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    Short Channel EfectsShort Channel Efects

    in MOSFETsin MOSFETs

    Fabio DAgostinoFabio DAgostino

    Daniele QuerciaDaniele Quercia

    Fall, 2000Fall, 2000

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    PresentationPresentation Outline

    Short-Channel Devices

    Short-Channel Effects (SCE)

    The modification of the threshold voltage due to SCE

    A numerical example

    Simulation: SCE impacts on the threshold voltage

    Simualtion: limiting effect of the saturation velocit

    Conclusion

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    DenitionDenition

    What is a short-channel device?

    A !"S#ET is considered to $e short %hen the channellength is the same order of magnitude as the depletion-laer %idths (xdD& xdS)

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    Short Channel EffectsShort Channel Effects

    Five different h!sical henono"ena have to be

    considered in short-channel devices#

    Drain induced $arrier lo%ering and 'unchthrough

    Surface scattering

    elocit saturation

    mpact ioni*ation

    +ot electrons

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    Drain-induced barrier loweringDrain-induced barrier lowering

    (DI!"(DI!"

    The electrons (carriers) in the channel face a potential

    $arrier that $loc,s their flo%s

    The potential $arrier& in small-geometr !"S#ETs& is

    controlled $ a t%o-dimensional electric field vector (inother %ords $ $oth Sand DS)

    f the drain voltage is increased the potential $arrierin the channel decreases& leading to

    Drain-$nduced %arrier &o'ering (D$%&)

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    Drain-induced barrier lowering (DI!" andDrain-induced barrier lowering (DI!" and

    PunchthroughPunchthrough

    .nder D/0 condiction electrons can flo% $et%een the

    source and drain even if S 1 T

    The channel current that flo%s in this case is calledsu$threshold current

    *unchthrough

    The D/0 phenomenon can $e accompanied $ the so-

    called punchthrough& that occurs %hen the depletionregion surrounding the drain extends to the source

    'unchthrough minimi*ed %ith thinner oxide& larger

    su$strate doping (and longer channel2)

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    Sur#ace scatteringSur#ace scattering

    #or small-geometr !"S#ETs& the electrons mo$ilit in

    the channel depends on a t%o-dimensional electric field(+& !)

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    Sur#ace scatteringSur#ace scattering

    The surface scatteringoccurs %hen electrons areaccelerated to%ard the surface $ the verticalcomponent of the electric field +

    The collision of the electrons causes a reduction in themo$ilit

    Electrons moves %ith great difficult parallel to the

    interface

    The average surface mo$ilit is a$out half as muchas that of the $ul, mo$ilit

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    $elocit% saturation$elocit% saturation

    #or lo% !the electron drift velocit vdein the channel

    varies linearl %ith the electric field intensit

    As !increases a$ove 3456cm the drift velocit tends

    to approach a saturation value of vde(sat)7348cm6s around

    !73496cm

    The velocit saturation reduces the transconductanceof short-channel devices in the saturation condiction&as the follo%ing formula sho%s:

    gm7 Coxvde(sat)

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    I&'act ioniationI&'act ioniation

    he resence of high longitudinal fields can

    accelerate electrons that "a! be able of ioniing .iato"s b! i"acting against the"

    ;ormall most of the e- are attracted $ the drain& soit is plausi$le a higher concentration of holes near thesource

    f the holes concentration on the source is a$le tocreates a voltage drop on the source-su$strate n-p

    thene- ma $e in

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    )ot electrons)ot electrons

    he channel /ot lectronseffect is caused b!

    electrons flo'ing in the channel for large 1D.

    e- arriving at the Si-Si"?interface %ith enough ,inetic

    energ to surmount the surface potential $arrier are

    inected into the o+ide

    This ma degrade permanentl the C- characteristicsof a !"S#ETs

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    The &odication o# theThe &odication o# the

    threshold *oltagethreshold *oltagedue to short-channeldue to short-channel

    efectsefects

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    Modication o# $Modication o# $T)T)due to SCEdue to SCE

    3uation giving the threshold voltage atero-bias

    ( )ox

    IFASi

    ox

    FFBTCqDNq

    CVV +

    ++= 22120

    accurate for large !"S transistors

    not accurate for short-channel !"S transistorsthe amount of $ul, charge is overestimated

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    Modication o# $Modication o# $T)T)due to SCEdue to SCE

    &arge 45. transistor# the delition isonl! due to the electric fieldcreated b! the gate voltage6

    ."all-geo"etr! transistor# in addition tothe revious contribution, thedelition charge near n7 regions isinduced b! -n unctions6

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    Modication o# $Modication o# $T)T)due to SCEdue to SCE

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    Modication o# $Modication o# $T)T)due to SCEdue to SCE

    he bul8 deletion charge is s"aller thane+ectedthe threshold voltage e+ression "ust be"odified to account for this reduction#

    00)(0 TTchannelshortT VVV =

    10# thresholdvoltage shift

    10# ero-bias

    thresholdvoltage

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    Modication o# $Modication o# $T)T)due to SCEdue to SCE

    We find the follo'ing relationshi#

    ( ) ( )222DjdmdDj Lxxxx ++=+

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    Modication o# $Modication o# $T)T)due to SCEdue to SCE

    9 and solving for LD

    we obtain#

    'here

    ( )

    +++= 1

    212

    222

    j

    dDjdDjdDdmjjD

    x

    xxxxxxxxL

    ( )0

    2

    +

    = DSASi

    dD

    VqN

    x

    .i"ilarl!, the length &.can also be found as

    follo's#

    'here( )0

    2

    =

    A

    SidS

    qN

    x

    + 1

    21

    j

    dSjSx

    xxL

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    Modication o# $Modication o# $T)T)due to SCEdue to SCE

    he a"ount of the threshold voltage reduction

    1,0due to short-channel effects can be foundas#

    ++

    += 1

    211

    21

    222

    10

    j

    dS

    j

    dDj

    FASi

    ox

    Tx

    x

    x

    x

    L

    xNq

    CV

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    Modication o# $Modication o# $T)T)due to SCEdue to SCE

    e consider an n-channel !"S process %ith the follo%ingparameters:

    =su$strate doping densit :A;&=gate oxide tic,ness to+; 0 n"&

    =oxide-interface fixed charge densit :o+;@6

    n addition& %e assume that the channel region is implanted%ith p-tpe impurities(impurit concentration :$; 2

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    Modication o# $Modication o# $T)T)due to SCEdue to SCE

    We obtain 9

    VT0

    = 0.855V - VT0

    ;

    where ___________

    VT0= ( 0.343/L[m] ) * (-0.724 + ( 1 + 2 xdD) _________________

    xDd= 0.13 (0.76 + VDS)

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    Modication o# $Modication o# $T)T)due to SCEdue to SCE

    9 and lotting the variation of the thresholdvoltage 'ith the channel lenght

    0.2

    0.3

    0.4

    0.5

    0.6

    0.7

    0.8

    0.9

    Vth:T

    hreshold

    voltage

    [V]

    (Vth vs. L) @ Vds=1V [-----] Vds=

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    Si&ulation+ i&'act o# SCE on the thresholdSi&ulation+ i&'act o# SCE on the threshold

    *oltage*oltage

    e simulate four n!"S#ETs in parallel& %ith differentchannel lengths and 'idths

    All the transistors have the same parameters@ 0EE0 ?

    of 'spice is used

    #or each transistor %e generate the D-Scharacteristic at DS 7 4=3

    The plots sho% ho% devices %ith smaller geometr havehigher drain currents at the same gate-to-sourcevoltage (i=e=& smaller threshold voltages)

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    Si&ulation+ i&'act o# SCE on the thresholdSi&ulation+ i&'act o# SCE on the threshold

    *oltage*oltage

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    Si&ulation+ the li&iting efects o# the saturationSi&ulation+ the li&iting efects o# the saturation

    *elocit%*elocit%

    e simulate t%o n!"S#ETs in parallel& %ith the samechannel length and %idth

    "ne transistor has a limited saturation velocit of vde(sat)

    7 2C

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    Si&ulation+ the li&iting efects o# the saturationSi&ulation+ the li&iting efects o# the saturation

    *elocit%*elocit%

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    ConclusionConclusion

    .E are governed b! co"le+ h!sical heno"enathat can be "ainl! related to the

    $nfluence of both vertical and horiontal

    electric field co"onents on the flo'of the electrons in the channel

    suall! .E interacts the one 'ith the other

    .E should be carefull! considered in order toevaluate their i"act on the general behaviour ofthe device, both for short-ter" and long-ter"