state of the art electronics: panel discussionweti.cs.ohio.edu/ron_weti.pdfstate-of-the-art...
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State of the art electronics: Panel discussion
R. Ho, S. Borkar, P. Chiang, K. Banerjee
Feb 2, 2012
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Wires. Can’t live without ’em. Can’t live with ’em.
The connections, the connections, the connections. It
will in the end be these details that give the product its
life.
Charles Eames (1907-78), American designer
God hangs the greatest weights upon the smallest
wires.
Francis Bacon (1561-1626), English philosopher
Man, wires suck.
Anon (2010), computer systems designer
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State-of-the-Art Electronics: Panel discussion
• Moderator / Instigator / Argument creator
– Ron Ho, Oracle Labs
• Panel
– Shekhar Borkar
• Intel Fellow and Director, Extreme-Scale Technologies
– Kaustav Banerjee
• Professor ECE, UC-Santa Barbara
– Patrick Chiang
• Asst. Professor ECE, Oregon State University
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The obligatory “life has been good” slide
• Cumulative annual growth rate of 35%
– But maintaining this performance trend will not be easy…
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Frequency scaling is dead; energy limits are king
• To get more performance we must push parallelism
– Multi- and many-core processors
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A braver, newer world?
• Lots of cores lots of wires!
– Message passing
– Task migration
– Cache coherence and sharing
– DMAs and scratchpad data
www.oracle.com www.amd.com
www.intel.com www.intel.com www.ibm.com www.nvidia.com
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Question 1
NoCs: What’s the point?
• What is the role of NoCs in future manycore systems?
• What topologies are most promising (energy, perf)?
• How heavily utilized are NoCs for practical applications?
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Question 2
Any low-hanging fruit?
• What physical technology offers good technology ROI?
• Where should we be investing our own energy?
• [applied to both on-chip and chip-to-chip wires]
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Question 3
Resilience: is this just “bend but don’t break”?
• What is interconnect’s role in overall system resilience?
• Must interconnects change to maintain or enable large-
scale resilience? How?
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Question 4
Packaging for on-chip and for chip-to-chip wires
• What enabling role is played by packaging/packages?
• Where should we be making direct research investment?
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Question 5
Only the paranoid survive
• What keeps you up at night about interconnects?
• Is cost (NRE, complexity, design time) a factor?
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