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The top documents tagged [thermal challenge]
MonolithIC 3D Inc. Patents Pending 1 THE MONOLITHIC 3D-IC DISRUPTOR A DISRUPTOR TO THE SEMICONDUCTOR INDUSTRY
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Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs Hao Yu, Joanna Ho and Lei He Electrical Engineering Dept. UCLA Partially supported
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An Alternative Cooling Arrangement for the End Region of A
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Towards Sustainable Small Ruminant Production System in Response to Climate Change
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Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs
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