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Elan Smart-KeyboardTM

eSK-R30B-X

Windows Windows Windows Windows 8888 TouchPad TouchPad TouchPad TouchPad SupportSupportSupportSupportssss for for for for MultiMultiMultiMulti----TouchTouchTouchTouch Gesture Gesture Gesture Gesture

Solution Specification

DOC. VERSION 1.3

ELAN MICROELECTRONICS CORP. Jan. 2013

Trademark Acknowledgments: IBM is a registered trademark and PS/2 is a trademark of IBM. Windows is a trademark of Microsoft Corporation.

ELAN and ELAN logo are trademarks of ELAN Microelectronics Corporation.

Copyright © 2009 by ELAN Microelectronics Corporation All Rights Reserved Printed in Taiwan The contents of this specification are subject to change without further notice. ELAN Microelectronics assumes

no responsibility concerning the accuracy, adequacy, or completeness of this specification. ELAN

Microelectronics makes no commitment to update, or to keep current the information and material contained in

this specification. Such information and material may change to conform to each confirmed order.

In no event shall ELAN Microelectronics be made responsible for any claims attributed to errors, omissions, or

other inaccuracies in the information or material contained in this specification. ELAN Microelectronics shall

not be liable for direct, indirect, special incidental, or consequential damages arising from the use of such

information or material.

The software (if any) described in this specification is furnished under a license or nondisclosure agreement, and

may be used or copied only in accordance with the terms of such agreement.

ELAN Microelectronics products are not intended for use in life support appliances, devices, or systems. Use of

ELAN Microelectronics product in such applications is not supported and is prohibited.

NO PART OF THIS SPECIFICATION MAY BE REPRODUCED OR TRANSMITTED IN ANY FORM OR BY

ANY MEANS WITHOUT THE EXPRESSED WRITTEN PERMISSION OF ELAN MICROELECTRONICS.

ELAN MICROELECTRONICS CORPORATION

Headquarters:

No. 12, Innovation Road 1

Hsinchu Science Park

Hsinchu, Taiwan 30077

Tel: +886 3 563-9977

Fax: +886 3 563-9966

http://www.emc.com.tw

Hong Kong:

Elan (HK) Microelectronics

Corporation, Ltd. Flat A, 19/F, World Tech Centre

95 How Ming Street, Kwun

Tong

Kowloon , HONG KONG

Tel: +852 2723-3376

Fax: +852 2723-7780

[email protected]

USA:

Elan Information

Technology Group (U.S.A.)

1821 Saratoga Ave., Suite 250

Saratoga, CA 95070

USA

Tel: +1 408 366-8225

Fax: +1 408 366-8220

Shenzhen:

Elan Microelectronics

Shenzhen, Ltd.

SSMEC Bldg., 3F, Gaoxin S. Ave.

Shenzhen Hi-Tech Industrial Park

Shenzhen, Guandong, CHINA

Tel: +86 755 2601-0565

Fax: +86 755 2601-0500

Shanghai:

Elan Microelectronics

Shanghai , Ltd.

23/Bldg. #115 Lane 572, Bibo Road

Zhangjiang Hi-Tech Park

Shanghai, CHINA

Tel: +86 21 5080-3866

Fax: +86 21 5080-4600

Contents

Solution Specification (V1.3) 2013.01.25 •••• iii

1. General Description _____________________________________________________1

2. Features ______________________________________________________________1

3. System Block Diagram___________________________________________________2

4. Schematic Diagram _____________________________________________________3

5. Main Components List___________________________________________________5

5.1 MCU package type __________________________________________________6

6. Touchpad Specifications ________________________________________________15

6.1 Touchpad Orientation ______________________________________________15

6.2 Pin Assignment ___________________________________________________16

6.3 Mechanical Drawing _______________________________________________17

6.4 Mounting Recommendations_________________________________________20

7. Keyboard Matrix ______________________________________________________21

8. Support Gestures Behavior ______________________________________________22

9. Ten key function_______________________________________________________23

10. Power Management ____________________________________________________24

11. The LED indicator _____________________________________________________25

12. Manual Syncing Steps __________________________________________________25

Contents

iv •••• Solution Specification (V1.3) 2013.01.25

Specification Revision History

Doc. Version Revision Description Date

1.0 Preliminary Specification 2012/07/19

1.1 Updata dongle circuit 2012/08/20

1.2 Additional the LED indicator and Manual syncing step described

2012/11/26

1.3 Modify RF ciruit 2013/01/25

Smart-Keyboard eSK-R30B-X

Solution Specification (V1.3) 01.25.2013 •••• 1 (This specification is subject to change without further notice)

1. General Description The Smart-Keyboard is a keyboard-touchpad hybrid meant to improve the experience of

using a keyboard attached to a computer as an input device. The Smart-Keyboard allows the

user to control a mouse cursor, enter numeric text, and perform Windows 8 multi-touch

without the need for a touch screen panel.

The touchpad has two distinct features: the first is that the touchpad is behaved as a multi-

touch input device which performs Windows 8 multi-touch as well; the second feature is that

the touchpad can sends graphical keypad characters out which are printed on the touchpad.

2. Features Wireless Keyboard with built-in touchpad

Integrated Touchpad plus 2 mouse buttons

Touchpad Support:

- Windows 8 Multi-Touch

- Mouse cursor

- Ten-Key function

Capacitive sensing technique (Elan registered patent *)

Contact count: Up to 2 fingers

USB Specification Compliance

- USB Specification Version 2.0 for low-speed requirements

- USB Device Class Definition for Human Interface Device (HID) Version 1.11

2.4GHz wireless transmission

Report rate: 90/sec


2 •••• Solution Specification (V1.3) 01.25.2013 (This specification is subject to change without further notice)

3. System Block Diagram

~ Figure 3-1: Smart-Keyboard System Block Diagram ~



4. Schematic Diagram Remote terminal with RF circuit:

~ Figure 4-1a: Smart-Keyboard system schematic diagram ~

U1

EM

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Dongle terminal:

~ Figure 4-1b: USB dongle schematic diagram ~

RF

_C

E

TP

6P

54

C9

22P

/0402

GN

D

C13

150pF

/0402

C1

*/0402

RF

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R

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R6

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I



5. Main Components List

Component Part No. Note

Keyboard

Control MCU EM78P451SAQ

Touchpad 83A871-XX11

RF Transceiver EM198860AW

Dongle

USB MCU EM78P611GAW

RF Transceiver EM198860AW

~ Table 5-1: Smart-Keyboard main component list ~



5.1 MCU package type

• 44-pin QFP : EM78P451SAQ

CLK

DA

TA

/IN

T

VS

S

OS

CO

R-O

SC

I V

DD

NC

NC

NC

P70/R

ES

ET

•• ••

44

43

42

41

40

39

38

37

36

35

34

P90 1 33 P71

P91 2 32 P72

P92 /SDI 3 31 P67

P93/SDO 4 30 P66

P94/SCK 5 29 P65

P95/SS 6 EM78P451SAQ 28 P64

P50 7 27 P63

P51 8 26 P62

P52 9 25 P61

P53 10 24 P60

P54 11 23 P87

12

13

14

15

16

17

18

19

20

21

22

P55

P56

P57

P80

P81

NC

P82

P83

P84

P85

P86

~ Figure 5-1a: 44-pin QFP EM78P451SAQ ~

~ Figure 5-1b: 44-pin QFP package information ~



~ Figure 5-1c: EM78P451SAQ 44-pin QFP Bonding Pad Diagram ~



EM78P451S 44-pin QFP PAD List

Chip Size :1650µm* 2250

Pad No. Sym. X Y Pad No. Sym. X Y

1 P90 -691.0 1015.0 23 P87 715.0 -960.5

2 P91 -715.0 89.5 24 P60 715.0 -855.5

3 P92/SDI -715.0 -15.5 25 P61 715.0 -750.5

4 P93/SDO -715.0 -120.5 26 P62 715.0 -645.5

5 P94/SCK -715.0 -225.5 27 P63 715.0 -540.5

6 P95//SS -715.0 -330.5 28 P64 715.0 -435.5

7 P50 -715.0 -435.5 29 P65 715.0 -330.5

8 P51 -715.0 -540.5 30 P66 715.0 -225.5

9 P52 -715.0 -645.5 31 P67 715.0 -120.5

10 P53 -715.0 -750.5 32 P72 715.0 -15.5

11 P54 -715.0 -855.5 33 P71 715.0 89.5

12 P55 -715.0 -960.5 34 P70 407.6 1015.0

13 P56 -421.8 -1015.0 35 - - -

14 P57 -316.8 -1015.0 36 - - -

15 P80 -211.8 -1015.0 37 - - -

16 P81 -106.8 -1015.0 38 VDD 302.5 1015.0

17 - - - 39 R-OSCI 197.6 1015.0

18 P82 -1.9 -1015.0 40 OSCO -152.8 1015.0

19 P83 103.2 -1015.0 41 VSS -257.8 1015.0

20 P84 208.2 -1015.0 42 /INT -362.8 1015.0

21 P85 313.2 -1015.0 43 DATA -471.1 1015.0

22 P86 418.1 -1015.0 44 CLK -582.7 1015.0



• 24-pin QFN : EM78P611G

P65

P64

P63

P62

P61

P60

•• ••

24

23

22

21

20

19

P77 1 18 P82

VDD 2 17 P81

OSCI 3 EM78P611G 16 P57

OSCO 4 15 P56

VSS 5 14 P55

V3.3 6 13 P54

7

8

9

10

11

12

D+

D-

P92

P93

P94

P53

~ Figure 5-1d: 24-pin QFN EM78P611GAW ~

~ Figure 5-1e: 24-pin QFN package information ~



~ Figure 5-1f: EM78P611G 24-pin QFN Bonding Pad Diagram ~



• EM198860 uses the QFN20 4x4 package

EM198860

1

2

3

4

5

6 7 8 9 10

20 1819 17 16

15

14

13

12

11

CE

CSN

MISO

IRQ

VDD3RX

VSSPA

RFN

REP

VDDPA

VD

D3B

VS

S3A

XT

AL

P

XT

AL

N

DV

SS

CD

VD

D

VD

D3IF

VS

SIF

IRE

F

SCK

MOSI

~ Figure 5-1g: EM198860 QFN20 4x4 pin assignment

~ Figure 5-1h: 20-pin QFN package information ~



~ Figure 5-1i: EM198860 20-pin QFN Bonding Pad Diagram ~



Chip Size : 80*67µm

Pad No. Sym. X Y Pad No. Sym. X Y

1 VDDPA 13.6 1527.875 11 DVSS 1433.955 25.925

2 RFP 13.6 1156.425 12 CE 1447.975 127.925

3 RFN 13.6 1054.425 13 CSN 1447.975 229.925

4 VSSPA 13.6 886.125 14 SCK 1447.975 1319.625

5 VSSPA 13.6 792.625 15 MOSI 1447.975 1421.625

6 VDD3RX 121.975 13.6 16 MISO 1447.975 1523.625

7 IREF 491.725 13.6 17 IRQ 1136.875 1592.9

8 VSSIF 593.725 13.6 18 VDD3B 1034.875 1592.9

9 VDD3IF 699.975 13.6 19 VSS3A 864.875 1592.9

10 CDVDD 1201.475 13.6 20 XTALP 762.875 1592.9

21 XTALN 660.875 1592.9



6. Touchpad Specifications

6.1 Touchpad Orientation

The orientation of the TouchPad is shown as follows. The connector part number is P-

TWO 196087-10021-1 or equivalent device (10PIN /1.0mm). For more information

about the connector, see the manufacturer’s specification.

Figure 6-1 TouchPad Orientation



6.2 Pin Assignment Pin # 1 2 3 4 5 6 7 8 9 10

Signal VCC GND BTN1 BTN2 BTN3 /INT SDI

(MOSI)

SDO

(MISO) SCK /SS

Connector type: P-TWO 196087-10021-1 10 pins connector or equivalent, pitch is 1.0

± 0.10 mm.

Pin Assignment Description

Pin Signal I/O Description

1 VCC Power VCC

2 GND Ground Ground

3 BTN1 I

Physical Button Input # 1, active low.

The BTN1 is connected to Vcc through a 66 KΩ resistor

inside the TouchPad controller.

4 BTN2 I

Physical Button Input # 2, active low.


inside the TouchPad controller.

5 BTN3 I

Physical Button Input #3, active low.


inside the

6 /INT O I Interrupt, active low, indicates that the Smart-Pad

TM is

ready to send data

7 SDI

(MOSI) I

Master out, Slave in.

Data from host to Smart-PadTM

.

8 SDO

(MISO) O

Master in, Slave out

Data from Smart-PadTM

to host.

9 SCK I SPI clock in

10 /SS I Slave select in



6.3 Mechanical Drawing

Physical Specification:

Overall PCB

Dimension

Width 107.70 mm

Height 71.05 mm

Active Area Width 104.1 mm

Height 67.50 mm

Thickness Please refer Table2.1

Module Drawings (Unit: mm) :

Figure 6-2 Top View

NOTE

1. PCB dimensional tolerances are ±0.3mm.



Bottom view(Unit: mm) :

Figure 6-3 Bottom View

NOTE

1. PCB dimensional tolerances are ±0.3mm.

2. Component area tolerances are ±0.05mm

3. We suggest that using system holders strengthen the Smart-PadTM

PCB

stability.

Put the system holder (it should be an insulator) to aim at the center of holder

area, moreover the diameter of the holder area is 10mm.

Figure 6-4 Side View with CONNECTOR + PCB + Adhesive



Figure 6-5 Side View with CONNECTOR + PCB + Mylar

NOTE

1. PCB dimensional tolerances are ±0.15mm

2. Component height tolerances are ±0.05mm

3. Adhesive thickness tolerance is ±0.02mm

4. Mylar thickness tolerance is ±0.02mm

5. Maximum bending radius=0.86 mm

6. Maximum height (CONNECTOR + PCB + ADHESIVE+) = 2.71mm

7. Maximum height (CONNECTOR + PCB + Mylar+) = 2.80mm



6.4 Mounting Recommendations

a. Mounting Method

The Smart-PadTM

should be supported near its 4 corners. The ideal case is

supported all around the perimeter.

A plastic bezel on top should have an opening that should extend inward

from the left and right edges by 1.2 ± 0.2 mm, and from the top and bottom

edges by 1.2 ± 0.2 mm. The ± 0.2 mm tolerance includes both the tolerance

for the size of the bezel opening and the tolerance for the alignment of the

bezel to the Reference Edges of the Smart-PadTM

.

The bezel should be non-conducting. If the bezel is conductive materials,

the insulator needs to be installed between the Smart-PadTM

and the bezel.

The insulator might be carved to contain the conductive materials for providing the

chassis grounding to enhance the ESD performance.

b. Keep Out Area

The “component area” is specified in the mechanical drawing. No part (from host) is

recommended to be placed in this area.

c. Mounting for ESD

For good ESD performance, a metallic mounting bracket or gasket could be used

between the computer chassis and the frame ground ring of the Smart-PadTM

.

Touchpad with a ground ring can be connected to ground for improving the ESD

performance. The conductive shield should remain outside the active area of the

Touchpad.

For the specified ESD performance, it is required to connect one or more of the

Ground pads on the Smart-PadTM

to the chassis ground of the host. This connection

should be done by means of a short wire with a minimum of 1 mm thickness, metallic

bracket, gasket or equivalent material.



7. Keyboard matrix

R0,P60,24 R1,P61,25 R2,P62,26 R3,P63,27 R4,P64,28 R5,P65,29 R6,P66,30 R7,P67,31

S0 Pause Power Sleep Ctrl-R Wake up Ctrl-L F5

P85,21 /Stop

S1 Q Tab A Esc Z N-CHG ` ( ~ ) 1 ( ! )

P70,34 (K131)

S2 W Cap S K45 X CHG F1 2 ( @ )

P71,33 (K132) /WWW Home

S3 E F3 D F4 C Roma F2 3 ( # )

P50,7 / Media / Play/Pause (K133) / E-mail

S4 R T F G V B 5 ( % ) 4 ( $ )

P51,8

S5 U Y J H M N 6 ( ^ ) 7 ( & )

P52,9 4 ( K ) 1 ( K ) 0 ( K ) 7 ( K )

S6 I ] ( ) K F6 , ( < ) K56 + ( = ) 8 ( * )

P53,10 5 ( K ) 2 ( K ) /PreTrack 8 ( K )

S7 O F7 L . ( > ) APP F8 9 ( '(' )

P54,11 6 ( K ) /NextTrack 3 ( K ) . ( K ) /Volume- 9 ( K )

S8 P [ ( ) ; ( : ) ' ( " ) K42 / ( ? ) _ ( - ) 0 ( ')' )

P83,19 - ( K ) + ( K ) / ( K ) *( K )

S9 Scroll FN Alt-L Mode Alt-R Print

P84,20

S10 K14 Backspace \ ( | ) F11 Enter F12 F9 F10

P82,18 /Num /Scroll /Volume+ /Mute

S11 7 4 1 Space Num ↓↓↓↓ Del Power

P80,15 (K) (K) (K) /Page down /INS

S12 8 5 2 0 / →→→→ Ins Sleep

P57,14 (K) (K) (K) (K) (K) /End / APP

S13 9 6 3 . * - Page up Page down

P56,13 (K) (K) (K) (K) (K) (K)

S14 +(K) K107 Enter(K) ↑↑↑↑ Play/Pause ←←←← Home End

P55,12 /Page up /Home

S15 Wake up Shift-L Shift-R Volume- Volume+ Next Track Pre Track Media

P81,16

S16 E-mail Win-L WWW WWW WWW WWW Mute WWW

P86,22 Forward Stop Back Refresh Search

S17 K150 WWW Win-R My Stop Calculator WWW K151

P87,23 (KR-L) Favorites Computer Home (KR-R)



8. Support Gestures Behavior

The Smart-TouchTM

supports various multi-finger taps and gestures to perform various

functions. The related gesture information for Windows 8 are shown in the following table.



9. Ten key function After power on, the eSK-R30 will go into the ten key mode, and the touchpad function

will be switched by the mode key. The mode switched condition as the follow table.

Function key Without driver

Mode Ten key ＜＝＞ Mouse (mode switch)

table 9-1 The mode condition of the ten key function.

Function descript:

1. Support the one key used.

2. Invalid action to the finger slide. When the finger slide , ten key function will keep the first

key data to output.

3. When button deep press and will only send a set of keys, until the finger release.

4. When more than two finger touch, the key will be set by touchpad sensor area.

5. If finger touch the out of key shape region, there will be one of the key happened, the

operating condition must be avoided.

*

7 9

5

1 3

/ +

8

4 6

2

0 Enter.

-

~ Figure 9-1 The ten key of graph paper ~



10. Power Management The Smart-Keyboard has automatic managerial function of saving power in each

mode to extend battery life.

There are three defined stages — Operating mode, Standby mode, and sleep mode.

Operating mode：When the fingers touch the touchpad to do gestures function.

Standby mode：After 1 second of no activity in Operating mode, the Smart-

Keyboard then goes into Standby mode.

Sleep mode：After 10 seconds of no activity in Standby mode, the Smart-

Keyboard then goes into Sleep mode.

Deep sleep mode：After 12 minutes of no activity in Sleep mode, the Smart-

Keyboard then goes into Deep sleep mode.

As per the Standby modes, any buttons, keys, touchpad motion will send the system

back to Operating mode.

The current measure as the below:

Test Condition: T = 25ºC, VDD=3.3V, VSS=0V,without DC-DC

mode Min. Typ. Max. Unit Remarks

Operating mode - 5.0 mA

Standby mode - 1.32 - mA

Sleep mode - 390 uA

Deep sleep mode 240 uA



11. The LED indicator

（1） Low voltage detect:

When low power happened and the keyboard activity, the LED indicator on the

keyboard will flash for 500ms with 6 times.

（2） Switch into binding mode:

The LED indicator on the keyboard will flash per 1s during 30s in binding mode.

12. Manual Syncing Steps

（1） Press connect button on the keyboard, the keyboard will get into binding mode

and the LED indicator on the keyboard will flash per 1 seconds.

（2） Insert the USB Dongle into an available USB port or USB HUB. The Dongle will

get into binding mode immediately and the LED indicator on the Dongle will flash

per 1 seconds. If you have completed the keyboard linkage successfully, the LED

indicator of the Dongle will go out immediately and work. If not, repeat the step

above step.

（3） If the keyboard and Dongle get into binding mode at the same time, and don’t

complete linkage between the keyboard and Dongle after time out (Keyboard

maximum time out = 30 seconds, Dongle maximum time out = 5 seconds) or

unplug Dongle during the binding mode in 5 seconds, the keyboard will use the

last linked successfully ID.

（4） When insert the Dongle to the USB port or USB HUB again, the Dongle will get

into binding mode. If the Dongle receives data from keyboard of the last

successfully completed link ID during 5 seconds, the Dongle will return to

operating mode.

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