thermal management 2003 final
TRANSCRIPT
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 1/29
1
Thermal Management Electronics Cooling
Paper By:
1. Prof. Kiran D. Devade (Lecturer, Mech Dept.)
2. Prof. Avinash M. Patil (Professor, Mech Dept.)
3. Prof. Sunil B. Ingole (Assistant Professor, Mech Dept)
1Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 2/29
2
Thermal Management
1. Introduction
2. Need3. Methods Available
4. Research Work
5. Future Prospective
6. Conclusion
The Paper deals With,
2Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 3/29
3
Introduction
• Electronics is
developing field, since
long through decades itis moving towards
miniaturization in size
and maximizing
capacities.
3Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 4/29
4
History
• This was the CPU of a
computer before
introduction of
microprocessors
4Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 5/29
5
PAST
• After microprocessors
computers becamemore smaller and
cheaper
5Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 6/29
6
Now,
• But with advancements
the computers are
becoming more
compact and morecheaper
Thermal Management- Electronic Cooling 6
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 7/29
7Thermal Management- Electronic Cooling 7
The graph indicates the relation of size vs computing ability of a chip it is increasing
exponentially.
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 8/29
8
Old
Thermal Management- Electronic Cooling 8
Latest
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 9/29
9
Why Electronic Cooling
Thermal Management- Electronic Cooling 9
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 10/29
10
Other Source of heat generation
Due to the advantages of high local heat and mass transferrate and a relatively easy control of areas to be cooledor heated, impinging jets are widely used in manyindustrial applications such as,
• cooling of hot steel plates.• annealing of glass and sheet metals.
• drying of papers, films , textiles.
• cooling of turbine blades.
• electronic components.• most recently manufacturing of TFT-LCD plate.
Thermal Management- Electronic Cooling 10
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 11/29
11Thermal Management- Electronic Cooling 11
Methods for cooling- forced convection
Various cooling options that are available till date are:
*Liquid Vapor phase change
*Direct Liquid cooling*Indirect Liquid cooling
*Impinging jets
*Droplets*Sprays
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 12/29
12Thermal Management- Electronic Cooling 12
Liquid Vapor phase change
It is also known as TWO PHASE HEAT TRANSFER:
In this a fluid is used as a media to transfer the heat from
source to surrounding, the fluid at liquid state absorbs heat from the hot
source and turns vapor. The vapor gives of the absorbed heat to
surrounding and regains liquid state. The fluid is transported through
closed tube hence it is also called as heat pipe.
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 13/29
13Thermal Management- Electronic Cooling 13
Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng in 2009
tested a CPU with phase change system and reported that
after modeling, design, and testing of a high flux and yetcompact two-phase CPU cooler, with excellent attributes of
low thermal resistance that are derived from the intrinsic
design features of phase change phenomena and minimal
vapor pressure drop of the device. For the same footprint of a
conventional cooler, the prototype rejects more than twice the
capacity of CPUs of today. The unique design minimizes its
overall size and yet provides adequate area for forced
convection cooling. Testing was conducted over an assorted
heat loads and air flow rates flowing through the fins,
achieving a best performance of 0.206 K/W of device thermal
resistance at a rating of 203 W under an air flow rate of0.98 m3/min.
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 14/29
14
Direct Liquid cooling
• In this method of cooling liquid is circulated continuously through the
sources of heat generation using small size pumps.
Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 15/29
15Thermal Management- Electronic Cooling
Cristina H. Amon, Jayathi Murthy, S. C. Yao, Sreekant Narumanchi, Chi-
Fu Wu, Cheng-Chieh Hsieh in 2001 sudied the effects of direct liquid
cooling for electronics applications and developed the technique fordroplet impingement for integrated cooling of electronics (EDIFICE). The
EDIFICE project seeks to develop an integrated droplet impingement
cooling device for removing chip heat fluxes in the range 70 –100 W/cm2,
employing latent heat of vaporization of dielectric fluids (50 –100 μm
droplets) to achieve these high heat removal rates. Micro-manufacturing
and micro electro-mechanical systems (MEMS) will be discussed as
enabling technologies for innovative cooling schemes recently proposed.
A novel feature to enable adaptive on-demand cooling is MEMS sensing
(on-chip temperature, remote IR temperature and ultrasonic dielectric
film thickness) and MEMS actuation. EDIFICE will be integrated within
the electronics package and fabricated using advanced micro-manufacturing technology (e.g., deep reactive ion etching (DRIE) and
complementary metal-oxide-semiconductor (CMOS) CMU-MEMS).
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 16/29
16
Indirect Liquid cooling
• In this method of electronics cooling the cooling is achieved by convection
heat transfer principles where the liquid is not in contact with the heat
source directly.
Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 17/29
17
• Yam Lai, Nicolás Cordero, Frank Barthel, Frank Tebbe,Jörg Kuhn, Robert Apfelbeck, Dagmar Würtenbergein 2009 performed experiments with Led’s and with
liquid cooling the thermal design from device toboard to system level has been carried out in thisresearch. Air cooling and passive liquid coolingmethods were investigated and excluded asunsuitable, and therefore an active liquid coolingsolution was selected. Several configurations of theactive liquid cooling system were studied and
optimization work was carried out to find anoptimum thermal performance.
Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 18/29
18
Impinging jets
• In this method of electronics cooling a jet of air or liquid is directly blown
on to the heated surface in normal orientation
Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 19/29
19
• Jemmy S. Bintoro, Aliakbar Akbarzadeh, and Masataka Mochizuki in 2005 carriedout experiments with single jet and heat exchangers and reported that thesystem has the cooling capacity of 200 W over a single chip with a hydraulicdiameter of 12 mm. The equivalent heat flux is 177 W/cm2. The cooling systemmaintains the chip’s surface temperature below 95 °C maximum when theambient temperature is 30 °C. De-ionized water is the working fluid of thesystem. For the impinging jet, two different nozzles are designed and tested. Thehydraulic diameters (d N) are 0.5 mm and 0.8 mm. The corresponding volumeflow rates are 280 mL/min and 348 mL/min. Mini channels heat exchanger has 6(six) copper tubes with the inner diameter of 1.27 mm and the total length ofabout 1 m. The cooling system has a mini diaphragm pump and a DC electric fanwith the maximum power consumptions of 8.4 W and 0.96 W respectively. The
coefficient of performance of the system is 21.4• A.M. Kiper in 1984 used water sprays for VLSI circuit cooling new method of
cooling of planar Very Large Scale Integrated (VLSI) circuits which allows one toobtain chip heat fluxes in excess of 500 W/cm2 with acceptable temperaturerises. It is shown that by scaling impinging fluid jet heat transfer technology tosmall geometrical dimensions, and by using water as the coolant, a high-performance cooling system can be designed. The convective heat transfer
coefficients obtained in this method are significantly greater than that obtainedin the convectional liquid cooling technology used for microelectronic devices,including the immersion cooling.
Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 20/29
20
Droplets
Thermal Management- Electronic Cooling
In this method of electronics cooling droplets of various sizes andat varying velocities are used to remove heat fluxes from a
electronic system
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 21/29
21Thermal Management- Electronic Cooling
• H. Oprins, J. Danneels, B. Van Ham, B. Vandevelde, M.
Baelmans in 2008 studied heat transfer rates for varying
droplet velocities and It is shown that the internal droplet
flow exhibits a parabolic characteristic at one hand and thatthe presence of two convection cells decreases the heat
transfer to the lower part of the droplet, thereby limiting the
overall heat transfer through the droplet. A typical
enhancement of the heat transfer with a factor 2 is achieved
with respect to the minimal value that would be obtained
assuming heat conduction as the only means of heat transfer
in the liquid. Further an analytic lumped model is presented
to estimate the transient average droplet temperature with an
accuracy of 5% compared to the full transient computationalfluid dynamics modeling.
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 22/29
22
Sprays
Thermal Management- Electronic Cooling
In this system to remove chip level heat fluxes the liquid or is
sprayed using number of nozzles on the heated surface.
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 23/29
23
• B.Q. Li, T. Cader, J. Schwarzkopf, K. Okamoto, B. Ramaprian An experimentaland inverse computational study is presented of spray cooling ofmicroelectronics with an emphasis on the spray angle effects on cooling
performance. A thermal test chip provides the heated target, and is cooledby a single pressure swirl atomizer. Thermal readings were taken at thespray angles of 0 –60°, at a fixed distance of 1.4 cm from the heated diesurface. An inverse heat transfer computational algorithm is developed tocalculate the unknown spray cooling heat fluxes using the measuredtemperature data inside the die. The computational scheme is acombination of the finite element method and the truncated single value
decomposition with the discrepancy principle for determining the optimaltruncation threshold value. Good agreement is obtained between theexperimental measurements and calculated results. For this particularsystem, a direct estimate using temperature readings at two adjacentpoints would produce incorrect heat flux results and an inverse algorithm isdeemed essential if an accurate heat flux is to be obtained from the
measurements. It is found that a major cause for the drop-off is thereduction in spray volumetric flux delivered to the die at the greater sprayangles.
Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 24/29
24
Research Status
Thermal Management- Electronic Cooling
*Liquid Vapor phase change- 5853
*Direct Liquid cooling- 7117*Indirect Liquid cooling-1737
*Impinging jets-549
*Droplets-2005*Sprays-1854
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 25/29
25
0
1000
2000
3000
4000
5000
6000
7000
8000
L i q u i d v a
p o r p h a
s e c h a
n g e
D i r e
c t L i q
u i d c o o l i n
g
I n d i r e
c t L i
q u i d
c o o l i n g
I m p i n g i n
g j e t
s
D r o p l e t
s
S p r a y s
Series1
Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 26/29
26
CONCLUSION
• Number of solutions have been used till date for electronicscooling problem, as the working demands are higher andheat flux being induced is increasing with time still asatisfactory solution can be put into action
• For electronics cooling with jet impingement experiments
can be performed by varying the nozzle shapes and to breaklaminar boundary layer various flow patterns can be used toenhance the heat transfer rates.
• Some fin geometries are in practice till date a compromisebetween cost and efficiency can be attained by varying the
arrangements and fin geometries.
Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 27/29
27
• for spray cooling the pressurized air and liquid mixture ca beused as mist to spray and combinations of air and liquid canbe studied at various flow rates to determine the best suitedflow-mixture combination.
• parabolic droplets of various cooling fluids can be studied forthis to remove the heat generated
• From the graph it is also clear that a lot of scope is there for
work in jet impingement cooling area.• Cross cutting of flat fins into multiple sections is also suggested
to improve heat transfer coefficient.
• Augmentation of the fins can also improve the performance.
• Jet impingement cooling using high speed blow directedtowards the base of the fin arrangement is effective.
Thermal Management- Electronic Cooling
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 28/29
28
References1. Michroelectromechanical system – based evaporative thermal management of high heat flux electronics,
Journal of heat and mass transfer, Volume 127,January 2005, Pages 66-75, Cristina H. Amon, S.C. Yao, C. F.Wu,C.C. Hseih.
2. Modeling and testing of an advanced compact two-phase cooler for electronics cooling International Journal of Heat and Mass Transfer , Volume 52, Issues 15-16, July 2009, Pages 3456-3463,Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng
3. The experimental investigation on thermal performance of a flat two-phase thermosyphon International Journal of Thermal Sciences, Volume 47, Issue 9, September 2008, Pages 1195-1203,MingZhang, Zhongliang Liu, Guoyuan Ma
4. MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingementfor integrated cooling of electronics Experimental Thermal and Fluid Science, Volume 25, Issue 5, November 2001, Pages 231-242,Cristina H.
Amon, Jayathi Murthy, S. C. Yao, Sreekant Narumanchi, Chi-Fu Wu, Cheng-Chieh Hsieh5. An absorption based miniature heat pump system for electronics cooling
International Journal of Refrigeration, Volume 31, Issue 1, January 2008, Pages 23-33 Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov
6. Development of a chip-integrated micro cooling device Microelectronics Journal , Volume 34, Issue 11, November 2003, Pages 1067-1074 J. Darabi, K. Ekula
7. Modeling and testing of an advanced compact two-phase cooler for electronics cooling International Journal of Heat and Mass Transfer , Volume 52, Issues 15-16, July 2009, Pages 3456-3463 Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng
8. Liquid cooling of bright LEDs for automotive applications Applied Thermal Engineering, Volume 29, Issues 5-6, April 2009, Pages 1239-1244 Yan Lai, Nicolás Cordero, Frank Barthel, Frank Tebbe, Jörg Kuhn, Robert Apfelbeck, Dagmar Würtenberger
8/13/2019 Thermal Management 2003 Final
http://slidepdf.com/reader/full/thermal-management-2003-final 29/29
29
9. Micro cooling systems for high density packaging Revue Générale de Thermique, Volume 37, Issue 9, October 1998, Pages 781-787 Bernd Gromoll
10. A closed-loop electronics cooling by implementing single phase impinging jet and minichannels heat exchanger Applied Thermal Engineering, Volume 25, Issues 17-18, December 2005, Pages 2740-2753,Jemmy S. Bintoro, Aliakbar Akbarzadeh, Masataka Mochizuki
11. Impinging water jet cooling of VLSI circuits International Communications in Heat and Mass Transfer , Volume 11, Issue 6, November-December 1984, Pages 517-526 A.M. Kiper
12. Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling Microelectronics Journal , Volume 39, Issue 7 , July 2008, Pages 966-974 H. Oprins, J. Danneels, B. Van Ham, B. Vandevelde, M. Baelmans
13. Spray angle effect during spray cooling of microelectronics: Experimental measurements andcomparison with inverse calculations
Applied Thermal Engineering, Volume 26, Issue 16, November 2006, Pages 1788-1795 B.Q. Li, T. Cader, J. Schwarzkopf, K. Okamoto, B. Ramaprian
14. Intermittent spray cooling: A new technology for controlling surface temperature International Journal of Heat and Fluid Flow , Volume 30, Issue 1, February 2009, Pages 117-130,Miguel R.O. Panão, António L.N. Moreira
15. WWW.sciencedirect.com