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REALIZING FULLY-PRINTED ELECTRONICS – STATE OF TECHNOLOGY IN 2018

OCTOBER 2018

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Table of Contents

List of Figures .............................................................................. v List of Tables ............................................................................... xi

Chapter 1 Introduction ................................ 1 Introduction to the Study ..................................................... 2

What are Printed Electronics? ...................................... 2 Printed Electronics: What is the promise? ................. 3 Topics – Functional Groups ......................................... 3

Methodology ......................................................................... 4 Literature Review ............................................................ 4 Survey................................................................................ 4 Conferences ..................................................................... 4 Interviews ......................................................................... 5 Patent Keyword Trend Analysis ................................... 5

Processing Techniques ........................................................ 5 Subtractive Manufacturing ........................................... 5 Additive Manufacturing ................................................. 8 Product Development .................................................. 15

Flexible Substrates ............................................................. 15 Polymer Substrates ...................................................... 15 Metals & Metalized Substrates .................................. 17 Paper and Paperboard ................................................. 17

Fluids/Inks ........................................................................... 17 Conductive inks ............................................................. 17 Semi-conductors ........................................................... 21 Insulators & Dielectrics ................................................ 21 Other Functional Inks ................................................... 21

Post-processing Techniques – Drying/Sintering/Calendaring .................................................. 21

Temperature Requirements ........................................ 21 Calendaring .................................................................... 22 Encapsulation ................................................................ 22

Packaging ............................................................................ 22 Packaging and FHE ...................................................... 22

Associations and Standards .............................................. 23 Technology Readiness Level (TRL) and Manufacturing

Readiness Level (MRL) ............................................................. 24

TRL .................................................................................. 25 MRL ................................................................................. 26 Correlation Between TRL and MRL ........................... 29

References ................................................................................. 30

Printed Passive Components and Graphics with Embedded Devices .. 31

Introduction to Printed Passive Components ................... 32 Printed Passive Components and Characterizations

................................................................................................... 32 Integrated and Integral Passive Components on

Printed Wiring Boards ............................................................ 37 Printing Passive Components on Low Temperature

Flexible Substrates ................................................................. 38 Current State of Technology .............................................. 39

Review of Published Work .......................................... 39 Industry Status and Material Suppliers .................... 45

................................................................................................... 47 Graphics with Embedded Electronics ....................... 47 Patent Trend Analysis .................................................. 50 Current TRL/MRL Assessments ................................ 52

Summary and Technology Projections ............................. 54 Challenges/ Needs/Gaps ............................................ 54 Technology Roadmaps ............................................... 54

References ................................................................................. 58

Sensors .................................... 60 Introduction to Sensors ...................................................... 61

Transducers and Transduction Mechanisms ......... 61 Sensor Performance Characteristics........................ 61 Performance Requirements and Integration

Approach .................................................................................. 64 Chemical Sensing ................................................................ 66

Gas Sensing ................................................................... 67 Relative Humidity Sensing .......................................... 70 Current TRL and MRL Analysis for Gas and RH

Sensing ..................................................................................... 71 Patent Keyword Trend Analysis for Gas and RH

Sensing ..................................................................................... 72


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Biomarker Sensing........................................................ 74 Current TRL and MRL Analysis for Biomarker

Sensing ..................................................................................... 77 Patent Keyword Trend Analysis for Biomarker

Sensing ..................................................................................... 77 Electrical Sensing ............................................................... 79

Proximity & Touch Sensing (Capacitive) .................. 79 Current TRL and MRL Analysis for Capacitive

Sensing. .................................................................................... 81 Patent Keyword Trend Analysis for Capacitive Touch

and Proximity Sensing ........................................................... 82 Mechanical Sensing ........................................................... 83

Strain Gage ..................................................................... 83 Force Sensing Resistor (FSR) ..................................... 85 Pressure Sensing - Piezoelectric ................................ 87 Current TRL and MRL Analysis for Mechanical

Sensing. .................................................................................... 87 Patent Keyword Trend Analysis for Mechanical

Sensing ..................................................................................... 88 Thermal Sensing ................................................................. 89

Thermocouple ............................................................... 89 Resistive Temperature Device (RTD) ........................ 90 Thermistors .................................................................... 91 Current TRL and MRL Analysis for Thermal Sensing.

.................................................................................................... 94 Patent Keyword Trend Analysis for Mechanical

Sensing ..................................................................................... 95 Electromagnetic Radiation (EMR) Sensing ....................... 96

Pulse Oximetry .............................................................. 96 Printed Organic Photodiodes ...................................... 97 Printed Photoemitters .................................................. 97 Current TRL and MRL Analysis for Pulse Oximetry.97 Patent Keyword Trend Analysis for Pulse Oximetry

.................................................................................................... 98 Summary & Projections ..................................................... 99

Challenges/ Needs/gaps ............................................. 99 Roadmaps .................................................................... 100

References .............................................................................. 104

Battery Technology .............. 108 Introduction to Battery Technology ................................. 109

Electrochemical Cells ................................................ 109 Introduction to Battery Design .........................................110

Energy Density and Power Density – the Ragone Plot .......................................................................................... 110

Battery and Product Waveforms ............................. 110 Battery-Capacitor Hybrid Structure ........................... cxi Battery Design Considerations in Products ............ cxii Battery Business Models and Supply Chains ......... cxii Battery Recycling and Standards ............................ cxiii Energy Storage Technology Comparisons ............ 114

Introduction to Printed Battery Technology ....................116 Introduction to Printed Battery Manufacturing ..... 116 Printing Technologies for Battery Production ....... 116 Printing Batteries ........................................................ 116 Battery Assembly by Thin Film Deposition. ........... 118

Primary Battery Technology Status .................................119 Primary Battery Chemistry ........................................ 119 Primary Battery Cycle Life ......................................... 120 Primary Battery Manufacturing................................ 120 Primary Battery Technology Outlook ...................... 121 Patent Keyword Trend Analysis - Primary Battery 124

Secondary Battery Technology Status ............................125 Secondary Battery Chemistry................................... 125 Secondary Battery Cycle Life.................................... 126 Recharging Systems for Secondary Batteries ...... 127 Safety, Reliability and Failure mechanisms ........... 127 Secondary Battery Manufacturing .......................... 128 Secondary Battery Technology Outlook ................. 129 Patent Keyword Trend Analysis - Secondary Battery

................................................................................................. 132 Electrochemical Capacitor (ECC) .....................................133

Introduction to Electrochemical Capacitor Technology ............................................................................ 133

Electrochemical Capacitor Manufacturing ............ 135 Electrochemical Capacitor Technology Outlook .. 136 Patent Keyword Trend Analysis - Electrochemical

Capacitor ................................................................................ 137 TRL/MRL Assessment Roadmaps ..................................139

Primary Battery TRL and MRL Roadmaps ............. 139


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Secondary Battery TRL and MRL Roadmaps ........ 143 Electrochemical Capacitor TRL and MRL Roadmaps

.................................................................................................. 146 References .............................................................................. 149

Printed Antennas .................. 152 Introduction to Printed Antennas .................................... 153

General Classification of Antennas ......................... 153 Antenna Characteristics and Performance............ 156 Printing as a Fabrication Process ............................ 160

Current State of Technology ............................................ 161 Manufacturing Processes and Current Performance

.................................................................................................. 161 Patent Trend Analysis ................................................ 173 Industry Status and TRL/MRL Assessment .......... 175

Technology Projections ................................................... 178 Challenges/ Needs/Gaps .......................................... 178 Technology Roadmap ................................................ 179

References .............................................................................. 182

Audio Technology ................ 186 Introduction to Audio Technology ................................... 187 Electrodynamic Speakers ................................................ 187

Introduction to Electrodynamic Speakers .............. 187 Electrodynamic Speaker Manufacturing for FHE . 189 Electrodynamic Speaker Technology Outlook ...... 190

Piezoelectric Speakers ..................................................... 191 Introduction to Piezoelectric Speakers ................... 191 Piezoelectric Speaker Manufacturing for FHE ...... 193 Piezoelectric Speaker Technology Outlook ........... 194

MEMS Speakers ............................................................... 195 Introduction to MEMS Speakers .............................. 195 MEMS Speaker Manufacturing for FHE ................. 195 MEMS Speaker Technology Outlook ....................... 196

Patent Key Word Trend Analysis - Audio Speakers ........ 197 Patent Keyword Trend Analysis – Audio Speakers

.................................................................................................. 197 TRL/MRL Assessment Roadmaps .................................. 197

Electrodynamic Speaker TRL and MRL Roadmaps .................................................................................................. 198

Piezoelectric Speaker TRL and MRL Roadmaps .. 200 MEMS Speaker TRL and MRL .................................. 201

References ...............................................................................203

Photovoltaics and Energy Harvesting ................................................ 204

Introduction to Energy Harvesting Technology...............205 Energy Harvesting ...................................................... 205 Using Harvested Energy ............................................ 206 Device Energy Waveforms ........................................ 207 Business Models and Supply Chains ...................... 209

Photovoltaic Technology ..................................................209 Introduction to Photovoltaic Technology ............... 210 PV Device Requirements for FHE ............................ 211 PV Business and Manufacturing Models ............... 212 PV Devices for FHE .................................................... 213 PV Technology Outlook ............................................. 226 Patent Keyword Trend Analysis – Photovoltaic

Technology ............................................................................ 226 Thermoelectric Generation ...............................................230

Introduction to Thermoelectric Energy Harvesting ................................................................................................. 230

TEG Device Requirements for FHE ......................... 231 TEG Business and Manufacturing Models ............ 233 TEG Devices for FHE .................................................. 233 TEG Technology Outlook .......................................... 237 Patent Keyword Trend Analysis – TEG Technology

................................................................................................. 239 Kinetic Energy Harvesting .................................................241

Introduction to Kinetic Energy Harvesting ............. 241 KEH Device Requirements for FHE ......................... 242 KEH Business and Manufacturing Models ............ 245 KEH Devices for FHE ................................................. 246 KEH Technology Outlook .......................................... 247 Patent Keyword Trend Analysis – KEH Technology

................................................................................................. 249 Wireless Charging Technology .........................................250

Introduction to Wireless Energy Harvesting .......... 250 Wireless Charging Device Requirements for FHE 252


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Wireless Charging Business and Manufacturing Models .................................................................................... 252

Wireless Charging Devices for FHE ......................... 253 Wireless Charging Technology Outlook ................. 255 Patent Keyword Trend Analysis - Wireless Charging

.................................................................................................. 256 TRL/MRL Assessment Roadmaps .................................. 258

PV TRL and MRL Roadmaps .................................... 258 TEG Energy Harvesting TRL and MRL Roadmaps260 KEH Energy Harvesting TRL and MRL Roadmaps

.................................................................................................. 263 Wireless Charging Energy Harvesting TRL and MRL

Roadmaps .............................................................................. 265 References .............................................................................. 267

FHE Integration, High Performance Circuits and Testing ....... 270

Introduction ....................................................................... 271 Organic Semiconductors ................................................. 271

State-of-the-art of Organic Thin Film Transistors . 271 Electron Mobility of Organic Semiconductor ......... 275 Applications of Organic Semiconductors .............. 275 Patent Keyword Trend Analysis for OFET .............. 276 TRL and MRL Assessment and Roadmap for OFET

.................................................................................................. 277 Wafer Thinning.................................................................. 279

Introduction to Wafer/Die Thinning ......................... 279 Standard Wafer Thinning Processes ...................... 279 The ChipFilmTM Process ............................................ 281 Flex Silicon-on-Polymer ............................................. 282 MRL Assessment of Wafer Thinning ...................... 283 Ultra-Thin Die Handling .............................................. 285

FHE Interconnection Methods ......................................... 289

Printed Interconnects with Electrically Conductive Adhesives (ECA) ................................................................... 290

Interconnection with ACA/ACF ................................ 291 Interconnection with ICA ........................................... 292 Soldering ...................................................................... 292 Patent Keyword Trend Analysis for FHE

Semiconductor Integration ................................................. 293 Current MRL assessment for Interconnection

Methods ................................................................................. 295 High Performance Circuits ...............................................295

Printed and Flex High Performance Substrate ..... 297 HiCoFlex Substrate and Integration with SMD

Components .......................................................................... 298 Chip in Flex (CIF) or Chip on Flex (COF) using Flip

Chip Technology ................................................................... 299 Chip in Polymer using Micro-Vias Technology ..... 301 Chip-Film Patch ........................................................... 303 FlexTrate technology ................................................. 304 MRL Assessment for Advanced Semiconductor

Integration .............................................................................. 305 Three-dimensional Electronics Integrating Electrical and

Mechanical Functions .............................................................305 In-Mold Electronics..................................................... 306 3D Printing ................................................................... 307 Current MRL Assessment and Roadmap for 3D

Electronics ............................................................................. 307 Reliability and Electrical Testing of FHE ..........................311

FHE Reliability Tests .................................................. 311 FHE Electrical Tests ................................................... 312 Patent Keyword Trend Analysis for FHE Testing . 313 Current MRL Assessment and Roadmap for FHE

Testing .................................................................................... 314 References ...............................................................................315 Acknowledgements .................................................................318


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List of Figures FIGURE 1.1 COPPER-CLAD FLEX CIRCUIT ON POLYIMIDE

WITH ATTACHED COMPONENT ........................................... 3 FIGURE 1.2 METHODOLOGY USED FOR GATHERING AND

SYNTHESIZING DATA .............................................................. 4 FIGURE 1.3 SPUTTERING DIAGRAM ......................................... 6 FIGURE 1.4 PHOTOLITHOGRAPHY DIAGRAM. ........................ 7 FIGURE 1.5 PHOTORESIST AND ETCHING PROCESS. .......... 7 FIGURE 1.6 LAB SCALE, HAND OPERATED SCREEN

PRINTING SHEETS. .................................................................. 9 FIGURE 1.7 ROTARY SCREEN PRINTING, ROLL-TO-ROLL

MANUFACTURING. .................................................................. 9 FIGURE1.8 INKJET DIAGRAM .................................................. 10 FIGURE 1.9 FLEXOGRAPHY DIAGRAM.................................... 11 FIGURE 1.10 SLOT DIE DIAGRAM. ........................................ 13 FIGURE 1.11 OPTOMEC AEROSOL JET® DIAGRAM. ......... 14 FIGURE 1.12 SUMMARY OF PROCESSING

TEMPERATURES FOR VARIOUS POLYMER SUBSTRATES 16

FIGURE 1.13 IMAGE OF FLAKE SILVER PARTICLES ......... 19 FIGURE 1.14 IMAGE SHOWING IDEAL HEXAGONAL

LATTICE OF CARBON ATOMS TO FORM GRAPHENE SHEET. 20

FIGURE 1.15 ILLUSTRATION OF FEW-WALL CARBON NANOTUBE 20

FIGURE 1.16 RELATIONSHIP BETWEEN TRL AND MRL. . 29 FIGURE 2.1 THE GEOMETRIES OF PLANAR RESISTORS CAN

BE DESCRIBED AS NUMBERS OF SQUARES. EACH SQUARE SIZE IS BASED ON THE WIDTH OF THE LINE .. 33

FIGURE 2.2 CONVENTIONAL LASER TRIM PATTERNS FOR FINE TUNING RESISTOR VALUES ....................................... 33

FIGURE 2.3 PARALLEL PLATE CAPACITOR STRUCTURE WITH TWO CONDUCTIVE PLATES AS THE ELECTRODES AND THE DIELECTRIC MATERIAL IN THE MIDDLE ......... 34

FIGURE 2.4 DIFFERENT FORMATS OF COPLANAR CAPACITORS WITH NO SANDWICHED DIELECTRIC LAYER 35

FIGURE 2.5 SCREEN PRINTED SPIRAL CONDUCTOR WITH 12 TURNS ................................................................................. 35

FIGURE 2.6 INKJET PRINTED MEANDER INDUCTORS REQUIRES NO VIAS ................................................................ 36

FIGURE 2.7 3D MODEL AND PRINTED INDUCTOR. A) 3D MODEL OF THE AIR CORE INDUCTOR; B) 3D PRINTED INDUCTOR STRUCTURE; C) SILVER CASTED 3D INDUCTOR ................................................................................ 36

FIGURE 2.8 DIRECT WRITING FABRICATED RESISTORS WITH DIFFERENT LENGTHS TO PRODUCT DIFFERENT RESISTIVITIES ......................................................................... 39

FIGURE 2.9 STRUCTURE OF A PRINTED CAPACITOR WHICH CONTAINS THE TOP AND BOTTOM ELECTRODES WITH THE DIELECTRIC LAYER IN BETWEEN. A) AND B) ARE THE SCHEMATICS OF A METAL-INSULATOR-METAL CAPACITOR; C) IS THE IMAGE OF A PRINTED CAPACITOR ............................................................................. 41

FIGURE 2.10 STRUCTURE OF PRINTED SQUARE SPIRAL INDUCTOR WITH CONDUCTORS (SILVER) AND INSULATOR (CPVP). A) IS THE SCHEMATIC OF THE PRINTED INDUCTOR; B) AND C) ARE THE INKJET PRINTED INDUCTOR WITH CONDUCTORS AND AN INSULATOR; D) IS THE PROFILE OF THE PRINTED CONDUCTOR ........................................................................... 43

FIGURE 2.11 THE STRUCTURE OF THE MEMBRANE SWITCH WITH GRAPHIC OVERLAY, FUNCTIONAL CIRCUIT, AND ADHESIVE LAYERS ...................................... 49

FIGURE 2.12 IN-MOLD PROCESS TO ATTACH THE PRINTED CIRCUIT TO A COMPLICATED 3D SURFACE .. 49

FIGURE 2.13 PATENT APPLICATION TREND ANALYSIS FROM 2007 TO 2016 BASED ON THE TERMS INCLUDING KEYWORDS AND COOPERATIVE PATENT CLASSIFICATION. ................................................................... 50

FIGURE 2.14 TOP FIVE PATENT ASSIGNEES BETWEEN 2007 AND 2016 IN PRINTED RESISTORS. ........................ 51

FIGURE 2.15 TOP FIVE PATENT ASSIGNEES BETWEEN 2007 AND 2016 IN PRINTED CAPACITORS. ..................... 51

FIGURE 2.16 TOP FIVE PATENT ASSIGNEES BETWEEN 2007 AND 2016 IN PRINTED INDUCTORS. ....................... 52

FIGURE 2.17 TECHNOLOGY ROADMAP OF PRINTED RESISTORS FOR THE NEXT 10 YEARS. ............................. 55

FIGURE 2.18 TECHNOLOGY ROADMAP OF PRINTED CAPACITORS FOR THE NEXT 10 YEARS. ......................... 56

FIGURE 2.19 TECHNOLOGY ROADMAP OF PRINTED INDUCTORS FOR THE NEXT 10 YEARS............................. 57

FIGURE 3.1 GRAPH SHOWING SATURATION/UDL REGION OF A SENSOR. ......................................................................... 62

FIGURE 3.2 SENSITIVITY SHOWS THE RELATIONSHIP BETWEEN INPUT AND OUTPUT AND HOW RESPONSIVE A SENSOR IS TO A SMALL CHANGE IN INPUT. ............... 63

FIGURE 3.3 LINEARITY ERROR SHOWING HOW THE OUTPUT CURVE DEVIATES FROM A STRAIGHT LINE.... 64

FIGURE 3.4 VAPOCHROMIC SENSORS HORTRESEACH RIPESENSE® (ETHYLENE) AND INSIGNIA TECHNOLOGIES CO2 SENSOR. ........................................... 65


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FIGURE 3.5 SENSORS INCLUDED IN THIS STUDY, BY TRANSDUCTION MECHANISM. ........................................... 66

FIGURE 3.6 - METHODS FOR GAS SENSING ................................ 67 FIGURE 3.7 PATENT KEYWORD SEARCH FOR GAS

SENSORS FROM 2007-2016. ALL SEARCHES USED KEYWORDS OF: (PRINTED OR FLEXIBLE) AND SENSOR AND THE SENSOR TYPE. ALL SENSORS EXCEPT RH USED PATENT CLASSIFICATION: G01N27/407 - INVESTIGATING OR ANALYSING MATERIALS BY THE USE OF ELECTRIC, ELECTRO-CHEMICAL, OR MAGNETIC MEANS FOR INVESTIGATING OR ANALYSING GASES. THE HUMIDITY SENSOR USED PATENT CLASSIFICATION: G01N27/225 - INVESTIGATING OR ANALYSING MATERIALS BY THE USE OF ELECTRIC, ELECTRO-CHEMICAL, OR MAGNETIC MEANS BY USING HYGROSCOPIC MATERIALS................................................. 72

FIGURE 3.8 TOP FIVE PATENT ASSIGNEES FOR SIX GAS AND RH SENSOR TYPES FROM 2007 TO 2016. .............. 73

FIGURE 3.9 SENSOR PERFORMANCE OF GLUCOSE IN HUMAN SWEAT ...................................................................... 76

Figure 3.10 – Graphene Electronic Tattoo (GET) substrate and circuit mounted on skin and compressed/stretched 25% .................................................................................................... 76

FIGURE 3.11 PATENT KEYWORD SEARCH FOR BIOMARKER SENSORS FROM 2007-2016. ALL SEARCHES USED KEYWORDS OF: (PRINTED OR FLEXIBLE) AND BIOSENSOR AND THE SENSOR TYPE. ALL SENSORS EXCEPT NEUROPEPTIDE Y (NPY) USED PATENT CLASSIFICATION: G01N27/00 - INVESTIGATING OR ANALYSING MATERIALS BY THE USE OF ELECTRIC, ELECTRO-CHEMICAL, OR MAGNETIC MEANS. THE NPY SENSOR USED PATENT CLASSIFICATION: G01N33/00 - INVESTIGATING OR ANALYSING MATERIALS BY SPECIFIC METHODS NOT COVERED BY THE PRECEDING GROUPS (REFER TO G01N). ................................................................... 78

FIGURE 3.12 TOP FIVE PATENT ASSIGNEES FOR SIX TYPES OF BIOMARKER SENSORS FROM 2007 TO 2016. 78

FIGURE 3.13 DIAGRAM SHOWING AN ELECTRIC FIELD THAT GENERATES ACROSS THE CONDUCTIVE PLATES OF A CAPACITOR. THE RATIO OF THE CHANGE IN ELECTRIC CHARGE RELATIVE TO A CORRESPONDING CHANGE IN VOLTAGE IS CAPACITANCE. ......................... 79

FIGURE 3.14 THREE FACTORS INFLUENCING CAPACITANCE: SURFACE AREA OF PLATES, DISTANCE BETWEEN PLATES AND PERMITTIVITY OF DIELECTRIC. 80

FIGURE 3.15 VARIETY OF DIFFERENT CO-PLANAR CAPACITIVE SENSOR DESIGNS. THE ONE ON THE FAR LEFT HAS LITTLE SURFACE AREA AND A WIDE GAP BETWEEN THE SENSORS. THE ONE ON THE RIGHT (ACTUALLY TWO SENSORS) HAS SIGNIFICANT

SURFACE AREA AND MINIMAL SEPARATION BETWEEN THE PLATES. ........................................................................... 81

FIGURE 3.16 DIAGRAM ILLUSTRATING DIFFERENT CAPACITANCES FOR LIQUID VOLUME MEASUREMENTS 81

FIGURE 3.17 PATENT KEYWORD SEARCH FOR CAPACITIVE PROXIMITY AND TOUCH SENSORS FROM 2007-2016. ALL SEARCHES USED KEYWORDS OF: (PRINTED OR FLEXIBLE) AND SENSOR AND (CAPACITIVE OR CAPACITANCE) AND (PROXIMITY OR TOUCH). THIS SEARCH USED TWO (OR) PATENT CLASSIFICATIONS: H03K2217/960755 - INDEXING SCHEME RELATED TO ELECTRONIC SWITCHING OR GATING, CONSTRUCTIONAL DETAILS OF CAPACITIVE TOUCH AND PROXIMITY SWITCHES OR H03K17/962 - ELECTRONIC SWITCHING OR GATING, CAPACITIVE TOUCH SWITCHES. .................. 82

FIGURE 3.18 TOP FIVE PATENT ASSIGNEES FOR CAPACITIVE SENSING. ......................................................... 83

FIGURE 3.19 WHEATSTONE BRIDGE, USED FOR DETERMINING RESISTANCE CHANGE IN A CIRCUIT. IN THIS EXAMPLE, RG REFERS TO A STRAIN GAGE. HOWEVER, IT COULD ALSO INDICATE RT FOR RTDS AND THERMISTORS ....................................................................... 85

FIGURE 3.20 – THREE PHASES OF FSR SENSOR ACTION. ..... 86 FIGURE 3.21 SHUNT MODE SCHEMATIC. .......................... 86 Figure 3.22 - Thru Mode schematic. .............................................. 87 FIGURE 3.23 PATENT KEYWORD SEARCH FOR

MECHANICAL SENSORS FROM 2007-2016. ALL SEARCHES USED KEYWORDS OF: (PRINTED OR FLEXIBLE) AND SENSOR AND THE SENSOR TYPE. FSR AND STRAIN GAGE USED PATENT CLASSIFICATION: G01L1/22 - MEASURING FORCE OR STRESS IN GENERAL USING RESISTANCE STRAIN. THE PIEZO SENSOR USED PATENT CLASSIFICATION: G01L1/16 - MEASURING FORCE OR STRESS IN GENERAL USING PROPERTIES OF PIEZO-ELECTRIC DEVICES. ................................................... 88

FIGURE 3.24 TOP FIVE PATENT ASSIGNEES FOR THREE MECHANICAL SENSORS FROM 2007 TO 2016. .............. 89

FIGURE 3.25 AEROSOL JET PRINTED THERMOCOUPLE SENSOR 90

FIGURE 3.26 PRINTED RTD ................................................... 91 FIGURE 3.27 RGO SCREEN-PRINTED RTD ......................... 92 FIGURE 3.28 RGO CALIBRATION CURVE, PRESUMABLY

WITH LINEARIZATION CORRECTION APPLIED ............... 92 FIGURE 3.29 KAHN PRINTED THERMISTOR.

COMPARISON OF RESPONSE TIME TO CONVENTIONAL THERMISTOR FROM 22°-31°C. RESPONSE CURVE OF PRINTED THERMISTORS ..................................................... 93

FIGURE 3.30 CAL POLY-DESIGNED DEMONSTRATOR USING PST SENSOR THERMISTOR ................................... 93


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FIGURE 3.31 BREWER SCIENCE’S THERMISTOR .............. 94 FIGURE 3.32 PATENT KEYWORD SEARCH FOR

TEMPERATURE SENSORS FROM 2007-2016. ALL SEARCHES USED KEYWORDS OF: (PRINTED OR FLEXIBLE) AND SENSOR AND THE SENSOR TYPE. THERMISTOR AND RTD USED PATENT CLASSIFICATION: G01K7/16 - MEASURING TEMPERATURE BASED ON THE USE OF ELECTRIC OR MAGNETIC ELEMENTS DIRECTLY SENSITIVE TO HEAT USING RESISTIVE ELEMENTS. THE THERMOCOUPLE SENSOR USED PATENT CLASSIFICATION: G01K7/02 - MEASURING TEMPERATURE BASED ON THE USE OF ELECTRIC OR MAGNETIC ELEMENTS DIRECTLY SENSITIVE TO HEAT USING THERMOELECTRIC ELEMENTS, E.G. THERMOCOUPLES. ................................................................. 95

FIGURE 3.33 TOP FIVE PATENT ASSIGNEES FOR THREE THERMAL SENSOR TYPES FROM 2007 TO 2016............ 96

FIGURE 3.34 CONVENTIONAL PULSE OXIMETRY. PHOTOGRAPH LICENSED UNDER CREATIVE COMMONS CC0 1.0 UNIVERSAL PUBLIC DOMAIN DEDICATION. ....... 97

FIGURE 3.35 PATENT KEYWORD SEARCH FOR PULSE OXIMETRY SENSOR FROM 2007-2016. SEARCHES USED KEYWORDS OF: (PRINTED OR FLEXIBLE) AND SENSOR AND PULSE OX AND (BLOOD OXYGEN SATURATION OR BLOOD OXYGEN CONCENTRATION) AND (ORGANIC PHOTODIODE OR ORGANIC PHOTODETECTOR OR OPD). THE SEARCH LIMITED THE RESULTS TO THE FOLLOWING PATENT CLASSIFICATION: A61B5/00 - DETECTING, MEASURING OR RECORDING FOR DIAGNOSTIC PURPOSES. ...................................................... 98

FIGURE 3.36 TOP FIVE PATENT ASSIGNEES FOR PULSE OXIMETRY SENSORS FROM 2007 TO 2016. .................... 99

FIGURE 3.37 GAS AND HUMIDITY SENSOR ROADMAP. 101 FIGURE 3.38 BIOMARKER SENSOR ROADMAP ............... 101 FIGURE 3.39 CAPACITIVE SENSOR ROADMAP ............... 102 FIGURE 3.40 - MECHANICAL SENSOR ROADMAP.................... 102 FIGURE 3.41 TEMPERATURE SENSOR ROADMAP ......... 103 FIGURE 3.42 PRINTED PULSEOX ROADMAP ................... 103 FIGURE 4.1 RAGONE PLOT FOR VARIOUS BATTERY

TECHNOLOGIES ...................................................................... cx FIGURE 4.2 EXAMPLES OF DEVICE WAVEFORMS TO WHICH

A BATTERY NEEDS TO RESPOND .......................................cxi FIGURE 4.3 BATTERY-CAPACITOR HYBRID CIRCUIT

SCHEMATIC ........................................................................... 112 FIGURE 4.4 A) CYLINDRICAL BATTERY CONSTRUCTION

(KOHLMEYER, 2017). B) FORM FACTORS FOR THIN FLEXIBLE BATTERIES .......................................................... 113

FIGURE 4.5 CROSS SECTION OF CYMBET ENERCHIP BATTERY ................................................................................ 118

FIGURE 4.6 PRIMARY BATTERY PATENT TREND ANALYSIS 124

FIGURE 4.7 TOP 5 PATENT ASSIGNEES BETWEEN 2007 AND 2016 FOR PRIMARY BATTERY ELECTRODES AND ELECTROLYTES .................................................................... 125

FIGURE 4.8 SECONDARY BATTERY PATENT TRENDS ANALYSIS............................................................................... 132

FIGURE 4.9 TOP 5 PATENT ASSIGNEES BETWEEN 2007 AND 2016 FOR SECONDARY BATTERY ELECTRODES AND ELECTROLYTES........................................................... 133

FIGURE 4.10 ECC SCHEMATIC CONSTRUCTION ........... 134 FIGURE 4.11 RAGONE PLOT INCLUDING CAPACITOR

TECHNOLOGY ....................................................................... 135 Figure 4.12 ECC patent trends analysis ................................ 138 FIGURE 4.13 TOP 5 PATENT ASSIGNEES BETWEEN 2007

AND 2016 FOR ECC ELECTRODES AND ELECTROLYTES 139

FIGURE 4.14 PRIMARY BATTERY TECHNOLOGY TRL ROADMAP - FHE ASSEMBLED PRODUCTS .................... 140

Figure 4.15 Primary Battery Technology MRL Roadmap - FHE Assembled Products ................................................... 141

FIGURE 4.16 PRIMARY BATTERY TECHNOLOGY TRL ROADMAP - FHE INTEGRATED PRODUCTS ................... 141

FIGURE 4.17 PRIMARY BATTERY TECHNOLOGY MRL ROADMAP - FHE INTEGRATED PRODUCT ...................... 142

FIGURE 4.18 SECONDARY BATTERY TECHNOLOGY TRL ROADMAP - FHE ASSEMBLED PRODUCTS .................... 143

FIGURE 4.19 SECONDARY BATTERY TECHNOLOGY MRL ROADMAP - FHE ASSEMBLED PRODUCTS .................... 144

FIGURE 4.20 SECONDARY BATTERY TECHNOLOGY TRL ROADMAP - FHE INTEGRATED PRODUCTS ................... 144

FIGURE 4.21 SECONDARY BATTERY TECHNOLOGY MRL ROADMAP - FHE INTEGRATED PRODUCTS ................... 145

FIGURE 4.22 ECC TECHNOLOGY TRL ROADMAP - FHE ASSEMBLED PRODUCTS .................................................... 146

FIGURE 4.23 ECC TECHNOLOGY MRL ROADMAP - FHE ASSEMBLED PRODUCTS .................................................... 147

FIGURE 4.24 - ECC TRL ROADMAP - FHE INTEGRATED PRODUCTS ............................................................................ 147

FIGURE 4.25 ECC MRL ROADMAP - FHE INTEGRATED PRODUCTS 148

FIGURE 5.1 RADIO FREQUENCY RANGE AND APPLICATIONS. .................................................................... 153

FIGURE 5.2 COORDINATE SYSTEM FOR ANTENNA ANALYSIS............................................................................... 157


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FIGURE 5.3 POWER PATTERN OF AN ANTENNA PLOTTED ON A LOGARITHMIC DB SCALE ......................................... 157

FIGURE 5.4 OMNIDIRECTIONAL PATTERNS WITH (A) AND WITHOUT SIDE LOBES (B) .................................................. 158

FIGURE 5.5 PARAMETERS ASSOCIATED WITH ANTENNA CHARACTERISTICS. ............................................................. 159

FIGURE 5.6 PARAMETERS ASSOCIATED WITH ANTENNA PERFORMANCE. ................................................................... 160

FIGURE 5.7 SIMULATION RESULT IS BASED ON THE ANTENNA PATTERN WITH SMOOTH EDGES. THE MEASURED RESULT INDICATES THE SHIFT FROM AN IDEAL PATTERN TO A PRINTED PATTERN IN TERMS OF THE RETURN LOSS .............................................................. 163

FIGURE 5.8 MEASURED AND SIMULATED ANTENNA REFLECTION COEFFICIENTS OF 30µM PRINTED DIELECTRIC FILM. THE DIFFERENCES ARE THE RESULTS OF THICKNESS VARIATION OF THE PRINTED DIELECTRIC FILM ................................................................. 164

FIGURE 5.9 INK DROP SPACING AND HOW THE PATTERNS OF THE ANTENNA ARE FORMED HAVE SIGNIFICANT IMPACT ON THE QUALITY OF INK FILM AND THE EFFICIENCY OF THE PRINTED ANTENNAS .................... 166

FIGURE 5.10 3D PRINTED METAL HORN ANTENNAS WITH POLISHED OUTSIDES. THE METALS USED FOR DIRECT 3D PRINTING ARE ALUMINUM ALLOY (LEFT) AND COPPER (RIGHT) .................................................................. 167

FIGURE 5.11 THE ILLUSTRATION OF HOW THE SURFACE ROUGHNESS OF 3D PRINTED ANTENNA STRUCTURE IMPACTS THE METALLIC LAYER BEING PLACED ON TOP OF IT. MORE LAYERS NEED TO BE DEPOSITED IN ORDER TO REDUCE THE RESISTANCE OF THE CONDUCTIVE FILM FOR A FUNCTIONAL 3D ANTENNA ........................ 167

FIGURE 5.12 INKJET PRINTED MICROSTRIP ANTENNA ARRAY ON A PLANAR SURFACE (LEFT) AND ON A CURVED SURFACE WITH 12-IN RADIUS .......................... 169

FIGURE 5.13 HEMISHPERICAL COIL ANTENNA IS PRINTED WITH STRETCHABLE CONDUCTIVE INK AND FOLLOWED BY THERMOFORMING TO THE HEMISPHERICAL SHAPE .................................................... 169

FIGURE 5.14 PRINTING CONDUCTIVE MATERIAL DIRECTLY ONTO A 3-DIMENSIONAL OBJECT ................ 170

FIGURE 5.15: ILLUSTRATION OF THE PAD PRINTING PROCESS PRINTING AN ANTENNA PATTERN ONTO A HEMISPHERE OBJECT. (A) THE SETUP OF A PAD PRINTING PRESS; (B) THE CLICHÉ AND THE TRANSFER PAD; 9C) THE PRINTED ANTENNA ON A HEMISPHERIC OBJECT. 170

FIGURE 5.16 THERMAL TRANSFER PROCESS DEPOSITS A LAYER OF ADHESIVE ON THE SUBSTRATE WITH THE DESIRED PATTERN. THEN THE THERMAL PRINTHEAD

TRANSFERS THE METAL FOIL ONTO THE PRINTED ADHESIVE TO FINISH THE PRINTING ............................. 172

FIGURE 5.17 PATENT KEYWORD TREND ANALYSIS WITH KEY WORDS OF “PRINTED” AND “ANTENNAS” AND “FLEXIBLE SUBSTRATES”, ALONG WITH CLASSIFICATION H05K1/00. ............................................. 174

FIGURE 5.18 TOP FIVE PATENT ASSIGNEES BETWEEN 2007 AND 2016 IN PRINTED ANTENNAS. ...................... 174

FIGURE 5.19 TECHNICAL ROADMAP OF PRINTED RFID ANTENNAS IN THE NEXT 10 YEARS................................ 179

FIGURE 5.20 TECHNICAL ROADMAP OF PRINTED L-C BAND ANTENNAS IN THE NEXT 10 YEARS. ................... 180

FIGURE 5.21 TECHNICAL ROADMAP OF PRINTED X BAND AND ABOVE ANTENNAS IN THE NEXT 10 YEARS. ....... 181

FIGURE 6.1 – SIZES OF SMALL SPEAKERS WITH A HUMAN EAR FOR REFERENCE. ........................................................ 187

FIGURE 6.2 - TYPICAL SPEAKER CONSTRUCTION WHERE: 1) IS THE MAGNET, 2) IS THE VOICE COIL, 3) IS THE SUSPENSION AND 4) IS THE DIAPHRAGM .................... 188

FIGURE 6.3 – MINIATURIZED SPEAKER WITH COMPONENTS ...................................................................... 188

Source: Speakers - Product Spotlight, 2018FIGURE 6.4 MINIATURIZED SPEAKER WITH COMPONENTS ASSEMBLED 188

FIGURE 6.5 KYOCERA PIEZOELECTRIC SPEAKER ............. 191 FIGURE 6.6 KYOCERA “SMART SONIC SOUND” SPEAKER

PARAMETERS ....................................................................... 191 FIGURE 6.7 PVDF BASED SPEAKER ...................................... 192 FIGURE 6.8 PRINTED PIEZOELECTRIC SPEAKER .............. 192 FIGURE 6.9 CROSS-SECTION VIEW OF A MEMS SPEAKER

195 FIGURE 6.10 PATENT KEYWORD TREND ANALYSIS -

AUDIO SPEAKER ................................................................... 197 FIGURE 6.11 TOP 5 PATENT ASSIGNEES BETWEEN 2007

AND 2016 FOR ELECTRODYNAMIC, PIEZOELECTRIC AND MEMS AUDIO SPEAKER TECHNOLOGIES....................... 198

FIGURE 6.12 ELECTRODYNAMIC SPEAKER TRL AND MRL ROADMAP – FHE ASSEMBLED PRODUCT ..................... 199

FIGURE 6.13 ELECTRODYNAMIC SPEAKER TRL AND MRL ROADMAP – FHE INTEGRATED PRODUCT .................... 199

FIGURE 6.14 PIEZOELECTRIC SPEAKER TRL AND MRL ROADMAP – FHE ASSEMBLED PRODUCT ..................... 200

FIGURE 6.15 PIEZOELECTRIC SPEAKER TRL AND MRL ROADMAP – FHE INTEGRATED PRODUCT .................... 201

FIGURE 6.16 MEMS SPEAKER TRL AND MRL ROADMAP – FHE ASSEMBLED PRODUCT .............................................. 201


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FIGURE 6.17 MEMS SPEAKER TRL AND MRL ROADMAP – FHE INTEGRATED PRODUCT ............................................. 202

FIGURE 7.1 ENERGY HARVESTING FAMILIES POSITIONED BY ENERGY OUTPUT. KINETIC (MORI & PRIYA, 2018); TEG (LEONOV, 2011); KINETIC (MIDE TECHNOLOGY, 2017); PV (“FOLDABLE SOLAR PANELS,” 2018) ............. 205

FIGURE 7.2 - WIRELESS CHARGING BROADCAST RANGES 206

FIGURE 7.3 BLOCK DIAGRAM FOR UTILIZING AN ENERGY HARVESTING DEVICE .......................................................... 207

FIGURE 7.4 EXAMPLES OF DEVICE WAVEFORMS TO WHICH A HARVESTER NEEDS TO RESPOND ............................... 208

FIGURE 7.5 BATTERY-CAPACITOR HYBRID CIRCUIT SCHEMATIC ........................................................................... 209

FIGURE 7.6 SIMPLE SCHEMATIC OF PV SOLAR CELL CONSTRUCTION ................................................................... 210

FIGURE 7.7 NREL BEST RESEARCH-CELL EFFICIENCIES . 211 FIGURE 7.8 - A) NASA'S SOLAR-ELECTRIC HELIOS PROTOTYPE

FLYING WING USED TILED PV PANELS, B) SOLAR FOLDABLE SOLAR PANEL .................................................. 212

FIGURE 7.9 PV MODULE ASSEMBLED WITH AN ELECTRONICS ASSEMBLY ................................................. 213

FIGURE 7.10 SCHEMATIC OF CDTE PV CELL .................. 217 FIGURE 7.11 SCHEMATIC OF CIGS PV CELL .................... 217 FIGURE 7.12 SOLAR PANEL POWER DENSITY PLOTS FOR

DIFFERENT MATERIAL SYSTEMS .................................... 220 FIGURE 7.13 SCHEMATIC CROSS-SECTION OF AN OPV

DEVICE 222 FIGURE 7.14 MATERIAL SYSTEM VERSUS MAXIMUM

PHOTON ENERGY UTILIZATION ....................................... 224 FIGURE 7.15 PATENT KEYWORD TREND ANALYSIS -

PHOTOVOLTAIC TECHNOLOGY ........................................ 229 FIGURE 7.16 TOP 5 PATENT ASSIGNEES BETWEEN 2007

AND 2016 FOR PV TECHNOLOGIES BY CATEGORY. .... 229 FIGURE 7.17 WASTE HEAT AND THERMOELECTRIC

POWER GENERATION ......................................................... 230 FIGURE 7.18 TEG SEMICONDUCTOR MATERIAL POWER

FACTOR 232 FIGURE 7.19 HUMAN SKIN TEMPERATURE MAP ........... 234 FIGURE 7.20 DESIGN CONSIDERATIONS FOR A

WEARABLE TEG DEVICE ..................................................... 235 FIGURE 7.21 TEG DEVICE FABRICATED WITH BULK LEGS

236 FIGURE 7.22 EXAMPLE OF FLEXIBLE TEG USING

THERMOELECTRIC INKS .................................................... 236

FIGURE 7.23 PATENT KEYWORD TREND ANALYSIS - TEG INKS 240

FIGURE 7.24 TOP 5 PATENT ASSIGNEES BETWEEN 2007 AND 2016 FOR TEG TECHNOLOGIES BY CATEGORY. . 240

FIGURE 7.25 MEMS KEH DEVICE USING SPRING-LOADED MAGNETS 243

FIGURE 7.26 MEMS A) UNIMORPH AND B) BIMORPH CONSTRUCTIONS ................................................................ 243

FIGURE 7.27 PIEZOELECTRIC ENERGY HARVESTER .... 244 FIGURE 7.28 PVDF BASED ENERGY HARVESTER .......... 245 FIGURE 7.29 PATENT KEY WORD TREND ANALYSIS - KEH

TECHNOLOGY ....................................................................... 249 FIGURE 7.30 TOP 5 PATENT ASSIGNEES BETWEEN 2007

AND 2016 FOR KEH TECHNOLOGIES BY CATEGORY. . 250 FIGURE 7.31 ILLUSTRATION OF INDUCTIVE COUPLED

WIRELESS CHARGING ........................................................ 251 FIGURE 7.32 DIFFERENCE BETWEEN WIRELESS

CHARGING WHICH REQUIRES A CRADLE (A) AND WIRELESS POWER WHICH CAN BE LOCATED ANYWHERE WITHIN THE CHARGING SPACE (B) ......... 252

FIGURE 7.33 ENERGOUS RECEIVER CHIP ........................ 253 FIGURE 7.34 COTA FOREVER BATTERY™ ......................... 254 FIGURE 7.35 PATENT KEYWORD TREND ANALYSIS FOR

WIRELESS CHARGING ........................................................ 257 FIGURE 7.36 TOP 5 PATENT ASSIGNEES BETWEEN 2007

AND 2016 FOR WIRELESS CHARGING TECHNOLOGIES BY CATEGORY ...................................................................... 257

FIGURE 7.37 PV ENERGY HARVESTER LANDSCAPE-FHE ASSEMBLED PRODUCT-TRL .............................................. 258

FIGURE 7.38 PV ENERGY HARVESTER LANDSCAPE-FHE ASSEMBLED PRODUCT - MRL ........................................... 259

FIGURE 7.39 PV ENERGY HARVESTER LANDSCAPE – FHE INTEGRATED PRODUCT-TRL ............................................. 259

FIGURE 7.40 PV ENERGY HARVESTER LANDSCAPE – FHE INTEGRATED PRODUCT – MRL ........................................ 260

FIGURE 7.41 TEG ENERGY HARVESTER LANDSCAPE – FHE ASSEMBLED PRODUCT-TRL ..................................... 261

FIGURE 7.42 TEG ENERGY HARVESTER LANDSCAPE – FHE ASSEMBLED PRODUCT - MRL .................................. 261

FIGURE 7.43 TEG ENERGY HARVESTER LANDSCAPE – FHE INTEGRATED PRODUCT - TRL .................................. 262

Figure 7.44 - TEG Energy Harvester Landscape – FHE Integrated Product - MRL ....................................................................... 262

FIGURE 7.45 KINETIC ENERGY HARVESTER LANDSCAPE – FHE ASSEMBLED PRODUCT – TRL .............................. 263


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FIGURE 7.46 KINETIC ENERGY HARVESTER LANDSCAPE – FHE ASSEMBLED PRODUCT - MRL ............................... 264

FIGURE 7.47 KINETIC ENERGY HARVESTER LANDSCAPE – FHE INTEGRATED PRODUCT - TRL .............................. 264

Figure 7.48 - Kinetic Energy Harvester Landscape – FHE Integrated Product - MRL .................................................... 265

FIGURE 7.49 WIRELESS CHARGING LANDSCAPE – FHE ASSEMBLED PRODUCT TRL & MRL ................................. 266

FIGURE 7.50 WIRELESS CHARGING LANDSCAPE – FHE INTEGRATED PRODUCT TRL & MRL ................................ 266

FIGURE 8.1 STRUCTURES OF OFETS IN EARLY TIME ...... 271 FIGURE 8.2 OFET STRUCTURE ............................................... 272 FIGURE 8.3 OFET STRUCTURE ............................................... 272 FIGURE 8.4 OFET STRUCTURE ............................................... 273 FIGURE 8.5 ELECTRON MOBILITY OF ORGANIC

SEMICONDUCTORS ............................................................. 275 FIGURE 8.6 PATENT KEYWORD SEARCH FOR OFETS FROM

2007-2016. ALL SEARCHES USED KEYWORDS OF: PATENT CLASSIFICATION NUMBER H01L51/00 AND (TRANSISTOR) AND (“FIELD EFFECT” OR “THIN FILM”) AND (PRINTED OR FLEXIBLE). ........................................... 276

FIGURE 8.7 TOP FIVE PATENT ASSIGNEES BETWEEN 2007 AND 2016 IN OFETS. ............................................................ 277

FIGURE 8.8 TRL/MRL ROADMAP FOR ORGANIC FETS ..... 278 FIGURE 8.9 HISTORICAL TREND OF WAFER THICKNESS

AND WAFER DIAMETER ...................................................... 279 FIGURE 8.10 BACK GRINDING PROCESS FLOW .............. 280 FIGURE 8.11 THE CHIPFILMTM PROCESS ......................... 282 FIGURE 8.12 SCHEMATIC OF SILICON-ON-POLYMER

TECHNOLOGY ....................................................................... 283 FIGURE 8.13 CUMULATIVE NUMBER OF PUBLICATIONS

IN MAJOR AREAS RELATED TO THIN-SI BASED ELECTRONICS, INCLUDING UTCS. ................................... 284

FIGURE 8.14 FRACTURE BEHAVIOR OF ULTRA-THIN SILICON CHIPS WITH DIFFERENT LAYERS .................... 285

FIGURE 8.15 EFFECT OF GRINDING WHEEL MESH SIZE ON CHIP STRENGTH MEASURED BY THE 4-POINT BENDING TEST ..................................................................... 286

FIGURE 8.16 A PHOTO SHOWING THE RIGIDITY OF A THINNED WAFER USING THE TAIKO PROCESS VERSUS CONVENTIONAL THINNING. .............................................. 287

FIGURE 8.17 SIMPLIFIED H-AP PROCESS......................... 288 FIGURE 8.18 SUMMARY OF INTERCONNECTION

METHODS FOR FHE ............................................................. 289 FIGURE 8.19 PRINTED INTERCONNECT ........................... 291

FIGURE 8.20 CRACKS IN PRINTED INTERCONNECTS .. 291 FIGURE 8.21 ULTRATHIN CHIP ASSEMBLED TO PRINTED

AG PADS USING ACA........................................................... 292 FIGURE 8.22 ASSEMBLY OF THIN SI CHIP ONTO FLEXIBLE

SUBSTRATES (POLYIMIDE OR LIQUID CRYSTAL POLYMER) USING SOLDERING APPROACH ................... 293

FIGURE 8.23 PATENT KEYWORD SEARCH FOR FHE SEMICONDUCTOR INTEGRATION FROM 2007-2016. ALL SEARCHES USED KEYWORDS OF: ASSEMBLY METHODS AND (ASSEMBLY OR INTEGRATION) AND (CHIP OR DIE) AND (PRINTED OR FLEXIBLE). PATENT CLASSIFICATIONS FOR (A), (B), (C), AND (D) ARE H01L25/00, H01L23/538, H05K1/00, AND H05K3/00, RESPECTIVELY. .................................................................... 294

FIGURE 8.24 TOP PATENT ASSIGNEES IN FHE SEMICONDUCTOR INTEGRATION FROM 2007 TO 2016. PATENT CLASSIFICATIONS FOR (A), (B), (C), AND (D) ARE H01L25/00, H01L23/538, H05K1/00, AND H05K3/00, RESPECTIVELY. .................................................................... 295

FIGURE 8.25 HICOFLEX PROCESS ..................................... 299 FIGURE 8.26 HICOFLEX SUBSTRATE WITH SMDS

ASSEMBLED .......................................................................... 299 FIGURE 8.27 FLIP CHIP IN FLEX ......................................... 300 FIGURE 8.28 CIF PROCESS FLOW ...................................... 300 FIGURE 8.29 INTERCONNECT PRINCIPLE OF AN

EMBEDDED CHIP IN A PWB BUILD-UP LAYER ............... 301 FIGURE 8.30 PROCESS FLOW OF THE CHIP IN POLYMER

TECHNOLOGY ....................................................................... 302 FIGURE 8.31 OVERVIEW OF UTCP TECHNOLOGY

PROCESS FLOW DEVELOPED BY IMEC ........................... 302 FIGURE 8.32 PROCESS FLOW OF THE CHIP FILM PATCH

TECHNOLOGY ....................................................................... 303 FIGURE 8.33 PROCESS FLOW OF FLEXTRATE

TECHNOLOGY ....................................................................... 304 FIGURE 8.34 SAMPLE IN-MOLD ELECTRONICS

COMPONENT FOR AUTOMOTIVE APPLICATIONS........ 305 FIGURE 8.35 IME DEVICE INCLUDING OLED AND

BATTERY 306 FIGURE 8.36 PRINTING CONDUCTIVE MATERIAL

DIRECTLY ONTO A 3-DIMENSIONAL OBJECT ............... 307 Figure 8.37 Roadmap MRL projection for 3D Direct Write 3D

electronics. ............................................................................ 309 FIGURE 8.38 ROADMAP MRL PROJECTION FOR IN MOLD

ELECTRONICS. ...................................................................... 310 FIGURE 8.39 ROADMAP MRL PROJECTION FOR PAD

PRINTING. 310


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FIGURE 8.40 PATENT KEYWORD SEARCH FOR FHE TESTING FROM 2007-2016 ................................................ 313

FIGURE 8.41 THE TOP PATENT ASSIGNEES RELATED TO FHE TESTING ........................................................................ 314

List of Tables TABLE 1.1 TYPICAL SCREEN PRINTING PROCESS

PARAMETERS ......................................................................... 10 TABLE 1.2 TYPICAL INKJECT PROCESS PARAMETERS ... 11 TABLE 1.3 TYPICAL FLEXOGRAPHY PROCESS

PARAMETERS ......................................................................... 12 TABLE 1.4 TYPICAL GRAVURE PROCESS PARAMETERS . 12 TABLE 1.5 SLOT DIE PROCESS PARAMETERS ................... 13 TABLE 1.6 AEROSOL JET PROCESS PARAMETERS. .......... 14 TABLE 1.7 RESISTIVITY (𝜌𝜌) AND CONDUCTIVITY OF

VARIOUS METALS. ................................................................. 18 TABLE 1.8 ASSOCIATIONS WITH INTEREST IN PRINTED

ELECTRONICS ......................................................................... 23 TABLE 1.9 STANDARDS FOR PRINTED ELECTRONICS ..... 24 TABLE 1.10 TECHNOLOGY READINESS LEVEL (TRL) AS

OUTLINED BY DEPARTMENT OF DEFENSE ...................... 25 TABLE 1.11 MANUFACTURING READINESS LEVEL (MRL) AS

OUTLINED BY THE DEPARTMENT OF DEFENSE ............. 26 TABLE 2.1 COMMON FUNCTIONAL MATERIALS USED FOR

PRINTING THICK-FILM PASSIVE COMPONENTS BY SCREEN PRINTING TECHNOLOGY ..................................... 38

TABLE 2.2 SAMPLING OF CURRENT RESEARCH IN PRINTING RESISTORS AND THE PERFORMANCE OF PRINTED RESISTORS. ........................................................... 40

TABLE 2.3 SAMPLING OF CURRENT RESEARCH IN PRINTING CAPACITORS AND THE PERFORMANCE OF PRINTED CAPACITORS. ........................................................ 42

TABLE 2.4 SAMPLING OF CURRENT RESEARCH IN PRINTING INDUCTORS AND THE PERFORMANCE OF PRINTED INDUCTORS. .......................................................... 44

TABLE 2.5 SAMPLING OF FUNCTIONAL MATERIAL SUPPLIERS WITH PRODUCTS THAT CAN BE USED FOR PRINTING PASSIVE COMPONENTS. .................................. 45

TABLE 2.6 SAMPLING OF US-BASED MANUFACTURES PRINTING PASSIVE COMPONENTS IN THEIR PRODUCTS. 48

TABLE 2.7 CURRENT TRL AND MRL ASSESSMENT FOR PASSIVE COMPONENTS FOCUSING ON SENSOR AND WIRELESS COMMUNICATION. ............................................ 53

TABLE 3.2 FUNCTIONALIZED CNT RESEARCH SUMMARIZED IN TANG, R., SHI, Y., HOU, Z., & WEI, L.

(2017). CARBON NANOTUBE-BASED CHEMIRESISTIVE SENSORS. SENSORS ............................................................. 68

TABLE 3.3 DEMONSTRATED OXIDE SENSING MATERIALS FOR GAS DETECTION ............................................................ 69

TABLE 3.4 SIGNIFICANT WORK IN REDUCED GRAPHENE OXIDE-BASED SENSING ........................................................ 70

TABLE 3.5 GRAPHENE OXIDE RH SENSING FULLY PRINTED HIGH PERFORMANCE HUMIDITY SENSORS BASED ON TWO-DIMENSIONAL MATERIALS. .................. 71

TABLE 3.6 CURRENT TRL AND MRL ASSESSMENT FOR GAS SENSING. ........................................................................ 71

TABLE 3.7 TYPICAL CONCENTRATION RANGES FOR COMMON BIOMARKERS IN SWEAT VERSUS BLOOD, PLASMA, AND/OR SERUM WITH SUB- SCRIPTS INDICATING PARTICULAR FLUID (B—BLOOD; P—PLASMA; S—SERUM). PLEASE SEE APPROPRIATE SECTIONS FOR ALL REFERENCES RELATED TO EACH BIOMARKER. ........................................................................... 75

TABLE 3.8 CURRENT TRL AND MRL ASSESSMENT FOR BIOSENSING. ........................................................................... 77

TABLE 3.9 CURRENT TRL AND MRL OF CAPACITIVE TOUCH AND PROXIMITY SENSORS. .................................. 82

TABLE 3.10 COMPARISON OF PRINTED GAGES WITH COMMERCIAL FOIL GAGE .................................................... 84

TABLE 3.11 GAGE FACTORS ACHIEVED BY VARIOUS RESEARCH GROUPS USING DIFFERENT PRINTING PROCESSES............................................................................. 84

TABLE 3.12 CURRENT TRL AND MRL OF PRINTED STRAIN, FSR AND PIEZOELECTRIC PRESSURE SENSORS. .......... 88

TABLE 3.13 CHARACTERISTICS OF CONVENTIONAL (MEMS OR SILICON) TEMPERATURE SENSORS ........................... 90

TABLE 3.14 CURRENT TRL AND MRL OF VARIOUS TEMPERATURE SENSORS ................................................... 94

TABLE 3.15 CURRENT TRL/MRL LEVELS FOR PULSE OXIMETRY ............................................................................... 98

TABLE 4.1 SUBSET OF BATTERY STANDARDS ................ 114 Table 4.2 – General Comparison of Energy Storage

Technologies ......................................................................... 115 TABLE 4.3 SUMMARY OF BATTERY INK PRINTING

METHODS .............................................................................. 117 TABLE 4.4. MAJOR PRIMARY BATTERY CHEMISTRIES .. 119


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TABLE 4.5 PRIMARY BATTERY MANUFACTURERS ......... 121 TABLE 4.6 - PRIMARY BATTERY LANDSCAPE – FHE

ASSEMBLED PRODUCT ....................................................... 122 TABLE 4.7 PRIMARY BATTERY LANDSCAPE – FHE

PRINTED INTEGRATION ..................................................... 123 TABLE 4.8 MAJOR SECONDARY BATTERY CHEMISTRIES

126 TABLE 4.9 SECONDARY BATTERY MANUFACTURERS ... 128 TABLE 4.10 SECONDARY BATTERY LANDSCAPE – FHE

ASSEMBLED PRODUCT ....................................................... 130 TABLE 4.11 SECONDARY BATTERY LANDSCAPE – FHE

PRINTED INTEGRATION ..................................................... 131 TABLE 4.12 ELECTROCHEMICAL CAPACITOR

MANUFACTURERS ............................................................... 135 TABLE 4.13 ECC LANDSCAPE – FHE ASSEMBLED PRODUCT

136 TABLE 4.14 ECC LANDSCAPE – FHE PRINTED

INTEGRATION ....................................................................... 137 TABLE 5.1 RFID FREQUENCIES AND APPLICATIONS ...... 154 Table 5.2: The frequencies of satellite communication ........... 155 TABLE 5.3 VARIOUS TYPES OF ANTENNA. ........................ 156 TABLE 5.4 COMPARISON OF SCREEN PRINTED ANTENNA

WITH DIFFERENT INKS AND DIFFERENT SUBSTRATES. 162

TABLE 5.5 COMPARISON OF INKJET AND AEROSOL JET PRINTED ANTENNA WITH DIFFERENT INKS AND ON DIFFERENT SUBSTRATES. ................................................. 165

TABLE 5.6 COMPARISON OF 3D PRINTER PRINTED ANTENNAS WITH DIFFERENT MATERIALS AND STRUCTURES. ....................................................................... 168

TABLE 5.7 COMPARISON OF DIRECT WRITING AND AEROSOL JET PRINTED ANTENNAS WITH DIFFERENT MATERIALS AND STRUCTURES. ....................................... 171

TABLE 5.8: SUMMARY OF LESS COMMON PROCESSES FOR ANTENNA FABRICATION. .......................................... 173

TABLE 5.9 PARTIAL LIST OF COMPANIES THAT PROVIDE THE SERVICES OF PRINTING ANTENNAS CURRENTLY. 175

TABLE 5.10: TRL AND MRL ASSESSMENT FOR PRINTED ANTENNAS. “2D” REFERS TO THE PRINTED ANTENNA WHILE FLAT WHEN IT IS IN USE. “2.5D” REFERS TO THE PRINTED ANTENNA WHEN BENT TO A CERTAIN RADIUS ON A SIMPLE CURVE DURING THE TIME OF USE. “3D” REFERS TO THE ANTENNA AS EITHER DIRECTLY PRINTED ON A RIGID 3D OBJECT OR BEING FORMED TO A RIGID 3D GEOMETRY. ...................................................... 177

TABLE 6.1 MINIATURIZED ELECTRODYNAMIC SPEAKER MANUFACTURERS............................................................... 189

TABLE 6.2 ELECTRODYNAMIC SPEAKER LANDSCAPE – FHE ASSEMBLED PRODUCT .............................................. 190

TABLE 6.3 ELECTRODYNAMIC SPEAKER LANDSCAPE – FHE PRINTED INTEGRATION ............................................ 190

TABLE 6.4 MINIATURIZED PIEZOELECTRIC SPEAKER MANUFACTURERS/MATERIAL SUPPLIERS ................... 193

TABLE 6.5 PIEZOELECTRIC SPEAKER LANDSCAPE – FHE ASSEMBLED PRODUCT ...................................................... 194

TABLE 6.6 PIEZOELECTRIC SPEAKER LANDSCAPE – FHE PRINTED INTEGRATION ..................................................... 194

TABLE 6.7 MEMS SPEAKER MANUFACTURERS .............. 196 TABLE 6.8 MEMS SPEAKER LANDSCAPE – FHE

ASSEMBLED PRODUCT ...................................................... 196 TABLE 6.9 MEMS SPEAKER LANDSCAPE – FHE PRINTED

INTEGRATION ....................................................................... 196 TABLE 7.1 AGGREGATOR WEBSITES FOR PV PRODUCTS

214 TABLE 7.2 SAMPLE SILICON CELL EFFICIENCY............... 214 TABLE 7.3 PATHWAYS TO MANUFACTURING BULK

CRYSTALLINE PV ENERGY HARVESTERS ...................... 215 TABLE 7.4 SAMPLE CIGS AND CDTE CELL EFFICIENCY 216 TABLE 7.5 CRYSTALLINE THIN FILM PV

MANUFACTURERS............................................................... 216 TABLE 7.6 PATHWAYS TO MANUFACTURING THIN FILM

PV ENERGY HARVESTERS ................................................. 218 TABLE 7.7 SAMPLE A-SI CELL EFFICIENCY....................... 219 TABLE 7.8 AMORPHOUS SILICON PV MANUFACTURERS

219 TABLE 7.9 PATHWAYS TO MANUFACTURING A-SILICON

PV ENERGY HARVESTERS ................................................. 220 TABLE 7.10 SAMPLE OPV CELL EFFICIENCY ...................... 221 TABLE 7.11 OPV MANUFACTURERS ..................................... 221 TABLE 7.12 PATHWAYS TO MANUFACTURING OPV

ENERGY HARVESTERS ....................................................... 223 TABLE 7.13 SAMPLE PEROVSKITE AND DSSC CELL

EFFICIENCY ........................................................................... 224 TABLE 7.14 PEROVSKITE PV RESEARCH ENTITIES .......... 225 TABLE 7.15 - PATHWAYS TO MANUFACTURING PEROVSKITE

PV ENERGY HARVESTERS ................................................. 225 TABLE 7.16 PV LANDSCAPE – FHE ASSEMBLED PRODUCT

227


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TABLE 7.17 PV LANDSCAPE – FHE INTEGRATED PRODUCT 228

TABLE 7.18 TEG COMPANIES AND RESEARCH INSTITUTIONS....................................................................... 234

TABLE 7.19 PATHWAYS TO MANUFACTURING TEG ENERGY HARVESTERS ....................................................... 237

TABLE 7.20 TEG LANDSCAPE – FHE ASSEMBLED PRODUCT 238

TABLE 7.21 TEG LANDSCAPE – FHE PRINTED INTEGRATION ....................................................................... 239

TABLE 7.22 AMBIENT VIBRATION SOURCES FOR KEH .... 242 TABLE 7.23 KEH COMPANIES AND RESEARCH

INSTITUTIONS....................................................................... 246 TABLE 7.24 PATHWAYS TO MANUFACTURING KEH

ENERGY HARVESTERS ....................................................... 247 TABLE 7.25 KEH LANDSCAPE – FHE ASSEMBLED PRODUCT

248 TABLE 7.26 KEH LANDSCAPE – FHE PRINTED

INTEGRATION ....................................................................... 249 TABLE 7.27 WIRELESS CHARGING TECHNOLOGY

SUPPLIERS ............................................................................. 253 TABLE 7.28 PATHWAYS TO MANUFACTURING WIRELESS

CHARGING ENERGY HARVESTER .................................... 254 TABLE 7.29 WIRELESS CHARGING LANDSCAPE – FHE

ASSEMBLED PRODUCT ....................................................... 255

TABLE 7.30 WIRELESS CHARGING LANDSCAPE – FHE PRINTED INTEGRATION ..................................................... 256

TABLE 8.1 COMPARISON OF ORGANIC SEMICONDUCTOR MADE BY DIFFERENT MATERIALS AND PROCESSES . 274

TABLE 8.2 CURRENT TRL AND MRL ASSESSMENT FOR OFET 278

TABLE 8.3 PERFORMANCE OF THINNING METHODS .... 280 TABLE 8.4 EFFECT OF THINNING METHODS ON WAFER

SURFACE ROUGHNESS AND DEFECTS, DATA FROM .. 281 TABLE 8.5 CURRENT MRL ASSESSMENT FOR WAFER

THINNING .............................................................................. 284 TABLE 8.6 LIST OF INTERCONNECTION METHODS ....... 290 TABLE 8.7 CURRENT MRL ASSESSMENT FOR

SEMICONDUCTOR INTEGRATION .................................... 296 TABLE 8.8 CURRENT MRL ASSESSMENT OF HIGH

PERFORMANCE SUBSTRATES ......................................... 297 TABLE 8.9 CURRENT MRL ASSESSMENT FOR

SEMICONDUCTOR INTEGRATION .................................... 305 TABLE 8.10 MRL LEVEL OF 3D ELECTRONICS.................... 308 TABLE 8.11 STANDARDS FOR PRINTED ELECTRONICS. ....... 312 TABLE 8.12 CURRENT TRL AND MRL ASSESSMENT FOR

FHE TESTING ........................................................................ 314

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