swa team meeting, july 2013

PAS progress/status. SWA Team Meeting, Rome, 23-25 July 2013

SWA Team Meeting, July 2013

PAS PROGRESS and STATUS

Outline:

1. PAS STM progressa. STM AITb. Physical propertiesc. STM planning

2. PAS EM Progressa. New model philosophy EM-1 and EM-2 b. IRAP FPGA progressc. Planning

3. Another PAS critical issues (to complete before CDR)a. PAS proto calibrationb. PAS/HIS ion optics modificationc. CEMs life time/Qualificationd. HV board progresse. Cleaning/Purging


SWA Team Meeting, Feb 2013

PAS PROGRESS and STATUS

Outline (continue):

4. PAS/HIS Alignment 5. PAS bracket6. PAS general planning


SWA Team Meeting, Feb 2013

PAS (HIS IRAP) team: Philippe Louarn (CoPI, Scientific leader)

Mechanics Design:Carine AmorosRomain Mathon

Electronics Design Instrument (Calibration, etc)

Henry Claude Seran (system and HV) Jean Rubiell RomeoRituparna Baruah (HV) Philippe RougerGuillaume Ortner (FPGA boss)Mathieu Petiot (FPGA, EGSE)Wilfried Marty (Sequencer, EGSE)Lubomir Prec (Prague, Detector board)

Quality and Administration Project manager and Instrument scientistSandra Bordon Andrey FedorovCatherina GaratGaelle Terrier


PAS STM progress

Good news: STM is completed and passed mechanical tests and physical properties measurements.

See the red tag smart cover sealing both entrances

Model Realization


PAS STM progress

Good news: STM is completed and passed mechanical tests and physical properties measurements.

Mechanical test. Macor washers have been replaced with Ti ones

MLI is installed


PAS STM progress

Physical properties measurements results:

External surface resistance measurements result:

Thermal shield surface to the grounding point: < 10 Ohm MLI surface to the grounding point: < 2 OhmWhite deflector housing: < 100 Ohm


Next step: Thermal Balance Test in ESTECContract: OK Feedthrough: will be delivered in August 2013Procedure: OKPredictive thermal analysis: OK

PAS STM progress

The test should be completed on 19 Oct 2013STM can be delivered to ASU on end of Oct. 2013


PAS EM progress

Due to very early EM delivery date, to keep the continuity in PAS electronics progress we have decided to make two EMs: EM-1 (deliverable) and EM-2 (for working with and perform most of the tests)

EM-1 EM-2 (with detectors to test functionality in the vacuum chamber)


PAS EM progress. FPGA

FPGA Board Schematics finished Place and route under

progress

Sequencer Software to edit, debug

and simulate the FPGA execution of the sequencer was done

Sequencer development is under progress High voltage sweeping

algorithm done Peak tracking, HK

development under progress


PAS EM progress. FPGA

FPGA Component EM : Does FPGA used is industrial or commercial quality? QM/FM : Explicit the philosophy and planning of burning and post

programming burning

FPGA board EM : How soldering the FPGA and is PCB?

FPGA interface Science packet encoding status?

Questions asked by the SWA team

Items for FPGA splinter :


PAS EM progress. FPGA and EM planning

Delivery of the first FPGA prototype is a critical point for the PAS progress

On October 2013 we will have two FPGA boards with no FPGA installed


Main EA properties as functions of the elevation angle

PAS Critical Issues. EA calibration/modification

The PAS/HIS calibration report is ready in the first (drafty) version.

Last simulation



Energy response EA properties as functions of the elevation angle



HIS G attenuation for different elevation angles



We have realized that the main part of the problem is coming from the top cap – analyzer interface. The top cap is too small and the electric field is quite different in the center and at the periphery, But particle entering at the periphery still can pass the analyzer. See the next slide.



If we make a ray tracing with the same conditions as the calibration, for 14° of elevation angle for instance, we will see that only periphery ions pass the analyzer while the central ions almost suppressed. They move at too low altitude and strike the inner sphere.



If we try to pull up the ions by Utopcap, it acts for only the central part of the beam. The whole profile is moving with Udefl value.

D=0.05 D=0.10



What to do:

1. Try to find the optimal voltage2. Change the deflector shape. It should be conical3. Try to change the size of the Top Cap4. Change the analyzer interplate distance

Questions:1. Whish variation of G(Elevation) is acceptable2. Does HIS need a variable GF?


PAS CEM life time / qualification

The small vacuum chamber for1. CEM life time tests2. HV boards testingis ready.HV board is the chamber (see photo)

But we still did not start the CEM testsDate: End of August


PAS ion optics HV board

HIS EA-IS HV board under calibration and test.Test at full voltage under dielectric liquidTest in vacuum with thermofoil heaters in preparation


PAS Cleaning and Purging

Sensitive Surface CEMs External Surfaces Aperture

Total Contamination (ppm) 71 263 299

1. Particulate contamination level

Prediction of contamination according to: (ECSS-Q-ST-70-01C)Where:M is the ISO class, c = 0,069 a constant from measurement , p = 0,72 a constant from measurementPAC prediction on sensitive surface:

2. Particulate contamination levelLaunch of a simulation with COMOVA to predict molecular contamination on sensitive surfaces

Cross view of PAS model used on simulation

Sensitive surface

Sensitive surface

Sensitive surface

CEMs

PAS Analyser

E-Box


PAS Cleaning and Purging

System TitleAnalysis DateEngineerNotes/ModificationsCONSTANTS UnitsTemperature °C 24,0

converted K 297,2Ambient Pressure Torr 760,0

converted Pa 101323,2PURGE & TARGET GASES

Purge Gas n2Target Gases h2o o2 hc

Diffusion Constant in Purge Gas sq-m/s 2,88349E-05 2,05888E-05 4,5993E-06Ambient RH or Concentration % 70% 21%Concentration ppm 20597 210000 100SYSTEM PARAMETERSEnclosed Volume L 5,2

cu-m 0,0052Orifice Area / Length Orifice 1 Orifice 2 Orifice 3 Orifice 4 Orifice 5Entries / scratch areas for area and length calculation

Orifice Diameter mm 4

Area (sq-m) sq-mm 12,56637061 13,004 8,15Length mm 1 10 10

Calculated / Converted to SI units

Area sq-m 1,25664E-05 1,3004E-05 0,00000815Length m 0,001 0,01 0,01

Area / Length m 0,012566371 0,0013004 0,000815∑A/L m 0,014681771Outlet Flow Velocity (from selected flow)Selected Purge Flow SLPH 5,2Outlet Gas Velocity m/s 0,04 0,04Reynolds number 5,6 5,7

Solar Orbiter PAS purge flow28/08/2012Jean Rubiella Romeo

Required flow rate: 5.2 SLPH

Maximum allowable purge interruption:

40 minutes

Purge gas: Zero grade nitrogen

Minimum period between purge interruptions:

25 minutes

PAS Purging

Calculations based on G. Ucker model

Input parameters in table here opposite

PAS purging requirements on table here below:


PAS/HIS alignment

1. The goal: we have to avoid a direct steady state sun light on any internal part of the sensor (see next slide)

2. The maximal possible steady state sun light ray deviation is 4.5°. This value includes:- EIDA R-140: 3.5° steady state off pointing- 1° solar radius at 0.28au

3. We assume that PAS/HIS fixation plane uncertainty (deviation of the line of intersection of S/C YZ plane and the fixation plane form S/C X axis) is +/- 0.25° (EIDA R-074, communication with Erik (if I understood him correctly). -> see next page


PAS/HIS alignment

4. We assume that we can provide an alignment inside the instrument +/- 0.25°. This is an uncertainty between PAS fixation plane and the PAS entrance axis. Thus we have 4.5° + 0.25° + 0.25° = 5° total possible deviation of the sun light from the instrument X axis.5. According these assumption the PAS/HIS sensor design was made as it is shown below. We have 10° free area to pass any possible steady state sun rays.6. ASTRIUM :

a. Agree to make a interface plate according to our spec.b. Demands to prove the X axis alignment when the instrument is bolted. HO TO DO

THIS?c. Telecon 30th of July. We have to give an answer.


PAS interface bracket

PAS bracket IRD and CAD do not conform to PAS in many aspects including the vertical position of PAS, URF etc


PAS interface bracket

The mechanical interface is completely wrong.


PAS planning

EM:1. EM-1: All boards and mechanics are ready to assembly: Nov 29, 20132. EM-1: Ready for delivery (real delivery depends on DPU EM) Jan 2 2014

FM HIS parts:3. FM HIS EA mechanics design ready Nov 2013 (TBC)4. FM HIS EA ready to delivery Mar or Apr 2014 (TBC)5. HV board is ready for delivery Apr 2014

FM PAS:6. New EA design: Sep 2013 (optimistic)7. PAS FM is ready for AIT Jun 20148. PAS FM calibration Sep 20149. Other tests Jan 201510. PAS FM delivery Jan 2015 (optimistic)

swa team meeting, july 2013

Documents

progress pas progressstatus

pas electronics

pas em progressdue

ohm pas progressstatus

pas stm progressgood

ok pas stm progressthe

irap team

tests em