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12/1/20031

Superior Decoupling for High Speed Digital Electronics with

3MTM Embedded Capacitor Material

Santa Clara Valley Chapter of the IEEE Components, Packaging & Manufacturing Technology Society

November 12th, 2003

12/1/20032

3M Facts for Year–end 20023M is one of 30 companies in the Dow Jones Industrial Average

and is a component of the Standard & Poor's 500 Index.Sales

Worldwide.................……………………………… $16.3 billionInternational (55% of total)……………………….. $ 8.9 billion

Earnings

Net Income – reported * …………………………. $ 1.97 billion

R&D Expenditures

For 2002..........................………………………….. $ 1.07 billion

Total for last five years ..............………………….. $ 5.33 billion

Employees

Worldwide ................................…………..………. 68,774

United States ……………………………………….. 35,024

Contributions

3M & 3M Foundation……………………………….. $43 million +

*Includes non-recurring net loss of $108 million principally related to 3M’s restructuring plan

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Microinterconnect Products Portfolio

Inkjet

DisplaysHard Disk Drives

Chip Scale Packaging

Medical

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375350300280250200Max Current/Device (A)Large Business Machine Products

300280240225225200Max Power/Device (W)Large Business Machine Products

‘16‘13‘10‘07‘06‘05‘04‘03‘02‘01NEMI Roadmap

288251218190180170160150140130Allowable Max Power (W)High Performance with Heatsink

0.40.50.60.70.90.91.01.01.01.1Power Supply Voltage (V)Vdd (High Performance)

‘16‘13‘10‘07‘06‘05‘04‘03‘02‘01SIA Roadmap

Driving Trends in Silicon

• Lower voltage• Higher power/current• Higher frequency

= ZVI

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12/1/20035

Power Distribution Impedance

Ways to lower power distribution impedance:

Decoupling capacitor

IC

Power Plane

Ground Plane

FR4 Spacing = 2 – 4 mils

Dk of FR4 = 4

• Reduce power-ground plane spacing

• Increase Dk of material separating power-ground planes

12/1/20036

3MTM Embedded Capacitor Material Construction

Dielectric Layer is a Ceramic filled epoxy

Cu Foil, 1 oz. (1.4 mil)

Cu Foil, 1 oz. (1.4 mil)

Thickness:Dk:

3M16 um

16

FR450 um

4

4

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3MTM Embedded Capacitor Material Properties

94V-0Flammability Rating

35 umCopper Thickness

>100V, 500V*>50V

Breakdown Voltage - 16 um - 8 um*

~130V/umDielectric Strength

Meets X7RFreq., Voltage, Temperature

16Dielectric Constant

5 nF/in210 nF/in2

Capacitance /area - 16 um - 8 um*

ValueAttribute

* In development

12/1/20038

Development History of Embedded Capacitors at 3M

• 1996 - 1999 DARPA Program

• 1998 - 2000 NCMS Embedded Decoupling Capacitance (EDC)

• 1999 - 2003 NIST ATP Embedded Passives

• End 2003 Commercial Release

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Performance Data

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Impedance Comparison

3M (8 um)

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Data from NCMS Embedded Decoupling Capacitance Project Report - 12/00

-2 .5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 x 10 ns

-1 .5

-1

-0 .5

0

0.5

1

1.5

50 O hm m ode, V=3.3v

TV 1-3-1 BC 2000TV 1-3-1 H i-K TV 1-3-1 EM C AP TV 1-3-1 C -P ly

TV 1-2-1 FR4+d

(Time Domain - 50 MHz)

Vol

ts

Power Bus Noise

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Power Bus Noise on Test Vehicle

• Traditional decoupling capacitors are not effective at frequencies above 1 GHz

• C-Ply layer has excellent performance to 5 GHz

-40

-35

-30

-25

-20

-15

-10

-5

0

5

No Caps (FR4) DecouplingCaps

BC2000 EmCap HiK DuPont 3M C-Ply

Material

dBm

1MHz to 1GHz1 GHz to 3 GHz3 GHz to 5 GHz

Data from NCMS Embedded Decoupling Capacitance Project Report - 12/00

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Radiated Emissions Comparison

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Examples of EmbeddedCapacitance Replacing Discretes

>75%26.9196952,900529 x 0.1 uF

OEM D

>75%~10.6~3003,18029 x 0.1 uF28 x 0.01 uF

OEM C

>60%30.02106,31062 x 0.1 uF

11 x 0.01 uF

OEM B

NA42.030012,600126 x 0.1 uF

OEM A

100%3.110533033 x 0.01 uF

EDC TV1

% of Total Discrete

Capacitance Removed

Ratio of Removed to Embedded

Embedded Capacitance

(nF)

Discrete Capacitance

Removed (nF)

Design

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12/1/200315

Electrical Performance Summary

• Lowers impedance of power distribution system

• Dampens board resonances

• Reduces noise on power plane

• Reduces radiated emissions

• Eliminates need for large numbers of discrete capacitors

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√Reduce EMI

√Improve PWB panel utilization

√√Reduce opportunities for damaged components

√Reduce weight

√Enable decoupling w/back-side heat sinks

√Reduce assembly time

√Reduce board size, thickness

√Simplify rework

√√Reduce via count

√Enable DS to SS assembly

√Reduce layer count

√√Eliminate capacitors

√√Reduce design time & redesigns

√Faster signaling/Reduce power bus noise

CostSpace PerformancePotential Benefits

Reasons for Embedded Capacitance

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12/1/200317

PCB Compatibility

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PCB Processing

• Compatible with all rigid and flex PCB processing (including laser ablation)

• Material handling is most significant issue (compares to bare 2 ounce copper)

• A sequential lamination process is recommended– Pattern 1st side copper– Laminate patterned side to another layer of prepreg– Pattern 2nd side copper

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12/1/200319

PCB Processing

4-Layer Board Cross Section

3MTM Embedded Capacitor layer

Through-hole connection to top electrode of embedded capacitor layer

12/1/200320

Environmental Testing

Test Property Result

High Temp (125°C) Capacitance No Change (1000 hrs)

Thermal Cycle Thermal Shock Capacitance No Change (1000 cycles)

High Humidity (85°C/85% RH)

Capacitance Dissipation Factor

10-15% Increase* 0.4% to 0.9%*

TMA (T260) Life >5 minutes THB

(85C/85%RH/15 V) Life >1000 hrs

ESD Capacitance/D.F. No change

Pressure Cooker Capacitance/D.F. No change after bake

Bend Test Capacitance No change

Multiple Reflow (3X) Capacitance No change

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TMA Profile

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UL Testing

Test Property Result

Laminate Flammability 94V-0

Laminate Solderability Limits 288C/30 sec

Laminate Relative Thermal Index 130C

Board (Merix) Flammability 94V-0

Board (Merix) Max Operating Temp 130C

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Intellectual Property & Licensing

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Intellectual Property & Licensing

• 3MTM Embedded Capacitor Material utilizes a patented formulation that incorporates barium titanate particles to increase the dielectric constant

• 3M will not require customers to purchase a license for this technology– Fabricator avoids unreasonable up-front fees– OEMs have wider choice of fabricators

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12/1/200325

Commercialization Status

• Product release by end of 2003• Currently sampling to OEMs and

Fabricators for qualification testing• Types of applications under evaluation

include:• Server/Workstation• Engine control unit• Wireless basestation• Video card• Weapon guidance

• Router• Burn-in boards• DUT boards• PDA• Aircraft electronics

12/1/200326

Contact Information

Bill Balliette(512) 984 7324

wmballiette@mmm.com