Taming the heat in today’s electronics

THERMAL INTERFACE MATERIALS

The role of Thermal Interface Materials is to

dissipate heat as quickly and effectively as

possible from the device. But not all devices

are the same. Requirements are driven by

product use, product life cycle, packaging

design, and operating conditions.

Thermal PerformanceIncreasing power densities are raising device

temperatures — requiring more effective TIM

solutions that must deliver low thermal imped-

ance and high bulk conductivity. Reducing oper-

ating temperature can reduce device throttling,

while increasing efficiency and design flexibility.

Product Life Cycle & ReliabilityMobile products such as tablets and smart-

phones have a relatively short product life, but

still require thermal management to protect

from extreme and sudden bursts of energy

and temperature spikes.

Conversely, automotive, power and server

products must remain robust for significantly

longer product life cycles. These applications

involve harsh operating conditions such as

extreme heat and humidity, which must be taken

into account in choosing the best TIM material.

The key requirement in these applications is not

just immediate performance but also sustained,

long-term thermal stability.

Gaps & Bond Line ThicknessIC designers are continually looking for ways

to achieve more processing power in less space.

Additionally, high power devices with dedicated

heat sinks aim to achieve an extremely thin TIM

bond line with low thermal impedance and a

reduced thermal path.

To add to the complexity, chip-scale packages

assembled on a PC board will share the same

heat spreader but will have different heights with

varying gaps, requiring a TIM that delivers both

thermal and compressible properties. Taking all

this into consideration, it is important for today’s

TIMs to provide effective thermal management

in increasingly constrained environments and

different assembly designs.

MATERIALS TARGETED TO MEET YOUR CHALLENGESOur extensive thermal interface material product portfolio is designed to support varying thermal needs across a broad range of applications. For example, gaming platforms and tablets experi-ence sudden temperature spikes and require very high thermal performance, while power elec-tronics in automobiles need extreme thermal stability to meet warranties that stretch over long lifetimes. Honeywell’s innovative solutions, R&D capabilities and extensive experience mean that your challenges are covered…now and in the future.

For over half a century, Honeywell has been a key supplier to the worldwide electronics industry, providing critical materials to enhance the performance and reliability of our customers’ products. We employ approximately 1200 people across the United States, Europe and Asia. In terms of strength, resources and best practices, Honeywell is one of the world’s leading corporations.

Our three major R&D centers are located in California, Washington and China, and we hold nearly 400 granted and pending patents. Continuous investment in advanced research, worldwide strategic collaborations, and dedication to

working closely with our customers have resulted in a wide-ranging product portfolio — including the most complete line of innovative thermal interface materials (TIMs) available today.

Find the Honeywell

TIMs most suitable

for your products on

the following pages

OUR APPROACH We have designed our

products to optimize

thermal impedance.

This means that we

look at the entire

thermal path, not just

the TIM itself. This

includes the material

interfaces, the thermal expansion of the joining

interfaces, contact resistance and bond line

thicknesses.

Our portfolio of materials dissipate heat away

from the IC, in a way that best suits the device

structure, packaging design and application.

Honeywell’s thermal interface approach is

based on phase change materials (PCMs). Our

PCM design is driven by an innovative polymer

technology and advanced filler systems that can

be customized to fit diverse product applications

and end uses. That means you get precisely what

you need, when you need it.

Honeywell TIMs’ thermal stability ensures continuous and reliable device performance.

BOTTOM LINE: No single TIM product is the ideal solution for every application.

Automotive IT/EnterprisePower Electronics Telecomm, Wired/Wireless High-Brightness LEDConsumer Electronics

DETERMINING YOUR TIM REQUIREMENTS

HONEYWELL TIM SELECTION GUIDEAutomotive & Power Electronics IT/Enterprise

APPLICATIONS

INDUSTRY

THERMAL MANAGEMENT NEEDS

SUGGESTED HONEYWELL PRODUCTS

Honeywell PCM Technology Enables Low Thermal Impedance (TI) and Long-Term Reliability Performance

Telecomm, Wired/Wireless High-Brightness LEDConsumer Electronics

Power Modules, Electric Vehicles (EV), Hybrid Vehicles (HV), Batteries,

Onboard Electronics, Wind/Solar, Variable Frequency Drives (VFD),

Industrial and Other Transportation Equipment

Servers, Supercomputing, Solid State Drives (SSD), Video Graphic

Array (VGA) Cards, GPU/MPU/CPU/Desktop

Switches, Routers, Transceivers, Base Stations

Tablets, Notebooks, Smartphones, Gaming, Action Cameras

Architectural Lighting, Outdoor Lighting, Automotive Lighting,

Industrial Lighting

Longer Warranties, Harsher Conditions, Higher Operating

Temperatures, Extreme Reliability

High Thermal Performance, Compressibility, Cost of

Ownership, Thermal Stability

High Thermal Performance, Compressibility, Cost of

Ownership, Thermal Stability

High Thermal Performance, Compressibility, Cost of

Ownership, Thermal Stability

High Temperature, Low Thermal Impedance

PTM7000 SeriesPTM6000 SeriesPTM5000 SeriesPTM “D” Series

PTM7000 Series PTM5000 SeriesPCM45F Series

TCM Series

PTM7000 SeriesPTM5000 SeriesPCM45F Series

TCM SeriesPTM5000 SeriesPCM45F Series

PTM5000 SeriesPCM45F Series

LTM Series

SOLUTIONS FOR EVERY TYPE OF THERMAL CHALLENGE

HONEYWELL PCM TECHNOLOGY • Long Polymer Chain • Rigid Polymer Structure

VS.

PCM: Long Chain Grease: Short Chain

Molecular Structure of PCMs versus Greases

The long chains in PCMs enable stable and consistant filler dispersion and polymermatrix in all states, minimizing migration and other issues.

The short chains in silicone greases enable good flowability and low BLT, but can cause migration, dry-out and pump-out issues.

Molecular Structure of PCMs versus Greases

The long chains in PCMs enable stable and consistant filler dispersion and polymermatrix in all states, minimizing migration and other issues.

The short chains in silicone greases enable good flowability and low BLT, but can cause migration, dry-out and pump-out issues.

• Stable and consistent filler

• Minimizes filler migra-tion and separation

• Good flowability but…• Potential for migration,

dry-out and pump-out issues Increasing Temperature

Theoretical Curve:PCM Viscosity vs. Temperature

Visc

osity

Solid Liquid/Gel State• Optimal surface wetting• Low contact resistance• Low thermal impedance

Phase ChangeTemperature

PCM PERFORMANCEPCM KEY ATTRIBUTES• Optimal surface wetting• Low contact resistance• Low thermal impedance

Stable TI across accelerated aging tests: HTB, thermal cycling, HAST

No bleed-out, pump-out or flow-out

• Easy assembly• Broader process windows• Higher yield with zero material

waste

TIMs

HONEYWELL TIM PRODUCT FAMILIES

High Compressibility PCM

High Voltage Dielectric PCM

Core PCM Offerings

Most Honeywell TIMs are available in both pad and paste/printable formats (designated by “SP”). Additional information and technical data sheets are available on request.

CUSTOM DEVELOPMENT

The expertise to create TIM prod-ucts exclusively for your needs

Our key strengths in polymer science, filler

technology, and process expertise has resulted

in our long-standing reputation for innovation

in electronic material solutions.

Whether adapted from our extensive portfolio

of proven materials, or developed specifically

for a customer, all Honeywell products under-

go rigorous research, testing and quality con-

trol protocols.

Analytical Capabilities• State-of-the-art Thermal Management

Development & Application labs

• Three R&D centers (Sunnyvale, Spokane, Shanghai) to support customer develop-ment projects.

• Rapid prototyping meeting customer needs

PRODUCT Thermal Impedance1

(C-cm2/W), No ShimThermal Conduc-

tivity (W/m˚C)Reliability

(hrs), 150°C BakingPad Thickness

(mm)

ASTM2 D5470 ASTM D5470 ASTM E1461

PTM7000 Series 0.04–0.06 6.0–8.0 >1500 0.20–1.00

PTM6000 Series 0.06–0.08 3.5–4.5 >3000 0.20–1.00

PTM5000 Series 0.06–0.08 3.5–4.5 >1000 0.20–1.00

PCM45F Series 0.09–0.12 2.0–2.5 >600 0.20–1.00

LTM Series 0.12–0.14 1.8–2.4 >600 NA

PRODUCT Thermal Impedance1

(C-cm2/W), No ShimThermal Conduc-

tivity (W/m˚C)Reliability

(hrs), 150°C BakingPad Thickness

(mm)

ASTM2 D5470 ASTM D5470 ASTM E1461

TCM Series 0.12–0.15 2.5–4.5 >600 0.50–3.00

PRODUCT Thermal Impedance1

(C-cm2/W), No ShimThermal Conduc-

tivity (W/m˚C)Reliability

(hrs), 150°C BakingPad Thickness

(mm)

ASTM2 D5470 ASTM D5470 ASTM E1461

PTM “D” Series 0.10–0.12 2.5–4.0 >600 0.20–1.00

1. TI data is collected after the material has fully changed phase.2. ASTM is American Standard Test Method.

Sample Size = 12

0.00

0.02

0.04

0.06

0.08

0.10

0.12

0.14

TI (AC) 200hr 400hr 600hr 800hr 1000hr 1300hr 1500hr 1800hr 2000hr 2200hr 2400hr 2600hr 2800hr 3000hr 3200hr

TI/(˚C.cm2 /W

)

PTM6000 Series Average

0.00

0.04

0.08

0.12

0.16

0.20

0 5 10 15 20 25 30 35 40 45

TI (o

C.c

m2 /W

Pressure (psi)

PTM 5000 PTM7000 PTM7900

Highest Thermal Performance – PTM7000 Series

Enhanced Thermal Reliability – PTM6000 Series

High Thermal Performance & Reliability – PTM5000 Series

0.00

0.20

0.40

0.60

0.80

1.00

1.20

Ther

mal

Impe

danc

e (°

C-c

m2/

W)

PTM3180

Grease A

Grease B

PTM5000 Series

0 200 400 600 800 1000

Hours Test Method: Laser Flash, ASTM E1461

High Temperature Bake at 150°CTI vs. Hours of Exposure

PTM5000 Series is our most frequently suggested TIM for a variety of applications in different industries.

PTM6000 Series is well suited to demanding auto-motive and power applications.

PTM7000 Series is suggested for Automotive, IT/ Enterprise and Telecomm appli-cations.

High Temperature Bake at 150°CTI vs. Hours of Exposure

Pressure vs. Thermal Impedance

Test Method: Laser Flash, ASTM E1461

Test Method: ASTM D5470

WORLDWIDE DEVELOPMENT, MANUFACTURING AND SUPPORT

United States Santa Clara, California Sunnyvale, California Spokane, Washington Chandler, Arizona Salt Lake City, Utah Bryan, Texas Houston, Texas Mansfield, Texas Fombell, Pennsylvania

Morristown, New Jersey

Europe Seelze, Germany

Asia Shanghai, China Jincheon, Korea Tokyo, Japan Yaita, Japan Chonburi, Thailand Hsinchu, Taiwan Singapore

E

EE

E Research & Development Site Manufacturing Site N Support Site

Although all statements and information contained herein are believed to be accurate and reliable, they are presented without guarantee or warranty of any kind, express or implied. Information provided herein does not relieve the user from the responsibility of carrying out its own tests and experiments, and the user assumes all risks and liability for use of the information and results obtained. Statements or suggestions concerning the use of materials and pro-cesses are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all toxicity data and safety measures are indicated herein or that other measures may not be required. August 2016 Rev1©2016 Honeywell International Inc.

Honeywell Electronic MaterialsUSA: 1-509-252-2102China: 86-21-28942481Germany: 49-5137-999-9199Japan: 81-3-6730-7092Korea: 82-2-3483-5076Singapore: 65-6580-3593Taiwan: 886-3-6580300 ext.312www.electronicmaterials.com

HONEYWELL TIM ADVANTAGES

Quality• Industry-leading reliability over

device lifetime

• More than twenty years specializing in TIM materials R&D and manufac-turing

• Proprietary formulations optimized for the needs of specific applications

• Proven, long-standing supplier with multiple worldwide quality certifica-tions

Customer Focused• Serving diverse range of customers

• TIMs offered in both pad and paste formats for ease of application

• Superior global technical support

• Portfolio of other materials, such as thermal spreaders, electrical

interconnect and pure metals

Find out more by visiting: electronicmaterials.com