MEMS

Workshop Bill Bader

CEO of iNEMI

Supported by:

Agenda

• MEMS & iNEMI

• Value of Membership

• Examples of the Value of Collaboration

• Session Objectives; A Call to Action

• Agenda Review

1

iNEMI Organization

• Not for profit, highly efficient R&D consortia

– Funded by Corporate membership

– Staffed globally with permanent employees

– Led by an international board with management depth that represents a

cross section of our industry

• Membership includes 100 leading industry companies & organizations

– OEM, ODM, EMS, & Research institutes

– Supply chain equipment and material companies

– Membership is global and well balanced internationally

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Implements a full global agenda through proven collaboration

methods that deliver lasting results

3

Global Operations

• iNEMI is headquartered in Herndon, Virginia, USA.

• Opened an office in Shanghai and added a team member in Europe in 2007.

• Dr. Haley Fu is leading operations in Asia, based in Shanghai, China.

• Grace O’Malley is representing iNEMI in Europe from her base in Ireland.

4

We Accomplish This By:

• Using the roadmap to project future technology needs for

the global supply chain.

• Developing and communicating research priorities.

• Leveraging the strength of our industry leading

international membership.

• Defining and implementing science based sustainable

solutions on complex critical challenges.

• Driving high impact collaborative R&D results through

constantly improving methodologies.

iNEMI Mission: Forecast and accelerate improvements

in the Electronics Manufacturing Industry for a

sustainable future

Leadership through Innovative Projects

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• iNEMI uses a proven approach for technology road mapping that identifies gaps in the industry; and then delivers a technical plan and research priorities

• iNEMI is currently focused in four key areas:

• Miniaturization, Environment, Medical Electronics and Alternative Energy

• iNEMI has a strong track record of developing supply chains to introduce new materials, processes, and technologies into production.

• Examples: HDI (high density interconnect); Pb-Free; BFR-Free

• iNEMI has currently 20+ collaborative R&D projects in process

• They address some key gaps in areas such as Miniaturization, the Environment, Manufacturing and Test capabilities, Optoelectronics, and Medical

• Projects typically have 10-20 member companies/institutions participating

iNEMI Key Deliverables

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1. Technology roadmaps: A comprehensive industry,

member, product, and technology forecast of 10-year

needs.

2. Research priorities and programs that engage

members.

3. Forums and Workshops around the globe on key

industry issues.

4. Technology deployment projects: Timely, high impact

projects to enable results that support members’

businesses.

5. Position papers to focus industry direction.

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International Members

Across The Total Supply Chain (Mar 2012)

Key Observations:

• New members joining to participate in Environmental and Packaging Projects and

in collaborative R&D opportunities

• 170% Growth in Europe Since 1/1/2010; 60% Industry Growth Overall

• 160% Growth in University/Research Institutes Since 1/1/2010

Total Global Supply Chain Integration

The International Membership Incorporated Location; Number of Members

INEMI Member Business Type North

America Asia

Region Europe Totals

OEM 15 2 2 19

ODM/EMS (inc. pkg. & test services) 4 7 11

Material Suppliers 8 14 11 33

Equipment Suppliers 8 1 2 11

Universities & Research Institutes 8 2 3 13

Organizations/consulting 10 1 2 13

Totals 53 27 20 100

iNEMI Membership Areas of “Critical Mass” • Leading OEMs &

Semiconductors

– IBM

– HP

– Dell

– Lenovo

– Intel

– Microsoft

– Delphi

– RIM

– Cisco

– Huawei

– Alcatel Lucent

– TI

– Many Medical OEM’s

• Packaging Firms

– STATS ChipPAC

– Amkor

– ASE Group

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• Laminate/substrate suppliers

– Ibiden

– Samsung Electro Mechanics Co

– NGK/NTK

– Rogers

– Doosan

– Multek

– ITEQ

– Nanya

– Shengyi Sci. Tech.

– Endicott Interconnect Tech.

– Elec & Eltek

– Dyconex

– AT&S

• Research Institutions

• MIT Fraunhofer

• SUNY Binghampton IMEC

• Peking U ASU

• ITRI RIT

• NIST Georgia Tech

• UC Berkeley NCMS

• Purdue

• ODM/EMS firms

– Celestica

– Quanta

– Sanmina SCI

– Plexus

– Flextronics

– Foxconn

• Test Firms

– Agilent

– Asset

– Corelis

– TRI

– Teradyne

• Chemical/Adhesives/Metals

- Dow -- Nippon

- Inventec - Heraeus

- Henkel - Hitachi Chem

- Indium - NAMICS

MEMS

Increase value

through

collaboration

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Background & Current Situation Analysis

• iNEMI has been road mapping semiconductors and

packaging for 10 roadmap iterations.

• In the 2011 RM MEMS was added as a focused technology

chapter.

• Three of our product emulator groups highlighted MEMS

as a rapidly growing technology in their product lines

– Automotive

– Medical

– Portable/Consumer

• Each of these segments have very different needs and

challenges.

• We believe it is time to expand the collaborative agenda for

MEMS

Automotive MEMS; Growing Rapidly

Key Challenges are Long Life & Extreme Thermal

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Collaboration Example

• Project: Full reliability evaluation of alternative Pb Free Alloy

Finishes – 18 companies participating

– On High Reliability 24 layer PCB test samples

– Using BGA packages and selective support components

– 16 Different combinations of stress test sequences.

– On 16 different surface finishes on boards and BGA’s

– 11 total different highly accelerated test sequences

• Assembly and Test (factory and stress) services donated

• Resource average of 0.2 heads/company leveraged by a factor of

17:1 – Your company saves 17x on HC – 3.4 FTE heads; and

$425k/year at $125k/year fully burdened rate

• Material Costs (if done alone) $100k - Cost per company

participating about $6k max – Savings of $94k per company if

done alone

• And no one company could do this work alone – lack the breadth

of expertise

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Medical Electronics; The Methodology Example

• Workshops Held

– In Berlin in October 2010

– In Santa Clara in May 2011

• From those workshops we had 7 proposed medical

collaboration projects

• We have three projects now in place and working problem

solving

• Three additional teams in the initiative phase.

• Participation from across the industry in these key gaps

and issues is terrific.

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Example of iNEMI Methodology

Substrate Packaging Program

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1. Technology roadmap: 2009 Roadmap Identified the

need

2. Research priorities: 2009 Proposed need for

Research

3. Work Shop: Technical Committee Organized a

workshop in Nagoya Japan in November 2009

4. Technology deployment projects: Four Projects very

active; all moved to Phase 2 in less than 6 months –

Attacking very complex technology challenges.

Great collaborative R&D across multiple nodes of the

supply chain – 12-15 companies per project

iNEMI Initiatives and Projects

• Problems and potential team efforts must be fully defined

and work statements created that clarify scope,

deliverables, resources needed, roles.

– We call that the “initiative” phase – Participants do not need

to be iNEMI members.

• When the statement of work is fully defined and agreed to

by all team members, it is reviewed by the iNEMI Technical

Committee for approval or feedback.

• If approved, the effort become an iNEMI “Project”

– There is a call for participation open for 4-6 weeks.

• To participate in a project, you must be an iNEMI Member

– Decisions made before the end of the sign up period.

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Bottom Line

• iNEMI Collaborative R&D Works

– Rights Projects

– Right Players

– Right Targeted Results

• It will move the industry ahead

• Let’s have a great day fleshing out key challenges

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Session Speaker Company/Title Subject

Intro. & Keynotes Bill Bader CEO of iNEMI iNEMI Overview & Workshop Objective

Dr. Michael Gaitan Leader, Enabling Devices

Group, NIST

MEMS Roadmap – Key Findings

Jean-Philippe Polizzi Microsystem Program Mgr.,

CEA-Leti

R&D Challenges for MEMS

Bill Bader CEO of iNEMI

Output of iNEMI UK Workshop

MEMS Supply Chain

& Technology

Dr. Mikhail Pinelis CEO, MEMS Journal MEMS Supply Chain Challenges

Dr . Janusz Bryzek VP MEMS & Sensor

Solutions, Fairchild

Semiconductor

MEMS Technology & Product Gaps

Lunch

MEMS Reliability Mike Aldrich Reliability Eng. Group Ldr.,

MEMS & Sensor Products,

Analog Devices

Reliability Challenges for MEMS

Group Discussion on Reliability

Breakout Groups Informal Working Groups

Key Learnings; Potential key

collaborative opportunities

Report Out/Action Plan

Agenda MEMS USA Workshop 5/10/12

www.inemi.org Email contacts:

Bill Bader

bill.bader@inemi.org

Bob Pfahl

bob.pfahl@inemi.org

Grace O’Malley - Europe

gomalley@inemi.org

Haley Fu - Asia

haley.fu@inemi.org