×
Log in
Upload File
Most Popular
Study
Business
Design
Technology
Travel
Explore all categories
The top documents tagged [variant thermal power]
Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs Hao Yu, Joanna Ho and Lei He Electrical Engineering Dept. UCLA Partially supported
213 views
Thermal Via Allocation for 3D ICs Considering Temporally and Spatially Variant Thermal Power Hao Yu, Yiyu Shi and Lei He Electrical Engineering Dept. UCLA,
213 views
Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs
35 views