiba Corporation.

Toshiba Reference Designs development plan

Phase-1 Phase-2 Phase-3

Term CY2014 CY2015 CY2016

items Basic function Up-to-date

Features

Unique module

Target

function

examples

Camera

WPC

TransferJet™

NFC

Ext. Memory

*Planning


Toshiba CMOS Image Sensor;

Latest 1.12um CIS Product line for Mobile phone

Pixel 8 Mpix 13 Mpix 20 Mpix

Product type # T4KA3 T4K82 T4KA7

Optical format (inch)

1/4 1/3.07 1/2.4

Frame rate 30fps@full resolution 120fps@720P (cropped & binning)

30fps@full resolution 30fps@4K2K 120fps@1080p

22fps@full resolution 90fps@1080P

Bright Mode Yes Yes -

HDR: High Dynamic Range

Yes Yes -


High Frame Rate demonstration (video)

• 240 fps - Full HD (1920 x 1080)

• 480 fps - (W)VGA (800x480);

• 900 fps - QVGA (320 x 240); Captured by T4K82; 13Mpix CIS



• 240 fps - Full HD (1920 x 1080)

• 480 fps - (W)VGA (800x480);

• 900 fps - QVGA (320 x 240); Captured by T4K82; 13Mpix CIS



Captured by T4K82; 13Mpix CIS

• 240 fps - Full HD (1920 x 1080)

• 480 fps - (W)VGA (800x480);

• 900 fps - QVGA (320 x 240);


Ara –camera module reference designs

Three Trials for Spiral-2

1. “ 2Mpix ” 3D CAD design of Receiver bar Low height camera module

2. “ 5Mpix ” mockup in 2x1 module with built-in ISP

3. “13Mpix ” mockup in 2x1 module

with Bright mode, High Frame Rate


#1, Receiver Module (Product Overview)


Receiver and Camera

in a Full Flat design body

Receiver Module


#1, Receiver Module (3D CAD design)

AP Bridge Audio codec CIS

Full flat Audio Receiver and Front camera

By adapting the technologies of;

1. Small footprint Audio codec IC,

TB94B15WBG, 3mmx3mm

2. Low height 2Mpix CIS camera

T4K71

3. High density SMT


#1, Receiver Module (Block Diagram)

AP Bridge T6WR5XBG TOSHIBA

Audio IC TC94B15WBG TOSHIBA

Receiver Units

CIS T4K71

TOSHIBA

ISP

I2S

MPHY

CSI

I2C

LDO 1.8V

TCR3DM18 Toshiba

Interface

DC/DC 1.2V

DC/DC 1.1V

LDO 2.8V

TCR3DM28 Toshiba

CSI

I2C

Specifications CIS: 2M CMOS Image Sensor Audio IC : CODEC, class G Stereo Headphone Amp


#2, 5Mpix Camera Module (Product Overview)

Specification

CMOS sensor : 5Mpixel, 1.4um, ISP integrated (P/N : JT8EV5)

Module size : 20mm x 40mm x 6.4mm

<Top View> <Bottom view> <Inside>

Schematics and Layout data will be available, after Q3/15 or the CS


#3, 13Mpix Camera Module (Product Overview)

Specification

CMOS Sensor : 13Mp, CIS, 1.12um (P/N : T4K82)

Module size : 20mm x 40mm x 7.1mm

<Top View> <Bottom view> <Inside>

Schematics and Layout data will be available, after Q3/15 or the CS


5Mpix Ara camera module Brought-up,

on a “Big Development Board”

Toshiba 5Mpix camera module

on a Big Development Board


5Mpix Ara camera module Brought-up

The first Ara camera module!

We did it!!!


Reference designs development plan

• Camera modules

• WPC module • TransferJet™ • NFC module • Memory module

Phase-1 “Basic phone function”

Phase-2 “Up-to-date Features”

Phase-3 “Unique module”

Note: The schedules above mentioned are subject to change.

CY2015 CY2016 CY2014

Done!

*Under Planning


Toshiba has opened Project Ara site in Toshiba Home Page to

support module developers

Website


Project Ara site in Toshiba Homepage


Contents


Application example page


FAQ page


TransferJet and TransferJet logos are trademarks of Sony Corporation. Wi-Fi is a registered trademark of Wi-Fi Alliance.

LETERAS and FlashAir are trademarks of Toshiba Corporation. Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba is under license.

toshiba’s reference designs for ara module...

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