thin film passive components: world markets, technologies & opportunities: 2016-2021
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About The Report This Paumanok Market Research Report Offers a Deep Dive Into the Global Market for Thin
Film Capacitors, Resistors, Inductors and
Integrated Passive Devices.
Report Overview: 2016
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• This is a 350 page detailed global market analysis with 105 Figures and Graphs on thin film passive components, including thin film capacitors, thin film resistors and thin film inductors and thin film integrated passive devices.
• This study has all the basic aspects of a market research report including the value of global demand by passive component type, world region and end-‐use market segment, with detailed compeHHve analysis, market shares and forecasts to 2021.
• The study contains a detailed technical analysis of processes and electronic materials and includes discussions on compeHHon with the thick film establishment and the clear direcHonal movement toward thin film materials processing for high frequency circuits above 3 Ghz in automoHve connecHvity and the internet of things; and for new levels of volumetric efficiency down to 008004 EIA (Inches) case size (0201mm).
Thin Film Passive Components World Markets, Technologies & OpportuniHes: 2016-‐2021 Pages 355 Tables & Graphs 105 Price: $3750.00 USD Published August 2016 ISBN # 1-‐893211-‐90-‐8 (THINFILMCRL2016) Published by Paumanok PublicaQons, Inc. 502 Ballad Creek Court Cary, NC 27519 USA (919) 468-‐0384 (919) 468-‐0386 Fax [email protected] www.paumanokgroup.com
©1988-‐2016 Paumanok PublicaQons, Inc., includes the Industrial Market Research Division for Capacitors, Resistors, Inductors and Circuit ProtecQon Devices; The Mergers & AcquisiQons Due Diligence Division; The Single Client ConsulQng Division; The On-‐Site PresentaQon/Seminar and Events Division; The Monthly Report (MLCC, Chip Resistor and Tantalum Capacitor Supply Chain Monitoring); The Specialty Markets (Defense, Medical, Mining and AutomoQve Power); and 75% Ownership of Passive Component Industry Magazine.
©2016 by Dennis M. Zogbi; Photograph Taken From SWA Flight Over Great Smokie Mtns Tennessee.
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Thin Film Passive Components World Markets, Technologies & OpportuniHes: 2016-‐2021 Table of Contents ExecuQve Summary & World Market Overview on Thin Film CRL (Pages 27 to 59)
-‐This secQon of the report combined together all appendixes into one concise global market overview for thin film passive components by type, world region, end-‐use market segment; compeQQve landscape, overall share data and overall forecasts to 2021. This secQon also describes the processes for thin film passive component producQon and integraQon including technology plahorm and materials development.
Appendix I: Thin Film Capacitors (Pages 61 to 94) A detailed global analysis of the thin film specialty ceramic chip capacitor markets for applicaQons at high frequency, including value of demand by world region and end-‐use market segment, compeQQve landscape, market shares and forecasts to 2021.
Appendix II: Thin Film Resistors and Integrated Passive Components (Pages 93 to 159) A detailed global analysis for thin film Nicr and TaN film resistors and integrated passive devices employing a myriad of electronic materials. This secQon includes value of demand by type and world region and end-‐use market segment, compeQQve landscape, market shares and forecasts to 2021.
Appendix III: Thin Film Inductors (Pages 161 to 258) A detailed global analysis for thin film ceramic inductors. This secQon includes value of demand by type and world region and end-‐use market segment, compeQQve landscape, market shares and forecasts to 2021.
Producer Profiles (Pages 259 to 350): A detailed compeQQve analysis of 51 known manufacturers of thin film passive electronic components for FY 2017.
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List of Tables and Graphs:
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FIGURE'1:'GLOBAL'THIN'FILM'PASSIVE'ELECTRONIC'COMPONENT'MARKET'VALUE'BY'COMPONENT'TYPE'(CAPACITORS,'RESISTORS,'INDUCTORS):'FY'2016'................................................................................................................................................................................................................'27'
FIGURE'2:'GLOBAL'THIN'FILM'PASSIVE'ELECTRONIC'COMPONENT'MARKET'VALUE'BY'WORLD'REGION'(CAPACITORS,'RESISTORS,'INDUCTORS):'FY'2016'..........................................................................................................................................................................................................................................'31'
FIGURE'3:'GLOBAL'THIN'FILM'PASSIVE'ELECTRONIC'COMPONENT'MARKET'VALUE'BY'THIN'FILM'COMPONENT'TYPE'AND'WORLD'REGION'(CAPACITORS,'RESISTORS,'INDUCTORS):'FY'2016'..........................................................................................................................................................................'33'
FIGURE'4:'GLOBAL'THIN'FILM'PASSIVE'ELECTRONIC'COMPONENT'MARKET'VALUE'BY'ENDDUSE'MARKET'SEGMENT'(CAPACITORS,'RESISTORS,'INDUCTORS):'FY'2016'................................................................................................................................................................................................................'36'
FIGURE'5:'GLOBAL'THIN'FILM'PASSIVE'ELECTRONIC'COMPONENT'VENDORS:'COMPETITIVE'ANALYSIS'AND'MARKET'SHARES'BY'COMPONENT'TYPE:'FY'2016'.................................................................................................................................................................................................................................'38'
FIGURE'6:'GLOBAL'THIN'FILM'PASSIVE'ELECTRONIC'COMPONENT'VENDORS:'OVERALL'SHARE'DATA:'FY'2016'...............................................................................................................'39'FIGURE'7:'PRODUCT'MARKETS'FOR'CERAMIC'CAPACITORS'IN'THE'1'TO'2.9'GHZ'RANGE'........................................................................................................................................................'41'FIGURE'8:'PRODUCT'MARKETS'FOR'CERAMIC'CAPACITORS'IN'THE'3.0'TO'30'GHZ'RANGE'.....................................................................................................................................................'43'FIGURE'9:'PRODUCT'MARKETS'FOR'CERAMIC'CAPACITORS'IN'THE'31'TO''100'GHZ'................................................................................................................................................................'44'FIGURE'10:'GLOBAL'THIN'FILM'PASSIVE'ELECTRONIC'COMPONENT'MARKET'VALUE'FORECASTS'BY'TYPE'
(CAPACITORS,'RESISTORS'AND'INDUCTORS):'FY'2016D2021'............................................................................................................................................................................................'45'FIGURE'11:'THE'VERTICAL'INTEGRATION'OF'COMPONENTS'FOR'GREATER'VOLUMETRIC'EFFICIENCY:'ROADMAP'...............................................................................................................'46'FIGURE 12: INTEGRATION SOLUTIONS OF PASSIVE COMPONENTS FY 2016-2021'............................................................................................................................................................'52'FIGURE 13: HOW CAPACITANCE, RESISTANCE AND INDUCTANCE AND BEING ACHIEVED IN NETWORKS AND
ARRAYS TO ACHIEVE'................................................................................................................................................................................................................................................................'54'FIGURE 14: HISTORICAL METHODS OF ACHIEVING CAPACITANCE, RESISTANCE, INDUCTANCE AND CIRCUIT
PROTECTION IN ELECTRONIC CIRCUITS'...............................................................................................................................................................................................................................'56'FIGURE 15: SYNERGISTIC TECHNOLOGY PLATFORMS IN PASSIVE COMPONENT PRODUCTION: FY 2016'..................................................................................................................'58'FIGURE 16: WHAT FUTURE PASSIVE COMPONENT INTEGRATION MEANS TO INTELLECTUAL PROPERTY
DEVELOPMENT TODAY'.............................................................................................................................................................................................................................................................'60'
TABLE OF FIGURES AND GRAPHS
FIGURE'18:'SLC'DESIGN'.........................................................................................................................................................................................................................................................................'62'FIGURE'19:'THIN'FILM'CERAMIC'CAPACITORS'AS'A'SUBSET'OF'THE'GLOBAL'CERAMIC'CAPACITOR'INDUSTRY:'FY'
2016'...............................................................................................................................................................................................................................................................................................'66'FIGURE'20:'THIN'FILM'CERAMIC'CAPACITORS:'WORLD'MARKETS'FY'2016'AND'FORECAST:'FY'2021'...............................................................................................................................'73'FIGURE'21:'HIGH'FREQUENCY'CERAMIC'CAPACITOR'CONSUMPTION'VALUE'BY'WORLD'REGION:'FY'2016'.........................................................................................................................'75'FIGURE'22:'THIN'FILM'CERAMIC'CAPACITORS:'WORLD'MARKETS'FY'2016'AND'FORECAST:'FY'2021'...............................................................................................................................'76'FIGURE'23:'THIN'FILM'CERAMIC'CAPACITOR'CONSUMPTION'VALUE'BY'ENDDUSE'MARKET'SEGMENT:'FY'2016'...............................................................................................................'78'FIGURE'24:'THIN'FILM'CERAMIC'CAPACITOR'CONSUMPTION'VALUE'BY'ENDDUSE'MARKET'SEGMENT:'FY'2016D'FY'
2021'...............................................................................................................................................................................................................................................................................................'79'FIGURE'25:'THIN'FILM'CERAMIC'CAPACITOR'VENDORS'(SLC)'AND'THEIR'THICK'FILM'MLCC'COMPETITION'IN'HI'Q'
MARKETS'........................................................................................................................................................................................................................................................................................'80'FIGURE'26:'COMPETITIVE'ENVIRONMENT'IN'HIGH'FREQUENCY'CERAMIC'CAPACITORS'BY'FREQUENCY'RANGE:'1'GHZ'
TO'100+'GHZ'................................................................................................................................................................................................................................................................................'83'FIGURE'27:'COMPETITIVE'ENVIRONMENT'IN'MICROWAVE'AND'MILLIMETER'WAVE'CERAMIC'CAPACITORS'BY'
CAPACITANCE'VALUE'(0.1'PF'TO'6000+'PF)'.........................................................................................................................................................................................................................'84'FIGURE'28:'BROADBAND'CERAMIC'CAPACITORS:'GLOBAL'COMPETITIVE'ENVIRONMENT'BY'OPERATING'VOLTAGE'
RANGE:'FY'2016'..........................................................................................................................................................................................................................................................................'85'
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FIGURE'29:'THIN'FILM'CERAMIC'CAPACITOR'VENDORS:'FY'2016'ESTIMATES'SALES'&'MARKET'SHARES'...........................................................................................................................'90'FIGURE'30:'A'THIN'FILM'CHIP'RESISTOR;'CROSS'SECTION'AND'CONSTRUCTION:'2015'........................................................................................................................................................'102'FIGURE'31:'THICK'VERSUS'THIN'FILM'RESISTOR'COMPARISON:'2015'......................................................................................................................................................................................'104'FIGURE 32: THIN FILM VERSUS THICK FILM CHIP RESISTOR CONSTRUCTION''...............................................................................................................................................................'108'FIGURE 33: HISTORICAL TECHNOLOGY DEVELOPMENT OF INTEGRATED PASSIVE DEVICES'......................................................................................................................................'114'FIGURE 34: GLOBAL VALUE OF CONSUMPTION FOR THIN FILM RESISTORS: 2003-2016'.............................................................................................................................................'126'FIGURE 35: GLOBAL VOLUME OF CONSUMPTION FOR THIN FILM RESISTORS: 2003-2016'.........................................................................................................................................'128'FIGURE 36: AVERAGE UNIT SELLING PRICES FOR THIN FILM RESISTORS: 2003-2016'.................................................................................................................................................'129'FIGURE 37: GLOBAL CONSUMPTION VALUE FOR THIN FILM RESISTORS BY TYPE AND CONFIGURATION AND
FORECASTS TO 2021'...............................................................................................................................................................................................................................................................'130'FIGURE 38: GLOBAL CONSUMPTION VALUE FOR THIN FILM RESISTORS BY TECHNOLOGY (NICR, TAN,
OTHER): 2016'...........................................................................................................................................................................................................................................................................'131'FIGURE 39: GLOBAL CONSUMPTION VALUE FOR THIN FILM RESISTORS BY WORLD REGION: 2016'......................................................................................................................'132'FIGURE 40: THIN FILM RESISTORS: GLOBAL CONSUMPTION VALUE BY END-USE MARKET SEGMENT: FY
2016'.............................................................................................................................................................................................................................................................................................'136'FIGURE'41:'THIN'FILM'RESISTOR'VENDORS'BY'MARKETS'SERVED:'FY'2016:'........................................................................................................................................................................'139'FIGURE'42:'THIN'FILM'RESISTOR'VENDORS'BY'RESISTIVE'ELEMENT'(NICR,'TAN,'SICR'AND'OTHER):'2016'...................................................................................................................'141'FIGURE 43: GLOBAL COMPETITIVE ENVIRONMENT IN THIN FILM RESISTORS: 2016'....................................................................................................................................................'142'FIGURE 44: THIN FILM RESISTOR VENDORS: FY 2016 ESTIMATED WORLDWIDE MARKET SHARES'.......................................................................................................................'154'FIGURE'45:'THIN'FILM'CHIP'RESISTOR'VENDORS:'2016'ESTIMATED'MARKET'SHARES'........................................................................................................................................................'156'FIGURE'46:'THIN'FILM'RESISTOR'NETWORK,'ARRAY'AND'INTEGRATED'PASSIVE'DEVICE'VENDORS:'2016'ESTIMATED'
MARKET'SHARES'........................................................................................................................................................................................................................................................................'158'FIGURE 47: GLOBAL CONSUMPTION FOR THIN FILM RESISTORS: 2016-2021 (VALUE, VOLUME AND PRICING
FORECASTS)'...............................................................................................................................................................................................................................................................................'159'FIGURE 48: GLOBAL CONSUMPTION VALUE FOR THIN FILM RESISTORS BY TYPE: 2016-2021 (IN MILLIONS
OF US DOLLARS)'.....................................................................................................................................................................................................................................................................'160'FIGURE 49: HIGH FREQUENCY CERAMIC CHIP INDUCTOR MARKETS BY TYPE: (THICK VERSUS THIN FILM):
FY 2016'......................................................................................................................................................................................................................................................................................'166'FIGURE 50: HIGH FREQUENCY CERAMIC CHIP INDUCTORS: COMPETITION BY CASE SIZE: (THICK VERSUS
THIN FILM): FY 2016'.............................................................................................................................................................................................................................................................'171'FIGURE 51: MINIMUM THICKNESS OF THIN FILM CHIP INDUCTORS: 2016 BY CASE SIZE (IN MM)'..................................................................................................................'173'
TABLE OF FIGURES AND GRAPHS-‐ ConQnued-‐2
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TABLE OF FIGURES AND GRAPHS-‐ ConQnued-‐3 FIGURE 52: CERAMIC VENDORS BY CASE SIZE AND INDUCTOR THICKNESS (THICK AND THIN FILM): FY
2016!.............................................................................................................................................................................................................................................................................................!175!FIGURE 53: MAXIMUM INDUCTANCE CAPABILITIES BY CHIP INDUCTOR CASE SIZE: FY 2016 (IN NH)!.........................................................................................................!177!FIGURE 54: COMPETITIVE ENVIRONMENT IN CERAMIC CHIP INDUCTORS BY CASE SIZE AND INDUCTANCE
RANGE: O1OO5 CASE SIZE (0.2 TO 47 NH)!....................................................................................................................................................................................................................!178!FIGURE 55: COMPETITIVE ENVIRONMENT IN CERAMIC CHIP INDUCTORS BY CASE SIZE AND INDUCTANCE
RANGE: O2O1 CASE SIZE (47 TO 100 NH)!......................................................................................................................................................................................................................!179!FIGURE 56: COMPETITIVE ENVIRONMENT IN CERAMIC CHIP INDUCTORS BY CASE SIZE AND INDUCTANCE
RANGE: O4O2 CASE SIZE (101 TO 330 NH)!....................................................................................................................................................................................................................!180!FIGURE 57: COMPETITIVE ENVIRONMENT IN CERAMIC CHIP INDUCTORS BY CASE SIZE AND INDUCTANCE
RANGE: 0603 CASE SIZE (331 TO 680 NH)!......................................................................................................................................................................................................................!182!FIGURE 58: COMPETITIVE ENVIRONMENT IN CERAMIC CHIP INDUCTORS BY CASE SIZE AND INDUCTANCE
RANGE: O8O5 CASE SIZE (LEGACY PART)!.....................................................................................................................................................................................................................!183!FIGURE 59: TECHNOLOGY TRENDS & DIRECTIONS: Q FACTOR BY CERAMIC CHIP CASE SIZE: FY 2016!..............................................................................................................!184!FIGURE 60: HIGH FREQUENCY CERAMIC CHIP INDUCTOR MARKET BY MINIMUM Q FACTOR: FY 2016!...............................................................................................................!186!FIGURE 61: 2 TO 3 MINIMUM Q FACTOR AND COMPETITIVE ENVIRONMENT: LEADING EDGE IN INDUCTIVE
TECHNOLOGY!............................................................................................................................................................................................................................................................................!187!FIGURE 62: 4 TO 8 MINIMUM Q FACTOR AND COMPETITIVE ENVIRONMENT: FY 2016!...............................................................................................................................................!188!FIGURE 63: 9 TO 12 MINIMUM Q FACTOR AND COMPETITIVE ENVIRONMENT: FY 2016!.............................................................................................................................................!189!FIGURE 64: 13+ MINIMUM Q FACTOR AND COMPETITIVE ENVIRONMENT: FY 2016!....................................................................................................................................................!191!FIGURE 65: MAXIMUM RATED CURRENT IN MILLIAMPS (MA) FOR MULTILAYERED AND CERAMIC THIN FILM
INDUCTORS BY CASE SIZE: FY 2016!................................................................................................................................................................................................................................!193!FIGURE 66: ESTIMATED CERAMIC INDUCTOR CONSUMPTION VALUE BY MILLIAMP RANGE: FY 2016!........................................................................................................!195!FIGURE 67: COMPETITION IN THE 80 TO 350 MA RANGE IN CERAMIC INDUCTORS: FY 2016!...................................................................................................................................!196!FIGURE 68: COMPETITION IN THE 351 TO 470 MA RANGE IN CERAMIC INDUCTORS: FY 2016!.................................................................................................................................!197!FIGURE 69: COMPETITION IN THE 471 TO 900 MA CERAMIC CHIP INDUCTOR MARKETS: FY 2016!.........................................................................................................................!198!FIGURE 70: COMPETITION IN THE 900 TO 1200 MA CERAMIC CHIP INDUCTOR MARKETS: FY 2016!......................................................................................................................!200!FIGURE 71: COMPETITION IN THE LEGACY CERAMIC CHIP INDUCTOR MARKETS: FY 2016!......................................................................................................................................!201!FIGURE 72: THIN FILM CERAMIC CHIP INDUCTOR VENDORS: FY 2016 SALES AND MARKET SHARES!...................................................................................................................!202!FIGURE 73: MURATA: THIN FILM INDUCTOR PRODUCT OFFERING BY CASE SIZE AND PERFORMANCE
CRITERIA FOR FY 2017!..........................................................................................................................................................................................................................................................!203!FIGURE 74: AVX: THIN FILM INDUCTOR PRODUCT OFFERING BY CASE SIZE AND PERFORMANCE CRITERIA
FOR FY 2017!.............................................................................................................................................................................................................................................................................!204!FIGURE 75: VISHAY-DALE: THIN FILM INDUCTOR PRODUCT OFFERING BY CASE SIZE AND PERFORMANCE
CRITERIA FOR FY 2017!..........................................................................................................................................................................................................................................................!205!FIGURE 76: TOKEN: THIN FILM INDUCTOR PRODUCT OFFERING BY CASE SIZE AND PERFORMANCE CRITERIA
FOR FY 2017!.............................................................................................................................................................................................................................................................................!206!FIGURE 77: AEM: THIN FILM INDUCTOR PRODUCT OFFERING BY CASE SIZE AND PERFORMANCE CRITERIA
FOR FY 2017!.............................................................................................................................................................................................................................................................................!207!FIGURE 78: DARFON: THIN FILM INDUCTOR PRODUCT OFFERING BY CASE SIZE AND PERFORMANCE
CRITERIA FOR FY 2017!..........................................................................................................................................................................................................................................................!207!FIGURE 79: VIKING: THIN FILM INDUCTOR PRODUCT OFFERING BY CASE SIZE AND PERFORMANCE CRITERIA
FOR FY 2017!.............................................................................................................................................................................................................................................................................!208!FIGURE 80: VIKING: THIN FILM INDUCTOR PRODUCT OFFERING BY CASE SIZE AND PERFORMANCE CRITERIA
FOR FY 2017!.............................................................................................................................................................................................................................................................................!208!FIGURE 81: CYNTEC: THIN FILM INDUCTOR PRODUCT OFFERING BY CASE SIZE AND PERFORMANCE
CRITERIA FOR FY 2017!..........................................................................................................................................................................................................................................................!209!FIGURE 82: HIGH FREQUENCY BANDS AND RELATED NOMENCLATURE!...........................................................................................................................................................................!211!FIGURE 83: ULTRA HI-Q MARKET DRIVERS (1 TO 2.9 GHZ): FY 2017-2021!.................................................................................................................................................................!213!FIGURE 84: HI-Q MARKET DRIVERS (3.1 TO 30 GHZ): FY 2017-2021!..............................................................................................................................................................................!214!FIGURE 85: EXTREMELY HI-Q MARKET DRIVERS (3.1 TO 30 GHZ): FY 2017-2021!....................................................................................................................................................!215!
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TABLE OF FIGURES AND GRAPHS-‐ ConQnued-‐4
FIGURE'86:'GLOBAL&CONSUMPTION&VALUE&FOR&MULTILAYERED&CERAMIC&CHIP&CAPACITORS&BY&END6USE&MARKET&SEGMENT:&FY&2016''..............................................................................................................................................................................................................................................'218'
FIGURE 87: GLOBAL CONSUMPTION VALUE FOR CERAMIC CHIP CAPACITORS BY WORLD REGION: FY 2016'...................................................................................................'221'FIGURE 88 CERAMIC CHIP BY CASE SIZE: FY 2016: THIN FILM VERSUS THICK FILM INDUCTOR COMPARISON'................................................................................................'223'FIGURE 89: HIGH FREQUENCY CERAMIC CHIP INDUCTOR MARKETS BY CASE SIZE: (O1OO5, O2O1, O4O2,
O6O3, O8O5, OTHER): FY 2016'........................................................................................................................................................................................................................................'225'FIGURE 90: MINIMUM THICKNESS OF MLCI AND THIN FILM CHIP INDUCTORS: 2016 BY CASE SIZE (IN
MM)'..............................................................................................................................................................................................................................................................................................'227'FIGURE 91: LOW PROFILE INDUCTORS: THICKNESS COMPARISON: THIN VERSUS THICK FILM FY 2016
TREND'........................................................................................................................................................................................................................................................................................'228'FIGURE 92 LOW PROFILE CERAMIC CHIP INDUCTORS: FY 2016: THIN FILM VERSUS THICK FILM INDUCTOR
COMPARISON'.............................................................................................................................................................................................................................................................................'229'FIGURE 93: MAXIMUM INDUCTANCE CAPABILITIES BY CHIP INDUCTOR CASE SIZE:'...........................................................................................................................................'231'FIGURE 94: THIN FILM INDUCTOR CHIPS BY INDUCTANCE VALUE- COMPARISON WITH THICK FILM
CHIPS BY CASE SIZE: FY 2016'.........................................................................................................................................................................................................................................'232'FIGURE 95 LOW PROFILE CERAMIC CHIP INDUCTORS: FY 2016: THIN FILM VERSUS THICK FILM INDUCTOR
COMPARISON'.............................................................................................................................................................................................................................................................................'233'FIGURE 96: TECHNOLOGY TRENDS & DIRECTIONS: Q FACTOR BY CERAMIC CHIP CASE SIZE: FY 2016'..............................................................................................................'235'FIGURE 97: HIGH FREQUENCY CERAMIC CHIP INDUCTOR MARKET BY MINIMUM Q FACTOR: FY 2016'...............................................................................................................'237'FIGURE 98: THIN FILM INDUCTOR CHIPS BY Q FACTOR: COMPARISON WITH THICK FILM CHIPS: FY 2016'.......................................................................................................'238'FIGURE 99: THIN FILM INDUCTOR CHIPS BY Q FACTOR: COMPARISON WITH THICK FILM CHIPS: FY 2016'........................................................................................................'239'FIGURE 100: MAXIMUM RATED CURRENT IN MILLIAMPS (MA) FOR MULTILAYERED AND CERAMIC THIN
FILM INDUCTORS BY CASE SIZE: FY 2016'......................................................................................................................................................................................................................'241'FIGURE 101: ESTIMATED CERAMIC INDUCTOR CONSUMPTION VALUE BY MILLIAMP RANGE: FY 2016'......................................................................................................'243'FIGURE 102: THIN FILM INDUCTOR CHIPS BY RATED CURRENT AND EIA CHIP CASE SIZE: COMPARISON
WITH THICK FILM CHIPS: FY 2016'...................................................................................................................................................................................................................................'244'FIGURE 103: THIN FILM INDUCTOR CHIPS BY RATED CURRENT: COMPARISON WITH THICK FILM CHIPS: FY
2016'.............................................................................................................................................................................................................................................................................................'245'FIGURE 104: CERAMIC CHIP INDUCTORS: GLOBAL MARKET FORECASTS FOR CONSUMPTION: FY 2016-2021'...................................................................................................'247'Figure 105: Ceramic Inductor Forecasts By Frequency Range: FY 2016-2021
Source: Paumanok PublicaQons, Inc. FY 2017 MulQple Single and MulQ-‐Client Studies: 1988-‐2016; and research as noted for this report.
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This global market research report focuses on the emerging market for thin film passive electronic components and their expected growth as a result of demand for smaller components and new opportuniQes at high frequencies where thin film shines. This 350 page report is unique and the culminaQon of three separate research projects into thin film passive components, materials and processes. Detailed compeQQve data; jusQfied forecasts to 2021.
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