thermal-aware dc ir-drop co-analysis using non- conformal domain decomposition methods by yang shao,...
TRANSCRIPT
Thermal-aware DC IR-drop co-analysis using non-conformal domain decomposition methods
by Yang Shao, Zhen Peng, and Jin-Fa Lee
Proceedings AVolume 468(2142):1652-1675
June 8, 2012
©2012 by The Royal Society
The geometry of the computational model.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Electrical–thermal coupling.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Notations for decomposing the original problem domain into two sub-domains.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Partitioning of the sub-domain unknowns into interior and boundary unknowns.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Views of the simulated IBM package geometry: (a) top view and (b) side view.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
PDN geometry that could cause the Swiss cheese effect.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Convergence study using DDM to compute voltage distribution of a product-level three-dimensional IC package.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
IBM package PDN with boundary conditions and voltage distribution on the top plane (unit: V).
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Voltage distribution on the power planes of layer 1 and layer 7 (unit: V).
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Voltage distribution on the ground planes of layers 3, 4, 5, 6 and 8 (unit: V).
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Notations for partitioning the problem domain into two sub-domains for steady-state thermal analysis.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Convergence study to compute voltage and temperature distribution of the chip-package-PCB model.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Chip, memory and thermal TSVs of chip and memory layers: (a) top view and (b) side view.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Volumetric power densities in chip and memory layers: (a) CPU1, (b) CPU2 and (c) RAM1 and RAM2.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Non-conformal partitioning and mesh of the PDN of the chip-package-PCB model.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Boundary conditions and voltage distribution of the PDN. (a) Boundary conditions and (b) computed initial voltage distribution at room temperature (unit: V).
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Boundary conditions and temperature distribution of the chip-package-PCB.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Detailed thermal-aware voltage distributions on the chip modules (unit: V).
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society
Maximum thermal-aware IR-drop results with iterations.
Yang Shao et al. Proc. R. Soc. A 2012;468:1652-1675
©2012 by The Royal Society