Spectral Imaging of the Coronal Environment

(SPICE)

Spectral Imaging of the Coronal Environment

(SPICE)

Caitlyn QuinnSummer 2010

Gregory Woytko, 547

Caitlyn QuinnSummer 2010

Gregory Woytko, 547

What is SPICE?What is SPICE?

Imaging coronal spectrograph

One of ten instruments to fly on the ESA/NASA Solar Orbiter mission in 2017

Will orbit the sun at closest distances ever attempted, around 1/4 AU

SPICE instrument currently in Phase A

Imaging coronal spectrograph

One of ten instruments to fly on the ESA/NASA Solar Orbiter mission in 2017

Will orbit the sun at closest distances ever attempted, around 1/4 AU

SPICE instrument currently in Phase A

Solar Orbiter Mission GoalsSolar Orbiter Mission Goals

Evaluate plasma properties and composition of the sun with unprecedented spatial and spectral resolution

Improve our understanding of the Sun’s effects on Earth and the solar system

Better understand CME and space weather

Evaluate plasma properties and composition of the sun with unprecedented spatial and spectral resolution

Improve our understanding of the Sun’s effects on Earth and the solar system

Better understand CME and space weather

OrbitOrbit

.23 AU

The InstrumentThe Instrument

Sun’s light comes in through entrance aperture

Ray hits primary mirror and series of optics

Pre-slit deflects excess radiation

Ray passes through slit mechanism; four slits of varying width

Detectors interpret incoming EUV light

Sun’s light comes in through entrance aperture

Ray hits primary mirror and series of optics

Pre-slit deflects excess radiation

Ray passes through slit mechanism; four slits of varying width

Detectors interpret incoming EUV light

The Detector (Housing and Door)The Detector (Housing and Door)

The DetectorThe Detector

Spring-loaded door2 detector stacks

Spring-loaded door2 detector stacks

MCP

HAS FOC

Detector StacksDetector Stacks Micro Channel Plates

(MCP) High voltage

Fiber Optic Coupler (FOC) Transmits/focuses image

HAS chip Intensified active pixel

sensors Off-centered active area

Components in stack connected by epoxy bond lines

Micro Channel Plates (MCP) High voltage

Fiber Optic Coupler (FOC) Transmits/focuses image

HAS chip Intensified active pixel

sensors Off-centered active area

Components in stack connected by epoxy bond lines FOCHAS

MCP

The DetectorThe Detector

Door opens, EUV radiation hits MCPs

MCPs are supplied a high voltage, detect and amplify incoming radiation

Radiation and voltage transmit through FOC to HAS chip

High voltage activates HAS pixels, which record incoming signal

Door opens, EUV radiation hits MCPs

MCPs are supplied a high voltage, detect and amplify incoming radiation

Radiation and voltage transmit through FOC to HAS chip

High voltage activates HAS pixels, which record incoming signal

HAS: Off-Centered Active AreaHAS: Off-Centered Active Area

Bonding the Detector TogetherBonding the Detector Together

Epotek 310M Epoxy Plastic adhesive Transparent, maintains

maximum strength down to 10-12 m

Connection between HAS and fiber optic coupler is CRITICAL Determines resolution of

images captured

Epotek 310M Epoxy Plastic adhesive Transparent, maintains

maximum strength down to 10-12 m

Connection between HAS and fiber optic coupler is CRITICAL Determines resolution of

images capturedCRITICAL bond line

Critical Bond: FOC to HASCritical Bond: FOC to HAS

FOC focus: 4 m HAS pixels: 18 m Light refracts 30° on

either side of ray from the FOC to epoxy

Distance between FOC and HAS (i.e. bond thickness) determines spread Smaller spread, better

resolution

FOC focus: 4 m HAS pixels: 18 m Light refracts 30° on

either side of ray from the FOC to epoxy

Distance between FOC and HAS (i.e. bond thickness) determines spread Smaller spread, better

resolution

Critical Bond: FOC to HASCritical Bond: FOC to HAS

Worst case scenario: bond line 12 m, single focused ray spreads over multiple HAS pixels

Issues With BondingIssues With Bonding

ESD sensitivity of HAS Accuracy, precision

How to ensure precise placement of FOC in active area despite slight variations in HAS chips?

2 bonds on one FOC Expense of HAS

Only get “one shot” to do it right during actual fabrication

Solution??

ESD sensitivity of HAS Accuracy, precision

How to ensure precise placement of FOC in active area despite slight variations in HAS chips?

2 bonds on one FOC Expense of HAS

Only get “one shot” to do it right during actual fabrication

Solution??

Bonding FixtureBonding Fixture Grounded metal plate with

HAS-shaped pocket Outer holes to secure

fixture and ground plate Holes around pocket for

T-shaped alignment bars (adjustable)

HAS is removable after bonding is achieved

Drawings approved, quote received, solid models in the making!

Grounded metal plate with HAS-shaped pocket

Outer holes to secure fixture and ground plate

Holes around pocket for T-shaped alignment bars (adjustable)

HAS is removable after bonding is achieved

Drawings approved, quote received, solid models in the making!

SPICE: General IssuesSPICE: General Issues

Ability of instrument to withstand wide range of temperatures

Will the detector and bonds withstand testing: vibration, thermal, acoustic, etc?

Passing upcoming CDRDelayed execution of instrument (>3 yrs)

Ability of instrument to withstand wide range of temperatures

Will the detector and bonds withstand testing: vibration, thermal, acoustic, etc?

Passing upcoming CDRDelayed execution of instrument (>3 yrs)

Other Experiences at NASAOther Experiences at NASA

Working alongside engineers, scientists, machinists

Clean room training

Disassembling hardware

Machine Shop ESDM 5-axis milling Metrology, FARO arms Rapid prototyping: SLA

Working alongside engineers, scientists, machinists

Clean room training

Disassembling hardware

Machine Shop ESDM 5-axis milling Metrology, FARO arms Rapid prototyping: SLA

2 in.

Questions?Questions?