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© ETSI 2016. All rights reserved The European Approach to Standardization for a Digital Market Athens, 18 - 19 May 2016

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© ETSI 2016. All rights reserved

The European Approach to Standardization for a Digital MarketAthens, 18 - 19 May 2016

© ETSI 2016. All rights reserved

Achilleas Kemos

[email protected]

© ETSI 2016. All rights reserved

Source Venture Scanner

© ETSI 2016. All rights reserved

Source Deloitte

© ETSI 2016. All rights reserved

IoT ecosystem in Europe

Launched by EC in March 2015

Breaking silos between application areas

Support IoT policies and dialogue with market players

Help EC prepare IoT R&I projects, standardization and policy roadmap

A EU roadmap : AIOTI, the Alliance for IoTInnovation

www.aioti.eu

© ETSI 2016. All rights reserved

Structure

Source: AIOTI WG3

Service & App

B2C

(e.g., Consumer Market)

B2B (e.g.,

Industrial Internet Market)

Connectivity

AIOTI

Open Automotive Alliance

NB-IoT

Forum

NB-IoT

Forum

Open

Connectivity

Foundation

© ETSI 2016. All rights reserved

Working Group 3 – Standardization

270 Members, incl 30+ SSOsLiaisons with major standards bodies

Deliverables3 reports published Oct. 2015 - IoT Landscape - High Level Architecture - Semantic interoperability http://bit.ly/1GtzJ5I

New AIOTI WG03 sub-group on Privacy + report V1.0Georgios Karagiannis

Huawei

JP Desbenoit, Schneider

Patrick Guillemin, ETSI

www.oneM2M.orgOver 200 members

All document are publically available

Serious credentials

http://www.etsi.org/technologies-clusters/technologies/internet-of-things

10

Horizontalization

BROAD ADOPTION High volume, low ARPC, low TCO

NICHE VERTICALSLow volumes, high ARPC, high TCO

• Devices and Applications are designed as “stove-pipes”• Devices dedicated for single application use• Solutions are closed and not scalable: duplication of

dedicated infrastructure• High development & delivery cost

• Devices and Applications are designed to collaborate across “clouds”

• Devices are used for multiple application purposes• Devices and Applications offering continuously evolve• Easy app development and device integra-tion through

APIs and standard interfaces

Horizontal platform with common functions and interfaces

Source: ALU

M2M Common Service Layer

A software layer

Sits between M2M applications and communication HW/SW that provides data transport

Normally rides on top of IP

M2M applications across different industry segments, exposed to apps via developer friendly APIs.

Allows for distributed intelligence (device, gateway, cloud apps)

© ETSI 2016. All rights reserved

ETSI STF 505 (IoT Analysis) in collaboration with AIOTI –EC funded- will publish 2 ETSI Technical Reports IoT Landscape Use Cases and Gap Analysis

Draft available for consultation dissemination and workshops at end of 2016H2020 ICT30 UNIFY-IoT and BE-IoT support AIOTI WG3H2020 IoT LSP Pilots and CSA (start Jan. 2017)

Next Steps AIOTI WG 3

© ETSI 2016. All rights reserved

13-17 June IoT Security Week at ETSI (Sophia Antipolis)http://www.etsi.org/news-events/events/1068-2016-06-security-week

On 16 JuneAIOTI Workshop on Security and Privacy in the hyper-connected world

Contact AIOTI WG03 Chair [email protected]