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Progress In Electromagnetics Research C, Vol. 9, 59–74, 2009
THE EFFECT OF AN EXTERNAL ELECTROMAGNETICFIELD ON ORTHOGONAL COUPLED MICROSTRIPTRANSMISSION LINES
M. Baqerian, A. Arshadi, and A. Cheldavi
College of Electrical EngineeringIran University of Science and TechnologyTehran, Narmak 16846, Iran
Abstract—The response of a two-layer structure of orthogonalcoupled microstrip transmission lines illuminated by an externalelectromagnetic field has been studied. A simple model for thecrosstalk region using lumped capacitance and inductance elementsis used. The effect of the external EM field on the microstrip lineswill be obtained using the method taking into account the EM field inorder to reach transmission line equations along the lines. The model isfinally validated using the full wave analysis simulator, HFSS. Voltageand current along the lines obtained by the present method are ingood agreement with the results of the full wave analysis (HFSS). Theproposed model has been used for voltage and current in terminal portsup to 10 GHz. This method can be developed simply for multilayerstructures.
1. INTRODUCTION
A large number of papers have been devoted to the analysis of varioustypes of planar transmission lines with multilayer dielectric media.Among them, the quasi-static analysis gives reasonable results with lesscomputational effort. Recent advances in microwave solid-state deviceshave stimulated interest in the integration of microwave circuits. Multi-layered coupled-microstrip lines are being widely used at present indesigning microwave integrated circuits.
A transmission line theory has been introduced to study the effectof electromagnetic field on a microstrip in the dielectric substrate [1].A new model for crossed orthogonal lines in [2–5] has utilized lumpedelements taking into account the coupling in the crosstalk region.
Corresponding author: A. Arshadi ([email protected]).
60 Baqerian, Arshadi, and Cheldavi
A new and simple lumped model was introduced for two crossedorthogonal coupled strip lines in [2]. This idea was generalized in [3]for an arbitrary number of orthogonal interconnects in an arbitrarynumber of layers. There are a lot of classical models to analyze simpleand parallel coupled multiconductor lines on the same layer or ondifferent layers [5–10]. Different parameters of coupled microstrip lineshave been studied [20–25] and many electronic devices using coupledMTLs have been fabricated with IC technology [26–38]. Multilayerprinted circuit boards are used in several applications to reduce thecoupling phenomenon between adjacent layers. Orthogonal strip linesdecrease the coupling effect between the lines in two different layers.The problem of crossed lines in the time and frequency domainshas been considered in [11, 12]. Static analysis of crossed planarmulticonductor structure has been examined in [11] using the methodof lines. Also, [12] analyzed coupled strip lines with crossed strips inthe frequency domain.
In this paper, a rigorous electromagnetic theory for quasi-staticfields [1] and a model of the cross talk region [2, 3] have been usedin order to model the effect of an external electromagnetic fieldon orthogonal microstrip lines in a two-layer structure. The entirecoupling phenomenon between the lines is assumed to be concentratedin the crosstalk region located in the center of both lines.
Lumped elements of capacitances and inductances are used tosimulate the coupling in the cross talk region. This model simulatesthe behavior of an orthogonal coupled microstrip transmission line intwo different layers exited by external fields with a great accuracy.
The voltage and current of the equivalent circuit are calculatedalong the length of the lines and compared with those obtained fromfull wave analysis (HFSS). The results show good agreement up to3GHz.
2. THE STRUCTURE AND ITS EQUIVALENT MODEL
Figure 1 shows the structure considered in this work, where twoorthogonal microstrip lines of length Lx and Ly are illuminated bya time harmonic uniform plane wave. The upper strip with widthwup and height d is directed along the x-axis on the boundary of thedielectric and free space, and the lower strip with width wdown andheight d − h is directed along the y-axis in the dielectric media. Thewidth and height of these lines are designed for a 50Ω characteristicimpedance. The ground plane and the strips are perfect conductorsand the dielectric is a lossless substrate with the permittivity εrε0.
In the quasi-TEM approximation, for each line, the electric field
Progress In Electromagnetics Research C, Vol. 9, 2009 61
Figure 1. Two orthogonal microstrip lines illuminated by an externalEM wave.
T4
T2
T3
T1
Figure 2. Model of the orthogonal lines including the crosstalk region.
lines are tied vertically to the ground planes and magnetic field linesin this mode are closed around the strips. In the crosstalk region,most of the electric field lines of the upper strip are closed to the downstrips. Fig. 2 shows the model that has been used for this region.The entire coupling phenomenon in this model is assumed to be inthe crosstalk region in the center of both the strip lines. So we have4 uncoupled sections of transmission lines and a network of lumpedelements representing the cross talk region, as shown in Fig. 2. T1 andT2 represent the lower strip and T3 and T4 represent the upper strip.
62 Baqerian, Arshadi, and Cheldavi
There are many formulas for the capacitance and inductance perunit length of ideal microstrip and strip lines [13–19]. The couplingbetween two layers has been simulated with Cc in this model. So, themutual capacitance of the cross talk region is obtained as [13, 14]:
Cc =wdown
h
εr − εr − εeff
1 + G(
ffp
)2
wdown +
Weff − wdown
1 +(
ffp
)2
(1)
where
G = 0.6 + 0.009Zw (2)
fp =Zw
2µ0d(3)
Weff =dη
Zw√
εeff(4)
η =√
µ0
ε0(5)
and
εeff =12
[εr + 1 + (εr − 1)
(1 + 10
d
wdown
)−0.5]
(6)
In (2) Zw is characteristic impedance.Some of the E-field lines of the lower strip are closed to the
ground plane. This effect is modeled by the capacitance Cg
(Fm
). For
a microstrip line structure, the capacitance per unit length can beobtained from [15]:
Cg =
4εrε0
(wdownd−h + 2
πLn2)
wdownd−h > 3
2πεrε0
[Ln
(16(d−h)πwdown
+ π2
48w2
down4(d−h)2
)]−1wdownd−h < 3
(7)
Inductances in this model represent the length of crosstalk region.Assuming the current distribution of the strips to be uniform, onehas [19]:
L=µ0`
2π
[Ln(u+
√u2+1)+
u2
3+
13u
+uLn
(1u
+
√1u2
+ 1
)− 1
3u(u2+1)
32
]
(8)when u = l/w, udown = wup
2wdownand uup = wdown
2wup.
Progress In Electromagnetics Research C, Vol. 9, 2009 63
3. TRANSMISSION LINE EQUATIONS
Voltage and current induced in the upper and lower strips will bestudied using a distributed source transmission line model [1]. Weconsider the equation ∇ × E = −jωµH and integrate over the areaenclosed by the path shown in Fig. 3. Using Stokes’ theorem we have
− d
dy
∫ −h
−dE(0, y, z) · zdz = jωµ
∫ −h
−dH(0, y, z) · xdz (9)
Next the quantity ∇ · (J + jωεE) = 0 is considered. It is integratedover the volume shown in Fig. 4 which encompasses the strip and thedivergence theorem is applied:
d
dy
∫ wdown2
−w2down2
Js(x, y) · ydx
= −jωε1
∫ wdown2
−w2down2
[E(x, y,−h+)− E(x, y,−h−)] · zdx (10)
Figure 3. Contour of integration in the y-z plane.
Figure 4. Volume chosen for integrating the quantity equation.
64 Baqerian, Arshadi, and Cheldavi
Defining following quantities:
induced voltage
V (y) = −∫ −h
−dE(0, y, z) · zdz (11)
induced current
I(y) =∫ wdown
2
−w2down2
Js(x, y) · ydx (12)
electric charge per unit length
Q(y) =∫ wdown
2
−w2down2
[E(x, y,−h+)− E(x, y,−h−)] · zdx (13)
and magnetic flux per unit length
φ(y) = −µ0
∫ −h
−dH(0, y, z) · xdz (14)
we will have ddyV (y) = −jωφ(y)ddy I(y) = −jωQ(y)
(15)
Based on the solving method of [1] we separate the contribution ofthe external field from that of the scattered field. The total fieldis decomposed to sum of a “primary” and “secondary” field withsuperscripts p and s, respectively:
E = Ep + Es
H = Hp + Hs (16)
The “primary” field is defined as the field exited by the incidentelectromagnetic field in the presence of the ground plane and thedielectric substrate, and in the absence of the metal strip. The“secondary” field is the field scattered by metal strip when exitedby the “primary” field in the presence of the ground plane and thedielectric substrate. From (15) and (16) we have
ddyV (y) = −jωφs(y)− jωφp(y)ddy I(y) = −jωQ(y)
(17)
where
φi(y) = −µ0
∫ −h
−dH i(0, y, z) · xdz; i = p, s (18)
Now with the assumption that all of the fields are quasi TEM, we candefine a per unit length inductance L and a per unit length capacitance
Progress In Electromagnetics Research C, Vol. 9, 2009 65
C:
L =φs
I= −
∫ −h−d Hs(0, y, z) · xdz
∫ wdown2
−w2down2
Js(x, y) · ydx(19)
C =Q
V s=
∫ wdown2
−w2down2
[Es(x, y,−h+)−Es(x, y,−h−)] · zdx
∫ −h−d Es(0, y, z) · zdz
(20)
It is clear that L and C are independent from the incident wave anddetermined only by the physical structure. We can rewrite (17) usingthese definitions
ddyV (y) = −jωLI(y)− jωφp(y)ddy I(y) = −jωCV (y) + jωCV p(y)
(21)
From (21) the transmission line equations describing this structure canbe written in the form
ddyV (y) + jωLI(y) = VF (y)ddy I(y) + jωCV (y) = IF (y)
(22)
which VF (y) = −iωφp(y) and IF (y) = jωCV P (y). The structure isilluminated by a uniform plane wave propagating in the zl directionthat forms an angle θi with the z axis (Fig. 1):
~Ei = ~E0e−j ~Ki·~r (23)
~Hi =√
ε0µ0
zi × ~E0e−j ~Ki·~r (24)
~Ki = K0zi = ω√
µ0ε0zi (25)zi · z = − cos θi (26)
The propagation vector ~Ki can be decomposed into transverse andaxial components with respect to the z direction
~K = ~Kt + Kz z = Ktv + Kzz (27)u× v = z (28)
In this new coordinate system the plane of incidence is the v-z plane.The incident plane wave is decomposed into the sum of TE (E normalto the plane of incidence and directed as u) and TM (E lying in theplane of incidence) waves.
66 Baqerian, Arshadi, and Cheldavi
Based on transmission line theory, the current and the voltagealong the length of a line oriented in the y axis will be written in theform of two coupled differential equations:
dVdy + jZKzI = 0dIdy + j Kz
Z V = 0(29)
If we use the transmission line model to analyze our structure, by acomparison between (29) and Maxwell equation (∇×E = −jωµH,∇×H = jωεE) for TE and TM mode, we will have
ZTMwj =
Kzj
wεj, j = 1, 2 (30)
ZTEwj =
ωµ0
Kzj, j = 1, 2 (31)
and the propagation constants are:
Kzj = K0
√(εrj − 1) + (zi · z)2, j = 1, 2 (32)
In (30)–(32) the index j = 1 refers to the dielectric substrate and j = 2to the free space; εr1 is the relative permittivity of the substrate andεr2 that of free space. Finally for the lower strip we obtain
IF (y) = jωCV p(y) = j2KtC
ε1
sinKz1(d− h)Kz1
e−jKyy
× E0 · vjZTM
w1 sinKz1d + ZTMw2 cosKz1d
(33)
VF (y) = −jωφp(y) = j2ωµ0sinKz1(d− h)
Kz1e−jKyy
×[
E0 · vu · xjZTM
w1 sinKz1d+ZTMw2 cosKz1d
+E0 · uv · x
jZTMw1 sinKz1d+ZTE
w2 cosKz1d
](34)
There are relations like those mentioned above for the strip onthe boundary of the substrate and free space. There is a subtlemodification in the equations describing the voltage and the currentin the upper strip. First of all the change in the height and width ofthe upper strip in comparison with those of the lower strip should beconsidered, and then it is very important to do replacements of x → yand y → −x for the upper strip because of the change in rectangularcoordinates.
For each line we have a system of equations with 4 unknowns. Inorder to solve these differential equations and determine the voltage
Progress In Electromagnetics Research C, Vol. 9, 2009 67
and current along the length of the lines, boundary conditions shouldbe written at x = 0± and x = ±`/2 for the upper strip and y = 0±and y = ±`/2 for the lower strip. Boundary conditions at ±`/2 arerelated to the termination ports and at 0± to the network model of thecrosstalk region. Now we have the following 8 boundary conditionsand our equations are solvable:
V1
(`
2
)= ZwI1
(`
2
)(35)
V2
(− `
2
)= −ZwI2
(− `
2
)(36)
V3
(`
2
)= ZwI3
(`
2
)(37)
V4
(− `
2
)= −ZwI4
(− `
2
)(38)
V1(0) + jωLdownI1(0) = V2(0)− jωLdownI2(0) (39)V3(0) + jωLupI3(0) = V4(0)− jωLupI4(0) (40)
−I1(0) + I2(0)− I3(0) + I4(0) = jωCG
[V1(0) + jωLdownI1(0)
](41)
I4(0)− I3(0) = jωCc [V3(0) + jωLupI3(0)]
−jωCc
[V1(0)+jωLdownI1(0)
](42)
The indexes 1–4 in (35)–(42) represent the respective transmission linesin Fig. 2.
4. RESULTS AND COMPARISON WITH HFSS
The model described in the previous sections applied to the study of theeffect of an external plane wave illumination on the orthogonal coupledMTL structure. The results are given as the voltage and current alongthe length of the lines up to a frequency 3 GHz.
The structure under consideration had these specifications:
Lx = Ly = 15 cmεr = 2.55
wup = 3.85mm, wdown = 1.925mmZw = 50Ω
The incident uniform plane wave is a TM wave with an electric fieldintensity of
√2 in the y-z plane (H i directed as the x axis) and its
plane of incidence is also coincident with the y-z plane with θi = 45.
68 Baqerian, Arshadi, and Cheldavi
(a) (b)
-8 -6 -4 -2 0 2 4 6 8x (cm)
-45
-50
-55
-60
-65
-70
-75
-80
-85
-90
Vo
ltag
e (d
Bv
)Voltage magnitude on down Strip
-8 -6 -4 -2 0 2 4 6 8x (cm)
Vo
ltag
e p
has
e (d
eg)
200
150
100
50
0
-50
-100
-150
-200
Voltage phase on down Strip
Figure 5. Lower strip voltage from the model in comparison withHFSS: (a) Magnitude, (b) phase.
Voltage magnitude on up Strip Voltage phase on up Strip
(a)
-8 -6 -4 -2 0 2 4 6 8y (cm)
(b)
-8 -6 -4 -2 0 2 4 6 8y (cm)
Vo
ltag
e p
has
e (d
eg)
200
150
100
50
0
-50
-100
-150
-200
Vo
ltag
e (d
Bv
)
-55
-60
-65
-70
-75
-80
-85
Figure 6. Upper strip voltage from the model in comparison withHFSS: (a) Magnitude, (b) phase.
0 1 2 3 4 5 6 7 8 9 10Frequency (GHz)
0 1 2 3 4 5 6 7 8 9 10Frequency (GHz)
Volt
age
phas
e on T
erm
inal
1 (
deg
) 200
150
100
50
0
-50
-100
-150
-200
θi = 0
(a) (b)
θi = 0
Volt
age
Mag
nit
ude
on T
erm
inal
1 (
dB
v)
-50
-80
-70
-60
-90
-100
-110
-120
Figure 7. Voltage from the model in Terminal T1 for a plane ofincidence in the z axis: (a) Magnitude, (b) phase.
Progress In Electromagnetics Research C, Vol. 9, 2009 69
Fig. 5 shows the magnitude and phase of voltage for the lower stripand Fig. 6 shows those of the upper strip obtained from the proposedmodel analyzed by MATLAB programming in comparison with the fullwave analysis using HFSS along the length of lines.
Figures 5 and 6 show good agreement of the proposed modelwith the full wave analysis and validate the claim of great precisionof this model in practical fabrication experiments. When the plane ofincidence is in the z axis and the electric field with intensity of
√2 is
coincident with the bisector of x-y plane, there is a special excitation.Figs. 7 and 8 show the voltage and current in the terminal port of thelower strip (T1) obtained from the model up to 10 GHz respectively.
θi = 0
0 1 2 3 4 5 6 7 8 9 10Frequency (GHz)
(b)
Cu
rren
t p
has
e o
n T
erm
inal
1 (
deg
) 200
150
100
50
0
-50
-100
-150
-2000 1 2 3 4 5 6 7 8 9 10
Frequency (GHz)
(a)
Cu
rren
t M
agn
itu
de
on
Ter
min
al 1
(d
BA
)
-90
-120
-110
-100
-130
-140
-150
-160
θi = 0
Figure 8. Current from the model in Terminal T1 for a plane ofincidence in the z axis: (a) Magnitude, (b) phase.
0 1 2 3 4 5 6 7 8 9 10Frequency (GHz)
(b)
Vo
ltag
e p
has
e o
n T
erm
inal
s (d
eg) 200
150
100
50
0
-50
-100
-150
-200
θi = 45
0 1 2 3 4 5 6 7 8 9 10Frequency (GHz)
(a)
θi = 45
Vo
ltag
e M
agn
itu
de
on
Ter
min
als
(dB
v)
-50
-55
-60
-65
-70
-75
-80
-85
-90
-95
-100
Figure 9. Voltage from the model in terminal T1 for θi = 45: (a)Magnitude, (b) phase.
70 Baqerian, Arshadi, and Cheldavi
Finally voltage and current in the terminal port of the lower strip(T1) obtained when θi = 45 and electric field intensity is 1 V/m werefound. Figs. 9 and 10 show these voltages and currents up to 10 GHz,respectively, when φi equals to 0, 45 and 90. φi is the angle between~Kt and x axis.
θi = 45
0 1 2 3 4 5 6 7 8 9 10Frequency (GHz)
(b)
Cu
rren
t p
has
e o
n T
erm
inal
s (d
eg) 200
150
100
50
0
-50
-100
-150
-200
θi = 45
0 1 2 3 4 5 6 7 8 9 10Frequency (GHz)
(a)
Cu
rren
t M
agn
itu
de
on
Ter
min
als
(dB
v)
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
-135
Figure 10. Current from the model in terminal T1 for θi = 45: (a)Magnitude, (b) phase.
5. CONCLUSION
In this paper, a simple model is presented to analyze crossed orthogonalmicrostrip lines exited by a uniform plane wave. This structure issimulated using the model of a MTL radiated by an external planewave and a lumped model of the cross region.
It is shown that this model has a good agreement up to 7 GHzcompared to HFSS. Full wave analysis of such a complicated structurewith HFSS or CST is time consuming and needs huge processingsystems. For example, analysis using the proposed model andMATLAB takes a few seconds but HFSS reaches a convergent solutionin more than an hour.
This model can be used to model more complicated structureslike crossed orthogonal coupled EMTL (Edged MTL) and multilayercoupled structures. It is shown that the proposed model can be usedto design two layer crossed orthogonal microstrip lines with a goodaccuracy.
Progress In Electromagnetics Research C, Vol. 9, 2009 71
REFERENCES
1. Bernardi, P., “Response of a planar microstrip line excited byan electromagnetic field,” IEEE Transaction on ElectromagneticCompatibility, Vol. 32, No. 2, May 1990.
2. Arshadi, A. and A. Cheldavi, “A simple and novel model for edgedmicrostrip line (EMTL),” Progress In Electromagnetics Research,PIER 65, 233–259, 2006.
3. Cheldavi, A. and A. Arshadi, “A simple model for the orthogonalcoupled strip lines in multilayer PCB: (Quasi-TEM approach),”Progress In Electromagnetics Research, PIER 59, 39–50, 2006.
4. Hashemi-Nasab, M. and A. Cheldavi, “Coupling model for the twoorthogonal microstrip lines in two layer PCB board (quasi-TEMapproach),” Progress In Electromagnetics Research, PIER 60,153–163, 2006.
5. Khalaj-Amirhosseini, M. and A. Cheldavi, “Optimum designof microstrip RF interconnections,” Journal of ElectromagneticWaves and Applications, Vol. 18, No. 12, 1707–1715, 2004.
6. Khalaj-Amirhosseini, M. and A. Cheldavi, “Efficient interconnectdesign using grounded lines,” Journal of Electromagnetic Wavesand Applications, Vol. 17, No. 9, 1289–1300, 2003.
7. Zhengorgr, T., F. Charles, and B. Peter, “Design of multilayermicrowave coupled-line structures using thick-film technology,”University of Surrey Guildford.
8. Matsanaga, M., M. Katayama, and K. Yasumoto, “Coupled modeanalysis of line parameters of coupled microstrip lines,” ProgressIn Electromagnetic Research, PIER 24, 1–17, 1999.
9. Homentcovschi, D. and R. Oprea, “Analytically determinedquasistatic parameters of shielded or open multiconductormicrostrip lines,” IEEE Trans. on Microwave Theory andTechniques, Vol. 46, No. 1, 18–24, Jan. 1998.
10. Owens, D., “Accurate analytical determination of quasi-staticmicrostrip line parameters,” Radio and Electronic Engineer.,Vol. 46, No. 7, 360–364, Jul. 1976.
11. Veit, W., H. Diestel, and R. Pregla, “Coupling of crossed planarmulticonductor systems,” IEEE Trans. on Microwave Theory andTechniques, Vol. 30, No. 3, Mar. 1990.
12. Pan, G.-W., K. S. Olson, and B. K. Gilbert, “Frequency-domainsolution for coupled striplines with crossing strips,” IEEE Trans.on Microwave Theory and Techniques, Vol. 39, No. 6, Jun. 1991.
13. Getsinger, W., “Microstrip dispersion model,” IEEE Trans. on
72 Baqerian, Arshadi, and Cheldavi
Microwave Theory and Techniques, Vol. 21, 34–39, Jan. 1973.14. Owens, R. P., “Predicted frequency dependence of microstrip
characteristic impedance using the planar waveguide model,”Electron. Lett., Vol. 12, 269–270, 1976.
15. Edwards, T., Foundation for Microstrip Design, Engalco,Knaresborough, UK, 1991.
16. Pozar, D. M., Microwave Engineering, Addison-Wesley PublishingCompany, 1990.
17. Balanis, C. A., Advanced Engineering Electromagnetics, JohnWiley & Sons, 1989.
18. Collin, R. E., Foundation for Microwave Engineering, McGraw-Hill, 1992.
19. Heer and C. Love, “Exact inductance equation for conductors withapplication to non-complicated geometries,” J. Research NationalBureau of Standards-C, Engineering Instrumentation, Vol. 69C,127–137, 1965.
20. Taha, T. E. and M. Elkordy, “Study of biasing effects on coupledmicrostrip lines characteristics,” International Symposium onCommunications and Information Technologies, ISCIT’06, 906–909, Sep. 2006.
21. Fu, J.-H., Q. Wu, Y.-M. Qin, X.-M. Gu, and J.-C. Lee, “Quasi-static parameter analysis for arbitrary metallization thicknessof RF MEMS coupled microstrip lines,” IEEE Antennas andPropagation Society International Symposium, Vol. 2B, 408–411,Jul. 2005.
22. Sun, S. and L. Zhu, “Guided-wave characteristics of periodicallynonuniform coupled microstrip lines-even and odd modes,” IEEETrans. on Microwave Theory and Techniques, Vol. 53, 1221–1227,Apr. 2005.
23. Muthana, P. and H. Kroger, “Behavior of short pulses on tightlycoupled microstrip lines and reduction of crosstalk by usingoverlying dielectric,” IEEE Transactions on Advanced Packaging,Vol. 30, 511–520, Aug. 2007.
24. Mehdipour, A. and M. Kamarei, “Fast analysis of external fieldcoupling to orthogonal interconnections in high-speed multilayerMMICs,” IEEE Transactions on Electromagnetic Compatibility,Vol. 49, 927–931, Nov. 2007.
25. Abegaonkar, M. P., H. Yu-Kang, and C. Young-Ki, “Fieldconfigurations for electromagnetically (EM) coupled microstrippatch antenna,” IEEE Antennas and Propagation SocietyInternational Symposium, Vol. 3, 128–131, Jun. 22–27, 2003.
Progress In Electromagnetics Research C, Vol. 9, 2009 73
26. Tanaka, T., M. Ueyama, and M. Aikawa, “A push-pushoscillator using coupled microstrip lines in common feedbackloop,” Microwave Conference, KJMW 2007, Korea-Japan, 137–140, Nov. 15–16, 2007.
27. Marimuthu, J. and M. Esa, “Wideband and harmonic suppressionmethod of Parallel Coupled Microstrip Bandpass Filter usingcentered single groove,” IEEE International Conference onTelecommunications and Malaysia International Conference onCommunications, 622–626, May 14–17, 2007.
28. Filho, P. N. S., A. L. Bezzera, A. J. B. De Oliveira, andM. T. De Melo, “Frequency shifting using corrugated coupledmicrostrip lines,” IEEE MTT-S International Conference, 47–50,Jul. 2005.
29. Enokihara, A., H. Yajima, M. Kosaki, H. Murata, andY. Okamura, “Guided-wave electro-optic modulator usingresonator electrode of coupled microstrip lines,” Electron. Lett.,Vol. 39, 1671–1673, Nov. 2003.
30. Enokihara, A., H. Furuya, H. Yajima, M. Kosaki, H. Murata, andY. Okamura, “60 GHz guided-wave electro-optic modulator usingnovel electrode structure of coupled microstrip line resonator,”International Microwave Symposium, 2004 IEEE MTT-S, Vol. 3,2055–2058, Jun. 6–11, 2004.
31. Subbiah, S. and A. Alphones, “Tunable isolator using a coupledmicrostrip line with an obliquely magnetised YIG substrate,” IEEProceedings — Microwaves, Antennas and Propagation, Vol. 150,219–222, Aug. 2003.
32. Rahim, M. K. A., Z. W. Low, P. J. Soh, A. Asrokin,M. H. Jamaluddin, and T. Masri, “Aperture coupled microstripantenna with different feed sizes and aperture positions,”International RF and Microwave Conference, 31–35, Sept. 12–14,2006.
33. Saksiri, W. and M. Krairiksh, “Lumped element model approachfor the bandwidth enhancement of coupled microstrip antenna,”Proceedings of the 2003 International Symposium on Circuits andSystems, Vol. 1, 581–584, May 25–28, 2003.
34. Nickel, J. G. and J. E. Schutt-Aine, “Matched coupledmicrostrip transistor amplifier methodology,” IEEE Transactionson Advanced Packaging, Vol. 26, 361–367, Nov. 2003.
35. Qinjiang, R. and R. H. Johnston, “Modified aperture coupledmicrostrip antenna,” IEEE Transactions on Antennas andPropagation, Vol. 52, 3397–3401, Dec. 2004.
36. Shih, C.-H., G.-H. Shiue, T.-L. Wu, and R.-B. Wu, “The
74 Baqerian, Arshadi, and Cheldavi
effects on SI and EMI for differential coupled microstrip linesover LPC-EBG power/ground planes,” Asia-Pacific Symposiumon Electromagnetic Compatibility and 19th International ZurichSymposium on Electromagnetic Compatibility, 164–167, May 19–23, 2008.
37. Pan, Z. H. and J. H. Wang, “Design of the UWB bandpassfilter by coupled microstrip lines with U-shaped defectedground structure,” International Conference on Microwave andMillimeter Wave Technology, Vol. 1, 329–332, Apr. 21–24, 2008.
38. Sharma, A. K., R. Singh, and A. Mittal, “Wide band dualcircularly polarized aperture coupled microstrip patch antennawith bow tie shaped apertures,” International IEEE Symposiumon Antennas and Propagation, Vol. 4, 3749–3752, Jun. 20–25,2004.