×
Log in
Upload File
Most Popular
Study
Business
Design
Technology
Travel
Explore all categories
The top documents tagged [thermal vias]
Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs Hao Yu, Joanna Ho and Lei He Electrical Engineering Dept. UCLA Partially supported
213 views
sc633
8 views
ATMEL High Temp H Bridge
50 views
1 High-Speed Digital Circuit Design Chris Allen (
[email protected]
) Course website URL people.eecs.ku.edu/~callen/713/EECS713.htm
226 views
100+ GHz Transistor Electronics: Present and Projected Capabilities
[email protected]
805-893-3244, 805-893-5705 fax 2010 IEEE International Topical
214 views
MARS A Scan-Island Based Design Enabling Pre-Bond Testability in Die-Stacked Microprocessors Dean L. Lewis Hsien-Hsin S. Lee Georgia Institute of Technology
214 views
Graham Beck (QMUL) LBNL Sept.2013 1 Berlin, March 2013: FEA of Side-Mounted Card + Straight Cooling Pipe (no meander through SMC region): For adequate
213 views
Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs
35 views
7 a H-Brigde for DC-Motor Applicattions
28 views
Thermal FEA Update (mainly END of STAVE) September 2013
40 views
100+ GHz Transistor Electronics: Present and Projected Capabilities
25 views
Class-D Audio Power Amplifiers: PCB Layout For Audio Quality, EMC & Thermal Success (Home Entertainment Devices) Stephen Crump
[email protected]
Audio Applications
226 views