the cbm-mvd prototype: realization & beam test michal koziel goethe-universität, frankfurt...
TRANSCRIPT
The CBM-MVD prototype Realization amp beam test
Michal KozielGoethe-Universitaumlt Frankfurt
mkozielgside
Detector Workshop March 25th-26th 2013 at GSI
2
Outline
CBM experiment and its requirements
Prototyping the CBM-MVD
Mechanical integration
Readout electronics and DAQ
Data analysis
Summary and outlook
3
Required performances (SIS-100)
Radiation tolerance
gt 1013neqcm2 amp gt1 Mrad
Read-out speed gt 30 kframess
Intrinsic resolution lt 5 microm
Operation in vacuum
bdquoLightrdquo support and cooling
Material budget ~ 03 X0
CBM-MVD will- improve secondary vertex resolution- background rejection in di-electron measurements- host highly granular silicon pixel sensors featuring
fast read-out excellent spatial resolution and robustness to radiation environment
The MVD ndash required performances
MVD
Up to 4 stations
4
Sensor RampD
DAQ
Mechanical integration
Sensor RampD
Syst
em in
tegr
ation
Research fields towards the MVD
Data analysis
IKF infrastructure
Class 1000 (ISO 6) clean room
Grey room Electronic workshop Mechanical workshop Equipment
bull Manual wire-bonderbull Probe stationbull 3 microscopesbull Powerful cooling
systembull Vacuum chamber
Prototype highlights
Develop cooling and support with low material budget employing advances materials
Develop sensor readout system capable to handle high data rates
20082010
Material budget~ 245 X0
SensorMIMOSA-20
~200 framessfew 1011 neqcm2 amp
~300 kRad750microm thick
Cooling amp supportTPG+RVC foam
Material budget~ 03 X0
SensorMIMOSA-26 AHR
~10 kframess~1013 neqcm2 amp gt300 kRad
50microm thinReadout
CPdigitalhigh data rates
Cooling amp supportpCVD diamond (thermal grade)
ReadoutSerialanalog
will meet all requirements
Sensor synergy with ALICE (diff geometry)
Readout speed ~30 kframess
Radiation tol gt1013 neqcm2 amp gt1 Mrad
Demonstrator
Prototype
Final
frac12 () of 1st station4 sensors
2012
gt2015
Progress towards the MVD
Sensor 50 microm
Al heat sink
CVD diamond
Flex Cable 200 microm
FEB
FEB
Encapsulation
Wirebonds
Glue
200 microm
Future MVD alternated sensors
6
Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels
MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)
Sensors for the MVD prototype
Bending radius ~30 cmSize 212 x 106 mm2
Possible issues
Internal stress -gt long-term reliability
Yield after assembly
Sensor pre-selection with probe cards
bull Positioning
Aspects addressed during prototyping phase
Sensor
CarrierGlue FPC
FPC
Sensor integration on CVD diamond
Readout amp controlbull Scalability bull Reliability
bull Adhesive bonding
bull Wire bondingbull Encapsulation
FPC
FPCDouble sided
sensor integration
Micro-trackingBeam T1
T2
T3
T4
DUTmicro-tracking
ro
Plane 2
Plane 1
Plane 4
Plane 3DUT
CoolingFront scintillator
Back scintillator
bull Cooling optimization
8
Test beam setup at
T1 T2 T3 T4DUT
Beam
Material budget 0053 X0
Material budget 0053 X0
200 μm CVD diamond 1 mm Al
200 μm CVD diamond
9
DAQ
10
FPC
based on MIMOSA-26 AHR
FEB
clockstartresetJTAG
converterboard
converterboard
converterboard
readout controller
board
driver board
FEB
sensors
readout controller
board
FEB
LVDS 1m4x 80 Mbits
LVDS4 x 80 Mbits
FPC
2 Gbitsoptical fiber to theMVD network
FPC
Slow control board
Dedicated DAQ
Hubreadout
controller board
readout controller
board
PCGeneral purpose add-on HADES TRB V2
~30 m Synergy with HADES
11
Tests before beam time
Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables
Fully operational setup ready for travelling to CERN
Laboratory setup
Corresponding fluence 24 kHzcm2 (limited by source)
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
2
Outline
CBM experiment and its requirements
Prototyping the CBM-MVD
Mechanical integration
Readout electronics and DAQ
Data analysis
Summary and outlook
3
Required performances (SIS-100)
Radiation tolerance
gt 1013neqcm2 amp gt1 Mrad
Read-out speed gt 30 kframess
Intrinsic resolution lt 5 microm
Operation in vacuum
bdquoLightrdquo support and cooling
Material budget ~ 03 X0
CBM-MVD will- improve secondary vertex resolution- background rejection in di-electron measurements- host highly granular silicon pixel sensors featuring
fast read-out excellent spatial resolution and robustness to radiation environment
The MVD ndash required performances
MVD
Up to 4 stations
4
Sensor RampD
DAQ
Mechanical integration
Sensor RampD
Syst
em in
tegr
ation
Research fields towards the MVD
Data analysis
IKF infrastructure
Class 1000 (ISO 6) clean room
Grey room Electronic workshop Mechanical workshop Equipment
bull Manual wire-bonderbull Probe stationbull 3 microscopesbull Powerful cooling
systembull Vacuum chamber
Prototype highlights
Develop cooling and support with low material budget employing advances materials
Develop sensor readout system capable to handle high data rates
20082010
Material budget~ 245 X0
SensorMIMOSA-20
~200 framessfew 1011 neqcm2 amp
~300 kRad750microm thick
Cooling amp supportTPG+RVC foam
Material budget~ 03 X0
SensorMIMOSA-26 AHR
~10 kframess~1013 neqcm2 amp gt300 kRad
50microm thinReadout
CPdigitalhigh data rates
Cooling amp supportpCVD diamond (thermal grade)
ReadoutSerialanalog
will meet all requirements
Sensor synergy with ALICE (diff geometry)
Readout speed ~30 kframess
Radiation tol gt1013 neqcm2 amp gt1 Mrad
Demonstrator
Prototype
Final
frac12 () of 1st station4 sensors
2012
gt2015
Progress towards the MVD
Sensor 50 microm
Al heat sink
CVD diamond
Flex Cable 200 microm
FEB
FEB
Encapsulation
Wirebonds
Glue
200 microm
Future MVD alternated sensors
6
Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels
MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)
Sensors for the MVD prototype
Bending radius ~30 cmSize 212 x 106 mm2
Possible issues
Internal stress -gt long-term reliability
Yield after assembly
Sensor pre-selection with probe cards
bull Positioning
Aspects addressed during prototyping phase
Sensor
CarrierGlue FPC
FPC
Sensor integration on CVD diamond
Readout amp controlbull Scalability bull Reliability
bull Adhesive bonding
bull Wire bondingbull Encapsulation
FPC
FPCDouble sided
sensor integration
Micro-trackingBeam T1
T2
T3
T4
DUTmicro-tracking
ro
Plane 2
Plane 1
Plane 4
Plane 3DUT
CoolingFront scintillator
Back scintillator
bull Cooling optimization
8
Test beam setup at
T1 T2 T3 T4DUT
Beam
Material budget 0053 X0
Material budget 0053 X0
200 μm CVD diamond 1 mm Al
200 μm CVD diamond
9
DAQ
10
FPC
based on MIMOSA-26 AHR
FEB
clockstartresetJTAG
converterboard
converterboard
converterboard
readout controller
board
driver board
FEB
sensors
readout controller
board
FEB
LVDS 1m4x 80 Mbits
LVDS4 x 80 Mbits
FPC
2 Gbitsoptical fiber to theMVD network
FPC
Slow control board
Dedicated DAQ
Hubreadout
controller board
readout controller
board
PCGeneral purpose add-on HADES TRB V2
~30 m Synergy with HADES
11
Tests before beam time
Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables
Fully operational setup ready for travelling to CERN
Laboratory setup
Corresponding fluence 24 kHzcm2 (limited by source)
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
3
Required performances (SIS-100)
Radiation tolerance
gt 1013neqcm2 amp gt1 Mrad
Read-out speed gt 30 kframess
Intrinsic resolution lt 5 microm
Operation in vacuum
bdquoLightrdquo support and cooling
Material budget ~ 03 X0
CBM-MVD will- improve secondary vertex resolution- background rejection in di-electron measurements- host highly granular silicon pixel sensors featuring
fast read-out excellent spatial resolution and robustness to radiation environment
The MVD ndash required performances
MVD
Up to 4 stations
4
Sensor RampD
DAQ
Mechanical integration
Sensor RampD
Syst
em in
tegr
ation
Research fields towards the MVD
Data analysis
IKF infrastructure
Class 1000 (ISO 6) clean room
Grey room Electronic workshop Mechanical workshop Equipment
bull Manual wire-bonderbull Probe stationbull 3 microscopesbull Powerful cooling
systembull Vacuum chamber
Prototype highlights
Develop cooling and support with low material budget employing advances materials
Develop sensor readout system capable to handle high data rates
20082010
Material budget~ 245 X0
SensorMIMOSA-20
~200 framessfew 1011 neqcm2 amp
~300 kRad750microm thick
Cooling amp supportTPG+RVC foam
Material budget~ 03 X0
SensorMIMOSA-26 AHR
~10 kframess~1013 neqcm2 amp gt300 kRad
50microm thinReadout
CPdigitalhigh data rates
Cooling amp supportpCVD diamond (thermal grade)
ReadoutSerialanalog
will meet all requirements
Sensor synergy with ALICE (diff geometry)
Readout speed ~30 kframess
Radiation tol gt1013 neqcm2 amp gt1 Mrad
Demonstrator
Prototype
Final
frac12 () of 1st station4 sensors
2012
gt2015
Progress towards the MVD
Sensor 50 microm
Al heat sink
CVD diamond
Flex Cable 200 microm
FEB
FEB
Encapsulation
Wirebonds
Glue
200 microm
Future MVD alternated sensors
6
Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels
MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)
Sensors for the MVD prototype
Bending radius ~30 cmSize 212 x 106 mm2
Possible issues
Internal stress -gt long-term reliability
Yield after assembly
Sensor pre-selection with probe cards
bull Positioning
Aspects addressed during prototyping phase
Sensor
CarrierGlue FPC
FPC
Sensor integration on CVD diamond
Readout amp controlbull Scalability bull Reliability
bull Adhesive bonding
bull Wire bondingbull Encapsulation
FPC
FPCDouble sided
sensor integration
Micro-trackingBeam T1
T2
T3
T4
DUTmicro-tracking
ro
Plane 2
Plane 1
Plane 4
Plane 3DUT
CoolingFront scintillator
Back scintillator
bull Cooling optimization
8
Test beam setup at
T1 T2 T3 T4DUT
Beam
Material budget 0053 X0
Material budget 0053 X0
200 μm CVD diamond 1 mm Al
200 μm CVD diamond
9
DAQ
10
FPC
based on MIMOSA-26 AHR
FEB
clockstartresetJTAG
converterboard
converterboard
converterboard
readout controller
board
driver board
FEB
sensors
readout controller
board
FEB
LVDS 1m4x 80 Mbits
LVDS4 x 80 Mbits
FPC
2 Gbitsoptical fiber to theMVD network
FPC
Slow control board
Dedicated DAQ
Hubreadout
controller board
readout controller
board
PCGeneral purpose add-on HADES TRB V2
~30 m Synergy with HADES
11
Tests before beam time
Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables
Fully operational setup ready for travelling to CERN
Laboratory setup
Corresponding fluence 24 kHzcm2 (limited by source)
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
4
Sensor RampD
DAQ
Mechanical integration
Sensor RampD
Syst
em in
tegr
ation
Research fields towards the MVD
Data analysis
IKF infrastructure
Class 1000 (ISO 6) clean room
Grey room Electronic workshop Mechanical workshop Equipment
bull Manual wire-bonderbull Probe stationbull 3 microscopesbull Powerful cooling
systembull Vacuum chamber
Prototype highlights
Develop cooling and support with low material budget employing advances materials
Develop sensor readout system capable to handle high data rates
20082010
Material budget~ 245 X0
SensorMIMOSA-20
~200 framessfew 1011 neqcm2 amp
~300 kRad750microm thick
Cooling amp supportTPG+RVC foam
Material budget~ 03 X0
SensorMIMOSA-26 AHR
~10 kframess~1013 neqcm2 amp gt300 kRad
50microm thinReadout
CPdigitalhigh data rates
Cooling amp supportpCVD diamond (thermal grade)
ReadoutSerialanalog
will meet all requirements
Sensor synergy with ALICE (diff geometry)
Readout speed ~30 kframess
Radiation tol gt1013 neqcm2 amp gt1 Mrad
Demonstrator
Prototype
Final
frac12 () of 1st station4 sensors
2012
gt2015
Progress towards the MVD
Sensor 50 microm
Al heat sink
CVD diamond
Flex Cable 200 microm
FEB
FEB
Encapsulation
Wirebonds
Glue
200 microm
Future MVD alternated sensors
6
Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels
MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)
Sensors for the MVD prototype
Bending radius ~30 cmSize 212 x 106 mm2
Possible issues
Internal stress -gt long-term reliability
Yield after assembly
Sensor pre-selection with probe cards
bull Positioning
Aspects addressed during prototyping phase
Sensor
CarrierGlue FPC
FPC
Sensor integration on CVD diamond
Readout amp controlbull Scalability bull Reliability
bull Adhesive bonding
bull Wire bondingbull Encapsulation
FPC
FPCDouble sided
sensor integration
Micro-trackingBeam T1
T2
T3
T4
DUTmicro-tracking
ro
Plane 2
Plane 1
Plane 4
Plane 3DUT
CoolingFront scintillator
Back scintillator
bull Cooling optimization
8
Test beam setup at
T1 T2 T3 T4DUT
Beam
Material budget 0053 X0
Material budget 0053 X0
200 μm CVD diamond 1 mm Al
200 μm CVD diamond
9
DAQ
10
FPC
based on MIMOSA-26 AHR
FEB
clockstartresetJTAG
converterboard
converterboard
converterboard
readout controller
board
driver board
FEB
sensors
readout controller
board
FEB
LVDS 1m4x 80 Mbits
LVDS4 x 80 Mbits
FPC
2 Gbitsoptical fiber to theMVD network
FPC
Slow control board
Dedicated DAQ
Hubreadout
controller board
readout controller
board
PCGeneral purpose add-on HADES TRB V2
~30 m Synergy with HADES
11
Tests before beam time
Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables
Fully operational setup ready for travelling to CERN
Laboratory setup
Corresponding fluence 24 kHzcm2 (limited by source)
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
20082010
Material budget~ 245 X0
SensorMIMOSA-20
~200 framessfew 1011 neqcm2 amp
~300 kRad750microm thick
Cooling amp supportTPG+RVC foam
Material budget~ 03 X0
SensorMIMOSA-26 AHR
~10 kframess~1013 neqcm2 amp gt300 kRad
50microm thinReadout
CPdigitalhigh data rates
Cooling amp supportpCVD diamond (thermal grade)
ReadoutSerialanalog
will meet all requirements
Sensor synergy with ALICE (diff geometry)
Readout speed ~30 kframess
Radiation tol gt1013 neqcm2 amp gt1 Mrad
Demonstrator
Prototype
Final
frac12 () of 1st station4 sensors
2012
gt2015
Progress towards the MVD
Sensor 50 microm
Al heat sink
CVD diamond
Flex Cable 200 microm
FEB
FEB
Encapsulation
Wirebonds
Glue
200 microm
Future MVD alternated sensors
6
Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels
MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)
Sensors for the MVD prototype
Bending radius ~30 cmSize 212 x 106 mm2
Possible issues
Internal stress -gt long-term reliability
Yield after assembly
Sensor pre-selection with probe cards
bull Positioning
Aspects addressed during prototyping phase
Sensor
CarrierGlue FPC
FPC
Sensor integration on CVD diamond
Readout amp controlbull Scalability bull Reliability
bull Adhesive bonding
bull Wire bondingbull Encapsulation
FPC
FPCDouble sided
sensor integration
Micro-trackingBeam T1
T2
T3
T4
DUTmicro-tracking
ro
Plane 2
Plane 1
Plane 4
Plane 3DUT
CoolingFront scintillator
Back scintillator
bull Cooling optimization
8
Test beam setup at
T1 T2 T3 T4DUT
Beam
Material budget 0053 X0
Material budget 0053 X0
200 μm CVD diamond 1 mm Al
200 μm CVD diamond
9
DAQ
10
FPC
based on MIMOSA-26 AHR
FEB
clockstartresetJTAG
converterboard
converterboard
converterboard
readout controller
board
driver board
FEB
sensors
readout controller
board
FEB
LVDS 1m4x 80 Mbits
LVDS4 x 80 Mbits
FPC
2 Gbitsoptical fiber to theMVD network
FPC
Slow control board
Dedicated DAQ
Hubreadout
controller board
readout controller
board
PCGeneral purpose add-on HADES TRB V2
~30 m Synergy with HADES
11
Tests before beam time
Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables
Fully operational setup ready for travelling to CERN
Laboratory setup
Corresponding fluence 24 kHzcm2 (limited by source)
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
6
Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels
MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)
Sensors for the MVD prototype
Bending radius ~30 cmSize 212 x 106 mm2
Possible issues
Internal stress -gt long-term reliability
Yield after assembly
Sensor pre-selection with probe cards
bull Positioning
Aspects addressed during prototyping phase
Sensor
CarrierGlue FPC
FPC
Sensor integration on CVD diamond
Readout amp controlbull Scalability bull Reliability
bull Adhesive bonding
bull Wire bondingbull Encapsulation
FPC
FPCDouble sided
sensor integration
Micro-trackingBeam T1
T2
T3
T4
DUTmicro-tracking
ro
Plane 2
Plane 1
Plane 4
Plane 3DUT
CoolingFront scintillator
Back scintillator
bull Cooling optimization
8
Test beam setup at
T1 T2 T3 T4DUT
Beam
Material budget 0053 X0
Material budget 0053 X0
200 μm CVD diamond 1 mm Al
200 μm CVD diamond
9
DAQ
10
FPC
based on MIMOSA-26 AHR
FEB
clockstartresetJTAG
converterboard
converterboard
converterboard
readout controller
board
driver board
FEB
sensors
readout controller
board
FEB
LVDS 1m4x 80 Mbits
LVDS4 x 80 Mbits
FPC
2 Gbitsoptical fiber to theMVD network
FPC
Slow control board
Dedicated DAQ
Hubreadout
controller board
readout controller
board
PCGeneral purpose add-on HADES TRB V2
~30 m Synergy with HADES
11
Tests before beam time
Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables
Fully operational setup ready for travelling to CERN
Laboratory setup
Corresponding fluence 24 kHzcm2 (limited by source)
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
bull Positioning
Aspects addressed during prototyping phase
Sensor
CarrierGlue FPC
FPC
Sensor integration on CVD diamond
Readout amp controlbull Scalability bull Reliability
bull Adhesive bonding
bull Wire bondingbull Encapsulation
FPC
FPCDouble sided
sensor integration
Micro-trackingBeam T1
T2
T3
T4
DUTmicro-tracking
ro
Plane 2
Plane 1
Plane 4
Plane 3DUT
CoolingFront scintillator
Back scintillator
bull Cooling optimization
8
Test beam setup at
T1 T2 T3 T4DUT
Beam
Material budget 0053 X0
Material budget 0053 X0
200 μm CVD diamond 1 mm Al
200 μm CVD diamond
9
DAQ
10
FPC
based on MIMOSA-26 AHR
FEB
clockstartresetJTAG
converterboard
converterboard
converterboard
readout controller
board
driver board
FEB
sensors
readout controller
board
FEB
LVDS 1m4x 80 Mbits
LVDS4 x 80 Mbits
FPC
2 Gbitsoptical fiber to theMVD network
FPC
Slow control board
Dedicated DAQ
Hubreadout
controller board
readout controller
board
PCGeneral purpose add-on HADES TRB V2
~30 m Synergy with HADES
11
Tests before beam time
Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables
Fully operational setup ready for travelling to CERN
Laboratory setup
Corresponding fluence 24 kHzcm2 (limited by source)
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
8
Test beam setup at
T1 T2 T3 T4DUT
Beam
Material budget 0053 X0
Material budget 0053 X0
200 μm CVD diamond 1 mm Al
200 μm CVD diamond
9
DAQ
10
FPC
based on MIMOSA-26 AHR
FEB
clockstartresetJTAG
converterboard
converterboard
converterboard
readout controller
board
driver board
FEB
sensors
readout controller
board
FEB
LVDS 1m4x 80 Mbits
LVDS4 x 80 Mbits
FPC
2 Gbitsoptical fiber to theMVD network
FPC
Slow control board
Dedicated DAQ
Hubreadout
controller board
readout controller
board
PCGeneral purpose add-on HADES TRB V2
~30 m Synergy with HADES
11
Tests before beam time
Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables
Fully operational setup ready for travelling to CERN
Laboratory setup
Corresponding fluence 24 kHzcm2 (limited by source)
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
9
DAQ
10
FPC
based on MIMOSA-26 AHR
FEB
clockstartresetJTAG
converterboard
converterboard
converterboard
readout controller
board
driver board
FEB
sensors
readout controller
board
FEB
LVDS 1m4x 80 Mbits
LVDS4 x 80 Mbits
FPC
2 Gbitsoptical fiber to theMVD network
FPC
Slow control board
Dedicated DAQ
Hubreadout
controller board
readout controller
board
PCGeneral purpose add-on HADES TRB V2
~30 m Synergy with HADES
11
Tests before beam time
Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables
Fully operational setup ready for travelling to CERN
Laboratory setup
Corresponding fluence 24 kHzcm2 (limited by source)
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
10
FPC
based on MIMOSA-26 AHR
FEB
clockstartresetJTAG
converterboard
converterboard
converterboard
readout controller
board
driver board
FEB
sensors
readout controller
board
FEB
LVDS 1m4x 80 Mbits
LVDS4 x 80 Mbits
FPC
2 Gbitsoptical fiber to theMVD network
FPC
Slow control board
Dedicated DAQ
Hubreadout
controller board
readout controller
board
PCGeneral purpose add-on HADES TRB V2
~30 m Synergy with HADES
11
Tests before beam time
Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables
Fully operational setup ready for travelling to CERN
Laboratory setup
Corresponding fluence 24 kHzcm2 (limited by source)
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
11
Tests before beam time
Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables
Fully operational setup ready for travelling to CERN
Laboratory setup
Corresponding fluence 24 kHzcm2 (limited by source)
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
12
Full beam setup at SPS
Huber cooling system
DAQ
Beam telescope
FEE
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
13
DAQ performance during beam tests
The Readout Network was proven to be highly scalable
All sensors are synchronized No deviations detected within 10 ns precision
DAQ runs very stable No network errors no data loss (5 days of tests)
bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs
bull JTAG passed also all tests (100 000 programming cycles per chain)
bull In total 2TB of data stored
12 sensors running in parallel
259 260
Frame number Frame number
110 ms
~9 s
CERN-SPSSpill structure
40 s9 s
Peak fluence 350-400 kHzcm 2
20 of MIMOSA-26 computing resources used
Factor of 1000 away from peak fluence AuAu 25AGeV
Limited by beam
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
14
Data analysis
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
15
Data analysis
Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope
(straight lines)4 Response of DUT to charged particles
20 ndash 120 GeV PionsCERN SPS North Hall
Plane 1Plane 2
Beam setup
beam
Plane 3Plane 4DUT
bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)
bull 4 inclination angles of 0 30 45 60
bull Temperature (-6 +6 +17 C) amp threshold scans
bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
16
Cluster shape studies
1 23 4
5
6
7
8
Top 8 most frequently observed cluster shapes
Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
Cluster multiplicity studies
17
PRELIMINARY
Charge = 80EPIth[μm] cos [e-]
EPI
Sensingdiode
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
18
Detection Efficiency (DUT)
prob
e
V threshold
V threshold
Ampl
itude
time
NOISE = individual pixel feature
signalnoise
bdquosaferdquo region
ExampleFHR lt 10-5
Efficiency gt 95
PRELIMINARY
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
19
Spatial Resolution (DUT)
Result for the DUT
σx= 33 micromσY= 33 microm
Spatial resolution DUT only
X (r
ow) b
ack
sens
or
Al heat sink
FEB
FEB
200 microm
Front sensor
Back sensor
π-Correlation back - front
X (row) front sensor
Reproducing the intrinsic parameters of the sensors validates the concept of the prototype
PRELIMINARY
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
20
Summary amp outlook
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
Summary
21
Mechanical integration
Achieved An ultra low material budget (03 X0) double-sided micro-tracking
device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures
DAQAchieved
Synchronization Reliability Scalability Slow control amp monitoring tools Data quality
Dataanalysis
Achieved package for alignment and data analysis for test beam setup
(telescope-DUT) online monitoring software (test beam setup)
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
22
Outlook p 1
DAQ
Dataanalysis
Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board
Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic
studies on detector performance
Mechanical integration
Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box
design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)
Improve in heat transfer Quality assurance while assembling (yields)
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
Outlook p 2
23
Expertise needed in the future Glue dedicated radiation tolerant reworkable
dispensing techniques Vacuum feed-through concepts MVD stations
positioning Cooling CO2 or conventional
Mechanical integration
Synergy with FAIR
experiment (and
beyond) needed
How to move the MVD stations in vacuum
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-
24
Thank you for your attention
- Slide 1
- Outline
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Tests before beam time
- Slide 12
- DAQ performance during beam tests
- Slide 14
- Data analysis
- Slide 16
- Cluster multiplicity studies
- Detection Efficiency (DUT)
- Spatial Resolution (DUT)
- Slide 20
- Summary
- Outlook p 1
- Outlook p 2
- Slide 24
-