superior performance. powerful technology. - home · pdf file · 2018-03-11superior...

superior performance. powerful technology.

SuperPower Inc. is a subsidiary of Furukawa Electric Co. Ltd.

2015 Technology and Manufacturing Innovations at SuperPower

2015 SuperPower Update All Rights Reserved. Copyright SuperPower® Inc. 2015

Outline

• Super Power (SP) history & background • General structure of 2G HTS • Electrical properties (Ic vs. B & T) • Insulation • Mechanical properties • New initiatives

– 15% Zr additions – 30µm substrates – In-situ insulation

• Applications case studies • Pricing and delivery

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One Furukawa: offering both LTS and HTS solutions

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Three core materials across five business segments

Metals Photonics

Metal Polymer

Telecommunications

Energy/Industrial Products:

Electronics/Automotive

Systems

Light Metals

CORPORATE PHILOSOPHY Drawing on more than a century of expertise in the development and fabrication of advanced materials, we will contribute to the realization of a sustainable society through continuous technological innovation.


Furukawa has a long history in LTS

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HIGH TECHNOLOGY Sophisticated metal composite technology

CUSTOMIZATION Various conductor designs satisfy customer demands

HIGH QUALITY High-precision cabling technology

NbTi wire with various Cu ratio & filament sizes

Low ac loss NbTi wire

High Jc Nb3Sn wire High strength Nb3Sn wire

Al-stabilized NbTi Rutherford cable NbTi Rutherford cable with cored bar

NbTi Rutherford cable with high-precision

Al-stabilized NbTi wire


SuperPower’s history as a 2G HTS industry leader

• 2000-2006: The Intermagnetics Years – SuperPower formed from the Technology Development Organization of

Intermagnetics – 2G HTS technology development – Production scale-up – Demonstration projects – energy focus

• 2006-2012: The Philips Years – Transition from scale-up to commercialization – Exploration of a wide range of commercial markets – Buildup of a broad customer base

• From 2012 onward: The Furukawa Years – Continuous manufacturing improvements over established baseline

capabilities … to address market needs – Steady expansion of production to meet market requirements – Focus on long-term sustainability in a slowly evolving market

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2G HTS wire has been produced at the manufacturing facility since 2006

MOCVD Substrate Electropolishing

Buffer Sputtering

IBAD


Technology benefits for our customers today

• High Ic : >450A standard (12 mm width; 77K, 0T) • Uniform Ic over long lengths: STDEV +/- 10%

– Good, repeatable bandwidth – Good 2D uniformity (across width)

• High engineering current density: – Very thin substrates and stabilizers

• Chemistry: – Currently two formulations

• AP (Advanced Pinning) – enhanced performance for in-magnetic field applications

• CF (Cable Formulation) – 77K, low fields (cable, FCL, transformer)

• Flexible, robust architecture: – Multiple widths and thicknesses (substrate, stabilizers)

• Superior mechanical properties: – Yield strength 550 MPa and higher with superalloy-based

coated conductors – Excellent joints and solderability

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• Hastelloy® C276 substrate • high strength • high resistance • non-magnetic

• Buffer layers with IBAD-MgO • Diffusion barrier to metal substrate • Ideal lattice matching from substrate through

REBCO

• MOCVD grown (RE)BCO layer with BZO nanorods • Flux pinning sites for high in-field Ic

• Silver and copper stabilization

SuperPower’s (RE)BCO superconductor with artificial pinning structure provides a solution for demanding applications

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< 0.

1 m

m

20µm Cu 50µm Hastelloy

20µm Cu


Each layer serves a function…. • Substrate (Hastelloy® C-276) – provides mechanical strength,

electropolished base for subsequent layer growth • Buffer stack provides:

– Diffusion barrier between substrate and superconductor – IBAD MgO layer provides texture template for growing aligned

superconductor, necessary for high current density – Final buffer layer provides lattice match between buffer stack and

superconductor • HTS superconductor layer – (RE)BCO superconductor with BZO

based pinning sites for high current carrying capability in background magnetic field

• Ag layer – provides good current transfer to HTS layer while providing ready oxygen diffusion path during final anneal

• Cu layer – provides stabilization (parallel path) during operation and quench conditions

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IcBT improvements

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Recent step wise improvements to meet market challenges

• Critical current – Recent advances in processing have significantly increased the

base Ic (77K, sf) of SP 2G HTS tapes into the 400-600 A/cm-w range

• Piece length – Recent advances in processing have also increased the stable

production piece length of SP 2G HTS tapes >500m • Current density

– SP 2G HTS tapes have the highest conductor Jc’s in the industry – New initiatives will maintain this performance advantage

• Thinner substrates (>30% Jc improvements) • Improved lift factors (2x +) with enhanced pinning

• Pricing – Improved yields improve costs – Review of pricing structure to facilitate competitive pricing

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Critical current vs. field: standard 7.5% Zr AP

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Measurements made at Tohoku University

4 mm-w


Lift factor vs. field: standard 7.5% Zr AP

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Critical current vs. field: enhanced 7.5% Zr AP

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4 mm-w


Lift factor vs. field: enhanced 7.5% Zr AP

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Critical current comparison: standard vs. enhanced

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4 mm-w


Lift factor comparison: standard vs. enhanced

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IcBT typical data

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IcBT vs. angle

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4 mm-w


Ic uniformity along length (TapeStar)

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Position (m)(on a 12 mm wide wire)

• Magnetic, non-contact measurement • High spacial resolution (?? mm), high speed, reel-to-reel • Monitoring Ic at multiple production points after MOCVD • Capable of quantitative 2D uniformity inspection

M4-288-6


Good 2D uniformity achieved across the width!

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Mechanical properties

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Comprehensive testing capabilities for mechanical and electromechanical properties

• Axial tensile test at room temperature or at 77K (with Ic) − Measurement of elastic modulus and yield stress − Determination of critical stress and irreversible stress (strain)

• Measurement of delamination strength – various testing methods − Peel test: at room temperature and with varying peeling angle − Pin-pull (c-axis tensile) test: at room temperature − Anvil (c-axis tensile) test: at room temperature or at 77K (with Ic)

• Transverse (c-axis) compressive test at 77K (with Ic) − Measurement of critical compressive stress

• Torsion-tension test at 77K (with Ic) − Measurement of critical tensile stress under twist

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Studies on mechanical/electromechanical properties • Mechanical behaviors under various stress conditions at RT and/or 77K • Electromechanical testing for stress (strain) dependence of Ic at 77K • Electromechanical strength determined by critical stress with 95% Ic retention

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Axial tensile RT or 77K w/ Ic

Transverse tensile Stud method

RT or 77K w/ Ic

Fixture for mechanical/electromechanical testing Normalized Ic vs. axial tensile stress for

2015 SuperPower Update All Rights Reserved. Copyright SuperPower® Inc. 2015 25

Studies on mechanical/electromechanical properties

Transverse tensile Pin-pull method

RT

Transverse tensile Anvil method RT or 77K

Weibull analysis results – anvil test

90° Peel test, RT


77K

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Tensile property of wire without stabilizer • Tensile stress-strain relationship (RT & 77K) and Ic vs. tensile stress

relationship (77K) measured on tape without Ag and Cu (processed up to (RE)BCO only. Hastelloy substrate thickness = 50 µm)

• σc,0.95≈800MPa, εc,0.95≈0.45%


Tensile property of various wires

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• Tensile stress-strain relationship measured at RT and 77K

RT 77K



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• Ic vs. tensile stress relationship at 77K

For wires on 50µm Hastelloy Substrate



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• Ic vs. tensile strain relationship at 77K

For wires on 50µm Hastelloy Substrate

0.45%


Effect of Cu/Substrate thickness ratio on σc,0.95 • Comparison of four wires on 50 µm thick substrate • E0.45, which is the chord modulus in between 0% and 0.45% strain, depends

on Cu/substrate thickness ratio • While εc,0.95 is a constant of about 0.45%, σc, 0.95 depends on E0.45

0.45%

77K



New initiatives

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New Initiatives being transitioned from R&D to production

• 15% Zr additions • 30 micron substrate • Bonded tapes • Insulation options

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15% Zr additions

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TEM analysis for enhanced Zr doping

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Zr = 7.5%

Size : 4.4~6.2nm Distance : 20.8~26.8nm

Zr = 11.5%

Size : 4.4~5.6nm Distance : 16~20.7nm

Zr = 15%

Size : 4.4~5.6nm Distance : 12.8~18.3nm


Trend of BZO rod

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0

1

2

3

4

5

6

7

0 5 10 15 20

BZO

size

[nm

]

Zr doping ratio [%]

• The BZO rod size is almost in the same range • Distance of BZO rods decreases with increasing Zr doping ratio

0

5

10

15

20

25

30

35

0 5 10 15 20

BZO

dis

tanc

e [n

m]

Zr doping ratio [%]


Ic performance with Zr = 15% at 50K

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• Enhanced Zr doping samples promise high Ic performance

0

50

100

150

200

250

300

350

400

-20-100102030405060708090100110

Ic [A

/4m

m-w

]

angle [theta]

Zr = 15%

Ic-theta at 50K

2T

5T

0

100

200

300

400

500

600

700

800

0 1 2 3 4 5 6 7 8 9 10

Ic[A

]

B[T]

Ic at 50K-B//c

ProductionProductionProductionR&D for Zr=7.5%R&F for Zr=15%R&D


In-field performance at 30K/2T

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• Enhanced Zr doping samples promise high Ic performance

0 100 200 300 400 500 600 700 800 900

1000

-10 0 10 20 30 40 50 60 70 80 90 100

Ic [A

/4m

m-w

]

angle [theta]

Zr=15%Zr=7.5%


Ic-B performance at various temperature

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• Zr enhanced sample show high Ic performance under 50K

1

10

100

1000

10000

1 10 100

Ic [A

] at 4

mm

W

B [T]

Zr=15%, 4.2K

Zr=15%, 20K

Zr=15%, 50K

Zr=15%, 77K

Zr=7.5%, 4.2K

Zr=7.5%, 20K

Zr=7.5%, 50K

Zr=7.5%, 77K

B//c

4.2K

20K

50K

77K

17T

HF inserts/ HEP magnets

Motors & generators

Maglev


Ic performance vs. axial position on tape with Zr = 15%

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• 130m length with Zr = 15% • Ic ~400A at 77K/sf


Long tapes with Zr = 15%

• Further work is underway before official release of Zr enhanced wires – Repeatability of Ic performance at 20~50K and 2T thru 5T – Dispersion of Ic performance – Mechanical property

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30 micron substrate

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Improved Je (engineering current density) wire with thinner substrate

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• Existing products based on either 50 or 100 µm Hastelloy® substrate • For wire with 50 µm substrate and 40 µm Cu, the total thickness is ~ 0.095 mm • Wires with thinner substrates (38, 30 and 25 µm) are being developed

• For standard Cu thickness of 40 µm total on a 30 µm Hastelloy® substrate, conductor thickness is reduced to ~75 µm

• This implies a 27% increase in engineering current density (Je)

Baseline wire is on 50µm substrate and with 40µm Cu


Tensile testing of thinner substrate • RT tensile testing of 1.2mil (30µm) thick substrate • Yield stress (σ0.2) and elastic modulus (E) measured and compared with

2.0mil (50µm) thick substrate

Vendor Specification Properties

Measured Properties σ0.2 (MPa) E (GPa)

HPM12096ACC1-1

1545.9 173.1

ESM179158-CD3

1538.1 176.7

ESM179158-D1

1523.7 175.5

ESM179158-MC2

1523.9 179.4

ESM179158-MC4

1524.2 175.1

50µm

30µm

30µm

30µm

σ0.2 (MPa) E (GPa)HPM 1516.8 205.5ESM 1461.7 X30µm

50µm

30µm

50µm 30µm-CD3 30µm-D1 30µm-MC2 30µm-MC4



Bonded tapes

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Bonded tapes tailored for various applications

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• Bonded tape provide benefits with higher Ic, higher mechanical strength, tailored normal state resistivity, and/or improved stability

• A fully automated system has been built for fabrication of multiple tape bonded wire

• Variation in architecture – material and number of tapes, orientation

X-ray inspection

Payoffs

Alignment & pre-clean Post clean

Bonding station

Take-up


Examples:

• One 2G tape bonded with one CuNi alloy tape (up to 1 mm thick) – conductor with high mechanical strength and tailored normal state resistivity for FCL transformer

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Examples (continued)

• Two 2G tapes bonded with one Cu tape in-between – conductor with high Ic and improved stability for accelerator magnets

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E-I characteristics (77K, sf) of a composite wire bonded with two 2G tapes with one Cu tape in-between


SP 2G HTS is used in several cable configurations

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Roebel Cable − Fabricated by winding mechanically punctured

meandering tapes – high Ic(~nkA) and low AC loss − Uniformity across width and mechanical strength

W. Goldacker et al, IEEE TAS , 17(2007)3398

CORC (Conductor on Round Core) Cable − Fabricated by winding multiple wires in a helical

way around a small former – high Ic(~nkA) − High Je and mechanical strength

D C van der Laan et al, SUST , 24(2011)042001

Twisted Stacked-Tape Cable (TSTC) − Fabricated by stacking multiple tapes together and

twisting at a pitch length – high Ic(~nkA) − Mechanical strength

M. Takayasu et al, SUST , 25(2012)014011



Insulation options

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New 2G HTS conductor insulations are being developed to meet customer requests

• Current option is a wrapped Kapton®/Polyimide insulation – Either overlapped (30-50%) or butt

wrapped – 12.7 to 25.4µm thick with 15µm

adhesive • Evaluating Polyimide Electro-Deposited

Conductor [PIED], developed by RIKEN, as alternative insulation – Thicknesses of 20µm and below are

being evaluated – Epoxied coils tested to date using this

insulation show excellent results & resistance to delamination

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PIED insulation


High voltage tape insulation for robust bonded conductor available

Multiple wrapped layers of PPLP or equivalent insulation on 2G HTS bonded conductors available for high voltage applications

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6 layers of wrapped insulation applied to ~ 14 mm x 1.1 mm bonded test conductor for 69 kV FCL transformer high voltage module


Offering improved services to our customers

• Up to 50% price reduction and delivery lead time compared 2013/2014 depending on application

• Upgraded Quick Ship list with greater variety • Longer piece lengths, higher Ic & greater product

varieties

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superior performance. powerful technology. - home · pdf file · 2018-03-11superior...

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