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AN ABSTRACT OF THE THESIS OF Mark Cheng for the degree of Master of Science in Electrical and Computer Engineering presented on July 18. 2000. Title: LOW FREQUENCY 1/f NOISE OF p-MOS. BIPOLAR, AND LATERAL BIPOLAR TRANSISTORS Abstract approved: F This thesis deals with 1/f noise in p-MOS, bipolar, and lateral bipolar transistors. Experimental measurements determine the appropriate 1/f noise for MOSFET's, bipolar transistors and lateral bipolar transistors. The literature on 1/f noise in p-MOSFETs, bipolar transistors and lateral bipolar transistors is reviewed. The two main sources of low frequency 1/f noise are mobility fluctuations and number fluctuations. Our 1/f noise measurements in p- MOSFET's, bipolar transistors, and lateral pnp bipolar transistors were done at frequencies of 1 Hz and 1 KHz respectively by both the automatic and analog methods. The measurement results suggest that the number fluctuation and mobility fluctuation models are applied for short channel and long channel p-MOSFET's in the saturation region respectively. Simulations have been done using PSPICE, with Redacted for Privacy

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AN ABSTRACT OF THE THESIS OF

Mark Cheng for the degree of Master of Science in Electrical and Computer Engineering

presented on July 18. 2000.

Title: LOW FREQUENCY 1/f NOISE OF p-MOS. BIPOLAR, AND

LATERAL BIPOLAR TRANSISTORS

Abstract approved:

F

This thesis deals with 1/f noise in p-MOS, bipolar, and lateral bipolar transistors.

Experimental measurements determine the appropriate 1/f noise for MOSFET's, bipolar

transistors and lateral bipolar transistors.

The literature on 1/f noise in p-MOSFETs, bipolar transistors and lateral

bipolar transistors is reviewed. The two main sources of low frequency 1/f noise are

mobility fluctuations and number fluctuations. Our 1/f noise measurements in p-

MOSFET's, bipolar transistors, and lateral pnp bipolar transistors were done at

frequencies of 1 Hz and 1 KHz respectively by both the automatic and analog

methods. The measurement results suggest that the number fluctuation and mobility

fluctuation models are applied for short channel and long channel p-MOSFET's in

the saturation region respectively. Simulations have been done using PSPICE, with

Redacted for Privacy

noise level NLEV = 0 and device model level 3 for long channel p-MOSFET's; with

noise level NLEV = 2 and device model level 6 for short channel p-MOSFET's.

Theoretical considerations as well as experimental results show that it is possible to

take advantage of MOSFET and bipolar devices for low noise integrated circuit

applications. Research on low frequency 1/f noise in the different semiconductor

devices is very important to determine the best semiconductor structure and best noise

model for different devices. This is an especially important consideration in the

development of the integrated circuits in high-density chip area, low voltage supply,

low power consumption and low noise applications.

Copyright by Mark ChengJuly 18, 2000

All Rights Reserved

LOW FREQUENCY 1/f NOISE OF p-MOS, BIPOLAR AND LATERAL

BIPOLAR TRANSISTORS

by

Mark Cheng

A THESIS

submitted to

Oregon State University

in partial fulfillment of

the requirement for the degree of

Master of Science

Presented July 18, 2000

Commencement June, 2001

Master of Science thesis of Mark Cheng presented on July 18. 2000

APPROVED:

/

Major Professor, Engineering

Head of

Dean of

and Computer Engineering

I understand that my thesis will become part of the permanent collection of OregonState University libraries. My signature below authorizes release of my thesis to anyreader upon request.

Redacted for Privacy

Redacted for Privacy

Redacted for Privacy

Redacted for Privacy

ACKNOWLEDGEMENTS

I wish to express my special thanks and gratitude to Professor Leonard

Forbes for guiding my efforts in the right direction and providing a supporting

atmosphere for ideas to develop.

I also wish to express my great appreciation to Professor Un-Ku Moon and

Tenca Alexandre for providing the best available knowledge of analog and digital

circuit analysis and design which is relative to this project.

Thanks also to my group members, Dingming Xie, Zhunlin Zhou for their

helpful comments and cooperation.

And finally, I would like to thank the National Science Foundation Center

for the Design of Analog/Digital Integrated Circuits (CDADIC) for the generous

financial support.

This thesis is dedicated to my dearest wife, Xiaohai, for her constant

encouragement and support.

TABLE OF CONTENTS

1. Introduction

1.1 Low Frequency 1/f Noise in p-MOSFETs .1

1.2 Low Frequency 1/f Noise in PNP Bipolar Transistors ...........................3

1.3 Low Frequency 1/f Noise in Lateral PNP Bipolar Transistors .................. 5

2. Low Frequency 1/f Noise in p-MOSFETs............................................... 6

2.1 Measurement Principles .............................................................. 6

2.2 p-MOSFET 1/f Noise PSPICE Simulation ........................................ 9

2.3 Results and Discussions.............................................................. 9

3. Low Frequency 1/f Noise in Bipolar PNP Transistors................................ 18

3.1 Measurement Principles ............................................................. 18

3.2 Low Frequency 1/f Noise Models-Current Dependent Component ........... 18

3.3 Low Frequency 1/f Noise Models-Voltage Dependent Component...........27

3.4 Conclusion ............................................................................ 32

4. Low Frequency 1/f Noise in Lateral PNP Transistors ................................33

4.1 Measurement Principles.............................................................. 33

4.2 DC Characteristics of Lateral PNP Transistors.................................... 33

4.3 Results and Discussions.............................................................. 38

5. Conclusions .................................................................................44

BIBLIOGRAPHY ..........................................................................46

TABLE OF CONTENTS (Continued)

APPENDICES .51

Appendix A MATLAB Program .52Appendix B PSPICE Simulation Program for flicker noise .......................54Appendix C The sources of the PMOS and bipolar transistors ................... 56

LIST OF FIGURES

Figure pg1.1 Noise sources in bipolar transistors ...................................................... 4

2.1 Block diagram for the theory of i/f noise measurement .............................. 8

2.2 Schematic diagram of the 1/f noise measurement system in........................... 8PMOS transistors

2.3 5.tm PMOS i/f drain current noise in the frequency domain ....................... 12PMOS:W=720m,L=5.0i.tm,Vss= 12V, Vgs=5V

2.4 Measured power spectral density (PSD) i/f noise of 5p.m PMOS .................. 13transistor

2.5 Measured and simulated DC characteristics of (5, 0,6, 1.2) p.m PMOS .......... 14T ransistors

2.6 Simulated and measured drain current noise versus Idg2 ............................. 16in (5.0, 0.6, 1.2) j.im PMOS transistors

2.7 Simulated and measured input-referred voltage noise................................. 17versus drain current Li82 in the saturation region L = 5.0 p.m,0.6 p.m, 1.2 p.m PMOS respectively. (1= 1 Hz.)

3.1 Analog i/f noise pnp bipolar measurement system-i ................................. 21

3.2 Analog 1/f noise pnp bipolar measurement system-2 ................................. 21

3.3 Block diagram of i/f noise measurement in pnp bipolar transistors ................22

3.4 Hybrid-Pi small signal model of bipolar transistors...................................22

3.5 Noise model of bipolar transistors .......................................................23

3.6 Low frequency noise model of bipolar transistors..................................... 23

LIST OF FIGURES (continued)

Figure

3.7 PNP (2N2907) transistor 1/f collector current noise in frequency domain ........ 25Vce=5.15V,Ic= lmA

3.8 Mean square current 1/f noise versus collector current in pnp...................... 26and npn transistors

3.9 Analog and automatic measurements of 1/f noise in pnp ............................ 29and npn bipolar transistors

3.10 Analog and automatic measurements of 1/f noise in pnp........................... 30bipolar transistors

3.11 Analog measurements of 1/f noise in pnp and npn bipolar transistors ............31

4.1 The circuit for the 1/f noise measurements in lateral pnp transistors................36

4.2 Basic lateral pnp transistor structure in p-MOSFET's ................................37

4.3 Collector current versus base voltage of lateral bipolar transistors .................39(0.6, 1.2,5)um

4.4 Lateral pnp transistor current gain versus collector current..........................40

4.5 1/f Mean square current noise density versus collector current ......................41in lateral pnp transistors

4.6 1/f Mean square voltage noise density versus collector current .....................43in lateral pnp transistors

LOW FREQUENCY 1/f NOISE OF p-MOS, BIPOLAR ANDLATERAL BIPOLAR TRANSISTORS

1. Introduction

The objective of this thesis is to investigate the behavior of 1/f noise in p-

MOSFETs, bipolar transistors and lateral bipolar transistors using standard CMOS

technology.

1.1 Low Frequency 1/f Noise in p-MOSFETs

Among all active devices, MOSFETs show the highest 1/f noise due to their

surface conduction mechanism. This fact, together with the lack of satisfactory

theory, results in an enormous number of papers in the literature on the discussion

of 1/f noise in MOSFETs both theoretically and experimentally [1]-[41]. Several

competing theories and physical models have been proposed to explain the 1/f

noise phenomenon in MOSFETs. Although these theories and models are based on

physical mechanisms, which are different in details, they all can be considered as

modified versions of two basic 1/f-noise theories. The mobility fluctuation model

is expressed by Hooge's empirical relation and the carrier density or the number

fluctuation model is introduced by Mc Whorter [1]-[3]. In the mobility fluctuation

model, the 1/f noise is assumed to be attributed to the fluctuation in mobility of free

carriers. The model is described by the Hooge empirical equation:

2

.2lj a1

j2Nf

Where a1 is Hooge's 1/f noise parameter, Nis the total number of the carriers in the

device, and I is the short-circuit current through the device.

Base on the Hooge empirical equation, Vandamm&s theory in MOSFET

saturation region is given as following [21].

.2=

q,u1(V VT)JDS

L2f

g,, = f2PeffCox(W/l)IDS

2 q/Jf(VGS VT)Vf= a, 2effCoxf

Where .t1 is effective 1/f noise mobility which depends strongly on the bias

conditions and some new fit parameters. Re!! is effective mobility of the device

which according to Motthiessen's theorem.

In the number fluctuation model, the 1/f noise is caused by random trapping

of the mobile carriers in the traps located at the Si - Si02, interface and within the

gate oxide. The charge fluctuation results in fluctuation of the surface potential,

which in turn modulates the channel carrier density. The theory predicts an input

referred noise power, which is independent of effective gate voltage, Vgs - Vt, but

inversely proportional to the square of gate capacitance, Cox.

3

In the last four decades, a considerable number of papers have been published

dealing with 1/f noise in MOSFETs. Research has focused on resolving these two

theories, but has not provided any satisfactory resolution. Inconsistent

experimental results were reported for both the n- and p-MOSFET devices. Also,

different 1/f noise MOSFETs models were introduced in different simulation tools,

such as P SPICE and HSPICE. None of these tools has explained which model is

more appropriate for n-MOS and p-MOS, and which one is most appropriate for

use in the MOSFETs with different effective channel lengths and operation regions.

1.2 Low Frequency 1/f Noise in PNP Bipolar Transistors

The theory of low frequency 1/f noise performance of the bipolar junction

transistor has existed for many years [42]-[44]. Although the theoretical treatment

of the 1/f noise in BJT is as difficult as it is for MOSFETs, little attention has been

paid to the fact that 1/f noise of BJT's is less than that of MOSFET's. This is

mainly due to the fact that 1/f noise in BJT is several decades lower than that in

MOSFET transistors. Low frequency noise sources of BJT transistor are shown in

figure 1.1. There are two shot noise sources in BJT junction transistor. One is in

the base area, which is parallel with the base-emitter junction of the BJT. Another

is the collector shot noise source, which is parallel to the collector-emitter terminal

of the BJT. The thermal noise source is associated with the extrinsic base

resistance of the device. The low frequency 1/f noise source of the bipolar junction

4

transistor is a flicker noise generator in parallel with the emitter-base junction of

the transistor.

Note: eb: Thermal noisei: 1/f noisei: shot

Fig. 1.1 Noise sources in bipolar transistors

As mentioned in the discussion of the 1/f noise mechanisms in MOSFETs,

two fluctuation mechanisms may be responsible for the observed 1/f noise.

Researchers trying to explain the noise in bipolar transistors have also used these

two 1/f-noise models, The application of the mobility fluctuation model to BJT is

based on the Einstein relation between mobility and the diffusion constant D as D =

kT/qp, where k, T, p, and q represent the Boltsman constant, room temperature,

mobility, and electron charge respectively. The fluctuation in mobility gives rise to

fluctuation in the diffusion constant, which in turn results in fluctuation in the

diffusion current. The application of the number fluctuation 1/f noise model

assumes that the number fluctuation is due to either a generation-recombination

process in the bulk E-B depletion region, or due to the surface recombination of the

mobile carrier by the oxide traps in the Si02 above the E-B junction. Consistent

results are obtained with respect to the dc bias dependence of 1/f noise. It is shown

that the 1/f noise power spectrum in bipolar junction transistors can be expressed

as:

2 KJIBAfiff

Where kf and Ajare technology dependent parameter, IBiS base current of BJT.

1.3 Low Frequency 1/f Noise In Lateral PNP Bipolar Transistors

As is generally known, bipolar transistors usually exhibit lower 1/f noise and

higher frequency performance compared to MOSFETs. However, MOSFET

transistors can operate at very low current with high input impedance. Taking the

advantages of both bipolar and MOSFET, a new idea and a good compromise

between low cost standard CMOS technology and the advantages of excellent

performance in bipolar transistors can be achieved by using bipolar transistors

derived from MOSFET structure; this is the lateral bipolar junction transistor.

2. Low Frequency 1/f Noise in p-MOSFETs

2.1 Measurement Principles

The method for measuring 1/f noise in the semi-conductor devices is to

evaluate the physical quantity of noise, which can be the current or voltage of the

device under tested. One can characterise x (t) by using the Fourier transform

which is given below:

x2Q) = fs(f)df

s (1) 4fx(t)(t + s) cos(cus)th

Once s, (t) is measured, then power density can be calculated. The block

diagram for its measurement is shown in Figure 2.1.

From the Fig. 2.1, the 1/f noise is sampled on the output terminal of the first

block, then amplified on the second block, and only the low frequency 1/f noise is

passed by the third block. Finally it is checked with a multi-meter on the last

block. The sample data represents either voltage or current. Based upon the Fig

2.1, the circuit schematic used to measure 1/f noise in p-MOS transistors is given in

Figure 2.2.

The p-MOS transistor is connected with positive power supplies to its gate

(Vgg) and source (Vss), and the drain is connected to the ground by a load resistor.

This makes the dc component of the sample voltage drop on the load resistor as

7

small as possible. It also reduces power supply noise on the load resistor. The dc

part of the sample voltage can be canceled by common mode rejection of the input

of the op-amp. Then, the weak 1/f noise signal can be amplified by a first order op-

amp filter with a voltage gain of45 and corner frequency of 21 kHz. The digital

multi-meter sampling frequency is 26 Hz. A fourth order Butter-worth filter is

needed to provide a gain of 2 and corner frequency of 4.2 Hz to match the sample

rate of the DMM. The measurement system can provide a total voltage gain of 90

with 4.2 Hz corner frequency. The system background noise is measured by

turning off the p-MOS transistor. The data from the digital multi-meter is

transmitted to the computer via an IEEE BUS port, which is used to interface

between the multi-meter and the computer. The computer is used to set up the data

bus, set the sample rate for the multi-meter, read data, and save it to the data file.

The output 1/f current noise time domain and 1/f current noise density can be

calculated and displayed by a MATLAB program. The 1/f voltage noise density

can be processed and displayed by an EXCEL program.

Device Under Gain Low Pass DigitalTest Amplifier Filter Multi-Meter

Fig. 2.1 Block diagram for the theory of 1/f noise measurement

Fig. 2.2 Schematic diagram of the 1/f noise measurement system in PMOStransistors

9

2.2 p-MOSFET 1/f Noise PSPICE Simulation

The 1/f noise simulation was performed on PSPICE. Two of the noise

models were chosen. The PSPICE device level 3 model is used for the long

channel p-MOS simulation and the PSPICE device level 6 model is used for the

short channel p-MO S simulation in accordance with the P SPICE manual and recent

publications [1]-[41].

The simulation results of the DC characteristics, which include drain current

and transconductance, closely match the data from the tested devices. The noise

characteristics corresponding to the experimental results can be simulated using the

appropriate noise equation selector (NLEV), flicker noise exponent (AF) and

coefficient (KF) in SPICE (see Table 2.1 for details about the device models and

noise models).

2.3 Results and Discussions

Both the long channel p-MOS device (L = 5.0 p.m) and the short channel p-

MOS devices (L = 1.2 .tm and 0.6 m) were measured in the saturation regions of

operation.

An example of the 1/f noise current in the frequency domain is shown in

Fig. 2.3. The measurement is done with a 5-nm p-MOS transistor with Rload = 100

ohm, Vds = 1 1.3V and Ids = 1.53mA in the saturation region.

10

Comparing the results of the DC characteristics of the PSPICE simulations

and measurement (see Fig.2.5), we see that both of them closely match. This is a

basic condition of the noise model. The PSPICE device model level 3 is the

appropriate model for the long channel 5-urn p-MOS transistor and the PSPICE

device model level 6 is the appropriate model for the short channel transistors. The

parameters for the 5-.tm long channel P-MOS device are: TOX = 1050 A and

KP = 25 tA/V2 NLEV == 0, AF = 1.5; and the parameters for the 0.6urn and

1.2um short channel device are: TOX = 95 A, KP = 50 jiA/V2 , NLEV == 2, AF

1.0. The detail of parameters of long and short channel p-MOS are in the

Appendix-A and Appendix-B.

Fig. 2.4 shows the corresponding power spectral density (PSD) of the

measured 5-i.xm p-MOS input-referred voltage noise. The flicker noise exponent,

AF, is close to 1.5.

11

Table 2.1 p-MOSFET noise simulation

Simulation Tools PSPICELevel 3

Device SPICE level 3 (noise model default: NLEV = 2.)Level 6

Model BSIM 3.2 (noise model default: NLEV = 2)KE 1AF

Noise Noise EV = 0 I =COXLeff2fModel

ModelIn JçjJAF

NLEV=1I 2_nd C WeffLefffox

SPICE level 3

NLEV = 2 & 3 (default):

KF.g,2j2nd COXWeffLefffAF

BSIM3.2 Same as above

1010

RiI

-15u, 100CCa)I-

C-)

C-20

t,109-00C))

a-

1025 LbL102 10_i 100 101

Frequency (Hz)

Figure 2.3 5m PMOS 1/f drain current noise in the frequency domainPMOS: W =720 p.m, L =5 pm, Vss = 12 V. Vgs = 5V

12

io-9

NI

U)C0) -10vlO0ci

U)

ci

U)0Ca)0)Co

0>

CU

0U)

CCUa)

1012

IEffective gate voltage VGS-VT (V)

Figure 2.4 Measured power spectral density (PSD) 1/f noise of 5um PMOS transistor

0)0

C

0

10.1

102

-3

io

io50

5um-pmos-measurement

O.6um-pmos-measurement1 .2um-pmos-measurement

o 5um-pmos-simulationo 1 .2um-pmos-simulation

o O.6um-pmos-simulation

2 4 6 8

Geta voltage VGS (V)

Figure 2.5 Measured and simulated DC characteristics of (5, 0.6, 1.2) urn PMOS transistors

10

-a

15

Figure 2.6 shows the simulated and measured p-MOS mean square drain

current noise versus the square of the drain current in the saturation region for L =

5.0 p.m, 1.2 p.m and 0.6 p.m respectively at a frequency of 1.0 Hz. It shows that the

shorter the p-MOS transistor channel, the larger the mean square drain current

noise. It also demonstrates that the mean square drain current noise (md2) is

proportional to the square of the drain current (Ids).

Fig. 2.7 shows the corresponding simulated and measured p-MOS input-

referred voltage noise in the saturation region. It indicates that the input-referred

voltage 1/f noise from simulation also fits that of the measurement.

For both long and short channel devices, from the measured data in Fig. 2.7,

we can see that the mobility fluctuation model (NLEV = 0) is the appropriate

model for long channel devices, since the input referred voltage noise is dependent

on the drain current, and the number fluctuation model (NLEV = 2 ) is the

appropriate model for short channel devices, since the input referred voltage noise

is independent on the drain current.

To summarize the results of simulation and measurement, the 1/f noise

current density and input-referred voltage of p-MOSFET, for long channel devices,

is approximately proportional to the DC bias current 1Ds2. This implies that the 1/f

noise of the p-MOS transistor (long channel) is consistent with the mobility

fluctuation noise model, but for short channel, it is consistent with the number

fluctuation model. Also, it is apparent that short channel transistors or p-MOS

transistors with a small gate area exhibit higher 1/f noise.

1014

Ar15:IU

1)

1O

4-C

° In-17ci)I-(U

C-Cl)

C

1O

0 5um p-MOS-measurement

AO.6um p-MOS-measurement

--H 0 1.2um p-MOS-measurement

1.2um p-MOS-simulation

A O.6um p-MOS-simulation

5um p-MOS-simulation

I flHzI

j----------------r---

.......................................

Pspice Simulation: AF = 1.55um: Level 3 nlevO, KF = 7.84e-27

Simulation: AF = 1.00.6um: Level 6 nlev2 KF = 1.6e-26I .2um: Level 6 nlev2 KF = 4.3e-27

1111111 11111111 Lilt liii IL 111111 Ii 111111 I I

I O I O I O10q

i O i o i o

Drain current lds2 (A2)

Fig. 2.6 Simulated and measured drain current noise versus lds2 in 5.0, 0.6, 1.2 urn PMOS transistors

io

N=

:

a,D)Co

0>2Co

U)

CCoa)

io-9

f1.OHz:

uDf

1013

.

O.6um p-MOS-measurement

I .2um p-MOS-measurement

1 .2um p-MOS simulation

o O.6um p-MOS simulation

A 5um p-MOS-measurement

t 5um p-MOS-simulationa .a.a.i a a a .aaa.j a a p aaa.aj a a I IIpI

I O I O i O i o i o i o i o

Drain current 'Ds (A2)

Fig. 2.7 Simulated and measured input-referred voltage noise versus drain current'DS in the saturation region. L= 5um, O.6um, 1.2 urn PMOS respectively. f = 1 Hz

I L'

18

3. Low Frequency 1/f Noise in Bipolar PNP Transistors

3.1 Measurement Principles

The principles of low frequency 1/f noise measurement in bipolar devices

are the same as with 1/f noise measurement in MOSFET devices. This is shown in

Figure 2.1, "Block diagram for the theory of 1/f noise measurements" (page 8), and

Figure 2.2, "schematic diagram of 1/f noise measurement system in p-MOS

transistors" (page 8). Figure 3.1 and Figure 3.2 shows the block diagram of 1/f

noise analog measurement system for the pnp bipolar transistors. Figure 3.3 shows

the block diagram of 1/f noise automatic measurement system for the pnp bipolar

transistors.

3.2 Low Frequency 1/f Noise Models-Current Dependent Component

For system analysis, the Hybrid-Pi small signal transistor model was chosen

as for this study. (See Figure 3.4) This model provides both an accurate description

of the performance of the bipolar transistor over a wide frequency range, and

insight into the physical processes, which occur in the transistor. Figure 3.4 shows

the noise model based on the Hybrid-Pi model of the transistor. There are four

noise generators: two shot noise, one 1/f noise, and one thermal noise, which are

represented by 'b, i and eb respectively. The ib is a shot noise generator in the

base circuit and i is a shot noise generator in the collector circuit.

19

The noise expressions are as follows:

1. shot noise in the base:2

lb =2qIdf2. shot noise in the collector:

2

i =2qIdf3. thermal noise:

2

eb =4kTRBdf4. low frequency 1/f noise:

2

i., =kIdf/f

Where q: electronic charge constant, 'C collector current of BJT, 'B: base current of

BJT, 1: absolute temperature, RB: base resistor, and k: Boltzman constant.

For low frequency, the noise model of Fig. 3.5 may be considerably

simplified. At low frequency, the effects of C,1 and C are very small, and they can

be taken out of the model. Fig 3.6 shows a simplified low frequency noise small

signal-Pi bipolar transistor model. This model shows a strong correlation between

the flicker noise and non-ideal component of the base current. It was concluded

that the flicker noise could be modeled as a single noise current generator placed

between the emitter and base junctions of the device. In the formula of the low

frequency flicker noise (4), the constant K is related to the base-emitter contact

region, ii, represents the non-ideal portion of the forward base current, df is the

measurement bandwidth. The results of research shows the number fluctuation 1/f

noise model is more favorable to bipolar devices [42]-[44}. The number fluctuation

is assumed to be due to either a generation-recombination process in the bulk E-B

depletion region, or to the surface recombination of the mobile carriers by the oxide

20

traps in the Si02 above the E-B area. More recent work has suggested that trapping

at residual oxide interface, between the poly-silicon and single crystal material

contributes significantly to the noise current, and it is also known from studies of

poly-silicon resistors that grain boundary effects in the emitter can also add to the

low frequency excess noise. A summary of the noise factors shows that the most

important geometrical parameter of a BJT transistor that affects the electrical

behavior is the active emitter area, AE. The 1/f noise power spectrum in BJT can be

expressed as:

2 KJ.JBAJiff

Where Kf and Af are technological dependent parameters, and 'B is base current of

BJT.

21

+\TDD

EI3

400k C lit AnalogMeasurement

T 100 uF[

I I

System

100 ohmlOOK

Fig. 3.1 Analog 1/f noise pnp bipolar measurement system-i

+VDD

lu AnalogI Measurement

System

Fig. 3.2 Analog 1/f noise pnp bipolar measurement system-2

22

Fig. 3.3 Block diagram of 1/f noise measurement in pnp bipolar transistors

Fig 3.4 Hybrid-Pi small signal model of bipolar transistors

23

Fig 3.5 Noise model of bipolar transistors

Fig. 3.6 Low frequency noise model of bipolar transistors

24

Both npn (2N2222A) and pnp (2N2907) have been measured in the

forward active regions of operation.

An example of the 1/f noise current in the frequency domain is shown as

Figure 3.7. The measurement is done with a pnp (2N2907) bipolar transistor with

Rload = 100 ohm, V = 5.15 V and I = 1 mA in the forward active region.

Figure 3.8 shows an automatic measurement of the npn and an pnp bipolar

transistor 1/f current noise versus collector current in the forward active region at a

frequency of 1.0 Hz. It shows that the results of the 1/f noise of npn and pnp

transistor are identical with the results of 1/f noise which were calculated from the

formula. As the base current goes up, both pnp and npn 1/f noise also goes up.

1010

NI

a)U)

0CCI-

C-)

0

- i-2°0 "C.)

.4-0

1025

io i02 10_i 100 101 102

Frequency (Hz)

Figure 3.7 PNP (2N2907) transistor 1/f collector current noise in thefrequency domain (Vce = 5.15 V, Ic = 1 mA)

25

1016

N17dO

Cl)

0CI-'

1018

C .ir-l9Cobci)

1020

1

A

10

A

100

Collector current (uA)

Fig. 3.8 Mean square current 1/f noise versus collector current in pnp and npn transistors

I

27

3.3 Low Frequency 1/f Noise Models-Voltage Dependent Component

Many authors have studied the low frequency 1/f noise of bipolar transistor

current dependence model. [42]-[48] One of the original references on 1/f noise in

bipolar transistors, by E.R. Chenette et al., [48] is still used as the basis for

modeling 1/f noise in bipolar transistors (see section 3.2). However, the

publication [48] also described a component, which depended on VCE or the

collector emitter voltage, although no model or equation was given for this

component. This parts of the chapter presents the collector-emitter voltage

dependence model [46]-[47].

From the 1/f noise temperature fluctuation analysis in bipolar transistors

[46]-[47], 1/f noise mean square current can be expressed as:

i=2qI( )2(AT)2(OCth)

KT/q T w

Where 2q1 is the shot noise, and Wcth is corner frequency of 1/f noise.

Let assume both (A V/VT) and (AT/i) are constant, the result is that the 1/f

noise current spectral density is proportional to Ji/ .O. From the results of analog

measurement, the corner frequency can be obtained. Then, it is easy to calculate the

1/f noise value from the analog measurement region to the automatic measurement

region. The effective device area also can be calculated by the formula

28

A2( LV )2041(VCeI)

KT/q T a

The results of the experiments from the analog and automatic measurements

show that the corner frequencies are 40 KHz and 70 KHz respectively. The active

areas are 4.386X107 Cm2 and 4.573X107 Cm2, which corresponding with the 40

kHz and the 70 kHz frequency, are the reasonable values for these bipolar

transistors.

Figure 3.9 and Figure 3.10 show collector current 1/f noise frequency

domain for two pnp and one npn bipolar transistors in the (Vce=5.15V and

Ic= 1 mA) forward active region by analog and automatic measurement.

At a low frequency, i.e. f < 10 kHz, the transistor noise spectral density

shows the well known 1/f distribution. In the experiment, two of the 1/f noise

measurement methods are used to confirm the theory is consistent with the results

of measurement. The analog measurements focus on the frequency region from 700

Hz to 5 kHz, and automatic measurement focuses on the frequency region 0.5 Hz to

1 Hz. The results of the measurements show that the trend of 1/f noise in pnp and

npn bipolar transistors is consistent from the analog testing frequency region to the

automatic testing frequency region.

Fig. 3.11 shows the corresponding measured npn and pnp bipolar transistor

1/f noise power special current density in the forward active region at I kHz, while

maintaining the same collector current but varying collector voltage. The result

shows that 1/f noise mean square current depends on the collector voltage.

1015

.4I1O

I O

i ü

A2 = (400 * 0.41 * 5.152* 10)/(3002* 6.28 * 40k) = 1924 * 1016 cm4

I

k = 1 (mA) & VCE = 5 15 (V)

rULUuIIOLI LOL

Calculated mean square current noiseo Analog test 2N2222A Load=1 00 ohmiAutomatic test 2N2222A

I I I llIlj I IIIII I I II IIIIj I I I III

0.1 I 10 100 1000 10000 100000 1000000

Frequency (Hz)Fig. 3.9 Anolog and automatic measurements of 1/f noise in pnp and npn bipolar transistors

1015

1016

Ni: -17

U)

.SQ -18o10

1019

1 022

1023

0.1 1 10 100 1000 10000 100000 1000000

Frequency (Hz)

Fig. 3.10 Analog and automatic measurements of 1/f noise in pnp bipolar transistors 0

1016

4f17.-' luN

ci) IA-18U) IV0C

10

c -20

0U)

CCoci)

10-

I 0

1 10 100

Collector and emitter voltage VCE (V)

Fig. 3.11 Analog measurements of 1/f noise in pnp and npn bipolar transistors

32

3.4 Conclusion

In conclusion for this chapter, the results of 1/f noise measurement and

results of 1/f noise calculated from 1/f noise voltage dependence theory confirm the

1/f noise behavior of noise in bipolar junction transistors. It shows a 1/f

distribution in the low frequency region. The experimental data fits the theory very

well at some points from 1 Hz to 5 kHz low frequency 1/f noise region. However in

very low frequency region, such as f < 1 Hz, more research works should be done

to investigate that region. The 1/f noise is also depend on collector voltage which

was found in the 1/f noise measurement of bipolar transistor.

33

4. Low Frequency 1/f Noise in Lateral PNP Transistors

4.1 Measurement Principles

The principles applied for low frequency 1/f noise measurement on the

lateral pnp bipolar devices are the same as those used for 1/f noise measurement on

MOSFET devices. The only difference is the different configuration on the p-

MOSFET transistor, which turns off the p-MOS transistor and turns on the lateral

pnp devices. For the system configuration, refer to Figure 2.1 "Block diagram for

the theory 1/f noise measurements" (page 8), and Figure 2.2 "Schematic diagram

the 1/f noise measurement system in p-MOSFET transistors" (page 8). Figure 4.1

shows the block diagram of 1/f noise measurement system for lateral pnp bipolar

transistors.

Figure 4.1 presents the lateral pnp device in long channel p-MOSFET

transistors. The configuration of lateral pnp for the short channel p-MOSFET

transistors is the same as that of long channels ones.

4.2 DC Characteristics of Lateral PNP Transistors

Figure 4.2 shows the basic structure of the lateral pnp bipolar transistor,

which includes one lateral and two vertical parasitic bipolar transistors that are

inherently available in standard CMOS technology. Considering standard CMOS

technology, the typical structure of a lateral pnp transistor is depicted in Figure 4.2.

34

In addition to the horizontal lateral transistor, two vertical parasitic devices can be

identified in this composite structure. If the lateral transistor is biased in its forward

region, one of the vertical transistors will work in the forward region. Due to fact

that the substrate is always tied to the most negative voltage in the circuits, the

holes injected from the emitter region toward the n-well, which plays the role of the

base for both the lateral and vertical pnp, will be just partially collected at the

collector terminal of the lateral device. In fact, an appreciable fraction of them will

reach the collector of the vertical transistor, that is the substrate. Due to the

physical structure of CMOS, there are three input terminal protection diodes. In

order to make the lateral pnp work correctly, the configuration of the system will

have to solve two problems: First, the p-MOS is approximately turned off, and

second, all of the protection diodes should be close to cut off. A small DC bias

source is used to obtain the bias conditions described above. The total 1/f noise of

the lateral pnp in p-MOSFET transistor, should include the noise coming from one

of the horizontal lateral pnp and one of two vertical pnp's and depends on the

circuit bias set up.

Details of the DC bias set up of the 1/f noise measurements for lateral pnp

transistors are shown in Fig. 4.1 and Fig 4.2. From the circuit DC set up, the

emitter connects to the positive power supply, the collector connects to ground, the

base is connected through a resistor to ground, and the substrate connect to

collector. For the horizontal lateral pnp transistor, emitter is connected to VDD,

and the base voltage is about 0.7 volts lower than the emitter. The base-emitter

35

junction is forward biased, and base-collector junction is reverse biased. This puts

the lateral pnp operating in the forward active region. For left side vertical lateral

pnp, the emitter is connected to VDD, the substrate is connected to the collector,

and the base is set to about 0.7 volts lower than the emitter, the pnp transistor is

operating in the forward active region. For the right side vertical lateral pnp

transistor, the emitter is connected to ground, the base voltage is higher than the

emitter, and the substrate is connected to the collector. This lateral pnp is in the cut

off region. The total 1/f noise sample from the lateral pnp should include the

horizontal lateral pnp and one of the vertical lateral pnp transistors. The most of the

1/f noise in this lateral pnp structure come from the horizontal lateral pnp. The

reasons are as follow: n-well, source and drain form the horizontal lateral pnp;

source or drain, n-well and substrate form the vertical lateral pnp. The vertical

conduction current is much smaller than that of the horizontal one.

Rb

Gnd

- 1.5V+

+VDD

Gate (Pin 10)

Base. (Pin 14)

Collector (Pin 11)

Emitter ( Pin 12)

Substrate ( Pin 7)

1K

36

Note: 1. For turn off the p-MOS, V1 1.4V, Vos <VT : Let VGB= O.4VSince VEB = O.7V VEG = O.7V-O.4V = O.3V, p-MOS is in cutoff region.

2. Since VBG = O.4V, the protection diode between the gate toN-well is cut off.

Fig. 4.1 The circuit for 1/f noise measurements in lateral pnp transistors

Source Gate DrainSubstrat (Emitter) (Collector)

......:::::::::::.

I IP !I P+

....................Base

P

p-substrate

37

Bulk(Base)

N-well

1, Lateral bipolar transistor: Emitter (source), Collector (drain), Base (N-well)2. Vertical parasitic bipolar transistor: Emitter (source), Collector (P-sub.), Base (N-well)3. Vertical parasitic bipolar transistor: Emitter (drain), Collector (P-sub.), Base (N-well)

Fig. 4.2 Basic lateral pnp transistor structure in p-MOSFET's

38

4.3 Results and Discussions

Figure 4.3 is the plot of the lateral pnp collector current versus base voltage

using 5um, O.6um and 1 .2um p-MOS devices. The plot shows the basic DC

characteristic of the pnp bipolar transistor.

Figure 4.4. is the plot of lateral pnp gain versus base resister using 5um,

O.6um and 1 .2um p-MOS devices. This plot shows the gain results of the lateral

pnp configuration in the p-MOS devices.

Figure 4.5 shows 1/f noise current density of the lateral pnp in p-MOS. It

compares the results of a commercial pnp device (2N2907) and long and short

channel p-MOSFET devices (CD-4007, Bpm 106 and Bpml 12 which are 5um,

0.6um and 1 .2um respectively).

10-

io

110.4

io

1O.61

0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85

Base voltage VBE (V)

Fig. 4.3 Collector current versus base voltage of lateral pnp transistors (0.6, 1.2, 5 ) urn

LI'J

(I)

0U)

U)

0C

CDI-a)4-,CD

9-0CCo

0

100

10

I

io io io io

Collect current I (A)

Fig. 4.4 Lateral pnp transistor current gain versus collector current

102

C

1014

1O

I..)liIllil 111111111 liii 11111 lIllilIll IlillIll Ill trill Ii 1111111

I41

1 I O I O i o i o i o i

Collect current Ic2 (A2)

Fig. 45 1/f Mean square current noise density versus collector current in lateral pnp transistors

io

42

Figure 4.6 shows the output noise current referred to input as a 1/f noise

voltage density of lateral pnp transistors in p-MOS devices.

The lateral pnp, which is built into the long and short channel p-MOS

devices has low 1/f noise when compared to the 1/f noise of original p-MOS

products (see Figure 4.5 ). The results of 1/f noise measurement show that the

lateral pnp is two to three orders in magnitude lower in both noise current density

and output referred to gate noise voltage density than that of the MOSFET. The

behaviour of 1/f noise and DC characteristics of the lateral pnp transistors means

that the lateral pnp can be applied in low power, low voltage circuits which use

standard CMOS structures. The results of these measurements show that a good

lateral bipolar transistor is available in any CMOS technology. Pure bipolar action

in a lateral pnp MOSFET structure has been illustrated and the operation of a

lateral pnp transistor has been demonstrated.

io-g

Ri' jr-10II'-,(N>(N

>z1O

>%

Cl)

C1)

0G) 1rr12Q)

0Cci)

1O

1015

5urnLateralp-MOS -:0 O.6um Lateral p-MOS0 1 .2um Lateral p-MOS0 pnp bipolar 2N2907.5ump-MOSa1.2um p-MOS.O6um p-MOs

Jn

+ ---------------------------------------

f=1.OHzI

10h1 10b0 108 iO io io

Collector current Ic2 (A2)

Fig. 4.6 1/f Mean square voltage noise density versus collector current in lateral pnp transistors

io-4 io

44

Chapter 5 Conclusions

In this thesis, a If noise analysis is performed for three different

technologies: the MOSFETs, the standard bipolar transistors and the lateral pnp

bipolar transistors. From these analyses, the theoretical lowest limits of 1/f noise

levels can be achieved by the three different technologies. In order to obtain insight

into the details of the noise behavior of MOSFET transistors and BJT transistors,

both theoretical and experimental studies of 1/f noise in MOSFET and BJT are

presented. The emphasis has been to compare the results of tests with theory,

analyze them, and to draw conclusions.

Summary two of basic 1/f noise theory in MOSFET, the carrier number

fluctuation theory predicts an input referred 1/f noise power which is independent

of the effective gate voltage, but inversely proportional to the capacitance, Cox. It

is given by the PSPICE level two 1/f noise equation (NLEV = 2); the mobility

fluctuation theory predict an input referred 1/f noise power which is dependent of

the effective gate voltage, inversely proportional to the gate capacitance, Cox. It is

given by the PSPICE level zero 1/f noise equation (NILEV = 0). The results of 1/f

noise measurement and simulation indicate that the low frequency 1/f noise in long

channel p-MOSFETs is proportional effective gate voltage and the low frequency

1/f noise in short channel p-MOSFET do not depend on the effective gate voltage.

This suggests that the flicker noise in long channel p-MOSFETs follows the

mobility fluctuation and the flicker noise in short channel p-MOSFETs follows

45

carrier density fluctuation. The reason of the two different results for the long and

short channel p-MOSFETs structure might be because of the short channel effect.

For the bipolar transistor, the 1/f noise is assumed to be due to the surface

recombination of the mobile carriers by the oxide traps in the SiO2 above the E-B

junction or due to a generation-recombination process in the bulk E-B depletion

region. Since in the modem BJT transistors the total base current flows mainly in

the bulk region, the surface 1/f noise is much smaller than the generation-

recombination 1/f noise, so that the surface 1/f noise can be neglected. Therefore

the 1/f noise power spectral density of bipolar transistor depend on the magnitude

of the base current, on the area of the emitter, and on the base width.

Our results of 1/f noise measurement in bipolar transistor shows that 1/f noise

in bipolar transistor is strongly dependent of the base current or collector current.

This is the basic 1/f noise current dependence model in bipolar transistor. On the

other hand, the data from our measurement also indicates that 1/f noise in bipolar

transistor not only depends on the collector current but also depends on the

collector voltage in the frequency region 1 Hz to 1 KHz.

The measurement of 1/f noise in lateral pnp bipolar transistors in CMOS

technology is discussed. It shows that the lateral bipolar transistor has the

advantage of lower 1/f noise compared to the CMOS devices. The measurements

also give the 1/f noise dependence of discrete bipolar transistors and show that they

are comparable.

46

BIBLOGRAPHY

[1] A. L. McWhorter, "1/fnoise and germanium surface properties," SemiconductorSurface Physics, R.H. Kingston, Ed., Philadelphia, PA: Univ. of Pennsylvania Press,pp. 207-228, 1957.

[2] F. N. Hooge, "1/fnoise is no surface effect," Phys. Lelt., vol. A-29, pp. 139-140,1969.

[3] F. N. Hooge, "1/f noise," Physica, vol. 83B, pp. 14-23, 1976.

[4] L. K. J. Vandamme and H. M. M. Werd, "1/fnoise model for MOSTs biased innonohmic region," Solid-State Electronics, vol. 23, pp. 325-3 29, 1980.

[5] H. S. Park, A. Van Der Ziel and S. T. Liu, "Comparison of two 1/f noise models inMOSFETs," Solid-State Electronics, vol. 25, no. 3, pp. 213-217, 1982.

[6] G. Reimbold, "Modified 1/f trapping noise theory and experiments in MOStransistors biased from weak to strong inversion-influence of interface states," IEEETransactions on Electron Devices, vol. ED-31, no. 9, pp.1190-1 198, Sept. 1984.

[7] G. Nicollini, D. Pancini and S. Pernici, "Simulation-oriented noise model for MOSdevices," IEEE Journal of Solid-State Circuits, vol. SC-22, no. 6, pp. 1209-12 12,Dec. 1987.

[8] Y. Tsividis, "Operation and modeling of the MOS transistor," McGraw- Hill Inc., pp.340, 1987.

[9] A. van der Ziel, "Unified presentation of 1/fnoise in electronic devices: Fundamental1/f noise sources," Proc. IEEE, vol. 76, no. 3, pp.233-258, March 1988.

[10] K. K. Hung and P. K. Ko, "A Unified Model For the Flicker Noise in Metal-OxideSemiconductor Field-Effect Transistors," IEEE Transactions On ElectronDevices, vol. 37, no. 3, pp. 654-664 March 1990.

[11] T. Elewa and B. Boukriss, "Low-frequency noise in depletion-mode DIMOXMOS transistors," IEEE Transactions on Electron Devices, vol. 38, no. 2, pp. 323-327, Feb. 1991.

[12] J. T. Hsu and J. Wang, "Flicker noise in thin film depleted SOT MOSFETS," IEEEDevice Research Conference, pp. 30-3 1, 1991.

47

[13] S. Fang and J. P. McVittie, "Thin-oxide damage from gate charging during plasmaprocessing," IEEE Electron Device Letters, vol. 13, no. 5, pp. 288-290, May 1992.

[14] C. H. Cheng and C. Surya, "The effect of hot-electron injection on the propertiesof flicker noise in n-channel MOSFETs," Solid-State Electronics, vol. 36, no. 3,pp. 475-479, 1993.

[15] D. M. Fleetwood and P. S. Winokur, "Effects of oxide traps, interface traps, andborder traps on metal-oxide-semiconductor devices," J. Appl. Phys, vol. 73, no.10, pp. 5058-5072, May 15, 1993.

[16] M. Tsai and T. Ma, "1/fnoise in hot-carrier damaged MOSFET's: effects of oxidecharge and interface traps," IEEE Electron Device Letters, vol. 14, no. 5, May 1993.

[17] P. R. Gray and R. G. Meyer, "Analysis and Design of Analog Integrated Circuits,"Third edition, John Wiley & Sons, Inc., 1993.

[18] D. M. Fleetwood, 1. L. Meisenheimer and J. H. Scofield, "1/fnoise and radiationeffects in MOS devices," IEEE Trans. on Electron Devices, vol. 41, no. 11, pp.1953-1964, Nov. 1994.

[19] J. Chang, A. A. Abidi and C. R. Viswanathan, "Flicker noise in CMOS transistorsfrom subthreshold to strong inversion at various temperatures," IEEE Trans. onElectron Devices, vol. 41, no. 11, pp. 1965-1971, Nov. 1994.

[20] J. H. Scofield and N. Borland, "Reconciliation of different gate-voltagedependencies of 1/fnoise in n-MOS and p-MOS transistors," IEEE Transactionson Electron Devices, vol. 41, no. 11, pp. 1946-1952, Nov. 1994.

[21] L. K. J. Vandamme, X. Li and D. Rigaud, "1/fnoise in MOS devices, mobility ornumber fluctuations," IEEE Trans. on Electron Devices, vol. 41, no. 11, pp. 1936-1944, Nov. 1994.

[22] C. Hu and G. P. Li, "Low-frequency noise considerations for MOSFET analogcircuits," Abst. IEEE Device Research Conf, Charlottesville, VA, pp. 16-17, 1995.

[23] C. Hu, J. Zhao, G. P. Li, P. Liu, E. Worley, J. White and R. Kjar, "The effects ofplasma etching induced gate oxide degradation on MOSFET's 1/f Noise," IEEEElectron Device Letts., vol. 16, no. 2, pp. 61-63, Feb. 1995.

[24] E. Simoen and C. Claeys, "Correlation Between the Low-Frequency Noise SpectralDensity and the Static Device Parameters of Silicon-on-Insulator MOSFET's," IEEETrans. on Electron Devices, vol. 42, no. 8, pp. 1467-1472, Aug. 1995.

48

[25] M. Aoki and M. Kato, "Hole-induced 1/f noise increase in MOS transistors," IEEEElectron Device Letis., vol. 17, no. 3, pp. 118-120, March 1996.

[26] N. Lukyanchikova, M. Petrichuk, N. Garbar, E. Simoen and C. Claeys, "Back andfront interface related generation-recombination noise in buried-channel SOl p-MOSFET's, "IEEE Transactions on Electron Devices, vol. 43, no. 3, pp. 4 17-423,March 1996.

[27] J. A. Babcock, W. M. Huang, J. M. Ford, D. Ngo, D. J. Sponsor and S. Cheng,"Low-frequency noise dependence of TFSOI BiCMOS for low power RF mixed-model applications," IEEE mt. Electron Device Meeting, pp. 133-136, 1996.

[28] S. S. Chen and S. C. Lin, "Kink effect on subthreshold current conductionmechanism for n-Channel metal-oxide-silicon devices," J. App!. Phys, vol. 80, no.10, pp. 5821-5827, Nov. 15, 1996.

[29] C. Hu, G. P. Li, E. Worley and J. White, "Consideration of low-frequency noise inMOSFET's for analog performance," IEEE Electron Device Letts., vol. 17, no. 12,pp. 552-554, Dec. 1996.

[30] E. Simoen and C. Claeys, "The low-frequency noise behavior of silicon-on-insulatortechnologies," Solid-State Electronics, vol. 39, no.7, pp. 949-960, 1996.

[31] HSPICE User's Manual, Meta-Software, Inc., 1996.

[32] J. A. Babcock, C. E. Gill, J. M. Ford, D. Ngo, E. Spears, J. Ma, H. Liang, D. J.Spooner and S. Cheng, "1/f noise in graded-channel MOSFET's for low-powerlow-cost RFIC's," Abst. IEEE Device Research Conf, Fort Collins, pp. 122-123,1997.

[33] T. Boutchacha, G. Ghibando, G. Guegan and T. Skotnicki, "Low frequency noisecharacterization of 0.18 urn Si CMOS transistors," Microelectron Reliab., vol. 37,no. 10/11, pp. 1599-1602, 1997.

[34] T.Boutchacha, G. Ghibando, G. Guegan and M. Haond, "Low frequency noisecharacterization of 0.25 urn Si CMOS transistors," .1. of Non-Crystalline Solids, vol.216, pp. 192-197, 1997.

[35] M. J. Chen and J. S. Ho, "A three-parameter-only MOSFET subthreshold currentCAD model considering back-gate bias and process variation," IEEE Trans. onComputer-Aided Design of Integrated Circuits and System, vol. 16, no. 4, pp. 343-352, April 1997.

49

[36] Daniel P. Foty, "MOSFET modeling with SPICE: principles and practice,"Prentice-Hall, Inc., 1997.

[37] PSPICE Manual, Version 8.0, MicroSim Corporation, June 1997.

[38] C.T. Liu, D. Misra, K. P. Cheung, G. B. Alers, C. P. Chang, J. I. Colonell, W. Lai, C.S. Pai, R. Liu and J. 1. Clemens, "Reduced 1/f noise and gm degradation for sub-0.25um MOSFETs with 25 -50 gate oxides grown on nitrogen implanted siliconsubstrates," A bst. IEEE Device Research Conference, Fort Collins, CO. pp. 124-125,1997.

[39] J. A. Babcock, D. K. Schroder and Y. Tseng, "Low-frequency noise in nearly-fully-depleted TFSOI MOSFET's," IEEE Electron Device Letts., vol. 19, no.2, pp. 40-43,Feb. 1998.

[40] C. Jakobson, I. Bloom and Y. Nemirovsky, "1/f noise in CMOS transistors foranalog applications from subthreshold to saturation," Solid-State Electronics, vol.42. no. 10, pp. 1807-1817, 1998.

[41] T. Wang and L. P. Chiang, "Characterization of various stress-induced oxidetraps in MOSFET's by using a subthreshold transient current technique," IEEETrans. on Electron Devices, vol. 45, no. 8, pp. 179 1-1796, Aug. 1998.

[42] R C. Jaeger, "Low-Frequency Noise sources in Bipolar Junction Transistors,"IEEE Trans on Electron Devices, vol. ED-17, no. 2, pp 126-134, Feb. 1970.

[43] Michael Stoisiek and Dietrich Wolf, "Origin of noise in Bipolar Transistors, "IEEETrans on Electron Devices, vol. ED-27, no. 9, pp 1753-1756, Sep. 1980.

[44] Mario Conti, "Surface and bulk effects in Low Frequency Noise in NPN PlanarTransistors, "Solid-State Electronics, Pergamon Press, vol. 13. pp. 1461-1469,1970.

[45] W. Timothy Hoiman and J. Alvin Connelly, "A Compact Low Noise OperationalAmplifier for a 1.2 tm Digital CMOS Technology, " IEEE Journal of SolidCircuits, vol. 30, no. 6, pp 710-714, June. 1995.

[46] L. Forbes, " 1/f noise due to temperature fluctuations in heat conduction, "IEEEDevice Research Conference, Santa Barbara, pp. 46-47, June. 1996.

[47] L. Forbes, M.S. Choi and W. Cao," 1/f noise due to temperature fluctuations in heatconduction in bipolar transistors, "Microelectronic Reliability, Vol. 39, No. 9, pp.1357-1364, 1999.

50

[48] J.L. Plumb and E.R. Chenette, "Flicker noise in transistors, "IEEE Trans onElectron Devices, vol. ED-b, pp. 304-308, 1963.

51

APPENDICES

52

The following programs have been used in this research to deal with the

measured noise data and the SPICE simulations.

Appendix A MATLAB Program

This program collects the Digital Multimeter (DMM) data, which is in the

form of voltage variation (unit, V) at the drain of the PMOS transistor in time domain,

and then changes it to the drain current noise (A2IHz) by doing the fast Fourier

transform (FFT). The results were plotted in frequency domain ranging from about

0.01 Hz to 4.2 Hz. Then the average drain current noise at the 1.0 Hz of frequency was

obtained by reading from the figure. There are some notes in the program to help to

understand the program.

% PSD of pmos 1/f noise% data is taken from experimental research lab

clear all; close all

load 'plO6tla7.dat' % PMOS data from Digital Multimeter

Vout plO6tla7; % Unit = Vdate = '6/29/99'; % the date when data is taken

fs=26; % the sampling rate of DI4Ngain=90; % noise amplification ratio by LM741Rload=l0O; % load resistorVnoise = Vout./gain; % PMOS drain voltage noise (V)Inoise = ( Vnoise./Rload); % PMOS drain current noise (A)L = length(Inoise); % L is also a window size. As L get

% larger, the magnitude of fft gets% closer to theoritical val

%SETUP AXISf = fs ( O:1/L:l-1/L ); % up to f=fs (Hz)f = f(1:L/2); % up to fs/2

53

time(O:L-1)/fs;%PSD of NOISEmag = (1/(L*fsfl*abs(mag = mag(1:L/2);

figure (1)

% unit = S

fft(Inoise) ) ."2; % unit = A2/Hz% the desired mean square% drain current noise

% two figures in one page

subplot(2,1,1); % DMM output in time domainplot(time,Vout); grid on;axis([O,200,-O.024,-O.O18]); % axis need to adjusttitle(sprintf('%s (%d pts, %s) ',L,date))xlabel('Time (S)'); % label of the X axisylabel('DMM output (V)'); % label of the Y axiszoom on

subplot (2,1,2);% measured mean square drain current noise in% frquency domain (A2/Hz)

loglog(f,mag,'r'), hold on, grid on,axis([O.O1,1O,le-20,1e--13]); %axis need to adjusttitle('PSD of PMOS Darin Current Noise (A'2/Hz) at

Vgs=2 . 5v')

xlabel ('Frequency (Hz) ');ylabel('PSD of PMOS drain current noise (A''2/Hz)');hold on,loglog(f,le-16./f/'1,'b-.'), % 1/f noise linezoom ongm = 3.9e-3; % measured when Vgs = 4 V for 5-urn PMOSmagi = mag./gm/'2; % change to input-referred noise

figure (2);% measured input-referred voltage noise in frequency% domain (A2/Hz)

loglog(f,magl,'r'), hold on, grid on,axis([O.O1,1O,le-14,le-7]); %axis need to adjusttitle('Power spectral density (PSD) of measured PMOS

input-referred noise.');xlabel('Frequency (Hz)');ylabel (Measured PMOS noise (V"2/Hz) ');hold on,loglog(f,3e-11./f/'1, 'b-.'), % 1/f noise linezoom on

HOLD OFF

54

Appendix B PSPICE Simulation Program for flicker noise

The following programs are used to simulate the 0.6-urn, 1.2-urn and 5-urn

PMOS flicker noise by PSPICE level 6 and level 3. First of all, the transistor DC

characteristics, including the drain current, Ids, and the transconductance, grn, are

matched to the experimental measured data by adjusting the parameters in the PSPICE

rnodels, such as the oxide thickness, TOX, and the intrinsic transconductance

parameter, KP. After that, the noise characteristics can be simulated according to the

noise experirnental results using the appropriate noise equation selector (NLEV),

flicker noise exponent (AF) and coefficient (KF) in PSPICE.

The output file of the PSPICE simulation does not directly give the mean

square drain current noise (md2) and the input-referred voltage noise (Vng2). It gives

the value of FN (output flicker noise at the drain node, V2IHz). We can calculate the

drain current noise and the input-referred voltage noise by the following:

FN(V2 1Hz)42 1Hz) Rload2(12)1nd '/

where Rload is the drain load resistance. In our case, its value is 100 ohms,

2r 2/liz)1nd './V(V2lHz)= gm2(lIc2)

and where gm can be obtained directly from the output file of the PSPICE simulation.

This program is used to simulate the 0.6 urn PMOS flicker noise by PSPICE level 6.

VDD 4 0 dc=-5V % DC power supply at the drain nodeVGS 1 0 dc=-2V ac=1V % DC, AC power supply at the gatenodeRg 1 2 1K % resistive load at the gate nodeRd 3 4 100 % resistive load at the drain nodeCgs 2 0 lOOu % additional gate-source capacitance

ml 3 2 0 0 mosni l=0.6u w=30.8u % PMOS netlist

.MODEL mosni PMOS level=6 tox=95.Oe-lO vto=-0.7v kp=50e-06 % main parameters of DC characteristics

+ nlev=2 af=l kf=2.84e-27.ac dec 100 .01 2.NOISE V(3,0) VGS 10.dc VGS 1 3 0.5.probe % write all.op % calculate

% voltages

55

% noise model parameters% AC analysis% noise analysis% DC analysisanalysis data to output fileand print all dc nodeand voltage source currents

.END % end of PSPICE simulation input file

This program is used to simulate the 1.2 um PMOS flicker noise by PSPICE level 6.

VDD 4 0 dc=-5V % DC power supply at the drain node

VGS 1 0 dc=-2V ac=1V % DC, AC power supply at the gatenodeRg 1 2 1K % resistive load at the gate nodeRd 4 3 100 % resistive load at the drain nodeCgs 2 0 lOOu % additional gate-source capacitance

ml 3 2 0 0 mosni ll.2u w=30.8u % PMOS netlist

.MODEL mosni PMOS level=6 tox=95.Oe-l0 vto=-0.7v kp=50e-06 % main parameters of DC characteristics

+ nlev=2 af=l kf=4.3e-27.ac dec 100 .01 2.NOISE V(3,0) VGS 10.dc VGS 1 3 0.5.probe % write all.op % calculate

% voltages

% noise model parameters% AC analysis% noise analysis% DC analysisanalysis data to output fileand print all dc nodeand voltage source currents

.END % end of PSPICE simulation input file

This program is used to simulate the 5 urn PMOS flicker noise by PSPICE level 3.

VDD 4 0 dc=-12V % DC power supply at the drain node

56

VGS 1 0 dc=-9V ac=1 % DC, AC power supply at the gatenodeRg 1 2 1K % resistive load at the gate nodeRd 4 3 100 % resistive load at the drain nodeCgs 2 0 lOOu % additional gate-source capacitance

ml 3 2 0 0 mosni l=5u w=480u % PMOS netlist

.MODEL mosni PMOS level=3 tox=1050e-10 vto=-1.4v kp=6.7e-06 % main parameters of DC characteristics

+ nlev=0 af=1.5.ac dec 100 .01.NOISE V(3,0) V.dc VGS 1 3 0.5.probe %

.op %00

kf=2.84e-27 % noise model parameters2 % AC analysisGS 10 % noise analysis

% DC analysiswrite all analysis data to output filecalculate and print all dc nodevoltages and voltage source currents

.END % end of PSPICE simulation input file

Appendix C The sources of the PMOS and bipolar transistors

2N4403 small signal transistors (PNP) General Semiconductor

MP52907 small signal transistors (PNP) General Semiconductor

M1PS2222A small signal transistors (NPN) General Semiconductor

CD4007M complementary pair plus inverter National Semiconductor

BPM1O6t1 0.6 um PMOS Seattle Silicon

BPM1 12t1 1.2 um PMOS Seattle Silicon