the hardware development process emil joannou, p.eng. naroch networks corporation 1
TRANSCRIPT
THE HARDWARE DEVELOPMENT PROCESS
EMIL JOANNOU, P.ENG.
NAROCH NETWORKS CORPORATION
WWW.NAROCHNETWORKS.COM
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GENERAL OVERVIEW
BreadBoard
Product Spec
Test
Integration
Electronics Software Mechanical
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BREADBOARDINGCustomer Device
USB
BlueTooth Link
Smart Phone 3
SINGLE BOARD COMPUTERS
Board uP Bits MHz ROM RAM Others
Arduino ATmega328
8 16 32k 2K I2C,SPI, USART
Beagle Bone
OMAP 3530
32 720 256M 256M HDMI USB,SD
Raspberry Pi
BCM 2835
32 700 ? 512M E-net HDMI
Intel Edison
Atom + Quark
32 500 100
4GB 1GB WiFi, BT
OLinuXino Cortex-A8
32 1000 4GB 512M WiFi VGA
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AN I/O BOUND PROCESSOR
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ELECTRONICS DESIGN PROCESS
Detailed Design
Schematic Capture
PCB Layout
BoM Generation
PCB Fab
Assembly
Test
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DETAILED DESIGN
Capacitors Size, Tolerance, Volts, Dielectric, Temperature, ESR, Ripple Current
Resistors Size, Tolerance, Power, Voltage, TCR
Digital Vinh,Vinl,VohVol, Ioh, Iol, Iin, tsu, th, tpd
Analog Vos, Ios, Ib, GBW, uV/sqrt(Hz)
Thermal Watts, Tamax, Tjmax, Θja, Θjc, Θha,
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CHIP RESISTOR SIZES
1/4 x 1/8 inch = 0.250 x 0.125 inch
size 2512.
1/8 x 1/16 inch = 0.125 x 0.0625 inch
size 1206.
1/16 x 1/32 inch = 0.0625x 0.03125 inch
size 0603.Also 0805, 0402, 0201, 01005
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SCHEMATIC CAPTURE
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LAYOUT
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BOM CREATION
Item # Qty Ref Des Type Mfg Mfg PN Digikey PN1 1 B1 BATT,coin,3V,Lithium PANASONIC CR-1220/HFN P244-ND2 2 C1,C2 CAP,12pF,5%,50V,NPO,0402 MURATA GM1555C1H120JA01D 490-5924-1-ND3 3 C3, C14-15 CAP,1uF,10%,16V,X7R,1206 KEMET C1206C105K4RACTU 399-1254-1-ND4 2 C7, C32 CAP,4.7uF,10%,25V,X5R,1206 TDK C3216X5R1E475K160AA 445-4047-1-ND5 2 C8, C13 CAP,22uF,10%,6.3V,X5R,0805 SAMSUNG CL21A226KQQNNNE 1276-2907-1-ND
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PCB FAB & ASSEMBLY
Fiberglass
Chip Cap
Top
Solder
Mask
Top
Solder
Paste
Silk
ScreenTop
Copper
Bottom
Copper
Bottom
Solder Mask
Via Hole
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TESTING• Design Verification Testing
• Test, Debug, Rework, Retest
• Manufacturing Test Procedure
• Standards Testing
• Gov’t Regulated:
• EMI (FCC/DOC) & Safety (CSA/UL)
• Industry Standards
• Telecom: NEBS
• Metering: Industry Canada/ANSI
• Medical: FDA, Health Canada
• Automotive & Others………
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FCC RADIATED EMISSIONS
Class A = Industrial , Commercial
Class B = More Strict = Residential
FCC regulations part 15 “Radio Frequency Devices”
Concerned with both Radiated and Conducted emissions.
Canadian DoC regs follow FCC rules
Europe has slightly different limits.14
SOME COMMON SAFETY STDS
• CSA/UL 60950 Safety of Information Technology Equipment
• CSA/UL 61010 Electrical Equipment for Measurement, Control, and Laboratory Use.
• UL 508 Industrial Control Equipment
• CSA-C22.2 No 14-10 Industrial Control Eqt
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UL/CSA 61010SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL, AND LABORATORY USE.
• Electrical Shock
• Mechanical Hazards
• Mechanical Stresses
• The Spread of Fire
• Hazards from Fluids
• Overheating
• Radiation, including laser, sonic, and ultrasonic.
• Liberated Gases, explosion, implosion.
Protection Against:
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APPROVALS LISTINGS
• To look up CSA LR file numbers go to http://www.csagroup.org/ca/en/services/testing-and-certification/certified-product-listing .
• To look up UL E file numbers go to http://database.ul.com/cgi-bin/XYV/template/LISEXT/1FRAME/index.html.
E143709LR3730
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THANK YOU
Slides available from
www.narochnetworks.com/iot_meetup