teosys laser micromachining capabilities - low res version
DESCRIPTION
TeoSys Engineering is a laser micromachining systems integrator and custom laser micromachining services provider. We specialize in deep UV but use all wavelengths when the situation demands. Our intra-cavity gain control allows us to obtain less taper and thus greater aspect ratios when drilling holes through thick material. Full size, industrial laser micromachining systems are also offered which house the above as well as up to 8 additional integrated axes of motion and full parts handling subsystems. These systems come with any type of laser (or wavelength (CO2) 10um, (Nd:YAG) 1.064um, 532nm, (UV) 355nm, (UV) 248nm, (UV)193nm) depending on the needs of the customer application. All of the underlying subsystems remain the same. TeoSys has designed the electrical, motion and software interfaces which are applicable to any type of laser (light bulb). TeoSys offers custom contract services in laser cutting, laser drilling and laser marking. We can laser mark any text, graphics,1 and 2-D barcodes. Our text is as small as 10 microns in character height. Our spot sizes are as small as 1 micron. Our laser systems range from fully automated 5-axis systems to semi-automated 2 axis. Examples of the materials on which we process: Plastics, Ceramics and Glass. Polyimide (Kapton) (Kalrez) Polyurethane PTFE Teflon PEBAX Polystyrene Parylene Nylon Polycarbonate Alumina Zirconia Silicon Carbonate Pyrex Glass Borofloat Borosilicate Diamond Quartz Fused Silica All colored gemstones Steel Stainless Steel Nickle (Mu-metal) Brass Other Metals Organic MaterialsTRANSCRIPT
TeoSys Engineering LLC Capabilities & Products
Introducing TeoSys Engineering LLC g y g gPrecision Microfabrication, Laser Systems
and Integrated Automation Solutions
TeoSys Engineering, LLC2138 Priest Bridge Ct. Ste. 10
Crofton, Maryland 21114Tel: 410 451 8058
TeoSys Engineering LLC Confidential
Tel: 410-451-8058Fax: 410-451-8059www.teosys.com Emre Teoman
Dana Lee Church
TeoSys Engineering LLC Capabilities & Products
What Drives Us – What we like to do• Finding new and innovative ways of applying lasers and laser solutions to resolve difficult, customer driven
applications.
• Finding and developing robust solutions where others could not.
• Demonstrating lasting and persistent value of our services to our clients and customers.
• Seeking to obtain complete customer satisfaction while maintaining a nurturing, creative and fulfilling work environment.
Currently installed customer base.
We are global!
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TeoSys Engineering LLC Capabilities & Products
Applications – Micro Hole DrillingMicro-Hole Drilling In Ceramic
3 6 h l d b d I Gl
Deep Hole Boring
3.6um hole deep bored In Glass
In Glass
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Laser Hole Drilling(Micro Hole Array)
High Speed Micro Hole Drilling in Stainless Steel (Ø 0.001”)
Hole Drilling in Silicon (10um and 50um)
TeoSys Engineering LLC Capabilities & Products
Applications – Deep Hole Drilling in 1MM thick glass slideMicro-Hole Drilling In Ceramic
3 6 h l d b d I Gl
Deep Hole Boring
3.6um hole deep bored In Glass
Hole Drilling in 1MM Soda Lime Glass
Close up view of intra-glass nozzle restriction
In Glass
Hole Drilling in 1MM Soda Lime GlassHole Drilling in 1MM Soda Lime Glass
(30um deep bore , 9um spout entrance and 30um spout exit) Example of Sub-surface shaping.
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TeoSys Engineering LLC Capabilities & Products
Applications – Deep Hole Drilling in 1MM Thick Glass SlideMicro-Hole Drilling In Ceramic
3 6 h l d b d I Gl
Deep Hole BoringHole Drilling in 1MM Soda Lime Gl3.6um hole deep bored In Glass Glass
31.8um deep bore drill thru 1MM Glass Slide
There is less than 3-4 microns of taper throughout the entire 1MM of glass.
High aspectHigh aspect ratios are capable via our intra-cavity gain control in our
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proprietary excimer laser technology.
TeoSys Engineering LLC Capabilities & Products
Applications – 532nm Polyurethane film hole drillingMicro-Hole Drilling In Ceramic
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Deep Hole Boring50um Exit holes in thin polyurethane
3.6um hole deep bored In Glass Cheaper and better capability than using an excimer which has a highera higher maintenance cost.
The software seen toh l f i lthe left is an example
of how we measureour parts.All objective on the 4 piece turret are pcalibrated to a NIST traceable slide so that we can guarantee actually measurement
d t l
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and tolerance specifications.
TeoSys Engineering LLC Capabilities & Products
Applications – 532nm Polyurethane film hole drillingMicro-Hole Drilling In Ceramic
3 6 h l d b d I Gl
Deep Hole Boring Line scribe -- Laser entrance side of the polyurethane (27 micron line
3.6um hole deep bored In Glassp y (
width)
Indicative of performance for thin (25-125um) polyurethane
membrane micromachining singmembrane micromachining using diode pumped 532nm as a low cost and fast micromachining solution. Typically this application always performed using an excimer laser.
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TeoSys Engineering LLC Capabilities & Products
Applications – Hole DrillingHigh Speed Micro Hole Drilling in Stainless Steel (Ø 0.001”)
Hole Drilling in Stainless Steel Ø 50um through
Hole Drilling in Silicon
(Ø 10um and Ø 50um)
Steel Ø 50um through 0.007” thick material (left).
Polymer (silicon) hole drilling (right) using
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drilling (right) using 193nm. Small holes are Ø 10um and large holes
are Ø 50um.
TeoSys Engineering LLC Capabilities & Products
Applications – Generic High-Speed Large Format Part Marking (Macro – Marking)
Slate
Plastic
Galvo based motion control utilizing all laser wavelengths towavelengths to perform traditional part marking for identification and serialization.
Many materials can be marked using many different
l h
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Anodized Metalwavelengths.
TeoSys Engineering LLC Capabilities & Products
Applications – Micro-Marking / Inscription100 um Inscription on
DiamondHigh Speed Inscriptions in Polyimide
(Text Logos and 2-D barcode)
Excimer marking using line widths down to 5 microns.
(Text, Logos and 2-D barcode)Small feature micro marking on transparent media.
1mm Square Bounding Box
75 Micron tall characters with 26 micron line
thickness (fully adjustable via ICVA) internal to the
excimer laser.
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2-D Barcodes on Metal
TeoSys Engineering LLC Capabilities & Products
Capabilities – Micro Marking in the Very SmallExcimer marking using line widths down to 5 microns. Spot overlap up to 0.33µm in pulse synchronized output mode This means that weoutput mode. This means that we are guaranteed a spot at every 0.33µms.
Small feature micro marking on transparent media.
Custom TeoSys user interface aids the operator in making small
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Custom TeoSys user interface aids the operator in making small marks without the knowledge of a CAD system interface.
“No prior experience necessary.”
TeoSys Engineering LLC Capabilities & Products
Applications – Transparent Media Marking
Judged ‘Best Sample’
19.9um Kerf
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TeoSys Engineering LLC Capabilities & Products
Applications – Glass Marking & Precision Reticule FabricationPROJECT:Marking custom glass optics with ultra low g g pdebris micro-inscriptions
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TeoSys Engineering LLC Capabilities & Products
Second test, most samples had excessive debris
Third Lot, all parts considered OK!
Applications – Glass Marking & Precision Reticule Fabrication
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TeoSys Engineering LLC Capabilities & Products
Visible Glass Marking - TeoSys Recipe and AdvantagesTeoSys Process Recipe• Final sample set was run @193nm, high rep rate for
excimers with high demagnification low fluence andexcimers, with high demagnification, low fluence and multiple internal (ICGC) and external spatial apertures to control groove shape, reflectivity and translucence.
• No additional material or substances were used to enhance inscription quality. p q y
• Groove shape is extremely important in controlling the bright and dark field performance of the optic.
• Current marking times run from 12min to 35min, without optimization. Faster speeds are probable with additional p p pprocess development.
Advantages• TeoSys can GUARANTEE that this process will never
k d th b t t ( lik th l d d iti )crack or damage the substrate (unlike some other laser and deposition processes).• The current process produces very little debris (all submicron in nature) and minimal recast.• May not need post inscription cleaning of any kind. IPA wipes was the only post process used.• None of the samples produced were post process treated in any way.
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None of the samples produced were post process treated in any way.• The TeoSys inscriptions will not degrade, nor loose contrast and are totally insensitive to temperature,
humidity, or vibration (unlike other reticule constructions).
TeoSys Engineering LLC Capabilities & Products TeoSys Engineering LLC Capabilities & Products
Capabilities – Part Marking for IdentificationHigh Speed Precision STENT Marking
Single pulse implementation of a 2D Data Matrix barcode
B d iBarcode is readable via a video microscope display screen using a Data Matrix 2D
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Matrix 2D barcode scanner device.
Data Matrix 2-D Barcode on Stent Leg
TeoSys Engineering LLC Capabilities & Products
Applications –Channel Drilling 27um Kerf Lines on Aluminum – Cross Pattern
Laser Ablation
25um Channel in Plastic
Top Hat Shape – Strict Bottom ProfileExcimer laser channel drilling for microfluidics (left) as well as thin film bl ti ( i ht)ablation (right).
Channel drilling for tube bending applications where the entire wall is
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the entire wall is removed (bottom right).
27um Lines on Aluminum Using Back Lighting as illumination
TeoSys Engineering LLC Capabilities & Products
Applications – Channel Drilling Parameter DefinitionKey Tube Cut Design Parameters• Cut width (kerf)
• Spacing between groups
• Spacing within a group
• Number of groups
• Rotation between each line in a group• Rotation between each line in a group
Varying of these parameters will result in successful flexibility for
TeoSys Engineering LLC Confidential
Varying of these parameters will result in successful flexibility for the different tube diameters and flex requirements
TeoSys Engineering LLC Capabilities & Products
Applications – Channel Drilling
Custom Motion Systems and Fixtures
Tube cutting in proprietary pattern.
Channel drilling in steel bar stock using 532nm, frequency doubledusing 532nm, frequency doubled Nd:YAG laser.
Channel widths of 25um through 500ums which spans the gamut between micromachining and
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traditional mechanical machining.
TeoSys Engineering LLC Capabilities & Products
Applications – Channel Drilling
TeoSys Engineering LLC Confidential
TeoSys Engineering LLC Capabilities & Products
Laser Microwelding
Laser Micro Molding
31mm
Other Applications
Microwelding Mold Master - Stainless
100 micron gears on diamond
1mmon diamondPolyimide
Master32 AWG
Stainless Tube
Custom Applications
Medical SensorAblate Window
Paralyene and
Completed AssembliesPolyimide Fiber Optic Print Head
Titanium Nitride
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TeoSys Engineering LLC Capabilities & Products
Custom Laser Systems Development – LMS 5000Automated Part Loading , Drilling, Measurement
and Ejection in Laser Drilling SystemLoads and Orients up to 6 Different Part Types
• Custom designed system to drill 50um Ø holes in steel mini-cups comprised of mostly nickel.
•Laser is an 1064nm Nd:YAG frequency doubled to 532nm.
A t ti i t f f di•Automation consists of a feeding mechanism, transfer system, pick and place tool, rotary index plate with 8 individual stations.
• Motion and laser system is integrated viaMotion and laser system is integrated via executive control software which also provides for a simplified man machine interface for production operators.
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TeoSys Engineering LLC Capabilities & Products
1. Automatic part loading via rung system which gathers parts from a bin ith a single orientation
4. Parts put onto the index plate in the appropriate alignment
LMS-5000 Laser System DevelopmentParts Automation System
gathers parts from a bin with a single orientation.•Each part type has a different drill location
•The part is rotated by the
3. Parts are picked up via vacuum tool and placed onto the indexing plate at the loading station
index plate to the drill station where it is laser drilled
5. After drilling, the part rotates to the measurement station where it is measured
2. Parts are rotated while facing upwards and roll down a track where they are placed onto a
measured
6. Based on the t th
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plate which separates each part from the other
measurement, the part is then ejected into a good or a bad bin
TeoSys Engineering LLC Capabilities & Products
• Automatic generation of tool cut path programs based on
• Motion system stage feedback for operator (axis position)
• Automatic calibration (in-situ) of the optical (flow)
LMS-5000(Software & Control)
user specified parameters including the following:
•Part type •Hole Diameter•Stage Speed•Trepan Number of Passes
) p ( )measurement system which measures hole diameter
• Automatic statistical process control – display
d di t t tPasses•Laser Energy
• Real time display of system status bits•Real time display of drilling operation• Operational modes such as
and recording to status files
dry run and full auto drill
• In-Situ Measurement of the machining features (hole diameter)
•Vertical distance between calipers, horizontal distance and point to point distance between horizontal and vertical intersecting lines
• Bright field dark field illumination top
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• Bright field, dark field illumination, top and bottom illumination
• Camera switching for operator feedback of multiple automation stations
TeoSys Engineering LLC Capabilities & Products
Custom Systems’ Software – LMS-5000 – Integrated Automatic Inspection• Diameter measurement via light extinction sensor made of dual laser diodes / photo detector combination• Measure hole diameters with 1 micron resolution from 20um Ø through 75um Ø• Basic hole positional information within 25um of true position• Diameter measurement calculated within 500ms and position measurement within 1 second.a ete easu e e t ca cu ated t 500 s a d pos t o easu e e t t seco d
• Incorporation of an Ophir Profilometer to measure beam profile
• Creation of 3rd order regression curve for calibration of photo detector
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with actual hole diameters to create the relationship between diameter and application flow rates.• Ability to take real time measurements from instrument• Status and feedback during operation
TeoSys Engineering LLC Capabilities & Products
Custom Systems - LMS-1500, IR / Green Micromachining System (532nm and 1,064um)
Semi-Automatic Parts Handling
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High Speed Precision Rotary
TeoSys Engineering LLC Capabilities & Products
Standard Systems – LMS-2500 - Heavy Duty Excimer Laser System
Heavy Duty T300, 193nm Deep UV 300 Hz HighSpeed Excimer Laser with Power Output of 14-16mJ
per pulse at 100 Hz.2x4” 1/4um accurate precision stages (X, Y, Z, U)
Automated Gas Handling. SystemTwo zoom levels
Integrated UV and Visible Imaging with projectedIntegrated UV and Visible Imaging with projectedfocusing reticule
Four Axis monochromatic illumination system
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TeoSys Engineering LLC Capabilities & Products
Standard Systems – LMS-650 Professional Excimer Laser System
• Heavy Duty T100 Laser.• 193nm Deep UV 100-200 Hz Excimer Laser .p• 10 - 12mJ per pulse.• 2x2” 1um accurate stages (X, Y automated
Axis).• 1” 2um accurate manual z-stage.• Manual Gas Handling• Manual Gas Handling.• Integrated UV and Visible Imaging with
projected focusing reticule.• Two Axis monochromatic illumination system
(Top and Bottom)
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Exclusive Excimer System of Harvard Robotics Laboratory
TeoSys Engineering LLC Capabilities & Products
Standard Systems – LMS-500 / 550Desktop Excimer Laser System
• Heavy Duty T20 Laser.193 D UV 25 H E i L• 193nm Deep UV 25 Hz Excimer Laser .
• 7 - 10mJ per pulse at 100 Hz.• 2x1” 3um accurate stages (automated X, Y manual Z Axis).• 1” 5um accurate manual Z-Stage.• Manual Gas Handling.
193nm Deep UV Laser Source Fully Integrated
Desktop
u G s d g.
Portable Version LMS-550User Friendly
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TeoSys Engineering LLC Capabilities & Products
LMS-550 – Fully Automated Wire Stripping
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TeoSys Engineering LLC Capabilities & Products
Custom Systems – UV Excimer Laser IntegrationCustom Systems Retrofitted Into Existing Automation Lines
Custom Drilling System for Medical Applications
• Integration of custom laser solutions into existing manufacturing systems.
• Clean room class 1000 • System Controller with Advanced Burst Mode Power Leveling and
Smart• Flow System• Advanced Gas Cabinet with Tank Minder Feature• Ultra-Stable Class I Enclosure
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TeoSys Engineering LLC Capabilities & Products
Custom Systems
Custom High Speed CO2 PillCustom High Speed CO2 Pill Drilling System
Generic Rapid Release Windows
In medication
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Custom precision four beam Excimer medical catheter drilling system
TeoSys Engineering LLC Capabilities & Products
The verification of each calibration constant was performed by measuring a known feature size using the NIST traceable calibration slide:
Offline NIST Traceable Measurement for Job Shop
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The features size according to the documentation that came with the slide is 50 microns. The circles outlined in REDindicate the measurements that we made using the calibration constant. We are good with this measurement.
TeoSys Engineering LLC Capabilities & Products
The final phase of the calibration
Offline NIST Traceable Measurement
of the calibration and measurement portion of the purchase order was to password pprotect the calibration constant.
This cal constant i d f this used for the measurement for both in-situ and offline metrology.
The screen to the right illustrates the password protection.
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p
TeoSys Engineering LLC Capabilities & Products
Upgraded Laser with Inspection Station and Kinematic Tube
Holding FixtureNew Laser System
with In-Situ Measurement Setup
In-Situ NIST Traceable Measurement for Catheter Drilling
Handling Table
Fixture #2
New Magnetic Kinematic
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New Magnetic Kinematic Holding Fixture with
Aerodynamic Slug Ejection Feature
TeoSys Engineering LLC Capabilities & Products
In-Situ Measurement Implementation for Catheter DrillingThe idea of this view is to provide 100%
The next phase of the work that TeoSys took upon itself to perform is the transition from 100% offline measurement to 100% on-line or in-situ , measurement. All measurement deliverables will be collected during the drilling process itself. See below:
measurement while actually machining the part. If the part is left in-situ, we can
thmeasure the actual exit dimensions non-destructively.
To the right is aTo the right is a part that had just been drilled and what the measurement of the exit hole would be.
This picture will be one of the deliverables as
ifi ti f th
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verification of the drilling process.
TeoSys Engineering LLC Capabilities & Products
Micro Operator: Custom Real Time Machine Vision System Micro Inspector: Post-process Measurement and Inspection Tool
Software Engineering – Machine Vision Application
Aligns part during d
Full video microscope capabilityprocess and compensates for rotation error
Halts process if pre-programmed
Provides saving and loading of previously processed images
Allows images to be non-destructively overlaid with user supplied text
h titl d t tprogrammed conditions are not met thereby reducing improperly processed parts
ifi f
such as title, date, etc.Fully integrated with motion system
for complete process inspection
Notifies operator of processing status
Micro View
Simple video microscope capability
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p y
TeoSys Engineering LLC Capabilities & Products
Software Engineering – Proprietary ProductsMicroMMI: Real Time Machine Vision System
• Multiple image processing algorithms (source code) available via proprietary vision system language (Based on RS 274)proprietary vision system language (Based on RS-274)
• Image processing source automatically generated via MicroCaliper program and may be copied into MicroMMI editor
• Fully integrated with motion system for pre/post/in-processing inspection, measurement and quality control
• Provides full in-process laser and system controlProvides full in process laser and system control• Provides an integrated development environment for operator to
single step, edit, and debug motion control programs written in the vision system language
Allows operator to make measurements of features within the live video image once the software has
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software has been calibrated to the optics and motion system
TeoSys Engineering LLC Capabilities & Products
The machine vision prototypingapplication will automaticallygenerate the machine vision PRGprogramming syntax for each of thecommands that the user applies viacommands that the user applies viathe user interface. This PRG codecan then be copied and pasted intoany PRG program that is capable ofrunning with MicroMMI.
In order to aid the engineers during experimentation, TeoSys hasprovided an image and machine vision prototyping application, whichcan be used to apply the various machine vision algorithms withoutwriting a single line of PRG code. This tuning program allows theuser to experiment with all of the machine vision commands beforepactually using them in a PRG program. Due to the many variablesinvolved when using any kind of image processing, this user interfacewas designed to provide a nondestructive method of testing whichimage processing and measurement functions should be used for aparticular video stream. All of the functions that are available in this
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prototyping interface are available via PRG programming commandsto the MicrOperator application so that they may be used in real-timein a motion control program.
TeoSys Engineering LLC Capabilities & Products The geometrical Search tool is a very good tool to use whensearching for a pattern that moves around the master image,changes intensity, suffers from blurring or defocusing, and forpatterns that reverse their contrast. Image number 1 was used totrain a fiducial pattern. The ROI was drawn around the fiducialso that the ROI bounding box just enclosed the fiducial fully.After the training was complete, a new image was loaded thatwas a picture of the same fiducial but its location within themaster image had changed and it was severely defocused. Thegeometrical search algorithm had no problem finding thegeometrical search algorithm had no problem finding thefiducial in picture number 2.
1. Original Fiducial Image Used to Train Fiducial Pattern
The Search tool can be used to find a trained pattern within thei (fi ld f i ) d k d i i imaster image (field of view) and make a decision to continue
based on the presence or absence of the fiducial or on thefiducial’s location. All patterns must have geometricalcharacteristics that can be seen such as the fiducial above. Thepattern must be unique and different from the rest of the image.It is best to have images that respond well to the Bi-Level
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2. Image of Defocused and Moved Fiducial
It is best to have images that respond well to the Bi-Levelthreshold. If the master image (or field of view) responds well tothe Bi-Level, then most characteristics should be able to befound.