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The top documents tagged [maximum thermal power]
Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs Hao Yu, Joanna Ho and Lei He Electrical Engineering Dept. UCLA Partially supported
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Thermal Via Allocation for 3D ICs Considering Temporally and Spatially Variant Thermal Power Hao Yu, Yiyu Shi and Lei He Electrical Engineering Dept. UCLA,
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InTech-Ch1 Experimental Investigation of Thermal Hydraulics in the Ipr r1 Triga Nuclear Reactor
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Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs
35 views
16 th International Congress on Neutron Capture Therapy June 14-19, Helsinki, Finland Improvement of a PGNAA Facility for BNCT in THOR C. K. Huang 1, H
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Thermal Via Allocation for 3D ICs Considering Temporally and Spatially Variant Thermal Power
54 views