(technoprobe tpeg mems t4 opm) eliminates challenges …test yield for t4_opm is significantly...

(Technoprobe TPEG™ MEMS T4 OPM) Eliminates Challenges faced with Cobra-like Solutions

Froilan Jandoc - Allegro Microsystems Phils.Mer Joy Uy - Allegro Microsystems Phils.

Wally Lacson - Technoprobe Phils.

2F. Jandoc, M. Uy, W. Lacson

OBJECTIVEThe objective of this project is to improve quality, machine utilization and repair-maintenance cost of probe card by converting present technology to best known technology available locally.

BACKGROUNDWhen the Probe product was initially transferred, the team was tasked with using existing technology being used by AML. Even with experience using this technology, manufacturing experienced quality issues (specifically hitting glass), poor up time and machine utilization, long repair lead-time due to overseas repair and high costs associated with the probe card price and overseas shipping cost.

Due to the negative impact as stated above, the team decided to initially to convert two problematic devices using a locally supplied and supported probe card.


ISSUES PRIOR QUALIFYING T4_OPM

Frequent hitting glass / probe mark misalignment

High occurrence of misaligned pins, bent pins, sunken pins and broken pins

Low mean touch down before repair

Long probe card repair lead time


TARGETS To improve the utilization from 58% to 70%.

To reduce misaligned probe marks and hitting glass issues by 90%.

To remove the 100% wafer inspection step.

To improve repair lead time of probe cards from 8 weeks to 1 week.

To improve mean touchdown before repair from 25,000 to 350,000.

To have a probe card vendor with local capability that can accommodate new and challenging designs.


Hitting glass Images using Cobra-like Technology

Technoprobe TPEG T4_OPM specs

T4_OPM - small probe mark even at 75um ODCobra-like Technology - large mark with less OD applied (<20 um)Cobra-like Technology Card has high BCF

Probe Mark Comparison of Vendor A (Cobra-like Technology) and T4_OPM

Multiple Test 1X / 5X / 10X using T4 TPEG Technology

1X TDPM Measurement = 12um

NORTH




SOUTH





EAST





WEST




Cobra-like Technology Probe Card = 8.29861 secsT4_OPM = 7.68754 secs

TEST TIME COMPARISON

• Repair Lead Time

Vendor Repair Lead Time

TP < 1 Week

Competitor Probe Card 1 month

Category Competitor Probe Card Technoprobe

Probing OD 100 um 40 um

Soak Time 2 Hrs. 2 Hrs.

Preheat Setting Same Same

Cleaning settings:

Cleaning Media ITS PP-300 WA6000

Cleaning OD 75 um 35um

Cleaning Frequency 125 TD 125 TD

• Prober and Cleaning setup Comparison

Use less expensive polishing media in comparison with competitor card.

Advantages using TP Probe Card

Improved Machine Index Time due to 4X1 or 1X4 configuration

Competitor Cards

Advantages using TP Probe Card

TechnoProbe Card

YIELD DATA COMPARISON (XXXX Device)

• Average Probe Yield of 93.62% using Cobra-like Technology Probe card.• Average Probe Yield of 94.78% using T4_OPM Probe card.• Significant Probe yield improvement, increased Good Die quantity

80.00

82.00

84.00

86.00

88.00

90.00

92.00

94.00

96.00

98.00

100.00

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

YIELD DATA COMPARISON

Cobra Technology T4_OPM Target Yield

YIELD DATA COMPARISON (YYYY Device)

0

20

40

60

80

100

120

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

YIELD DATA COMPARISON

Cobra Technology T4_OPM TARGET YIELD

• Average Probe Yield of 90.23% using Cobra-like Technology Probe card.

• Average Probe Yield of 93.55% using T4_OPM Probe card.• Significant Probe yield improvement, increased Good Die quantity.

0 142 0 0

3591

0 0 0 0 268 0 12373 0 0 0 0

5207

2985

352

4756

346 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 00

1000

2000

3000

4000

5000

6000

1733

018Q

…17

3602

4Q…

1738

221Q

…17

3942

1Q…

1741

532Q

…17

4598

9Q…

1746

294Q

…17

4591

5Q…

1751

337Q

…18

0101

9Q…

1803

955Q

…18

0466

2Q…

1805

060Q

…18

0620

7Q…

1806

436Q

…18

0768

2Q…

1807

588Q

…18

0945

5Q…

1812

490Q

…18

1433

5Q…

1816

074Q

…18

1938

1Q…

1822

872Q

…18

2771

0Q…

1827

972Q

…18

2821

0Q…

1829

916Q

…18

3197

0Q…

1832

425Q

…18

3375

2Q…

1833

873Q

…18

3538

3Q…

1835

594Q

…18

3679

8Q…

1836

896Q

…18

3416

9Q…

1836

166Q

…18

3727

7Q…

1837

277Q

…18

3761

6Q…

1840

941Q

…18

4126

2Q…

1842

762Q

…18

4454

7Q…

1845

799Q

…18

4632

0Q…

1847

529Q

…18

4800

6Q…

1849

419Q

…18

5061

2Q…

1850

773Q

…18

5104

4Q…

XXXX - Hitting Glass Occurrence - Dice per Lot Comparison of Old and New Probe Card

76-XXXX(Cobra Technology)

0002281(T4_OPM)

0 1 0 0 2 0 0 0 0 2 0 1 1 0 0 0 0

4

7

2

910

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 00

2

4

6

8

10

12

1733

018Q

…17

3602

4Q…

1738

221Q

…17

3942

1Q…

1741

532Q

…17

4598

9Q…

1746

294Q

…17

4591

5Q…

1751

337Q

…18

0101

9Q…

1803

955Q

…18

0466

2Q…

1805

060Q

…18

0620

7Q…

1806

436Q

…18

0768

2Q…

1807

588Q

…18

0945

5Q…

1812

490Q

…18

1433

5Q…

1816

074Q

…18

1938

1Q…

1822

872Q

…18

2771

0Q…

1827

972Q

…18

2821

0Q…

1829

916Q

…18

3197

0Q…

1832

425Q

…18

3375

2Q…

1833

873Q

…18

3538

3Q…

1835

594Q

…18

3679

8Q…

1836

896Q

…18

3416

9Q…

1836

166Q

…18

3727

7Q…

1837

277Q

…18

3761

6Q…

1840

941Q

…18

4126

2Q…

1842

762Q

…18

4454

7Q…

1845

799Q

…18

4632

0Q…

1847

529Q

…18

4800

6Q…

1849

419Q

…18

5061

2Q…

1850

773Q

…18

5104

4Q…

XXXX - Hitting Glass Occurrence - Wafer per Lot Comparison of Old and New Probe Card


0002281(T4_OPM)

COBRA-LIKE TECHNOLOGY

T4_OPM PROBE CARD

Hitting Glass Occurrence Comparison (XXXX Device)

0 0 0 0

6482

0 0

9469

0 8921652 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 00

2000

4000

6000

8000

10000

1733

144…

1736

016…

1742

019…

1745

023…

1741

125…

1736

017…

1744

089…

1746

111…

1747

058…

1748

124…

1752

005…

1750

096…

1746

125…

1802

077…

1803

094…

1805

068…

1736

049…

1750

096…

1806

063…

1806

113…

1809

015…

1808

060…

1815

066…

1816

099…

1819

101…

1819

062…

1821

038…

1820

104…

1820

104…

1822

109…

1822

108…

1822

110…

1824

073…

1823

016…

1823

056…

1823

055…

1825

054…

1827

098…

1826

089…

1827

027…

1827

046…

1828

038…

1828

039…

1831

015…

1830

072…

YYYY - Hitting Glass Occurrence - Dice per Lot Comparison of Old and New Probe Card


0002281(T4_OPM)

0 0 0 0

6

0 0

13

0 2

7

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 002468

101214

1733

144P

DAA

1736

016P

DAA

1742

019P

DAA

1745

023P

DAA

1741

125P

DAA

1736

017P

DAA

1744

089P

DAA

1746

111P

DAA

1747

058P

DAA

1748

124P

DAA

1752

005P

DAA

1750

096P

DAA

1746

125P

DAA

1802

077P

DAA

1803

094P

DAA

1805

068P

DAA

1736

049P

DAA

1750

096P

DBA

1806

063P

DAA

1806

113P

DAA

1809

015P

DAA

1808

060P

DAA

1815

066P

DAA

1816

099P

DAA

1819

101P

DAA

1819

062P

DAA

1821

038P

DAA

1820

104P

DAA

1820

104P

DAB

1822

109P

DAA

1822

108P

DAA

1822

110P

DAA

1824

073P

DAA

1823

016P

DAA

1823

056P

DAA

1823

055P

DAA

1825

054P

DAA

1827

098P

DAA

1826

089P

DAA

1827

027P

DAA

1827

046P

DAA

1828

038P

DAA

1828

039P

DAA

1831

015P

DAA

1830

072P

DAA

YYYY - Hitting Glass Occurrence - Wafer per Lot Comparison of Old and New Probe Card

Hitting Glass Occurrence Comparison (YYYY Device)

T4_OPM PROBE CARD

COBRA-LIKE TECHNOLOGY

Contact Resistance Measurements

BCF Comparison of TP and Vertical Cobra-like Probe Cards @ 25um OD

0

1

2

3

4

5

0 1 2 3 4 5

BCF

SITE

Competitor Card

0

1

2

3

4

5

0 1 2 3 4 5

BCF

SITE

Technoprobe Card

Competitor Card (Cobra-like) @ 25 microns Overdrive BCF reading: 2.9 - 4.1

Technoprobe Card (TPEG T4 OPM) @ 25 microns Overdrive BCF reading: 2.7 - 4.0

Conclusion Technoprobe Card and Competitor card BCF performance at 25microns overdrive are almost the same.

BCF Comparison of TP and Vertical Cobra Probe Cards @ 75um OD

0123456789

101112131415

0 1 2 3 4 5

BCF

SITE

Competitor Card [OD @ 75]

0123456789

101112131415

0 1 2 3 4 5

BCF

SITE

Technoprobe Card [OD @ 75]

Competitor Card (Cobra Like) @ 75 microns Overdrive BCF reading: 9.7 - 12.9

Technoprobe Card (TPEG T4 OPM) @ 75 microns Overdrive BCF reading: 3.7 - 4.6

CONCLUSION:Competitor Card (Cobra Like)

BCF reading increases as the overdrive increases Technoprobe Card (TPEG T4 OPM)

BCF reading was consistent ranging up to 4.5g even though the overdrive applied has different values.

CONCLUSIONS Utilization was improved from 58% to 80%.

Test yield for T4_OPM is significantly improved and increased meeting the target device yield.

Misaligned probe marks and hitting glass issues are significantly reduced from 40% to 0%.

100% wafer inspection was removed, and normal inspection requirement is done on affected devices, thus lot cycle time is improved.

Rebuild lead time of probe cards was reduced from 6-8weeks to less than 1 week.

Cobra like technology BCF reading increases as overdrive increases, while T4 BCF reading was consistent ranging up to 4.5g even though overdrive applied has different values.

Improvement on test time from 8.29 to 7.68 seconds/touch down.

FUTURE PLANS Our Team plans to convert more devices that have

similar quality and productivity issues to Technoprobedesign.

Considering Technoprobe card as an option for new product designs.

Follow on activities include collaborating with and evaluating Technoprobe for Hot Probe.


Thank You

Mike Agbesi – Allegro LLC Probe Process Engr.Mark Harbinson – Allegro LLC Equipment Development ManagerJim Tan – Allegro Phils. Test Eng’g. Department ManagerJack Sadie- Allegro Phils. Test and Probe Operation Director

Raffale Vallauri – R&D & Process Eng’g DirectorHellen Kee – Asia Pacific Sales Manager.

(technoprobe tpeg mems t4 opm) eliminates challenges …test yield for t4_opm is significantly...

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