study of glues for the assembly of the alice silicon pixel detectors status at 10 .0 3 .2003

Marcello Lunardon - ALICE Gluing Meeting 010/03/2003

Study of glues for the assembly of the ALICE Silicon Pixel Detectors

Status at 10.03.2003

The PADOVA Gluing Team:

Daniela Fabris2

Marcello Lunardon1,2

Francesca Soramel3,4

1 Dept. of Physics of the University of Padova2 INFN Sezione di Padova

3 Dept. of Physics of the University of Udine 4 INFN Sezione di Trieste-Gruppo collegato di Udine

for the ALICE collaboration


Assembling the SPD

Test protocol for glue selection

First results

What next

INDEX


The Gluing Tasks for the SPD

HALF STAVE

CFSS

TASK 1:

ASSEMBLING THE HALF STAVE

( BARI )

TASK 2:

ASSEMBLING THE HALF STAVES ON THE

CARBON FIBER SECTOR SUPPORT

( PADOVA )


Assembling the Silicon Pixel Detectors (I)

TOP VIEW

BOTTOM VIEW

GROUNDING FOIL WITH

WINDOWED KAPTON LAYER

BACK SIDE

OF THE CHIP


Assembling the Silicon Pixel Detectors (II)

Carbon Fiber Sector Support

Cooling Duct



THERMAL ADHESIVE PADS



Half Stave

UV GLUE



Carbon Fiber Clips

UV GLUE


Assembling the Silicon Pixel Detectors (III)

Main problems to be studied:

• thermal contact

• mechanical stability with UV glue

The two problems are independent in the new

mounting scheme


TEST PROTOCOL (I)

TC.a) preliminary adhesion testshow glues look like

TC.b) thermal conductivity measurementsmeasurements for about 0.1 mm adhesive thickness used in working conditions first reduction of candidates

TC.c) glue spreading testsspreading the thermal adhesive on windowed kapton-glass samples fixed above the cooling duct with UV glue and with pressure control glue spreading procedures

TC.d) thermal contact reliability tests w.r.t. thermal cyclestest of thermal contact after many thermal cycles (about 5 – 50 °C ) with best candidates and best glue spreading procedures best candidate(s) selection and definition of the gluing procedure

Thermal compound tests


TEST PROTOCOL (II)

UV.a) UV glue basic tests- test the gluing strength with kapton-glass samples to be glued on CFSS- tests of ungluing- tests of clip mounting UV glue quantity and curing time

UV.b) irradiation tests - test the UV glue before and after irradiation

Mechanical assembly with UV glue

TC.e) test of compatibility with Bari glue (ECCOBOND 45)verify the compatibility between the thermal compound and the adhesive used to glue the grounding foil on the bottom side of the half stave

TC.f) irradiation tests with best candidate(s)thermal contact reliability test of best candidate(s) after irradiation final selection of thermal compound


Glue Vendor Type Thermal cond.

[W/m°K]

Sample quantity

Comments

Staystik 541 Cookson Electronics

Thermoplastic adhesive film

3.0 M high temperature for curing

Micro Faze K AOS Film 150 micron

1.8 M high pressure

SE 4486 Dow Corning Silicon 1 comp.

1.59 M short workability time

CGL7018 AI Tech. Epoxy 4.1 M ATLAS studySE 4445 Dow Corning Silicon 2

comp.1.26 M ATLAS study

AOS 52032 AOS Non sil. Grease

0.7 S very soft


1.68 S less soft

AOS 54012 AOS Sil. Grease 2.58 S Migration problems?


0.7 S less soft

LIST OF THERMAL COMPOUNDS

tested and rejectedtesting

not yet tested


FIRST TEST RESULTS

TC.a) Preliminary adhesion tests

test of adhesion for thermoplastic adhesive

easy to handle, but very difficult to get a good contact in working conditions (low pressure, air ). Problems to reach the polymerization temperature rejected

TC.b) Thermal conductivity measurements

Measurement of thermal conductivity of a 0.1 mm thick adhesive layer for glues and greases

see next slides

UV.a) UV glue basic tests

first trial of assebly and unassembly with UV glue

see next slides


THERMAL CONDUCTIVITY TESTS (I)

Let be:DISC 1 at T1DISC 2 at T2R dissipating a power Wx the thickness of the glueA the area of the glue

W = k A (T1 -T2) / x

k = x W / (T1 - T2)A

• T from R(PT100) and tables (0.387 / K)• Corrections for power dispersion and thermal resistance between PT100 sensors applied


THERMAL CONDUCTIVITY TESTS (II)

Gluek nominal

[W/°Km]Thickness

[micron]k measured

[W/°Km]T/W [°K/W]

Comment

MICRO FAZE K with 0.1 psi pressure

1.8 150 ± 10 0.29 ± 0.02 7need high pressure

SE 4486 1.59 95 ± 9 0.59 ± 0.06 3.4short work

time

SE 4445 1.26 36 ± 6

190 ± 10 0.27 ± 0.06

0.56 ± 0.073.6

ATLAS meas.: 0.5

CGL 7018 460 ± 8

110 ± 11 0.66 ± 0.15

0.74 ± 0.113

ATLAS meas.: 0.6

AOS 52032 0.7 125 ± 13 0.68 ± 0.13 2.9 non sil.

AOS 52029 1.68 130 ± 15

175 ± 15 1.28 ± 0.20

1.26 ± 0.201.6

non sil.

AOS 54012 2.58 130 ± 15 1.44 ± 0.20 1.4 siliconic

expected T/W for 100 micron thickness assuming a chip with 4 x 12.5 = 50 mm2 thermal contact window

tested and rejectedtesting


FIRST UV GLUE TESTS (I)

The tooling for UV gluing tests in Padova is almost ready...


FIRST UV GLUE TESTS (II)

... meanwhile, some hand-made trial:


TC.b) thermal conductivity measurements: completed

TC.c) glue spreading tests: mechanics for tests just completed; starting soon

UV.a) UV glue tests: first assembly and unassembly trials with clips done; mechanics for tests just completed; starting soon more quantitative tests

TC.d) thermal contact reliability tests w.r.t. thermal cycle: mechanical setup and heaters defined, to be realized

TC.e) test of compatibility with Bari glue:setup to be defined

TC.f/UV.b) irradiation tests with best candidate(s): setup for both thermal adhesive and UV glue: to be defined

WHAT NEXT


THE END


INVENTARIO

More electronics and mechanics for tests

Glue dispenser I&J Fisnar mod. DD305 arrived and tested

UV glue and UV source

Norland Prod. Inc. mod. Opticure 3

arrived and tested

CF clips INFN PD first version ready

HeatersINFN PD – simple circuit with thin FR4 substrate

design finalized, to be realized

CFSS raw support

INFN PD ready

XY automated movement for glue dispenser

INFN PDready, computer control ready soon

Arm for dispenser

INFN PD ready

Vacuum support for blades

INFN PD almost ready

study of glues for the assembly of the alice silicon pixel detectors status at 10 .0 3 .2003

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