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The top documents tagged [microbump location]
MICRO-BUMP ASSIGNMENT FOR 3D ICS USING ORDER RELATION TA-YU KUAN, YI-CHUN CHANG, TAI-CHEN CHEN DEPARTMENT OF ELECTRICAL ENGINEERING, NATIONAL CENTRAL UNIVERSITY,
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ILP-Based Inter-Die Routing for 3D ICs Chia-Jen Chang, Pao-Jen Huang, Tai-Chen Chen, and Chien-Nan Jimmy Liu Department of Electrical Engineering, National
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