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SRN# Date Description NOTE: If a document does not appear on this list it was:

a) Never approved for release b) Superceded by another document c) The information is included in the manual

IN1040A 1/96 CPU Replacement; Themis frame grabber adapter IN1041C 7/96 CPU Retrofit; Themis board with GMS board IN1051 6/96 Transport Base Model 360C-HD IN1060 7/96 Unpacking Model 360C-HD on transport base from shipping crate IN1061 12/96 Y Axis cable rerouting IN1062A 1/97 Model 360C IN1063 2/97 Lubrication Kit Instruction/application sheet IN1064 4/97 Bearing housing cover assembly replacement IN1065 11/99 Power supply replacement procedure IN1066 11/99 Wire clamp assembly IN1067 11/99 Change fan speed on 4-bulb fluorescent fixture IN1068 8/97 Installation of new PR, Version GSII IN1069 7/97 Installing the replacement hard disc drive IN1071 11/97 Installation of Z-cable protection kit IN1072 11/99 Matching Signal Sample on new ultrasonic generator board IN1073 1/98 Installing the Motor/Encoder Replacement Kit IN1075 4/98 Replacing Z motor and/or Theta motor IN1076 2/99 Small wire forcer PWM switch IN1077 4/98 Light fixture latch IN1078 4/98 Replacing the Dereeler IN1080 11/99 Replacing the NVR chip on the THEMIS IN1081 12/99 Replacing the fluorescent fan IN1082A 4/00 Retrofit Force CPU for Themis or GMS CPU IN1083 10/00 Generator Load Box IN1083A 4/01 Generator Load Box Revision IN1084 8/00 Camera Mounting Block IN1088 1/01 Convert an ALC Head to work as a Standard Large Wire IN1089 2/02 Replace X and/or Y Leadscrew IN1090 3/02 Wide Angle Coaxial Light IN1091 4/01 Conversion from Large to Small Wire IN1092 4/01 Z Belt Replacement Kit IN1093 6/01 Rebuilding the ALC Bond Head IN1094 8/01 Clamp Mounting Block Replacement IN1095 6/01 Camera Slide Replacement IN1096 8/01 Grounding the Transducer IN1097 7/01 Dorio Monitor Board Isolation Kit IN1099 3/03 Z Cable Spacer Kit IN1100 3/03 CHD Tool Kit IN1101 N/A

11/19/99

INSTALLATION INSTRUCTION

APPROVAL SHEET

No.: 1040A Resp. Engineer

V.P. Engineering “Bob” Babayan

Subject: CPU Replacement, Themis;Frame Grabber Adapter

Mktg. Approval

V.P. Marketing Bill Larkin

DrawingNo.:

171555, Rev B Tech. PublicationApproval

PreparedBy:

George Ritsi

Purpose:

Replacement of the Themis CPU Board marked TSVME-120 with TSVME-120E requires installation ofa Frame Grabber Adapter to correct a bus timing compatibility problem.

Themis redesigned the CPU Board to improve performance and reliability. The new board has a Themispart number marked TSVME-120E on the lower ejector handle and on the sticker attached to the VMEP2 connector. The design change, however, introduced a bus timing incompatibility. The kit providedsolves the timing compatibility issue with the inclusion of a Frame Grabber Adapter, to be installed onthe Frame Grabber Board.

Applicable:

Model 360A (with new PR) & Model 360B

Summary:

Replacement of this Themis board is accomplished using a kit from Orthodyne consisting of:

(1) CPU Board, Themis, TSVME - 120E

(1) Frame Grabber Adapter

(1) Software diskette, Version 4.09 or later

(1) Drawing 171555

January 8, 1996

INSTALLATION INSTRUCTIONS 1040A 1

INSTALLATION INSTRUCTIONS No. 1040A

Replacement of Themis CPU Board.

ApplicableModel 360A (with new PR) & Model 360B

BackgroundReplacement of the Themis CPU Board marked TSVME-120 with TSVME-120E requiresinstallation of a Frame Grabber Adapter to correct a bus timing compatibility problem.

Themis redesigned the CPU Board to improve performance and reliability. The new board has aThemis part number marked TSVME-120E on the lower ejector handle and on the sticker attached tothe VME P2 connector. The design change, however, introduced a bus timing incompatibility.Orthodyne designed a kit, provided with the Themis replacement board, that solves the timingcompatibility issue with the addition of a Frame Grabber Adapter, to be installed on the Frame GrabberBoard.

Contents of Package

(1) CPU Board, Themis, TSVME - 120E

(1) Frame Grabber Adapter

(1) Software diskette, Version 4.09 or later

(1) Drawing 171555

ProcedureRefer to Figure 1 for CPU and Frame Grabber Board location in the VME card cage.

Replace the Themis CPU and Frame Grabber Adapter using the following procedure:

1. Locate the CPU and Frame Grabber Boards on the left side of the VME card cage.

2. Disconnect the ribbon cable from the CPU Board.

3. Remove the screws holding the CPU Board to the card cage, and remove the boards using theejector handles.

4. Replace the new CPU Board and reattach the ribbon cable. Reattach the holding screws.

5. Remove cables from the Frame Grabber Board.

6. Remove the screws holding the Frame Grabber Board to the card cage, and remove using theejector handles.

7. Remove the IC at U62, and replace with the enclosed Adapter (171507). See Figure 2.

January 8, 1996


Figure 1. Board Location Diagram

Figure 2. Frame Grabber Adapter Installation

1. Reassemble the CPU and Frame Grabber Boards into the VME card cage.Remember to tighten the screws holding in the Boards.

2. Reattach respective cables on CPU and Frame Grabber Boards.

3. Insert the enclosed new system disk and power-up the machine.

NOTE: The 8 pins on theadapter piece face thefront of the board

January 8, 1996


The next series of instructions depend on whether Version 4.09 (or later ) is installed, and whether ornot the machine has a hard disk drive.

If software Version 4.09 (or later) is already installed on the machine, ignore the steps below. If themachine has an earlier software version then proceed.

If your machine has no hard drive:Use the enclosed floppy disk to boot up the machine.

If the machine has a hard disk drive, then perform the following steps:

1. Boot up the bonder normally (boot from the hard disk).2. Exit the bonder program (MAIN MENU, “!” key).3. Insert the new system disk in the data drive on the front of the bonder control drawer

(/d1).4. Type “/d1/install” and press ENTER.5. The installation process will take several minutes to install over a previous version. It will

take substantially longer to install onto an empty hard disk (the install command onlyinstalls those files which have been updated since the last release).

6. When the installation process is complete, cycle power on the bonder to restart thesystem. (Power must be cycled, rather than just typing “m360” because the OS-9 kernelmust be reloaded due to updates to some of the system modules.)

If any problems are experienced after installing version 4.09a, it may be necessary to clear thesystem RAM and reload default values. Use the following procedure:

1. From the MAIN MENU, type “RESET”.2. When the “System RAM Corrupt” screen displays, select “D” to reload defaults.3. All machine calibrations must be performed again (limits, touch sensor, forcer, offsets,

etc.). Also, any handler, printer, and system parameters must be re-entered.

NOTE: The modification is backward compatible with the older version Themis CPUboard. A new, redesigned Themis board (identified by TSVME-120E), however, cannotbe used without the Frame Grabber Adapter.

05/11/00

Replacing the Themis CPU with GMS CPU

RevisionRev. B: Added note to the last page for booting the new software into the machine with

versions earlier than 5.3.

Rev. C: Added part number of the kit to instructions.

Rev. D: Complete revision and reformat. Frame grabber is upgraded to Rev. U or later. Steps and pictures pertaining to U62 are deleted. The kit uses software Rev 5.4 or higher.

Applicable:Model 360C family machines with Themis CPU.

Part Numbers:The GMS CPU kit (P/N 172425) contains the following:

(1) CPU card, GMS (P/N 172543)

(1) Cable Assembly (P/N 172630)

(1) Cable Clamps (P/N 618506)

(1) Software diskette, Version 5.4 (or later)

(1) Drawing 172425

INSTALLATION INSTRUCTION No. IN1041Rev. D

Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5

Common Hand Tools 1/2 Hour(s) EASY

Metric Allen Wrenches

MODERATE

DIFFICULT

ORTHODYNE ELECTRONICS INSTALLATION INSTRUCTION IN1041 PAGE 1 OF 5

05/11/00

IntroductionOrthodyne has qualified and will be using General Micro Systems (GMS) as a CPUboard supplier. When replacing a Themis CPU with a GMS CPU some cable replace-ment and routing is required. Adjustments to the system memory map are implementedby software Version 5.4 or higher.

Compatibility

! Frame Grab PCB Assembly (P/N 171507) must be revision“U” or higher or any Rev. GSII PR board (P/N 172802).

! I/O Interface PCB Assembly (P/N 171532) must berevision “M” or higher. Universal I/O Interface PCBAssembly (P/N 175512) with revision “E” or higher.

! Software revision must be 5.4 or higher.

Replacing The Themis CPU

CAUTION: If the current software is earlier than Version 5.4,install the software included in the package beforeremoving the Themis CPU board. See the Soft-ware Installation section of this procedure.

1. Reboot the system. If you installed new software prior to the board replacement aSystem Data Error message screen will appear. Select F9: “Load System Datafrom the Hard Drive.”

2. Power down the machine.

CAUTION: Before removing and handling electronic boards,make sure you are properly grounded and followESD procedures. Failure to do so may result indamage to the sensitive components on the board.

3. Open the VME drawer and locate the CPU board.

4. Release the cable clamp, unplug, and discard the old Floppy Disk Drive Logiccable (P/N 172630).

5. Unplug the Hard Disk Drive cable (P/N 171610) from the Themis CPU Breakoutboard at P2 backplane.


05/11/00

6. Remove the Themis CPU Breakout board from the P2 backplane.

7. Install the GMS CPU Breakout board (P/N 172554-97) into the P2 backplane. SeeSee Figure 1 .

8. Unplug the Data Terminal cable (P/N 172620) from the front of the Themis CPUand remove the CPU from the VME card cage.

9. Mount the flat cable clamps on the left side plate located on the VME card cage.See Figure 2.

10. Insert the GMS CPU into the same card cage slot and secure.

Figure 1 GMS CPU and Cable Locations

Cable Clamp


05/11/00

Figure 2 CPU Breakout Board and Cable

11. Install the Hard Disk Drive cable (P/N 171610) into the breakout board.

12. Route the Data Terminal cable (P/N 172620) around the left side of VME cardcage, through the cable clamps to the breakout board. Plug the connector in at J3.Secure screw-locks at J3.

13. Connect the new Floppy Disk Drive Logic cable assembly (P/N 172630 Rev. B)to the floppy disk drives with Pin 1 toward the floppy drive power connector.Secure the cable to the Hard Drive Disc cable with the clip. See Figure 3.

14. Route the other end of the new Floppy Disk Drive Logic cable assembly (P/N172630 Rev. B) through the cable clamps to the front of the GMS CPU and plug itin at the FDC connector with Pin 1 at the bottom of the CPU.


05/11/00

Figure 3 Cable Clamp Location

Software Installation Instructions

These instructions are used when the software version currently being run on this bonder is not compatible with the new hardware that was just installed.

1. Insert one system floppy disk into d0 and one system floppy disc into d1.

2. Power up the bonder

3. When the Main menu is reached (this takes approximately 30 minutes), exit thebonder program.

4. Type “/dl/install” at the prompt.

5. When the software installation is completed, remove both system floppies andreboot the bonder. Close and secure VME drawer.

6. After swapping out the board and booting the system, a system data error messagescreen will appear. Select F9: “Load System Data from the Hard Drive.”


INSTALLATION INSTRUCTIONS 1041C Page 1

July 29, 1996

INSTALLATION INSTRUCTIONS

APPROVAL

No.: 1041C Resp. Engineer


Subject: CPU Retrofit, replacingThemis board with GMSboard.

Mktg. Approval


Drawing/P/N:

172425 Tech. PublicationApproval

PreparedBy:

George Ritsi

Problem:

This Bulletin covers the field retrofit of a CPU board manufactured by General Micro Systems(GMS), in place of the CPU board manufactured by Themis. The retrofit requires the replacement ofthe CPU, replacement of an IC chip U62 on the Frame Grabber Board with the retrofit PCB Adapterassembly (172569), replacement of a Flat Cable, and installation of Software Version 5.3.

Applicable:

Model 360C

Summary:

Replacement of this Themis CPU is accomplished using a kit consisting of:

(1) CPU card, GMS

(1) Frame Grabber Adapter (172569)

(1) Cable Assembly (172630)

(2) Cable Clamps (618506)

(1) Software diskette, Version 5.3 (or later)

(1) Drawing 172425

Revision C:

Rev B: Added note to last page for booting new software in machine with version earlier than 5.3.

Rev C: Added Part Number of Kit to Instructions.

Introducing …

ORTHODYNE’S

TRANSPORT BASEfor the

MODEL 360C-HD

Installation Instructions

JUNE, 1996

Document Number IN1051

Document Number: IN1051 1

INSTALLATION INSTRUCTIONS FOR TRANSPORT BASE KIT

INTRODUCTION

Orthodyne’s new Transport Base Kits gives the user of a Model 360C-HD a safe andconvenient way to move the machine when required, without the need to disassemble themachine, or re-align the leadframe handler. This provides the production department theflexibility to modify the production line quickly, and save set up time.

Once the machine is mounted on the new Transport Base, it can be moved as a unitaround the factory floor, transported by forklift truck, or even set up for crating and longdistance moving, while still retaining its alignment (see Figure 1). The kits containdevices to accommodate all these transport modes.

base 19

Figure 1. Model 360C-HD on the Transport Base with Caster Channel


DESCRIPTION OF KITS

The Transport Base system consist of three kits.

1. Base Kit (P/N 173305)

2. Base Caster Kit (173306)

3. Loading Channel Kit (173307)

One Base Kit is required for each Model 360C-HD. However, only one Caster Kit andone Loading Channel Kit is required for each location. The Loading Kit is necessary onlyif the customer plans to load or unload a machine on the Transport Base by themselves.So, for example, if a local factory had three Model 360C-HD’s, they may require three (3)Base Kits, but only one each of the Caster Kit and Loading Channel Kit. These can beeasily shared when making the Transport Base installation on each machine. YourOrthodyne Electronics representative will help you make the most economical choice tomeet your specific factory need.


INSTALLATION PROCEDURE

WARNING: The installation procedures involve heavy lifting ofequipment and machines. Only personnel trained by Orthodyne factory trainers or theirauthorized representatives should attempt these procedures. Possible damage toequipment and physical injury could result if the procedures are not followed in theproper sequence. READ THIS MANUAL before performing the installation.

Experience in forklift operation, machine installation, and these procedures is required.

A video of the installation procedure is available upon request from OrthodyneElectronics.

Preparing the Machine


2. Remove the Magazine Handler assemblies and set them aside. They will be re-installed after the machines are loaded on the Transport Base.

3. Disconnect the two machines by unplugging the interface cable (P/N 173636 - locatedon Leadframe Handler Transport #2 I/O board, connector P17).

4. Disconnect the Emergency Stop cable going to Leadframe Handler Transport #1. Themachines are now electrically separated.

5. Remove the bolts that attach the foot pads to the isolation blocks. The machines arenow mechanically separated.

6. Install the original, old style Dolly bars (P/N 172405-1) on the machine. When themachine is solidly attached to the dolly bars, the isolation blocks will remain on thefloor.

NOTE: Some models may have locating cap screws on the bottom of the machine thatwere used to engage the notch in the isolation pads. Make sure these cap screws areremoved. If present, they can damage the isolation blocks in a later step. These screwsare no longer required.

7. Remove the isolation pads from the blocks. These will be installed on the newTransport Base.

8. Position the machines in a clear area so there is room to put the Transport Base on thefloor behind the machines.


Preparing the Frame

1. After uncrating the Base Kit, flip the base frame (P/N 172095) up side down andsupport it at least 6” from the floor. Install the six leveling feet (P/N 618316). Figure2 shows the leveling feet installed with two nuts and a washer. The leveling feetshould be fully retracted at this time so when the frame is flipped over to its normalposition, the bottom of the Base Frame rests on the floor.

Figure 2. Installation of the Leveling Feet on the Base Frame(Frame shown upside down)

2. Install the existing isolation pads, removed in Step 6 above, with M6 cap screws (P/N500600-30) while the base frame is up side down as shown in Figure 2, with thenotches on the pads pointing inward. Figure 3 shows the correct orientation of theisolation pads with the base frame right side up.

3. Install the two Bumper Corner pieces (P/N 618315) with M3 x 10 (P/N 500300-10)cap screws on the rear corners of the base frame. When the Model 360C is on thebase, the bumper corners will be at the back of the machine.

Bottom ofBase Frame

Leveling Feet Isolation Pads


base 3

Figure 3. Installing the Isolation Pads on the Mounts

4. Place the loading channels (P/N 172356 from Kit #3) on the frame with the fixed feeton the floor, pointing toward the machines. Slide the loading channels toward theBase frame until the welded tabs on the channels touch the base (see Figure 4).

5. Place the Blocks (P/N 172357) under the adjustable ends of the loading channels toprotect the floor. Attach the hex screws to the adjustable ends of the channels andengage recessed holes in the blocks.

Notch FacingInward


base 1

Figure 4. Transport Base with Loading Channels Ready to Accept Machine

Moving the Machine onto the Transport Base

The machines will be placed on the Transport Base one at a time.

1. Raise up the loading channels with the hex screws until the channels are slightlyabove the level of all the isolation pads.

2. Move the machine so that the rear of the machine is in position over the loadingchannels (see Figure 5). Some dolly bars may have caster wheels on the insidemounting holes. If so, adjust the spacing of the loading channels so the castersstraddle the two channels.

NOTE:

Loading Channel

Direction ofLoading

Rear SideRubber Corner

Tabs FixedFeet

Adjustable Endof LoadingChannel


Base 2

Figure 5. Moving The Machine Into Position On The Loading Channels

3. Remove the dolly bar from the rear of the machine. This will put the weight of themachine on the loading channels. (Figure 5 shows the machine in place over theloading channels, before removing the rear dolly bar.)

4. Slide the machine on the loading channels (see Figure 6) until the front dolly barcomes in contact with the Base Frame. Be careful when sliding the machine on theloading channels not to damage the isolation pads.

Moving the machine on the loading channels should be doneby two people.

5. Remove the front dolly bar and continue sliding the machine on the loading channelsuntil the four machine foot pads are over the isolation pads (see Figure 7). Make surethe holes in the foot pads line up with the holes in the isolation pads.

6. Lower the loading channels by withdrawing the hex screws until the machine rests onthe isolation pads.

7. Remove the hex screws and blocks from the loading channels.

8. Remove the loading rails from the front of the machine (see Figure 8).

HINT:

Rear of Machine

Dolly Bar

Loading Channel


Base 4

Figure 6. Slide The Machine On The Loading Channels

Base 6

Figure 7. Front View Of Machine With Foot Pads Over The Isolation Pads

Machine FootPads

Isolation Pads


Base 8

Figure 8. Remove The Loading Rails From The Front

9. Repeat steps 1 through 8 for the second machine.

10. Once the machines are on the transport base, reattach the I/O interface cable and theemergency stop cable. (See Installation Procedure, page 2, steps 3 and 4.)


Aligning The Two Machines On The Base

1. After both machines are positioned over the isolation pads on the base, align the twomachines to be in the same plane by placing shims under the mounting pads (see Figure 9).

Shim2

Figure 9. Putting Shims Under The Foot Pads To Align The Machines

2. Add shims where required so that a straight bar across the two tables shows no gaps.

3. Next sight across the two machines and adjust the shims until the machines appearparallel. Figure 10 shows a straight bar across the two tables (do not put the straightbar across the key pads). The picture shows a gap between the bar and the left table,indicating that shims must be placed under the right machine.


Base 11a

Figure 10. Aligning The Machines With A Straight Bar

4. The above two procedures will provide the coarse alignment. Use a leadframe on thetrack between the two machines for the fine adjustment. Shim the machine so there isno gap along the straight edge across the two machines.

5. When the machines are properly aligned, bolt the machines to the isolation pads.

Recommended Shimming Procedure

Using the shim pieces (P/N 172254)included in the kit, the machine can be jacked upwhile on the base to create clearance between the mounting pads and the isolation padsfor inserting shims.

1. Attach the shipping plates to the mounting pads with the bolts provided in the kit (usetwo washers). Mount the plates perpendicular to the machine so the clearance hole inthe plate is over a clear spot on the floor.

2. Place a bolt through the top of the clearance hole and thread a thrust washer and a nutso they are snug against the bottom of the plate (see Figure 11).

Straight Bar

Table of LeftMachine

Gap between StraightBar and Table


3. Put a spacer block between the bottom of the screw and the floor.

4. Using a wrench, turn the screw clockwise so it bears against the spacer block. Usingtwo wrenches as shown in Figure 12, jam the nut against the bottom of the strap, andturn the screw clockwise to lift the machine off the isolation pad.

5. Continue the process at the four shipping plates (one on each corner of the machine)until there is sufficient clearance for the shims under the mounting pads. Move theshipping plates to the second machine and repeat the process.

6. When the machines are aligned, remove the shipping plates.

Figure 11. Using the Shipping Plate to Raise the Machine forInserting Shims Under the Mounting Pad

Machine Shipping PlatePerpendicular toMachine

Mounting Pad

Isolation Pad

TransportBase

Spacer Block

Use Bolt to RaiseMachine Up forShims

Jam Nuts andThrust WasherShim


Shim 1

Figure 12. Raising the Machine

The shipping plates must not be attached to the machine during normaloperation. To do so will eliminate the beneficial effect of the isolationblocks causing excess vibration. Excess vibration can adversely affectthe bond quality.

WARNING:


Attach The Leadframe Magazine and Support Brackets.

1. Adjust the feet of the magazine handler to make contact with the floor.

2. Position the leadframe magazine handler along side the machine, line it up withthe rails or output kicker, and screw into place (see Figure 13).

Base 16

Figure 13. Position The Leadframe Magazine In Place


3. Attach the magazine handler support bracket to the base, placing the notch of thebracket under the magazine handler leg (see Figure 14).

Figure 14. Leadframe Magazine Support Bracket In Place

4. When moving the machine, back off the leveling feet to put the load of the handler onthe support bracket.

5. When the transport base is in the desired final position, adjust the 6 leveling feetscrews on the base to make the machine level with ground. Adjust the two levelingfeet of each handler so they are also level.

Magazine HandlerSupport Bracket

Front of TransportBase Frame


TRANSPORT PROCEDURES

Moving the Machine With The Optional Caster Channels

The optional Caster Channel attachment (see Figure 15) provides a practical andconvenient method to move the Model 360C-HD machine to a new location without theneed to disassemble the machine, and still preserve the alignment. The combination ofthe transport base and the Caster Channel attachment should save many hours of set-uptime when relocating the machine.

The optional Caster Channel Kit (P/N 173306) attachment consists of two channels withcasters and guide pipes on the bottom of each channel. The guide pipes go into holes inthe transport base frame. When used together with the spacer blocks (P/N 172299) thatcome with the kit, the Caster Channels can lift the machine a small amount so it can bemoved around the factory floor. Installing the Caster Channels without the spacer blockswill provide approximately 60 mm. clearance under the base frame for the tangs of aforklift truck. The transport base gives a strong and stable platform to move the machineeven with a forklift. When using a forklift, insert tangs from the rear of machine unit.

Base 13

Figure 15. Caster Channel Showing Locating Pipes

CasterChannel

Guide Pipes

LocatingHoles

NOTE: Photo does notinclude the magazinehandlers so the CasterChannel installationcan be shown moreclearly. However, youdo not need to removethe magazine handlersto install the CasterChannels.

SpacerBlock


1. Attach the Caster Channels on either side of the transport base frame as shown inFigure 16. Install two 5/8”-11 hex bolts (P/N 658603) and washers on each channel.Raise the Base by alternately turning all four hex bolts.

NOTE: Use a 5/8” socket wrench to raise the base.

Base 14

Figure 16. Attaching The Caster Channels

2. Use the spacer blocks for moving the machine over a level floor (see Figure 17).

OR

3. Attach the Caster Channels without the spacer blocks for maximum clearance for aforklift.

Make sure the caster wheels are in-line with the channel.

HINT:


Base 15

Figure 17. Rolling The Machine Into Position

4. When the machine is rolled to the new position, remove the Caster Channels.

5. Adjust the 6 leveling feet screws of the base to make the machine level with ground.Adjust the two leveling feet of each handler so they are also level.


Shipping The Machine On The Transport Base

The following procedure assumes the machine will be shipped on a conveyance, somedistance away from the machine’s present location. The significant portion of theprocedure is the installation of shipping plates to lock down and protect the isolator padsfrom the motion of travel.

Before moving the machine to the shipping area,

1. Retract all leveling feet so the transport base rests on the floor. Tighten nut #1 tosecure the leveling feet to the transport base.

2. Spin nut #2 down on each leveling foot screw so they are below the level of themounting pads.

3. Attach the shipping plates with two holes (P/N 172294) on the corner isolation padsusing a screw (P/N 505160-30) and two washers (P/N 570160). See Figure 18.

4. Spin a nut #3 down on the top of the shipping plate until it is firm on its surface.

5. Tighten the nut #2 below the shipping plate.

6. Repeat for all four corners.

7. Repeat for the two shipping plates that over the center mounting pads using the sameprocedure, except use the shipping plates with three holes (P/N 172295). See Figure 19.

WARNING: The above procedures takes the vibration and shear load offthe isolation pads. Without these shipping plates installed, shippingmotion could cause failure of the glue joints in the isolation pads andpossibly allow the machine to slip off the base.

Let us assume that you use the Caster Channels to move the machine onto the shippingplatform. The platform could be the bed of a truck, or a suitable constructed shippingcrate. A fork lift might even be used to position the machine on the shipping conveyance.

CAUTION: Do not ship the machine with the Caster Channels attached to the machine.The transport base is designed to put the weight of the machine on the base of theshipping container.

NOTE: Four 28 mm. holes on the transport base frame can be used to anchor themachine to the base of the shipping container.


Base 20

Figure 18. Shipping Plate Installed Over The Corner Foot Pad

Base 20a

Figure 19. Shipping Plate Installed Over Center Foot Pads

Center ShippingPlate

Corner ShippingPlate

Spacer Block

Nut #3 2 Washers

Nut #1

Nut #2


After Shipping

1. To put the machine in place after shipping, remove the crate or protective covering.

2. Install the Caster Channels (see above).

3. Move the machine into place.

4. Lower the leveling feet screws to be slightly lower than the transport base bottom.

5. Remove all the shipping plates.

6. Adjust the leveling feet screws so the machine is level with ground.

7. Remove and save the Caster Channels and spacer blocks.

Do not operate the machine with the shipping plates attached. These plates,when installed using the steps described above, take the load off the isolationpads. Operating the machine with the isolation pads disabled can causeexcessive vibration and affect the quality of the bonds.

Storing Parts

1. Shipping plates can be stored in a tapped hole on the base frame between the twoModel 360C machines. A hand knob is provided for this purpose.

2. Spacer blocks and the 5/8-11 x 4 inch hex bolts can be stored on the Caster Channel.

3. Blocks and the 5/8-11 x 2 inch hex bolts for the Loading Channel can be stored on theChannel.

NOTE:


SUPPLEMENTAL INSTRUCTION FOR SHIPPING

MODEL 360C-HD ON TRANSPORT BASE

The instruction manual and video shows the method of using the transport base elementswhen moving the machine around the factory floor, and with the aid of a forklift

Crating the machine for shipment over long distances requires a professionally designedcrate to support and protect the machine during the shipping process. It is very importantto protect the machine against moisture, and to anchor the machine against suddenmovement.

We discovered, during a recent move, that the support bracket for the leadframe magazinehandler was not adequate to protect the machine in a crate. This bracket was designed tosupport the weight of the handler during normal moving. It does not adequately lock thehandler magazine against jarring movement caused by jolts or bumps to the crate.

When placing the machine in a shipping crate, theleadframe magazine handler bracket should be inplace as shown in the illustration to the left. After themachine is in the container, lower the leveling feet ofthe magazine handler until they are solid against theshipping container base. Then remove the leg supportbracket and re-attach it backwards so it is not incontact with the leadframe leg. The load of theleadframe magazine is now taken up by the levelingfeet and the shipping container base.

Secure the top of the leadframe magazine withinthe shipping container with a cushioned strut toprevent upward movement in the event of a bounceor jolt to the container. The figure at the rightshows two cushioned struts supporting the bottomand top of the leadframe magazine handler. Nail thecushioned support struts in place from the containerside panels. Repeat on both sides of the machine.

CushionedSupport Struts

July 8, 1996

Page 1 of 1


APPROVAL SHEET

No.: 1060 Rev: Prepared By:

Subject: Unpacking Model 360C-HD onTransport Base from ShippingCrate

Resp. Engineer:

DrawingNo.:

V.P. Engineering:

“Bob” Babayan

PartNo.:

V.P. Marketing:

Bill Larkin

Models: Model 360C-HD on TransportBase

Tech. Publication:

George Ritsi

Purpose:

The purpose of this Installation Instruction is to show how to remove the Model 360C-HD from theshipping crate when the machine is installed on a Transport Base from the factory

Applicable:

Model 360C-HD on a Transport Base

Summary:

This manual replaces Document IN1051 for inclusion with machines initially loaded on the TransportBase from the factory.

Document IN1051 still applies to Transport Base Kits sold separately to customers who intend to loadtheir Model 360C-HD’s on the Transport Base themselves.

NOTE: The Installation Instruction Manual is not a part of this Approval Form. IN1060 is a separatedocument, bound separately for inclusion with each Model 360C-HD.

INSTALLATION INSTRUCTIONS 1061 Page 1

December 3, 1996


APPROVAL

No.: 1061 Reps. Engineer


Subject: Y Axis Cable Rerouting Mktg. Approval


Drawing/P/N:


PreparedBy:

Randall Maynard George Ritsi

Problem:

This Bulletin covers the field rerouting of the Y axis encoder and power cables.

Applicable:

All Model 360C’s

Summary:

The field retrofit kit for the cable rerouting consists of:

(4) Cable Tie (618709)

(6) Cable Tie (618700)

(1) Cable Clamp (618500)

(1) Screw (500400-16)

(1) Nut (582401)

(2) Washer (570401

(1) Drawing (172003)

December 3, 1996

INSTALLATION INSTRUCTIONS IN1061 Page 1 of 4

INSTALLATION INSTRUCTIONS No. IN1061

Y Axis Cable ReroutingApplicable: All Model 360C’s

Drawing Number: 172003

Part Number: 172608-3

Background

Orthodyne has found that, under certain conditions, the Y motor power cable can become damagedcausing intermittent failures. When using long travel in the X axis, the Y motor power cable’s innershielding can become frayed causing the wires to short circuit. Rerouting the cable will eliminate abend in the wire preventing the occurrence in the future.

Contents of Package: (4) Cable Tie (618709)

(6) Cable Tie (618700)

(1) Cable Clamp (618500)

(1) Screw (500400-16)

(1) Nut (582401)

(2) Washer (570401

(1) Drawing (172003)

Procedure:

1. Turn off main power switch. Check that the Bond Head cannot contact any parts in the Y and X

axis during this procedure.

2. Remove rear and side covers from bonder assembly. Remove outboard side of bellows. See

figure 1.

3. Locate and disconnect Y motor encoder and power cable from the motor drive card cage.

Side bellows screws.

Figure 1. Remove covers.

December 3, 1996


4. Loosen main cable tie. Remove the two cable ties that hold the main loom together. Remove the

Y motor encoder and power cable from the main loom. Using two large cable ties, cable tie the

loom and reposition in the main cable tie. See figure 2.

5. Remove all cable ties from Y motor encoder and power cable. Remove cable block from Y

motor. Remove cable clamp at motor mount. See figure 3.

6. Loosely install Y motor encoder and power cable to cable block using three (3) small cable ties.

Loosely install the cable block to the top of the Y motor using one large cable tie. See figure 4.

cable clamp

Figure 2. Remove the Y motorencoder and power cables from themain loom

Figure 3. Remove cable clamp andcable block from motor mount.

cable block

Figure 4. Loosely install Y motorencoder and power cable to cableblock.

December 3, 1996


7. Position the Y motor encoder and power cable on top of the Y motor. It may be necessary to hold

the cables in position on top of the motor, snug the small cable ties, and then carefully pull the

block to the side and tighten them completely. Cut tails off of small cable ties. Return the cables

to the top of the motor and tighten the large cable tie. See figure 5.

8. Install power cable to the underside of upper base casting using clamp (618500), with screw

(500400-16), nut (582401) and washers (570401). Leave enough length to connect the cables to

the motor drive card cage. See figure 6 and 7.

NOTE: Check for tight bends and kinks in the Y motor encoder and power cable as itleaves the motor and travels over the top.

Figure 6. Access screw from top ofbonder base plate

cable clamp

Figure 7. Leave enough length toconnect cables to the motor drive cardcage.

Figure 5. Position cables and tightencable ties.

December 3, 1996


9. Tie together the Y motor encoder and power cable in three places, equally spaced, between the Y

motor and the cable clamp. See figure 8

10. Connect cables to the motor drive card cage.

11. Reinstall side and rear covers. Reinstall bellows.

NOTE: Carefully check for binding and chafing of cables while moving bonder severaltimes in the X axis. Adjust as necessary.

cable ties

Figure 8. Tie together the Y motorencoder and power cable in three places.

MODEL 360C

Unpacking Instructions

JANUARY, 1997

Document Number IN1062-A

Document Number: IN1062-A 1

PREFACE

Your new Model 360C was shipped from the factory with protective packing aroundAND IN the head area. This packing material protects the head from movement duringshipping.

YOU MUST REMOVE THE PACKING MATERIAL BEFORE MOVING THE BONDHEAD OR OPERATING THE MACHINE.

WARNING: Failure to remove the packing material before operating themachine could cause permanent damage and require expensive repair.

PROCEDURE

1. Remove the plastic protective shield from the bond head (Figure 1).

Figure 1. Protective Shipping Shield Covering Bond Head.

Shipping Shield


2. Notice the red Warning tag (Figure 2).

Figure 2. Front View of Bonder Before Removing Warning Tag.

3. Remove the bond head cover (Figure 3).

Figure 3. Removing the Bond Head Cover.

4. Remove the protective foam collar from the Z/Theta bearing by grasping and pullingoutward (Figure 4).

Warning Tag


Figure 4. Removing the Foam Packing Material from the Z/Theta Bearing.

5. Remove the bracket between the frame and the XY table from the right side of thebonder. Pull the bonder out to remove foam from behind the bond head (Figure 5).

Figure 5. Removing the Foam From Behind the Bond Head.

6. Remove the plastic foam wedges that keep the keyboard from rolling out.

7. Peel off the protective foam pad from the work table.

8. Remove the camera cable from the protective bag and reconnect to the camera on topof the bond head.

9. Proceed with the remaining Installation Instructions described in the User’s Manual.


READ THIS FIRST

BEFORE

UNPACKING

MACHINE FROM

CRATE

January 31,1997



APPROVAL

No.: 1062-A Manufacturing

Paul Suter

Reps. Engineer


Subject: Model 360C UnpackingInstructions

Mktg. Approval


Drawing/P/N:

na Tech. PublicationApproval

PreparedBy: Randall Maynard George Ritsi

Problem:

A change was made in the procedure for unpacking the Model 360C. New unpackinginstructions are needed.

Applicable:

All Model 360C’s

Summary:

A Corrosion-Inhibitor is used in shipping the Model 360C. In the past, the inhibitorwas located directly on the z-band assembly. If not removed by the customer, the z-band could be become damaged. The inhibitor has been moved to the inside of thefront cover where it becomes a permanent part of the machine.


11/19/99


APPROVAL

No.: IN1063 Reps. Engineer


Subject: Lubrication KitInstruction/Application Sheet

Mktg. Approval


Drawing/P/N:


PreparedBy:


Problem

The current lubrication kit has no direct instructions for the use of each lubricant.

Applicable

All Model 360’s

Summary

This installation instruction will accompany the Lubrication Kit P/N 160342. Using references tomanuals or technical bulletins, the customer will be instructed on how and when to performlubrication maintenance using the contents of this kit.

11/19/1999



Lubrication Kit P/N 160342

Applicable

All Model 360’s

Introduction

Your Model 360 wirebonder is a rugged, flexible production machine that will give you many years ofreliable service. Like any high-performance machine, the wirebonder requires regular preventivemaintenance. Properly lubricating your machine will provide you with better performance and longerlife.

Lubrication Kit P/N 160342 contains the recommended products to use with your machine. Thisdocument outlines the lubricant, the procedure, the frequency of lubrication maintenance and, whereapplicable, refers you to an Orthodyne manual or Technical Bulletin for further instructions.

Contents of Lubrication Kit

Qty. P/N Description

1 649507 Lubricant, Anti-Seize, SAF-T-EZE

2 172850-1 Grease, Braycote, 622 Polytube, 5 grams

1 172850-2 Grease, Braycote, 622 Pillow Pak, 5 grams

1 649501 Molykote 33/Med., Silicone Grease

1 649504 Grease, Magnalube, 14 1/2 OZ. Cartridge

1 649505 Gun, Grease, 14 1/2 OZ

1 649506 Fitting, Extension, Grease Gun

Procedure

The tables below give specific lubrication instructions for each machine type.

I. Model 360ALocation or Part To Lubrication Interval Grease Description Procedure

11/19/1999


Be Lubricated and Part Number

X/Y TableAssembly

Once every sixmonths, or onceevery 1000 hours,which ever comesfirst

Magnalube TeflonGrease

P/N 649504

Follow procedure as stated in Model360A Technician’s Manual, PreventiveMaintenance Section, Section B, 3-5.

Z/Theta BearingAssembly

Once every sixmonths (assumingone shift per day)

Braycote 622Grease

P/N 172850-2

Follow procedure as stated in Model360A User’s Manual, Technical Bulletin#1048A, or #1068 (whichever isapplicable).

SAF-T-EZE Anti-Seize Lubricant

P/N 649507

When re-installing the Bearing HousingCap, use a small amount on each screwto prevent seizing.

II. Model 360BLocation or Part ToBe Lubricated

Lubrication Interval Grease Descriptionand Part Number

Procedure

X/Y TableAssembly

Once every sixmonths, or onceevery 1000 hours,which ever comesfirst.


P/N 649504

Follow procedure as stated in Model360B Technician’s Manual, PreventiveMaintenance Section, Section B, 3-5.



Braycote 622Grease

P/N 172850-2

Follow procedure as stated in Model360B User’s Manual, Technical Bulletin#1048A, or #1068 (whichever isapplicable).


P/N 649507


III. Model 360C and 360SLocation or Part ToBe Lubricated


Procedure

11/19/1999


X/Y TableAssembly



P/N 649504

Follow procedure as stated in Model360C User's Manual, PreventiveMaintenance Section, Section B1.



Braycote 622Grease

P/N 172850-2

Follow procedure as stated in Model360C User’s Manual, Technical Bulletin#1048A, or #1068 (whichever isapplicable).


P/N 649507


Theta Belt Once every year(assuming oneshift per day)

Dow Corning 33

P/N 649501

Follow procedure as stated in Model360C User's Manual, PreventiveMaintenance Section, Section D8.

IV. Model 360C-H and 360C-HDLocation or Part ToBe Lubricated


Procedure

X/Y TableAssembly



P/N 649504

Follow procedure as stated in Model360C User's Manual, PreventiveMaintenance Section, Section B1.



Braycote 622Grease

P/N 172850-2

Follow procedure as stated in Model360C User’s Manual, Technical Bulletin#1048A, or #1068 (whichever isapplicable).

SAF-T-EZE Anti-Sieze Lubricant

P/N 649507


Theta Belt Once every year(assuming oneshift per day)

Dow Corning 33

P/N 649501

Follow procedure as stated in Model360C User's Manual, PreventiveMaintenance Section, Section D8.

Input/OutputHandler


Braycote 622Grease

P/N 172850-1

Follow procedure as stated in Model360C-H/C-HD User's Manual, PreventiveMaintenance Section, or TechnicalBulletin #1071(whichever is applicable).


February 20, 1997

INSTALLATION INSTRUCTIONSAPPROVAL

No.: 1064Reps. Engineer Charles Kim

V.P. Engineering “Bob” BabayanSubject: Bearing Housing Cover

Assembly ReplacementMktg. Approval

V.P. Marketing Bill LarkinDrawing/ P/N: 175250 Tech. Publication

ApprovalPrepared By:


Purpose:

This Installation Instruction covers the field replacement of the Bearing Housing Cover on the Model360S Small Wire Bonder.

Applicable:

All Model 360S’s

Summary:

The original design for the Bearing Housing Cover proved to be troublesome. There was inadequateaccess room for threading wire. Therefore, a new door was designed, providing a larger working area,better light entry to the area and improved access for wire threading. The following items are includedin the kit:

Qty. P/N Description1 175000 Drawing, Kit, 2 Mil, 2 Mil Option, M360C, Rev. A

1 175200 Drawing, Dereeler Assembly, 2 Mil Dereeler, 2 Mil Option, Rev. E

1 175250 Drawing, Assy, Cover, Bearing Housing

1 175250 Assy, Cover, Bearing Housing

1 175253 Bracket, Dereeler Top

1 175254 Bracket, Dereeler Bottom

4 500400-08 Screw, Soc. Hd Cap, M4 x 0.7 x 8mm Lg

11/19/1999

INSTALLATION INSTRUCTIONS 1064 Page 1 of 6

INSTALLATION INSTRUCTIONS No. 1064

Bearing Housing Cover Assembly Kit

Applicable: All Model 360S’s

Introduction:

Orthodyne Electronics continuously upgrades parts and accessories to improve performance andlower the costs of our products. We have redesigned the Bearing Housing Cover to allow bettervisibility and access for wire feeding. The Bearing Housing Cover Assembly Kit comes with all theparts and drawings necessary to complete the installation.

Contents of Kit:

The following items are included in the kit:


1 175000 Drawing, Kit, 2 Mil, 2 Mil Option, M360C, Rev. A

1 175200 Drawing, Dereeler Assembly, 2 Mil Dereeler, 2 Mil Option, Rev. E

1 175250 Drawing, Assy, Cover, Bearing Housing

1 175250 Assy, Cover, Bearing Housing

1 175253 Bracket, Dereeler Top

1 175254 Bracket, Dereeler Bottom

4 500400-08 Screw, Soc. Hd Cap, M4 x 0.7 x 8mm Lg

Procedure:

1. Power down the Bonder.

2. Remove Camera Cable from the Camera and from the 3/8” Cable Clip attaching it to the HousingCover.

11/19/1999


3. Remove the Rear Cover from back of the Dereeler (see Figure 1). Remove Urethane Tube andRibbon Cable from rear of Dereeler (see Figure 2).

Figure 1: Remove Rear Cover from the Dereeler

Figure 2: Remove Ribbon Cable and Urethane Tube

4. Remove Dereeler from the brackets that hold it onto the Bond Head (see Figure 3).

Ribbon Cable

Urethane Tube

Rear Cover

11/19/1999


Figure 3: Remove the Dereeler from the Brackets on the Bond Head

5. Remove old-style Housing Cover from Bond Head (see Figure 4).

Figure 4: Remove old-style Housing Cover

6. Remove the top and bottom Dereeler brackets from Bond Head. Remove the black panel screwfrom the bottom bracket and place on the side of the Bond Head (see Figure 5).

Dereeler

11/19/1999


Figure 5: Place Black Panel Screw from Bottom Bracket onto the side of the BondHead

7. Install Right Bracket onto the Bond Head (see Figure 6).

Figure 6: Install Right Bracket

7. Loosely install the Top Bracket (P/N 175253) and Bottom Bracket (P/N 175254) onto theDereeler (see Drawing #175200).

8. Install the Dereeler onto the Right Bracket (see Figure 7). Align Dereeler and tighten all screws.Connect Ribbon Cable and Urethane Tube. Install Rear Cover onto Dereeler.

Right Bracket

Panel Screw

11/19/1999


Figure 7: Install Dereeler onto the Right Bracket

9. Install Rear Cover (with Front Cover attached) onto the Bond Head. Carefully align Front Coverwith Right Bracket and tighten all Panel Screws (see figure 8).

Figure 8: Install Rear Cover

Front Cover

Rear Cover

Dereeler

11/19/1999


Note: Check that the Front Cover closes completely and securely. Adjust the magnet asneeded to secure the Front Cover during Bonding movements (see Figure 9).

Figure 9: Adjust Front Cover using Magnet

9. Install Camera Cable into the 3/8” Cable Clip and onto the Camera.

10. Power up the Bonder.

Magnet


April 30, 1997


No.: IN1065Reps. Engineer

V.P. Engineering “Bob” BabayanSubject: Power Supply Replacement

ProcedureMktg. Approval

V.P. Marketing Bill LarkinDrawing/ P/N: 172000 & 172017 Tech. Publication

ApprovalPrepared By:


Purpose:

This Installation Instruction covers the replacement procedure for the power supply in Model 360Cfamily and Model 360S family machines.

Applicable:

All Model 360C family and Model 360S family machines

Summary:

This Installation Instruction covers the procedure for replacing a power supply. There has been a casein the field where a customer replaced a power supply and re-wired it incorrectly. Damage occurred tothe following boards and parts:

Pattern Recognition monitor

Z-cable

Fluorescent Light assembly

Head Junction board

Floppy Disk drives

LVDT

Programmable Focus board

I/O Interface board

Junction board

Dereeler board

To avoid this situation in the future Installation Instruction IN1065 will accompany replacementpower supplies into the field.

11/19/1999



Power Supply Replacement Procedure

Applicable: All Model 360C Family and 360S Family Machines

Introduction:

Installation Instruction IN1065 has been written to accompany a replacement power supply. Wheninstalling a new power supply it is important to follow these instructions carefully. It is possible todamage many of the circuit boards in the machine if the instructions are not followed. After installingthe replacement power supply, follow the test procedure before putting the machine back into service

Procedure:


2. Disconnect the power cord from the rear of the machine and remove the rear panel (see Figure 1).

Figure 1: Remove Power Cord And Rear Cover

Remove All Screws

Remove Power Cord

11/19/1999


3. Disconnect the Data Monitor power cord from the AC junction box and lay out of the way(see Figure 2).

Figure 2: Remove Data Monitor Power Cord

4. Remove the TB3 terminal cover from the front of the power supply (see Figure 3).

Figure 3: Remove Cover From TB3 Terminal

Disconnect Power Cord

Remove Cover

11/19/1999


5. Disconnect the three wires from TB3 at the front of the power supply (see Figure 4). Lay themaside.

Figure 4: Disconnect Wires from TB3

6. Disconnect all wires from positive, ground, TB1 and TB2 terminals at the front of the powersupply (see Figure 5). Remove the Ground Jumper from power supply.

Note: Use care to note the location of each wire as you remove it from the power supply.Refer to drawing #172017 for wire locations. Damage will occur to circuit boards if thewires are not replaced in the proper terminals.

Figure 5: Remove All Wires And Ground Jumper From Front Of Power Supply

TB3

40 Volts Positive Terminal (+)

Ground Terminal (-)

TB1 Terminal

TB2 Terminal

Ground Jumper

11/19/1999


7. Remove the large terminal block (TB1) from the top of the power supply by removing the twoscrews (see Figure 6).

Figure 6: Remove Terminal Block (TB1) From Power Supply

8. Remove the two cap screws that hold the power supply in place (see Figure 7). Carefully slide thepower supply forward and then up, to remove it from the machine. Lay the power supply on it’stop and remove the chassis from the bottom.

Figure 7: Remove Power Supply

9. Install the chassis onto the bottom of the replacement power supply using the same screws thatcame off the old power supply.

Note: Do not use any other screws to install the chassis to the power supply. Damagewill result to the power supply.

10. Carefully install the replacement power supply into the machine. Install and tighten screws.

Remove Two Screws

Remove Two Screws

TB1

11/19/1999


11. Install the large terminal block back onto the replacement power supply. Install and tightenscrews.

12. Install ground jumper and connect all wires to the positive, ground, TB1 and TB2 terminals at thefront of the replacement power supply (see Figure 8).

Warning: Use care to install the wires correctly. Damage will occur to the circuitboards if the wires are not connected to the correct terminals. Refer to drawing #172017(Power Supply Assembly), or to Figure 8, for proper wire locations.

Figure 8: Connect Wires To The Power Supply

40 Volts Positive (+),2 Red Wires

Ground (-), 2 Black Wires

5 Volt, 2 Blue Wires5 Volt, 2 Blue Wires

Ground (-), 2 Black WiresGround (-), 2 Black Wires

Note: Ground Jumper (-)

TB1

TB2

-12 Volt, 2 Yellow Wires

+12 Volts, 2 White/Red Wires

Ground (-), 2 Black WiresGround (-), 2 Black Wires

11/19/1999


13. Connect the three wires to TB3 at the front of the replacement power supply (see Figure 9).Replace the cover.

Warning: Use care to install the wires correctly. Damage will occur to the power supplyif the wires are not connected to the correct terminals. Refer to drawing #172000 (TopAssembly, sheet 3 of 5), or to Figure 9, for proper wire locations.

Figure 9: Connect Wires To TB3

14. Connect the Data Monitor power cord at the AC junction box.

15. Install the rear cover and connect the power cord to the rear of the machine.

Warning: Do Not Power-Up Machine. Follow test procedure below before powering-up themachine.

Test Procedure

1. Before powering-up the machine it is necessary to follow a test procedure to check for anyproblems with the output voltage. You will need a volt meter that will measure 50+ volts DC.

2. To protect the circuit boards from damage while testing output voltage disconnect the followingcables:

a) 12 volt power cable at the Pattern Recognition monitor.

Warning: Place this plug away from any metallic surface. The plug could ground on themachine while testing voltage outputs causing damage to the machine.

Brown Wire

Blue Wire

Green/Yellow Wire

TB3

11/19/1999


b) Power connector J7 on the Forcer/Focus board inside the Bonder assembly (see Figure 10).

Figure 10: Disconnect Power To Forcer/Focus Board

c) Power connector J3 at the Motor Drive card cage (see Figure 11).

Figure 11: Disconnect Power To Motor Drive Card Cage

Disconnect J7

Disconnect J3

11/19/1999


d) Power connector J9 on the Generator board located in the VME card cage (see Figure 12).

Figure 12: Disconnect Power To Generator Board

e) Disconnect all circuit boards from the VME card cage except the Power Distribution board. To dothis, loosen the two screws that hold each circuit board in place. Pull the board out just enough todisconnect it from the VME card cage. There is no need to completely remove the boards fromthe VME card cage.

f) Disconnect the power to the hard drive and the two disk drives (see Figure 13).

Figure 13: Disconnect Power To The Hard Drive And Disk Drives

g) Disconnect the power to the handler, if equipped.

Disconnect J9

Hard Drive Power Connector

Disk Drive Power Connectors

11/19/1999


3. Connect the ground lead of your volt meter to the ground test point in the Power Distributionboard (see Figure 14). Set voltmeter to over 50 volts DC.

Figure 14: Ground Test Point On Power Distribution Board

4. Turn on the power to the machine.

5. Connect your positive lead to each of the following test points located on the Power Distributionboard (see Figure 15). Take note of each voltage. See Table 1 below for unloaded voltagetolerances for each test point.

Figure 15: Test Points On Power Distribution Board

Power Distribution Board

+5 Volts

+12 Volts

-12 Volts

GND (Ground)

+40 Volts

11/19/1999


Test Point Unloaded Voltage Tolerance

+5 Volts +4.25 Volts to +5.75 Volts


-12 Volts -10.2 Volts to -13.8 Volts

+40 Volts +34 Volts to +46 Volts

Table 1: Unloaded Output Voltage Tolerances

6. If one or more output voltage is not within tolerance, go to step 7. If all output voltages are withinthe tolerances, turn the machine off, then re-install all circuit boards, re-connect all cables and goto step 8.

Warning: Do not attempt to operate the machine with output voltages that are out oftolerances. If any output voltage is not within tolerances, adjust the voltage usingstep 7.

7. If one or more output voltage is out of tolerance, you will need to adjust the voltage output. Youwill need a small, flat-blade screwdriver to reach into the front of the power supply and adjust theoutput voltage. Connect the voltage meter to the appropriate test point on the power distributionboard. Watch the meter reading while turning the appropriate adjustment in the front of the powersupply (see Figure 16). Adjust until the output voltages are correct.. When all output voltages arewithin the tolerances, turn the machine off, install all circuit boards, and connect all cables.

Figure 16: Adjust Voltages

40 Volt Adjustment

5 Volt Adjustment

12 Volt Adjustment

11/19/1999


8. Turn on the machine and re-check output voltages. Refer to Table 2 below to check if the loadedvoltages are within tolerance.

Test Point Loaded Voltage Tolerance



-12 Volts -11.40 Volts to -12.6 Volts


Table 2: Loaded Output Voltage Tolerances

9. If one or more output voltage is out of tolerance, you will need to adjust the voltage output as instep 7.

10. If all voltage outputs are now within the tolerances, power-up the machine and operate as normal.

Warning: Do not attempt to operate the machine with voltage outputs that are out oftolerance. If you are unable to adjust the output voltages, consult your OrthodyneElectronics Field Service representative, or the Orthodyne Electronics factory forfurther instruction.


May 13, 1997




Subject: Wire Clamp AssemblyReplacement Procedure

Mktg. Approval


Drawing/ P/N: 175009 Tech. PublicationApproval

Prepared By: Randall Maynard George Ritsi

Purpose

The purpose of Installation Instruction IN1066 is to provide a replacement procedure for the wire clampassembly on a Model 360S bond head.

Applicable

Model 360S family machines

Summary

This Installation Instruction covers the procedure for replacing the wire clamp assembly on a Model360S bond head.

11/19/1999



Wire Clamp Assembly Replacement Procedure

Applicable

All Model 360S family machines

Introduction

Installation Instruction IN1066 provides instruction on the proper replacement of the wire clampassembly for a Model 360S family machine.

Procedure

1. Remove the bonding tool from the bond head (see Figure 1).

Figure 1: Remove Bonding Tool

Remove Bonding Tool

11/19/1999


2. Remove the wire clamp assembly by removing two screws. Slide the clamp cable out of the wireclamp assembly as you remove the assembly from the bond head (see Figure 2).

Figure 2: Remove Wire Clamp Assembly

3. Slide the clamp cable into position on the new wire clamp assembly and loosely install the assemblywith two screws (see Figure 3).

Figure 3: Loosely Install Replacement Wire Clamp Assembly

Remove Screws

Replacement Wire Clamp Assembly

Clamp Cable

11/19/1999


4. Install wire clamp gauge (P/N 175013) into the transducer (see figure 4).

Figure 4: Install Wire Clamp Gauge P/N 175013

5. Position the wire clamp assembly so the tips of the wire clamp rest on the bottom step and forwardface of the gauge and tighten the screws. This will set both the height and location of the wire clampassembly.

Note: Apply force only to the stationary arm (left side) of the clamp when makingadjustments.

6. Check the alignment of the wire feed tube. Re-align if necessary by loosening the clamp screw andaligning the tube to the three faces on the gauge (see Figure 5). Tighten the set screw.

Figure 5: Align The Wire Feed Tube

Wire Clamp Gauge

Wire Guide Clamp Screw

Wire Feed Tube

11/19/1999


7. Install the bonding tool using gauge block (P/N 175010) (see Figure 6). To check the installation ofthe bonding tool, do a Generator Test. From the Main Menu select Calibration Menu (7), thenGenerator Test (3). Press [START] to energize the bonding tool. The reading should be a minimumof 50. If below 50, check that the transducer setscrew is secure or worn out. If the setscrew is wornout, replace with a new screw and do another generator test.

Figure 6: Install Bonding Tool Using Gauge Block P/N 175010

8. Loosen the pivot arm screw. Make a coarse lateral adjustment to the clamp mount adjustmentassembly so that the tips of the wire clamp are aligned with the tip of the bonding tool to within ±.005” (See Figure 7). Tighten screw.

Figure 7: Align Clamp Assembly With The Bonding Tool

9. Make a fine lateral adjustment using the fine adjustment screw in the clamp adjustment block tocenter the wire clamp assembly (See Figure 8). Using a microscope and a mirror, insert a wirethrough the clamp jaws and into the bonding tool. Pull about 1/2” of wire straight out. Check that thewire feeds between the clamp jaws, not under or around. While turning the fine adjustment screw,look at the wire where it exits the bonding tool. Center the wire relative to the tool.

Gauge Block P/N 175010

Pivot Arm Screw

Clamp Mount Adjustment Assembly

11/19/1999


Figure 8: Fine Adjustment of the Clamp Assembly

10. Adjust the clamp tip opening size. From the Main Menu, select the Calibration menu (7), AdjustWire Clamp (6). Follow the instructions on the screen to complete the wire clamp adjustment.

Access the Fine Adjustment Screwthrough the backside of the ClampAssembly. Wire


11/19/1999


No.: IN1067 Reps. Engineer Charles Kim


Subject: Change Fan Speed On 4-BulbFluorescent Fixture

Mktg. Approval


Drawing/ P/N: SK970515 Tech. PublicationApproval


Purpose

Installation Instruction IN1067 describes the procedure for reducing the fan speed on the 4-bulbfluorescent light fixture (P/N 175403-X).

Applicable

Model 360B, C, and S’s equipped with 4-bulb fluorescent lighting fixture (P/N 175403-X).

Summary

The 4-bulb fluorescent fixture (P/N175403-X) has a small fan attached to the assembly to prevent opticalshimmer in high magnification caused by the heat generated by the lights. This fan operated at 10,000rpm. It was observed that, at this speed, the fan was causing sufficient vibration to be felt at the wedgebonding tool. There was a concern that this vibration could adversely affect the bond pull and shearvalues for small wires. Lowering the fan speed to 6,500 rpm reduces the vibration to an insignificantamount and eliminates any adverse affect on bond quality.Reference ECN: 7820

Contents of kit are:

Part Number Description

SK970515 Module, High Intensity F/L Fan

618513 Cable Clip, 3/8”

IN1067 Installation Instructions for Changing Fan Speed On 4-Bulb Fluorescent Light Fixture

SK970515 Drawing, Module, High Intensity F/L Fan

11/19/1999



Changing Fan Speed On 4-Bulb Fluorescent Light Fixture

Applicable

All Model 360B, 360C, and 360S’s equipped with 4-bulb fluorescent lighting fixture (P/N 175403-X).

Introduction

Installation Instruction IN1067 provides instruction on the proper installation of the module for reducingthe fan speed on a 4-bulb fluorescent bulb light fixture.

Procedure

1. Remove the right side cover from the bond head on M360B and M360C (See Figure 1). On anM360S, remove the rear cover (see Figure 2).

Figure 1: Remove Right Side Cover From M360B & M360C Bond Head

11/19/1999


Figure 2: Remove Rear Cover From M360S Bond Head

2. Disconnect Z-cable cable (M360B P/N 172618, M360C P/N 172610) from the bond head (M360Band M360C see Figure 3, for M360S see Figure 4).

Figure 3: Disconnect Z-Cable from M360B and M360C

Z-Cable (P/N 172610)

11/19/1999


Figure 4: Disconnect Z-Cable From M360S Bond Head

3. Remove light cover (see Figure 5).

Figure 5: Remove Light Cover

11/19/1999


4. Disconnect fan cable at terminal J4 of the PCB (P /N 175549) and plug into module.

5. Remove screw and attach module (see Figure 6). Connect module wire to terminal J4 on PCB (P/N175549).

Figure 6: Install Module

6. Replace light cover.

7. Re-connect Z-cable.

8. Replace side cover on Model 360B and Model 360 C, or rear cover on Model 360S.

Module

Module Wire To Terminal J4

PCB (P/N 175549)

Screw Fan


8/15/97




Subject: Installation of new PR,Version GS II

Mktg. Approval



Prepared By: George RitsiRandall Maynard

George Ritsi

Purpose

Installation Instruction IN1068 describes the procedure for installing the new version of PR, GS II.

Applicable

All Model 360C and Model 360S family machines.

Summary

The new PR kit, Version GS II, incorporates features and capabilities to improve the pattern recognitionof low contrast images, and images with irregular surface content (like DBC). Screens have beensimplified to contain the most used features and functions on the principal page. Other less frequentlyused functions were placed in a companion “Expert Screen” page. The Arrow Button functions have beenchanged to always move the cursor exactly as shown by the arrows.

Contents of kit (P/N 172444) include the items shown in the Table below:

Part Number Description172518-1 Software Version 5.5A

Software Release Notes for Version 5.5A

172444 GS II PR Retrofit Kit

172444 Drawing, PR board retrofit

IN1068 Installation Instructions

360C User’s Manual

618710 20 Cable Ties

8/15/97



Installing New PR Version GS II

Applicable

All Model 360C and Model 360S family machines.

Introduction

This document describes the procedure for installing PR Version GS II. This Pattern Recognition versionrequires board replacements, a cable rework or change, and installation of Software version 5.5A. NewPR Version GS II is compatible with all CPU’s and I/O boards applicable to Model 360C and 360Smachines.

What Is New In This Version

The new PR kit, Version GS II, incorporates features and capabilities to improve the pattern recognitionof low contrast images, and images with irregular surface content (like Direct Bonded Copper ). Newfeatures include:

• Enhanced Video Tools:Histogram EqualizationExploded ImageBinary Image

• Pixel Editing of Models:Model Pixel ThinningManual Pixel Editing

• Line Find Mode

Screens have been simplified to contain the most used features and functions on the principal page. Otherless frequently used functions were placed in a companion “Expert Screen” page. The Arrow Buttonfunctions have been changed to always move the cursor exactly as shown by the arrows in all cases.

8/15/97


Procedure

A. Install Software Version 5.5A

NOTE: Before you install the new software:• Read the Software Release notes for version 5.5A.• Read “Programming the PR List ” in chapter 3 of the 360C user’s manual supplied with the kit.• Copy the Master wire parameters to a floppy disk using the Transfer File command. The new

software will write a new set of Master Wire Parameters to your hard drive. To keep youroriginal Master wire parameters (especially if you customized the list), simply transfer theMaster wire parameters back from the floppy disk to the hard drive after you install the newsoftware.

• Copy all existing programs onto a floppy disk.

1. Boot up the bonder (from the hard disk).

2. Exit the bonder program (MAIN MENU, “!” key).

3. Insert the new system disk in the data drive on the front of the bonder control drawer (D1).At the prompt, type “/d1/install” and press [ENTER].

4. When the installation process is complete, cycle power on the bonder to restart the system.(Power must be cycled, rather than just typing “m360” because the OS-9 kernel must bereloaded due to updates to some of the system modules.)

NOTE: It may be necessary to clear the system RAM and reload default values ONLY if anyproblems are experienced after installing the new version. Use the followingprocedure:

1. From the MAIN MENU, type “RESET”.

2. When the “System RAM Corrupt” screen displays, select “D” to reload defaults.

3. All machine calibrations must be performed again (limits, touch sensor, forcer, offsets, etc.).Also, any handler, printer, and system parameters must be re-entered.

B. Replace Printed Circuit Boards

1. Shut off power to the bonder.

2. Open the VME drawer and disconnect the camera cable (P/N 172635) and the video cable(P/N 708211) from the front of the Frame Grab board (see Figure 1).

8/15/97


NOTE: Wear grounding straps when handling the printed circuit boards to prevent staticelectricity build-up in your body from damaging sensitive electronic components on theboards.

Figure 1: Disconnect Camera and Video Cables

3. Remove the Frame Grab and DSP boards from the card cage.

4. Disconnect the CPU Breakout board from the P2 backplane (drawing #172000, view M_M).See Figure 2. You do not need to disconnect any cables or wires from the CPU Breakoutboard.

Figure 2: Remove CPU Breakout Board

Frame Grab board DSP board

Camera cable (P/N 172635)

Video cable (P/N 708211)

CPU Breakout board

8/15/97


5. Loosen and disconnect the blue 5V wire and the black ground wire from the P2 backplane(see Figure 3).

Figure 3: Disconnect Blue 5V Wire and Black Ground Wire From the P2Backplane

6. Remove the six screws holding the P2 backplane in place and remove.

7. Install the new P2 backplane (P/N 172832) using the P2 connector on the CPU to align thenew backplane board and fasten it using the hardware supplied in the kit (Items 11, 14, and15 designated in drawing #172444). Install the CPU Breakout board onto the new P2Backplane.

8. Install the new PR board (P/N 172802) in the card cage slot next to the CPU board. Connectthe video cable (P/N 708211) to the PR board. Do not connect the camera cable (P/N172635) at this time.

9. Install the filler panel (P/N 172246-3) in the empty slot in the VME card cage between thenew PR board and the Motor Drive Interface board.

10. Affix the new VME card cage label over the existing label (see Figure 4).

Figure 4: Affix New Label to VME Card Cage

Label

Black Ground Wire Blue 5V Wire

P2 Backplane

8/15/97


NOTE: There are two options for the camera cable (P/N 172635): Rework the cable (usingStep C), or replace it with the cable supplied in the kit. Modifying the cable willrequire some soldering skills and will take about ½ hour to complete. Replacing thecable will require hand tools and will take about 1½ hours to complete (using Step D).

NOTE: If your camera cable is Rev. C or higher, you will not need to rework or replace yourcable.

C. Rework Instructions for Camera Cable P/N 172635

NOTE: Camera cable (P/N 172635) must be modified to correctly function with the newPattern Recognition GS II. Follow the procedure below to modify the cable. You willneed to solder two wires together using wire strippers, a soldering iron, and solderwith flux to complete this modification.

1. Locate the camera cable P4 connector at the VME card cage. Remove the plastic cover fromthe end of the cable by removing the three small screws (see Figure 5).

Figure 5: Remove Plastic Cover From P4 Connector

2. Carefully cut back about 1½”(38mm) of the gray wire insulation (see Figure 6a). Unwrap thefoil covering to expose the wires. The wire without insulation is the “drain wire.”

3. Locate the black, line ground wire that ends at Pin 2 (see Figure 6). Using wire strippers,strip a ¼”(6mm) section of insulation from the wire about 1¼”(32mm) from the P4connector (see Figure 6a). This part of the wire is where you will solder the drain wire.

8/15/97


Figure 6: Pin 2 Location

Figure 6a: Approximately 1¼”(32mm) from the P4 Connector, Strip ¼”(6mm) ofInsulation from the Black, Line Ground Wire at Pin 2

4. Solder the drain wire to the stripped portion of the black, line ground wire (see Figure 7).

Figure 7: Solder the Drain Wire to the Black, Ground Wire

1¼”(32mm)

Strip off ¼”(6mm) of Wire Insulation

P4 Connector

Black, Line Ground Wire at Pin 2

Drain Wire

Drain WireBlack, Line Ground Wire

Solder

Soldering Iron

8/15/97


5. Wrap the foil back around the wires. Replace the gray outer insulation. Wrap a small amountof electrical tape around the cable to hold the gray insulation in place.

6. Replace the plastic cover. Using a black permanent ink marker, record the new revision levelon the cable label (revision C).

7. Plug the camera cable into the new PR board.

8. Turn on the power to the bonder. If camera functions properly, close VME drawer. If cameradoes not function properly, proceed to step #9.

9. If camera does not function properly, turn off the power to the bonder and check allconnections. After checking all the connections, turn on the power to the bonder and checkcamera function. If camera functions properly, close VME drawer. If camera doesn’tfunction properly, call your Orthodyne Electronics Field Service representative for furtherassistance.

D. Replace Camera Cable (P/N 172635), Refer to Drawings #172000 and #172003

1. Remove the rear panel from the bonder (item 18, #172000). Remove the rear base cover(item 43, #172000) and top cover (item 44, #172000) from the bonder assembly.

2. Start to remove the camera cable at the P4 connector end (at the VME card cage). Cut offany cable ties and remove from any plastic clips as you work your way up the cable.

NOTE: Take note of where you remove the cable ties from so that you may replace them inthe same location upon reassembly.

4. Remove the stiffener bracket from the bottom of cat track (item 152, #172000)

5. Remove the two cable clamps (item 153, #172000) at each end of the cat track (item 123,#172003). Remove the outer covering from the cat track to gain access to the camera cable.By placing a finger into the top link of the cat track you will be able to start removing theouter covering (see Figure 8). Push the top link out and carefully continue to remove thelinks all the way down the cat track.

8/15/97


Figure 8: Remove the Outer Covering From the Cat Track

NOTE: The links in the outer covering are fragile and need to be removed carefully.

6. Disconnect the camera cable from the camera and remove cable from the plastic clips insidethe bonder assembly. Remove the camera cable from the cat track.

7. Connect the new camera cable to the PR board. Run the cable back along the route up towardthe cat track. Run the cable through the cat track and into the bonder assembly. Place cableinto the plastic clips and loop the cable as shown in figure 9. The camera should be in the fulldownward position when making the loop.

Figure 9: Loop Camera Cable As Shown

8. Turn on the power to the bonder. If camera functions properly, turn off the power to thebonder and finish the cable routing by tying the camera cable in place and attaching anyplastic clips that were removed. Proceed to step #10. If camera does not function properly,proceed to step #9.

9. If camera does not function properly, turn off the power to the bonder and check allconnections. After checking all the connections, turn on the power to the bonder and checkcamera function. If the camera functions properly, turn off the power to the bonder and finishthe cable routing by tying the cable in place and attaching any plastic clips that wereremoved. Proceed to step #10. If camera doesn’t function properly, call your OrthodyneElectronics Field Service representative for further assistance.

3”(76mm)

Push Out The Top Link

8/15/97


10. Replace the outer covering and plastic cable clamps (item 153) on the cat track. Replace therear base cover (item 43) and top cover (item 44) onto the bonder assembly. Replace the rearpanel onto the bonder (item 18). Close the VME drawer.

11. Turn on the power to the bonder.


7/30/97




Subject: Installation of new Hard Drive Mktg. Approval


Drawing/ P/N: 172453 Kit Drawing Tech. PublicationApproval

Prepared By: George Ritsi George Ritsi

Purpose

Installation Instruction IN1069 describes the procedure for installing the new Hard Drive

Applicable

All Model 360C’s.

Summary

The new Hard Drive kit, P/N 172453 requires changing two EPROMS on the CPU board.

Contents of kit, P/N 172453 include the items shown in the Table below:

Part Number Description172558 Hard Disk, 3.5”, SCSI

172721-1 Program EPROM for GMS CPU board

172721-2 Program EPROM for GMS CPU board

172453 Drawing, Hard Disk Drive Kit

The new Hard Drive replaces the previous hard drive which has been obsoleted by the manufacturer.The new hard drive contains more memory. It comes with Software Version 5.5.

The Kit requires that two EPROMS included in the Kit be replaced on the GMS CPU board.

7/30/97



Installing the Replacement Hard Disk Drive

Applicable

Model 360C’s with GMS CPU boards only. Use P/N 172453.

Machines with Themis CPU board or Seagate ST15260N Hard Disk do not need the entire kit, only theHard Disk drive (P/N 172558). Note that this Hard Disk drive will come loaded with software version5.5 (or the latest released software version).

Part Number

The replacement Hard Drive Kit Part Number is P/N 172543

Introduction

The new Hard Disk Drive replaces the previous Hard Disk Drive which has was discontinued by themanufacturer. The replacement Hard Drive contains more memory than the old unit.

The Hard Drive Kit contains two EPROMs which replace comparable units on the GMS CPU board, ifthe existing EPROMs on the board are Rev A or older. If your GMS CPU board contains EPROMs thatare Rev B or newer, then you do not have to replace the EPROMs.

Contents of the kit include:

Part Number Descriptions

172558 Hard Disk, 3.5", SCSI

172721-1 Rev B Program EPROM for GMS CPU board

172721-2 Rev B Program EPROM for GMS CPU

172453 Drawing, Hard Disk Drive Kit

Procedure

1. Power down the bonder.

2. Remove the CPU board from the VME card cage.

WARNING: Before you handle any Orthodyne circuit board assembly, you must be groundedprevent static electricity discharge from damaging the board.

7/30/97


1. Check the Rev Number of the EPROMs and replace if they are Rev A or older with the unitsincluded in the kit.

2. Remove the old Hard Disk Drive and replace with the unit included in the kit. Use existinghardware to install the new disk.

3. Replace the CPU board and reconnect all cables.

4. Close the VME card cage securely and Power up the machine.

NOTE: The new Hard Disk Drive is pre-loaded with Software Version 5.5. It requires Version 5.5or later in order to operate.

11/05/97

INSTALLATION INSTRUCTION INXXXX PAGE 1 OF 1

INSTALLATION INSTRUCTIONAPPROVAL SHEET



Subject: Installation of Z-CableProtection Kit

Mktg. Approval


Drawing/ P/N: 172000 172003, and 172457 Tech. PublicationApproval


Purpose

The purpose of IN1071 is to provide instructions for the installation of the Z-cable protection kit (P/N 172457).

Applicable


Summary

Applications that require extreme rotational movement may cause the Z-cable (P/N 172610) to wear against theoptics tube (P/N 171005) and the wire guide tube (P/N 172238). To avoid this potential problem, Orthodynerecommends installation of Z-cable protection kit.

Installation Instruction 1071 is divided into two sections; one covers the Model 360C bonder and the other coversthe Model 360S bonder.

Contents Of Kit P/N 172457

Qty. P/N Description1 619616 Grommet, Rubber, 3/8” ID

80mm 649025 Tubing, Teflon, .208” ID x .015” Wall Thk

1 172383 Nose, Optical Tube

1 172457 Drawing, Z-Cable Protection Kit

1 IN1071 Installation Instruction 1071

11/05/97

INSTALLATION INSTRUCTION IN1071 PAGE 1 OF 6


Installation of Z-Cable Protection Kit

ToolsNeeded:

Time toComplete:

DifficultyLevel: 1 2 3 4 5

Common Hand Tools ½ Hour(s) EASY

Rubber Grommet (provided in kit)

Metric Allen wrenches MODERATE

DIFFICULT

Applicable


Part Number

172457, Z-Cable Protection Kit


Qty. P/N Description1 619616 Grommet, Rubber, 3/8” ID

80mm 649025 Tubing, Teflon, .208” ID x .015” Wall Thk

1 172383 Nose, Optical Tube

1 172457 Drawing, Z-Cable Protection Kit

1 IN1071 Installation Instruction 1071

Introduction

Applications that require extreme rotational movement may cause the Z-cable (P/N 172610) to wear against theoptics tube (P/N 171005) and the wire guide tube (P/N 172238). To avoid this potential problem, Orthodynerecommends installation of Z-cable protection kit.

Installation Instruction 1071 is divided into two sections; one covers the Model 360C bonder and the other coversthe Model 360S bonder.

Procedure For Model 360C

1. Turn off the power to the bonder.

2. Remove the wire from the bond head (P/N 172003).

11/05/97


3. Open the dereeler cover (P/N 172215) and lift the idler pivot arm (P/N 172155) upward. (This will allow thewire guide sleeve to be moved upward in step #4.)

Figure 1: Lift Idler Pivot Arm (P/N 172155) Upward

4. Gently move the wire guide sleeve (P/N 168066-2) up just inside the wire guide tube (P/N 172238). See Figure 2.

WARNING: Do not use tweezers to lift the wire guide sleeve upward. The wire guide sleeveis easily damaged.

Figure 2: Move Wire Guide Sleeve Up Into The Wire Guide Tube

Move Wire Guide Sleeve To Here

Wire Guide Sleeve

Lift Idler Pivot Arm Upward

11/05/97


5. Remove the wire tube guide (P/N 172325) from the bottom of the wire guide tube (P/N 172238). See Figure 3.

Figure 3: Remove Wire Tube Guide (P/N 172325) From Bond Head

6. Straighten the teflon tubing (P/N 649025) provided in the kit. Slide the teflon tubing onto the wire guide tube.

WARNING: The bottom edge of the wire guide tube may be sharp!

7. Install the wire tube guide back onto the bond head.

8. Slide teflon tubing (P/N 649025) down until it bottoms out on the wire tube guide (P/N 172325).

9. Place wire guide sleeve back into position.

10. Disconnect the frame grabber board-to-camera cable (P/N 172635) from the top of the camera (P/N 172255).

11. Remove the camera (with optic tube attached) from the optic tube clamp (P/N 172153) by loosening the twoclamp screws.

12. Screw the optic tube nose (P/N 172383 onto the end of the optic tube (P/N 171005). Locate the rubber grommetprovided in the kit. Slip the rubber grommet over the optic tube nose, grip the optic tube nose with the grommetand tighten as much as possible by hand. Remove the grommet after tightening

WARNING: Do not use pliers, or other similar tool, to tighten the optic tube nose to the optictube. Damage to the outside surface of the optic tube nose could result, allowinga sharp edge for the Z-cable to wear against.

12. Install the camera (with optic tube attached ) back into the optic tube clamp. Do not over tighten the screws thathold the optic tube in place.

WARNING: Do not allow the Z-cable to be caught between the optic tube and the wire guidetube. The Z-cable must be behind both the optic tube and the wire guide tube.Remove the bearing housing cover (P/N 172222) to view down the Z-Thetabearing tube. Check this carefully to be sure the Z-cable routing is correct.Install the bearing housing cover when you are sure the routing of the Z-cable iscorrect.

Remove Wire Tube Guide

11/05/97


13. Connect the frame grabber board-to-camera cable to the camera.


15. Check for camera alignment. From the Main Menu, choose Manual Positioning (4). Using the spinners on thekeypad, move the camera to a distinct spot on the work surface. Change focus as necessary. Place the spot on farleft side of the X crosshair. Spin the X spinner to move the spot to the right side of the crosshair. If the spot isnot on the right crosshair, adjust the camera by loosening the two clamp screws slightly and rotate the camera tobring the spot closer to the X crosshair. Repeat the test until the spot stays on the X crosshair as you move fromleft to right.

16. Perform Magnification Calibration. From the Main Menu, choose Calibration Menu (7), then MagnificationCalibration (D). Follow the on screen instructions.

17. Perform Focus Offset Calibration. From the Main Menu, choose Calibration Menu (7), then Focus Offset (C).Follow the on screen instructions.

18. Perform Offset Calibration. From the Main Menu, choose Calibration Menu (7), then Offset Calibration (C).Follow the on screen instructions.

Procedure For Model 360S


2. Open the left portion of the bearing housing cover assembly (P/N 175250). This is the door portion of theassembly.

3. Remove the wire from the bond head.

4. Remove the forcer wire guide (P/N 175338) from the bond head (see Figure 4).

Figure 4: Forcer Wire Guide (P/N 175338) From Bond Head

5. Remove the wire guide tube holder (P/N 172346) from the bond head (see Figure 3).

Wire Guide Tube Holder Forcer Wire Guide

11/05/97


6. Straighten the teflon tubing (P/N 649025) provided in the kit. Slide the teflon tubing onto the wire guide tube(P/N 175219).

WARNING: The bottom edge of the wire guide tube may be sharp!

7. Install the wire guide tube holder back onto the bond head.

WARNING: Do not allow the Z-cable to be caught between the optic tube and the wire guidetube. The Z-cable must be behind both the optic tube and the wire guide tube.Check this carefully to be sure the Z-cable routing is correct.

8. Slide teflon tubing (P/N 649025) down until it bottoms out on the wire guide tube holder (P/N 172346).

9. Install the forcer wire guide back onto the bond head.

10. Disconnect the frame grabber board-to-camera cable (P/N 172635) from the top of the camera (P/N 172255).

11. Remove the camera (with optic tube attached) from the optic tube clamp (P/N 172153) by loosening the twoclamp screws.

12. Screw the optic tube nose (P/N 172383), provided in the kit, onto the end of the optic tube (P/N 171005).Locate the rubber grommet provided in the kit. Slip the rubber grommet over the optic tube nose, grip with thegrommet, and tighten as much as possible by hand. Remove the grommet after tightening

WARNING: Do not use pliers, or other similar tool, to tighten the optic tube nose to the optictube. Damage to the outside surface of the optic tube nose could result, allowinga sharp edge for the Z-cable to wear against.

12. Install the camera (with optic tube attached) back into the optic tube clamp. Do not over tighten the screws thathold the optic tube in place.

WARNING: Do not allow the Z-cable to be caught between the optic tube and the wire guidetube. The Z-cable must be behind both the optic tube and the wire guide tube.Look down the Z-Theta bearing tube to carefully check that the Z-cable routingis correct. Close the bearing housing cover when you are sure the routing of theZ-cable is correct.

13. Connect the frame grabber board-to-camera cable to the camera.


15. Check for camera alignment. From the Main Menu, choose Manual Positioning (4). Using the spinners on thekeypad, move the camera to a distinct spot on the work surface. Change focus as necessary. Place the spot on farleft side of the X crosshair. Spin the X spinner to move the spot to the right side of the crosshair. If the spot isnot on the right crosshair, adjust the camera by loosening the two clamp screws slightly and rotate the camera tobring the spot closer to the X crosshair. Repeat the test until the spot stays on the X crosshair as you move fromleft to right.

16. Perform Magnification Calibration. From the Main Menu, choose Calibration Menu (7), then MagnificationCalibration (D). Follow the on screen instructions.

17. Perform Focus Offset Calibration. From the Main Menu, choose Calibration Menu (7), then Focus Offset (C).Follow the on screen instructions.

11/05/97


18. Perform Offset Calibration. From the Main Menu, choose Calibration Menu (7), then Offset Calibration (C).Follow the on screen instructions.

11/10/97

PAGE 1 OF 1




Subject: Matching Signal Sample OnNew Ultrasonic GeneratorBoard

Mktg. Approval


Drawing/ P/N: 172000 & 175505, 175507 Tech. PublicationApproval


Purpose

The purpose of IN1072 is to provide instructions for the installation of three resistors onto the Ultrasonic Generatorboard (P/N 175507).

Applicable

All Model 360C family and Model 360S family machines with Ultrasonic Generator board (P/N 175507)

Summary

The Signal Sample of the Ultrasonic Generator board (P/N 175507) is not matched to the same voltage as the old-style Ultrasonic Generator board (P/N 172567). To correct this difference, three resistors are soldered onto theUltrasonic Generator board (P/N 175507). IN1072 explains the proper procedure for correctly soldering the resistorsonto the Ultrasonic Generator board.

NOTE: The analog signal sample does not affect the operation of the bonder. This signal isused to monitor the load impedance under the bond tool.


Qty. P/N Description1 738558 Resistor Carb. Film, ±5%, 1/8W, 2.7K MEG, R441 738560 Resistor Carb. Film, ±5%, 1/8W, 3.3K MEG, R411 738644 Resistor Carb. Film, ±5%, 1/8W, 2.7 MEG, R11

11/10/97



Matching Signal Sample On New Ultrasonic Generator Board

ToolsNeeded:

Time toComplete:


Common Hand Tools ¾ Hour(s) EASY

Soldering Tool with 1/16” soldering tip

Solder with Flux (.036” - .020” diameter) MODERATE

DIFFICULT

Applicable

All Model 360C family and Model 360S family machines with Ultrasonic Generator board (P/N 175507)

Part Number

172458, Dual Level U/S Generator Modification Kit


Qty. P/N Description1 738558 Resistor Carb. Film, ±5%, 1/8W, 2.7K MEG, R441 738560 Resistor Carb. Film, ±5%, 1/8W, 3.3K MEG, R411 738644 Resistor Carb. Film, ±5%, 1/8W, 2.7 MEG, R11

Introduction

The Signal Sample of the Ultrasonic Generator board (P/N 175507) is not matched to the same voltage as the old-style Ultrasonic Generator board (P/N 172567). To correct this difference, three resistors are soldered onto theUltrasonic Generator board (P/N 175507). IN1072 explains the proper procedure for correctly soldering the resistorsonto the Ultrasonic Generator board.

NOTE: The analog signal sample does not affect the operation of the bonder. This signal isused to monitor the load impedance under the bond tool.

Procedure


11/10/97


2. Open the VME chassis assembly (P/N 172015) to gain access to the ultrasonic generator board (P/N 17507) (seeFigure 1).

Figure 1: Ultrasonic Generator Board (P/N 175507)

3. Remove the signal sample cable (P/N 708210) from the front panel of the ultrasonic generator board.

4. Disconnect the generator-to-junction board coaxial cable (P/N 172618-1) and the power supply-to-generatorcable (P/N 172628) from the back of the ultrasonic generator board (see Figure 2).

Figure 2: Remove Generator-To-Junction Board Cable (P/N 172618-1)

ESD Warning: Wear grounding straps when handling the printed circuit boards to preventstatic build-up from damaging sensitive electronics components on theboards.

6. Loosen the two retaining screws on the ultrasonic generator board and remove the ultrasonic generator boardfrom the VME card cage (P/N 172016).

Ultrasonic Generator Board

Disconnect Cable P/N 172618-1

Disconnect Cable P/N 172628

11/10/97


7. Locate the following resistors on the ultrasonic generator board (see Figure 3 to help with location):

• Resistor network RP4 (P/N 741505)

• Resistor R11 (P/N 738644)

• Resistor R41 (P/N 738568)

Figure 3: Locate Resistors On Ultrasonic Generator Board

8. Using the soldering tool, remove resistor R11. Replace R11 with 2.7 Meg resistor (P/N 738644).

9. Using the soldering tool, remove resistor R41. Replace R41 with 3.3K Meg resistor (P/N 738560).

Resistor Network RP4

Resistor R11 Resistor R41

11/10/97


10. Turn the board over and locate resistor network RP4 (See Figure 4 to help with location). Locate pin 7 andpin 8 on RP4.

Figure 4: Locate Resistor Network RP4 On Back Of Generator Board

11. Solder 2.7K Meg resistor (P/N 738558) from pin 7 to pin 8 on network RP4 as shown in Figure 5.

Figure 5: Solder Resistor P/N 738558 To Resistor Network RP4

Pin #8

Pin #7

Locate Resistor Network RP4

Solder Resistor P/N 738558 To Pins #7 & #8 Of RP4

11/10/97


12. Using a black, fine-tipped marker, change the revision level of the board to “G” as shown in Figure 6.

Figure6: Mark Board As Revision ”G”

13. Slide the ultrasonic generator board back into the VME card cage. Firmly seat the board into place. Tighten thetwo screws that hold the board in place.

14. Connect the generator-to-junction board cable and the power supply-to-generator cable to the back of theultrasonic generator board.

15. Connect the signal sample cable to the front panel of the ultrasonic generator board.

16. Close the VME chassis assembly.


Mark Board As Revision “G”

1/28/98

PAGE 1 OF 1




Subject: Installing the Motor/EncoderReplacement Kit

Mktg. Approval




Purpose

The purpose of IN1073 is to provide instruction for the installation of the motor/encoder assembly replacement kit(P/N 172455 or 172455-1).

Applicable

Model 360C family and Model 360S family machines

Summary

During certain X-axis moves, the Y-motor cable to Y-motor connection might fail. The failure was due to arcingcaused by the poor fit of the Y-cable connector to the motor. Orthodyne Electronics created a new motor and cablecombination to fix this problem. IN1073 describes the proper method to replace the Y-motor/encoder and cable withthe new motor/encoder combination.

• If the customer has a Y-motor with encoder attached (P/N 172233) it will be replaced by Motor/EncoderReplacement Kit (Basic Kit) P/N 172455.

• If the customer has a Y-motor (P/N 172372) with separate encoder (P/N 172652), the encoder does not need tobe replaced. Use Motor/Encoder Replacement Kit P/N 172455-1.

1/28/98



Installing the Motor/Encoder Replacement Kit (P/N 172455)

ToolsNeeded:

Time toComplete:


Common Hand Tools 1 Hour(s) EASY

Metric Allen wrenches

1000 Gram Gauge MODERATE

Small Ruler

DIFFICULT

Applicable


Part Number

172455, 172455-1, and 172455-99

Introduction

Orthodyne Electronics has created a new-style Y-motor/encoder and cable combination (P/N 172455-99). Undercertain situations the old-style Y-motor and cable combination could fail at the connector. By designing the cable asa permanent attachment to the motor the possibility of the connector failing has been eliminated.

• If you have a Y-motor with encoder attached (P/N 172233, old style encoder) it will be replaced byMotor/Encoder Replacement Kit (Basic Kit) P/N 172455.

• If you have a Y-motor (P/N 172372) with separate encoder (P/N 172652, new style encoder), the encoder doesnot need to be replaced. Use Motor/Encoder Replacement Kit P/N 172455-1.

Procedure

Follow the procedure below to install the new-style Y-motor/encoder and cable:

1. Press the “Home” key on the keypad to raise the bond head to home. This will prevent you from running thebond head into a solid object during this procedure.


1/28/98


Remove the Y-Motor From the Bonder Assembly

1. Remove the rear base cover (P/N 172220), the two side base covers (P/N 172219), and the bellows outer plate(P/N 172172) from the bonder assembly (see Figure 1).

Figure 1: Remove Covers As Shown

2. Determine if your bonder is a “Left” or a “Right” machine. Looking from the front of the bonder, notice whichside of the bonder your motor drive card cage (P/N 172020) is located. If your cage is on the left, you have a“Left” bonder. If your cage is on the right, you have a “Right” bonder. This will be important later.

3. Now that you know which kind of bonder you have, remove the outer bellows plate (P/N 172169) that is on theopposite side as the motor drive card cage (see Figure 1).

4. Disconnect the Y-motor cable and the encoder cable from the motor drive card cage.

5. Remove the two screws that hold the Y-axis motor mounting bracket (P/N 172122) to the X-axis casting (P/N172137-99) casting (see Figure 2). This will allow you to remove the Y-motor with the bracket. Set the beltaside.

Remove Both Side Covers

Remove Bellows Outer Plate

Remove Outer Bellows Plate(See Step #3)

Remove Rear Cover

1/28/98


Figure 2: Remove the Y-Axis Motor Mounting Bracket From The X-Casting

6. Remove all the cable clips and cable ties from the Y-motor and encoder cables. Remove all the cable tiesholding the cables to the Y-motor.

7. Remove the four screws that hold the Y-motor to the bracket.

8. Remove the leadscrew pulley (P/N 172241-2) from the shaft of the Y-motor.

Determine The Style Of Encoder

Take a look at the encoder assembly on the motor (see Figure 3). If you have a motor with an “old-style” encoder goto “Install New Y-Motor/Encoder to Bracket.” If you have a “new-style” encoder go to “Remove and InstallEncoder.”

Figure 3: Which Style Encoder Do You Have?

Remove Two Screws

Y- Axis Motor Mounting Bracket

Old Style Encoder New Style Encoder

1/28/98


Remove and Install Encoder

You have determined that you have a new style encoder. Use the procedure below to remove the encoder from theold motor and install it onto the new motor that came with the kit.

1. Remove the two set screws that hold the encoder wheel to the motor shaft (see Figure 4).

2. Remove the two screws that hold the encoder assembly to the motor (see Figure 4). Lift the encoder off theshaft.

Figure 4: Remove Encoder Assembly

3. Place the encoder on the new Y-motor assembly. Fasten the encoder to the motor using the two screws andwashers supplied in the kit.

4. Look into the set screw holes. Line up the two flats on the motor shaft with the set screw holes.

5. Install the two set screws and tighten.

Install New Y-Motor/Encoder To Bracket

Remember when you determined which “side” machine you have. Is it a “right,” or a “left?” Keep this in mind asyou finish the rest of the procedure.

1. Look at Figure 5. Note that the way the cables are held to the motor is a “mirror” image of each other. One isfor the “right” bonder and the other is for the “left” bonder.

Remove Two Set Screws From Shaft(Step #1)

Remove Two Screws From Motor(Step #2)

1/28/98


Figure 5: Routing Of The Cables On The Motor

2. Using the cable ties and cable tie mount provided in the kit, attach the cables to the motor as shown in drawing#172455 and Figures 5, 6, and 7.

Figure 6: Routing For “Right” Bonder Figure 7: Routing for “Left” Bonder

3. Using three cable ties (P/N 618700) provided in the kit, tie the encoder cable to the motor cable as shown inFigure 8.

“Right” Bonder Routing “Left” Bonder Routing

11/22/99

INSTALLATION INSTRUCTION IN1073

Figure 8: Tie Cables Together

4. Install the motor to the bracket using the four screws you removed earlier. Note the orientation of the cables ondrawing 172455.

5. Install the pulley onto the motor shaft. Set the pulley on the shaft as show in Figure 9. Be careful to fully engageboth flats on the motor shaft and tighten the set screws.

Figure 9: Set Pulley Onto The Motor Shaft

Install Y-Motor Onto Bonder Assembly

1. Loosely install the Y-motor onto the bonder assembly using the two screws you removed earlier.

2. Install the belt onto the pulleys. Set the tension on the belt and tighten the screws on the bracket. Tension shouldbe measured at the center of the belt (between the pulleys). Apply 1000 grams of force to center of belt andmeasure the deflection. Deflection should be about ¼”(6mm) .

3. Route the cables as shown in Figures 10, or 11, depending on if your bonder is a “right” or a “left.” Use cableclamp (P/N 618520), screw (P/N 500400-12), hex nut (P/N 582401), and washers (P/N 570401) to hold themotor cable to the underside of the top base casting (P/N 172136).

Set Gap To .03”(.75mm)

Space The Ties 2 ¾”(70mm) Apart

PAGE 6 OF 7

11/22/99

INSTALLATION INSTRUCTION IN1073

Figure 10: Routing For “Right” Bonder Figure 11: Routing For “Left” Bonder

4. Connect the Y-motor cable to J6 on the motor drive card cage.

5. Connect the encoder cable to J11 on the motor drive card cage.

6. Move the bonder assembly side to side in the X-axis several times. Be sure that the cables move smoothly anddo not bind. Check that the cables do not rub against the motor drive card cage.

Finish Installation Procedure

1. Install the two side base covers (P/N 172219) and the outer bellows plate (P/N 172169) onto the bonderassembly.


3. Check home offset calibration by going from Main Menu, to Calibration Menu [7], to Recalibrate Home [9].

4. Press [START] to recalibrate home. The bond head will move forward and then back. The data monitor willchange to the VERIFY screen. Check that the Y offset value is in the specified range between 15 and 50. If theoffset value is between 15 and 50, go to step #7. If the offset value is not between 15 and 50, go to step #5.

5. If the offset values are not between 15 and 50, loosen the two screws that hold the Y-motor bracket. Move thebelt slightly on the motor pulley. Set the tension on the belt using step #2 in “Install Y-Motor Onto BonderAssembly. ”

6. Repeat steps #4 and #5 until the offset values for the Y-axis are between 15 and 50.

7. Install the rear base cover (P/N 172220) and the bellows outer plate (P/N 172172) onto the bonder assembly.

NOTE: It may be necessary to recalibrate X and Y on all files. Check for correct bondlocations in all files before running production.

Attach Motor Cable To Casting

PAGE 7 OF 7

4/29/98

Replacing Z Motor and/or Theta Motor

Applicable:


Part Numbers:

New Z Motor (with permanently attached lead): P/N 634823

New Theta Motor (with permanently attached lead): P/N 634823

New Z Motor Interconnect Cable: P/N 172666-1

New Theta Motor Interconnect Cable: P/N 172666-2

Kit, Z Motor/Encoder Replacement: P/N 172455-2

Contains: New Z Motor, replaceable encoder (P/N 172652), new interconnect cable(P/N 172666-1), cable clamps and other hardware.

Kit, Theta Motor/Encoder Replacement: P/N 172455-4

Contains: New Theta Motor, replaceable encoder (P/N 172652), new interconnectcable (P/N 172666-2), cable clamps and other hardware.

INSTALLATION INSTRUCTION No. IN1075

Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5



MODERATE

DIFFICULT


4/29/98

Introduction

Orthodyne Electronics has created a new style Z and Theta motor/encoder and cable com-bination. The new style motor has a permanently attached cable, eliminating the connec-tor on the motor body. This configuration has been found to be less susceptible to damage by sustained vibration.

There are a number of possible replacement kit numbers depending on the configuration of the motor being replaced. The choices are shown in the following table:

Procedure

The replacement procedure is written to show the replacement of both the Z and Theta motors, and the installation of the new interconnect motor drive cables through the cat track, at the same time. Because of the time involved in the installation, you may find it more efficient to replace both Z and Theta motor/cables sets, even if only one has failed.

Replacement Kit Table

Motor To Be

ReplacedP/N Replacement Kit

P/NReplacement Kit

Contents

Old style Z or Theta motor with permanently attached encoder assembly

172233Cable: 172608-2

Z: Kit 172455-2 Motor: 634823Encoder: 172652Cable: 172666-1

172233Cable: 172606-4

Theta: Kit 172455-4 Motor: 634823Encoder: 172652Cable: 172666-2

Newer style Z or Theta motor with detachable encoder assembly

172372Cable: 172608-2

Z: Kit 172455-3 Motor: 634823Cable: 172666-1

172372Cable: 172608-4

Theta: Kit 172455-5 Motor: 634823Cable: 172666-2


4/29/98

Remove Z and Theta Motor Assemblies

1. Press the “Home” key on the control pad to raise the bond head to its home posi-tion. This will prevent you from running the bond head into a solid object duringthis procedure.


3. If necessary, move the bonder so you have access to the side and rear of thebonder.

4. Remove the left cover to the upper bonder assembly and disconnect camera cable.(see Figure 1).

5. Remove Back and Left side covers from the X-Y table.

Figure 1 Remove Left Bonder Cover

ESD WARNING: Always wear ground straps when working near the printedcircuit boards to prevent electro-static discharge from dam-aging any sensitive electronic components on the boards.

6. Disconnect the Z motor and encoder cable connectors from the motor/encoder.

7. Disconnect all cables from Forcer/Focus board (see Figure 2). This will make iteasier to disconnect and remove the Z and Theta cables, and to disconnect the cattrack.

Remove Left Bonder Cover

Disconnect Camera Cable


4/29/98

Figure 2 Disconnect all Cables from the Forcer/Focus Board

8. Remove the Z motor by removing the two cap screws that hold the Z motorbracket on the casting (see Figure 3). Once the motor is loose, remove the beltfrom the pulley and remove the motor.

Disconnect All CablesDisconnect All

Cables


4/29/98

Figure 3 Remove The Z Motor

9. Remove the Theta Motor by disconnecting the bracket holding the motor to thebonder casting. The figure shows the screws holding the bracket being removedby an Allen wrench. This will remove the motor and the sensor/flag assembly too.

Figure 4 Disconnect the Theta Motor Support Bracket

10. To remove the Theta belt, remove the access plate from the top-right side of thebonder and work loose the Theta belt (see Figure 5).

Remove Two Screws

Z-Axis Pulley

Theta Motor Bracket

Allen Wrench


4/29/98

Figure 5 Removing The Theta Belt

11. Disconnect all cables to the Theta motor and the theta encoder, and remove themotor and the assembly (with the home flags) from the bonder and lay it aside.Figure 6 shows the bonder with the Z and Theta motors removed.

Figure 6 View of Bonder Housing With Motors Removed

Remove AccessPlate

Theta Belt


4/29/98

Remove Cat Track

1. Unplug all cables that go through the cat track from the upper bonder housing.

2. Remove cable clamps and ground connections from the bonder casting that gothrough the cat track.

3. Remove the cat split clamp and cat track clamp (see Figure 7).

Figure 7 Remove the Cat Track Clamp

4. Carefully feed all the cables that go into the cat track through the opening in thecasting and lay the cat track out flat along the back of the machine (see Figure 8).

Figure 8 Remove The Cat Track From The Top Of The Bonder

Cat Split Clamp

Cat Track Clamp

Cat Track Removed From Upper Clamp Connection


4/29/98

Remove and Replace The Motor Drive Cables In The Cat Track

1. Remove the cable clamps from the top and bottom of the cat track.

2. At the bottom of the bonder casting, cut the outer cable ties and loosen the centercable clamp (see Figure 9).

Figure 9 Cut The Outer Cable Ties

3. Pull out the Z and Theta motor drive cables from the cat track (see Figure 10).You will find it easier to remove the cables if you unsnap the cat track links atleast half way up the track. You may have to lightly pry the cat track links apart.

Figure 10 Remove Old Motor Drive Cables From Cat Track

4. Disconnect the old Z and Theta motor drive cables from the motor drive board(see Figure 11). The Theta cable is connected to J4 and the Z cable to J5.


4/29/98

Figure 11 Disconnect Old Motor Drive Cables From Back-plane Board of the Motor Drive Card Cage

5. Replug the new Z and Theta motor drive cables to the backplane board of themotor drive card cage.

NOTE: Make sure the end of the cable that is nearest the motor drive board hasthe correct mating connector. The two ends of the motor drive cableshave different connectors.

6. Now feed the new Z and Theta motor drive cables (P/N 172666-1 and 172666-2)through the cat track. You will feed the cable from the bottom of the cat track tothe top. (Refer to drawing 172000, sheet 4 of 5, section L-L for details on thearrangement of wires in the cat track.)

7. Carefully work the motor drive cables through the cat track, being careful not totwist the cable bundle as you feed the connector up the cat track. Make sure youallow a large enough service loop at the bottom to accommodate cat track move-ment.

Reassemble

1. Plug the motor cables into the backplane board of the motor drive card cage.Theta motor drive cable connects to J4 and the Z motor drive cable connects to J5.

2. Re-attach the bottom cat track cable clamp.


4/29/98

NOTE: Make sure you don’t pinch the flat ribbon cable when re-installing thelower cat track cable clamp.

3. Dress the cables neatly through the cat track so they are flat.

4. Roll up the cat track towards the top of the bonder.

5. Feed the cables through the casting opening at the top of the bonder.

6. Re-attach the cat track split clamp and upper cable clamp.

7. Re-attach the cat track support.

Assemble The New Motors

Figure 12 shows the old motor on the left and the new motor on the right. The new motor has a permanently attached cable pigtail. This pigtail will connect to the new motor inter-connect cable you just fed through the cat track.

Figure 12 Old and New Motor Configuration

1. You will now remove the old Theta motor from the Home sensor assembly andmotor bracket.

NOTE: Observe the position of the gears before you disassemble the Thetamotor, so you can replace the new motor in the same position. The ori-entation of the sensor flags is shown in Figure 13.

Old MotorNew Motor With Permanent Lead


4/29/98

o n

Figure 13 Orientation of Shutter Position

2. Loosen the set screw holding the gear and flag assembly and remove it from themotor shaft (see Figure).

Figure 14 Removing The Motor From The Flag And Belt Pulley Assembly

3. Loosen the two set screws holding the belt pulley on the motor shaft

4. Remove the screws holding the motor to the motor bracket and slide the motor outthe bottom from the belt pulley and bracket.

5. Reverse the procedure to attach the new Theta motor to the motor bracket.

Loosen Set Screw And Pull Up On Flag To Remove From Motor Shaft

Loosen (2) Set Screws TLet Motor Shaft Slip Dow


4/29/98

6. Re-attach the Home Sensor assembly. When you re-install the Home Shutterassembly, mesh the gear teeth in the same position as shown in Figure 13.

NOTE: Mount the motor so no backlash occurs between the two gears, whilealso avoiding excessive contact pressure

7. Re-install the Theta Motor bracket on the casting. Make sure you thread the Thetabelt properly before attaching the bracket. The lead from the Theta motor shouldface the front of the machine as shown in Figure 15 and go underneath the Zmotor case. Attach motor lead connector to motor cable P/N 172666-2.

8. Re-install the Theta belt and Access plate.

9. Check the belt tension. The belt should have about ¼” (6 mm) deflection at about500 grams force. A firm tension by hand at the Theta drive motor is sufficient.

10. Re-attach the Z motor bracket to the casting. Make sure you thread the Z beltproperly before tightening the bracket. The Z belt should be tight with little or nodeflection. Do not use any form of leverage or tools to tension.

11. Use a cable tie to dress the lead of the Z Motor as shown in Figure 15.

12. The Theta motor lead points towards the front of the bonder, and is routed underthe Z motor as shown in Figure 16.

Figure 15 Assembled Motors Showing Routing of Leads

Z Motor

Attach Z Motor Lead To Motor Case Using Cable Tie As Shown

Theta Motor

Theta Motor Lead Points Towards Front And Passes Under Z Motor


4/29/98

Figure 16 View Showing Routing Of Theta Lead Under Z Motor

13. Replug all cables from the cat track and the Z and Theta motors & encoders.Make sure you have sufficient service loops to accommodate movement of the cattrack.

14. Power up the machine.

15. Check Z home offsets and limits.

After replacing the Theta belt:

1. Perform Recalibrate Home and adjust the Theta home flag as described in the Pre-ventive Maintenance section of the M360C User’s Manual.

2. Perform Recalibrate Limits and adjust the Theta limit flag as described in the Pre-ventive Maintenance section of the M360C User’s Manual.

3. Press [HOME] to home the Theta drive and align the head.

4. Loosen the screw that tightens the mounting ring holding the head on the Z-Thetatube. Rotate the head until straight (don't let the tube rotate). Tighten the screwfirmly, but do not overtighten (32 in-lb torque).

5. Press [HOME] to check the rotational alignment. Look directly from the front ofthe bonder, referencing the flats of the Theta/Z Tube bearing block with the flatson the head. You can also sight along the Z tube from the top down to align theflats.

6. Replace all covers.

Z Motor Lead

Theta Motor Lead

Z Motor

Theta Motor


4/29/98

Small Wire Forcer PWM* Switch

Applicable: M360C/S

Part Number: 175562

Introduction:

A small piggy-back circuit board is added to the Forcer/Focus board. The board contains a miniature switch and additional circuitry. This switch has two positions depending on whether a Small Wire head or Large Wire head is on the machine.

When the switch position is on Small Wire head, additional circuitry is added to prevent spurious instability from affecting the forcer circuit. This instability could occasionally cause inconsistent bonds, or could stimulate a resonance which would cause the tool to repeatedly hit the surface.

Procedure

1. Turn off power to the bonder.

2. Locate the forcer/focus board (P/N 175537) under the top assembly cover.

ESD WARNING: Always wear ground straps when handling the printedcircuit boards to prevent electrostatic discharge from dam-aging any sensitive electronic components on the boards.

3. Remove all cables connected to the forcer/focus board.


Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5


Small Soldering Iron

Solder sucker or solder wick MODERATE

DIFFICULT

* PWM (Pulse Width Modulation)


4/29/98

NOTE: The F/F board (175537) must be “Rev G” to start. After the modifica-tion is made to the board, change the marking on the board to Rev H.

If your F/F board is earlier than Rev G, call your Orthodyne Representa-tive to determine how you can upgrade your board to Rev G.

4. Remove the board from the housing by removing the four 2.5mm cap screwslocated at the corners of the board.

5. Place the forcer/focus board on an appropriate ESD-safe surface for making sol-dering connections on the board.

Figure 1 shows the appearance of the board before making the modification. The capaci-tor and resistor you will remove to install the new piggy-back board are shown circled in Figure 1.

Figure 1 Forcer/Focus Board Before Modification

6. Locate capacitor C16 and resistor R24. Turn the board over and notice where theleads of these components are soldered on the back of the board (see Figure 2).The tape arrows were placed on the board to help you locate the pins.

Remove Capacitor and Resistor


4/29/98

Figure 2 Component Leads On the Backside Of Board

7. Unsolder the four component leads. Figure 3 shows the technique the technicianuses to unsolder. First place a small amount of solder on the lead. Then place thesolder pump next to the pin and reheat the solder on the pin. Immediately activatethe solder pump to suck away the solder. Repeat the same procedure on theremaining leads.

Figure 3 Unsolder The Component Leads


4/29/98

8. Turn the board over, and apply a small amount of flux over the four empty holes.

9. Carefully insert the piggy-back board (P/N 175562) into the four holes. This is atight fit. When the pins are aligned with the holes, gently push the board downuntil the pins extend about 3mm out the back side of the board. The piggy-backboard can be slightly elevated from the mother board. Solder into place. Whenproperly installed, the piggy-back board orientation will be as shown in Figure 4.

Figure 4 Location Of The Piggy-Back Board

10. Trim the newly soldered leads on the back of the board so they are approximatelythe same height as the other leads.

11. Re-install the board and re-attach the cables.


Orientation of the Piggy-Back Board


4/29/98

13. The small two-position switch on the piggy-back board determines whether it isset for large or small wire operation. When the green LED on the piggy-backboard in ON, it is ready for small wire operation. If the green LED is OFF, it is setfor large wire operation. It is okay to change the position of thw switch while themachine is powered up.

NOTE: A tag is attached next to the Generator board in the VME cage remind-ing the user to place the switch on the piggy-back board in the correctposition depending on the type of head installed on the machine. Thewarning tag is close to the generator power level switch (which also hasto be selected for the type of head installed).


4/29/98

Light Fixture Latch

Applicable: M360C/S with Fluorescent Light Fixtures

Part Number: 172469 (kit)

Introduction:

The new latch for the fluorescent light fixture provides positive closure even under extreme theta axis rotation. The new latch replaces all previous versions.

The latch is simple to install and operate. The latch is strong enough to withstand normal handling loads encountered in the factory.

The new latch kit (172469) replaces the previous push-push mechanical latch (172467), or the older style magnetic latch.

The latch kit contains all the parts required for the installation. Some hardware from the existing latch will be reused.

Procedure

1. Remove the two screws holding the old latch to the fluorescent light fixture anddiscard them.

2. Attach the new latch to the fluorescent fixture using the screws and washers (A)provided with the kit (see Figure 1).


Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5


MODERATE

DIFFICULT


4/29/98

Figure 1 New Latch Attached To Fluorescent Fixture

3. Remove the existing latch assembly from the plastic plate on the bond head byremoving the two screws (B) shown in Figure 1. Save these screws.

4. Attach the new striker plate in the same position using the screws from step 3above.

5. Remove the elastic bumper (if installed) from the light fixture bracket that wasused in the old latch unit (P/N 172467). This piece is no longer needed for theproper operation of the new latch.

6. To open the latch, push in on the knob portion of the latch spring hook arm so thehook on the latch clears the vertical pin on the striker plate while applying rear-ward motion to the light fixture. (See Figure 2.)

Figure 2 Opening The Latch

Attach New Light Fixture Latch Using New Screws (A) From The Kit

Attach Striker Plate Using Screws (B) From Existing Unit

Striker Plate Pin

Latch Spring Hook Arm

Opening Knob

Open by pushing the knob on the latch arm while applying rearward pressure

Latch Is Shown In The Closed Position


4/29/98

7. To close the latch, push the light fixture towards the bond head until the latchengages the striker plate pin. The fluorescent fixture will be held firmly in placeby the spring action of the the latch spring hook arm.


4/29/98

Replacing The Dereeler

Applicable:

Model 360S family machines

Part Numbers:

P/N 175552

(Replaces dereeler P/N 175522)

Introduction

The new dereeler board for the Small Wire bonder, 175552, corrects a drift problem observed with the old dereeler board (175522). The old dereeler had a tendency to drift over time which would sometimes cause the dereeler to despool, or would not identify a tight wire condition and result in a wire break.

The new dereeler board has new circuitry which corrects this problem.

The Installation Instruction describes how to replace the existing dereeler board with the new model, and how to calibrate the new dereeler.


Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5



MODERATE

DIFFICULT


4/29/98

Replacing The Dereeler Board

The procedure describes how to remove the old dereeler, replace it with the new model, and perform the calibration.

NOTE: If your M360S is already equipped with a new style dereeler board (P/N175552), skip to the Calibration portion of this document.


2. Remove the cover from the dereeler.

ESD WARNING: Make sure you are properly grounded before getting closeto or working on any M360C electronic board to preventESD damage.

3. Remove the cables from the old dereeler board shown in Figure 1.

Figure 1 Remove Old Dereeler Board (P/N 175522)

4. Replace with new dereeler board (P/N 175552).

5. Re-connect all cables.


7. Proceed with Calibration.

Remove All Cables

Remove 4 screws


4/29/98

Calibration Procedure

1. Remove the wire from the dereeler

2. Remove the side cover from dereeler to reveal the sensor circuit boards (P/N175552 and 175528). P/N 175528 is located behind the dereeler sensor plate.

Feed Sensor Calibration:

1. To monitor this sensor, place the positive lead of a voltmeter on TP6 and the neg-ative lead on TP3 on circuit board P/N 175552 (see Figure 2).

Figure 2 Test Points for the Feed Sensor and Tight Sensor

2. Adjust VR1 on P/N 175528 (not 175552) until the voltmeter reads 2.75V (seeFigure 3).

Put voltmeter negative lead on TP3Put voltmeter negative lead on TP3 for Feed Sensor

Put voltmeter positive lead on TP6 for Feed Sensor

P/N 175552

Positive lead on TP4 for Tight Sensor

Negative lead on TP5 for Tight Sensor


4/29/98

Figure 3 Adjusting VR1 and VR2 for the Feed Sensor and the Tight Sensor

Tight Sensor Calibration

3. To monitor this sensor, place the positive lead of a voltmeter on TP4 and thenegative lead on TP5 on circuit board 175552 (see Figure 2). Adjust VR2 on P/N 175528 until the voltmeter reads 2.75V. (See Figure 3.)

Motor Speed Calibration

4. Place the leads of a frequency meter from TP8 to TP7 on board 175552.

5. Hold panel switch at the “feed” position, and adjust VR4 until the frequencymeter reads 200Hz. (See Figure 4.)

P/N 175528

VR1 for Feed Sensor

VR2 for Tight Sensor


4/29/98

Figure 4 Adjusting the Motor Speed

“Entry” Feed Threshold Calibration

6. This is a new calibration. To calibrate this setting, place the positive lead of avoltmeter on TP11 and the negative lead on TP13. Adjust VR1 until the voltme-ter reads 300mV.

Figure 5 Adjusting the Entry Feed Threshold

TP7

TP8

Adjust VR4 so Frequency Meter reads 200Hz

TP11

TP13

Adjust VR1 so the voltmeter reads 300mV


4/29/98

“Exit” Feed Calibration

7. This is a new setting. To calibrate this setting, place the positive lead of a voltme-ter on TP12 and the negative lead on TP13. Adjust VR2 until the voltmeter reads(-200mV). (See Figure 6.)

Figure 6 Adjusting the Exit Feed Threshold

“Entering” Tight Calibration

8. This is a new setting. To calibrate this setting, place the positive lead of a voltme-ter on TP14 and the negative lead on TP15. Adjust VR3 until the voltmeter reads850mV. (See Figure 7.)

TP12

TP13

Adjust VR2 so the voltmeter reads (-200mV)


4/29/98

Figure 7 Adjusting the Entering Tight Threshold

9. Replace the side cover on the dereeler.

10. Re-install wire spool and operate the dereeler to make sure it functions properly.

TP15

TP14

Adjust VR3 so the voltmeter reads 850mV


12/28/99

Replacing The Fluorescent Fan

Applicable:

Model 360C/S family machines with four-bulb fluorescent light fixtures

Part Numbers:

P/N 175246

Introduction

Orthodyne has changed the manufacturer supplying the miniature fan for the 4-bulb fluo-rescent light fixture. The new manufacturer’s fan runs smoother and produces less vibra-tion than the previous supplier’s fan.

This fan replacement is only recommended where the user has experienced some prob-lems with the existing fan.

Replacing The Fluorescent Fan

The procedure describes how to remove the old fan, replace it with the new model. A minor circuit board modification is required.



Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5



Small Soldering Iron and solder MODERATE

DIFFICULT


12/28/99

2. The location of the fixture is shown in Figure 1 for the M360S bond head (thelocation of the fixture on the M360C is similar). The insert to the right in thefigure shows a side view of the light fixture in the open position.

Figure 1 Fluorescent Fixture Cover With Fan

3. Disconnect the fluorescent light connector (J6) from the Head Junction Board.

4. Remove the fluorescent light fixture from the bond head.

5. Remove the bracket holding the fan (see Figure 2).

Figure 2 Remove the Existing Fan Unit

Remove These Two Screws


12/28/99

6. Use a 5mm open-end wrench and Allen wrench to remove the fan from thebracket (see ).

NOTE: Pay attention to the location of the rubber washers. They should remainin place when re-installing the new fan.

Figure 3 Remove the Fan From The Bracket

7. Locate the capacitor on the circuit board (see Figure 4).

8. Solder a jumper wire across the capacitor leads as shown in Figure 4. Then recon-nect the new fan cable connector to the circuit board.


12/28/99

Figure 4 Solder a Jumper Wire Across the Capacitor

9. Reinstall the new fan on the light fixture bracket, and the light fixture bracket tothe bond head by reversing the steps used to disassemble the fan.

NOTE: The direction of the air flow from the fan must be towards the fluores-cent bulbs. Note arrows on the fan to orient it properly.

10. Power up the machine and verify proper functioning of the new fan. The direc-tion of the air flow should be across the fluorescent bulbs.

Solder a Jumper across the Capacitor

Plug In the New Fan Cable Connector


11/24/99

Replacing The NVR Chip on Themis CPU

Applicable:

Model 360C family machines with Themis CPU.

Part Numbers:

P/N 172734

Introduction

Failure of the NVR chip on the Themis CPU will result in a “Calendar” field error during self-test on boot up. If this condition occurs, you will see an error at the Calendar field that reads, *FAILED* last error # = FFFF.

Even if this condition occurs, you can still proceed with the boot up of the operating system by pressing the Reset button on the front panel of the CPU board. The machine will continue to boot and then show an error in the SYSTEM DATA ERROR screen. Press [F9] to load system data into RAM from the hard disk system file and continue. The machine will then operate normally until you power down.

The above error condition will be repeated on power up until such time as you replace the NVR chip in the Themis CPU.


Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5



MODERATE

DIFFICULT


11/24/99

Replacing The NVR Chip

The procedure describes how to replace the NVR chip on the Themis CPU board.



2. Open the VME drawer and remove the CPU board.

3. Locate the NVR chip on the board as shown in Figure 1.

Figure 1 Location of NVR Chip on Themis CPU

Location of NVR Chip

Note Location of Orientation Dot on Chip. Indi-cates position of Pin 1

Front of CPU Board


11/24/99

4. Remove the defective NVR chip by carefully prying it up from the board. Thebest tool to use is a chip puller. However, if you do not have this tool, you can usea small screwdriver to pry the chip from its board socket as shown in Figure 2. Ifyou use this method to remove the chip, apply equal pressure with the tool oneach edge of the chip.

Figure 2 Remove the NVR Chip

5. Place the new NVR chip in the socket, being careful to align the orienting dot onthe chip package with Pin 1 on the board socket. Press the chip in place.

6. Power up the machine and boot up the operating program. The machine will giveyou an error message: SYSTEM DATA ERROR. Press [F9] to load the systemdata into the NVR chip.

7. Proceed with normal operation of the machine.


8/16/00

Replace Themis or GMS CPU with Force CPU

RevisionRev. A: Added Software Installation Instructions section. Changed Step 13 to include the instructions. Typing error corrected, (P/N 172620).

Rev. B: Added additional cable routing directions, diagrams, and details.

Applicable:Model 360C family machines with Themis or GMS CPU.

Part Numbers:P/N 172470 - Force CPU Replacement Kit.

IntroductionThe manufacturer of the GMS CPU will no longer supply this CPU board. Orthodyne selected a new vendor to supply our Model 360C family CPU boards. The company is called “Force.” The new Force CPU will directly replace the GMS or the Themis CPU.

Compatibility

Table 1 shows the minimum requirements to run the Force CPU: Check the revision level of the boards shown in the table. If you have a lower revision level, it will be necessary to upgrade the board to the minimum requirement before proceeding with the installation.

INSTALLATION INSTRUCTIONDoc No. DC07-172470

Tracking No. IN1082B

Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5



MODERATE

DIFFICULT


8/16/00

Replacing The GMS CPU

The following procedure describes how to replace the GMS CPU board. Refer to drawing 172470 for additional information.

CAUTION: If the current software is earlier than Version 5.7j,install the software included in the package beforeremoving the GMS CPU board. See the SoftwareInstallation section of this procedure.



2. Open the VME card cage drawer and locate the CPU board.

3. Unplug the Hard Disk drive cable P1 (P/N 171610), Data Terminal cable P3 (P/N172620), and cable P4 (P/N 172647) from the GMS CPU Breakout Board(located at the P2 Backplane). See Figure 1. Cable P4 goes to the “RS232” con-nector on the Front Connector Panel.

NOTE: Older machines do not have an “RS232” connector, nor a P4 cable.

Table 1: Component Compatibility Requirements for Force CPU

Component Revision Level

I/O Board 172532 Rev M (or later), or

175512 Rev E (or later)

Frame Grab Board (with GS I PR only)

171507 Rev U (or later)

Software Version 5.7j (or later)


8/16/00

Figure 1 Force CPU Breakout Board Connection

4. Remove the GMS CPU Breakout board from the P2 Backplane.

5. Plug the Force Breakout board (P/N 172867) into the same connector in the P2Backplane.

6. Unplug the Floppy Disk Drive cable (P/N 172630) at the front of the GMS CPUboard and remove the CPU from the VME card cage.

7. Insert the Force CPU into the same location in the card cage and secure in place.See Figure 2.

Figure 2 Install the CPU Board

8. Connect the Hard Disk Drive cable P1 (P/N 171610) to the Force CPU Breakoutboard (P/N 172867).

9. Route the Floppy Disk Drive cable (P/N 172630) from the front to the back of theVME card cage. Connect it to the Force CPU Breakout board. See Figure 3.


8/16/00

Figure 3 Floppy Disk Drive cable

10. Route the Data Terminal cable P3 (P/N 172620) towards the front of the cardcage. Connect it to the adapter cable (P/N 172620 A) supplied with the kit.Connect the other end of this adapter cable into Port #1 on the front panel of theCPU. Dress the excess cable and secure to the cable clamp. See Figure 4.

Figure 4 Data Terminal Cable

11. Route the “RS232” cable P4 (P/N 172647) towards the front of the VME cardcage. Connect the cable into the other adapter cable (P/N 172670) and this assem-bly into port #2 in the front panel of the CPU. See Figure 5. Dress the excesscable and secure.

Force CPU Breakout board (P/N 172867) supplied with Force CPU (P/N 172573)

Floppy Disk Drive cable (P/N 172630)

Hard Disk Drive cable P1 (P/N 171610)

Cables from CPU board (P/N 172573)

Data Terminal cable P3 (P/N 172620) Con-nect to Port #1 on CPU

To Connector Panel “RS232 P4” (P/N 172647) Connect to Port #2 on CPU


8/16/00

Figure 5 Adapter Cable Installation (172670 A)

12. Reboot the system. If you installed new software prior to the board replacement, a“system data” error message screen will appear. Select F9: “Load System Datafrom the Hard Drive.”

13. If your software appears to be incompatible with the new hardware (version 5.7jor earlier), use the software installation instructions at the end of this document.

Replacing The Themis CPU

The procedure below describes how to replace the Themis CPU board.

CAUTION: If the current software is earlier than Version 5.7j,install the software included in the package beforeremoving the Themis CPU board. See the Soft-ware Installation section of this procedure.



2. Open the VME drawer and locate the CPU board.

3. Unplug the Hard Disk drive cable P1 (P/N 171610), and Floppy Disk Drive cable (P/N172630) from the Themis CPU Breakout Board at the P2 backplane. See Figure 1 , onpage 3.

Adapter Cable (172670 A)


8/16/00

4. Remove the Themis CPU Breakout board from the P2 backplane.

5. Plug the Force CPU Breakout board (P/N 172867) into the same location.

6. Plug the Hard Disk drive cable P1 (P/N 171610) and the Floppy Disk drive cableP3 (P/N 172630) into the Force CPU Breakout board (P/N 172867).

7. Unplug the Data Terminal cable P3 (P/N 172620) from the front of the ThemisCPU and remove the CPU from the card cage.

8. Insert the Force CPU into the same card cage slot and secure. See Figure 2 , onpage 3.

9. Connect “RS232” cable P4 (P/N 172647) into adapter cable (P/N 172670) andthis assembly into port #2 on the front panel of the CPU. See Figure 5 , on page5. Dress the excess cable and secure.

10. Plug the Data Terminal cable P3 (P/N 172620) into the second adapter cable andthe other end of this adapter cable into port #1 on the front panel of the CPU.

11. Reboot the system. If you installed new software prior to the board replacement, a“system data” error message screen will appear. Select F9: “Load System Datafrom the Hard Drive.”

12. If your software appears to be incompatible with the new hardware (version 5.7hor earlier), use the software installation instructions below.

Software Installation Instructions

The standard software installation instructions are in the Software Release Notes. The fol-lowing instructions are used when the software version currently being run on this bonder is not compatible with the new hardware that was just installed.

1. Insert one system floppy disk into d0 and one system floppy disc into d1.

2. Power up the bonder

3. When the Main menu is reached (this takes approximately 10 minutes), exit thebonder program.

4. Type “/dl/install” at the prompt and press ENTER.

5. When the software installation is completed, remove both system floppies andreboot the bonder. Close and secure VME drawer.

6. After swapping out the board and booting up the system, a “system data” errormessage screen will appear. Select F9: “Load System Data from the Hard Drive.”


1/9/03

Instructions for Using the Generator Load Box

Applicable:Model 360A, M360B, M360C and M20 machines.

Part Numbers:P/N 172478 and P/N 172478-1

IntroductionThe Generator Load Box is used to calibrate the ultrasonic generators of the Model 360 and Model 20 machines for the sampling gain, output level, and frequency range. These instructions will guide you through the use of both the 172478 and 172478-1 Generator Load Boxes.

Compatibility

The 172478 (basic) Generator Load Box is used for calibrating the generator on all Model 360A, 360B, and 360C machines. The 172478-1 is used to calibrate the M-20 generator.

INSTALLATION INSTRUCTION No. IN1083F

Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5


Oscilloscope

Frequency Counter MODERATE

Digital Multimeter

DC Ammeter (1% accuracy or better, with a 4-1/2 digit display)

Small Screwdriver DIFFICULT

Potentiometer Tuning Tool (P/N 171238)

BNC Tee adapter

Generator Load Box

NOTE: This IN is superceded by TB 1116 for newer revision Load Boxes

ORTHODYNE ELECTRONICS INSTALLATION INSTRUCTION IN1083F PAGE 1 OF 28

System Administrator

Please Note: This document IN1083F is now Technical Bulletin 1116 for current Load Box Models. Earlier models that use Load Boxes with a oscilliscope use this IN 1083F.

1/9/03

Installation/Operation — 172478 (Basic) M360A, 360B, and 360C Machines

NOTE: There are two methods for calibrating the “Output Voltage” for theModel 360A (PDOS and OS9), B, C, and S generators. Orthodyne rec-ommends the first method, using the Generator Load Box 172478 Revi-sion D1 and a DC Ammeter with an accuracy of 1% or better and a 4 1/2digit display. The second method is performed using the Generator LoadBox 172478 Revision A or B and an oscilloscope. Both methods aredescribed in this document.

MODEL 360A (PDOS Version Only)

The objectives of this calibration are to:

Set the location of the frequency capture window

Set the maximum open-circuit output voltage

Set the signal level of the transducer signal sample to the analog-to-digital converter (ADC)

To perform this calibration, the following equipment is required:

Oscilloscope or DC Ammeter

172478 (Basic) Generator Load Box with cable 708214

BNC Tee adapter (coaxial)

Potentiometer tuning tool (OE P/N 171238)

PDOS version of the GENTEST program. The PDOS version is for early Model 360A machines with Binary Pattern Recognition. The OS9 version is for the Model 360A or B machines with Gray Scale Pattern Recognition.

IMPORTANT: The following test procedure must be followed carefully. TheTechnician should be familiar with the bonder and the testequipment, preferably trained by the factory. If not performedcorrectly these calibrations, may cause severe damage to thegenerator and transducer, and may render the generator testindication meaningless. Use the proper care in handling any ofthe electronic components. Prevent static damage to the boardsand components.


1/9/03

Because the generator is designed to run on the VME bus controlled by the system micro-computer, it is more convenient to calibrate it in that environment.

Calibrating Generator to Transducer Frequency

NOTE: Perform this test after replacing a generator and/or a transducer. Thetransducer should be properly mounted in the bonding head and shouldhave a properly aligned bonding tool in it before this procedure is per-formed. Each of the following tests must be performed in order.

1. The machine should be powered down before performing this calibration. Discon-nect the transducer coax connector and the power connector from the back of thegenerator (see Figure 1, on page 4). Loosen the four (4) screws that secure thegenerator into the VME cage and remove the generator completely.

2. Remove the four (4) phillip screws that hold the side Power Amp panel intact.Next, remove the side panel (see Figure 2, on page 4) but keep it connected to thegenerator.

3. Install the generator back into VME cage, reconnect the power cable and the trans-ducer coax cable and lay the panel along side of the generator (see Figure 2, onpage 4).

4. Power up the machine and access the Generator Test Screen (type 7, 3 from theMain Menu).

5. Press and hold down the START button. The indicator on the test scale shouldread at least 50 out of a maximum 100. This reading depends primarily on thetransducer and the alignment of the tool, unless the generator capture window issignificantly different from generator to transducer. When the time-out occursduring this procedure and the indicator drops to zero, press START again to con-tinue the tuning process.

6. Insert the plastic potentiometer tuning tool into the inductor (L1) of the generator(see Figure 7, on page 8). Turn the inductor clockwise while observing the indi-cator on the screen. Stop turning when the indicator starts to drop off; this is oneend of the frequency window.

7. Turn the inductor counterclockwise and start counting the number of turns untilyou reach the other end of the frequency window and the indicator starts to dropoff again. Record the number of turns. There should be about one to two turnsbetween window limits.

8. Turn the inductor clockwise for half the number of turns recorded in step 7. Thecenter of the capture window will coincide with the transducer’s resonant fre-quency.


1/9/03

Output Level Calibration

1. Power the machine down and disconnect the transducer coax cable from the backof the generator.

2. Plug in the BNC Tee adapter to the back of the generator (see Figure 3, on page5).

Figure 1 Disconnect Transducer and Power Cables

Remove these four (4) screws and this Power Amp panel but leave wires connected to generator

Lay Power Amp Panel along side of generator but keep panel connected to generator

Figure 2 Remove Four Screws and Panel


1/9/03

3. Plug one end of cable 708214 into the BNC Tee adapter (see Figure 3) and theother end into the back of the Generator Load Box marked “M360 GENERA-TOR” (see Figure 4).

IMPORTANT: Make sure the Generator Load box selector switch is on “Vout” before powering up the bonder. If the selector switch is inany other position, you will damage the Generator Load box.

4. Insert the GENTEST program disk and power up the bonder.

Figure 3 BNC Tee Adapter with Coax Cable

Figure 4 Front and Rear View of Load Box

FRONT VIEW REAR VIEW

V out


1/9/03

5. Once the machine boots up, the following menu should be displayed:

6. At the O> prompt type GENTEST (upper case) and press ENTER. The followingmenu should be displayed:

Booting...Please Wait...Ready

O> MENU

ORTHODYNE MODEL 360A UTILITIES

O>* MENU: Displays list of utilities

O>*GENTEST: Generator test and calibration

O>

Model 360 GENERATOR TEST AND CALIBRATIONGentest SOFTWARE (c) Copyright 1992by Orthodyne Electronics Corporation

All Rights Reserved

Version numbers: Gentest: 1.00 Terminal: Wyse WY-60

Press Any Key


1/9/03

7. Press any key to continue. The following menu appears:

Output Voltage Calibration using the Load Box (Rev. B) with the DC Ammeter:

8. Set the selector knob (front of load box) to the V out position. See Figure 4, onpage 5.

9. Connect the positive (red) and negative (black) banana plug leads from theAmmeter into the Load Box. See Figure 5.

10. Type 1 to select “Output level calibration”.

11. Type 255 in the generator power field, press START and hold.

12. Adjust R25 (see Figure 7, on page 8) until the DC Ammeter reads 3.000 mA (± .010).

13. Type F16 to return to the Main menu.

GENTEST MAIN MENU

1) Output level calibration

2) A/D calibration

3) Step ramp waveform

Positive

Negative

Figure 5 Connecting DC Ammeter to Loadbox


1/9/03

Output Voltage Calibration using an Oscilloscope:

1. Connect the oscilloscope ground for Channel 1 to the wall of the BNC TeeAdapter (see Figure 6).

2. Connect Channel 1 probe to the center conductor of the open port of the BNC Teeadapter (see Figure 6).

Figure 6 Oscilloscope Probes to BNC Tee Adapter

Figure 7 Location of L1 and R25

L1

R25Adjust L1


1/9/03

1. Type 255 in the Generator Power field, press START and hold.

2. Adjust R25 on the generator (see Figure 8) until the oscilloscope displays a sinewave 300 volts peak to peak +/- 10Vptp (60 KHz).


4. There should be no output to the oscilloscope.

A/D Calibration

1. Connect the Generator Load Box at the M360 GENERATOR connector (locatedback of loadbox) to the test cable (cable should still be connected to the back ofthe generator) and set the selector knob (front of the Load Box) to the R position.

2. Type 2 to select the A/D calibration.

3. Press START on the bonder’s control panel and follow the instructions on thescreen.

4. Using the tuning tool, adjust R27 Course Adjust (see Figure 9, on page 10) toobtain a 0 reading on the monitor scale. This will be in the middle of the scale.

5. Press STOP and follow the instructions on the screen.

6. Using the tuning tool, adjust R26 Fine Adjust (see Figure 9, on page 10) to obtaina 0 reading on the monitor scale. This will be in the middle of the scale.

7. Press STOP.

Figure 8 Adjust R25


1/9/03

8. Compare the Programmed Values and the Measured Values displayed on thescreen. Both values should be the same (±2). If the values differ by more than 2,perform the A/D calibration again. If after recalibrating the A/D the values arestill not within the specification, the generator may need to be serviced by the fac-tory. Consult your Orthodyne service representative.

9. Type F16 to return to the GENTEST main menu.

Test Complete

1. Disconnect the BNC Tee adapter and cables from the back of the generator.

2. Turn the bonder power OFF.

3. Remove the generator from the VME card cage and reinstall the Power Amppanel with the four (4) phillip screws (Figure 2, on page 4). Install the generatorback into the VME, secure it with the four (4) mounting screws, and connect thepower and transducer cables.

4. Remove the GENTEST program disk and replace with the M360 program disk.Power up the bonder as usual.

R27

R26

Figure 9 Adjust R27 and R26


1/9/03

MODEL 360A and B (OS9 System only)

The objectives of this calibration are to:

Set the location of the frequency capture window

Set the maximum open-circuit output voltage

Set the signal level of the transducer signal sample to the analog-to-digital converter (ADC)

To perform this calibration, the following equipment is required:

Oscilloscope

172478 (Basic) Generator Load Box with cable 708214

BNC Tee adapter (coaxial)

Potentiometer tuning tool (OE P/N 171238)

OS9 version of the GENTEST program. The OS9 version is for the Model 360A or B machines with Gray Scale Pattern Recognition

Calibrating Generator to Transducer Frequency

NOTE: Perform this test after replacing a generator and/or a transducer. Thetransducer should be properly mounted in the bonding head and shouldhave a properly aligned bonding tool in it before this procedure is per-formed.

1. The machine should be powered down before performing this calibration. Discon-nect the transducer coax connector and the power connector from the back of thegenerator (see Figure 1, on page 4). Loosen the four (4) screws that secure thegenerator into the VME cage and remove the generator completely.

2. Remove the four (4) phillip screws that hold the side panel intact. Next, removethe side panel (see Figure 2, on page 4) but keep it connected to the generator.

3. Install the generator back into VME cage, reconnect the power cable and the trans-ducer coax cable and lay the panel along side of the generator (see Figure 2, onpage 4).

4. Power up the machine and access the Generator Test Screen (type 7, 3 from theMain Menu).

5. Press and hold down the START button. The indicator on the test scale shouldread at least 50 out of a maximum 100. This reading depends primarily on thetransducer and the alignment of the tool, unless the generator capture window issignificantly different from generator to transducer. When the time-out occursduring this procedure and the indicator drops to zero, press START again to con-


1/9/03

tinue the tuning process.

6. Insert the plastic potentiometer tuning tool into the inductor (L1) of the generator(see Figure 7, on page 8). Turn the inductor clockwise while observing the indi-cator on the screen. Stop turning when the indicator starts to drop off; this is oneend of the frequency window.

7. Turn the inductor counterclockwise and start counting the number of turns untilyou reach the other end of the frequency window and the indicator starts to dropoff again. Record the number of turns. There should be about one to two turnsbetween window limits.

8. Turn the inductor clockwise for half the number of turns recorded in step 7. Thecenter of the capture window will coincide with the transducer’s resonant fre-quency.


1. Power down the machine and disconnect the transducer coax cable from the backof the generator.

2. Plug in the BNC Tee adapter to the back of the generator (see Figure 3, on page5).

3. Plug one end of cable 708214 into the BNC Tee adapter (see Figure 3, on page 5)and the other end into the back of the Generator Load Box marked “M360 GEN-ERATOR” (see Figure 4, on page 5).

IMPORTANT: Make sure the Generator Load box selector switch is on “Vout” before powering up the bonder. If the selector switch is inany other position, you will damage the Generator Load box.

4. Insert the GENTEST program disk and power up the bonder.


1/9/03

5. Type GENTEST, press ENTER. The notice screen appears:

6. Press any key to continue. The following menu appears:


7. Set the selector knob (front of load box) to the V out position. See Figure 4, onpage 5.

8. Connect the positive (red) and negative (black) banana plug leads from theAmmeter into the Load Box. See Figure 5, on page 7.

9. Type 1 to select “Output level calibration”.


11. Adjust R25 (see Figure 7, on page 8) until the DC Ammeter reads 3.000 mA (± 0 .10). For 40 kHz generators, the value should read 2.900 mA± 0.10.


Model 360 GENERATOR TEST AND CALIBRATIONGentest SOFTWARE (c) Copyright 1992by Orthodyne Electronics Corporation

All Rights Reserved

Version numbers: Gentest: 1.1 Terminal: Wyse WY-60

Press Any Key

F16EXIT

GENTEST MAIN MENU


2) A/D calibration


1/9/03


1. Connect the oscilloscope ground for Channel 1 to the wall of the BNC TeeAdapter (see Figure 6, on page 8).

2. Connect Channel 1 probe to the center conductor of the open port of the BNC Teeadapter (see Figure 6, on page 8).

3. Type 1 to select Output level calibration.


5. Adjust R25 (see Figure 8, on page 9) on the generator until the oscilloscope dis-plays a sine wave 300 volts peak to peak +/- 10Vptp (60 KHz). Press STOP. For40 kHz generators, the value should read 290 Vptp +/- 10Vptp (60 KHz).

6. Type F16 to return to the menu.

7. There should be no output on the oscilloscope.

8. Disconnect the oscilloscope from the test cable.

A/D Calibration

1. Connect the Generator Load Box at the M360 GENERATOR connector (locatedback of loadbox) to the test cable (cable should still be connected to the back ofthe generator) and set the selector knob (front of the Load Box) to the R position.

2. Type 2 to select the A/D calibration.

3. Press START on the bonder’s control panel and follow the instructions on thescreen.

4. Using the tuning tool, adjust R27 Course Adjust (see Figure 9, on page 10) toobtain a 0 reading on the monitor scale. This will be in the middle of the scale.

5. Press STOP and follow the instructions on the screen.

6. Using the tuning tool, adjust R26 Fine Adjust (see Figure 9, on page 10) to obtaina 0 reading on the monitor scale. This will be in the middle of the scale.

7. Press STOP.

8. Compare the Programmed Values and the Measured Values displayed on thescreen. Both values should be the same (±2). If the values differ by more than 2,perform the A/D calibration again. If after recalibrating the A/D the values arestill not within the specification, the generator may need to be serviced by the fac-tory. Consult your Orthodyne service representative.

9. Type F16 to return to the GENTEST main menu.

Test Complete

10. Disconnect the BNC Tee adapter and cables from the back of the generator.



1/9/03

12. Remove the generator from the VME card cage and reinstall the Power Amppanel with the four (4) phillip screws (Figure 2, on page 4). Install the generatorback into the VME, secure it with the four (4) mounting screws, and connect thepower and transducer cables.

13. Remove the GENTEST program disk and replace with the M360 program disk.Power up the bonder as usual.


1/9/03

MODEL 360C - Universal Generator (P/N 175507 - 60 kHz)

Calibrating the generator consists of three calibrations: Output level calibration, Sam-pling gain calibration, and Phase calibration.

Because the Output level calibration and Phase calibration influence each other, the Output level calibration should be repeated after Phase calibration.

NOTE: There are three different generators that may be found on the Model360C -- P/N 175507 (60 kHz), P/N 172567 (60 kHz), and P/N 172528(40 kHz). The calibration procedure for each generator is slightly differ-ent and will be discussed separately beginning with 175507.

NOTE: If you are interchanging a Large Wire bond head with a Small Wirebond head, do the Large Wire calibration first, then do the Small Wirecalibration. By doing so, the effects on Small Wire values by the LargeWire calibration will be accommodated.

Output Voltage Calibration using the Load Box (Rev. D1) with the DC Ammeter:

1. Open the VME card cage tray.

2. Unplug the BNC connector from the back of the universal generator board (P/N175507), connector (J8). See Figure 10, on page 17.

3. Connect one end of cable 708214 (coaxial, male both ends) to connector (J8) andconnect the other end of the cable to the back of the Load Box marked M360GENERATOR. See Figure 4, on page 5.

IMPORTANT: Make sure the Generator Load box selector switch is on “Vout” before performing the output calibration test. If the selec-tor switch is in any other position, you will damage the Gener-ator Load box.

ITEMS REQUIREDTool height gauge (OE P/N 172475-x)Generator Load Box (OE P/N 172478)

DC Ammeter (1% or better accuracy) with 4 1/2 digit displayCoax cable with banana jacks

Positive and Negative cables with banana jacks on both ends


1/9/03


5. Set the DC Ammeter to the 20 mA range.

6. Press [F14] and follow the instructions on the screen. The software detects whichbond head is installed on the machine, and directs you to make certain the VoltageLevel toggle switch on the Generator board (see item 8, Figure 12, on page 18) isin the correct position. It should be “High” Level for the Large Wire bond head.

7. With a small screwdriver, adjust VR4 (High Level) on the front of the Generatorboard (see item 7, Figure 12, on page 18) so that the DC Ammeter reads 3.000mA. ± 0.10.




Figure 10 Remove Transducer from Generator (J8)

Figure 11 Load Box Connectors for DC Ammeter

Positive

Negative


1/9/03

Figure 12 U/S Generator Board Adjustments

1. LEDs for different power supply voltages: +40V, +12V, +5V, -5V.

2 Spare I/O connector.

3. Transducer Current LED indicates connected trans-ducer.

4. VR1 Gain adjustment high level (Large Wire).

5. VR1 Gain adjustment low level (Small Wire).

6. VR3 Forcer Null adjustment (Factory Use Only).

7. VR4 High level adjustment (Large Wire).

8. Voltage Level toggle switch (between Large/Small Wire).

9. U/S Level LED (indicates U/S Output). This LED is on as long as there is an ultrasonic output.

10.VR5 Low level adjustment (Small Wire).

11.Frequency adjustment (Freq-Adjust window for phase adjustment).

12.BNC connector for trigger signal out.

13.VR6 phase and shift adjustment (Factory Use Only).

14. “Phase +” LED indicates a positive phase shift.

15.BNC connector for phase shift voltage out.

16.VR7 Phase shift adjustment (Factory Use Only).

17.Phase LED (indicates a negative phase shift).

18.BNC connector for signal sample out.

NOTE: Note: If “Phase +” and “Phase -” areboth off then the Phase Shift is zero.If the (+) is on, the pot is turned toofar counter-clockwise. If (-) is on, thepot is turned too far clockwise.

1

2

34567910

11

12

13

15

1617

8

18

14


1/9/03

3. Plug in a BNC connector probe from your oscilloscope into J8.

4. Press [F14] (Generator Output Cal) and follow the instructions on the screen. Thesoftware detects which bond head is installed on the machine, and directs you tomake certain the Voltage Level toggle switch on the Generator board (see item 8,Figure 12, on page 18) is in the correct position. It should be “High” Level for theLarge Wire bond head.

5. With a small screwdriver, adjust VR4 (High Level) on the front of the Generatorboard (see item 7, Figure 12, on page 18) so that the oscilloscope reads 300 Vptp+/- 10Vptp (60 KHz) for the Large Wire Bond Head.

Sampling Gain Calibration

1. Set the load box rotary switch to “R” to engage the 84.5 Ohm resistor.

2. Return to the Generator Test Screen, and press START.

3. The directions on the screen will ask you to adjust the gain until the pointer on thescale lines up with “50”.

4. Adjust the gain using a small screwdriver at VR1 (Gain 1). See item 4, Figure 12,on page 18.

5. Remove the OE Generator Load Box Assembly and plug the transducer cableback to the BNC connector (J8).

Phase Calibration

1. Press [F9] and follow the instructions on the screen.

IMPORTANT: Do not remain in the PHASE CALIBRATION mode for morethan 30 seconds. This will cause components inside the Gener-ator to heat up.After performing the PHASE CALIBRATION, wait for 2minutes until you do the GENERATOR TEST. This willallow the components to cool down and produce a more accu-rate reading.

2. Using the plastic screwdriver (OE P/N 622218), adjust the “Freq adjust” potentiome-ter on the front of the Generator board. See item 11, Figure 12, on page 18.

3. After performing this test, repeat the Output Level Calibration test.

MODEL 360C - Generator Calibration (P/N 172567 - 60 kHz and P/N 172528 - 40 kHz)

1. Output Level Calibration: You only have to do a “High” output calibration.Follow the same procedure as calibrating the 175507 Generator except adjust the“Power Calib” pot (see Figure 13) on the generator board (instead of the VR4“High Level Adjust” pot) so:


1/9/03

If using the Load Box (Rev. B) with the DC Ammeter:

The DC Ammeter reads 3.000 mA (± 0.10). For 40 kHz generator, the value should read 2.900 mA (± 0.10).

If using an Oscilloscope:

The oscilloscope reads 300 Vptp +/- 10Vptp (60 KHz). For 40 kHz generator, the value should read 290 Vptp +/- 10Vptp (60 KHz).

2. Sampling Gain calibration follows the 175507 Generator procedure except adjustthe “Fine Adjust” pot (see Figure 13) on generator board (instead of the VR1“Gain 1” pot).

NOTE: Do not adjust the “Course Adjust” pot. This is a factory set adjustmentonly.

3. For Phase Adjust calibration attach a voltmeter to “Phase Shift” output (see Figure13) on the generator board and hold down the START button while in the Genera-tor Test screen. Adjust “Freq Adjust” pot on generator board to read 0 volts ±10mV. Generator will time-out after a few seconds. If so, press START to re-starttest.

Figure 13 Generator 172567 and 172528


1/9/03

MODEL 360S

Calibrating the generator consists of three calibrations: Output level calibration, Sam-pling gain calibration, and Phase calibration.

Because the Output level calibration and Phase calibration influence each other, the Output level calibration should be repeated after Phase calibration.


NOTE: If you are interchanging a Large Wire bond head with a Small Wirebond head, do the Large Wire calibration first, then do the Small Wirecalibration. By doing so, the effects on Small Wire values by the LargeWire calibration will be accommodated.




3. Connect one end of cable 708214 (coaxial, male both ends) to connector (J8) andconnect the other end of the cable to the back of the Load Box marked M360GENERATOR. See Figure 4, on page 5.

IMPORTANT: Make sure the Generator Load box selector switch is on “Vout” before performing the output calibration test. If the selec-tor switch is in any other position, you will damage the Gener-ator Load box.



ITEMS REQUIREDTool height gauge (OE P/N 175010-x)Generator Load Box (OE P/N 172478)

DC Ammeter (1% or better accuracy) with 4 1/2 digit displayCoax cable with banana jacks

Positive and Negative cables with banana jacks on both ends


1/9/03

6. Press [F14] and follow the instructions on the screen. The software detects whichbond head is installed on the machine, and directs you to make certain the VoltageLevel toggle switch on the Generator board (see Figure 12, on page 18) is in thecorrect position. It should be “Low” Level for the Small Wire bond head.

7. With a small screwdriver, adjust VR5 (Low Level) on the front of the Generatorboard (see Figure 12, on page 18) so that the DC Ammeter reads 1.150 mA. ±.010




3. Plug in a BNC connector probe from your oscilloscope into J8.

4. Press [F14] and follow the instructions on the screen. The software detects whichbond head is installed on the machine, and directs you to make certain the VoltageLevel toggle switch on the Generator board (see Figure 12, on page 18) is in thecorrect position. It should be “Low” Level for the Small Wire bond head.

5. With a small screwdriver, adjust VR5 (Low Level) on the front of the Generatorboard (see Figure 12, on page 18) so the oscilloscope reads 115 Vp-p for theSmall Wire Bond Head.

Sampling Gain Calibration

1. Set the load box rotary switch to “R” to engage the 84.5 Ohm resistor.

2. Return to the Generator Test Screen, and press START.

3. Adjust the gain until the pointer on the scale lines up with “62”.

4. Adjust the gain using a small screwdriver at VR2 (Gain 2). See Figure 12, onpage 18.

NOTE: The gain adjustment will not make the pointer on the screen move con-tinuously. The motion of the pointer will be in discrete steps. Estimatethe value “62” by moving the pointer one or two ““notches” beyond thevalue 60.

Phase calibration:

1. Remove the OE Generator Load Box Assembly and plug the transducer cableback into the BNC connector (J8). See Figure 10, on page 17



1/9/03

IMPORTANT: Do not remain in the PHASE CALIBRATION mode for morethan 30 seconds. This will cause components inside the Gener-ator to heat up.After performing the PHASE CALIBRATION, wait for 2minutes until you do the GENERATOR TEST. This willallow the components to cool down and produce a more accu-rate reading.

3. Using the plastic screwdriver (OE P/N 622218), adjust the “Freq adjust” potentiome-ter on the front of the Generator board. See Figure 12, on page 18.

4. After performing this test, repeat the Output Level Calibration test.


1/9/03

MODEL 20 (Use Load Box P/N 172478-1 with Cable 130606)

The generator may be checked out either on the bonder or in a maintenance shop (if a suitable interface cable and power supply are available).

This procedure includes adjusting the frequency range and output voltage as well as checking the phase-lock circuitry.

1. Unplug the machine from the power source.

2. Loosen the captive thumbscrew at the rear of the bonder (see Figure 14) and slidethe generator part way out.

3. Reach into the opening in the panel and disconnect the electrical cable from thegenerator.

4. Place the generator on the right side of the bonder base. Bring the electrical cablethrough the opening and reconnect it to the generator (see Figure 15, on page 25).

5. Plug the machine into the power source.

6. Check the voltages on the generator, +34VDC, +17VDC and +12VDC. SeeFigure 16, on page 25 or refer to Schematic 130620 found in the M20 User’sManual.

7. Connect the oscilloscope to the generator (L103) as shown in Figure 17, on page26.

ITEMS REQUIREDDigital Voltmeter

OscilloscopeGenerator Load Box (OE P/N 172478-1)

Frequency CounterPotentiometer Tuning Tool (OE P/N 171238)

Figure 14 Rear View showing Thumbscrew

Thumbscrew


1/9/03

Figure 15 Set Generator on Bonder Base

Figure 16 Power and Logic Connector


1/9/03

pe

y

pe

8. Disconnect the transducer connector J7 from the connector board. The transducerconnector is located as shown in Figure 18, on page 27.

Figure 17 Generator PC Board

R163Time Burst

L101Frequency Adjust

Oscillosco

FrequencCounter

R164Power Adjust

IC 105Connect Oscillocope to Pin 3

High-Low Switch

OscilloscoGround (end of capacitor)

L103


1/9/03

9. Set the TIME 1, TIME 2, POWER 1 and POWER 2 controls to maximum. Set theHigh-Low generator switch (see Figure 17, on page 26) to high if not already inthat position.

10. Cycle the bonder and adjust R164 (see Figure 17, on page 26) for a 30 volt peakto peak sine wave on the oscilloscope.

11. Connect the frequency counter to the generator as shown in Figure 17, on page26.

IMPORTANT: Do not hold the TEST button in for more than two seconds ata time. Holding the switch in for longer periods can damagethe ultrasonic generator.

12. Using the Generator Load Box (OE P/N 172478-1), connect cable 130606 into theback of the Load Box marked M20 GENERATOR. Connect the other end of thecable in place of the transducer (connector J7 shown in Figure 18) and set theselector knob (on the front of the Load Box) to the L position. Depress and holdthe TEST button on the front of the generator.

J7Transducer Connector

Figure 18 Remove Transducer Connector


1/9/03

13. Adjust L101 (see Figure 17, on page 26) with a non-metallic hex tuning tool (OEP/N 171238), until the frequency counter reads 57.50 kHz. Release the TESTbutton.

14. Set the selector knob (on the front of the Load Box) to the C position. Depressand hold the TEST button on the front of the generator.

15. Observe the reading on the counter and adjust L101 to split the differencebetween the present reading and 60.50kHz. For example, if the frequency readingis 60.80kHz with the Load Box set to C, adjust L101 to read 60.65 kHz.

16. Remove the Load Box.

17. Connect the oscilloscope to IC105 pin 3 (see Figure 17, on page 26).

18. Cycle the bonder and adjust R163 (see Figure 17, on page 26) so that the oscillo-scope shows a positive going pulse that is of 500 milliseconds duration.

19. Remove all of the test equipment from the generator.

20. Reinstall the transducer connector J7 to the connector board.


8/14/00

Replace Camera Mounting Block For 3” Tool Kit

Applicable:Model 360C / S machines.

Part Numbers:P/N 172421 Camera Mounting Block Kit for 3” Tool.

Introduction

The purpose of Installation Instruction IN1084 is to provide instructions for replacing the camera mounting block for the 3” tool kit, and also for the block light kit. With either of these kits, the camera must be lowered relative to the work table to maintain the same focus range on the camera. This is accomplished by replacing the camera mounting block/focus flag assembly.


Tracking No. IN1084

Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5



MODERATE

DIFFICULT

ORTHODYNE ELECTRONICS INSTALLATION INSTRUCTIONTRACKING NO. IN1084 PAGE 1 OF 5

8/14/00

Procedure

1. Remove camera cable from the camera. Remove Z-bearing housing cover.

2. Loosen the screws on the split block that hold the camera and optics tube assemblyand remove the camera with its optic tube from the Split Block Clamp (see Figure 1).

Figure 1 Remove Camera / Optics Tube Assembly

3. Loosen the screws that clamp the Focus Block Flag to the Focus Drive Belt. Remove theclamp. Be aware that a spring is attached to a pin on the Focus Block Flag Clamp (seeFigure 2).

Figure 2 Loosen Focus Block Flag

Remove Camera Cable

Loosen Camera Clamp Block Screws

Loosen Screws On Focus Flag Clamp(Two Screws - Only One Shown in Picture)

Disconnect Spring


8/14/00

4. Slowly let the Focus Block assembly move up to relieve tension on the spring,then remove the spring. Tweezers will help you perform the spring removal.

5. Remove the screws that hold the Focus Arm to the Focus Clamp Block andremove the Focus Arm.

6. Remove the Focus Block assembly from the Z tube mounting plate by removing thefour screws (see Figure 3).

Figure 3 Remove Focus Block

7. Attach the new Focus Arm to the new Focus Block.8. Attach the Belt Clamp to the Focus Arm using only the screw closest to the locat-

ing pin on the Belt Clamp. 9. Remove the old and install the new Wire Guide Clamp (P/N 172124) if the

machine is equipped with Wire Guide Mount Plate (175236) and Wire GuideTube Holder (172359).

10. Attach the Focus Block assembly to the Z axis mounting plate starting with thesecond set of screw holes in the dotted area shown as illustrated in Figure 4 , onpage 4.

Remove 4 Screws To Remove Focus Block


8/14/00

Figure 4 Attach New Focus Block Assembly

11. Make sure the Focus Arm goes behind the focus belt, and the Belt Clamp goes infront of the belt.

12. Slide the Focus Block assembly up and down to make sure nothing binds on thebelt.

13. Install the second screw on the Belt Clamp to hold the Clamp to the belt, but donot tighten yet.

14. Attach the spring to the pin on the back of the Focus Arm.15. Move the focus assembly up and down to assure it moves freely without binding

on the belt. The finished installation is shown in Figure 5.16. Replace the camera /optics tube assembly back into the clamp. Be sure to use the

old nylon bushing in the camera block.

Figure 5 Finished Installation (Side View)

Focus Block Attachment Area

Camera Focus Block

Camera Tube

Focus Arm

Focus Block Tension Spring

Camera Split Block Tightening Screws


8/14/00

Adjustment

1. Go to the MANUAL POSITIONING screen.

2. Change the Focus field to [15]. This value corresponds to the lowest position theCamera Focus Block can achieve.

3. Manually slide the Camera Focus Block to the lowest position and tighten theFocus Belt Clamp.

4. Place a Gauge block that is 24 mm. between the Wire Tube Clamp Block and theFocus Belt Clamp Arm. Tighten the Clamp Plate in position on the Drive Belt.

NOTE: The tooth on the Clamp Plate must be located between two teeth on theDrive Belt.

5. Loosen the two Camera Clamp Block adjusting screws and move the camera upor down to achieve a sharply focused image.

6. Change the Focus field to the uppermost position. The Focus Block should not hitthe upper stop. If it does, back off the nylon stop screws.

7. Set the camera orientation to be true with the X and Y axes by picking a signifi-cant reference point on the work surface, and positioning the camera so the pointappears on the horizontal or vertical crossline on the screen. Move the head in theX and Y directions. The selected point should stay on the crossline. If it does not,loosen the camera and rotate it so the reference point stays on the crossline overthe full travel of the head in the X and Y directions. Before re-tightening thecamera, make sure it is pushed all the way down into the Clamp Block.

8. Perform “Focus Offset”, “Magnification”, and “Offsets” calibrations per instruc-tions in the M360C User’s or Technician’s Manual.


4/30/01

Reconfiguring An ALC Head To Function As A Standard Large Wire Head

Applicable:Model 360C machines with ALC.

Part Numbers:P/N 177004 - ALC Head Assembly

P/N 172672 - Reconfiguration Cable for ALC

IntroductionThe purpose of Installation Instruction IN1088 is to provide instructions for reconfigur-ing an ALC Bond Head to appear to the system as if it were a standard Large Wire Head. The conversion will make the head recognition software think it is operating a standard Large Wire Bond Head instead of an ALC head.

With some hardware changes, the ALC head can be set up for Front Cut or Rear Cut.

The normal ALC configuration comes with a Front Cut configuration. It is also possible, with the substitution of parts described later in this document, to convert the ALC head to a standard one-piece front cut, or a rear cut configuration.

INSTALLATION INSTRUCTIONDoc No. DC07-177000C

Tracking No. IN 1088

Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5



MODERATE

DIFFICULT

ORTHODYNE ELECTRONICS INSTALLATION INSTRUCTIONTRACKING NO. IN 1088 PAGE 1 OF 9

4/30/01

Forcer/F

Electrical Reconfiguration Of ALC To Standard Head

The procedure that follows will reconfigure your ALC head to appear to the system as if it were a standard Large Wire head. The change involves connecting a new cable, P/N 172672, from the Forcer/Focus Board (P/N 175537) to the Z-Cable assembly that goes to the Head Junction Board (P/N 172837).

NOTE: Before handling any electrical boards, make sure you are properlygrounded to prevent damage from Electro-Static Discharge (ESD).


2. Remove the Bonder Top Cover.

3. Locate connector J3 on the Forcer/Focus board and disconnect the Z-Cable thatgoes to the Head Junction Board. (See Figure 1). Note the orientation of the smallT-shaped PCB at the end of this cable.

Figure 1 Forcer/Focus Board

4. Connect the T-shaped PCB end of the new cable in the same orientation to con-nector J3 (see Figure 2, on page 3).

5. Connect the Z-cable into the open end of the new cable. The completed connec-tion is shown in Figure 3, on page 3.

Connector J3

Z-Cable Ass’y (P/N 172610)T-Shaped PCB

ocus Board


4/30/01

J3 Conne

New CableConnectedZ Cable anForcer/Fo

Figure 2 Connecting The New Cable

Figure 3 Completed Connection of New Cable

New Cable

Z Cable T-Shape PCB

ctor

Between d J3 on

cus Board


4/30/01

Software Adjustments

To reconfigure the ALC head, you will make a choice of the cutter configuration you want to use. You will also make that choice to the software. The following procedure will change the head recognition software (so the machine will recognize the head as a stan-dard large wire bond head instead of an ALC), and also let you select the cutter configu-ration you want to use.


2. Before the machine has completed the boot up process, either or both of the fol-lowing error messages may appear:

[509] SPI NOT RESPONDING“Press START to continue...”

If the above screen should appear, press [F16] for large wire.

SYSTEM DATA ERROR“Discrepancies in system data found...”

If the above screen should appear, press [F9] to update the system RAM from thehard disk system data file.

3. From the MAIN MENU, select [7] “Calibration Menu”.

4. Go to [B] “Internal Settings”.

5. Go to [F15] “System Configuration”.

6. When in the “System Configuration” screen, use the Arrow key to move thecursor to the “Cutter Blade” field. Use the toggle or space bar so that this fieldreads “Back” for Rear cut, or “Front” for Front cut. If choosing “Back”, you mustthen choose LVDT or SWITCH for cut depth sensor.

NOTE: After completing this boot up process, and you select the cutter type andinstall it, the machine will require recalibration of the following: LVDT,Force, Cut Switch, and Tool Offsets.

7. From the MAIN MENU, select [7] “Calibration Menu”.

8. Perform the required calibrations.

9. Press [F13] to save back to the “Calibration Menu”.


4/30/01

Mechanical Reconfiguration to Front Cut

The object of the following procedure is to reconfigure the ALC to resemble the mechan-ical configuration of a standard Large Wire bonder. You can select one of three different cutter configurations — two-piece front cut (same as ALC), one-piece front cut, or rear cut. In all cases, to resemble the standard Large Wire bonder you must remove the ALC Clamp Assembly and replace the wire guide. Therefore, we will describe this procedure first, and then describe the cutter reconfigurations.

Removing the ALC Clamp Assembly

To remove the Clamp Assembly, use the following procedure: (See Figure 4).

1. Loosen the Clamp Cable set screw. Then loosen the Clamp Cable by turning theclamp cable screw.

2. Remove the cable from the Clamp Cable slot.

3. Completely remove the Clamp Cable set screw and the clamp cable.

Figure 4 Remove Clamp Cable

4. Remove the Clamp Jaws by completely removing the socket head cap screws andflat washers as shown in Figure 5, on page 6 (refer also to drawing 177004, sheet 3).

Turn The Clamp Cable Screw To Loosen Cable.

Remove Clamp Cable Set Screw

Remove Clamp Cable From Slot


4/30/01

Figure 5 Remove Clamp Jaws

Two-Piece Front Cutter

The two-piece front cut configuration is standard on the ALC, therefore, no change to the cutter configuration is required. Figure 6 shows the front cut, two-piece cutter configura-tion change. The left figure insert shows the profile view of the ALC front cut tools. The right insert shows the same head profile with the clamp assembly removed, and a stan-dard wire guide (P/N 127150-xx).

Figure 6 Front Cut Tool Configurations

Remove Two Cap Screws and Washers

ALC Front Cut Configuration Standard Large Wire Front Cut Configuration


4/30/01

One-Piece Front Cutter

If you wish to reconfigure the head to a one-piece, front cutter configuration, you will remove the two-piece cutter from the cutter holder and replace it with a one-piece cutter blade. You will also replace the pusher with one for a one-piece cutter, and you will need to use a different tool height gauge (P/N 172475).

For the following procedure, refer to the ALC Bond Head drawing (Dwg. No. 177004.)

1. Remove the pusher (P/N 177103 - item #25 in the BOM) and replace it with apusher for a one-piece cutter (P/N 172341). (Refer to drawing 172416.)

2. Remove the ALC wire guide.3. Replace with the wire guide for a Large Wire head (P/N 127150-xx). The dash

number will correspond to the wire size for your application.4. Insert a one-piece cutter (P/N 172340-1,2) into the cutter block. Make sure the

cutter is all the way up against the top of the groove in the cutter block, andagainst the stop set screw on the left.

NOTE: P/N 172340-1 is for wire sizes from 5 to 12 microns; P/N 172340-2 isfor wire sizes from 10 to 20 microns.

The profile view of Large Wire bond head tools is shown in Figure 7, on page 7.

Figure 7 One-Piece Front-Cut Tool Configuration

5. Refer to M360C User manual, “Setting Up The Tools” for the setup procedure forthe wire guide and cutter.

Cutter Block

One-Piece Cutter Pusher

One-Piece Cutter


4/30/01

Mechanical Reconfiguration to Rear Cut

To make the ALC operate in a rear cut configuration, you have to remove the Clamp Jaw assembly, the pusher, the cutter holder, and the ALC wire guide. Replace them with the following parts:

! 172309 - Rear Cutter Block! 172340-xx - Standard Cutter Blade! 168073 - Rear Cutter Gauge! 127150 - Wire Guide! 562301-04 - Screw Nylon Tip (2)! 560300-06 - Set Screw, Cup point (3)! 564300-08 - Set Screw, Flat point (1)! 172475 - Standard Tool Height Gauge

Installing the Rear Cutter

1. Remove the cutter blade holder (P/N 172332 - item #14 in the BOM) by remov-ing the two socket head cap screws.

2. Replace with Rear Cutter Block (P/N 172309) using the Rear Cutter Gauge.

3. Remove the pusher (P/N 177103 - item #25 in the BOM), and completely removethe three set screws which adjust and hold the pusher in place. The reason forremoving these screws is to prevent them from vibrating loose and falling into themachine during operation. These screws will have no function after you removethe pusher.

4. Install all set screws into cutter blade holder. (Refer to Drawing 172004.)

5. Make sure the two cutter blade fastening set screws are loose (see Figure 8, on page 9).

6. Insert the rear cutter blade into the cutter holder block. Push the cutter to the topof the slot and to the left against the stop set screw.

7. Tighten the two cutter blade fastening set screws.


4/30/01

Figure 8 Rear Cutter Installation

NOTE: For additional information on the Rear Cutter adjustment, see the M360CTechnician’s Manual, “Replacing and Adjusting Cutter (Rear Cutter)”.

Fastening Set Screws

Left Stop Set Screw Rear Cutter

Blade


5/17/01

Replacement of the X and/or Y axis Leadscrews

Applicable:Models 360C & 360S machines.

Part Numbers:P/N 172041 - Ball Screw Assembly

IntroductionThe purpose of Installation Instruction IN1089 is to provide instructions for the replacement of the X Axis and/or Y Axis Leadscrews (Ball Screw Assemblies).

Three separate procedures are presented in the following document: a Troubleshooting procedure, the X Axis Leadscrew Removal and Installation procedure, and the Y Axis Leadscrew Removal and Installation procedure. Perform the Troubleshooting procedure first to ensure that a Leadscrew is causing your problem.

Refer to Drawings 172003 and 172041 found in the Model 360C or 360S Drawings and Schematics Manual while performing the following procedures.



Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5



Alignment Block X Axis OE P/N 122308-01 MODERATE

Alignment Block Y Axis OE P/N 122308-02

Torque Wrench (20-300 in-lb (2.3-34.7 N-m)) w/ 4 & 6 mm drives & 17 mm Crows Foot DIFFICULT

Orthodyne Belt Tension Gauge OE P/N 122305

ORTHODYNE ELECTRONICS INSTALLATION INSTRUCTION TRACKING NO. IN 1089 PAGE 1 OF 14

5/17/01

Troubleshooting

1. Apply power to the machine.

2. After machine boot up, press any key. The monitor will then display the Main Menu.

3. Select [4], “Manual positioning”. The monitor will display the MANUAL POSITIONING screen. When this screen is displayed, power is supplied to the four axis stepper motors.

4. While viewing the PR Monitor, use your hand and lightly push (back and forth, front and rear) against the “X” and “Y” castings to test for X Axis and Y Axis movement. The PR Monitor will aid in the detection of movement by the Bonder Assembly.

a. The Bonder Assembly should not move unless a large force is applied.

1) If the Bonder Assembly does not move with light force, the Leadscrews do not need to be adjusted. Do not continue with this procedure.

2) If the Bonder Assembly moves (back and forth, front or rear) with light force, the Leadscrew in that axis must be inspected. Refer to the Leadscrew Removal procedure that applies to the particular axis that has movement.

X Axis Leadscrew

Removal

1. Remove power from the machine.

2. Remove the X Axis Bellows (one from each side).

a. Remove the three outside button screws.

b. Remove the three inside cap screws found under the Bellows.

c. Remove the Bellows.

d. Repeat for the other side.

3. Check the Leadscrew’s attaching hardware.

a. Locate the Leadscrew’s Support (next to pulley). Check the two attaching cap screws.

b. Locate the Leadscrew’s Bearing Block (opposite end from pulley). Check the two attaching cap screws.

c. If the screws in steps a and/or b are tight, continue, if they are loose, skip to the Installation Section on page 4, and begin with step 4.


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CAUTION: Do not force the Timing Belt over the Pulley’s flange. Move the Motor to allow easy Belt removal.

4. Loosen the X Axis Motor Mounting Bracket’s two cap screws and remove the Timing Belt from the Leadscrew Pulley.

5. Loosen the two pulley set screws and remove the Leadscrew Pulley from the X Axis Ball Screw.

6. Check the torque on the Ball Screw Assembly Support’s Lock Nut.

a. Loosen the Lock Nut’s set screw.

b. Torque the Lock Nut to 60 in-lb (6.9 N-m).

c. Tighten the Lock Nut’s set screw.

d. If the Lock Nut was loose and needed to be torqued, skip to the Installation Section on page 4, and begin with Step 16. If the Lock Nut did not move when you applied the specified torque, continue with this procedure.

WARNING: After removing the cap screws which attach the Self Aligning Nut Assembly to the X Axis Casting, there is nothing to prevent the Bonder Assembly from sliding off the Linear Guides. This action can cause harm to personnel, Linear Guide Bearing loss, and damage to the Bonder. Place restraints and visual warnings on the machine to prevent the Bonder Assembly from sliding off the Linear Guides.

7. Pull the Y casting to the full forward position and locate the two cap screws attaching the X Axis Ball Screw’s Self Aligning Nut Assembly to the X Axis Casting (see Figure 1).

a. If these screws are loose, skip to the Installation Section on page 4, and begin with Step 15. If the screws are tight, remove them and continue with this procedure.

8. Remove the cap screws from the Ball Screw’s Bearing Block.

9. Remove the cap screws from the Ball Screw’s Support.

10. Carefully slide the X Axis Ball Screw Assembly out the X Axis Motor side of the Bonder Assembly


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Figure 1 Self Aligning Nut’s Attaching Screw Locations(View from directly above the Y casting)

Installation

1. Carefully place the new Ball Screw Assembly into position.

CAUTION: As you move the Bonder Assembly to gain access to the Ball Screw’s Support and Bearing Block, ensure that the travel of the Bonder Assembly does not exceed the travel limits of the Linear Guide.

2. Loosely install the Ball Screw Support’s two cap screws.

3. Loosely install the Ball Screw Bearing Block’s two cap screws, and lightly push the Ball Screw Assembly in the direction of the Pulley to seat the Assembly.

4. Position the X Axis Alignment Block OE P/N 122308-01 about 0.25 inch (6.35 mm) from the Ball Screw’s Support (see Figure 2).

a. Ensure the proper side of the Block is up (you should see ‘X Axis’ stamped into the block).

b. Ensure the screw arrow is pointing toward the Ball Screw.

5. Lightly push the Ball Screw against the Alignment Block and snug the Ball Screw Support’s two cap screws.

Y Axis Leadscrew

Y Axis Outrigger Rail X Axis

Leadscrew

X Axis Ball Screw Self

Aligning Nut’s attaching Cap

Screws

Y Casting

Front


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Figure 2 X Axis Alignment Block Placement

6. Remove the Alignment Block and move the Bonder Assembly to gain access to the Ball Screw’s Bearing Block.

7. Position the X Axis Alignment Block about 0.25 inch (6.35 mm) from the Ball Screw’s Bearing Block.

a. Ensure the proper side of the Block is up (you should see ‘X Axis’ stamped into the block).


8. Lightly push the Ball Screw against the Alignment Block and snug the Ball Screw Bearing Block’s two cap screws.

9. Check the Alignment by sliding the Alignment Block along the exposed Screw.

a. The Block should not bind or have any space to move toward or away from the Screw (smooth travel). If the check does not satisfy these requirements, loosen the cap screws (both ends) and repeat steps 4 through 9.

10. Remove the Alignment Block and move the Bonder Assembly to gain access to the Ball Screw’s Support.

Left Side Alignment

Right Side Alignment

Note the tail piece seated on the Linear

Guide

The Alignment Block is fully seated against the Linear Guide

and the Leadscrew. Make sure the block’s tail is down completely flat

on the Linear Guide and the opposite end is completely down

on the leadscrew.


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11. Reinstall the Alignment Block on the Ball Screw and check the alignment by sliding the Alignment Block along the exposed screw.

a. The Alignment Block should not bind or have any space to move toward or away from the Screw (smooth travel). If this check does not satisfy these requirements, loosen the cap screws (both ends) and repeat steps 4 through 11. If these steps are repeated and the alignment is still not achieved, contact your local Orthodyne Electronics Representative for assistance.

12. Torque the Ball Screw Support’s two cap screws to 250 in-lb (28.9 N-m).

13. Torque the Ball Screw Bearing Block’s two cap screws to 100 in-lb (11.5 N-m).

14. Position the Ball Screw’s Self Aligning Nut Assembly for easy access to its grease fitting. Using a grease gun filled with (Magnalube G, OE P/N 649504) grease, pump grease into the Self Aligning Nut Assembly until it comes out around the Ball Screw (see Figure 3).

15. Install the Ball Screw’s Self Aligning Nut Assembly onto the Bonder.

a. Position the Ball Screw’s Self Aligning Nut Assembly under the Bonder Assembly and snug the two attaching cap screws.

b. Tighten the four cap screws on the Ball Screw’s Self Aligning Nut Assembly in a criss-cross pattern (see Figure 3).

c. Loosen the two attaching cap screws and wiggle the Bonder Assembly.

d. Tighten the two attaching cap screws very tight.

Figure 3 Ball Screw Self Aligning Nut Assembly

16. Install the Leadscrew Pulley on the X Axis Ball Screw.

a. Position the Pulley flush on the Ball Screw’s Shaft and tighten the two set screws (see Figure 4). Ensure the setscrews are centered on the flats of the shaft and very tight.

Grease FittingTighten cap screws in a criss-cross

pattern


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Figure 4 X Axis Leadscrew Pulley Position

CAUTION: Do not force the Timing Belt over the Pulley’s flange. Move the Motor to allow easy Belt installation.

17. Install the Timing Belt onto the Motor and Leadscrew Pulleys.

18. Using the Orthodyne Belt Tension Gauge (P/N 122305), tension the Timing Belt 0.050 to 0.070 inch deflection on the Gauge.

a. Ensure the X Axis Motor Bracket is parallel to the Ball Screw Assembly.

b. Snug the X Axis Motor Bracket’s two cap screws.

19. Physically move the Bonder Assembly through its X Axis range of motion.

a. Observe the Timing Belt and ensure it remains in the center of the two Pulleys as the Bonder Assembly moves from one extreme to the other. If the belt is centered, proceed to step 20. If the Belt walks from one Pulley flange to the other or binds against one flange, the Motor is out of alignment and the Motor Mounting Bracket is misaligned on the Bonder Assembly’s Top Base Casting.

1) Loosen the X Axis Motor Bracket’s two cap screws, realign the motor, and repeat steps 18 through 19.

20. Check the Belt tension (tension if necessary, step 18) and torque the X Axis Motor Bracket’s two cap screws to 75 in-lb (8.7 N-m).

X Axis Leadscrew’s Pulley flush

with Ball Screw’s Shaft

X Axis Ball Screw

X Axis Motor Bracket


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21. Install the X Axis Bellows.

a. Position the Bellows and install the three inside cap screws located under the Bellows.

b. Install the three outside button screws.

c. Repeat for the other side.

22. Perform the Troubleshooting procedure and ensure the X Axis is tight.

Y Axis Leadscrew

Removal


2. Remove the Y Axis Bellows.

a. Remove the two outside button screws.

b. Remove the three inside cap screws found under the Bellows.

c. Remove the Bellows.

3. Remove the two button screws and the Y Axis Front Cover which has a Caution Placard.

4. Check the Leadscrew’s attaching hardware.

a. Locate the Leadscrew’s Support (next to pulley). Check the two attaching cap screws.

b. Locate the Leadscrew’s Bearing Block (opposite end from pulley). Check the two attaching cap screws.

c. If the screws in steps a and/or b are tight, skip to step 5, if they are loose, skip to the Installation Section on page 10, and begin with step 6.

5. Loosen the four panel screws and remove the Rear Base Cover from the Bonder Assembly.

CAUTION: Do not force the Timing Belt over the Pulley’s flange. Move the Motor to allow easy Belt removal.

6. Loosen the Y Axis Motor Mounting Bracket’s two cap screws and remove the Timing Belt from the Leadscrew Pulley.

7. Loosen the two pulley set screws and remove the Leadscrew Pulley from the Y Axis Ball Screw.


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8. Check the torque on the Ball Screw Assembly Support’s Lock Nut.

a. Loosen the Lock Nut’s set screw.

b. Torque the Lock Nut to 60 in-lb (6.9 N-m).

c. Tighten the Lock Nut’s set screw.

d. If the Lock Nut was loose and needed to be torqued, skip to the Installation Section on page 10, and begin with Step 16. If the Lock Nut did not move when you applied the specified torque, continue with this procedure.

WARNING: After removing the cap screws which attach the Self Aligning Nut Assembly to the Y Axis Casting, there is nothing to prevent the Bonder Assembly from sliding off the Linear Guides. This action can cause harm to personnel, Linear Guide Bearing loss, and damage to the Bonder. Place restraints and visual warnings on the machine to prevent the Bonder Assembly from sliding off the Linear Guides.

9. Locate the two cap screws attaching the Self Aligning Nut Assembly to the Y Axis Casting (see Figure 5).

a. If these screws are loose, skip to the Installation Section on page 10, and begin with Step 15. If the screws are tight, remove them and continue with this procedure.

Figure 5 Self Aligning Nut’s Attaching Screw Locations

Theta AxisMotor

Z Axis MotorY Axis Ball Screw Self Aligning Nut’s

attaching Cap Screws


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10. Remove the Retaining Ring from the Ball Screw’s Bearing Block, and discard the ring. A new Retaining Ring is supplied with the replacement Ball Screw.

a. Do not remove the two cap screws from the Bearing Block at this time.

11. Remove the cap screws from the Ball Screw’s Support.

12. Carefully slide the Y-axis Ball Screw Assembly out the rear of the Bonder Assembly, leaving the Ball Screw’s Bearing Block on the X Axis Casting.

13. Remove the Ball Screw Bearing Block’s two cap screws and the Ball Screw Bearing Block from the front of the Bonder Assembly.

Installation

1. Carefully place the new Ball Screw Assembly into position.

2. Loosely install the Ball Screw Support’s two cap screws.

3. Install the Ball Screw’s Bearing Block onto the Ball Screw with the new Retaining Ring.

4. Loosely install the Bearing Block’s two cap screws, and lightly push the Ball Screw Assembly in the direction of the Pulley to seat the Assembly.

5. Position the Y Axis Alignment Block (OE P/N 122308-02) about 0.25 inch (6.35 mm) from the Ball Screw’s Support (see Figure 6).

a. Ensure the proper side of the Block is up (you should see ‘Y Axis’ stamped into the block).


6. Lightly push the Ball Screw against the Alignment Block and snug the Ball Screw Support’s two cap screws.

7. Remove the Alignment Block and move the Bonder Assembly to gain access to the Ball Screw’s Bearing Block.

8. Position the Y Axis Alignment Block (OE P/N 122308-02) about 0.25 inch (6.35 mm) from the Ball Screw’s Bearing Block.

a. Ensure the proper side of the Block is up (you should see ‘Y Axis’ stamped into the block).


9. Lightly push the Ball Screw against Alignment Block and snug the Ball Screw Bearing Block’s two cap screws.

10. Remove the Alignment Block and move the Bonder Assembly to gain access to the Ball Screw’s Support.


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Figure 6 Y Axis Alignment Block Placement

CAUTION: As you move the Bonder Assembly to gain access to the Ball Screw’s Support and Bearing Block, ensure the travel of the Bonder Assembly does not exceed the travel limits of the Linear Guide.

11. Reinstall the Alignment Block on the Ball Screw and check the alignment by sliding the Alignment Block along the exposed screw.

a. The Alignment Block should not bind or have any space to move toward or away from the Screw (smooth travel). If this check does not satisfy these requirements, loosen the cap screws (both ends) and repeat steps 5 through 11. If these steps are repeated and the alignment is still not achieved, contact your local Orthodyne Electronics Representative for assistance.

12. Torque the Ball Screw Support’s two cap screws to 250 in-lb (28.9 N-m).

Front Alignment

Rear Alignment

Note the tail piece seated on the Linear

Guide

The Alignment Block is fully seated against the Linear Guide and the

Leadscrew. Make sure the block’s tail is down completely flat on the Linear

Guide and the opposite end is completely down on the leadscrew.


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13. Torque the Ball Screw Bearing Block’s two cap screws to 100 in-lb (11.5 N-m).

14. Position the Ball Screw’s Self Aligning Nut Assembly for easy access to its grease fitting. Using a grease gun filled with (Magnalube G, OE P/N 649504) grease, pump grease into the Self Aligning Nut Assembly until it comes out around the Ball Screw (see Figure 7).

15. Install the Ball Screw’s Self Aligning Nut Assembly onto the Bonder.

a. Position the Ball Screw’s Self Aligning Nut Assembly under the Bonder Assembly and snug the two attaching cap screws.

b. Tighten the four cap screws on the Ball Screw’s Self Aligning Nut Assembly in a criss-cross pattern (see Figure 7).

c. Loosen the two attaching cap screws and wiggle the Bonder Assembly.

d. Tighten the two attaching cap screws very tight.

Figure 7 Ball Screw Self Aligning Nut Assembly

16. Install the Leadscrew Pulley on the Y Axis Ball Screw.

a. Position the Pulley so that the Ball Screw’s Shaft is inset from the Pulley’s flange about 0.125 inch (3.2 mm) and tighten the set screws (see Figure 8). Ensure the setscrews are centered on the flats of the shaft and very tight.

CAUTION: Do not force the Timing Belt over the Pulley’s flange. Move the Motor to allow easy Belt installation.

17. Install the Timing Belt onto the Motor and Leadscrew Pulleys.

18. Using the Orthodyne Belt Tension Gauge (P/N 122305), tension the Timing Belt 0.050 to 0.070 inch deflection on the Gauge.

a. Ensure the Y Axis Motor Bracket is perpendicular to the X Axis Casting.

b. Snug the Y Axis Motor Bracket’s two cap screws.

Grease FittingTighten cap screws in a criss-cross

pattern


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Figure 8 Y Axis Leadscrew Pulley Position

19. Physically move the Bonder through its Y Axis range of motion.

a. Observe the Timing Belt and ensure it remains in the center of the two Pulleys as the Bonder Assembly moves from one extreme to the other. If the belt is centered, proceed to step 20. If the Timing Belt walks from one Pulley flange to the other or binds against one flange, the Leadscrew Pulley is not mounted properly on the Ball Screw Assembly.

1) Loosen the Y Axis Motor Bracket’s two cap screws and move the Motor. If moving the motor aligns the pulleys (belt centered on pulleys), repeat steps 18 through 19, if not, continue.

2) Remove the Timing Belt.

3) Loosen the Pulley’s two set screws, realign the Pulley and tighten the two set screws.

4) Repeat steps 17 through 19.

20. Physically move the Bonder Assembly through its X Axis range of motion.

a. If the Y Axis Motor Bracket makes contact with the Bonder Assembly’s Top Base Casting, the Y Axis Motor Bracket is not perpendicular to the X Axis Casting.

1) Loosen the Y Axis Motor Bracket’s two cap screws and repeat steps 18 through 20.

21. Check the Belt tension (tension if necessary, step 18) and torque the Y Axis Motor Bracket’s two cap screws to 75 in-lb (8.7 N-m).

22. Install the Bonder Assembly’s Rear Base Cover and tighten the four panel screws.

Y Axis Motor Bracket

Y Axis Leadscrew Pulley mounted with Ball Screw’s Shaft

inset about 0.125 inch (3.2 mm)


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23. Install the Y Axis Bellows.

a. Install the three inside (under the Bellows) cap screws.

b. Install the two outside button screws.

24. Install the Y Axis Front Cover (Caution Placard) with the two button screws.

25. Perform the Troubleshooting procedure and ensure the Y Axis is tight.


2/20/03

Wide Angle Coaxial Light Kit

Revision B:

Added view of ALC Head Junction PCB for connection illustration with instructions for the two different PCBs (MMR 022003-1).

Revision A:

Added P/N. Exchanged Figure 1 Wide Angle Coaxial Light for corrected picture. Revised appropriate Notes (JP1 Jumper is for the red LED light source. JP2 Jumper is for the fluorescent light); (Image is shifted forward 8.5 mm, which reduces negative Y Axis travel by 8.5 mm) (MMR 030102-1).

Applicable:

Model 360C and 360S machines.

Part Numbers:

P/N 172486 Wide Angle Coaxial Light Assembly for 360C

P/N 172486-01 Wide Angle Coaxial Light Assembly for 360S


Tracking No. IN1090C

Tools:Time To

Complete:Difficulty: 1 2 3 4 5

Common Hand Tools EASY

Metric Alan Wrenches

24.0 mm Gauge Block 1 Hour MODERATE

DIFFICULT

ORTHODYNE ELECTRONICS INSTALLATION INSTRUCTIONTRACKING NO. IN1090B REV. B PAGE 1 OF 12

2/20/03

Introduction

The purpose of Installation Instruction IN1090 is to provide instructions for replacing the Light Assembly with a Wide Angle Coaxial Light. The Coaxial Light provides uniform, collimated illumination using LED light sources, and is interchangeable with the other Light Assemblies. See Figure 1.

Refer to Drawing Numbers 172000 and 172004 found in the Model 360C Drawings and Schematics Manual while performing the following procedures.

Figure 1 The Wide Angle Coaxial Light and Optical Jogbox

Procedure

Light Assembly Removal

1. Remove power from the machine (place the power switch in the OFF position).

2. Remove the two pan head screws and the Right Access Cover from the Bond Head.

3. Remove the two pan head screws and the Left Access Cover from the Bond Head.

Wide Angle Coaxial Light (typical) Optical Jogbox


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4. Front Cut or Rear Cut Bond Head

a. Disconnect the Z Cable from connector J1 on the Head Junction PCB. See Figure 2.

NOTE: Under the cable connected to J1 are two jumper locations JP1 and JP2. JP1 Jumper is for the red LED light source. JP2 Jumper is for the Fluorescent Light.

Figure 2 Head Junction PCB

b. Place the jumper on position JP1.

c. Connect the Z Cable to connector J1 on the Head Junction PCB.

5. ALC Bond Head

a. Place Switch S-1 in the LED position. See Figure 3, on page 4.

J6 Light Assy

Connector

J1

JP1 & JP2 located under

cable

Wire Tube Guide


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Figure 3 ALC Head Junction PCB

6. Disconnect the Lighting Assembly’s Ribbon Cable from connector J6 on the Head Junction PCB.

7. Carefully remove the Lighting Assembly’s Ribbon Cable from the Bond Head.

a. Note the routing of the cable.

8. Remove the attaching pan head screw, washer, and cable clamp from the Light Assembly’s Ribbon Cable.

a. Save the clamp, screw, and washer for the Wide Angle Coaxial Light’s Ribbon Cable.

9. Remove the two pan head screws, nylon set screw, nut, and the Light Assembly from the Bond Head.

10. Open the Wire Feed Guide from the Bonding Tool and remove the wire from the Guide.

11. Pull the small Teflon Wire Feed Tube and wire from the Bond Head Wire Guide Tool.

12. Cut the wire flush with the Teflon Tube and push the Tube, with wire, up into the metal Wire Guide Tube. See Figure 4, on page 5.

13. Remove the two flat head socket screws and the Wire Tube Guide from the Bond Head.

Switch S-1

J6 Light Assy


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Figure 4 Teflon Wire Guide Tube

Wide Angle Coaxial Light Installation

1. Install the new Wire Guide Tube Holder in the location of the old Wire Tube Guide with the two flat head socket screws.

a. Ensure the Holder is flush with the Bond Head.

2. Install the Optical Jogbox onto the Wire Guide Tube Holder with the two pan head screws.

a. Ensure that the Optical Jogbox is flush with the Holder.

3. Install the Latch Assembly Pin onto the Wire Guide Tube Holder with the two pan head screws and flat washers. See Figure 5, on page 6.

Push Teflon Wire Guide Tube up into

the metal Wire Guide Tube

Metal WIre Guide Tube

Wire Tube Guide

IMPORTANT: The Wire Guide Tube Holder is a Delron bracket with threads tapped into the Delron. While installing the Optical Jogbox do not cross thread the screws. If resistance is encountered while installing the screws, remove them and start again.


2/20/03

Figure 5 Latch Assembly Pin Installation

4. Install the Wide Angle Coaxial Light onto the Bond Head with the two pan head screws and flat washers.

a. Ensure the Wide Angle Coaxial Light is horizontal to the Bond Head’s X Axis.

5. Clip the Wide Angle Coaxial Light onto the Latch Assembly Pin.

6. Route the Wide Angle Coaxial Light’s ribbon cable around into the Bond Head (similar to old ribbon cable routing) and connect it into J6 on the Junction Head PCB.

7. Use the old cable clamp and secure the ribbon cable to the Bond Head with the pan head screw and washer.

8. Install the Right Access Cover with the two pan head screws.

9. Install the Left Access Cover with the two pan head screws.

10. Unlatch the Wide Angle Coaxial Light and hinge it out away from the Bond Head.

11. Feed the small Teflon Wire Guide Tube into the Wire Guide.

12. Feed the wire back into the Bond Head’s Tooling.

13. Latch the Wide Angle Coaxial Light.

14. Apply power to the machine (place the power switch in the ON position).

Wire Guide Tube Holder

Optical Jogbox Latch Assembly

Pin


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15. Go to the Manual Position display and adjust the Camera for a focused view.

NOTE: The Optical Jogbox moves the focus range of the Camera up 0.33 inch (8.5 mm). A new Focus Arm may need to be installed to obtain a focused image on the PR Monitor. The image is shifted forward 8.5 mm, which reduces negative Y Axis travel by 8.5 mm.

16. If the camera will not focus at its lower limit, the Camera’s Focus Arm and Optical Tube Clamp will need to be changed. Skip to Camera Focus Arm, on page 9.

17. Align the Wide Angle Coaxial Light for an optimum image on the Camera’s display.

NOTE: The Optical Jogbox shifts the optical axis forward by 0.33 inch (8.5 mm). For some applications, adjust the Y Axis position of the work holder to ensure that the PR locations and bond coordinates are within the field-of-view of the Camera.

18. Perform the Camera Gain Calibration as follows:

a. On the Manual Positioning display, set the value of Lamp 1 and Lamp 2 to 3.

b. Install the Camera Calibration Box (OE P/N 172912) over the Bond Head.

1) Align the slot in the box with the Z Tube.

2) Install the box over the Bond Head.

a) Ensure the Z Tube is completely into the slot.

c. Go to the Main Menu and type: CGC (may have to type: VG).

d. Set the Camera switch to M. See Figure 6, on page 8.

e. Adjust the Camera Gain Potentiometer for an indication of 20.

1) Allow a few minutes for settling time.

NOTE: Some applications require a slight variation from this setting to optimize the PR quality or to compensate for different magnification optics. Start with this setting and vary as needed.


2/20/03

Figure 6 Camera Gain Potentiometer

19. Perform the following calibrations using the procedures found in the Model 360C User’s Manual:

a. Magnification (Main Menu [7], Calibration Menu [D]).

b. Offsets (Main Menu [7], Calibration Menu [2]).

NOTE: Perform the Offsets at the actual bond level to achieve the highest accuracy.

NOTE: The position of the Camera may be shifted back. To see the Offset Tool marks, use the Spinners and position the Camera forward to find the marks.

NOTE: After performing the Offsets calibration, the optical offset will be greater than the range displayed on the screen. With the Wide Angle Coaxial Light, the optical axis is shifted forward therefore, the optical offset will be 5500 to 6000.

c. Focus Offset (Main Menu [7], Calibration Menu [C]).

Camera’s Gain Potentiometer

Camera Switch


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Camera Focus Arm

Only use this procedure if the Camera will not focus at the lower limit after the Wide Angle Coaxial Light has been installed.

Removal

1. Remove power from the machine (place the power switch in the OFF position).

2. Remove the four panel screws and the Z/Theta Bearing Cover.

3. Disconnect the Camera’s Cable and loosen the two screws in the Camera Optic Tube Clamp.

4. Remove the Camera with the attached Optics Tube.

5. Remove the Nylon Bushing from the Camera Optic Tube Clamp.

a. Save the Nylon Bushing for use with the new Camera Optic Tube Clamp.

6. Disconnect the spring from the Focus Arm.

7. Remove the two cap screws and the Belt Clamp from the Focus Arm.

a. Save the Belt Clamp and screws for use with the new Focus Arm.

8. Remove the four cap screws and the Camera Optic Tube Clamp with Focus Arm from the Bond Head.

Installation

1. Install the Nylon Bushing into the new Camera Optic Tube Clamp.

2. Install the Camera Optic Tube Clamp onto the Bearing Guide with the four cap screws.

3. Install the new Focus Arm onto the Camera Optic Tube Clamp with the two cap screws.

a. Snug the cap screws at this time.

IMPORTANT: Do not allow the Bearing Guide to exceed its range of travel after the Camera Optic Tube Clamp is removed. There is nothing to keep the Bearing from coming apart and all the little ball bearings separating from the Guide with the Clamp removed.


2/20/03

4. Loosely install the Belt Clamp on the new Focus Arm with the old cap screws.

a. Ensure the Belt is in the Clamp, but not clamped by the Clamp.

5. Install the Camera with Optics Tube into the Camera Optic Tube Clamp and snug the screws.

6. Connect the Camera’s cable to the Camera.

7. Hook the Spring onto the Focus Arm.

8. Apply power to the machine (place the power switch in the ON position) and go to the Manual Position display (Main Menu [4]).

9. Use the Spinner and position the Camera for a displayed Focus: value of 15.

10. Place a 24.0 mm gauge block between the Focus Arm and the Wire Tube Clamp Block. See Figure 7.

Figure 7 Focus Arm Installation

11. Position the Focus Arm against the gauge block and tighten the two Belt Clamp cap screws.

a. Ensure the tooth on the Belt Clamp is located between two teeth on the Belt.

12. Look at the Camera’s picture and adjust the Camera Optic Tube Clamp up and down until the picture is sharp and focused, then tighten the two cap screws attaching the Focus Arm to the Camera Optic Tube Clamp.

Old Belt Clamp on new Focus

Arm

Camera ClampWith Camera

Position at 15, set this gap to be 24.0 mm then

tighten the Belt Clamp screws.

Initially snug screws then tighten after

final Camera focus is achieved.

Wire Tube Clamp Block

Focus Arm


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13. Using the Spinner, position the Camera up and down to ensure smooth travel during movement.

14. Using the Spinners, position the Camera’s cross hairs so that they are over a spot on the work surface.

15. Move the Camera in the X Axis only and ensure that the spot remains on the X Axis line.

16. If the spot does not stay on the line, gently rotate the Camera in the Camera Optic Tube Clamp and repeat steps 14 and 15 until the spot remains on the line.

17. Tighten the Camera Optic Tube Clamp’s cap screws securing the Camera.

18. Install the Z/Theta Bearing Cover with the four panel screws.

19. Align the Wide Angle Coaxial Light for an optimum image on the Camera’s display.

NOTE: The Optical Jogbox shifts the optical axis forward by 0.33 inch (8.5 mm). For some applications, adjust the Y Axis position of the work holder to ensure that the PR locations and bond coordinates are within the field-of-view of the camera.

20. Perform the Camera Gain Calibration as follows:

a. On the Manual Positioning display, set the value of Lamp 1 and Lamp 2 to 3.

b. Install the Camera Calibration Box (OE P/N 172912) over the Bond Head.

c. Go to the Main Menu and type: CGC as of software release 5.8, or VG).

d. Verify if the Camera switch is set to M. See Figure 8, on page 12.


2/20/03

Figure 8 Camera Gain Potentiometer

e. Adjust the Camera Gain Potentiometer for an indication of 27.

NOTE: Some applications require a slight variation from this setting to optimize the PR quality or to compensate for different magnification optics. Start with this setting and vary as needed.

21. Perform the following calibrations using the procedures found in the Model 360C User’s Manual:

a. Magnification (Main Menu, Calibration Menu [7], Magnification [D]).

b. Offsets (Main Menu, Calibration Menu [7], Offset [2]).

NOTE: Perform the Offsets at the actual bond level to achieve the highest accuracy.

NOTE: The position of the Camera may be shifted back. To see the Offset Tool marks, use the Spinners and position the Camera forward to find the marks.

NOTE: After performing the Offsets calibration, the optical offset will be greater than the range displayed on the screen. With the Wide Angle Coaxial Light, the optical axis is shifted forward therefore, the optical offset will be 5500 to 6000.

c. Focus Offset (Main Menu, Calibration Menu [7], Focus Offset [C]).

Camera’s Gain Potentiometer

Camera Switch


4/30/01

Conversion to Small Wire Bond Head

Applicable:

Model 360C machines.

Part Numbers:

P/N 175000 - 360C 2 mil Option Kit

Introduction

The purpose of Installation Instruction IN1091 is to provide instructions for the replace-ment of the large wire bond head with a small wire bond head.

The following procedures assume the machine has software version 5.4 or higher. Also, it assumes the following part numbered PCBs are installed:

! 175507 Universal Generator PCB

! 175512 Universal I/O PCB

! 175537 Forcer/Focus PCB

Refer to Drawing Number 175000 found in the Model 360S Drawings and Schematics Manual while performing the following procedures.

INSTALLATION INSTRUCTION Doc No. DC07-172000


Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5

Common Hand Tools 2 Hour(s) EASYMetric Allen Wrenches

MODERATE

DIFFICULT

For a break down of the time, see

Table 1, on page 7


4/30/01

Conversion Procedure

1. Remove power from the Bonder.

2. Remove the spool driver assembly (Figure 1).

a. Disconnect the cable (P/N172606) from the rear of the spool driver assembly.

b. Disconnect the large teflon tubing from the spool driver and the dereeler, then remove the large teflon tubing.

c. Remove the three cap screws and the spool driver assembly from the frame and set it aside.

Figure 1 - Spool Driver, Dereeler, and Cover Removal

3. If a Leadframe Handler with pulltest is part of the machine, remove the pull tester cover and the first pull tester (closest to bond head). This is required due to head clearance during rotation.

4. Loosen the screws and remove the cover from the Z/Theta bearing assembly (Figure 1).

5. Disconnect the small and large teflon tubes that run from the dereeler to the bond head (Figure 1).

Disconnect the Teflon Tubes

from the Dereeler.(Step 5)

Disconnect the Connector and Teflon Tube, remove three

screws and the Spool Driver.

(Step 2)

Disconnect the Teflon Tube at the

Dereeler and remove it.(Step 2)

Loosen the screws and remove the

Cover.(Step 4)


4/30/01

6. Remove the two screws and the wire guide mount plate (P/N 172124) along with the attached stainless steel tube containing the Teflon Tubes (Figure 2). They will not be used with the Small Wire bond head.

Figure 2 - Wire Guide Removal

7. Install the new wire guide mount plate (P/N 175236) with the wire guide tube assembly (P/N 175000-98) using the two screws. The bend in the tube should be aligned directly behind the camera tube (Figure 3).

Figure 3 - New Wire Guide

8. Install the new Z/Theta bearing cover (P/N 1752500) using the existing screws (Figure 4, on page 4).

9. Install the new dereeler assembly (P/N 175200) using the supplied brackets and four screws (Figure 4, on page 4). Connect the gas tube from the wire guide tube to the dereeler.

Remove the screws and the

Wire Guide Plate with Tube.

(Step 6)

DO NOT remove the Wire Guide Mount

Plate.

Remove the Bracket before installing the

new Cover.(Step 8)

Camera Tube Install the new Wire Guide Tube behind the Camera Tube.

(Step 7)


4/30/01

10. Loosen the screws and remove the Bonder side cover. Route the dereeler cable (P/N 175603) from the dereeler to the forcer/focus board (Figure 5).

Figure 4 - New Dereeler Installation

Figure 5 - Dereeler Cable Routing

11. Install the Bonder side cover using the existing screws.

12. Install the regulator (P/N 175000-99) with bracket, using the two supplied screws, and set it to 40 PSI. Nitrogen or clean air is used to help feed the wire, maintain the wire loop in the sensor block, and keep the wire clean (Figure 6, on page 5).

13. Connect the tubing from the regulator to the back of the dereeler (Figure 6, on page 5).

Install new Dereeler onto

new Cover(Step 9)

Dereeler Mounting Bracket and

screws.(Step 9)

Dereeler Mounting Bracket and screws.

(Step 9)

Install new Z/Theta Bearing Cover.(Step 8)

Connect the Gas Tube to the Dereeler.

(Step 9)

Connect the Cable into the Forcer/Focus

PCB, J5.(Step 10)

Cable Routing(Step 10)

Route the Cable

through the hole in the Side

Panel(Step 10)


4/30/01

Figure 6 - Regulator Installation

14. Remove the large wire bond head and replace it with the small wire bond head (Figure 7).

a. Remove the two screws and the right side bond head cover.

b. Disconnect the Z-cable from J1 and remove the screw and Z-cable clamp.

c. Loosen the large wire bond head clamp screw and remove the bond head.

d. Install the small wire bond head and snug the bond head clamp screw.

e. Connect the Z-cable to J1 and install the Z-cable clamp using the old screw.

Figure 7 - Bond Head Removal

15. Disconnect the camera’s cable, loosen the two screws on the camera clamp, and remove the camera with the attached optics tube (Figure 8, on page 6).

Install the Regulator with Bracket using the supplied

screws.(Step 12)

Connect the Tubing from the Regulator to the

Dereeler.(Step 13)

Disconnect the Z-cable from J1.

(Step 14)

Remove the screw and the Z-cable Clamp.

(Step 14)

Loosen the Bond Head

Clamp screw.(Step 14)


4/30/01

16. Unscrew the large wire optics tube from the camera and attach the new optics tube (P/N 175022) to the camera.

17. Install the camera with the new optics tube attached and tighten the camera clamp screws (Figure 8). Connect the camera’s cable.

NOTE: The camera’s serial number must face the rear of the machine or thepicture will be upside down.

Figure 8 - Camera Installation

18. Power up the machine. The software will automatically detect the type of bond head installed and check to make sure that the generator is set to the correct mode.

19. After the Bonder completes the move to the home position, adjust the new bond head to be parallel to the Z bracket. Torque the bond head clamp screw to 3.4 N-m (30 inch-lbs.).

20. The software program will default into the calibration procedures for the new bond head. Follow the calibration procedures on the monitor and perform the following calibration procedures:

• LVDT Calibration• Force Calibration• Camera Alignment• Magnification Calibration• Generator Calibration• Clamp Calibration• Offset Calibration• Clamp Calibration again

Loosen the Camera Clamp screws for

removal, tighten after installation.

(Steps 15 & 17)

Install the Camera and attached

Small Wire Optics Tube. The

Camera’s serial number is facing

to the rear.(Step 17)


4/30/01

Table 1: Nominal Time to Complete Tasks

Time in Minutes

Task

1 Remove power from the Bonder.

3 Remove the spool drive assembly.

3 Remove the pull test cover and pull test assembly.

1 Remove the cover from the Z/T bearing.

1 Remove the small and large teflon tubes.

2 Remove the block and steel wire guide tube.

2 Install the block and small wire guide tube.

5 Install the small wire dereeler assembly.

5 Remove the Bonder’s side cove and route the dereeler’s cable.

4 Install the regulator and set it to 40 psi.

3 Connect the tubing from the regulator to the dereeler.

3 Remove the large wire bond head.

4 Install the small wire bond head.

2 Remove the camera and the optics tube.

2 Remove the optics tube and install the small wire optics tube onto the camera.

2 Install the camera with optics tube onto the Bonder.

2 Apply power to the machine.

1 Align the bond head and torque the clamp screw.

4 LVDT calibration

12 Force calibration

3 Align the camera.

3 Magnification calibration

8 Generator calibration

10 Clamp calibration

10 Offset calibration

3 Clamp calibration again

3 Install the Bonder side cover and the Z/T bearing cover.

1hr 42 min


8/3/01

Z Belt Replacement Kit

Applicable:

Model 360C, S machines.

Part Numbers:

P/N 172485 - Z Belt Replacement Kit

P/N 122305 - Belt Tension Gauge (Optional)



Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5

Common Hand Tools 3/4 Hour(s) EASYMetric Allen Wrenches

MODERATE

DIFFICULT


Introduction

The purpose of Installation Instruction IN1092 is to provide the procedure for replacing the old Z Belt with the new GT style Z Belt. Also, a description and use of the optional Belt Tension Gauge is contained in this document.

Conversion Procedure

The Z Belt Replacement Kit contains the large black Pulley, the small red Pulley, and the new GT style Belt. All three of these items must be installed as a set, replacing the original items.

8/3/01


2. Remove or loosen the nine screws and remove the bonder top cover.

3. Remove the outside cap screw and washer, loosen the inside cap screw, and move the Z-axis motor mounting bracket to loosen the Z belt (see Figure 1).

4. Remove the original Z belt and discard the belt.

Figure 1 Original Z-Axis Drive System

5. Loosen the two set screws on the motor damper.

6. Carefully rotate the Z axis motor clockwise far enough to remove the motor damper.

7. Loosen the two set screws and remove the Z drive pulley, discard the pulley.

8. Loosen the two set screws and remove the Z axis pulley assembly, discard the

Remove this Screw and loosen the Screw opposite

Z Drive Pulley

Motor Damper

Z Belt

Z Axis Pulley Assembly


pulley assembly.

NOTE: GT style Belt and Pulleys are not interchangeable with old (original)Belt and Pulleys.

Installation Procedure

1. Install the new Z axis pulley assembly onto the Z drive shaft with the set screw flange near the shaft end. Align the pulley flush with the end of the shaft and tighten the two set screws (see Figure 2).

8/3/01

2. Install the new GT (timing) pulley on the motor shaft extension with the pulley’s teeth closest to the motor. Ensure the pulley is fully seated on the shaft extension and tighten the two set screws.

3. Install the original motor damper on the motor shaft extension. Ensure the damper is fully seated against the drive pulley and tighten the two set screws.

Figure 2 New Z Axis Drive System

CAUTION: Do not force the belt over the pulley flange. Loosen the motor enough to allow for easy installation of the belt. Forcing the belt will stretch and weaken it.

4. Rotate the motor counterclockwise to its installation position and install the new GT Z belt.

Align the new Pulley Assy flush with the

end of the Shaft

New GT Pulley fully seated against Motor

Shaft Extension

Original Motor Damper fully seated against Drive Pulley

New GT style Z Belt

Motor Bracket Cap Screw (one opposite)


5. Install the cap screw and washer on the motor bracket and snug both cap screws.

6. Using the belt tension gauge (OE P/N 122305), tension the Z belt 70 to 80 gauge deflection (0.070 to 0.080 inch) and tighten the two motor bracket cap screws.

7. Install the Bonder top cover with the nine screws.

8. Apply power to the machine.

9. From the MAIN MENU, press [7] and from the CALIBRATION MENU, press [9], then follow the on screen instructions to Recalibrate Home.

8/3/01

Belt Tension Gauge

Use the following Table for determining the correct belt tension settings while using the Belt Tension Gauge (OE P/N 122305):

Place the tension gauge in the middle of the longest non-contact strand of the belt (see Figure 3).

Table 1: Belt Tension Settings

Belt Tension (gauge) Tension (inches)

X & Y Axis 50 to 70 0.050 to 0.070

Z Axis (Old Belt) 55 to 65 0.055 to 0.065

Z Axis (GT Style) 70 to 80 0.070 to 0.080

Theta Axis 85 to 115 0.085 to 0.115

Camera Focus 75 to 90 0.075 to 0.090


Figure 3 Belt Tension Gauge

8/3/01

Rebuilding the ALC Bond Head

Applicable

Model 360C machines equipped with the ALC Bond Head.

Part Numbers

P/N 177004 - M360C ALC Bond Head

Introduction



Tools Time To Difficulty 1 2 3 4 5


Torque Wrench (0 - 20 in-lb) with 2.5 mm driver MODERATEAlignment Gauge (OE P/N 168031)

DIFFICULT


The purpose of Installation Instruction IN1093 is to provide the instructions for rebuilding the ALC Bond Head. Each assembly has a procedure for its removal and installation with the minimal disassembly of the other assemblies.

Procedures

The following procedures are step-by-step instructions for the removal and installation of the individual assemblies that complete the M360C ALC Bond Head. After completing the required procedures, the Bond Head must be adjusted and recalibrated, refer to the “Required Adjustments” on page 23 to complete the calibrations. Refer to Drawing 177004 while performing the following procedures:

8/3/01

D/A Head Control PCB

Removal

1. Remove the four pan screws (two each) and the Right and Left Covers.

2. Disconnect the six cable assemblies (J2 - J6 and J8) from the D/A Head Control PCB (see Figure 1).

Figure 1 D/A Head Control PCB

3. Remove the three pan screws and the D/A Head Control PCB.

J2 Transducer Cable

J3 Forcer CableJ6 Lighting Cable

J5 LVDT Cable

J4 Clamp Motor Cable

J8 Clamp Sensor Cable


Installation

1. Install the D/A Head Control PCB.

a. Position the PCB on the back of the Bond Head.

b. Carefully route the cables out from under the PCB.

c. Install the three pan screws.

2. Connect the six cable assemblies (J2 - J6 and J8) onto the D/A Head Control PCB (see Figure 1).

3. Install the Right and Left Covers with the four pan screws (two each).

8/3/01

Lighting Assembly

Removal


2. Disconnect the Lighting Cable from J6 on the D/A Head Control PCB (see Figure 1, on page 2).

3. Carefully wiggle the Cable through the slot under the D/A Head Control PCB. Remove the Cable from all the cable clips.

4. Remove the pan screw, washer, and the cable clamp from the Cutter/Lighting Mounting Block (see Figure 2).

Cable Clamp

Cable Clips

Lighting Cable

Lighting Assembly

Attaching Hardware


Figure 2 Lighting Assembly (Shown without Cover)

5. Remove the two pan screws and the Lighting Assembly’s Cover.

6. Remove the two pan screws and the Lighting Assembly.

Installation

1. Install the Lighting Assembly on the Light Assembly Swing Arm with the two pan screws.

2. Install the Lighting Assembly’s cover with the two pan screws.

8/3/01

3. Route the Lighting Cable into the Bond Head (see Figure 2, on page 3 and Figure 3).

a. Secure the Cable to the Cutter/Lighting Mounting Block with the cable clamp, pan screw, and washer.

b. Insert the Cable into the cable clips and carefully route the cable under the D/A Head Control PCB.

c. Connect the Lighting Cable into connector J6 on the D/A Head Control PCB (see Figure 1, on page 2).

Figure 3 Light Cable Routing(Shown with the Lighting Assembly Cover removed)

Lighting Cable in Cable Clip



Force Spring Assembly

Removal


2. Loosen the locking set screw, the adjustment set screw, the attaching set screw, and remove the Pusher (see Figure 4, on page 5).

3. Loosen the cap screw and remove the Wire Guide Holder Tube (see Figure 5, on page 5).

8/3/01

4. Remove the two cap screws and the Force Spring Assembly (see Figure 6, on page 6).

Figure 4 Pusher(Shown with Bond Head Covers attached)

Locking Set Screw

Adjustment Set Screw

Pusher

Attaching Set Screw


Figure 5 Wire Guide Holder Tube

Wire Guide Holder Tube

Cap Screw

8/3/01

Figure 6 Force Spring Assembly

Installation

1. Install the Force Spring Assembly into the Main Body.

a. Position the Assembly in the Main Body cavity with the Assembly Shaft’s set screw facing the rear of the Main Body.

b. Ensure that the Spring is completely seated in the counterbore in the Upper Parallelogram Arm.

c. Install the two cap screws.

2. Install the Wire Guide Holder Tube and tighten the cap screw (see Figure 5,

Force Spring Assembly

Attaching Hardware


on page 5).

3. Install the Pusher and tighten the attaching set screw (see Figure 4, on page 5).


8/3/01

LVDT

Removal

1. Perform the Force Spring Assembly “Removal” on page 4.

2. Loosen the set screw and remove the LVDT Core Pin (see Figure 7).

Figure 7 LVDT Core Pin(Shown with Forcer Assembly removed)

3. Disconnect the LVDT Cable from J5 on the D/A Head Control PCB (see Figure 1, on page 2).

LVDT Core Pin

Attaching Setscrew


4. Carefully wiggle the Cable through the slot under the D/A Head Control PCB. Remove the Cable from the cable clip.

5. Remove the two cap screws, washers, and the LVDT (see Figure 8, on page 8).

8/3/01

Figure 8 LVDT Hardware (Shown with all Assemblies removed)

Installation

1. Install the LVDT into the Main Body (see Figure 9, on page 9).

a. Position the Cable through the top side notch in the LVDT Housing

b. Position the LVDT with the Cable extending to the rear of the Main Body.

CAUTION: Do not pinch the wires under the LVDT when you tighten the screws.

Cap Screws


c. Install the two cap screws and tighten them. Leave these screws loose enough to allow the LVDT Housing to move.

2. Remove the LVDT Gauge Pin from the Left Cover.

3. Insert the LVDT Gauge Pin, through the top of the Main Body, into the LVDT Housing and tighten the set screw (see Figure 7, on page 7).

8/3/01

Figure 9 LVDT Positioning(Shown with all Assemblies removed)

4. Align the LVDT to the Parallelogram Assembly.

a. Physically move the Parallelogram Assembly up and down to align the LVDT on the Gauge Pin.

b. Tighten the two cap screws (see Figure 8, on page 8).

c. Physically move the Parallelogram Assembly up and down to test for binding. If there is binding, loosen the two cap screws and repeat Step 4.

5. Loosen the set screw, remove the LVDT Gauge Pin, and install it on the Left

Housing Notch

LVDT


Cover.

6. Install the LVDT Core Pin, through the top of the Main Body, into the LVDT Housing (see Figure 7, on page 7).

a. Insert the solid end of the LVDT Core Pin first. See Figure 10, on page 10 for the Core Pin alignment.

b. Tighten the attaching set screw (see Figure 7, on page 7).

c. Physically move the Parallelogram Assembly up and down to test for binding. If there is binding, remove the LVDT Core Pin, loosen the two cap screws, and repeat Steps 2 through 6.

8/3/01

Figure 10 LVDT Core Alignment

7. Route the LVDT Cable through the cable clip and the slot under the D/A Head Control PCB, and connect it to J5 (see Figure 11).

8. Perform the Force Spring Assembly “Installation” on page 6.

Cable Clip


Figure 11 LVDT Cable Routing

LVDT Cable

8/3/01

Forcer Assembly

Removal

1. Perform the Lighting Assembly “Removal” on page 3.


3. Loosen the cap screw and remove the Wire Guide Holder Tube (see Figure 12).

4. Remove the two countersunk screws and the Wire Tube Guide (see Figure 12).

Cap ScrewWire Guide Holder Tube

Wire Tube Guide

Countersunk Screws


Figure 12 Wire Tube Guide and Wire Guide Holder Tube(Shown with Light Assembly attached)

5. Remove the two cap screws, nutplate, and Cutter Blade Holder (see Figure 13, on page 12).

8/3/01

Figure 13 Cutter Blade Holder Attaching Hardware(Shown with Light Assembly attached)

6. Remove the two cap screws and the Cutter/Lighting Mounting Block (see Figure 14).

Cap Screws

Cutter/Lighting Mounting Block

Cap Screws


Figure 14 Cutter/Light Mounting Block Attaching Hardware

7. Disconnect the Forcer Cable from J3 on the D/A Head Control PCB (see Figure 1, on page 2).

8. Carefully wiggle the Cable through the slot under the D/A Head Control PCB. Remove the Cable from all the cable clips (see Figure 2, on page 3).

8/3/01

9. Remove the two cap screws and split washers, and carefully pull the Forcer Assembly forward and out of the Main Body (see Figure 15).

Figure 15 Forcer Assembly Attaching Hardware

Installation

1. Carefully position the Forcer Assembly in the Main Body.

a. The Forcer’s Cable extends to the rear of the Main Body.

b. Ensure the wires are not pinched between the Forcer Assembly and the Main Body.

Forcer Assembly

Cap Screws with Split Washers


2. Install the two cap screws with split washers and tighten the screws. Leave the screws loose enough to allow the Forcer Assembly to move.

3. Place one 10 mil shim on each side of the Magnet Holder Assembly between the Forcer Coils (see Figure 16, on page 14).

4. Tighten the Forcer Assembly’s two cap screws and remove the two shims. There should be equal drag on each shim as it is removed from the Bond Head.

5. Physically move the Parallelogram Assembly up and down to test for binding. If there is binding, loosen the two cap screws with split washers and repeat Steps 3 through 5.

8/3/01

Figure 16 Shim Placement

6. Route the Forcer’s Cable through the two cable clips and the slot under the D/A Head Control PCB, and connect it to J3 (see Figure 17).

7. Install the Cutter/Lighting Mounting Block with the two cap screws (see Figure 14, on page 12).

Magnet Holder Assembly

Forcer CoilForcer Coil

10 mil Shims (2)

Cable Clips


Figure 17 Forcer Cable Routing

8. Install the Cutter Blade Holder with the two cap screws and the nutplate (see Figure 13, on page 12).

Forcer Cable

8/3/01

9. Install the Wire Tube Guide with the two countersunk screws (see Figure 12, on page 11).

10. Install the Wire Guide Holder Tube and tighten the cap screw (see Figure 12, on page 11).


12. Perform the Lighting Assembly “Installation” on page 3.

Clamp Actuator Assembly

Removal



3. Loosen the cap screw and remove the Wire Guide Holder Tube (see Figure 12, on page 11).

4. Disconnect the Clamp Motor Cable from J4 on the D/A Head Control PCB (see Figure 1, on page 2).

5. Carefully wiggle the Cable through the slot under the D/A Head Control PCB. Remove the Cable from the cable clip.

6. Disconnect the Clamp Sensor Cable at the Sensor (see Figure 18, on page 16).


8/3/01

Figure 18 Clamp Actuator Assembly

7. Loosen the locking set screw and the Clamp Assembly’s Pull Cable, hold the Clamp Assembly open and remove the Pull Cable from the Clamp Assembly (see Figure 19).

Disconnect Cable at the Sensor

Clamp Sensor Cable


Clamp Motor Cable

Cable Clip


Figure 19 Actuator Cable(Shown with Main Body removed)

8. Scribe a line along the interface of the Parallelogram Mounting Block and the Clamp Motor Mounting Bracket (see Figure 20, on page 17).

Locking Set Screw

Loosen Pull Cable

Clamp Assembly

Disconnect Cable from Clamp Assembly here

8/3/01

Figure 20 Scribe Line(Shown with Main Body removed)

9. Remove the two cap screws and the Clamp Actuator Assembly (see Figure 21).

Parallelogram Mounting Block

Clamp Motor Mounting Bracket

Scribe a Line

Cap Screws


Figure 21 Clamp Actuator Assembly Attaching Hardware(Shown with Main Body removed)


8/3/01

Installation

1. Install the Clamp Actuator Assembly with the two cap screws.

a. Align the Clamp Motor Mounting Bracket with the scribed line on the Parallelogram Mounting Block (see Figure 20, on page 17).

b. Tighten the two cap screws.

c. Check the alignment of the Clamp Motor Mounting Bracket to the scribe line. If it is not aligned, loosen the two cap screws and repeat Step 1.

2. Install the Clamp Actuator Assembly’s Pull Cable onto the Clamp Actuator Assembly (see Figure 19, on page 16).

a. Adjust the Pull Cable to keep it from falling off the Clamp. The tension on the Pull Cable will be adjusted while performing the “Required Adjustments” on page 23.

3. Connect the Clamp Sensor Cable to the Clamp Sensor.

4. Route the Clamp Motor Cable through the cable clip and the slot under the D/A Head Control PCB (see Figure 18, on page 16).

5. Connect the Clamp Motor Cable to J4 on the D/A Head Control PCB (see Figure 1, on page 2).

6. Install the Wire Guide Holder Tube and tighten the cap screw (see Figure 12, on page 11).




Transducer and Parallelogram Assemblies

Removal

1. Perform the Clamp Actuator Assembly “Removal” on page 15.

2. Disconnect the Transducer Cable from J2 on the D/A Head Control PCB (see Figure 1, on page 2).

3. Carefully wiggle the Cable through the slot under the D/A Head Control PCB.

4. Hinge the Lighting Assembly away from the Bond Head and remove the two cap screws, nutplate, and Cutter Blade Holder (see Figure 13, on page 12).

8/3/01

5. Remove the two cap screws, washer, and Parallelogram Assembly from the Main Body (see Figure 22).

Figure 22 Parallelogram Attaching Hardware(Shown with Clamp Actuator Assembly attached)

6. Remove the cap screw, star washer, and Transducer Ground Wire from the Pusher Mounting Bracket (see Figure 23).

Cap Screws

Pusher Mounting


Figure 23 Transducer Ground Wire

Cap Screw

Bracket

Transducer Ground Wire

8/3/01

7. Loosen the set screw and remove the Transducer Assembly (see Figure 24).

Figure 24 Transducer Assembly Attaching Hardware

Installation

1. Install the Transducer Assembly in the Parallelogram Assembly (see Figure 25, on page 21).

a. The embossed serial number on the Transducer Assembly must be on the Pusher Mounting Bracket side.

b. Align the Transducer’s Collar flush (+ 0.00 to - 0.04 inch) with the Parallelogram Assembly.

Set Screw


c. tighten the set screw.

2. Install the Transducer Ground Wire on the Pusher Mounting Bracket with the cap screw and star washer (see Figure 23, on page 19).

a. Ensure the Transducer Ground Wire’s lug is between the cap screw and the star washer.

3. Install the Parallelogram Assembly on the Main Body with the two cap screws and washers. Do not tighten the two cap screws (see Figure 22, on page 19).

8/3/01

Figure 25 Transducer Position

4. Install the Alignment Gauge (OE P/N 168031) in the Main Body Clamp (see Figure 26, on page 22).

a. Insert the Gauge through the top of the Main Body Clamp.

b. Align the Gauge’s Disc Pin with the slot of the Main Body Clamp.

c. Insert the Gauge’s Shaft Pin in the Bond Tool hole in the Transducer Assembly.

d. Do not tighten the Bond Tool set screw.

e. Ensure the Gauge is fully seated and tighten the Main Body Clamp screw.

Align Transducer’s Collar flush (+0.00 to -0.04 inch)

with the Parallelogram Assembly

Pusher Mounting Bracket

Transducer’s embossed Serial Number


f. Physically move the Parallelogram Assembly up and down to ensure free movement of the Transducer Assembly on the Alignment Gauge Shaft Pin. If it binds, loosen the Parallelogram Assembly’s attaching cap screws and test for free movement (see Figure 22, on page 19).

8/3/01

Figure 26 Alignment Gauge (Shown with Clamp Actuator attached and most Assemblies removed)

5. Ensure the Transducer’s Collar is flush (+ 0.00 to - 0.04 inch) with the Parallelogram Assembly (see Figure 25, on page 21).

6. Physically raise the Parallelogram Assembly until it is parallel with the Main Body Clamp and tighten the Bond Tool set screw.

7. Position the Parallelogram Assembly Mounting Block’s sides to be flush with the Main Body Mount and tighten the two cap screws (see Figure 22, on page 19).

Align the Gauge’s Disc Pin with the Clamp Slot

Main Body Clamp Screw

Insert the Gauge’s Shaft Pin in the Transducer’s

Bond Tool Hole

Alignment Gauge


NOTE: There maybe some overhang on either or both sides.

8. Torque the Transducer set screw 6 in-lb (0.69 N-m) (see Figure 24, on page 20).

9. Loosen the Bond Tool set screw and physically move the Parallelogram Assembly up and down to test for binding. If there is binding, loosen the Transducer set screw and repeat Steps 8 through 9.

10. Loosen the Main Body Clamp screw and remove the Alignment Gauge (see Figure 26).

11. Route the Transducer Cable under the D/A Head Control PCB and connect it into J2.

8/3/01

12. Install the Cutter Blade Holder with the two cap screws and the nutplate (see Figure 13, on page 12).

13. Perform the Clamp Actuator Assembly “Installation” on page 18.

Required Adjustments

1. After the ALC Bond Head has been installed on the Bonder, refer to the 360C User’s Manual, “Installing the ALC Bond Head Kit” on page ALC 1-10 and start with Step 5.

2. Setup the Bond Head, refer to the 360C User’s Manual, “BOND HEAD SETUP” on page ALC 2-1.

3. Perform Offsets, Generator Test, Touch Sensor (LVDT), and Force Calibrations.

a. Offset; refer to Model 360C User’s Manual, “Offsets” on page 7-127.

b. Generator Test; refer to Model 360C User’s Manual, “Generator Test” on page 7-130.

c. Touch Sensor Calibration (LVDT); refer to Model 360C User’s Manual, “Touch Sensor Calibration” on page 7-132.

d. Force Calibration; refer to Model 360C User’s Manual, “Force Calibration” on page 7-133. If the Clamp Actuator Assembly was removed then, during this procedure, the Clamp Actuator Assembly Pull Cable’s horizontal positioning must be checked/adjusted as follows:

1) The Bond Head will touch down (Bond Tool touching the surface)


and stop. At this point in the procedure check the Pull Cable.

2) Use a measuring device and compare the Pull Cable’s height at Point 1 to Point 2 (see Figure 27, on page 24). These two points’ values must be within 0.1 mm of each other.

3) If the values are within 0.1 mm, proceed with the Force Calibration. If the values are not within 0.1 mm, proceed as follows:

a) Loosen (keep snug) the Clamp Actuator Assembly’s two attaching cap screws (see Figure 21, on page 17).

b) Adjust the Assembly’s height until points 1 and 2 are within 0.1 mm of each other and tighten the two cap screws.

c) Proceed with the Forcer Calibration.

8/3/01

Figure 27 Clamp Assembly’s Pull Cable Horizontal Alignment


8/21/01

Clamp Mounting Block Replacement

Applicable

Model 360C-H/HD machines.

Introduction

The purpose of Installation Instruction IN1094 is to provide the procedures for replacingcrank arm pins that can become loose and back out of the mounting hole. Adding theCrank Arm Pin Support onto the Clamp Mounting Block will retain the pin.

There are three different configurations to this retrofit depending on the handler model.Despite the three different configurations, the procedure remains the same accept for thenumber of screws required to mount the Crank Arm Pin Support which is unique for eachsetup.

INSTALLATION INSTRUCTION Doc No. DC07-176006A


Tools Time To Difficulty 1 2 3 4 5


Caliper MODERATE

DIFFICULT


8/21/01

Part Numbers

Please refer to the drawings for your configuration, see Table 1 and Table 2 whichindicate the appropriate part numbers for each configuration. Refer to Figure 2, on page3, Figure 3, on page 4, and Figure 1, on page 3.

Table 1: Configuration Drawing Numbers

Top Assembly Sub-assembly

Standard Indexer/Clamp Station Transport Assembly

M360CH (P/N 173003)

Clamp Indexer Mounting Block Assembly (P/N 173215)

Dip Clamp Indexer/Dipclamp Trans-port Assembly M360CH-

Dip (P/N 176003)

Dipclamp Station Bridge (P/N 176101 or 176101-1)Wide Reel to Reel used on

58.5 (P/N 176010-1)

Wide Matrix Indexer/Dipclamp Trans-port Assembly M360CH-

Matrix (P/N 176006)

Matrix Clamp Mount Bridge Assembly (P/N 176208)

Table 2: Retrofit Parts Matrix

Standard(173215)

Dip Clamp(176101)

Wide Matrix(176208)

Pin 173215-98 176951 176951

Mounting Block

173215-99 176101-99 176208-99

Support 173215-97 176953 176953


8/21/01

Figure 1 Standard Bridge Assembly (P/N 173215)

Figure 2 Matrix Bridge Assembly (P/N 176208)

Support

Clamp Mounting Block

Pin

Screws (4)

Pin

Support



8/21/01

Figure 3 Dip Clamp Bridge Assembly (P/N 176101)

ProceduresThe following procedures are step-by-step instructions for the removal and installation ofthe individual assemblies that complete the retrofit. This is accomplished in severalphases.

! Removal of the covers and Indexer Assembly

! Installation of the retrofit parts

! Reassembly of the Handler

! Testing the unit

Refer to appropriate drawing listed in Table 2:, on page 2, while performing theseprocedures.

Handler Removal

1. Home the Indexers and save this position. Do this for both Input and Outputassemblies. You will use this position to realign the system after you completethe support installation to align the system.

a. From the Main Menu select and open a file.

b. Select 4, Manual Positioning.

Clamp MountingBlock

Support

Pin


8/21/01

c. Use the spinners to locate the Index Pawl. Select a corner that locates the Pawl in the corner of one of the quadrants of the cross-hair.

d. Press F14, Mark Park X Y, and F13, Save.

2. Move the head position to the far left and rear.


4. If the machine is equipped with Pulltesters (P/N 174001), they will need to bedisconnected and removed. Loosen the clamps retaining them and removethem.

5. Remove the left and right front panels. They are retained by two thumb screwseach. Disconnect the two cable assemblies, P2 and P8, and ground wire, fromthe back of the panel.

Subassembly Removal

1. Make sure the long, black plate that is located at the top of the IndexerAssembly (Indexer Slide Shield, P/N 173225) is parallel to the edge of theClamp Station. See Figure 4. If there is a gap between the plate and theIndexer edge, loosen the two Shield mounting screws, push the plate againstthe edge, then tighten the screws. This will allow you to align the IndexerAssembly when it is reinstalled.

Figure 4 Remove the Four Bolts Retaining the Indexer

2. Disconnect the Sensor cable (P/N 173618), Index Home Flag, from S1connector. This will allow you to move the subassembly aside to allow accessto the components. See Figure 5, on page 6.

Indexer Mounting

Indexer Slide Shield

Shield Mounting Screws (2)

Screws (4)


8/21/01

Figure 5 Indexer Removed and Set Aside

3. Loosen the four bolts that retain the Clamp Arms and remove them.(2 bolts hold the High Side clamp arm).(2 bolts hold the Low Side clamp arm).

Retrofit Installation

1. Remove the E-ring from the pin. See Figure 6.

Figure 6 E-ring and Crank Arm Location

2. Remove the plastic washers from the shafts.

Indexer Assembly

E-ring

Crank Arm

Support


8/21/01

3. Remove the crank arm from the shaft.

4. Remove the spring (located on the opposite side). See Figure 7.

5. Remove the eight allen head bolts that retain the slide and Clamp MountingBlock.

6. Remove the slide from the Clamp Mounting Block.

Figure 7 Spring Location

NOTE: Inspect the slide assembly and ensure it is properly greased beforeattaching the assembly. See Figure 8.

7. Remove the Clamp Arm Mounting Plates and place them on the new ClampMount Bridge assembly (P/N 176208). See Figure 8.

Figure 8 Slide Assembly and Clamp Mounting Block

Spring Mounting Bolts (8)

Slide Assembly

Clamp Mount Block

Clamp Arm Mount Plate


8/21/01

8. Use the a caliper to ensure the slide assembly is mounted parallel. See Figure9 and Figure 10, on page 9.

! Standard 17.20” (P/N 173215) along the left side

NOTE: Only measure along the left side (as indicated by the notched corner).The slide is offset from the center of the Clamp Mounting Block.

! Wide Matrix 12.15” (P/N 176208) along the left side

! Dip Clamp 4.65” (P/N 176101) and 8.65” (P/N 176101-1) along the left side

Figure 9 Aligning the Slide Assembly and Clamp Mount Block

4.65” (P/N 176101)8.65” (P/N 176101-1)

Dip Clamp (P/N 176101)

12.15”

Wide Matrix (P/N 176208)

Standard (P/N 173215)

17.20”

Clamp MountingBlock (typical)

Slide Assembly(typical)


8/21/01

NOTE: You must use the correct length screws (8mm). If the screws are toolong they will damage the rollers, if they are to short then they will stripthe mounting threads.

9. Tighten the screws down to the bottom and then back them out a 1/4 turn. Thiswill allow you to move the assembly into alignment when you check forparallelism with the caliper. Hand tighten all the screws in a cross pattern oncethe assembly is straight. See Figure 10.

Figure 10 Aligning the Clamp Mounting Block

10. Place the spacers on both shafts.

11. Pack grease into the bearing slide once the arm has been placed on theassembly.

12. Place two more plastic spacers onto the lower shaft.

NOTE: The spacers must be fully seated on the shaft or it will bind and causeintermittent feed problems.

13. Place the C-ring onto the shaft.

14. Place the spring back onto the shaft. See Figure 7, on page 7.

Use the caliper toensure perpendicularity

Clamp Arm Mount Plate


8/21/01

Figure 11 Standard Assembly (P/N 173215)

15. Remove the grease cap screw. Ensure that the reservoir is full. See Figure 11.

Installing the Subassembly and Handlers

1. Reinstall the Indexer Assembly using the four screws. Do not tighten thescrews yet. Ensure the plate is parallel to the edge of the Track Station. Handtighten the screws. See Figure 4, on page 5.

2. Connect the Sensor cable (P/N 173618), Index Home Flag, from S1 connector.See Figure 5, on page 6.

3. If the machine is equipped with Pulltesters (P/N 174001), they will need to beinstalled and connected. Tighten the clamps retaining them.

4. Power up the bonder. To check the Indexer alignment:

a. Press Toggle (in MANUAL POSITIONING screen).

b. If the position does not line up with the Indexer Pawl, loosen the four screws, align, and tighten.

5. Replace all the cover panels and secure with the screws.


Pin

Clamp Arm Mounting Plate

Support

Grease Fitting

C-ring


8/21/01

Testing

1. Power up the bonder.

2. Cycle the Clamp Motor a couple of times manually with no part present.

3. With the Clamps in the “clamped” position, turn the Clamp Motor knob slowlycounterclockwise which is the opposite of the direction of normal travel.

4. Watch the LEDs mounted on the left side wall:

a. D8 should be on when the Clamps are fully closed. D8 should turn off after turning the knob counterclockwise.

b. Continue to turn the knob counterclockwise.

c. D6 should come on after D8 goes off.

5. If D6 comes on before D8 goes off, then the part sensor needs to be adjusted. Toadjust it loosen the part sensor screws and move it back until the LEDs arecorrectly timed.


6/04/01

Camera Slide Replacement

Applicable:

Model 360C, 360C-H/HD machines.

Part Numbers:

P/N 172232 - Camera Slide

Introduction

The purpose of Installation Instruction IN1095 is to provide the procedure for replacing the camera slide.

Replacement Procedure


2. Disconnect the camera video cable from the camera. (Figure 1).

3. Take off the optics tube and the camera from the mounting block. (Figure 1). Note the orientation of the camera in the mounting block so you re-mount it in the same orientation later.



Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5

Common Hand Tools 3/4 Hour(s) EASYMetric Allen Wrenches

MODERATE

DIFFICULT


6/04/01

Figure 1 Remove the Optics Tube and Camera

4. Take off the focus spring. This spring hooks on to the optics tube mounting block at the back of the slide. (Figure 2).

5. Take off the optics tube mounting block from the slide by removing the four screws. (Figure 3)

1. Remove video cable

3. Remove Camera & Optics Tube

2. Loosen Two Screws

Remove the Focus Spring

Figure 2 Remove Focus Spring

Figure 3 Remove Camera Block

Remove 4 Screws


6/04/01

6. Scribe a line along the side of the camera slide on the casting it is mounted to. This line will help you position the new slide in the same position. (Figure 4).

Figure 4 Scribe A Reference Line

7. Take off the slide by removing the four screws. (The screws are under the slide). Move slide up and remove bottom two screws, then move slide down and remove top two screws. (See Figures 4 and 5).

Figure 5 Remove Slide

8. Put on the new slide in the same location as the old slide using the scribed lines as a reference.

9. Install the optics tube mounting block.

10. Install the focus spring.

Scribe a Line Along the Existing Slide on the Casting (Top and Bottom)

Move Slide Up

Remove Two Screws When You Move Slide Up

Remove Two Screws When You Move Slide Down

Allen Wrench


6/04/01

11. Install the camera and optics tube. Remember to install the camera in the same orientation as it was in the mounting block when you removed it initially. Do not tighten the mounting screws completely because you may have to adjust the horizontal orientation of the camera.

12. Connect the camera video cable.


14. Align the horizontal orientation of the camera. You can make this alignment by using the “Magnification Calibration” screen. The Magnification Screen shows two connected crosshairs.

a. Place the left-most crosshair over a prominent feature on the die.

b. Use the X Spinner to move the right-most crosshair over the same spot. If the horizontal orientation of the camera is correct, the left and right crosshair will cover the same spot. If they do not, rotate the camera in the mounting block and repeat the procedure until the two crosshairs coincide over the same spot when you move the table with the X spinner.

c. When this alignment is complete, tighten the camera mounting screws.

15. Perform the Magnification Calibration described in the M360C Technician’s Manual, “Magnification Calibration”, page 5-38.

16. Perform a tool offset calibration. (See M360C Technician’s Manual, pg 5-6).

17. Check optical offset. If the result is outside the accepted tolerence, perform the procedure described in the M360C Technician’s Manual, “Adjusting the Tool Offset”, pg 6-79.


8/31/01

Grounding the Transducer

Applicable:

All Model 360C, 360S, and 360 ALC machines. This procedure applies to P/N 175537 Forcer Focus Assembly Board Rev. J and K only. It does not apply to Revisions A through I or L and later version boards.

Part Numbers:

P/N 172674 Bonding Tool Grounding Cable Assembly.

Introduction

The purpose of this document is to provide instructions for installing the grounding jumper on the Forcer Focus board (P/N 175537) to provide additional grounding to the transducer. This ground line was omitted on Forcer Focus board Rev. J and K.

Procedure

Install the Jumper


2. Remove the cover from the bonder assembly.

INSTALLATION INSTRUCTION Doc No. DC07-175537B


Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5

Common Hand Tools 10 minutes EASY

MODERATE

DIFFICULT


8/31/01

3. Remove the top left hand side screw that secures the Forcer Focus board (P/N 175537) to the bonder assembly. See Figure 1 and Figure 2.

Figure 1 “Piggy Back” Cable

4. Attach the grounding terminal of the “Piggy Back” cable to the Forcer Focus board as shown in Figure 2.

Figure 2 Grounding Cable Location

5. Unplug the J2 connector from the Forcer Focus board (generator).

6. Insert the “piggy back” Jumper Cable (P/N 172674) in between the cable coming from the Junction board (J2) (generator) and the connector on the Forcer Focus board (P2). See Figure 2.

7. Replace the cover.

Inspect the Transducer Connector Wires

1. Remove the bond head cover.

2. Insure the transducer connector wires are in the correct pin location:

To Junction board(P/N 175537 J2)

To Generator Cable 172618-1

J2

P2

Loosen the screw and attach the terminal

Insert “piggy back” jumper into the connector P2


8/31/01

a. Pin 1 should be red

b. Pin 2 should be white

If these wires are reversed you may get error message: “[475] - Detected power is too high. Indicates short circuit or generator problem.”, when performing a “Gentest” calibration.

c. Rewire these lines if incorrect. See Figure 3.

Figure 3 Transducer Line Wiring

3. To change the wires:

a. Unplug the connector

b. Use a small blade screwdriver or micro-tweezers to release the clip that retains the wire.

c. Insert the wire into the correct pin, it will lock in place.

4. Replace the bond head cover.

Red Wire (Pin 1)

White Wire (Pin 2)


8/3/01

Dorio Board Isolation Kit

Applicable:

All Model 360C, 360S, and 360C-H/HD machines equipped with the Dorio Monitor.

Part Numbers:

Dorio Monitor PC Board Isolation Kit P/N 172488.

Introduction



Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5


MODERATE

DIFFICULT


The purpose of Installation Instruction IN1097 is to provide the procedure to add isola-tion mounts and insulation tape to the Dorio Monitor cover.

Replacement Procedure


2. Disconnect the power and the three communication cables from the back of the Dorio monitor.

8/3/01

3. This step requires two people. The first person must hold the monitor to prevent it from sliding while the second person removes the four cap head screws, from underneath the monitor mounting bracket, that attach it to the stand.

4. Place a soft cloth or padding on the work table. Place the monitor, screen down, on the padding.

WARNING: Avoid contact with the monitor’s PC board and the high voltagetransformer (yoke). It contains several capacitors that will dis-charge if you touch them. See Figure 1.

5. Remove the screw, in the back of the monitor, that holds the cover. See Figure 2, on page 3.

NOTE: Do remove the monitor bracket from the monitor.

Warning: Do nottouch! High voltagedischarge area.


Figure 1 Warning, High Voltage Discharge Area

6. Locate the two Retaining Lock Buttons on the bottom of the cover and use your fingers to depress them. See Figure 2, on page 3. The cover will now slide off.

7. Remove the backing from the Isolation Mount (P/N 618313) and place it onto the inside of the cover as indicated. The location is four inches from the left edge and against the first ridge. See Figure 2, on page 3.

8. Place the tape (P/N 172936) over the four metal tabs that lock the Mounting Bracket onto the cover.

8/3/01

Figure 2 Isolation Mount and Tape Locations

9. Install the cover, the Retaining Locks will snap into place in the slots.

10. Insert and tighten the cover’s screw in the back.

11. Set the monitor back onto the stand. The first person must hold the monitor to prevent it from sliding, while the second person installs the four cap head screws from underneath the monitor mounting bracket that attach it to the stand.

12. Connect the power and the three communications cable onto the back of the monitor.

Tape over the

IsolationMount

ScrewLocation

Retaining LockSlot Locations

4 in.

metal tabs thatmount the baseto the cover.


7/2/03

Z-Cable Spacer Kit

Applicable:

All M360C family

Part Numbers:

172494

Introduction

The purpose of this Installation Instruction is to describe the procedure for incorporating a spacer kit for the Z-Cable in the Z Tube.

Procedure

Installing the Spacers1. Turn off power to the machine and remove wire from the Bond Head.

2. Disconnect the teflon tube at the dereeler.

3. Unplug Z-Cable from the Head Junction Board and remove cable clip at the Bond Head.



Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5


MODERATE

DIFFICULT


7/2/03

4. Remove the Bond Head.

5. Unplug the camera at the camera and remove the camera and camera tube assembly.

6. Remove the two screws securing the wire guide mount plate.

7. Twist the plate around 180 degrees and remove it along with the wire feed tube from the z theta tube.

8. Install the z cable spacer, nylon washer, and finally the clamp onto the wire feed tube from the bottom.

9. Orient the clamp so that the screw is directly away from where the camera tube would be.

10. Position the spacer and clamp so that the bottom of the spacer is 88mm from the bottom of the wire feed tube. See Figure 1.

Figure 1 Position Spacer and Clamp

Routing the Z-Cable1. Make sure the z-cable is dressed so that it exits the coiled section under the

wire guide mount plate as far away from the wire feed tube as possible.

2. Route the z-cable into the u-groove on the spacer. See Figure 2, on page -3.

3. Replace the whole assembly into the z-theta tube.

4. Cut the teflon wire guide sleeve to 72mm and then slip it onto the bottom of the wire feed tube.


7/2/03

5. Route the z-cable through the head, and insert the bottom of the Wire Feed Tube into the hole in the wire feed tube guide on the Bond Head. Be sure the Z-cable is not wrapped around the wire feed tube.

Figure 2 Installation of Z-Cable Spacer

6. Dress the z-cable so that the spacer is pointing as far to the back of the machine as possible, then install the cable clip and plug the z cable into the Head Junction Board.

7. Reinstall the camera and plug it in.

Checking the Adjustment1. Before powering up, move the Bond Head to both extremes in theta with the

head all the way up. At each extreme, move the focus up and down, making sure that the camera tube does not hit the clamp, spacer or the z-cable.

NOTE: Note: it may not be possible to move theta all the way to –200 degreesand focus all the way down and the head all the way up without a slightamount of rubbing. It should be able to go through about 150 degreeswith the head all the way up and the focus all the way down.

2. Move the Bond Head all the way down and focus all the way up. Rotate the Bond Head to extremes again and ensure that the spacer cannot rotate under camera.


7/2/03

3. If there is some rubbing of the cable by the camera tube at any of these extremes, the distance of the spacer from the bottom of the wire feed tube can be changed up to 5mm, up or down. END.


7/2/03

360CHD Tooling Change (SPM27/SPM28)

Applicable:Model 360C-H/HD machines.

Part Numbers:

IntroductionThe purpose of Installation Instruction IN1100 is to provide the procedure to convert tooling from SPM27 to SPM28.

Procedure

Tools Required:Metric hex wrench set

Small flashlight

INSTALLATION INSTRUCTION Doc No. DC0 Tracking No. IN 1100

Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5

Common Hand Tools 25 minutes EASYGauges provided with Tool Kit

MODERATE

DIFFICULT

ORTHODYNE ELECTRONICS INSTALLATION INSTRUCTION DOC NO. DC0 TRACKING NO. IN 1100 PAGE 1 OF 16

7/2/03

Set of leadframe handler setup gauges (Kit P/N 173805-38), including:

- Magazine handler shim (P/N 173410-2)- Anvil Height/Rail Spacing Guage (P/N 176838-20)- Llamp Height Guage (P/N 176480-24)- Index Pawls Gauge (P/N 173416-xx)

Input Transport1. Remove the four mounting bolts and remove the Bridge Assembly. See Figure 1.

Figure 1 Bridge

2. Remove the mounting bolts and remove high and low side anvils, shims, and heat sink anvil. See Figure 2, on page 3.

Mounting Bolts


7/2/03

Figure 2 Anvil, Shims, and Hi/Lo Inserts

3. Replace the Blower Nozzle.

a. Remove the two retaining screws.

b. Disconnect the hose assembly.

c. Attach the new Blower Nozzle Assembly

d. Attach the nozzle using the two screws that retain it.

4. Inspect the O-ring on the Anvil Mount for wear, or damage. Replace if necessary.

Figure 3 O-ring

Hi/Lo Anvils

Shims (Record the number ofAnvil

Heat Sink shims used for later reference)

O-ring


7/2/03

5. Insert the new Heat Sink Anvil, Hi/Lo Anvils, and Shims. (The quantity shim thickness has already been determined from the intital set-up).

6. Adjust the High Side Anvil position:

a. Retrieve the SPM27 or SPM28, ANVILHI file.

b. From the Main Menu, access the Manual Position screen.

CAUTION: Bond Head movement is rapid. Before using the Toggle Button to retrieve the position, make sure all the Holdown Rollers are down and the Bond Head’s travel path is clear of any obstructions.

c. Press the Toggle. The Bond Head will move to the pre-programmed X-Y location for the Hi-side Anvil. See Figure 4.

Figure 4 Hi-side Anvil Position

d. Position the Anvil until it lines up with the cross-hairs as shown in Figure 4. Tighten the screws.

7. Adjust the Low Side Insert position:

a. Retrieve the SPM27 or SPM28, ANVILLO file.


Crosshairs are centered betweenthe two circles.

Line up on Crosshairs


7/2/03

c. Press the Toggle. The Bond Head will move to the pre-programmed X-Y location for the Low-side Anvil. See Figure 5, on page 5.

d. Position the Anvil until it lines up with the cross-hairs as shown in Figure 5. Tighten the screws.

8. Install the Bridge Assembly and four mounting bolts.

Figure 5 Lo-side Anvil Position

9. Place a leadframe into the Anvil and manually rotate the Clamp Station knob to the full clamped position. The leadframe should now be centered within the High and Low Side Anvil cut-outs.

NOTE: If the Anvil needs to be adjusted, loosen the bolts and move the Anvilassembly and not the pin that is used to locate the Bridge.

10. Reposition the Mis-Index sensors;

a. Retrieve the SPM27 or SPM28, SEN1 file.

b. Access the Manual Position screen.

CAUTION: Bond Head movement is rapid. Before using the Toggle Button to retrieve the position, make sure all the Holdown Rollers are down


Line up on Crosshairs


7/2/03

and the Bond Head’s travel path is clear of any obstructions.

c. Press the Toggle. The Bond Head will move to the pre-programmed X-Y location for the Mis-indexer Sensor 1. Figure 6, on page 6.

d. Position the sensor as shown in Figure 6.

e. Retrieve the SPM27 or SPM28, SEN2 file.

f. Repeat Steps “10-b” through “10-d.”

Figure 6 Mis-Index Position

11. Reposition the Indexer pawls;

a. Retrieve the SPM27 or 28 PAWL1 file.

b. Access the MANUAL POSITIONING screen.


c. Press the Toggle. The Bond Head will move to the pre-programmed X-Y location of Indexer Pawl 1 as shown in Figure 8, on page 8.



7/2/03

d. On the MANUAL POSITIONING screen, use the spinners to position the crosshairs over a feature on the device as seen in Figure 8, on page 8.

e. Remove the Transport front, left cover.

f. Use an 3 mm Allen wrench to loosen the indexer assembly. See Figure 7, on page 7.

g. Move the pawl's guide rails, in the X-axis only, so the index pawl is aligned with the crosshairs. If the Indexer Pawl is difficult to see, shine a small flashlight down onto the top of the pawl.

h. Tighten the X Axis Guide Rail.

i. Install the Transport cover.

j. Retrieve the SPM27 or SPM28 Pawl 2 file.

k. Repeat Steps “11-b” through “11-i.”

Figure 7 Indexer Pawl Slide


7/2/03

Figure 8 Indexer Pawl Position

12. Reposition Input Feed sensor.

a. Remove the sensor cover.

b. Loosen the set screw and move it the sensor to it’s predetermined position. For SPM27 set the right side of the sensor to 42mm. For SPM28, set the left side of the sensor to 84mm. Please note that these positions may require slight adjustment.

c. Tighten the mounting screws and replace the cover.

CAUTION:The Feed sensors must be set accurately or Mis-indexing will occur. The sensor is responsible for positioning the Index Pawl in the proper hole in the frame.


7/2/03

Figure 9 Sensor Cover

Figure 10 Sensor Position


7/2/03

Output Transport1. Remove the four mounting bolts and remove the Bridge Assembly. See Figure

1, on page 2.

2. Remove the mounting bolts and remove high and low side Anvils, shims, and Heat Sink Anvil. See Figure 2, on page 3.

3. Replace the Blower Nozzle.

a. Remove the two retaining screws.

b. Disconnect the hose assembly.

c. Attach the new Blower Nozzle assembly.

d. Attach the nozzle using the two screws.

4. Inspect the O-ring on the Anvil Mount for wear, or damage. Replace if necessary.

5. Insert the new Heat Sink Anvil, Hi/Lo Anvils, and Shims.

6. Adjust the High Side Anvil position:

a. Retrieve the SPM27 or SPM28, ANVILHI file.


c. Press the Toggle. The Bond Head will move to the pre-programmed X-Y location for the Hi-side Anvil. See Figure 4, on page 4.

d. Position the Anvil until it lines up with the cross-hairs as shown in Figure 4, on page 4. Tighten the screws.

7. Adjust the Low Side Anvil position:

a. Retrieve the SPM27 or SPM28, ANVILLO file.


c. Press the Toggle. The Bond Head will move to the pre-programmed X-Y location for the Low-side Anvil. See Figure 5, on page 5.

d. Position the Anvil until it lines up with the cross-hairs as shown in Figure 5, on page 5. Tighten the screws.

8. Install the Bridge Assembly and four mounting bolts.

9. Place a leadframe into the Anvil and manually rotate the Clamp Station knob to the full clamped position. The leadframe should now be centered within the High and Low Side Anvil cut-outs.

NOTE: If the Anvil needs to be adjusted, loosen the bolts and move the Anvil


7/2/03

assembly and not the pin that is sued to locate the Bridge.

10. Reposition the Mis-Index sensors;

a. Retrieve the SPM27 or SPM28, SEN1 file.

b. Access the Manual Position screen.


c. Press the Toggle. The Bond Head will move to the pre-programmed X-Y location for the Hi-side Anvil. Figure 6, on page 6.

d. Position the sensor as shown in Figure 6, on page 6.

e. Retrieve the SPM27 or SPM28, SEN2 file.

f. Repeat Steps “10-b” through “10-d.”

11. Reposition the Indexer pawls;

a. Retrieve the SPM27 or 28 PAWL1 file.

b. Access the MANUAL POSITIONING screen.


c. Press the Toggle. The Bond Head will move to the pre-programmed X-Y location of Indexer Pawl 1 as shown in Figure 8, on page 8.

d. On the MANUAL POSITIONING screen, use the spinners to position the crosshairs over a feature on the device as seen in Figure 8, on page 8.

e. Remove the Transport front, left cover.

f. Use an 3mm Allen wrench to loosen the indexer assembly. See Figure 7, on page 7.

g. Move the pawl's guide rails, in the X-axis only, so the index pawl is aligned with the crosshairs. If the Indexer Pawl is difficult to see, shine a small flashlight down onto the top of the pawl.

h. Tighten the X Axis Guide Rail.

i. Install the Transport cover.


7/2/03

j. Retrieve the SPM27 or SPM28 Pawl 2 file.

k. Repeat Steps “11-b” through “11-i.”

12. Reposition Input Feed sensor.

a. Remove the sensor cover.

b. Loosen the set screw and move it the sensor to it’s predetermined position. For SPM27 set the right side of the sensor to 42mm. For SPM28, set the left side of the sensor to 84mm. Please note that these positions may require slight adjustment.

c. Tighten the mounting screws and replace the cover.

CAUTION:The Feed sensors must be set accurately or Mis-indexing will occur. The sensor is responsible for positioning the Index Pawl in the proper hole in the frame.

13. Recall the “Software Setup”;

a. From the Main Menu select “7-Setup” menu. See Figure 11, on page 12.

b. From the Setup Menu select “3-Recall Save.” See Figure 12, on page 13.

c. Select “1”-Recall. See Figure 13, on page 13.

d. Recall Setup From (see Figure 14, on page 13);

1) 1 Setup Memory 1 for (SPM27).

2) 2 Setup Memory 1for (SPM28).

Figure 11 Main Menu


7/2/03

Figure 12 Setup Menu

Figure 13 Select Menu

Figure 14 Recall Setup Menu

Input/Output Magazine Handlers1. Perform each step on both handlers.


7/2/03

Figure 15 SPM27 & 28 Magazines

NOTE: Before making adjustments to the handlers, lay a cloth or piece of paperon the unloader shelf. This prevents tools or debris from falling insidethe handler assembly.

2. To adjust the magazine position between the two vertical guides:

a. Loosen the three cap screws on the loader's outside guide, and the four cap screws on the unloader's outside guide. See Figure 16.

b. Place the magazine on its side, between the two guides.

c. Place the magazine shim between the magazine and the guide.

d. Move the outside guide flush against the magazine and shim. Ensure that the plastic wear strip is flush with the outer edge of the guide.

e. Check the full width of the magazine loader for binding. When complete, tighten the guide's screws.

f. Repeat for the Unloader.


7/2/03

Figure 16 Magazine Guide Adjustment

3. Press [UP ARROW] on the Input Magazine Handler's Control Panel to move the elevator to the highest position. The magazine retaining arms should be flush with the bottom of the magazine.

4. On the input magazine handler, adjust the Input Kicker (strip pusher) so it won't interfere with the magazine elevator travel. Loosen the two Input Kicker Adjustment cap screws (see Figure 17) and move the strip pusher so it is slightly behind the leadframe crowder.

5. Tighten the screws.

CAUTION: Make sure the Input Kicker Arm (at Home posi-tion) does not extend beyond the leadframe crow-der, or will not catch any part of a leadframe traveling in the magazine elevator


7/2/03

.

Figure 17 Top View of Input Kicker (Strip Pusher) and Leadframe Crowder


TB# Date Description NOTE: If a document does not appear on this list it was:

a) Never approved for release b) Superceded by another document c) The information is included in the manual

1029 2/96 Pull tester timing belt 1037 11/99 M360C-H/M360C-HD Clamp station belt 1040 8/96 CPU Board Replacement for Model360C family 1042 11/99 CPU Board replacement for Model 360A with new PR, and Model 360B 1045 7/96 Wyse terminal set-up 1046 3/96 Pull tester hook reference 1047 4/96 Installation of electrical filter capacitors in the fan motor circuit 1049 6/96 Soldering Fluorescent Bulbs 1052 8/96 Replace the U19 chip on the I/O board 1054 1/2000 Pull tester home control 1055 5/97 LED board and Focus Sensor board alignment 1056 5/97 Spool Driver Speed adjustment 1057 5/97 Dereeler Op Amp replacement 1058 1/2000 Replacement of Z/Theta Bearing in the field 1059 1/2000 Wyse 160 Data Terminal/Keyboard compatibility 1060 1/2000 Calibration procedure for Universal Generator PCB 1062 2/97 LVDT Gain change for new I/O Board 1063 1/2000 Change Remote Handler Interface operating voltage 1064 2/97 Replacing the Clamp Adjustment Block 1065 2/97 M360C Printer parallel port 1066 5/97 Memory Allocation Error in Software Version 5.4b 1067 3/97 Revised Isolation pad design 1068 5/99 Z/Theta Bearing Lubrication 1069 4/97 Active Clamp Head Calibration, remove cutter 1070 4/97 Power-up Screen 1073 8/97 Z-Band replacement procedure 1075 9/97 Forcer Offset Calibration 1076 8/99 Correcting noise on the SPI line 1080 10/97 Z-Band replacement procedure 1081 1/98 Calibration procedure for Generator PCB 1083 7/98 Add capacitor to Forcer/Focus Board 1086 1/98 Isolate Head Controller on the 360S Bond Head 1087 3/99 Replace connector on PR monitor cable P/N 172619 1089 3/99 X & Y Outrigger bearing replacement 1090 12/98 Clean the wire clamp jaws of the ALC Bond Head of aluminum 1091 6/98 Change in the Bonding Wedge part number 1092 3/99 Motor/Encoder Replacement for X, Y axis 1093 3/99 Change to electronic board spare parts

TB# Date Description 1094 7/98 New latch for florescent light fixture 1095 8/98 Replacement of the Z/Theta bearing in the field 1099 7/99 Dorio Monitor Set Up Instructions 1100 7/99 Changes to the Handler Interface PLC Adapter 1101 3/00 ALC Pulltest Values 1102 2/00 Pulltester Sensor Board Fix 1103 3/00 Fixing a Broken Transducer Screw 1104 4/00 Clamp Motor Driver Board Adjustment (173512) 1105 4/00 M360C Repacking Instructions 1107 8/00 Fluorescent Light Affects Forcer Calibration 1108 8/00 S/W Head/ALC Stepper Motor Rotation 1109 10/00 Dorio Monitor Attachment 1112 2/01 Reformatting the Hard Drive (for Internal Use Only) 1113 4/01 Focus System Board Replacement 1114 4/01 Instructions for Bonding Tool Installation 1115 6/01 Instructions for Anvil Cam Replacement 1116 11/02 Generator Load Box 1118 10/02 Using Area Statistics to Optimize PR 1123 12/02 Dorio Jibberish

Feb. 29, 1996

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET

No.: 1029 Rev: A Prepared By:Spence Uota

Subject: Pull Tester Timing Belt Tension Resp. Engineer:

DrawingNo.:

V.P. Engineering:“Bob” Babayan

Part No.: 603456 V.P. Marketing:Bill Larkin

Models: 360C-H/C-HD Tech. Publication:George Ritsi

Objective:

Instructions for installation and adjustment of the Pull Tester Timing Belt. Field observations show thatthis belt can be installed with too high a tension, causing failure of the ball bearing that supports the camshaft.

Background:

Field reports indicated premature failure of the Pull Tester Timing Belt. Orthodyne selected anothervender for this part. Our tests show the new belt has significantly improved life expectancy. While thepart number for the new belt is the same (603456), it can be distinguished from the old belt by its color.The new belt is orange, while the old belt was gray.

Applicable

M360C-H, M360C-HD

Summary:

We have had numerous instances of field replacements of the timing belt with too high tension. Thisputs a side load on the shaft bearing which causes excessive wear and pre-mature failure of the PullTester. The Technical Bulletin provides a technique for correct tensioning of the belt.

February 29, 1996

PULL TESTER TIMING BELT INSTALLATION Page 1 of 1

TECHNICAL BULLETIN No. 1029 Rev. APull Tester Timing Belt Installation

ApplicableModel 360C-H, Model 360C-HD

Part NumberPull Tester Timing Belt: 603456

BackgroundOrthodyne Electronics recently selected a different vender for the Pull Tester timing belt, whoseproduct had a longer lifetime. The new belt carries the same part number as the previous belt, butcan be distinguished by its color. The new, longer-lasting belt is orange, while the previous belt wasgray.

We have encountered problems in the field when replacing this belt because of improper tension.This Technical Bulletin offers a technique for applying sufficient tension on the belt to perform itsfunction without over-tightening.

ProblemInstallation of the Pull Tester Timing belt requires careful attention to belt tension. Too tight tensioncan cause failure of the shaft support bearing,

We advise that existing Pull Tester timing belts have their tension checked as a routine preventativemaintenance action, using the procedure described below.

SolutionThe proper technique for adjusting tension on the timing belt is to make the belt tight enough to justtake out the slack. The belt should not put any side load on the bearing. A good test of enoughtension is to hold the rotating pin and then turn the motor. The belt should wrap around the pulleywith zero stretch, and be tight enough so that is doesn’t skip teeth.

The function of this belt is to swivel the arm left and right. It does not have to be tight. If the belt istoo tight, there will be excessive wear on the bearing, which will cause a general failure of the PullTester.

of 1

11/23/99

TECHNICAL BULLETIN

APPROVAL SHEET

No.: 1037 Rev: A Prepared By:

Subject: M360C-H/M360C-HD ClampStation Belt

Resp. Engineer:

Drawing

No.:

173003, Rev F V.P. Engineering:

“Bob” Babayan

Part No.: 603449 V.P. Marketing:

Bill Larkin

Models: 360C-H/C-HD Tech. Publication:

George Ritsi

Purpose:

Correct part number callout of replacement belt.

Applicable:

Model 360C-H/C-HD

Summary:

Original Technical Bulletin was issued to cover replacement of clamp station belt made from adifferent material. The part number of the belt listed in the Technical Bulletin was incorrect.This revision corrects the belt part number. All other aspects of the Technical Bulletin remainthe same.

MARCH 4, 1996

Page 1 of 2

TECHNICAL BULLETIN No. 1037 Rev. A

Replacement of Clamp Station Belt

ApplicableModel 360C-H and 360C-HD.

PurposeThe purpose of this revision is to correct the part number callout of replacement belt.

BackgroundThe original Technical Bulletin was issued to alert users of a change in the Clamp Stationbelt. The correct part number of the clamp station belt is 603449. All other aspects of theTechnical Bulletin remain the same. For convenience, this bulletin contains all the pertinentinformation contained in the original Technical Bulletin 1037.

Problem:There have been a few instances reported in the field, where the clamp station timing belt (P/N603449) on the Orthodyne leadframe handler has failed prematurely.

Solution:We discovered that the timing belt quality did not meet our specifications. We have changedto a higher quality timing belt. The differences between the two belts are:

• Old belt - made of Kevlar with urethane. (Color is gray.)

• New belt - made of neoprene with fiberglass. (Color is black.)

The new clamp station timing belt has the same part number 603449. The new style belt isblack, while the old style belt is gray. Orthodyne will replace the old style belt free ofcharge. Please contact us to receive the new style belt replacements. Kindly give us theserial number of the bonder(s) requiring a replacement belt.

If your machine is using the old style belt, please inspect it for any signs of damage.

To inspect the belt, remove the front left cover of the indexer station. Using a flashlight,carefully inspect the clamp station timing belt for any missing teeth or cracks anywhere onthe belt. If any such signs are observed, please replace the belt with a new style beltimmediately.

Storage and Handling the Belt. Care should be taken in storing and handling the newmaterial belt not to kink or crush it. Doing so could break the fiberglass fibers in the belt andreduce its life expectancy.

MARCH 4, 1996

Page 2 of 2

NOTE: If you have not been factory trained on removing the clamp station, do not performthis replacement! Please contact either Orthodyne or your local representative forassistance.

CPU COMPATIBILITY 1

8/19/96

TECHNICAL BULLETIN

APPROVAL SHEET

No.: 1040 Resp. Engineer


Subject: CPU Board Replacement forModel 360C family

Mktg. Approval


DrawingNo.:


PreparedBy:

George Ritsi

Purpose:

CPU Board replacement requires compatible Rev levels on Frame Grabber and I/O boards for timingcompatibility. This Tech Bulletin provides a matrix of compatible combinations. Alerts users and Reps toprovide Orthodyne with specified VME board part numbers when requesting replacement CPU.

Applicable:

Model 360C, and Model 360C-H/C-HD

Summary:

Inform users and Representatives of background on CPU replacements, and required Revision letter ofFrame Grabber board and I/O board. Emphasizes need to use part numbers from boards in the machinewhen requesting replacements to assure compatibility.

TECHNICAL BULLETIN 1040 August 13, 1996

CPU COMPATIBILITY 1 of 2

TECHNICAL BULLETIN No. 1040

Replacement of CPU Boards.

ApplicableModel 360C, Model 360C-H/C-HD

PurposeCPU Board replacement requires compatible Revision Numbers on Frame Grabber and I/O boards.This Tech Bulletin provides a matrix of compatible combinations, and alerts users andRepresentatives to provide Orthodyne with specified VME board part numbers when requestingreplacement CPU’s.

BackgroundOrthodyne and its CPU board suppliers have made improvements to the boards over a period of timeto improve performance, provide additional functionality, and correct problems reported from thefield. Introduction of redesigned boards into our Model 360 family of wirebonders have, at times,necessitated modifications to other boards to maintain correct timing interfaces. Therefore, not allCPU boards are interchangeable in all machines.

Because of the large number of Model 360 machines installed in industry, it is no longer possible toorder a replacement “CPU” board by name only. Requests for a board replacement requires completePART NUMBER information of the other boards in the machine to assure the correct parts aresupplied.

If a particular CPU part number is no longer in stock, or has been upgraded to a different partnumber, Orthodyne will provide the replacement CPU along with any required adapters and cables.

CPU Compatibility MatrixThe Table below lists the Model 360C’s along with the CPU part number, and the part numbers ofcompatible I/O and Frame Grabber boards.

The Table shows two possible configurations for Model 360C CPU replacement. The first possibilityis a replacement of a Themis board with the same part number. This is a straight-forwardreplacement. The second possibility is the replacement of a Themis CPU with a board manufacturedby General Micro Systems (GMS). Orthodyne has qualified GMS to supply CPU boards to assurebetter availability of components to meet our production demands. The GMS board requires amodification to the Frame Grabber, and some cabling changes. Orthodyne will supply the necessarycomponents as part of a replacement kit. There will be no extra charge for the kit.

NOTE: Upgrades can only be done to boards whose Revision Numbers are included in the chart onthe next page.

If the I/O or Frame Grabber boards are a lower Revision Number than shown in the chart, theywill have to be replaced -- contact your local Orthodyne Representative for board availability.

TECHNICAL BULLETIN 1040 August 13, 1996

CPU COMPATIBILITY 2 of 2

Model 360C-H or Model 360C-H/D are identical to the Model 360C for CPU replacement.

Compatibility Matrix

ModelNo.

CPUPart No.(original)

CPUPart No.(replace)

Install.Dwg. No.

FrameGrabberPart No.

Rev I/O BoardPart No.

Rev SoftwareVersion

360C360C-H360C-HD

Themis172502

GMS172543

172425 171507Remove ICU62-replacewith Adapter

M orhigher

172532 J orhigher

5.3 orgreater

end.

1

11/23/99

TECHNICAL BULLETIN

APPROVAL SHEET

No.: 1042A Resp. Engineer


Subject: CPU Board Replacement forModel 360A with new PR, andModel 360B

Mktg. Approval


DrawingNo.:

171555 Rev D Tech. PublicationApproval

PreparedBy:

George Ritsi

Revision A:

This revision makes a change to the compatibility matrix Table shown on page 2.

WAS: DSP board P/N 171562 (any Rev.).

IS: DSP board P/N 171562 (must be Rev. E or higher).

Purpose:

CPU Board replacement requires compatible Rev levels on Frame Grabber and DSP boards for timingcompatibility. This Tech Bulletin provides a matrix of compatible combinations. Alerts users and Reps toprovide Orthodyne with specified VME board part numbers when requesting replacement CPU.

Applicable:

Model 360A (with new PR), and Model 360B

Summary:

Inform users and Representatives of background on CPU replacements, and required Revision letter ofFrame Grabber board and DSP board. Emphasizes need to use part numbers from boards in the machinewhen requesting replacements to assure compatibility.

Added note that if Rev # on board is lower than shown in table, board must be replaced.

Added note that DSP # 171512 must be replaced with P/N 171562.

TECHNICAL BULLETIN 1042A May 20, 1997

1 of 2

TECHNICAL BULLETIN No. 1042A

Replacement of CPU Boards.

Revision AThe Revision to this Technical Bulletin is issued to note a change in the Compatibility table on page 2.The “new” Themis board is compatible with DSP boards having Revision E or higher. The previousTechnical Bulletin indicated that the new Themis board (P/N 171555-98) was compatible with all Rev.DSP boards. This statement was incorrect.

ApplicableModel 360A with new PR, and Model 360B

Drawing Number171555, Rev D

PurposeCPU Board replacement requires compatible Revision Numbers on Frame Grabber and DSP boards.This Tech Bulletin provides a matrix of compatible combinations, and alerts users andRepresentatives to provide Orthodyne with specified VME board part numbers when requestingreplacement CPU’s.

BackgroundThe vendor of the CPU redesigned the board. We discovered that the redesigned board can causesome bus timing changes. This, in turn, caused a change in compatibility between the CPU, the DSP,and the Frame Grabber boards. Consequently, not all CPU boards are interchangeable in allmachines.

Because of the large number of Model 360 machines in the field, it is no longer possible to order areplacement “CPU” board by name only. Requests for a board replacement requires complete PARTNUMBER information of the other boards in the machine to assure the correct parts are supplied.

If a particular CPU part number is no longer in stock, or has been upgraded to a different partnumber, Orthodyne will provide the replacement CPU along with any required adapters and cables.

CPU Compatibility MatrixThe Table below lists the applicable Model 360’s, along with the CPU part number and the partnumbers of compatible DSP and Frame Grabber boards.

NOTE: Upgrades can only be done to boards whose Revision Numbers are included in the chart onthe next page.

If the Frame Grabber boards are a lower Revision Number than shown in the chart, they will have tobe replaced -- contact your local Orthodyne Representative for board availability.

If your machine has a DSP board P/N 171512, it must be replaced with P/N 171562.

TECHNICAL BULLETIN 1042A May 20, 1997

2 of 2

Compatibility Matrix

ModelNo.

CPUPart No.(original)

CPUPart No.(replace)

Install.Dwg. No.

FrameGrabberPart No.

Rev DSPBoardPart No.

Rev SoftwareVersion

360A withnew PR.

360B

Themis171502-1

“new”Themis171555-98

171555 171507Remove ICU62-replacewith Adapter

M orhigher

171562 Revision Eor higher

4.09 orgreater

end.

July 22, 1996

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET

No.: 1045 Rev: A Prepared By:George Ritsi

Subject: Wyse Terminal Set up. Resp. Engineer:

Drawing

No.:

V.P. Engineering:

“Bob” Babayan

Part No.: 639055 V.P. Marketing:

Bill Larkin

Models: All model 360’s with Wyseterminal.

Tech. Publication:

George Ritsi

Revision:

Remove STATUS LINE field to simplify the procedure.

Problem:

Under certain circumstances it is possible to lose the set up on the Wyse monitor. Loss of set up willresult in strange characters on the terminal, or no screens at all. This technical bulletin supplies theprocedure for re-installing the set up.

Applicable:

All Models with Wyse terminal

Summary:

Defines the set up procedure.

July 22 1996

WYSE TERMINAL SET UP PAGE 1 of 1


Wyse Terminal Set Up Procedure

ApplicableAll Model 360C’s with Wyse 160 terminal.

Revision ARevision A removes the STATUS LINE field instruction to simplify the procedure.

PurposeThis Technical Bulletin describes the procedure to re-establish the Wyse terminal set up on yourModel 360 wirebonder.

ProblemIf the Terminal does not respond correctly to keyboard commands, if the screen goes blank, or if theterminal displays strange characters, it may be that the set up was lost from memory. The proceduredescribed below will re-establish the Wyse 160 terminal set up.

Procedure1. Press the SETUP key on the keyboard (located on the top, right end of the row of function keys),

then press ENTER key (located by the number pad). This will load the default values of allsettings between the keyboard and the terminal. Next, it is necessary to change some of theparameters in selection fields for compatibility with the OE software.

2. Press !. This will bring up a screen with a number of fields.Use the arrow keys to move the cursor to the desired field.Use the space bar to toggle the value in the field.

3. Use the arrow keys to go to the field entitled DATA LINES. Use the space bar to change thevalue in the field to “25”.

4. Go to the field entitled DISPLAY CURSOR. Use the space bar to toggle the field to “OFF”.

5. Press #. This will bring up a screen with another set of fields.

6. Use the arrow keys to go to the field entitled KEYCLICK, and use the space bar to toggle to“OFF”.

7. Press %. Use the arrow keys to go to the field entitled SER 1 BAUD RATE, and use thespace bar until the field shows the number “38400”.

8. Press =. Press the space bar to toggle SAVE to “YES”, then press = again. This will saveyour selections.

9. Turn the power OFF. Wait 30 seconds and turn the power back on. The Wyse terminal will nowhave the settings required by Orthodyne software.

March 28, 1996

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET


Subject: Pull Tester Hook Reference Resp. Engineer:

DrawingNo.:

V.P. Engineering:

“Bob” Babayan

PartNo.:

174076-x V.P. Marketing:

Bill Larkin

Models: 360C-H/C-HD with pulltesters. Tech. Publication:

George Ritsi

Purpose:

The purpose of this Technical Bulletin is to provide users with a reference for selection criteria forhooks for the pulltester, and part number information for ordering replacements.

Applicable:

Model 360C-H/C-HD with pulltesters.

Summary:

March 28, 1996

PULLTESTER HOOK REFERENCE Page 1 of 2

TECHNICAL BULLETIN No. 1046 Rev.

Pulltester Hook Reference Guide

ApplicableModel 360C-H/C-HD with pulltesters.

PurposeThis Technical Bulletin provides reference information for selecting and ordering hooks for thepulltester. Questions from our users indicated the need for additional information on how to selectpulltester hooks for use with various size wires, and information for ordering hooks from Orthodyne.

DiscussionTable 1, shows hooks available from Orthodyne for the Pulltester. The table identifies the Orthodynehook part number, the typical type of leadframe, the range of pull force the hook can withstand, andthe tip length.

Table 1. Pulltest Hook Reference Information

Item Hook P/N Frame Type Pull Force Tip Length

1 174076-1 Dpak 0-45 g 3.5 mm

2 174076-2 TO-3P, TO-220 0-190 g 4.0 mm

3 174076-3 TO-3P, TO-220 0-500 g 4.5 mm

4 174076-4 TO-3P, TO-220 0-190 g 2.5 mm tapered

5 174076-5 Dpak 0-45 g 2.5 mm

6 174076-6 TO-3P, TO-220 0-190 g 2.5 mm

Items -2 and -6 are identical except for hook tip length. The -6 is shorter. Similarly, items -1 and -5are the same except the -5 is shorter. Item -4, with the tapered hook tip was designed for insertioninto very low loop-height applications for larger wire sizes (higher non-destructive pull forcesallowed; not recommended for use on Dpak).

Hooks are not limited to the type of leadframe shown in the table. These are typical leadframeapplications. Consult your Orthodyne Representative, Sales or Service Engineer for hookrecommendations for different applications.

March 28, 1996

PULLTESTER HOOK REFERENCE Page 2 of 2

The best pulltester hook for pulltesting 20 mil wire is the 174076-3,which has a tip thickness of 0.57/0.62 mm. This hook is the only one strong enough to withstand thehigh non-destructive pull forces for 20 mil wire. A word of caution: if the package loop height is toolow, then inserting this thicker hook under the wire can be difficult without damaging the die; if thenon-destructive pull test is approximately 1/3 to 1/2 the wire tensile strength, then the hook will liftor “set” the wire loop. Also, using this high a pull force could lift the wire above the customer’smaximum loop height specification.

Short Hook Tip Length vs. Standard Hook Tip Length.

A short hook tip length is less likely to accidentally contact an adjacent wire at the end of thehorizontal travel of the pulltester arm (2 mm). Shorter hook tip lengths are likely to have longerlifespans because of smaller cantilever loads. However, short length hooks may have problems if thedie attach placement is not consistent, causing wire placement to move (left & right). This couldcause the hook to miss the loop during its vertical travel.

Pulltest Set Up

When setting up the pulltester arm, pulltest the wire near the center of the hook, not near the tip end.Pulltesting the wire near the center of the hook tip will maximize hook lifespan.

NOTE: As the non-destructive pull force increases, the hook lifespan decreases.

April 25, 1996

FILTER BLOCK INSTALLATION Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET


Subject: Installation of electrical filtercapacitors in fan motor circuit.

Resp. Engineer:

DrawingNo.:

V.P. Engineering:

“Bob” Babayan

PartNo.:

V.P. Marketing:

Bill Larkin

Models: All model 360’s. Tech. Publication:

George Ritsi

Purpose:

The purpose of this Technical Bulletin is to show users where and how to install filter capacitors forthe fan motor circuit.

Applicable:

All Model 360C’s.

Summary:

A problem was observed where the crosshair appears to be jumping on the video monitor. Theproblem was traced to noise coming from the fans under the VME card cage. The problem seemedmore pronounced with machines that used fans from Nidec, in place of the discontinued Interfan fans.Thus the problem is less likely to show up on older machines (with the Interfan fans). It is also lesssevere on machines with Power One supplies because Power One supplies have better output filtersthan Astec supplies.

The fix is to install filter capacitors to the fan motor circuit.

April 25, 1996



Fan Electrical Filter Installation

ApplicableAll Model 360C’s (shipped prior to April 1996)

Part Number:P/N 172822 filters (three required per machine -- a Model 360C-HD requires six filters).

P/N 618703 Cable clips (two required per machine -- a Model 360C-HD requires four clips)

PurposeThis Technical Bulletin provides installation instructions for the electrical filter in the 12 V supplyfor the fans.

ProblemA problem was observed where the crosshair appears to be jumping on the video monitor. Theproblem was traced to noise coming from the fans under the VME card cage. The problem seemsmore pronounced with machines that use Nidec fans, in place of the discontinued Interfan fans. Thusthe problem is less likely to show up on older machines (with the Interfan fans).

SolutionOrthodyne has made available a kit with an electrical filter, to be placed in series with the 12 Vsupply for the fans, that reduces the noise introduced by the fans. This will eliminate the jumping ofthe video crosshairs.

InstallationInstallation of the filters occurs in two locations on a single Model 360C, and in four locations on aModel 360C-HD. The installation instructions will show how to install the filter kits for both types ofmachines. The illustrations show a Model 360C-HD, however, specific instructions for a Model360C will be made clear in the text.

1. The filters (P/N 172822) are supplied with double-back tape on the back of each unit (see Figure 1).Do not remove the protective layer on the tape until you are ready to attach the filters.


3. Open the VME drawer. You will need access to the back of the VME cage to unscrew the fantray on the bottom of the cage (see Figure 2).

NOTE: Filter installation on the VME fan tray is same for M360C, M360C-H,and M360C-HD

April 25, 1996


Figure 1. Filter blocks are supplied withdouble-back tape applied

4. The fan tray is held into the VME cage with two screws, one on either end of the tray. Removethe screws and pull out the tray carefully, until there is enough clearance to turn the tray upside-down. Rest the tray on the drawer slide (see Figure 3). There is enough slack in the wires toallow this move. Figure 4 shows the fan connections before installing the filters.

Figure 3. Turn Fan Tray Upside-Down

5. Disconnect the fan connectors shown in Figure 4, and clean the area with a cotton swab andacetone.

6. Place a filter block in position as shown in Figure 5 and connect the leads from the filter block tothe fan connectors. This step will assure that the male and female connectors are closest to eachother. For convenience, you can unplug the connectors before attaching the filter block, takingcare not to change the orientation of the filter block.

7. Remove the protective layer from the double-tape on the bottom of a filter block and press it inplace as shown in Figure 5. The block should be about one index-finger width from the fan andfrom the back wall of the fan tray.

Figure 2. Open VME Cage to AccessFan Tray

Fan Tray

Figure 4. Close-up Showing FanConnections Before InstallingFilters

April 25, 1996


Figure 5. Position the First Filter Block

8. Place the second filter block on the Fan Tray so that it is behind the notch on the plate (see Figure 6).Leave enough clearance between the block and the rear fan tray wall to place the wires andconnectors. Make sure the correct cable connectors are close together.

HINT: Plug in the connectors before attaching the filter block permanently to the Fan Tray tomake sure the wires will fit.

9. After the filter blocks are firmly attached to the fan tray, attach cable clips to hold the wires inplace as shown in Figure 7. One cable clip goes on the near side of the fan tray, and another goesbehind the filter blocks.

10. Power up the machine and check to see that the fans work.

11. Power down the machine, flip the Fan Tray over and reinstall in the VME card cage with the twoscrews removed in step 4. Figure 8 shows the Fan Tray back in position. Close the VME cabinet.

12. The third filter block is installed in the right side of the X-Y cabinet of the bonder. Push the bondhead all the way left to give clearance. Remove the cover plate and fold back the right bellows(Figure 9). The figure shows the output side of an M360C-HD.

Figure 6. The Second Filter BlockPosition Behind the Notch

Figure 7. Completed Installation onFan Tray

Figure 8. Fan Tray Reinstalled inVME Cage

April 25, 1996


13. Unscrew the motor drive card cage mounting screws. Turn motor drive card cage as shown inFigure 10. Unplug fan from the in-line connector. Clean the plate with a cotton swab and acetone.

14. Attach the third filter block as shown in Figure 11. Connect the filter to the fan connector and thein-line connector. Power up the machine to check for proper operation of the fan.


16. Reinstall the motor drive card cage, reattach the bellows and replace the cover.

14. The installation of the fan filters for the input side of the Model 360C-HD are almost identical tothe steps above. The lower two filter blocks are installed under the fan tray in the VME cardcage. The upper filter block for the input side is installed in the rear of the X-Y housing(Figure 12).

Figure 11. Output Side Upper FilterBlock Installed in Model360C-HD

Figure 12. Input Side Location forthe Upper Filter Block onthe Model 360C-HD withCover Removed.

Figure 9. Remove Cover Plate andUnscrew Motor Card Cage

Figure 10. Turn Card Cagecounter clockwise toaccess left side plate

Motorcardcage

April 25, 1996


18. Figure 13 shows the filter block installed inthe X-Y Table cabinet. Note that the filteris attached to the base of the X Y casting.Clean the area with a cotton swab andacetone before attaching the filter block.

19. Connect the filter to the fan connector andthe in-line connector.

20. Power up the machine and test that the fanis operating properly.

21. Re-attach the back plate of the X-Y Tablecabinet.

NOTE: Figure 13 is the same for the upper filter block installation for a single Model 360C.

Figure 13. Completed Installation ofUpper Filter Block on InputMachine

June 6, 1996

SOLDERING FLUORESCENT BULBS Page 1 of 4


Soldering Fluorescent Bulbs

ApplicableModel 360’s with the fluorescent light option.

ProblemRecent failures of the optional fluorescent fixtures have been traced to intermittent contact in the springsocket that connects the bulbs to the board. Carbon build-up and slag due to vibration induced arcing in thesocket can develop over a period of time, which is thought to be the problem. In some cases of non-functioning fluorescent bulbs, we observed a fine carbon powder around the bulb contact.

SolutionIf you experience the problem of the fluorescent bulbs flickering, or not functioning, the solution to theproblem is to solder the fluorescent bulbs to the connectors on the board. At Orthodyne, we are nowusing the soldering procedure for assembling the fluorescent light fixture option.

ProcedureWe recommend you remove the fluorescent fixture from the bond head so you can solder theconnections on a workbench with a small vise.


2. Remove the protective cover of the fluorescent fixture by taking off the Phillips head screws.Unplug the cable and remove the light fixture from the hinge bracket.

3. Place the light fixture board in a small vise and examine the bulb contacts (see Figure 1). Cleanany black residue around the contacts. If black residue is severe, remove the bulbs and clean (seenext section).

Bulb Contacts

Bulb Contacts

Figure 1. Examine theBulb Contacts

June 6, 1996


4. Using a “no clean” solder and a small soldering iron, flow some solder between the bulb lead andthe inside of the socket. See Figure 2.

Figure 2. Soldering the Bulb on the Board.

To Remove Bulb and Socket

This section covers the situation where the bulbs are not yet soldered into the board, and you want toremove them for cleaning the leads and the sockets. A later section will discuss how to change a lightbulb after they are soldered.

1. Figure 3 shows the fixture (covers removed) held in a vice. Carefully unscrew the supportingbracket holding the bulbs to the board. The bulbs are electrically connected to the board byspring-loaded contacts inside the board socket. Hold the bulb at each end and gently pry the bulbout of the board socket.

Figure 3. Remove Lamp Support Bracket

2. Clean the bulb wires, and clean the board sockets.

3. Re-insert the fluorescent bulbs into the board sockets.

4. Attach the bulb support brackets and solder the leads as in step 4 in the Procedure section above.

June 6, 1996


To Unsolder and Replace a Bulb and Socket.

This section covers the situation where the bulbs are already soldered into the board sockets, and youwant to remove them. This situation may occur if a bulb is burned out and needs to be replaced.Because of the orientation of the socket in the board, it will be necessary to unsolder both the socketsand the bulb leads (see Figure 4).

Figure 4. Orientation of Socket and Lead in Board

Whether or not the bulb is intended to be resoldered into the board, do not reuse the socket. You willfind it difficult to remove the solder from the interior of the socket which will make it difficult toinsert the bulb lead. When ordering replacement bulbs, P/N 725015 also order replacement bulbsockets, P/N 742026 (six required per fixture assembly).

1. Support the light fixture board as shown in Figure 5, and use a small iron on the side of the boardopposite the bulb to heat the solder from the board socket while applying gentle upward pressureon the bulb. The bulb and bulb socket should come away from the board.

solbulb

Figure 5. Unsoldering the Socket and Lamp Lead from the Board

2. Use a solder wick to clean up solder from the connector hole in the board (see Figure 6).

3. Heat-to-remove and discard the socket from the lamp lead (if you intend to reuse the lamp).

4. Insert a new socket on each bulb lead with the socket flange closest to the bulb.

5. Insert the bulb (with sockets attached to the leads) into the board.

Soldering Iron

Socket

Fluorescent BulbLead

Solder Fillet

Boot

June 6, 1996


wicka

Figure 6. Remove Excess Solder from Hole with Wick

6. Attach the bulb support bracket to hold the bulb (and socket) in place.

7. Flip the board over and apply a “no clean” solder fillet with a small soldering iron around thesocket and in the center of each bulb connector (see Figure 7).

solbub3a

Figure 7. Solder New Socket and Lead into Board

8. Reassemble the light fixture and install on the bond head hinge bracket. Connect the light fixturecable.


END.

August 7, 1996

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET


Subject: Replace U19 chip on I/O board Resp. Engineer:

DrawingNo.:

172532 V.P. Engineering:

“Bob” Babayan

PartNo.:

172442-99 & 720065 V.P. Marketing:

Bill Larkin

Models: Model 360C’s Tech. Publication:

George Ritsi

Purpose:

The purpose of this Technical Bulletin is describe a procedure to retrofit a new U19 chip on the I/Oboard.

Applicable:

All Model 360C’s.

Summary:

A number of failures in the field were traced to the forcer control IC (U19) on the I/O board.Engineering study of the problem indicates the problem to be related to the Astec power supply.Apparently the power-up sequence in this power supply can adversely affect the U19 chip, causing itto fail (or become substandard). A new adapter socket for U19 has been designed to protect the chip.

This Technical Bulletin covers the retrofit of the new U19 chip in the field. All machines will get theretrofit regardless of which power supply the machine was built with.

Revision A

Adds the replacement of the U20 chip.

August 7, 1996

RETROFITTING U19 Page 1 of 2


Replacing U19 on the I/O Board

ApplicableModel 360C’s.

Part NumberP/N 172442 (Kit part number - includes drawing)

ProblemProblems related to Forcer malfunctions were reported from the field. Engineering analysis traced thefailure mode to the power-up sequence on the power supply. The problem was more pronounced with theAstec power supply, but also exists with the Power One power supply. The power-up sequence coulddamage the U19 chip that contains the Forcer values. This, in turn, can cause the machine to lose forcercalibration or make it difficult to achieve calibration. The Power One power supply can cause a soft failureof U19 which shows up as a drift in Forcer calibration with time.

SolutionOrthodyne has designed a new adapter socket for U19 with protective circuit components built in toprotect against slight irregularities in the power-up sequence. The retrofit socket with a new U19 IC willbe supplied to all 360C machines.

ProcedurePower down the machine.

1. Open the VME card cage and remove the I/O board.

2. Remove the U20 IC located on the lower right corner of the I/O board (see Figure 1) and replacewith the new U20 IC (P/N 720065). The purpose of replacing the U20 voltage buffer is to reducethe offset to assure good performance from U19.

3. Remove the U19 IC located on the lower right corner of the I/O board (see Figure 1).

4. Replace it with the new U19 IC and adapter socket supplied by Orthodyne.

5. Replace the I/O board in the VME card cage and close the cage.


7. Perform a Forcer Calibration (see User’s Manual, Section 5, page 5-76). Repeat the ForcerCalibration at least three times.

8. Check the Force values at the midpoints between the Calibration values (type in the desired forcevalue on the screen and press F14). These values should fall within the specification range of:

Force less than 175 gm..........................+/- 5 gm

Force greater than 175 gm.....................+/- 3%

August 7, 1996

RETROFITTING U19 Page 2 of 2

If the force values measured in Step 8 do not fall within the specification range, it is possible that thenew U19 IC does not fall within the offset window of the board. If this is the case, then do thefollowing:

1. Remove just the U19 IC from the new socket and replace it with a different U19. (Try the oldU19 IC.)

2. Rerun the Forcer Calibration as in steps 7 and 8 above.

Figure 1. Location of U19 and U20

Front Panel

I/O BoardP/N 172532

U19 and SocketLocationP/N 172442-99

U20 LocationP/N 720065

01/17/2000

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET

No.: 1054 Rev: Prepared By: George Ritsi

Subject: Pulltester Home Control Resp. Engineer:

DrawingNo.:


“Bob” Babayan

PartNo.:

738596 (Resistor R5) V.P. Marketing:

Bill Larkin

Models: Model 360CH/CHD Tech. Publication:

George Ritsi

Purpose:

The purpose of this Technical Bulletin is to address the problem of pulltester motor overshooting thehome sensor, causing it to run continuously or give an error message “Pulltester not home - press anykey to try again”.

Applicable:

Model 360CH/CHD

Summary:

Some pulltesters have been seen to overshoot the home sensor which results in the motor runningcontinuously, until the CPU reaches a time-out condition.

The fix is to remove one resistor in the motor ramp-down circuit which causes the motor to slowdown faster. This will also affect the motor speed so a readjustment of motor speed setting is required.

Reference for this Tech Bulletin is ECN 7292.

9/06/96

PULLTESTER HOME CONTROL Page 1 of 4


Pulltester Home Control

ApplicableModel 360CH/CHD

Part NumberP/N 174507

Assembly Drawing174507

ProblemSome pulltester motors have been seen to run continuously until a time-out condition is reached, followedby an error signal that says “Pulltester not home - press any key to try again”. It was determined that theproblem was caused when the motor overshoots the home sensor. The problem was traced to a ramp circuitthat slows the motor down gradually to reach the home position. Due to some component tolerances, themotor sometimes does not slow down fast enough and may overshoot the sensor window. The CPU willthen keep trying to find home until it reaches the time-out limit.

SolutionA minor circuit adjustment is made to reduce the time taken to stop the pulltester motor so it will notovershoot the sensor window. The fix is to remove a resistor from the pulltester control board, thenreadjust the motor speed.

Procedure1. Power down the bonder.

2. Open the transport handler covers to gain access to circuit board assembly 174507, located at theback of the input side of the transport assembly.

3. Detach the bracket holding the pulltester motor control circuit board by removing the three capscrews as shown in Figure 1.

9/06/96


pulsnp1z

Figure 1. Remove the three cap screws holding the pulltester control circuit board bracket.

4. Lift the bracket so you can easily reach the resistor that must be removed (see Figure 2). Becareful when lifting the bracket that you do not snag the large capacitor that is on the bottom ofthe circuit board.

pulsnp2fz

Figure 2. Lift up the bracket holding the pulltester control circuit board.

5. With a small wire cutter, cut out resistor R5. The technician in Figure 3 is pointing to the locationof resistor R5. It is located between potentiometer VR2 and the I/C U2.

Cap screws

9/06/96


pulsnp3z

Figure 3. Remove resistor from location shown by technician.

In order to set the motor speed, it is necessary to cause the motor to spin continuously so you canmeasure the frequency. You can do this by following the procedure below.

1. Remove the connector at the rear of the pulltester as shown in Figure 4. With this connectordetached, you can now power up the machine and cause the pulltester motor to spin for severalcycles (until the CPU time out limit is reached). This will give you enough time to make thefrequency adjustment.

pulsnp5z

Figure 4. Disconnect the connector at the back of the pulltester.

Location ofResistor R5

VR 2

U2

9/06/96


2. To set the motor speed, connect the frequency meter leads to TP6 (ground) and TP7. The locationof the test points are shown by the technician in Figure 5.

pulsnp4z

Figure 5. Attach a frequency meter to test points TP6 and TP7 and adjust pot VR2 to read1000 Hz. while the motor is running


4. From the MAIN MENU of the transport handler, cycle the handler. You will cause the motor tospin several time, and then get an error message “Pulltester not home. Press any key to retry”.

5. Adjust VR2 until the frequency meter reads 1000 Hz. while pressing any key to make the motorspin.

6. When finished, power down the machine and reassemble the pulltester control board bracket,reattach the pulltester connector, and replace all covers.

Two Pulltesters. If your machine is equipped with two pulltesters, then it will be necessary to repeatthe procedure for the second pulltestor control board. The second pulltester control board is locatednext to the first board on the pulltester motor control board bracket.

Follow the same procedure to remove resistor R5 from the second board as outlined above.

Adjust the motor speed of the second pulltester motor using the same steps as for the first motor,except only disconnect the sensor cable from the second pulltester to make that motor spincontinuously. When adjusting the second motor speed, the sensor cable for the first motor should beconnected.

The modification is now complete and you may proceed to power up the machine for normaloperation.

Test pointTP6 (ground)

Test pointTP7

05/21/97 3:37 PM

LED BOARD AND FOCUS SENSOR BOARD ALIGNMENT Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET

No.: 1055 Rev: Prepared By: Randall Maynard

Subject: LED Board and Focus SensorBoard Alignment

Resp. Engineer:

Drawing

No.:


“Bob” Babayan

PartNo.:

172010-99 V.P. Marketing:

Bill Larkin

Models: All Model 360C and Model360S family machines

Tech. Publication:

George Ritsi

Purpose

The purpose of this Technical Bulletin is to describe the procedure for replacing and aligning the LEDboard and focus sensor board assembly for the camera focus control.

Applicable

All Model 360C and Model 360S family machines

Summary

When a customer replaces an LED board and focus sensor board assembly (P/N 172010-99) in the field,the boards must be aligned correctly when installed. Technical Bulletin TB1055 provides the properprocedure to install and align the LED board and focus sensor board assembly.

5/21/97



LED Board and Focus Sensor Board Alignment

ApplicableAll Model 360C and Model 360S family machines

Part NumberP/N 172010-99


ProblemIf the LED board and focus sensor board assembly (P/N 172010-99) is improperly installed, the camera focussystem will not operate correctly.

Solution

Follow the procedure below to correctly install and align the LED board and focus sensor board assembly.

Procedure1. Power down the bonder.

2. Remove the top cover from the bonder assembly (see Figure 1).

Figure 1: Remove The Top Cover From The Bonder Assembly

Remove Top Cover

5/21/97


3. Disconnect the focus sensor cable (P/N 172613) from J1 on the sensor board (P/N 172539).

4. Remove the LED board and focus sensor board assembly by removing the three screws on the topand side of the sensor board (see Figure 2). Carefully slide the assembly down to remove.

Figure 2: Remove LED Board and Focus Sensor Board Assembly

5. Loosely install the new LED board and focus sensor board assembly using the three screws.

Note: Slide the assembly up into place carefully. The LEDs can be damaged by hitting themon the shutter (P/N 171195).

6. Use two, 1.85mm (.073”) diameter, drill blanks to align the LED board and focus sensor boardassembly with the shutter (see Figure 3). Place the drill blanks in the alignment holes as shown ondrawing 172010 and Figure 3 (note the orientation of the shutter). This will allow you to hold theLED board and focus sensor board assembly in place while tightening the three screws. Check thatthe drill blanks are free to move in and out of the holes. If the drill blanks bind, loosen the threemounting screws to make adjustment and re-tighten the screws.

Note: You may substitute a twist drill for a drill blank. Use the correct diameter, but be sureto insert the twist drill into the alignment holes shank first (as shown below). Do notinsert twist drill point first.

Remove Three Screws

Alignment Hole In LED Board

5/21/97


Figure 3: Align LED Board and Focus Sensor Board Assembly With Shutter

7. Connect the focus sensor cable (P/N 1726130) to J1 on the sensor board.

8. Replace the top cover on the bonder assembly.


Insert Drill Blanks To Align Assembly

Adjust Alignment WithThese Three Screws

5/29/97

Page 1 of 1

TECHNICAL BULLETINAPPROVAL SHEET


Subject: Spool Driver Speed Adjustment Resp. Engineer: Tom Nguyen

Drawing

No.:

172827Spool Driver PCB Assembly

V.P. Engineering:

“Bob” Babayan

PartNo.:

172827Spool Driver PCB Assembly

V.P. Marketing:

Bill Larkin

Models: All Model 360C family machines Tech. Publication:

George Ritsi

Purpose:

The purpose of Technical Bulletin 1056 is to describe the procedure for adjusting the frequency on thenew spool driver circuit board (P/N 172827).

Applicable:

All Model 360C family machines

Summary:

The new spool driver board features a time-out of 400 msec to prevent the excess feeding of wire in caseof a malfunction. After installing the new board, the spool driver frequency setting must be adjusted.

5/29/97

SPOOL DRIVER SPEED ADJUSTMENT Page 1 of 3


Spool Driver Speed Adjustment Procedure

Applicable

All Model 360C family machines

Part Number

P/N 172827 (Spool Driver PCB Assembly)

Assembly Drawing

172827 (Spool Driver PCB Assembly)

Problem

A problem was encountered in the field where some machines would get stuck on wire feed and de-spool anentire wire spool. The problem is intermittent, and only seems to affect certain machines, and certain types ofwire and sizes.

Solution

No clear cause could be found that was at the root of the observed problem. A work-around solution wasdevised where a time-out function was incorporated into the spool driver circuit board. In this manner, if themalfunction were to occur, the time-out would prevent the loss of an entire spool of wire.

Orthodyne supplies the new spool driver board to any customer who has experienced an uncontrolled de-spooling problem with their machine.

This procedure is to adjust the spool driver frequency setting, after changing the board.

Procedure

1. This procedure can be conducted with the power on.

5/29/97


2. Unplug motor cable from J3 on the spool driver board (see Figure 1).

Figure 1: Disconnect Motor Cable From J3

3. Use a mini-jumper to short pin 7 and pin 9 of J4. These pins are side by side in the lower right cornerof J4 (see Figure 2).

Figure 2: Attach Mini-Jumper to Pin 7 And Pin 9 Of J4

Motor Cable

J3

Mini Jumper

5/29/97


4. Attach the probe or live clip of a frequency counter to TP2, using TP1 as ground. Adjust VR1(speed) for a frequency of 1000 Hz.(see Figure 3).

Figure 3: Attach Probes And Adjust Frequency

5. When done, remove the mini-jumper and plug the motor connector on J3.

VR1

TP1 TP2

5/29/97

Page 1 of 1



Subject: Dereeler Op Amp Replacement Resp. Engineer: Tom Nguyen

Drawing

No.:

Wire Sensor Circuit PCB Ass'y

175528-E

V.P. Engineering:

“Bob” Babayan

PartNo.:

Wire Sensor Circuit PCB Ass'y

175528-E

V.P. Marketing:

Bill Larkin

Models: 360S (Small Wire bonder) Tech. Publication:

George Ritsi

Purpose:

The purpose of Technical Bulletin 1057 is to describe the procedure for replacing the Op Amp on theDereeler wire sensor circuit board.

Applicable:

Model 360S

Summary:

The wire sensor sensitivity has a tendency to drift. This could cause problems in feeding the wire.Replacing the existing Op Amp on the wire sensor circuit board with a different Op Amp lessens thedrift. A more permanent solution is under investigation by engineering.

5/29/97

DEREELER OP AMP REPLACEMENT Page 1 of 2


Dereeler Op Amp Replacement Procedure

Applicable

Model 360S.

Part Number

P/N 720086 IC, TLC272 Op Amp

Assembly Drawing

P/N 175528 (Wire Sensor Circuit board assembly).

Problem

Drift of the Wire Sensor sensitivity has been observed by users in the field. The drift causes some problemsin feeding the wire. Replacing the existing Op Amp with a different Op Amp lessens the drift. This is atemporary solution. Engineering is working on a permanent fix to the problem.

Solution

A variety of factors was found to influence the stability of the wire sensor circuit, including temperatureand air flow. While a clear cause and solution has not yet been found, a work-around solution to improvethe stability of the wire sensor was to substitute a different Op Amp. This bulletin covers the procedurefor replacing the existing Op Amp (P/N 720086) with a different Op Amp (P/N 720092).

Procedure


2. Open the Dereeler cover and the wire sensor cover and unthread the wire.

3. Remove the three screws holding the wire sensor circuit assembly to the dereeler housing. (SeeFigure 1).

4. Carefully remove the entire wire sensor assembly until you can reach the circuit board attached tothe back. There is one connector and a small diameter air tube attached to the back of thisassembly.

5. Pry up and remove U1 720086 IC and replace it with U1 720092 IC. (See Figure 2).

5/29/97

DEREELER OP AMP REPLACEMENT Page 2 of 2

6. Replace the Wire Sensor assembly and reattach with the threescrews.

7. Recalibrate the Wire Sensor, per the procedure in the User's Manual, after replacing U1.

8. Power up the machine and rethread the wire. You may now resume operation.

Figure 1. Remove the Wire Sensor Assembly to Replace Op Amp

Figure 2. Component Placement on Wire Sensor Circuit Board

Wire SensorAssembly

Remove ThreeScrews

Wire Sensor Cover Open

Replace U1

01/17/2000

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET


Subject: Replacement of Z/ThetaBearing in the field

Resp. Engineer:

DrawingNo.:

V.P. Engineering: “Bob” Babayan

PartNo.:

172030 V.P. Marketing: Bill Larkin

Models: All Model 360C’s Tech. Publication: George Ritsi

Purpose:

The purpose of this Technical Bulletin is to describe the procedure for replacing a Z/Theta Bearing inthe field.

Applicable:

Model 360C’s

Summary:

A fixture used by manufacturing to determine the bearing preload of the Z-Theta Bearing wasincorrectly calibrated. This caused excessive preloading of the bearing. These Z-Theta Bearingassemblies need immediate replacement. Only Z-Theta Bearings with serial numbers between9607000 to 96010011 need immediate replacement. Approximately 20 bearings are involved, some ofwhich have already been replaced. The rest must be replaced in the field by Field Service personnel.The procedure described has a number of short cuts proved out during factory replacement that shouldspeed the process.

01/17/200001/17/200001/17/2000 01/17/2000

FIELD REPLACEMENT OF Z/THETA BEARING Page 1 of 5


Field Replacement Of Z/Theta Bearing

ApplicableModel 360C’s

Part NumberP/N 172030 (Z/Theta Bearing)


ProblemA recent manufacturing assembly error was discovered that caused the Z/Theta bearing preload to behigher than the specification. No immediate problem is caused by this condition, however, theexcessive preload could cause premature failure of the Z/Theta bearing assembly. This conditionoccurred on only a small number of machines shipped between 9/27/96 to 11/11/96.

SolutionOrthodyne Field Service personnel will replace the Z/Theta bearing assemblies at the customer’s facilitywith correct design specification bearings. The procedure below describes a fast and effective method toperform the Z/Theta bearing replacement.

Procedure

1. Turn off main power switch. Check that the bond head cannot contact any parts during thisprocedure.

2. Place bond head in full up (Z) position.

3. Pull out bonder in the Y-axis so the bond head is closest to you.

4. Remove the left side and front cover from bonder.

5. Loosen the Theta-motor mount to slacken the belt. Remove belt in upward direction.

6. Remove right side cover of bond head.

7. Remove Z-cable from bond head at connector and wire clamp. See Figure 1.

01/17/200001/17/200001/17/2000 01/17/2000


8. Remove bond head.

NOTE: Use caution when removing bond head not to hit it on anything.Otherwise, extensive damage may result.

9. Remove 4” extension spring from pin on the back of Z/Theta bearing. See Figure 2.

Remove wire clip.

Remove spring

Figure 1. Remove connector and wireclamp.

Figure 2. Remove spring from pin.

Remove connector

01/17/200001/17/200001/17/2000 01/17/2000


10. Carefully scribe a line onto the Y-casting, along the left vertical edge of the Z/Theta Bearing toreference the location of the bearing (see Figure 3).

11. Remove (2) screws that connect the Z-band to the Z/Theta Bearing.

12. Remove (2) screws that hold the Wire Feed Tube bracket to the Z/Theta Bearing.

13. Remove (6) screws that hold the Z/Theta Bearing in place and work it down slowly to clear theother components in the area.

NOTE: Use caution when removing the bearing not to hang up on the Z-band orthe Z-cable.

14. Do not remove the Camera/Optic Tube assembly.

15. Remove the Z-home flag from the Z/Theta bearing.

16. Install the Z-home flag on the replacement Z/Theta bearing.

17. Reinstall the Z/Theta bearing and the remaining components in reverse order.

NOTE: When installing the replacement Z/Theta bearing remember to align withthe vertical scribe line. To set the height of the Z/Theta bearing, center thescrew heads in the counter-bores.

Recalibrate the Bond Head as follows:


2. From Main Menu, go to Calibration Menu; go to Offsets. (7,2). Using a pointed tool run anoffset four-pointed pattern. Press F13 to save settings.

Z/Theta bearing.

Y-casting.

Scribe line here.

Figure 3. Z/Theta bearing. Front view.Scribe along right vertical edge ofZ/Theta bearing onto Y- casting.

01/17/200001/17/200001/17/2000 01/17/2000


3. Check that the X-Optical value is between -50 and +50. Adjust the Z/Theta bearing to thesevalues by rotating the Z/Theta bearing assembly either clockwise (CW) or counter-clockwise(CCW). If the value needs to be more negative then rotate the Z/Theta Bearing CCW. If thevalue needs to be more positive then rotate the Z/Theta Bearing CW. See Figure 4.

HINT: To ease adjustment, snug the upper right screw while leaving the other(5) screws slightly loose. Rotate about the upper right screw to achieveadjustment. Snug all screws before doing another offset run. When the propervalue is reached, be sure to tighten all screws.

4. Check the X and Y tool values on the screen. Adjust as needed. Press F13 to save settings. Exit tomain menu.

5. If you needed to adjust the X and Y tool values you must perform an LVDT float test. From MainMenu, go to Diagnostics, to LVDT float test (B,2). Follow instructions on screen, adjust asneeded. Using 0.25mm feeler gauge, check that the forcer is within tolerance (0.25mm ±0.08mm). Adjust as needed.

6. If you needed to adjust the X and Y tool values you must recalibrate the Touch sensor. If not, skipto step 7. From the Main Menu, go to Calibration, to Touch Sensor (7,4). Follow instructions onscreen and press F13 to save settings. Exit to main menu.

7. Recalibrate the Home Offsets. From the Main Menu, go to Calibration, to Recalibrate Home(7,9). Adjust home flags as needed. Exit to main menu.

8. Recalibrate the Limits. From the Main Menu, go to Calibration, to Recalibrate Limits (7,A). It ispossible that the Theta Limit will not be within specification (200 and -200). Adjust as needed.Exit to main menu.

CW

CCW

Figure 4. Adjust position of Z/Thetabearing assembly to the X-Optical valueon the screen.

Rotate about this screw.

01/17/200001/17/200001/17/2000 01/17/2000


9. As with any procedure that would remove the Bond Head, you must recalibrate Z position foreach File/Wire List. From the Main Menu, go to Calibration, to Recalibrate Z (7,8). Press SingleTouch. Press F13 to save settings.

10. If you are using a value for Z programmable home, this value must be reset. From the Main Menu,go to Manual Positioning (4). Using the down arrow, scroll to Z programmable home. Using the Yspinner reset value as needed. Exit to main menu.

01/17/2000

Page 1 of 1

TECHNICAL BULLETIN

FOR INTERNAL USE ONLY

APPROVAL SHEET

No.: 1059 Rev: Prepared By: Luc Van Maldren

Subject: Wyse 160 Data Terminal/Keyboard Compatibility

Resp. Engineer:

DrawingNo.:


PartNo.:

639055 (terminal)749102 (keyboard)

V.P. Marketing: Bill Larkin


Purpose:

This bulletin corrects a compatibility issue between the Wyse 160 Data Terminal and the Keyboard,manufactured after a certain date.

Applicable:

Model 360C’s

Summary:

The Wyse Data Terminal, Model 160, was redesigned and released into production September 1994.They also redesigned their ASCII Keyboard which began shipping several months ago. Thecombination of these two components may have a compatibility problem caused by a ringing on thesignal lines between the Data Terminal and the Keyboard.

Not all Data Terminals/Keyboards have this problem. The bulletin defines how to identify the suspectkeyboards.

The solution is to change out the keyboard.

01/17/200001/17/200001/17/2000 01/17/2000

WYSE DATA TERMINAL/KEYBOARD INCOMPATIBILITY Page 1 of 2


Compatibility Issue Between Wyse Data Terminal and Keyboard

ObjectiveThere is a potential incompatibility between some Wyse Data Terminals and Keyboards. This bulletinidentifies which combination Data Terminal/Keyboard may be affected, the symptoms of the problemand the solution.

ApplicableModel 360C’s

Part Number639055 (terminal)749102 (keyboard)

ProblemRinging on the signal lines between the Wyse Model 160 Data Terminal and the ASCII Keyboard oncertain revision combinations can cause the terminal to recognize different characters than those sentby the keyboard. If this occurs, a problem may show up as:

• Pressing SHIFT-1 may produce SHIFT-2 results on the Data Terminal.

• Pressing SHIFT-∧ and/ or SHIFT-∨ (changing cut depth) may not work properly.

• The keyboard may not work at all.

If any of these problems occur, check the revision letter of the keyboard to determine if it fits theproblem category.

Suspect Problem Keyboards: All keyboards carrying Revision F on Model 360C’s manufacturedprior to July 1996.

EffectivityNot all Data Terminal/Keyboard combinations have this problem. The following keyboards ARE NOTaffected:

• Wyse Data Terminals manufactured prior to September 1994. (See Note below to determinemanufacture date.)

• All Keyboards carrying Revision E or earlier.

• All Keyboards carrying Revision F with Keyboard adapter (Wyse P/N 920151-01) installedbetween the keyboard and the Data Terminal.

01/17/200001/17/200001/17/2000 01/17/2000

WYSE DATA TERMINAL/KEYBOARD INCOMPATIBILITY Page 2 of 2

• All keyboards carrying Revision F with label: FEB-477 added next to the Revision F label.

• All keyboards carrying Revision F on Model 360C’s manufactured after July 1996.

SolutionReplace the Keyboard with the proper Revision Letter and effectivity date.

Procedure

NOTE: How to recognize the manufacture date of your Wyse Data Terminal:

The Serial Number Name Tag is located on the back of the Data Terminal. The manufacturedate may be stamped on the Name Tag. If not, the manufacture date is embedded in theSerial Number

Serial Number: xxxxYMxxxx where:Year = (1-9)Month = (1-9, A, B, C).

For example, the serial number of a Data Terminal manufactured in September, 1995 mightlook like:

Serial Number: 1234594444Similarly, a Data Terminal manufactured in November, 1995 might appear as:

Serial Number: 12345B4444

1. Determine the Revision Letter of your keyboard. Find the Revision Letter by opening the raiserflap on the bottom of the keyboard.

2. Compare the Revision Letter and the manufacture date to the exclusion list shown in theEffectivity section.

3. If the Data Terminal/Keyboard is showing the problems described and the keyboard Revisionletter and manufacture date fall into the problem category, Orthodyne will provide you with areplacement keyboard at no cost.

4. If the Data Terminal/ Keyboard is showing a problem but the keyboard Revision letter andmanufacture date fall into the exclusion category (see Effectivity section), then the problem mayhave another source. Contact your Orthodyne representative for troubleshooting assistance.

1995 November

5/1/01

Calibration Procedure for Universal Generator Board, P/N 175507

ApplicableAll Model 360C machines that were shipped post 11/11/96, and all Model 360S or Small Wire Bonder kits.

ObjectiveThis technical bulletin describes a calibration procedure for the new universal generator board (P/N 175507).

Part Number175507 (assembly)

175505 (schematic)

SummaryAll Model 360 machines shipped post 11/11/96 include newly designed boards for the Generator, and I/O. The Generator board is designed to operate with both the standard Large Wire bond head, and the new Small Wire bond head. A switch is located on this board to set the transducer voltage level that is, required by each type of head.

We discovered, during machine checkout of the Small Wire bonders, that some generator boards were incorrectly set. These were corrected, however, there is a remote chance that a few machines were shipped with incorrect voltage calibration. Instead of a voltage level of 115 Vp-p, some may have been set to 100 Vp-p.

The consequence of a non-spec lower voltage level, would be that bond parameters would consistently require higher power settings than those of the default set to achieve high quality bonds. We recommend that all machines be calibrated to the design specifications, even though there is a work around solution.

This Technical Bulletin describes the calibration procedure for setting the correct values of the Generator board. The procedure is in two parts: one for the Small Wire bond head, and the other for the Large Wire bond head.

NOTE: Adjusting values on the generator board for the Large Wire bond head will affect the values for the Small Wire bond head, but Small Wire adjustments will not affect the values for the Large Wire bond head.

TECHNICAL BULLETIN No. 1060 Rev. C

ORTHODYNE ELECTRONICS TECHNICAL BULLETIN TB1060 C PAGE 1 OF 6

5/1/01

Revision A: This revision adds a part number call out to page 4, Step 1, Sampling gain calibration; corrects the voltage reading on page 5, step 8. The correct voltage should read 115 Vp-p.

Revision B: Changes the Phase Calibration Procedure by adding a step. Whenever the Phase Calibration is performed, repeat the Output Calibration procedure. The reason for the change is that the two adjustments are interrelated. Changing one adjustment can affect the other.

Revision C:A Caution was added to instruct the operator not to adjust the Null potentiometer. A Caution was added to instruct the operator about the amount of time the Generator PCB can be on during the Phase Calibration. Both Phase Calibration procedures have a new first step that installs a bond tool and a new second step that sets up the program for the test being performed. A plastic screwdriver (OE P/N 622218) was added to the Phase Calibration Procedure.

Procedure

Large Wire Bond Head

Output Level Calibration:If you interchange the Large Wire bond head and the Small Wire bond head, do the Large Wire calibration first, and then do the Small Wire calibration. In that way, the effects on Small Wire values by the Large Wire calibration will be accommodated.

1. From the Main Menu, press [7], Calibration Menu, and select Generator Test by pressing [3].

2. Open the VME card cage drawer.

3. Disconnect the BNC connector from J8 on the back of the universal generator board (P/N 175507) (see Figure 1).


5/1/01

Figure 1 BNC Connector on the back of the Generator Board

4. Connect a BNC connector probe from your oscilloscope into J8.

5. Press [F14], and follow the instructions on the screen. The software detects which bond head is installed on the machine, and directs you to make certain the Level toggle switch on the Generator board is in the correct position. It should be "High Level" for the Large Wire bond head.

CAUTION: Do not adjust the Null Adjustment potentiometer. This is a factory set adjustment. Adjusting this potentiometer without the factory setup will cause the Generator PCB to fail.

6. Using a small screwdriver, adjust VR4 (High Level) on the front of the Generator boards so the oscilloscope reads 300 Vp-p (see Figure 2).

BNC Connector


5/1/01

Figure 2 Front of Generator Board Showing Adjustment Ports

Sampling Gain Calibration:

1. Remove the oscilloscope connector from J8 and connect an OE Generator Load Box Assembly, P/N 172478, set to position “R” (84.5 Ohms).

2. Return to the Generator Test Screen, from the Main Menu, press [7], [3], and [START].

3. Using a small screwdriver on VR1 (Gain 1), adjust the gain until the pointer on the scale lines up with "50" (see Figure 2).

Phase Calibration:

1. Install a bond tool that is the same length as the tool that will be used for bonding wire. Ensure that the bond wire, cutter, and wire guide are not touching the tool.

2. Remove the OE Generator Load Box Assembly and connect the transducer cable back into the BNC connector (J8) on the back of the Generator PCB.


VR1 - Gain 1 Pot

VR2 - Gain 2 Pot

Do Not adjust the Null Pot

VR4 - High Level PotVR5 Low Level Pot

Freq Adjust Pot

Level Switch “Up” = High, “Down” = Low


5/1/01

CAUTION: Do not remain in the PHASE CALIBRATION mode for more than thirty (30) seconds. This will cause components inside the Genera-tor to heat up.


5. Using the plastic screwdriver (OE P/N 622218), adjust the Freq Adjust potentiometer until the reading on the screen is 128 ± 1 (see Figure 2).

6. Repeat the Output Level Calibration procedure.

Small Wire Bond Head

Output Level Calibration:

1. Install the Small Wire bond head on the machine.


3. Open the VME card cage drawer.

4. Disconnect the BNC connector (J8) from the back of the universal generator board (P/N 175507) (see Figure 1).

5. Connect a BNC connector probe from your oscilloscope into J8.

6. Press [F14] and follow the instructions on the screen. The software detects which bond head is installed on the machine, and directs you to make certain the Level toggle switch on the Generator board is in the correct position. It should be "Low Level" for the Small Wire bond head.

7. Using a small screwdriver, adjust VR5 (Low Level) until the oscilloscope reads 115 Vp-p (see Figure 2).

Sampling Gain Calibration:

1. Remove the oscilloscope connector from J8 and connect an OE Generator Load Box Assembly, P/N 172478, set to position “R” (84.5 Ohms).

2. Return to the Generator Test Screen, press and hold [START].


5/1/01

3. Using a small screwdriver, adjust VR2 (Gain 2) until the pointer on the scale is at a value of about "62" (see Figure 2).

NOTE: The gain adjustment will not make the pointer on the screen move continuously. The motion of the pointer will be in discrete steps. Estimate the value "62" by moving the pointer one or two "notches" beyond the value 60.

Phase Calibration:

1. Install a bond tool that is the same length as the tool that will be used for bonding wire. Ensure that the bond wire and clamps are not touching the tool.

2. Remove the standard load and connect the transducer cable back to the BNC connector (J8).


CAUTION: Do not remain in the PHASE CALIBRATION mode for more than thirty (30) seconds. This will cause components inside the Genera-tor to heat up.


5. Using the plastic screwdriver (OE P/N 622218), adjust the Freq Adjust potentiometer until the reading on the screen is 128 ± 1 (see Figure 2).

6. Repeat the Output Level Calibration.


02/24/97 7:41 AM

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET


Revision By:

G. Ritsi

Randall Maynard

Subject: LVDT Gain Change for New I/OBoard.

Resp. Engineer:

DrawingNo.:

175512 Rev E

ECN 7579


Part No.: 175512 Rev D or earlier V.P. Marketing: Bill Larkin

Models: Small Wire Bond Kits built prior toJanuary 1997.

Tech. Publication: George Ritsi

Purpose:

This bulletin corrects a potential problem of achieving a maximum cut depth of 300 or more with aLarge Wire Bonder that contain the new I/O board (P/N 175512 Rev D or earlier).

Applicable:

Small Wire Bond Head Kits built prior to January 1997.

Summary:

The new I/O board contains a number of performance enhancements supporting the Small Wire BondHead. One of the enhancements is increased LVDT resolution. This was achieved by increasing theLVDT gain. We discovered, however, that the gain value chosen limited the LVDT range to fewerthan 300 Z steps. Although not a problem with the Small Wire Bond Head, the Z-limitation couldaffect the maximum cut depth of a Large Wire Bonder containing a new I/O board (P/N 175512 RevD or earlier).

The new I/O board was included in all Small Wire Bond Head Kits. These Kits permit the standardModel 360C machine to be configured for either Small Wire or Large Wire application. A correctionto the LVDT gain is necessary to prevent limiting the maximum cut depth of the Large Wire BondHead containing a new I/O board, P/N 175512 Rev D or earlier.

Affected Small Wire Bond Kits were built prior to January 1997. After that date, all new I/O wereupdated to Revision E which corrected the problem.

There are only a few I/O boards (P/N 175512 Rev D or earlier ) in the field. These boards may becorrected by changing Resistor R12 on the LVDT board which lowers the LVDT gain by about 30%.The lower gain does not affect the performance of the Small Wire Bond Head.

Revision A:

Corrects numbering on page 2 and 3.Adds line 10 and 14 regarding Cutter Blade removal and installation

01/17/200001/17/2000 02/24/97 7:41 AM

LVDT GAIN CHANGE FOR NEW I/O BOARD Page 1 of 3


LVDT Gain Change in the New I/O Board

Revision A:Corrects numbering on page 2 and 3.Adds line 10 and 14 regarding Cutter Blade removal and installation

ObjectiveThis Technical Bulletin corrects a potential problem that would limit the maximum cut depth on aLarge Wire Bond Head on machines equipped with the new I/O board (P/N 175512 Rev D or earlier).This situation would occur only with machines equipped with the Small Wire Bond Kit built prior toJanuary 1997. Any machine equipped with I/O board P/N 175512 Rev E will not exhibit the problem.

ApplicableThis Technical Bulletin applies to Small Wire Bonder Kits built prior to January 1997 intended fordual capability (Large Wire / Small Wire) on the same machine.

Part Number175512 Rev E

ProblemThe new I/O board (P/N 175512) was included in all Small Wire Bond Head Kits. These Kits permitthe standard Model 360C machine to be configured for either Small Wire or Large Wire application.

The new I/O board contains a number of performance enhancements supporting the Small Wire BondHead. One of the enhancements is increased LVDT resolution. This was achieved by increasing theLVDT gain. We discovered, however, that the gain value chosen limited the LVDT range to fewerthan 300 Z steps. Although not a problem with the Small Wire Bond Head, the Z-limitation couldaffect deep access performance of a Large Wire Bonder containing a new I/O board (P/N 175512 RevD or earlier).

The problem would be seen on Large Wire Bonder containing I/O board P/N 175512 Rev D or earlier,when the application required the cut depth to exceed 300 Z steps. These applications would mostlikely involve machines with back cut. The problem would show up with an error message that said:

Unable to reach LVDT value at requested cut depth.

Although your specific application may not encounter this problem, Orthodyne recommends youperform the solution described below to prevent future problems.

01/17/200001/17/2000 02/24/97 7:41 AM


SolutionReplace Resistor R12 on I/O board (P/N 175512 Rev D or earlier) from 10 K Ohms to OE P/N 739037(22.1 K Ohms (1%)). This resistor change will lower the gain of the LVDT by about 30%. The lowergain will extend the cut depth on the Large Wire Bonders. The lower gain does not affect theperformance of the machine when configured with the Small Wire Bond Head.

ProcedureThis procedure is performed with the Large Wire Head installed on the machine. Remember the newI/O board is only compatible with software version 5.4 or higher.


2. Open the VME card cage and remove the I/O board (P/N 175512).

3. Verify that the board is Rev D or lower. Figure 1 is a photo of the board showing the location ofthe Rev number. If the Rev number is E or higher, no change is required.

4. Find the location of R12 (see Figure 1).

Figure 1. I/O Board showing location of the Resistor modification

5. Carefully unsolder the resistor and remove it from the board. This procedure is best done under amicroscope using a small soldering iron. Care must be taken not to damage adjacent componentsor traces.

6. Insert a new 21.1 K Ohm resistor (OE P/N 739037) in the same holes and solder in place.

Drawing Rev NoResistor R12

01/17/200001/17/2000 02/24/97 7:41 AM


7. Change the Rev letter designation to read “E”.

8. Re-install the I/O board back in the VME card cage making sure it is well seated.

9. Close the card cage and power up the machine.

10. Remove Cutter Blade from Bond Head.

Note: If Cutter Blade is not removed damage to the Bond Head may result whileperforming the following calibrations

11. Recalibrate LVDT. From the MAIN MENU, select [7] for the CALIBRATION MENU and thenselect [4] for the TOUCH SENSOR CALIBRATION. See page 5-189 in the Model 360C User’sManual for step-by-step instructions.

12. With a Large Wire Bond head installed, test the correction by programming a cut depth greaterthan 300 Z steps.

13. Recalibrate cut depth. From the MAIN MENU, select [7] for the CALIBRATION MENU andthen select [6] for the CUT DEPTH CALIBRATION. See page 5-41 in the Model 360C User’sManual for step-by-step instructions.

14. Install Cutter Blade using directions in the Model 360C User’s Manual titled “Wire Cutter” in the“Getting Started” section.

01/17/2000

PAGE 1 OF 1



Subject: Change Remote Handler InterfaceOperating Voltage

Resp. Engineer:

Drawing

No.:

172000 & 175512 V.P. Engineering: “Bob” Babayan

PartNo.:


Models: All Model 360C’s and Model 360S’swith new I/O (P/N 175512)


Purpose

The purpose of Technical Bulletin 1063 is to alert users to a change in the Remote Handler Interface voltage to “trueTTL” 5 volts, and describe the installation of PLC adapter board kit (P/N 175557) to accommodate voltage higherthan 5 volts.

Applicable

All Model 360C and Model 360S family machines equipped with new I/O Board (P/N 175512)

Summary

The new I/O board incorporates the Remote Handler Interface on the board, eliminating the need for the optionalDiscrete I/O Interface Kit (P/N 172577). Now the Remote Handler Interface is brought out to the Handler connectoron the Interface Control Panel (P/N 172058) of the machine.

The new I/O board was included in all Small Wire Bond Head Kits, and in all Model 360C built since January 1997.

The interface for the Remote Handler is now “true TTL”, meaning it operates at 5 volts. This may cause a problemwith Model 360C machines built prior to January 1997, equipped with the optional Remote Handler Kit, where theuser changes to the new I/O board.

A PLC adapter board (P/N 175557) is needed if the Remote Handle Interface voltage was operating above 5 volts.

WARNING: The I/O board may be damaged if a Remote Handler Interface operating athigher than 5 volts is connected. PLC adapter board (P/N 175557) must beattached to the I/O board to operate at higher than 5 volts.

01/17/2000 01/13/97 8:26 AM

CHANGE REMOTE HANDLER OPERATING VOLTAGE PAGE 1 OF 3


Change Remote Handler Operating Voltage With New I/O Board (P/N175512)

ToolsNeeded:

Time toComplete:



MODERATE

DIFFICULT

Applicable

All Model 360C and Model 360S family machines equipped with new I/O Board (P/N 175512)

Part Number

175512 and 175557

Problem

If a customer has been using the optional Discrete I/O Interface kit (P/N 172577) in conjunction with the old-styleI/O interface board (P/N 172532), or has changed handler interface systems, they may have a voltage compatibilityproblem when upgrading to the new I/O interface board (P/N 175512). The Discrete I/O Interface kit, used inconjunction with the old-style I/O interface board, allowed the use of a handler with an interface voltage of 5 to 24volts.

The new I/O interface board has the remote handler interface built into the board. However, the interface voltage isnow “true TTL”; meaning that it operates only at 5 volts. A remote handler of higher than 5 volts may damage thenew I/O board if installed.

Solution

To be capable of running a voltage higher than 5 volts, the I/O interface board must be equipped with PLC adapterboard (P/N 175557) and ribbon cable (P/N 172609-1).

WARNING: The I/O board may be damaged if a Remote Handler interface operating athigher than 5 volts is connected. PLC adapter board (P/N 175557) must beattached to the I/O board to operate at higher than 5 volts.

01/17/2000 01/13/97 8:26 AM


Procedure


2. Open the VME chassis assembly (P/N 172015) to gain access to the I/O interface board (P/N 175512) (seeFigure 1).

Figure 1: I/O Interface Board (P/N 175512)

3. Remove all cables from the I/O interface board.

ESD Warning: Wear grounding straps when handling the printed circuit boards to preventstatic build-up in your body from damaging sensitive electronicscomponents on the boards.

4. Loosen the two retaining screws on the I/O interface board and remove the I/O interface board from the VMEcard cage (P/N 172016).

5. Remove the ribbon cable from the I/O interface board by removing the two mounting screws and releasing theclips at J2 (see Figure 2).

Figure 2: Remove Ribbon Cable From J2

6. Install PLC adapter board (P/N 175557) to J2 on the I/O interface board (see Figure 3).

I/O Interface Board

Remove Two Screws

J2

Release Clips To Remove Cable

01/17/2000 01/13/97 8:26 AM


Figure 3: Install PLC Adapter Board (P/N 175557)

7. Install the ribbon cable (P/N 172609-1) supplied in the kit to the I/O interface board and the PLC adapter board(see Figure 4). Use the two screws that you removed in step #5 to mount the cable to the front of the I/Ointerface board. Route the ribbon cable as shown in Figure 5.

Figure 4: Install Ribbon Cable (P/N 172609-1)

Figure 5: Top View Of Ribbon Cable Routing

8. Install I/O interface board into the VME card cage. Tighten retaining screws.

9. Reconnect all cables to the I/O interface board.

10. Close the VME drawer.


02/03/97 2:27 PM

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET


Subject: Replacing the ClampAdjustment Block on a Model360S Bond Head.

Resp. Engineer:Ray Chuang

DrawingNo.:


“Bob” Babayan

PartNo.:

175349 V.P. Marketing:

Bill Larkin

Models: Model 360S Tech. Publication:

George Ritsi

Purpose:

The purpose of this Technical Bulletin is to describe the procedure for replacing the ClampAdjustment Block on a Model 360S Bond Head in the field.

Applicable:

Model 360S

This should be done as required, and when convenient.

Summary:

The old-style Clamp Adjustment Block was designed with Belleville washers which were collapsingwhen lateral adjustments were made to the Wire Clamp Jaws. This caused the Wire Clamp Jaws to nolonger be adjusted properly. A revised Clamp Adjustment Block, eliminating the Belleville Washers,has been manufactured to solve the problem.

ECN reference: #7633

01/17/200001/17/2000 02/03/97 2:27 PM

Replacement of the Clamp Adjustment Block Page 1 of 6


Replacement Of the Clamp Adjustment Block

Applicable:

Model 360S

Part Number:

P/N 175349 (Clamp Adjustment Block)

Assembly Drawing:

175349

Next Assembly Drawing:

175020

Problem:

Orthodyne Electronics found that the old-style Clamp Adjustment Block using Belleville Washerswas inadequate. After several adjustments the Belleville Washers would lose their spring and fineadjustments would be impossible.

Solution:

Orthodyne Electronics has manufactured a replacement part (P/N 175349) to be installed on all Model360S machines, as required.

Procedure:

1. Remove Bonding Tool from Transducer (See Figure 1).

NOTE: To avoid losing parts into the Handler, place a rag or other barrier over thehandler.

01/17/200001/17/2000 02/03/97 2:27 PM


Figure 1: Remove Bonding Tool

2. Loosen the jam nut on the Clamp Cable. Remove the cable ball end from the Wire ClampAssembly (see Figure 2).

Figure 2: Remove Clamp Cable

3. Remove the Clamp Assembly from the Bond Head (see Figure 3).

Remove Bonding Tool

Clamp Cable Ball End

Clamp Cable Jam Nut

Wire Clamp Assembly

01/17/200001/17/2000 02/03/97 2:27 PM


Figure 3: Remove Clamp Assembly

4. Remove the old-style Clamp Mounting Bracket. The Clamp Mounting Bracket and the Bellevillewashers will fall off. Discard the screw, Belleville washers, and Clamp Mounting Bracket (seeFigure 4).

Figure 4: Remove Clamp Mounting Bracket

5. Install new Clamp Adjustment Block (P/N 175349) with supplied screw (P/N 500200-06).

6. Install the Clamp Assembly to the new Clamp Adjustment Block with the two screws and washersyou removed in step 3. Do not tighten screws at this time.

Screw for Removing Clamp Mounting Bracket

Mounting Screws For Clamp Assembly

Old-Style Clamp Mounting Bracket

Clamp Assembly

01/17/200001/17/2000 02/03/97 2:27 PM


7. Using Wire Clamp Gauge (P/N 175013), locate the Clamp Assembly into position. Allow theClamp Jaw tips to rest on the bottom step of the gauge. Tighten the screws. This will set theheight of the jaws and the proper distance from the bonding tool ( see Figure 5). Check thealignment of the Wire Guide Tube during this step. Adjust as necessary.

Note: When adjusting the Clamp Assembly, use force to move the assembly only on thestationary arm of the clamp (left side).

Figure 5: Aligning and Adjusting the Clamp Assembly

8. Install Bonding Tool using Gauge Block (P/N 175010) (see Figure 6).

Wire Clamp Gauge

Touch Clamp Jaws To These Surfaces

Clamp Assembly

Wire Guide Tube

01/17/200001/17/2000 02/03/97 2:27 PM


Figure 6: Install Bonding Tool

9. To check the installation of the Bonding Tool, do a Generator Test. From the Main Menu selectCalibration Menu (7), then Generator Test (3). Press [START] to energize the Bonding Tool. Thereading should be a minimum of 60. If below 60, check that the Transducer setscrew is secure.

10. Loosen the Pivot Arm screw. Make a coarse lateral adjustment to the Clamp Mount AdjustmentAssembly so that the Wire Clamp Assembly is aligned with the Bonding Tool to within ± .005”(See Figure 7). Tighten screw.

Gauge Block P/N 175010

Bonding Tool

01/17/200001/17/2000 02/03/97 2:27 PM


Figure 7: Align Clamp Assembly with the Bonding Tool

11. Make a fine lateral adjustment using the Fine Adjustment Screw in the Clamp Adjustment Blockto center the Wire Clamp Assembly (See Figure 8). Using a microscope and a mirror, insert a wirethrough the Clamp Jaws and into the Bonding Tool. Pull about 1/2” of wire straight out. Checkthat the wire feeds between the Clamp Jaws, not under or around. While turning the FineAdjustment Screw, look at the wire where it exits the Bonding Tool. Center the wire relative tothe tool.

Figure 8: Fine Adjustment of the Clamp Assembly.

12. Install the ball end of the Clamp Cable. Adjust the Wire Clamp. From the Main Menu, select theCalibration menu (7), Adjust Wire Clamp (6).Follow the instructions on the screen to completethe Wire Clamp Adjustment.

Pivot Arm Screw

Wire

Access the Fine Adjustment Screwthrough the backside of the ClampAssembly.

02/20/97 3:16 PM

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET

No.: 1065 Rev: Prepared By: G. Ritsi

Subject: M360C Printer Parallel Port Resp. Engineer:

DrawingNo.:


PartNo.:



Purpose:

This bulletin alerts the user to the proper interface for the printer.

Applicable:

All Model 360C’s

Summary:

The Model 360C supports a parallel printer ONLY. The printer plugs into the PRINTER connectoron the front panel. This port is NOT to be used to plug in a serial printer. If a serial printer is pluggedinto this parallel printer port, damage to the I/O board can occur.

This happened to a customer with Model 360B and Model 360C machines on the same line. TheModel 360B uses a serial printer.

The RS232 connector on the front panel is a serial port used to download log files and statistics to ahost computer. This port shall not be used to plug in a serial printer.

01/17/200001/17/2000 02/20/97 3:16 PM

PARALLEL PRINTER INTERFACE Page 1 of 1


Parallel Printer Interface to the Model 360C.

ObjectiveThis bulletin alerts the user to the proper interface for the parallel printer.

ApplicableModel 360C family machines.

BackgroundThe Model 360C family of machines were designed to support a parallel printer interface. Theparallel printer connection is on the front panel of the machine marked, “PRINTER”. This is aparallel port only.

The connector on the front panel marked, “RS232”, is a serial port that is used for downloading logfiles and/or statistical data to a host computer. This port should not be used for a serial printer.

ProblemOlder Orthodyne machines (Model 360A and Model 360B) supported a serial printer. The Model 360Csupports parallel printers ONLY. This interface uses a Centronics standard, which is a 5 volt parallelinterface. It does not support serial printers. If a serial printer, which uses a ±12 volt interface, isplugged into the Model 360C parallel printer port, damage to the I/O board can occur.

SolutionMake certain you connect the correct piece of equipment to the Model 360C.

WARNING: Do not plug a serial printer into the connector marked “PRINTER” on the frontpanel of the Model 360C machine. This is a parallel port only. Connecting a serial printer tothis port can seriously damage the I/O board.

of 1

05/23/97 7:36 AM



Subject: Memory Allocation Error InSoftware Version 5.4b

Resp. Engineer:

Drawing

No.:


Part No.: V.P. Marketing:Bill Larkin

Models: All Model 360C and Model360S Family Machines WithSoftware Version 5.4b

Tech. Publication:George Ritsi

Purpose

The purpose of Technical Bulletin TB 1066 is to alert customers of a memory allocation problem in theWIRE LIST EDIT screen of software version 5.4b.

Applicable

All Model 360C and Model 360S family machines with software version 5.4b

Summary

When bonding a high number of wires (over 300) on a single device, a customer may run into a memoryallocation limit problem using software version 5.4b. The situation occurs when bonding a device withover 300 wires and trying to save the file in the WIRE LIST EDIT screen. The software will display a“memory allocation error” screen and will not save the file.

The memory problem affects very few customers in the field. Only customers with a device requiringover 300 wires may be affected. Since memory allocation is influenced by many factors, a customer mayhave a device with more than 300 wires and not see this problem.

There is no work-around to the problem. The only solution is to load version 5.4c, or higher software.

05/23/97 7:36 AM

MEMORY ALLOCATION ERROR IN SOFTWARE VERSION 5.4B Page 1 of 1


Memory Allocation Error In Software Version 5.4b

Applicable

All Model 360C and Model 360S family machines using software version 5.4b

Problem

When bonding a high number of wires (over 300) on a single device, it has been found that you may runinto a memory allocation limit problem using software version 5.4b. The situation occurs when bondingover 300 wires and trying to save the file in the WIRE LIST EDIT screen. The software will display a“memory allocation error” screen and will not save the file.

Memory allocation is based on many factors and this condition may not show itself, even while bondingmore than 300 wires. This problem affects very few applications. Therefore, no action is necessary unlessyour machine shows this condition.

Solution

There is no work-around solution to the problem while using software version 5.4b. The only solution isto load software version 5.4c or higher. Contact your Field Service Representative, or the OrthodyneElectronics main office, to upgrade your software.

03/03/97 12:03 PM

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET


Subject: Revised Isolation Pad Design Resp. Engineer:

Drawing No.: 172262 V.P. Engineering: “Bob” Babayan

Part No.: 172262

ECN # 7659 V.P. Marketing Bill Larkin

Models: Model 360C, C-H, C-HD andModel 360S, S-H, S-HD


Purpose:

The purpose of this Technical Bulletin is to describe a change to the Isolation Pad used on Model360C’s and Model 360S’s, and how that changes the installation of the Isolation Pad Mounting FootAssembly .

Applicable:

Model 360C, C-H, C-HD and Model 360S, S-H, S-HD

Summary:The Isolation Pad design was changed by removing a slot. To install a new Isolation Pad, remove anM6 screw from the bottom of the bonder. In the past, this screw was used to “key” the Isolation Pad.We no longer install the “key” screw, therefore the Isolation Pad was revised.

When replacing an Isolation Pad in the field there are different procedures to follow depending on theconfiguration of the bonder. This Technical Bulletin explains the different procedures for replacingthe Isolation Pad.

01/17/200001/17/200001/17/2000 03/03/97 12:03 PM

REVISED ISOLATION PAD DESIGN Page 1 of 11


Revised Isolation Pad Design

Objective

This Technical Bulletin explains the revision to the Isolation Pad and the procedure for replacing theIsolation Pad in the field.

Applicable

Model 360C, C-H, C-HD and Model 360S, S-H, S-HD

Part Number

172262

Problem

In the on-going effort to reduce parts and part costs, Orthodyne Electronics has improved the strengthand longevity of the Isolation Pad for the Model 360C and Model 360S bonders. OrthodyneElectronics was able to simplify the manufacturing of the Isolation Pad by eliminating a machinedslot, and removing a locating screw from the bonder.

The deleted screw is an M6 screw located on the underside of the bonder. This screw was used to“key” the old-style Isolation Pad when it was mounted on the bonder. These changes reduce cost andassembly time.

A problem arises when a customer wants to replace an old-style Isolation Pad in the field. The new-style Isolation Pad has no provision for the “key” screw, therefore the screw must be removed beforethe new-style Isolation Pad can be installed.

SolutionThis Technical Bulletin describes the procedure for installing the new-style Isolation Pad.

Procedure 1: For Model 360C, C-H, C-HD Without Transport Base (OuterMounts) and 360S, S-H, S-HD Without Transport Base (Outer Mounts)


01/17/200001/17/200001/17/2000 03/03/97 12:03 PM


Note: In order to raise the bonder to replace an Isolation Pad, the Transport Dolly Wheelsmust be used. If you are changing all four Isolation Pads on a bonder, it is advisable to do oneside of the bonder at a time.

2. Remove the screws that holds the Isolation Pad Mounting Foot Assemblies to the Bonder (seeFigure 1).

Figure 1: Remove Screws that Secure Isolation Pad Mounting Foot Assembly toBonder

3. Install Transport Dolly Wheels to the bonder. Tighten screws to lift the bonder just enough toslide the Isolation Pad Mounting Foot Assembly out (see Figure 2).

Figure 2: Install Transport Dolly Wheels to Bonder.

4. Slide the Isolation Pad Mounting Foot Assembly from under the bonder. Remove the two screwsthat hold the Isolation Pad to the Support Block (see figure 3). Attach new-style Isolation Pad toSupport Block.

Remove Screw

Isolation Pad

Tighten Screws to Lift Bonder Slightly

01/17/200001/17/200001/17/2000 03/03/97 12:03 PM


Figure 3: Remove Isolation Pad from Support Block by Removing Two Screws

5. Replace the old-style Isolation Pad with the new part.

6. Look underneath the bonder to see if your bonder has a M6 key screw (see Figure 4). If it does,remove the screw and discard it.

Figure 4: Remove the M6 Screw and Discard

7. Slide the Isolation Pad Mounting Foot Assembly back under the bonder. Replace any shims andloosely install the screw that holds the Isolation Pad Mounting Foot Assembly to the bonder (seeFigure 5). Lower the bonder back down onto the floor by loosening the screws holding theTransport Dolly Wheels to the bonder.

Note: Because of variations in the thickness of the Isolation Pads it is advisable to checkthe steadiness of the bonder after this procedure. Adjust shims as needed.

Remove Screws LocatedUnder Mounting Foot

Isolation Pad Mounting Foot Assembly

Remove M6 Screw

01/17/200001/17/200001/17/2000 03/03/97 12:03 PM


Figure 5: Loosely Install the Isolation Pad Mounting Foot Assembly onto the Bonderwith Screw

5. Remove the Transport Dolly Wheels from bonder and tighten the screw that holds the IsolationPad Mounting Foot Assembly to the bonder.

6. Power up bonder.

Procedure 2: For Model 360C-HD and 360S-HD (With TransportBase)

1. Power down the bonder

2. Install Shipping Strap to the bonder (see Figure 6). Tighten screw that holds Shipping Strap to thebonder.

Figure 6: Install Shipping Strap to Bonder

Screw


Shipping Strap

01/17/200001/17/200001/17/2000 03/03/97 12:03 PM


3. Remove screw that holds the Isolation Pad to the bonder (see Figure 7). Remove the screws thathold the Isolation Pad to the Transport Base (see Figure 7a)

Figure 7: Remove Screw that holds Isolation Pad to Bonder

Figure 7a: Remove Screws Holding Isolation Pad to Transport Base

4. Turn the Nut on the Leveling Pad to raise the bonder. Raise the bonder just enough to get theIsolation Pad out from between the bonder and the Transport Base (see Figure 8)

Screws

Screw

01/17/200001/17/200001/17/2000 03/03/97 12:03 PM


Figure 8: Turn Nut to Raise Bonder Slightly

5. Slide the old-style Isolation Pad out. Look underneath the bonder to see if your bonder has a M6key screw (see Figure 9). If it does, remove the screw and discard it.


6. Slide the new Isolation Pad under the bonder (see Figure 10 ). Replace any shims and looselyinstall the screws that holds the Isolation Pad to the bonder and the Transport Base. Lower thebonder back down. Tighten all screws

Note: Because of variations in the thickness of the Isolation Pads it is advisable to checkthe steadiness of the bonders after this procedure. Adjust shims as needed.

Isolation Pad

Remove M6 Screw

Nut

Leveling Pad

01/17/200001/17/200001/17/2000 03/03/97 12:03 PM


Figure 10: Slide Isolation Pad Back into Place


NOTE: For changing inner mounts on a C-HD or S-HD use the three-hole shipping strap toraise the machine. Install the shipping strap and raise one corner of the bonder at a time. Therest of the procedure is the same.

Procedure 3: For Inner Isolation Pad on Model 360C-HD and 360S-HD (WithoutTransport Base)

Note: This procedure is used to replace an Isolation Pad that is mounted on one of the innermounts of an Input bonder or Output bonder. This Procedure involves moving the Outputbonder about 10 inches (25 cm) to the right. To accommodate the removal of the innerIsolation Pad from the Isolation Pad Mounting Foot Assembly. Outer Isolation Padreplacement may use Procedure 1.


2. Disconnect the following cables from the Transport Station on the Output bonder (refer to360CH-D Top Assembly Drawing #173040 for location of cables):

Description Location Part Number

Dual Machine Interface Cable P17 on I/O Board. (Disconnect and feedout of Handler)

173636

Emergency Stop Coaxial Cable Emergency Stop Switch (Disconnect andlet hang free)

708214

Handler Interface Cable J18 on I/O Board (If equipped,Disconnect and feed out of Handler)

173646

01/17/200001/17/200001/17/2000 03/03/97 12:03 PM


Note: Cables must be disconnected or damage will result to Cables and the Handler I/OBoard.

3. Starting at the rear of the Output bonder, remove the screws that hold the Isolation Pad MountingFoot Assemblies to the bonder (see Figure 11).

Figure 11: Remove Screws that Secure Isolation Pad Mounting Foot Assemblies toBonder

4. Install Transport Dolly Wheels to the rear of the bonder. Tighten screws to lift the bondersecurely onto the Transport Dolly Wheels (see Figure 12).

Figure 12: Install Transport Dolly Wheels to Output Bonder.

5. Perform steps 2, 3, and 4 to the front of the Output bonder.

6. Roll the Output bonder about 10 inches (25 cm) to the right (see Figure 13).

Remove Screw (2 places)

Isolation Pad

Tighten Screws to lift Bonder off of Isolation Pad Mounting Foot Assemblies

01/17/200001/17/200001/17/2000 03/03/97 12:03 PM


Figure 13: Roll Output Bonder away from Input Bonder.

7. At the rear (or front) of the Input bonder, remove the screw that secures the Isolation PadMounting Foot Assembly to the bonder (see Figure 14).

Figure 14: Remove Screws that Secure Isolation Pad Mounting Foot Assembly toBonder (rear shown)

8. Install Transport Dolly Wheels to the rear (or front) of Output bonder. Only raise the bonder highenough to get the inner Isolation Pad Mounting Foot Assembly out from under the bonder.

9. Slide the Isolation Pad Mounting Foot Assembly from under the bonder. Remove the two screwsthat hold the Isolation Pad to the Support Block (see Figure 15).

Remove Screw

Isolation Pad

01/17/200001/17/200001/17/2000 03/03/97 12:03 PM


Figure 15: Remove Isolation Pad from Support Block by Removing Two Screws

10. Replace the old-style Isolation Pad with the new part.

11. Look underneath the bonder to see if your bonder has a M6 key screw (see Figure 16). If it does,remove the screw and discard it.


12. Slide the Isolation Pad Mounting Foot Assembly back under the bonder. Replace any shims andloosely install the screw that holds the Isolation Pad Mounting Foot Assembly to the bonder (seeFigure 17). Lower the bonder back down onto the floor by loosening the screws holding theTransport Dolly Wheels to the bonder.

13. Tighten the screw that holds the Isolation Pad Mounting Foot Assembly to the bonder.


Remove M6 Screw

Remove Screws LocatedUnder Mounting Foot

01/17/200001/17/200001/17/2000 03/03/97 12:03 PM


Figure 17: Loosely Install the Isolation Pad Mounting Foot Assembly onto the Bonderwith Screw

14. Place the Output bonder back into position next to the Input bonder. Check that the TransportStations are properly aligned.

15. Loosely install all the Isolation Pad Mounting Foot Assemblies. Remove the Transport DollyWheels from the bonder and tighten the screw that holds the Isolation Pad Mounting FootAssemblies to the bonder.

16. Re-connect all cables to the Output bonder Transport Station.


Screw

01/17/00 05/24/99 4:43 AM

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET

No.: 1068 Rev: A Prepared By: Mike Brumbaugh

Subject: Z/Theta Bearing Lubrication Resp. Engineer:

Drawing

No.:

172030 V.P. Engineering:“Bob” Babayan


Models: All model 360’s with a Z/Thetabearing stamped with serial#9703001D and higher.


REVISION AThis revision eliminates the pillow pack (P/N 172850-2) and replaces it with additional quantity of thepolytube (P/N 172850-1). In addition, the amount of grease in the polytube was increased from 5 gms.to 7 gms.

PurposeThe purpose of this Technical Bulletin is to alert users when, where and how to lubricate all Model360’s equipped with a Z/Theta bearing (P/N 172030 Rev. F) stamped with serial #9703001D andhigher.

ApplicableAll Model 360’s equipped with a Z/Theta bearing (P/N 172030 Rev. F) stamped with serial#9703001D and higher.

SummaryModifications have been made to the retaining rings and grease for the Z/Theta bearing. Because ofthese changes, Technical Bulletin #1048 (Z Tube Lubrication) is superseded by this document.

The Z/Theta bearing now uses a new grease called Braycote by Castrol (P/N 172850-1). The grease iscompletely compatible with the old-style NSK grease. Braycote is packaged in polytubes designedspecifically for use with the Z/Theta bearing. Each ”tube” has enough grease to lubricate one end ofthe Z/Theta bearing. Therefore, two are required for each bearing.

05/24/99 4:43 AM

Z/THETA-TUBE LUBRICATION Page 1 of 5

TECHNICAL BULLETIN No. 1068 Rev.A

Z/Theta Bearing Lubrication

Applicable

All Model 360’s equipped with a Z/Theta bearing (P/N 172030 Rev. F) stamped with serial#9703001D and higher.

Problem

To alleviate some service problems, revisions have been made to the retaining ring and grease for theZ/Theta bearing (P/N 172030). The revisions change the lubrication procedure of the Z/Theta bearingassembly.

Solution

This Technical Bulletin provides instructions for the proper lubrication of the Z/Theta bearing on allModel 360 Wirebonders equipped with a Z/Theta bearing (P/N 172030 Rev. F) stamped with serial#9703001D and higher.

Orthodyne Electronics has packaged the grease for the Z/Theta bearing in individual “”polytubes”(P/N 172850-1) containing the correct amount of grease for one end of the bearing. Two “packs” arerequired for each bearing. The new grease is completely compatible with the original NSK grease and,therefore, the bearing requires no cleaning.

The Z Tube must be lubricated every 6 months. Failure to do so can lead to failure of the Z/Thetabearing.

Procedure

Perform the following steps to clean and grease the Z/Theta tube:


2. Remove cover from the front of bond head assembly. Figure 1 shows the Z/Theta bearingassembly with the cover removed.

05/24/99 4:43 AM


Figure 1: Z/Theta Bearing Assembly

3. Clean around the top seal and the tube with a soft, lint-free cloth.

4. Move the head all the way down by hand. Clean the lower portion of the tube.

5. Raise the head to the upper position.

6. Remove the four cap screws that hold the upper retaining ring to the bearing housing (Figure 2).

Figure 2: Remove Four Screws

7. Slide the ring up to gain access to the bearing (see Figure 3).

Bearing Housing Retaining Rings

05/24/99 4:43 AM

Z/THETA-TUBE LUBRICATION

Figure 3: Slide Retaining Ring Upward

8. Lower the head about 1/2”(13mm) to create an area to place the grease into (see Figure 4).

Figure 4: Lower Bond Head 1/2”(13mm)

9. Remove the cap from the polytube (P/N 172850-1) and cut the end of the tip off. Squeeze all ofthe grease around the Z/Theta tube (see Figure 5). Use your finger to spread it evenly around thetube.

1
Polytube P/N 172850-
Page 3 of 5

05/24/99 4:43 AM


Figure 5: Squeeze Grease Around Z/Theta Tube

10. Slide the retaining ring back down to the bearing block. Install and tighten the four cap screws.Use a small dab of Saf-T-Eze lubricant on the threads to avoid seizing.

11. Lower the head assembly all the way down to gain access to the lower retaining ring. Remove thefour cap screws holding the lower retaining ring on the bottom of the bearing housing (Figure 6).Slide the retaining ring down towards the bonding head.

Figure 6: Remove Screws

12. Move the head up about 1/2”(13mm) to create a an area to place the grease into and lubricate thelower bearing by applying grease as in Step 9.

13. Slide the ring back up the bearing tube. Install and tighten the four cap screws. Use a small dab ofSaf-T-Eze lubricant on the threads to avoid seizing.

14. Manually move the bond head up and down, and rotate in Theta to spread the grease on the tube.

15. Power up the machine and go to the System Parameter Menu (from the Main Menu press [5],[1])Select “System Speed” and set to “1/2 SPEED”. Press F13 to save settings.

Grease Here

05/24/99 4:43 AM


16. For a Model 360C, spread the grease by moving the head up and down with the Exercise Motorsfeature. Go to the Exercise Motors feature (from Main Menu, press [B],[1]). Turn on the Z and Tmotor only. Use the Y spinner to lower the head. Press F14 to set the depth. Press START andexercise for about 5 minutes. Press STOP.

Warning: For Model 360C-H and C-HD with a leadframe handler, move the bond headto an area where there are no obstacles to make contact with in the Z and T direction.Remove the tool cutter, pusher, and the wire feed tube. Go to the Manual Positioningscreen to run the bond head up and down to check clearance (from the Main Menu press[4]). Exercise in Z and T direction only when you are sure there is no chance ofdamage to the bond head.

17. After exercising for about 5 minutes, return the speed to NORMAL. Press [HOME] on the keypadto send the bond head home. Go to the System Parameter Menu (from the Main Menu press[5],[1]) select “System Speed” and set to “NORMAL”. Press F13 to save settings.

18. Wipe off any excess grease that has accumulated on the tube.

19. Examine the rear of the Z/Theta Bearing Assembly (from the top and bottom) and remove anyexcess grease from the weep hole with a cotton swab (see Figure 7). This will prevent any excessgrease from falling on the work in progress.

Figure 7: Wipe Off Excess Grease From the Rear of the Z/Theta Bearing(view from bottom)

Note: Repeat step 19 after a few days of running the machine to remove any additionalgrease that may have squeezed out of the weep hole.

Grease

Weep Hole

04/11/97 3:36 PM

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET

No.: 1069 Rev: Prepared By: G. Ritsi

Subject: Active Clamp Head Calibration,Remove Cutter

Resp. Engineer:

DrawingNo.:


PartNo.:


Models: Model 360C with Active ClampHead


Purpose:

This bulletin alerts the user to a change in the touch sensor calibration procedure.

Applicable:

Model 360C with Active Clamp Head

Summary:

Provides a work-around procedure for calibration of the touch sensor to avoid damaging the cutter.Corrects a problem observed in Version 5.4C with the Active Clamp Head.

The problem may be exacerbated by tolerance stack-up in the parts involved. Tolerances havetightened on the dimensions that contribute to height variation of the cutter assembly. This may makethe problem go away. Engineering tests will be conducted on assemblies built to the revised drawingin the near future.

01/17/2000 04/11/97 3:36 PM

ACTIVE CLAMP HEAD TOUCH SENSOR CALIBRATION Page 1 of 1


Active Clamp Head Touch Sensor Calibration

ObjectiveThis bulletin alerts the user to the proper procedure for calibrating the Touch Sensor on the ActiveClamp Head when using software Version 5.4C.

ApplicableModel 360C with Active Clamp Head.

BackgroundThe Active Clamp Head option was just released for the Model 360C family of machines. This headoption requires software Version 5.4C.

ProblemA problem has surfaced when running the Active Clamp Head option with version 5.4C. This head usesmuch shallower cut depths. Version 5.4C uses the standard cut depth. The result is that the cutter bladecould be damaged when performing the Touch Sensor calibration.

SolutionThe software bug will be corrected in software version 5.5 to be released soon. In the meantime,avoid damage by removing the cutter blade during Touch Sensor calibration of the Active Clamp headwith Version 5.4C.

04/14/97 1:59 PM

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET


Subject: Power -Up Screen Resp. Engineer:

Drawing

No.:


Part No.: V.P. Marketing:Bill Larkin

Models: Model 360C family or Model360S family with I/O InterfaceBoard P/N 175512


PurposeThe purpose of this Technical Bulletin is to alert customers of a potentially confusing screen shownon the data monitor during the power-up (start-up or boot-up) procedure.

ApplicableAll Model 360C family or Model 360S family with I/O Interface Board P/N 175512.

SummaryDuring the power-up procedure (start-up or boot-up) of a Model 360C family or Model 360S familyequipped with an I/O Interface Board P/N 175512, a message appears on the screen indicating thatcertain circuit boards have been detected. The lines: “I/O Test: Failed” and “Ext. I/O Test: NotFound” appear on this screen. This condition is only seen on the power-up screen at the beginning ofthe power-up procedure. Since the data monitor is not warmed up at this point the screen is not seen.However, after using the emergency stop (“e-stop”) button the data monitor remains on. When themachine is re-started the start-up screen is now visible.

The message could confuse a customer into thinking there is a problem with the I/O board in theirmachine after using the emergency stop button. There is no problem with the machine and no action isrequired. The machine will continue to run its power-up procedure without operator intervention.

This problem is cosmetic rather than functional, therefore there is no fix planned for the immediatefuture.

April 28, 1996

POWER-UP SCREEN Page 1 of 1


Power-Up Screen

Applicable

All Model 360C family or Model 360S family with I/O Interface Board P/N 175512.

Problem

During the power-up procedure (start-up or boot-up) of a Model 360C family or Model 360S familywith an I/O Interface Board P/N 175512, a message appears on the screen indicating that certaincircuit boards have been detected. However, the lines: “I/O Test: Failed” and “Ext. I/O Test: NotFound”, will also appear on this screen. This is not a problem because software does not check forthese boards.

Solution

Normally this condition is not seen on the power-up screen at the beginning of the power-upprocedure because the data monitor is not warmed up when this screen appears. However, after usingthe emergency stop (“e-stop”) button, the data monitor remains on. When the machine is re-started thestart-up screen is now visible.

There is no problem with the machine and no action is required. The machine will continue to run itspower-up procedure without operator intervention.

08/06/97 11:59 AM

Page 1 of 1



Subject: Z-Band ReplacementProcedure

Resp. Engineer:

DrawingNo.:

171000, 171003, & 171035 V.P. Engineering: “Bob” Babayan

PartNo.:

171018 & 171100 V.P. Marketing: Bill Larkin

Models: Model 360B Tech. Publication: George Ritsi

Purpose

The purpose of Technical Bulletin 1073 is to describe the procedure for replacing the Z-band assembly(P/N 171018) in the field.

Applicable

Model 360B

Summary

The Z-band (P/N 171100) has a critical adjustment that is not possible to accurately complete in the field.Therefore, if a Z-band fails in the field, the entire Z-band assembly must be replaced. TB 1073 describesthe procedure for the proper replacement of the Z-band assembly.

08/06/97 11:59 AM

Z-BAND REPLACEMENT PROCEDURE Page 1 of 5


Z-Band Replacement Procedure

ToolsNeeded:

Time toComplete:


Common hand tools 1 ½ Hour(s) EASYSAE Allen wrenches

MODERATE

DIFFICULT

Applicable

Model 360B

Part Number

Z-band Assembly #171018

Assembly Drawing

171000, 171003, and 171035

Problem

The Z-band (P/N 171100) must have the factory specified tension and alignment to function correctly andprovide dependable service. It has been found that adjusting the proper tension and alignment of the Z-band isnot possible in the field. Therefore, if a Z-band requires service in the field, the entire Z-band assembly (P/N171018) must be replaced.

Solution

Technical Bulletin 1073 describes the procedure for the proper replacement of the Z-band assembly.

Procedure

Remove Z-band Assembly

NOTE: If your bonder is equipped with a handler, you will want to cover the handler to keepparts from falling into it.

08/06/97 11:59 AM



2. Remove the top cover (P/N 171211) from the bonder assembly. Remove the bearing housingcover (P/N 171210).

3. Slacken the Z drive belt. Loosen the two screws holding the Z-motor mounting bracket (P/N171184) (see Figure 1). Remove the Z-drive belt.

Figure 1: Z Motor Bracket Screws

4. Remove the two setscrews holding the Z-band pulley onto the Z-drive shaft (P/N 171178)(see Figure 2).

Figure 2: Z Motor Drive Pulley Setscrews

Z-Band Assembly

08/06/97 11:59 AM


5. Remove the four cap screws holding the Z-drive shaft assembly in place (see Figure 3). Carefullyremove the assembly. Spin the drive shaft to be sure that the Z-band hub slides easily off the frontend of the drive shaft.

Figure 3: Z Drive Shaft Assembly

6. Remove the two cap screws from the top of the Z-band assembly (see Figure 4). Slowly push theZ-tube all the way up and remove the Z-band assembly from the bonder.

Figure 4: Remove Cap Screws From Arm

Z-Band Assembly Arm

Push Z-Tube Up

Z-Drive Shaft Assembly

08/06/97 11:59 AM


Install New Z-band Assembly

NOTE: Be extremely careful when handling and installing the new Z-band assembly. Do nottouch, bend, dent, or apply side loads to the Z-band. This will cause a significantshortening of the Z-bands service life.

1. Lower the new Z-band assembly into place.

2. Install the two cap screws at the top of the Z-band assembly, leaving them loose enough (about 1turn) for the assembly to move freely for later adjustment (see Figure 4).

3. Carefully install the Z-drive shaft assembly. While inserting it into the Z-band hub, gently movethe head up and down while holding the Z-drive shaft from turning. Continue the up-and-downmotion to spin the pulley, until the drive shaft assembly is fully installed. Install and tighten thefour cap screws that hold the Z-drive shaft assembly in place (see Figure 3). Gently move the headup and down while tightening the screws to make sure there is no damaging side load on the Z-band.

4. Clean the threads on the setscrews that are supplied in the kit with a degreaser or acetone. Applyone drop of Loctite 242 (supplied with the Z-band assembly) to the threads of each screw.

WARNING: Do not allow the Loctite 242 to get on the Z-band. Damage will result.

5. Rotate the Z-drive shaft several times to allow the Z-band assembly to find a relaxed position onthe shaft. Looking into the screw holes on the Z-band hub, you will be able to see the flats on theZ-drive shaft that the set screws will sit on. Install one set screw. As you begin to feel the set screwtouch the surface of the Z-drive shaft, move the shaft back and forth a little to ensure that the setscrew fully engages the flat on the shaft. Install the other set screw and follow the same procedureto engage the flat on the shaft. Tighten both set screws (see Figure 2)

6. Move the bond head assembly up and down a few times. Lightly snug down the cap screws at thetop of the Z-band assembly. Tighten the cap screws completely after you are sure the Z-band isproperly aligned.

NOTE: The idea here is to not bind the Z-band. The Z-band must be free of kinks andbinding. If there is any bind in the Z-band, the Z-band will be noisy and inaccurate,and will have a shorter service life.

7. Install the Z drive belt. Adjust the tension on the drive belt. Measure the deflection of the beltacross the pulleys with a straight edge or ruler. Deflection should be 1/16”(2mm) at 500 grams offorce. It is usually sufficient to simply pull the motor up by hand. Tighten the Z-motor mountingbracket screws (see Figure 1).

8. Turn on the power to the bonder. Follow the next procedure to recalibrate Z home.

08/06/97 11:59 AM


Z Home Sensor Adjustment

1. Re-adjust the Z-home sensor overall position (see Figure 5). Locate the sensor just above theZ/Theta bearing tube. Loosen the two screws on the bracket (note the slotted holes), and move thesensor to the desired position depending on your package needs.

WARNING: Make sure the bond head will not hit anything when sent Home.

Figure 5: Z-Home Sensor

2. Perform Recalibrate Home (from the MAIN MENU, press [7],[9]).

3. Check the Z Home Offset number in the Internal Settings screen (from the MAIN MENU, press[7],[B]). The value should be between -115 and -145. Adjust as necessary by loosening one screwholding the sensor to the bracket and moving the sensor up a small amount (0.001”-0.003”). Aftermoving the sensor, be sure to recalibrate Home before checking the Home Offset number. Youmust recalibrate Home, otherwise the bonder will not acknowledge or update the change in thesensor position. Continue to adjust, recalibrate, and check until the value is within the -115 to -145range.

NOTE: After performing Z Depth Calibration, perform Recalibrate Z in all files (see section3.2.8 in the Model 360B User’s Manual).

Z-Home Sensor

Z-Home Flag

8/21/97

NOISE ON THE SPI LINE Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET

No.: 1076 Rev:A Prepared By: George Ritsi

Subject: Correcting Noise on the SPILine.

Resp. Engineer:Tom Nguyen

DrawingNo.:

175512 Rev K V.P. Engineering: “Bob” Babayan

PartNo.:

P/N 175512 Rev K V.P. Marketing: Bill Larkin

Models: Model 360C’s with new I/Oboard and Active Loop ControlHead or Small Wire Head

Model 360S with new I/O board


Purpose:This bulletin addresses the problem of random noise on the SPI line between the I/O board and theALC and Small Wire bond heads. Noise on this line can cause occasional errors which would affectwire feed or wire clamping.

Revision A:Corrects the labeling of the Technical Bulletin number. This Technical Bulletin was incorrectlycalled TB 1075. The correct number is TB 1076.

Applicable:• Model 360C with new I/O board (P/N 175512) and Active Loop Control Head or Small Wire

Head.

• Model 360S with new I/O board (P/N 175512).

Summary:Sporadic looping and/or wire feed problems on the ALC and Small Wire heads were traced to randomnoise getting into SPI, especially the MISO line. The noise is thought to be due to coupling betweenlines in the Z cable. A straight-forward fix to the problem is to add a filter capacitor between pins 2and 20 on U20 on the I/O board. The capacitor is mounted on the solder side of the board.

In addition, a software filter routine was added into software version 5.5A as added protection againstthis type of noise.

Reference:ECN 7919

8/15/97



Correcting Noise on the SPI Line

ObjectiveThis Technical Bulletin describes a solution to correct random noise on the SPI line that can causeerrors in machine operation.

Revision A:Corrects the labeling of the Technical Bulletin number. This Technical Bulletin was incorrectlycalled TB 1075. The correct number is TB 1076.

ApplicableModel 360C’s with the new I/O board (P/N 175512, Rev J or older) and Active Loop Control (ALC)Head or Small Wire Head (M360S).

Part NumberI/O board P/N 175512 Rev J.

Capacitor P/N 702111

ProblemSporadic looping and/or wire feed problems on the ALC and Small Wire heads were traced to randomnoise getting into SPI, especially the MISO line. The noise is thought to be due to coupling betweenlines in the Z cable.

This problem was only observed with machines using Version 5.5, and only with ALC or Small Wireheads.

SolutionA straight-forward fix to the problem is to add a 100pF filter capacitor (P/N 702111) between pins 2and 20 on U20 on the I/O board. The capacitor is mounted on the solder side of the board.

In addition, a software filter routine was added into software version 5.5A as added protection againstthis type of noise.

Machines built with I/O board P/N 175512 Rev K or newer, have the filter capacitor installed at thefactory, and operate with software Version 5.5A.

8/15/97


ProcedureIf your Model 360C-type machine uses a Small Wire Head or the Active Loop Control Head, andcontains I/O board P/N 175512 Rev J or older, then perform the following procedure:


2. Open the VME card cage drawer and locate the I/O board.

3. Disconnect the cables, loosen the mounting screws and remove the I/O board.

WARNING: Before you handle any Orthodyne circuit board assembly, you must be grounded toprevent static electricity discharge from damaging the board.

4. Locate U20 on the board (see Figure 1). (Refer also to Drawing Number 175512.)

Figure 1. I/O Board Assembly showing location of U20

4. Turn the board over to the solder side and locate pins 2 and 20 of U20.

5. With a small soldering iron, using flux solder, carefully add a 100pF capacitor (OE P/N 702111)between pins 2 and 20. The finished installation should look like Figure 2.

Location ofU20

Top-Front ofI/O BoardAssembly

8/15/97


Figure 2. Solder side of I/O Board Assembly showing location of new capacitor.

4. Replace the I/O board into the card cage, tighten the mounting screws and re-attach the cables.


NOTE: For additional protection against noise interference on the SPI line, installsoftware Version 5.5A. You may request a copy of this software from yourOrthodyne representative.

Top-front of I/OBoard Assembly

Pin 2 of U20

Pin 20 of U20

Capacitor(P/N 702111)

Pin 1

Pin 2

Pin 20

10/16/97

Page 1 of 1



Subject: Z-Band ReplacementProcedure

Resp. Engineer:

DrawingNo.:

Model 360C: 172000 & 172003Model 360S: 172000, 172003,175000, & 175200


PartNo.:

Model 360C & 360S: 172018 V.P. Marketing: Bill Larkin

Models: All 360C family machines, and360S family machines


Purpose:

The purpose of Technical Bulletin 1080 is to describe the procedure for replacing the Z-band assembly(P/N 172018) in the field.

Applicable:

All Model 360C family machines and 360S family machines

Summary:

The Z-band has a critical adjustment that is not possible to accurately complete in the field. Therefore, ifa Z-band fails in the field, the entire Z-band assembly must be replaced. TB 1080 describes the procedurefor the proper replacement of the Z-band assembly.

10/16/97



Z-Band Replacement Procedure

ToolsNeeded:

Time toComplete:


Common hand tools 1 ½ Hour(s) EASYMetric Allen wrenches

MODERATE

DIFFICULT

Applicable

All Model 360C family machines and 360S family machines

Part Number

Z-band Assembly #172018

Assembly Drawing

Model 360C: 172000 & 172003Model 360S: 172000, 172003, 175000 & 175200

Problem

The Z-band (P/N 172250) must have the factory specified tension and alignment to function correctly andprovide dependable service. It has been found that adjusting the proper tension and alignment of the Z-band is not possible in the field. Therefore, if a Z-band requires service in the field, the entire Z-bandassembly (P/N 172018) must be replaced.

Solution

Technical Bulletin 1080 describes the procedure for the proper replacement of the Z-band assembly.

10/16/97


Procedure

NOTE: The majority of the following procedure covers both the Model 360C and 360Sbonders. However there are some differences in the placement of covers and thedereeler assembly. To point out the different steps, a [C] will be used next to a stepthat is ONLY for a model 360C, and a [S] will be used next to a step that ONLYapplies to the Model 360S bonder. ALL other steps apply to both Model 360C and360S.

Remove Z-band Assembly

NOTE: If your bonder is equipped with a handler, you will want to cover the handler to keepparts from falling into it.


2. Remove the top bonder cover (P/N 172221) from the bonder assembly. If you are performing this

procedure on a Model 360C, go to step #3. If you are performing this procedure on a Model 360S,

go to step #4.

3. [C] Remove the bearing housing cover (P/N 172222) from the Z-theta bearing assembly. Proceed

to step #6.

4. [S] Remove the left portion of the bearing housing cover assembly (P/N 175250). This is the door

portion of the assembly.

5. [S] Remove the dereeler assembly as follows:

a) [S] Remove the ribbon cable (P/N 175603) from the rear of the dereeler assembly

(see Figure 1).

10/16/97

Z-BAND REPLACEMENT PROCEDURE

Figure 1: Side/Rear View of Dereeler

b) [S] Remove the rear cover (P/N 175215) from the dereeler assembly (P/N 175200)

(see Figure 1).

c) [S] Remove the hose (P/N 649023) from the rear of the dereeler assembly (see Figure 2).

Figure 2: Remove Hose

d) [S] Remove the hose (P/N 649022) from the filter regulator

Ribbon Cable

Rear Cover

e
Hos
Page 3 of 8

assembly (P/N 699207).

10/16/97

Z-BAND REPLACEMENT PROCEDURE

e) [S] Remove the right bracket (P/N 175251), with the dereeler assembly attached, from the

bonder assembly (see Figure 3).

Figure 3: Remove Right Bracket Wi

6. Disconnect the Z-motor cable (P/N 172608-2).

7. Disconnect the Z-motor encoder cable.

8. Remove the two cap screws that hold the Z-motor in pldrive belt (P/N 603439).

Figure 4: Z-Motor Assembly And

Remove Two ScrewsTo Remove Z MotorBracket

Right Bracket

th Dereeler Attached

ace (see Figure 4). Remove Z-motor and

Z-Pulley Assembly

Dereeler Assembly

Remove ZDrive Belt

Page 4 of 8

10/16/97


9. Remove the Z-axis pulley assembly (P/N 172108) from the Z-drive shaft (P/N 172180)(see Figure 5).

10. Remove the e-type retaining ring (P/N 652204) from the end of the Z-drive shaft that you justremoved the Z-axis drive pulley from.

Figure 5: E-Type Retaining Rings On Z-Drive Shaft

11. Loosen the setscrews holding the Z-band hub onto the Z-drive shaft (P/N 172180). Loosen the setscrews enough so the Z-drive shaft may spin freely inside the Z-band hub.

12. Remove the two cap screws from the top of the Z-band assembly (see Figure 6). Raise the bondhead to the full up position.

Figure 6: Remove Cap Screws From The Z-Band Assembly

13. Holding the Z-band assembly with your right hand, use your left hand to spin and push the Z-driveshaft into the Z-band hub. The Z-drive shaft will not slide into the hub without spinning it.

Remove E-Type Retaining Ring Z-Band Hub

Z-Drive Shaft

Remove Two Cap Screws

10/16/97


14. When the Z-drive shaft is as far into the Z-band hub as possible, use a long, flat blade screwdriverthe gently remove the e-type retaining ring (P/N 652204) from the Z-drive shaft (see Figure 7).

NOTE: Be very careful not to damage the e-ring groove while removing the e-ring. Damageto the e-ring groove will result in not being able to remove the Z-band assembly fromthe bonder.

Figure 7: Remove E-Type Retaining Ring

14. Holding the Z-band assembly with your right hand, use your left hand to spin and pull the Z-driveshaft out of the Z-band hub. The Z-drive shaft will not slide out of the hub without spinning it.

15. Remove the Z-band assembly from the bonder assembly by gently lifting it out.

Install New Z-band Assembly

NOTE: Be extremely careful when handling and installing the new Z-band assembly. Do nottouch, bend, dent, or apply side loads to the Z-band. This will cause a significantshortening of the Z-band’s service life.

1. Lower the new Z-band assembly into place. Spin and slide the Z-drive shaft into the Z-band hubfar enough to gain access to the e-type retaining ring groove. Install the e-type retaining ring ontothe Z-shaft right behind the Z-band hub.

NOTE: There are one or two thin spacers that go between the e-type retaining ring and thebearing (see Figure 7). This spacer must be in place when the e-type retaining ring isplaced back into position.

2. Carefully install the e-type retaining ring onto the Z-drive shaft at the Z-axis pulley end.

Note Spacers Here Remove E-Type Retaining Ring

Move Z-Drive Shaft and Z-Band Hub

10/16/97


3. Install the Z-axis pulley onto the Z-drive shaft. Set the pulley about .06”(1mm) from the end of theZ-drive shaft (see Figure 8). Tighten set screws.

Figure 8: Install Z-Pulley Onto Z-Drive Shaft

4. Install Z-motor and drive belt. Align the pulleys and adjust the tension on the drive belt. Beltdeflection should be 1/16”(2mm) at 500 grams of force. It is usually sufficient to simply pull themotor by hand. Tighten the cap screws.

5. Connect the Z-motor cable and the encoder cable to the Z-motor.

6. Install the two cap screws at the top of the Z-band assembly, leaving them loose enough (about 1turn) for the arm to move freely for later adjustment.

7. Clean the threads on the setscrews (supplied with the Z-band assembly) with a degreaser oracetone. Apply one drop of Loctite 242 (supplied with the Z-band assembly) to the threads of eachscrew.

WARNING: Do not allow the Loctite 242 to get on the Z-band. Damage will result.

8. Rotate the Z-drive shaft several times to allow the Z-band assembly to find a relaxed position onthe shaft. Looking into the screw holes on the Z-band hub, you will be able to see the flats on theZ-drive shaft that the set screws will sit on. Install one set screw. As you begin to feel the set screwtouch the surface of the Z-drive shaft, move the shaft back and forth a little to ensure that the setscrew fully engages the flat on the shaft. Install the other set screw and follow the same procedureto engage the flat on the shaft. Tighten both set screws.

9. Move the bond head assembly up and down a few times. Lightly snug down the cap screws at thetop of the Z-band assembly. Tighten the cap screws completely after you are sure the Z-band isproperly aligned. If you are performing this procedure on a Model 360[C] proceed to step #11. Ifyou are performing this procedure on a Model 360[S], proceed to step #10.

NOTE: The idea here is to not bind the Z-band. The Z-band must be free of kinks andbinding. If there is any binding in the Z-band, the Z-band will be noisy and inaccurate,and will have a shorter service life.

.06" (1mm)

Z-Drive Shaft

Z-Axis Pulley Assembly

10/16/97


10. [S] Install the dereeler assembly as follows:

a) [S] Install the right bracket, with the dereeler assembly attached, to the bonder assembly.

b) [S] Install the hose to the filter regulator assembly.

c) [S] Install the hose to the rear of the dereeler assembly .

d) [S] Install the rear cover to the dereeler assembly.

e) [S] Install the ribbon cable to the rear of the dereeler assembly.

11. Install the top bonder cover to the bonder assembly.

12. Turn on the power to the bonder. Follow the next procedure to recalibrate Z Home.

Recalibrate Z Home

1. Perform Recalibrate Home (from the MAIN MENU, press [7],[9]).

2. Check that the Z Home Offset number is between 15-50 after recalibration is complete. If thenumber is between 15-50, proceed to step #4. If not, then proceed to step #3.

3. Loosen one screw holding the Z-home sensor (P/N 728520) in place. Push the sensor up or down asmall amount. Tighten the screw down. Do not over-tighten the screw, the sensor may crack.Perform recalibration. Continue until calibration is in specification. If you are performing thisprocedure on a Model 360C proceed to step #5. If you are performing this procedure on a Model360S, proceed to step #4.

NOTE: Perform Recalibrate Z for every device file in your system. Using Single touch forrecalibration is sufficient.

1. [S] Install the left portion of the bearing housing cover assembly.

2. [C] Install the bearing housing cover to the Z-Theta bearing assembly.

1/28/98

Page 1 of 1

TECHNICAL BULLETIN


APPROVAL SHEET


Subject: Calibration procedure forGenerator PCB

Resp. Engineer:T. Nguyen

DrawingNo.:

172565 (schematic) V.P. Engineering: “Bob” Babayan

PartNo.:

172567 (assembly) V.P. Marketing: Bill Larkin

Models: All Model 360C’s shippedbefore November 11, 1996 withGenerator Board (P/N 172567)


Purpose

This technical bulletin provides a field procedure for determining and setting the correct output voltageand phase settings for the generator board.

Applicable

Model 360C’s shipped before 11/11/96, equipped with generator board (P/N 172567).

Summary

The voltage and phase settings are set by the factory. There are times, in the field, when recalibrating thegenerator is necessary. This procedure describes the proper method to set the correct voltage, and phasesettings, on the generator.

1/28/98

GENERATOR CALIBRATION PROCEDURE Page 1 of 3



Calibration Procedure for Generator Board (P/N 172567)

ToolsNeeded:

Time toComplete:



Oscilloscope

Voltmeter, DC MODERATE

Orthodyne Electronics Standard Load Box (P/N 172478)

DIFFICULT

ObjectiveThis technical bulletin describes the calibration procedure for the generator board (P/N 172567).

ApplicableModel 360C’s shipped before 11/11/96, equipped with generator board (P/N 172567).

Part Number172567 (assembly)172565 (schematic)

Procedure

Output level calibration1. From the Main Menu, go to the Calibration Menu (Item 7) and select Generator Test (Item 3).


3. Unplug the BNC connector (generator to junction board cable, P/N 172618-1) from the back ofthe generator board (P/N 172567) (see Figure 1).

1/28/98


Figure 1: Unplug BNC Connector From The Rear Of The Generator Board

1. Plug in the BNC connector probe from your oscilloscope into J8, where you just disconnected thegenerator to junction board cable.

2. Press F14 “Generator Output Cal” and follow the instructions on the screen.

3. With a small screwdriver, adjust the “POWER CALIB” pot on the front of the generator boarduntil the oscilloscope reads 300 Vp-p (see Figure 2).

4. Press STOP to end the generator calibration.

Figure 2: “POWER CALIB” Pot on the Front of Generator Board

Sampling gain calibration1. Remove the oscilloscope connector from J8 and plug in an OE Generator Load Box Assembly,

(P/N 172478). Set the load box rotary switch to “R” to engage the 84.5 Ohm resistor.

2. From the Main Menu, go to the Calibration Menu [7], and select Generator Test [3].

“POWER CALIB” Pot

BNC Connector

1/28/98


3. Press and hold down the START button. The indicator should read 50. If not, adjust the “FINEADJUST” pot on the front of the generator (see figure 3) until the indicator shows 50.

Figure 3: “FINE ADJUST” Pot on the Front of Generator Board

Phase calibration1. Remove the OE Generator Load Box Assembly and connect the generator to junction board cable

back onto J8.

2. Connect a voltmeter, set to mVDC(millivolts DC), to the “PHASE SHIFT” output on the front ofthe generator board (see Figure 4).

Figure 4: Phase Shift Output and “Freq Adjust” Pot on the Front of Generator

3. From the Main Menu, go to the Calibration Menu [7], and select Generator Test [3].

4. Press and hold down the START button.

5. Using the “FREQ ADJUST” pot on the front of the generator (see Figure 4), adjust the voltage toread 0 volts ±10mV.

NOTE: Generator will time-out after a few seconds. Press START to re-start the test.

6. Disconnect the BNC voltmeter connection from the front of the generator.

7/20/98

PAGE 1 OF 1


No.: 1083 Rev: A Prepared By: George Ritsi

Subject: Add Capacitor to Forcer/FocusBoard

Resp. Engineer:

Drawing

No.:


“Bob” Babayan

Part No.: 175537 and 702408 V.P. Marketing:Bill Larkin

Models: All Model 360S family machineswith Forcer/Focus Board P/N175537, Rev. F1, or earlier


Purpose

The purpose of this Technical Bulletin is to describe the procedure for installing a capacitor (P/N 702408) on theforcer/focus board (P/N 175537).

Revision A

Added value of capacitor for P/N 702408 (.047 µF, 50VDC, ±5%).

Applicable

All Model 360S family machines with Forcer/Focus board (P/N 175537) of revision F1, or lower.

Summary

During DAC damping calibration it was found that the values were inconsistent. This was attributed to excessivenoise on the forcer control line. The solution is to install a capacitor (P/N 702408) across the backside of the R25resistor on the forcer/focus board. By reducing the noise on the LVDT line, the DAC damping values will beconsistent.

7/20/98

INSTALL CAPACITOR FORCER/FOCUS BOARD P/N 175537 PAGE 1 OF 4

TECHNICAL BULLETIN No. 1083 Rev A.

Add Capacitor to Forcer/Focus Board P/N 175537

ToolsNeeded:

Time toComplete:




Solder with Flux (.036” - .020” diameter) MODERATE

DIFFICULT

Applicable

All Model 360S family machines with Forcer/Focus board (P/N 175537) of revision F1, or lower.

Revision A

Added value of capacitor for P/N 702408 (.047 µF, 50VDC, ±5%).

Problem

During DAC damping calibration it was found that the values were inconsistent. The cause was excessive noise onthe forcer control line.

Solution

The solution to this problem is to install a capacitor (P/N 702408) across the backside of the R25 resistor on theforcer/focus board. By reducing the noise on the LVDT line, the DAC damping values will be consistent.

Procedure

Follow the procedure below to install the capacitor to the forcer/focus board in your Model 360S bonder.

Remove Forcer/Focus Board From Bonder Assembly


ESD Warning: Wear grounding straps when handling the printed circuit boards to preventelectro-static discharge from damaging sensitive electronics components onthe boards.

7/20/98


2. Remove the bonder top cover (P/N 172221) from the left side of the bonder assembly (P/N 172003) (see Figure 1).

Figure 1: Remove Top Bonder Cover

3. Locate the forcer /focus board on the rear panel of the dereeler assembly (P/N 172025) (see Figure 2).

Figure 2: Locate Forcer/Focus Board

Remove Top Bonder Cover

Forcer/Focus Board

7/20/98


4. Disconnect all cables from the forcer/focus board (see Figure 3).

Figure 3: Disconnect All Cables From the Forcer/Focus Board

5. Remove the forcer/focus board from dereeler assembly by removing the four mounting screws.

Solder Capacitor Onto The Forcer/Focus Board At R25 Resistor

1. Locate the R25 resistor on the forcer/focus board (see Figure 4).

Figure 4: Locate R25 Resistor

Disconnect All Cables Disconnect All Cables

Locate R25 Resistor

7/20/98


2. Turn the board over and locate the R25 resistor on the back of the forcer/focus board.

3. Solder capacitor (P/N 702408) (.047 µF, 50VDC, ±5%) across the R25 resistor (see Figure 5).

Figure 5: Solder Capacitor Across R25.

Install Forcer/Focus Board Into Bonder Assembly

1. Install the forcer/focus board back into the bonder assembly using the four mounting screws you removedearlier.

2. Connect all cables back onto the forcer/focus board.

3. Install the top bonder cover back onto the bonder assembly.


Solder Capacitor Across R25

1/26/98

PAGE 1 OF 1


No.: 1086 Rev: A Prepared By: Randall Maynard

Subject: Isolate Head Controller Board on360S Bond Head

Resp. Engineer:

Drawing

No.:


“Bob” Babayan

Part No.: 175004 and 175517 V.P. Marketing:Bill Larkin

Models: All Model 360S family machineswith P/N 175517 of Rev. C orlower.


Purpose

The purpose of this TB1086 is to describe the procedure for isolating the ground connection between the headcontroller board (P/N 175517) and bond head (P/N 175004) on a model 360S machine.

Applicable

All Model 360S family machines with head controller board (P/N 175517) of revision C, or lower.

Summary

There is a small voltage difference between the bonder chassis and the tip of the bonding tool. That voltagedifference is sometimes called “ground potential.” On Model 360S with Head Controller board 175517 Rev C orearlier, the ground potential is around 10 to 15 mV. This voltage may exceed some specs on bonded devices.

Using the parts in the table below, the customer can lower the ground potential by isolating the Head Controllerboard from the bond head.

You will need the following parts to complete this procedure:


8 670035 Washer, Flat, Nylon

4” (10cm) 733205 Heat Shrink Tubing, .12” Diameter, Black

It is not necessary to distribute this Technical Bulletin to all customers and is only intended for “as needed” usage.

Revision A

Revision A corrects the following:

• Heading on page 4 of 5 changed to read “Test Head Controller Board For Ground Isolation.”

• Move “Warning” message from page 5 of 5 to page 4 of 5.

1/26/98

ISOLATE HEAD CONTROLLER BOARD ON MODEL 360S BOND HEAD PAGE 1 OF 5


Isolate Head Controller Board on Model 360S Bond Head

ToolsNeeded:

Time toComplete:



Heat gun (blower)

Scissors and/or Razor blade MODERATE

Ohm Meter

DIFFICULT

Revision A

Revision A corrects the following:

• Heading on page 4 of 5 changed to read “Test Head Controller Board For Ground Isolation.”

• Move “Warning” message from page 5 of 5 to page 4 of 5.

Applicable

All Model 360S family machines with head controller board (P/N 175517) of revision C, or earlier.

Problem

A difference in the ground voltage-potential exists on Model 360S bonders equipped with head controller boards ofrevision letter “C”, or earlier. In rare cases, this condition could cause voltage breakdown damage to specializedlogic devices.

Solution

The solution is to install flat, nylon washers, and shrink tubing, to the mounting screws of the head controller board.This will isolate the ground connection to the head controller board.

Procedure

You will need the following parts to complete this procedure:


8 670035 Washer, Flat, Nylon

4” (10cm) 733205 Heat Shrink Tubing, .12” Diameter, Black


1/26/98


ESD Warning: Wear grounding straps when handling the printed circuit boards to preventelectro-static discharge from damaging sensitive electronics components onthe boards.

2. Remove the rear cover (P/N 175318) of the bond head (see Figure 1).

Figure 1: Remove the Rear Cover of the Bond Head

3. Disconnect all the cables from the head controller board (P/N 175517) (see Figure 2).

Figure 2: Disconnect All Cables From the Head Controller Board

Disconnect All Cables Disconnect All Cables

Remove Rear Cover From Bond Head

1/26/98


4. Remove the head controller board by removing the four mounting screws that hold the board to the bond head.

Figure 3: Remove the Head Controller Board From the Bond Head

5. Cut 4 pieces of shrink tubing (P/N 733205), ¼” (6mm) in length.

6. Using a heat gun, shrink the tubing onto the four mounting screws (see Figure 4). You may want to cut theshrink tubing a little long, shrink it, and then trim the tubing to the proper length with a razor blade.

Figure 4: Shrink Tube the Mounting Screws

Remove Four Screws

1/26/98


7. Place a nylon washer (P/N 670035) on each side of the head controller board and install board to the bond head(see Figure 5).

Figure 5: Place Nylon Washers on Screws and Install Board to Bond Head

8. Do not connect any cables until you have completed the following test.

Test Head Controller Board For Ground Isolation

WARNING: Do not connect any cables when performing this continuity test.

1. Set your Ohm meter to Ohms infinity (Ω ∞).

2. Place one probe on the upper end of R2 shown in Figure 6. Place the other probe on the head of any of the fourmounting screws shown in Figure 6. Your Ohm meter should show an open circuit (no connection). If it doesn’tshow an open circuit, the board is still grounded to the bond head. Check that all the nylon washers areinstalled. Check that all the screws are covered sufficiently with shrink tubing.

Nylon Washers (P/N 670035)

Screw With Shrink Tubing

Head controller Board and Spacer

1/26/98


Figure 6: Place Ohm Meter Probes at These Locations

3. Connect all cables to appropriate connectors.

4. Replace rear cover on bond head. Rotate the bond head back to the normal, “home” position.


Place Probe on any Screw Head

Place Probe on Upper End of R2

03/10/99

PAGE 1 OF 1



Subject: Replace Connector on PR MonitorCable P/N 172619

Resp. Engineer:

Drawing

No.:


“Bob” Babayan


Models: All Model 360C family and Model360S family machines


Purpose

The purpose of this Technical Bulletin is to describe the procedure to replace a connector on the power supply to PRmonitor cable (P/N 172619).

Applicable

All Model 360C family and 360S family machines

Summary

An estimated 16-20 machines were shipped with an improper sized connector on the power supply to PR monitorcable (P/N 172619). The proper connector has a white, plastic tip that identifies the inside diameter of the connector.The improper connector tip has a black, plastic tip. The black, plastic tipped connector does not fit the monitorconnection correctly and may come loose. If a customer finds they have a connector with a black, plastic tip, it mustbe replaced with the correct connector (P/N 707042).

The customer will need the following parts to complete the procedure.


1 707042 Connector, 2 P Plug, Male

20mm 733204 Tubing, Plastic Shrink, .19” diameter, Black

03/10/99

REPLACE CONNECTOR ON PR MONITOR CABLE P/N 172619 PAGE 1 OF 1


Replace Connector on PR Monitor Cable P/N 172619

ToolsNeeded:

Time toComplete:




Solder with flux (.036-.020” diameter) MODERATE

Heat gun

DIFFICULT

Applicable


Problem

The power supply to PR monitor cable (P/N 172619) has a connector at the PR monitor that must have a certaininside diameter to fit properly. Some connectors do not have the correct inside diameter. Connectors with white,plastic tips have the correct inside diameter. Cables with black, plastic tips do not have the correct inside diameter.Connectors with a black, plastic tip may come loose from the PR monitor. This could cause a short circuit againstthe bonder chassis.

Solution

First, you will need to determine the kind of connector your power supply to PR monitor cable has. The solution tothis problem is to replace the connector at the PR monitor with the proper connector.

Procedure

You will need the following parts to replace your connector.


1 707042 Connector, 2 P Plug, Male

20mm 733204 Tubing, Plastic Shrink, .19” diameter, Black

Determine What Connector You Have

You will need to determine which connector you have. Follow the instructions below to determine if you need toreplace your connector. If you have already determined that you have a black, plastic tip on your connector, godirectly to “Locate And Remove Connector.”


03/10/99


2. Find the power supply to PR monitor cable (P/N 172619) located at the back of the PR monitor (P/N 172548)(see Figure 1).

Figure 1: Find the Power Supply to PR monitor Cable

3. Disconnect the power supply to PR monitor cable from the PR monitor.

4. Take a look at the connector on the end of the cable (see Figure 2). Does it have a white, or black plastic tip? Ifit is white, you have the proper cable-end. Go to step # 5. If you have a black, plastic tip, you will need toreplace it with a new connector. Go to step #4 of “Locate and Remove Connector.”

Figure 2: Do You Have A White Or Black Tip on Your Connector?

5. Connect the power supply to PR monitor cable back to the PR monitor.


Locate And Remove Connector


Power Supply to PR monitor Cable (P/N 172619)

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2. Find the power supply to PR monitor cable (P/N 172619) located at the back of the PR monitor (P/N 172548)(see Figure 3).

Figure 3: Find the Power Supply to PR monitor Cable (P/N 172619)

3. Disconnect the power supply to PR monitor cable from the PR monitor.

4. Hold the end of the connector and unscrew the black, plastic cover from the connector. This will expose thewires and their connection to the connector.

5. Cut the connector off of the two wires.

Solder Connector (P/N 707042) To Cable

1. Strip about 1/8”(3mm) of insulation from the end of each wire.

2. Slide the shrink tubing down the cable far enough to not be effected by the heat from soldering.

3. Tin each wire with solder.

4. Solder the black wire to the short connection and the brown wire to the long connection of connector(P/N 707042) (see Figure 4).

Note: The ground (-) connection is on the inside of the connector. The +12 volt connection ison the outside of the connector.

Figure 4: Solder Black and White Wire to Connector

5. Place the shrink tubing over the connections and shrink the tubing with the heat gun.

6. Replace the black, plastic cover onto the connector.

7. Plug the connector into the PR monitor.

8. Turn the power to the bonder.

Power Supply to PR monitor Cable (P/N 172619)

Black Wire

Brown Wire

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X & Y Outrigger Rail & Outrigger Bearing Replacement

Applicable

Model 360B/C & Model 360S family machines

Problem

Orthodyne Electronics has been informed of isolated instances where the outrigger be(P/N 600028) has seized. This is a “sealed” bearing which makes it difficult to inspect.the bearing seizes, it may wear a groove into the outrigger rail (P/N 172107-1, -2) if noreplaced soon after failure.

If you hear a “squeaking” sound coming from the bonder assembly (P/N 172003), intigate immediately. Determine the cause and take action to fix the problem. If you finthat the problem is the outrigger bearing, follow this procedure to replace the bearinCheck the outrigger rail for wear, and replace if you detect any sign of wear.

Another technique to determine if the outrigger bearing has seized is to use Manualtioning to move the bonder in X and Y direction while looking at the outrigger bearinMake sure they rotate. If they do not, then they must be replaced.

Solution

Orthodyne has selected a new type of roller bearing (P/N 600511) as a replacementhe outrigger bearings. The replacement procedure described below uses each of thexisting bearings as a reference for changing its opposite mate. The bearings are mon eccentric shafts, so it is important that the new bearing be replaced in the same ption as the old one in order that the X and Y tables run true.


Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5


Torque Wrench (inch/lbs. or Nm)

Braycote 622 Grease (P/N 172850-1) MODERATE

DIFFICULT

ORTHODYNE ELECTRONICS TECHNICAL BULLETIN TB1089 PAGE 1 OF 18

3/10/99

atnotne

WARNING: This procedure is difficult. It must be done carefully, with greattention to detail. Do not attempt this procedure if you are qualif ied. If you need assistance, contact your OrthodyElectronics representative or the factory.

Ordering Information

Replacement parts are available in three kit choices:

Kit Number Kit Description

172479-01 Outrigger Bearing Replacement for X and Y Axis

172479-02 Outrigger Rail and Bearing Replacement for Y Axis

172479-03 Outrigger Rail and Bearing Replacement for X Axis

Kits contain the following List of Materials:

-01Qty

-02Qty

-03Qty Part No. Description

2 1 1 171253-1 Shaft, Eccentric, Outrigger, Upper

2 1 1 171253-2 Shaft, Eccentric, Outrigger, Lower

4 2 2 600511 Roller Bearing, 10 ID x 30 OD x 15 WD

2 1 1 652011 Retaining Ring, E-type, 3/8” shaft

- 1 - 172107-2 Outrigger rail, Y-Axis

- - 1 172107-1 Outrigger rail, X-Axis

- 4 6 500500-12 Screw, Soc Hd, Aly, M5 X .8 X 12mm LG

1 1 1 122304 Alignment Gauge (Position Reference Jig)

1 1 1 Drawing 172479, Outrigger Rail & Bearing Repl.

1 1 1 Tech Bulletin TB 1089 X & Y Rail & Bearing Repl.


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Procedure

The following procedure describes how to replace the Y Outrigger rail and Y Outriggbearings. To replace the X outrigger rail and X outrigger bearings, see “Replace X Origger Rail and X Outrigger Bearings” on page 12. To replace both rails and all four ings, follow the entire procedure starting with “Replace Y Outrigger Rail and Y Outrigger Bearings”.

Refer to drawings 172000, 172003, and 172479 (included with the bearing replacement

Replace Y Outrigger Rail and Y Outrigger Bearings

Remove The Covers


WARNING: Check to make sure that the bond head will not be able to conanything on the work table. You will be moving the bonder assebly manually. Contacting the bond head with another object mcause expensive damage.

2. Remove the top bonder cover (P/N 172221) from the bonder assemblyFigure 1 ).

Figure 1 Remove the Left Bellows from the Bonder Assembly

3. Remove the left X-axis bellows (P/N 171123) on the left side of the boassembly (see Figure 1 ). You do this by removing the three screws that hold outer bellows plate in place and then removing the three screws that hooutside bellows frame in place (P/N 172169 & 172170). Also remove thebellows plate (2 button-head screws).

Remove Left X-Axis Bellows

Remove Top Bonder Cover


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e X-rside

4. Remove the front plate of the base casting, which will allow easy access slots in this casting. This will simplify the removal and installation of screwsthe outrigger roller assembly.

5. Locate the Y Outrigger rail and Outrigger bearings (see Figure 2 ).

Figure 2 Locate Y Outrigger Rail and Outrigger Bearings

Attach The Position Reference Jig

1. Move the head to the position shown in Figure 3 and install the position refer-ence jig (P/N 122304) in the center bellows screw hole on the edge of thcasting. Make sure the tip is pressed up solidly and flat against the undesurface of the Y-casting as shown in Figure 4 , on page 5. Tighten the screw.

Y Outrigger Rail

Y Outrigger Bearings


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een

Figure 3 Locating The Position Reference Jig

Figure 4 Jig Must Be Flat And Tight Against Y-Casting

NOTE: Do not move the table forward or backward until the jig has bremoved!

Position Reference Jig

X-Casting

Y-Casting

Jig must be flat and tight against bottom of Y-Casting


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2. Loosen the setscrew for the upper roller and remove the shaft and rollerFigure 5 for location.)

3. Clean any old grease from the upper roller housing and the outrigger rail.

Figure 5 Y Outrigger Roller Assembly

4. Install the new eccentric shaft (P/N 171253-1) and roller bearing. Make surshaft is pushed all the way in.

5. Turn the upper eccentric shaft so the roller does not touch the surface of that this time. Lightly tighten the setscrew to apply drag on the shaft while ading it.

6. Turn the eccentric shaft clockwise until the roller makes firm contact withtop surface of the outrigger rail. This contact should be firm enough so the bearing can just barely be rotated by your fingers when pushing on top oroller. When adjusted properly, it should take a good amount of force wclean (un-greasy) finger to rotate the bearing. See Figure 6 .

NOTE: Make sure you actually see the bearing turn. The bearings are so smit sometimes feels like they're turning when they're not.

Shoulder Screw Y Outrigger Rail

Belleville Washers

Upper Roller Eccentric Shaft

Lower Roller Eccentric Shaft

Setscrew For Upper Roller Shaft


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Figure 6 Rotate Upper Bearing While Adjusting Eccentric Shaft

7. Carefully tighten the setscrew making sure to maintain the position ofeccentric shaft. When properly adjusted, the position reference jig should the same position relative to the Y-casting as in step 1 on page 4.

8. Remove the position reference jig from the side of the casting.

Replacing The Lower Bearing

1. Remove the shoulder screw and belleville washers that apply force to the roller assembly. See Figure 7 , on page 8. Be sure to note the orientation of belleville washers. Some face cone-up, and others face cone-down. Their tation is important because they act as a stiff spring. You do not need to rethe belleville washers, but if you do, they must be re-assembled in the configuration later. (See drawing 172479 supplied with the kit.)

2. Remove the two cap screws holding the lower outrigger arm to the Y-casand remove that assembly. See Figure 7 .


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Figure 7 Remove the Lower Outrigger Arm

3. Loosen the setscrew holding the lower eccentric shaft and remove the shaf

4. Remove the E-ring holding the lower roller bearing to the eccentric shaft.

5. Install the new eccentric shaft and bearing, and install the E-ring.

NOTE: If you do not need to replace the Outrigger Rail, proceed to “InstallLower Y Outrigger Arm Assembly”, on page 10.

Replacing The Y Outrigger Rail

WARNING: For the next procedure, be very careful not to allow the Y-axiscasting to roll off the Y-axis linear guide (P/N 171150-2). If the casting is allowed to roll off the Y-linear guide, in either directiothe bearings will come out of the linear guide. You will not be ato put them back in place properly. The only fix will be to purchaand install a new linear bearing.

1. Manually move the Y-casting forward to expose the rear screws that helpthe outrigger rail to the X-axis (P/N 172137-99) casting. Remove all thscrews that are visible (see Figure 8 ).

NOTE: You may have to back off the nylon stop screw at the rear of thecasting to provide enough clearance to remove the front rail screw. Areplacing the rail, return the stop screw to its original position.

Remove Cap Screws

Setscrew

Shoulder Screw and Belleville Washers


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Figure 8 Remove the Rear Three Screws From the Y Outrigger Rail

2. Manually move the Y-casting to middle of its travel.

3. Remove the two screws (see Figure 9 , on page 9) that hold the Y-casting to thself aligning nut assembly (P/N 172008). Access to these screws may bepered by the cables. You may find it easier to remove these screws by usextended T-wrench or offset ratchet handle with a 3 mm bit.

Figure 9 Remove Two Screws from Self Aligning Nut Assembly

Y Outrigger RailRemove Three Screws

Remove Two Screws

Theta Axis Motor


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4. Carefully move the Y-casting to the rear until you can just see the front scthat holds the outrigger rail in place (see Figure 10 ). Remove the screw andslide the outrigger rail out from under the Y-casting.

Figure 10 Remove the Front Screw From Y Outrigger Rail

NOTE: If there are any shims under the outrigger rail, replace them in the sposition when replacing the rail.

Install Y Outrigger Rail

1. Slide the new outrigger rail into place.

2. Loosely install the front screw.

3. Move the Y-casting forward to allow the three rear screws to be installed. Inthe screws. Bias the screws in the counterbores in the direction of the ashown in Figure 10 , on page 10. Tighten all the screws to 100 in-lb. (11.3 Nm

4. Carefully move the Y-casting to the rear and tighten the front screw to 10lbs. (11.3 Nm).

5. Move the Y-casting over the self aligning nut. Re-install the two screws tighten. Do not overtighten these screws to avoid stripping them.

Install Lower Y Outrigger Arm Assembly

1. Position the shaft so the roller will be down, away from the outrigger rail wthe assembly is installed on the Y-casting.

Push The Rail In The Direction Of The Arrow When Replacing The Screws


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NOTE: Make sure the roller is against the side of the Outrigger Arm when tiening the setscrew. There should be no gap between the roller and ring, or the roller and the arm (see Figure 11 ).

Figure 11 Lower Roller Bearing Should Be Snug Against The Arm

2. Re-install the lower Outrigger Arm. Use the position reference jig to posthe rear of the arm and lightly tighten one of the screws. When the notch la“Y” on jig is placed against the rail, the body of the jig should be flat againstarm. See Figure 12 .

Figure 12 Using Jig To Adjust Outrigger Arm Parallel To Table

3. Move the jig to the roller-end of the outrigger arm to set the position. Whenarm is parallel to the casting surface, tighten the remaining cap screw to hoarm in place. Re-check that the screw-end of the outrigger arm is still paand fully tighten both cap screws.

No Gaps When Re-installing Roller

Large Notch In Jig Is Flat Against Machined Surface Of Casting

Side Of Jig Is Flat Against Outrigger Arm


3/10/99

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4. Adjust the lower roller upward until it is just touching the under side of the Notice that as you turn the eccentric screw, the bearing will turn with the suntil contact is made with the rail. Then the outer race will stop turning. Pdown on the Y-casting when you make this adjustment.

5. Tighten the setscrew. Verify position of the shaft and roller. (See Note on page

6. Re-install and tighten the shoulder screw and the belleville washers in original orientation. Tighten the shoulder screw fully so the shoulder is tagainst the casting.

7. Lightly lubricate the rail with Braycote 622 grease (P/N172850-1).

NOTE: If you are going to replace the X Outrigger rail and bearings, do install the left bellows at this time, go to the next section, “ReplacOutrigger Rail and X Outrigger Bearings”. If you are not going toreplace the X Outrigger rail and bearings, go to the next step.

8. Manually move the bonder assembly close to “home” (center of table travX and Y directions).

9. Turn on the power to the bonder. Go to “Recalibrate the Bonder”.

Recalibrate the Bonder

To perform some of these recalibrations, you may find access is easier if you removY-axis bellows from the rear of the bonder assembly. Locate the Y-axis bellows andremove it using the same basic procedure you used to remove the left X-axis bellow

1. Perform the following bonder calibrations:

z Recalibrate Home

z Recalibrate Limits

z Offset calibration

z Recalibrate Z

2. Install the left X-axis bellows. If you removed the Y-axis bellows from bonder assembly, install it now.

Replace X Outrigger Rail and X Outrigger Bearings

Remove Outrigger Arm



3/10/99

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WARNING: Check to make sure that the bond head will not be able to conanything. You will be moving the bonder assembly manually. Ctacting the bond head with another object may cause expendamage.

2. Remove the X-axis bellows (P/N 171123) on the right side of the bonder asbly (P/N 172003) (see Figure 1 , on page 3). You do this by removing the thrscrews that hold the outer bellows plate in place and then removing the screws that hold the outside bellows frame in place (P/N 172169 & 172170

3. Perform the same procedure as step 2 to remove the X-axis bellows froright side of the bonder assembly.

4. Remove the Y-axis bellows by removing the Y-axis outer bellows plate aninner Y-axis bellows plate (P/N 172174 & P/N 172173) from the bonder assbly. This is similar to the previous two steps.

5. Remove the rear base cover (P/N 172220).

6. Clean any old grease from the bearing holder and the outrigger rail.

Replacing The X-Axis Outrigger Bearings

1. Position the head as shown in Figure 13 so the shoulder screw is in the center the shoulder screw cutout in the base casting.

Figure 13 X-Axis Outrigger Arm

Shoulder Screw

Shoulder Screw CutoutCap Screws Attaching The Arm

X Outrigger Arm


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2. Install the position reference jig to the rear bellows screw hole on the edthe X-casting. Make sure the tip of the jig is pressed down solidly, and thajig is flat against the top surface of the base casting as shown in Figure 14 .

Figure 14 Attaching The Position Reference Jig To The X-Casting

3. Remove the two screws that hold the Y-motor assembly (see Figure 15 ) to theX-axis casting (P/N 172137-99). Remove the belt. Set the assembly dowthe bonder assembly. Do not disconnect the cables

Figure 15 Remove Y-Motor Assembly

Jig must be flat against machined surface

Remove Two ScrewsRemove Two Screws

Y-Motor Assembly


3/10/99

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4. Loosen the setscrew for the upper roller and remove the shaft and roller.

5. Install the new shaft and roller, making sure the shaft is pushed all the waPosition the eccentric shaft so the roller does not touch the rail at this Lightly tighten the setscrew to apply drag to the shaft while adjusting it.

6. Turn the eccentric shaft clockwise until the roller makes firm contact withtop surface of the outrigger rail (see Figure 16 ). This contact should be firmenough so the roller bearing can just barely be rotated by your fingers wpushing on top of the roller. When adjusted properly, it should take a gamount of force with a clean (un-greasy) finger to rotate the bearing.

NOTE: Make sure you actually see the bearing turn. The bearings are so smit sometimes feels like they're turning when they're not.

Figure 16 Adjust Position Of Upper X-axis Bearing

7. Carefully tighten the setscrew making sure to maintain the position ofeccentric shaft.

8. Remove the position reference jig from the side of the casting.

Replacing The Lower X-Axis Outrigger Bearing

1. Loosen the setscrew holding the lower roller shaft, and rotate the shaft sthe roller no longer touches the underside of the outrigger rail.

2. Remove the shoulder screw and belleville washers that apply force to the roller assembly. See Figure 13 , on page 13.


3/10/99

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NOTE: Be sure to note the orientation of the belleville washers. Some face cup, and others face cone-down. Their orientation is important becthey act as a stiff spring. They must be re-assembled in the same curation later.

3. Remove the two cap screws holding the lower outrigger arm to the Y-casand remove that assembly.

4. Wipe the area between the roller and the rail clean so there is no grease area.

5. Loosen the setscrew holding the lower eccentric shaft and remove the shaf

6. Remove the E-ring holding the lower roller bearing to the eccentric shaft.

7. Install the new eccentric shaft and bearing, and install the E-ring.

Remove and Replace X Outrigger Rail

NOTE: If you are not replacing the X-Axis Outrigger Rail, proceed to “Replac-ing The X-Axis Lower Outrigger Bearing.”

1. Move the bonder assembly all the way to the left. Remove all the screwsthe outrigger rail that you can reach.

2. Move the bonder assembly all the way to the right. Remove all the remascrews from the outrigger rail.

3. Remove the outrigger rail and place the new rail into position.

4. Loosely install all the screws. Center the screw heads in the counterboresthe rail towards the back of the machine as you tighten the screws.

5. Tighten all the screws to 100 in-lb. (11.3 Nm).

Replacing The X-Lower Outrigger Arm

1. Position the shaft so that the roller will be down, away from the outriggerwhen the assembly is installed on the X-casting.

NOTE: Make sure the roller is against the side of the Outrigger Arm wtightening the setscrew. There should be no gap between the rollethe E-ring, or the roller and the arm (see Figure 17 ).


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arm.

Figure 17 Lower Roller Bearing Should Be Snug Against The Arm

2. Re-install the lower Outrigger Arm. Use the position reference jig to posthe rear of the arm and lightly tighten one of the screws. When the notch la“X” on jig is placed against the rail, the body of the jig should be flat againstarm. See Figure 18 .

3. Move the jig the roller-end of the outrigger arm to set the position. Whenarm is parallel to the casting surface, tighten the remaining cap screw to hoarm in place. Re-check the screw-end of the outrigger arm for parallel andtighten both cap screws.

Figure 18 Adjust Outrigger Arm To Be Parallel To Casting

4. Adjust the lower roller upward until it is just touching the under side of the Turn the roller with your finger while adjusting to feel when it just touchPress down on the X-casting when you make this adjustment.

5. Tighten the setscrew. Verify that the roller is flush against the outrigger You may now stop pressing down on the casting.

No Gaps When Re-installing Roller

Small Notch is flat against casting

Jig is flat against Arm


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theiright

when

6. Re-install and tighten the shoulder screw and the belleville washers in original orientation. Tighten the shoulder screw fully so the shoulder is tagainst the casting.

7. Lightly lubricate the rail with Braycote 622 grease (P/N172850-1).

8. Re-attach the Y-motor assembly and the belt.

9. Tension the belt. The belt should have about 0.25 inch (6 mm) deflection approximately 1000 gram force is applied to the center of the belt.

10. Manually move the bonder assembly close to “home.”

11. Turn on the power to the bonder. Go to “Recalibrate the Bonder”.

Recalibrate the Bonder

1. Perform the following bonder calibrations:

z Recalibrate Home

z Recalibrate Limits

z Offset calibration

z Recalibrate Z

2. Install the left X-axis, right X-axis, and Y-axis bellows.


12/4/98

Cleaning the ALC Jaws

Applicable

Model 360C with Active Loop Control (ALC) Head

Purpose

The purpose of this Technical Bulletin is to describe a recommended procedure for clean-ing the wire clamp jaws of the ALC bond head of accumulated aluminum buildup.

Background

Some customers have observed an occasional buildup of aluminum on the wire clamp jaws of the ALC head. Orthodyne developed a simple procedure for cleaning the jaws that could still preserve the wire clamp adjustment.

Solution

The idea for cleaning the clamps is to open the clamps manually, insert a folded strip of abrasive paper between the jaws, close the jaws and pull the abrasive paper through.

Material Required

Cleaning strip, OE P/N 177900

Prepare cleaning strip as shown below:


Cleaning StripP/N 177900

Abrasive Side

Fold Cleaning Strip in Half so Abrasive is Outside

Abrasive Side

Abrasive Side


12/4/98

Procedure

1. Move bond head to Z-home.

2. Set clamps to close position

3. Move the clamps backwards using the “unlock” button.

4. If larger than 10mil wire is used, use adjustment screw to loosen clamp cable untilclamps touch.

5. Open clamps manually by squeezing them together above the pivot.

6. Fold cleaning strip in half, so abrasive side is on the outside.

7. Position the abrasive strip between the clamps.

8. Close the clamps by squeezing them together below the pivot (with approxi-mately 500 grams force).

9. Pull strip towards you and downward until it exits clamp.

10. Repeat if necessary, but no more than twice.

11. Lock clamps in position.

12. If larger than 10mil wire is used, re-adjust the slack in the clamp cable if neces-sary.

13. Re-adjust clamp open steps if necessary. (Refer to ALC Supplement, Manual No.177000, page 3-3.)

Cleaning Interval

Cleaning interval is highly dependent on the application and the adjustment of the clamp. Orthodyne recommends you observe the clamps periodically (approximately 40,000 bonds), for any evidence of aluminum buildup. Clean only if necessary.


6/11/98



Subject: Change in Bonding Wedge PartNumber.

Resp. Engineer:

Drawing

No.:

V.P. Engineering:

“Bob” Babayan

Part No.: 127153 Rev. B V.P. Marketing:Bill Larkin

Models: All Model 360C family and Model360S family machines


Purpose

The purpose of this Technical Bulletin is to alert customers of an impending tool change. The revision numberchange from Rev A to Rev B reflects a tightening of manufacturing tolerance for the tools.

Applicable


Summary

Orthodyne is implementing dual sources for our bonding tools. We have been sole source buying tools fromDeweyl. We are now adding Gaiser to the approved vendor list. To facilitate comparable quality from two differentsources, we have tightened the manufacturing tolerances for the 127153 tools. We have assigned REV B to thesenew tools.

Engineering tests with prototype tools built against the new manufacturing drawings show that the Rev B toolperformance is within +/- 5% of the Rev A. tool. This is considered to be within an acceptable process window.

The Rev B change for tightened tolerances will apply to:

Part Number 127153 - 4 through 127153 - 12 tools.

NOTE: Tool P/N 127153 - 14 through 127153 - 25 will be designated as Rev B, but therewill be no physical changes to the tool manufacturing drawings. All specificationsfor these tools remain the same.

6/11/98


Bonding Wedge Tool Revision Letter Change

Applicable

All Model 360C familyBonding Tool Series P/N 127153-XX

Background

Orthodyne has tightened the manufacturing specifications and tolerances for these tools. Changes to themanufacturing drawings are within the tolerance window of the previous drawings. We anticipate these tools willhave no impact on process parameters, but will enhance performance repeatability.

The purpose of this Technical Bulletin is to alert customers that there will be a revision change to the part number ofthese tools.

Discussion

Bonding tool series P/N 127153 Rev. A, will be changed to P/N 127153 Rev. B. The revision involves a tighteningof manufacturing tolerances on the following tools:

The Rev. B change for tightened tolerances will apply to:

Part Number 127153 - 4 through 127153 - 12 tools.

NOTE: Tool P/N 127153 - 14 through 127153 - 25 will be changed to Rev B, but there willbe no changes to the tool manufacturing. All specifications for these tools remainthe same.

Effectivity

Orthodyne expects to complete the transition from Rev. A to Rev. B tools in approximately four months. In theinterim, you may receive either Rev. A and/or Rev B. tools. The tools will be segregated and marked accordingto the Rev. letter.

3/10/99

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Motor/Encoder Replacement For X, Y Axis

ApplicableAll Model 360C’s and Model 360S

PurposeThe purpose of this Technical Bulletin is to describe a recent modification to the X aMotor/Encoder for the Model 360C and 360S family.

BackgroundOrthodyne is changing the X and Y axis motor/encoder style and part numbers. Thechanges will improve the reliability and serviceability of our wire bonders. The primachange is a new style motor, which now includes a cable that is permanently attachthe motor. This is the only style X or Y motor Orthodyne will support in the future.

The new motor/encoder assembly can be separated into the motor and encoder, ancan be ordered and replaced separately.

Orthodyne will no longer support the old style motor/encoder assembly (P/N 172233where the motor and encoder were one unit and could not be disassembled, and whseparate cable was used to connect the motor to the motor drive board.

Ordering InformationTo order a replacement X or Y motor, the correct part number depends on whether have an old style motor/encoder, or a new style motor/encoder. To order correctly, dmine which style motor/encoder you currently have.

Determine the Style Motor/Encoder You Want To Replace

Look at the encoder assembly on the motor as shown in Figure 1 on the left. The old style encoder (P/N 172233) was permanently attached to the motor; it could not beassembled in the field; and the motor was connected to the motor drive board withseparate cable (P/N 172608-3).

The new style encoder, show on the right side of Figure 1 , can be detached from the motorby removing two screws. This style motor/encoder was introduced about one year ago, originally included a motor that was connected to the motor drive board by a separate c

Any replacement of an X or Y motor now will have a cable that is permanently attached motor. See Figure 2 on page 3.



3/10/99

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If You Have An Old Style Motor/Encoder (P/N 172233) …

To replace an X, and/or Y axis motor, you must order a complete motor/encoder repment kit, P/N 172455. This Kit includes:

Motor with permanently attached cable — P/N 634822 Encoder— P/N 172652Mounting brackets and cable ties.

If You Have A New Style Motor/Encoder (172372 & 172652) with a motor that does not have a permanently attached cable …

To replace an X, and/or Y axis motor, order replacement kit P/N 17455-1. This Kit includes:

Motor with permanently attached cable P/N 634822Mounting brackets and cable tiesNO encoder.

If You Have A New Style Motor/Encoder with a motor that has a permanently attachcable …

You can replace either the Motor, or the Encoder individually by ordering the part yowant by its own part number:

Motor with permanently attached cable P/N 634822Encoder P/N 172652NO brackets or cable ties will be included for parts ordeindividually.

Figure 1 Determine Style of Encoder

Old Style Encoder

New Style Encoder


3/10/99

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Figure 2 New Style Motor/Encoder With Permanently Attached Cable

NOTE: For Z and Theta axis motor/encoders, customer should oreplacement for 172233 by ordering together encoder P/N 172652motor P/N 172372 for the first time. Thereafter, they need only orderpart that has failed, either the motor, or encoder, separately.

Installation ProcedureInstallation Instruction, IN 1073, is included with each X or Y motor (P/N 172372). Tdocument shows how to route the permanently attached cable.


3/10/99

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Change To Electronic Board Spare Parts Kit

Applicable

All Model 360C’s and Model 360S

Purpose

The purpose of this Technical Bulletin is to describe a recent modification to the Eletronic Board Spare Parts Kit (P/N 172430-2) for the Model 360C and 360S family.

Background

Orthodyne is changing the content of the Electronic Board Spare Parts Kit (P/N 1722) to include a complete GMS CPU retrofit kit instead of just a GMS CPU board assbly. The reason for the change is to prevent an accidental incompatible exchange othe GMS CPU board assembly on an older machine that had a Themis CPU.

To correctly replace a Themis CPU with a GMS CPU, a kit is required ( P/N 172425)consists of:

The GMS CPU Kit Contents:

GMS CPU board assembly with breakout board (P/N 172453)A longer cable (P/N 172630), An adapter board that attaches to the Frame Grab board (P/N 172New software (Version 5.5 or higher),Installation Instructions.

This GMS CPU kit (P/N 172425) is now incorporated into the Electronic Board SparParts Kit.

If a customer already has a GMS CPU board assembly in their machine, replacing ijust the GMS CPU board assembly from the Electronic Board Spare Parts Kit is peracceptable.

However, if a customer wants to replace a Themis CPU board assembly on an oldemachine, then they must use all the parts of the GMS CPU kit described above, whinow contained in the Electronic Board Spare Parts Kit (P/N 172430-2).



3/10/99

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Ordering Information

To Upgrade an older Electronic Board Spares Part Kit (P/N 172430-1, or earlier), that cotains a GMS CPU, Order:

cable (P/N 172630), adapter board (P/N 172569) that attaches to the Frame Grab boasoftware (Version 5.5 or higher) (if not already installed),Installation Instructions IN1041C.

To Replace a GMS CPU that had already been installed in your machine, Order:

GMS CPU board assembly -- P/N 172543

To Replace the Themis CPU from the Electronic Boards Spares Part Kit, Order:

GMS CPU Kit -- P/N 172425

To order an entire Electronic Board Spares Part Kit, Order:

Electronic Board Spares Kit -- P/N 172430-2

Electronic Board Spares Part Kits shipped after August 1, 1998 will contain the complete GMS CPU Kit -- P/N 172425.


8/31/98

Page 1 of 1

TECHNICAL BULLETIN

APPROVAL SHEET


Subject: Replacement of Z/ThetaBearing in the field

Resp. Engineer:

DrawingNo.:


PartNo.:


Models: Model 360B Tech. Publication: George Ritsi

Purpose:

The purpose of this Technical Bulletin is to describe the procedure for replacing a Z/Theta BearingAssembly for a model 360B.

Applicable:

Model 360B

Summary:

A procedure is required to replace Z/Theta Bearing Assembly for model 360B, to accommodatenormal wear.

The procedure described has a number of short cuts that should speed the process.

01/18/200001/18/200001/18/2000 8/31/98

FIELD REPLACEMENT OF Z/THETA BEARING ASSEMBLY Page 1 of 6


Field Replacement Of Z/Theta Bearing Assembly For Model 360B

ApplicableModel 360B

Part NumberP/N 171030 (Z/Theta Bearing Assembly)


ObjectiveA procedure is described to replace Z/Theta Bearing Assembly for model 360B, to accommodatenormal wear.

This procedure has a number of short cuts that should speed the process.

Procedure1. Turn off main power switch. Check that the bond head cannot contact any parts during this

procedure.

2. Place bond head in full up (Z) position.

3. Pull out bonder in the Y-axis so the bond head is closest to you.

4. Remove the left side and front cover from bonder.

5. Remove right side cover of bond head.

6. Remove Z-cable from bond head at connector and wire clamp. See Figure 1.

01/18/200001/18/200001/18/2000 8/31/98


Figure 1. Remove Connector and Wire Clamp

7. If the bond head has a touch sensor mounted at the front, remove the touch sensor but do notremove the flag. Removing the touch sensor will give you the necessary clearance to remove theZ-cable.

NOTE: Newer versions of the Model 360B have the touch sensor mounted on theside of the bond head. The touch sensor does not have to be removed to extract theZ-cable.

8. Remove bonding wire from the bond head.

9. Remove bond head.

NOTE: Use caution when removing bond head not to hit it on anything. Otherwise,extensive damage may result.

10. Loosen the Theta-motor mount to slacken the belt. Remove belt in upward direction.

11. Remove 4” extension spring from pin on the back of Z/Theta bearing assembly. See Figure 2.

Remove connector.

Remove wire clip.

01/18/200001/18/200001/18/2000 8/31/98


Figure 2. Remove Spring from Pin

12. Carefully scribe a line onto the Y-casting, along the left vertical edge of the Z/Theta BearingAssembly to reference the location of the bearing housing (see Figure 3).

Figure 3. Scribe a Line Along Edge of Z/Theta Bearing Housing for Reference

Remove Spring

Z/Theta Bearing

Y-Casting

Scribe aLineAlongThis Edge

01/18/200001/18/200001/18/2000 8/31/98


13. Remove (2) screws that connect the Z-band to the Z/Theta Bearing Assembly. Be careful not todamage the Z-band. (See Figure 4.)

Figure 4. Remove Z-band from the Z-tube

14. Remove (2) screws that hold the Wire Feed Tube bracket to the Z/Theta Bearing Housing.

15. Remove the Z-home flag from the Z/Theta bearing housing.

16. Remove (6) screws that hold the Z/Theta Bearing Assembly in place and work it down slowly toclear the other components in the area.

NOTE: Use caution when removing the bearing not to hang up on the Z-band or theZ-cable.

17. Do not remove the Camera/Optic Tube assembly.

18. Re-install the Z/Theta bearing and the remaining components in reverse order.

NOTE 1: When installing the replacement Z/Theta bearing assembly, remember toalign with the vertical scribe line. To set the height of the Z/Theta bearing, center thescrew heads in the counter-bores.

NOTE 2: When attaching the Z-band to the Z/Theta bearing assembly, move theZ/Theta tube up and down while tightening the two Z-band screws. This will ensureproper alignment of the Z-band.

Remove TwoCap Screws

01/18/200001/18/200001/18/2000 8/31/98


Recalibrate the Bond Head as follows:


2. If the touchdown sensor was removed from the bond head, perform touchdown sensorcalibration at this time. (Refer to Model 360B Technician’s Manual.)

3. From Main Menu, go to Calibration Menu. Then go to Offsets. (7, 2). Using a pointed tool runan offset four-pointed pattern. Press F13 to save settings.

4. Check that the X-Optical value is between -50 and +50. Adjust the Z/Theta bearing housing tothese values by rotating the Z/Theta bearing assembly either clockwise (CW) or counter-clockwise (CCW). If the value needs to be more negative then rotate the Z/Theta Bearinghousing CCW. If the value needs to be more positive then rotate the Z/Theta Bearing housingCW. See Figure 5.

HINT: To ease adjustment, snug the upper right screw while leaving the other (5)screws slightly loose. Rotate about the upper right screw to achieve adjustment.Snug all screws before doing another offset run. When the proper value is reached,be sure to tighten all screws.

Figure 5. Adjust Position of Z/Theta Bearing Assembly

5. Recalibrate the Home Offsets. From the Main Menu, go to Calibration, to Recalibrate Home(press 7, 9). Adjust home flags as needed. Exit to main menu.

6. Recalibrate the Limits. From the Main Menu, go to Calibration, and then to Recalibrate Limits(press 7, A). Adjust as needed. Exit to main menu.

CW

CCW

Rotate about this screw

01/18/200001/18/200001/18/2000 8/31/98


7. If you are using a lower Z home position, then perform Z-depth calibration as per the Model 360BUser’s Manual.

8. As with any procedure that would remove the Bond Head, you must recalibrate Z position foreach File/Wire List. From the Main Menu, go to Calibration, to Recalibrate Z (7,8). Press F13 tosave settings.

8/2/99

DORIO MONITOR SET UP INSTRUCTONS

Applicable

All Types of Model 360 WireBonders

Purpose

The purpose of this Technical Bulletin is to describe the set up of the Dorio monitor.

Procedure

To enter the setup menu, press and hold the Shift key then press the Setup key (both located on the keyboard). Use the following steps to setup the monitor.

NOTE: The settings below are for all types of M360 machines, except wherenoted.

1. Cursor to the Actions menu and select Restore Factory Defaults.

1. Cursor to the Terminal Type menu set the Emulation mode to “Wyse 160/60Native”.

2. In the Display menu, make the following changes to the next 6 selections:

! Under the Columns per page heading, clear the check mark in the box next to the Clear on change setting.

! Set the Status display option to “None”.

! Under the Cursor Display heading, remove the check mark from the Enable cursor option.

! Set the Zero option to “φ”

! Place a check mark next to the Overscan option.

! Change the Refresh rate to “60Hz”.

3. In the ASCII emulation menu, change the Data lines option “25 Lines” (Models Band C only). For Model A only, set Data Lines to “24 Lines”

4. Under the Keyboard menu, turn the Keyclick volume “OFF”.



8/2/99

5. In the Communication menu, make the following changes to the selectionslisted below:

! Change the Port Select option to “S1 = comm1 print = parallel”.

! For MODEL A ONLY: set the “Word Size” to “7 bit”

! Set the Transmit speed to “38.4k baud” (Model C). For Model A and Model B set the Transmit speed to “19.2k baud”.

! Set the Transmit Flow Control to “None”.

! For MODEL A ONLY: set the Receive Flow Control to “DTR”

! Set the Transmit rate limit to “None”.

! Set the Fkey rate limit to “None”.

6. In the Printer menu, set the Port Select option to “S1 = comm1 print = parallel”.

7. Verify that there is a check in the Online box.

8. Save the settings.

9. Exit

10. Cycle the power to the bonder OFF then ON, to restart the machine.


8/2/99

DORIO MONITOR SET UP INSTRUCTONS

Applicable

All Types of Model 360 WireBonders

Purpose

The purpose of this Technical Bulletin is to describe the set up of the Dorio monitor.

Procedure

To enter the setup menu, press and hold the Shift key then press the Setup key (both located on the keyboard). Use the following steps to setup the monitor.

NOTE: The settings below are for all types of M360 machines, except wherenoted.

1. Cursor to the Actions menu and select Restore Factory Defaults.

1. Cursor to the Terminal Type menu set the Emulation mode to “Wyse 160/60Native”.

2. In the Display menu, make the following changes to the next 6 selections:

! Under the Columns per page heading, clear the check mark in the box next to the Clear on change setting.

! Set the Status display option to “None”.

! Under the Cursor Display heading, remove the check mark from the Enable cursor option.

! Set the Zero option to “φ”

! Place a check mark next to the Overscan option.

! Change the Refresh rate to “60Hz”.

3. In the ASCII emulation menu, change the Data lines option “25 Lines” (Models Band C only). For Model A only, set Data Lines to “24 Lines”

4. Under the Keyboard menu, turn the Keyclick volume “OFF”.



8/2/99

5. In the Communication menu, make the following changes to the selectionslisted below:

! Change the Port Select option to “S1 = comm1 print = parallel”.

! For MODEL A ONLY: set the “Word Size” to “7 bit”

! Set the Transmit speed to “38.4k baud” (Model C). For Model A and Model B set the Transmit speed to “19.2k baud”.

! Set the Transmit Flow Control to “None”.

! For MODEL A ONLY: set the Receive Flow Control to “DTR”

! Set the Transmit rate limit to “None”.

! Set the Fkey rate limit to “None”.

6. In the Printer menu, set the Port Select option to “S1 = comm1 print = parallel”.

7. Verify that there is a check in the Online box.

8. Save the settings.

9. Exit

10. Cycle the power to the bonder OFF then ON, to restart the machine.


10/22/99


Changes to the Handler Interface PLC Adapter

Applicable

All Types of Model 360C Wire bonders that use the Universal I/O Board #175512 revision R or earlier, and using non-opto-isolated signal lines.

Purpose

The purpose of this Technical Bulletin is to describe potential noisy interface signal lines when using non-opto-isolated signals.

Problem

Noise on the “Remote Stop” signal line may cause the Bonder to drop out of the “Auto-Run” or “Remote” mode during operation. This condition is a potential problem for systems that use the universal I/O board #175512 revision R or earlier, and non-opto-isolated signals.

Solution

Capacitors have been added to the Handler Interface PLC Adapter board (which is mounted to the I/O board) to filter out the unwanted noise. PLC Adapter #175557 revision C or higher has the capacitors included. An upgrade kit #172482 which consists of 3 capacitors has been created. However, installing the capacitors in the field can be difficult. Therefore, if you have established that this problem exists and your machine is configured as mentioned, Orthodyne recommends that you request a replacement PLC Adapter #175557 Rev C. Orthodyne will send you an upgraded PLC Adapter in exchange for your old PLC Adapter.I/O boards #175512 revision S or higher already have the upgraded PLC Adapter included.


6/6/00

ALC Pulltest Values

Applicable

All Types of Model 360C Wire bonders that use the ALC Bond Head.

Purpose

The purpose of this Technical Bulletin is to describe the latest recommended values for the ALC Pulltest feature.

Background

The ALC Bond Head has the capability of pulltesting each bond just after it is made. The user can also program the number of bonds to be pulltested. Orthodyne published an initial set of default values to use with this capability. As we have gained experience with more applications using the InLine pulltest feature, we have refined our recommended pulltest values which result in a better measure of the strength of the bond.

NOTE: Pulltesting with the ALC is one of a number of quality control tests forbond quality. It is not intended to be a stand-alone 100% “good bond/bad bond” test.

Recommendation

InLine pulltest values will vary depending on the size of the wire. The table below shows the pulltest values (as a function of wire diameter) that were originally recommended.

Additional testing and inputs from customers with various applications show that the origi-nal pulltest values were on the low side, and may occasionally let a bond pass that would have failed with a stronger pull.

The last column in the Table 1, “Recommended Pulltest Values,” on page 2 shows the current recommended default values. We have found that the larger pull values will give a more reliable test of the bond strength. The higher values minimize the possibility of the test passing a wire that has marginal bond adhesion.



6/6/00

*This is a maximum value. Pulltest cannot be increased greater than 200 gram-force.It should be noted that the “Current Recommended Values” are minimum values. You may want to increase these parameters further depending on the quality control criteria of your application.

Proper pulltesting also requires minimum values for other parameters like those listed below:

z Minimum pull time = 30 ms

z Pull tolerance = 150 microns

NOTE: When using the InLine pulltest feature of the ALC, it is important tochange the wire feed tube on a weekly basis. The reason for this is thatcontinual feeding of wire will cause wear on the tube. This, in turn, willadd unwanted drag to the wire feed system. Even though the pulltestmay pass, if the drag was greater than the pull force, the drag force couldlift the bond.

Table 1: Recommended Pulltest Values

Wire Dia(mil)

Original Pull Value(gms)

Current Recommended Value(gms)

5 20 40

6 20 45

7 25 50

8 25 60

10 35 100

12 50 120

14 50 140

15 50 150

20 75 200*


6/6/00

Pulltester Sensor Board Fix

Applicable

Model 360C-H/HD Wire bonders that use optional Pulltesters.

Purpose

The purpose of this Technical Bulletin is to describe a potential problem and fix of the Pulltester Sensor board.

Problem

A change in sensor vendor used to supply components for the Pulltest Sensor Board (P/N 174512) necessitated a slight modification of the sensor circuit board. The modification inadvertantly moved a circuit trace under the head of a board mounting screw. If the screw is overtightened, it could short the trace. If this happens, the Pulltester will con-tinue to spin until the unit times-out and produces an error signal: “Pulltester cannot home”.

Solution

The problem was fixed by cutting the trace and bypassing it with a jumper wire routed around the mounting screw (see Figure 1 ).

The modification to the Pulltester sensor board (P/N 174512 Rev. C) was implemented end of January 2000. Pulltester boards in question were Rev B boards manufactured between September 1999 and early January 2000.

You can recognize whether you have a new sensor board by the appearance of an “S” shaped jumper wire, as shown in Figure 1 .

If you have a machine with the old style board (Rev B or earlier) and the machine is working, it should continue to work without problem unless the sensor board is removed and re-installed (not a common occurrence) and the mounting screw is overtightened.

If a problem is encountered with an old style board, and the machine exhibits the problem described above, the correct fix is to replace the board with the revised version (P/N 174512 Rev. C).

A field fix of the board should only be done by a qualified OE technician or field represen-tative. Unauthorized repair should not be attempted because of the risk of damage to the board and the machine.



6/6/00

Figure 1 Revised Sensor Board Showing Jumper Wire

Top View Of Pulltest Assembly (P/N 174001)

Jumper Wire

Mounting Screw That Could Cause Problem In Older Style Board


6/6/00

Fixing a Broken Transducer Set Screw

Applicable

Model 360 family machines (A deep access, B, and C).

Purpose

The purpose of this Technical Bulletin is to describe a potential problem and fix when the hex wrench breaks in the transducer set screw that holds the bond tool.

Problem

Users who accidently break the hex wrench in the transducer set screw have encountered difficulties trying to correct the problem. Inappropriate methods used to correct the problem can result in further significant problems to the bond head. This Technical Bulle-tin shows you what to do, and what methods to avoid in order to correct the problem.

Figure 1 illustrates the problem. You can see the technician holding the hex wrench which was sheared off while over-tightening the set screw.

Figure 1 Broken Set Screw Wrench



6/6/00

Solution

The best solution is to remove the hex wrench stub from the set screw hole so another wrench can be used to loosen the screw and remove the bond tool. The first (and easiest) solution for removing the stub is to use a magnet to extract the piece from the set screw. This technique (illustrated in Figure 2) is especially useful if the stub brake off flush with the head of the set screw. Perform a Gentest at the same time to help loosen the broken wrench stub.

If the hex wrench stub is sticking out of the set screw slot, you may also be able to pull it out with a small pair of needle nose pliers or tweezers.

Figure 2 Removing the stub with a magnet

DO NOT ATTEMPT TO FORCE THE BOND TOOL FROM THE TRANSDUCER BY FORCING IT OUT WITH A PAIR OF PLIERS AS SHOWN IN Figure 3.

Figure 3 Do Not Force The Tool Out With A Pliers


6/6/00

As a last resort, you may try to remove the bond tool from the transducer by loosening it within the transducer hole. This procedure is illustrated in Figure 4.

Grasp the bond tool with a pair of vice-grip pliers as shown in the figure and carefully twist the tool back and forth about the Z-axis while gently pulling down on the tool.

Figure 4 Loosen The Bond Tool In The Transducer Hole

With the bond tool removed from the transducer, you can now remove the transducer from the bond head to make further repairs.


6/6/00


Clamp Motor Driver Board Adjustment (173512)

ApplicableModel 360C-H/HD

PurposeThe purpose of this Technical Bulletin is to describe a potential problem and fix that involves clamping inconsistency.

ProblemThe clamp motor may not stop at the same spot consistently.

SolutionExchange the Motor Drive Board (P/N 173512) with (P/N 173512-2), which has more torque, or convert the (P/N 173512) revision to a (P/N 173512-2). This document explains how to covert to increase torque on the Motor Driver board (P/N 173512).

NOTE: Do not adjust the other motor drive boards used in the Input/Output ele-vators or Transport Assembly.

WARNING: Beware of breaking misaligned parts because of higher motortorque (e.g. clamp fingers).


Tools Needed:

Time To Complete:

Difficulty Level:

1 2 3 4 5


1 Hex keys (set)

1 Jumper connector with pin 5 and 7 shorted MODERATE

1 Jumper (JP2) for two pins

1 Potentiometer adjustment tool DIFFICULT

1 Frequency/Voltmeter


6/6/00


2. Remove the Clamp Motor Drive board (P/N 173512) by following these steps.See Figure 1:

a. Remove the Logic (J2) and Motor (J3) connectors from the Motor Driver board. Connector (J1) is left in place.

b. Remove both screws (M3) holding the Clamp Motor Drive board in place.

c. Pull the board out of the transport station.

d. Remove the protective cover from the board assembly.

e. Locate test pins TP5 and potentiometer VR1.

Figure 1 Location of Clamp Motor Drive board components

Clamp Motor Drive board w/cover

Board power (J1)

Motor Logic (J2)

Mounting screws


6/6/00

Figure 2 Clamp Motor Driver board jumper location

3. Short Pins 5 and 7 on the logic connector (J2).

4. Add a jumper to JP2 (test) shown in Figure 2.

5. Attach a Voltmeter between ground TP10 (black) and TP5 (orange).

6. Turn the power ON and adjust the potentiometer VR1 so that the Voltmeter reads370 mV ± 5mV. (The original setting was approximately 195 mV).

7. Turn the power OFF. Remove the jumper to JP2 (Test) and the jumper betweenpins 5 and 7 of the logic connector J2.

NOTE: Do not forget to remove jumper JP2 (Test).

8. Add a “-2” to the existing part number of the PCB to reflect the “Clamp MotorOnly” use of the board. P/N 173512 becomes 173512-2.

9. Install the board and plug in all the connectors.

10. Turn the power ON and test the clamp station to insure correct clamping opera-tion.

TP5

VR1 Jumper JP2 TP10 J2


6/6/00

M360C Repacking Instructions

Applicable

All Model 360C style machines

Purpose

This Bulletin provides instructions on the proper procedure for repacking an M360C style machine for shipment. It is assumed that the original packing material and shipping crate were saved. If these materials are not available, call Orthodyne for further instructions.

Problem

Companies sometimes have to ship their machines to various other sites. These machines must be repacked for proper, safe shipment to the other locations. Whereas unpacking instructions are included with each machine, technicians were not always clear on how to re-pack the machine for shipment. This document provides repacking instructions.

Procedure

1. Remove the WYSE and Panasonic monitors. Leave the Panasonic's screws on thetop of the bonder (securely screwed in). Leave the WYSE monitor's screwssecurely fastened to the monitor's bracket.

2. Pack the WYSE terminal securely into its ORIGINAL box with its protectivestyrofoam packing supports.

3. Wrap the box in a large plastic bag to eliminate the possibility of moisture gettinginto the box.

4. Repeat Step 3 for the Panasonic monitor.

5. Cover the monitor's cables with a plastic bag and seal the bag closed with a cabletie. Tie the cables down to the upright monitor support bar of the bonder.

6. Disconnect the camera cable and cover it in an electrostatic bag and cable tie thebag over the cable (should be a pink bag with packing bubbles on it).

7. Remove the Z-Theta bearing Cover (see Figure 1 ).



6/6/00

Figure 1 Remove the Z/Theta Cover

8. Install the styrofoam piece between the theta drive and the top of the Z-Thetabearing (see Figure 2 ). This foam maintains space between the tool and theclamp station. Re-install the Z-Theta bearing cover.

Figure 2 Install Foam Pad Around Bearing Tube

9. Set foam piece behind the bond head (see Figure 3 ). It rests between the back ofthe bond head and the front of the bonder (just in front of the sticker, whichdescribes the torque requirements for the transducer).

10. Wrap bond head with plastic wrap before installing foam shipping cover.


6/6/00

Figure 3 Place Foam Pad Behind Bond Head

11. Install the L-shaped bracket, which attaches between the bottom of the topassembly of the bonder (below the dereeler assembly) and the right-side bellowassembly. Two cap screws attach this L-shaped bracket at each surface. (SeeFigure 4)

12. Set the foam shipping cover over entire Z-Theta Bearing and bond head. Securethis piece to the bonder by stringing a strong piece of plastic wrap around the topassembly of the bonder, even going around to the back of the bonder. We use aheavy-gauge plastic wrap material (see Figure 4 ).

Figure 4 Protective Cover Around Bond Head

13. Tie plastic wrap around the wire spool holder assembly to ensure that it doesn'topen during shipment.

Foam Shipping Cover

Secure with plastic wrap

L-Shape Bracket


6/6/00

14. Put a piece of foam on either side of the keyboard to hold it in place.

15. Remove and repackage the microscope assembly and cross-arm. Leave only the e-stop and the upright arm on the machine during shipping. The cross-arm andmicroscope must be carefully packaged and put into a box (microscope and eye-pieces have their own boxes).

16. Place plastic “scratch sheet” to cover the clamp station and the whole transport,all the way down to the operator keypad.

17. Install the casters on the machine. Remove the Isolation Pad Mounting FootAssemblies.

18. Put the isolation pads and all shims back into their original box (it should beroughly the same size as the pads put together).

19. Wheel the machine to your shipping area and near the crate.

20. Prepare the bottom of the crate (assuming that you still have the crate) bycovering it with an uncut length of the heavy gauge Cortec material (VCI-126,Vapor Corrosion Inhibitor). Lay two 2’ x 4” wood pads onto the blue plastic forthe machine feet (see Figure 5 ).

NOTE: If you do not have the original crate, call Orthodyne for instructions onhow to fabricate a shipping crate.

Figure 5 Prepare Crate Bottom With Plastic Wrap and Wood Rails

21. Use a forklift to lift the bonder. Remove the moveable casters and set the bonderonto the bottom crate.

22. Drill holes into the pads and install the four 3/8" bolts to hold the bonder in place


6/6/00

to the bottom of the crate (see Figure 6 ). Put the bolt in from the bottom so thebolt head is down (this will prevent damaging the bolt shank by the fork lift). Putthe nuts on from the top, and tighten with two wrenches (one on the bolt head andthe other on the nut).

Figure 6 Drill Holes For Mounting Bolts

23. Set the WYSE, Panasonic, and spare parts BOXES (set up gauges, tooling,manuals, microscope) in front of the VME electronics drawer, underneath thetransport station (see Figure 7 ).

Figure 7 Position Boxes Around Machine

24. Take the ends of the heavy plastic and fold it up overlapping onto the bonder sothat the machine and boxes are completely covered (see Figure 8 ). Cut the excessplastic off. Secure the plastic to the bonder.


6/6/00

Figure 8 Drape and Secure Blue Plastic Wrap Around Machine

25.Completely cover the machine, especially the top assembly with plastic shrinkwrap. Go in circles around the whole machine with a roll of wrap (see Figure 9 ).

Figure 9 Wrap Machine With Shrink Wrap

26. Install the sides of the crates by first using spring clips to hold the sides into place.Then use nails to secure them. Nail at the interface between the sides and the bottomof the crate and at the edges between the sides themselves (see Figure 10 ).


6/6/00

Figure 10 Nail Sides Of Crate Together

27. Install the top of the crate, using spring clips to hold the top first and thenreinforce with nails around the edges, but not the front held on with spring clips(see Figure 11 ).

Figure 11 Nail Top Of Crate

NOTE: The crate walls and top can be held together with spring clips only if youexpect to reuse the crate a number of times.


8/10/00

Instructions for Preventing Fluorescent Light Interference with Forcer Calibration

Revision

None

Applicable

All Model 360A, B, C, and S style machines equipped with fluorescent lights.

a) P/N 172436 Fluorescent Light Kit (3 bulb)

b) P/N 172403 Fluorescent Light Kit (4 bulb)

c) P/N 172443 Fluorescent Light Kit (coaxial)

Purpose

The purpose of this Technical Bulletin is to provide instructions to prevent electromag-netic interference, radiating from the fluorescent light fixture, from affecting the scalereadings. This scale is used during Forcer calibrations.

Problem

Electromagnetic interference, caused by the fluorescent light’s DC/AC inverters, affectsscale readings during force calibration. A scale that is not zeroed out correctly alters thecalibration outcome and may affect bonding.

Procedure

WARNING: Do not engage the interlock switch when the cover is off. VeryHIGH VOLTAGE present.

1. Unlatch and swing the fluorescent light fixture from the bond head.

2. Loosen the two Phillips-head retaining screws on top of the light cover. Slip thecover off. There is a interlock switch that turns the light off and eliminates theelectromagnetic interference once the cover is removed. See Figure 1.

3. When the light is off, swing the fluorescent light fixture closed and secure the latch.

TECHNICAL BULLETINDoc No. DC06-999000

Tracking No. TB 1107


8/10/00

4. Zero out the scale and perform the Forcer calibration.

5. After the calibration is complete, open the latch, replace the cover, tighten thescrews, and close the latch. When you replace the cover, the interlock switch willclose and turn the light back on.

.

Figure 1 Fluorescent Light and Cover Assembly

Screws

Cover

Interlock Switch


8/7/00

PM Instructions for Small Wire and ALC Head Stepper Motors

Applicable

All Model 360S machines, and 360C machines with ALC heads.

Part Number

Stepper Motors, 175101-1,-2

Purpose

The purpose of this Technical Bulletin is to provide instructions for preventive mainte-nance on the stepper motors that move the clamps on the Small Wire bond head, and theclamp jaws on the ALC head.

Problem

These stepper motors operate over a very small range of motion. This operating condi-tion can cause early failure of the motors due to inadequate distribution of lubricant. ThisTechnical Bulletin provides instructions for preventive maintenance which will extendthe life of these motors.

SMALL WIRE HEAD

Procedure

The recommended Preventive Maintenance action is to rotate the motors every month in order to spread the grease on the motor shaft bearings.

The stepper motors are shown in Figure 1 .

1. Remove the cover from the bond head.

2. Loosen the locking nut on the clamp cable and turn the clamp cable to loosen it.

3. Remove the clamp cable from the slot in the clamp jaw (see Figure 2 ).

NOTE: If you open the clamp jaws by hand by squeezing the moveable clamp,the clamp cable may be removed and re-installed without requiringadjustment.



ORTHODYNE ELECTRONICS TECHNICAL BULLETIN TRACKING NO. TB 1108 PAGE 1 OF 5

8/7/00

4. With your finger, rotate each of the two stepper motor shafts clockwise for severalrevolutions.

5. Re-attach and adjust the clamp cable (see Small Wire Bonder Kit Supplement,page “supplement-33” in your User’s Manual).

6. Replace the bond head covers.

7. Repeat this procedure monthly.

Figure 1 Location of Small Wire Head Stepper Motors

Wire Clamp Motor

Wire Feed Motor


8/7/00

Figure 2 Remove Clamp Cable From Clamp Jaw

ALC HEAD

Procedure

The recommended Preventive Maintenance action is to rotate the stepper motor every month in order to spread the grease on the motor shaft bearings.


2. Remove the covers from the ALC bond head.

3. Disconnect the clamp jaw cable from the slot in the moveable jaw (see Figure 3 ).

Loosen Clamp Cable Lock Nut

Turn The Clamp Cable Screw To Loosen Cable. Remove From Clamp Jaw Slot


8/7/00

Figure 3 Remove the Clamp Cable from the Moveable Clamp Jaw

4. With the clamp cable disconnected, you can turn the cam attached to the shaft ofthe stepper motor with your finger (see Figure 4 ). Turn the shaft severalrevolutions.

5. Re-attach the clamp cable into the slot of the moveable clamp jaw.

HINT: Press the moveable clamp jaw so as to open the clamp andput the cable end into the slot using tweezers.

6. Adjust the clamp cable using the procedure described in the ALC Supplement,“Setting Up The ALC Bond Head”, page 3-2, in the M360C User’s Manual.

NOTE: If you open the clamp jaws by hand, the clamp cable may be removedand re-installed without requiring adjustment.

7. Re-install the covers.

8. Perform this preventive maintenance action once a month.

Clamp Cable Connects to Slot in Moveable Jaw Pivot

Moveable Jaw


8/7/00

Figure 4 Remove Clamp Cable and Turn Motor Cam

Clamp Cable

Motor Cam


10/25/00

Dorio Monitor Attachment

Applicable

All Types of Model 360C Wire bonders.

Purpose

The purpose of this Technical Bulletin is to describe a field retrofit procedure for secur-ing the Dorio Monitor to its housing.

Background

The Dorio Monitor (P/N 639066) is attached to its housing using spring clips around the front panel, and a safety screw in the rear of the monitor that anchors the monitor to the housing frame. (See Figure 1 ).

Figure 1 Dorio Monitor On Display Shelf

The monitor housing frame is firmly attached to the display shelf on the top of the Wire Bonder. We have had a few incidents, however, where the safety screw on the monitor became loose because the rear plastic housing of the monitor cracked. Because the monitor is mounted at an angle, if the safety screw fails, it is possible for the monitor to detach from its housing anchor and fall out of its frame.


Dorio Monitor Attaches To Frame Using Spring Clips (2 on each side)


10/25/00

Corrective Action

The problem was solved temporarily by substituting a larger safety screw and a large diam-eter washer on the back of the monitor to anchor it to its frame. (See Figure 2 ). This is an interim fix.

Figure 2 Dorio Monitor Safety Screw

The Dorio company was apprised of the problem and they have instituted a redesign to strengthen the rear housing of their monitor. The re-designed monitor will be introduced into production in the near future.

However, customers with machines that have Dorio Monitors are encouraged to replace the existing safety screw on the back of the monitor with the more robust screw/washer combination recommended by Orthodyne to avoid a potential safety hazard of the monitor falling from its mounting shelf.

Substitute the following for the existing screw:

658138 Pan Head Screw - 6-32 x 0.75” L671001 Lock Washer - ST # 6 (Zinc Plated)670060 Flat Washer - 0.150” ID x 0.625” OD x 0.06” Thick

Substitute New Screw and Washer For Existing Screw


2/13/01

Internal Use Only

Reformatting The Hard Drive

Applicable

All Types of Model 360C Wire bonders.

Purpose

The purpose of this Technical Bulletin is to describe a field procedure for reformatting the Hard Drive.

Background

Customers reporting failure of the Hard Disk drive in the M360C were required to return the unit to Orthodyne for replacement or repair. In many cases, failure analysis showed the fault to be corrected by reformatting the Hard Drive. A procedure was developed to accom-plish the reformatting without requiring the unit to be removed and returned to Orthodyne.

! The part number of the Hard Drive is: 172558! The part number of the Reformatting Disk is: 172583! The Drawing Number for the assembly containing the Hard

Drive is: 172015

Corrective Action

Reformatting the Hard Drive can be accomplished at a field site by inserting a special floppy disk (P/N 172583) into the System Drive (P/N 172503-1). (See drawing number 172015 for reference.) When the machine is powered on, the user will be directed to follow the instructions on the screen.

The reformatting procedure varies slightly depending on type of CPU board in the machine. Instructions are given for machines with GMS, Force, or Themis CPU’s.

GMS or Force CPU

Use the following procedure if your machine contains either a GMS or Force CPU:

1. Insert the Reformatting Disk (P/N 172583) into the System Drive.



Peter Dallman

2/13/01


3. Follow the instructions on the screen.

Themis CPU

1. Power up the machine. Allow the machine to attempt HDD boot.

2. Ignore ALL error messages.

3. Insert the Reformatting Disk (P/N 172583) into the System Drive.

4. Press the RESET switch on the CPU.

5. Follow the instructions on the screen.

After Reformatting The Hard Drive and Installing The Bonder Software —

1. Perform a complete calibration of the system to ensure that you have correctsystem data in NVR.

2. After calibration, verify that all bond locations on your current program are cor-rect.

3. If you have a ZIP option on your machine (internal or external), re-install the ZIPdriver from the Driver Diskette (P/N 172598). Insert the diskette into the datadrive d1.

4. From the OS-9 prompt, type “/d1/install” <ENTER>.

5. When the installation is complete, cycle the power on the machine.


5/3/01


Focus System Board Replacement

ApplicableModel 360C & S Wire bonders.

BackgroundUnavailability of certain components made it necessary to redesign the Focus System circuit boards. The redesign effort created a single circuit board to replace the two-board configuration. The redesigned single-board part number is:

P/N 172527This circuit board replaces the two previous boards whose part numbers were:

P/N 172534 and 172539

NOTE: M360C’s built prior to June’97 had two PCB’s, LED PCB (P/N 172534) and Sensor PCB (P/N 172539) for the focus system function.

The single-board focus circuit board is physically and functionally interchangeable with the dual-board focus system circuit boards. Refer to drawing 172010 for more detailed information.

The ProblemWhen the high resolution focus kit was added to the Small Wire bond head, it was discovered that the new single-board focus board configuration did not work. However, the old dual-board con-figuration did work. Therefore, while the single-board configuration works very well for most machines, the old dual-board focus circuit board configuration must be used on machines that use the high resolution focus kit. Most likely, these machines would be using a Small Wire head. Because Orthodyne has a limited inventory of these dual-board configurations, we must reserve them for machines that use the high resolution focus kit only.

Solution

Orders for replacement focus system circuit boards for any machine (other than for a Small Wire bond head with a high resolution focus kit), will be filled with the single-board:

P/N 172527 For replacement focus system circuit boards for Small Wire bond heads with the high resolution focus kit, please order:

P/N 172534 and 172539For more detailed information, see Drawing Number 172010. For installation instructions, refer to M360C Technician’s Manual (DC03-173000A), “Focus System Adjustments”.


8/31/01


Instructions for Bonding Tool Installation

Applicable

All 360C and 360S machines, and including ALC heads.

Part Number

Bonding Tool Set Screw (PN 659819)

Purpose

The purpose of this Technical Bulletin is to provide instructions for correctly tighteningthe Bonding Tool set screw for optimum bonding results.

Problem

Orthodyne recommends that the Bonding Tool set screw be torqued down to the recom-mended setting, then loosened, and retightened again to the initial setting.

The tool is seated the first time you tighten the screw. Some settling may occur just afterthe first tightening . The second screw tightening firmly sets the tool in place. This elimi-nates any potential loosening over time that may occur if you torque the set screw onlyonce.

Procedure

Large Wire Head Bonding Tool Set Screw

1. Tighten the set screw to 4-6 in-lb. (0.46-0.69 Nm)

2. Loosen the set screw, then tighten it again to 4-6 in-lb. (0.46-0.69 Nm)

Small Wire Head Bonding Tool Set Screw

1. Tighten the set screw to 2-3 in-lb. (0.23-0.34 Nm)

2. Loosen the set screw, then tighten it again to 2-3 in-lb. (0.23-0.34 Nm)

NOTE: Orthodyne recommends this screw be replaced every five tool changes.A kit of 100 screws and 40 keys (P/N 138111-3) is available from OE.

TECHNICAL BULLETINDoc No. DC06-172000B


8/3/01

360C-H/HD Anvil Cam Replacement

Applicable

Model 360C-H and 360C-HD machines.

Part Number

Anvil Cam (P/N 173243-7.3mm and P/N 173240-4.3mm stroke)

Purpose

The purpose of this Technical Bulletin is to provide instructions for correctly replacing anAnvil Cam. They are typically replaced when changing the Anvil set-up to adjust for adifferent size leadframe.

Procedures

The following procedures are step-by-step instructions for the removal and installation ofthe individual assemblies that complete the cam exchange. This is accomplished inseveral phases.

z Remove the covers and Indexer Assembly

z Exchange the Cam

z Reassemble the Handler

TECHNICAL BULLETINDoc No. DC06-172000B



z Test the unit

Preparations


2. Home the Indexers and save this position. Do this for both Input and Outputassemblies. You will use this position to realign the system after you complete thecam installation.

a. From the Main Menu select a file.

b. Select 4, Manual Positioning.

c. Use the spinners to locate the index pawl. Select a corner that locates the pawl in the corner of one of the quadrants of the cross-hair.

d. Press F14 (Mark Park X Y) and F13 (Save).

8/3/01

3. Use the Spinners to move the bondhead over the space where the Pulltestersare normally mounted.


5. If the machine is equipped with Pulltesters (P/N 174001), they will need to bedisconnected and removed. Loosen the clamps retaining them and removethem.

6. Remove the:

a. Right rear panel. It has two screws.

b. Left rear panel. It has four retaining screws.

7. Remove the left and right front panels. They are retained by two screws each.Disconnect the two cable assemblies, P2 and P8, and ground wire, from theback of the panel.

Indexer Assembly Removal

1. Make sure the long, black plate (Indexer Slide Shield, P/N 173225) that islocated at the top of the Indexer Assembly is parallel to the edge of the ClampStation. See Figure 1 . If there is a gap between the plate and the Indexer edge,loosen the two Shield mounting screws, push the plate against the edge, thentighten the screws. This will allow you to align the Indexer Assembly when itis reinstalled.

Indexer Mounting Screws (4)


Figure 1 Remove the Four Bolts Retaining the Indexer

2. Disconnect the Sensor cable (P/N 173618), Index Home Flag, from S1connector. This will allow you to move the assembly aside to allow access tothe components. See Figure 2 .

Indexer Slide Shield

Shield Mounting Screws (2)

8/3/01

Figure 2 Indexer Removed and Set Aside

Anvil Cam Replacement

1. Remove the Home Sensor Mount Bracket by removing the two MP3 screws. Thescrews are located underneath the bracket. See Figure 3 , on page 4

2. Remove the Clamp Station Knob by loosening the two set screws.

3. Remove the Shutter Hub by loosening the two set screws.

NOTE: Do not loosen the two screws holding the shutter to the hub as this willmisalign the shutter for proper clamping.

4. Loosen the Clamp Motor Bracket by loosening the two screws going into the

Indexer Assembly


nutplate to remove the belt from the pulley.

5. Remove the Pulley by loosening the set screw. See Figure 4 , on page 4.

6. Before removing the Anvil Hub, compare its orientation with the new cam toeensure that it will be mounted properly. The shape of the two cams should besimilar and should vary only in size. See Figure 4 .

8/3/01

Figure 3 Cam and Assemblies

Clamp Station Knob

Home Sensor Mount Bracket

Cam

Cam Mounting Hub

Bracket moved aside

Make sure there is no space betweenbetween the hubs

Note orientation of old cam before installing new cam.


Figure 4 Cam Replacement

7. Remove the Anvil Cam Assembly Hub by loosening the set screws. See Figure 5 , onpage 5.

8. Install the new Cam onto the hub. See Figure 6 , on page 5.

8/3/01

Figure 5 Anvil Cam Shaft Stripped

9. Install the new cam assembly onto the shaft making sure that both set screws areperpendicular on the shaft and are securely tightened.


Figure 6 Replace the Cam on the Hub

10. Reinstall the Pulley onto the shaft and secure the set screws.

NOTE: When you install the hub and the pulley make sure there is no spacebetween as shown in Figure 4 , on page 4.

11. Reinstall the Pulley Belt and tighten the Motor Bracket to the correct belt tension.Make sure the two pulleys are in line.

12. Reinstall the Shutter Hub making sure you tighten the set screw.

13. Reinstall the Home Sensor Mount Bracket.

8/3/01

Installing the Subassembly and Handlers

1. Reinstall the Indexer Assembly using the four screws. Do not snug the bolts.Make sure the plate is parallel to the edge of the Track Station. See Figure 1 .Tighten the bolts.

2. Connect the Sensor cable (P/N 173618), Index Home Flag, from S1 connector.See Figure 5, on page 6.

3. If the machine is equipped with Pulltesters (P/N 174001), they will need to beinstalled and connected. Tighten the clamps retaining them.

4. Power up the bonder. To check the Indexer alignment:

a. Press Toggle, Manual Positioning.

b. If the position does not line up with the Indexer Pawl, loosen the four screws, align, and tighten.

5. Replace all the cover panels and secure with the screws.

Testing


2. Cycle the Clamp Motor a couple of times manually with no part present.

3. With the Clamps in the “clamped” position, turn the Clamp Motor knob slowlycounterclockwise which is the opposite of the direction of normal travel.

4. Watch the LEDs mounted on the left side wall:

a. D8 should be on when the Clamps are fully closed. They should turn off after turning the knob counterclockwise.


b. D6 should come on with continued turning after D8 goes off.

5. If D6 comes on before D8 goes off, then the part sensor needs to be adjusted. Toadjust it loosen the part sensor screws and move it back until the diodes arecorrectly timed.

Calibration Instructions for the Generator PCB using the Generator Load Box

Document Revision ARevision A of this document shows the modification of the Front Panel to make the Load Box compatible with NGB machines. A toggle switch was added to the panel to select between 50 Ohms and 84.5 Ohms. For the Model 360 Family and the Model 20, the toggle switch shall point to 84.5 Ohms. The 50 Ohms is only used for the NGB’s.

ApplicableAll M20 and M360 Family machines.

Part Number172478 Generator Load Box (includes Cables P/N 708214 and P/N 130606)

PurposeThis Technical Bulletin provides procedures for calibrating the various Generator PCBs using the Generator Load Box.

ProblemCalibrating the Generator PCBs is an important factor in producing a high quality bond. To calibrate the Generator PCB requires various test equipment and loads that are not commonly found at every production site. Orthodyne created a Generator Load Box that simulates various loads and requires (in most cases) the use of an Ammeter or digital multimeter (DMM).

ProceduresThis document consists of separate procedures for each type of Generator PCB used on each type of Wire Bonder. Refer to the Model Number Wire Bonder and Generator PCB type for the procedure to use from the following:

Model 360A PDOS version with Binary PR and Generator PCB (P/N 160713) (Page 2)

Models 360A or 360B OS9 version with Gray Scale PR and Generator PCBs (P/N 160713) (60 kHz) or (P/N 160753) (40 kHz) (Page 10)

Model 360C with Universal Generator PCB (P/N 175507) (60 kHz) (Page 18)

Model 360C with Generator PCBs (P/N 172567) (60 kHz) or (P/N 172528) (40 kHz) (Page 23)

Model 360S with Generator PCB (P/N 175507) (60 kHz) (Page 27)

Model 20 with Generator PCB (P/N 130610) (Page 31)

TECHNICAL BULLETINDoc No. DC06-172478A

Tracking No. TB 1116 RevA1

ORTHODYNE ELECTRONICS TECHNICAL BULLETIN DOC NO. DC06-172478A (TB 1116) PAGE 1 OF 35

Model 360APDOS Version with Binary PR and Generator PCB (P/N 160713)

Phase Calibration


2. Install a Bond Tool, similar to the one you will use for bonding. See the Technician’s Manual, “Setting Up The Bond Tools” on page 4-1.

3. Open the Electronic Cabinet and slide the VME Card Cage out.

4. Disconnect the Power and Transducer Cables from the back of the Generator PCB. See Figure 1.

Figure 1 Power and Transducer Cables

5. Disengage the four captive screws and remove the Generator PCB from the VME Card Cage.

Items Required

DC Ammeter

Generator Load Box P/N 172478

Cable P/N 708214

BNC Tee Adapter

Tuning Tool P/N 171238

IMPORTANT: Prior to handling electronic printed circuit boards, you must protect the PCBs from electrostatic damage. Before opening the Electronic Cabinet or handling the Generator PCB, ensure that you are wearing an ESD wrist band or other ESD preventive clothing.

Transducer Cable

Power Cable

PAGE 2 OF 35 ORTHODYNE ELECTRONICS TECHNICAL BULLETIN DOC NO. DC06-172478A (TB 1116)

6. Remove the four pan screws attaching the Power Amp Panel to the Generator PCB and separate the Panel from the PCB. Do not disconnect the wiring. See Figure 2.

Figure 2 Power Amp Panel on Generator PCB

7. Carefully install the Generator PCB with the loose Power Amp Panel into the VME Card Cage. Lay the Panel next to the PCB. See Figure 3.

Figure 3 Generator PCB with Loose Power Panel

8. Connect the Power Cable onto the back of the Generator PCB. See Figure 1 , on page 2.

9. Install a BNC-T Adapter onto the XDCR connector on the back of the Generator PCB.

Attaching Hardware

Attaching Hardware

Power Amp Panel

Generator PCB

Power Amp Panel


10. Connect the Transducer Cable onto one side of the BNC-T. See Figure 4.

11. Apply power to the Bonder.

Figure 4 BNC Tee

12. From the Main Menu, type [7] and then [3] to access the Generator Test screen.

13. Press and hold down the [START] button. The displayed scale should indicate a value greater than 50. If not, check the Tool alignment.

NOTE: The Generator Test will time out and the value will drop to zero. Press and hold [START] to continue the adjustment after each time out.

a. Use Tuning Tool (P/N 171238) and adjust Inductor L1 on the Generator PCB. See Figure 5 , on page 5.

b. Observe the scale on the display and adjust Inductor L1 clockwise until the value starts to drop off (not time out) and then stop turning.

c. Count the number of turns while you adjust Inductor L1 counterclockwise until the value starts to drop off (not time out) again and then stop turning. It should be about one to two turns.

d. Divide the number of turns by two and turn Inductor L1 clockwise that number of turns.

Example: 1½ turns counterclockwise

1½ turns ÷ 2 = ¾ turn

Adjust L1 clockwise ¾ turn.

Cable (P/N 708214) Used in the Output

Level (Voltage) Section

Connect Transducer Cable onto BNC-T


Figure 5 Inductor L1

Output Level (Voltage)


2. Place the selector switch on the front of the Generator Load Box in the “V out” position.

3. Make sure the toggle switch points to 84.5 Ohms.

4. Connect Cable (P/N 708214) onto the open side of the BNC-T Adapter you placed on the back of the Generator PCB in the previous procedure. See Figure 4 , on page 4.

5. Connect the other end of the Cable onto the M360 GENERATOR connector on the back of the Generator Load Box. See Figure 6.

Figure 6 Generator Load Box

L1

Front View Rear View


6. Connect the DC Ammeter into the Generator Load Box [(+) white and (-) black banana terminals]. See Figure 7.


Figure 7 Ammeter Connection on Generator Load Box

8. Insert the GENTEST program disk in the Bonder’s Floppy Drive and apply power.

9. After bootup, the display should be as follows:

Booting....Please Wait....Ready

O> Menu


O>*Menu: Displays list of utilities

O>*Gentest: Generator test and calibration

O>

Negative Terminal

Positive Terminal


10. At the O> prompt type GENTEST (upper case) and press [Enter]. The display will change to:

11. Press any key and the display will change to the following Menu:

12. Type “1” which selects the Output level calibration. The display will change to the Output level calibration screen.

13. Type “255” in the generator power field and press and hold the [START] button.

Model 360 GENERATOR TEST AND CALIBRATION

Gentest SOFTWARE Copyright 1992by Orthodyne Electronics Corporation

All Rights Reserved

Version numbers:Gentest: 1.00Terminal: Wyse WY-60

Press Any Key

GENTEST MAIN MENU


2) A/D calibration



14. Use a small screwdriver and adjust R25 until the Ammeter indicates 3.00 ± 0.10 mA. See Figure 8.

Figure 8 Resistor R25

15. Press [F16] and the display changes to the GENTEST MAIN MENU.

A/D Calibration

1. Place the selector switch on the front of the Generator Load Box in the “R” position.

2. Type “2” which selects the A/D calibration.

3. Press [START] and follow the instructions displayed on the monitor.

4. Use a small screwdriver and adjust the COARSE ADJUST potentiometer (R27) until the scale on the display indicates 0 (middle of scale). See Figure 9.

Figure 9 A/D Adjustment Potentiometers

R25

R27

R26


5. Press [STOP] and follow the instructions displayed on the monitor.

6. Use a small screwdriver and adjust the FINE ADJUST potentiometer (R26) until the scale on the display indicates 0 (middle of scale). See Figure 9.

7. Press [STOP].

8. Compare the Programmed Values with the Measured Values indicated on the display. If the Values differ by more than two (2), repeat steps 3 through 8. If the values still differ by more than two (2) after repeating the steps, the Generator PCB may be faulty and may need to be replaced.


Return the Bonder to Operation Status


2. Disconnect Cable (P/N 708214) and the Transducer Cable, and remove the BNC-T Adapter from the back of the Generator PCB.

3. Carefully remove the Generator PCB with the Power Amp Panel attached from the VME Card Cage.

4. Install the Power Amp Panel onto the Generator PCB with the four pan screws.

5. Install the Generator PCB into the VME Card Cage and secure it with the four captive screws.

6. Connect the Power and Transducer Cables onto the back of the Generator PCB. See Figure 1 , on page 2.

7. Remove the GENTEST program disk and install the M360 program disk in the Bonder’s Floppy Drive.



Model 360A or 360BOS9 Version with Gray Scale PR and Generator PCBs

(P/N 160713) (60 kHz) or (P/N 160753) (40 kHz)

Phase Calibration




4. Disconnect the Power and Transducer Cables from the back of the Generator PCB. See Figure 10.

Figure 10 Power and Transducer Cables

Items Required

DC Ammeter


Cable P/N 708214

BNC Tee Adapter



Power Cable

Transducer Cable


5. Disengage the four captive screws and remove the Generator PCB from the VME Card Cage.

6. Remove the four pan screws attaching the Power Amp Panel to the Generator PCB and separate the Panel from the PCB. Do not disconnect the wiring. See Figure 11.

Figure 11 Power Amp Panel on Generator PCB

7. Carefully install the Generator PCB with the loose Power Amp Panel into the VME Card Cage. Lay the Panel next to the PCB. See Figure 12.

Figure 12 Generator PCB with Loose Power Panel

8. Connect the Power Cable onto the back of the Generator PCB. See Figure 10 , on page 10.

Attaching Hardware

Attaching Hardware

Power Amp Panel

Power Amp Panel

Generator PCB


9. Install a BNC-T Adapter onto the XDCR connector on the back of the Generator PCB and connect the Transducer Cable onto one side of the BNC-T. See Figure 13.

Figure 13 BNC Tee


11. From the Main Menu, type [7] and then [3] to access the Generator Test screen.

12. Press and hold down the [START] button. The displayed scale should indicate a value greater than 50. If not, check the Tool alignment.

NOTE: The Generator Test will time out and the value will drop to zero. Press and hold [START] to continue the adjustment after each time out.

a. Use Tuning Tool (P/N 171238) and adjust Inductor L1 on the Generator PCB. See Figure 14 , on page 13.

b. Observe the scale on the display and adjust Inductor L1 clockwise until the value starts to drop off (not time out) and then stop turning.

c. Count the number of turns while you adjust Inductor L1 counterclockwise until the value starts to drop off (not time out) again and then stop turning. It should be about one to two turns.

d. Divide the number of turns by two and turn Inductor L1 clockwise that number of turns.

Example: 1½ turns counterclockwise

1½ turns ÷ 2 = ¾ turn

Adjust L1 clockwise ¾ turn.

Cable (P/N 708214) Used in the Output

Level (Voltage) Procedure

Connect Transducer Cable onto BNC-T


Figure 14 Inductor L1





4. Connect Cable (P/N 708214) onto the open side of the BNC-T Adapter you placed on the back of the Generator PCB in the previous procedure. See Figure 13 , on page 12.

5. Connect the other end of the Cable onto the M360 GENERATOR connector on the back of the Generator Load Box. See Figure 15.


L1





Figure 16 Ammeter Connection on Generator Load Box

8. Insert the GENTEST program disk in the Bonder’s Floppy Drive and apply power.

9. After bootup, the display should be as follows:

Booting....Please Wait....Ready

O> Menu


O>*Menu: Displays list of utilities

O>*Gentest: Generator test and calibration

O>

Negative Terminal

Positive Terminal


10. At the O> prompt type GENTEST (upper case) and press [Enter]. The display will change to:

11. Press any key and the display will change to the following Menu:

12. Type “1” which selects the Output level calibration. The display will change to the Output level calibration screen.

13. Type “255” in the Generator Power field and press and hold the [START] button.

Model 360 GENERATOR TEST AND CALIBRATION

Gentest SOFTWARE Copyright 1992by Orthodyne Electronics Corporation

All Rights Reserved

Version numbers:Gentest: 1.1Terminal: Wyse WY-60

Press Any Key

GENTEST MAIN MENU


2) A/D calibration



14. Use a small screwdriver and adjust R25 until the Ammeter indicates 3.00 ± 0.10 mA (60 kHz) or 2.90 ± 0.10 mA (40 kHz). See Figure 17.

Figure 17 Resistor R25


A/D Calibration

1. Rotate the selector switch on the front of the Generator Load Box to the “R” position.

2. Type “2” which selects the A/D calibration.


4. Use a small screwdriver and adjust the COARSE ADJUST potentiometer (R27) until the scale on the display indicates 0 (middle of scale). See Figure 18.

Figure 18 A/D Adjustment Potentiometers

R25

R27

R26


5. Press [STOP] and follow the instructions displayed on the monitor.

6. Use a small screwdriver and adjust the FINE ADJUST potentiometer (R26) until the scale on the display indicates 0 (middle of scale). See Figure 18.

7. Press [STOP].

8. Compare the Programmed Values with the Measured Values indicated on the display. If the Values differ by more than two (2), repeat steps 3 through 8. If the values still differ by more than two (2) after repeating the steps, the Generator PCB may be faulty and may need to be replaced.




2. Disconnect Cable (P/N 708214) and the Transducer Cable, and remove the BNC-T Adapter from the back of the Generator PCB.

3. Carefully remove the Generator PCB with the Power Amp Panel attached from the VME Card Cage.

4. Install the Power Amp Panel onto the Generator PCB with the four pan screws.

5. Install the Generator PCB into the VME Card Cage and secure it with the four captive screws.

6. Connect the Power and Transducer Cables onto the back of the Generator PCB. See Figure 10 , on page 10.

7. Remove the GENTEST program disk and install the M360 program disk in the Bonder’s Floppy Drive.



Model 360Cwith Universal Generator PCB (P/N 175507) (60 kHz)

NOTE: If you are interchanging or are going to interchange a Large Wire Bond Head with a Small Wire Bond Head, perform the calibration with the Large Wire Bond Head and then change the Bond Head. This will eliminate the generator as a suspect if the Small Wire Bond Head does not calibrate properly. After the change proceed to the 360S calibration procedure.





Items Required

DC Ammeter


Cable P/N 708214

Plastic Screwdriver P/N 622218



4. Disconnect the Transducer Cable from the J8 Connector on the back of the Generator PCB. See Figure 19.

Figure 19 Connector J8

5. Connect one end of Cable (P/N 708214) onto Connector J8 and the other end of the Cable onto the M360 GENERATOR connector on the back of the Generator Load Box. See Figure 20.



7. Place the toggle switch so that it points to 84.5 Ohms.


Transducer Cable

Connector J8



Figure 21 Ammeter Connection on the Generator Load Box



11. From the Main Menu, press (7) and then (3) to get to the Generator calibration test.

12. Press [F14] and follow the instructions displayed on the monitor. As part of the instructions, you will be directed to ensure the LEVEL Switch on the Generator PCB is in the HIGH position. See Figure 22 , on page 21.

13. Use a small screwdriver and adjust the HIGH potentiometer (VR4) until the Ammeter indicates 3.00 ± 0.10 mA. See Figure 22 , on page 21.

14. Press [F16]. The display will change to the Main Menu.

Negative Terminal

Positive Terminal


Figure 22 Universal Generator P/N 175507 Front Panel

NOTE: The (9) LEVEL LED is ON as long as there is an ultrasonic output.The (+/-) PHASE LED’s are both OFF when the phase is zero. If (+) is ON, the potentiometer is too far counterclockwise. If (-) is ON, the potentiometer is too far clockwise.

1 Power Supply LEDs; On = that voltage is present

2 Spare I/O Connector

3 TRANSDUCER CURRENT LED; On = Transducer connected

4 GAIN 1 potentiometer (VR1) (Large Wire Bond Head)

5 GAIN 2 potentiometer (VR2) (Small Wire Bond Head)

6 NULL potentiometer (VR3) (Factory Use Only) (DO NOT ADJUST)

7 HIGH potentiometer (VR4) (Large Wire Bond Head)

8 LEVEL Switch (HIGH = Large Wire Bond Head; LOW = Small Wire)

9 LEVEL LED; On = Generator has an Ultrasonic output at some voltage

10 LOW potentiometer (VR5) (Small Wire Bond Head)

11 FREQ ADJUST potentiometer

12 TRIGGER Connector (BNC Connector)

13 PHASE (+) potentiometer (VR6) (Factory Use Only) (DO NOT ADJUST)

14 PHASE (+) LED; On = Positive Phase Shift

15 PHASE SHIFT Connector (BNC Connector)

16 PHASE (-) potentiometer (VR7) (Factory Use Only) (DO NOT ADJUST)

17 PHASE (-) LED; On = Negative Phase Shift

18 SIGNAL SAMPLE Connector (BNC Connector)

NOTE: If both PHASE (+) and PHASE (-) LEDs are off, then the Phase Shift is zero (0).

1

2

34567891011

12

1314

15

1617

18


Sampling Gain

1. Place the selector switch on the front of the Generator Load Box in the “R” position.

2. On the Main Menu, press [7] and then [3], and the display will change to the Generator Test screen.


4. Use a small screwdriver and adjust the GAIN 1 potentiometer (VR1) until the pointer on the displayed scale indicates 50. See Figure 22.

5. Disconnect Cable (P/N 708214) from Connector J8 on the back of the Generator PCB and connect the Transducer Cable onto J8.

Phase Shift

1. Press [F9] and follow the instructions displayed on the monitor.

2. Use the Plastic Screwdriver (P/N 622218) and adjust the FREQ ADJUST potentiometer until the value on the display is 128 ± 1.


4. Repeat procedure “Output Level (Voltage)” on page 18.

5. Close the Electronic Cabinet.

IMPORTANT: DO NOT remain in the PHASE CALIBRATION mode for more than 30 seconds. This test causes the internal components of the Generator PCB to heat up which will distort the output. This will cause the calibration settings to fall outside of the specification.


Model 360Cwith Generator PCBs (P/N 172567) (60 kHz) or

(P/N 172528) (40 kHz)







Items Required

DC Ammeter

Digital Multimeter


Cable P/N 708214


IMPORTANT: Prior to handling electronic printed circuit boards you must protect the PCBs from electrostatic damage. Before opening the Electronic Cabinet or handling the Generator PCB, ensure that you are wearing an ESD wrist band or other ESD preventive clothing.

Transducer Cable

Connector J8


5. Connect one end of Cable (P/N 708214) onto Connector J8 and the other end of the Cable onto the M360 GENERATOR Connector on the back of the Generator Load Box. See Figure 24.











Negative Terminal

Positive Terminal


13. Use a small screwdriver and adjust the POWER CALIB potentiometer until the Ammeter indicates 3.00 ± 0.10 mA (60 kHz) or 2.90 ± 0.10 mA (40 kHz). See Figure 26.

Figure 26 Generator P/Ns 172567 and 172528 Front Panel


Sampling Gain


2. On the Main Menu, press [7] and then [3]. The display will change to the Generator Test screen.


4. Use a small screwdriver and adjust the FINE ADJUST potentiometer until the pointer on the displayed scale indicates 50. See Figure 26.

5. Disconnect Cable (P/N 708214) from Connector J8 on the back of the Generator PCB, and connect the Transducer Cable onto J8.

IMPORTANT: DO NOT adjust the COARSE ADJUST and PHASE ADC potentiometers. They are factory adjustable only. Adjusting these potentiometers will force the PCB out of the specification and cause a fault.

POWER CALIB Potentiometer

DO NOT Adjust the COARSE ADJUST or the PHASE ADC

Potentiometers

FINE ADJUST Potentiometer

FREQ ADJUST Potentiometer

PHASE SHIFT Connector


Phase Shift

1. Connect the Digital Multimeter onto the PHASE SHIFT Connector on the front panel of the Generator PCB. See Figure 26 , on page 25.

2. Set the Multimeter to the 2 VDC range.

3. If you are not on the Generator Test screen, press [F16], [7], and then [3].

4. Press and hold the [START] button.

5. Use the Plastic Screwdriver (P/N 622218) and adjust the FREQ ADJUST potentiometer until the Multimeter indicates 0 ± 0.010 VDC. See Figure 26 , on page 25.

NOTE: The Generator will time-out after a short time, to continue, release the [START] button and then press and hold the [START] button.

6. Press [F16] and the display will change to the Main Menu.

7. Disconnect the Multimeter from the PHASE SHIFT Connector.



IMPORTANT: DO NOT remain in the PHASE CALIBRATION mode for more than 30 seconds. This test causes the internal components of the Generator PCB to heat up which will distort the output. This will cause the calibration settings to fall outside of the specification.


Model 360Swith Universal Generator (P/N 175507) (60 kHz)







Items Required

DC Ammeter


Cable P/N 708214


IMPORTANT: Prior to handling electronic printed circuit boards, you must protect the PCBs from ESD. Before opening the Electronic Cabinet, ensure that you are wearing an ESD wrist band or other ESD preventive clothing.

Connector J8

Transducer Cable


5. Connect one end of Cable (P/N 708214) onto Connector J8 and the other end of the Cable onto the M360 GENERATOR connector on the back of the Generator Load Box. See Figure 28.










Negative Terminal

Positive Terminal


12. Press [F14] and follow the instructions displayed on the monitor. As part of the instructions, you will be directed to ensure the LEVEL Switch on the Generator PCB is in the LOW position. See Figure 30.

Figure 30 Universal Generator P/N 175507 Front Panel

NOTE: The (9) LEVEL LED is ON as long as there is an ultrasonic output.The (+/-) PHASE LED’s are both OFF when the phase is zero. If (+) is ON, the potentiometer is too far counterclockwise. If (-) is ON, the potentiometer is too far clockwise.

1 Power Supply LEDs; On = that voltage is present

2 Spare I/O Connector

3 TRANSDUCER CURRENT LED; On = Transducer connected

4 GAIN 1 potentiometer (VR1) (Large Wire Bond Head)

5 GAIN 2 potentiometer (VR2) (Small Wire Bond Head)

6 NULL potentiometer (VR3) (Factory Use Only) (DO NOT ADJUST)

7 HIGH potentiometer (VR4) (Large Wire Bond Head)

8 LEVEL Switch (HIGH = Large Wire Bond Head; LOW = Small Wire)

9 LEVEL LED; On = Generator has an Ultrasonic output at some voltage

10 LOW potentiometer (VR5) (Small Wire Bond Head)

11 FREQ ADJUST potentiometer

12 TRIGGER Connector (BNC Connector)

13 PHASE (+) potentiometer (VR6) (Factory Use Only) (DO NOT ADJUST)

14 PHASE (+) LED; On = Positive Phase Shift

15 PHASE SHIFT Connector (BNC Connector)

16 PHASE (-) potentiometer (VR7) (Factory Use Only) (DO NOT ADJUST)

17 PHASE (-) LED; On = Negative Phase Shift

18 SIGNAL SAMPLE Connector (BNC Connector)

NOTE: If both PHASE (+) and PHASE (-) LEDs are off, then the Phase Shift is zero (0).

1

2

34567891011

12

1314

15

1617

18


13. Use a small screwdriver and adjust the LOW potentiometer (VR5) until the Ammeter indicates 1.15 ± 0.10 mA. See Figure 30.


Sampling Gain


2. On the Main Menu, press [7] and then [3], and the display will change to the Generator Test screen.


4. Use the small screwdriver and adjust the GAIN 2 potentiometer (VR2) until the pointer on the displayed scale indicates 62. See Figure 30 , on page 29.

NOTE: The GAIN 2 potentiometer adjustment does not give a continuous movement on the indicator scale. The movement is in discrete steps that take time to get used to. Use patience and the adjustment can be accomplished.

5. Disconnect Cable (P/N 708214) from Connector J8 on the back of the Generator PCB, and connect the Transducer Cable onto J8.

Phase Shift


2. Use the Plastic Screwdriver (P/N 622218) and adjust the FREQ ADJUST potentiometer until the value on the display is 128 ± 1.

3. Press [F16] and the display will change to the Main Menu.



IMPORTANT: DO NOT remain in the PHASE CALIBRATION mode for more than 30 seconds. This test causes the internal components of the Generator PCB to heat up, which will distort the output. This will cause the calibration settings to fall outside of the specification.


Model 20with Generator PCB (P/N 130610)



2. Open the Bonder’s Head Covers and disconnect the Transducer Cable from Connector J7. See Figure 31.


Items Required

Digital Multimeter

Oscilloscope

Frequency Counter


Cable P/N 130606


IMPORTANT: Prior to handling electronic printed circuit boards, you must protect the PCBs from electrostatic damage. Before opening the bonder’s covers or handling the Generator PCB, ensure that you are wearing an ESD wrist band or other ESD preventive clothing.

Connector J7


3. Disengage the Generator Assembly’s attaching captive thumbscrew at the rear of the Bonder. See Figure 32.

Figure 32 Generator Assembly’s Attaching Thumbscrew

4. Slide the Generator Assembly part-way out of the rear of the Bonder. Pull the Assembly out far enough to access the attached Electrical Cable’s Connector P101.

5. Disconnect the attached Electrical Cable from Connector P101 on the Generator Assembly.

6. Place the Generator Assembly on top of the right side of the Bonder’s Base. See Figure 33.

Figure 33 Generator Assembly on Bonder’s Base

7. Route the Electrical Cable out the cavity in the Bonder’s Base and connect it into Connector P101 on the Generator Assembly.


9. Use the Multimeter and check the Power Supply voltages at Connector P101 on the Generator PCB. See Figure 34 , on page 33.

a. Place the plus lead (+) on Pin 11 with the minus lead (-) on Pin 6.

1) The Multimeter should indicate 34 ± 3 VDC.

b. Place the plus lead (+) on Pin 5 with the minus lead (-) on Pin 6.

1) The Multimeter should indicate 17 ± 2 VDC.

Attaching Thumbscrew

Generator Assembly

P101 Connector

Bonder’s Base


c. Place the plus lead (+) on Pin 4 with the minus lead (-) on Pin 6.

1) The Multimeter should indicate 12 ± 0.5 VDC.

Figure 34 Connector P101

10. Connect the oscilloscope onto one lead of Inductor L103 on the Generator PCB, and connect the ground lead onto the minus (-) lead of Capacitor C101. See Figure 35.

Figure 35 Generator PCB

L103 Oscilloscope Connection Lead

C101 Oscilloscope & Frequency

Counter Ground Connection Lead

HI-LOW Switch↑ = HI; ↓ = LO

Potentiometer R164

L103 Freq. Counter Connection Lead

Inductor L101

IC105 Pin 3

Potentiometer R163


11. Place the HI-LOW Switch S103 on the Generator PCB in the HI position. See Figure 35.

12. Set the TIME 1, TIME 2, POWER 1, and POWER 2 controls on the Generator’s Front Panel to maximum.

13. Cycle the Bonder and use a small screwdriver to adjust Potentiometer R164 on the Generator PCB for a 30 Vp-p sine wave indication on the oscilloscope. See Figure 35 , on page 33.

14. Disconnect the oscilloscope from the Generator PCB.

Frequency Range

1. Connect the frequency counter onto the opposite lead of Inductor L103 that was connected to the oscilloscope. See Figure 35 , on page 33.

2. Connect the ground lead to the minus lead of Capacitor C101, as was done with the oscilloscope in Step 10 on the previous page.

3. Open the left Bond Head Cover and connect one end of Cable P/N 130606 onto Connector J7. See Figure 31 , on page 31.

4. Connect the other end of Cable (P/N 130606) onto the M20 Generator Connector on the back of the Generator Load Box. See Figure 36.


5. Place the selector switch on the front of the Generator Load Box in the “L” position.


7. Press and hold the TEST button on the Generator’s Front Panel for less than two (2) seconds at a time.

a. Use the Tuning Tool (P/N 171238) and adjust Inductor L101 until the indication on the frequency counter is 57.50 kHz. See Figure 35 , on page 33.

8. Rotate the selector switch on the front of the Generator Load Box to the “C” position.


IMPORTANT: DO NOT hold the TEST button down for more than two (2) seconds at a time. Longer periods of time will cause the internal components to heat up and can damage the Generator PCB.


9. Press and hold the TEST button on the Generator’s Front Panel for less than two (2) seconds at a time.

a. Record the indication on the frequency counter.

b. Subtract 60.50 kHz from the recorded frequency.

c. Divide the sum by two (2).

d. Add that product to 60.50 kHz.

e. Adjust Inductor L101 for an indication on the frequency counter that equals the final sum. See Figure 35 , on page 33.

Example: Recorded Value = 60.76 kHz

60.76 - 60.50 = 0.26 kHz

0.26 ÷ 2 = 0.13 kHz

60.50 + 0.13 = 60.63 kHz

Adjust L101 for an indication of 60.63 kHz, on the frequency counter.

10. Disconnect Cable P/N 130606 from Connector J7 and remove the Generator Load Box.

11. Disconnect the frequency counter from Inductor L103.

Phase Lock

1. Use an IC clip and connect the oscilloscope onto Pin 3 of IC105 on the Generator PCB. See Figure 35 , on page 33.

2. Connect the ground lead onto the minus (-) lead of Capacitor C101.

3. Cycle the Bonder and use a small screwdriver to adjust Potentiometer R163 on the Generator PCB for a 500 ms positive going pulse indication on the oscilloscope. See Figure 35 , on page 33.

4. Disconnect the oscilloscope and remove the IC clip.

5. Connect the Transducer Cable into Connector J7 and close the Bond Head Covers. See Figure 31 , on page 31.



2. Disconnect the Electrical Cable from Connector P101 on the Generator Assembly.

3. Route the Electrical Cable into the cavity in the Bonder’s Base.

4. Install the Generator Assembly into the Bonder.

a. Slide the Assembly part-way in from the rear of the Bonder.

b. Connect the Electrical Cable into Connector P101.

c. Completely seat the Assembly in the Bonder and tighten the captive thumbscrew.



Using Area Statistic In PR

Applicable

M360 Family machines.

Purpose

The Area Statistics screen is a tool to assist in developing a strong PR program. It contains data on PR performance during auto-run. You can use this data to modify the existing program to:

increases bonder performance

decreases machine stoppages

determines die placement accuracy

Procedure

To access this screen:

Software version 5.7J: Press from the Main Menu (9) Statistics, F14 for Area Statistics

Software version 5.8: Press from the Main Menu (9) Statistics, F14 for PR Stat Menu, PR list for Area Statistics

The screen shows three types of information, shown in Figure 1 , on page 2.

1. Total number of PR failures and a breakdown of the failures

2. Die placement accuracy data

3. Quality results data



ORTHODYNE ELECTRONICS TECHNICAL BULLETIN DOC NO. DC06-172000 (TB 1118) PAGE 1 OF 3

Figure 1 Area Statistics Screen

Part 1 - PR failures

Let’s examine this example from a PR list using dual point PR. The six “Region 1 quality failures” occur when the quality results are less than the programmed quality threshold. It may be due to:

a. poor model selection

b. quality threshold set too high

c. die placement varies outside of the search box.

The two “dual point tolerance failures” indicate that one model is found in a different location other than the programmed location. The problem is the PR is finding objects that aren’t your programmed model. Programming a better model and/or increasing the quality threshold to avoid these false finds will resolve this problem.

Part 2 - Mean X & Y

This shows the average coordinate of the assist point, which is linked directly to the model’s “find” location. By subtracting the MIN from the MAX value, you can determine the range of die/pin/substrate movement in each axis. In the X axis the MIN and MAX difference is 68 microsteps, or 212.5 microns (1 motor step = 3.125 microns). With this data you can optimize your search box dimensions to account for the die/pin/substrate movement. The goal is to make the box as small as possible to minimize PR time, yet large enough to allow for the varied placement of the object.

AREA STATISTICS

Area 1 Area Find Failures 8

Eyepoint 1 Region 1 quality failures 6

Region 2 quality failures 0

Dual Point Tolerance failures 2

Number of Samples 50

Mean X: -867.7 (min: -885, max -817) Standard deviation: 12.7

Mean Y: 412.1 (min: 341, max 449) Standard deviation: 17.1

Region 1

First Iteration of Quality Mean: 936.0 Standard deviation: 21.5

Second Iteration of Quality Mean: 926.1 Standard deviation: 22.0

Region 2

First Iteration of Quality Mean: 936.8 Standard deviation: 15.3

Second Iteration of Quality Mean: 926.7 Standard deviation: 9.9

Arrows

F12: Clear Statistics F15: Assist Stats

F16: Abort

PAGE 2 OF 3 ORTHODYNE ELECTRONICS TECHNICAL BULLETIN DOC NO. DC06-172000 (TB 1118)

Part 3 - Quality Result

The average values of each region and iteration quality results will help you choose the “quality threshold” parameter when editing your PR program. Knowing the mean and standard deviation, you can choose a value that will pass a valid point, but fail for invalid points.

In the example, a mean quality result of 936 with a standard deviation of 21 might suggest a quality threshold of approximately 900. You must confirm that 900 is well above the quality result when the model is outside the search box. To accomplish this, move the X and Y location away from the model location and perform multiple PR spots in the PR Edit Screen. The main goal is to choose a value just below the quality mean so that the bonder finds only the valid model and stops when the model is not within the search box.


Correcting Dorio Monitor Scrambled Data

ApplicableAll M360 family of machines.

PurposeThe Dorio monitor would occasionally display unintelligible text. This condition may be caused by an incompatibility with the GMS break-out board (P/N 172543-97). This bulletin describes a fix for this sit-uation.

SolutionSome of the Dorio monitor issues which may appear as intermittent displays of unintelligible text may be a compatibility problem caused by the use of a Texas Instrument chip (TI 75C188), or another brand of chip, used in U3. If a machine has a combination of a GMS CPU and a break-out board with the TI or other chip in U3 displays this problem, the solution is to replace the U3 chip with Motorola MC1488 (718093).

Procedure1. Power down the Bonder.

NOTE: Proper ESD protective measures must be used before handling any electronic boards.

2. Open the electronic card cage drawer.

3. Determine if the machine has a GMS CPU.

4. If is does, remove the break-out board (P/N 172543-97).

5. Examine the U3 chip. If the break-out board does not have a Motorola chip, then contact OE to get a replacement break-out board.

6. A picture of the correct break-out board configuration is shown in Figure 1.




Figure 1 Correct GMS Break-Out Board

END.

Motorola MC1488 (718093) - U3

PAGE 2 OF 2 ORTHODYNE ELECTRONICS TECHNICAL BULLETIN DOC NO. DC06-172543 (TB 1123)

SRN# Date Description 5.7f 2/99 New technical updates and bug fixes 5.7g 4/99 Fixes two bugs 5.7h 1/00 Two feature change: 40 volt interlock system and instructions 5.7i 1/00 Not released 5.7j 1/00 New CPU board made by Force Company replaces GMS board 5.8 rev. A 4/00 New Release, adds SECS/GEM and other screen update 5.8A 1/01 New Release 5.8B 8/01 New Release 5.8C 11/01 New Release 5.8D 1/02 New Release 5.8E 10/02 New Release 5.1.1 4/01 Autoline 5.10 12/02 New Release

2/22/99

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Applicable

Version 5.7F is targeted to run on all variations of the M360 platform, including the Active LControl Bond Head option, and the Model 360S Small Wire Bonder. This release note incorates all the changes made to date to the 5.7x series software.

Objective

Software Version 5.7F includes new functional features and bug fixes. Bug fixes are inclusall previous versions of the 5.7 software series.

Contents of Package

(1) Floppy disk containing Version 5.7F (P/N 172518-1 R) (System).

(1) Software Release Instructions for Version 5.7F.

Compatibility

Version 5.7F is backwards compatible with all previous machines that used 5.x series softwarecombinations of hardware will be supported, including old (P/N 171507) and new (P/N 171562old (P/N 172532) and new (P/N 175512) I/O, and old (P/N 172567) and new (P/N 175507) gen

NOTE: Wire lists created or edited on Version 5.7F cannot be run on software verearlier than 5.7. Once Version 5.7F is installed, editing and then saving a procreated with a version earlier than 5.7 will automatically update it to the laVersion 5.7F.

Therefore the program will no longer be compatible with the earlier softwaresions. OE suggests you make copies onto floppies of Wire lists createdearlier version software so you can run those Wire lists with the earlier vesoftware.


NOTE: Before you install the new software, print out a hard copy of the default parameters. With this release, new default wire parameters will overwrite thevious default wire parameters. Manually reenter the parameters you want chto the default sets after loading Version 5.7F.

SOFTWARE RELEASE Version 5.7F

ORTHODYNE ELECTRONICS SOFTWARE RELEASE SW 5.7F.FM PAGE 1 OF 5

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To install software, use the following procedure:


2) Exit the bonder program (MAIN MENU, “!” key).

3) Insert the new system disk (P/N 172518-1 R) in the data drive on the front of the bcontrol drawer (D1). At the prompt, type “/d1/install” and press [ENTER].

4) When the installation process is complete, cycle power on the bonder to restasystem. (Power must be cycled, rather than just typing “m360” because the OS-9 must be reloaded due to updates to some of the system modules.)

If any problems are experienced after installing the new version, it may be necessary to clesystem RAM and reload default values. Use the following procedure:


2) When the “RESET COMMAND HAS BEEN ENTERED” screen displays, select “D”reload defaults.

3) All machine calibrations must be performed again (limits, touch sensor, forcer, ofetc.). Also, any handler, printer, and system parameters must be re-entered.

NOTE: This Software Release document describes the significant additions to Ve5.7F from 5.6B. If you are replacing software versions earlier than 5.6B, yourequest the Release Notes from your current version forward, so you can ssequential improvements made to the software up to Version 5.7F. Contact Odyne Technical Documentation Department to update your documents.

Feature Changes

1. Small Wire and ALC: Added into EXERCISE MOTORS screen an [F12] commanexercise the clamp motor and the feed motor on the Small Wire head, and the motor on the ALC head.

2) Small Wire: Added into EXERCISE MOTORS screen an [F9] command to exercisForcer.

The modified screen is shown below:


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PURPOSE: This option is useful for troubleshooting motor problems or totribute grease after lubricating the leadscrews.

ACCESS: From the DIAGNOSTICS MENU, press [1].

CONDITIONS: This option is always available.

DESCRIPTION: This screen causes the various axis motors to move fromto limit. This can be useful in troubleshooting motor problems or whenbricating leadscrews as part of the preventive maintenance routine.

Use this screen for troubleshooting when the bonder is consistently geencoder errors in any given axis.

3) Small Wire on a M360C-H/HD: Enabled the XY Spinners in the last step of the forceibration for small wire head (setting the hold force). This allows the user to movhead to a spot on the handler where there is room to hang the calibration weight.

Cut Switch Option

a The cut switch option will be re-implemented for machines equipped with the new(P/N 175512) board and rear cutter. (Machines equipped with the old I/O (P/N 17board have always had the cut switch option available.)

b The cut switch option for the new I/O board is implemented exactly as with the olboard. Cut switch parameters will be available for selection in the SYSTCONFIGURATION screen (access from the MAIN MENU by pressing [7], [B], [F15]

c The LVDT cut method will still be available.

File Name EXERCISE MOTORS Log File

X motion: NoY motion: NoZ motion: NoT motion: Yes

Focus NoMaximum Z depth: 200

When in Maximum Z field, adjust depth with Y spinner then press F14Allowable maximum Z depth is 8500

WARNING: Head will move between axis limitsBe sure there is clearance for the bond tool before pressing START

START: Proceed

SPIN XY F9: Exercise forcer No TOGGLE ARROWS F12: Exercise clamp No F16: Exit


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ZIP Drive Option

a This software version will enable the installation of an optional ZIP drive. Thedrive disk will hold 100 megabytes of information, compared to 1.4 megabytes normal floppy disk. The obvious advantage is that many more wire list programbe stored on one ZIP disk than on a standard floppy.

b The ZIP drive option requires one of two hardware kits; one for an inteinstallation, and one to permit external connection of a drive.

NOTE: File transfers to/from the ZIP drive are available as “Backup aRestore” menu items from the Transfer File selection. Note, hever, that selectable file transfer is not available to/from the ZIPdrive. Only full backup and full restore are available at this timThe standard data drive floppy is still available for the “TransFiles” operations.

c Ordering Information:

Bug Fixes

Version 5.7F corrects the following discovered bugs:

1. Small Wire: Corrected a bug where an excessive wire deformation error occurringsionally during bond-off and offsets calibration. It was incorrectly reported as “Unabclose clamp”.

2) ALC: Corrected a bug that occurred during the “Pull up using forcer” function in thetest calibration screen. If the pulltest failed, the red status light was turned on and dturn off after recovery.

3) Large Wire: Corrected a bug that would happen when initiating bonding (by preSTART from edit or run mode) and then interrupting it (say, by pressing STOP) whenhead is between search height and the surface. This would cause the bonder to lock u

Configuration Part Number Contents

Internal 172480-01 ZIP DriveInstallation Hardware KitSoftware

External 172480-02 Installation Hardware KitSoftware(ZIP Drive not included)


2/22/99

layedage for

orrectith

Thisering”

ntane-red

filee fileters).

cor-isk,arance

ve,

not and

n.

4) All: Corrected miscellaneous formatting problems with German language.

5) ALC Pulltest: Corrected a bug which occurred when pulltest failed. The help dispon the error screen had the wrong message, incorrectly displaying the help messthe tight wire error.

6) Small Wire: Corrected a bug where the bond head would occasionally make incmoves during bonding, resulting in position verification errors. Error would occur wlarger wire lists (containing more than 25 wires).

7) Small Wire: Corrected a bug by turning off the small wire head damper after bond.bug could cause the damper circuit to oscillate the bond head, resulting in “hammon the next bond.

8) Misplaced bonds: Corrects a problem where PR-referenced bonds seemingly spoously shift position during run. This problem can only occur after having enteREWORK, either from the Main Menu or from any of the run modes. The wire liston disk becomes corrupted by exiting REWORK and then editing and saving thwithout having performed a new PR (such as may happen when editing wire parame

At this point, the wire list in memory is still good, but the copy on disk has becomerupted. Thus, the problem will not manifest itself until the wire list is reloaded from dwhich may happen at any time, even hours or days later, thus producing the appethat the bond placement has spontaneously shifted.

9) ALC Wire Clamp Operation: The wire clamp will now always open for the hop moand will always close for the break move.

10) All: During verify PR of the second pair of linked eye points, the verify point wascorrectly positioned based on the “found” point of the second eye point. Also, the XY coordinates on the PR monitor were not being updated to reflect the verify positio


4/22/99

Applicable

Version 5.7g is targeted to run on all variations of the M360 platform, including the Active Loop Control Bond Head option, and the Model 360S Small Wire Bonder. This release note incorpo-rates all the changes made to date to the 5.7x series software.

Objective

Software Version 5.7g corrects two bugs in the previous release software (5.7f). Bug fixes are inclusive of all previous versions of the 5.7 software series. The software bug caused the second assist point to be moved when not using reference points. In addition, a Y2K problem was also fixed to make this version of software completely Y2K compliant.

Contents of Package

(1) Floppy disk containing Version 5.7g (P/N 172518-1 R) (System).

(1) Software Release Instructions for Version 5.7g.

Compatibility

Version 5.7g is backwards compatible with all previous machines that used 5.x series software. All combinations of hardware will be supported, including old (P/N 171507) and new (P/N 171562) PR, old (P/N 172532) and new (P/N 175512) I/O, and old (P/N 172567) and new (P/N 175507) generator.

NOTE: Wire lists created or edited on Version 5.7g cannot be run on software versionsearlier than 5.7. Once Version 5.7g is installed, editing and then saving a programcreated with a version earlier than 5.7 will automatically update it to the latestVersion 5.7g.

Therefore the program will no longer be compatible with the earlier software ver-sions. OE suggests you make copies onto floppies of Wire lists created withearlier version software so you can run those Wire lists with the earlier versionsoftware.

SOFTWARE RELEASE Version 5.7g

ORTHODYNE ELECTRONICS SOFTWARE RELEASE SW 5.7G.FM PAGE 1 OF 5

4/22/99


NOTE: Before you install the new software, print out a hard copy of the default wireparameters. With this release, new default wire parameters will overwrite the pre-vious default wire parameters. Manually reenter the parameters you want changedto the default sets after loading Version 5.7G.




3) Insert the new system disk (P/N 172518-1 R) in the data drive on the front of the bondercontrol drawer (D1). At the prompt, type “/d1/install” and press [ENTER].

4) When the installation process is complete, cycle power on the bonder to restart thesystem. (Power must be cycled, rather than just typing “m360” because the OS-9 kernelmust be reloaded due to updates to some of the system modules.)

If any problems are experienced after installing the new version, it may be necessary to clear the system RAM and reload default values. Use the following procedure:


2) When the “RESET COMMAND HAS BEEN ENTERED” screen displays, select “D” toreload defaults.

3) All machine calibrations must be performed again (limits, touch sensor, forcer, offsets,etc.). Also, any handler, printer, and system parameters must be re-entered.

NOTE: This Software Release document describes the significant additions to Version5.7g from 5.6B. If you are replacing software versions earlier than 5.6B, you mayrequest the Release Notes from your current version forward, so you can see thesequential improvements made to the software up to Version 5.7g. Contact Ortho-dyne Technical Documentation Department to update your documents.

Feature Changes (introduced in version shown in each paragraph)

1. (5.7) Small Wire and ALC: Added into EXERCISE MOTORS screen an [F12] commandto exercise the clamp motor and the feed motor on the Small Wire head, and the clampmotor on the ALC head.

2) (5.7) Small Wire: Added into EXERCISE MOTORS screen an [F9] command to exercisethe Forcer.


4/22/99


PURPOSE: This option is useful for troubleshooting motor problems or to dis-tribute grease after lubricating the leadscrews.



DESCRIPTION: This screen causes the various axis motors to move from limitto limit. This can be useful in troubleshooting motor problems or when lu-bricating leadscrews as part of the preventive maintenance routine.

Use this screen for troubleshooting when the bonder is consistently gettingencoder errors in any given axis.

3) (5.7d)Small Wire on a M360C-H/HD: Enabled the XY Spinners in the last step of theforce calibration for small wire head (setting the hold force). This allows the user to movethe head to a spot on the handler where there is room to hang the calibration weight.

Cut Switch Option (5.7b)

a The cut switch option will be re-implemented for machines equipped with the new I/O(P/N 175512) board and rear cutter. (Machines equipped with the old I/O (P/N 172532)board have always had the cut switch option available.)

b The cut switch option for the new I/O board is implemented exactly as with the old I/Oboard. Cut switch parameters will be available for selection in the SYSTEMCONFIGURATION screen (access from the MAIN MENU by pressing [7], [B], [F15]).







START: Proceed



4/22/99

ZIP Drive Option (5.7b)

a This software version will enable the installation of an optional ZIP drive. The ZIPdrive disk will hold 100 megabytes of information, compared to 1.4 megabytes for anormal floppy disk. The obvious advantage is that many more wire list programs canbe stored on one ZIP disk than on a standard floppy.

b The ZIP drive option requires one of two hardware kits; one for an internalinstallation, and one to permit external connection of a drive.

NOTE: File transfers to/from the ZIP drive are available as “Backup andRestore” menu items from the Transfer File selection. Note, how-ever, that selectable file transfer is not available to/from the ZIPdrive. Only full backup and full restore are available at this time.The standard data drive floppy is still available for the “TransferFiles” operations.


Bug Fixes

Version 5.7g corrects the following discovered bugs: (bug fixes from previous versions are included for the sake of continuity).

1. (5.7) Small Wire: Corrected a bug where an excessive wire deformation error occurringoccasionally during bond-off and offsets calibration. It was incorrectly reported as“Unable to close clamp”.

2) (5.7) ALC: Corrected a bug that occurred during the “Pull up using forcer” function inthe pull test calibration screen. If the pulltest failed, the red status light was turned on anddid not turn off after recovery.

3) (5.7) Large Wire: Corrected a bug that would happen when initiating bonding (by pressingSTART from edit or run mode) and then interrupting it (say, by pressing STOP) when bond


Internal 172480-01 ZIP Drive

Installation Hardware Kit

Software

External 172480-02 Installation Hardware Kit

Software

(ZIP Drive not included)


4/22/99

head is between search height and the surface. This would cause the bonder to lock up.

4) (5.7) All: Corrected miscellaneous formatting problems with German language.

5) (5.7) ALC Pulltest: Corrected a bug which occurred when pulltest failed. The help dis-played on the error screen had the wrong message, incorrectly displaying the helpmessage for the tight wire error.

6) (5.7a) Small Wire: Corrected a bug where the bond head would occasionally make incor-rect moves during bonding, resulting in position verification errors. Error would occurwith larger wire lists (containing more than 25 wires).

7) (5.7f)Small Wire: Corrected a bug by turning off the small wire head damper after bond.This bug could cause the damper circuit to oscillate the bond head, resulting in “hammer-ing” on the next bond.

8) (5.7c) Misplaced bonds: Corrects a problem where PR-referenced bonds seemingly spon-taneously shift position during run. This problem can only occur after having enteredREWORK, either from the Main Menu or from any of the run modes. The wire list fileon disk becomes corrupted by exiting REWORK and then editing and saving the filewithout having performed a new PR (such as may happen when editing wire parameters).

At this point, the wire list in memory is still good, but the copy on disk has become cor-rupted. Thus, the problem will not manifest itself until the wire list is reloaded from disk,which may happen at any time, even hours or days later, thus producing the appearancethat the bond placement has spontaneously shifted.

9) (5.7e) ALC Wire Clamp Operation: The wire clamp will now always open for the hopmove, and will always close for the break move.

10) (5.7f) All: During verify PR of the second pair of linked eye points, the verify pointwas not correctly positioned based on the “found” point of the second eye point. Also, theX and Y coordinates on the PR monitor were not being updated to reflect the verify posi-tion.

11) (5.7g) All: When using linked eye points with Use reference point = NO (Assist pointedit), re-entry to PR Edit would cause the second assist point to revert to the referencepoint for the link-primary eye point. This problem only appeared in Version 5.7F.

12) (5.7g) All: Leap year problem with Y2K. In screen (SET SYSTEM CLOCK), leap yearday of Feb 29 is skipped while the clock is counting.Since the clock chip handles Y2K correctly, SET SYSTEM CLOCK now changes theclock chip contents directly, rather than change OS-9 time. The bug fix also correct theproblem that if the date was set to Feb 23, then March 1 was skipped. This will no longeroccur.A side effect of the bug fix, however, is that the user cannot abort back to the originaltime, because we no longer have two timers.

13) (5.7g) Corrected a bug that would occasionally result in a “Y position verification”error with the ALC head installed.


1/10/00

Applicable

Version 5.7h is targeted to run on all variations of the M360 platform, including the Active Loop Control Bond Head option, and the Model 360S Small Wire Bonder. This release note incorpo-rates all the changes made to date to the 5.7x series software.

Objective

Software Version 5.7h introduces two feature changes.

1) Software Modification for the 40 Volt Interlock Systems

2) Software filtering for Cut Switch line.

Contents of Package

(1) Floppy disk containing Version 5.7h (P/N 172518-1 R) (System).

(1) Software Release Instructions for Version 5.7h.

Compatibility

Version 5.7h is backwards compatible with all previous machines that used 5.x series software. All combinations of hardware will be supported.

NOTE: Wire lists created or edited on Version 5.7h cannot be run on software versionsearlier than 5.7. Once Version 5.7h is installed, editing and then saving a programcreated with a version earlier than 5.7 will automatically update it to the latestVersion 5.7h.Therefore the program will no longer be compatible with the earlier software ver-sions. OE suggests you make copies onto floppies of Wire lists created withearlier version software so you can run those Wire lists with the earlier versionsoftware.


NOTE: Before you install the new software, print out a hard copy of the default wireparameters. With this release, new default wire parameters will overwrite the pre-vious default wire parameters. Manually reenter the parameters you want changedto the default sets after loading Version 5.7h.

SOFTWARE RELEASE Version 5.7h

ORTHODYNE ELECTRONICS SOFTWARE RELEASE SW 5.7H.FM PAGE 1 OF 5

1/10/00










NOTE: This Software Release document describes the significant additions to Version5.7h from 5.6b. If you are replacing software versions earlier than 5.6b, you mayrequest the Release Notes from your current version forward, so you can see thesequential improvements made to the software up to Version 5.7h. Contact Ortho-dyne Technical Documentation Department to update your documents.


1. (5.7h) Large Wire: Software filtering has been added to help prevent noise on the “cutswitch” line. Noise on this line may cause false cut switch detections (even when LVDTis selected as the cut method).

2) (5.7h) 40 Volt Interlock Systems Only: Software has been modified to reduce the currentto the motors when the bond head is at the PARK position. Reducing the current to themotors reduces the load seen by the power supply when it powers back up from a 40 voltinterlock turn-off, thus allowing it to return to full voltage.

3) (5.7) Small Wire and ALC: Added into EXERCISE MOTORS screen an [F12] commandto exercise the clamp motor and the feed motor on the Small Wire head, and the clampmotor on the ALC head.



1/10/00







5) (5.7d)Small Wire on a M360C-H/HD: Enabled the XY Spinners in the last step of theforce calibration for small wire head (setting the hold force). This allows the user to movethe head to a spot on the handler where there is room to hang the calibration weight.

Cut Switch Option (5.7b)

a The cut switch option is re-implemented for machines equipped with the new I/O (P/N175512) board and Rear Cutter. (Machines equipped with the old I/O (P/N 172532)board have always had the cut switch option available.)








START: Proceed



1/10/00

ZIP Drive Option (5.7b)





Bug Fixes

Version 5.7h corrects the following discovered bugs: (bug fixes from previous 5.7x versions are included for the sake of continuity).

1. (5.7) Small Wire: Corrected a bug where an excessive wire deformation error occurringoccasionally during bond-off and offsets calibration. It was incorrectly reported as“Unable to close clamp”.



Internal 172480-01 ZIP Drive

Installation Hardware Kit

Software 5.7x

External 172480-02 Installation Hardware Kit

Software 5.7x

(ZIP Drive not included)

172598 Zip Drive Software


1/10/00

3) (5.7) Large Wire: Corrected a bug that would happen when initiating bonding (by pressingSTART from edit or run mode) and then interrupting it (say, by pressing STOP) when bondhead is between search height and the surface. This would cause the bonder to lock up.




7) (5.7f)Small Wire: Corrected a bug by turning off the small wire head damper after bond.This bug could cause the damper circuit to oscillate the bond head, resulting in “hammer-ing” on the next bond.

8) (5.7c) Misplaced bonds: Corrects a problem where PR-referenced bonds seemingly spon-taneously shift position during run. This problem can only occur after having enteredREWORK, either from the Main Menu or from any of the run modes. The wire list fileon disk becomes corrupted by exiting REWORK and then editing and saving the filewithout having performed a new PR (such as may happen when editing wire parameters). At this point, the wire list in memory is still good, but the copy on disk has become cor-rupted. Thus, the problem will not manifest itself until the wire list is reloaded from disk,which may happen at any time, even hours or days later, thus producing the appearancethat the bond placement has spontaneously shifted.

9) (5.7e) ALC Wire Clamp Operation: The wire clamp will now always open for the hopmove (after second bond), and will always close for the break move.

10) (5.7f) All: During verify PR of the second pair of linked eye points, the verify pointwas not correctly positioned based on the “found” point of the second eye point. Also, theX and Y coordinates on the PR monitor were not being updated to reflect the verify posi-tion.


12) (5.7g) All: Leap year problem with Y2K. In screen (SET SYSTEM CLOCK), leap yearday of Feb 29 is skipped while the clock is counting.Since the clock chip handles Y2K correctly, SET SYSTEM CLOCK now changes theclock chip contents directly, rather than change OS-9 time. The bug fix also correct theproblem that if the date was set to Feb 29, then March 1 was skipped. This will no longeroccur. A side effect of the bug fix, however, is that the user cannot abort back to the orig-inal time, because we no longer have two timers.

13) (5.7g) Corrected a bug that would occasionally result in a “Y position verification”error with the ALC head installed.


1/25/00

Applicable

Version 5.7J replaces all previous versions of 5.7x. It will run on all variations of the M360 plat-form, including the Active Loop Control Bond Head option, and the Model 360S Small Wire Bonder. This release note incorporates all the changes made to date to the 5.7x series software.

Objective

Software Version 5.7J is similar to 5.7i and 5.7h except that it is designed to work with a new CPU board made by the Force company. The Force CPU replaces the board made by the GMS company. While software version 5.7J is backward compatible with the other CPU boards used by Orthodyne in its machines, the Force CPU will only operate with version 5.7J.

NOTE: Only 5.7J should be used with any machine using the Force CPU,and with the Small Wire head. A bug in 5.7i could cause theSmall Wire head to move unexpectedly and could possibly causethe head to crash.

Contents of Package

(1) Floppy disk containing Version 5.7J (P/N 172518-1 R) (System).

(1) Software Release Instructions for Version 5.7J.

Compatibility

Version 5.7J is backwards compatible with all previous machines that used 5.x series software. All combinations of hardware will be supported.

NOTE: Wire lists created or edited on Version 5.7J cannot be run on software versionsearlier than 5.7. Once Version 5.7J is installed, editing and then saving a programcreated with a version earlier than 5.7 will automatically update it to the latestVersion 5.7J.Therefore the program will no longer be compatible with the earlier software ver-sions. OE suggests you make copies onto floppies of Wire lists created withearlier version software so you can run those Wire lists with the earlier versionsoftware.

SOFTWARE RELEASE Version 5.7J

ORTHODYNE ELECTRONICS SOFTWARE RELEASE SW 5.7J.FM PAGE 1 OF 6

1/25/00


NOTE: Before you install the new software, print out a hard copy of the default wireparameters. With this release, new default wire parameters will overwrite the pre-vious default wire parameters. Manually reenter the parameters you want changedto the default sets after loading Version 5.7J.


1) Boot up the bonder (from the hard disk).





1) From the MAIN MENU, type “RESET”.



NOTE: This Software Release document describes the significant additions to Version5.7J from 5.6b. If you are replacing software versions earlier than 5.6b, you mayrequest the Release Notes from your current version forward, so you can see thesequential improvements made to the software up to Version 5.7J. Contact Ortho-dyne Technical Documentation Department to update your documents.


1) (5.7J) All machines: Allows installation of the CPU made by the Force company. Com-patible with all other CPU’s used in Orthodyne 360 series machines.

2) (5.7h) Large Wire: Software filtering has been added to help prevent noise on the “cutswitch” line. Noise on this line may cause false cut switch detections (even when LVDTis selected as the cut method).


1/25/00

3) (5.7h) 40 Volt Interlock Systems Only: Software has been modified to reduce the currentto the motors when the bond head is at the PARK position. Reducing the current to themotors reduces the load seen by the power supply when it powers back up from a 40 voltinterlock turn-off, thus allowing it to return to full voltage.

4) (5.7d) Small Wire on a M360C-H/HD: Enabled the XY Spinners in the last step of theforce calibration for small wire head (setting the hold force). This allows the user to movethe head to a spot on the handler where there is room to hang the calibration weight.

5) (5.7b) Cut Switch Option

a The cut switch option is re-implemented for machines equipped with the new I/O (P/N175512) board and Rear Cutter. (Machines equipped with the old I/O (P/N 172532)board have always had the cut switch option available.)



6) (5.7b) ZIP Drive Option





1/25/00


7) (5.7) Small Wire and ALC: Added into EXERCISE MOTORS screen an [F12] commandto exercise the clamp motor and the feed motor on the Small Wire head, and the clampmotor on the ALC head.




Internal 172480-01 ZIP DriveInstallation Hardware KitSoftware 5.7x

External 172480-02 Installation Hardware KitSoftware 5.7x(ZIP Drive not included)

172598 Zip Drive Software






START: Proceed



1/25/00






Bug Fixes

Version 5.7J corrects the following discovered bugs: (bug fixes from previous 5.7x versions are included for the sake of continuity).

1) (5.7J) Corrected a bug that affected the Small Wire machine when editing the Wire List.The problem would occur when entering the Wire List Edit with wires already defined.This would cause bond locations to be corrupted and could result in unexpected move-ment of the head. A head crash could occur as a result.

2) (5.7i) Cleans up the boot-up screen by removing extraneous numbers (9999) from thescreen. This does not affect any functionality of the machine.

3) (5.7h) Large Wire: Added software filters to reduce noise on the “cut switch” line fromthe Forcer/Focus board (P/N 175537). Noise on this line may cause false cut switchdetections.

4) (5.7h) 40 volt interlock. Modified software to reduce the current when the bond head is atthe PARK position. Reducing the current to the motors reduces the load seen by thepower supply when it powers back up from a 40 volt interlock turn-off, thus allowing itto return to full voltage.


6) (5.7g) All: Leap year problem with Y2K. In screen (SET SYSTEM CLOCK), leap yearday of Feb 29 is skipped while the clock is counting.Since the clock chip handles Y2K correctly, SET SYSTEM CLOCK now changes theclock chip contents directly, rather than change OS-9 time. The bug fix also correct theproblem that if the date was set to Feb 29, then March 1 was skipped. This will no longeroccur. A side effect of the bug fix, however, is that the user cannot abort back to the orig-inal time, because we no longer have two timers.

7) (5.7g) Corrected a bug that would occasionally result in a “Y position verification” errorwith the ALC head installed.


1/25/00

8) (5.7f) All: During verify PR of the second pair of linked eye points, the verify point wasnot correctly positioned based on the “found” point of the second eye point. Also, the Xand Y coordinates on the PR monitor were not being updated to reflect the verify posi-tion.

9) (5.7f) Small Wire: Corrected a bug by turning off the small wire head damper after bond.This bug could cause the damper circuit to oscillate the bond head, resulting in “hammer-ing” on the next bond.

10) (5.7e) ALC Wire Clamp Operation: The wire clamp will now always open for the hopmove (after second bond), and will always close for the break move.

11) (5.7c) Misplaced bonds: Corrects a problem where PR-referenced bonds seemingly spon-taneously shift position during run. This problem can only occur after having enteredREWORK, either from the Main Menu or from any of the run modes. The wire list fileon disk becomes corrupted by exiting REWORK and then editing and saving the filewithout having performed a new PR (such as may happen when editing wire parameters). At this point, the wire list in memory is still good, but the copy on disk has become cor-rupted. Thus, the problem will not manifest itself until the wire list is reloaded from disk,which may happen at any time, even hours or days later, thus producing the appearancethat the bond placement has spontaneously shifted.


13) (5.7) Small Wire: Corrected a bug where an excessive wire deformation error occurringoccasionally during bond-off and offsets calibration. It was incorrectly reported as“Unable to close clamp”.


15) (5.7) Large Wire: Corrected a bug that would happen when initiating bonding (by pressingSTART from edit or run mode) and then interrupting it (say, by pressing STOP) when bondhead is between search height and the surface. This would cause the bonder to lock up.




6/6/00

Revision A

This revision corrects errors in the Release Note documentation.

a The NOTE section WAS “…cannot run on software versions earlier than 5.7”; IS“…cannot run on software versions earlier than 5.8”.

b In the section, Feature Enhancements, General, 1. Camera Gain Calibration: WAS“…Camera switch set to M, adjust the camera gain pot to have a VG reading of 82”;IS “…have a VG reading according to the value on the OE Calibration Box.”

c In Compatibility, correct Part Numbers to read as follows; “…old PR (P/N 171507and 171562) and new PR (172802).

Applicable

Version 5.8 is targeted to run on all variations of the M360 platform, including the Active Loop Control Bond Head option, and the Model 360S Small Wire Bonder.

Objective

Software Version 5.8 includes new functional features and bug fixes.

Contents of Package

(1) Floppy disk containing Version 5.8 (P/N 172518-1 R) (System).

(1) Software Release Instructions for Version 5.8

Compatibility

Version 5.8 is backwards compatible with all previous machines that used 5.x series software. All combinations of hardware will be supported, including old (P/N 171507, 171562) and new (P/N 172802) PR, old (P/N 172532) and new (P/N 175512) I/O, and old (P/N 172567) and new (P/N 175507) generator.

NOTE: Wire lists created or edited on Version 5.8 cannot be run on software versions earlierthan 5.8. Once Version 5.8 is installed, editing and then saving a program createdwith a version earlier than 5.7 will automatically update it to the latest Version 5.8.Therefore the program will no longer be compatible with the earlier software ver-sions. OE suggests you make copies onto floppies of Wire lists created with earlierversion software so you can run those Wire lists with the earlier version software.

SOFTWARE RELEASE Version 5.8 Rev A

ORTHODYNE ELECTRONICS SOFTWARE RELEASE SW 5.8A.FM PAGE 1 OF 21

6/6/00


NOTE: Before you install the new software, print out a hard copy of the default wireparameters. With this release, new default wire parameters will overwrite the pre-vious default wire parameters. Manually reenter the parameters you want changedto the default sets after loading Version 5.8.




3. Insert the new system disk (P/N 172518-1 R) in the data drive on the front of the bondercontrol drawer (D1). At the prompt, type “/d1/install” and press [ENTER].




2. When the “RESET COMMAND HAS BEEN ENTERED” screen displays, select “D” toreload defaults.

3. All machine calibrations must be performed again (limits, touch sensor, forcer, offsets,etc.). Also, any handler, printer, and system parameters must be re-entered.

New Features

SECS/GEM

Version 5.8 supports a new optional feature called SECS/GEM. This option requires additional hardware.

The acronym stands for “Semiconductor Equipment Communication Standard/General Equip-ment Model”. This communication standard allows a factory host computer system to interface with diverse pieces of equipment for automated process control. A typical factory layout is shown in the block diagram. Even though the various equipment are built by different manufac-turers, if they adhere to the SECS/GEM standard, they will all have an interface standard that allows them to communicate with the host computer. This option can be purchased and will require additional hardware.


6/6/00

When installed, SECS/GEM is found as menu item C in the MAIN menu.

Execution List

An automatic mode is added that allows the execution of several wire lists in succession for each assembly. This new feature improves the capability to bond complex assemblies by linking together several smaller wire lists. The characteristics of this feature are described below:

An automatic mode is added that allows the “chaining” together of several Wire Lists within a single assembly. The benefit of this feature is now you can modify an application to include additional items without having to reprogram the entire assembly. This can save considerable programming time. A number of examples are included below to illustrate the variety of ways you can use this feature:

Example 1: Large Hybrid Package

Large complex hybrids were processed as one big part with one large wirelist. If, for example you had a 200 item wire list and 50 of them neededchange, in most cases you could either change all of the wires or just one at atime.

With the Execution List mode you can divide the part into several smallersub-sections. This allows you to independently edit these smaller sub-sections with no affect on the others. With this feature you could modifythose 50 wires in a one-step global change without touching the other 150*.After the modification you can run all the individual wire lists “ganged” as agroup in a single step.

*This assumes that all 50 wires are in one wire list.

Wafer Saw Die Bonder Wire Bonder Molding

Host Computer Factory Automa-tion Program


6/6/00

.

Example 2: Use with Link List Option

Execution List can contain several Wire Lists, but cannot contain anotherExecution List. Execution List can work with Link List. These options areillustrated below:

:

Rules for creating and using Execution Lists are listed below:

1. Execution List feature is enabled by making an entry in the INTERNAL SETTINGSscreen.

Single part with 4 die

Die 1, 2, 3 and 4 are defined by in-dependent programDie 1

(P/R)Die 2 (P/R)

Die 3 (P/R)

Die 4 (P/R)

Execution List

Wire List

Wire List

Execution List

Wire List

Wire List

Wire List

Wire List

Link List

OR

Execution List


6/6/00

2. When an execution list is selected, its name appears in the upper left corner of the dataterminal along with the Wire List name, separated by the “@” symbol. For example inthe screen above, “Sample program (AL2) @GJ”, the “@GJ” symbol means that an Exe-cution List is in memory and can be run from the MAIN MENU.

Program Name INTERNAL SETTINGS LOG

Link

Tool mark powerTouch down clock divisorMinimum wire feedTouch twist heightPR delayTick marks on crosshairType-aheadLanguageEnable execution lists

(default = 25)(default = 50)(default = 10)(default = 50)(default = 20)

2550105020No

Yes1

Yes

1(:

F13: Save parameters

ARROWS F15: Configuration

F16 Abort edit

Sample program (AL2) @GJ WIRE PARAMETER EDIT LOG1

LINK File 1(: Name, entered as any 15 characters

WIRE PARAMETERS FOR “FILE NAME”

Name/type [AL 2]

First bond:

Start ForceEnd force:Start power:End power:Ramp time:Total time:

Second bond:Start force:End force:Start power:End power:Ramp time:Total time:

9012032351050

9012034381050

Prebond delay:Generator ramp time:Step angle:Loop value:Descent delaySearch height:Twist height:Tail length:Break height:Break angle:Break distance:Force during cut:Vertical hop (percent):

2050

1040

10080

160153

2035090

F13: Save bond parameters

F10: Edit minima F14: Save to default set

ARROWS F11: Edit maxima

PAGE F16: Abort edit


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3. The currently selected wire list need not be in the currently selected execution list.

4. An additional key [F10] has been provided in Link List Edit to facilitate selection of exe-cution lists for inclusion into the link list.

5. Execution list has been added to the FILE TYPE menu for all file operations (select,copy, delete, etc.).

6. When an execution list is entered into a Link List, the execution list is marked with an“E”, to distinguish it from normal wire lists, which are marked with a “W”.

7. Editing of execution lists is similar to editing of link lists (the screens and edit operationsare almost identical).

8. In RUN MENU, an Execution list selection can be run in either Automatic/Remote orEntire Assembly.

Feature EnhancementsGeneral

1. (5.8 for All machines) Camera Gain Calibration: This procedure requires an OECamera Calibration Box. With Version 5.8, go to the MAIN MENU and type “VG”. Thisis a change from previous versions where you would type “CGC”. With the Cameraswitch set to M, adjust the camera gain pot to have a VG reading according to the valueon the OE Calibration Box. Allow a few minutes settling time.

Large Wire Machine

1. (5.7h for Large Wire) Software Filter for Cut Switch Line: Software filtering hasbeen added to help prevent noise on the “cut switch” line. Noise on this line may causefalse cut switch detections (even when LVDT is selected for the cut method).

Sample Program (AL2)@GJLINKComments

LINK LIST EDIT

0: GJ E 5:

1: PR TEST -1_12 W 6:

2: PR TEST -1_33 W 7:

3: 8:

4: 9:

ARROWS F13: Save

PAGE F10: Execution List Directory

F 16: Abort

Execution File

Wire List File


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2. (5.7h) 40 Volt Interlock Systems: Available only with systems with 40 Volt Interlockoption. Software has been modified to reduce the current to the motors when the bondhead is at the PARK position. Reducing the current to the motors reduces the load seenby the power supply when it powers back up from a 40 volt interlock turn-off, thus allow-ing it to return to full voltage.

3. (5.8) Programmable Z Home For Tool Check: Adds a provision to bring the bond headto a programmable Z home while in Tool Check and Tool Offsets calibration. Presently,if the head is sent to its hard home, several key strokes are required to bring the bondhead down to programmable Z home. This feature significantly speeds up the process ofcalibration.

The [F11] key will be available to move to Z programmable home when the head is withinthe Z home region. This key will not appear if the head is already at Z programmable home,which is the normal case. The key will appear after the HOME key is pressed and the Z axisis moved up to the zero position.

4. (5.8) Forced Bond Angles Greater Than 90 Degrees: With this software version, theuser can program any bond angle to be used on the first bond. A warning message willappear in the WIRE LIST EDIT screen if the bond angle exceeds ±90° from the naturalwire angle for a Large Wire bonder, and ±45° for a Small Wire machine.

5. (5.8) Increase Generator Test Scale From 100 to 150: Increases generator test scalefrom 100 to 150 to accommodate new low gain transducers. This will not change theexpected results for current transducers. An explanation of the scale is added to the HELPscreen for the generator test.

6. (5.8) Forcer/Focus Switch Message for Large Wire/Small Wire Changeover: Adds amessage when converting from small wire to large wire (and vice-versa) that the switchon the forcer/focus must be changed, similar to the generator high/low message dis-played at changeover.

Manual Positioning: 1. (5.8) Renumber “Save” and “Abort” commands. In MANUAL POSITIONING screen

the “Save” and “Abort” commands have been renumbered to be consistent with otherscreens. Now, [F13] will always be “Save” and [F16] will always be “Abort”.

2. (5.8) Focus and LED Levels. The purpose of this screen is to set parameters for generalpurpose operations such as Lamp intensity and Focus. With this version of software, thelast focus and LED settings are saved in NVRAM, so these values are available for a newfile when you close the current wire list.

If no file is selected when you power up the machine, the lamp and focus values will be thelast values you selected before powering down.


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Small Wire Machine1. (5.8) Remove Small Wire Bond Angle Limitation:

With this software version, the user can program any bond angle to be used on the firstbond. A warning message will appear in the WIRE LIST EDIT screen if the bond angleexceeds ± 45° from the natural wire angle for a Small Wire bonder.

2. (5.8) Small Wire Loop Settings:

A new field called “Active radius looping” now appears in the INTERNAL SETTINGSscreen. This field can be toggled ON or OFF. Turn this parameter ON if you have bond padsthat are relatively close together with a relatively high loop top. The machine would thencompute a radius move from Loop Top to the second bond pad, resulting in a well-formedloop.

3. (5.8) Down Interval Parameter Included in Wire Parameters:

The “Down Interval” parameter controls the rate at which the small wire head tilts down totouch the surface during bonding. Values assigned are now 1.5, 2, or 3, corresponding towire sizes. Below that wire size, users may experience excessive pre-flattening of the wiredue to touchdown. Increasing this value slightly can help alleviate this condition.

4. (5.8) New Forcer Calibration for Small Wire:

A new Forcer calibration procedure introduced with this version improves the linearityacross the stack up range. Additional force settings are incorporated into the procedure.

5. Additional Small Wire Default Parameters:

Default Wire Parameter for additional wire sizes have been developed, and are located inthe Appendix E of the User’s Manual for the Small Wire machine. Parameters are given forthe following wire sizes: 1.2 mils Aluminum, 1.5 mils Aluminum, 1.5 mils Gold, and 2 milsGold.

6. Forcer/Focus Switch Message for Large Wire/Small Wire Changeover:

A message is added when converting from Small Wire to Large Wire (and vice-versa) thatthe switch on the Forcer/Focus board must be change to correspond to the machine. Theswitch is located on a small daughter board near the top edge of the Forcer/Focus board. Ifyou have a machine that was built before February 1999, the installation of this daughter-board switch was described in Installation Instruction 1076.

ALC Machine

1. (5.8) ALC Pulltest Calibration Screen Cleanup:

The InLine calibration screen is simplified by removing all the numbers except for the forcebeing calibrated.

2. (5.8) Default Pulltest Time. The default pull test time was increased from 25 ms. to 30ms. from previous software versions to allow more time for the pull test to adequatelytest the integrity of the bond.


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3. (5.8) ALC Head Clamp Changes. This version of the software changes the action of thewire clamps to achieve more reliable loop formation.

In the current software version, the clamps are closed during the cut and break move, andremain closed throughout the interwire moves up to the first search position of the next firstbond. This prevents the wire from accidentally slipping out of the tool groove during highspeed moves.

To simplify keeping track of whether the clamp is open or closed, the clamp will be closedwhen entering and/or exiting the RUN MENU screen.

All the clamp movements that were implemented in software version 5.7e remain the same,namely: Clamps always remain open from the top of the v-hop into the cut move. They al-ways close during the cut move.

4. (5.8) Pulltest Enabled As Default: In this version of the software, the pulltest function isalways enabled when an ALC head is installed on the machine. Consequently, the “Pulltest enabled” field in the SYSTEM CONFIGURATION screen is no longer present.Now, you will always have a field in the WIRE LIST EDIT screen called “Pull enabled”where you can choose whether you want to pull a particular bond on each wire. Since theWIRE LIST can be protected with a password (but the SYSTEM CONFIGURATIONscreen cannot), this new function will prevent accidentally cancelling pull test.

5. (5.8) Pulltest Diagnostics: A new function is added to the DIAGNOSTICS MENU thatallows you to see LVDT values corresponding to pull displacements. These values aredisplayed in a new screen that is accessed by selecting the “LVDT values” field in theDiagnostic Menu, or you can press [F6].

If a pull test fails, the word “FAIL” will appear next to the LVDT value for that bond.

6. (5.8) Handler Interface Extensions For ALC Pulltest Control:

Additional function extensions are added to the Remote Mode for Pulltest control. Detailsfor this feature are included in the ALC Pulltest Remote Control Specification portion ofthe Model 360C/S Peripheral Equipment Interface Specification Manual, dated September1999.

Pattern Recognition (PR)

New functions have been added to the PR system to simplify the programming of complex,multiple devices on a substrate. These new functions are described below. In addition, otherrefinements incorporated into the PR system are also described.

Entire Assembly PR is normally used for an assembly that contains multiple devices whichare tied together. For example a single substrate assembly with multiple devices called asnapstrate. Some of the benefits of using Entire Assembly PR are:


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z By defining the location of the assembly, by default you define the position of alldevices, since they are all fixed to the same assembly. It is not necessary to PR thesubstrate area for each device. (Device PR is not required).

z Bonds on the substrate can be tied to entire Assembly PR by selecting assembly as thearea in the Wire List.

z The camera X and Y location of all areas contained within all devices will be updatedaccording to the found position of the of the Entire Assembly PR.

Entire Assembly function reduces the number of PR programming steps and PR executionsteps for a number of identical device patterns located on a single substrate. Program sucha part as follows:

1. Go to Entire Assembly and program the location of the substrate extremes on whichall the repetitive patterns are located.

2. Define the device locations in Device List.

3. Go to PR List screen and program the areas on one of the devices. Any device can beselected.

The above sequence saves programming effort and execution time because it eliminates theneed to perform PR to locate each device.

With Entire Assembly selected, when you now execute the Wire List associated with thefirst repetitive pattern, the machine will do one PR search to locate the substrate, and thenPR search the individual areas of the repeat pattern. This eliminates the PR search time offinding each repeated PR pattern.

PR List. This is the standard PR List edit the same as in previous software versions.

Selecting the Device/Assy PR Edit menu opens another menu where the user can make thefollowing selections:

Device PR. This function replaces the PR Offset in previous soft-ware versions. Device PR simplifies the PR programming of arepetitive pattern on a single device.

Entire Assembly. This feature is most useful when you have anumber of identical devices on a single substrate. You can programthe PR areas on one of the devices, and then the positions of PRareas on all the other devices (or repetitive patterns) are correctedbased on the results of the PR location of the Entire Assembly sub-strate.

This feature will save you programming steps and, moreimportantly, save you Run time because the machine will do one PRsearch to find the substrate, and then do one PR search for the areason a single device. It then assumes the position of all the otherdevices on the substrate are fixed.


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4. (5.8) Failed PR Action (SMR S454) “Conditional PR”

When running the part, if PR fails, the PR ASSISTANCE REQUIRED screen will appear onthe data monitor. The screen will contain choices of assistance actions. You can choose:

z Manual assist

z Skip device

z Skip failed area

a. Manual Assist. If pattern recognition fails to locate the area, the machine stops andrequires the manual targeting of a pre-defined reference point before continuing. Thisaction can only be overridden using the “Skip PR Assist in Remote” option (providedyou are operating in the Remote Mode). If the user manually assists, it is considered a“good” PR.

b. Skip Device. If pattern recognition fails to locate the area, the Device is skipped. Ifthe program contains multiple devices, PR would be attempted on the next device inthe sequence until the “PR failures allowed” count is exceeded. Once exceeded, thebonder will complete bonding on any Devices (successfully identified by PR) andstop before indexing to the next Assembly.

c. Skip Failed Area. If multiple PR Areas are used within a Device and the patternrecognition fails on one Area, all subsequent PR Areas will still be attempted. Anywires associated with PR areas successfully located would be bonded. If a PR areaassociated with a first bond passes and the area associated with the second bond fails;the wire would not be bonded.

Using Conditional PR with “PR failures allowed”. The use of Conditional PR alters the“PR failures allowed” concept used in previous software versions.

If you are using Assembly PR and the search fails, the next assembly will be indexedand the bonder will stop only when the “PR failures allowed” count for Assemblies isexceeded. If you have an assembly and you have four failures on that assembly theyare counted as a single failure. These failures do not have to be of the same type to becounted as one failure. These failures are consecutive. Examples:

a. If the pattern recognition search fails to find two Assemblies in a row, with the “PRfailures allowed” set to 2, the bonder stops before the next Assembly is indexed.

b. If the Assembly passes, but multiple Devices within the Assembly fail, the bonderwill stop when the “PR failures allowed” count for Devices is exceeded.

c. If the Assembly PR passes and the Device PR passes, but multiple PR Areas withinthe Device fail using Skip Failed Area enabled, the bonder will continue to referenceall PR areas within the Device before stopping. Any wire associated with “legal” PRArea (meaning successfully found using pattern recognition) would be bonded.


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d. If any PR Area fails within the Device, it counts as one failure. The “PR failureallowed” count only applies to Devices or Assemblies. This means that you couldhave the “PR failures allowed” set to 2, fail four PR Areas within a Device and thebonder would not stop, as this would be considered to be only one Device failure. Ifthat Device exceeds the “PR failure allowed” count, the bonder will stop before thenext Device is attempted.

NOTE: Skip failed area replaces the parameter Skip bonding wires withfailed PR that was located in the SYSTEM PARAMETER menuscreen. That parameter is no longer present in the SYSTEMPARAMETER screen. Instead, you can choose the Failed PRaction in the PR EDIT screen.

5. (5.8) PR Failure Condition Examples:

This feature is illustrated by the following PR screens. The action will depend on the pa-rameter selection you made earlier.

a. Conditional PR - Manual Assist selected:

File Name ASSIST POINT EDIT LOG 1LINK File Model capture required before save(if used)

Area1Eye Pt: Primary Linked-primary

*[ assist ]

Focus:Use reference points:X1:Y1:Name:

X2:Y2:Name:

Link check tolerance:Failed PR action:

11No2074-5086first assist point

2086-5003second assist point

0MANUAL ASSIST

1(:

TOGGLEARROWS

F13: Save

F16: Abort


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PR failure in Automatic mode — machine stops for assistance.

PR failure in Remote mode — machine stops for assistance.UNLESS “Skip PR Assist in Remote” was set to YES. This optionoverrides the selection of Failed PR action in the ASSIST POINTEDIT screen, and skips to the next device.

b. Conditional PR — Skip Device

PR failure in Automatic and/or Remote mode — skips device.

NOTE: Action is the same if using “PR failures allowed” (requires theHandler Type in the Handler Parameters to NOT equal 0), how-ever, bonder will not stop until the end of the assembly, evenafter exceeding the PR failure allowed count. This works for SkipDevice or Skip failed area only.



*[ assist ]


X2:Y2:Name:




0SKIP DEVICE

1(:

TOGGLEARROWS

F13: Save

F16: Abort


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c. Conditional PR — Skip Failed Area

PR failure in Automatic and/or Remote mode (all options) skipsbonding of wires that are associated with the failed PR area.

NOTE: Exceeding the maximum number of “PR fails allowed” willrequire operator intervention, but after the wire bonds associatedwith successfully located areas have been bonded. This occurs atthe end of the assembly.



*[ assist]


X2:Y2:Name:




0SKIP FAILED AREA

1(:

TOGGLEARROWS

F13: Save

F16: Abort


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6. (5.8) PR Edit On Any Device In Multiple Device Assemblies

This version expands the Edit flexibility of the system by allowing you to edit any PR Areaor Bond Location, even in a multiple device assembly. When you select DEVICE PR ED-IT, PR LIST EDIT, or WIRE LIST EDIT, you will see a screen like the one shown below.

This software version allows the editing of PR Areas or Wire List positions on any devicewithin an assembly. This means that you can use any device position to edit PR areas ormodify wire positions. In previous software versions, you could only make such changeson device #1.

Previous versions of the software required that all edits of PR or Wire Lists be performedon the first device. This meant the user would have to swap devices so edits could be per-formed on clean, unused devices.

With Version 5.8, the user is prompted to target any device within an assembly before en-tering PR or Wire List. It is important to note that the device locations can only be changedin the Device List.

You can edit any of the devices shown on the screen. Move the cursor to the desired devicenumber, and press START. This will open the PR LIST EDIT screen to edit the device.

NOTE: PR Edits made on any device in a multiple device list will affectall the devices in the list. This is because the bonder treats“multiple devices” as a single device separated by offsetcoordinates. So, in effect, the multiple device list is only onedevice.

File name SELECT DEVICE LOG

Device 1 2 3 4 *

X: 527 4180 7842 11501

Y: 956 1034 1113 1193

Z 3612 3625 3659 3721

ENTER: Select START: Select

ARROWS

PAGE F16: Abort list


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7. (5.8) General PR Operations

a. “Home” Key Disable: The HOME key on the control panel and the keyboard isdisabled when you are in the PR EDIT screen to prevent accidentally pressing thiskey while programming PR. This will avoid a surprise movement of the head to theHome position.

b. PR Reference Points Coordinates Display: With this software version, thecoordinates of the Reference Point are displayed on the monitor when the Referencepoint field is active and you move the Spinners to select a point.

c. Thin Model: The Thin Model option was moved to the EXPERT screen.

8. (5.8) Chain Mode Selection: The Chain Mode can be enabled by toggling a field in theExpert screen. When you save the file, this parameter is stored in NVR so it will stayenabled until you disable it, even when you change files, or power down the machine.

9. (5.8) Line Find Improvements: There are a number of refinement to the Line FindMode to make the programming easier to use and understand.

a. PR Line Find Mode Threshold. The “Line Mode Threshold” parameter field wasmoved from the Expert Screen to the Main screen to make it more readily accessible.

b. Re-spot for Line Find. A Respot function is now available by pressing the STARTkey while viewing the Line Find Results screen. This change makes this functionmore consistent with other PR Mode Display screens.

c. Arrows on the Search Lines. The horizontal and vertical search lines now havearrow heads showing the direction of the scan. You can toggle the path of the searchto outside-in or inside-out directions for both the horizontal and vertical search paths.The arrow heads show the direction of the scan.

d. Transition Threshold. This term is used (instead of Threshold Level) to moreclosely describe the function performed by this parameter. It specifies the location ofthe transition calculation relative to the video output of the scan line at which a“Find” will be declared.

e. PR Line Find Threshold Display. You can display the results of the Line Find bypressing [F10] in the LINE FIND screen. The threshold data used during the “Find”algorithm is shown on the graphical display.

f. Correlation Result For Line Find Screen Cleanup. You can choose to view onlythe Results of the Horizontal edge, the Results of the vertical edge, or both.

10. Model Pixel Editing Improvements: The improvements in this version include changesto make the graphics easier to interpret.

a. Display Thin Model Label. If “Thin Model” is selected from the MODEL EDITscreen, the word THIN will appear in the upper corner of the model video on themonitor. This is to serve as a reminder that you selected this mode of operation.


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b. Model Thinning and Pixel Editing. Once a model is captured, you can manuallyedit pixels by pressing the [F9] key. This will bring up a screen titled, “ModelThinning and Pixel Editing”. A new feature included with this version is the ability toturn on all the pixels and make them available for editing. This is done by pressingthe [F12] which appears on the screen. An example of this screen is shown below:

As shown in the figure, the pixels can be edited by moving the cursor over the pixel tobe edited by using the ARROW keys and then performing any of the functions shownon the screen. For example, you can turn pixels ON/OFF using the SPACE Bar, or copya pixel color using the [F14] key. If you copy a color, then the “paste color” field willappear. You can then paste the selected color onto another pixel using the RETURNkey.

As you perform manual pixel editing, if you select too few pixels, you will see a warn-ing message, “Too few pixels in model” on the top of the data monitor.

c. Super Pixel Editing: You can select the super pixel resolution to be used in themodel for performing the PR spot. You choose this parameter in the MODEL EDITscreen. The choices available are fine, medium, or coarse. These resolution choicescorrespond to super pixel sizes 2, 4, or 8.

The system performs a PR spot by making as many as two passes over the model, de-pending on the resolution. For example, if you selected “fine” resolution, the systemwill first search the model using super pixel size “4” and then “2”. This algorithm willgive the most accurate find results. Similarly, “coarse” resolution uses super pixel size“8” and “4”.

Therefore, if you edit the model, either by thinning or manually, at one super pixel res-olution (say, “8”) then you will be warned to also perform model editing at the othersuper pixel resolution for the resolution category you selected (fine, medium, orcoarse).

PROGRAM MODEL THINNING and PIXEL EDITINGLOG

ARROWS - move cursor

SPACE BAR - toggle pixel on/off

F14 - copy color

RETURN - paste color

F12: All pixels on F13: Save parameters

F16: Abort edit


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Run Mode

1. Rework: The Rework functionality was improved by increasing the range over which theSPINNERS could reposition the first bond. This is useful when you have a large areaapplication. The procedure for making a bond location correction in Rework is shown inthe table that follows.

2. PR Failure Manual Assist: When running a part, if PR fails, this version gives you theoption in the Manual Assist screen to skip the failed PR area and go on to PR (and bond)the remaining areas on that device. This feature allows you to bond a portion of thedevice that previously would have to be skipped entirely.

Wire List1. Separate Display For Stitch Bond Trace Data: Pressing [F2] will bring up Bond Trace

data. With this version, you can assign stitch bonds to a separate bond group. Previouslyyou could only assign bonds to a group for either first or second bonds. Now you canassign stitch bonds to a separate group to examine those as well.

Applying an offset for firstbond:

With the cursor on the wire #1, use thespinners to position the video monitorcrosshairs over the new first bond area.Bond 1 will be in the new location; allother bonds on the wire will be in theiroriginally programmed locations.

If the offset is more than ±1000 mi-crosteps, you will get an error message,“[367] Excessive spinner movement”.To correct this error, you must changethe bond location as described below.

Changing the position ofany bond:

Press [STOP], [ENTER] or [DOWN ARROW].Refer to REWORK EDIT screen. Edit as youwould in WIRE LIST. After saving the change,arrow back to the wire that was modified andpress [START] to bond.


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2. Forced Bond Angles Greater Than 90°: With this software version, the user canprogram any bond angle to be used on any bond. A warning message will appear in theWIRE LIST EDIT screen if the bond angle exceeds ±90° from the natural wire angle fora Large Wire bonder, and ±45° for a Small Wire machine.

3. Internal Setting Deformation Limits: This screen allows you to set the deformation limits(both maximum and minimum) of the bond. This version gives this parameter selectiongreater flexibility by allowing to specify the deformation limits separately for the first andsecond bonds. In previous version, the parameter was applied equally to both bonds.

File Management

1. Focus and LED Levels Saved In File: General purpose operations are improved by thisversion with better file management of Lamp intensity and Focus parameters. With thisversion of software, the last focus and LED settings are saved in NVRAM, so thesevalues are available for a new file when you close the current wire list.


2. Transfer Files, Password Protect, Supervisor Password: During Transfer File opera-tions, password protected files can be transferred over pre-existing files by using theSupervisor Password disk without having to re-enter the supervisor password for eachprotected file. That is, entering the supervisor password once will suffice for the rest ofthe transfer operations.

NOTE: The Supervisor Password is treated as an expansion of the “Over-write All” function. Once the supervisor password is entered, allfiles from that point on will be overwritten, including files withno password.

Statistics

1. (5.8) Bond Trace Display For Multiple Devices:

This feature allows the operator to collect data from up to 50 devices, limited only by theamount of available memory. The number of devices for which data may be accumulatedis specified in the SYSTEMS PARAMETER EDIT menu using the Monitor devices pa-rameter.

2. (5.8) Second Bond Counter:

A second bond counter has been added. Previous versions provided only one bond counter.Each bond counter will have an independently specified alarm level, and each may be in-dependently cleared. Parameters for the second bond counter are located on the STATIS-TICS menu screen.


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ZIP Drive Enhancement

The ZIP drive option was introduced with Software Version 5.7b. This software version enhances the functionality of the ZIP drive. The mass backup and restore functions remain the same as before, but functions are now added to make the ZIP behave similar to the /d1 floppy.

a. The FILE TYPE menu will appear as follows:1 - Wire list2 - Default wire parameters3 - Link list4 - Log file5 - Execution list

b. Selecting “1 - Wire list” brings up the following TRANSFER DIRECTION menu:

1 - Hard disk to floppy2 - Floppy to hard disk3 - Floppy to floppy4 - Folder to folder copy5 - Folder to folder move6 - Hard disk to ZIP disk7 - ZIP disk to hard disk8 - ZIP disk to ZIP disk9 - Backup to ZIP driveA - Restore from ZIP drive.

For convenience, the Overwrite All and Supervisor Password features have been implemented for Transfer files.

c. When the ZIP disk is installed, to help the operator remember which drive is active,the disk path name precedes the open folder name in the directory display.

d. Multiple Folders feature is excluded when the ZIP drive option is installed becausethe increased functionality of the ZIP drive. Omitting the Multiple Folder featurereduces process time and avoids potential for errors in the file transfer.

Bug Fixes

Version 5.8a corrects the following discovered bugs: (bug fixes from previous 5.8a versions are included for the sake of continuity).

1. (5.8) The magnification message display warning is set to a value below 450 and above1800. The new value seeting is changed to above 1850.

2. If PR fails when running in the remote mode, F12 appears to check PR. If you check PR,make a change and do PR Spot, an option will appear “Press F13 to save PR.” PressingF13 does not save the PR and the same screen remains. The only way to exit the screen is


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to Abort by pressing F16.

3. While in Wire List create a both a new wire, by selecting the down arrow, and a secondbond, by selecting the right arrow (before marking it with START). Arrow back to thefirst bond and mark both bonds using START. Save the list using F13. You will noticethat the data monitor indicates the file was never saved. From the edit menu, go back intothe Wire List Edit, abort out, and then go to the Main Menu. If you go back into the WireList Edit screen you will see the wire that was created has disappeared.

4. If a folder is created before or during the process of transferring files into it, the foldercannot be deleted.

5. When the files in a Link List or Executuion List are renamed, the file names in either listare not updated. The Link List continues to function until you attempt to access the filewhose name was changed. If the Execution List is run an error message “the referencedfile cannot be found” will be displayed.

The following change was made. When a file name is changed, the currently selected Link List or Executuion List will be searched to see if they contain the old name. If they do, a warning message will be dispalyed stating the file is in the Link List or Executuion List with the option of continuing the rename of the file or aborting the rename attempt.

6. Recalibrating the Z function does not do Assembly PR.

7. The PR quality result on the current eyepoint deos not get updated when doing PR Spotwith linked eyepoints if the other eyepoint has a bad PR quality result.

The PR quality is now cleared (set to 0) before doing any PR. If you do a PR Spot with linked eyepoints and the other eyepoint fails it will yeild a quality result of zero in the eyepoint the PR Spot came from. If you have a quality result of zero, you will need to go to the other eyepoint and fix the problem.

8. The PR List consisted of a primary eyepoint, a primary linked eyepoint, an alternate eye-point, and an alternate linked eyepoint. The assist points were set to “Yes” for using ref-erence points. After a PR fail of both primary and alternate linked eyepoints, the assistwould go to the primary refrence point and the primary linked reference point. Occasion-ally the second assist point would go to the alternate linked reference point.

9. In a newly created file, go to the “System Parameter Edit” screen. The default value forPR Fails Allowed is zero. The valid range of values is 1 to 100.

The default value for PR Fails is one.


1/08/01

Applicable

Version 5.8A is targeted to run on all variations of the M360 platform, including the Active Loop Control Bond Head option, and the Model 360S Small Wire Bonder.

Objective

Software Version 5.8A includes new functional features and bug fixes.

Contents of Package

(1) Floppy disk containing Version 5.8A (P/N 172518-1 R) (System).

(1) Software Release Instructions for Version 5.8A.

Compatibility

Version 5.8A is backwards compatible with all previous machines that used 5.x series software. All combinations of hardware will be supported, including old (P/N 171507, 171562) and new (P/N 172802) PR, old (P/N 172532) and new (P/N 175512) I/O, and old (P/N 172567) and new (P/N 175507) generator.

NOTE: Wire lists created or edited on Version 5.8A cannot be run on software versionsearlier than 5.8. Once Version 5.8A is installed, editing and then saving a programcreated with a version earlier than 5.8 (5.7J or prior) will automatically update it tothe latest Version of 5.8A.Therefore the program will no longer be compatible with the earlier software ver-sions. OE suggests that you make copies onto floppies of Wire lists created withearlier versions software so that you can run those Wire lists with the earlier versionof software.


NOTE: Before you install the new software, print out a hard copy of the default wireparameters. With this software release, new default wire parameters will over-write the previous default wire parameters. Manually reenter the parameters youwant changed to the default sets after loading Version 5.8A.

SOFTWARE RELEASE Version 5.8A


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3. Insert the new system disk (P/N 172518-1 R) in the data drive on the front of the bondercontrol drawer (D1). At the prompt, type “/d1/install” and press [ENTER].




2. When the “RESET COMMAND HAS BEEN ENTERED” screen displays, select “D” toreload defaults.

3. All machine calibrations must be performed again (limits, touch sensor, forcer, offsets,etc.). Also, any handler, printer, and system parameters must be reentered.


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New Features

SECS/GEM

Version 5.8A supports a new optional feature called SECS/GEM. This option requires addi-tional hardware.

This acronym stands for “Semiconductor Equipment Communication Standard/General Equip-ment Model”. This communication standard allows a factory host computer system to interface with diverse components of equipment for automated process control. A typical factory layout is shown in the block diagram. Even though the various pieces of equipment are built by different manufacturers, if they adhere to the SECS/GEM standard, they will all have an interface stan-dard that allows them to communicate with the host computer. This option can be purchased and will require additional hardware.


Execution List

An automatic mode was added to version 5.8A that allows the execution of several wire lists in succession for each assembly. This new feature improves the capability to bond complex assem-blies by linking together several smaller wire lists. The characteristics of this feature are described below:

An automatic mode was added that allows the “chaining” together of several Wire Lists within a single assembly. The benefit of this feature is that now you can modify an application to include additional items without having to reprogram the entire assembly. This can save considerable programming time. A number of examples are included below to illustrate the variety of ways you can use this feature:


Large complex hybrids were processed as one big part with one large wirelist. If, for example, you had a 200 item wire list and 50 of them neededchange, in most cases you could either change all of the wires or just one at atime. This case would apply before the implementation of the automaticmode.




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However, with the Execution List mode you can divide the part into severalsmaller sub-sections. This allows you to independently edit these smallersub-sections with no affect on the others. With this feature you could modifythose 50 wires in a one-step global change without touching the other 150*.After the modification you can run all the individual wire lists “ganged” as agroup in a single step.


.


Execution List can contain several Wire Lists, but cannot contain anotherExecution List. Execution List can work with Link List. These options areillustrated below:

:


Die 1, 2, 3 and 4 are defined by an independent programDie 1

(P/R)Die 2 (P/R)

Die 3 (P/R)

Die 4 (P/R)

Execution List

Wire List

Wire List

Execution List

Wire List

Wire List

Wire List

Wire List

Link List

OR

Execution List


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1. The Execution List feature is enabled by making an entry in the INTERNAL SETTINGSscreen.

Program Name INTERNAL SETTINGS LOG Link



2550105020No

Yes1

Yes

NEW


ARROWS F15: ConfigurationF16 Abort edit

Sample program (AL2) @GJ WIRE PARAMETER EDIT LOG1LINK File NEW Name, entered as any 15 characters

WIRE PARAMETERS FOR “FILE NAME”Name/type [AL 2]

First bond:Start Force:End force:Start power:End power:Ramp time:Total time:


9012032351050

9012034381050

Prebond delay:Generator ramp time:Step angle:Loop value:Descent delay:Search height:Twist height:Tail length:Break height:Break angle:Break distance:Force during cut:Vertical hop (percent):

2050

1040

10080

160153

2035090

F13: Save bond parametersF10: Edit minima F14: Save to default set

ARROWS F11: Edit maximaPAGE F16: Abort edit


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2. When an execution list is selected, its name appears in the upper left corner of the dataterminal along with the Wire List name, separated by the “@” symbol. For example, inthe previous screen, “Sample program (AL2) @GJ”, the “@GJ” symbol means that anExecution List is in memory and can be run from the MAIN MENU.







Feature Enhancements

General



LINK LIST EDIT

0: GJ E 5:

1: PR TEST -1_12 W 6:

2: PR TEST -1_33 W 7:

3: 8:

4: 9:

ARROWS F13: Save


F 16: Abort

Execution File

Wire List File


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Large Wire Machine

1. (5.7h for Large Wire) Software Filter for Cut Switch Line: Software filtering hasbeen added to help prevent noise on the “cut switch” line. Noise on this line may causefalse cut switch detections (even when LVDT is selected for the cut method).

2. (5.7h) 40 Volt Interlock Systems: Available only for systems with 40 Volt Interlockoption. Software has been modified to reduce the current to the motors when the bondhead is at the PARK position. Reducing the current to the motors reduces the load seenby the power supply when it powers back up from a 40 volt interlock turn-off, thus allow-ing it to return to full voltage.






Manual Positioning: 1. (5.8) Renumber “Save” and “Abort” commands. In the MANUAL POSITIONING

screen the “Save” and “Abort” commands have been renumbered to be consistent withother screens. Now, [F13] will always be “Save” and [F16] will always be “Abort”.

2. (5.8) Focus and LED Levels. The purpose of this screen is to set parameters for generalpurpose operations such as Lamp intensity and Focus. With this version of software, thelast focus and LED settings are saved in NVRAM, so these values are available for a newfile when you close the current wire list.



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3. (5.8) Down Interval Parameter Included in Wire Parameters:The “Down Interval” parameter controls the rate at which the small wire head tilts down totouch the surface during bonding. Values assigned are now 1.5, 2, or 3, corresponding towire sizes. Below that wire size, users may experience excessive pre-flattening of the wiredue to touchdown. Increasing this value slightly can help alleviate this condition.

4. (5.8) New Forcer Calibration for Small Wire:A new Forcer calibration procedure introduced with this version improves the linearityacross the stack up range. Additional force settings are incorporated into the procedure.


Default Wire Parameter for additional wire sizes have been developed, and are located inthe Appendix E of the User’s Manual for the Small Wire machine. Parameters are given forthe following wire sizes: 1.2 mils Aluminum, 1.5 mils Aluminum, 1.5 mils Gold, and 2 milsGold.


A message is added when converting from Small Wire to Large Wire (and vice-versa) thatthe switch on the Forcer/Focus board must be changed to correspond to the machine. Theswitch is located on a small daughter board near the top edge of the Forcer/Focus board. Ifyou have a machine that was built before February 1999, the installation of this daughter-board switch was described in Installation Instruction 1076.

ALC Machine


The Inline calibration screen is simplified by removing all the numbers except for the forcebeing calibrated.

2. (5.8) Default Pull Test Time. The default pull test time was increased from 25 ms. to 30ms. from previous software versions to allow more time for the pull test to adequatelytest the integrity of the bond.


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3. (5.8) ALC Head Clamp Changes: This version of the software changes the action of thewire clamps to achieve a more reliable loop formation.



All the clamp movements that were implemented in software version 5.7e remain the same,namely: Clamps always remain open from the top of the v-hop into the cut move. They al-ways close during the cut move.

4. (5.8) Pull Test Enabled As Default: In this version of the software, the pull test func-tion is always enabled when an ALC head is installed on the machine. Consequently, the“Pull test enabled” field in the SYSTEM CONFIGURATION screen is no longerpresent. Now, you will always have a field in the WIRE LIST EDIT screen called “Pullenabled” where you can choose whether you want to pull a particular bond on each wire.Since the WIRE LIST can be protected with a password (but the SYSTEM CONFIGU-RATION screen cannot), this new function will prevent accidentally cancelling a pulltest.

5. (5.8) Pull Test Diagnostics: A new function is added to the DIAGNOSTICS MENU thatallows you to see LVDT values corresponding to pull displacements. These values aredisplayed in a new screen that is accessed by selecting the “LVDT values” field in theDiagnostic Menu, or you can press [F6].


6. (5.8) Handler Interface Extensions For ALC Pull Test Control:

Additional function extensions are added to the Remote Mode for Pull Test control. Detailsfor this feature are included in the ALC Pulltest Remote Control Specification portion ofthe Model 360C/S Peripheral Equipment Interface Specification Manual, dated September1999.


New functions have been added to the PR system to simplify the programming of complex,multiple devices on a substrate. These new functions are described below. In addition, otherrefinements incorporated into the PR system are also described.

Entire Assembly PR is normally used for an assembly that contains multiple devices whichare tied together. For example, a single substrate assembly with multiple devices called asnapstrate. Some of the benefits of using Entire Assembly PR are:


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! By defining the location of the assembly, by default you also define the position of alldevices, since they are all fixed to the same assembly. It is not necessary to PR thesubstrate area for each device. (Device PR is not required).

! Bonds on the substrate can be tied to the entire Assembly PR by selecting assembly asthe area in the Wire List.

! The camera X and Y location of all areas contained within all devices will be updatedaccording to the found position of the of the Entire Assembly PR.







PR List is the standard PR List edit which is the same as in previous software versions.


" Device PR. This function replaces the PR Offset in previous soft-ware versions. Device PR simplifies the PR programming of arepetitive pattern on a single device.

" Entire Assembly. This feature is most useful when you have anumber of identical devices on a single substrate. You can programthe PR areas on one of the devices, and then the positions of PRareas on all the other devices (or repetitive patterns) are correctedbased on the results of the PR location of the Entire Assembly sub-strate.



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4. (5.8) Failed PR Action (SMR S454) “Conditional PR”When running the part, if PR fails, the PR ASSISTANCE REQUIRED screen will appear onthe data monitor. The screen will contain choices of assistance actions. You can choose:

! Manual assist! Skip device! Skip failed area



c. Skip Failed Area. If multiple PR Areas are used within a Device and the patternrecognition fails on one Area, all subsequent PR Areas will still be attempted. Anywires associated with PR areas successfully located would be bonded. If a PR areaassociated with a first bond passes and the area associated with the second bond fails,the wire would not be bonded.







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d. If any PR Area fails within the Device, it counts as one failure. The “PR failureallowed” count only applies to Devices or Assemblies. This means that you couldhave the “PR failures allowed” set to 2, fail four PR Areas within a Device and thebonder would not stop because this would be considered to be only one Devicefailure. If that Device exceeds the “PR failures allowed” count, the bonder will stopbefore the next Device is attempted.

NOTE: Skip failed area replaces the parameter Skip bonding wires withfailed PR that was located in the SYSTEM PARAMETER menuscreen. That parameter is no longer present in the SYSTEMPARAMETER screen. Instead, you can choose the Failed PRaction in the PR EDIT screen.

5. (5.8) PR Failure Condition Examples:This feature is illustrated by the following PR screens. The action will depend on the pa-rameter selection you made earlier.




*[ assist ]


X2:Y2:Name:




0MANUAL ASSIST

NEW

TOGGLEARROWS

F13: Save

F16: Abort


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" PR failure in Automatic mode — machine stops for assistance.

" PR failure in Remote mode — machine stops for assistance.UNLESS “Skip PR Assist in Remote” was set to YES. This optionoverrides the selection of Failed PR action in the ASSIST POINTEDIT screen, and skips to the next device.


" PR failure in Automatic and/or Remote mode — skips device.

NOTE: Action is the same if using “PR failures allowed” (requires theHandler Type in the Handler Parameters to NOT equal 0), how-ever, bonder will not stop until the end of the assembly, evenafter exceeding the PR failure allowed count. This works for SkipDevice or Skip failed area only.



*[ assist ]


X2:Y2:Name:




0SKIP DEVICE

NEW

TOGGLEARROWS

F13: Save

F16: Abort


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" PR failure in Automatic and/or Remote mode (all options) skipsbonding of wires that are associated with the failed PR area.

NOTE: Exceeding the maximum number of “PR fails allowed” willrequire operator intervention, but only after the wire bonds asso-ciated with successfully located areas have been bonded. Thisoccurs at the end of the assembly.



*[ assist]


X2:Y2:Name:




0SKIP FAILED AREA

NEW

TOGGLEARROWS

F13: Save

F16: Abort


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6. (5.8) PR Edit On Any Device In Multiple Device Assemblies This version expands the Edit flexibility of the system by allowing you to edit any PR Areaor Bond Location, even in a multiple device assembly. When you select DEVICE PR ED-IT, PR LIST EDIT, or WIRE LIST EDIT, you will see a screen like the one shown below.





NOTE: PR Edits made on any device in a multiple device list will affectall the devices in the list. This is because the bonder treats“multiple devices” as a single device separated by offsetcoordinates. So, in effect, the multiple device list is only onedevice.


Device 1 2 3 4 *

X: 527 4180 7842 11501Y: 956 1034 1113 1193Z 3612 3625 3659 3721


ARROWSPAGE F16: Abort list


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7. (5.8) General PR Operations a. “Home” Key Disable: The HOME key on the control panel and the keyboard is

disabled when you are in the PR EDIT screen to prevent accidentally pressing thiskey while programming PR. This will avoid a surprise movement of the head to theHome position.




9. (5.8) Line Find Improvements: There are a number of refinements made to the LineFind Mode to make the programming easier to use and understand.


b. Re-spot for Line Find. A Re-spot function is now available by pressing the STARTkey while viewing the Line Find Results screen. This change makes this functionmore consistent with other PR Mode Display screens.








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b. Model Thinning and Pixel Editing. Once a model is captured, you can manuallyedit pixels by pressing the [F9] key. This will bring up a screen titled, “ModelThinning and Pixel Editing”. With this feature you can turn on all the pixels so theyare available for editing. To access this feature press [F12] which appears on thescreen. An example is shown below.

To edit the pixels, move the cursor over the pixel you want to select using theARROW keys. You can now perform any of the functions shown on the screen. Youcan:

" Turn pixels ON/OFF using the SPACE BAR

" Copy a pixel shade using the [F14] key

" The “Paste Super Pixel” function only appears after you select(F14) “Copy super pixel” otherwise it is turned off. You paste theselected shade onto another pixel using the RETURN key.

As you perform manual pixel editing, if you select too few pixels, a warning message,“Too few pixels in model” will appear at the top of the data monitor.

c. Super Pixel Editing: When performing PR spot, you have the option of selecting thesuper pixel resolution used in the model. The resolution you choose determines thepixel size. Your selections for this parameter are located in the MODEL EDIT screen.The choices available are fine, medium, or coarse. These resolution choicescorrespond to super pixel sizes 2, 4, or 8.

The system performs a PR spot by making as many as two passes over the searcharea, depending on the resolution. For example, if you selected “fine” resolution, thesystem will first search for the model using super pixel size “4” and then “2”. TheSUPER PIXEL SIZE menu example shown below is for the fine resolution. Thisalgorithm will give the most accurate find results. Similarly, “coarse” resolution usessuper pixel size “8” and “4”.


Toggle a super pixel ON (rectangle shown) to include it in a thin model find.To enable thin model finds, set “Use thin model” to ON in the expert screen.

Toggle: Super pixel on/offEnter: Paste super pixel

F13: Save parametersARROWS F14: Copy super pixel

F12: All super pixels on F16: Abort edit


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If you edit the model, either by thinning or manually, at one super pixel resolution,for example “2”, then you may be warned to also perform model editing at superpixel size “4”. Remember, if you selected “fine” resolution, the system will search forthe model using super pixel size “4” and then “2”. If you selected “course” then itwill search by “8” then “4”. “Medium” searches at only resolution “4”. The warningscreen example is shown below.

.

Run Mode

1. Rework: The Rework functionality was improved by increasing the range over which theSPINNERS could reposition the first bond. This is useful when you have a large areaapplication. The procedure for making a bond location correction in Rework is shownbelow:

PROGRAM LOG

(xxx) Super pixel editing may be required for other super pixel sizesPress any key

Applying an offset for first bond:

With the cursor on the wire #1, use the spinners to position the video monitor crosshairs over the new first bond area. Bond 1 will be in the new location; all other bonds on the wire will be in their originally programmed locations.

If the offset is more than ±1000 microsteps, you will get an error message, “[367] Excessive spinner movement”. To correct this error, you must change the bond location as described below.

Changing the position of any bond:

Press [STOP], [ENTER] or [DOWN ARROW]. Refer to REWORK EDIT screen. Edit as you would in WIRE LIST. After saving the change, arrow back to the wire that was modified and press [START] to bond.


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Wire List

1. Separate Display For Stitch Bond Trace Data: Pressing [F2] will bring up Bond Tracedata. With this version, you can assign stitch bonds to a separate bond group. Previouslyyou could only assign bonds to a group for either first or second bonds. Now you canassign stitch bonds to a separate group to examine those as well.

2. Forced Bond Angles Greater Than 90°°°°: With this software version, the user canprogram any bond angle to be used on any bond. A warning message will appear in theWIRE LIST EDIT screen if the bond angle exceeds ±90° from the natural wire angle fora Large Wire bonder, and ±45° for a Small Wire machine.

3. Internal Setting Deformation Limits: This screen allows you to set the deformation limits(both maximum and minimum) of the bond. This version gives this parameter selectiongreater flexibility by allowing to specify the deformation limits separately for the first andsecond bonds. In previous versions, the parameter was applied equally to both bonds.

File Management

1. Focus and LED Levels Saved In File: General purpose operations are improved by thisversion with better file management of Lamp intensity and Focus parameters. With thisversion of software, the last focus and LED settings are saved in NVRAM, so that thesevalues are available for a new file when you close the current wire list.



NOTE: The Supervisor Password is treated as an expansion of the “Over-write All” function. Once the supervisor password is entered, allfiles from that point on will be overwritten, including files withno password.


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Statistics






The ZIP drive option was introduced with Software Version 5.7b. Software version 5.8A enhances the functionality of the ZIP drive. The mass backup and restore functions remain the same as before, but functions are now added to make the ZIP behave similar to the /d1 floppy.







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d. Multiple Folders feature is excluded when the ZIP drive option is installed because ofthe increased functionality of the ZIP drive. Omitting the Multiple Folder featurereduces process time and avoids potential for errors in the file transfer.

Bug Fixes

The following software bugs were corrected:

1. All: Access “Wire List”:

a. Select the down arrow to create a new wire.

b. Create a second bond selecting the right arrow (before marking it with START).

c. Arrow back to the first bond and mark both bonds using START.

d. Save the list using F13.

The data monitor indicated the file was never saved.

From the “Edit” menu:

a. Go back into the “Wire List Edit.”

b. Abort out.

c. Access the “Main Menu.”

The problem was that the wire that was created had disappeared. When you returned the“Wire List Edit” screen you would not see the wire. This has been corrected. Now the“Wire List Edit” screen will show the wire, and the data monitor will indicate that the filewas saved.

2. All: Can’t Delete Folder. Corrected a problem whereby a folder created before or duringthe process of transferring files into it could not be deleted.

3. All: File Names In Link List Are Not Updated. Corrected the problem so that now whena file name is changed, the currently selected link list and execution list will be searchedto see if they contain the old name. If they do, a warning message will be displayedstating the file is in the link list or execution list. An option is given of continuing therename of the file, or aborting the rename attempt.

4. All: Recalibrate Z Did Not Do Assembly PR. Corrected the problem so that now whenyou Recalibrate Z, it will do Assembly PR.

5. All: The PR quality result on the current eyepoint does not get updated when doing PRSpot with linked eyepoints if the other eyepoint had a bad PR quality result.

The PR quality is now cleared (set to 0) before doing any PR. If you do a PR Spot withlinked eyepoints and the other eyepoint fails, it will yield a quality result of zero in theeyepoint that the PR Spot came from. If you have a quality result of zero, you will needto go to the other eyepoint and fix the problem.

6. All: The PR List consisted of a primary eyepoint, a primary linked eyepoint, an alternate


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eyepoint, and an alternate linked eyepoint. The assist points were set to “Yes” for usingreference points. After a PR fail of both primary and alternate linked eyepoints, the assistwould go to the primary reference point and the primary linked reference point. Occa-sionally the second assist point would go to the alternate linked reference point. By goingto the alternate link point the PR Offset would be shifted over out of position causingmisplaced bonds.

The software has now been modified to default only to the primary and linked eyepoint reference points.

7. All: Inconsistent Default For PR Fails Allowed. In a newly created file, the default valuefor PR Fails Allowed was set to 0 (in the System Parameter Edit Screen). However, thevalid range for PR Fails Allowed is 1 to 100. The default value has been corrected so thatit now reads “1”.

8. All: Incorrect Cut Clock When Switching Front to Back Cut. When changing from frontcutter to rear cutter and setting the cut depth sensor to switch, the cut clock would auto-matically default to an incorrect value of 289694. This has been corrected so that thedefault value is 33.

9. SW and LW: Incorrect Recover From Tight Wire Error. Corrected an error where by a“Tight Wire” error message would appear if the Dereeler switch was set to OFF andbonding was started. When the switch was set to AUTO and the START button waspressed, the bond head would move up as if the STOP button was pressed.

10. All: Ramp Time Longer Than Total Time. If the Ramp Time is longer than the TotalTime, an error message appears: “Ramp time exceeds Total time for first bond”. If youabort the screen by pressing [F16], additional buttons [F14], [F15] would appear that hadno function and could result in a logic loop. The problem was corrected by applyingcorrect functions to these buttons as follows: [F13] = Ignore, [F14] = Abort verify, and[F16] = Abort.

11. SW: Error in Optical Offsets Computation. In the Small Wire Optical Offsets calibration,the results were skewed towards the +180o direction. The problem was corrected byaveraging the +180o and -180o and using the result as one point in the optical offsetscomputation

12. All: Saving Chain Mode In The PR Expert Setting. Corrected a problem that occurredwhen a file was loaded with PR Expert screen enabled and the Chain mode was notenabled in the Expert Screen, even though the Chain mode would appear in an eyepoint.In this correction, the Chain mode will be explicitly enabled if the file is loaded that con-tains a Chain mode eyepoint. In this manner, the Chain mode will remain enabled untilexplicitly disabled by the user, even if a subsequent file is loaded that does not contain aChain mode eyepoint.


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13. All: Tight Wire Not Detected During Stitch Bonding. If the bonder stops at search heightand an error message appears that says “Wire feed detected after cut”, the tight wire con-dition must be cleared before pressing START to continue bonding. Otherwise, the bondhead will return to Home without properly completing the stitch bond.

14. All: “THN” Legend on PR Monitor In Line Mode. The THN legend does not apply toLine Mode. Corrected a display problem that occurred when the model thinning parame-ter was set to YES and the find mode was switched from Point to Line, the “THN”legend would still appear on the monitor.

15. All: Assembly PR Not Retained If “Skip Device” Selected. Corrected a problem thatoccurred when using Assembly PR and multiple devices, if a PR error occurred and [F15]“Skip Device” or [F16] “Abort” was pressed, PR Assembly data would be lost.

16. All: Run Screen After PR Assist In Rework. Corrected a problem of the Run Screen(Bond Counter) appearing briefly between each PR area when there was an unsuccessfulPR find in REWORK and the START button was pressed to mark the PR position.

17. All: Incorrect PR Area Numbering After Delete Area. Corrected a problem of the propernumbering of PR Areas.

18. All: No PR Graphics On PR Fail Or PR Edit. Corrected a problem where the PR graphicscreen was not visible if PR failed and the cursor was on the PR Area or on the EyepointEdit field.

19. All: F8: Image Enhancement Legend Is Underlined. Eliminated the underline from the“[F8] Image Enhancement” legend. The underline implies there might by motion of thehead if the item were selected. There is no motion that occurs by selecting the “ImageEnhancement” field.

20. All: Discrepancies With PR. Corrected a number of problems related to PR whenattempting to perform various edit procedures. The following corrective actions weretaken:

a. “Skip device” and “Skip failed area” are disregarded in the edit menu. “Manualassist” is the correct default setting.

b. Only “Assembly PR” will be performed prior to Device List Edit. This is applicablewhen in the Assembly PR function.

c. “Assembly PR” will always be performed first when entering REWORK.

d. “Assembly PR” will be cleared on abort from Wire List Edit, so that if you abort fromWire List Edit without selecting a device and you then re-enter Wire List Edit,Assembly PR will be performed.


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21. All: STOP Aborts Stitch Bonding. Corrected a problem when bonding in REWORK,such that if “Stop at search” is OFF, and the STOP key is pressed prior to a Stitch Bond,the head would move straight up and not complete the wire. (Note: This only wouldoccur if there was a forced angle on the bond). Now, pressing STOP in the middle of awire does not abort the wire.

22. All: Manual Manipulation of Bond Head In SECS/GEM. Corrected a problem that wouldcause the machine to lock up when in the SECS/GEM mode if the bond head was manu-ally moved so you could make some adjustment to the bond head. The problem wouldoccur only if you had entered a Programmable Z-Home, and only on the second attemptto manually adjust the head position. The machine now works as expected.


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Applicable

Version 5.8B is targeted to run on all variations of the M360 platform, including the Active Loop Control Bond Head option, and the Model 360S Small Wire Bonder.

Objective

Software Version 5.8B includes new functional features and bug fixes to include the Expanded Remote Pulltest Function.

Contents of Package

(1) Floppy disk containing Version 5.8B (P/N 172518-1 S) (System).

(1) Software Release Instructions for Version 5.8A.

Compatibility

Version 5.8B is backwards compatible with all previous machines that used 5.x series software. All combinations of hardware will be supported, including old (P/N 171507, 171562) and new (P/N 172802) PR, old (P/N 172532) and new (P/N 175512) I/O, and old (P/N 172567) and new (P/N 175507) generator.

NOTE: Wire lists created or edited on Version 5.8B cannot be run on software ver-sions earlier than 5.8. Once Version 5.8B is installed, editing and then saving aprogram created with a version earlier than 5.8 (5.7J or prior) will automaticallyupdate it to the latest Version of 5.8B.Therefore, the program will no longer be compatible with the earlier software ver-sions. OE suggests that you make copies onto floppies of Wire lists created withearlier versions of software so that you can still run those Wire lists when using anearlier version of software.


NOTE: Before you install the new software, print out a hard copy of the defaultwire parameters. With this software release, new default wire parameters will over-write the previous default wire parameters. Manually reenter the parameters you wantchanged to the default settings after loading Version 5.8B.

SOFTWARE RELEASE Version 5.8B

ORTHODYNE ELECTRONICS SOFTWARE RELEASE SW 5.8B PAGE 1 OF 26

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3. Insert the new system disk (P/N 172) in the data drive on the front of the bonder controldrawer (D1). At the prompt, type “/d1/install” and press [ENTER].




2. When the “RESET COMMAND HAS BEEN ENTERED” screen is displayed, select “D”to reload defaults.



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New Features

Version 5.8B

ALC Machine

1. ALC Pulltest Function Operable in “Rework” (5.8B): The goal was to be able to usethe ALC pulltest function while in “Rework.” This added function allows the operator tocollect all the parts requiring rework automatically on the line. The operator can start the360C in “Rework” to process all the parts. This requires the “Remote Pulltest Function”to be available when the machine is started in “Rework.” The “Remote Pulltest Func-tions” are available if the 360C drops out of automatic mode into “Rework.” This modifi-cation makes the “Remote Pulltest Functions” active in “Rework” at all times (ifenabled).

Version 5.8A

SECS/GEM

Version 5.8A supports a optional feature called SECS/GEM. This option requires additional hardware.

This acronym stands for “Semiconductor Equipment Communication Standard/General Equip-ment Model”. This communication standard allows a factory host computer system to interface with diverse components of equipment for automated process control. A typical factory layout is shown in the block diagram. Even though the various pieces of equipment are built by different manufacturers, if they adhere to the SECS/GEM standard, they will all have an interface stan-dard that allows them to communicate with the host computer. This option can be purchased and will require additional hardware.


Execution List

Version 5.8A has an automatic mode that allows the execution of several wire lists in succession for each assembly. This new feature improves the capability to bond complex assemblies by linking together several smaller wire lists. The characteristics of this feature are described below:




1/08/01



Before the implementation of the automatic mode, large complex hybridswere processed as one big part with one large wire list. If, for example, youhad a 200 item wire list and 50 of them needed change, in most cases youcould either change all of the wires or just one at a time.

Now, when using Execution List mode, you can divide the part into severalsmaller sub-sections. This allows you to independently edit these smallersub-sections with no affect on the others. With this feature you could modifythose 50 wires in a one-step global change without touching the other 150*.After the modification, you can run all the individual wire lists “ganged” as agroup in a single step.


.


An Execution List can contain several Wire Lists, but cannot contain anotherExecution List. An Execution List can work with a Link List. These optionsare illustrated below:



(P/R)Die 2 (P/R)

Die 3 (P/R)

Die 4 (P/R)


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:






2550105020No

Yes1

Yes

NEW



Execution List

Wire List

Wire List

Execution List

Wire List

Wire List

Wire List

Wire List

Link List

OR

Execution List


1/08/01










9012032351050

9012034381050


2050

1040

10080

160153

2035090




1/08/01




Version 5.8A

General


Large Wire Machine




LINK LIST EDIT

0: GJ E 5:

1: PR TEST -1_12 W 6:

2: PR TEST -1_33 W 7:

3: 8:

4: 9:

ARROWS F13: Save


F 16: Abort

Execution File

Wire List File


1/08/01





screen the “Save” and “Abort” commands have been renumbered to be consistent withother screens. Now, [F13] will always be “Save” and [F16] will always be “Abort”.

2. (5.8) Focus and LED Levels. The purpose of this screen is to set parameters for generalpurpose operations such as Lamp intensity and Focus. With this version of software, thelast Focus and LED settings are saved in NVRAM, so these values are available for anew file when you close the current wire list.

If no file is selected when you power up the machine, the Lamp Intensity and Focus valueswill be the last values you selected before powering down.


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3. (5.8) Down Interval Parameter Included in Wire Parameters:The “Down Interval” parameter controls the rate at which the small wire head tilts down totouch the surface during bonding. Values assigned are now 1.5, 2, or 3, corresponding towire sizes. Below these wire sizes, users may experience excessive pre-flattening of thewire due to touchdown. Increasing this value slightly can help alleviate this condition.

4. (5.8) New Forcer Calibration for Small Wire:A new Forcer calibration procedure introduced with this version improves the linearityacross the stack up range. Additional force settings are incorporated into the procedure.


Default Wire Parameters for additional wire sizes have been developed, and are located inthe Appendix E of the User’s Manual for the Small Wire machine. Parameters are given forthe following wire sizes: 1.2 mils Aluminum, 1.5 mils Aluminum, 1.5 mils Gold, and 2 milsGold.



7. Internal Setting Deformation Limits: This screen allows you to set the deformation limits(both maximum and minimum) of the bond. This version gives this parameter selectiongreater flexibility by allowing you to specify the deformation limits separately for the firstand second bonds. In previous versions, the parameter was applied equally to both bonds.

ALC Machine




1/08/01





All the clamp movements that were implemented in software version 5.7e remain the same,namely: Clamps always remain open from the top of the v-hop into the cut move. They arealways closed during the cut move.


5. (5.8) Pull Test Diagnostics: A new function is added to the DIAGNOSTICS MENU thatallows you to see LVDT values corresponding to pull displacements. These values aredisplayed in a new screen that is accessed by selecting the “LVDT values” field in theDiagnostic Menu, or you can press [F6].


6. (5.8) Handler Interface Extensions For ALC Pull Test Control: Additional functionextensions are added to the Remote Mode for Pull Test control. Details for this featureare included in the ALC Pulltest Remote Control Specification portion of the Model360C/S Peripheral Equipment Interface Specification Manual, dated September 1999.


New functions have been added (in 5.8A Rev.) to the PR system to simplify the program-ming of complex, multiple devices on a substrate. These new functions are described be-low. In addition, other refinements incorporated into the PR system are also described.

Entire Assembly PR is normally used for an assembly that contains multiple devices whichare tied together. For example, a single substrate assembly with multiple devices called asnapstrate. Some of the benefits of using Entire Assembly PR are:


1/08/01

! By defining the location of the assembly, by default you also define the position of alldevices, since they are all fixed to the same assembly. It is not necessary to PR thesubstrate area for each device. (Device PR is not required).


! The camera X and Y location of all areas contained within all devices will be updatedaccording to the found position of the of the Entire Assembly PR.













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4. (5.8) Failed PR Action (SMR S454) “Conditional PR”When running the part, if PR fails, the PR ASSISTANCE REQUIRED screen will appear onthe data monitor. The screen will contain choices of assistance actions. You can choose:











1/08/01


NOTE: Skip failed area replaces the parameter Skip bonding wires with failed PRthat was located in the SYSTEM PARAMETER menu screen. That parameter is nolonger present in the SYSTEM PARAMETER screen. Instead, you can choose theFailed PR action in the PR EDIT screen.






*[ assist ]


X2:Y2:Name:




0MANUAL ASSIST

NEW

TOGGLEARROWS

F13: Save

F16: Abort


1/08/01


" PR failure in Remote mode — machine stops for assistance.UNLESS “Skip PR Assist in Remote” was set to YES. This optionoverrides the selection of Failed PR action in the ASSIST POINTEDIT screen, and skips to the next device.



NOTE: Action is the same if using “PR failures allowed” (requires the HandlerType in the Handler Parameters to NOT equal 0), however, bonder will not stop untilthe end of the assembly, even after exceeding the PR failure allowed count. Thisworks for Skip Device or Skip failed area only.



*[ assist ]


X2:Y2:Name:




0SKIP DEVICE

NEW

TOGGLEARROWS

F13: Save

F16: Abort


1/08/01



NOTE: Exceeding the maximum number of “PR fails allowed” will require opera-tor intervention, but only after the wire bonds associated with successfully locatedareas have been bonded. This occurs at the end of the assembly.



*[ assist]


X2:Y2:Name:




0SKIP FAILED AREA

NEW

TOGGLEARROWS

F13: Save

F16: Abort


1/08/01






NOTE: PR Edits made on any device in a multiple device list will affect all thedevices in the list. This is because the bonder treats “multiple devices” as a singledevice separated by offset coordinates. So, in effect, the multiple device list is onlyone device.


Device 1 2 3 4 *

X: 527 4180 7842 11501Y: 956 1034 1113 1193Z 3612 3625 3659 3721




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b. Model Thinning and Pixel Editing. Once a model is captured, you can manuallyedit pixels by pressing the [F9] key. This will bring up a screen titled, “ModelThinning and Pixel Editing”. With this feature you can turn on all the pixels so theyare available for editing. To access this feature press [F12] which appears on thescreen. An example is shown below.




" The “Paste Super Pixel” function only appears after you select(F14) “Copy super pixel.” Otherwise, it is turned off. You pastethe selected shade onto another pixel using the RETURN key.


When Thin Model is selected and you are looking at a model, all the pixels that are“not” selected will turn black. This will highlight the model and place the unselectedpixels in a black background. You must be sure that the significant “selected” pixels arenot black or this feature will make the model unreadable.

c. Super Pixel Editing: When performing PR spot, you have the option of selecting thesuper pixel resolution used in the model. The resolution you choose determines thepixel size. Your selections for this parameter are located in the MODEL EDIT screen.The choices available are fine, medium, or coarse. These resolution choicescorrespond to super pixel sizes 2, 4, or 8.







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.

Run Mode

1. Rework: The Rework functionality was improved by increasing the range over which theSPINNERS could reposition the first bond. This is useful when you have a large areaapplication. The procedure for making a bond location correction in Rework is shownbelow:

PROGRAM LOG



With the cursor on wire #1, use the spinners to position the video monitor crosshairs over the new first bond area. Bond 1 will be in the new location; all other bonds on the wire will be in their originally programmed locations.



1/08/01


Wire List


File Management


NOTE: The Supervisor Password is treated as an expansion of the “Overwrite All”function. Once the supervisor password is entered, all files from that point on will beoverwritten, including files with no password.

Statistics






Press [STOP], [ENTER] or [DOWN ARROW]. Refer to REWORK EDIT screen. Edit as you would in WIRE LIST. After saving the change, arrow back to the wire that was modified and press [START] to bond.


1/08/01


The ZIP drive option was introduced with Software Version 5.7b. Software version 5.8A enhances the functionality of the ZIP drive. The mass backup and restore functions remain the same as before, but functions are now added to make the ZIP behave similar to the /d1 floppy.






d. The Multiple Folders feature is excluded when the ZIP drive option is installedbecause of the increased functionality of the ZIP drive. Omitting the Multiple Folderfeature reduces process time and avoids potential for errors in the file transfer.

Bug Fixes

The following software bugs were corrected:

Version 5.8B1. All: The bond head did not move to the new Z Programmable Home after a file change

when running Execution Lists. This was corrected and tested. The bond head now movesto the Z Programmable Home of its current Wire List each time a file has been loadedduring Execution List bonding.


1/08/01

2. 360S: The Offset Calibration was producing incorrect offset values causing unpredict-able bond head movement. After the Tool Offset Calibration was performed, the offsetvalues were unusually large and had no relation to actual offsets. The Offset Calibrationwas corrected.

3. All: The Help screen for the “Cut Move Clock” parameter in the Internal Settings screenwas displaying the Help screen for “Start in Remote.” This is corrected.

4. 360S: The Help screen for the small wire bonder Force Calibration had listed the proce-dure required for the large wire bonder Force Calibration. The correct “Help” screen hasbeen substituted.

5. 360S: The Help screen for the Wire Feed Check Parameter, located in System Parame-ters, had listed large wire bonder options and not the screen for small wire. Large wirebonder options are off, on, cut, or both. The small wire bonder options are either on oroff. The small wire Help screen is now the correct one.

6. ALC bonders: The Help screen used for the Pull Test Data option, located in the Diag-nostic Menu, was for the Incremental Move option. The correct screen was substituted.

7. All: The Rework screen did not retain the Assembly PR Offset values when there aremultiple devices in the Wire List. When entering the Rework screen, the device selectscreen appears after the Assembly PR has been performed. Initially, all the devices arecorrectly offset by the Assembly PR, but once the user has entered the edit screen of adevice and backed out to the device select screen again, the Assembly PR Offset is nolonger applied. The devices are then returned to their original programmed locations. TheRework screen should retain the assembly PR Offset after a device has been selected.This condition was corrected and tested.

8. All: Setting the cutter blade parameter to “back” and changing the cut depth sensor to“switch” in the System Configuration screen enabled a new feature called the “cut moveclock” to appear in the internal settings screen. When first changing to cut switch, thevalue for the “cut move clock” parameter was set to an arbitrary number out of the valuerange. After exiting the internal settings screen and then re-entering, the field for “cutmove clock” was renamed to “tool mark power.” The Cut Move Clock was adjusted andnow operates correctly.

Version 5.8AThe following bugs were previously corrected in version 5.8A.








1/08/01



b. Abort out.


The problem was that the wire that was created had disappeared. When you returned the“Wire List Edit” screen you would not see the wire. This has been corrected. Now the“Wire List Edit” screen will show the wire, and the data monitor will indicate that the filewas saved.

2. All: Can’t Delete Folder. Corrected a problem whereby a folder created before or duringthe process of transferring files into it could not be deleted.

3. All: File Names In Link List Are Not Updated. Corrected the problem so that now whena file name is changed, the currently selected link list and execution list will be searchedto see if they contain the old name. If they do, a warning message will be displayedstating the file is in the link list or execution list. An option is given of continuing therename of the file, or aborting the rename attempt.

4. All: Recalibrate Z Did Not Do Assembly PR. Corrected the problem so that now whenyou Recalibrate Z, it will do Assembly PR.



6. All: The PR List consisted of a primary eyepoint, a primary linked eyepoint, an alternateeyepoint, and an alternate linked eyepoint. The assist points were set to “Yes” for usingreference points. After a PR fail of both primary and alternate linked eyepoints, the assistwould go to the primary reference point and the primary linked reference point. Occa-sionally the second assist point would go to the alternate linked reference point. By goingto the alternate link point the PR Offset would be shifted over out of position causingmisplaced bonds.



1/08/01

7. All: Inconsistent Default For PR Fails Allowed. In a newly created file, the default valuefor PR Fails Allowed was set to 0 (in the System Parameter Edit Screen). However, thevalid range for PR Fails Allowed is 1 to 100. The default value has been corrected so thatit now reads “1”.

8. All: Incorrect Cut Clock When Switching Front to Back Cut. When changing from frontcutter to rear cutter and setting the cut depth sensor to switch, the cut clock would auto-matically default to an incorrect value of 289694. This has been corrected so that thedefault value is 33.

9. SW and LW: Incorrect Recover From Tight Wire Error. Corrected an error where by a“Tight Wire” error message would appear if the Dereeler switch was set to OFF andbonding was started. When the switch was set to AUTO and the START button waspressed, the bond head would move up as if the STOP button was pressed.

10. All: Ramp Time Longer Than Total Time. If the Ramp Time is longer than the TotalTime, an error message appears: “Ramp time exceeds Total time for first bond”. If youabort the screen by pressing [F16], additional buttons [F14], [F15] would appear that hadno function and could result in a logic loop. The problem was corrected by applyingcorrect functions to these buttons as follows: [F13] = Ignore, [F14] = Abort verify, and[F16] = Abort.

11. SW: Error in Optical Offsets Computation. In the Small Wire Optical Offsets calibration,the results were skewed towards the +180o direction. The problem was corrected byaveraging the +180o and -180o and using the result as one point in the optical offsetscomputation

12. All: Saving Chain Mode In The PR Expert Setting. Corrected a problem that occurredwhen a file was loaded with PR Expert screen enabled and the Chain mode was notenabled in the Expert Screen, even though the Chain mode would appear in an eyepoint.In this correction, the Chain mode will be explicitly enabled if the file is loaded that con-tains a Chain mode eyepoint. In this manner, the Chain mode will remain enabled untilexplicitly disabled by the user, even if a subsequent file is loaded that does not contain aChain mode eyepoint.

13. All: Tight Wire Not Detected During Stitch Bonding. If the bonder stops at search heightand an error message appears that says “Wire feed detected after cut”, the tight wire con-dition must be cleared before pressing START to continue bonding. Otherwise, the bondhead will return to Home without properly completing the stitch bond.

14. All: “THN” Legend on PR Monitor In Line Mode. The THN legend does not apply toLine Mode. Corrected a display problem that occurred when the model thinning parame-ter was set to YES and the find mode was switched from Point to Line, the “THN”legend would still appear on the monitor.

15. All: Assembly PR Not Retained If “Skip Device” Selected. Corrected a problem thatoccurred when using Assembly PR and multiple devices, if a PR error occurred and [F15]“Skip Device” or [F16] “Abort” was pressed, PR Assembly data would be lost.

16. All: Run Screen After PR Assist In Rework. Corrected a problem of the Run Screen


1/08/01

(Bond Counter) appearing briefly between each PR area when there was an unsuccessfulPR find in REWORK and the START button was pressed to mark the PR position.

17. All: Incorrect PR Area Numbering After Delete Area. Corrected a problem of the propernumbering of PR Areas.

18. All: No PR Graphics On PR Fail Or PR Edit. Corrected a problem where the PR graphicscreen was not visible if PR failed and the cursor was on the PR Area or on the EyepointEdit field.

19. All: F8: Image Enhancement Legend Is Underlined. Eliminated the underline from the“[F8] Image Enhancement” legend. The underline implies there might by motion of thehead if the item were selected. There is no motion that occurs by selecting the “ImageEnhancement” field.






21. All: STOP Aborts Stitch Bonding. Corrected a problem when bonding in REWORK,such that if “Stop at search” is OFF, and the STOP key is pressed prior to a Stitch Bond,the head would move straight up and not complete the wire. (Note: This only wouldoccur if there was a forced angle on the bond). Now, pressing STOP in the middle of awire does not abort the wire.

22. All: Manual Manipulation of Bond Head In SECS/GEM. Corrected a problem that wouldcause the machine to lock up when in the SECS/GEM mode if the bond head was manu-ally moved so you could make some adjustment to the bond head. The problem wouldoccur only if you had entered a Programmable Z-Home, and only on the second attemptto manually adjust the head position. The machine now works as expected.


11/29/01

Applicable

Version 5.8C is targeted to run on all variations of the M360 platform, Large Wire Bonder including the Active Loop Control Bond Head option and the Model 360S Small Wire Bonder.

Objective

Software Version 5.8C corrects functional problems and minor bug fixes discovered in Version 5.8B.

Contents of Package

(1) Floppy disk containing Version 5.8C (P/N 172518-1 S) (System).

(1) Software Release Instructions for Version 5.8C.

Compatibility

Version 5.8C is backwards compatible with all previous machines that used 5.x series software. All combinations of hardware will be supported, including old (P/N 171507, 171562) and new (P/N 172802) PR, old (P/N 172532) and new (P/N 175512) I/O, and old (P/N 172567) and new (P/N 175507) generator.

NOTE: Wire lists created or edited on Version 5.8C cannot be run on software ver-sions earlier than 5.8. Once Version 5.8C is installed, editing and then saving aprogram created with a version earlier than 5.8 (5.7J or prior) will automaticallyupdate it to the latest Version of 5.8C.Therefore, the program will no longer be compatible with the earlier software ver-sions. OE suggests that you make copies onto floppies of Wire lists created withearlier versions of software so that you can still run those Wire lists when using anearlier version of software.


NOTE: Before you install the new software, print out a hard copy of the defaultwire parameters. With this software release, new default wire parameters will over-write the previous default wire parameters. Manually reenter the parameters you wantchanged to the default settings after loading Version 5.8C.

SOFTWARE RELEASE Version 5.8C

ORTHODYNE ELECTRONICS SOFTWARE RELEASE SW 5.8C.FM PAGE 1 OF 26

11/29/01




3. Insert the new system disk (P/N 172518-1 S) in the data drive on the front of the bondercontrol drawer (D1). At the prompt, type “/d1/install” and press [ENTER].






New Features

Version 5.8CThis revision includes; the addition of the “No Pulltest” feature to the Remote ALC Pulltest. Fea-tures introduced by previous software release versions are described in the following sections in order to make this a complete and independent document.

Version 5.8B

ALC Machine

1. ALC Pulltest Function Operable in “Rework” (5.8B): The goal was to be able to use theALC pulltest function while in “Rework.” This added function allows the operator tocollect all the parts requiring rework automatically on the line. The operator can start the360C in “Rework” to process all the parts. This requires the “Remote Pulltest Function”to be available when the machine is started in “Rework.” The “Remote Pulltest Func-tions” are available if the 360C drops out of automatic mode into “Rework.” This modifi-cation makes the “Remote Pulltest Functions” active in “Rework” at all times (ifenabled).


11/29/01

Version 5.8A

SECS/GEM

Version 5.8A supports an optional feature called SECS/GEM. This option requires additional hardware.

This acronym stands for “Semiconductor Equipment Communication Standard/Generic Equip-ment Model.” This communication standard allows a factory host computer system to interface with diverse components of equipment for automated process control. A typical factory layout is shown in the block diagram. Even though the various pieces of equipment are built by different manufacturers, if they adhere to the SECS/GEM standard, they will all have an interface stan-dard that allows them to communicate with the host computer. This option can be purchased and will require additional hardware.


Execution List




Before the implementation of the Execution List automatic mode, largecomplex hybrids were processed as one big part with one large wire list. If,for example, you had a 200 item wire list and 50 of them needed change, inmost cases you could either change all of the wires or just one at a time.




11/29/01

Now, when using Execution List automatic mode, you can divide the partinto several smaller sub-sections. This allows you to independently edit thesesmaller sub-sections with no affect on the others. With this feature you couldmodify those 50 wires in a one-step global change without touching the other150*. After the modification, you can run all the individual wire lists“ganged” as a group in a single step.


.






(P/R)Die 2 (P/R)

Die 3 (P/R)

Die 4 (P/R)

Execution List

Wire List

Wire List

Execution List

Wire List

Wire List

Wire List

Wire List

Link List

OR

Execution List


11/29/01






2550105020No

Yes1

Yes

NEW







9012032351050

9012034381050


2050

1040

10080

160153

2035090




11/29/01

3. The currently selected wire list need not be in the currently selected execution list. 4. An additional key [F10] has been provided in Link List Edit to facilitate selection of exe-

cution lists for inclusion into the link list.






Version 5.8C1. (5.8C for ALC Machine) Addition of “No Pulltest” feature to the Remote ALC

Pulltest. The remote ALC pulltest feature allows for two commands, “Pulltest” or “Pro-ceed.” These commands are issued remotely during bonding to allow for a remotehandler to specify if a bond should be pulltested.

A particular bond can be set to either Always pulltest, or to Remote pulltest. If set to Remotepulltest, the bonder will wait for the “Pulltest” or “Proceed” command.

The enhanced feature in Version 5.8C adds a third command option, of Never Pulltest. TheNever Pulltest option allows the user to specify that certain bonds should never be pulltest-ed regardless of the commands received during bonding. These selections are found on thesecond page of the WIRE LIST EDIT display.

Enhancements introduced in previous Software Release versions are described in the fol-lowing sections.


LINK LIST EDIT

0: GJ E 5:

1: PR TEST -1_12 W 6:

2: PR TEST -1_33 W 7:

3: 8:

4: 9:

ARROWS F13: Save


F 16: Abort

Execution File

Wire List File


11/29/01

Version 5.8AGeneral

1. (5.8 for All machines) Camera Gain Calibration: This procedure requires an OE CameraCalibration Box. With Version 5.8, go to the MAIN MENU and type “VG”. This is achange from previous versions where you would type “CGC”. With the Camera switchset to M, adjust the camera gain pot to have a VG reading according to the value on theOE Calibration Box. Allow a few minutes settling time.

Large Wire Machine

2. (5.8) Programmable Z Home For Tool Check: Adds a provision to bring the BondHead to a programmable Z home while in Tool Check and Tool Offsets calibration. Pres-ently, if the head is sent to its hard home, several key strokes are required to bring theBond Head down to programmable Z home. This feature significantly speeds up theprocess of calibration.





Manual Positioning:

1. (5.8) Renumber “Save” and “Abort” commands. In the MANUAL POSITIONINGscreen the “Save” and “Abort” commands have been renumbered to be consistent withother screens. Now, [F13] will always be “Save” and [F16] will always be “Abort.”



11/29/01


Small Wire Machine

1. (5.8) Remove Small Wire Bond Angle Limitation:


2. (5.8) Small Wire Loop Settings:A new field called “Active radius looping” now appears in the INTERNAL SETTINGSscreen. This field can be toggled ON or OFF. Turn this parameter ON if you have bond padsthat are relatively close together with a relatively high loop top. The machine would thencompute a radius move from Loop Top to the second bond pad, resulting in a well-formedloop.


The “Down Interval” parameter controls the rate at which the small wire head tilts down totouch the surface during bonding. Values assigned are now 1.5, 2, or 3, corresponding towire sizes. Below these wire sizes, users may experience excessive pre-flattening of thewire due to touchdown. Increasing this value slightly can help alleviate this condition.









11/29/01

ALC Machine









5. (5.8) Pull Test Data: A new function is added to the DIAGNOSTICS MENU that allowsyou to see LVDT values corresponding to pull displacements. These values are dis-played in a new screen that is accessed by selecting the “Pull Test Data” in the Diagnos-tic Menu, or you can press [F6]. If a pull test fails, the word “FAIL” will appear next tothe LVDT value for that bond.


11/29/01

Figure 1 Diagnostic Menu

Figure 2 Pull Test Data

6. (5.8) Handler Interface Extensions For ALC Pull Test Control: Additional functionextensions are added to the Remote Mode for Pull Test control. Details for this featureare included in the ALC Pulltest Remote Control Specification portion of the Model360C/S Peripheral Equipment Interface Specification Manual, dated November 2001.



PROGRAM NAME

LINK FILE NAME(if selected)

DIAGNOSTICS MENU

[1] - Exercise motors 2 - LVDT float test 3 - Bond monitor 4 - Wire Feed Data 5 - Cut Depth Data 6 - Pulltest Data*

*(ALC Only)

ENTER:Select START: Select

ARROWS F2: Bond MonitorF3: Wire feed data

F4: Cut depth dataF6: Pulltest data*

F16 Abort

Pull Test Data

PROGRAM NAME

Pull microns

48

27

F15: Clear data

F16: Abort


11/29/01

Entire Assembly PR is normally used for an assembly that contains multiple devices whichare tied together, for example, a single substrate assembly with multiple devices called asnapstrate. Some of the benefits of using Entire Assembly PR are:

! Defining the location of the assembly also defines the position of all devices, sincethey are all fixed to the same assembly. It is not necessary to PR the substrate area foreach device. (Device PR is not required).


! The camera X and Y location of all areas contained within all devices will be updatedaccording to the found position of the Entire Assembly PR.


1. Go to Entire Assembly and program the location of the substrate extremes on which allthe repetitive patterns are located.










11/29/01













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c. If the Assembly PR passes and the Device PR passes, but multiple PR Areas withinthe Device fail using Skip Failed Area enabled, the bonder will continue to referenceall PR areas within the Device before stopping. Any wire associated with a “legal”PR Area (meaning successfully found using pattern recognition) would be bonded.








*[assist]


X2:Y2:Name:




0MANUAL ASSIST

NEW

TOGGLEARROWS

F13: Save

F16: Abort


11/29/01


" PR failure in Remote mode — machine stops for assistance, Unless“Skip PR Assist in Remote” was set to YES. This option overridesthe selection of Failed PR action in the ASSIST POINT EDITscreen and skips to the next device.






*[assist]


X2:Y2:Name:




0SKIP DEVICE

NEW

TOGGLEARROWS

F13: Save

F16: Abort


11/29/01






*[assist]


X2:Y2:Name:




0SKIP FAILED AREA

NEW

TOGGLEARROWS

F13: Save

F16: Abort


11/29/01





You can edit any of the devices shown on the screen. Move the cursor to the desired devicenumber and press START. This will open the PR LIST EDIT screen to edit the device.



Device 1 2 3 4 *

X: 527 4180 7842 11501Y: 956 1034 1113 1193Z 3612 3625 3659 3721




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b. Model Thinning and Super Pixel Editing. Once a model is captured, you canmanually edit pixels by pressing the [F9] key. This will bring up a screen titled,“Model Thinning and Super Pixel Editing”. An example is shown below.





" Turn all pixels on simultaneously using [F12]



c. Super Pixel Editing: When performing PR spot, you have the option of selecting thesuper pixel resolution used in the model. The resolution you choose determines thesuper pixel size. Your selections for this parameter are located in the MODEL EDITscreen. The choices available are fine, medium, or coarse. These resolution choicescorrespond to super pixel sizes 2, 4, or 8. Note that in the Eye Point Edit screen,thinned models are displayed as they would appear during super pixel editing.

PROGRAM MODEL THINNING and SUPER PIXEL EDITINGLOG






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.

Run Mode

1. Rework: The Rework functionality was improved by increasing the range over which theSPINNERS could reposition the first bond. The procedure for making a bond locationcorrection in Rework is shown below:

PROGRAM LOG






Press [STOP], [ENTER] or [DOWN ARROW]. Refer to REWORK EDIT screen. Edit as you would in WIRE LIST. After saving the change, move the arrow back to the wire that was modi-fied and press [START] to bond.


11/29/01


Wire List


File Management



Statistics






The ZIP drive option was introduced with Software Version 5.7b. Software version 5.8A enhances the functionality of the ZIP drive. The mass backup and restore functions remain the same as before, but functions are now added to make the ZIP behave similar to the /d1 floppy. For convenience, the Overwrite All and Supervisor Password features have been implemented for Transfer files.


11/29/01


b. Selecting “1 - Wire list” brings up the following TRANSFER DIRECTION menu:1 - Hard disk to floppy2 - Floppy to hard disk3 - Floppy to floppy4 - Folder to folder copy5 - Folder to folder move6 - Hard disk to ZIP disk7 - ZIP disk to hard disk8 - ZIP disk to ZIP disk9 - Backup to ZIP driveA - Restore from ZIP drive.



Corrected ProblemsThe following software problems were corrected:

Version 5.8C1. All: DSP Timeout Error. Corrected a problem with an Autoline machine where the

machine would stop with a “DSP timeout” error message when operating in auto runmode while the machine performed PR. Although the machine would recover when theoperator pressed any key, this error was not normal. The software problem was found andfixed.

2. All: Machine Lockup after Tight Wire. A tight wire error can occur for a number of validreasons such as: the spool ran out of wire, the wire got hung up somewhere, etc. Theerror message stops the machine and signals the operator to fix the situation. All this isnormal. However, the machine should not lock up when this error occurs. This problemwas found and corrected.


11/29/01

3. All: Incorrect Statement in VG. A dialog box says “to exit the VG screen, press any key”.However, because the keypad was not active, the statement was not strictly correct andcould have caused confusion. A software fix was included which now responds to anykey — keyboard or keypad.

4. All: Incorrect Default Front Cut Parameters. Incorrect default tail length parameters wereshown when front cut was selected. These have now been corrected to read “Minimum =0, and Maximum = 2000”.

5. M360C-H/HD: Transport Index Problem After PR Failure. When in the Auto mode, thetransport would incorrectly index after a PR failure was identified and corrected. This isfixed in this software release.

6. All: Monitor Compatibility Problem. When running GS1 PR with a GMS CPU and aDorio monitor, the machine would intermittently hang up when in Manual Positioning,especially when moving the Spinners slowly. The problem was found and fixed.

7. All: Old PR/v5.8 Problem with Monitor. Fixed a problem where occasionally, whenusing old PR with v5.8, gibberish would display on the monitor. This seemed to occurmostly with the Force CPU.

8. All: Send Bond Head To Home Before Going To Park. Corrected a problem in ManualPositioning mode that could have caused a head crash. If the Z height of the Bond Headis lowered manually (not by software), and then the “Toggle” or “F10” is pressed, theBond would move to the Park position before giving a position verification error. Now,the Bond head is always sent to Home before going to Park in Manual Positioning mode.

9. All: Tool Offset Calibration With Bond Head At X Or Y Limit. Performing a “ToolOffset” calibration if the bonder reaches an X or Y limit could cause erroneous tool offsetcalculation. To prevent this error from going unnoticed, an Error Message is now pro-vided if the bonder is too close to a machine limit. This Error Message is displayedbefore the head moves.

Version 5.8B1. All: The Bond Head did not move to the new Z Programmable Home after a file change

when running Execution Lists. This was corrected and tested. The Bond Head now movesto the Z Programmable Home of its current Wire List each time a file has been loadedduring Execution List bonding.

2. 360S: The Offset Calibration was producing incorrect offset values causing unpredict-able Bond Head movement. After the Tool Offset Calibration was performed, the offsetvalues were unusually large and had no relation to actual offsets. The Offset Calibrationwas corrected.


4. 360S: The Help screen for the small wire bonder Force Calibration had listed the proce-dure required for the large wire bonder Force Calibration. The correct “Help” screen has


11/29/01

been substituted.














b. Abort out.


The problem was that the wire that was created had disappeared. When you returned the“Wire List Edit” screen you would not see the wire. This has been corrected.


11/29/01

Now the “Wire List Edit” screen will show the wire, and the data monitor will indicatethat the file was saved.

2. All: ‘Can’t delete folder.’ Corrected a problem whereby a folder created before or duringthe process of transferring files into it could not be deleted.

3. All: ‘File names in link list are not updated.’ Corrected the problem so that now when afile name is changed, the currently selected link list and execution list will be searched tosee if they contain the old name. If they do, a warning message will be displayed statingthe file is in the link list or execution list. An option is given of continuing the rename ofthe file, or aborting the rename attempt.

4. All: ‘Recalibrate Z did not do assembly PR.’ Corrected the problem so that now whenyou Recalibrate Z, it will do Assembly PR.





7. All: ‘Inconsistent default for PR Fails allowed.’ In a newly created file, the default valuefor PR Fails Allowed was set to 0 (in the System Parameter Edit Screen). However, thevalid range for PR Fails Allowed is 1 to 100. The default value has been corrected so thatit now reads “1”.

8. All: ‘Incorrect Cut Clock when switching front to back cut.’ When changing from frontcutter to rear cutter and setting the cut depth sensor to switch, the cut clock would auto-matically default to an incorrect value of 289694. This has been corrected so that thedefault value is 33.


11/29/01

9. SW and LW: ‘Incorrect recover from tight wire error.’ Corrected an error indicated by a“Tight Wire” error message that would appear if the Dereeler switch was set to OFF andbonding was started. When the switch was set to AUTO and the START button waspressed, the Bond Head would move up as if the STOP button was pressed.

10. All: ‘Ramp time longer than Total Time.’ If the Ramp Time is longer than the TotalTime, an error message appears: “Ramp time exceeds Total time for first bond”. If youabort the screen by pressing [F16], additional buttons [F14], [F15] would appear that hadno function and could result in a logic loop. The problem was corrected by applyingcorrect functions to these buttons as follows: [F13] = Ignore, [F14] = Abort verify, and[F16] = Abort.

11. SW: ‘Error in Optical Offsets computation.’ In the Small Wire Optical Offsets calibra-tion, the results were skewed towards the +180 degrees direction. The problem was cor-rected by averaging the +180 degrees and -180 degrees and using the result as one pointin the optical offsets computation

12. All: ‘Saving Chain Mode in the PR Expert setting.’ Corrected a problem that occurredwhen a file was loaded with PR Expert screen enabled and the Chain mode was notenabled in the Expert screen, even though the Chain mode would appear in an eyepoint.In this correction, the Chain mode will be explicitly enabled if the file is loaded that con-tains a Chain mode eyepoint. In this manner, the Chain mode will remain enabled untilexplicitly disabled by the user, even if a subsequent file is loaded that does not contain aChain mode eyepoint.

13. All: ‘Tight Wire not detected during stitch bonding.’ If the bonder stops at search heightand an error message appears that says “Wire feed detected after cut”, the tight wire con-dition must be cleared before pressing START to continue bonding. Otherwise, the BondHead will return to Home without properly completing the stitch bond.

14. All: “THN” legend on PR monitor in Line Mode.’ The THN legend does not apply toLine Mode. Corrected a display problem that occurred when the MODEL THINNINGPARAMETER was set to YES and the find mode was switched from Point to Line, the“THN” legend would still appear on the monitor.

15. All: ‘Assembly PR not retained if “Skip Device” Selected. Corrected a problem thatoccurred when using Assembly PR and multiple devices. If a PR error occurred and[F15] “Skip Device” or [F16] “Abort” was pressed, PR Assembly data would be lost.

16. All: ‘Run screen after PR Assist in Rework.’ Corrected a problem of the Run screen(Bond Counter) appearing briefly between each PR area when there was an unsuccessfulPR find in REWORK and the START button was pressed to mark the PR position.

17. All: ‘Incorrect PR Area numbering after Delete Area.’ Corrected a problem of the propernumbering of PR Areas.


11/29/01

18. All: ‘No PR graphics on PR Fail or PR Edit.’ Corrected a problem where the PR graphicscreen was not visible if PR failed and the cursor was on the PR Area or on the EyepointEdit field.

19. All: F8: ‘Image Enhancement legend is underlined.’ Eliminated the underline from the“[F8] Image Enhancement” legend. The underline implies there might be motion of thehead if the item were selected. There is no motion that occurs by selecting the “ImageEnhancement” field.






21. All: ‘STOP aborts Stitch bonding.’ Corrected a problem when bonding in REWORK,such that if “Stop at search” is OFF, and the STOP key is pressed prior to a Stitch Bond,the head would move straight up and not complete the wire. (Note: This only wouldoccur if there was a forced angle on the bond). Now, pressing STOP in the middle of awire does not abort the wire.

22. All: ‘Manual manipulation of bond head in SECS/GEM.’ Corrected a problem that wouldcause the machine to lock up when in the SECS/GEM mode if the bond head was manu-ally moved so you could make some adjustment to the bond head. The problem wouldoccur only if you had entered a Programmable Z-Home, and only on the second attemptto manually adjust the head position. The machine now works as expected.


1/9/02

Applicable

Version 5.8D is targeted to run on all variations of the M360 platform, Large Wire Bonder including the Active Loop Control Bond Head option and the Model 360S Small Wire Bonder.

Objective

Software Version 5.8D corrects functional problems and minor bug fixes discovered in Version 5.8x.

Contents of Package

(1) Floppy disk containing Version 5.8D (P/N 172518-1 S) (System).

(1) Software Release Instructions for Version 5.8D.

Compatibility

Version 5.8D is backwards compatible with all previous machines that used 5.x series software. All combinations of hardware will be supported, including old (P/N 171507, 171562) and new (P/N 172802) PR, old (P/N 172532) and new (P/N 175512) I/O, and old (P/N 172567) and new (P/N 175507) generator.

NOTE: Wire lists created or edited on Version 5.8D cannot be run on softwareversions earlier than 5.8. Once Version 5.8D is installed, editing and then saving aprogram created with a version earlier than 5.8 (5.7J or prior) will automaticallyupdate it to the latest Version of 5.8D.Therefore, the program will no longer be compatible with the earlier software ver-sions. OE suggests that you make copies onto floppies of Wire lists created withearlier versions of software so that you can still run those Wire lists when using anearlier version of software.


NOTE: Before you install the new software, print out a hard copy of the defaultwire parameters. With this software release, new default wire parameters will over-write the previous default wire parameters. Manually reenter the parameters you wantchanged to the default settings after loading Version 5.8D.

SOFTWARE RELEASE Version 5.8D

ORTHODYNE ELECTRONICS SOFTWARE RELEASE SW 5.8D.FM PAGE 1 OF 26

1/9/02










New Features

Version 5.8CThis revision includes; the addition of the “No Pulltest” feature to the Remote ALC Pulltest. Fea-tures introduced by previous software release versions are described in the following sections in order to make this a complete and independent document.

Version 5.8B

ALC Machine



1/9/02

Version 5.8A

SECS/GEM




Execution List








1/9/02



.






(P/R)Die 2 (P/R)

Die 3 (P/R)

Die 4 (P/R)

Execution List

Wire List

Wire List

Execution List

Wire List

Wire List

Wire List

Wire List

Link List

OR

Execution List


1/9/02






2550105020No

Yes1

Yes

NEW







9012032351050

9012034381050


2050

1040

10080

160153

2035090




1/9/02

3. The currently selected wire list need not be in the currently selected execution list. 4. An additional key [F10] has been provided in Link List Edit to facilitate selection of exe-

cution lists for inclusion into the link list.






Version 5.8C1. (5.8C for ALC Machine) Addition of “No Pulltest” feature to the Remote ALC

Pulltest. The remote ALC pulltest feature allows for two commands, “Pulltest” or “Pro-ceed.” These commands are issued remotely during bonding to allow for a remotehandler to specify if a bond should be pulltested.



Enhancements introduced in previous Software Release versions are described in the fol-lowing sections.


LINK LIST EDIT

0: GJ E 5:

1: PR TEST -1_12 W 6:

2: PR TEST -1_33 W 7:

3: 8:

4: 9:

ARROWS F13: Save


F 16: Abort

Execution File

Wire List File


1/9/02

Version 5.8AGeneral


Large Wire Machine






Manual Positioning:

1. (5.8) Renumber “Save” and “Abort” commands. In the MANUAL POSITIONINGscreen the “Save” and “Abort” commands have been renumbered to be consistent withother screens. Now, [F13] will always be “Save” and [F16] will always be “Abort.”



1/9/02


Small Wire Machine



2. (5.8) Small Wire Loop Settings:A new field called “Active radius looping” now appears in the INTERNAL SETTINGSscreen. This field can be toggled ON or OFF. Turn this parameter ON if you have bond padsthat are relatively close together with a relatively high loop top. The machine would thencompute a radius move from Loop Top to the second bond pad, resulting in a well-formedloop.











1/9/02

ALC Machine











1/9/02






PROGRAM NAME


DIAGNOSTICS MENU


*(ALC Only)




F16 Abort

Pull Test Data

PROGRAM NAME

Pull microns

48

27

F15: Clear data

F16: Abort


1/9/02


! Defining the location of the assembly also defines the position of all devices, sincethey are all fixed to the same assembly. It is not necessary to PR the substrate area foreach device. (Device PR is not required).


! The camera X and Y location of all areas contained within all devices will be updatedaccording to the found position of the Entire Assembly PR.












1/9/02













1/9/02









*[assist]


X2:Y2:Name:




0MANUAL ASSIST

NEW

TOGGLEARROWS

F13: Save

F16: Abort


1/9/02


" PR failure in Remote mode — machine stops for assistance, Unless“Skip PR Assist in Remote” was set to YES. This option overridesthe selection of Failed PR action in the ASSIST POINT EDITscreen and skips to the next device.






*[assist]


X2:Y2:Name:




0SKIP DEVICE

NEW

TOGGLEARROWS

F13: Save

F16: Abort


1/9/02






*[assist]


X2:Y2:Name:




0SKIP FAILED AREA

NEW

TOGGLEARROWS

F13: Save

F16: Abort


1/9/02








Device 1 2 3 4 *

X: 527 4180 7842 11501Y: 956 1034 1113 1193Z 3612 3625 3659 3721




1/9/02
















1/9/02






" Turn all pixels on simultaneously using [F12]










1/9/02



.

Run Mode


PROGRAM LOG








1/9/02


Wire List


File Management



Statistics








1/9/02






Version 5.8DThe primary purpose of this version release is to correct a bug in 5.8C (and in previous versions of 5.8x) having to do with motor power when the machine is in Park Position during Automatic Mode. This function was meant specifically for the Toyota Interface. A change was made in 5.7x series software to reduce motor power during Automatic. This change was missed when writing the 5.8x series software. This change has now been implemented into 5.8D version.

Version 5.8C1. All: DSP Timeout Error. Corrected a problem with an Autoline machine where the

machine would stop with a “DSP timeout” error message when operating in auto runmode while the machine performed PR. Although the machine would recover when theoperator pressed any key, this error was not normal. The software problem was found andfixed.


1/9/02



4. All: Incorrect Default Front Cut Parameters. Incorrect default tail length parameters wereshown when front cut was selected. These have now been corrected to read “Minimum =0, and Maximum = 2000”.






Version 5.8B1. All: The Bond Head did not move to the new Z Programmable Home after a file change

when running Execution Lists. This was corrected and tested. The Bond Head now movesto the Z Programmable Home of its current Wire List each time a file has been loadedduring Execution List bonding.



1/9/02
















b. Abort out.


1/9/02





3. All: ‘File names in link list are not updated.’ Corrected the problem so that now when afile name is changed, the currently selected link list and execution list will be searched tosee if they contain the old name. If they do, a warning message will be displayed statingthe file is in the link list or execution list. An option is given of continuing the rename ofthe file, or aborting the rename attempt.









1/9/02



11. SW: ‘Error in Optical Offsets computation.’ In the Small Wire Optical Offsets calibra-tion, the results were skewed towards the +180 degrees direction. The problem was cor-rected by averaging the +180 degrees and -180 degrees and using the result as one pointin the optical offsets computation








1/9/02











10/11/02

Applicable

Version 5.8E is designed to run on all variations of the M360 platform, Large Wire Bonder including the Active Loop Control Bond Head option and the Model 360S Small Wire Bonder.

Objective

Software Version 5.8E corrects functional problems and minor bug fixes discovered in Version 5.8x.

Following is a summary of the corrections made in 5.8E:

1. Corrected excessive heel cracks in first bond compared to 5.7J.

2. Corrected machine lock-up problem in Bond Off.

3. Corrected PR problem when using Single Point Mode.

4. Corrected SECS/GEM Auto Mode indexing problem.

5. Changed Area Statistics screen name for easier recognition.

Contents of Package(1) Floppy disk containing Version 5.8E (P/N 172518-1 S) (System).

(1) Software Release Instructions for Version 5.8E.

CompatibilityVersion 5.8E is backwards compatible with all previous machines that used 5.x series software. All combinations of hardware will be supported, including old (P/N 171507, 171562) and new (P/N 172802) PR, old (P/N 172532) and new (P/N 175512) I/O, and old (P/N 172567) and new (P/N 175507) generator.

NOTE: Wire lists created or edited on Version 5.8E cannot be run on software ver-sions earlier than 5.8. Once Version 5.8E is installed, editing and then saving aprogram created with a version earlier than 5.8 (5.7J or prior) will automaticallyupdate it to the latest Version of 5.8E.Therefore, the program will no longer be compatible with the earlier software ver-sions. OE suggests that you make copies onto floppies of Wire lists created withearlier versions of software so that you can still run those Wire lists when using anearlier version of software.

SOFTWARE RELEASE Version 5.8E

ORTHODYNE ELECTRONICS SOFTWARE RELEASE SW 5.8E.FM PAGE 1 OF 28

10/11/02


NOTE: Before you install the new software, print out a hard copy of the defaultwire parameters. With this software release, new default wire parameters will over-write the previous default wire parameters. Manually reenter the parameters you wantchanged to the default settings after loading Version 5.8E.











10/11/02

New Features

Version 5.8E

No new features were added.

Version 5.8D

No new features were added.

Version 5.8C

This revision includes; the addition of the “No Pulltest” feature to the Remote ALC Pulltest. Fea-tures introduced by previous software release versions are described in the following sections in order to make this a complete and independent document.

Version 5.8B

ALC Machine


Version 5.8A

SECS/GEM




10/11/02


Execution List










10/11/02

.





Program Name INTERNAL SETTINGS LOG

Link



(P/R)Die 2 (P/R)

Die 3 (P/R)

Die 4 (P/R)

Execution List

Wire List

Wire List

Execution List

Wire List

Wire List

Wire List

Wire List

Link List

OR

Execution List


10/11/02






2550105020No

Yes1

Yes

NEW

Start in Remote mode F13: Save parameters

ARROWS F15: Configuration

F16 Abort edit

Sample program (AL2) @GJ WIRE PARAMETER EDIT LOG1

LINK File NEW Name, entered as any 15 characters

WIRE PARAMETERS FOR “FILE NAME”

Name/type [AL 2]

First bond:

Start Force:End force:Start power:End power:Ramp time:Total time:


9012032351050

9012034381050


2050

1040

10080

160153

2035090

F13: Save bond parameters

F10: Edit minima F14: Save to default set

ARROWS F11: Edit maxima

PAGE F16: Abort edit


10/11/02





Feature EnhancementsVersion 5.8E

1. (5.8E) Area Statistics: The “PR List” area statistics screen was re-labeled to make itmore intuitive to find.

Version 5.8C

1. (5.8C for ALC Machine) Addition of “No Pulltest” feature to the Remote ALCPulltest. The remote ALC pulltest feature allows for two commands, “Pulltest” or “Pro-ceed.” These commands are issued remotely during bonding to allow for a remotehandler to specify if a bond should be pulltested.



Enhancements introduced in previous Software Release versions are described in the fol-


LINK LIST EDIT

0: GJ E 5:

1: PR TEST -1_12 W 6:

2: PR TEST -1_33 W 7:

3: 8:

4: 9:

ARROWS F13: Save


F 16: Abort

Execution File

Wire List File


10/11/02

lowing sections.

Version 5.8AGeneral


Large Wire Machine







screen the “Save” and “Abort” commands have been renumbered to be consistent withother screens. Now, [F13] will always be “Save” and [F16] will always be “Abort.”



10/11/02


Small Wire Machine















10/11/02

ALC Machine











10/11/02






PROGRAM NAME


DIAGNOSTICS MENU


*(ALC Only)




F16 Abort

Pull Test Data

PROGRAM NAME

Pull microns

48

27

F15: Clear data

F16: Abort


10/11/02


Defining the location of the assembly also defines the position of all devices, sincethey are all fixed to the same assembly. It is not necessary to PR the substrate area foreach device. (Device PR is not required).

Bonds on the substrate can be tied to the entire Assembly PR by selecting assembly asthe area in the Wire List.

The camera X and Y location of all areas contained within all devices will be updatedaccording to the found position of the Entire Assembly PR.












10/11/02




Manual assist

Skip device

Skip failed area









10/11/02









*[assist]


X2:Y2:Name:




0MANUAL ASSIST

NEW

TOGGLEARROWS

F13: Save

F16: Abort


10/11/02


PR failure in Remote mode — machine stops for assistance, Unless“Skip PR Assist in Remote” was set to YES. This option overridesthe selection of Failed PR action in the ASSIST POINT EDITscreen and skips to the next device.






*[assist]


X2:Y2:Name:




0SKIP DEVICE

NEW

TOGGLEARROWS

F13: Save

F16: Abort


10/11/02






*[assist]


X2:Y2:Name:




0SKIP FAILED AREA

NEW

TOGGLEARROWS

F13: Save

F16: Abort


10/11/02









Device 1 2 3 4 *

X: 527 4180 7842 11501

Y: 956 1034 1113 1193

Z 3612 3625 3659 3721


ARROWS

PAGE F16: Abort list


10/11/02

7. (5.8) General PR Operations















10/11/02



Turn pixels ON/OFF using the SPACE BAR

Copy a pixel shade using the [F14] key

The “Paste Super Pixel” function only appears after you select(F14) “Copy super pixel.” Otherwise, it is turned off. You pastethe selected shade onto another pixel using the RETURN key.

Turn all pixels on simultaneously using [F12]





Toggle a super pixel ON (rectangle shown) to include it in a thin model find.

To enable thin model finds, set “Use thin model” to ON in the expert screen.

Toggle: Super pixel on/off

Enter: Paste super pixel


ARROWS F14: Copy super pixel



10/11/02



.

Run Mode


PROGRAM LOG








10/11/02


Wire List


File Management



Statistics








10/11/02







Version 5.8E

A problem was corrected that caused a higher percentage of heel cracks in the first bond for the Small Wire Bond Head using 5.8E, than when using 5.7J.

Pressing the STOP key during the time when the Bond Head was searching for the surface while performing a Bond Off, the machine would lock up. This was corrected

When using Point Mode for PR, if the size of the search box was reduced, the PR Result would decrease significantly. This problem was corrected.

SECS/GEM Auto Mode is engaged after an edit was made and saved, the first two devices would index and be bonded without PR. This problem was corrected.


10/11/02

Version 5.8 All

A bug was recently discovered and corrected that occurred in the development of Version 5.8. This bug was present in all versions of 5.8. There were certain conditions that could result in a near 360 degree rotation in the middle of a wire (between first and second bond). The condition of such an illegal forced wire angle rotation was unusual, and the problem was missed during the normal software checkout procedure.

We have recently implemented additional angle checks to the wire list validation to prevent this from happening. A side effect of this bug fix is that angle checking on current 5.8D software is more thorough so that typed-in angle values that were allowed in the past will now be caught and an error message will be issued.

Keep in mind that these large typed-in angles were always illegal and should not have been allowed in the early versions of the 5.8x software.

A simple work-around solution for those customers that experience the illegal angle error, is to edit the wire list by typing in the mirror angle for those bonds. A mirror angle is the same angle but with the opposite sign. For example, if there is a bond with an erroneous angle of -185 degrees, change the forced angle to +175 degrees (360° - 185°).

Version 5.8D

The primary purpose of this version release is to correct a bug in 5.8C (and in previous versions of 5.8x) having to do with motor power when the machine is in Park Position during Automatic Mode. This function was meant specifically for the Toyota Interface. A change was made in 5.7x series software to reduce motor power during Automatic. This change was missed when writing the 5.8x series software. This change has now been implemented into 5.8D version.

Version 5.8C

1. All: DSP Timeout Error. Corrected a problem with an Autoline machine where themachine would stop with a “DSP timeout” error message when operating in auto runmode while the machine performed PR. Although the machine would recover when theoperator pressed any key, this error was not normal. The software problem was found andfixed.



4. All: Incorrect Default Front Cut Parameters. Incorrect default tail length parameters were


10/11/02

shown when front cut was selected. These have now been corrected to read “Minimum =0, and Maximum = 2000”.






Version 5.8B

1. All: The Bond Head did not move to the new Z Programmable Home after a file changewhen running Execution Lists. This was corrected and tested. The Bond Head now movesto the Z Programmable Home of its current Wire List each time a file has been loadedduring Execution List bonding.






10/11/02




Version 5.8A

The following bugs were previously corrected in version 5.8A.









b. Abort out.





3. All: ‘File names in link list are not updated.’ Corrected the problem so that now when a


10/11/02

file name is changed, the currently selected link list and execution list will be searched tosee if they contain the old name. If they do, a warning message will be displayed statingthe file is in the link list or execution list. An option is given of continuing the rename ofthe file, or aborting the rename attempt.










11. SW: ‘Error in Optical Offsets computation.’ In the Small Wire Optical Offsets calibra-


10/11/02

tion, the results were skewed towards the +180 degrees direction. The problem was cor-rected by averaging the +180 degrees and -180 degrees and using the result as one pointin the optical offsets computation













10/11/02






4/3/01

Applicable

Version 5.1.1 replaces the pre-release version of version 5.1. It contains all the elements of 5.1, and corrects a minor bug that was discovered and corrected before the official release of version 5.1. Version 5.1.1 software supports the Autoline M360C-HD configured to operate in a SECS/GEM environment. It corrects problems found during integration with the Autoline system.

Version 5.1.1 software replaces versions 2.7, 3.2 and supersedes version 4.1 and version 5.0. Version 5.1.1 for CHD’s will work with all models of Model 360C-H, 360C-HD Handlers, and multi head machines, consisting of three or more machines and transporters in tandem.

Objective

Like Software Version 5.0 which it supersedes, Version 5.1.1 software for the Handler enables the SECS/GEM communication protocol and includes functional improvements and bug fixes from previous versions. This software version will operate any combination of 360C-H, 360C-HD, or multi head tandem machine configurations.

Software version 5.1.1 carries forward inter-machine communication across any number of tandem machines.

No other software version is necessary for 3 or more head configurations.

Contents of Package

Software Release instructions for Handler Software Version 5.1.1

EPROMs:

! For Model 360C-H; (2) Magazine EPROMs (P/N 173702-1) & (1) Trans-port EPROM (173702-2)

! For Model 360C-HD; (2) Magazine EPROMs (P/N 173702-1) & (2) Transport EPROM (173702-2)

SOFTWARE RELEASE Version 5.1.1

ORTHODYNE ELECTRONICS SOFTWARE RELEASE 5.1.1 PAGE 1 OF 7

4/3/01

Compatibility

Version 5.1.1 requires revision B or later of the Transport CPU board. The Magazine handler EPROM will work in any revision of the CPU board.

NOTE: If you are upgrading from a software version earlier than 3.0, version5.1.1 requires both the new leadframe CPU board (P/N 173507 Rev B -or later) and interface cable (P/N 173646) to function properly. It is notnecessary to make these changes if you are already running version 3.0or later. This applies to the transport software only. The magazinehandler software will still work in the old CPU board.


Use the following instructions when the software current version being run on this bonder is not compatible with the new hardware that was just installed.

The software changes are resident on the EPROMs. The installation procedure requires that the new EPROMs replace the existing EPROMs.

To install Software Version 5.1.1, use the following procedure:


ESD WARNING: Always wear ground straps when handling the printedcircuit boards to prevent electro-static discharge from dam-aging any sensitive electronic components on the boards.

Magazine Handler:

2. Remove the back cover on the magazine handler to access CPU board 173507.Extract the EPROM from location U13 (see Figure 1 ) and replace with the newEPROM (173702-1).

NOTE: Make sure you install the new EPROM with the notch in the same orien-tation as the one you removed from the board.

3. Repeat the procedure for both magazine handlers.


4/3/01

Transport Station:

1. Remove the left front cover from the transport station (indexer).

2. The recommended approach for replacing EPROM (173702-2) is to remove theCPU boards (P/N 173507).

3. Remove the cables attached to the board. There are four connectors on the stan-dard board, and a fifth connector if the machine has a Pull Tester.

4. Remove the two (large) cap screws on the front of the bracket. Slide the board (andbracket) out of the frame. It may be more convenient to partially remove the boardin order to reach the Pull Tester connector (J6) located at the back of the board.

5. Replace old EPROM with new EPROM (173702-2) in slot U13. Note the orienta-tion of the notch of the old EPROMs and place the new EPROMs in the same ori-entation.

6. If the upgrade is performed on a Model 360C-HD, the EPROM (173702-2) mustbe replaced on both transport station CPUs.

7. Re-install the boards, re-attach the connectors, replace all covers, and power upthe machines.

8. The screen should read “Version 5.1.1” software.

Figure 1 Magazine Handler CPU / EPROM Location

EPROMLOCATION


4/3/01

Feature Changes

1. Version 5.1.1 allows “one-to-one magazine filling” from the Input Magazine tothe Output Magazine. Therefore, if the input magazine has only three leadframes,the output magazine will take those same three leadframes and then be unloaded.This option can be selected from the System Edit screen. The “one-to-one maga-zine filling” setting can be set to “YES” which enables the feature, or “NO”which disables the feature.

2. Version 5.1.1 supports three pulltest methods. They are: “Normal”, “Always”,and “Matrix”. The methods can be configured in the System Edit screen. Theoption can be set to one of the three choices described below:

! In Normal mode, the pulltesters will run anytime there is a device present, but not if that device failed PR. A device will be marked as “failed” in the device status data if either pulltester fails it.

! In Always mode, the pulltesters will always run, even if PR fails. A device will be marked as “failed” in the device status data if either pulltester fails it.

! In Matrix mode, the pulltesters will always run, however, the transport will stop or not stop based on certain conditions:

NOTE: Matrix can only be selected when both pulltesters are installed andenabled. Matrix is for use with multiple devices per index leadframes.

a) If a device fails PR, it is not marked as having failed pulltest unless both pulltesters fail.

b) If PR fails and both pulltesters fail, then the transport will stop and increment the first pulltester’s fail count.

c) If only one pulltester fails, the transport will not stop and will not count a pulltest failure.

d) If a device passes PR and then fails either pulltester, it is marked as having failed pulltest.

e) A pull failure will increment the count for the pulltester(s) that failed.

For Matrix pulltesting, PR fail data is not sent as part of the device statusdata. PR failures are used only to determine the outcome of the pulltesting.This feature is changed from version 5.0, which sent PR failure data as a partof the device status information. Because this might cause downstream ma-chines to skip devices where they should not, this data was omitted in ver-sion 5.1.1.

3. Version 5.1.1 supports the rear-load magazine, which is used to interface with theESEC Autoline configuration.


4/3/01

Operational Changes

Version 5.1.1 incorporates a number of changes to the operation of the handler as follows:

Main Menu Changes

1. The F4 key is now available for leadframe removal.

The system has been modified to allow the user to remove a leadframe from the machine, and to inform the system of this action. Pressing F4 brings up a dialog screen which specifies three leadframe removal possibilities:

" Before the clamp

" In the clamp

" After the clamp

Any leadframe on the input track which does not yet have any of its devices clamped, is considered to be before the clamp.If any of the devices in the leadframe are physically in the clamp, it is considered to be in the clamp.If all the leadframe devices have passed the clamp, it is considered to be after the clamp even if there are still devices of that leadframe that are in the pulltest queue.This leadframe removal feature revises the device status buffer data so it does not get out of synch with the physical parts.

NOTE: Removal of leadframes before the clamp on any but the first machine inline will also result in the input feeder being inhibited. This is to preventthe feeding in of a new leadframe before the user may have removed thespecified leadframe.

On these machines, once the leadframe has been removed, press F1 tore-enable input feeding.

System Edit Changes

Three parameters were changed/added in the System Edit screen:

1. Send part status to next machine.In order to support device status across multiple (3 or more) machines and one-to-one filling, this new parameter controls whether a given machine sends device failure information (pulltest or PR) to the next machine in line. (This parameter is not


4/3/01

available to the last machine in line.) When the parameter is set to “YES”, pulltest and PR information is included in the device status information sent down the line.When the parameter is set to “NO”, device status information is still sent to the next machine, but all devices are marked as “good”.

NOTE: For any machine to use the failure status of previous machines, allmachines ahead of it in line must have “Send part status to nextmachine” set to “YES”.

2. Enhanced the device status communication.

Device status communication allows the last strip of a magazine to be identified. (This requires that Device Status or One-to-one magazine filling communication to be enabled even if it is not being used for device status). In order to make this signal more robust and less prone to synchronization errors, device status is sent for an entire leadframe when the leadframe is fed from one machine to the next.

3. One-to-one magazine filling.

In version 5.1.1 the one-to-one magazine filling parameter controls whether or not the marker (indicating that a particular leadframe is the last one out of the input magazine) is sent to the next machine, along with the device status information. This parameter is available on all machines in line except the last one. Previously, this parameter was available only on the first machine.To activate one-to-one magazine filling, all machines in line must have “One-to-one magazine filling” set to “YES”.

4. Pulltest during manual index.

This feature is new in version 5.1.1 and controls the operation of the pulltester(s) during manual indexing. When set to “YES”, the pulltester(s) will operate during manual indexing. When set to “NO”, they will not.All devices manually bonded during manual indexing are marked as “Good”. No PR failures on devices bonded manually are included in the device status information. Pulltest statistics are updated just as they would be during automatic (or single cycle) operation.

Bug Fixes

1. Editing Elevator First Offload Position. Corrected a problem where when elevator first offload position was programmedand saved, the elevator would drive down to its lower stop and stall the motor


4/3/01

2. Spurious Kicker Operation at Bootup.Corrected a problem where Kicker would randomly run at startup.

3. Disable Input Enable / Disable control at Bootup.Removed display for Input Enable / Disable key for inline interface equipped ma-chines.

4. Clamp / Unclamp Legends in Main Menu.Corrected a problem in the clamp motor legend where it would incorrectly cyclefrom Clamp to Unclamp and back to Clamp when the clamp motor was manipulatedby hand.

5. Error in Default Pull Force in Manual Pull Cycle Screen.Corrected an erroneous default for gram force when entering the Manual Cyclemenu.

6. Incorrect Range for Output Queue Value.This bug was thought to be corrected in version 5.1. The Output queue field was tobe corrected to accept a value up to 25. The maximum length for either pulltestqueue was to be 24 (it had to be one less than output queue). During checkout ofversion 5.1, it was discovered that the problem was not completely cured. Version5.1.1 fully implements the correction as stated.


SPECIAL NOTE TO FIELD SERVICE PERSONNEL

The Model 360C and S series of bonders software revision 5.8X (versions A through E) contained new Functions and Feature Enhancements not available in previous 5.7J default software.

All these Functions and Features, summarized in this manual after the Software Release Notes, are contained in the latest Version 5.10. This summary describes these changes when upgrading from 5.7J to the revision 5.10 and this document should be reviewed thoroughly before preceding.

The 5.10 revision User Manual contains all this information for your reference and can be used for 5.8 Software Revision with acception of these additions:

• Adds additional bond counters for statistical data gathering

• Corrects the display of ALC pulltest data

• Preserves Password protection for copied files Corrects the compatibility of the Force CPU with an external interface

• Adds the display of “Cannot reach surface” error statement.

12/18/02

ORTHODYNE ELECTRONICS SOFTWARE RELEASE SW 5.10 FM6.FM PAGE 1 OF 4

ApplicableSoftware version 5.10 was developed primarily to implement password protection for copied files.

Version 5.10 is targeted to run on all variations of the M360 platform; standard large wire head, active clamp head, and small wire head. All combinations of hardware will be supported, includ-ing GSI and GSII PR, old and Universal I/O, and old and Universal generator.

ObjectiveSoftware version 5.10 adds a password protection feature to the software series 5.8X. All the functional features and corrections incorporated into the 5.8 series are included in the 5.10 ver-sion.

In summary, this software release:

Preserves Password protection for copied files

Adds additional bond counters for statistical data gathering

Corrects the display of ALC pulltest data

Corrects the compatibility of the Force CPU with an external interface

Corrects the error statement for “Hit surface unexpectedly”

Adds the display of “Cannot reach surface” error statement.

Corrects various bugs found in previous versions of 5.8x software.

Contents of Package(1) Floppy disk containing Version 5.10 (P/N 172518-1) (System).

(1) Software Release Instructions for Version 5.10.

SOFTWARE RELEASE Version 5.10

12/18/02


CompatibilityVersion 5.10 is backwards compatible with all previous machines that used 5.x series software. All combinations of hardware will be supported, including GSI (P/N 171507, 171562) and GSII (P/N 172802) PR, old (P/N 172532) and Universal (P/N 175512) I/O, and old (P/N 172567) and Universal (P/N 175507) generator.

NOTE: Wire lists created or edited on Version 5.10 cannot be run on software ver-sions earlier than 5.8. Once Version 5.10 is installed, editing and then saving aprogram created with a version earlier than 5.8A (or prior) will automatically updateit to the latest Version of 5.10. Therefore, the program will no longer be compatiblewith the earlier software versions. OE suggests that you make copies onto floppies ofWire lists created with earlier versions of software so that you can go back to runthose Wire lists when using an earlier version of software.


NOTE: Before you install the new software, print out a hard copy of the defaultwire parameters. With this software release, new default wire parameters will over-write the previous default wire parameters. Manually reenter the parameters you wantchanged to the default settings after loading Version 5.10.




3. Insert the new system disk (P/N 172518-1) in the data drive on the front of the bondercontrol drawer (D1). At the prompt, type “/d1/install” and press [ENTER].

4. When the installation process is complete (between 10 and 30 minutes), cycle power onthe bonder to restart the system. (Power must be cycled, rather than just typing “m360”because the OS-9 kernel must be reloaded due to updates to some of the system mod-ules.)





12/18/02


New FeaturesVersion 5.10

1. When a copy is made of the file, and if any of the menu items were password protected,the program will ask for the password before a copy can be made.

a. Wire feed check in the system parameters is added to the password menu.

2. Three additional bond counters and alarms are added to the Statistics screen. Eachcounter will have a separate clear and alarm level.

Corrected ProblemsThe following software problems were corrected in version 5.10.

1. An error was corrected in the “pulltest” data display in the Diagnostics Menu. In theDiagnostic Menu, under Pulltest Data, the data shown was not displayed correctly if morethan 50 pulltests were completed. The number of rows of data and the number of valuesper row are now shown correctly with the release of version 5.10.

2. Corrected a problem found in M360C with Force CPU board, equipped with ExternalInterface board, 40V interlock, and 5.8D software. A “System Error” would occur when“Fault Reset” was enabled.

3. If the bond head hits the surface unexpectedly, instead of displaying “[5] Hit SurfaceUnexpectedly", the machine error message would displays "[26] Position VerificationError." This was corrected.

4. Corrected a problem occurring during the cut move. If the surface was lower than thesecond bond surface (such as bonding on a pin), an error “[45] Unable to reach LVDTvalue at requested cut depth” should be displayed. This message was not shown. If thissituation occurred during auto-run, the bonder would jump into Rework with no errormessage. The Log File would show “[6] Stop Pressed” instead of error message [45].Version 5.10 will show the correct error message during bonding, and in the Log File.

5. Forced Angle First Bond, Stitch Bond and Second Bond limitations have been correctedto prevent erroneous and excessive Bond Head rotation. Wires that were created using5.7J would work correctly, but when transferred to 5.8C the same wire would receive anerror “[364] Excessive Bond Angle”. Software 5.10 fixes this problem.

6. Corrected a problem when using Chain Mode PR. In previous software versions, the firstPR was set to have an average model size and a large search area. The second PR was setto have a small search area, with FINE resolution. The first area search would result inmoderate correlation results (low 800s) but the Find location was good. The second areasearch would have correlation in the low 800s also, but would not find the correct PRspot regardless of how big the search area was made, or how good the model was. Thework-around solution was making the first area resolution MEDIUM. The first and

12/18/02


second area correlations would increase to the high 900s with the correct Find location.The penalty, however, was a longer Find time (sometimes as high as 20 ms.)

This was corrected in version 5.10. The work-around is no longer necessary.7. Small Wire Bond Head - Corrected a heel-break problem when bonding a wire list

created with 5.7J that was translated into 5.8x. The problem was traced to a compilingerror. The work-around solution was to delete the 5.7J generated wire list and re-write thewire list in the current 5.8x version software.

This problem was solved with 5.10. Wire lists generated with 5.7J can now be safely usedwith version 5.10 without degrading bond/heel quality.

8. Corrected a Formatting error. In attempting to check for a missing format command, theversion 5.8D software would interpret a floppy disk formatting error as if no commandwas executed. Version 5.7J could not detect a missing format command but would havegiven a floppy disk error code.

Version 5.10 fixes this problem.

NOTE: For a complete list of Features and Problem Corrections made to previousversions of 5.8x software, please contact Orthodyne Electronics.

3/31/03

ORTHODYNE ELECTRONICS SOFTWARE RELEASE 5.10 PAGE 1 OF 22

5.8 Software Revision SummaryApplicableThe Model 360C and S series of bonders software revision 5.8X (versions A through E) con-tained new Functions and Feature Enhancements not available in default software (5.7J). All these Functions and Features, summarized in this document, are contained in the latest Version 5.10. This summary describes these changes when upgrading from 5.7J to the revision 5.10 and this document should be reviewed thoroughly before preceding. The 5.10 revision User Manual contains all this information for your reference.

NOTE: Revision 5.10 is the default software is used on all new M360C produc-tion machines as of March, 2003. Software Version 5.9 was not released outsideOrthodyne.

Version 5.10 and 5.8X are designed to run on all variations of the M360 platform, Large Wire Bonder including the Active Loop Control Bond Head option and the Model 360S Small Wire Bonder.

New Features

ALC Machine1. ALC Pulltest Function Operable in “Rework”: The goal was to be able to use the ALC

pulltest function while in “Rework.” This added function allows the operator to collect allthe parts requiring rework automatically on the line. The operator can start the 360C in“Rework” to process all the parts. This requires the “Remote Pulltest Function” to beavailable when the machine is started in “Rework.” The “Remote Pulltest Functions” areavailable if the 360C drops out of automatic mode into “Rework.” This modificationmakes the “Remote Pulltest Functions” active in “Rework” at all times (if enabled).

2. This revision includes the addition of the “No Pulltest” feature to the Remote ALC Pullt-est.

SECS/GEMThis software supports an optional feature called SECS/GEM. This option requires additional hardware.

This acronym stands for “Semiconductor Equipment Communication Standard/Generic Equip-ment Model.” This communication standard allows a factory host computer system to interface with diverse components of equipment for automated process control. A typical factory layout is shown in the block diagram. Even though the various pieces of equipment are built by different manufacturers, if they adhere to the SECS/GEM standard, they will all have an interface stan-

3/31/03


dard that allows them to communicate with the host computer. This option can be purchased and will require additional hardware.


Execution ListThis version has an automatic mode that allows the execution of several wire lists in succession for each assembly. This new feature improves the capability to bond complex assemblies by linking together several smaller wire lists. The characteristics of this feature are described below:








3/31/03


.






(P/R)Die 2 (P/R)

Die 3 (P/R)

Die 4 (P/R)

Execution List

Wire List

Wire List

Execution List

Wire List

Wire List

Wire List

Wire List

Link List

OR

Execution List

3/31/03






2550105020No

Yes1

Yes

NEW

Start in Remote mode F13: Save parameters






90120

32351050

90120

34381050


2050

1040

10080

160153

20350

90



3/31/03









Feature Enhancements1. Area Statistics: The “PR List” area statistics screen was re-labeled to make it more intui-

tive to find.

2. (ALC Machine) Addition of “No Pulltest” feature to the Remote ALC Pulltest. Theremote ALC pulltest feature allows for two commands, “Pulltest” or “Proceed.” Thesecommands are issued remotely during bonding to allow for a remote handler to specify ifa bond should be pulltested.



LINK LIST EDIT

0: GJ E 5:

1: PR TEST -1_12 W 6:

2: PR TEST -1_33 W 7:

3: 8:

4: 9:

ARROWS F13: Save


F 16: Abort

Execution File

Wire List File

3/31/03


The enhanced feature adds a third command option, of Never Pulltest. The Never Pulltestoption allows the user to specify that certain bonds should never be pulltested regardless ofthe commands received during bonding. These selections are found on the second page ofthe WIRE LIST EDIT display.Enhancements introduced in previous Software Release versions are described in the fol-lowing sections.

3. (All machines) Camera Gain Calibration: This procedure requires an OE Camera Calibra-tion Box. Go to the MAIN MENU and type “VG”. This is a change from previous ver-sions where you would type “CGC”. With the Camera switch set to M, adjust the cameragain pot to have a VG reading according to the value on the OE Calibration Box. Allow afew minutes settling time.

Large Wire Machine4. Programmable Z Home For Tool Check: Adds a provision to bring the Bond Head to a

programmable Z home while in Tool Check and Tool Offsets calibration. Presently, if thehead is sent to its hard home, several key strokes are required to bring the Bond Headdown to programmable Z home. This feature significantly speeds up the process of cali-bration.


5. Forced Bond Angles Greater Than 90 Degrees: With this software version, the usercan program any bond angle to be used on the first bond. A warning message will appearin the WIRE LIST EDIT screen if the bond angle exceeds ±90° from the natural wireangle for a Large Wire bonder, and ±45° for a Small Wire machine.

6. Increase Generator Test Scale From 100 to 150: Increases generator test scale from100 to 150 to accommodate new low gain transducers. This will not change the expectedresults for current transducers. An explanation of the scale is added to the HELP screenfor the generator test.

7. Forcer/Focus Switch Message for Large Wire/Small Wire Changeover: Adds amessage when converting from small wire to large wire (and vice-versa) that the switchon the forcer/focus must be changed, similar to the generator high/low message dis-played at changeover.

Manual Positioning: 1. Renumber “Save” and “Abort” commands. In the MANUAL POSITIONING screen

the “Save” and “Abort” commands have been renumbered to be consistent with otherscreens. Now, [F13] will always be “Save” and [F16] will always be “Abort.”

3/31/03


2. Focus and LED Levels. The purpose of this screen is to set parameters for generalpurpose operations such as Lamp intensity and Focus. With this version of software, thelast Focus and LED settings are saved in NVRAM, so these values are available for anew file when you close the current wire list.


Small Wire Machine1. Remove Small Wire Bond Angle Limitation:


2. Small Wire Loop Settings:


3. Down Interval Parameter Included in Wire Parameters:


4. New Forcer Calibration for Small Wire:






3/31/03



ALC Machine1. ALC Pulltest Calibration Screen Cleanup. The Inline calibration screen is simplified

by removing all the numbers except for the force being calibrated.

2. Default Pull Test Time. The default pull test time was increased from 25 ms. to 30 ms.from previous software versions to allow more time for the pull test to adequately test theintegrity of the bond.

3. ALC Head Clamp Changes: This version of the software changes the action of the wireclamps to achieve a more reliable loop formation.

In the current software version, the clamps are closed during the cut and break move, andremain closed throughout the interwire moves up to the first search position of the next firstbond. This prevents the wire from accidentally slipping out of the tool groove during highspeed moves.To simplify keeping track of whether the clamp is open or closed, the clamp will be closedwhen entering and/or exiting the RUN MENU screen. All the clamp movements that were implemented in software version 5.7e remain the same,namely: Clamps always remain open from the top of the v-hop into the cut move. They arealways closed during the cut move.

4. Pull Test Enabled As Default: In this version of the software, the pull test function isalways enabled when an ALC head is installed on the machine. Consequently, the “Pulltest enabled” field in the SYSTEM CONFIGURATION screen is no longer present.Now, you will always have a field in the WIRE LIST EDIT screen called “Pull enabled”where you can choose whether you want to pull a particular bond on each wire. Since theWIRE LIST can be protected with a password (but the SYSTEM CONFIGURATIONscreen cannot), this new function will prevent accidentally cancelling a pull test.

5. Pull Test Data: A new function is added to the DIAGNOSTICS MENU that allows youto see LVDT values corresponding to pull displacements. These values are displayed in anew screen that is accessed by selecting the “Pull Test Data” in the Diagnostic Menu, oryou can press [F6]. If a pull test fails, the word “FAIL” will appear next to the LVDTvalue for that bond.

3/31/03




6. Handler Interface Extensions For ALC Pull Test Control: Additional function exten-sions are added to the Remote Mode for Pull Test control. Details for this feature areincluded in the ALC Pulltest Remote Control Specification portion of the Model 360C/SPeripheral Equipment Interface Specification Manual, dated November 2001 or late.

Pattern Recognition (PR)New functions have been added to the PR system to simplify the programming of complex,multiple devices on a substrate. These new functions are described below. In addition, otherrefinements incorporated into the PR system are also described.

PROGRAM NAME


DIAGNOSTICS MENU


*(ALC Only)




F16 Abort

Pull Test Data

PROGRAM NAME

Pull microns

48

27

F15: Clear data

F16: Abort

3/31/03



Defining the location of the assembly also defines the position of all devices, sincethey are all fixed to the same assembly. It is not necessary to PR the substrate area foreach device. (Device PR is not required).

Bonds on the substrate can be tied to the entire Assembly PR by selecting assembly asthe area in the Wire List.

The camera X and Y location of all areas contained within all devices will be updatedaccording to the found position of the Entire Assembly PR.





The above sequence saves programming effort and execution time because it eliminates theneed to perform PR to locate each device.With Entire Assembly selected, when you now execute the Wire List associated with thefirst repetitive pattern, the machine will do one PR search to locate the substrate, and thenPR search the individual areas of the repeat pattern. This eliminates the PR search time offinding each repeated PR pattern.PR List is the standard PR List edit which is the same as in previous software versions.Selecting the Device/Assy PR Edit menu opens another menu where the user can make thefollowing selections:



3/31/03



4. Failed PR Action “Conditional PR”


Manual assistSkip deviceSkip failed area








c. If the Assembly PR passes and the Device PR passes, but multiple PR Areas withinthe Device fail using Skip Failed Area enabled, the bonder will continue to reference

3/31/03


all PR areas within the Device before stopping. Any wire associated with a “legal”PR Area (meaning successfully found using pattern recognition) would be bonded.



5. PR Failure Condition Examples:


3/31/03




PR failure in Remote mode — machine stops for assistance, Unless“Skip PR Assist in Remote” was set to YES. This option overridesthe selection of Failed PR action in the ASSIST POINT EDITscreen and skips to the next device.




*[assist]


X2:Y2:Name:




0MANUAL ASSIST

NEW

TOGGLEARROWS

F13: Save

F16: Abort

3/31/03






*[assist]


X2:Y2:Name:




0SKIP DEVICE

NEW

TOGGLEARROWS

F13: Save

F16: Abort

3/31/03







*[assist]


X2:Y2:Name:




0SKIP FAILED AREA

NEW

TOGGLEARROWS

F13: Save

F16: Abort

3/31/03




This software version allows the editing of PR Areas or Wire List positions on any devicewithin an assembly. This means that you can use any device position to edit PR areas ormodify wire positions. In previous software versions, you could only make such changeson device #1.Previous versions of the software required that all edits of PR or Wire Lists be performedon the first device. This meant the user would have to swap devices so edits could be per-formed on clean, unused devices.In the software version, the user is prompted to target any device within an assembly beforeentering PR or Wire List. It is important to note that the device locations can only bechanged in the Device List.You can edit any of the devices shown on the screen. Move the cursor to the desired devicenumber and press START. This will open the PR LIST EDIT screen to edit the device.



Device 1 2 3 4 *

X: 527 4180 7842 11501Y: 956 1034 1113 1193Z 3612 3625 3659 3721



3/31/03


7. General PR Operations




8. Chain Mode Selection: The Chain Mode can be enabled by toggling a field in the Expertscreen. When you save the file, this parameter is stored in NVR so it will stay enableduntil you disable it, even when you change files, or power down the machine.

9. Line Find Improvements: There are a number of refinements made to the Line FindMode to make the programming easier to use and understand.









3/31/03




Turn pixels ON/OFF using the SPACE BAR

Copy a pixel shade using the [F14] key

The “Paste Super Pixel” function only appears after you select(F14) “Copy super pixel.” Otherwise, it is turned off. You pastethe selected shade onto another pixel using the RETURN key.

Turn all pixels on simultaneously using [F12]

As you perform manual pixel editing, if you select too few pixels, a warning message,“Too few pixels in model” will appear at the top of the data monitor.When Thin Model is selected and you are looking at a model, all the pixels that are“not” selected will turn black. This will highlight the model and place the unselectedpixels in a black background. You must be sure that the significant “selected” pixels arenot black or this feature will make the model unreadable.







3/31/03




.

Run Mode1. Rework: The Rework functionality was improved by increasing the range over which the

SPINNERS could reposition the first bond. The procedure for making a bond locationcorrection in Rework is shown below:

PROGRAM LOG







3/31/03



Wire List1. Separate Display For Stitch Bond Trace Data: Pressing [F2] will bring up Bond Trace

data. With this version, you can assign stitch bonds to a separate bond group. Previouslyyou could only assign bonds to a group for either first or second bonds. Now you canassign stitch bonds to a separate group to examine those as well.

File Management2. Transfer Files, Password Protect, Supervisor Password: During Transfer File opera-

tions, password protected files can be transferred over pre-existing files by using theSupervisor Password disk without having to re-enter the supervisor password for eachprotected file. That is, entering the supervisor password once will suffice for the rest ofthe transfer operations.


Statistics1. Bond Trace Display For Multiple Devices:


2. Second Bond Counter:


ZIP Drive EnhancementThe ZIP drive option was introduced with Software Version 5.7b. This software version enhances the functionality of the ZIP drive. The mass backup and restore functions remain the same as before, but functions are now added to make the ZIP behave similar to the /d1 floppy. For convenience, the Overwrite All and Supervisor Password features have been implemented for Transfer files.

3/31/03






Doc# Date Description DC04-172483 9/2002 SECS Gems Supplement

DC04-173024A 11/2002 Universal Tooling Supplement

DC04-172444 2/2002 PR System GS II & GS IIA Supplement

DC04-170041B 5/2000 Autoline Supplement

DC04-170874 9/2000 Device ID Sensor

DC01-175000A 2/2002 Small Wire User’s Supplement

DC04-177000C 11/2001 ALC Supplement

DC04-176000A 9/200 Mis-Index Supplement

DC04-176000C 10/2000 Reel-To-Reel Supplement

PR SYSTEM GS II & IIA

SUPPLEMENT

MANUAL No. DC04-172444

Software Version 5.7J

ISSUE DATE: February, 2002

Orthodyne Electronics Corporation

16700 Red Hill Ave

Irvine, California, U.S.A. 92606-4802

Telephone (949) 660-0440

FAX 949-660-0444

E-mail [email protected]

All Rights Reserved.

Copyright 2001 by Orthodyne Electronics Corp.

Products described in this publication are covered by one or more Orthodyne US and foreign patents.

F O R W A R D

Table 1: Revision History

Date Revision Content

02/15/02 D GSII PR Board (172802) is superseded by GSIIA PR board(72-32737).

Z:\GEORGE\WORK\Special Projects\GSII Supplement\Text\GS_IIcvr.fm

New PR GSII Supplement

TABLE OF CONTENTS

PREFACE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iWhat’s New In GS II &IIA i

INSTALLING NEW PR VERSION GS II. . . . . . . . . . . . . . . . . . . . . . . . . . 1-1Introduction 1-1Installation Instructions 1-1

Install Software 1-1Replace Printed Circuit Boards 1-2Step A: Rework Instructions for Camera Cable (P/N 172635) 1-5

Step B: Replace Camera Cable (P/N 172635) 1-8

PROGRAMMING WITH THE NEW PR SYSTEM . . . . . . . . . . . . . . . . . . 2-1Programming With Pattern Recognition 2-1

PR Made Simple 2-1How PR Works 2-2

Programming the PR List 2-4Illustrating PR 2-4Defining the PR Areas 2-5Selecting the Eye Point 2-7Selecting the Find Mode 2-10Define The Model 2-10

Set the Capture Box Position 2-11Set the Capture Box Size 2-11Capture the Model 2-11

Editing the Model Portion 2-12Search Box 2-12Find Resolution 2-13Using Correlation 2-13Reference Point 2-14Quality Threshold 2-15

Linked Eye Point 2-16Assist Point Edit 2-18Where Do You Go Next? 2-20

Additional Find Modes 2-21Dual Point 2-21Edge Mode 2-23Line Mode 2-26Chain Mode 2-31

PR Enhancement Tools 2-33Expert Screen [F5] 2-33Model Pixel Editing 2-34

Using the “Thin Model” Tool 2-34Manual Pixel Editing 2-35

Enhanced Video Tools 2-37Histogram Equalization 2-38Exploded Image 2-38

GS II Supplement TOC-i

TABLE OF CONTENTS

Binary Image 2-41Alternate Eye Points 2-41

Creating a PR Offset Point 2-42The Wire List 2-43

Creating A Wire List 2-45Editing The Wire List 2-46A Final Note To Remember 2-47

Editing Bond Position 2-47Editing Parameters 2-48

Add A Wire 2-49Delete A Wire 2-49Add A Bond 2-49Delete A Bond 2-50Delete/Undelete 2-50

Stitch Bonds 2-50

TESTING AND OPTIMIZING THE PROGRAM . . . . . . . . . . . . . . . . . . . . 3-1PR List Testing 3-1Wire List Testing 3-2Optimizing A Program 3-4

Optimize Pattern Recognition 3-4Optimize For Speed 3-5Optimize For Accuracy 3-6

GS II Supplement TOC-ii

PREFACE

The subject of this supplement to the M360C User’s Manual is the newPattern Recognition (PR) System, GS II & IIA.

The GS II & IIA PR system was released by Orthodyne in the Fall of 1997.The system is being installed on all new Orthodyne M360C family of wirebonding machines, and is available as a retrofit kit for prior-built wirebonders.

The GS II & IIA Supplement describes how to install the hardware andsoftware for the system, and gives you information on how to use the newfeatures.

Orthodyne recommends you keep this supplement with your M360C User’sManual for ready reference.

The GS II PR System incorporates new hardware and software that gives youimproved functionality, simpler user controls, and generally greater PRspeed. The new PR is better able to handle parts with low contrast featuresand undesirable artifacts that could confuse previous PR systems.

The hardware design takes advantage of faster, more capable chip sets toconsolidate the Frame Grab board and the Digital Signal Processing boardinto one. The higher degree of circuit integration in the new design allowsfor in-line, pre-processing for image enhancement.

The static RAM Frame Grabber, operating in a 32 bit processingenvironment, lets the system do more processing in less time.

The software uses a more logical organization of User screens, minimizingthe operator choices in creating a PR program. Commands and fields that areused frequently are presented in the default page, while less-frequently usedfields for image enhancement and other special situations are contained in aseparate “expert page” screen.

The GS II & IIA includes a new function called “Image Enhancement”. Thiscommand field gives you a number of options to deal with parts that havelow contrast, or other features and anomalies that might cause unreliable“finds”.

Whats New In GS II & IIA

GS II & IIA SUPPLEMENT i

Whats New In GS II & IIA PREFACE

The new Image Enhancement tools in the GS II & IIA allow you to:

Reduce the effects of lighting and contrast variations

Enhance edges for better definition

Mask or reduce visual anomalies

Increase through-put by decreasing PR “find” times.

A new mode called “Line Find” has been added to the system (in addition tothe other four modes you are accustomed to). This new mode is very usefulfor locating edges of inconsistent surfaces like Direct Bonded Copper(DBC).

In the latest implementation of the PR board, part number P/N 172802 wassuperseded by P/N 72-32737. This change was effective 2/15/02.

ii GS II & IIA SUPPLEMENT

Introduction

C H A P T E R 1

INSTALLING NEW PR VERSION GS II & IIA

Introduction

This document describes the procedure for installing PR Version GS II &IIA. This Pattern Recognition version requires board replacements, a cablerework or change, and will work with Software versions 5.6b through 5.7h.Current machines have version 5.7j installed. The current GS II kits are alsoshipped with version 5.7j. New PR Version GS II & IIA is compatible withall CPU’s and I/O boards applicable to Model 360C and 360S machines.

ApplicableAll Model 360C and Model 360S family machines.


CAUTION: Before you install the new software, observe the followingprecautions: Copy the Master wire parameters to a floppy disk usingthe Transfer File command. The new software will write anew set of Master Wire Parameters to your hard drive. Tokeep your original Master wire parameters (especially ifyou customized the list), simply transfer the Master wireparameters back from the floppy disk to the hard drive afteryou install the new software. Copy all existing programs onto a floppy disk.



Install Software

GS II & IIA SUPPLEMENT 1-1

Replace Printed Circuit Boards INSTALLING NEW PR VERSION GS II & IIA

3. Insert the new system disk in the data drive on the front of the bondercontrol drawer (D1). At the prompt, type “/d1/install” and press[ENTER].

4. When the installation process is complete, cycle power on the bonder torestart the system. (Power must be cycled, rather than just typing“m360” because the OS-9 kernel must be reloaded due to updates tosome of the system modules.)

NOTE: It may be necessary to clear the system RAM and reload defaultvalues ONLY if any problems are experienced after installing thenew version. Use the following procedure:


6. When the “System RAM Corrupt” screen displays, select “D” to reloaddefaults.

7. All machine calibrations must be performed again (limits, touch sensor,forcer, offsets, etc.). Also, any handler, printer, and system parametersmust be re-entered.

Replace Printed Circuit Boards

1. Shut off power to the bonder.

2. Open the VME drawer and disconnect the camera cable (P/N 172635)and the video cable (P/N 708211) from the front of the Frame Grabboard (see Figure 1-1 ).

CAUTION: Wear grounding straps when handling the printed circuitboards to prevent static electricity build-up in your bodyfrom damaging sensitive electronic components on theboards.

1-2 GS II & IIA SUPPLEMENT

Replace Printed Circuit Boards

Figure 1-1 Disconnect Camera and Video Cables

3. Remove the Frame Grab and DSP boards from the card cage.

4. Disconnect the CPU Breakout board from the P2 backplane (drawing#172000, view M_M). See Figure 1-2 . You do not need to disconnectany cables or wires from the CPU Breakout board.

Figure 1-2 Remove CPU Breakout Board

DSP BoardFrame Grab Board

Camera Cable (P/N 172635)

Video Cable (P/N 708211)

CPU Breakout Board


Replace Printed Circuit Boards INSTALLING NEW PR VERSION GS II & IIA

5. Loosen and disconnect the blue 5V wire and the black ground wire fromthe P2 backplane (see Figure 1-3).

Figure 1-3 Disconnect Blue 5V Wire and Black Ground Wire From the P2Backplane

6. Remove the six screws holding the P2 backplane in place and remove.

7. Install the new P2 backplane (P/N 172832) using the P2 connector onthe CPU to align the new backplane board and fasten it using the hard-ware supplied in the kit (Items 11, 14, and 15 designated in drawing#172444). Install the CPU Breakout board onto the new P2 Backplane.

8. Install the new PR board (P/N 72-32737) in the card cage slot next tothe CPU board. Connect the video cable (P/N 708211) to the PR board.Do not connect the camera cable (P/N 172635) at this time.

9. Install the filler panel (P/N 172246-3) in the empty slot in the VMEcard cage between the new PR board and the Motor Drive Interfaceboard.

10. Affix the new VME card cage label over the existing label (see Figure 1-4).

Black Ground Wire

Blue 5V Wire

P2 Backplane


Step A: Rework Instructions for Camera Cable (P/

Figure 1-4 Affix New Label to VME Card Cage

There are two options for the camera cable (P/N 172635):

Rework the cable (using Step A), or replace it with the cable sup-plied in the kit. Modifying the cable will require some solderingskills and will take about ½ hour to complete.

Replacing the cable will require hand tools and will take about 1½hours to complete (using Step B).

NOTE: If your camera cable is Rev. C or higher, you will not need torework or replace your cable. Rev. C cables can work with GS Ior GS II. You do not have to change cables.

Camera cable (P/N 172635) must be modified to correctly function with thenew Pattern Recognition GS II & IIA. Follow the procedure below to modifythe cable. You will need to solder two wires together using wire strippers, asoldering iron, and solder with flux to complete this modification.

1. Locate the camera cable P4 connector at the VME card cage. Removethe plastic cover from the end of the cable by removing the three smallscrews (see Figure 1-5).

Step A: Rework Instructions for Camera Cable (P/N 172635)

Label


Step A: Rework Instructions for Camera Cable (P/N 172635) INSTALLING NEW PR VERSION GS II & IIA

Figure 1-5 Remove Plastic Cover From P4 Connector

2. Carefully cut back about 1½”(38mm) of the gray wire insulation (seeFigure 1-6). Unwrap the foil covering to expose the wires. The wirewithout insulation is the “drain wire.”

3. Locate the black, line ground wire that ends at Pin 2 (see Figure 1-7).Using wire strippers, strip a ¼”(6mm) section of insulation from thewire about 1¼”(32mm) from the P4 connector. This part of the wire iswhere you will solder the drain wire (the wire without insulation).

Figure 1-6 Approximately 1¼”(32mm) from the P4 Connector,Strip ¼”(6mm) of Insulation from the Black, Line Ground Wire at

Pin 2

Drain Wire

Strip off 1/4" (6mm) of WireInsulation

1 1/4" (32mm)

Black, Line Ground Wire atPin 2

P4 Connector


Step A: Rework Instructions for Camera Cable (P/

Figure 1-7 Pin 2 Location

4. Solder the drain wire to the stripped portion of the black, line groundwire (see Figure 1-8).

Figure 1-8 Solder the Drain Wire to the Black, Ground Wire

5. Wrap the foil back around the wires. Replace the gray outer insulation.Wrap a small amount of electrical tape around the cable to hold the grayinsulation in place.

6. Replace the plastic cover. Using a black permanent ink marker, recordthe new revision level on the cable label (Revision C).

7. Plug the camera cable into the new PR board.

8. Turn on the power to the bonder. If camera functions properly, closeVME drawer. If camera does not function properly, proceed to step #9.

Soldering Iron

Black, Line Ground Wire

Solder

Drain Wire


Step B: Replace Camera Cable (P/N 172635) INSTALLING NEW PR VERSION GS II & IIA

9. If camera does not function properly, turn off the power to the bonderand check all connections. After checking all the connections, turn onthe power to the bonder and check camera function. If camera func-tions properly, close VME drawer. If camera doesn’t function properly,call your Orthodyne Electronics Field Service representative for furtherassistance.

Refer to Drawings #172000 and #172003

1. Remove the rear panel from the bonder (item 18, #172000). Remove therear base cover (item 43, #172000) and top cover (item 44, #172000)from the bonder assembly.

2. Start to remove the camera cable at the P4 connector end (at the VMEcard cage). Cut off any cable ties and remove from any plastic clips asyou work your way up the cable.

NOTE: Take note of where you remove the cable ties from so that youmay replace them in the same location upon reassembly.

3. Remove the stiffener bracket from the bottom of cat track (item 152,#172000)

4. Remove the two cable clamps (item 153, #172000) at each end of thecat track (item 123, #172003). Remove the outer covering from the cattrack to gain access to the camera cable. By placing a finger into the toplink of the cat track you will be able to start removing the outer cover-ing (see Figure 1-9). Push the top link out and carefully continue toremove the links all the way down the cat track.

Step B: Replace Camera Cable (P/N 172635)


Step B: Replace Camera Cable (P/N 172635)

Figure 1-9 Remove the Outer Covering From the Cat Track

NOTE: The links in the outer covering are fragile and need to be removedcarefully.

5. Disconnect the camera cable from the camera and remove cable fromthe plastic clips inside the bonder assembly. Remove the camera cablefrom the cat track.

6. Connect the new camera cable to the PR board. Run the cable backalong the route up toward the cat track. Run the cable through the cattrack and into the bonder assembly. Place cable into the plastic clips andloop the cable as shown in Figure 1-10. The camera should be in thefull downward position when making the loop.

Figure 1-10 Loop Camera Cable As Shown

Push Out The Top Link

3" (76mm)


Step B: Replace Camera Cable (P/N 172635) INSTALLING NEW PR VERSION GS II & IIA

7. Turn on the power to the bonder. If camera functions properly, turn offthe power to the bonder and finish the cable routing by tying the cameracable in place and attaching any plastic clips that were removed.Proceed to step #10. If camera does not function properly, proceed tostep #8.

8. If camera does not function properly, turn off the power to the bonderand check all connections. After checking all the connections, turn onthe power to the bonder and check camera function. If the camera func-tions properly, turn off the power to the bonder and finish the cablerouting by tying the cable in place and attaching any plastic clips thatwere removed. Proceed to step #10. If camera doesn’t function prop-erly, call your Orthodyne Electronics Field Service representative forfurther assistance.

9. Replace the outer covering and plastic cable clamps (item 153) on thecat track. Replace the rear base cover (item 43) and top cover (item 44)onto the bonder assembly. Replace the rear panel onto the bonder (item18). Close the VME drawer.



C H A P T E R 2

PROGRAMMING WITH THE NEW PR SYSTEM

This chapter leads you through the steps to program PR with your new GS II& IIA system. We go through the basic steps of writing a PR program, andthen introduce some of the advanced features of the GS I & IIA.

The Pattern Recognition (PR) program provided with your machine allowsyou to teach the bond head to automatically search for and find designatedlocations. This feature performs the same functions as programming withManual Assist Points, except it does it automatically. Once properlyprogrammed, this feature will greatly speed up the entire bonding process,and is the heart of high-UPH, production wire bonding.

The following sections will step you through the systematic procedure forprogramming PR. You will be shown the simplest approach first, and thenhow to program using more advanced features.

But first, let us start with a simple explanation of how the Orthodyne patternrecognition system works. This overview perspective of the program willhelp you to understand the controls and choices you will make later in the PRprogramming screens.

The picture you see on the monitor is a magnified image that comes from thevideo camera mounted above the Z-tube. What you see on the screen is thecamera FOV (field-of-view). The center of this FOV is the camera location.You can move the camera location about using the Spinners.

The Figure 2-1 below represents three important areas you work with in PR.The screen is the picture on the video monitor. This is the largest picture areathe PR system will have to work with. The desired PR location must bewithin the screen.

Programming With Pattern Recognition

PR Made Simple

GS II SUPPLEMENT 2-1

How PR Works Programming With Pattern RecognitionPROGRAMMING WITH THE NEW PR SYS-

The search area is a smaller portion of the total screen where you will lookfor the PR designated location. The search area can be almost as large as thescreen, but this will probable result in the search taking a very long time.You will be able to adjust the size of the search area in one of the PRscreens.

The model is a small digitized image of a unique portion of the part that willbe saved in memory when you "capture" the model. The model will bescanned across the search area to "find" the best match, which is the desiredPR location.

Figure 2-1 The Main Parts Of PR

Important. The Model must be unique.

You will be able to adjust the size of the model in one of the PR screens.You will soon see that it is important for the model to be unique.

If the model is not unique, then when the PR system scans the model aroundthe search area, it may find more than one location that matches the model.This is not good, because the PR system may not always go to the samedesignated location. Hence, the bond would not be in the location youwanted.

In this section, we describe what happens when you capture a model, howthe system scans the model around the search area, and how the PR systemdetermines that it found the designated location you programmed.

How PR Works

ScreenSearchArea

Model

Crosshairs

The Part

CameraEye Point

2-2 GS II SUPPLEMENT

Programming With Pattern Recognition How PR Works

The M360C pattern recognition system is an area correlator type. Theprocess begins by digitizing the video image. This means the picture in thescreen is divided into small segments called "pixels", and each pixel is givena number from 0 to 256 depending on the brightness of the image at thatspot. The array of numbers that represents the picture is stored in memory.(In a future section we will describe how you can speed up the PR process byusing "super pixels".)

When you "capture" a model, the system works in a similar way. A digitizedimage of the model is captured and stored in a permanent memory. Later,each time you perform a PR search, it will use this model.

When you command the system to do a PR "spot", the PR system lays themodel over the picture in memory, starting at the upper left corner. Itcompares the brightness value of every pixel to those below it. Thesecomparisons are entered into a complex mathematical equation called acorrelation function. The correlation process evaluates each comparison forquality of the match, and assigns it a quality value.

The model is moved one pixel to the right and the process is repeated, eachtime placing a value in another memory map as a "correlation result" in thecorrelation memory. When it reaches the end of the row, it moves down onepixel and starts at the left again until the entire search area has been scanned.

Once the results of the comparisons are all in the correlation memory map,the system looks for the location that has the highest value. The systemdesignates this location as a "find", and an overall quality value is given tothe correlation result. Ideally, there should only be one point in the searcharea that matches the model, and the correlation value should be high. Moreon these subjects later.

Key Thought: The objective of setting up a PR area is to find thedesignated PR location in the shortest possible search time.

Setting up Pattern Recognition on the Model 360C involves many differentconsiderations. Besides locating a unique feature on the part, there are majorissues to consider to minimize recognition search time and maximizeaccuracy:

What PR areas and eye points are needed?

What features on the object are suitable for pattern recognition?

How much can search time be minimized without compromisingthe accuracy of the find?

These issues will be addressed in the following sections on creating the PRprogram. The program is called the "PR List".


Programming the PR List Programming the PR List PROGRAMMING WITH THE NEW PR SYSTEM

This section describes the procedure for setting up the Pattern Recognitionfor the device you wish to bond. The procedure is illustrated using an actualdevice, going through the steps to make and edit a PR List.

The Model 360C Wire Bonder uses the new Orthodyne GS II & IIA VisionSystem. Many controls and tools are included in the system to adapt to awide variety of devices typical of the applications suited for the Model 360CWire Bonder. The examples shown in this section were selected to illustratethe operation of the system. They do not represent the only kind of objects towhich you will apply PR.

Figure 2-2 shows a picture of a typical part where PR is required to find theindividual bond locations. We will use this part to illustrate the PR steps. Inthis case PR is necessary because the location of the die within the part canvary from part to part due to stack-up of manufacturing tolerances. Also, thesmall size of the bond pads requires that the wire bonds be precisely located.

Figure 2-2 Typical Part Used to Illustrate PR Procedure

The procedure you will use to program PR involves a series of actions thatwill be very much the same for all parts (we will cover some of thevariations later). We will describe the basic steps, and then go into moredetail on the variation you may encounter depending on the specificapplication.

IMPORTANT:Set up programmed Z Home before PR in Manual Posi-tioning because of the distance of the head from the part caninfluence the lighting effect on the image.

Programming the PR List

Illustrating PR


Programming the PR List Defining the PR Areas

First you define all the pattern recognition search areas.

Next you will define the eye points parameters.

Select the Find Mode.

Go to MODEL EDIT and capture the model.

Set the size of the Search Box.

Choose the Search Resolution.

Do the PR Spot.

Check Correlation Results, set the Reference Point, and set QualityThreshold.

Select a Linked Primary Point (corrects for possible rotation ofpart).

Set the Assist Point (an aid to help you locate the spot if PR fails).

Save Area.

The order of the areas determines the order of pattern recognition operations.All PR Areas on a device are numbered in the order they will be recognized.This has no effect on the order in which the bonder will bond the wire; thewire list determines that order.

NOTE: The order of pattern recognition should be a logical, well thoughtout path that reduces the overall XY travel required for a com-plete part find.

1. From the MAIN MENU press [5] to go to the EDIT MENU, then accessPR LIST by pressing [5] from the EDIT MENU. Figure 2-3 shows thescreen you will see on the data monitor. The top left corner of thescreen contains the name of the file and the Default Wire Parameter set.

The PR areas appear in order on the PR LIST EDIT screen. Thenumbers of the areas will appear in the top row, labeled "Area". Youwill be able to view up to nine Areas on the screen, but you can scroll tothe right to see more. The asterisk in the Area row means there are noPR areas in the list for this file.

Defining the PR Areas


Defining the PR Areas Programming the PR List PROGRAMMING WITH THE NEW PR SYSTEM

Figure 2-3 PR List Edit Screen

To generate a PR Area:

2. Press [F14], [STOP], or [ENTER] to insert an area into the list. Thenumber (1) will then appear in the Area field on the screen. A newscreen will appear called the PR AREA EDIT as shown in Figure 2-4,on page 2-6. Now you can select an Eye point in this area by movingthe cursor to the Eye Pt field.

Figure 2-4 PR Area Edit Screen

PROGRAM NAME PR LIST EDIT LOG 1

Area [ * ]EyePt

F13: Save list

ARROWS F14: Insert area

F16: Abort edit

File Name PR AREA EDIT LOG 1LINK File Capture has not been performed for model 1(if used)

AreaEyePt

[ 1 ][ primary ]

*assist

Camera X,YCamera focusLED 1,2Linked eyeptFind mode

-652712

NoPOINT

1728 NOTE: The [STARTbutton is not active untilyou capture a model.

---REGION 1 ---

Model NumberSearch boxFind resolutionReference pointQuality thresh/result

1Position SizeFinePosition850 / 0

ARROWSPAGE

F5: Expert screenF6: Image enhancement

STARTF13:

PR spotSave area

F11: Cursor to camera X, Y F15: Delete eyept

F16: Abort area


Programming the PR List Selecting the Eye Point

When you move the cursor from the Area/EyePt region of the chart to theEye Point region (below the line), the screen will automatically change to theEYE POINT EDIT screen described below.

The EYE POINT EDIT screen shown in Figure 2-5, on page 2-8 seems tocontain a lot of information, but basically contains three main sections: area,eye point, and model.

Area - is a unique bonding surface made up of one or more eyepoints and manual assist points. The Area number defines thesearch sequence.

Eye Point - is a unique location within the area and contains themodel, search parameters, and search mode.

Model - is the stored image used as a template in the searchroutine.

The following procedure steps you through the command fields in theEYEPOINT EDIT screen where you define each of the above three elements.

1. Press the [DOWN ARROW] on the Key Pad or Keyboard to movedown to the Eye Point portion of the screen for editing the eye point. Asyou move the cursor down, you can change the values by enteringnumbers through the keyboard, or toggling.

Selecting the Eye Point


Selecting the Eye Point Programming the PR List PROGRAMMING WITH THE NEW PR SYSTEM

Figure 2-5 The Eye Point Edit Screen

2. While the cursor is highlighting the Camera X,Y field, use the spinnersso the device features you want to use for PR appear in the camera'sfield of view. Press [F14] to mark the X, Y location.

Figure 2-6 shows the corresponding appearance of the video monitor. Thepart will appear magnified compared to the picture of the part in Figure 2-2,on page 2-4 so you can select the eye point for PR.

3. Move the cursor down to the Camera focus field with the [DOWNARROW] to adjust the focus so the picture in the video monitor issharp. The focus can be adjusted using the Y Spinner, or you can enter anumber through the keyboard and press [ENTER]. The range ofnumbers in this field will be from 1 to 15. Press [START] to advance,or Arrow down.

File Name EYE POINT EDIT LOG 1LINK File Capture has not been performed for model 1(if used)

AreaEyePt

1[ primary ]

*assist


-652712

NoPOINT

1728

---REGION 1 ---



Y SPINNERTOGGLEARROWS

F5: Expert screenF6: Image enhancement F14: Mark position

F11: Cursor to camera X, Y F15: Model Edit

F16: Abort

Area portion ofscreen

Eye Point portionof screen

Model portion ofscreen

F15 appears whenthe cursor is onModel Number


Programming the PR List Selecting the Eye Point

Figure 2-6 Video Monitor View Of Part For Eye Point Selection

4. LED1 and LED2 control the intensity level for the lamp cluster. LED1controls the left side, LED2 controls the right side. To change, enter thedesired intensity level (0 through 7) or turn the Y Spinner to decrement/increment. Press [START] or Right Arrow. Repeat for LED 2. Press[START] to advance.

NOTE: With fluorescent lights installed, the LED1/LED2 field is notfunctional.

5. Linked eyept, this field defaults to No indicating standard single pointPR operation. On devices or assemblies requiring two-point PR spots(for example to correct for part rotation), press [TOGGLE], or [SPACE]to toggle to Yes. Yes means the next eye point is linked to the currenteye point. When two eye points are linked, only the first eye point ofeach pair will have its linked field marked Yes. Press [DOWNARROW] to leave this field at No.

HINT: To avoid unnecessary movement of the bond head when linkingeye points, complete the edit of the primary eye point first withthe “Link eye point” field set to “No”. Then go to the Alternateeye point and complete that edit. Finally, return to the Primaryeye point and set link to “Yes”.

Another alternative we will discuss later is the use of Dual Point mode ifboth features fit in the same camera field of view.

6. Press [START] to advance to Find Mode.

Capture BoxSearch Area


Selecting the Find Mode Programming the PR List PROGRAMMING WITH THE NEW PR SYSTEM

Now you are ready to select the Find mode for pattern recognition. TheOrthodyne vision system has five modes to choose from. The proper choicewill depend on the part, the lighting conditions and many other variables.Try different modes until you find the one that works best for your situation.

In this particular example, we will use Point mode.

NOTE: Find modes include – Point, Dual Point, Line, Edge, and Chain. Youwill find additional information about these modes in the nextchapter.

1. Select the Find Mode by toggling through the available choices. Pressthe [TOGGLE] button, or the Space Bar on the Keyboard to select Pointmodes.

2. Press [START] to advance the Model region.

Press the [DOWN ARROW] to move the cursor to the Model Number field.Each model must have its own unique number. The Model Number fielddefaults to the next number available. You can override with any unusedModel Number from 1 through 99.

1. Press [F15 - Model Edit] to go to the MODEL EDIT screen (see Figure2-7).

Figure 2-7 Model Edit Screen

Selecting the Find Mode

Define The Model

File Name MODEL EDIT LOG 1LINK File Model capture required before save(if used)

Model number:Super pixel size:

Model description:Capture position H,V:

Capture size H,V:

14MODEL 1[ 241 ], 21121, 91

1728

SPIN BOXARROWS

F8: Use thin model [ NO ]F9: Edit model

START:

F14:

Mark position

Mark position

F11: Model display [ ON ] F15: Capture model

F16: Abort


Programming the PR List Set the Capture Box Position

With the cursor at the Capture position H,V field in the MODEL EDITscreen, use the spinners to move the capture box over the feature you want touse as the model. The position that is important is the upper left-hand cornerof the box. This position is fixed and size adjustments are always to the rightand down. The coordinates show on the screen. Press [F14] or [START] tomark the position.

With the cursor at the Capture size H,V field, use the spinners to set the sizeof the Capture Box (spinners will adjust the lower right coordinate of thebox). Press [F14] or [START] to set the size of the box.

Press [F15] to capture the model. The captured image appears in the upperright corner of the video monitor. Figure 2-8 shows the video monitor withthe PR model inset in the upper right corner.

NOTE: The displayed image will appear digitized even without anyadvanced image enhancement techniques. You may view (only)the model at different super-pixel resolutions by togglingbetween 2, 4, and 8 with the cursor on the super pixel size field.You will choose the resolution later in a different screen.

.

Figure 2-8 Capturing the PR Model

2. Press [F13] to SAVE the model. This action will also bring you back tothe EYE POINT EDIT screen.

Set the Capture Box Position

Set the Capture Box Size

Capture the Model

PR Model

Capture Box

Superpixel size

ModelNumber


Editing the Model Portion Programming the PR List PROGRAMMING WITH THE NEW PR SYSTEM

3. If you leave the screen without pressing [F13] to save the model, youwill have to repeat the process.

There are several parameters you can adjust to edit the PR Eye Point in orderto get a high quality, consistent PR spot. Parameters include setting the sizeof the Search Box, adjusting the Find Resolution, and defining a ReferencePoint.

Figure 2-9 Eye Point Edit Screen With Model Selected

The next step is to set the size of the search box. The size of the search boxshould be:

Editing the Model Portion

File Name EYE POINT EDIT LOG 1LINK File Find time: ____ms(if used)

AreaEyePt

1primary

*assist


-652712

NoPOINT

1728

---REGION 1 ---


[ 1 ]Position SizeFinePosition750 / 720



START:F13: Save

F10: CorrelationF11: Cursor to camera X,Y F15: Model edit

F16: Abort

Search Box


Programming the PR List Find Resolution

Large enough to locate search features within their positionaltolerances (package position, die placement, etc.).

Small enough so the system does not locate "false" features.

Small enough to be quickly searched.

1. Move the cursor to the Search Box Position field using the [DOWNARROW]. Use the [SPINNERS] to set the position of the upper lefthand corner of the Search Box. This maneuver is similar to the one usedto set the Capture Box. Press [START].

2. Similarly set the size of the Search Box and press [START] to save thisparameter. The cursor will advance to the Find resolution field.

1. The Find resolution field is a toggle field. The choices are Fine,Medium, and Coarse. These resolution parameters correspond to Super-pixel sizes 2, 4, and 8 respectively.

2. Make the selection using the [Space bar] or the [TOGGLE] button onthe Keypad.

3. Press [START] to advance to the Quality threshold field. We will domore with this later.

NOTE: The cursor will skip over the Reference Point field at this time. Itwill become active later.

Correlation is a very useful tool to show you the uniqueness of your model.As the model is scanned across the image in the search box, the systemcomputes a correlation value, which is a measure of the quality of a match.

1. Press [START] to perform the PR Spot. A successful "find" will show asmall cross in the capture box on the monitor.

2. After a successful find, press [F10] to bring up the correlation function.This is an extremely useful tool that shows the "strength" of the PR spotby showing you the correlation "scores" over the search region.

3. Set the correlation threshold to a large number (using the instructions onthe screen). Observe the bright area in the PR spot window as youchange this value. You should see a small white spot. The spot shouldbecome smaller as the threshold increases in value.

Find Resolution

Using Correlation


Reference Point Programming the PR List PROGRAMMING WITH THE NEW PR SYSTEM

Figure 2-10 below illustrates what happens when you change the correlationthreshold value. If the spot remains large as the threshold is increased, itindicates that a valid find could be anywhere in the PR spot area. This is notgood. Edit the PR model and try again. You may have to adjust the capturebox size and location and recapture the model. Multiple spots are bad, too.

Figure 2-10 Illustration of Correlation Function

4. Use the [Left/Right ARROW] key to change the correlation qualitythreshold up/down. Press [SHIFT]+[ARROW] to change the correla-tion value by x10.

NOTE: The maximum value is 251

5. Increase the Correlation Quality threshold to show only the top 20% to30% (values from 180 to 200) of the PR spot to see if the PR findappears as one small spot. If not, edit the model and try again.

6. Press [F13] to return to the Eye Point Edit menu.

The crosshair that appears in the monitor when you have a successful PRspot is the location of the center of the PR model. The location of thecrosshair is an important indicator of the consistency of the Eye Point.However, the default location of the crosshair may not be the mostconvenient for this purpose. You may manually choose another position forthe crosshair that is an easily identified feature of the device.

Reference Point

Model

Search Box

Scan Lines

Threshold Level

CorrelationValues

Correlation PeakT

hre

sho

ldA

xis

0

251


Programming the PR List Quality Threshold

1. The Reference point field lets you choose a point where the crosshairwill appear upon a successful PR find. After a successful PR spot, press[UP ARROW] to move the cursor to the Reference point field.

IMPORTANT:Keep the Reference Point within the Model Area to avoidconfusion in case the part has a large rotation error.

2. Use the [SPINNERS] to choose a convenient point within the ModelArea that will make it easy to check the repeatability of the find after aPR spot.

NOTE: Access to the Reference point field can occur only if there hasbeen a valid PR find.

The video monitor crosshairs will be over the Reference point for EyePt1. InDUAL POINT and EDGE, the X1, Y1 will be region 1's Reference point,X2, Y2 will be region 2's Reference point (you can use the SPINNERS inEYE POINT Edit to move the Reference Point to an easily identified featureas shown in Figure 2-11.

Figure 2-11 Reference Point Position.

At Quality Threshold field, you can specify a quality value for the PR find tobe considered successful. The quality value of the PR spot appears in theQuality Result field after a find.

Quality Threshold

Search Area

Reference Pointis at an easilyrecognized spotin the model


Linked Eye Point Programming the PR List PROGRAMMING WITH THE NEW PR SYSTEM

1. Move the cursor to Camera X,Y field (or press [F11]), and use theSPINNERS to move the eye point around inside and outside the SearchBox. Observe and note the Quality Threshold number while pressing[START] to make repeated PR finds.

The best technique for setting the Quality Threshold is to note the QualityResults as you move the Search Box around. Select a value that is lower thanthe smallest value when the PR spot is "good" and higher than the highestQuality Result value of a "bad" PR spot. A good PR spot is when thereference point is on the selected position. A bad PR spot is when it islocated anywhere else. Also, the crosshair should not bounce around whenyou do repeated PR spots, without moving the camera XY.

The ideal condition you are looking for is that there should be no false PRfinds when the search area is moved far from its nominal position. Better toget no PR find than to get a false PR find.

2. Cursor to the Quality threshold field and enter the quality value asderived from the above discussion.

3. Go back to Camera X, Y and move the eye point around to retest as youpress [START].

4. Press [F13] to save. You will go back to the PR AREA EDIT screen.

When using POINT mode, it is important to establish a Linked eye point tocompensate for any rotational position errors on the die. You will addanother eye point in the opposite corner of the die from the primary eye pointyou just established.

When you save the last designated eye point, the cursor will move from thePrimary field to the Assist point field in a screen titled PR AREA EDIT. Toadd additional eye points for this area, press [F14]. This will add an eye pointcalled Alternate 1, and shift the Assist Point over one column. The screenshould appear as in Figure 2-12 .

With the cursor on the Alternate 1 position, press the [DOWN ARROW] tomove into the parameter field region of the screen.

Linked Eye Point


Programming the PR List Linked Eye Point

Figure 2-12 Adding A Linked-Primary Eye Point

The screen will change to an EYE POINT EDIT screen, where you canprogram the values of the Alternate 1 eye point just as you did for thePrimary eye point (see "Selecting the Eye Point", on page 2-7).

When you finish programming the Alternate eye point and press [F13] tosave, you will again see a screen like in Figure 2-13 . The cursor will beover the "Assist" point field. Now you can change the Alternate 1 eye pointinto the Linked-Primary eye point.

1. ARROW left so the cursor is on the Primary eye point.

2. ARROW down so the cursor is on the Link field, and toggle to selectYES.

3. Press [F13] to save. Now the Alternate 1 will change to say Link-Primary on the screen.

4. When you press [START] to PR spot, the head will jump from the firstPrimary eye point to the Link-Primary eye point.

File Name PR AREA EDIT LOG 1LINK File Model capture required before save(if used)

AreaEyePt

1primary

*[ Alternate 1 ] Assist


-652712

NoPOINT

---REGION 1 ---


[ 1 ]Position SizeFinePosition750 / 720



START:F13: Save


F16: Abort


Assist Point Edit Programming the PR List PROGRAMMING WITH THE NEW PR SYSTEM

The purpose of the Assist Point is to enable the system to orient itself (withthe help of an operator) to the part, if the PR system is unable to perform asuccessful find using any of the eye points in a PR Area. You must providelocation information, when prompted by the PR ASSISTANCE REQUIREDSCREEN. In essence, you will perform a "manual" PR by going to a point onthe device that you will designate as an "Assist" point, and pressing[START].

NOTE: Refer back to "Programming With Manual Assist Points" as arefresher.

There are two techniques for designating Assist points. One technique usesthe Reference points you specified earlier when defining the primary andlinked-primary eye points.

You may choose this method by scrolling to the "Use reference point" fieldin the ASSIST POINT EDIT screen, and toggling to YES. If you choose thismethod, and the system fails to find a good PR spot, the system will expectyou to place the crosshairs over the pre-selected Reference points.Remember to change the names of the reference points, and the linktolerance when you use this method.

The second method allows you to select a completely different set of Assistpoints, independent of the Reference points. To use this method, use thefollowing procedure.

1. Put the cursor in the “assist” field, shown in Figure 2-13, and press[ENTER or Down Arrow]. You will then be able to program the param-eters for the Assist Point by scrolling through the parameter fields andentering values just as you did for the Primary Eye Point.

Assist Point Edit


Programming the PR List Assist Point Edit

Figure 2-13 Assist Point Edit Screen

2. Scroll cursor to "Use reference point" and toggle this field to NO byusing the Toggle button or the Space Bar.

3. The bonder requires you to identify two points on the object. Thesepoints could be two corners, bond pads, fiducial marks or any otherfeature that is repeatable. Use the spinners to position the video monitorcrosshairs over an easily recognizable feature on the object. This featuremust be repeatable and accurately placed in both X and Y relative to thePR Area. Press [F14] or [START] to mark the position.

4. You may also name the Assist points. The name will appear on the PRASSISTANCE REQUIRED screen and remind you which point wasselected. For example, you can name the point "bond pad 1," or "fidu-cial mark," or "upper right corner," or any other appropriate name. Thedefault is "First assist point" or "Second assist point." Position thecursor at Name and override the default, if desired. The name canconsist of up to 40 alphanumeric characters.

When running the part, if the PR ASSISTANCE REQUIRED screen appearson the data monitor, use the spinners to position the crosshairs over thefeature selected in step 3. The reference name provides clarification.

5. Move the cursor to "Link check tolerance" and enter an appropriatevalue.



*[ assist ]


X2:Y2:Name:

Link check tolerance:



0

SPIN X YARROWS

START:F13:F14:

Mark positionSaveMark position

F16: Abort


Where Do You Go Next? Programming the PR List PROGRAMMING WITH THE NEW PR SYSTEM

When the system is using the Assist point to locate the part (because PR wasunsuccessful), a check is made to determine if the distance between the firstand second assist points are within an acceptable tolerance. The valueentered in this field is in microstep units (0.12 mils/microsteps).

With hybrid thick film substrates, a typical link check tolerance might be avalue greater than 100 microsteps. For semiconductor die, a typical linkcheck tolerance might be 15-30 microsteps. You should base the number youput in this field on the fabrication tolerances of your device.

6. Press [F13] to save the assist points, and press it again to save the area.The PR AREA EDIT screen will appear on the data monitor. Repeat theentire procedure for additional PR areas.

7. When you are done programming, press [F13] repeatedly until you savethe PR List.

The next step to complete your program is to create the Wire List. Togetherwith the PR List, these two topics make up a complete program file.

You have a choice as to what to read next. If you want to learn more aboutPR, then continue reading the following sections in the order presented. Ifyou want to complete your program file, skip ahead to the section on creatinga Wire List.

Where Do You Go Next?


Additional Find Modes Additional Find Modes

The introduction to PR said there were five "find" modes. The previoussection covered the "Point" mode is some detail. This section describes theadditional find modes available. Each of these modes was developed tohandle particular PR issues in order to satisfy the PR needs of a wider rangeof application.

In the Dual Point find mode, you will select two search regions in the sameeye point. This means the search regions must be within the same camerafield-of-view.

This Find mode is useful because two “searches” are performed in a single XY table position, thus all the information is provided to calculate the Thetaangle of the reference. Use this mode when the rotation tolerance is aconcern.

Dual Point find mode serves the same purpose as linking two single eyepoints, except it is faster because there is no head movement between points.However, Dual Point is more limited than linking two Point eye pointsbecause both points must be in the same camera FOV, whereas Linked-Primary eye points can be separated beyond the camera FOV.

In Dual Point spotting, you will select two regions in the same eye point. Thefirst region provides the XY position of the object. The second regionsearches for another unique feature on the object and provides the correctionfor any rotational misalignment. Thus, very accurate positioning of all bondson the object can be obtained.

The EYE POINT EDIT screen for Dual Point is shown in Figure 2-14, onpage 2-22.

Additional Find Modes

Dual Point


Dual Point Additional Find Modes PROGRAMMING WITH THE NEW PR SYSTEM

Figure 2-14 Dual Point Screen

When you compare this screen to the Point Mode screen, you will noticethey are identical except that there is a "Region" field for the second point.

Leave "Linked Eye Point" to NO

Follow the same procedures as described for Point Mode, first definingModel 1, and then Model 2.

The appearance of the video monitor for this mode is shown in Figure 2-15 .

Figure 2-15 Dual Point Video Monitor


AreaEyePt

1[ primary ]

*assist


-6527127NoDUAL POINT

1728

---Region 1-- --Region 2--


1Position SizeMediumPosition750 / 920

2Position SizeMediumPosition750 / 920



START:F13:

PR spotSave


F16: Abort


Additional Find Modes Edge Mode

The screen will show two search area boxes, and two model capture boxeson the same monitor screen. The first set can be manipulated when the cursoris in the Region 1 model portion of the EYE POINT screen. The second setwill become active when you advance the cursor to Region 2.

Edge Mode is useful when linear features are easier to distinguish and moreaccurate than a pattern on the die. In this situation, the PR system will searchfor two linear features (edges) using a correlation process. The search modewill find many points with high correlation values within the search area.The system will then form line segments by connecting these points.

The program performs a similar search in the vertical and horizontaldirections to form two line segments. The line segments are extended tointersect. This intersection determines the XY location of the PR find, whilethe angle of the vertical line determines the Theta reference.

The EYE POINT EDIT screen for Edge mode is similar to Dual Point mode,except the two model regions are labeled Vertical Edge and Horizontal Edge,as shown in Figure 2-16 .

Figure 2-16 Edge Mode Screen

Edge Mode


AreaEyePt

1[ primary ]

*assist


-6527127NoEDGE

1728

---VerticalEdge-- --Horizontal Edge--

Model NumberSearch boxFind resolutionReference pointPoint required/foundQuality thresh/result

1Position SizeMediumPosition25 / 49750 / 720

2Position SizeMediumPosition25 / 36750 / 720



START:F13:

PR spotSave


F16: Abort


Edge Mode Additional Find Modes PROGRAMMING WITH THE NEW PR SYSTEM

The appearance of the video monitor is shown in Figure 2-17. You will seetwo rectangular search area boxes at right angle to each other. One is forfinding the vertical edge, and the other the horizontal edge.

Figure 2-17 Video Monitor For Edge Mode

1. Move the cursor to the Vertical Edge region of the model portion of thescreen.

2. Put the model capture box on a portion of the vertical linear featureusing the X and Y Spinners. The model box dimension should benarrow in the direction of the search, and wide enough in the orthogo-nal direction to cover the linear feature.

In this case the model should not be unique, because you want the model tofind many points along the edge feature. The more points you find along theedge feature, the more accurate will be the line.

3. Adjust the size of the search box to cover a substantial portion of theedge feature. The width of the search box should cover the expectedangular variation from part to part.

4. Follow the same procedure for the horizontal edge.

5. Advance the cursor to the "Point required/found" field and press[START] to PR spot.

6. Press [F10] to see the correlation results.

You will see a series of lines along the respective edges with small bumpsrepresenting the highest correlation of the edge along each scan line. Thesearch box shows the collection of lines that matched the model.

Horizontal Search Box Horizontal Model

VerticalSearch Box

VerticalModel


Additional Find Modes Edge Mode

7. In the correlation screen, turn on the "Show points" by pressing [F10].Increase the value to 251. The small crosses on the screen represent thepoints found along the edge feature. You should see many crosses in astraight line along the edge.

The program draws a "best fit" line through the points to define the edge.

The video monitor shows the calculated lines, extended to an intersection.The intersection is the XY location of the find point.

8. Define the "Reference point" position as you did for Point mode, exceptyou will be moving the whole line to a more convenient location. Theline is drawn throught the center of the reference point.

9. Set the "Use reference point" field to NO in order to define your Assistpoints. You may define any two Assist points anywhere on the part justlike you did in Point mode.

There are three considerations to verify a correct find in Edge mode. First,find the parameter "Points required/found" in the EYE POINT EDIT screen.The number of points required is programmable. The default value for thisparameter is 25. The number of points found results from the correlationsearch of the model. If the points found are less than those required, you willget a PR failure.

The "Quality thresh/result" field is the other factor to consider to verify acorrect find. The threshold for Edge mode works a little different than forPoint mode. In Point mode, you got the best results when there was only oneunique correlation peak as the result of a search. With Edge mode, you wantmany correlations along the edge. How, then, should you set the threshold?

The quality result displayed in the EYE POINT EDIT screen is the mean(average) value of all the edge points found along the line over the qualitythreshold. Changing the Quality threshold value raises (or lowers) theminimum acceptable quality result. Raising the quality threshold willeventually lead to a decrease in the number of points found.

If the model is good, increasing the threshold should result in finding pointsmostly along the line. Balance this against the Points required.

The third quality check is slope tolerance. "Slope tolerance" in the Expertscreen is another quality check that determines how close to 90° the twoedge lines must be before the system declares an error and indicates "No PRfound."


Line Mode Additional Find Modes PROGRAMMING WITH THE NEW PR SYSTEM

The Line Find mode resembles the Edge mode in appearance only. Itoperates on a totally different principle. Line Find is not model-correlationbased. Rather, this method searches along operator-selected lines in the videoimage looking for significant changes in surface texture or pixel value. ThisFind mode is suited for examples such as: crossing dark bands, or thetransition from a smooth surface to a rough surface (going from a die to aDirect Bonded Copper substrate).

Figure 2-18 shows an example of the Line Find mode on a DBC trace in adevice. In the past, the mottled nature of DBC traces made it difficult to finda reliable PR model. The Line Find mode handles this situation very well.

Figure 2-18 Line Find Mode On DBC

The Line Find search is conducted along two horizontal and two verticallines. Each search line will find a single point when crossing a contrastingborder. The two points (one from each line) are connected to define an edge.

When successfully completed, Line Find will locate a vertical and ahorizontal edge, the intersection of which becomes the PR find point. As inEdge mode, the angle of the vertical line gives you rotational information.You can select where the search lines will be on the object, and the directionof the search along these lines.

Generally, the technique works best when going from a smooth surface to arough surface, or when going from a lighter appearing surface to darkersurface. A schematic representation of an object on which Line Find is usedis shown in Figure 2-19 .

The thin black horizontal pair of lines and the thin black vertical pair of linesrepresent the search paths. The arrows shown in the black rectanglerepresents the direction of the scan along the search lines.

Line Mode


Additional Find Modes Line Mode

Figure 2-19 Line Find Elements on Monitor

Choose the direction of scan to go from the most uniform surface to therougher surface. Or, as in this example, if you are looking for a transitionbetween a light and dark surface, choose the scan direction to go from thelighter to the darker surface.

The Line Find algorithm looks for the most uniform segment in the first halfof each line and begins the search there. It adapts to the brightness level andlocal image texture within this segment before looking for a significantchange. When it finds a large abrupt change, the algorithm will declare a findat that location on the scan line.

Following are some suggestions to help you use Line Find mode. The Linefind mode usually works best when the image is enhanced, as described inthe “Enhanced Video Tools” section, page 2-37.

The procedure steps relate to the parameter field on the EYE POINT EDITscreen shown below:

In this illustration, the screen shows that you are in PR Area 1, and you aredefining the primary eye point.

Horizontal SearchLines Find VericalEdge

Find Point

Object

Horizontal Line Find

Direction of Scan forVertical Search Lines

Direction of Scan for Horizontal Search Lines

Line FindVertical



In this illustration, the screen shows that you are in PR Area 1, and you aredefining the primary eye point.

1. Toggle the Find mode to “Line”.

2. The Search line field allows you to set the position and size of thesearch line for both the Vertical and Horizontal edges. The length (size)of the lines should reflect the position uncertainty of the object. Thefurther apart the lines, the more stable the angles of the found edges willbe. Roughly the first 1/3 to 2/3 of the search line should lie on thesearch surface.

3. Search direction field can be toggled so you can start the search direc-tion depending on the search mode requirements.

4. Search mode can be toggled to the following choices: WHT, DIE,DBC, and THRS.

WHT: This is the only mode that will work when you are search-ing for a transition from a very dark surface to a lighter one.

HYBRID1 (AL10 (250)) EYE POINT EDIT

Area [ 1] *EyePt [ primary ] assist

Camera X,Y [-450] , 512LED 1 , 2 6 , 6Linked eye point No

Find mode Line

- - - Vertical edge - - - - - - Horizontal edge - - -

Search lines Position Size Position SizeSearch direction RIGHT and UPSearch mode THRS

Transition width 4 Pixels 4 PixelsQuality thresh/result 750 / 785 750 / 850F5: Expert screen START: Advance

F6: Image enhancementY SPINNERTOGGLE F11: Cursor to Camera X,Y

F16: Abort


Additional Find Modes Line Mode

NOTE: You could also engage “Exploded Image” enhancement featureand reverse the image so dark becomes light and then use anotherSearch mode. This is explained later in the “Enhanced VideoTool” section, page 2-37.

DIE: Use this mode when you are on a lighter surface searchingfor a dark transition (for example, a dark band around a die).

DBC: This mode is primarily intended for detecting a transitionfrom a uniform surface to a chaotic surface (like found with DirectBonded Copper).

THRS: Use this mode when you are searching for a transitionfrom a light surface to a surface or band that is always much darkerthan the beginning search surface. (DIE mode is similar but isintended for more subtle transitions.)

5. Transition width should be less than but close to the transition bandyou are looking for. The choices are: 2, 4, 8, or greater than 8 pixels.The transition width is the number of pixels required to cross the transi-tion line in order to detect an edge.

NOTE: You may get false finds if the transition width is chosen nar-rower than any dark spots on your search surface. However, youmay fail to find consistently if you set the transition width toowide. In this case, the pixel value transition you want to find willbe ignored by Line Find.

6. Quality threshold applies to the quality of the edge in between thesearch lines.

7. Press [F5] to enter the “Expert” screen.

The edge is searched in between the search lines with several small searchlines, to test the straightness of the edge. This is compared with thecalculated line between the two found edge points on the major search lines.

8. Set the Threshold level so the threshold curve crosses near the middleof the pixel value change at the transition you want to find (use [F10] tosee the pixel value graph). This is illustrated in Figure 2-20.



.

Figure 2-20 Examples of Threshold Selections

9. Die rotation is normally set to 0 degrees. Use 45 degree for diemounted near 45 degrees.

10. Rotation tolerance defines how much the actual edge angles may varyrelative to the Die rotation command.

11. Slope tolerance has the same definition as in Edge mode.

12. [F10] provides you with a graphical representation of the calculationmade by Line Find mode. Figure 2-21 illustrates what you would seewhen you press [F10].

Figure 2-21 Example of Pixel Value Curve Threshold Curves

Wh

ite

Bla

ck


Additional Find Modes Chain Mode

The jagged curve illustrates the pixel values for a rough surface. The dashedline below the pixel value curve is the threshold curve calculated by the LineFind algorithm. The two vertical bars represent the Transition width chosenin the Expert screen.

Even though the pixel curve crosses the threshold curves in several locations,these are not considered “finds” because the number of consecutive pixelsthat exceed the threshold are less than the Transition width. A “find” isdeclared when the pixel curve crosses the threshold for a number of pixelsgreater than the Transition width. This is shown on the figure by a triangle.

An Edge is determined by calculating the line that joins the “find” locationson each of the two scan lines.

The Find Point is the calculated intersection of the horizontal and verticaledges found according to the process described above.

Chain Mode is enabled in Expert Screen.

Chain Mode is useful when looking for a small, or detailed, feature in a largearea. A CHAIN eye point localizes the region where the search feature maybe found.

In a CHAIN, there are two search regions. In the first region the PR systemsearches for a gross, but not sufficiently accurate, feature. This informationdirects the PR system where to search more accurately in a smaller searcharea for the desired feature. The find location of the first point defines thesearch area for the second point.

While this mode seems to resemble Dual Point, the significant difference isthat you will search in two areas but you only end up with one PR point (theone in Region 2), just as if you used Point mode.

The appearance of the video monitor for this Find mode is shown in Figure2-22 .

Chain Mode


Chain Mode Additional Find Modes PROGRAMMING WITH THE NEW PR SYSTEM

Figure 2-22 Chain Mode Video Screen

When programming in CHAIN mode, you will use the following procedure:

1. Enable the Chain mode to YES from within the EXPERT screen. (Press[F5] to go to the Expert screen.)

2. Program Region 1 as usual, with normally a large search area andmodel with a medium or coarse resolution.

3. The search area for Region 2 a small size around the part feature youwant to capture as the model. Normally use a fine resolution.

4. Set up the Model for Region 2 in the usual way.

5. Program the Region 2 as usual.

6. The Reference point will only apply to Region 2.

7. Program Assist point as you would for Point mode.

If rotation is required, you can link a second eye point to the chain eye point.

NOTE: When linking two eye points, they do not have to use the samefind mode. For example, a Chain mode eye point can be linked toa Point mode eye point.

Search Region 1

Model 1

Search Region 2

Model 2


PR Enhancement Tools PR Enhancement Tools

Version GS II for PR places the most commonly used PR fields andcommands on the first PR EDIT screen you will normally encounter. Thecontent of these screens should be sufficient for most of the PR programmingyou will need to do. Other commands that are used less frequently can befound on the EXPERT screen, described below.

Press [F6] from the EYE POINT EDIT screen to bring up a series of imageenhancement tools. These tools can be used to change the way the imageappears on the screen by adjusting the contrast distribution of the video.

From the MODEL EDIT screen, you can modify the actual pixel structure ofthe model with two different commands; the "Use thin model" automaticallyselects a subset of pixels from your model (similar to compressing animage); another set of commands allows you to remove or add individualpixels from your model. Both of these commands will reduce the search timefor performing a PR find.

Pressing [F5] when in the Eye Point Edit screen will bring up the "Expert"screen. You will find commands on this screen that are used infrequently.The content of the screens will vary depending on the Find Mode selected.For example, for Point Mode the screen will look as follows:

Toggle between Equation 2 and Equation 1 and observe the effect on FindTime, and the stability of the PR spot. Equation 1 works well when there is alot of detail in the model, and the scenery is dull. It does not work well inhigh contrast areas.

PR Enhancement Tools

Expert Screen [F5]

EXPERT SCREEN, Point Find

Equation utilized: Accurate (Eqn 2) or Fast (Eqn 1)

Chain mode: Disabled

TOGGLE F13: Save

ARROWS

F16: Abort


Model Pixel Editing PR Enhancement Tools PROGRAMMING WITH THE NEW PR SYSTEM

Equation 2 is a more precise equation. It works well in distinguishingbetween subtle differences in the image, and is less affected by high contrastareas than Equation 1.

Notice that the control field to "Enable" or "Disable" Chain mode is on thisscreen. Chain mode is useful when looking for a small feature or detail in alarge search area.

Each Find mode has an Expert screen. The dialogue portion in the screenwill vary according to the mode. The table below show the expert parameterfield for the rest of the find modes.

Press [F8] in the MODEL EDIT screen to use “thin models” for pixelthinning. This tool automatically selects an initial subset of pixels for the PRmodel.

NOTE: To get to the MODEL EDIT screen, go the EYE POINT EDITscreen and place the cursor on the Model Number field. Thenpress [F15].

Model thinning is very useful for reducing the time required for a PRcorrelation of fairly large PR models by eliminating nonessential pixels.Manual editing is also available to optimize the correlation further.

Dual Point Edge

Equation utilized: Accurate (Eqn 2)Chain mode: DisabledDual pt. tolerance: 25

Equation utilized: Accurate (Eqn 2)Chain mode: DisabledDirection: 0 degreesSlope tolerance: 5

Line Chain

Threshold level: MEDIUMDie rotation: 0 degreesRotation tolerance: Up to 15 degreesSlope tolerance: 5

Equation utilized: Fast (Eqn 1)

Model Pixel Editing

Using the “Thin Model” Tool


PR Enhancement Tools Manual Pixel Editing

Figure 2-23 shows an enlarged view of the PR model with the reducednumber of pixels selected by the software. The Pixel Thinning tool is used inconjunction with manual pixel editing.

Figure 2-23 Pixel Thinning applied to PR Model

After model thinning, additional editing of individual pixels might benecessary to optimize the correlation of the model and reduce the timerequired for PR.

Manual Pixel Editing

Pixels SelectedBy SoftwareWhen ChoosingThin Model

Cursor


Manual Pixel Editing PR Enhancement Tools PROGRAMMING WITH THE NEW PR SYSTEM

Figure 2-24 Example of Manual Pixel Editing

Figure 2-24 shows the results of manually selection pixels, optimally placedfor PR. There are two pixel-editing features in the new PR; pixels may beturned on/off (thinning), or they may be assigned a different contrast value.Compare Figure 2-23 and Figure 2-24 to see that some pixels were turnedOFF, and others turned ON to give the result shown in Figure 2-24.

To edit pixels, press [F9] from the MODEL EDIT screen. This will bring upa screen titled, “Model Thinning and Pixel Value Editing”, shown below.Use the ARROW keys on the Keypad or Keyboard to move the cursoraround the model. The cursor (the small black square shown in Figure,moves in steps to the center of each pixel shown in the model).

To remove (or add) active pixels, move the cursor using the ARROW keyson to the desired pixel in the model, and press the SPACE bar. When you doso, you will notice the dashed outline around the pixel will disappear (orappear), indicating it is inactive or active.

To change the contrast value or color of a pixel, move the cursor to a pixelyou want to copy and press [F14]. Then move the cursor to the pixel youwant to change and press the RETURN key (from the Keyboard).

Pixels Manually Edited(Darkened) To EliminateLighter Colored Pixels.

Manually SelectedPixels


PR Enhancement Tools Enhanced Video Tools

Advanced image processing techniques are included in PR version GS II toenhance the video shown on the monitor and to improve the accuracy oflocating objects. These new tools can be used to improve the video clarity ofcertain types of devices, thus making it easier to determine reliable PRmodels. Compared to previous versions of PR, these video enhancing toolsresulted in reducing “PR fail” errors on difficult to find PR spots on somedevices.

Press [F6] from the EYE POINT EDIT screen. Use the [Space Bar] or[Toggle button] to select among the following Enhancement tools: Normalimage (this is the default value), Histogram Equalization, Exploded Image,and Binary Equalization.

To illuminate the effects of the Enhanced Video Tools, a series of "before"and "after" images were taken of various parts which exhibit the benefit ofthe enhancement tool.


ARROWS - move cursor

SPACE BAR - toggle pixel on/off

F14 - copy color

RETURN - paste color


F16: Abort edit

Enhanced Video Tools


Histogram Equalization PR Enhancement Tools PROGRAMMING WITH THE NEW PR SYSTEM

This tool changes the contrast distribution in the video to enhance whatmight be a low contrast image. Histogram equalization changes the contrastvariation of the image from a limited range to a uniform distribution fromfull black to white. The normal image shown on the left in Figure 2-25 isdark and lacks significant contrast (even with optimized lighting), whichwould make it difficult to get reliable PR finds.

Figure 2-25 Example of Histogram Equalization

The image shown on the right in Figure 2-25 is after application of theHistogram Equalization tool. The image now shows significant contrast,greatly improving the ability to create a good PR model.

This tool is used to change the minimum to maximum contrast levels in theimage without changing the contrast distribution – in effect “exploding” theimage. Figure 2-26, shows the video from a typical low contrast part. Thegraph that is superimposed on the video show the distribution of contrastvalues. Some operators might have difficulty determining a reliable PRmodel with this part. Notice the contrast levels are closely grouped in thegray region.

Histogram Equalization

Exploded Image

Normal Image Before Equalization After Histogram Equalization

Contrast DistributionGraph On NormalImage


PR Enhancement Tools Exploded Image

Figure 2-26 Example Of The Video And Contrast Distribution Before Using"Exploded Image"

The image on the right shows the same part with exploded contrast appliedto the image so the existing distribution of contrast is adjusted by theoperator. By entering numbers in the appropriate field in the control screen,the contrast values can be shifted towards "white", giving the results shown.

If you select Exploded Image as the video enhancement mode, you will see ascreen as shown below:

After Exploded Image EqualizationNormal Image

Exploded Image With Contrast Reversal Equalization


Exploded Image PR Enhancement Tools PROGRAMMING WITH THE NEW PR SYSTEM

There are three parameters to choose from the “Exploded Image” screen:

Lower threshold

Upper threshold

Top map value

Look at the "Normal Image" picture in Figure 2-26 . Notice the graphsuperimposed on the image. This graph shows the contrast distribution fromblack (corresponding to the "0" value), to white (corresponding to 255).

Lower threshold is the darkest contrast value you want in the picture. Pixelswith values less than the lower threshold go to "0".

Upper threshold is the lightest contrast value you want in the picture. Pixelswith values greater than the upper threshold go to "top map value". Itdefaults to 255 (white). Lowering the "top map value" will shift these pixelstowards gray.

Top map value sets the absolute upper contrast value for "white".

Pixels whose values are between the lower threshold, and the upperthreshold, are distributed between "0" and "255", according to the normalimage contrast distribution graph.

The values selected for this image were: lower threshold value = 25; upperthreshold value = 75; top map value = 255. Try different values to create animage that is easy for you to find a good PR mode.

NOTE: Adjusting the lower contrast value to 75 so it is greater than theupper contrast value set at 25 will, in effect, reverse the image asshown in the lower picture in Figure 2-26. This can be useful.

IMAGE ENHANCEMENT

Enhancement Mode: Exploded Image

Lower threshold: 96

Upper threshold: 28

Top map value: 255

TOGGLE F13: Save program

ARROWS

F16: Abort


Alternate Eye Points Binary Image

GS II PR system includes a binary video tool which can make the videoimage appear pure black or white. Figure 2-27 is the video from a deviceusing the binary mode. The control screen allows you to choose the thresholdvalue. In this case, the threshold was set to 50 so that all contrast valuesbelow 50 become black, and all contrast values above 50 become white.While Binary Image may result in faster Pattern Recognition, it is the mostsensitive to lighting variations.

Figure 2-27 Example of Binary Video Enhancement

For most applications, you will find Point Mode (Unlinked or Linked), andDual Point Mode to be commonly used Find modes.

In this section we describe an advanced PR technique for designating anAlternate eye point to handle the situation where the Primary eye point failsPR because the part looks different than the original model. This can happen,for example, because of die tilt, or differences due to variation of thepassivation layers.

You can overcome this problem by programming the system to have one ormore Alternate eye points, which can be optimized to the different-appearingparts, provided the variations are consistent.

You could, for example, program the Primary eye point on one style of part,and an Alternate eye point on another style part using one of the enhancedvideo tools to optimize the eye point.

Binary Image

Alternate Eye Points

After Binary Video EnhancementNormal Image Before Enhancement


Creating a PR Offset Point Alternate Eye Points PROGRAMMING WITH THE NEW PR SYSTEM

The Alternate eye points will show on the EYE POINT EDIT screen asAlternate1, Alternate2, etc. You would set up Alternate eye points using avariation of the procedure described in an earlier section called “Linked EyePoint” on page 2-16, as part of the conventional method of establishing aPoint mode Eye Point. The variation is that you do not link the Alternate1eye point to the primary eye point.

When you do a PR Spot, if the Primary eye point fails, the system willautomatically try each Alternate eye point you programmed. If they all fail,then you will be asked to provide operator assistance by designating theAssist point.

To use Alternate eye points for linked eye points, you would program analternate pair of linked eye points. This way, if the first search fails on eitherthe primary or linked-primary, the search will switch to the alternate pair.

On some devices, all the objects requiring pattern recognition are mountedon another object (i.e., a substrate) whose location varies enough from deviceto device to require pattern recognition operations. PR offsets can be used to“tie” area camera XY locations to a specific reference point. By specifying aPR offset point, the pattern recognition system will adjust the patternrecognition camera XY locations according to the displacement of the objectthey are mounted on..

Figure 2-28 PR Offset Screen

Creating a PR Offset Point

File Name PR OFFSETS (DISABLED) LOG 1LINK File Capture has not been performed for Model 2(if used)

EyePt primary assist

Camera X,YLED 1, 2Linked eye pointFind mode

2006

NoPOINT

-5708

---REGION 1 ---



ARROWSPAGE

START:F13:

AdvanceSave area

F11: Enable F15: Delete eyept

F16: Abort


The Wire List The Wire List

NOTE: The PR Offset is not classified as a PR area, therefore bonds inthe Wire List cannot be tied to it.

1. Press [6] from the EDIT MENU to set up a PR offset point. This willbring up the screen shown in Figure 2-28

Program the PR Offset point the same way as any other PR Area: youmay program multiple eye points and the final eye point is always anassist point.

2. Press [ENTER] or [down arrow] to generate an eye point for both oneand two point PR spotting. Modify and insert additional eye points fol-lowing the same procedures as in the PR LIST section.

3. Press [F11] to enable the PR Offset point. You must enable PR Offsetsbefore they take effect.

Use WIRE LIST EDIT to generate, test, or modify bond locations andparameters for all wirebonding programs. The order of the wires, and of thebonds within a wire listed in the WIRE LIST EDIT screen determine thebonding sequence for the machine when you begin to bond.

You can insert, delete and rearrange bonds and wires on this screen. To testlocations and parameters, you may bond individual wires without leaving theWIRE LIST EDIT screen.

1. Press [2] on the EDIT MENU to access WIRE LIST EDIT:

The Wire List


The Wire List The Wire List PROGRAMMING WITH THE NEW PR SYSTEM

All wires on a device are numbered in the order they will be bonded. Inaddition, all bonds on a particular wire are numbered in order. The wiresappear in order on the wire list.

The number of the wire appears in the top row, labeled Wire. There is roomto view nine wires on the screen. When the number of wires in the wire listexceeds nine, you can scroll to the right to see additional wires.

When a wire number is highlighted, all the bonds on that wire appear inorder on the screen. The number of each bond appears in the row labeledBond.

There is room to view nine bonds for a single wire on the screen. The screen(from the Bond row and below) scrolls to the left when the number of bondson a particular wire exceeds nine. An asterisk marks the end of the wire orbond list.

The asterisk (*) in the Wire row in the preceding sample screen, shows thereare there are two wires in this list.

All the parameters for a bond are listed under each bond number. They arecontained on two screen pages. Press [F11] to toggle between the pages onall wire and bond editing screens. Default values for bond parameters appearas [ · ] on the screen. If you put the cursor on a “dot”, the value of the defaultparameter will appear under the screen title.

Program Name WIRE LIST EDIT LOG 1LINK File(if used)

Wire: [ 1] 2 *

Bond: 1 2

Area:Focus:Angle:Start force:End force:Start power:End power:Ramp time:Total time:Loop:

1

······

1

·······

TOGGLE: Stop at search: [OFF] START: Next wire

SHIFT - ^/v: Cut depth [310.2] STOP: Insert wire

SPIN X Y F13: Save wire

F14 Insert wire

ARROWS F11:Bond page [1] F15: Delete wire

PAGE F16 Abort wire


The Wire List Creating A Wire List

1. Press [STOP], [F14], [DOWN ARROW] or [ENTER] to insert a wireand bond into the list:

2. A zero (0) appears in the Area field. Area names the pattern recognitionsearch area assigned to this bond. The 0 means that pattern recognitionis not required to locate this bonding point. If pattern recognition isrequired, replace the zero by the number of the PR area.

3. Use the spinners to move the head to the location of Bond 1 on Wire 1.Look at the video monitor and position the crosshairs over the center ofthe bond location. Press [START] to mark the X and Y location of thebond, and the cursor will highlight the field for the next bond. Thecurrent X and Y position in microsteps will appear numerically in the Xand Y fields (on page 2). The Z field contains a period. The bonder cal-culates Z later.

NOTE: You can enter numeric quantities into bond location fields (X, Y,Z) instead of marking the position. Enter numbers in microstepsfrom the keyboard.

Creating A Wire List

Program Name BOND EDIT -- INSERT MODE LOG 1LINK File(if used)

Wire: [ 1 ] 2 *

Bond: [ 1 ] 2


1······

1·······

TOGGLE: Stop at search: [OFF] START: Auto-edit (Mark/Save)

SHIFT - ^/v: Cut depth [310.2]

SPIN X Y F14 Mark position

ARROWS F11: Bond page [ 1 ]

PAGE F16 Abort bond


Editing The Wire List The Wire List PROGRAMMING WITH THE NEW PR SYSTEM

Important: Always input the PR Area number before you move the spinners to a new bondlocation.

4. Enter the appropriate Area number for the second bond.

5. Use the spinners to move to the next bond location then press [START]again. The cursor will now highlight bond #3 location. Continue addingnew bonds using the spinners - START sequence.

The head will move to touch the surface at each bond location when you finish inputting awire.

6. At the end, press [START] without moving the spinners. If the head iswithin 0.005 inches (125 microns) of the X and Y location for the previ-ous bond, the system deletes this extra inserted bond and saves the wire.The head will move to each bond point and touch down to measure theZ position. For additional wires, return to step 1.

7. Repeat for all wires on the device.

8. After the last wire, press [F13] to save the Wire list.

After creating a wire list, you may need to make adjustments to the locationof the bonds, or the parameters of the bonds. Or, you may have to modify theprogram to add or delete a wire.

The following sections discuss the way to edit the program. The first sectiondescribes how to edit the XY location, and the second section deals withediting parameters. Then we will describe how to add/delete wires.

Notice the additional command buttons on the WIRE LIST EDIT screenbelow.

Editing The Wire List


The Wire List A Final Note To Remember

Bond locations must be tied to PR locations. Bonds can appear to shiftbecause of marginal PR eye points. If your bonds shift, make sure you have agood PR model and good correlation results. Fix your PR before editing theWire List.

Use the following procedure to edit (change) the XY position of a bond. Theprocedure assumes you are in the BOND EDIT screen of the desiredprogram.

1. Arrow down to the bond whose position you want to change. Use theSpinners to place the crosshair over the revised bond location. Press[START]. This will mark the new position, save it, and move the cursorto the next bond.


Wire: [ 1] 2 *

Bond: 1 2


1

······

1

·······

TOGGLE: Stop at search: [OFF] START: Next wire

SHIFT - ^/v: Cut depth [310.2] STOP: Insert wire

SPIN X Y F8: Bond off F13: Save wire

F14 Insert wire

ARROWS F11:Bond page [1] F15: Delete wire

PAGE F12: Undelete wire F16 Abort wire

A Final Note To Remember

Editing Bond Position


Editing Parameters The Wire List PROGRAMMING WITH THE NEW PR SYSTEM

2. You can continue moving from bond to bond by pressing [START],each time you will mark/save the new position and cycle to the nextbond. (You don’t have to change the XY position when you cycle to abond location. Don’t move the Spinners if you want to keep a particularbond where it is.)

CAUTION: When you finish with the last bond of the last wire in thelist, pressing [START] will return you to the WIRE LISTscreen, with the cursor on wire #1. If you press [START]again, you will bond that wire.

3. When you are finished editing a wire (or all the wires), press [F13] tosave the wire.

4. Press [F13] again to save the wire list.

5. If you don’t want to save the changes you just made, press [F16]. Thescreen will prompt you to be sure you want to ignore the changes youmade in this session.

6. If you press [15] at this point, you will delete all the changes made inthis editing session.

1. From the WIRE LIST EDIT screen, arrow to the wire and down to thebond you wish to edit.

Remember: There are more parameters on page 2 of the screen.

2. Arrow to the parameter you want to change. Enter the desired valuethrough the keyboard. Appendix E (PARAMETERS) lists minimumand maximum parameter values, and the units of measure for each.

3. Press [F13] to save the bond, and press [F13] again to save the wire. Or,press [START] to save the parameter and go to the next bond. Press[F11] to return to Bond page 1.

HINT: If you want to change the same parameter on the same bondnumber on many wires, press the [PAGE] key. This will save thechanges and move the cursor to the same bond number on thenext wire. Now you can enter the value and quickly move to thenext wire by pressing [PAGE].

Editing Parameters


The Wire List Add A Wire

4. Press [F16] to move the cursor up one level, for example, to move fromthe parameter field to the bond number.

5. Press [F13] repeatedly to save bond, save wire, and save wire list. Press[15] if you want to delete all the changes made in this editing session.

NOTE: If the cursor is in the parameter portion of the BOND EDITscreen and you use the Spinners to change the bond position,when you press [START] or [F14] to save, the head will touch-down to recompute Z.

If you want to add a wire into an existing Wire List, use the followingprocedure.

1. The [F14] “Insert wire” command will insert a new wire to the left ofthe cursor position. Wires to the right of the inserted wire will be incre-mented by one number. So, for example, if the Wire List containedthree wires and you place the cursor on wire #3, pressing [F14] willplace a new wire labeled “wire #3”, and what was wire #3 will becomewire #4.

If you want to remove a wire from an existing Wire List, use the followingprocedure.

1. Put the cursor on the wire number you want to delete.

2. Press [F15]. The wire will be removed from the wire list and all wiresthat were to the right of deleted wire will be decremented by onenumber. For example, if the wire list contained four wires and youwanted to remove wire number 2, place the cursor on that wire numberand press [F15]. What was wire #3 will now become wire #2, and whatwas wire #4 will become wire #3.

If you want to add a bond onto an existing wire, use the following procedure.

1. Move the cursor to the Bond portion of the screen

Add A Wire

Delete A Wire

Add A Bond


Delete A Bond The Wire List PROGRAMMING WITH THE NEW PR SYSTEM

2. The [F14] “Insert bond” command will insert a new bond to the left ofthe cursor position. Bonds to the right of the inserted wire will be incre-mented by one number. So, for example, if the wire #2 contained twobonds and you place the cursor on bond #2, pressing [F14] will place anew bond labeled “bond #2” in that location, and what was bond #2 willbecome bond #3.

Remember: A wire must have a minimum of two bonds.

You can delete a bond in a similar manner.

1. Put the cursor on the bond number you will to delete.

2. Press [F15]. The bond will be removed and all the bonds to the right ofthat position will be decremented by one number.

You can use the combination of [F12] Undelete and [F15] Delete to easilychange the order of a wire or bond, in a similar way to using Cut and Pastein a word processing program.

The following example shows you how to make bond #2 into bond #1.

1. Place the cursor over bond #1 and press [F15]. What was bond #1 willdisappear from the screen, and what was bond #2 will become bond #1.

2. Put the cursor in the bond #2 position and press [F12]. The previousbond #1 will now become bond #2.

The 360C can make many bonds in one continuous wire before cutting. Thesequence of operations will simply be chained together at the twist heightpoints.

Delete A Bond

Delete/Undelete

Stitch Bonds


The Wire List Stitch Bonds

Stitch bonds are intermediate bonds on a continuous wire between the firstand last bond. Because there are more than two bonds on the same wire, thequestion can be asked, “what default wire parameters are used for theintermediate bonds?” Figure 2-29 illustrates a part that uses stitch bonds.

Figure 2-29 Stitch Bond Example

With Version 5.7C and alter versions, the default parameters for theintermediate bonds are the same as those for the last bond. This is a changefrom some previous software versions.

New wire lists created with software 5.7C and later will use the defaultparameters of the last bond for the intermediate stitch bonds. However, if youhave a wire list that was created with previous software versions 5.4Bthrough 5.5A, the stitch bond default parameters were from the first bond.You may have to manually edit these older wire list programs to insert thedesired wire parameters for the intermediate stitch bonds.

StitchBonds

LastBond

ContinuousWire

First Bond


PR List Testing

C H A P T E R 3

TESTING AND OPTIMIZING THE PROGRAM

Whenever you create a new program or modify an existing one, you shouldtest it to make sure everything is working the way you intended. This chapterwill discuss techniques for testing the program, and making fine adjustmentsto optimize throughput speed (UPH) and accuracy.

HINT: Before starting testing, make sure that the parameter "Always spotbefore edit" is ON. This parameter is located in the SYSTEMPARAMETER EDIT screen. This will make the bonder performa PR operation every time the PR List or Wire List is started.

First, test the PR List to make sure the bonder is finding all the Areas andEye Points. It is a good idea to test several parts so you can be sure theprogram is robust enough to handle any minor variations that can occur frompart to part.

1. With the program loaded in the machine, turn on the system parameter"Verify PR" from the SYSTEM PARAMETER EDIT screen. This willstop the machine at each area to show you where it found the eye point.You can press [F13] to redo the search if the PR failed.

2. Press [START] to proceed through the entire PR List.

3. If you encounter a PR fail, make sure you manually assist the PR Areawith the correct Assist Points in your program.

CAUTION: If you fail to correctly assist a PR area failure, editing ormodifying the PR Area in the PR List will can change yourbond positions associated with that area

PR List Testing


Wire List Testing TESTING AND OPTIMIZING THE PROGRAM

Once the initial PR has been completed you will enter the PR List. You canarrow to any existing PR Area eye point and press [START] to perform a PRspot. You should see the crosshair move to the selected find point and youshould see a number appear in the “Quality results” field in the EYE POINTEDIT screen (assuming the PR spot was successful).

Ideally, the reference point crosshair in the video should appear in the sameplace for repeated PR spots, and the same find point should be found as youmove the camera position around and press [START].

If a PR Area fails, you should arrow to the failed area and determine whatthe failure was, and how or if it should be corrected.

The two most common problems that result in PR failure are:

If PR fail problem still persist, try other models, or use Enhanced Imagetools.

Before testing the Wire List, make sure you successfully tested your PR Listwithout errors. Failure to do so will lead to misplaced bonds.

1. From the MAIN menu, go to the Wire List by pressing [5], [2]. Thiswill bring up the WIRE LIST EDIT screen of your program. Make surethe PR was correctly entered going into the Wire List.

2. Move the cursor down over the first bond of the first wire.

3. Step through the program without bonding by pressing [START]. Thiswill move the bond head to each bond position.

4. The Spinners will be active, so you can make fine adjustments to bondposition by moving the crosshair over the desired bond location andpressing [START] to Mark & Save the new position.

Problem Solution Reference

Threshold result lowerthan the Qualitythreshold

Threshold may be settoo high. Lower theQuality threshold andretest.

“Quality Threshold” onpage 2-15

Area has movedoutside the search box

Increase the size, orre-adjust the searchbox position andretest.

“Search Box” on page2-12

Wire List Testing


Wire List Testing

NOTE: Be careful when you reach the last bond of the last wire in theprogram. Pressing [START] again will move the cursor to thefirst bond of the first wire. Pressing [START] again will causethe bonder to begin bonding wires.

5. Step through the Wire List with several parts to make sure the bondlocations are consistently correct.

Ready to Bond.

6. Before you begin the trial bonding, set the field "Stop at search" to ONin the WIRE LIST EDIT screen so you can watch the machine gothrough each bonding step. Also make sure the appropriate set up proce-dures have been completed (i.e. cut calibration, tool offsets, etc.).

7. Press [START] to advance the machine to the next bonding step.

CAUTION: Make sure you turn the "Stop at search" field to OFF whenyou are ready for production.

8. Continue bonding until the part is complete.

HINT: For better visibility when you are trial bonding, you can slowdown the machine System Speed from Normal to a fractionalspeed. This parameter field is located in the SYSTEM PARAME-TER screen.


Optimizing A Program TESTING AND OPTIMIZING THE PROGRAM

Inspect and Test

After the part is complete, perform a visual inspection of the wire bonds.Then perform Pull tests and Shear tests on the wires to determine theintegrity of the bonds.

Editing Wire Parameters

The results of the Pull and Shear tests may indicate you need to change someof the wire parameters. You have a choice on editing wire parameters:

Edit wire parameters on a per bond basis in the Wire List. Youmay save these changes with your file, and they will only affectthat file.

Edit wire parameters globally in the WIRE PARAMETER EDITscreen.

Because of the wide range of variables that can influence PR, you may notget close to the ideal on the first try. The discussion below is intended tointroduce you to additional tools that you can use to optimize your PR, andto suggest adjustments to try.

PR is not an exact science. It is impossible to cover all the conditions thatcan occur to influence your results. If you do not achieve ideal results at first,try making adjustments using the guidelines presented in this section.

The table below presents a list of “what if” conditions, and possibleremedies. The table also suggests the use of additional tools that could beused.

Optimizing A Program

Optimize Pattern Recognition

Table 1 What If Conditions

Condition Solution

What if PR is too slow (over100 ms).

Minimize the search area,use a smaller model, usemodel thinning, use pixelediting.


Optimize For Speed

There are several techniques to try for optimizing the speed of your program.Each may only contribute a savings of a few milliseconds, but collectivelythey can add up to substantial reduction in time to complete the bonding ofyour part.

1. Lower Z Home - but watch out for obstructions.

2. Lower Interwire height - should clear all wires by approximately 0.2" (5mm).

3. Decrease the size of the PR search box - this will reduce the searchtime.

4. Decrease model size - a smaller model will take less time to movethrough the search box.

5. Use pixel thinning - this advanced technique eliminates pixels that don’tcontribute to the correlation.

6. Use Dual Point mode instead of Linked Eye Points - searches twosearch areas simultaneously without moving the camera XY location.

7. Use Medium or Coarse resolution for PR - provided you still achievethe accuracy you need.

8. Optimize the X Y movements and Theta movement of the bond headduring the "Planning the Layout of your Part".

9. Lower the search height on non-critical surfaces (not the die) that have agood fixed Z-height.

What if PR is inaccurate (i.e.,spot point jumps around;Reference point does not stayin the same place).

Pick a different model. Tryusing Image Enhancementtools described in theAdvanced PR section.

What if PR is inconsistent(i.e., Quality Results varywidely from spot-to-spot;occasional PR fails).

Try a different find mode.Try using ImageEnhancement toolsdescribed in the AdvancedPR section.

What if you have difficultygetting a find (PR fails).

Try a different model. Trya different find mode. UseImage Enhancement tools.

Optimize For Speed

Table 1 What If Conditions (cont’d)

Condition Solution


Optimize For Accuracy TESTING AND OPTIMIZING THE PROGRAM

There are a number of items you can adjust to improve the accuracy ofplacement of your bonds:

1. Use Fine resolution for PR.

2. Always use two eye points for X Y and Theta. The further apart you canplace the two eye points, the better resolution in Theta you will get.

3. Choose eye points as close to the bond area as possible.

4. Make sure the part is clamped solidly.

5. When placing a bond on a narrow bond pad, you can designate a pro-grammable angle for first or second bond.

Normally, the bond angle is the same as the wire angle. You can program anangle such that the bond is always parallel to the narrow side of the pad,regardless of the wire angle. This angle should be limited to ±45° of thenatural wire angle.

A first bond angle will not compromise speed. A second bond angle willaffect speed. This is because the bond head touches down at the naturalangle first to seat the wire under the tool. The bond head then raises slightly(according to touch twist height) before turning to the programmed angle andbonding.

Optimize For Accuracy


USER'S SUPPLEMENT

UNIVERSAL TOOLING SETUPFOR M360C-H/HD

Document Part No. DC04-173024A

ISSUE DATE: November, 2000


2300 Main Street


Telephone (949) 660-0440

FAX (949)-660-0444

E-mail: [email protected]




F O R W A R D



11/06/00 Orig Initial publication

Z:\GEORGE\WORK\Special Projects\Universal Tooling Supplement\Universal Suppl cvr.fm

-2 Device ID Sensor Supplement

TABLE OF CONTENTS

CHAPTER 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1Overview 1-1Functional Description 1-1Tooling Components 1-3

CHAPTER 2 SET UP PROCEDURE. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1Clamp Arm Height Adjustment 2-1Clamp Set Up Procedure 2-2

Finger Setup and Overtravel Adjustment 2-4 Adjustment When There Is Interference 2-5 Final Position Adjustment 2-5

UNIVERSAL TOOLING SUPPLEMENT TOC-1

C H A P T E R 1

This supplement describes the installation and adjustment for yourset of Universal Tooling. This description is general because itapplies to all “dash number” tooling kits. When combined withyour specific tooling drawing, you should have all the informationrequired to install and adjust your tooling to your application.

The Universal Tooling design gives you the benefit of a generaltooling configuration that can apply to many different types of 3-lead leadframes with inexpensive, easy-to-replace components.With prolonged use, the wear that occurs on the tool fingers thatpress against the leadframe does not mean you have to replace theentire tool set. With Universal Tooling, if the tool fingers wear out,you need only to replace them. This aspect of Universal Toolingreduces the recurring cost of operation.

Universal Tooling can be installed on almost any Model 360C-H/C-HD bonder that is set up to bond 3-lead devices on leadframes. Ourengineering department evaluates each proposed application todetermine whether Universal Tooling can benefit you. If your machineis equipped with Universal Tooling, it means our engineers havedetermined that the tooling is right for your application.

Figure 1-1 and Figure 1-2, on page 1-2 are two examples ofUniversal Tooling configurations. The first Figure shows a setupwith two center clamps, two high-side clamps, and two low-sideclamps. The second Figure shows a configuration with just twohigh-side clamps, and two low-side clamps.

The Universal Tooling set is composed of commonly shaped partsthat are put together to fit each particular application.

INTRODUCTION

Overview

Functional Description

UNIVERSAL TOOLING SUPPLEMENT 1-1

INTRODUCTION

Figure 1-1 Universal Tooling - Example 1

Figure 1-2 Universal Tooling - Example 2

1-2 UNIVERSAL TOOLING SUPPLEMENT

Tooling Components

Universal tooling is made up of component parts that can beassembled and adjusted to fit many different applications.Moreover, the parts that are most likely to wear out as a result oflarge production runs, can be easily exchanged with inexpensivereplacement parts. This greatly reduces the cost of ownership ofthe tooling because custom shaped parts do not have to becompletely replaced when they wear out.

Examples of the component parts are shown Figure 1-3.

Figure 1-3 Universal Tooling Component Parts

Clamp Holders are available in different shapes and sizes. TheClamp Holders are mounted onto the front and rear Clamp Armswith M4 mounting screws and washer plates. As shown in Figure1-3, the Clamp Holders are shaped for high-side right-hand, high-side left-hand, high-side center, low-side right-hand, and low-sideleft-hand clamping.

Clamp Holder

Pinch Plate

Clamp Finger

Pinch Plate Ass’y Mounting Screws

Clamp Finger Adjusting Set Screw

Locking Set Screw

M4 Ass’y Mounting Screws


INTRODUCTION

Pinch Plates are used as a clamping device for the Clamp Fingers.The Clamp Fingers should be mounted onto the Clamp Holder sothat the end opposite the Finger “tip” is as far back on the Holderas it can go. (Some minor deviation is allowed at final adjustmentif needed). The Pinch Plate is mounted on the Clamp Holder andover the Finger. This assembly combination securely clamps theFinger between the Holder and the Pinch Plate.

The Adjusting Set Screw is used to push the Finger tip down inorder to achieve the desired uniform clamp force. The Locking SetScrew will lock the Adjusting Set Screw after the correct forces arese t up . Some Clamp f inger ad jus tment can be made toaccommodate production wear. Clamp Fingers are the most likely“wear” item and are easily replaced.


C H A P T E R 2

SET UP PROCEDURE

Clamp Arm Height Adjustment

Refer to Figure 2-1 for the following adjustment steps.

1. Put the clamp in the “closed” position.2. Loosen (4) M5 cap screws so that the high-side and low-side

clamp arm can move freely (see Part “B” of Figure 2-1).

3. Remove the Anvil.

4. Remove the Insert.

5. Place Clamp Height Gauge (P/N 173995-XX) on the TrackMounting Plate. The dowel pin of the gauge must align with thelocating hole in the plate. Tighten in place using the four knobs(see Part “A” of Figure 2-1 to see which knobs to tighten).

6. Raise up the High Side Clamp Arm against the gauge and tightenthe Knob Assembly (P/N 173176-8) (see Part “A” of Figure 2-1to see which knobs to tighten).

7. Repeat the same procedure with the Low Side Clamp Arm.8. Tighten all M5 cap screws to secure the Clamp Arms at this posi-

tion.9. Loosen knob assemblies and remove the gauge.


SET UP PROCEDURE

Figure 2-1 Clamp Arm Height Adjustment

Clamp Set Up Procedure

NOTE: Before you mount the Clamp Holder Assemblies onto the ClampArms, make sure both locking and adjusting set screws are loose.

1. Assemble the Clamp Assemblies per tooling kit drawing173024-XX. (See Figure 2-2, on page 2-3).

The Pinch Plates are used as clamping devices for the ClampFingers. The Clamp Fingers should be mounted onto the ClampHolder so that the end opposite the Finger tip is as far back on theHolder as it can go. (Some minor deviation is allowed at the finaladjustment if needed).

The Pinch Plate is mounted on the Holder and over the Finger.This assembly combination securely clamps the Finger betweenthe Holder and Pinch Plate.

The Adjusting Set Screw is used to push the Finger tip down toachieve the desired uniform clamp force. The Locking Set Screwwill lock the Adjusting Set Screw after the correct forces are setup. Some Clamp Finger adjustment can be made to compensate forproduction wear.

Clamp Height Gauge

Step 2, Four Places

Step 3, Two Places

Step 4, Two Places PART A

Step 1 and 5Step 1 and 5

PART B


Clamp Fingers are the most likely item to wear and are readilyreplaced.

Figure 2-2 Clamp Holder Assembly

2. For the High Side Clamps, position the fingers directly overthe leads.

3. For the Low Side Clamps, position the fingers over the heatsink clamping surface.

NOTE: It is important at this stage that the fingers are completely on thesurface to be clamped, not partially hanging over an edge.

4. When the Clamps are positioned in accordance with the abovesteps, tighten all M4 assembly mounting screws. (See Figure1-3, on page 1-3).

At this point in the installation process, you must make a decision:as to whether there is there sufficient adjustment range availablefrom the Adjusting set screw or not. The fingers must have someclearance above the leadframe. Figure 2-3, on page 2-4 is a logicdiagram that illustrates the decision tree.

Finger

Clamp Holder

Mounting Screws

Locking Set Screw

Pinch Plate

AdjustingSet Screw


Finger Setup and Overtravel Adjustment SET UP PROCEDURE

Figure 2-3 Adjustment Logic Diagram

Finger Setup and Overtravel Adjustment

The overtravel adjustment on the fingers applies the necessaryclamping pressure on the work surfaces.

1. Use the “Adjusting set screw” to adjust all clamp fingers untilthey just make contact with the leadframe. Use the micro-scope to verify contact with the leadframe.

2. Turn the adjustment set screw on the Pinch Plate 1/4 turnclockwise for each 0.25mm (10 mil) of overtravel. Typicalovertravel should be 0.50mm (20 mil) for leads, and 0.50 mm(20 mil) for heat sinks.

3. Typical overtravel for D-PAK heat sinks is 0.375 mm (15mil).

CAUTION: Do not exceed one full turn of clockwise adjustment on theClamp Finger Adjustment set screws as permanent Fingerdistortion may occur.

Installation of Pinch Plates and Fingers

Does the Adjusting set screw give you clearance?

Yes

No

Finger Setup and Overtravel Adjustment

Final Position Adjustment

Ajustment When There Is Interference


4. Before making the final finger positioning adjustments,tighten all Locking set screws to retain the overtravel adjust-ment.

Adjustment When There Is Interference

If any of the clamp fingers are already pushing down on theleadframe and the adjusting set screw cannot be backed off so thatthe finger is just touching the leadframe, this is called Interference.If you encounter this situation, you must make a height adjustmentto the Clamp Holder so the Adjusting set screw will give you arange of motion of the Finger.

1. If one or more clamp fingers are interfering with the lead-frame, adjust the height of each Clamp Holder by inserting ashim under each one. The shims should be 0.02” (500microns) thick for a standard leadframe, or should be 0.015”(375 microns) thick for a D2PAK leadframe.

2. Use the “Adjusting set screw” to adjust all clamp fingers untilthey just make contact with the leadframe. Use the micro-scope to verify contact. Tighten all “Locking set screws”.Then loosen the Clamp Holders and remove all the shims.

3. When you re-tighten the Clamp Holder screws, the absence ofthe shims will automatically apply the correct overtravel andclamp force by the Fingers on the leadframe.

4. Proceed with the next step to adjust the final position of theclamps.

Final Position Adjustment

Use the same procedure to make the final position adjustment asyou would have if there was no initial interference. For yourconvenience, these steps are repeated below:

1. Loosen the Clamp Holders and Pinch Plate mounting screws asneeded to precisely locate the Finger Clamp tips. When you aresatisfied with the Finger tip final positions, re-tighten all mount-ing hardware. (Do not loosen the Adjusting or Locking setscrews.)

CAUTION: Use caution when loosening the Pinch Plate mounting screwsbecause they apply a holding force on the Fingers, and theymay slip out of position.


Final Position Adjustment SET UP PROCEDURE

2. Visually confirm the location of the Finger tips using themicroscope and the video camera display.

3. Tighten all Mounting Assembly screws.

NOTE: Fingers may settle after bonding the first magazine of parts, andovertravel of the Fingers may need to be re-adjusted. Check andmake appropriate adjustments.


USER'S SUPPLEMENT

MODEL 360S SMALL WIRE BONDER KIT

MANUAL No. DC04-175000

PR Version GS II & IIA

ISSUE DATE: February, 2002


16700 Red Hill Avenue


Telephone: (949) 660-0440

FAX: 949-660-0444





MODEL 360S KIT USER’S MANUAL Supplement - 1

FORWARD

About the Documentation

This supplement manual is intended for a customer that buys a Small WireBonder retrofit kit to be added to an existing Model 360C. With the SmallWire Bonder kit installed, we refer to this machine as the Model 360S. Themanual assumes the customer has extensive knowledge of wire bonding, andprevious experience with Model 360C wire bonder. This manual is intendedas a supplement to the User’s Manual for the M360S, showing the installa-tion procedures for installing the Small Wire Kits 175000 and 175000-1.

The manual covers installation and operation of the Small Wire Bonder kitincluding the new bond head, software, and selected circuit boards. Thecircuit boards and software supplied with the kit make the machine univer-sal, because the machine will be able to operate with either the Small Wirebond head or the standard Model 360C bond head with no further changes.

This documentation pertains to both of the following kits:

175000 - Small Wire Kit without Universal Boards

175000-1 - Small Wire Kit with Universal Boards

NOTE: M-360C machines manufactured prior to January 1, 1997, requirethe Small Wire Kit 175000-1 with Universal Boards.M-360C machines manufactured after January 1, 1997, requirethe Small Wire Kit 175000 without Universal Boards.

MODEL 360S USER’S MANUAL Supplement - 3

C H A P T E R 1

INTRODUCTION

Orthodyne has a new machine that is ideal for high volume production ofpower and hybrid devices. The new addition to our Model 360C family ofwire bonders is specially designed to bond from 1.5 mil (38 micron) to 3 mil(75 micron) aluminum wire. Available as a new stand-alone machine and asa retrofit kit, the Model 360S Small Wire Bonder increases the capability tobond wires from 1.5 mil to 20 mil on the same basic machine. (See Figure 1-1.)

The Model 360S Small Wire Bonder Kit contains all necessary hardware andsoftware to convert an Orthodyne Model 360C Large Wire Bonder to smallwire capability. New design features in the Model 360S Small Wire Bonderoptimize the handling and bonding of from 1.5 mil to 3 mil aluminum wire.

Figure 1-1 Small Wire Bonder

The Model 360S can bond up to 1,500 wires automatically in any directionon virtually any electronic package. Unique motion control techniques solvecommon problems associated with wire feed and wire termination in a smallwire application. The proprietary techniques allow precise, programmablecontrol of the wire feed, wire break and wire clamping.

INTRODUCTION Major Assemblies of the Small Wire Bonder

Supplement - 4 MODEL 360S USER’S MANUAL

Major Assemblies of the Small Wire Bonder

The Model 360S Small Wire Bonder Kit’s modular design minimizesmachine downtime during conversion. Assemblies are either plug-in replace-ment or upgraded modules which support both large and small wire bond-ing. Small wire bonding requires substantial design changes to the mechanicsof bonding, the handling and feeding of the wire, and the electrical character-istics of the ultrasonic generator.

The three major assemblies to the Small Wire Bonder Kit are:

• Bond Head• Wire Dereeler

• Universal Circuit Boards (175000-1 Kit only).

NOTE: Installing the Universal circuit boards will convert a Model 360Cto universal capabilities allowing it to be converted to and from aModel 360S.

Highlights of each of these assemblies are described in the followingsections.

The major design challenge in the development of the Small Wire Bonderwas to reduce the size and mass of the components to control the motion andforces applied to the small wire. The design features of the Small WireBonder include:

• Rotary small wire bond head

• Automatic wire dereeler assembly for 2” wire spools

• Universal Hi/Low ultrasonic generator (one time replacement)

• Upgraded software, supporting large and small wire menus

• High magnification optics

• Universal I/O board (one time replacement)

• Universal Forcer/Focus board (one time replacement)

Now let’s explore the Small Wire Bonder in more detail to see how thesechanges interact together.

INTRODUCTION Bond Head Assembly


Bond Head Assembly

The all-new design of the Small Wire Bond Head contains six basic changesfrom the Large Wire Bond Head to work with the 1.5 to 3 mil wire. Theseare:

1. Wire Feed and Break

2. Wire Clamp

3. Forcer Assembly

4. Forcer used for touch down

5. Controller Board

6. Transducer Pivot Assembly

Figure 1-2 Small Wire Bond head (Front View)

Front and side views of the small wire bond head (Figure 1-2 and Figure 1-3 on page Supplement-6) show the main new elements. In the front view, thelamp assembly is moved to the side to show the details on the head. Thenew, small bonding tool is attached to the transducer, which is a part of thepivoting Transducer Carrier. The transducer carrier movement is controlledby the Forcer Assembly.

Small wire bonding tool

Transducer Carrier

Forcer Assembly

INTRODUCTION Wire Clamp Mechanism


Figure 1-3 Small Wire Bond Head (Side View)

Wire Clamp Mechanism

The Small Wire Bond Head uses a positive wire feed mechanism. Theclamps located behind the bonding tool accomplishes this function. Theclamp has two kinds of motion—open/close, and feed/break. Two miniaturestepper motors are used for actuating the wire clamp. One opens and closesthe clamp, the other moves it forward and/or back to feed the wire for thefirst bond, and break the wire after the second bond.

The left side of the bond head in Figure 1-3 shows the two stepper motorsthat control the motion of the wire clamp. Adjustment of this mechanism iscovered in the calibration procedure section.

Forcer and LVDT Assembly

The entire forcer assembly is smaller, lighter, and performs a key function ofenabling the tool to touch the work surface. In the Small Wire Bond Head,the transducer is mounted on a pivoting arm, not a parallelogram structurelike the Large Wire Bonder.

Bonding Tool

Wire Clamp Motor

Fluorescent Lamp Assembly

Wire Feed Motor

Wire Clamp Assembly

Transducer

INTRODUCTION Controller Board


In the Small Wire Bonder, the spring pulls up on the transducer assembly.The forcer overcomes the spring force and drives the transducer assemblyand bonding tool down to the work surface. We can control the touch downand achieve fine force adjustability using this mechanism, in conjunctionwith a high sensitivity LVDT sensor.

Adjustment to this mechanism includes the LVDT core, the spring, and theupper and lower limit stops of the transducer pivot assembly. Adjustmentprocedures are covered in the calibration section.

Controller Board

The Controller board replaces the Head Junction Board in the Large WireBonding system head. The Controller board contains a microcontroller thatcontrols the stepper motors that feed, break and clamp the wire.

In addition, there is a slide switch to select between fluorescent lighting, orLED lighting (available as an option). Figure 1-4 shows the back of theBond head with cover removed to reveal the Controller board.

Figure 1-4 Controller Board at Rear of Bond Head

LVDT Conditioner chip

Light control selector switch

Wire Clamp Motor Control chip

Microcontroller chip

Wire Feed Motor Control chip

INTRODUCTION Position Sensor/LVDT


Position Sensor/LVDT

The sensitivity of the LVDT has been increased to provide finer resolution tothe CPU and feedback system. The LVDT is used to sense and feedback theposition of the transducer assembly with respect to ground position. Theincreased sensitivity of the LVDT reduced the size of its operating window,thus making the LVDT adjustment more critical. Please refer to the LVDTcalibration in the next section.

Wire Dereeler

The Small Wire Dereeler is designed to handle from 1.5 mil (38 micron) to 3mil (75 micron) size wire. The Dereeler is installed on the X-Y stage toreduce the length of wire between the source spool and the tool, thus reduc-ing any pre-stressing of the wire. This feature reduces the incidence of break-age. Figure 1-5 on page Supplement-9 shows the Dereeler with theprotective cover open.

A spool of 2 mil (50 micron) wire is shown with the wire feeding frombottom right side of the spool, through the lower two guide pins, loopingacross the wire-feed sensor plate, between the upper three guide pins, andinto the jewel-bearing wire guide. The wire passes into the feed capillary,and down the Z-axis shaft of the bonder.

Two methods can be used to determine if sufficient wire was fed by thedereeler to ensure that wire is under the tool when bonding:1. LVDT sensing of wire deformation. This method is always on. The

system checks to see if the LVDT senses a deformation of the wireduring bonding. If not, then the system assumes there is no wire underthe tool and flags an error.

2. Wire Feed Check. This method can be toggled ON/OFF in theSYSTEM PARAMETER EDIT screen. This method uses the Wire FeedSensor to determine if sufficient wire was fed by the dereeler. But withsmall stepbacks, this method may not give a reliable indication of wireunder the tool. You can select the number of "wire feed errors allowed"in the System Parameters.

Dry nitrogen or clean air is used to maintain the loop in the wire feed sensor,and to help feed the wire through the feed tube down the Z axis.

INTRODUCTION Wire Dereeler


Figure 1-5 Wire Dereeler

Figure 1-6 is a close-up of the sensor plate on the dereeler, showing theaction of the continuous feed nitrogen/air in forming the wire loop across thesensor plate. This device senses a change in the position of the wire loop andeither feeds wire or signals the operator of a tight-wire condition at the endof the spool or in the event of a tangle in the wire.

Figure 1-6 Dereeler Sensor Board Close-up

INTRODUCTION New Universal Circuit Boards (Kit 175000-1)


New Universal Circuit Boards (Kit 175000-1)

Three new circuit boards are included in the Small Wire bonder kit (P/N175000-1). When these boards are installed, they will work with both theLarge and Small Wire bond heads, so the M360C becomes dual purpose.

The new boards are:

• Universal Generator Board

• Universal I/O Board

• Universal Forcer/ Focus Board

NOTE: Machines manufactured prior to January 1, 1997 require theSmall Wire Kit with Universal Boards 175000-1. Machines man-ufactured after January 1, 1997 require Small Wire Kit withoutUniversal Boards 175000.

A side view of the VME card cage, shown in Figure 1-7 , identifies the loca-tion of the Generator and I/O boards.

Figure 1-7 VME Card Cage

Generator Board Ass’y.

I/O Board Ass’y.

INTRODUCTION Generator Board


Generator Board

The new Universal Generator Board (175507) was designed to provide twooutput levels, set by a switch on the front panel. The LOW output at 115 Vp-p is for the Small Wire bond head, while the HIGH output at 300 Vp-p is for the Large Wire bond head.

Two LEDs, labeled "PHASE +" and "PHASE -" were added to the frontpanel of the Generator Board to facilitate tuning of the "FREQ ADJUST"during the Phase Calibration portion of the Generator test.

We also added a spare digital I/O port with 7 inputs and 7 outputs for futureexpansion.

I/O Board

The new Universal I/O board (175512) was also designed to work with eitherthe Large or Small Wire bond heads. The Forcer control and the LVDT mon-itoring circuits are now operating with 12-bit resolution (vs. 8-bit resolutionon the previous design). The higher resolution is needed to provide a smoothtouchdown for small wire bonding. In addition, a software-controlleddamping circuit was implemented to improve tool movement during touch-down.

The new I/O board also provides serial communication (SPI) to the micro-processor in the Small Wire bond head.

Due to the 12 bit resolution and SPI lines, this board requires a new junctionboard, now called the "Forcer Focus" board.

Forcer/Focus Board

The Forcer/Focus board (175537), installed at the rear of the top bonderenclosure, replaces the previous junction board used in the standard Model360C. The new Forcer/Focus board incorporates all the functions of the pre-vious board and additional circuitry for the SPI. Additional test points wereincorporated in the board for the LVDT signal to facilitate troubleshooting.

NOTE: The new I/O board (175512) and the new Forcer Focus board(175537) must be used together.

INTRODUCTION General Operating Considerations


General Operating Considerations

The Model 360S software gives you as much useful information as possibleon each screen, following the same style as the basic Model 360C.

General

No changes have been made to the General Operating Considerations. Com-puter files are generated and stored in the same manner as with the basicModel 360C, with the exception of the new folder directories for wire lists.

• Machine specific variables (calibration offsets, etc.) and the name of theselected file are stored in nonvolatile RAM (NVR) in the CPU. Followingpower up, all information in NVR when the bonder was powered downwill be saved, unless battery backup was lost. System data files are alsoloaded into NVR from the hard disk at boot up.

• Operator requested aborts will require a confirmation if changes weremade to the file. If you confirm the abort, the changes are not saved.

• You can cause the bonder to make an emergency stop by pressing the[STOP] button three times. The bonder will stop at the end of the currentwire if you press [STOP] once during Run Mode.

NOTE: If the bonder is equipped with the Emergency Stop Switchoption, you can press this switch to immediately disable allbonder functions.

• The PR monitor graphics display is turned off after a time delay. Press anykey to restore the graphics.

A new feature is included in the software which allows users to group filestogether in "folders". This feature improves the organization of wire lists.

The Keyboard and Control Panel

The Keyboard and Control Panel retain the same features and functions forthe Small Wire bonder and for the Large Wire bonder. Some individual soft-ware screens call out the use of new “F” function keys, but these areexplained on the affected screens. (Also see Chapter 7 in this Manual for adescription of the modified screens).

INTRODUCTION The Screen


The Screen

The Model 360S software controls all operations performed by the machine.The software uses two basic types of data monitor screens: menu screens anddata/action screens. No changes in screen format have been made betweenthe Model 360C and Model 360S, but screen content may be different.Screens that are unique to the Model 360S are included in this manual.


C H A P T E R 2

GETTING STARTED

This section describes the installation of the Small Wire Kit 175000-1 (withUniversal Boards) on your machine, and the initial calibration once the newhead is installed. If your machine was built after January 1997, and your Kitis 175000-1, skip steps 3, 4, and 5.

Installing the Bond Head

NOTE: For initial installations, Load the new software containing theSmall Wire bonder program before proceeding. (For softwareloading instructions, see Version 5.7j or higher Software ReleaseNotes, “Installation Instructions” on page 2-6 in the Technical Bul-letin section of this manual.)

1. Refer to drawing 175000 (M-360S Drawings and Schematics Manual).


3. Remove the older large wire generator (P/N 172567) from the VMEcard cage and replace it with the universal generator board (P/N175507). Be sure the board is seated into the back plane and the switchis in the low level position. Boards with Revision F or later should havethe rotary coded switches set to: SW1-MSB = 0; SW2-LSB = 1. Boardsearlier than Revision F should have the rotary coded switches set to:SW1=0; SW2=0. Fasten the board into the VME card cage with theboard’s built in screws.

4. Remove the older I/O board (P/N 172532) from the VME card cage andreplace it with the new universal I/O board (P/N 175512). Be sure theboard is seated into the back plane. Check that the rotary codedswitches have these settings: SW1-LSB = 1; SW2-MSB = 0; SW3-IRQLevel = 2. Tighten the board into the VME card cage with the board’sbuilt in screws.

5. Remove junction board (P/N 172592) from the upper bond head assem-bly and replace with new forcer focus board (P/N 175537) Be sure theboard is screwed into position.

GETTING STARTED Installing the Bond Head


6. Unplug the cable (P/N172606) from the rear of the spool driver assem-bly. Remove the large teflon tubing that runs from the spool driver tothe wire feed rollers. Remove the spool driver assembly by removingthe three cap screws that secure the spool driver to the frame. The spooldriver should now be free from the bonder. Set this unit aside.

7. If a Leadframe Handler with pulltest is part of the machine, remove thepulltester cover and the first pulltester (closest to bond head). This isrequired due to head clearance during rotation.

8. Remove the cover from the Z/Theta bearing assembly.

9. Remove the small and large teflon tubes that run from the dereeler tothe bond head.

10. Remove the stainless steel tube that runs down the center of the Z tubeby loosening two screws and the set screw on the wire guide mountplate (P/N 172124). Remove the old wire guide mount plate. They willnot be used with the Small Wire bonder.

11. Install new wire guide mount plate (P/N 175236) included with the kitand the wire guide tube assembly (P/N 175000-98). The bend in thetube should be aligned directly behind the camera tube.

12. Attach the new dereeler assembly (P/N 175200) with the brackets sup-plied. Route dereeler cable (P/N 175603) from the dereeler to the forcerboard.

13. Install regulator (P/N 175000-99) and set it to 40 PSI. Nitrogen or cleanair is used to help feed the wire, maintain the wire loop in the sensorblock, and keep the wire clean.

14. Install tubing from the regulator to the back of the dereeler. Make surethe Z cable is routed behind this tube and does not rub on the opticstube.

15. Remove the large wire bond head and replace it with the small wirebond head. The same Z cable is used for both the large wire and smallwire bond heads.

16. Remove camera and optics tube, attach the new optics tube(P/N 175022) to the camera. Replace camera assembly and set aside theold optics tube. Note: Camera must have the serial number facing therear of the machine or the picture will be upside down.


18. The software will automatically detect the type of head installed andcheck to make sure that the generator is set to the correct mode.

19. Adjust the new bond head to be parallel to the Z bracket. Torque themounting screw to 3.40 N-m (30 inch-lbs.).

20. Follow the calibration procedures on the monitor.

GETTING STARTED Machine Warm-up


21. Install the newly supplied Z Bearing Cover (P/N 175250).

Machine Warm-up

To achieve accurate bond placement, the machine should be allowed towarm up for at least one hour before calibrating or creating wire lists formost applications. For the highest accuracy bond placement, allow themachine to reach steady state temperature by warming up for two hours.

Initial Set-Up

This section describes installation of the bonding tool, the initial calibration,and feeding the wire into the machine

Installing Bonding Tool

1. Go to MAIN MENU and select [4] - Manual Positioning.

2. Use the spinners to bring the head forward to a convenient position.

3. Loosen the transducer tool setscrew.

4. Insert the tool provided into the transducer, with the flat face of the tooltowards the setscrew. Push the tool up.

5. Slip on the gauge block (P/N 175010) and push the tool down until it touchesthe bottom of the gauge block. (See Figure 2-1 ). Torque the setscrew to 2 in-lb (0.226 N-m).

Figure 2-1 Adjust the Tool Using the Tool Height Gauge P/N 175010

Tool Height Gauge 175010

GETTING STARTED Initial Calibration


NOTE: Gauge length for the Small Wire Tools is 25.5 mm.

6. From the Main Menu, enter [7] on the keyboard to access the Cali-bration Menu. Press [3] to access Generator Test. The Generator Phasemust be set first, if requested on the screen. Press [START] to pulsegenerator, note the scale reading on data monitor. The reading should bea minimum of 50. If not, the tool setscrew may be loose or worn, orthere may be a problem with the tool or transducer.

After the bond head is installed, the bonder must be calibrated before it canbe programmed or used in production. The following calibration procedure isto be used when the Small Wire bond head is installed for the first time.Thereafter, calibrate as needed, similar to the procedure used for the LargeWire bonder.

Initial Calibration

The CALIBRATION MENU is shown in Figure 2-2. New subscreens havebeen added to the CALIBRATION MENU for items [4], [5], and [6]. Screen[6] was changed to read “Adjust wire clamp”.

Figure 2-2 Calibration Menu Screen

PROGRAM NAME


CALIBRATION MENU

[1] - Tool check 2 - Offsets 3 - Generator test 4 - LVDT Calibration 5 - Force 6 - Adjust wire clamp 7 - Recalibrate XY 8 - Recalibrate Z 9 - Recalibrate home A - Recalibrate limits B - Internal settings C - Focus offset D - Magnification


ARROWS

F16: Main menu

This field will show "No Files" when first converted to small wire.

GETTING STARTED Dereeler Calibration


Begin the initial calibration in the following order:

Refer to Chapter 7, “REFERENCE GUIDE” on page 7-1 for additionaldescription of each screen.

Dereeler Calibration

NOTE: For calibration of Dereeler board 175552, refer to Chapter 3,“Dereeler Calibration (Dereeler PCB 175552)” on page 3-8 For calibration of Dereeler board 175522, refer to Chapter 8,“Dereeler (Dereeler PCB 175522)” on page 8-4.

Installing the Wire

1. Insert a spool of wire on the spool holder so that the wire feeds from thebottom and to the right of the spool.

2. The spool rotation-direction switch (SW1) must be placed in theCounter-clockwise position.. Remove the cover from the Dereeler toreveal the dereeler PCB Assembly 175522 or 175552. The motor rota-tion-direction slide switch is located at the top-right edge of this board.

3. Referring to Figure 2-3 on page Supplement-20, thread the wirebetween the lower two guide pins on the Sensor Plate, and between thethree upper guide pins. Close the Sensor cover and put the toggle switchto "Auto" position. This will begin the flow of air and help form theloop in the sensor. The Air Pressure gauge should be set to 40 psi.

1. Check Dereeler calibration 5. Generator calibration

2. LVDT calibration 6. Clamp calibration

3. Force calibrationa) Spring calibrationb) Damping calibrationc) Forcer calibrationd) Damping calibration (again)

7. Offset calibration

8. Clamp calibration (again)

4. Magnification calibration NOTE: After initial calibration, you only need to calibrate as necessary.

GETTING STARTED Installing the Wire


Figure 2-3 Threading the Dereeler

4. With tweezers, feed about 2” of wire through the wire guide and intothe wirefeed capillary. If sufficient wire is in the feed tube, then thewire will feed using the air.

5. Press the “Wire Thread” button to air-feed the wire, and momentarilypress the toggle switch to the “Feed” position to despool some wirewhile pressing the Wire Thread button, until the wire exits the feed tubenear the bottom of the head.

6. Insert the wire through the lower wire guide and into the lower teflonfeed capillary (Figure 2-4 on page Supplement-21) and feed until thewire exits the stainless steel feed tube near the clamp.

Wire Guide

WireCapillary

Upper Guide Pins

Lower Guide Pins

Wire Loop

GETTING STARTED Installing the Wire


HINT: Hot key F5 will fire a 1 second burst of energy from the genera-tor when available on screen. A burst of ultrasonic energy can aidin threading small diameter wire by dislodging any debris caughtin the tool feed hole.

Figure 2-4 Threading the Head

7. Go to the MAIN Menu and select [A] - Wire Maintenance.

8. Press [F12] to rotate the head 90 deg. if desired, and feed the wirethrough the jaws of the clamp and into the hole in the tool. Use [F10] toopen and close the jaws.

9. The completed wire threading should appear as shown in Figure 2-5.

Figure 2-5 Threading the Tool

Wire Feed Capillary

Teflon Feed Tube

Wire exits here for threading guide and into tool

Wire threaded through the clamp tool

GETTING STARTED LVDT Calibration


LVDT Calibration

1. Select item [4] - LVDT calibration from the CALIBRATION MENU.The screen contains instructions for this procedure. The LVDT value isshown on the screen.

2. Loosen upper and lower stop adjustment screws so that the transducercarrier can rock up and down freely. See Figure 2-7.

3. Place the 0.125 inch (3.175 mm) gauge pin (P/N 643100 provided in theSetup Gauge Kit) against the notch in the lower stop holder, whilegently pressing down on the transducer arm. See Figure 2-6 . Releasethe transducer arm to hold the pin in place. This step positions the trans-ducer arm in the perpendicular position. Figure 2-6 shows the notchfor the gauge pin.

Figure 2-6 Using Perpendicularity Gauge Pin for LVDT Calibration

4. Loosen the LVDT core set screw and position the core to obtain areading between -5 and 5. Ideally, this value should read “0”. Be awarethat small motion of the core will make large changes in the numbers onthe screen.

5. Retighten the set screw. The LVDT step sensitivity scale factor is finerthan on the standard 360C machine.

6. Press [START] to record the value and bring up the next screen.

Apply gentle downward pressure on Transducer Carrier to install Gauge Pin

LVDT set screw

Gauge Pin (0.125") in place

LVDT Core



7. A new screen will appear that asks you to remove the perpendicularitypin and press [START]. This action will bring up the screen shownbelow.

8. Adjust the upper LVDT stop adjust screw (Figure 2-7) so that thereading of LVDT value shown on the screen is 0.015 ±0.002 inches.Press [START] to continue.

Figure 2-7 LVDT Stop Adjustment Screws

Program Name LVDT CALIBRATION LOG 1LINK File(if used)

Set UPPER stop position to 0.015" +/- 0.002"Distance from perpendicularity position:

0.015", 0.38mm

START: Proceed

F16 Abort

Upper Stop set screw

Lower Stop adjust screw

Lower Stop set screw

Upper Stop adjust screw



9. The next screen directs you to set the lower stop position. Do the adjust-ment then press [START] to proceed.

NOTE: The Transducer Carrier lower stop set screw is set tight at thefactory to prevent movement of the carrier during shipping. If theTransducer Carrier does not move an appropriate amount, youwill get a screen with an error message "Unable to move the toolwith the forcer. Check the upper and lower stops for sufficienttravel"

10. The system will now touch down to calibrate LVDT vs. Z steps andthen will move to the home position.

11. The next screen allows you to adjust for system stack up tolerances. Usethe v a lu es show n i n Ta b le 1 , “ S t ac k - Up To le r an ce s , ” o npage Supplement-25. Adjust the upper stop to obtain the value selectedfrom Table 1 for "Upper Stop Setting".

The Stack-Up tolerance is the height variation of the part being bonded.

NOTE: When touching down to calibrate Z for a wire list, it is recom-mended you use a part built to nominal (+/-0.000 stack-up)dimensions. This will ensure that the whole range of stack-upmotion will be usable during the lot run.


Set LOWER stop position to 0.015" +/- 0.002"Distance from perpendicularity position:

0.015", 0.38mmMANUALLY press down on tool to make sure it is against the stop.

START: Proceed

F16 Abort

GETTING STARTED Force Calibration


12. Press [START]. The Forcer is now activated. Adjust the lower stopscrew to obtain the lower stop setting (see Table 1). Gently lock thelower stop set screw. Press [START] to Save.

Force Calibration

1. Select item [5]- Force on the calibration screen. This will bring up anew subscreen as shown below.

Table 1: Stack-Up Tolerances

STACK-UP TOLERANCE

UPPER STOP SETTING

LOWER STOP SETTING

±0.005” 0.011-0.014 0.016 ±0.002

±0.010” 0.015-0.018 0.019 ±0.002

±0.015” 0.019-0.021 0.022 ±0.002


Adjust the upper stop to account for system stack up.Distance from perpendicularity position:

0.015", 0.38 mm

START: Calibrate

F16 Abort

PROGRAM NAME FORCE CALIBRATION


Force: [50]Z height: [0 ]

Remove wire from tool before calibrating forcePress LEFT or RIGHT arrows to change focus, Current value 3

START: Apply force

SPIN XY F9: Calibrate spring-OK F14: Touch down with force

ARROWS F10: Calibrate damping-OK F15 Load default references

F11: Calibrate forcer-OK F16: Exit

GETTING STARTED Force Calibration


2. Press [F9] to calibrate the spring force and follow instructions on thedata terminal. Hook the calibration weight (OE P/N 175347) on top ofthe bond tool, when asked.

3. Press [F10] to calibrate damping. This calibration is automatically per-formed by the system. You will see the transducer oscillate in the Zdirection a few times then stop. The calibration is complete.

4. Position the digital scale on the workstage and use the spinners to posi-tion the crosshairs on the video monitor over the center of the scale. UseArrow to go to [Z height]. For convenience, the Spinners can nowadjust the Z height for a temporary setting above the gram scale. Set theZ height so the tool is about ¼ inch (5 mm) above the scale. Press [F14]to mark the temporary height. This will reduce the time spent in Z travelfor tool touchdowns during forcer calibration.

NOTE: A plate must always be used on the top of the scale. Without aplate, the bond tool may damage the scale and get false or incor-rect readings.

5. Press [F11] to calibrate the forcer and follow the instructions on thescreen. Use the Y Spinner to adjust the forcer until the value on thescale matches the value shown on the screen. Continue until complete,then EXIT.

NOTE: During first-time forcer calibration you may see an error messageif the forcer references change by more than a predeterminedamount. Excessive reference changes during calibration maycause small errors in the force calibration. Repeat the calibrationa second time. A problem with the forcer is indicated if thismessage occurs repeatedly during force calibration.

HINT: Hot key F12 will cause the head to "retouch" during force cali-bration. The bond head will move up and then touch downthrough overtravel at the same force level. Use this feature whenyou want to check that the flex in the force scale has been prop-erly compensated.

GETTING STARTED Magnification Calibration


Magnification Calibration

1. Select item [D] from the Calibration Menu to bring up the Magnifica-tion Calibration screen. At the same time, the video monitor will show ahorizontal line and two vertical lines, forming two crosshairs.

2. Load a device with easily noticeable features into a workholder.

3. Following the instructions on the Calibration Screen, use the spinners toposition the left crosshair visible in the video monitor over a feature onthe device (such as a fiducial mark or corner of a bond pad). Press[START].

4. Use the spinners to position the right crosshair over the same feature.Press [START].

5. Press [F13] to save.

Generator Test

During setup, this test determines if the bonding wedge is located properly inthe transducer and that the guide is clear of the bonding tool. The F14 key isalso available to calibrate the software controlled maximum generatoroutput.

1. Select Item [3] on the Calibration Menu.

2. Press [START] to energize the generator. Note the scale reading on thedata monitor. The reading should be a minimum of 50. If below, checkto make sure the set screw is secure.

Additional information on this test is located in Chapter 7, “Generator Test”on page 7-132.

Clamp Position Adjustment

1. Remove the bonding tool and install the wire clamp gauge (P/N175013) into the transducer. (Figure 2-8 on page Supplement-28).

NOTE: There is more than one Wire Clamp Gauge. Refer to Table 2,“Wire Clamp Gauges,” on page Supplement-28 for the propergauge.

GETTING STARTED Clamp Position Adjustment


Figure 2-8 Wire Clamp Adjustment Gauges

Table 2: Wire Clamp Gauges

175013 2 mil with bent feed tube

175013-1 3 mil with bent feed tube

175013-2 2 mil with straight feed tube

175013-3 3 mil with straight feed tube

175013-4 1.5 mil with bent feed tube

Bent Feed Tube Straight Feed Tube

Bent Feed Tube Gauge

Straight Feed TubeGauge



2. Loosen the two clamp mounting screws on the wire clamps (Figure 2-9). Position the clamps so the tips of the wire clamp rest on the bottomstep of the wire clamp gauge with the tips also touching the face of thegauge and retighten the screws. This sets both the height and gapbetween the bond tool and clamps.

NOTE: Apply force only to the stationary arm of the clamp (left side)when making adjustment.

3. Re-install the bond tool using the tool height gauge (175010). Performthe Generator Test again. This should be done every time the tool ischanged.

4. For the following procedures, Figure 2-9 shows a close up of the frontview of the Clamp assembly, while Figure 2-10 on page Supplement-30 shows a side view of the location of the Fine Adjust Screw.

NOTE: The use of a small mirror and the microscope can help in check-ing the alignment of the clamps with the bond tool.

Figure 2-9 Adjusting Clamp Alignment

Slide Clamp Pivot Arm along shaft until clamp lines up with tool

Clamp Pivot Arm Cap Screw




5. Loosen the pivot arm screw. Make a coarse lateral adjustment to theclamp mounting block so that the tips of the wire clamp are alignedwith the tip of the bonding tool to within ±.005 inch. Retighten the pivotarm screw (see Figure 2-9 on page Supplement-29.

6. Make a fine lateral adjustment using the fine adjustment screw in theclamp adjustment block to center the wire clamp assembly (see figure2-10). Using a microscope and a mirror, insert a wire through thebonding tool. Pull about 1/2 inch (12mm) of wire straight out. Checkthat the wire feeds through the jaws, not under or around them. Whileturning the fine adjustment screw, look at the wire where it exits thebonding tool. Center the wire relative to the tool.

Figure 2-10 Fine adjustment screw for the Clamp Jaws

7. Adjust the clamp tip opening size. From the Main menu, select Calibra-tion menu (7), Adjust wire clamp (6). Follow the on-screen instructionsto complete the wire clamp adjustment.

Wire

Access the fine adjustment screw through the backside of the clamp assembly.

GETTING STARTED Adjust Wire Clamp Cable


Adjust Wire Clamp Cable

1. From the MAIN MENU, press [7] to select the CALIBRATIONMENU. Press [6] to select ADJUST WIRE CLAMP. Follow theinstructions on the screen.

2. To adjust the clamps to where they just close, loosen the locking nut forthe head clamp cable. Rotate the cable until the wire clamps just close,then tighten the locking nut (Figure 2-11). Press [START].

Figure 2-11 Clamp Calibration

3. Insert a 0.005 inch (0.125 mm) shim between the clamps. Press[START] to close the wire clamp jaws.

4. Press [START] and test to see if shim is loose in the clamps. If shim isloose, remove it and press [F16] to exit calibration procedure. If shim isNOT loose, press [START] to repeat calibration.

Locking Nut

Clamp Cable

GETTING STARTED Offset Calibration


Offset Calibration

From the CALIBRATION MENU (item 7 on the MAIN MENU), press [2]to select OFFSET CALIBRATION.

1. Press [HOME] on the keypad to home the bond head, then follow theinstructions on the screen. For this calibration procedure, the systemwill make nine bonds at 45 degree intervals, therefore wire must be inplace and dereeler turned on.

2. Place the crosshairs on the center of each bond and press [START].

NOTE: This procedure will use wire for the bonds. Set the dereeler to"Auto".

3. Complete all nine bonds and check center of pattern. Press [F13] toSAVE when complete.

NOTE: If tool offsets are not within posted range, the marks will berotated. The transducer must then be realigned in the transducercarrier and the offsets must be recalibrated. Figure 2-12 shows anexample of a tool offset pattern.

Figure 2-12 Tool Offset Pattern

Offsets not within posted range.

Offsets within posted range. Notice how the bonds are arranged on the crosshairs.

GETTING STARTED Offset Calibration


NOTE: If you are using the Small Wire head on a machine with anOrthodyne Handler, you may want the optional Offset Calibra-tion Platform, kit number 175354. The platform gives you a con-venient raised platform for performing the test without danger ofcrashing the head into nearby structure.

GETTING STARTED Cleaning Bonding Tools


Cleaning Bonding Tools

Keeping tools clean is critical to the proper operation of the bonder. Bondingwith a dirty tool can not only shorten its life, but also lower the quality of thebonds. The average life span of a standard tool is approximately 300,000bonds. With proper care, however, the life of a tool can be extended to asmuch as 500, 000 bonds per tool.

Tools should be cleaned every 20,000 bonds, or when aluminum buildupcauses bond quality to suffer. Bonds with heel cracks in the first bond of thewire indicate excessive aluminum buildup in the bond tool or impropersetup. After a tool is freshly cleaned, it will behave similar to a new tool andthe first few bonds may not stick.

Use the following procedure to clean tools:

1. Clean tools in a plastic container. To avoid chipping, clean toolsindividually or in a way in which they will not come into contact witheach other. This precaution especially applies if you are using anultrasonic cleaner.

CAUTION: DO NOT USE glass or similar hard material containers toclean bonding tools. These materials may chip tool edges.

2. Clean tools in a room temperature solution of 20% sodium hydroxide(NaOH)*. No substitutes! Soak tools until clean.

CAUTION: Do not, under any circumstances, use:

Acetone AlcoholMethylethylketone (MEK) Trichlorethylene (TCE)Styrene FreonOr any other solvent to clean or rinse the tools.

Rinsing with solutions other than water can cause rapidbuildup of aluminum in the groove.

CAUTION: When handling NaOH*, be sure to comply with:

1) Material Safety Data Sheet for this product, and2) Local regulations governing this substance.

GETTING STARTED Cleaning Bonding Tools


HINT: If you wish to reduce cleaning time, you can warm the solutionslightly. Do not exceed 30 degrees C. Higher temperatures canresult in faster erosion of the bond tool tip will cause rapidbuildup of aluminum.

Cleaning usually takes 10 to 20 minutes. However, you can leave tools up tofour hours in room temperature solution without damaging them.

3. After cleaning, rinse with water (deionized water is preferred) and blowdry with oil free air. Use faucet water if DI is not available. Do not airdry since it will leave a residue on the tool’s tip. Leaving tools in the DIis not recommended because it will affect the surface of the bond tooltip and cause rapid aluminum buildup on the tool.

*NaOh is on the California Director’s List of Hazardous substances

USER'S SUPPLEMENT

DEVICE ID SENSORSUPPLEMENT

Document Part No. DC04-176874

ISSUE DATE: September, 2000




Telephone (949) 660-0440

FAX (949)-660-0444





F O R W A R D



9/29/00 Initial publication

Z:\GEORGE\WORK\Special Projects\Device ID Sensor\Device ID cvr.fm

-2 Device ID Sensor Supplement

TABLE OF CONTENTS

CHAPTER 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1Overview 1-1Functional Description 1-2

Device ID Sensor 1-3Theory Of Operation 1-4

CHAPTER 2 KIT INSTALLATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1Contents 2-1Installation 2-1

ID Sensor Unit 2-1Digital Amplifier Block 2-3Junction Board 2-4EPROMs 2-4

CHAPTER 3 OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1Transport Menu Window 3-1

Programming The Sensor ID 3-1Error Condition 3-2

Device ID Sensor Supplement TOC-i

Z:\GEORGE\WORK\Special Projects\Device ID Sensor\OVERVIEW.FM

C H A P T E R 1

This manual describes the operation of the Device ID Sensorpackage. This kit works in conjunction with the Wide Matrixconfiguration of the Model 360C-H.

The technical documentation with this kit includes:

Device ID Sensor package Installation Instructions

Device ID Sensor operating instructions

Device ID Sensor drawings and schematics

The Model 360C-H Wide Matrix wire bonder machine is tailoredto operate with a customer-specified leadframe that is wide enoughfor leadframes with widths of 50mm to 75mm. A special set ofclamp tooling was developed for the wide matrix leadframe. Itpresses the row of devices against their individual device heatsinkanvils.

The function of the Device ID Sensor package (Drawing No.176874) is to provide a means of identifying a preset code stampedinto the leadframe corresponding to the specific device bonded onthe leadframe. This will provide protection against inadvertentlymixing leadframes with different devices on a bonder programmedfor one specific device.

If the Device ID Sensor package detects a leadframe with adifferent device code than is programmed for the currentproduction run, it will stop the machine and signal for operatorintervention.

INTRODUCTION

Overview

Device ID Sensor Supplement 1-1

Functional Description INTRODUCTION

The Device ID Sensor can be installed on any Model 360C-H/C-HD bonder.

The Model 360C-H with the Wide Matrix option has severalspecially designed features. They include leadframe Input andOutput Magazine Handlers, a wider Transport mechanism, andcustom Clamp Tooling at the bonding station. The location ofthese machine elements are shown in Figure 1-1.

Figure 1-1 Model 360C-H With The Wide Matrix Handler Option

A close-up view of the Transport Track is shown in Figure 1-2, onpage 1-3. The leadframe is fed onto the Transport Track from theInput Magazine Handler, in the direction shown by the large arrow.The leadframe is pressed against the track by the Hold Down


Transport

Input MagazineHandlerOutput MagazineHandler

Input MagazineHandler

Device IDSensor

1-2 Device ID Sensor Supplement

INTRODUCTION Functional Description Device ID Sensor

Roller. The Device ID Sensor consists of LED sources that directlight up to the leadframe, and sensors to measure the reflectedlight.

Figure 1-2 Leadframe Transport with Device ID Sensor

Device ID SensorThis version of the Leadframe Transport is equipped with a DeviceID Sensor to determine the identity of the device on the leadframe.The Sensor consists of a series of 8 LED reflective sensorsarranged in a four-by-two array. The sensor package is illustratedin the sketch as shown in Figure 1-3, on page 1-4.

Transport TrackHold Down RollerUnit

Multiple DeviceClamp Station

Device ID Sensor

Leadframes feed inthe direction shownby big arrow

Device ID Sensor Supplement 1-3

Theory Of Operation Functional Description INTRODUCTION

Figure 1-3 Sensor Array On Transport Track

Theory Of Operation

The leadframe is identified by a code consisting of a pattern ofholes in the leadframe. The hole pattern is read by the sensor afterthe first device is clamped in the bonding station. The Device IDSensor then translates the pattern into a numerical value. If thedetected value corresponds to the value programmed for theleadframe, the bonder proceeds and the transport unit indexes theleadframe to the bonding station.

However, if the detected code does NOT correspond to theprogrammed code, the machine will stop and signal for operatorintervention. The operator must then determine whether to removethe leadframe, change the code, or manually cycle the partsthrough the bonder.

The code is determined by the detected pattern of holes asillustrated by Figure 1-4, on page 1-5. The sensors may respond toany combination of holes excluding “no holes” or “eight holes”.These exclusions are to provide a fail-safe condition in case thesensors are all blocked, or an electronic failure causes them all tosignal.

The number of possible combinations with seven hole positions is254. Thus codes can be established for 254 different die devices.

Front Of Machine

Hole Sensor #0

Hole Sensor #7


Theory Of Operation Functional Description INTRODUCTION

Figure 1-4 Hole Pattern Combinations

Each hole-sensor position shown in Figure 1-4 represents a binarynumber having the form 2n where n is the sensor position. A programnumber value is calculated as the sum of these values from only thesensors which have detected holes.

For example, if a hole is detected at sensor position “0”, the systemwould read a value of “1”. If the holes detected are over sensorpositions “0” and “7”, the system would read a value of “129”.

The value read is checked against the operator-entered value toconfirm that the correct leadframe is present.

2 7 = 128 2 6 = 64 2 5 = 32 2 4 = 16

2 3 = 8 2 2 = 4 2 1 = 2 2 0 = 1

1

56

2

7

03

4

Front Of Machine


Z:\GEORGE\WORK\Special Projects\Device ID Sensor\Kit Installation.fm

C H A P T E R 2

The Device Sensor ID Kit consists of the following items:

1. Device Sensor ID unit and mounting bracket (P/N 176874)

2. Set of sensor amplifiers

3. Fiber optic cable bundle that goes from Item 1 to Item 2

4. Terminal Strip for connecting to the I/O board

5. EPROMs with software version 5.0 for the CHD Handler andTransport:

For Model 360C-H: (2) Magazine Handler EPROMs(P/N 173702-1) & (1) Transport EPROM (173702-2)

For Model 360C-HD: (2) Magazine HandlerEPROMs (P/N 173702-1) & (2) Transport EPROMs(173702-2)

6. Holdown Assembly and fasteners.

7. Drawings and Schematics

8. User Manual Supplement

CAUTION: Before removing and handling electronic boards, make sureyou are properly grounded and follow ESD procedures.Failure to do so may result in damage to the sensitive com-ponents on the board.

KIT INSTALLATION

Contents

Installation

DEVICE SENSOR ID USER’S MANUAL 2-1

ID Sensor Unit Installation KIT INSTALLATION

The Sensor unit attaches to existing holes in the Transport TrackMounting Plate. Figure 2-1, on page 2-3 shows the Sensor unitinstalled in the correct location.

1. Attach the Device ID Sensor to the Transport Track so thathole-sensor #3 is located to the front-left of the machine.

2. Slide a leadframe on the Transport Track and position the firstdevice at the clamping station. Activate the clamp.

NOTE: If your machine does not have a Mis-Index option then you mayskip Step 3. You must have software version 4.1 installed to runthe Mis-Index sensors.

3. With Mis-Index sensor system equipped machines the clampmay not activate if it senses the leadframe is not in the correctposition. If the clamp fails to activate:

a. Turn the sensor dip switch to “D on” (dark on). SeeFigure 2-3, on page 2-4.

b. Clamp the leadframe in the correct position relative tothe clamp fingers and anvil.

c.Turn the sensor dip switch to “L on” (light on).

4. Align the Device ID Sensor so that the LED lights can be seenclearly through the holes in the leadframe.

HINT: Look at the number shown on the Digital Amplifier Block. Posi-tion the Device ID Sensor so that the amplifier displays thelowest number.

5. Adjust the position of the Sensor so that the digital amplifierscorresponding to the holes in the leadframe that are farthestapart result in the lowest reading. This means the mostamount of light is going through the holes. The digital ampli-fier block is located as shown in Figure 2-2, on page 2-4.

6. Tighten the Sensor mounting screws.

7. Adjust the Hold Down Roller Unit so that the leadframe isheld firmly against the Track/Rail near the ID Sensor.

ID Sensor Unit

2-2 DEVICE ID SENSOR USER’S MANUAL

KIT INSTALLATION Installation ID Sensor Unit

Figure 2-1 Sensor Unit Installation

Hold Down RollerUnit. (Photo showsprototype unit).Sensor Unit

DEVICE ID SENSOR USER’S MANUAL 2-3

Digital Amplifier Block Installation KIT INSTALLATION

Figure 2-2 Digital Amplifier Block Installation

Figure 2-3 Setting The Sensitivity

Digital Amplifier Block

Sensor FiberOptic Cables

Sensor AmplifierBlock

1. The sensitivity number is shown in the Digital LEDmonitor display on each amplifier.

2. To set the sensitivity number, press the Manual(toggle) button in either the (+) or (-) direction toincrease or decrease the number shown on the LEDdisplay.

3. Set the sensitivity of all eight (8) amplifiers so that thenumber reads 1500 (see Figure 2-3).

Digital Amplifiter Part Number:

P/N 708512


KIT INSTALLATION Installation Junction Board

The Junction Board (P/N 173557) is located in the rear portion of thetransport track assembly, near the pull tester location. DisconnectCable J19 from the I/O board (P/N 173552) and plug it intoconnector J3 on the Junction Board. This completes the electricalinstallation of the kit.

The new set of EPROMs (P/N 173702-1) and (173702-2) replacethe existing ones in the Transport Unit and Magazine Handler.

1. Power Down the bonder.

2. Remove cover plates from Transport Unit and the MagazineHandlers.

3. Locate the EPROMs on the CPU’s and replace with the newunits.

4. Replace covers, and boot up the machine.

Junction Board

EPROMs


OPERATION Transport Menu Window Programming The Sensor ID

C H A P T E R 3

OPERATION

The Menu Window in the Transport Unit appears as in Figure 3-1when the Device ID Sensor kit is installed.

Figure 3-1 Main Menu Window

The only difference in the Main Menu is the addition of thefunction line [F2: Set Device ID]. Use this function to set theDevice Identifier Value for the Device ID.

NOTE: The input keys you will be using are the Transport’s “F” keys.The bonder’s “F” keys will not perform these functions.

1. Press [F2]. This will bring up the window shown in Figure 3-2.

Figure 3-2 Device ID Programming Window

Transport Menu Window

MAIN MENU

1 Unclamp2 Index3 Feed in4 Feed out

5 Input handler6 Output handler7 Setup menu

F2: Set Device ID

Programming The Sensor ID

-: DEVICE ID SETUP :-

Device identifier value

F1: Save F4: Abort


Error Condition Transport Menu Window OPERATION

2. Using the keypad on the Transport Station enter the DeviceIdentifier Value (1 through 254) for the corresponding lead-frame.

3. Press [F1] to Save.

If the Device Sensor unit detects a code on the leadframe that isdifferent than the programmed value, the machine will stop andshow an error condition on the Transport Unit screen as shown inFigure 3-3.

Figure 3-3 Error Condition Screen

1. Press any key to continue. This will take you back to the MainMenu.

2. You may now press [F2] to enter a new value and press [F1]to save, or

3. Remove the Leadframe strip and insert the correct coded lead-frame, or

4. Use the Main Menu commands to continue bonding opera-tions.

Error Condition

-: RUN HALTED ON ERROR :-

Device ID Read: 160, Expected: 1

Press any key

F4: Abort


USER'S SUPPLEMENT

ACTIVE LOOP CONTROL BOND HEADSETUP

MANUAL No. DC04-177000H

ISSUE DATE: Jan, 2003

Orthodyne Electronics Corporation16700 Red Hill AvenueIrvine, California, U.S.A. 92606-4802Telephone (949) 660-0440FAX (949)-660-0444E-mail [email protected] Rights Reserved.



FOREWARD

EffectivityThis manual represents Model 360C ALC configurations built after January 2000. This configuration has an ALC Bond Head with a low profile Clamp Jaw Assembly to enhance bonding in tight packages.

Machines built prior to Jan 2000, may present some differences in the descriptions of certain sub-assemblies.

Revision History

Date Revision Description of Change

9/29/99 A Revised to incorporate software version 5.7h

12/1/99 B Revised to incorporate software version 5.7i.

1/17/00 C Revised to incorporate software version 5.7J. Expanded Index. Incorpo-rate low profile clamp assembly.

5/12/00 D Added additional information on Pull test values in Chapt. 5. Incorporate supplement into M360C User’s, software version 5.8

11/12/01 E Added Chapter 7. Updated information to 5.8C software revision. MMR 103101-1.

5/14/02 F Added "Wire Size Dependent Items" chart to Chapter 2.

1/8/03 G Updated, MMR 102402-1.

1/8/03 H Updated, MMR 102402-1.

TABLE OF CONTENTS

DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1Theory of Operation 1-3

Wire Bond Definitions 1-3Active Loop Control Bond Head Kit 1-4

Bond Head Assembly 1-4 Wire Clamp Mechanism 1-5

New Circuit Board Assemblies 1-6 I/O Board 1-6 Forcer / Focus Board 1-6

General Operating Considerations 1-8 General 1-8 Summary of Changes for Active Loop Control 1-8

Getting Started 1-10Installing the ALC Bond Head Kit 1-11

BOND HEAD SETUP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1Bond Tool Setup Summary 2-2Bond Tool Setup Details 2-3Wire Guide Height Setup Summary 2-7Wire Guide Height Setup Details 2-8Wire Guide Side-to-Side Alignment Summary 2-10Wire Guide Side To Side Alignment Details 2-11Wire Guide Opening (Gap) Setup Summary 2-12Wire Guide Opening (Gap) Adjustment Details 2-13Vertical Adjustment of the Wire Clamp Summary 2-14Vertical Adjustment of the Wire Clamp Details 2-15Lateral Adjustment of the Wire Clamp (Part 1) Summary 2-16

PART 1 2-16Lateral Adjustment of the Wire Clamp (Part 1) Details 2-17

PART 2 2-18 Lateral Adjustment of the Wire Clamp (Part 2) Details 2-19Fine Adjustment of the Wire Clamp Fixed Jaw Details 2-21Fine Adjustment of the Moveable Wire Clamp Jaw Summary 2-22Fine Adjustment of the Wire Clamp Moveable Jaw Details 2-23Adjusting the Wire Clamp Force Summary 2-24Adjusting the Wire Clamp Force Details 2-25

Clamp Open Steps 2-26Wire Cutter Configurations 2-27Wire Cutter Details 2-28Setting Up the Cutter Holder and One-Piece Front Cutter Summary 2-29Setting Up the Cutter Holder and One-Piece Front Cutter Details 2-30Setting Up the Front Cutter Pusher Summary 2-33Setting Up the Front Cutter Pusher Details 2-34Setting Up the Two-Piece Front Cutter Summary 2-35Setting Up the Two-Piece Front Cutter Details 2-36

Active Loop Control Bond Head Supplement TOC-1

TABLE OF CONTENTS

BOND HEAD MOVEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Home to Search 3-1 Search to First Bond 3-2 First Bond to Loop Top 3-2 Loop Move 3-3 Second Bond 3-3 Hopback 3-4 Cut Move 3-4 Cut Move to Interwire Height 3-5

INLINE BOND PULL TEST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1Setting Up the Inline Bond Pull Test 4-3

Pull Test Force 4-6 Pull Test Frequency 4-7 Pull Test Control Screen 4-7 Pull Test Data Screen 4-9

Calibration Procedure 4-11

PREVENTIVE MAINTENANCE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1Caution 5-1PM That Directly Affect Wire Drag Force 5-2

Wire Feed Tubes 5-2 Replacing the Small Teflon Wire Feed Tube 5-2 Replacing the Large Wire Feed Tube 5-3

Cleaning the ALC Jaws 5-4 Background 5-4 Solution 5-4 Material Required 5-4 Procedure 5-4 Cleaning Interval 5-5

Dereeler 5-6 Feed Wire / Tight Wire And Motor Speed Adjustment 5-6 Calibration Procedure 5-6 Spool Driver Motor Speed and Shutter Adjustment 5-9 Motor Speed Adjustment 5-10 Rollers 5-12

ALC Stepper Motor PM 5-13 Procedure 5-13

ALC TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1

ALC PULLTEST REMOTE SPECIFICATION . . . . . . . . . . . . . . . . . . . . . 7-1General Description 7-1

System Requirements 7-1Standard Mode Handler Type 1 7-2


TABLE OF CONTENTS
Description 7-2 Interface Signal Description - Standard Mode 7-3
Remote Mode Handler Type 2 7-5 Description 7-5 Interface Signal Description - Remote Mode 7-5


C H A P T E R 1

Orthodyne’s new Active Loop Control (ALC) head gives you positive controlof wire feeding during loop forming and step-back moves. This optional headfor our Model 360C family of wire bonders specifically addresses low loopand small step-back applications.

Low loop height with minimum step-back capability satisfies the needs oflow profile, dense package designs. Similarly, many power applicationsrequire long loop interconnection but are also constrained by a low profileconfiguration.

The Active Loop Control (ALC) head accomplishes controlled looping whileusing the same range of wire diameters (5 mil to 20 mil) as the standard head,and by incorporating a computer-controlled clamping device integral with thewire feed guide. Figure 1-1 shows a close-up of the new head arrangement. Thefollowing chapters will describe the installation, operation and adjustment of theALC head. The photo shows the latest maximum clearance clamp jawconfiguration.

Figure 1-1 Active Loop Control Head for Low-Loop, Small Step-Back Bonds

DESCRIPTION

Low Profile Clamp Configuration

Wire Guide

Bonding Tool

Cutter Blade

Pusher

Active Loop Control Bond Head Supplement ALC 1-1

DESCRIPTION

The Active Loop Control (ALC) Head has an additional feature whichallows the user to pulltest bonds immediately after they are made. We callthis feature the Inline Bond Pull Test.

The Inline Bond Pull Test feature works by programming the wire clampjaws to clamp the wire after the bond is made and exert a pull force of aselected value for a specified short interval of time, before continuing withthe rest of the wire loop forming steps.

The advantage of the Inline Bond Pull Test feature is that it lets you donondestructive testing of first and second bonds independent of loopgeometry or hook placement, for up to 100% of the wires. It is intended to bea companion to the usual quality control tests that you would apply to yourproduct, not a replacement for quality control testing.

The disadvantage of the Inline Bond Pull Test feature is that it adds time tothe wire loop forming process. Therefore, extensive use of the feature willshow up as a reduction in UPH.

Chapter 5 describes how to use and program the Inline Bond Pull Testfeature.

SUMMARY OF ALC ADVANTAGES & DISADVANTAGES

Advantages Disadvantages

Programmable control of wire loop formation Proper operation requires a precise setup of the bond tools

Consistent short step-back loops Strict adherence to PM schedule is required to mini-mize wire feed drag. If drag force exceeds a pro-grammed pull test force, that test is essentially invalid, but the accuracy of the rest of the pull test system is not affected.

Low loop height formation Inline Bond Pull Test adds time to the bond cycle

Inline Bond Pull Test of first and second bonds during wire loop formation

Inline Bond Pull Test is intended to augment, not replace, normal Quality Control inspection of the product

Inline Bond Pull Test is independent of hooks or wire loop geometry

Not a 100% guarantee of bond quality

Inline Bond Pull Test can be applied on to 100% of wire bonds

ALC 1-2 Active Loop Control Bond Head Supplement

DESCRIPTION Theory of Operation

One objective of the ALC head design is to create bonds with very low loopheights and minimum step-back. Using the standard Bond Head, whenforming wire with low loop heights and small step-backs, the wire has atendency to be forced back into the wire guide. This makes it difficult tomaintain a well formed and consistent loop.

The new design incorporates a programmable clamp, nestled in the wireguide, to clamp the wire at loop top and prevent it from going back up intothe wire guide during the critical loop-forming moves.

Figure 1-2 shows the typical elements of a bonded wire. The step-back is thedistance from the centerline of the first bond to the centerline of the secondbond. The Loop height is the distance from the bonding surface to the top ofthe loop. First and Second bond are self-explanatory.

Figure 1-2 Wire Bond Definitions

Theory of Operation

Wire Bond Definitions

First Bond

Second Bond

Loop Height

step-back


Active Loop Control Bond Head Kit DESCRIPTION

The Active Loop Control Bond Head assembly is interchangeable with thestandard large wire Bond Head. The differences between the two heads aremost noticeable in the arrangement of the parts in the lower portion of thehead. Figure 1-3 illustrates the tool configuration.

Figure 1-3 Active Loop Control Bond Head

The Active Loop Control Clamp jaws nestle in a cut out in the wire guide.The wire is fed through the wire guide as in a standard large wire head,passes through the jaws of the clamp, and exits to the groove of the bondingwedge.

The Active Loop Control Head option is available with front cut only. Thecutter blade and pusher have been optimized to function with the ActiveLoop Control Clamp mechanism. The cutter blade is secured into its holderwith one set screw. This makes cutter blade replacement easier.

Active Loop Control Bond Head Kit

Bond Head Assembly

Active Loop Control Clamp Jaws

Wire Guide

Cutter

Pusher

Bonding Wedge

Low Profile Clamp Assembly


DESCRIPTION Wire Clamp Mechanism

The Active Loop Control Wire Clamp mechanism operates during the loop-forming moves of the head to achieve precise loop control. Under softwarecontrol, the clamp opens and closes at strategic times during the wire feed toprevent the wire from going back into the wire guide.

The opening and closing of the wire clamp is controlled by a mini-steppermotor controlled by a local printed cirucit board. The cable mechanism isshown in the front view of the Bond Head in Figure 1-4.

Figure 1-4 Active Loop Control Clamp Mechanism

The stepper motor rotates a cam acting against the arm to which the clampcable is attached. Adjustment of this mechanism is covered in the calibrationprocedure section.

Wire Clamp Mechanism

Cutter Blade Holder

Wire Clamp Control Cable

Replaceable Cutter Blade

Pusher

Stepper Motor

Cable Control Cam


New Circuit Board Assemblies DESCRIPTION

The Active Loop Control Head kit 177402-2 requires the new I/O board (P/N175512) and the Forcer/Focus board (P/N 175537). Model 360C machinesbuilt after January 1997 (Serial #9701xxx) already include these boards. Kit177402-1, which is provided for older machines, will include all newrequired circuit boards.

When these boards are installed, they will work with the standard LargeWire, Small Wire, and Active Loop Control Bond Heads. The Active LoopControl Kit gives you the added flexibility of interchangeability with thestandard Large Wire head because the required software Version 5.7J isbackward compatible.

The new circuit boards are:

I/O board (P/N 175512)

Forcer/Focus board (P/N 175537)

The I/O board is located in the VME card cage, while the Forcer/Focus boardis mounted in the top bonder assembly housing.

The new I/O board (P/N 175512) is a universal circuit board designed towork with the Active Loop Control, Large, or Small Wire Bond Heads.

The new I/O board also provides a serial peripheral interface (SPI) signal tothe microprocessor in the Active Loop Control Bond Head.

Due to some additional connections required for new features, this boardrequires a new junction board, now called the "Forcer/Focus" board.

The Forcer/Focus board (P/N 175537), installed at the rear of the top bonderenclosure, replaces the previous junction board used in the standard Model360C (Figure 1-5, on page 1-7). The new Forcer/Focus board incorporatesall the functions of the previous board except that the SPI signal replaces thecut-switch signal. With ALC, this function is provided by the LVDT. If astandard Large Wire head were placed on the machine instead, the cut-switchline would be operative.

New Circuit Board Assemblies

I/O Board

Forcer / Focus Board


DESCRIPTION Forcer / Focus Board

Additional test points were incorporated into the board for the LVDT signalto facilitate troubleshooting.

The red tag on the board is a reminder that the Forcer/Focus board (see Figure1-5) must be used in conjunction with the new I/O board (P/N 175512), andrequires software version 5.4 or later. The latest software version is 5.7J.

.

Figure 1-5 Forcer / Focus Board

NOTE: The new I/O board (P/N 175512) and the new Forcer/Focusboard (P/N 175537) must be used together.


General Operating Considerations DESCRIPTION

No changes have been made to the General Operating considerations (referto Chapter 1 of the M360C User’s Manual) to accommodate the Active LoopControl Head. Changes made to the system for the Active Loop ControlHead are summarized below:

Software Version 5.7j

1. Clamp OPEN/CLOSE toggle selection was added to these menus:WIRE MAINTENANCE, WIRE PARAMETERS, REWORK, PULLTEST SETUP, and RUN.

2. "Clamp open steps" is a new field in the WIRE PARAMETERS EDITmenu screen. It takes the place of "Descent delay" which is not usedwith the wire clamp. The "Clamp open steps" field is also added to theWIRE MAINTENANCE screen.

3. "Pull Force" is a new field added to the WIRE PARAMETERS EDITmenu screen. This parameter is used to set the pull force for Inline BondPull testing. The default minimum value for pull force is dependent onthe wire diameter. Recommended values are shown in Table 4-3, onpage 4-8 in Chapter 4.

4. There is a different set of Default Wire Parameters for the Active LoopControl Head than for the standard Large Wire head. These DefaultWire Parameters are stored in different directories. When you changeheads, you will automatically get the Default Wire Parametersappropriate to the head that is installed. (Refer to the "ReferenceSection, Edit Menu [5], Wire Parameters [4]" in the User’s manual formore information on Default Wire Parameters).

5. The Active Loop Control Head rotates 90° in the clockwise directionwhen entering "cut depth calibration" in order to obtain a good view ofthe cutter with the microscope.

6. Software version 5.6B or higher (the current version is 5.7J) willautomatically detect the presence of the Active Loop Control Head.

General Operating Considerations

General

Summary of Changes for Active Loop Control


DESCRIPTION Summary of Changes for Active Loop Control

Software Version 5.8

1. A new function is added to the DIAGNOSTICS MENU that allows youto see LVDT values corresponding to pull displacements. These valuesare displayed in a new screen.

Software Version 5.8C

1. The software version features the addition of “No Pulltest” feature tothe Remote ALC Pulltest. It allows for two commands, “Pulltest” or“Proceed.” These commands are issued remotely during bonding toallow for a remote handler to specify if a bond should be pulltested.

A particular bond can be set to either Always pulltest, or to Remotepulltest. If set to Remote pulltest, the bonder will wait for the “Pulltest”or “Proceed” command.

The enhanced feature in Version 5.8C adds a third command option, ofNever Pulltest. The Never Pulltest option allows the user to specify thatcertain bonds should never be pulltested regardless of the commandsreceived during bonding.


Getting Started DESCRIPTION

1. If this is the first time installing the ALC Bond Head, install softwareversion 5.7J (or later version) before you begin the installation of thehead. (See the Software Release Notes supplied with your new softwarefor installation instructions.)

2. Install the Bond Head following the instructions on page 1-11.

3. When you power up the new ALC Bond Head for the first time, you canexpect to get an error report if you had previously been running aprogram created with a Standard Large Wire Bond Head. This errorreport will appear on the screen as follows:

This error report is the result of Wire Parameters which have not yet beenadjusted for the ALC. Proceed as follows:

4. Press any key to bring up the MAIN MENU, then go to the WIREPARAMETER screen.

5. Enter the default value of "Clamp open steps" for the appropriate wiresize (the value must be less than 30) as shown in Table 2-1, on page 2-26.Press [F13] to save this parameter with your particular file. (For moreinformation on Wire Parameter Edit, refer to the "Reference Section, EditMenu [5], Wire Parameters [4]" in the User’s manual.)

6. Press the [HOME] key on the keypad to initialize the Bond Head.

7. Proceed with the calibration of the head as described on page 4-11 ofthis supplement.

8. If you now cycle power, the new program will load without causingerror reports as long as you use it with the ALC.

NOTE: Each time you try to load a program created with a StandardLarge Wire Bond Head, you will get a reminder to change thewire parameters before bonding. The key parameter field tochange is the "Clamp open steps". You may also want to adjustthe loop parameters for your ALC application.

Getting Started

TIMEOUT WAITING FOR ACKNOWLEDGMENT FROM SPI

Press any key


DESCRIPTION Installing the ALC Bond Head Kit

The procedure described below is for the installation of an Active LoopControl Head kit to a Model 360C with a Large Wire Bond Head. Theinstallation kit includes two new circuit boards and new software.1 If themachine was purchased with the Active Loop Control Head configurationonly, then ignore steps 2 to 3 because these were performed at the factory.Please refer to drawing 172004-99 in the Drawing and Schematics Manual(P/N DC02-172000A) for the referenced item numbers.

NOTE: When installing the software for the first time, make sure that youinstall the software before changing any circuit boards. (For soft-ware loading instructions, see the Software Release Notes in theTechnical Bulletin section of the 360C User’s Manual.).


2. Remove the old I/O board (P/N 172532) from the VME card cage andreplace it with the new I/O board (P/N 175512). Check that the rotarycoded switches have these settings before installing the board: SW1-LSB = 1; SW2-MSB = 0; SW3-IRQ Level = 2. Be sure the board isseated into the back plane. Tighten the board into the VME card cagewith the board’s built in screws.

3. Remove the old Junction board (P/N 172592) from the upper bonderassembly and replace with the new Forcer/Focus board (P/N 175537)Be sure the board is screwed into position and that all connectors areproperly seated.

NOTE: You must remove the Large Wire Bond Head and replace withthe Active Loop Control Bond Head. The same Z-cable is usedfor both the Large Wire and Active Loop Control Bond Heads.

4. Remove the four pan screws and the Bond Head covers (18 and 10).

Installing the ALC Bond Head Kit

1. Model 360C machines built after January 1997 (Serial #9701xxx) already include the new boards as fac-tory equipment. They would not be in the kit (P/N 177402-2).


Installing the ALC Bond Head Kit Installing the ALC Bond Head Kit DESCRIPTION

5. Disconnect cable assembly J1 from the head junction board (46), and remove the cap screw and the cable clamp (89) attaching the cable assembly to the Bond Head. See Figure 1-6, on page 1-12.

6. On the Dereeler, open the top pinch wheels. At the Bond HeadBond Head, push the small teflon tube and the bonding wire up and into the metal wire guide tube with your fingers.

Figure 1-6 Head Junction Board’s Z Cable Connection

NOTE: Do not use tweezers on the teflon tube.

CAUTION: Prior to loosening the Bond Head clamp screw, support the Bond Head to keep it from falling onto any surface.

7. Loosen the Bond Head clamp screw (61) and remove the Bond Head from the Z/Theta bearing tube (see Figure 1-7). Make sure you support the Bond Head as you loosen the screw. Place the Bond Head on a clean table surface while you perform the rest of the procedure.

8. Replace any covers you removed from the Bond Head.

J1 Cable Assembly

Cable Clamp


DESCRIPTION Installing the ALC Bond Head Kit

Attaching the bond head follows the reverse order from the removal procedure.

1. Thread the Z cable assembly P1 through the top of the bond head, guide the metal wire guide tube into the hole in the wire tube guide, and seat the bond head on the Z tube. Make sure the bond head is completely seated on the Z tube.

2. Adjust the front face of the bond head frame so it is parallel to the Z/Theta bearing housing block and snug the bond head clamp screw.

CAUTION: Do not over-tighten the bond head clamp screw as this can damage the Z bearing tube.

3. Torque the bond head clamp screw (61) to 30 in-lb (3.4 N-m).

4. Connect the Z cable into J1 on the head junction board, and attach the cable to the bond head with the cable clamp, screw, and washer.

5. Apply power to the Bonder and press [HOME] on the keypad. The Bonder will move all axes to their home position.

CAUTION: Look down the Z tube from the top and make sure the Z cable assembly is behind the optics tube and wire guide tube. If incorrectly installed, the Z cable might be pinched between the stainless steel wire guide tube and the optics tube. This could cause misplaced bonds due to incorrect PR.

6. Check the alignment of the bond head to make sure the flat face on the bond head frame is parallel to the flat of the Z bearing tube. If not, repeat steps 2 and 3 from above.


Installing the ALC Bond Head Kit DESCRIPTION

CAUTION: Do not use tweezers on the teflon tube.

7. Route the small teflon tube through the back hole in the transducer and into the wire guide holder tube. Close the pinch rollers in the dereeler and close the dereeler’s cover.

Figure 1-7 Bond Head Removal

8. Power up the machine. The software will automatically detect the typeof head installed. Press the HOME key on the Keypad to bring the headto the top of Z-travel and to the “0” degree Theta position.

9. Adjust the Bond Head:

Position it so that the front face of the split-clamp block is parallelto the Z Bearing Housing.

Tighten the M5 split-clamp block screw and press HOME again.Check that the split-clamp block is still parallel to the Z BearingHousing.

Torque the mounting screw to 30 in-lbs.

CAUTION: In order to avoid damaging the Z Bearing Tube, do notover-tighten the mounting screw above 30 in-lbs.

10. Follow the calibration procedures on the monitor.

Loosen Bond Head Clamp Screw


C H A P T E R 2

BOND HEAD SETUPThis chapter describes the correct way to set up the ALC Bond Head tools.The sections in this chapter are organized to show you a summary of thesetup and adjustments on the first left page of the section, and more specificstep-by-step instructions on the next right page and following pages. Thisarrangement of information allows you a quick reference to refresh yourmemory on the important topics of the section, followed by detailedinformation for more in-depth study of the topic.


Bond Tool Setup Summary

Bonding with a good, clean bonding tool is critical for producing quality bonds. Knowing how and when to change a tool is a very important step in maintaining the machine. This section will teach you the proper methods needed for performing the bond tool set up.

Key points for the Bond Tool Setup:• Tool Height Gauge #172475 or #177401 (sets tool height of 2.30 inch/58.42 mm)

CAUTION: Gauge must be positioned in a straight, vertical line. Apply only light pressure tothe top of the tool and remove the gauge by pulling off in a straight motion (donot tilt the gauge). Removing the gauge incorrectly can result in damage to thetool.

• Set screw #659819 tightened to 4-6 in-lbs. (.45-.68 N-m) and replaced every 5 tightenings.• Wrench/set screw kit #138111-3• Generator Test reading of 60+ (a consistent reading between tool changes of the same wire

size is most important)• Reasons for low tuning:

loose or worn set screwwire guide/cutter blade touching the toolincorrect tool height

Calibrations required for tool change:

• Generator Test, Offsets, Recalibrate Z (each file), Cut Depth

Use gauge #177401 for the 2-piece cutter #172461 (kit)

Use gauge #172475 for the 1-piece cutter #172340-1Gauge must be positioned in a straight

vertical line

Apply only light pressure to the top of the tool


Bond Tool Setup Details

Standard Wire Guide

Needle Tip Wire Guide


To remove the tool, refer to Figure 2-1, and use the following procedure:

1. Loosen the set screw holding the tool at the tip of the transducer.

2. Place your hand under the tool.

3. Open the wire guide by rotating the wire guide toggle knob located onthe right side of the bonding head. The tool will drop from the trans-ducer. If not, pull down on the tool. To avoid chipping, do not allow thetool to drop onto any hard surface.

Wire Size V-Groove Bonding Tools Color Wire-guide

Wire Guides Front & Rear Cutters

Mils Microns Standard Short Ft.5 125 127153-5 127175-5 Dk. Blue 127150-5 177105-16 150 127153-6 127175-6 Pink 127150-6 177105-17 175 127153-7 127175-7 Pink 127150-6 177105-18 200 127153-8 127175-8 Green 127150-8 177105-110 250 127153-10 127175-10 Black 127150-10 177105-212 300 127153-12 127175-12 Red 127150-12 177105-214 350 127153-14 N/A Yellow 127150-15 177105-215 375 127153-15 127175-15 Yellow 127150-15 177105-216 400 127153-16 127175-16 Yellow 127150-15 177105-218 450 127153-18 127175-18 Lt. Blue 127150-20 177105-220 500 127153-20 127175-20 Lt. Blue 127150-20 177105-2

Wire Size V-Groove Bonding Tools Color Wire-guide

Wire Guides Front & Rear Cutters

Mils Microns Standard Short Ft.5 125 127153-5 127175-5 Blue 127171-5 177105-16 150 127153-6 127175-6 Pink 127171-6 177105-18 200 127153-8 127175-8 Green 127171-8 177105-110 250 127153-10 127175-10 Black 127171-10 177105-212 300 127153-12 127175-12 Red 127171-12 177105-215 375 127153-15 127175-15 Yellow 127171-15 177105-220 500 127153-20 127175-20 Lt. Blue 127171-20 177105-2


Figure 2-1 Removing the Bonding Tool

To install a bonding tool:

1. Hold open the wire guide by rotating the toggle knob located on theright side of the Bond Head. With flat surface of tool facing forward,place the bonding tool in the transducer horn.

2. Position the tool with the tool height gauge fixture (P/N 172475 or177401). Make sure the gauge is parallel to the tool and that the bottomof the tool is solidly against the gauge platform. (See Figure 2-2.)

Bond Tool Set Screw

Do Not Let Bond Tool Fall And Hit A Hard Surface



Figure 2-2 Bonding Tool Positioning

3. Tighten the set screw to 4-6 inch/lbs (0.46 to 0.69 N-m). Loosen the setscrew, then torque it again 4 to 6 in-lbs . The first screw tightening seatsthe tool, the second screw tightening secures the tool.

NOTE: Knurls on the screw conform to the tool surface for better cou-pling of ultrasonic energy. A kit (P/N 138111-3) of 100 screws and 25 keys is available. Orthodyne recommends this screw be replaced every five tightening cycles. Tightening, loosening, and tightening the screw is considered one cycle of the five per screw allowed.

4. Remove the gauge.

5. From the Main Menu, enter [7] on the keyboard to access the Cali-bration Menu. Press [3] to access the Generator Test. Press [START] topulse the generator. Note the scale reading on the data monitor. If thereading is below 60, then either the tool set screw is loose or worn, orthe cutter or wire guide is mis-adjusted, causing undesirable damping ofthe ultrasonic vibration of the tool. Adjust until the meter reading is ator above 60.

Make sure these surfaces are parallel

Tool Height Gauge


6. Similar tools should give similar results. The generator test readingsdepend on the type of tool used. For example, if the Generator Testreading was 78 with a previous 7 mil tool, then a new 7 mil tool shouldalso give a reading of 78 (±5).

NOTE: If you cannot resolve the problem, contact the factory for trouble-shooting.

7. Press [F16] to return to the Calibration Menu.

8. Check to see that the wire guide is positioned correctly in relation to thebonding tool.

Is the wire guide's groove aligned laterally with the bonding tool'sgroove? If not, see “Wire Guide Side-to-Side Alignment Sum-mary” on page 2-10.

Is the distance between the bonding tool and the wire guide nomore than 0.004 inches (0.1 mm)—or one-half the wire diameter?If not, see “Wire Guide Opening (Gap) Setup Summary” on page2-12.

Is the bottom of the wire guide 0.010 to 0.015 inches (0.25 to 0.38mm) above the bottom of the bonding tool? If not, see “WireGuide Height Setup Summary” on page 2-7.

9. If a different size tool was installed, check that the tip of the cutter doesnot make contact with the tool . If i t does, see “Wire CutterConfigurations” on page 2-27.

10. After replacing tools, perform the Offset Calibration (item 2 on theCalibration Menu). If the crosshairs are not centered between the marks,adjust and repeat the calibration.


Wire Guide Height Setup Summary

Wire Guide Height Setup Summary

The purpose of the wire guide is to guide the wire, form the loops, and break the wire after the cut. A proper setup is critical. An improper setup of the wire guide can result in wire feed and looping problems. Wire Guide setup is shown in Figure 2-3.

Key points for wire guide height adjustment:• Location of the height adjustment screw.• Use the shim with the tool height gauge (as shown in the picture above).• Use the .010 shim for wires sizes 5 to 10 mil.• Use the .015 shim for wire sizes 12 to 20 mil.• Wire guide is parallel to the back of the tool.

NOTE: Verify the proper height setup by using a small mirror and micro-scope to view the tip of the wire guide and tool V-groove. Thewire guide should not be set above the V-groove of the bondtool. This will cause the wire to scrape against the back of thetool as it is pulled through the V-groove.

0.010 to 0.015 inch shim between the tool gauge and the wire guide tipWire Guide Height

Adjustment Screw

Figure 2-3 Wire Guide Height


Wire Guide Height Setup Details

The plastic guides snap on and off a stainless steel shaft. To remove the thesewire guide:

1. From the MAIN menu, press [A] on the keyboard. In the WIREMAINTENANCE screen, toggle F10 (Clamp Open/Closed) to the Openposition.

2. Press the Clamp Assembly Unlocking Button (see Figure 2-4) to movethe clamp assembly out of the way.

3. Depress the wire guide lock (as shown in Figure 2-5, on page ALC 2-9)and slide the plastic wire guide down. Slide the replacement wire guideup into the shaft until it snaps into place.

4. Check the height, side to side, and gap adjustments of the wire guide tothe bond tool. If adjustments are necessary, start at the Wire GuideHeight instructions (found on the next page) and follow all theinstructions related to Wire Guide adjustment. If adjustments are notnecessary, perform steps 5 and 6 listed on the next page.

5. Push the Wire Clamp assembly back into the locked position. With yourtweezers, pull some wire through the wire guide.

6. You should still be in the WIRE MAINTENANCE screen. Toggle F10(Clamp Open/Closed) to the Closed position.

Clamp Unlocking Button

Figure 2-4 Clamp Assembly Unlocking Button


Wire Guide Height

Wire Guide HeightUse the following instructions to adjust the wire guide so that it is about0.010 to 0.015 inches (0.25 to 0.38mm) above the bottom of the tool (seeFigure 2-3, on page ALC 2-7).

1. The Wire Clamp Assembly must be back, away from the Wire Guide. Ifit is not out of the way, perform steps 1 and 2 on the previous page.

2. Rotate the Bond Head clockwise.

3. Place the Tool Height gauge on the tool.

4. Loosen the guide height adjustment screw (see Figure 2-3, on page ALC2-7).

5. Place a 0.010 to 0.015 inch (.25 to .38 mm) plastic shim on the top surfaceof the Height Gauge platform just behind the tool (see Figure 2-3, on pageALC 2-7). Lower the wire guide until it contacts the shim. If the wire guideis too high, the wire may drag against the back of the tool during bonding.

NOTE: It is necessary to adjust the rotation of the guide during this pro-cedure:

6. Rotate the guide until the tip of the guide is parallel with the back of thetool.

7. Remove the gauge.

Figure 2-5 Wire Guide and Shaft

Stainless Steel Shaft

Depress Guide Lock and Slide Guide Down

Plastic Wire Guide


Wire Guide Side-to-Side Alignment Summary

The wire guide must be adjusted so that the wire feeds from the guide into the center of the bonding tool groove. Incorrect adjustment can result in bonds being smashed on one side by the foot of the bonding tool. Wire Guide alignment is shown in Figure 2-6.

Key points for center alignment of the wire guide:• Location of the side to side adjustment screw.• Using a mirror to perform the set up.• The wire guide feed hole is in centerline with the groove of the bond tool.• Wire Guide tip groove is centered with the groove of the bond tool.

Wire Guide side to side adjustment screw

Figure 2-6 Lateral Adjustment Screw Location


Wire Guide Side To Side Alignment Details

Wire Guide Side To Side Alignment Details

1. Align the wire guide so that its slot is centered with the groove in thebonding tool. If it is not, the wire may come out of the guide's slot. Amis-aligned wire guide can also result in one side of the bond beingsmashed by the foot of the bond tool.

2. Place a mirror under the bond tool and wire guide to inspect thealignment.

3. Use the wire guide side to side adjustment cap screw (see Figure 2-6,on page ALC 2-10) to make any adjustment. Turn the screw counter-clockwise to move the guide to the left and turn clockwise to move theguide to the right.


Wire Guide Opening (Gap) Setup Summary

The gap between the wire guide and bond tool must be set correctly. Wire feed problems may be encountered if the opening is too small. If the wire guide touches the bond tool, the ultrasonics may be dampened, affecting bond quality. If the opening is too large, the wire will not remain in the groove of the bond tool and will cause inconsistent looping and cut problems. Wire Guide opening gap adjustment control screws are shown in Figure 2-7.

Key points for setting the opening (gap) of the wire guide:• Location of the wire guide opening adjustment screw.• Bond Head must be turned clockwise to obtain a side view of the tooling.• Correct gap between the wire guide and tool is 0.001 to 0.004 inches (0.025 to 0.102 mm), or

less than one-half of the wire diameter.• Wire should run free through the wire guide without escaping.

Wire Guide Gap Adjustment Screw

Wire Guide“Gap” Adjustment

Wire GuideToggle Knob

Figure 2-7 Location of Wire Guide “Gap” Adjustment Screw


Wire Guide Opening (Gap) Adjustment Details

Wire Guide Opening (Gap) Adjustment Details

If the guide opening is too large, the wire may not remain in the tool groove andmay cause inconsistent loops and cut problems. If the opening is too small, thewire may not feed easily and some loops may not form in the vertical planebetween the bonds but may instead form in a tilted manner or not at all. Mal-shaped loops can occur if the wire guide gap is too small, because the wire isbeing pulled by the clamp instead of being allowed to form a normal loop.

If this condition occurs, adjust as follows:

1. Turn the Bond Head clockwise by hand so you have a good view of theWire Guide in relation to the bond tool.

2. Inspect the opening between the wire guide and tool. The openingshould be about 0.001 to 0.004 inches (0.025 to 0.102 mm), or less thanone-half of the wire diameter. The ideal opening will just permit thewire to run free without escaping from the guide.

3. Rotate the wire guide opening adjustment screw (see Figure 2-7, onpage ALC 2-12) while looking at the gap through the microscope toachieve the opening mentioned in the step above.

4. Press [HOME] to return the head to Home.


Vertical Adjustment of the Wire Clamp Summary

The Vertical adjustment is done to position the clamps in the center of the cutout of the wire guide (see Figure 2-8). This is done without wire threaded into the wire guide.

Key points for vertical alignment of the clamps:• Locate and loosen the 2 vertical adjustment screws.• Position the clamps to be in the center of the cutout of the wire guide.• Keep a slight gap between the wire guide and the clamps to avoid binding.• Push on the moving clamp to make sure that it does not bind.• Vertical adjustment must be done whenever changing to a different wire size.

Vertical (and Horizontal) Adjustment Screws

Figure 2-8 Location of Vertical Adjustment Screws


Vertical Adjustment of the Wire Clamp Details

Vertical Adjustment of the Wire Clamp Details

Without the wire threaded in the wire guide, adjust the Active Loop Controlclamp to fit the cutout in the wire guide by loosening the two screws thathold the clamp to the clamp frame. These screws are visible from the leftside of the Active Loop Control assembly as shown in Figure 2-8, on pageALC 2-14.

1. With the Vertical Adjustment screws loosened, gently rock the ActiveLoop Control clamp so that it fits into the wire guide cutout. Thereshould be a slight gap between the wire guide and the clamp to avoidbinding the clamp jaws. Tighten these screws when the adjustment iscomplete.

2. Unlock the clamp assembly by pushing the ball-spring release button tomove it out of the way and thread the wire through the wire guide. SeeFigure 2-4, on page ALC 2-8.

NOTE: The vertical adjustment will have to be done whenever youchange the wire guide to accommodate a different size wire. Asthe wire size gets larger, for example, the tool’s foot lengthbecomes longer, requiring the wire guide and clamp to move.


Lateral Adjustment of the Wire Clamp (Part 1) Summary

The Lateral adjustment positions the fixed clamp jaw relative to the wire. Procedure Part 1 and 2 is a rough adjustment of the clamp. Wire Guide lateral adjustment screws are shown in Figure 2-9.

PART 1Key points for lateral adjustment of the Wire Clamp:

• From the MAIN menu, select WIRE MAINTENANCE [A], toggle F10 (Clamp Open/Closed) to the OPEN position.

• Turn the Bond Head 180 degrees to view the back of the clamp.• Turn the Lateral Adjustment screw until the wire appears to be centered laterally between the

clamp jaws.• Press the Clamp Unlocking Button to unlock the clamp assembly and move it out of the way.

Feed the wire through the wire guide.

Lateral Adjustment Screw

Clamp Unlocking Button

Rear View

Figure 2-9 Location of Lateral Adjustment Screw


Lateral Adjustment of the Wire Clamp (Part 1) Details


The following steps describe adjusting the lateral position of the clamprelative to the wire. The clamps will be adjusted around the centerline of thewire so that the jaws grip the wire without moving it in the lateral direction.The alignment procedure makes allowances for adjusting to the diameter ofthe wire. This procedure is done with wire in the clamp jaws.

When in the Open position, the jaws must be wide enough apart and centeredabout the centerline of the wire so that when the clamp assembly is pushedforward into the locked position, it will not bind on the wire. Remember, theclamps must accommodate wires from 4 mil (100 micron) to 20 mil (500micron) depending on your application.

The first five (5) steps below are a rough adjustment of the clamp. Turn thehead 180 degrees so that you are looking at the back of the clamp.

1. From the MAIN menu, press [A] on the keyboard. In the WIREMAINTENANCE screen, toggle [F10] (Clamp Open/Closed) to theOpen position.

2. Turn the Lateral Adjustment screw until the wire appears centeredlaterally between the clamp jaws. The adjustment screw can be seen inFigure 2-9, on page ALC 2-16.

3. Loosen the set screw holding the Active Loop Control Clamp cable inplace (see Figure 2-10, on page ALC 2-18). Rotate the Clamp CableAdjustment screw (see Figure 2-10, on page ALC 2-18) counter-clockwise to take up any slack in this cable. Turning the screw in thisdirection Opens the movable clamp jaw. The opening between the jawsshould be wide enough to clear both sides of the wire.

4. Push the clamp assembly into the locked position. The jaws are openand straddle the wire without touching it.

5. With your tweezers, pull some wire through the tool. The wire shouldpull smoothly with little resistance.


Lateral Adjustment of the Wire Clamp (Part 2) Summary

The Lateral adjustment positions the fixed clamp jaw relative to the wire (see Figure 2-10).

PART 2Key points for lateral adjustment of the clamp:

• Location of the Clamp Cable set screw. • Adjust the Clamp Cable Adjustment to take up any slack in the cable. • Counter-clockwise adjustment of the screw Opens the movable clamp jaw.• Opening between the jaws wide enough to clear both sides of the wire.• The open jaws should not touch the wire when in the locked position.• The wire should pull smoothly with little resistance.

Clamp Cable

Fixed Jaw

Clamp Cable Adjustment Screw

Clamp Cable Set Screw

Figure 2-10 Adjustment of the Fixed Jaw




1. Loosen the set screw holding the Active Loop Control Clamp cable inplace (see Figure 2-10, on page ALC 2-18).

2. Rotate the Clamp Cable Adjustment screw (see Figure 2-10, on pageALC 2-18) counter-clockwise to take up any slack in this cable. Turningthe screw in this direction Opens the movable clamp jaw. The openingbetween the jaws should be wide enough to clear both sides of the wire.

3. Push the clamp assembly into the locked position. The jaws should beopen and straddle the wire without touching it.

4. With your tweezers, pull some wire through the tool. The wire shouldpull smoothly with little resistance.


Fine Adjustment of the Fixed Wire Clamp Jaw Summary

This is the fine adjustment procedure for the FIXED JAW of the clamp assembly (see Figure 2-11).

Key points for fine adjustment of the clamps:• Lateral Adjustment is made until the fixed jaw makes contact with the wire.• Adjustment is done with wire being pulled through the wire guide.• Adjust until "drag" is felt on the wire.• Lateral Adjustment is complete when the wire pulls freely, with little resistance.

Lateral Adjustment Screw

Figure 2-11 Fine Adjustment of the Fixed Jaw


Fine Adjustment of the Wire Clamp Fixed Jaw Details

Fine Adjustment of the Wire Clamp Fixed Jaw Details

1. Turn the Lateral Adjustment screw clockwise until the fixed jaw justmakes contact with the wire. Pull some wire through the tool as youadjust this screw. Stop turning the screw when you begin to feel someadditional drag on the wire as the jaw makes contact.

2. Back off the Lateral Adjustment screw until the wire runs free again.Now the fixed jaw is in the proper position.


Fine Adjustment of the Moveable Wire Clamp Jaw Summary

This is the fine adjustment procedure for the MOVEABLE JAW of the clamp assembly (see Figure 2-12).

Key points for fine adjustment of the clamp:• Toggle F10 in the WIRE MAINTENCE screen to the Closed position.• Turn the Clamp Cable Adjustment screw clockwise until the movable jaw makes contact with

the wire. There should be a small amount of slack in the cable.• Toggle F10 in the WIRE MAINTENCE screen (between closed/open) as you pull the wire.

The wire should be gripped when the clamps are closed.

Clamp Cable

Clamp Cable Adjustment Screw

Clamp Cable Set Screw

Moveable Jaw

Figure 2-12 Fine Adjustment of the Moveable Jaw


Fine Adjustment of the Wire Clamp Moveable Jaw Details

Fine Adjustment of the Wire Clamp Moveable Jaw Details

1. Toggle [F10] in the Wire Maintenance screen to the Closed position.

2. Turn the Clamp Cable Adjustment screw (see Figure 2-12, on pageALC 2-22) clockwise so that the moveable jaw makes contact with thewire. There should be a small amount of slack in the cable as the resultof this adjustment.

3. Toggle [F10] as you pull the wire to test that the wire is gripped whenthe clamp is closed, and runs free when the clamp is open.


Adjusting the Wire Clamp Force Summary

This procedure will show you how to set the force of the clamps. The force exerted by the clamp is used to grip the wire during looping, inline pulltesting, and termination of the wire. (See Figure 2-13.)

Key points for force adjustment of the Clamp:

NOTE: The clamp should be in the Closed position.

• Location of the Clamp Force Adjustment jam nut.• Adjust the Clamp Force Adjustment screw so that the wire will slip when pulled.• Clamp Force Adjustment is complete when the jaws grip the wire strong enough so that the

wire breaks when pulled.• Clamp Force Adjustment screw jam nut must be retightened.

Clamp Force Adjustment Screw

Clamp Force Adjustment Screw Jam Nut

Figure 2-13 Adjust Wire Clamp Force


Adjusting the Wire Clamp Force Details

Adjusting the Wire Clamp Force Details

1. Loosen the Clamp Force Adjustment screw jam nut (see Figure 2-13,on page ALC 2-24) and turn the Clamp Force adjustment screwcounter-clockwise so that the wire will slip when pulled with yourtweezers. Remember the clamp must be in the Closed position.

2. Adjust the Clamp Force Adjustment screw clockwise to exert increasingforce on the wire. Stop the adjustment when the jaws grip the wirestrong enough so that the wire breaks when pulled with your tweezers.

3. Retighten the Clamp Force Adjustment screw jam nut.


Clamp Open StepsThe Clamp open steps field in the WIRE PARAMETERS menu allows youto fine-tune the Open/Close adjustment of the clamp by changing the numberin this field. You can also change the Clamp open steps in the WIREMAINTENANCE menu by using LEFT/RIGHT Arrows.

Clamp open steps default values are provided to you by Orthodyne fordifferent wire sizes (see Table 2-1). The default value should be close tooptimum for most applications. However, you may adjust this value to fityour specific application.

Remember, making the Clamp open steps number smaller reduces themovement of the clamp from the open to the close position. The smaller themovement of the clamp, the less time will be taken for the clamp movement.Fine-tuning this number may reduce the time for a bond cycle and henceincrease the UPH.

Table 2-1: Recommended Clamp Open Step Values

Wire Diameter

(mils)

Recommended Clamp Open

Steps

5 8

6 8

7 8

8 8

10 10

12 10

14 10

15 10

20 10


Wire Cutter Configurations

Wire Cutter Configurations

The set up procedure for the Front Cutter blade can be followed for both oneand two-piece cutter configurations. These are shown in Figure 2-14.

The ALC Bond Head can be configured with either the one-piece cutterblade #172340-1, or the two-piece cutter #172461 kit (both shown above).The one-piece cutter is also used on the M360C Standard Deep Access Headthat is configured for Front Cut.

The picture on the right shows the location of the set screws used to adjustthe cutter gap and mount the cutter blades into the cutter holder. Theadjustment screws are the same for both the one and two-piece cutters.

1 Piece Cutter#172340-1

Pusher#172341

Bond Tool

1 Piece Cutter 2 Piece Cutter

Cutter Stop Screw

Cutter Blade Hold-Down Set Screws Cutter

Adjustment Screw

Cutter Adjustment Locking Set Screw

Figure 2-14 Location of Cutter Adjustment Screws


Wire Cutter Details

The Model 360C has two possible wire cutter set-ups: the Rear Cutter andthe Front Cutter. The ALC Head uses only the Front Cutter. Themechanical setups differ significantly. Some screens are also different. Youcan specify the cutter option on the SYSTEM CONFIGURATION screen(press [F15] from the INTERNAL SETTINGS screen). Front Cutters comein either a one-piece or two-piece cutter configuration.

Wire cutters are wire size dependent. See Table 2-2 for part numbers. Adjustthe wire cutter's position when changing tool or wire size, or when replacingthe cutter.

During bonding, check the cut. If the cutter does not cut the wire completely,press [SHIFT][down arrow] to adjust the cut depth. If it cuts too deep, press[SHIFT][up arrow]. This is available on any bond edit or run mode screen.

Table 2-2: Cutter Part Numbers For Different Wire Sizes

Wire Size 1 Piece Front Cutters

2 Piece Front Cutters

Mils Microns5 125 172340-1 177105-16 150 172340-1 177105-17 175 172340-1 177105-18 200 172340-1 177105-110 250 172340-1,-2 177105-1,-212 300 172340-1,-2 177105-1,-214 350 172340-2 177105-215 375 172340-2 177105-216 400 172340-2 177105-218 450 172340-2 177105-220 500 172340-2 177105-2


Setting Up the Cutter Holder and One-Piece Front Cutter Sum-

Setting Up the Cutter Holder and One-Piece Front Cutter Summary

Initial setup of the front cutter requires the use of the front cutter height gauge #168073-50 (see Figure 2-15). This gauge will set the cutter home position to .070 inch ±.005 inch.This gauge is used for both the one and two-piece cutter blades.

Key points for front cutter height adjustment:• Location of the cutter mounting screws.• Proper usage of the correct gauge (gauge seated all the way up in the holder).• Correct setup of the pusher.• After completing this procedure, install the correct cutter blade by following the installation

instructions found on the next page. These instructions can be used for both the one-piece cut-ter and the two-piece cutter.

• Calibrations required: Cut Depth

Figure 2-15 Front Cutter Height Gauge


Setting Up the Cutter Holder and One-Piece Front Cutter Details

CUTTER HOLDER (Front Cutter)During initial setup, after rebuilding the head or during preventivemaintenance, you must adjust the cutter holder to achieve the proper gapbetween the tool and cutter, and the proper cutter height. Use the followingprocedure to adjust the cutter holder:

1. Install the bonding tool and set it to the proper height according to theinstructions in the SETTING UP ALC BOND TOOLS found on pageALC-1 of this chapter.

2. Loosen the pusher mounting screw and remove the pusher. If the pusherdoes not come out easily, loosen the pusher adjustment screw as well(Figure 2-18, on page ALC 2-33).

3. Loosen the cutter adjustment screw (Figure 2-17, on page ALC 2-32)by turning it counterclockwise. Loosen the two cutter hold-down setscrews and remove the cutter.

4. Loosen the cutter block mounting screws and lower the cutter holder asfar as possible (see Figure 2-16, on page ALC 2-31). Install the frontcutter holder setup gauge (168073-50) in place of the cutter blade(Figure 2-15, on page ALC 2-29). Make sure that the gauge is seated allthe way up into the groove of the cutter block. Tighten the two cutterhold-down set screws. Check that the cutter adjustment screw is notpushing on the cutter holder setup gauge.

5. Position the cutter setup gauge so that it is against the front and bottomof the tool (Figure 2-15, on page ALC 2-29). Tighten the two cutterblock mounting screws. Check again that the entire length of the gaugeis against the face of the bonding tool.


CUTTER HOLDER (Front Cutter)

6. Remove the setup gauge and install the correct cutter blade.

7. Place the cutter in the slot.

8. Push the cutter to the top of the slot, and to the left against the CutterStop screw (see Figure 2-17 ). The cutter should be centered in front ofthe tool. If not, loosen the Cutter Stop locking set screw and turn theCutter Stop screw until it is centered. If the cutter is not aligned prop-erly from side to side it will not cut the wire and it could damage bondsor devices next to the current bond pad. Tighten the Cutter Stop lockingset screw.

9. Tighten the two cutter blade hold-down screws.

Figure 2-16 Front Cutter Holder Gauge


10. Check the tip of the cutter blade; it should not contact the tool. Usingthe cutter adjustment screw, adjust the cutter until it is about 0.001 to0.002 inches (0.025 to 0.076 mm) from the bonding tool. Tighten thelocking set screw.

Figure 2-17 Front Cutter Adjustment Screws


Setting Up the Front Cutter Pusher Summary

Setting Up the Front Cutter Pusher Summary

The Pusher (see Figure 2-18) is used to push the Front Cutter Blade in toward the Bond Tool during the cut move. Proper setup of the cutter and pusher will result in the shortest first bond tail length. For the one-piece cutter, use pusher #172341 and for the two-piece cutter, use pusher #177103.

Key points for the Pusher adjustment:• Location of the Pusher mounting and adjustment screws.• The Pusher, Cutter Blade and Bond Tool should not touch one another while at the rest posi-

tion.• Move the Transducer Carrier up and down and see where the Cutter Blade is contacting the

Bond Tool.• While moving the Transducer Carrier up and down, adjust the Pusher so that it pushes the

Cutter Blade to contact the Bond Tool just slightly above the tool groove, and remains in con-tact with the Bond Tool until the Cutter Blade passes the tip of the tool.

• Perform the Cut Depth Calibration.

Figure 2-18 Front Cutter Pusher Adjustment Screws


Setting Up the Front Cutter Pusher Details

1. Using the pusher adjustment screw, adjust the pusher until it barelytouches the cutter yet does not push the cutter closer to the tool. Tightenthe locking set screw. (See Figure 2-18, on page ALC 2-33.)

2. Move the transducer carrier up and down while viewing the movementof the cutter through the microscope. When it is at rest, make sure thatthe pusher, cutter, and tool are not touching one another. Also, makesure that the cutter blade is pushed over against the face of the toolwhen the transducer moves upward. It should touch just above the toolgroove and stay against the face until it is past the tip of the tool.

3. Access the CUT DEPTH CALIBRATION procedure ([7],[6] from theMAIN MENU). Use the spinners to move the bonding head over thetest plate. Press [START]. The Bond Head will rotate counterclockwise90° and will descend until the tool reaches overtravel.

4. Cautiously, (so as not to damage the cutter on the work surface) use theY spinner to lower the head to the desired cut depth (approximately 90to 95% through the wire). Press [START],[F13] to Save. For a normalsetup, cut depth should range from 200 to 250 depending on wire size.If cut depth exceeds 280, check your setup again.

5. During bonding, check the cut. If the cutter does not cut the wire to theproper depth, press [SHIFT][up/down arrow] to adjust the cut depth.This is available on any bond edit or run mode screen.


Setting Up the Two-Piece Front Cutter Summary

Setting Up the Two-Piece Front Cutter Summary

The pictures above show the two-piece cutter kit #172461 assembly and its components.

Key Points for setting up the 2-piece cutter blade• Location of the set screw that holds the Cutter Blade Tip into the Holder.• Inspect and replace the Cutter Blade Tip as needed.• Cutter Blade Tip must be in straight line with the tool groove (not offset).• 2 Piece Cutter Assembly must be fully seated, up into the cutter holder block.• The Pusher must be properly adjusted.

2 Piece Cutter Assy. #172461 (Kit)

Pusher #177103

Cutter Holder Cover #177108 and Holder Base #177107

Pusher #177103

Leaf Spring #177106

2 Screws #542010-03

Set Screw #659801

Cutter Blade Tip #177105-1 or -2

Figure 2-19 2 Piece Cutter Components


Setting Up the Two-Piece Front Cutter Details

To remove the cutter:

1. Loosen the set screw (#659801 see Figure 2-19, on page ALC 2-35) toremove the cutter blade tip (#177105-1 or -2). A special 6-splinewrench is used to remove or loosen the set screw. The part number ofthe wrench is #622100. Both the wrench and set screws can bepurchased as a kit. The kit number is #138111-2.

NOTE: If the cutter holder height has not been set with the cutter heightgauge, follow the instructions starting on page ALC 2-29 “Set-ting Up The Cutter Holder And 1 Piece Front Cutter.”

To replace the cutter:

1. Place the cutter blade tip in the slot.

2. Push the cutter to the top of the slot, and to the left against the CutterStop Screw (see Figure 2-17, on page ALC 2-32). The cutter should becentered in front of the tool. If not, loosen the Cutter Stop locking setscrew and turn the Cutter Stop screw until it is centered. If the cutter isnot aligned properly from side to side it will not cut the wire and itcould damage bonds or devices next to the current bond pad. Retightenthe Cutter Stop locking set screw.

3. Access the CUT DEPTH CALIBRATION procedure ([7],[6] from theMAIN MENU). Use the spinners to move the bonding head over thetest plate. Press [START]. The Bond Head will rotate counterclockwise90° and will descend until the tool reaches overtravel.

4. Cautiously, (so as not to damage the cutter on the work surface) use theY spinner to lower the head to the desired cut depth (approximately 90to 95% through the wire). Press [START],[F13] to Save. For a normalsetup, cut depth should range from 200 to 250 depending on wire size.If cut depth exceeds 280, check your setup again.

5. During bonding, check the cut. If the cutter does not cut the wire to theproper depth, press [SHIFT][up/down arrow] to adjust the cut depth.This is available on any bond edit or run mode screen.


C H A P T E R 3

BOND HEAD MOVEMENTThis section describes the movement of the bonding head during a typicalwire bonding sequence for the Active Loop Control Head. The series ofmoves that make up a complete bonding cycle for the Active Loop ControlHead is different than that of a standard Large Wire Bond Head. Thedifferences occur during the action of the Active Loop Control Clampmovements when forming the loop.

Figure 3-1 illustrates the bonding head movement for a simple, single wirebond.

NOTE: The Active Loop Control bonding head option is available onlywith front cut option.

The sequence begins with the bonding head at the home position (orprogrammable Z home). The head moves from the home position to thesearch height above the first bond placement (see Figure 3-1).

NOTE: Placement of bonds is determined by using the WIRE LIST EDIT.See page 5-34 and page 7-54 in the Model 360C User’s Manual.

Figure 3-1 Home to Search

Home to Search

Reflection of Tools in Work Surface

Tools at First Search Height


Search to First Bond BOND HEAD MOVEMENT

Figure 3-2 Touching the Surface

The Bond Head touches the surface at the first bond position according to thevalues contained in the WIRE LIST EDIT screen (see Figure 3-2). TheWIRE PARAMETER EDIT screen shows the parameter fields and defaultvalues for performing the first and second bonds.

After the first bond is made, the Bond Head lifts off the surface in a “step-forward” maneuver, as shown in Figure 3-3. The step forward angle isselected from the WIRE PARAMETER, or WIRE LIST EDIT menu. Theheight above the work surface at the end of this move is set by the valueentered in the “Loop value” field. At the end of this maneuver, the tool is at“loop top.”

Figure 3-3 First Bond to Loop Top

Search to First Bond

First Bond to Loop Top

Step Forward Angle

First Bond


BOND HEAD MOVEMENT Loop Move

At Loop Top, the clamps close under software control. The Bond Head thenmoves the tool down to the search height of the next bond. The clamping ofthe wire during the loop move provides extra control for consistent loopheight and for making short stepback loops (see Figure 3-4).

Figure 3-4 Loop Move

At second bond search height, the clamp is opened again. The second bond(see Figure 3-5) is made at the position determined in the WIRE LIST menu,using the bonding parameters selected in the WIRE PARAMETER menu.

Figure 3-5 Second Bond

Loop Move

Second Bond

First Bond Second Bond


Hopback BOND HEAD MOVEMENT

After the second bond is made, the head makes a short hopback away fromthe second bond to form the tail for the next bond and provide clearance forthe cut move (see Figure 3-6).

Figure 3-6 Hopback

The Active Loop Control Clamp closes, holding the wire firmly in place, asthe cutter moves down to cut the wire (see Figure 3-7). The depth of thecutter into the wire is selectable through the WIRE LIST EDIT screen using“Shift ^/v” keystroke. With the Active Loop Control Clamp still closed, thehead makes a short move to break the wire. The Break Distance and BreakAngle are selectable parameters in the WIRE LIST EDIT screen.

Figure 3-7 Cut Move

Hopback

Cut Move

Cutter Moves Down to Cut the Wire


BOND HEAD MOVEMENT Cut Move to Interwire Height

After completing the cut move, the head moves to the interwire heightposition on the way to the next bond (see Figure 3-8). The interwire height isadjusted in the MANUAL POSITION screen. The Bond Head returns to a“Home” position after the last bond of the last wire.

Figure 3-8 Interwire Height Position

Cut Move to Interwire Height

Completed Loop


INLINE BOND PULL TEST

C H A P T E R 4

INLINE BOND PULL TESTThe Active Loop Control Head has an additional feature which allows theuser to test bonds immediately after they are made. We call this feature theInline Bond Pull Test. When activated, the ALC Clamp will clamp the wireand apply a force to the newly created bond after the Bond Head reachestwist height for the first bond, or at the top of the Vertical Hop for the secondbond. Any movement of the wire as the clamp applies force to the bond ismonitored by the LVDT. If the bond lifts, the LVDT senses the movement,signals a bad bond, and stops the bond sequence.

NOTE: For information regarding clearance issues, refer to the ALCHead Clearance drawing #177400 located in the Options sectionof the Model 360C Drawings and Schematics manual.

The major benefit of the Inline Bond Pull Test feature is that it allows you todo nondestructive testing of first and second bonds independent of loopgeometry or hook placement for up to 100% of the wires. You can alsoprogram individual wires and individual devices to Pull test. Also, you cancontrol the amount of force used to pull on the bond, and the amount of timespent observing for bond lifts.

Although optional Pull testers are available for our M360C-H/HD Bonders,at most only two Pull testers can be installed on the leadframe transport.Thus, with the maximum number of Pull testers installed on the machine,only two wires at a time can be tested per Bond Head. With the Inline BondPull Test feature, you can test as many wires as you bond without regard forwire placement or orientation.

There are advantages and disadvantages of each type of Pull testingtechnique. Users must consider their application before selecting thetechnique that is best suited to them.


INLINE BOND PULL TEST

Conventional Pull tester

Inline Bond Pull Tester

For hybrid applications, the Inline Bond Pull Test feature serves as anondestructive supplement to the normal destructive Pull testing of lotsamples, giving you increased confidence of process stability between thelots.

Of course, if you choose to test 100% of the bonds, you will increase theamount of time required to complete the part. On the other hand, performinga quality test of the bonds with the Inline Bond Pull Test feature as they aremade decreases the probability of downstream rework or lower yields.

The optimum setting of parameters for Inline Bond Pull Testing isapplication dependent, and will require some experimentation on the part ofthe user.

Table 4-1: External Pull tester Advantages and Disadvantages


Pull testing after the wire loop is made minimizes additional stress on wire during loop formation.

Can only test a maximum of two wires per pass.

Pull tests first and second bond simultaneously. Loop must be high enough for hook to pass through and pull up on the wire. Not suitable for very low or flat loops.

Does not disturb UPH because testing is performed after all wires are bonded on the device.

Limited wire orientation geometry suitable for Pull testing. Wire must be approx. perpendicular to Pull tester.

Table 4-2: Inline Bond Pull Tester Advantages and Disadvantages


Tests each bond as it is made. Loop-forming forces and wire drag forces can be higher than the programmed pull test force. Because of this, bonds may lift even after passing the inline pull test. Normal QC inspection is recommended.

Fully programmable. Can test some or all of the bonds.

Inline Bond Pull Testing does add time to each wire tested. Can contribute to lower UPH.

Independent of wire or bond orientation geometry.


INLINE BOND PULL TEST Setting Up the Inline Bond Pull Test

To enable the Inline Bond Pull Test feature, use the following procedures:

Software Version 5.7j

1. Beginning at the MAIN MENU, go to the SYSTEM CONFIGURATIONscreen by pressing [7] Calibration, [B] Internal Settings, [F15]. Thiscombination of key strokes will bring up the following screen:

NOTE: The Inline Bond Pull Test feature is only available if the BondHead is calibrated with a spring force of 500 grams, and is notavailable if the calibration is for a spring force of 700 grams.

2. Move the cursor to the Pull test Enable field and toggle to ON.

3. From the MAIN MENU, go to the WIRE LIST EDIT screen bypressing [5] Edit, [2] Wire List Edit. Press [F11] to go to page 2 of theWIRE LIST EDIT screen.

4. With Pull test enabled ON, you will now see a new field appear undereach wire on which you can perform an Inline Bond Pull Test. Thedefault setting for the “Pull enabled” field in the WIRE LIST EDITscreen is NO. You must specifically choose to Pull test a particularbond.

Setting Up the Inline Bond Pull Test

PROGRAM NAME SYSTEM CONFIGURATIONSpring tension:Pull test enabled:

Software version:Cut depth:Magnification:

= 500On

X.X1551702 [5.32 mm]

X Y Z THome offset:Positive motion limit:Negative motion limit:

2331872-31872

4119124-15872

3485000

31200-200


TOGGLEARROWS F16: Return


Setting Up the Inline Bond Pull Test INLINE BOND PULL TEST

In the WIRE LIST EDIT screen shown below, you can choose any or allbonds to be Pull tested by setting the Pull enabled field to YES or NO.


In this version of the software, the pull test function is always enabled whenan ALC head is installed on the machine. Consequently, the “Pull testenabled” field in the SYSTEM CONFIGURATION screen is no longerpresent. Now, you will always have a field in the WIRE LIST EDIT screencalled “Pull enabled” where you can choose whether you want to pull aparticular bond on each wire. Since the WIRE LIST can be protected with apassword (but the SYSTEM CONFIGURATION screen cannot), this newfunction will prevent accidentally cancelling a pull test.


The remote ALC pulltest feature allows for two commands, “Pulltest” or“Proceed.” These commands are issued remotely during bonding to allow fora remote handler to specify if a bond should be pulltested. These selectionsare found on the second page of the WIRE LIST EDIT display called “Pullmode.”


Wire: [ 1] 2 *Bond: 1 2

Search height:Twist height:Step forward:Gen ramp:Min wire feed:X:Y:Z:Pull enabled:Bond profile:

***

-265661237334Yes1

*

-58961237329Yes2

TOGGLE: Stop at search: [OFF] START: Bond wireSHIFT-^/v: Cut depth [149.4] STOP: Edit wire

F8: Bond off F13: Save listF10: Clamp [OPEN] F14 Insert wire

ARROWS F11:Bond page [2] F15: Delete wirePAGE F16: Abort list


INLINE BOND PULL TEST Setting Up the Inline Bond Pull Test

A particular bond can be set to either Always pulltest, or to Remote pulltest.If set to Remote pulltest, the bonder will wait for the “Pulltest” or “Proceed”command. Remote is the default setting.

The enhanced feature in Version 5.8C adds a third command option, ofNever Pulltest. The Never Pulltest option allows the user to specify thatcertain bonds should never be pulltested regardless of the commandsreceived during bonding.


Wire: [ 1] 2 *Bond: 1 2

Search height:Twist height:Step forward:Gen ramp:Min wire feed:X:Y:Z:Pull mode:Bond profile:

***

-265661237334Remote1

*

-58961237329Remote2

TOGGLE: Stop at search: [OFF] START: Bond wireSHIFT-^/v: Cut depth [149.4] STOP: Edit wire

F8: Bond off F13: Save listF10: Clamp [OPEN] F14 Insert wire

ARROWS F11:Bond page [2] F15: Delete wirePAGE F16: Abort list


Pull Test Force INLINE BOND PULL TEST

Pull Test Force

When you set “Pull enabled” to YES, changes are made to other screens toaccomplish the Pull test task. You will program the force to be used in Pulltesting the selected bonds (wires) through the WIRE PARAMETER EDITscreen, shown on the next page.

The default pull force value shown in the WIRE PARAMETER EDIT screenis dependent on the wire size you selected. These values are held in NVR.You may change this value through the keyboard. If you do, however,remember that this value of Pull test force for this particular wire size will beused for all future files that use the same wire.

If a pull test fail should occur, the screen will appear as shown below:

Program Name WIRE PARAMETER EDITLINK File Clamp open steps, from 10 to 30(if used) WIRE PARAMETERS FOR "FILE NAME"Name/type [AL 5]

First bond:Start ForceEnd force:Start power:End power:Ramp time:Total time:

9016040441050

Prebond delayGenerator ramp time:Step forward angle:Loop value:Clamp open steps:Search height:

205012[12]100

Second bond: Twist height 80Start force:End force:Start power:End power:Ramp time:Total time:

10016040441050

Tail length:Break height:Break angle:Break distance:Force during cut:Vertical hop (percent):Pull force:

13515520757040F13: Save bond parameters

F10:Edit minima F14: Save to default setARROWS F11:Edit maximaPAGE F16: Abort edit

Program Name ERROR REPORT LOG 1LINK File(if used)

[53] PULL TEST FAILURE START: ContinueSTOP: Abort bonding


INLINE BOND PULL TEST Pull Test Frequency

Pull Test Frequency

You will also be able to set the frequency of Pull testing by entering a valuein the “No. of devices between Pull test” in the SYSTEM PARAMETEREDIT screen. This frequency is based on the number of devices, notindividual wires or bonds. This means that each of the bonds you selected tobe Pull tested in the WIRE LIST EDIT screen will be tested on every nthdevice. For example, on a leadframe you might choose every 4th indexeddevice to be Pull tested; on a hybrid workstage with 10 devices you mightchoose every 4th device from your device list to be Pull tested.

You can use this feature as a constant measurement of process quality.

To set up the Inline Bond Pull Test parameters, use the following procedure:

1. Beginning at the MAIN MENU, go to FORCE CALIBRATION bypressing [7] Calibration, [5] Force.

2. With ‘Pull Test Enabled’ ON, press [F8] to bring up the Pull test setupscreen shown below:

Pull force when START is pressed is the force applied by the clamp for testpurposes. Enter this value through the keyboard. The pull force that will beapplied to each selected bond is entered through the WIRE PARAMETEREDIT edit screen.

NOTE: The START legend only appears in this screen if the Pull forcehas been calibrated. See section below.

Pull Test Control Screen

Program Name PULL TEST SETUPLINK File(if used)

Pull force when START is pressedPull time (millisec)Pull tolerance (microns)

[40] 30150

Press LEFT or RIGHT arrow to change focus. Current value: 15START: Pull up using forcer

SPIN X Y F10: Clamp [OPEN] F13: Save ARROWS F12: Calibrate pull force F15: Touch surface

F16: Abort


Pull Test Control Screen INLINE BOND PULL TEST

The Pull test values shown in Table 4-3, on page 4-8 are a function of wiresize diameter. The recommended values shown in this table are higher thannumbers published at the introduction of the ALC bonder. The higherrecommended values shown in the table result in a more reliable indicationof bond strength, as determined through Orthodyne and customer applicationtesting.

NOTE: Pull testing with the ALC is one of a number of quality controltests for bond quality. It is not intended to be a stand-alone 100%“good bond/bad bond” test.

NOTE: Default parameters are suggested starting values. Theseparameters may require modification specific to your application.

Pull time (milliseconds) defines how long the force is applied to test thewire bond. This value will apply to each bond selected for Pull testing.Orthodyne recommends a value of 30 ms for all wires.

Table 4-3:Recommended Pull Test Starting Values

Wire Dia(mil)

Recommended Pull Test Values(gms)

5 40

6 45

7 50

8 60

10 100

12 120

14 140

15 150

20 200


INLINE BOND PULL TEST Pull Test Data Screen

Pull tolerance is applied to the LVDT value to allow for the stretching of thewire and other movement which may be normal and not an indication thatthe wire bond has failed. Orthodyne recommends a value of 150 microns forall wires.

F10 is a toggle to OPEN or CLOSE the clamp.

F12 calibrates the desired Bond Test force using a calibration weightsuspended from the tool. This button will bring up a series of screens to leadyou through the calibration procedure.


A new function is added to the DIAGNOSTICS MENU that allows you tosee LVDT values corresponding to pull displacements. These values aredisplayed in a new screen that is accessed by selecting the “Pull Test Data”in the Diagnostic Menu, or you can press [F6]. If a pull test fails, the word“FAIL” will appear next to the LVDT value for that bond.


Pull Test Data Screen

PROGRAM NAME


DIAGNOSTICS MENU


*(ALC Only)




F16 Abort

Pull Test Data

PROGRAM NAME

Pull microns


Pull Test Data Screen INLINE BOND PULL TEST


48

27

F15: Clear data

F16: Abort


INLINE BOND PULL TEST Calibration Procedure

The Pull Force calibration procedure is similar to the Force calibration forthe standard Large Wire Bond Head, however, the operation of the two isdifferent. The force used for bonding exerts pressure in the downwarddirection. This force is needed to keep the bond tool on the surface duringbonding. Unlike the Forcer, the Wire Clamps must exert approximately 0-200 grams of pull force in the upward direction during the pull test operation.To calibrate the Pull Force, you will use a calibration weight (P/N 177403),use a gram force scale sitting flat on a work stage, and follow the directionson a series of screens. The following screens are used in the calibrationprocedure.

1. Set the gram force scale on the work stage and press ON to activate.

2. Press [F12] (from the Pull test Setup screen) to bring up the firstcalibration screen shown below. Press START to send the Bond Headdown to the scale.

3. Press START to bring up the next screen. Enter the spring force valueshown on the scale through the keyboard. This is the value of the gramforce spring located in the Bond Head.


Program NameLINK File(if used)

Use spinners to position the head over the scale, then press START

START: ProceedF16: Abort

Program Name CALIBRATE PULL FORCELINK File(if used) Enter spring force value shown on scale: [ 475 ]

Press [F14] to accept spring forceNOTICE: Clamp cable should have some slack when clamp is closed

F14: Spring force

F16: Abort


Calibration Procedure INLINE BOND PULL TEST

4. When you press [F14] again to enter the spring force value shown onthe scale, another screen will appear asking you to place the calibrationweight (P/N 177403) on the transducer.

Since you need to pull up in the opposite direction of the forcer, you use thecalibration weight to add the additional weight (approximately 250 grams)required to prevent the tool from lifting off the scale. See Figure 4-1.

Figure 4-1 Put Pull test Calibration Gauge on Transducer

5. Press [F14] to proceed.

6. The next screen asks you to enter the total force value shown on the scale.Do this through the keyboard. The total force equals the preload of thegram force spring, plus the calibration weight (i.e. spring = 475, weight =250, for a total of 725). Press [F14] again to accept the total force.

Program Name CALIBRATE PULL FORCELINK File(if used) Attach calibration tool P/N 177403 to the transducer

F14: Proceed

F16: Abort

Gauge 177403


INLINE BOND PULL TEST Calibration Procedure

A series of screens will follow that calibrate to various pull force values. Atypical screen is shown below. Follow the instructions on the screen. Thiscalibration screen calculates the 725 (total force), minus 475 (spring force),minus 250 (adjusted scale force reading), to give the first calibrating point of0 gram pull force.

7. Screens will appear to calibrate values of 0, 100, 120, 140, 160, 180,and 200 gmf. Press [F14] for each calibration.

Program Name CALIBRATE PULL FORCELINK File(if used) Enter total force value shown on scale [725]

Press F14 to accept total forceF14: Total force

F16: Abort

Program Name CALIBRATE PULL FORCELINK File(if used)

Calibrating 0 gmf pull forceUse Y spinner to adjust scale force to 250

Spring force: 475Total force: 725

Use the Y spinner to adjust the forcer for the correct forceForcer calibration value: 1005

STOP: AbortF14: Next force calF16 Abort

Program Name CALIBRATE PULL FORCELINK File(if used)

Calibrating 100 gmf pull forceUse Y spinner to adjust scale force to150

Spring force: 475Total force: 725

Use the Y spinner to adjust the forcer for the correct forceForcer calibration value: 520

STOP: AbortF14: Next force calF16 Abort


Calibration Procedure INLINE BOND PULL TEST

This calibration screen calculates the 725 (total force), minus 475 (springforce), minus 150 (adjusted scale force reading), to give the secondcalibrating point of 100 gram pull force. Each following calibration point iscalculated in the same way, but using different values.

8. When complete, the last screen will remind you to remove thecalibration weight and press any key to proceed.


PREVENTIVE MAINTENANCE Caution

C H A P T E R 5

PREVENTIVE MAINTENANCEThe Active Loop Control Head must be maintained properly in order todeliver its maximum performance. The maintenance procedures are notcomplex. In fact, they are very similar to those you would perform on astandard Large Wire bond head, with a few variations.

Orthodyne recommends you establish a regular maintenance routine for eachmachine. Your company may have its own style of maintenance tracking.Use the proper PM schedule in the next section according to your machineusage.

Caution

CAUTION: Always wear ground straps when handling the printedcircuit boards to prevent ESD from damaging sensitiveelectronic components on the boards.

CAUTION: Always turn the ON / OFF switch, SW1 on the InterfaceControl Panel, to the OFF position before removing anycircuit board.

CAUTION: When the ON / OFF switch is in the OFF position, AC highvoltage is still supplied to the bonder. To disconnect powerto the bonder, unplug the power cord from its connector onthe back of the bonder.

Follow the above directions to prevent injury to you, or damage to themachine. Other Caution Flags are included in the specific PM sections wherenecessary.


PM That Directly Affect Wire Drag Force PREVENTIVE MAINTENANCE

PM That Directly Affect Wire Drag Force

Wire Feed Tubes

With extended use, the wire feed through the Teflon tubes can wear groovesinto the tubes. These grooves can cause an increase in the drag forces on thewire. An increase of the drag force on the wire can cause the calibrated pulltest force to be inaccurate.

It is recommended that the wire feed tubes be inspected monthly (one shift/day operation) or weekly (three shifts/day operation) for any signs of wear.Replace if necessary using the following procedures.

Replacing the Small Teflon Wire Feed Tube

The small wire feed tube (P/N 168066-2) extends from the Dereeler's blueencoder wheel through the transducer and metal wire guide tube andterminates at the top of the wire guide.

1. Turn the Dereeler switch to OFF. Remove the wire and the worn wirefeed tubing. Save the worn wire feed tubing.

2. Install a wire guide, if not already installed.

3. From the Main Menu, press [4] to select Manual Positioning. Move thecursor to Z Programmable Home. Turn the Y spinner to move thebonding head in Z to about the center of its travel. This is 1 inch(2.54cm) lower than the upper limit of travel.

4. If replacing with a precut length of tubing (P/N 168066-2), go directlyto step 5. If replacing from a spool of tubing (P/N 649021), performthis step. With a razor blade, or sharp utility knife, cut a length oftubing the same length as the worn tubing you removed. Make sure theopening in the end of the tubing is not pinched. If the old tubing is notavailable, cut the tubing to a length of 23.25 inches, ± .06 inches(59.06cm, ± .15cm).

WARNING: To avoid damage or kinking of the tubing, never handle with tweezers orneedle nose pliers. Kinking the tubing will cause excessive drag on thewire.


PREVENTIVE MAINTENANCE Replacing the Large Wire Feed Tube

5. Feed the new tubing in from the top through the larger Teflon tube,through the transducer hole, and into the wire guide tube until itbottoms out on the top of the wire guide.

6. Verify that the upper end of tubing extends approximately .12 inches, ±.02 inches (3.05mm, ± .50mm) beyond the large Teflon tube. If it is toolong, cut it so it does not interfere with the encoder rollers. To cut thetubing, place a flat blade screwdriver behind the tubing and cut with arazor blade or sharp utility knife against the screwdriver. Make sure theopening in the end of the tubing is not crushed.

Replacing the Large Wire Feed Tube

The large wire feed tube (P/N 160113-4) extends from the spool driver to theDereeler pinch wheels.

1. Remove the wire. Loosen the clamping blocks on either end of thetubing to remove the worn tubing. Save the old tubing.

2. If replacing with a precut length of tubing (P/N 160113-4), go directlyto step 3. If replacing from a spool of tubing (P/N 649016), performthis step. With a razor blade or sharp utility knife, cut a length of tubingthe same length as the worn tubing you removed. Make sure theopening in the end of the tubing is not pinched. If the old tubing is notavailable, cut the tubing to a length of 19.75 inches (50.165cm).

3. Install the new tubing into the clamping blocks. You may need togently pry open the clamping blocks with a small f lat bladescrewdriver. Adjust the tubing so it extends .01inches, ± .02 inches(.25mm, ±.50mm) above the upper clamp and extends .63 inches, ± .04inches (16.00mm, ± 1.02mm) beyond the clamp block near theDereeler pinch wheels. Tighten the clamp block screws.


Cleaning the ALC Jaws PREVENTIVE MAINTENANCE

Cleaning the ALC Jaws

Background

Some customers have observed an occasional buildup of aluminum on thewire clamp jaws of the ALC Head. Orthodyne developed a simple procedurefor cleaning the jaws that could still preserve the wire clamp adjustment.

Solution

The idea for cleaning the clamps is to open the clamps manually, insert afolded strip of abrasive paper between the jaws, close the jaws and pull theabrasive paper through.

Material Required

Cleaning strip, P/N 177900

Prepare cleaning strip as shown below:

Procedure

1. Move Bond Head to Z-home.

2. Set clamps to close position

3. Move the clamps backwards using the “unlock” button. This will pullthe wire out of the Wire Guide.

4. If larger than 10mil wire is used, use adjustment screw to loosen clampcable until clamps touch.

5. Open clamps manually by squeezing them together above the pivot.

6. Fold cleaning strip in half, so abrasive side is on the outside.

7. Position the abrasive strip between the clamps.

8. Close the clamps by squeezing them together below the pivot (withapproximately 500 grams force).


PREVENTIVE MAINTENANCE Cleaning Interval

9. Pull strip towards you and downward until it exits clamp.

10. Repeat if necessary, but no more than twice.

11. Lock clamps in position.

12. If larger than 10mil wire is used, re-adjust the slack in the clamp cableif necessary.

13. Re-adjust clamp open steps if necessary. (Refer to ALC Supplement,Manual No. 177000, page 3-7.)

Cleaning Interval

Cleaning interval is highly dependent on the application and the adjustmentof the clamp. Orthodyne recommends you observe the clamps periodically(approximately 40,000 bonds), for any evidence of aluminum buildup. Cleanonly if necessary.


Dereeler PREVENTIVE MAINTENANCE

Dereeler

Feed Wire / Tight Wire And Motor Speed Adjustment

Normally, the only maintenance tasks on the Dereeler are to replace therollers if worn and to clean off the sensors and pinch rollers. Clean thesensors with a dry cotton tipped swab and clean the pinch rollers with a drycloth (refer to drawing #172025 in the M360C Drawings and SchematicsManual).

In addition, the Dereeler may need recalibration every one or two years, orafter replacing components. Wire feed problems or inconsistent wirelooping are indications that recalibration is necessary. Use the followingprocedure to calibrate the Dereeler. Follow the instructions carefully. Thisis an extremely sensitive adjustment.


PCB 172562

The Dereeler PC board is under the bonder’s left cover. It is facing the leftside of the bonder.

Motor Speed AdjustmentTo perform this procedure:

1. Connect a frequency counter ground to TP2. Connect the test probe toTP9.

2. Position the Dereeler toggle switch at FEED to run the motor (removethe wire spool, if installed).

3. Adjust the VR5 pot (variable resistor) for 750 pulses per second.

ITEMS REQUIRED:Drawing 172562

Frequency CounterOscilloscope

Spool of 5 mil wireDrawing 172035


PREVENTIVE MAINTENANCE Feed Wire Sensitivity

Feed Wire Sensitivity1. Install a spool of five mil wire in the spool driver (see Figure 5-1). The

dancer arm weight #172272 must be installed on the dancer arm shaftwhen using wire sizes 5-15 mil. Orthodyne uses five mil wire in thefactory setup; any other size will change the calibration. Set theDereeler toggle switch to OFF. Feed the wire all the way through thethe Teflon tube, down to the Bond Head.

Figure 5-1 Spool Holder

2. Connect the oscilloscope ground probe to TP2 of the Dereeler board(refer to drawing 172562), and the test probe to TP3.

3. Use the Small Wire Encoder Roller (see Figure 5-2, on page 5-8) tomove the wire back and forth in front of the two back sensor pairs.Observe a peak to peak rise and fall as you move the wire from set toset. If you do not see a rise while the wire is over one set or the other, itis an indication that there is a problem with that LED sensor pair.Resolve the problem before continuing.


Tight Wire Sensitivity PREVENTIVE MAINTENANCE

Figure 5-2 Wire Dereeler

4. Move the wire to achieve the highest peak to peak reading. Adjust theVR1 potentiometer for 200 mVPP (millivolt peak-to-peak).

5. Move the wire back and forth in front of the forward set of feed sensors.The reading should be at least 100 mV and should not dip lower than 50mV when moving between sensor pairs.

NOTE: Move the wire back and forth to make sure you obtain a 200mVPP reading.

Tight Wire Sensitivity1. Move the test probe to TP1. Keep the ground probe on TP2.

2. Pull the wire tight into the front sensor set. Make sure the wire is as farforward as it can possibly travel.

3. Adjust the VR2 pot for a reading of 40 mV peak to peak.

4. Set the Dereeler switch to Auto. Move the wire back and forth toconfirm proper operation.

5. Move the wire to the hard stop (all the way forward) that is between theclear guides. Check that only the TIGHT WIRE light is lit. If LOOSEWIRE light is lit, there is a misadjustment; recheck the Feed/Tight WireSensitivity calibration procedure.


PREVENTIVE MAINTENANCE Spool Driver Motor Speed and Shutter Adjustment

PCB #172557

1. Remove the left cover (P/N 172120) from the spool driver assembly.Remove the spool of wire from the spool driver assembly. While lookinginto the spool driver assembly from the left side, gently pull the dancerarm (P/N 172130) down until the top edge of the arm is 9mm (3/16”)below the top of the groove (see Figure 5-3 ). The spool driver motorshould run. If it is out of adjustment, loosen the S2 sensor screws andcenter the sensor in its mounting holes. Tighten the screws. Loosen thetwo screws that hold the dancer arm shutter (P/N 172129) in place andturn the shutter until the spool driver motor starts to run while the dancerarm is held at 9mm (3/16”). Tighten the screws on the shutter.

Figure 5-3 Adjust Dancer Arm Shutter

2. Gently pull the dancer arm down until the bottom edge of the arm is1mm (1/16”) above the bottom of the groove (see Figure 5-3). Thespool driver motor should stop running (tight wire condition). Raise orlower the S1 sensor until the motor stops running when the dancer armis 1mm. above the bottom of the groove.

Spool Driver Motor Speed and Shutter Adjustment

Shutter Adjustment

EQUIPMENT REQUIRED:Gram gauge with a 0 to 50 grams range

Drawing 172035

Sensors S1 & S2

Dancer Arm ShutterSpring Tension Shaft Dancer Arm

Groove


Motor Speed Adjustment PREVENTIVE MAINTENANCE

3. Using a gram gauge, press down on the end of the dancer arm. Springtension on the arm should be between 12 and 15 grams at the 9mm.point. Adjust the spring tension by raising or lowering the springtension shaft (P/N 172130) (see Figure 5-3). Install the spool of wireand the left cover.

Motor Speed Adjustment

This adjustment is made to the Spool Driver printed circuit board.

1. Remove the left cover from the Spool Driver Assembly.

2. Unplug the motor cable from J3 on the Spool Driver PCB (see Figure5-4).

Figure 5-4 Disconnect the Motor Cable From J3

ITEMS REQUIRED:Frequency Counter

Drawing 172035

J3

Motor Cable


PREVENTIVE MAINTENANCE Motor Speed Adjustment

3. Use a mini-jumper to short pin 9 and pin 10 on J4. These pins are in thelast vertical row in the right corner of J4 (see Figure 5-5).

Figure 5-5 Attach Mini-Jumper to Pin 9 and Pin 10 of J4

4. Attach the probe or live clip of the Frequency Counter to TP2, usingTP1 as ground.

5. Adjust VR1 (speed) for a frequency of 1000pps (see Figure 5-6).

Figure 5-6 Attach Probes and Adjust Frequency

6. When done, remove the jumper and plug the motor connector on J3.Replace the left cover.

Jumper pin 9 and pin 10

VR1

TP1 TP2


Rollers PREVENTIVE MAINTENANCE

Rollers

1. If the rollers show signs of aluminum buildup, clean with a dry cloth ordry cotton swab. See Figure 5-2, on page 5-8, for location of the rollers.

CAUTION: Do not clean the rollers with alcohol or other cleaners orsolvents. A dry cloth or cotton swab is sufficient.

DO NOT USE OIL to lubricate roller bearings. KEEPALL OIL products AWAY from the Dereeler/SpoolDriver, or it will contaminate your wire and devices.

2. Check for grooves where the wire has been tracking on the rollers.Replace the wire feed rollers (P/N 172275) if they are too worn for thesmaller wire sizes.

HINT: You can double the roller life by removing the roller and rein-stalling it from the other side. Normally, the wire is not pinchedin the center of the roller.


PREVENTIVE MAINTENANCE ALC Stepper Motor PM

ALC Stepper Motor PM

Procedure

The recommended Preventive Maintenance action is to rotate the steppermotor every month in order to spread the grease on the motor shaft bearings.


2. Remove the covers from the ALC Bond Head.

3. Disconnect the clamp jaw cable from the slot in the moveable jaw (seeFigure 5-7).

NOTE: If you open the clamp jaws by hand, the clamp cable may be removed and re-installed without requiring adjustment.

Figure 5-7 Remove the Clamp Cable from the Moveable Clamp Jaw

4. With the clamp cable disconnected, you can turn the cam attached to theshaft of the stepper motor with your finger (see Figure 5-8). Turn theshaft several revolutions.

5. Re-attach the clamp cable into the slot of the moveable clamp jaw.

Clamp Cable Connects to Slot in Moveable Jaw Pivot

Moveable Jaw


Procedure PREVENTIVE MAINTENANCE

HINT: Press the moveable clamp jaw so as to open the clamp and put thecable end into the slot using tweezers.

6. Adjust the clamp cable using the procedure described in the ALCSupplement, “Setting Up The ALC Bond Head”, page 3-2, in theM360C User’s Manual.

7. Re-install the covers.

8. Perform this preventive maintenance action once a month.

Figure 5-8 Remove Clamp Cable and Turn Motor Cam

NOTE: Performing the PM described above will extend the life of this motor. How-ever, because of the small range of motion performed by this motor, it may havea tendency to wear and may need to be replaced in 2 to 3 years.

Clamp Cable

Motor Cam


C H A P T E R 6

ALC TROUBLESHOOTINGTroubleshooting involves a systematic approach to link an observed problemto a probable cause and then determines the correct approach necessary to fixthe problem. Often, the troubleshooting process will give you a number ofpossible causes and fixes. You will then select the most probable cause andtest the fix.

Remember, you are dealing with a machine that has many parts, manyvariables, and a process that has even more variables. This manual cannotpossibly cover every conceivable problem. Our intent is to guide you to themost likely causes and solutions. If you cannot solve the problem with theinformation in this book, call your Orthodyne Representative or factoryCustomer Service for assistance.

Table 6-1 lists the most likely problems that may occur with the ALC Head,and a summary of possible solutions.

Table 6-1: ALC Troubleshooting

Error Message Possible Cause Possible Solutions

M360C does not recognize ALC head

No SPI communication between Bond Head and I/O board.

1. Replace I/O board2. Replace Z cable3. Replace Head Junction board4. Replace Forcer/Focus board

[509] "SPI not responding" error message

Program written with standard head 1. Upgrade to software version 5.8 or later

2. Verify ALC specific wire parameters

Clamp not adjusted properly Verify Bond Head setup

Something rubbing against motor cam 1. Make sure all cables are routed properly

2. Make sure covers installed properly

Faulty clamp motor / sensor Adjust or replace

Noise on SPI lines 1. Upgrade I/O board (Rev K or higher)2. Upgrade Forcer/Focus board (Rev. E

or higher)

Faulty Z Cable Replace Z cable

Faulty Head Junction board; or faulty Forcer/Focus board; or faulty I/O board

Replace boards one at a time.

Active Loop Control Bond Head Supplement

ALC TROUBLESHOOTING

M360C stops with a false [53] "Pull test failure" alarm

Pull tolerance set too low Increase value to 150

Clamp does not close fully Adjust clamp linkage cable

Wire slips in clamp Clean clamp and adjust clamp force

Pull force not properly calibrated Calibrate

First Bond lifts, but ALC did NOT stop with a[53] "Pull test failure" alarm

HINT: Put machine in slow motion or "stop at search" to diagnose the following conditions:

a) During Pull test at twist height

Pull tolerance set too high Decrease value

Pull force not calibrated properly Calibrate

Pull force too low Increase pull force

Pull time too short Increase pull time to ≥ 30 msec

b) Between twist height and loop top move

Pull force too low Increase pull force

Too much drag in wire feed system 1. Wrong head setup2. Worn teflon tubing3. Worn wire guide4. Worn feed rollers

Minimum wire feed too low Increase Minimum Wire Feed parameter

c) Between loop top and second search move

Not enough wire to make loop Increase "Loop Value" parameter

Not enough wire due to too much drag in wire feed system

1. Worn teflon tubing2. Worn wire guide3. Worn feed roller

Second Bond lifts but ALC did NOT stop with a [53] "Pull test failure" alarm


a) During Pull test at vertical hop

Pull test tolerance too high Set tolerance lower

Pull force not calibrated properly Calibrate

Pull force too low Increase full force

Pull time too short Increase pull time to ≥ 30 msec

b) Between vertical hop and tail length move

Excessive drag force in wire feed system

1. Worn teflon tubing; 2. Worn wire guide; 3. Worn feed rollers

Wire guide too high Adust wire guide to 10-15 mils

Vertical hop value too low Increase vertical hop value



6-2 Active Loop Control Bond Head Supplement

ALC TROUBLESHOOTING

Low loop or flat loop Loop value too low Increase loop value

Wire guide too high Adjust wire guide to 10-15 mils

Clamp setup faulty Adjust clamp

Step back too short 1. Increase step back (if possible)2. Increase step forward angle

Wire breaks at first heel but ALC did NOT stop with [53] "Pull test failure" alarm


a) During Pull test at twist height

Pull force too high Decrease pull force. This can only happen if the pull tolerance is set too high.

Pull tolerance too high Decrease pull tolerance

Pull force not calibrated properly Recalibrate pull force

b) During twist height to loop top move

Too much drag in wire feed system 1. Worn teflon tubing2. Worn wire guide 3. Worn feed rollers

Not enough clamp open steps 1. Adjust clamp cable2. Increase clamp open step parameter

Wire already damaged at heel due to dirty bonding tool

Inspect and clean bond tool

Bond power too high resulting in over-deformed bond

Lower bond power

c) During loop top to second search move

Loop value too low Increase loop value parameter

Not enough wire due to too much drag in wire feed system

1. Worn teflon tubing2. Worn wire guide3. Worn feed rollers




C H A P T E R 7

ALC PULLTEST REMOTE SPECIFICATION

This modification to the M360C software adds the capability to control theALC bond head's pulltest feature through the handler interface. When thisfeature is enabled, the bonder will stop after each bond and wait for acommand from the handler. The handler may command the bonder to eitherpulltest this bond, or to continue bonding without performing the pulltest.This feature is optional, and may be selectively enabled/disabled at the user'sdiscretion. Both the standard mode and remote mode handler interfaces aresupported.


A new function is added to the DIAGNOSTICS MENU that allows you tosee LVDT values corresponding to pull displacements. These values aredisplayed in a new screen.


The software version features the addition of a “No Pulltest” feature to theRemote ALC Pulltest. It allows for two commands, “Pulltest” or “Proceed.”These commands are issued remotely during bonding to allow for a remotehandler to specify if a bond should be pulltested. A particular bond can be setto either Always pulltest, or to Remote pulltest. If set to Remote pulltest, thebonder will wait for the “Pulltest” or “Proceed” command.

The enhanced feature in Version 5.8C adds a third command option, ofNever Pulltest. The Never Pulltest option allows the user to specify thatcertain bonds should never be pulltested regardless of the commandsreceived during bonding. These selections are found on the second page ofthe WIRE LIST EDIT display.

System RequirementsThe pulltest remote control feature is available only on model M360Cmachines equipped with the ALC Bond Head. It is implemented in softwareversion 5.8, so version 5.8 or later is required to access this feature.

General Description

Active Loop Control Bond Head Supplement 7-1

Standard Mode Handler Type 1 ALC PULLTEST REMOTE SPECIFICATION

When bonding with the Pulltest remote control enabled, the bonder will pauseat the twist height (hop height for the last bond in the wire) and wait for instruc-tions from the handler. The handler will have the option of commanding thebonder to either pulltest the bond or proceed to the next bond without pulltest-ing. Note the following changes to bonder operation when Pulltest remote con-trol is enabled:

Because the bonder must pause at the twist (hop) height until itreceives instructions from the handler, all moves to twist (hop) willbe made at constant velocity.

Bonds marked in the wire list (Wire List Edit) to be pulltested willalways be pulltested, and the bonder will disregard the PULLTESTand PROCEED interface lines.

If the bonder remains paused at twist (hop) without seeing a signalfrom the handler for more than Handler timeout seconds, a "Handlertimeout" error will occur.

If the pulltest fails, the bonder will enter a "Pulltest failed" errorcondition.

Standard Mode Handler Type 1

Description


ALC PULLTEST REMOTE SPECIFICATION Interface Signal Description - Standard Mode

The existing handler interface signals do not change. The new interface sig-nals are accommodated via currently unused interface lines. (Note thatmachines equipped with the 172532 I/O board will need the discrete I/O kit tomake use of the additional interface signals. Machines equipped with the175512 I/O board have these lines available as standard, and do not requireany further hardware upgrades.) Electrically, the signal lines used for thePulltest remote control are the same as for the existing interface lines. Refer tothe Handler Interface: “Basic Hardware Implementation”, on page 1-7 forelectrical characteristics in the Peripheral Equipment Interface Specificiation(P/N DC05-172000).

When the bonder has completed the bond and has moved up to twist (hop)height, it will turn on the BONDER STANDBY interface signal. This indicatesto the handler that the bonder is paused waiting for a command from the handler.BONDER STANDBY will turn off when the bonder has received either thePULLTEST or the PROCEED command, and has resumed processing thedevice. (BONDER STANDBY also turns off in the event of a handler timeout.)

BONDER STANDBY will not turn on if the bond is marked for pulltesting inthe wire list (bonder does not wait for handler commands in this circumstance).

Two new signals are required to implement the Pulltest remote control. Thedesignations of these two signals are PULLTEST and PROCEED. Both arenecessary for operation of the Pulltest remote control.

PULLTEST is an active low input to the bonder from the handler(handler interface connector, pin 31). The bonder monitors thissignal only when it is in a paused condition (after the bond, waitingfor instructions from the handler). When the bonder receives thePULLTEST signal, it will perform the pulltest and continue to thenext bond.

PROCEED is an active low input to the bonder from the handler(handler interface connector, pin 37). The bonder monitors thissignal only when it is in a paused condition (after the bond, waitingfor instructions from the handler). When the bonder receives thePROCEED signal, it will continue on to the next bond without per-forming the pulltest.

Note that if either PULLTEST or PROCEED is turned on when the bonderturns on BONDER STANDBY, the bonder will respond immediately andperform the designated action. Also, PULLTEST takes precedence overPROCEED. That is, if both PROCEED and PULLTEST are turned on at thesame time, the bonder will act on PULLTEST and disregard PROCEED. It isthe responsibility of the handler to insure that both these signals are in theirdesired states before the bonder enters the paused condition.

Interface Signal Description - Standard Mode


Bond Cycle Sequence ALC PULLTEST REMOTE SPECIFICATION

Bond Cycle SequenceRefer to Figure 4-1 the bond cycle sequence in standard mode.

Figure 4-1 Standard Mode

1. Bonding. At the end of the bond, the Bond Head moves up to twistheight. (For the last bond in the wire, the Bond Head moves up to hopheight.)

2. Bonder arrives at twist (hop) height. If the bond is not marked for pulltest-ing in the wire list, the bonder will turn on BONDER STANDBY andwait here for instructions from the handler. If the bond is marked forpulltesting in the wire list, the bonder will perform the pulltest as in step4.

3. If the handler turns on the PULLTEST signal, the bonder will proceedwith the pulltest cycle. If the handler turns on the PROCEED signal, thebonder will skip pulltesting and proceed immediately to the next bond.In either case, the BONDER STANDBY signal is turned off.

4. Pulltesting. If the pulltest fails, the bonder will stop with an error. If thepulltest passes, the bonder will proceed to the next bond.

Handler Parameters Changes An additional parameter has been added tothe Handler Parameters Edit screen to support selective enable/disable of thisfeature, Pulltest remote control. It is only available on ALC Bond Headequipped machines. Possible values are "Yes" and "No". When set to "Yes",the feature is enabled. When set to "No", the feature is disabled. There are noother changes to the handler parameters.

Bonding

Move up to twist

Bond complete

Wait for commandfrom handler

Arrive at twist/BONDER STANDBY on

[bond not marked for pulltest]

Pulltesting

PULLTEST signal/BONDER STANDBY off

Bonder stoppedwith error Fail pulltest

Proceed to nextbond

Pass pulltest

PROCEED signal/BONDER STANDBY off

Arrive at twist/[bond is marked for pulltest]


ALC PULLTEST REMOTE SPECIFICATION Remote Mode Handler Type 2

When bonding with the Pulltest remote control enabled, the bonder will pause atthe twist height (hop height for the last bond in the wire) and wait for instruc-tions from the handler. The handler will have the option of commanding thebonder to either pulltest the bond or proceed to the next bond without pulltest-ing. Note the following changes to bonder operation when Pulltest remote con-trol is enabled:

Because the bonder must pause at the twist (hop) height until itreceives instructions from the handler, all moves to twist (hop) willbe made at constant velocity.

Bonds marked in the wire list (Wire List Edit) to be pulltested willalways be pulltested, and the bonder will disregard the remoteextended command interface lines while bonding.

If the bonder remains paused at twist (hop) without receiving acommand from the handler for more than Handler timeout seconds,a "Handler timeout" error will occur.

If the pulltest fails, the bonder will enter a "Pulltest failed" errorcondition.

The existing handler interface signals do not change. The new interface func-tionality is accommodated by extensions to the remote extended command set.(Note that machines equipped with the 172532 I/O board will need the discreteI/O kit to make use of the remote extended commands. Machines equipped withthe 175512 I/O board have the necessary signal lines available as standard, anddo not require any further hardware upgrades.) Refer to the Handler Interface:“Basic Hardware Implementation”, on page 1-7 for electrical characteristics ofthe handler interface in the Peripheral Equipment Interface Specificiation (P/NDC05-172000).

When the bonder has completed the bond and has moved up to twist (hop) height,it will turn on the BONDER STANDBY interface signal. This indicates to thehandler that the bonder is paused waiting for a command from the handler.BONDER STANDBY will turn off when the bonder has received either thePULLTEST or the BOND command, and has resumed processing the device.(BONDER STANDBY also turns off in the event of a handler timeout.)BONDER STANDBY will not turn on if the bond is marked for pulltesting in thewire list (bonder does not wait for handler commands in this circumstance).

Remote Mode Handler Type 2

Description

Interface Signal Description - Remote Mode


Interface Signal Description - Remote Mode ALC PULLTEST REMOTE SPECIFICATION

Since implementation of the Pulltest remote control feature is accomplishedvia the existing remote extended commands interface, no additional interfacesignals are required. However, a new command (PULLTEST) is added to theremote extended commands, as described below.

PULLTEST. Hex 54 (ASCII "T"). When the bonder is paused attwist (hop) height, it monitors the remote extended command lines.If it receives the PULLTEST command, it will perform the pulltestand continue bonding.

BOND. Hex 42 (ASCII "B"). This is an existing command,normally used to initiate bonding in remote mode after index-ing. It is used here to command the bonder to proceed to thenext bond without performing the pulltest.


ALC PULLTEST REMOTE SPECIFICATION Bond Cycle Sequence

Bond Cycle SequenceRefer to Figure 4-2 for the Bond Cycle sequence in Remote mode.

Figure 4-2 Remote Mode

1. Bonding. At the end of the bond, the Bond Head moves up to twistheight. For the last bond in the wire, the Bond Head moves up to hopheight.

2. Bonder arrives at twist (hop) height. If the bond is not marked for pulltest-ing in the wire list, the bonder waits here for instructions from the han-dler. If the bond is marked for pulltesting in the wire list, the bonder willperform the pulltest as in step 4.

3. If the handler sends the PULLTEST command, the bonder will proceedwith the pulltest cycle. If the handler sends the BOND command, thebonder will skip pulltesting and proceed immediately to the next bond.In either case, the BONDER STANDBY signal is turned off.

4. Pulltesting. If the pulltest fails, the bonder will stop with an error. If thepulltest passes, the bonder will proceed to the next bond.

Bonding

Move up to twist

Bond complete

Wait for commandfrom handler

Arrive at twist/BONDER STANDBY on

[bond not marked for pulltest]

Pulltesting

PULLTEST command/BONDER STANDBY off

Bonder stoppedwith error Fail pulltest

Proceed to nextbond

Pass pulltest

BOND command/BONDER STANDBY off

Arrive at twist/[bond is marked for pulltest]


Notation ALC PULLTEST REMOTE SPECIFICATION

Handler Parameters Changes An additional parameter has been added tothe Handler Parameters Edit screen to support selective enable/disable of thisfeature, Pulltest remote control. It is only available on ALC bond headequipped machines. Possible values are "Yes" and "No". When set to "Yes",the feature is enabled. When set to "No", the feature is disabled. There are noother changes to the handler parameters.

NotationThe ellipse indicates a unique machine state. States are terminatedby events, which cause the machine to transition to the next state.

The event which terminates a state is listed first, and may result in anaction. The action will be separated from the event by a slash (/).

Transitions between states may also depend on a condition. Conditions follow events and actions and are indicated by beingenclosed in brackets ([]).

From the above explanations, we see that the notation "Arrive attwist/BONDER STANDBY on [bond not marked for pulltest]"indicates that this transition was triggered by the bond head'sarrival at twist height, the BONDER STANDBY line was turnedon in response to this event, and that this transition will be takenonly if the bond is not marked for pulltest.


INDEX

MODEL 360C USER’S MANUAL INDEX-1

AActive Loop Control Bond Head

definitions 1-3description 1-1inline bond test calibration 4-11installation 1-11major assemblies 1-4operating considerations 1-8pcb assemblies 1-6theory of operation 1-3

ALCsee Active Loop Control Bond Head

Bbonding tools

installing 2-4OE part numbers 2-3position illustration 2-5

Ddereeler

spool drivershutter adjsutment 5-9

Wwire cutter

OE part numbers 2-3wire guides

OE part numbers 2-3

USER'S SUPPLEMENT

MIS-INDEX POSITION SENSORSUPPLEMENT

Document Part No. DC04-176000A

ISSUE DATE: September, 2000


2300 Main Street


Telephone (949) 660-0440

FAX (949)-660-0444





F O R W A R D




-2 Mis-Index Position Sensor Supplement

TABLE OF CONTENTS

CHAPTER 1 MIS-INDEX SENSOR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1Overview 1-1Installation 1-1Set up 1-2Adjusting The Amplifier 1-5

Amplifier Type P/N 708506 1-5Amplifier Type P/N 708512 1-8

Error Condition 1-9


This supplement describes the installation and adjustment of the Mis-IndexPosition Sensors. These sensors are incorporated into the DIP Handleroption. The purpose of these sensors is to monitor the position of theleadframe relative to the bonding station. If the leadframe is not in the properposition, a signal from the sensor will stop the machine and prevent thebonding action from taking place.

The Mis-Index Position Sensors are shown in Figure 1 and Figure 2. Thesesensors are positioned to the left and to the right of the Clamp Station. Thepurpose of the sensors is to prevent a device from being damaged in theevent of a mis-index.

NOTE: Handler software 4.1 or higher is required for the Wide MatrixLeadframe Handler.

Mis-IndexPositionSensor


Figure 1 Sensor Installation Shown Without Covers

C H A P T E R 1

MIS-INDEX SENSOR

This supplement describes the installation and adjustment of the Mis-IndexPosition Sensors. These sensors are incorporated into the DIP Handleroption. The purpose of these sensors is to monitor the position of theleadframe relative to the bonding station. If the leadframe is not in the properposition, a signal from the sensor will stop the machine and prevent thebonding action from taking place. More importantly, the machine will stopthe clamp station from clamping and possibly damaging the leadframe.

The Mis-Index Position Sensors are shown in Figure 1 and Figure 2. Thesesensors are positioned to the left and to the right of the Clamp Station.

NOTE: Handler software 4.1 or higher is required for the Mis-IndexSensor.

Overview

Installation



Figure 1 Sensor Installation Shown Without Covers

Mis-index Sensor Supplement 1-1

Set up MIS-INDEX SENSOR

The position of the Mis-Index Position Sensors will vary from product toproduct. Refer to the tooling drawing (#176020-xxx for DIP, or #173022-xxxfor Reel to Reel) that corresponds to your product for instructions on settingthe location of these sensors.

If the sensors require adjustment:

1. Remove the screws that secure the Track Mounting Cover Plates. (referto Figure 2, on page 1-2) then remove the covers (or cover).

NOTE: Use of Track Mounting Cover plates is dependent upon the appli-cation. Covers are included with the PSO-10 two and three-rowleadframes, but not with D2/P2 PAK.

2. Locate the 3 cap screws that secure the sensor in position (refer toFigure 3, on page 1-3).

Set up

Figure 2 Sensors Shown with Covers and Tooling



Track MountingCover Plate

1-2 Mis-Index Sensor Supplement

MIS-INDEX SENSOR Set up

3. Refer to the tooling drawing that corresponds to your product anddetermine the direction (X or Y) that the sensor(s) need to be moved.The height and of the sensor(s) must also be set to the value specifiedon the appropriate tooling drawing (refer to the tooling drawing). Inaddition the rotation must be set. Line up the sensors to the Y-axis asshown in Figure 4, on page 1-4.

4. Clamp a leadframe in the Clamp Station making sure that it is centeredrelative to the Anvil and Clamp Fingers.

5. With a leadframe strip clamped in the Clamp Station, go to theMANUAL POSITION screen and use the spinners to move thecrosshairs to the position of the Mis-Index Sensor specified on theappropriate tooling drawing.

6. Exit the MANUAL POSITION screen. This will disable the spinners sothe set position will not be lost.

7. Unclamp the leadframe strip and remove it from the Clamp Station.

8. Loosen the appropriate Position Sensor screw(s), adjust the Sensor tothe center of the crosshairs on the monitor (use Figure 4 as a reference),and retighten the screw(s).

HINT: If the sensor’s fiber optic red lights are to bright to position accu-rately, they can be dimmed temporarily. Follow these steps:1) Flip the locking tab into the up position. See Figure 5, on page1-5.

2) Slowly pull the fiber optic cable connector out of the amplifiertop until the sensor light can be viewed clearly on the monitor.

3) After you have completed positioning the sensor, make sureyou re-insert the cable connectors into the amplifier and flip thelocking tab back to the down position.

Figure 3 Mis-Index Position Sensor Cap Screws

X

YY

Mis-Index Sensor Supplement 1-3

Set up MIS-INDEX SENSOR

9. Re-install the Track Mounting Cover Plates (if applicable) and tightenall screws.

Figure 4 Aligning Sensor to Crosshairs

Red Fiber Optic Light


Amplifier Type P/N 708506 Adjusting The Amplifier MIS-INDEX SENSOR

Orthodyne may use one of two styles of Mis-Index Sensor amplifiers,depending on the customer application. The adjustment procedure for eachtype will be described.

Figure 5 shows a drawing of the Amplifier, with call outs to identify theimportant features of the device.

Figure 5 P/N 708506 Sensor Amplifier

To adjust the sensitivity of the Sensor, you will be using the OperationIndicator light, the Sensitivity Level Indicator, and the Sensitivity Adjuster(potentiometer).

Adjusting The Amplifier

Amplifier Type P/N 708506

Part Description

(Normally set to “NON”)

Locking Tab


Sensitivity Adjustment Adjusting The Amplifier MIS-INDEX SENSOR

1. Verify the sensitivity by observing the correct condition of theOperation Indicator (Orange). The function of the Operation Indicatordepends upon the combination of the sensing condition and the selectedMODE as shown in the following table.

2. The Sensitivity Adjuster is a 12-turn potentiometer. The maximumsensitivity is obtained by turning it fully clockwise.

3. The Sensitivity Level Indicator (see Figure 6) shows the presentsensitivity level.

Figure 6 Sensitivity Indicator Showing Present Value

Sensitivity Adjustment

SensorCondition MODE Operation

Indicator

LightL-ON (Light - ON)

D-ON (Dark - ON)

DarkL-ON (Light - ON)

D-ON (Dark - ON)

MAX

OPTIMUMPOINT


Sensitivity Adjustment Adjusting The Amplifier MIS-INDEX SENSOR

The sensing method used in the Mis-Index Position Sensor is Reflective, thatis, if the leadframe is in the wrong position, the light will be reflected back tothe sensor. If the leadframe is in the correct position, the light will passthrough and the beam will not be received by the sensor. These conditionsare illustrated in the table below.

Step Sensing Method Operation Sensitivity LevelIndicator

Reflective

1 Set the operationselection switch to theLight-ON mode (initialsetting)

Turn the sensitivity adjuster fullcounterclockwise (Minimum sen-sitivity)

2

Beam received

In the beam received condition,slowly turn the adjuster clockwiseand find the point A where thesensor is switched ON. Observethe Orange light on the OperationIndicator.

3

No beam received

In the no-beam condition, turn theadjuster further clockwise untilthe sensor goes into the ON stateagain. Once it is switched ON,turn the adjuster counterclock-wise a little and find the point Bwhere it is switched OFF.If the sensor does not go into theON state, MAX is point B.

4 Set the adjuster at the center onpoints A and B. This is regardedas the optimum sensitivity point.

B

A MAX

MAX

A ON

MAX

BOFF

ONMAX


Amplifier Type P/N 708512 Adjusting The Amplifier MIS-INDEX SENSOR

Amplifier Type P/N 708512

Amplifier type P/N 708512 presents the sensitivity level indication usingLED digital readout. The amplifier unit can be used with a single sensor unit,or ganged together with several sensor units.

1. Set the sensitivity of the amplifier so that the number reads 1500 on thedigital display (see Figure 7). This is a mid-point value.

Figure 7 Setting The Sensitivity

2. Place a leadframe in the clamping station and adjust its position so thatmost of the light from the sensor will shine through the index hole onthe leadframe.

3. Set the MODE switch on the amplifier to LIGHT ON.

4. Adjust the amplifier sensitivity so that the LED reads a large numberwhen the sensor is ON and a small number when it is OFF.

This component is equipped with an interference prevention function. Up tothree fiber optic sensors can be mounted close to each other by settingdifferent emission frequencies. Response time varies with the emissionfrequency as given in the following table.

Interference Prevention Function

The sensitivity number is shown in the Digital LEDmonitor display on each amplifier.

To set the sensitivity number, press the Manual (toggle)button in either the (+) or (-) direction to increase ordecrease the number shown on the LED display.

Locking Tab


MIS-INDEX SENSOR Error Condition Interference Prevention Function

If the leadframe strip is not indexed into or out of the Clamp Stationproperly, the Position Sensors will detect the mis-indexed strip and will notallow the clamps to close. The following error message will appear in theTransport Station display window:

To recover from the above error:

1. “Press Any Key” as stated in the message.

2. Press #2 (“Index Home”) on the handler key pad.

3. Determine why the strip did not index properly and correct its position.

The handler can now be put back into the Auto Run or Remote mode(whichever mode you were using).

EmissionFrequency

ResponseTime

FR1 0.5ms or less

FR2 0.65ms or less

FR3 0.75ms or less

Error Condition

-: Transport Station Error:-

Strip not in position

Press Any Key

Mis-Index Sensor Supplement 1-9

USER'S SUPPLEMENT

AUTOLINE M360C-HDSUPPLEMENT

P/N DC04-176041B

ISSUE DATE: MAY, 2000


2300 Main Street


Telephone (949) 660-0440

FAX (949)-660-0444

E-mail [email protected]




F O R W A R D




-2 Autoline M360C-HD Supplement

TABLE OF CONTENTS

CHAPTER 1 AUTOLINE PROJECT CONTENT. . . . . . . . . . . . . . . . . . . 1-1Equipment Specifications 1-2

Rear Load Magazine Handler 1-2SECS/GEM Computer 1-2

(Minimum Requirements) 1-2

CHAPTER 2 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1Overview 2-1Functional Description 2-2

Magazine Handlers 2-2

CHAPTER 3 SETTING UP THE HANDLER . . . . . . . . . . . . . . . . . . . . . . 3-1Mechanical Setup 3-1

Input/Output Magazine Handlers 3-1Bar Code Reader And Buffer Sensor 3-3Programming The Elevator 3-5

Autoline M360C-HD Supplement TOC-i

C H A P T E R 1

The Autoline M360C-HD machine configuration is a special edition of thestandard machine. The primary differences, compared to the standardM360C-HD include:

Custom, rear-loading magazine input and output handlers

Bar code reader included in the input and output handler

SECS/GEM compatible interface

SECS/GEM model software loaded on a separate PC supplied withmachine

Transport Software version 5.0 for M360C-HD

NOTE: Your machine includes new software. Read the Software Releaseinformation. Software version 5.8 is required for the machinesystem, while software version 5.0 is for the Transport and Maga-zine Handlers. Release Instructions for 5.0 are included in thisdocument, while 5.8 are in the M360C-HD User’s Manual.

AUTOLINE PROJECT CONTENT

Part No. Item

178400 Rear Load Magazine retrofit kit

172483 SECS/GEM Kit

Autoline Supplement 1-1

Equipment Specifications Equipment Specifications AUTOLINE PROJECT CONTENT

NOTE: Leadframes and magazines that are shorter than the minimum lengthspecifications require a special kit. Contact OE Rep. or factory fordetails.

Equipment Specifications

Rear Load Magazine Handler

Handler Type Remote mode

Floor Space Requirements Model C-H:127 cm wide x 126 cm deep

Model C-HD:193 cm wide x 126 cm deep

Magazine Specifications Length:Minimum: 165 cmMaximum: 260 cm

Width:Minimum: 30 cmMaximum: 80 cm

Height:Minimum: 60 cmMaximum: 150 cm

Strip Specifications Length:Minimum: 160 cmMaximum: 255 cm

Width:Minimum: 25 cmMaximum: 75 cm

SECS/GEM Computer(Minimum Requirements)

Processor Pentium 100 MHz

RAM 32 MB

Hard disk 500 MB

Monitor 15 inch

1-2 Autoline Supplement

C H A P T E R 2

The 360C-HD Wire Bonder in the Autoline configuration is a fully auto-matic wire bonder with magazine fed indexing system, designed to interfacewith an automated factory material handling system.

The autoline handler system incorporated into the bonder can accommodate avariety of leadframe devices. Using custom designed tooling, the wire bondercan be set up to run the TO-220FP leadframe design, P2PAK, D2PAK, andmany other products.

This manual describes the functions, set up, and operating instructions of theHandler portion of this 360C-HD.

Figure 2-1 Model 360C-HD Autoline Configuration

INTRODUCTION

Overview

Transport #1Transport #2

InputMagazineHandler

OutputMagazineHandler

Autoline M360C-HD Supplement 2-1

Functional Description Functional Description INTRODUCTION

Refer to Figure 2-1, on page 2-1 for the location of the various componentsof the Leadframe Handler.

The machine is designed to operate with a SECS/GEM factory host com-puter in an automated factory production line. SECS/GEM stands for “Semi-conductor Equipment Communication Standard/General Equipment Model”.It is an industry standard for Computer Integrated Manufacturing for auto-mated factories. SECS/GEM is basically a communication protocol thatallows various types of equipment to talk to a factory Host computer.

With SECS/GEM in place, the status of each production step can be mea-sured as to performance or downtime and displayed to remote locations. Ourmachine provides the user with real-time information regarding the state ourequipment is in, to identify errors and any undesirable trends that might bedeveloping. This allows timely adjustment of the process flow to minimizequality problems.

A two-shelf magazine handler is located on the left side of the handler andfeeds devices onto the transport system. This is called the “Input MagazineHandler”. In the Autoline configuration, the Magazine Handler opens to theback of the machine so they can be loaded by the robotic material transfersystem.

Each Magazine Handler consists of a Load and Unload Platform. EachPlatform has a dual pusher system. On the Load Platform, the first set ofpushers fill a buffer area, while the second set of pushers move magazinestoward a vertical elevator mechanism. On the Unload Platform, the first setof pushers remove the magazines from the elevator and fills a buffer area.The second set of pushers moves the magazines to the end of the platformwhere they can be picked up by the material transfer robot.

If the elevator is busy, the first set of pushers will fill the buffer area, whilethe second set of pushers will wait for the elevator to be ready. The bufferarea will continue to be filled until the “buffer full” sensor is activated.

Unique to the Autoline configuration is a Bar Code sensor that reads a barcode strip affixed to each magazine. The elevator pauses part way down itsvertical travel to allow the Bar Code sensor to read the strip, prior toreaching the first magazine slot location.

The Bar Code is used to ensure that the equipment and host agree on whichmagazine is due to be processed next. If the Bar Code does not match the


Magazine Handlers

2-2 Autoline M360C-HD Supplement

INTRODUCTION Functional Description Magazine Handlers

expected value, the elevator will move the magazine back up to the loading deckand stop.

All other aspects of the Input (and Output) Magazine Handlers are the sameas for a standard M360C-H/HD machine. Refer to the appropriate portions ofthe M360C-H/HD User’s Manual for additional information.


C H A P T E R 3

The User’s Manual for standard M360C-H/HD machine contains instruc-tions for the mechanical setup and device conversion procedures for adapt-ing the magazine to the Handler. These procedures stay the same for theWide Matrix, Autoline machine except as noted.

Before beginning the adjustments described in this chapter:

1. Power up the bonder as described in the 360C User's Manual.

The Input and Output Magazine Handlers attach to the machine in a similarway as for the standard M360C-HD. The Magazine Handler sits on a frameattached to the machine (see Figure 3-1).

Figure 3-1 Magazine Handler Mounting Frame

The Magazine Handler attaches to the frame with screws that pass throughthe slots in the frame. The elongated slots allow the Magazine Handler to be

SETTING UP THE HANDLER

Mechanical Setup

Input/Output Magazine Handlers

Magazine HandlerMounting Frame


Input/Output Magazine Handlers Mechanical Setup SETTING UP THE HANDLER

adjusted in the X and Y direction (relative to the Transport feed track). Theseadjustments are used when aligning the feed position of the leadframe maga-zine and will have to be performed each time the leadframe width ischanged. Figure 3-2 shows the Input Magazine Handler properly attached tothe machine.

Figure 3-2 Input Magazine Handler Installed On Machine

Note that the Handler opening is to the back of the machine (see Figure 3-3).

Figure 3-3 Autoline Magazine Handler View From Front Of Machine

Magazines Feed FromThe Back Of Machine


SETTING UP THE HANDLER Mechanical Setup Bar Code Reader And Buffer Sensor

The Handler is longer to handle magazine loading from the rear. Each maga-zine is identified by a bar code so that the system can recognize the productand compare it to the value received from the SECS/GEM host.

The magazines are transferred to the Handler Elevator in two steps, as shownin Figure 3-4. The first loader track pushes the magazines approximatelyhalf way filling a buffer area, then the second track loader pushes the maga-zines the rest of the way. In the event the elevator is occupied, the first set ofpushers will continue to fill the buffer area until the buffer sensor triggersand reports a “buffer full” condition to the system. The transfer mechanismis factory adjusted and requires no additional set up by the User.

Figure 3-4 Magazine Loader System

Instructions for adjustments to the Magazine Handler and the alignment of theElevator to the Transport Unit can be found in Chapter 2, “Setting Up the Han-dler” and Chapter 3, Programming (Input Setup), both in the standard M360C-H/HD User’s Manual.

Unique to the Autoline Handler system is the buffer sensor and the bar codereader. The placement of these components is shown in Figure 3-5.

Bar Code Reader And Buffer Sensor

Bar Code

First Loader TrackSecond Loader Track

Buffer Area


Bar Code Reader And Buffer Sensor Mechanical Setup SETTING UP THE HANDLER

Figure 3-5 Location of Magazine Sensors

Twenty (20) mm of adjustment is provided with the magazine buffer sensoralong the long axis of the Loader. The adjustment (rarely required) is toallow for cutouts or other features on the bottom of the magazine whichmight otherwise interfere with the proper functioning of the sensor.

The Bar Code Reader light beam can be seen in Figure 3-6.

Figure 3-6 Bar Code Scanning Sensor Beam

The Bar Code Reader attempts to acquire the bar code value on the maga-zine as the magazine is lowered into position by the elevator. The verticalposition of the magazine on the elevator is programmable, where it pauses sothe sensor can read the bar code. Programming this position will be dis-cussed in the next section.

Bar Code Reader Ismounted undermagazine platform

Magazine Buffer Sensor

Bar CodeReader

Bar Code ReaderLight Beam


SETTING UP THE HANDLER Mechanical Setup Programming The Elevator

The Bar Code Reader line can be adjusted so it is approximately centered onthe bar code label. This adjustment is illustrated in Figure 3-7.

Figure 3-7 Adjusting The Bar Code Reader

CAUTION: Do not look directly into the bar code laser beam becausethis may injure your eyes.

1. Put a magazine in the elevator and lower the magazine to the bar coderead position.

2. Turn on the bar code reader scan line using the “Calibrate Bar CodeReader” button in the SECS/GEM Control Application (Material Move-ment page).

3. Loosen the two screws holding the Bar Code Reader package.

4. Adjust the Bar Code Reader scan line location with respect to the barcode label on the magazine by moving the sensor with an M4 wrenchinserted in the slot next to the screws. Find a retaining feature with theM4 wrench in the bracket below, and then adjust along the slot length.

5. Retighten the screws.

6. In the event that there is not sufficient adjustment, remove the bracketand switch the sensor’s mounting position to a second position on thebracket. Then re-install the bracket.

The procedure to program the elevator can be found in the standard Model360C-HD User’s Manual, Chapter 3. Listed below are the differences forprogramming the Autoline Elevator.

Programming The Elevator

Bar Code Reader Screws

Insert An M4 Wrench Into SlotTo Adjust Along Slot Length


Programming The Elevator Mechanical Setup SETTING UP THE HANDLER

The Input Handler Setup Menu has one additional selection field, “4 EditBar Code Reader” as shown in the following screen.

When you press [4], another screen will appear (shown below) containingtwo parameters.

The “bar code reader enabled” parameter can be set to “Yes” or “No”. If theparameter is set to “No”, the bar code will not read the magazine. If runningwith the ESEC Autoline, the parameter must be set to “Yes”.

The bar code reader slot position can be modified in this screen, but it is notrecommended because the position will be set as part of the magazinehandler “Teach”.

The “Teach” routine for the magazine handler is the same as that describedin the standard User’s Manual except that the Bar Code Reader positionneeds to be set up.

1. From the Setup Menu, press [6],[2] to access the Teach input routine:

A screen will appear that reads “Verify the ability to read the bar code”.

2. At this point, turn on the bar code scan line using the “Calibrate BarCode Reader” button in the SECS/GEM Control Application (MaterialMovement page).

3. Perform the horizontal Bar Code Reader and vertical elevator adjust-ments. The horizontal adjustment is described in the previous section.The vertical adjustment is done using the [F2] (Up) and [F3] (Down)keys.

INPUT HANDLER SETUP

1 Edit

2 Teach

3 Set Last Magazine

4 Edit Bar Code Reader

F1: Proceed F4: Abort

INPUT HANDLER SETUP

Bar code reader enabledBar code reader slot position

No4000

F1: Save F4: Abort


SECS/GEM USER’S MANUALSUPPLEMENT

MODEL 360 FAMILY BONDERS

Document Part Number: DC04-172483

Revised: September, 2001




Telephone (949) 660-0440

FAX 949-660-0444





FORWARD

Revision HistoryREVISION DATE REVISED BY: DESCRIPTION

1.0 08/24/99 Ed Shields First revision

2.0 9/23/99 Ed Shields Added section 3.3 Reset/Emergency Stop, general corrections

3.0 11/2/99 Ed Shields Added Appendix 1 and 2

4.0 2/22/00 Cindy von Tresckow Revisions for Autoline application and SEC/GEM Software version 2.0

5.0 7/25/00 Cindy von Tresckow Revisions for Autoline application and SECS/GEM Software version 2.1

6.0 8/4/01 Dominic Sha Revised to add Autoline charts MMR 073001-1

-2 MODEL 360 SECS/GEM MANUAL SUPPLEMENT

TABLE OF CONTENTS

SECS/GEM USER’S MANUAL SUPPLEMENT . . . . . . . . . . . . . . . . . . . 1-11.0 Introduction...................................................................................................... 1-12.0 Host SECS/GEM Interface............................................................................... 1-13.0 Startup and Shutdown .................................................................................... 1-1

3.1 Start Up 1-13.2 Shutdown 1-23.3 Reset / Emergency Stop 1-23.4 Putting Devices into Local / Remote Mode 1-3

4.0 User Interface................................................................................................... 1-44.1 Title Bar 1-54.2 States 1-64.3 Terminal Services 1-74.4 Orthodyne Equipment Constants 1-74.5 Status Indicators 1-74.6 Tabbed Activity Groups 1-8

4.6.1 Remote Commands 1-84.6.2 Process Programs 1-104.6.3 GEM Equipment Constants 1-124.6.4 Material Movement 1-13

M360C Set Up............................................................................................ Appendix-11.1 Hardware Setup Appendix-11.2 Software Setup Appendix-3

PC Set Up .................................................................................................. Appendix-42.1 Introduction Appendix-4

2.1.1 General Procedure Appendix-42.2 Installation and Configuration of the 8-port/16-port Serial Board Appendix-4

2.2.1 Hardware Installation Appendix-42.2.2 Board Configuration Appendix-5

2.3 Installation of the SECS/GEM Control Application Appendix-52.3.1 General Procedure Appendix-52.3.2 Configuring GWGEM Appendix-8

Changing Configuration After Installation ............................................. Appendix-93.1 Introduction Appendix-93.2 Configuring Device COM Ports Appendix-93.3 Configuring The Host Resume Option Appendix-103.4 Configuring the Processing State Model Appendix-11

MODEL 360C USER’S MANUAL TOC-i

SECS/GEM USER’S MANUAL SUPPLEMENT

1.0 Introduction

The M360C SECS/GEM Control Application allows an operator and/or a Hostcomputer to control the M360C Wire Bonding cell. The operator can control the cellvia the User Interface and the Host can control the cell via the M360C SECS/GEMinterface. The M360C SECS/GEM control application runs on the externalcomputer (supplied with kit P/N 172483) which is attached to the Wire Bonding cellwith cables.

The M360C SECS/GEM Control Application is GEM compliant, and most of theGEM capabilities available to the Host are also available to the Operator. TheM360C SECS/GEM Control Application is easily configured to represent the wirebonding cell configuration of your needs. It may control a cell that consists of asingle Transport and a single Wire Bonder, up to a cell that consists of one (1) InputMagazine Handler, one (1) Output Magazine Handler, two (2) Transport Systems,two (2) Wire Bonders and two (2) Barcode Readers. Such flexibility is achievedthrough simple editing of the configuration file.

This document explains the details of the User Interface and teaches the readers howto control the equipment via the User Interface.

2.0 Host SECS/GEM Interface

Under normal (non-alarm) conditions, the M360C Wire Bonding cell can be entirelycontrolled by a Host computer.

The M360C SECS/GEM Control Application is GEM compliant and can beconfigured to communicate either via SECS-I or HSMS. The SECS/GEM interfaceto the Host is not the focus of this document. The SECS/GEM interface is explainedin detail in the M360C SECS/GEM Interface Specification document.

The M360C SECS/GEM Control Application software should be started before allthe devices in the Wire Bonding cell are powered up. After the M360C SECS/GEMControl Application has started and the User Interface is fully displayed, the Usermay power up all the devices composing the cell. Once all the devices in the cell

3.0 Startup and Shutdown

3.1 Start Up

M360 SECS/GEM USER’S MANUAL SUPPLEMENT 1

3.2 Shutdown

have been powered up and have completed initialization, the User must click on the“Initialize” Button in the Remote Commands area of the M360C SECS/GEMControl Application (Figure 1, on page 4).

NOTE: Device initialization is complete when the main menu screens areshown on all wirebonders/transports and the magazine handlers are nolonger moving.

This will cause the M360C SECS/GEM Control Application to synchronize its dataand states with those of the Wire Bonding cell. If after pressing the Initialize buttonthe Current Status indicator shows “Not All Devices Initialized”, press the Initializebutton again until the Current Status shows “All Devices Initialized”.

Once initialization of all devices is completed successfully, the M360C SECS/GEMControl Application is ready to operate.

3.2 Shutdown

This section describes shutdown procedures. Do not shut down the ControlApplication until all individual devices composing the Wire Bonding cell havebeen shut down.

To shut down the system, follow these procedures:

1. Wait until the system is no longer processing parts.

2. In the M360C SECS/GEM Control Application, switch the CommunicationsState to “DISABLED” or the Control State to “OFFLINE”. This prevents hostinterference during the shutdown process.

3. Turn off the wire bonder(s).

4. Close the M360C SECS/GEM Control Application by clicking on the “X”button on the top-right corner of the User Interface.

5. The system will prompt you to provide a shutdown password. Provide thepassword and press the ENTER key. If no password has been set up, simplypress the ENTER key.

3.3 Reset / Emergency Stop

In the event it is necessary to reset any of the components of the Wire Bonding cell,or if the Emergency Stop is used, all components of the cell (including the M360CSECS/GEM Control Application) must be re-initialized. First, follow the procedureoutlined in section 3.2, “Shutdown”, then bring the system back up following theprocedure in section 3.1, “Startup”.

2 M360 SECS/GEM USER’S MANUAL SUPPLEMENT

3.4 Putting Devices into Local / Remote Mode

3.4 Putting Devices into Local / Remote Mode

The devices in a wire bonding cell are always in one of two modes: either local orremote. These modes determine whether wire bonding actions can be affected viaSECS/GEM activity. Local mode means that neither the M360C SECS/GEMControl Application nor the factory host can start or stop any activity at the wirebonder. In local mode, the only way to start or stop wire bonding is by pressingbuttons on the wire bonder itself. Remote mode lets the Control Application initiateor stop wire bonding activities.

Upon powerup, the devices always begin in local mode. Before the operator cancontrol the wire bonding cell from the Control Application, all devices in the wirebonding cell must be in remote mode.

To put a transport into remote mode, make sure the transport’s main menu isshowing. Then press the AUTO button on its interface panel. Finally, press thenumber two on the keypad to put the transport into remote mode.

NOTE: Remote mode is only displayed as an option on the transport if theControl Application has successfully initialized the transport.

To put a bonder in remote mode, make sure the bonder’s main menu is showing.Then select option C (SECS/GEM Control). Finally, press the START button to putthe wire bonder into remote mode.

You will notice that the magazine handler transitions to remote mode when theadjacent transport does. When the transport enters local mode, the magazine handleralso goes into local mode.


4.0 User Interface

This Section explains how to use the Control Application software. The applicationis divided into a few screen regions you can interact with (see Figure 1, on page 4).At the top-most area of the screen is a title bar. The title bar provides you with themeans to close the application. It also provides you with a system menu.

Below the title bar, you may note that the screen divides into two main regions. Theleft-hand side of the screen shows a set of controls which are always visible andthus readily available. This side of the screen gathers related controls into thefollowing outlined boxes: States, Terminal Services, Orthodyne EquipmentConstants, and Status.

Unlike the left-hand side of the screen, the right side is composed of four differentsets of controls, only one of which is visible at any given time. Each set is dedicatedto a specific activity. The tabbed activity groups are labeled as Remote Commands,Process Programs, GEM Equip Constants, and Material Movement. You mayaccess these controls by selecting the appropriate tab along the top-right side of thescreen.

Figure 1 M360C SECS/GEM Control Application User Interface Screen

4.0 User Interface


4.1 Title Bar

4.1 Title Bar

The title bar sits at the top of the SECS/GEM Control Application window. The titlebar has two controls, located on opposite ends of the bar. The control on the far leftside looks like a small picture next to the name of the program. This control bringsup the application’s system menu. The control on the far right side looks like an“X”. It closes the application.

The system menu contains the following options you can use:

Close Alt-F4

About Tool App…

Close Ports / Open Ports

Reset Leadframe Count

Change Password

The Close option closes the program. When you select this option, you will beprompted to provide a password. Type in the password provided by your applicationadministrator and then press ENTER. If the application administrator has notestablished a password, you can simply press ENTER.

About Tool App… brings up a small dialog box that describes version informationabout the software program.

Close Ports / Open Ports allows you to either close or open communication ports.Ports are automatically opened when you start the program, and they areautomatically closed when you close the program. You should not need this option.

Reset Leadframe Count resets the control application’s internal leadframe count.The application keeps track of the number of leadframes present on the transport atany given time. If you run the bonder without running the SECS/GEM ControlApplication, this number can get out of synch. Select this menu item if the bonderhas processed leadframes without the Control Application running. Make surethat when you select this menu item, no leadframes are present on the transport.There is also one other situation in which you should select this menu item. If youmanually remove a leadframe from the transport, then you must clear allleadframes from the transport and then select this menu item to reset theleadframe count.

Change Password allows you to change the shutdown password. It prompts you toprovide the old system password*, then asks you to provide a new password. Thenew shutdown password takes effect immediately.

On the far right side of the title bar, the X button allows you to close the program.Pressing this button has the same effect as choosing Close from the application’ssystem menu.

* If no password has been set up, when the application prompts you to provide the oldpassword, just hit the ENTER key. The default password is an empty string.


4.2 States

4.2 States

The States group box informs the operator of the current Communications, Control,Process and Spool states of the wire bonding cell, as defined and required by theGEM standards. Each of these states is displayed to the right of the correspondinglabel. Please refer to the M360C SECS/GEM Interface Specification document for afull description and meaning of each of these states.

As required by the GEM standard, the M360C SECS/GEM Control Applicationprovides means for the operator to switch Communication and Control States. Theoperator may switch the Communications State via the top combo box in the Statesgroup box. Depending on the current Communication State of the equipment, theoperator may choose to DISABLE or ENABLE communications.

NOTE: The factory host system cannot communicate with the Control Applica-tion / wire bonding system unless communications are ENABLED.

If the change in the Communications State is successful, the new CommunicationsState will be displayed.

Similarly, the operator may switch the Control State of the equipment via the bottomcombo box in the States group box. Depending on the current Control State of theequipment and also on the Control State of each device in the Wire Bonding cell,the operator may select to go OFFLINE, ONLINE LOCAL, or ONLINE REMOTE.The operator may select to go OFFLINE and ONLINE at anytime, and if such anattempt is successful, the new State will be displayed.

NOTE: The M360C SECS/GEM Control Application will only allow theONLINE REMOTE control state when all devices that form the WireBonding cell are also in Remote mode.

Additionally, the operator can change the Control State via activity at the wirebonder. If the Control Application shows the Control State as ONLINE LOCAL andthe operator puts all devices into remote mode, then the Control State willautomatically transition to ONLINE REMOTE.

Likewise, if the Control State is ONLINE REMOTE and the operator removes oneof the devices from remote mode, then the Control State will automaticallytransition to ONLINE LOCAL.

For trouble shooting purposes, if all devices seem to be in remote mode and theM360C SECS/GEM Control Application still cannot go to remote mode, place alldevices in local, and then switch them all back to remote again. This shouldsynchronize the M360C SECS/GEM Control Application control state.

The Spool and Process states reflect the state of the current communications link tothe Host computer and the processing stage of the Wire Bonding cell, respectively,and can not be changed directly.


4.3 Terminal Services

4.3 Terminal Services

The Terminal Services Group box provides means for the operator to send a textmessage to the Host, as well as for the Host to send a text message to the operator.The operator may in turn acknowledge such receipt. To send a message to the host,the operator enters a text message in the “Message to Host” box, then clicks on the“Send” button. The text message will be sent to the Host, provided that the currentCommunications, Control and Spool states allow (i.e., Communication State mustbe COMMUNICATING, Control State must be ONLINE, and Spool State must beINACTIVE).

Text messages received from the Host will be displayed in the “Message from Host”box. Once a text message is received, the “Acknowledge” button is enabled andremains so until the message is acknowledged. Messages that were notacknowledged by the operator will be overwritten by incoming messages, as definedby the GEM standard.

4.4 Orthodyne Equipment Constants

The region of the screen labeled Orthodyne Equipment Constants allows theoperator to modify those constants which are specific to Orthodyne’s M360Cproduct. To modify an equipment constant value, the operator first selects a constantfrom the drop-down combo box, then enters the desired value in the field labeledNew Value, and finally presses the Apply button. The equipment constant updatewill be sent to the appropriate device. The outcome of this operation will bedisplayed in the status group box. The possible outcomes are:

INVALID ECID OR VALUE

EC NOT UPDATED

EC UPDATE ACCEPTED BY DEVICE

EC UPDATE REJECTED BY DEVICE.

The equipment constant was only set successfully if the status box shows ECUPDATE ACCEPTED BY DEVICE; all other outcomes indicate a problem.

4.5 Status Indicators

The Status Indicators provide a way for the M360C SECS/GEM ControlApplication to give the operator feedback and keep them informed of the status ofcurrent operations. The status indicates the outcome of attempts to changeequipment constants, issue remote commands, or initiate process programmanagement operations. Errors that occurred during operations will be displayed inred color. The current status will blink during long operations, such as processprogram uploads and downloads.


4.6 Tabbed Activity Groups

4.6 Tabbed Activity Groups

The right-hand side of the Control Application behaves like a binder that gatherstogether groups of activities. Each page in the binder represents one distinct class offunctionality available to the operator. The Control Application provides these fouractivity groups:

Remote Commands

Process Programs

GEM Equipment Constants

Material Movement

Only one group of activities is shown at any given time. To switch from one activityto another, the operator chooses the appropriate tab from along the top-right side ofthe Control Application screen.

Each tab will change color depending upon the status of the tab. If a particularactivity group is not available, then the associated tab text is white. If an activitygroup has been selected and is currently displayed below the tabs, then the tab textis blue. If a tab is not selected but the mouse cursor is floating over the tab, ready toselect it, then the tab text is red.

As previously stated, each tab provides access to one group of related controls. TheRemote Commands group, for instance, allows the operator to control the wirebonding cell. The Process Programs group shows all resident process programs andallows the operator to upload and download process programs with the host system.The GEM Equipment Constants group allows the operator to change SECS/GEMcommunications parameters. And finally, the Material Movement group allows theoperator to oversee automated material transfers. Material Movement is an optionalupgrade. If you did not purchase the Material Movement feature, then this tab isdisplayed with white text; this tab is unavailable.

4.6.1 Remote CommandsThe Remote Commands activity page provides means for the operator to control theprocessing of the Wire Bonding cell. The operator may issue INITIALIZE, START,STOP, PAUSE, RESUME, ABORT, PROCESS-MAGAZINE, CLEAR-COUNTS,and RESET-TOOL-COUNTS commands by simply clicking in the correspondingbutton. These buttons as well as most of the other buttons in the User Interface willonly be enabled if such command is appropriate at the current process state of theWire Bonding cell.

NOTE: Remote Commands can only be issued if all devices in the wirebonding cell have been placed into REMOTE mode.

For both RESET-TOOL-COUNTS and CLEAR-COUNTS, the operator may choosewhich counter he/she wishes to reset by selecting the appropriate counter (one ofthe radio buttons in the count group box).


4.6.1 Remote Commands

Below is a brief description of these commands.

When a command is being sent to the equipment, the current Status indicator willshow:

“SENDING <string> COMMAND...”where <string> will be one of the following: START, STOP, PAUSE, RESUME,RESET-TOOL-COUNTS, CLEAR-COUNTS, ABORT or PROCESS-MAGAZINE.

Once the reply is received from the equipment, the current Status indicator willshow:

“<string> COMMAND <outcome>”where again <string> will be one of the above and <outcome> will be either“ACCEPTED” or “REJECTED”

START The START command instructs the wire bonder to initiate processing. Thiscommand is available only when process program(s) have been selected,material is available for processing, no alarms are present, the system is notbonding, and the system is not currently PAUSED.

STOP This command completes the current assembly and stops in a safe condition.If a STOP command is issued while the system is in a paused state, the systemwill no longer be considered paused, but neither shall it resume processing.

PAUSE This command puts the system into a paused state once the current assemblycompletes processing. At this point, the system stops processing material. Thesystem will remain paused until the operator resumes, stops, or abortsprocessing.

RESUME This command resumes processing from the point where the process wasPAUSED. This command is recognized only if the wire bonder is paused.

ABORT This command completes the current assembly and stops in a safe condition.If an ABORT command is issued while the system is in a paused state, thesystem will no longer be considered paused, but neither shall it resumeprocessing.

PROCESS-MAGAZINE This command instructs the wire bonder to initiate processing, but unlike theSTART command, this command only processes parts from the currentmagazine (or the next magazine if no magazine is currently loaded). Thiscommand is only available in some conditions. Please see the STARTcommand for those conditions

CLEAR-COUNTS This command resets selected Transport System counts. The operator maychoose which counter(s) to reset by selecting the appropriate button in theTransport System Counts box and then pressing the CLEAR-COUNTSbutton.

RESET-TOOL-COUNTS This command resets selected Wire Bonder counts. The operator may choosewhich counter(s) to reset by selecting the appropriate button in the WireBonder Counts group box and then pressing the RESET-TOOL-COUNTSbutton.


4.6.2 Process Programs

4.6.2 Process ProgramsThe Process Program activity page provides the operator with means to list, upload,download, delete, and select Process Programs. Each Wire Bonder has its ownseparate List Box and set of buttons for these capabilities.

Figure 2 shows the Control Application screen with the Process Programs pagedisplayed.

Figure 2 Control Application Screen with Process Programs Page

To list the Process Programs stored in the Wire Bonder, the operatorneeds only to click on the “LIST” button. The list of Process Programs inthe bonder will be uploaded and displayed in the list box.

NOTE: This step is not usually necessary since the bonder will update the listboxes after initialization or whenever a process program is “added /deleted” at the bonder.


4.6.2 Process Programs

To upload a process program to the Host, the operator selects a processprogram from the list box and click the “UP” button. The processprogram will be uploaded from the Bonder and sent to the Host.

To Download a process program from the host, the operator clicks on the“DOWN” button. A dialog will pop up, requesting the operator to enter theProcess Program to download from the Host. The operator enters theProcess Program ID and clicks OK. At this point, the system downloadsthe specified process program from the host and sends it to the appropriateWire Bonder. Note that all Process Program IDs must have a descriptorthat identifies to which Wire Bonder the process program belongs. ProcessProgram IDs that end in “.bd1” belongs to Wire Bonder 1, whereas ProcessProgram IDs that end in “.bd2” belong to Wire Bonder 2.

A Process Program may be deleted by first selecting it in the appropriateProcess Program List box, then clicking the “DEL” button.

The operator may select a new process program to be active on a WireBonder by selecting the Process Program ID from the list box and click-ing the “SEL” button. Once the process program is selected, the operatormay issue a START command to start processing the selected program.

Similar to the buttons in the Remote Commands page, the process programmanagement buttons will be disabled during certain process states, more specificallyduring bonding. The Wire Bonders shall not be interrupted while bonding, thereforenone of these capabilities will be available to the operator or the host.

Outcomes of process program management operations will be displayed in thestatus group box. Below is a description of the messages that will be displayed.

On an Operator Initiated Upload:

UPLOADING PROCESS PROGRAM FROM BONDER...PROCESS PROGRAM UPLOADED FROM BONDERUPLOADING PROCESS PROGRAM TO HOST...PROCESS PROGRAM SUCCESSFULLY UPLOADED

On a Host Initiated Upload:

HOST REQUESTED PROCESS PROGRAM UPLOADUPLOADING PROCESS PROGRAM FROM BONDER...PROCESS PROGRAM UPLOADED FROM BONDERUPLOADING PROCESS PROGRAM TO HOST...PROCESS PROGRAM SUCCESSFULLY UPLOADED

In the event of rejection of the Upload by the Bonder or the Host, one of the twofollowing messages will appear:

PROCESS PROGRAM UPLOAD REJECTED BY BONDERPROCESS PROGRAM NOT UPLOADED TO HOST

On an Operator Initiated Download:

DOWNLOADING PROCESS PROGRAM FROM HOSTPROCESS PROGRAM DOWNLOADED FROM HOSTDOWNLOADING PROCESS PROGRAM TO BONDER...PROCESS PROGRAM DOWNLOADED SUCCESFULLY


4.6.3 GEM Equipment Constants

On a Host Initiated Download:

PROCESS PROGRAM DOWNLOADED FROM HOSTDOWNLOADING PROCESS PROGRAM TO BONDER...PROCESS PROGRAM DOWNLOADED SUCCESFULLY

In the event of rejection of the Download by the Bonder or the Host, one of thefollowing 2 messages will appear:

PROCESS PROGRAM DOWNLOAD REJECTED BY BONDERPROCESS PROGRAM CAN NOT BE DOWNLOADED

WARNING: The User must not switch the Communications State to “DIS-ABLED” or the Control State to “OFFLINE” while a process pro-gram management operation is in progress, otherwise the processprogram operation will be aborted prior to its completion.

4.6.3 GEM Equipment ConstantsThe GEM Equip Constants activity page (Figure 3) allows the operator to tailorcommunications-related settings. To modify equipment constant values, the operatoralters the values and then presses the Apply button. The equipment constant updatewill take effect immediately. If the user wishes to abort changes that have not yetbeen applied, the user should press the Cancel button. Changes that have alreadybeen applied via the Apply button cannot be cancelled.

As an example, if the user wants the initial control state to be Offline, then the usershould select the Offline radio button under the Initial Control State group box. Atthis point, the change has not yet taken effect. The user must press the Apply buttonfor the change to occur. Alternatively, if the user wishes to abort the change, thenthe user should press the Cancel button.


4.6.4 Material Movement

Figure 3 Control Application Screen with GEM Equipment Constants Page

4.6.4 Material MovementThe Material Movement activity page allows the operator to oversee automatedmaterial transfers and material tracking. The Material Movement page is organizedinto two groups of controls: those for the preprocess (first) magazine handler andthose for the postprocess (second) magazine handler. The upper controls in eachgroup show which magazines have been transferred to the M360C system viaSECS/GEM material transfers. These are material tracking controls. The bottomcouple of controls on each side are used when setting up Barcode Readers.

The following graphic (Figure 4) shows the Control Application screen when theMaterial Movement tab is selected.



Figure 4 Control Application Screen with Material Movement Page

The material transfer controls are labeled INPUT, Process, Load, and OUTPUT. TheINPUT control shows which magazines have been transferred to the input buffer.The Process / Load controls identify the magazine currently being processed.Finally, the OUTPUT control shows magazines that have completed processing andare awaiting transfer.

If more than one magazine is in the input buffer, then the operator can use the scrollbar beneath the INPUT control to view all other magazines at the input buffer. Thesame is true for the output buffer; the operator can use the scroll bar to view allother magazines waiting in the output buffer. By default, the INPUT control showsthe next magazine to be processed. By default, the OUTPUT control shows the nextmagazine to be transferred out of the M360C system via SECS/GEM.



The PreProcess and PostProcess group boxes show arrows leading from the INPUTto the Process / Load position, and finally to the OUTPUT position. These arrowsshow the order of magazines moving through the system. For the PreProcess side,when the M360C first receives a magazine, it enters tracking on the left-most side ofthe INPUT control.

To view this magazine ID, move the scroll bar thumb under the INPUT control untilit is all the way to the left. As the scroll bar thumb moves to the right, the INPUTcontrol shows magazines that are closer to the magazine handler elevator, and thuscloser to being processed.

The magazine at the far right of the INPUT control is the next magazine to beprocessed. The Process control shows the magazine that is currently beingprocessed. Looking at the OUTPUT control, the magazine to the far right is the onethat has most recently been processed. The magazine at the far left of the control isthe next one that will be transferred out of the M360C preprocess output buffer.

Again, this description applies to the PreProcess side. For the PostProcess side, thearrows travel in the opposite direction, thus when the Postprocess input bufferreceives a new magazine, it appears at the far right of the INPUT control.

The barcode reader controls only need to be used during installation of theequipment. These buttons help the technician determine when the magazine handlerand barcode reader have been positioned correctly to provide repetitive, successfulbarcode reads.

During installation, press the Calibrate Barcode Reader for the appropriatemagazine handler. Calibration is successful if the correct barcode value appears inthe adjacent box. Once the calibration completes successfully, press the ReadMagazine button. If both of these return a good barcode match, then barcodereading is setup properly.

Together, the material tracking and barcode read buttons comprise the materialmovement controls available for the M360C SECS/GEM Control Application.


A P P E N D I X 1

M360C Set Up

1.1 Hardware Setup

The hardware setup for the SECS/GEM kit involves two parts, setup of thecomputer and cabling the computer to the M360C hardware.

The computer setup for SECS/GEM involves 4 components: computer tower,monitor, keyboard and mouse. Setup the computer within 2 feet of the M360Chardware. Setup involves plugging in the connectors for the keyboard, mouse, andmonitor. Power for the computer can be 115 or 230 Volts. Make sure to verify thatany power select switches are properly set before plugging in power.

To connect the serial expansion box to the computer, connect one end of the Serialexpansion cable to the 44 pin connector on the back on the computer. Connect theother end of the cable to the serial expansion box IN connector.

The last portion of the setup involves the connection of the serial cables. Shownbelow are the configurations for each of the potential setups that you could have.

Table 1: Standard M360C-HD Cable Configuration

Table 2: M360C-HD Cable Configuration for Autoline

CableNumber

From To

172669 Input Magazine CPU Board J1 Serial Expansion BoxConnector 1

172669 Input Transport CPU Board J1 Serial Expansion BoxConnector 2

172669 Output Transport CPU BoardJ1

Serial Expansion BoxConnector 3

172669 Output Magazine CPU BoardJ1


708226 Input Bonder RS232Connector


708226 Output Bonder RS232Connector


CableNumber

From To

178669 Input Bar Code Reader(already installed)


178669 Output Bar Code Reader(already installed)


M360 SECS/GEM USER’S MANUAL SUPPLEMENT Appendix - 1

Table 3: M360C-H Cable Configuration

Table 4: M360C-HD without Magazine Handler Cable Configuration

Table 5: M360C-H without Magazine Cable Configuration











CableNumber

From To


172669 Transport CPU Board J1 Serial Expansion BoxConnector 2



708226 Bonder RS232 Connector Serial Expansion BoxConnector 4

CableNumber

From To








CableNumber

From To

172669 Transport CPU Board J1 Serial Expansion BoxConnector 1

708226 Bonder RS232 Connector Serial Expansion BoxConnector 2

Appendix - 2 M360 SECS/GEM USER’S MANUAL SUPPLEMENT

Table 6: M360C-H with 4 Headed Machine Config. for AUTOLINE

1.2 Software Setup

Verify that the software version for the M360C Bonder is 5.8 or later. Also verifythat M360C handler software is 4.1 or later for standard handlers, or 5.0 or later forrear-loading handlers. If you do not meet one of these requirements, please contactOrthodyne to get the latest version.

The SECS/GEM SDR software (Part number 172579) needs to be installed on thebonder for the SECS/GEM software to run. Exit the bonder program (Type ! inbonder main menu). Insert the SDR installation disk into data drive and type /d1/install_sdr. Reset the bonder to complete the SDR installation.

CableNumber

From To

178669 Bar Code Reader 1 (Input) Serial Expansion BoxConnector 1

178669 Bar Code Reader 2 (Output) Serial Expansion BoxConnector 2

172669 Magazine Handler 1 (Input) Serial Expansion BoxConnector 3

172669 Magazine Handler 2 (Output) Serial Expansion BoxConnector 4

172669 Transport System 1 (1st left to right) Serial Expansion BoxConnector 5

172669 Transport System 2 (2nd left to right) Serial Expansion BoxConnector 6

172669 Transport System 3 (3rd left to right) Serial Expansion BoxConnector 7

172669 Transport System 4 (4th left to right) Serial Expansion BoxConnector 8

708226 Wire Bonder 1 (1st left to right) Serial Expansion BoxConnector 9

708226 Wire Bonder 2 (2nd left to right) Serial Expansion BoxConnector 10

708226 Wire Bonder 3 (3rd left to right) Serial Expansion BoxConnector 11

708226 Wire Bonder 4 (4th left to right) Serial Expansion BoxConnector 12


A P P E N D I X 2

PC Set Up

2.1 Introduction

2.1.1 General ProcedureThe installation of the M360C Tool Control Application software consists of 3 basicsteps: installation and configuration of the 8-port serial digi board, installation of theGW Associates GWGEM product, installation and configuration of the M360CSECS/GEM Control Application software. One should first install and configure the8-port serial board, then the Control Application software. The sections that followcontain instructions for the installation of each one of these components.

2.2 Installation and Configuration of the 8-port/16-portSerial Board

This section will have already been completed as the Digi PCI board should beinstalled and the Digi software driver also installed. This can be verified by going tothe Start, Settings, Control Panel, Ports panel. If ports COM3 through COM10 arealready there then the Digi board has been installed. If those ports are not there, thensections 2.2.1 and 2.2.2 need to be completed.

2.2.1 Hardware InstallationTo install the 8-port serial board, you will need an empty PCI slot on the computer’smotherboard.

1. Shutdown the computer.

2. Unplug power from the PC.

3. Remove the computer cover.

4. Locate the available PCI slot and insert the 8-port/16-port adapter board intothe computer chassis.

5. Replace the computer cover.

6. Attach one end of the cable to the connector on the back of the adapter and theother end to the In connector of the PORTS/8em/16em module.

7. Power the computer on.


2.2.2 Board ConfigurationFollow the steps below to configure the 8-port/16-port serial board:

1. Put Access Resource AccelePort Products CD in CD-ROM drive.

2. If the Digi International CD Viewer window appears on your screen, go to step 3.If the window did not appear, click on the My Computer icon and then click onthe CD-ROM icon to start Digi International CD Viewer software.

3. Choose Install Software option.

4. Choose Windows NT 4.0 device driver option from list.

5. Follow steps 1 through 4 in the Digi AccelePort Device Driver Installationwindow.

6. Select the Digi AccelePort Xem (PCI) Adapter option in the Select OEMOption window and click OK.

7. In the Adapter Config Wizard window, select Ports/8em Module from the listbox.

8. Click on Add button.

9. Click on Next> button.

10. When prompted to change starting port name, set/verify it is COM3 and clickFinish.

11. Click OK in Adapter Setup window.

12. Click Close in Network box.

13. Restart the computer.

2.3 Installation of the SECS/GEM Control Application

2.3.1 General Procedure

1. Insert installation disk #1, click on Start, Run, and type a:\setup on the RunProgram box. (Where a: is the floppy drive from which the software is beinginstalled.) It’s recommended that you accept all the default values, unlessotherwise noted in this installation guide. Thus, we suggest that you install in to thedefault location, C:\Program Files\Orthodyne Electronics\M360CToolApp. If thisfolder does not exist, setup will ask and create it for you.

2. Setup will start copying files to your computer. At some point, the installationwill request disk 2. Please insert the disk requested by the installation software.

3. After setup has copied files and updated the registry, it will ask you to configureSDR. This will determine the method by which the equipment will communi-cate with the host, either via serial cable or network. If the connection is via


serial cable, then choose the option SDR 140 (Serial) and select the COM port towhich the cable will be attached on the SECS/GEM Control Application com-puter. If the connection with the host uses a network, then choose the optionlabeled SDR 170 (HSMS).

4. Setup will then ask you to configure the M360C Control Application. In thegroup box labeled Tool App Configuration, select the equipment type (M360CH,M360CHD, etc.).

The next control down determines whether the Host Resume option is turned on oroff. If Host Resume is selected, then the application must wait for an explicitcommand from the host in order to resume interrupted processing upon re-enteringremote mode. If Host Resume is not selected, then the equipment can automaticallyresume previously-interrupted processing upon transition from local to remote state.For the typical (non-Autoline) installation, Host Resume is off. If this installation isfor an Autoline machine, then Host Resume must be selected.

The setup dialog’s bottom-most group box asks you to select a process state model.Select either Detailed or Simplified. These process state models are described inOrthodyne Electronic’s SECS/GEM Interface Specification document. If thisinstallation is for an Autoline machine, then the Simplified model must be selected.

Finally, select COM ports for each device. We recommend the following COMports be used:

For the Standard M360C-HD Configuration:

For the Autoline M360C-HD Configuration:

Device COM Port

Magazine Handler 1 COM3


Transport System 1 COM4


Wire Bonder 1 COM7

Wire Bonder 2 COM8

Bar Code Reader 1 (Not Used)


Device COM Port





Wire Bonder 1 COM9

Wire Bonder 2 COM10


For the M360C-H Configuration:

For the M360C-HD without Magazine Handlers Configuration:

For the M360C-H without Magazine Handlers Configuration:

Bar Code Reader 1 COM3

Bar Code Reader 2 COM4

Device COM Port




Transport System 2 (Not Used)

Wire Bonder 1 COM6

Wire Bonder 2 (Not Used)



Device COM Port

Magazine Handler 1 (Not Used)




Wire Bonder 1 COM5

Wire Bonder 2 COM6



Device COM Port




Transport System 2 (Not Used)

Wire Bonder 1 COM4

Wire Bonder 2 (Not Used)




Press OK when all desired options have been selected in this setup dialog.

For the M360C-H with 4 Headed Machine Configuration for AUTOLINE:

Press OK when all desired options have been selected in this setup dialog.

5. Click on the Finish button for any subsequent dialogs. The SECS/GEM ControlApplication is now installed.

2.3.2 Configuring GWGEM

1. If using a serial cable connection to host, open the file gem140.cfg. If using anetwork (HSMS) connection to host, open gem170.cfg instead. These files arelocated in the directory where you installed the SECS/GEM ControlApplication. (The default location will be C:\Program Files\OrthodyneElectronics\M360CToolApp).

2. Configure timeout values to meet your system requirements.

Device COM PortBar Code Reader 1 (Input) COM3Bar Code Reader 2 (Output) COM4Magazine Handler 1 (Input) COM5Magazine Handler 2 (Output) COM10Transport System 1 (1st left to right) COM6Transport System 2 (2nd left to right) COM7Transport System 3 (3rd left to right) COM8Transport System 4 (4th left to right) COM9Wire Bonder 1 (1st left to right) COM11Wire Bonder 2 (2nd left to right) COM12Wire Bonder 3 (3rd left to right) COM13Wire Bonder 4 (4th left to right) COM14


A P P E N D I X 3

Changing Configuration After Installation

3.1 Introduction

This section explains how to change the configuration of the SECS/GEM ControlApplication after installation. Configuration data is stored in a file calledM360C.cfg , located in the installed directory of the SECS/GEM ControlApplication1. By changing the contents of this file, you can adjust the followingelements of the SECS/GEM system:

devices and assigned COM ports

host resume option

processing state model

Any changes you make will take effect the next time you start the SECS/GEMControl Application. The following sections describe this configuration file in moredetail.

3.2 Configuring Device COM Ports

When you open the M360C.cfg file, you will see that the first several lines associatedevices in the wire bonding cell with their respective COM ports. There are twopossible reasons you may want to edit this section. If you chose the incorrectequipment configuration (M360C-HD, M360C-H, etc.) during installation, youshould edit this file to reflect the devices present in your system. You should alsoedit this file if you need to change the COM port settings for the devices in the wirebonding cell.

The format for this section of the configuration file is:

<device> PORT COM<x>

where <device> could be MAGAZINE, TRANSPORT, WIREB-ONDER or BARCODEREADER, and<x> is the number of the desired COM port.

For example, this section of your configuration file may have:

MAGAZINE PORT COM5

MAGAZINE PORT COM8

TRANSPORT PORT COM6

1. The default installation directory for the SECS/GEM Control Application is C:\Program Files\OrthodyneElectronics\M360CToolApp.


TRANSPORT PORT COM7

WIREBONDER PORT COM9

WIREBONDER PORT COM10

BARCODEREADER PORT COM3

BARCODEREADER PORT COM4

You may edit this section to change the COM port associated with a device. If youchange the COM port associated with a device, please ensure that device is cabledto the appropriate port of the port expansion box.

Note that the COM port settings are related to the cable configuration at the portexpansion box. The COM port settings for each device in the configuration file mustmatch the associated connectors in the serial expansion box.

Thus if the configuration file shows a TRANSPORT configured at COM5, thattransport must be connected to the serial expansion box through connector #3.

3.3 Configuring The Host Resume Option

The Host Resume option dictates the equipment’s behavior when switching fromlocal mode to remote mode. This option is only examined under the condition where(1) the equipment was running in remote mode and processing material, (2)processing was interrupted and the equipment went to local mode (due to an alarmor the operator pressing the STOP button), and then (3) the operator put theequipment back into remote mode.

At this point, if the Host Resume option is turned off, then the equipmentautomatically resumes processing on its own. In this case, the equipment startsprocessing without instruction from the host.

If instead the Host Resume option is turned on, then the equipment does notautomatically resume processing. The equipment transitions to remote mode butremains idle / ready.

If you have the Host Resume option turned off, this ensures that the equipment

COM Port Serial Expansion BoxConnector

COM3 Connector #1

COM4 Connector #2

COM5 Connector #3

COM6 Connector #4

COM7 Connector #5

COM8 Connector #6

COM9 Connector #7

COM10 Connector #8


resumes processing as soon as it is able. This could have a positive impact onthroughput. Alternatively, if you have the Host Resume option turned on, the hostsystem has greater control over the equipment. Given an efficient host, throughputmay not be affected or may only marginally be affected.

If you do not see the term HOST_RESUME in the configuration file, then this optionis turned off. If it is turned on, the term HOST_RESUME will appear on a line byitself.

If you do not have the HOST_RESUME option in your configuration file and wouldlike to add it, add the following line to your configuration file:

HOST_RESUME

This term should start at the beginning of the line.

3.4 Configuring the Processing State Model

Orthodyne Electronics provides two possible processing state models. Theequipment can use either the simplified model or the detailed model, documented inthe SECS/GEM Interface Specification document.

To use the simplified processing state model, your configuration file should havethe following line:

SIMPLIFIED_PROCESS_STATE

This term should start at the beginning of the line. To use the detailed processingstate model, omit the above line. If this term does not exist in the configuration file,you are using the detailed processing state model.

Table 7:

Device Hardware Expansion BoxSoftware

Serial COMPort

Bar Code Reader 1 (Input) Serial Expansion Box Connector 1 Com 3

Bar Code Reader 2 (Out-put)

Serial Expansion Box Connector 2 Com 4

Magazine Handler 1(Input) Serial Expansion Box Connector 3 Com 5

Magazine Handler 2 (Out-put)


Transport system 1(1st leftto right)



Transport system 2 (2ndleft to right)


Transport system 3 (3rd leftto right)


Transport system 4 (4th leftto right)


Wire Bonder 1(1st left toright)


Wire Bonder 2 (2nd left toright)


Wire Bonder 3 (3rd left toright)

Serial Expansion Box Connector10

Com 12

Wire Bonder 4 (4th left toright)

Serial Expansion Box Connector11

Com 13

Table 7:

Device Hardware Expansion BoxSoftware

Serial COMPort


USER'S SUPPLEMENT

REEL-TO-REEL SUPPLEMENT

Document Part No. DC04-176000C

ISSUE DATE: October, 2000




Telephone (949) 660-0440

FAX (949)-660-0444





F O R W A R D



10/03/00 Orig Initial publication. Model No. 176000-11/13

-2 Reel-to-Reel Supplement

C H A P T E R 1

REEL-TO-REEL SUPPLEMENT

This manual describes the configuration and operation of the Reel-to-Reel wire bonder machines which were built for InfineonMelaka. These machines incorporate OE supplied input and outputtransport tracks that operate in conjunction with the Orthodyne-supplied Disconnect unit. A machine set consists of two M360C(with ALC heads) or S wire bonders connected by the Disconnectunit as shown in Figure 1-1.

Figure 1-1 Reel-to-Reel Machine Configuration

Introduction

Output Track fromLeft Machine

Input Track fromRight Machine

Path of Leadframe

Disconnect Unit

Reel-to-Reel Supplement 1-1

Clamp Station Configuration REEL-TO-REEL SUPPLEMENT

The Transport Track and Clamp Station configuration of the Reel-to-Reel machine consists of a Wide Matrix transport track systemthat includes:

Mis-Index Sensor

Index Pawl

DIP Clamp Station

Interposer

Part Sensor/Pusher

These devices are illustrated in Figure 1-2, and are described in thesections that follow.

Figure 1-2 Clamp Station Configuration

This transport station is specifically designed for the Infineon 4-row, matrix, reel-to-reel, D-PAK leadframe. Notice the two sets ofclamp fingers in the clamp station.

Clamp Station Configuration

Part Sensor/Pusher

DIP Anvil

Interposer

Mis-IndexSensor

Index Pawl

Wide Matrix Track

1-2 Reel-to-Reel Supplement

REEL-TO-REEL SUPPLEMENT Clamp Station Configuration Mis-Index Sensor

The purpose of the Mis-Index sensor is to monitor the position ofthe leadframe relative to the bonding station. If the leadframe is notin the proper position, a signal from the sensor will stop the clampstation from clamping, thus preventing possible damage to theleadframe.

A close-up view of the Mis-Index sensor is shown in Figure 1-3.

Figure 1-3 Mis-Index Sensor

In this application, the position of the Mis-Index Position Sensor isfor the Infineon Reel-to-Reel setup. Refer to the tooling drawings173022-03 and 173022-4 that correspond to the product forinstructions on setting the location of the sensor.

Mis-Index Sensor

Setting Up The Mis-Index Sensor

Mis-Index Sensor

Sensor Adjustment Screws


REEL-TO-REEL SUPPLEMENT Clamp Station Configuration Setting Up The Mis-Index Sensor

If the sensors require adjustment:

1. Locate the 2 cap screws that secure the sensor in position (refer toFigure 1-4).

Figure 1-4 Adjusting The Location Of The Mis-Index Sensor

2. Refer to the tooling drawing that corresponds to your product anddetermine the direction (X or Y) that the sensor(s) needs to be moved.The height of the sensor(s) must also be set to the value specified on theappropriate tooling drawing (see drawing # 176002). In addition, therotational position of the sensor must be set.

3. With a leadframe strip clamped in the Clamp Station, go to theMANUAL POSITION screen and use the spinners to move thecrosshairs to the position specified on the appropriate tooling drawing.

4. Exit the MANUAL POSITION screen. This will disable the spinners sothe set position will not be lost.

5. Unclamp the leadframe strip and remove it from the Clamp Station.

6. Loosen the appropriate Position Sensor screw(s), adjust the Sensor tothe center of the crosshairs on the monitor (use Figure 1-5 as areference), and retighten the screw(s).

Figure 1-5 Aligning Sensor to Crosshair

X

YY


REEL-TO-REEL SUPPLEMENT Clamp Station Configuration Adjusting The Mis-Index Sensor

)

The Mis-Index Sensors use digital amplifiers to adjust thesensitivity level of the sensor to the reflected light from the LED.Orthodyne may use one of two styles of Mis-Index Sensoramplifiers, depending on the customer application. The adjustmentprocedure for each type is described below:

Amplifier Type P/N 708506Figure 1-6 shows a drawing of the Amplifier, with call outs toidentify the important features of the device.

Figure 1-6 P/N 708506 Sensor Amplifier

Part DescriptionTo adjust the sensitivity of the Sensor, you will be using theOperation Indicator light, the Sensitivity Level Indicator, and theSensitivity Adjuster (potentiometer).

Sensitivity Adjustment

1. Verify the sensitivity by observing the correct condition of theOperation Indicator (Orange). The function of the Operation Indicatordepends upon the combination of the sensing condition and the selectedMODE as shown in the following table.

Adjusting The Mis-Index Sensor Amplifiers

(Usually set to “Non”


REEL-TO-REEL SUPPLEMENT Clamp Station Configuration Sensitivity Adjustment

2. The Sensitivity Adjuster is a 12-turn potentiometer. The maximumsensitivity is obtained by turning it fully clockwise.

3. The Sensitivity Level Indicator (see Figure 1-7) shows the presentsensitivity level.

Figure 1-7 Sensitivity Indicator Showing Present Value

The sensing method used in the Mis-Index Position Sensor isReflective, that is, if the leadframe is in the wrong position, thelight will be reflected back to the sensor. If the leadframe is in thecorrect position, the light will pass through and the beam will notbe received by the sensor. These conditions are illustrated in thefollowing table.

SensorCondition MODE Operation

Indicator

LightL-ON (Light - ON)

D-ON (Dark - ON)

DarkL-ON (Light - ON)

D-ON (Dark - ON)

MAX


REEL-TO-REEL SUPPLEMENT Clamp Station Configuration Sensitivity Adjustment

Amplifier Type P/N 708512Amplifier type P/N 708512 presents the sensitivity level indicationusing LED digital readout. The amplifier unit can be used with asingle sensor unit, or grouped together with several sensor units.

1. Set the sensitivity of the amplifier so that the number reads 1500 on thedigital display (see Figure 1-8, on page 1-8). This is a mid-point value.

Step Sensing Method Operation Sensitivity LevelIndicator

Reflective

1 Set the operationselection switch to theLight-ON mode (initialsetting)

Turn the sensitivity adjuster fullcounterclockwise (Minimum sen-sitivity)

2

Beam received

In the beam received condition,slowly turn the adjuster clockwiseand find the point A where thesensor is switched ON. Observethe Orange light on the OperationIndicator.

3

No beam received

In the no-beam condition, turn theadjuster further clockwise untilthe sensor goes into the ON stateagain. Once it is switched ON,turn the adjuster counterclock-wise a little and find the point Bwhere it is switched OFF.If the sensor does not go into theON state, MAX is point B.

4 Set the adjuster at the center onpoints A and B. This is regardedas the optimum sensitivity point.

Optimum Point

A ON

MAX

BOFF

ONMAX

B

A MAX

MAX


REEL-TO-REEL SUPPLEMENT Clamp Station Configuration Interference Prevention Function

Figure 1-8 Setting The Sensitivity

2. Place a leadframe in the clamping station and adjust its position so thatmost of the light from the sensor will shine between the heatsinks on theleadframe.

3. Set the MODE switch on the amplifier to the desired mode of operation;either LIGHT ON or DARK ON.

4. Adjust the amplifier sensitivity so that the LED reads a large numberwhen the sensor is ON and a small number when it is OFF.

Interference Prevention FunctionThe Sensor Amplifier is equipped with an interference preventionfunction, so that up to three fiber optic sensors can be mountedclose to each other by setting different emission frequencies.Response time varies with the emission frequency as given in thefollowing table.

EmissionFrequency

ResponseTime

FR1 0.5ms or less

FR2 0.65ms or less

FR3 0.75ms or less

The sensitivity number is shown in the Digital LEDmonitor display on the amplifier.

To set the sensitivity number, press the Manual (toggle)button in either the (+) or (-) direction to increase ordecrease the number shown on the LED display.


REEL-TO-REEL SUPPLEMENT Clamp Station Configuration Mis-Index Error Condition

If the leadframe strip is not indexed into or out of the ClampStation properly, the Position Sensors will detect the Mis-Indexedstrip and will not allow the clamps to close. The following errormessage will appear in the Transport Station display window:

To recover from the above error:

1. “Press Any Key” as stated in the message.

2. Press #2 (“Index Home”) on the handler key pad.

3. Determine why the strip did not index properly and correct its position.

The handler can now be put back into the Auto Run or Remotemode (whichever mode you were using).

Mis-Index Error Condition

-: Transport Station Error:-

Strip not in position

Press Any Key


Mis-Index Error Condition Index Pawl REEL-TO-REEL SUPPLEMENT

The operation and programming of the Transport is described in theModel 360C-HD User’s Manual (Document Part Number DC01-173000A), Chapter 3. This chapter describes the various screens thatappear on the front of the Transport Hardware. Some additionalscreens appear only on the Reel-to-Reel machine. These screenscontrol functions and programming that only apply to the Infineonmachine.

The leadframe is indexed over to the clamp station by a mechanicalpawl that engages a hole in the leadframe strip. (See Figure 1-9).

Figure 1-9 Index Pawl and Interposer Control “X” Position Of The Leadframe

The index pitch of the pawl can be adjusted using the Transportsoftware. From the MAIN MENU on the Transport Unit, press [7] [4][1] to bring up the INDEXER PARAMETER SCREEN (see Figure1-10, on page 1-11).

Index Pawl

Index Pawl Rides In A Slot In Front OfThe Hold-Down Roller

Interposer Blade

Part Sensor/PusherWheel


REEL-TO-REEL SUPPLEMENT Index Pawl Adjustment Of The Index Pitch

Figure 1-10 Indexer Pitch Parameter Screen

The Index Pawl and the Interposer work together to make theleadframe stop in the correct position at the DIP clamp station forbonding. The indexer advances the leadframe and the interposerstops it.

The adjustment of these two devices is critical because you do notwant the Index Pawl trying to push the leadframe forward whilethe Interposer is trying to stop it at the same time. The indexer hasto disengage from the leadframe just before the interposer engages.

Adjustment Of The Index Pitch

1. The index pitch is controlled by entering a number into a control fieldon the Transport Display. The larger the number, the farther theleadframe will travel during indexing.

NOTE: Before adjusting the index pitch, manually feed the leadframe onthe Transport Rail so that it engages all four sets of Hold DownRollers. (See Figure 1-11, on page 1-12). This will prevent theleadframe from moving backwards after indexing, which wouldspoil the accuracy of the adjustment.

INDEXER PARAMETER EDIT

Indexer pitch 150Number of devices/strip 20

F1: Save F2: Up F3: Down F4: Abort


Adjustment Of The Index Pitch Index Pawl REEL-TO-REEL SUPPLEMENT

Figure 1-11 Pinch Wheels Hold Down Leadframe

2. Position the leadframe in the Clamp Station to the correct locationaccording to the tooling drawing, and clamp the leadframe.

3. Operate the indexer several times to make sure that the leadframemoves to the correct position.

4. If the indexed position of the leadframe comes up short of the idealposition, type in a larger number in the Indexer Pitch field. Use thefollowing path to get to the Indexer Pitch field:

5. If the indexed position of the leadframe is too long, type in a smallernumber into the Indexer Pitch Field.

Hold Down RollerSets

Direction Of Travel OfLeadframe

Setup Menu Index Setup Edit Indexer Pitch (type in the number)


REEL-TO-REEL SUPPLEMENT Interposer Along-Track Position Adjustment

The Interposer is a mechanical stop that works in conjunction withthe index pawl to assure the leadframe stops at a precise andrepeatable position at the clamp station. (See Figure 1-9, on page1-10). The timing of the vertical movement of the Interposer iscontrolled by software as a percentage of the time it takes tocomplete one index pitch cycle. The horizontal position of theInterposer is a mechanical adjustment.

Along-Track Position Adjustment

1. Unclamp the leadframe.

2. Using the microscope to observe the leadframe’s position relative to theanvil, move the leadframe to the ideal clamping position.

3. Clamp the leadframe.

4. Loosen the screws holding the Interposer and slide it back and forthalong the transport track until the Interposer blade surface almosttouches the right edge of the heatsink (or another suitable edge). (SeeFigure 1-12). Use the microscope to get a clear view of this adjustment.

Figure 1-12 Adjusting The Interposer Stop Position

5. Tighten the Interposer Adjustment screws.

Interposer

Interposer AdjustmentScrews

Direction OfAdjustment Motion

Interposer Blade


Adjustment Of The Interposer Timing DIP Clamp Station REEL-TO-REEL SUPPLEMENT

Adjustment Of The Interposer Timing

The Interposer normally sits below the surface of the TransportRail. It raises up into the locating hole during a portion of the indexcycle to stop the forward motion of leadframe. The clamp engagesthe leadframe to hold it firmly in place during the bonding cycleand the Interposer retracts before the start of the next index cycle.

1. Use the following path to get to the Interposer Timing Adjust field:

2. Set the nominal value for Interposer Delay to be 60% of the index cycletime. Adjust as necessary so that the Interposer blade comes up into theindex hole during the later portion of the index cycle.

3. Use the “Toggle solenoid” field from the SETUP Menu to move theInterposer blade up and down.

The DIP Clamp Station is described in the Option Section of theModel 360C-H/HD User’s Manual.

The transport track consists of a pair of rail guides that confine theleadframe as it is indexed across the machine. Precise adjustmentof the position of the leadframe in the “Y” direction is determinedby the position of the bearing between the two top rails. A spring-loaded roller at the clamp station (see Figure 1-9, on page 1-10)pushes the leadframe against the bearing between the fixed high-side rail, assuring precise alignment.

The roller serves a dual function. Not only does it push theleadframe against the high side guide bearing, but it also senseswhether a leadframe strip is present. The signal provided by the

DIP Clamp Station

Part Sensor/Pusher

Setup Menu Hardware Setup F3 (toggle down) Interposer Delay (% of Index)- (type in value)


Adjusting Loop Sensors Disconnect Unit REEL-TO-REEL SUPPLEMENT

part sensor verifies that a part is in the clamp station. Thiscomponent is adjusted at the factory and does not require furtherad ju s t men t .

Disconnect Unit

The Disconnect unit serves as a buffer between a pair of bonders tocompensate for any difference in the leadframe feed rate betweenthe two. The interior of the Disconnect Unit is shown in Figure 1-13.

Figure 1-13 Disconnect Unit Sensors

Adjusting Loop Sensors

1. Feed the leadframe strip between the rollers on the output bracket forMachine #1 (Machine #1 is the left machine of the pair) and form a“U”-shape in the Disconnect unit as shown in Figure 1-13 above.

2. Feed the leadframe strip through the Staple Sensor and pass it throughthe rollers on the input bracket for Machine #2. Continue to feed theleadframe strip onto Machine #2 until it is past the Hold-down rollerand Index Pawl on the Transport Rail.

Staple Sensor

Hard Stop Sensor(#2 Amplifier)

Leadframe Sensor (#2Amplifier)

Hard Stop Sensor (#1Amplifier)

Leadframe Sensor (#1Amplifier)

Damper

Leadframe Strip


Adjusting Loop Sensors Disconnect Unit REEL-TO-REEL SUPPLEMENT

3. Adjust the loop in the Disconnect Unit until the leadframe isapproximately midway between the two Leadframe Sensors for Bonder#1 and #2.

4. Adjust the sensitivity of the Leadframe Sensor amplifier for Bonder #1until LED #5 on the Transport Display on Bonder #1 is green. Figure 1-14 shows the LED lights on the control panel.

Figure 1-14 Control Panel Lights

NOTE: The Sensor Amplifier for Bonder #1 is located on the left side ofthe Disconnect Unit. The Sensor Amplifier for Bonder #2 is onthe lower right side. The Staple Sensor Amplifier is on the upperright side.

5. If Bonder #1 is running faster than Bonder #2, the leadframe strip willmove down in the Disconnect Unit so that it comes closer to theleadframe Sensor #1. Index the leadframe from the Transport until theleadframe is above the Hardstop Sensor #1 (but do not let the leadframestrip touch the Hard Stop sensor).

6. Adjust the amplifier for leadframe Sensor #1 until LED light #5 on theTransport Display of Bonder #1 goes OFF. When the bonders arerunning in the Automatic Mode, this condition will cause Bonder #1 topause indexing and bonding while Bonder #2 continues to run.

7. If Bonder #2 is running faster than Bonder #1, the leadframe strip willmove up in the Disconnect Unit so that it comes closer to the upperSensor Unit. With Bonder #1 idle, index the leadframe for Bonder #2 toget this condition. Again, stop indexing before the leadframe stripcontacts the upper Hard Stop sensor.

8. Adjust the amplifier for leadframe sensor #2 until LED light #2 on theTransport Display on Bonder #2 goes OFF. This will cause Bonder #2to pause indexing and bonding while Bonder #1 continues to run.


REEL-TO-REEL SUPPLEMENT Disconnect Unit Adjusting Staple Sensor

NOTE: If the Hardstop Sensors #1 or #2 are activated, either of theseconditions will cause an Error Message to appear on the screensaying “Waiting for Output (or Input) Buffer”.

9. If the leadframe strip contacts either the lower or upper hard stopsensors, it will cause the corresponding machine to STOP. Either LEDlight #6 on Bonder #1 or light #1 on Bonder #2 will go OFF, and anerror message will appear on the control panel of the correspondingmachine saying “Machine halted on Error”.

10. Correct the condition that caused the error and re-start the machine inAutomatic Mode.

Adjusting Staple Sensor

Leadframe segments are connected together using a large staple inthe center of the leadframe strip. It is important for the machineNOT to attempt to bond in this area because it might damage thetooling or the leadframe.

The Staple Sensor is located at the top, right-hand side of theDisconnect Unit.

1. To adjust the Staple Sensor, count the number of part indexes fromwhen the staple just activates the Staple Sensor to just before the staplereaches the clamp station.

2. On the Control Panel of Bonder #2, go to the HARDWARECONFIGURATIONS screen and scroll down until you see the message,“FIRST STAPLE SENSE TO CLAMP”. Enter the number of indexesfrom Instruction #1 above.

3. Scroll down to the next field with the message, “STAPLE SPAN(DEVICES)”. Enter the number of indexes (devices) necessary for thestaple section to go past the clamp station without clamping.

SPC Allowance

Statistical Process Control identifies a portion of the leadframestrip after each staple section which will be later cut out and testedfor process control.

1. Scroll to the field with the message that says, “SPC DELAY AFTERSTAPLE”. Enter a number in this field for the number of devices afterthe staple that will be unbonded. This will give you an easily


REEL-TO-REEL SUPPLEMENT Disconnect Unit SPC Allowance

identifiable portion of the leadframe strip before the start of the SPC testsection.

2. Scroll to the field with the message that says, “SPC WIDTH”. Enter thenumber of devices that will be included in the SPC test sample.

3. Scroll to the field with the message that says, “BOND AFTER STAPLESENSE”. Enter a number that is the TOTAL of the number of blankdevices (from Instruction #1 above), plus the number of devicesincluded in the SPC section (from Instruction #2 above), plus anotherblank section of devices that identifies the end of the SPC strip. Themachine will now continue to do production bonding.


tbsrin notes

Engineering

new board

cpu retrofit themis

onthe frame grabber

page desired

page command

linked page

page number box

original page