thin film deposition quality – composition, defect density, mechanical and electrical properties...
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Thin Film Deposition
• Quality – composition, defect density, mechanical and electrical properties
• Uniformity – affect performance (mechanical , electrical)Thinning leads to R
Voids: Trap chemicals lead to cracks (dielectric) large contact resistance and sheet resistance (metallization)
AR (aspect ratio) = h/w with feature size in ICs.
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Chemical Vapor Deposition
Flat on the susceptor
Cold wall reactor
Methods of Deposition:
Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD: evaporation, sputtering)Atmospheric Pressure : APCVD
Cold wall reactors (walls not heated only the susceptor)Low pressure: LPCVD – batch processing.
Hot wall reactor
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Plasma Enhanced Chemical Vapor Deposition(PECVD)
Used when :
• Low T required (dielectrics on Al, metals) but CVD at decreased T gives increased porosity, poor step coverage.
• Good quality films – energy supplied by plasma increases film density, composition, step coverage for metal decreases but WATCH for damage and by product incorporation.Outgassing , peeling ,
cracking stress.
P 50 mtorr - 5 torr
Plasma: ionized excited molecules, neutrals, fragments, ex. free radicals very reactive reactions @ the Si surface enhanced increase deposition rates
200- 350 °C
13.56 MHz
Ions, electrons, neutrals = bombardment
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Physical Vapor Deposition (PVD) – no chemical reactions
(except for reactive sputtering)
Evaporation
Advantages:
• Little damage
• Pure layers (high vacuum)
Disadvantages:
• Not for low vapor pressure metals
•No in-situ cleaning
• Poor step coverage
Very low pressure (P < 10 –5 torr) - long mean free path.
• purer – no filaments, only surface of the source melted
• X-rays generated trapped charges in the gate oxides anneal it !
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Evaporation
Partial Pressure of the source (target)
e
2
1
s2
evap PT
mA1083.5R ⎟
⎠
⎞⎜⎝
⎛×= −
Needed for reasonable v 0.1 - 1m/min
No alloys – partial pressure differences
Use separate sources and e-beam
incident
reactedc F
FS =
Step Coverage Poor :
• Long mean free path (arrival angle not wide = small scattering) and low T (low energy of ad-atoms)
• Sticking coefficient high (@ T) no desorption and readsorption poor step coverage
• Heating can increase Sc but may change film properties (composition, structure)
Sticking coefficient
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Sputter Deposition
Higher pressures 1 –100 mtorr ( < 10-5 torr in evaporation)
Alloys (TiW, TiN etc)
• good step coverage
• controlled properties
DC Sputtering (for metal)
Conductive
Al, W, Ti
Ar inert gas at low pressure.
No free radicals formed by Ar (ex. O, H ,F as was for PECVD)
Major Technique in Microelectronics for:
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RF Sputter DepositionDielect
ric
13.6 MHz RF coupled capacitively to plasma
several 100V
wafers
DC sputter cannot be used for dielectrics
secondary e-
plasma extinguished (VZ )
More on the walls charge built-up
potential VP
potential
@ the target ( area)
-
= NON-CONDUCTINGOscillating (with RF) e- ionization yield
pressure
+ magnet e- trajectory Magnetron Sputter Deposition have better ionization yields
deposition rates (10-100X)better film quality (Ar needed)use in DC & RF ( heating of the target since I+ )
large A1 area
A2
A2A1
e- charge
e- d
tenths of volts
faster, smaller
can be used
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Polysilicon - Very Widely Used in MEMS
columnar structure
As & P deposition rate of poly – Si use doping after poly deposition
B Vpoly - Si
As, P segregate @ the grain boundaries ( B does
not ! )625°C
Low T gives more amorphous layers
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Various Aspects of Deposition Processes
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Etching
DRY ETCH
ANISOTROPIC
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Etching Profiles
PR Mask
Rounded & sloped PR
Lateral etching chemical
good selectivity
Lateral etching
poor selectivity
Required for scaled down devices
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Wet Etching – Isotropic Etch
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Plasma Etching
Parallel plate system
Replace wet processes in VLSI – directional etching, faster, (less) selective but does not degrade PR adhesion as some wet steps do.
MEMS use plasma etching widely (deep etch, highly anisotropic)
• Reactive chemical components
• Ionic components
!
As in CVD & or sputtering (here RF electrode was much smaller and neutral gas Ar)
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Low pressure1mtorr-1torr
Chemical Etching
Isotropic arrival angle
ISOTROPIC ETCH
Low sticking coefficient
volatile
Free radicals : S
But in practice S is low
(0.01-0.05F - Si)
Physical Etching
Ion bombardmentDegrades selection= sputter etch
Cl+
+ O2 F recombination with CF3
CF4 F etch rates
@ small amounts of O2 but
@ large O2 etch rates decreases+oxidation of Si takes place
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Ion-Enhanced Etching
Chemical component selectivity
Physical component anisotropy
Etching
Enhancement by ions
volatility of byproducts
Role of ions:
Adsorption, Reaction, Formation of byproducts, and their removal
No plasma Sputtering
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Polymer formation on all walls but removed at the bottom by bombardment
Anisotropic Etch
Fast formation of the polymer
Slow polymer formation
May contain byproducts of etching, various layers including resist
MEMS call for optimization of cross-reactivity of various materials (layers) and processes
Silicon-Based MEMS Processes
Bulk micromachining (historically the first): silicon substrate is the main active part of the MEMS structures
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Oxide etch Or nitride if used as a mask for Si etching
Expose PR
Develop PR
Oxide growth or nitride deposition(if needed)
Wafer bonding
Wafer thinningby Chemical Mechanical Polishing to leave a thin membrane
Make piezoresistors (deposition, patterning, doping) to measure stress (use Wheastone bridge etc.)
Etch silicon
Strip PR
Si etched
Bulk Micromachining
• Fabrication of pressure sensors seen in cross-sections
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Membrane made of poly-Si, Si-nitride, or of oxide but also from polymers
Surface Micromachining
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Historically - the later process. Relies on the sacrificial layers deposited and etched selectively
etching
LIGA process• Three dimensional metallic and polymer structures 500µm deep (up to 6cm?!) require
deep etching, molding, plating etc.• LIGA=X-ray Lithography, electroplating (galvo) and injection molding (abformung) and
damascene processes are widely used. Now UV-LIGA is used more frequently.
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LIGA integration with CMOS via: Post-processing approachPreprocessing approachSide-by-side processing
500-60,000µm
New Materials and Fabrication Processes• Materials: Silicon was the main material but others are also widely
used Polymers as active structures: optical transparency, biocompatibility Polymers as protection and sealing layers High T and corrosive operation conditions (silicon carbide, diamond,
nitrides …) Other semiconductors (optical operation)
• Processes: traditional IC fabrication and other complementary/new processes (for nanoscale dimensions) and/or complementary materials Self assembly New lithography processes (molding, imprints …)