tof introductionsi copyright @2020 3d technologies triangulation time of flight stereo vision...
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COVER PAGE SUBTITLE PLACEHOLDER
Copyright @Silicon Integrated
ToF IntroductionMEMS Consulting
Silicon IntegratedSep 2020
SI Copyright @2020
Mobile Face payment and E banking
Home appliance and Drones AR/VR/MR
The emerging market of 3D imaging
SI Copyright @2020
3D vision techniques – stereo vision
• Extracts the depth information by matching the
same point or pattern in two images
• Low cost in sensors
• Can add extra pattern by projector (Active stereo)
• High computation power required
• Baseline requirements
• Low frame rate
• Suffered in low illumination environment
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3D vision techniques – structure light
• Project a special pattern to the objects. Observer
the pattern distortion to re-create the objects info
• High accuracy in close objects (less than 1m)
• Good performance in low illumination
• Complex system design, especially in projector
• High system cost
• High computation power
• Relative low performance in long distance
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The working principle of ToF
Source: AMS
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3D Technologies
Triangulation Time of Flight
Stereo Vision Structure Light d-ToF i-ToF
Scenario Short distance Short distance Middle to long Short to middle
Resolution Good Good Low Medium
Host processing High High Low Medium
System cost Low High High Low
Configurability Limited by baseline Flexible Flexible
Distance range Medium Low Long Medium
Dark performance Bad Good Good Good
Sunlight performance Good Bad Good Medium
AccuracyGood in short distance,
∝ 1/d2 ConstantProportional to
distance
System complexity Medium HighLow/High in
spotLow
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ToF technology
Source: AMS
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The ToF market growth forecast
Source: Yole Development, “3D Imaging and Sensing Yole 2020
• 3D vision is still the most innovative
technology in mobile, and brings
steady growth of ToF.
• With the expected rapid growth in
coming 5 years, ToF might overtake
structure light and become
mainstream technology in consumer
market.
• The emerging applications power new
growth of ToF
• The Covid-19 will slow down the
growth of ToF but never stop.
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ToF trend in mobile
Front Camera
• Apple will still adopt SL for next generation
iPhone.
• In Android flagship, high resolution iToF has
been employed for faceID and bokeh and
became main stream.
Rear Camera
• The new iPhone Pro will adopt dToF (Lidar)
system for novel AR applications
• Android phones will use iToF in short time,
and move to dToF for high end phones
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Front Camera
• 0.3~1m with flood illumination
• VGA resolution
• High IR quality is necessary
• Narrow baseline
• Low system power
• Eye safety
• Low system cost
• Under-display is potential
The requirements of ToF in mobile
Rear Camera
• Long distance: up to 5~6m
• Multiple zone dot illumination
• Low resolution
• Ultra low system power for
long time application
• AI algorithm for resolution
reconstruction
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ToF in payment and E-banking
E-payment
• China is the biggest facial payment market in the
world and powered by policy and capital
• In coming years, the total equipment market can hit
several millions sets per year with sustainable rapid
growth.
• Currently structure light is still the dominate solution
according to the maturity of technology. Benefiting
from lower cost and system complexity, ToF
potentially becomes the more widely used technology.
• Turnkey solution is necessary
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Scenario Requirements
Small object detection and avoidance Resolution: H>300, V>30
SLAM and one-time path plan Distance up to 6.5m with wide FOV
High efficiency vacuum fps >30
Key solution Multiple-path solution
Eye safety Class-I
ToF in home robot
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ToF in AR/MR/VR
AR/MR
• ToF cameras are key components of AR/MR, and they
can bring more nature HMI experience
• In short term, the AR headset will focus on professional
and industrial market.
• The burst of AR in consumer market depends on the
application and eco-system.
• The requirements of ToF in AR:
- High resolution for accurate gesture control → 1.2M
- High fps for low latency → 60fps
- Ultra low power consumption → battery life and
heating
- High precision → millimeters
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I-ToF D-ToF
Product portfolio SIF2610 SIF2310 SIF7X10
Spatial pixel resolution VGA (640 x 480) HVGA (480 x 360) HQVGA (240 x 180)
Pixel pitch 5um 7um
Technology Process BSI
Increased modulation frequency 150MHz 100MHz NA
Ranging distance 0.2~5m 0.2~5m up to 10m
Relative accuracy & absolute accuracy 0.2% & 1% 0.5% & 1% <1%
Status ES in Q4 2020 Available and MP
Applications
SI ToF product portfolio
Front 3D in mobile，Face ID，3D modeling
Machine vision, industry, Drones
Mid to long range imaging，VSLAM，AR/MR
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SIF2310 – State of Art iToF sensor
SIF 2310
Resolution HVGA
480X360
Pixel Pitch 7.2um
Technology BSI CIS
Pixel array 3.45x2.6
Frame rate 240fps in raw
60fps in depth
Fmod Up to100MHz
Interface MIPI,TCMI
Precision (σ) <0.5%
Accuracy ~1%
Supply Voltage 3.3V, 1.8V,1.2V
Status Available
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Turnkey ToF solution by SI
VCSEL driver IC
• Driver IC customized forToF sensor
• Auto power control
• Eye safety detection
• Drive current up to 4.5A
• <1ns rising time @ 1-3A
• Biased current up to 1A
• Temperaturecompensation
ToF software suite
• Raw data to depth
• Depth imaging processing
• De-noise
• Jumping edge
• HDR
• 2D/3D mapping
• Batch calibration
• Non-linearity calibration
• Temp compensation
VGA ToF Sensor
• Resolution 640X480, 1/4”
• Backside illumination
• Pixel Size: 5um
• NIR sensitive
• 60fps depth frame
• 5m Range with 1% accuracy
• Face ID, 3D Modeling、Machine vision、AR/VR
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SI — A HIGH PERFORMANCE MIXED SIGNAL IC COMPANY
Core business◼ High resolution ToF sensor and 3D system: Production sample ready
◼ Smart audio amplifiers and sound solution：Mass production in toptier smartphone OEMs
Profile◼ Founded in 2016，HQ in Wuhan，R&D branch in Europe and America
◼ 120+FTE, 80% in R&D, 30% employee background in Europe and Japan◼ Success experience in ToF and SPAD design and process integration
◼ Strategical partnership with Chinese leading smartphone OEMs
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Team background
Management Team
• CEO：Director, top 10 IC company
• CTO：Principle architect, Broadcom
• COO：Operation specialist, Huawei
• Sales VP：Director Sales, NXP
R&D Team
Application Team
• Architect in ToF system with MP experience
• Solid optical knowledge• Algorithm: Top image lab in top
universities
Sales & Marketing
• More than 10y experience in key account management，more than $300M revenue in China mobile market
• Analog：Former NXP / IMEC / AM
S / Broadcom
• Digital：ST / Synopsys / HiSilicon
• Device experts with process development and customization
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A complete eco system
ToF Sensor 3D Camera 3D CloudGesture &
Facial ID
middleware
Application
