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Volume 5 Number 3 May/June 2014

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Southeast AsiaSoutheast Asia

Avian HoInterview Inside

PLUS: MULTILAYER PRINTING FOR HIGH-PERFORMANCE ELECTRONIC COMPONENTS • ADVANTAGES AND DISADVANTAGES OF VAPOR PHASE SOLDERING & more

SELECTIVE SOLDERING USING THE MULTI WAVE PROCESS

Global SMT & Packaging Southeast Asia – May/June 2014 – 1www.globalsmtsea.com

Contents

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Volume 5, No. 3

May/June 2014

Contents

8

14

28

EDITORIAL2 India needs a “National Electronics Mission” Debasish Choudhury

TECHNOLOGY FOCUS8 Selective soldering using the multi wave process Jürgen Friedrich, Ersa GmbH, Wertheim14 Layer by layer—multilayer printing for high- performance electronic components Michael Heilmann and Franz Padinger, BOTEST, and Franz Plachy, EKRA20 The advantages and disadvantages of vapor phase soldering Patrick McWiggin, SolderStar Ltd

SPECIAL FEATURES28 Interview—Avian Ho, ASM Pacific Technology Ltd30 SEMICON Singapore loses its sheen, moving to Malaysia in 2015

REGULAR COLUMNS24 Global outlook: Modest year-on-year and sequential growth Walt Custer and Jon Custer-Topai

4 Industry News32 New Products35 Association News36 International Diary

OTHER REGULAR FEATURES

Southeast AsiaSoutheast Asia

Title

2 – Global SMT & Packaging Southeast Asia – May/June 2014 www.globalsmtsea.com

Editorial OfficesEuropeTrafalgar Publications Ltd.Globals SMT & PackagingCrown House, 72 Hammersmith Rd, Hammersmith, London, W14 8TH, UKTel: +44 (0) 207 559 1467 Fax: +44 (0) 207 559 1468E-mail: [email protected]: www.globalsmt.netUnited StatesTrafalgar Publications Ltd.Global SMT & PackagingPO Box 7579Naples, FL 34102, USATel: +1 (239) 245-9264Fax: (239) 236-4682AsiaTrafalgar Publications Group Pvt LtdM-161/1 G.L. House, Gautam NagarBehind India Oil BhawanNew Delhi – 110049Office: +86 351 652 3813Fax: +86 351 652 0409Editor-in-ChiefTrevor GalbraithTel: +1 (239) 245 9264 ext. 101UK Mobile: +44 (0)7584 072926German Handy: +49 (0)1573 278 4316US Cell: +1 (239) 287 5401Fax: +1 (239) 236 4682Skype: [email protected] EditorTel: +1 (239) 245-9264 [email protected] EditorLu [email protected] Asia Technical EditorDebasish [email protected]: +1 (239) 245-9264 [email protected] DeveloperTorrence GermanyTel: +1 (239) 245-9264 [email protected] AdvertisingEurope—Trevor GalbraithTel: +1 (239) 245 9264 ext. [email protected] AmericaSandy DaneauTel: +1 [email protected] Asia—India, Singapore & MalaysiaDebasish ChoudhuryTel: +91 120 6453260Mobile: +91 [email protected] ChangTel: [email protected], Taiwan & Hong KongPaul ChenTel: +86 [email protected]

Debasish Choudhury

Editorial

India needs a “National Electronics Mission”

By the time this issue reaches you, Narendra Modi will have assumed office as India’s 15th Prime Minister. India’s loud yearning for a change has fructified, and the country is finally MODIfied. My warmest congratulations to Mr. Modi and the new government!

Just before the swearing-in ceremony, “The Economist” in its May 24 edition placed India’s new PM on the cover with a caption: India’s “Strongman.” All of us in India too believed that a decisive mandate for Narendra Modi and his party, BJP, would give India its best chance ever of prosper-ity. I agree with The Economist’s view too: “An Indian growth miracle would be a great thing not just for Indians, but also for the world.” In terms of purchasing power parity (PPP), India is now the world’s third largest economy—surpassing Japan—but we fail miserably on the manufacturing front. Mr. Modi & his party had expressed their intent to unleash a manufacturing tsunami when voted to power. We need a major tweaking in the tax regime to make it more competi-tive for the local industry. Another major drag for local electronic manufacturing is Free Trade Agreements (FTAs). We should review all the FTAs so that we can create a level-playing field for Indian manufac-turers. In my view, India needs a “National Electronics Mission” to devise ways to reform and revise the sector to make India a global EMS hub in the next five years.

Furthermore, a dazzling economy can’t grow without a sound R&D and innova-tion infrastructure. I was amazed to know Singapore’s semiconductor industry con-tributes over 5% of the country’s GDP and 37% of all R&D spending by the manufac-turing industry. It’s about time for India to pursue its dream of increasing R&D invest-ment to 2% of GDP in the next five years so that enough jobs are created. The new

government should make investments in science/innovation a national priority too.

It was also heartening to see sea-soned and well respected bureaucrat M.N. Vidyashankar taking over as the new President of India Electronics & Semiconductor Association (IESA), the premier trade body representing the Indian electronic system design and manufactur-ing (ESDM) industry.

But what pained me most are the tax troubles faced by Nokia’s manufactur-ing facility in Chennai, which is currently outside the Microsoft’s global takeover of Nokia’s devices and services units. So, Nokia India’s Chennai facility is currently operating as a contract manufacturer for Microsoft. This uncertainty is spilling over its business associates namely Flextronics, Foxconn and other cluster members slowly. I am sure, the new government will address these issues quickly, and the ESDM sector will be on global map in no time.

— Debasish Choudhury

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Microcare adds new facility in Singapore, expands global footprint

MicroCare Corp., a leading global manu-facturer of precision cleaning, coating and lubrication products, announced today the opening of a distribution center in Singapore to serve their rapidly-expand-ing customer base in the Pacific Rim. This new facility will support end-users located throughout Southeast Asia (ASEAN) region as well as the greater China mar-ketplace. Managing the new division will be Jerald Chan, who was recently hired as regional sales manager.

The new facility will house a sales staff, a fully stocked warehouse and a testing lab. It will support customer requirements for the full array of MicroCare products, including electronics cleaners, the Sticklers® line of fiber optic cleaning tools, the Duraglide® line of medical device lubricants, the Dupont™ Vertrel® cleaning fluids and the full array of MicroCare precision defluxers and degreasers.

The office will begin operations May 19th and be fully operational by the end of the summer 2014. www.microcare.com

ITI signs MoU with Department of TelecommunicationsITI Limited signed the Memorandum of Understanding (MoU) for the year 2014-15 with the Department of Telecommunications, Ministry of

Communication & IT, Govt. of India. Mr. M.F.Farooqui, Secretary Department of Telecommunications and Mr. K.L.Dhingra, Chairman and Managing Director ITI Limited signed the MoU on March 27, 2014. The MoU envisages ITI’s significant role in the field of Telecommunications, to pursue opportunities of indigenous tele-com equipments manufacturing arising out of Government’s National Telecom Policy and Preferential Market Access; and also to play an important role in the Govt. of India funded projects of National impor-tance like National Optical Fiber Network (NOFN) and Network for Spectrum (NFS). www.itiltd-india.com

AIM Solder expands technical support in IndiaAIM230514AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, announces the addition of Chetan Shiva to the position of Technical Sales Engineer. Based out of Bangalore, India, Chetan will assist in find-ing technical solutions for AIM customers within India.

Chetan Shiva has vast technical expe-rience having worked in the electronics industry for more than ten years with companies such as Schneider APC, EMADS and Aristos EMS. Chetan possesses skills in areas such as SMT and THT manufac-turing processes, ROHS conversion and new product introduction.

Chetan’s proven expertise in these key areas will make him a valuable addition to AIM’s growing global technical support team, further strengthening the company’s commitment to providing unparalleled technical support to its customers around the world. www.aimsolder.com

Indium Corporation, Kyzen host seminar in TaiwanIndium Corporation and Kyzen hosted a technical seminar on April 29 in Hsinchu, Taiwan. The seminar featured presentations by Sze Pei Lim, Indium Corporation’s tech-nical manager for Southeast Asia, and Jason Chan, Kyzen’s technical applications man-ager. Each presented on a variety of topics, including low temperature alloys, cleaning semiconductor devices, and new technolo-gies.

Sze Pei is responsible for managing Indium Corporation’s technical teams

throughout the Asia-Pacific region. She joined Indium Corporation in 2007 as an area technical manager. She earned her bachelor’s degree in Chemistry from the National University of Singapore, and has 17 years of experience in the SMT and PCB assembly industries.

Chan has nine years of experience in semiconductor applications and elec-tronics packaging assemblies, including wafer-bumping processes, flip-chip pack-aging, LED packaging, passive and hybrid components, PCB assembly applications, and more. He earned his bachelor’s degree in computer information systems from the University of Detroit Mercy in Mich., USA. www.indium.com, www.kyzen.com

India Electronics and Semiconductor Association announces Executive Council for 2014 - 2015India Electronics and Semiconductor Association (IESA), the premier industry body representing the Indian Electronic System Design & Manufacturing (ESDM) industry announced its new Executive Council (EC) for the year 2014-15.

Mr. Ashok Chandak, Senior Director, Global Sales and Marketing at NXP Semiconductors, who was earlier the Vice Chairman for 2013-14, has taken over the role of Chairman for 2014-15. Mr. Vinay Shenoy, Managing Director, Infineon Technologies would be the new Vice Chairman of IESA and Krishna Moorthy K, MD, Rambus Technologies will serve as the new Treasurer.

The newly elected Executive Council members are Mr. Ganesh Guruswamy, MD, SanDisk India, Mr. Jaswinder Ahuja, MD, Cadence Design Systems, Mr. Krishna Moorthy K, MD, Rambus Technologies, Ms. Kumud Srinivasan, President, Intel India, Mr. Santhanakrishnan Raman, MD, LSI India and Dr. Satya Gupta, Founder and CEO, Concept2Silicon Systems.

Mr. Sanjeev Keskar, Managing Director, Sales, PMC-Sierra, who was the previous Chairman at IESA would continue on the Executive Council in his capacity as Advisor. Other members who continue to be on the Council are Mr. BV Naidu, Chairman and CEO, Sagitaur Ventures India, Mr. Rajendra Kumar Khare, Chairman and Managing Director, SureWaves MediaTech and Mr. Vinay Shenoy, Managing Director, Infineon

Industry newsIndustry news


Industry news

Technologies.The industry body has been instru-

mental in putting forward favourable policies for electronics and semiconductor manufacturing, aimed at boosting the growth of Indian ESDM sector. www.iesa-online.org

Renesas Electronics establishes a subsidiary in India to expand footprint and accelerate business expansionRenesas Electronics Corporation opened Renesas Electronics India Pvt. Ltd, a wholly-owned subsidiary of Renesas Electronics Singapore Pte. Ltd., located in Bangalore, India. Guests from Embassy of Japan in India, company representa-tives from Japan and Singapore as well as customers and industry partners attended the opening ceremony held in Bangalore, India.

Since 2010, Renesas has been carrying out its business promotion activities and providing technical product support to its customers in India via its branch offices in Bangalore, Delhi and Mumbai. As part of its expansion plan, Renesas is converting its India branch offices to a full subsidiary. Renesas can now expand its operations to other cities in India as well as engage in a wider range of business activities. Customers can expect a higher level of engagement and services delivered closer to their doorsteps.

The new subsidiary is located in Bangalore and is staffed by field application engineering, product marketing and sales resources. Renesas India plans to expand its application engineering team to develop and market ‘India-centric’ solutions. The team will first focus on two-wheeler auto-motive solutions. Renesas India intends to expand the team’s operations to other cities in India to extend its solution offerings to industrial and consumer appliances in time to come. in.renesas.com

Asia/Pacific PC market declined Year-on-Year for the eighth consecutive quarter in Q1 2014, reports IDCIDC’s preliminary results show that the Asia/Pacific (excluding Japan) PC market declined 8% sequentially and 11% year-on-year in 2014 Q1 to reach 23.8 million units, coming in marginally lower than IDC’s initial forecasts. Elections in some of the bigger markets contributed to the region’s overall decline.

In India, an ongoing large educa-tion project was postponed due to the upcoming elections, shaving off about half a million units from the commercial PC segment. In Thailand, political unrest continued to have an adverse impact on the economy, while in Indonesia, government funds were diverted in the run-up to the elections, resulting in lower commercial spending in PCs there this quarter.

“However, as these markets stabilize after the elections, IDC expects commer-cial activity to resume in the second half as a result of pent-up demand,” says Handoko Andi, Research Manager for Client Devices at IDC Asia/Pacific.

“On the consumer side, ongoing distractions from smartphones and tablets as well as cautious channel intake impacted most markets in the region, especially in South East Asia.” www.idc.com

KL Dhingra, CMD, ITI Limited conferred “Excellence Award”K.L. Dhingra, Chairman and Managing Director, ITI Limited, Bangalore, has been conferred “Excellence Award” in the field of Telecommunications by Delhi Telugu Academy on 29th March 2014, at New Delhi. Delhi Telugu Academy (DTA) rec-ognizes Eminent Personalities in different fields of work and honours them for their excellent services on the eve of Ugadi every year. www.itiltd-india.com

STATS ChipPAC Conferred Singapore’s Prestigious Distinguished Partner in Progress AwardSTATS ChipPAC Ltd. received Singapore’s highly exclusive and prestigious honour, the Distinguished Partner in Progress (DPIP) award, in recognition of its strong leader-ship and outstanding contributions to the local semiconductor industry. Singapore Deputy Prime Minister and Coordinating Minister for National Security & Minister for Home Affairs, Mr. Teo Chee Hean, conferred the award to STATS ChipPAC during a ceremony held earlier today.

The DPIP award is an exclusive and prestigious corporate award initiated by the Singapore Economic Development Board (EDB) in 1991 to recognise compa-nies for their contributions to Singapore’s economic growth and their commitment to promote the country’s social and commu-nity interests. Representing a diverse range of industries over the years, DPIP award recipients are local and global leaders in the

markets they serve. STATS ChipPAC is the third homegrown Singapore company and first Outsourced Semiconductor Assembly and Test (OSAT) provider to receive the DPIP award. www.statschippac.com

Pace Power Systems buys GE Power business in IndiaBangalore-based Pace Power Systems has acquired the entire business of GE (General Electric) Power Electronics India, which provides energy management solutions to telecom tower companies and telecom operators. Pace Power also gets the rights to use GE’s Lineage Power brand in some of its areas of operation. The companies declined to disclose the value of the deal. Pace is an over Rs 300 crore company, with 2,400 employees. The acquisition marks a consolidation in the Indian market for energy management solutions for telecom towers, where the major players are Pace, GE, Emerson, Delta and Eltek. (Source: TOI). www.pacepowersystems.com

Techspray introduces new 2014 Product Catalog & Application GuideTechspray has released their 2014 Product Catalog and Application Guide. Techspray’s 2014 catalog includes high precision clean-ers, conformal coatings, and rework, repair and cleaning supplies. Improved look-up tables offer more product and applica-tion specifications to guide the product selection and qualification process. Break-through new products detailed in the catalog include XT-Armor Oven Shield, Eco-dFluxer SMT200 and SMT300 inline and batch defluxers, and Fine-L-Kote High Viscosity AR conformal coating.www.techspray.com

Enthone Shanghai receives ISO 9001 quality system management certificationThe Enthone Shanghai Technical and Manufacturing Center received certi-fication to the ISO 9001:2008 Quality Management System (QMS). BSI Management Inc. conducted the indepen-dent, third party certification and issued Certificate Number FM 611444.

The Enthone Shanghai Technical and Manufacturing Center encompasses over ten acres (42,000 sq. meters) and consists of a raw material and finished goods ware-house, manufacturing building, and a tech-nology center. www.enthone.com

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Selective soldering using the multi wave process

Observing the currently available spectrum of selective soldering technology, one finds soldering robots, focused IR light units, laser soldering systems, induction solder-ing system, and soldering systems that work with small solder waves. For economic rea-sons, and because of the incessant drive towards achieving the highest level of qual-ity and reproducibility, mini-waves have more or less established themselves as the wave of choice in the electronic manufac-turing industry.

In daily operation, distinction is made between systems utilizing a small solder wave, which sequentially solders each joint on the assembly, and systems with multiple solder waves, which simultaneously solder all joints on the assembly. The inherent advantage of either system is obvious: Because of their fully programmable move-ments, single wave systems are very flexible, whereas multi wave systems offer short cycle times to the user.

Combining both soldering technolo-gies into one system, enables operators to process products in high volumes and with short cycle times on the multi wave,

and process those assemblies that run in smaller batches on the flexible single wave module.

Manufacturers using this modern technology range from the small contract assembly house with few employees to electronic manufacturing services and global corporations with manufacturing facilities world-wide. One very important and continuously growing market is that of the automotive industry. The number of electronic modules and features found in current models of cars is continuously rising. And to assure the integrity of these increasingly complex systems, the indi-vidual board assemblies installed must satisfy the highest quality standards.

Manual repair of an electronic assembly, even if it is only to remove a solder bridge, is no longer permitted. In effect, any board assembly displaying a defect must be scrapped.

This being the general background, all modern selective soldering systems must be capable to fully and independently monitor the soldering process, and assure the stability of the process and its repro-

The selective soldering process is today an inherent part of the manufacturing structure of electronic assemblies. The market for selective soldering systems has grown strongly over the last few years, and today many different methods and technologies are around, all of which are intended to solve issues with selective soldering applications. For many users this diversity becomes a major challenge, especially when achieving the highest quality level at the best economic efficiency is the objective. It is therefore essential to consider the intended applications when selecting the suitable technology.

Dip-soldering takes up a special position amongst the selective soldering technologies.

Jürgen Friedrich, Ersa GmbH, Wertheim


Figure 1. Fluxer module with four multi-drop fluxing heads.

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ducibility. This is the only way in which a high first pass yield can be achieved. In opposition to these quality considerations stands the requirement for a high uptime of the system, so that it can be operated economically and with high efficiency. For the produc-tion floor, this means that the periods when the system is not in production have to be kept at an absolute minimum. Measures have to be taken during the initial design of the equipment, so that the time required to verify program parameters, for product change over, main-tenance, or programming itself etc. has a minimum negative impact on the future uptime of the system.

Multi wave selective soldering systemsToday, surface mount technology (SMT) is the standard technology in all areas of the electronic industry. Yet, not all components are available as surface mount devices (SMD’s). And to selectively solder these leaded (through-hole) components on

to the SMT assembly represents an addi-tional process step, which is not allowed to become the bottle neck in production. It is therefore of great importance to look at the cycle time of the system in relation to the number of solder joints that have to be formed. In order to reach cycle times of 20 seconds, which are required in many high volume production environments, the choice of selecting a process falls squarely into the area of multi wave soldering.

As in the standard wave soldering process, the process steps are fluxing, preheating and soldering.

Safe-guarding a multi wave soldering process starts in the design phase of the

board assemblies. To assist its user, ERSA offers board designers recom-mendations as to the preferred layout of the compo-nents on the board. Defined minimum distances between components are essential to provide a process window large enough for a

robust process.

The fluxing systemsThe flux applied in the selective soldering process has to be locally confined. On the areas of the assembly which will not be wetted by the solder wave, no flux may be present. This is assured today by the use of multi drop fluxer heads, whose origin lie in industrial ink-jet technology. Here the flux is not atomized, but is deposited as distinct small droplets to pre-programmed locations on the surface of the board assembly. To achieve this, the fluxer heads are mounted on an x/y axis system which

Combining both soldering technologies into one system, enables operators to process products in high volumes and with short cycle times on the multi wave, and process those assemblies that run in smaller batches on the flexible single wave module.

Figure 2. Preheating module with top side preheaters, at right side of movable shuttle to transfer the assemblies in the soldering system.



moves about underneath the conveyor system, transporting the boards.

Fluxing a board assembly is, similar to printing a page on an ink jet printer, a sequential process whose cycle time is determined by the extent of the area to be fluxed. To adapt the cycle time of fluxing to the short cycle times of the multi wave solder process, the fluxer unit can be equipped with up to four fluxer heads.

All fluxer heads can work in parallel applying one type of flux, or they can be split into two pairs of heads, each pair dispensing a different flux. The latter situ-ation occurs most frequently at contract assembly houses, which have to respond with high flexibility to the customer’s requirements. The selection of the flux applied is specified in the solder program.

The precise flux deposition achieved with the multi drop fluxer heads is contin-uously monitored during the automatic operation of the soldering system. The continuous monitoring has to address both the position of the deposition as well as its flux volume. Both parameters are captured and evaluated in the system by laser light barriers. If the recorded values differ from the nominal values, within certain toler-ances, the process is terminated and an operating notification for the operator is generated.

PreheatingPreheating board assemblies is of great importance in the lead-free soldering pro-cess. When processing SnCu- or SnAgCu solders, the thermal balance of the solder joint is heavily dependent on the preheat

temperature, especially if the board assem-bly has a large heat capacity. These solder alloys solidify quicker, since the excess heat stored in the solder after peak reflow reduces faster, when compared to SnPb solder alloys. This physical disadvan-tage of the solder material, though, can and has to be compensated for by an effective preheat-ing unit.

In the ERSA product range of selective soldering systems, preheat modules based on short wave IR emitters and hybrid convection preheat units are avail-able for standard configurations. To preheat the assem-blies from below, IR emitters are used, whereas the top-side preheaters are based on hybrid convection units. Top side preheaters can be installed both in the preheat area as well as over the solder module. Depending on the

type of system selected, up to four preheat modules can be integrated into a selective soldering system.

The size of the preheat units is standard-ized and generally based on the maximum board size that can be processed. If only small assemblies need to be processed, the preheating module can be segmented through the installation of a second PCB stopper. This optional feature doubles the throughput of the preheater, and the cycle time of the assembly can be halved.

The application of a top side preheater in the solder module maintains the assembly at a continuous temperature of the assembly during the soldering process and prevents the assembly from cooling down during a lengthy solder cycle. In dip soldering applications, this option is not required as the cycle time in this process is short.

The multi wave soldering unitWhenever short cycle times are required, the use of a multi wave solder baths for simultaneous dip soldering is called for.

Figure 3. Detail of a nozzle plate with complex nozzle geometries.

Figure 4. Soldering unit in maintenance and set-up position. nordsonmarch.com

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The heart of this solder module is the product specific soldering tool, the nozzle plate. This is made up of a solid, heavy baseplate, on which nozzles are mounted whose size and position correlates to the solder joints which are to be made. In addition to the geometry of standard nozzles available, nozzles frequently need to be modified to conform to the require-ments called for by special situations found on the board. These modified nozzles are designed using 3D-CAD, and are subse-quently milled out from a solid block of material. Care and experience is required when designing solder nozzles for special applications will provide the assurance, that a stable soldering process, high uptime of the system and a high quality level of the solder joints is being achieved. The nozzle plate is mounted onto a pressure chamber in the solder bath by a number of quick connects, so that it can easily and quickly be exchanged. Solder is provided to the pressure chamber by an induction solder pump. The solder enters the nozzles from below, rises up and forms small solder waves upon exiting the nozzle.

The latest generation of multi wave selective soldering systems operates with electro-magnetic pumps, which have no movable parts and do not require any maintenance. The output of the pump is infinitely variable, so that the height of the solder wave can be precisely adjusted. The pumps are suitable for use with all lead-free solders available on today’s market.

The standard soldering unit has an optimized solder volume of approximately 220 kg (SAC305), and has external heaters as well as a protective coating against the aggressiveness of lead-free solders. The maximum area that can be soldered in a multi wave bath is 360 x 380 mm.

A hood, flooded with a protective gas, is installed over the solder bath. It encloses the complete solder area and the conveyor system, so that a stable protective gas atmosphere is assured during the soldering process.

For dip soldering, manufacturers frequently request that components be held down during the soldering process. In the selective soldering systems manu-factured by ERSA, the space over the board assembly is not occupied by grippers or other handling systems, which allows a system of component hold-downs to be

integrated. These hold-downs are required once only for each board type, and can—as in the case with the nozzle plates—be exchanged easily and quickly. The use of numerous expensive board carriers with integrated component hold-downs can thus be eliminated.

As the first step of the soldering process, the board assembly is moved on the conveyor system to the solder module, where it is stopped and secured over the solder bath. The output of the solder pump is increased to the working height of the small waves, and the complete solder bath is raised to a precisely defined distance from the assembly, where it will remain for between 2 and 3 seconds (contact time). The leads of the components are immersed in the solder waves for the programmed time and the solder joints are formed. When the time has elapsed, the bath is lowered again and the board assembly is released to move out of the soldering module.

Changing the tools on the dip-soldering module might be an issue—due to the system downtime—in those instances where the system is operating in a high volume environment. In order not to impact on the uptime of the system, a

second solder module can be installed. This “on-the-fly” tool change option allows changing and setting up a new tool on the second, pres-ently not in use, solder bath while the system is in full productive opera-tion on the first solder module. This elimination of downtime due to the

tool changes substantially improves the throughput of the total system.

Further standard options available for the solder baths are the solder level moni-toring and control feature, as well as the solder bar feeder.

Traceability and process interlockIn production environments with a high portion of semi-skilled operators it could happen that, during a product change on the production line, an incorrect nozzle plate or a wrong component hold-down plate is installed in the system. Errors of this type would lead inevitably to boards that need to be scrapped, until the error has been detected.

To eliminate this possibility, both nozzle plates and hold-downs can be coded. The soldering systems are furnished with a trace interface, which allows them to communicate with a customer-specific MES- or ERP-system.

Before the MES releases the process on the soldering system, the higher level system verifies that the coding of the nozzle plate, the hold-down plate and the

Figure 5. Ersa Selective Soldering System ECOCELL with downstream cooling tower/buffer.

The latest generation of multi wave selective soldering systems operates with electro-magnetic pumps, which have no movable parts and do not require any maintenance.



solder program selected coincide. This being the case, the process is released, and production can start on the system. If the data received is incorrect, the process remains locked.

During operation of the system all system specific data, as well as all data relevant to the production of the specific assembly, are stored in the controller of the soldering system, from where they can be accessed by the MES-/ERP-System through the trace interface. Traceability and quality management of the assemblies manufactured are thus assured at all times.

The Ersa ECOCELL From all other selective soldering systems, the Ersa ECOCELL distinguishes itself by its U-shaped conveyor system layout. This makes it ideal for installation in manufac-turing islands or as a “side line” system. It offers space for five individual process sta-tions, which can be configured, for exam-ple, with 1 x fluxing, 2 x preheating and 2 x dip-soldering stations. With this configura-tion, cycle times of below 30 seconds for a pallet / board assembly including a product change “on the fly” can be achieved.

The programming of the system can be done off-line with the Ersa CAD-Assistant, a graphical programming environment that uses scanned photos of the assembly to program the fluxer. For dip soldering, the amount of programming for the solder module is reduced to very few parameters,

since graphical programming of move-ments is not required.

Necessitated by the U-shaped conveyor system, the directional transfer of the assemblies is achieved by a moveable shuttle. In order not to break the process chain, a preheating unit is installed in the shuttle, with the option to install a top side preheater as well.

Entering and exiting board assemblies into and from the ECOCELL is either manual or with semi-automatic handling systems. The full range of modern handling systems can be specified, which allows for very flexible and customer-specific solu-tions. A further feature is the optional FIFO cooling buffer at the exit of the ECOCELL. It makes available five FIFO positions, and it assures that—provided appropriate timing—all assemblies can move without interruption through the soldering system. This allows the soldering process, consisting of fluxing, preheating and soldering, to always take place under the same process conditions, regardless of any operator intervention, line stoppages or other delays caused by exterior circum-stances. The board assemblies are held in the buffer, until they can exit again.

While held in the FIFO buffer, the board assemblies are being actively cooled down. The temperature of the board assembly when leaving the buffer is below 35°C. The boards can therefore be handled immediately by the operators or passed on to subsequent test systems.

Further options are AOI systems in the entry and exit areas of the ECOCELL. These systems serve to verify compo-nent placement, the correct placement of the board into a pallet or to inspect the soldering results.

SummaryThe multi wave soldering technology provides its users a stable and reproduc-ible selective soldering process with short cycle times. Extensive configuration char-acteristics allow for economic processes with low operating costs, high uptime of the system and concurrent high quality of the soldered joints. The continuous pro-cess monitoring and -protection feature both allows the system to run without the need for an operator while also providing the base for traceability of the assemblies manufactured.

Step Stencils with the LPKF StencilLaserNot just flat stencils: LPKF’s StencilLaser is able to produce step-up and step-down stencils with a suitable process control. Additional information at www.lpkf.com/step-stencils

A Unique Combination

LPKF Laser & Electronics AG Phone +49 (0) 5131-7095-0


Layer by layer—multilayer printing for high-performance electronic components

Specialists at workThe company EKRA, located in Bönnigheim near Stuttgart, offers special thick film solutions in the HYCON product portfolio. Besides standard SMT applica-tions, EKRA has specialised for decades in products for niche markets such as printing on hybrids, glass, wafers, flexible foils, but also direct printing of functional layers.

The subsidiary BOTEST is a member of the ASYS group like EKRA, specialising in paste development as well as developing and optimising new printing processes. The research laboratory in Linz is where further components of the printing process, such as screen, stencil and printing medium, are adapted to each customised application. Dedicated solutions optimally matched to the specific customer process can thus be offered from a single source.

The functional printing of electrically conductive pastes opens new produc-tion methods for the electronics industry. However, the conductivity of the ultra-thin layers, which are often only a few microns thick, is limited. Larger currents can be transported over tiny printed ridges only with significant electrical losses. Combined with high resolution, this is a challenge. Printing machine manufacturers, process

technologists and paste developers are requested here to create the technical conditions for positionally accurate multi-layer printing.

The following shows the production of prints with electrically conductive pastes and an excellent ratio between print dot height and print dot diameter (= aspect ratio).

The printed dots have a diameter of approx. 70 µm and require for their function as elastic contact pads a height of also 70 µm. The distance to neighbouring contact pads is also approximately 70 µm thanks to a staggered structure of the contact points. With an active area of 180 mm x 255 mm, this results in approximately 2.3 million contact pads to print. Stencil printing was chosen as the method to use, with up to four layers printed one above the other, to achieve the desired aspect ratio of nearly 1.

Printing parametersAn EKRA inline printing system was used for printing on a flexible PE foil substrate. The print nest available was an alumin-ium print-nest with glued poroplast and vacuum suction. This made it possible to create a highly homogeneous support sur-face for the substrate.

The term “printed electronics” represents a trend reversal in electronics production. It means that new product features, new functions, and simplified production processes will in future be found in the market. Often, however, the printed layers are too thin to achieve the required electrical properties. The solution is multilayer printing. Thanks to this, several layers can be printed on each other in order to obtain high-performance structures and electronic components.

Michael Heilmann and Franz Padinger, BOTEST, and Franz Plachy, EKRA


ListenReadWatch

Figure 1. Multilayer printing of elastic elec-trodes w/80X magnification, dot diameter approx. 85 µm, aspect ratio approx. 0.8.

Figure 2.a Print image with a squeegee angle that is too flat.

Figure 2b. Example of a squeegee angle that is too steep. In both 2a and 2b, the print dots are “smeared,” resulting in a smudgy print image.

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The printing paste was specifi-cally developed by BOTEST to achieve the required parameters with regard to conductivity and elasticity of the pads to be printed. Thus, the rheological proper-ties of the printing paste could be perfectly adapted to the used printing parameters and the coating of the stencil.

Multilayer printing: The printing processThe stencil was preflooded while printing the electrically conductive paste. Although this is uncommon in stencil printing, it is indispensable here.

After the printing process, the printed substrate was remove and dried in the oven. To prevent the foil from warping at temperatures or due to influence from humidity, it was adapted again to the envi-ronmental parameters after drying. Before the next printing step, the substrate had to be precisely positioned on the printing table again. This was done using the patented optical positioning system EVA™, which is built into the EKRA printer.

In addition, the gap between the substrate and stencil and the down-stop at the squeegee head had to be adjusted to prevent the printing paste from flowing under the stencil. This process was repeated up to four times, so that the height of the contact pads could be reached.

Influences of the process parametersThe printing results could be optimised thanks to tuning three parameters: stencil, process parameters and printing paste. The following sections evaluate specifically the influence of the process parameters during the printing process.

Squeegee angle Figure 2 shows microscopic images of prints with squeegee angles that are too steep or too flat. If the squeegee angle is too

steep, the printing paste smears below the stencil, creating a smudgy image. This in turn would cause a “shorting” between the individual contact points. A squeegee angle that is too steep leads to uneven “filling” of the stencil openings.

Squeegee pressureExcessive squeegee pressure (Figure 3), just like a flat squeegee angle, results in “smearing” of the printing paste below the stencil and hence in a smudgy, distorted print image. This deformation of the pads also makes the exact positioning of the next printing layer difficult in multilayer printing. In addition, the print dots spread due to the excessive squeegee pressure, which also increases the risk of shorting. Continuous monitoring of the squeegee pressure and closed-loop control of the EKRA printer allow a homogeneous dis-tribution of the squeegee pressure over the entire squeegee path.

Print directionAn essential factor in high-resolution mul-tilayer printing is the print direction. The squeegee pressure slightly “warps” the sten-cil. If the print direction changes while the multilayer print is being composed, it will negatively affect the printing result. The underlying dots can no longer be matched despite precise positioning by means of the alignment system. In this case, there can

be deviations of more than 20-30 µm per layer, as shown in Figure 4. This offset can be determined and compensated by enter-ing it in the software of the printer.

Positioning accuracyTo obtain the best possible positioning accuracy, it is important to align the layer to be printed only with the base fiducials. If other markers, for example fiducials that were printed later, are used for the align-ment, the deviations accumulate. In a realised multilayer print consisting of four layers, the difference with regard to repeat-

Figure 3. Print dots distort in the direction of the squeegee if the squeegee pressure is too high.

Figure 4. Influence of varying the print direction on the printing result.

Figure 5. 3D representation of an opti-mized 4-layer multilayer print of an elastic electrode.

Figure 6. Optimal processing of the elec-trode dots on the base electrode.

Figure 7. Height profile of the multilayer electrode formed in four printing steps.

Figure 8. EKRA printing system X5 Profes-sional (SERIO product family).



ability could be optimised and an overall deviation for 4 layers of ±12.5 µm could be reached. This result could be achieved using the patented optical positioning system EVA™ and using only the base fidu-cials for alignment.

ResultsBy means of evaluating the optimal param-eters, it was possible to achieve very good print results (Figure 5). Thanks to multi-layer printing, the base of the contact pads spreads from 65 µm – 70 µm (monolayer printing) to approximately 85 µm – 93 µm, as shown in Figure 6. The adjacent elec-trodes are not contacted on the underly-ing base electrodes structured in the ratio of 70:30 (70 µm wide with 30 µm distance to the next electrode). This allows a proper electrical function of the elastic contact pads.

Figure 7 shows the height of the indi-vidual contact pads. Thanks to multilayer printing, a height of 55 µm to 65 µm could be achieved for the individual contact pads, which corresponds to an aspect ratio of approximately 0.8.

ConclusionThanks to the optimal interaction between printing parameters and the printing paste, the print results for high-resolution multi-layer printing could be markedly improved. With an optimised aspect ratio of printed structures in multilayer printing, it is pos-sible to create highly conductive structures. They can be used for efficient transport of electricity and represent an attractive option in future electronic production.

However, prerequisite for optimum positioning of the solder deposits is a high-precision screen and stencil printer. Thanks to clever machine features, such as closed-loop squeegee pressure control, the patented optical positioning system EVA™ and a variety of different align-ment options, EKRA printers provide for precision and process stability. Besides the drive unit consisting of a servo motor and a resolver, the print system comprises an additional built-in scale with a resolu-tion of 1 µ. This allows monitoring and, if possible, correcting when the target position is reached even in case of mechan-ical wear.

Since all EKRA stencil printers are equipped with these features, users of PCB printing applications benefit from the mentioned advantages as well. Hence the exact placement of minimised solder paste deposits, as required e.g. for the component size 03015, is no longer merely a vision of the future. All inline printing systems of the SERIO product family and the new SERIO 4000 printer platform are “03015-ready” already today.

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The advantages and disadvantages of vapor phase soldering

To combat these process chal-lenges, a new profiling system has been designed specifically for vapor phase machines. The latest evolution of vapor phase machines now offer much more user con-trolled soldering, the main advan-tages of a vapor phase system such as fixed peak temperature remain, but freely adjustable temperature gradients and profiles are now pos-sible, automatically controlled time above liquidus and a perfect auto-matic inert gas atmosphere.

The original ‘dream’ sold by the manufactures of vapor phase soldering machines was that profiling was not needed, the reality of course in production is ‘You Can’t Manage What You Don’t Measure’. Other problems are evident in the process, usually ‘tomb-stoning’ of components. Given the even heating of the Vapor Phase process you would not expect this, but as PCB designers do not always adhere to machine manufactures recommendations they then need to be set-up by an engineer and monitored if the long term quality is to be maintained.

Whether batch or inline, atmo-spheric or vacuum, SolderStar has developed a solution that offers users the ability to understand and control the production process and production quality. A two-piece, low mass heat-shield gives protec-tion whilst minimizing process impact, allowing operation across pre-heat, vapor and vacuum stages. Once retrieved from the process, the hot shield can be opened allowing data download and rapid air cooling, minimizing the potential for instrument damage. Alternatively captured data can be transferred by wireless telem-etry to any selected PC station,

allowing real-time profile viewing and analysis by the user.

Soldering always means to heat up everything well enough so that soldering can be accom-plished even on sockets or large BGAs, but at the same time to be sure that nothing is overheated or delaminated. So especially for lead free soldering the process window becomes very small. With vapor phase soldering even FR4 boards or double-sided densely packed boards can be soldered reliably and with no danger of overheating.

The advantages of the vapor phase heat transfer in combination with new machines and options offer an excellent tool for easy and defect-free reflow soldering, irre-spective of whether lead free or leaded solders are used.

Machine types and profiling methodsThere are a number of machine types on the market. They offer different solutions in a wide range of machine sizes, starting from small laboratory equipment for prototyping, testing and rework, to medium size batch, up to inline machines for high volume produc-tion. Some of the batch machines can be upgraded to inline use later as it might be needed.

There are several machines that benefit from using a profes-sional thermal profiling system, one being medium size produc-tion machines. These machines are batch based and the PCBs are loaded into the basket. The basket then moves through the machine and enters the vapor phase chamber for preheating and soldering and exits again once complete.

In the beginning of SMT, vapor phase soldering, also well known as condensation soldering, was the preferred reflow soldering technology because of its excellent heat transfer capabilities. The process is widely used for assemblies with a large variable of thermal mass components on the PCB, popular in laboratories for prototype level assembly, and also with some small manufacturers. It has the advantage that it can heat large masses evenly and quickly whilst the peak temperature is controlled. It emits thermal energy by phase change of the heat transfer medium from gas-like to liquid state. This phase change, known as condensation, on the surface of the solder piece lasts until the assembly has reached the temperature of the vapor. Another advantage includes no overheating of assemblies, so vapor phase soldering is ideal for lead free solder processes. It also offers continuous heating-up of the complete assembly, no matter what the assembly is made from; an oxygen free soldering process without the use of any protective gas and finally the efficient use of energy because of the high heat transfer, therefore reducing operating costs compared to other soldering technologies. However there were some disadvantages like fast temperature rise and nearly no influence on the temperature profiles. Due to this, vapor phase soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace).

Patrick McWiggin, SolderStar Ltd


Read ListenWatch



This style of machine is harder to profile as some machines have internal thermocouple ports internally wired to the outside world. An external profiler can be used to capture the profile, although this is more difficult and not ideal for daily production testing.

These machine can also come with a vacuum stage. If this is employed the soldering stage uses a sealed chamber and it is not possible to get wires inside, a true pass through profiler is needed.

Another machine process is inline. These are much more difficult to profile with long wires in the same way a long conventional reflow oven is not profiled with long wires, they snag and the results are not always accurate. Again, if vacuum is employed you cannot use long wires.

The profiling system described here allows users of batch and in-line vapor phase soldering systems to fully profile their products in the same way as a conventional reflow machine. The system includes a data-logger combined with a sealed light-weight heat shield capable of operating in the pre-heat, vapor reflow and vacuum stages of the machine. Data can be passed to a nearby PC via wireless telemetry allowing the profile to be viewed in real-time by the user. Once data capture is complete the heat shield can be opened and the datalogger removed, allowing rapid cool down cycles and minimizing the risk of overheating the profiling unit.

An external data logger with long wires is the ideal choice for manufactures with different soldering processes, wave etc. as one datalogger does it all. There is also added ‘down the wire’ logging capa-bilities via a USB connection, with live data which can be viewed by the engineer as the PCB passes through the machine. A pass through profiling unit is the only way to profile machines with vacuum stages, and is really is a far superior method for any Vapor Phase machine, other than labora-tory machines.

The profiler’s enemy: high thermal transfer!Because of the use of Galden vapor in the machines, the thermal transfer is very high compared to a conventional reflow oven, and subsequently the thermal protection of the datalogger is paramount to survive overheating. The vapor must also not be allowed inside the profiling unit as it will ultimately damage the electronics and insulation used. As vacuums are employed the problems increase, the system must also be able to withstand any pressure dif-

ference seen in the process, and a real-time a wireless telemetry link is required to relay data back to PC from inside the machine and vacuum chamber

There are two approaches to this problem:

The 1 box approach: a datalogger electronic PCB inside a sealed box. The advantage is that it’s physically smaller. The disadvantage is, as it is perfectly sealed to withstand vacuum, it needs to be strong; hence, thermal mass/weight is high. When it exits the machine, it is very hot. As the unit is sealed if it is simply left it will continue to heat and damage the battery

and or electronics. Force cooling is needed such as a water bath or similar.

The 2 box approach: a datalogger is used that can be separated from the protec-tive shield when it exits the machine. This offers the advantage of better production thermally, and it has a rapid cool down. SolderStar’s generic datalogger can be used for multiple processes if required. Only one calibrated unit is needed each year, rather than multiple units. Its disadvantage is that it is physically larger. Most engineers are concerned that the measurement instru-ment being in the process will take energy away from the vapor cloud and affect the measurement and not be a true reflection of the PCB profile. The larger it is, the more concern there is. We did not find the 1 box approach to be the favored process.

Our approach to the problem of ‘physi-cally larger’ was to look laterally at the problem. The actual problem is the thermal mass of the object. They produced a ‘thin’ wall protective shield which has a large surface area, but exceptionally low thermal mass. It is Teflon coated to resist the Galden build up, and has proved to have virtually no impact on the process. The lightweight skin of the shield heats rapidly, and once up to temperature the condensing on the shield is minimal. The carefully ribbed and strengthened design, includes a pressure release system to ease opening the system after the vacuum stage.

SolderStar undertook internal testing of the system on a Asscon Quicky 450. The test was done using the smallest scale machine, which if an ‘impact’ would be seen then it would be seen on this level of machine. It allowed a profile to be captured with long wires, so no instrument in the process chamber, and then with the instru-ment inside.

The purpose of the test was to:1. Further validate the thermal perfor-

mance of the new VP heat shield2. Perform a ‘leak test’ evaluation of the

new ‘O’ Ring seal3. Monitor any effect of the thermal

shield on the process

Conclusion to the internal testing:1. Thermal performance is adequate for

most vapor phase processes, with the original spec. of 250˚C for 9 minutes likely to be achieved.

2. New ‘O’ ring provides sufficient seal3. Both the red & green traces almost

exactly overlay in the ramp up and peak stages, the green trace has a longer peak as it was left in the process longer. The ramp up slope & time are the same with the system inside & outside the barrier.

The vapor energy available within a machine like the Asscon Quicky, is less than the machines this profiling system is likely to be used within. The light weight shield is heated rapidly and energy then thermal absorption minimized, at no point did the vapor ‘collapse’ and the process be impacted.

The system has been proven not just through in-house testing, but also through use by manufacturers. Both Rehm and IBL have tested the system and recommend it. IBL now offer the system with their machines.

Figure 1. Early solution developed by Sol-derStar : 1 Box style datalogger.

Figure 2. 2 Box style datalogger.



Real-time telemetryAnother technology that had to be inves-tigated was real-time telemetry that could reliably function within the vacuum stages of the process. For this type of process, engineers like to see the profile in real-time. This is tricky in any industrial machine as the RF energy is greatly attenuated by the metalwork etc. When there is a vacuum stage it is even more difficult, as it is essen-tially a sealed metal box, we rely on wiring etc. through into the chamber to allow any RF energy to be in/out.

SolderStar’s approach is innovative and has proved an exceptional solution. The system is designed using ‘mesh networking’ technology which provides a ‘self-healing’, very reliable, network/data link. The approach allows routers/repeaters to be used as necessary to relay the signal in machines where other systems would simply not work. Normally no repeater is necessary if the PC receiver is within 10 meters of the machine. Additionally, as no signal is 100% guaranteed they employ an intelligent ‘2 way‘ protocol, if a ‘dead spot’ is encountered for a few seconds in the machine, the datalogger buffers the data then offloads once the link is re-established catching up and continuing in real-time. Other systems just miss the data.

ConclusionVapor Phase soldering has become com-petitive for high volume productions. State-of-the-art machines offer high throughput in combination with high quality results. The vapor, like all gases, is tending to equally fill out a given sphere, such as a Vapor Phase process chamber. The equal temperature distribution over the boards is automatically provided by this physical effect, while in a convection oven the cross profile can vary in tempera-ture. The physical limitation of the maxi-mum temperature in a vapor phase system does not require further controlling mech-anisms to avoid overheating. This quality feature is providing the highest benefits in long-term reliability of the soldered electronic boards. In a convection oven the creation of temperature profiles needs thorough preparation, overheating cannot be securely avoided especially on boards with varying mass distribution.

The excess heat needed to ensure a perfect solder result in vapor phase soldering is only 5˚C to 10˚C over the melting point of the solder paste. Other reflow methods require 30˚C to 35˚C excess heat for the same task due to its lower heat transfer rate.

Lower soldering temperatures are limiting the stress for the components, avoid delamination on PCB substrates and

limit the risk of popcorning on modern components. The vapor phase process provides an oxygen free atmosphere at no extra cost leading to the best possible wetting. The energy consumption (typi-cally 5-6 kW for a large inline system) is much lower than convection as the energy remains in the hot liquid. Optimized insu-lation reduces the introduction of heat into the surrounding atmosphere and thus saves air conditioning costs in the plant. Vapor Phase ovens are smaller than convection ovens, thus they also save space in produc-tion. Considering today´s and future complex components and processes, vapor phase is a perfect choice, and together with a SolderStar profiling system and its dedicated software, vapor phase machines can be defined and the process controlled to the same extent as conventional reflow oven.

Information used from:www.ibl-loettechnik.dewww.asscon.dewww.rehm-group.com

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Contact us to learn how TBS can help grow your company.

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Global outlook: Modest year-on-year and sequential growth

Modest growth has returned to the global electronics industry. After expanding 6.1% in 4Q’13 vs. 4Q’12 electronic equipment sales grew an estimated 2.9% in the first quarter of this year compared to the same quarter a year earlier (Chart 1). Although the industry experienced its normal first quarter seasonal slowdown, it is again expanding year-on-year.

Based upon composite sales of groups of companies making similar product, most (but not all) sectors of the electronic supply chain returned to growth in the first quarter (Chart 2), with semiconductor capital equipment and most components leading the way.

EMS and ODM companies are partici-pating in the current expansion as the composite revenues of 53 of these compa-

nies rose 11% in 1Q’14 vs. 1Q’13. They had their normal first quarter seasonal dip but were up year-on-year (Chart 3).

Based upon data through April the Taiwan listed ODM companies have recov-ered from the post-Christmas & Lunar New Year downturn and should start growing again in late spring (Chart 4).

For printed circuit boards (Chart 5) the Asian seasonal recovery had already begun by April with sequential growth likely to continue until October or November of this year. Even Japan, N. America, and Europe’s PCB sales are growing a small bit!

Looking forward, and thanks to Ed Henderson, electronic equipment growth (Chart 6) is expected to register mid single-digit growth for the next few years.

There are no booms or bust on the

horizon however we live in a fragile finan-cial climate so keep an on the numbers!

End marketsWorldwide IT spending forecast down-graded to 4.1% growth by IDC due to emerging markets and mobile device slow-down.Computers & peripherals• PC shipments declined 1.7% y/y to 76.6

million units in 1Q’14.—Gartner• Laptop computer shipments are

expected to decline by 1-2% in 2014 and will return to positive growth of 2.8% in 2015 and 3.6% in 2016.—TrendForce

• Branded tablet shipments reached 41 million units in 1Q’14; Apple and Samsung combined for 71% market share.—ABI Research

• White-box tablet shipments decreased 27.4% q/q and 2.4% y/y to 20.4 million units in 1Q’14.—Digitimes Research

• Personal & entry level storage ship-ments declined 6.9% y/y to nearly 19 million units in 1Q’14.—IDC

• Worldwide sensor hub shipments are expected to grow 154% y/y to 658 mil-lion units in 2014.—IHS

Telecom and datacom• Smartphone shipments rose 1.13%

q/q to 266.9 million units in 1Q’14.—TrendForce

• Home network penetration is expected to climb from 24.8% in 2013 to 33.2% by 2018.—ABI Research

• Passive optical network equip-ment market is expected to grow at a 22.7% CAGR from USD 4 billion in 2013 to USD 13.6 billion in 2019.—Transparency Market Research

Displays• Flat panel display revenues are will

expand 1% y/y to $131 billion in 2014.—NPD DisplaySearch

• Professional flat panel display ship-ments increased 8% q/q in 4Q’13 to 567,000 units, finishing 2013 with

Walt Custer and Jon Custer-Topai

Global outlook: Modest year-on-

year and sequential growth

Electronic Equipment SuppliersComposite of 141 Public Companies

Revenue, Net Income & Inventory

Computer 13, Internet 9, Storage 10, Communication 20, SEMI 20, Medical 23, Instruments 11, Military 6, Business & Office 3, Consumer 13, Automotive 11

-100

0

100

200

300

400

500

600

Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1

2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 20132014

$ Billions

Revenue

Income

Inventory

+2.9%Preliminary

Chart 1.

Read ListenWatch



20% volume growth.—Futuresource Consulting

• Touch panel revenues are expected to decline 1%, while shipments are forecast to rise 15% in 2014.—NPD DisplaySearch

Other• 3D printer sales for home-use will

grow from 44,000 units in 2014 to over 1 million units globally by 2018.—Juniper Research

• Taiwan ministry committed NT$70 million (US$2.33 million) each year to help local development of 3D printing technology.

• Enterprise wearables market will grow at a 56.1% CAGR to US$18 billion by 2019.—ABI Research

• Wearable device shipments are expected to grow at a 78.4% CAGR from over 19 million units (US$6 bil-lion) in 2014 to 112 million units (US$20.6 billion) in 2018.—IDC

• Medical robotic systems market will grow at 16.1% CAGR from $1,781 million in 2013 to $3,764 million by 2018.—MarketsandMarkets

• Smart home connected appliance installations are forecast to rise from 4 million units in 2013 to over 10 million in 2017.—Juniper Research

EMS, ODM & related assembly activityTop 50 EMS providers’ sales grew 1.9% y/y to USD 254.3 billion in 2013—Manufacturing Market InsiderGerman electronic components (in-house manufacturers and electronic manufactur-ing services provider) market is expected to increase 4.5% to 26.1 billion Euros in 2014.—ZVEI PCB and Electronic SystemsAssel invested in a new Vitronics Soltec Delta 5 wave soldering equipment.Asteelflash closed its Owego, New York plant.Cirtech hired and appointed Rick Pelletier, Ex. VP.Conelec Electronics Manufacturing hired Mark Flynn as Director of Supply Chain Management.Creation Technologies relocated its

Design Center to a 16,000 SF facility in Golden, Colorado.Datest is celebrating its 30 year anniver-sary. Congrats Bob & Regina!Digicom Electronics received ITAR certi-fication.ECR appointed Dan Negrea, CEO and Werner Fischer, Sales Director.Enics • Nova Dubnica, Slovakia plant received

ISO/TS16949:2009 certification from Bureau Veritas.

• Slovakia appointed Miroslav Sagan, GM.

• Suzhou expanded its facility to 5500 SM from 1500 SM.

ESCATEC installed an Elite EM-5700N PCB router in Switzerland.FERCAD Elektronik added three Juki SMT assembly lines and a JUKI RS-1000N nitrogen oven.Firstronic named Steve Fraser, VP of Operations.Flextronics • is investing $15M and hiring 300 new

employees in North Austin, Texas.

Global Electronic Supply Chain Growth 1Q'14 vs. 1Q'13 (preliminary)

3-4

-25

-48

-32

06

-139

114

37

-23

-321

-10 0 10 20 30 40 50Electronic Equipment

MilitaryBusiness & Office

Instruments & ControlsMedical

CommunicationInternet

ComputerData Storage

AutomotiveConsumer

SEMI EquipSemiconductors (SIA)Passive Components

PCBsComponent Distributors

Large EMS (excl Foxconn)ODM

PCB Process EquipmentMaterials

PCB Laminate

% ChangeUS$ equivalent at fluctuating exchange; based upon industry composites including acquisitions

Chart 2.

Global EMS & ODM Companies Composite of 53 Public Companies

Revenue

0

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Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1 Q3 Q1

2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 20132014

US$ Sales @ fluctuating exchangeM

illio

ns +11.1%US $ Billions

Chart 3.

Taiwan ODM CompaniesComposite Sales of 11 Large Manufacturers

0100200300400500600700800900

1,000

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98 99 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14

Apr 2014 was 1.4 above Apr 2013 but 5.3% downsequentially from Mac 2014

NT$ (Billions)

Asustek Computer, Chei Mei, Compal Electronics, Foxconn, Chimei Innolux , Inventec, Inventec Appliance, Lite On Technology, Mitac International, Pegatron, Quanta Computer, Wistron, Chei Mei Display replacing Chei Mei & Innolux Display 3/10 & later

Calendar YearCompany Financial Releases

Chart 4.

World PCB Monthly ShipmentsConverted @ Fluctuating Exchange Rates

0.0

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00 01 02 03 04 05 06 07 08 09 10 11 12 13 14

N AmericaEuropeJapanTaiwan/ChinaRest of AsiaKorea

$ Billions

Source: Custer Consulting GroupCalendar Year

Chart 5.



joined Power Matters Alliance Board of Directors.

• Medical Group received contract to provide design and manufacturing services to Ichor Medical Systems for TriGrid™ DNA delivery systems.

Foxconn/Hon Hai • raised pay at subsidiaries: Innolux,

Foxconn Technology and Zhen Ding Tech.

• appointed Accel Frontline as their war-ranty service partner for Motherboards in India.

• and HP entered JV agreement to create a new line of cloud-optimized servers specifically targeting service providers.

• sold its communications technology patents to Google.

• suspended operations in Vietnam for three days “out of concern for workers’ safety during the May riots.

Interphase added Juki GL screen print-ers, KE-3010 chip mounter, KE-3020V flex mounter, RS-800 8-zone reflow oven, and SW-450 wave solder machine at its new Carrollton corporate and manufacturing facility.Grossenbacher Systeme added THT auto-mation technology from JUKI Europe in St Gallen, Switzerland.Kingfield Electronics refurbished its 3000m² Derbyshire location.Kitron • appointed Peter Nilsson, CEO.• Arendal, Norway received a NOK 80.7

million order from Kongsberg Defence & Aerospace for military communica-tions equipment.

Lacroix increased its overall manufactur-ing area to 12,000 M2 in Kwidzyn, Poland.

Libra Industries appointed Gerry Waldron to Director of Product Realization and pro-moted Bruce McKee to Program Manager.MTI Electronics achieved ISO 9001:2008, ISO 13485:2003 and AS9100C quality stan-dard recertifications.Nam Tai Electronics terminated its elec-tronic manufacturing and design services business and changed its name to Nam Tai Property Inc.Neways acquired BuS Holding GmbH.PartnerTech • appointed Stefan Hansson-Mutas,

Acting President for Electronics Technology division.

• received 3 MEUR contract to provide PCBAs for Exide Technologies.

Plexus • appointed Patrick Jermain, CFO.• spent £1.6m for additional SMT place-

ment line in Kelso, Scotland.REStronics appointed Luke Elliott to South Central U.S. territory (Iowa, Missouri, and Kansas) sales team.Saline Lectronics implemented Cogiscan’s Track, Trace and Control system.Silicon Mountain installed Universal Instruments Fuzion4-120 high-speed and Fuzion2-37 flexible platforms.SMTC appointed Jim Currie, Interim CFO.TT Electronics-IMS opened new engineer-ing office in Cary, North Carolina.Varitron Group acquired Altronics Manufacturing.

PCB fabricationWorld PCB market will grow 4% y/y to $62.294 billion in 2014.—ZVEI PCB &

Electronic SystemsGerman PCB market is forecast to grow 3.9% y/y to approximately 1.43 billion Euros in 2014.—ZVEI PCB and Electronic SystemsAdvanced Circuits is celebrating its 25th anniversary.Aspocomp Group appointed Mikko Montonen, President and COO.AT&S Group achieved automotive quality standard ISO 9001, ISO / TS 16949, envi-ronmental standard ISO 14001 and Health & Safety OHSAS 18001 certifications.Daeduck Electronics began mass-produc-ing four-layer FC CSP measuring 25~30 micrometers in line width for low-end mobile application processor market.Elmatica appointed Michel Buia, Country Manager for French operations.Fittec International Group’s factory in Vietnam was torched and looted by protes-tors.Gardien Services USA added Titan AOI equipment in Dallas, Texas.GCL-Poly acquired 67.99% controlling stake in Same Time Holdings.IBM purchased i3 Electronics CITC testers for in-house PCB reliability testing.Innovative Circuits added an Orbotech Sprint 120 Inkjet printer.Invotec Group appointed Thomas Witt and Monika Braun as Sales Agent and Sales Assistant for Germany.IPC President’s awards recipients were: Daniel Gamota, Jabil Circuit; E. Eddie Hofer, Rockwell Collins; Gerard O’Brien, Solderability Testing & Solutions; Richard Rumas, Honeywell Canada; Tony Senese, Panasonic Electric Works; and Donald Walsh, Uyemura.Kyocera consolidated its North American sales and technical operations of Kyocera SLC Technologies and Kyocera Circuit Solutions USA into Kyocera America.LG Innotek expanded middle to low-end AP product line ranging from high-end six-layer FC CSP measuring 20 microm-eters in width to four-layer model measur-ing 30 micrometers in line width.Malmö Mönsterkort AB appointed Jonas Wackerfeldt, CEO.Merlin Circuit Technology installed a new MECetchBOND process.Precision Technology added a KISS-102 selective soldering system from ACE Production Technologies.Shennan Circuits began small-volume production of wirebond substrates with mass production to start in 3Q’14.Siber Circuits received UL listing for Aismalibar’s Cobritherm line of insulated metal substrate materials.

World 1.0 -2.6 4.3 5.8 6.1

USA -0.9 -4.1 0.9 5.6 5.6

W. Europe -3.4 -3.6 3.2 3.1 3.6

Japan -2.6 -10.3 1.4 2.8 3.2

Four Tigers -1.2 2.3 4.3 5.7 6.2

China 2.6 -2.4 5.6 6.7 7.0

Henderson Ventures 5/2014www.hendersonventures.com

2012 2013 2014 2015 2016

Electronic Equipment Production Growth

Constant $ Growth Rates Converted @ Constant Exchange Rates

Chart 6.



Simmtech plans to begin mass-production of four-layer 25 micrometers width FC CSP for middle to low-end AP market in 2H’14.Taiwan PCB Techvest plans to increase its PCB capacity to 1.5 million SF/ month by the end of 3Q’14.Teknoflex Interconnect Solutions passed AS9100C audit.Unimicron increased HDI board produc-tion the utilization rate to 80-90% due to strong demand from the smartphone sector.Unitech will spend NT$1.5 billion (US$49.62 million) to ramp up its produc-tion capacity of any-layer HDI boards and flex-rigid boards in 2014.WUS Printed Circuits and Schweizer Electronic entered long-term HF PCB pro-duction cooperation agreement.

Materials & process equipmentAgilent Technologies • appointed Paul Clark and James Cullen

to Keysight Technologies Board of Directors.

• named Jay Alexander, CTO of Keysight Technologies.

BASF opened an Electronic Materials Sampling and Development facility in Hillsboro, Oregon.Burkle North America hired Michael Hornbaker as Sales Manager, Coating and Finishing Equipment.Electrolube appointed Phil Kinner, Global Business/ Technical Director for interna-tional conformal coatings division.Enthone Shanghai received ISO 9001 Quality System Management certification.Heraeus entered an invisible patterning technology partnership for conductive polymer films with Toagosei.Isola launched a technology-licensing pro-gram to mitigate conductive anodic fila-mentation problems in the fabrication of PCBs.Liquid Control Ltd changed its name to Fluid Research Ltd.Manz is investing CNY8.0 million (US$1.3 million) to establish a PCB production equipment experimental factory at its existing plant in Suzhou, China.Merck acquired AZ Electronic Materials.MicroCare added a new facility in Singapore.Nidec acquired full ownership of Nidec-Read and Nidec Copal Electronics.Nordson ASYMTEK President, Peter Bierhuis, joined the IPC SMEMA Council.Park Electrochemical is celebrating 60 years in business.

Photo Stencil • added a 35,200 SF manufacturing plant

in Golden, Colorado. • installed its 3rd laser cutting stencil

system in Guadalajara, Mexico.RENA GmbH appointed Jan von Schuckmann to management.Rogers • named David Mathieson, VP of

Finance and CFO.• and Northeastern University opened

an Innovation Center in Burlington, Massachusetts.

SMT North America President, Manfred Maehl retired.Spartanics appointed David Birch, Business Development Manager.Teknek sold its 20,000th clean machine in March, 2014.Tektronix opened a calibration facility in Salt Lake City, Utah.Teledyne • named Rex Geveden, CEO of DALSA

division; Brian Doody retired.• appointed Janice Hess to President of

Engineered Systems segment. Universal Robots opened a 12,000 M2 headquarters in Odense, Denmark.Uyemura, USA, became an eSurface certi-fied supplier.Veeco appointed Shubham Maheshwari, CFO.Vi TECHNOLOGY promoted Jean-Marc Peallat to Global Sales VP.Viscom is celebrating its 30th anniversary.Yamaha Motor IM supplied precision high-speed SMT systems to Carel’s inter-national manufacturing network in Italy, Brazil, China and USA.Zuken expanded E³.series sales and train-ing capacity in Germany.

Semiconductors & other componentsWorldwide semiconductor industry sales reached record $78.47 billion 1Q’14.—SIA/ WSTSWorldwide semiconductor assembly and test services market grew 2.3% y/y to $25.1 billion in 2013.—GartnerWorldwide semiconductor capital equipment spending declined 11.5% y/y to $33.8 billion in 2013; is expected to increase 12.2% y/y to $37.5 billion in 2014.—GartnerWorldwide semiconductor materials market sales decreased 3% y/y to $43.5 bil-lion in 2013.—SEMIWorldwide semiconductor photomask market is forecast to grow from $3.1 bil-lion in 2013 to $3.3 billion in 2015.—SEMIEuropean passives components market is expected to grow 1% y/y to 4.1 billion

Euros in 2014.—EPCIAGerman semiconductor market will grow 5.4% y/y to 11.147 EUR million in 2014.—ZVEI PCB and Electronic SystemsTaiwan IC backend production value is expected to expand 5.9% y/y in 2014.—Digitimes ResearchBluetooth chipset shipments will increase from two billion units in 2012 to over three billion in 2015 and four billion in 2018.—ABI ResearchFabless chip market increased 8% y/y to $77.91 billion in 2013.—IC InsightsIC market is expected to reach US$285.9 billion in 2014, with communications sys-tems accounting for 37.9% of the total, computer systems 36.3%, consumer elec-tronics 11.2% and automotive electronics 7.6%.—IC InsightsIndustrial electronics chip market rev-enue grew 9% y/y to $32.8 billion in 2013 and is expected to grow 11% y/y to $36.4 billion in 2014.—IHSTablet applications processor market revenues are set to grow at a 5-year 14.6% CAGR to $7.2 billion in 2018.—Strategy AnalyticsTablet microprocessors represented nearly 6% of worldwide MPU sales in 2013 compared to 4% in 2012, while cellphone application processors accounted for 25% of revenue total, up from 22% in 2012.—IC InsightsWorldwide sensors and actuators sales are forecast to grow 14% y/y to $9.9 billion in 2014 and an additional 16% y/y in 2015 to $11.4 billion.—IC Insights

Walt Custer is an independent consultant who monitors and offers a daily news service and market reports on the PCB and assembly automation and semiconductor industries. He can be contacted at [email protected] or visit www.custerconsulting.com.

Jon Custer-Topai is vice president of Custer Consulting Group and responsible for the corporation’s market research and news analysis activities. Jon can be contacted at [email protected].

Title


Please tell us about your company, and its business lines?

Founded in 1975, ASM Pacific Technology Ltd. (ASM PT) now stands as the world’s largest assembly packaging equipment supplier for the semiconductor and LED industries. It produces and markets semi-conductor equipment and operates in vari-ous countries, such as Hong Kong, China, Singapore, Malaysia, and most recently,

Germany. Its stakeholders range from mul-tinational chip manufacturers, indepen-dent IC assembly houses, and customer electronics companies.

What’s the primary reason for your par-ticipation at the SEMICON Singapore 2014 show?

ASM PT’s attendance in this year’s SEMICON Show in Singapore is meant to showcase the best of the company’s inno-

vations and new offerings, including its new machines as well as new partners in the industry. This exhibition is an oppor-tunity to demonstrate to both current and prospective customers the capabilities and solutions ASM PT can offer, in order to further solidify its position as the “solution provider.” By utilizing various marketing collaterals, such as posters, brochures, etc., as well as marketing support team, ASM strives to maximize customer experience.

Tell us about your products on display at the show. Are there any new launches?

We displayed advanced packaging solutions, such as the flip chip system, thin/stacked-die mounting system, and test handler. They are the systems with the latest inno-vation, e.g. Eagle Xpress GoCu high speed wire bonder for wider substrates, ISLinDA automatic die bonder, AD8312FC auto-matic flip chip bonder specially designed for low pin chip packages, iHawk Xpress XL ball bonder for LED/Opto application, FT-Mini Turbo automatic turret-based test

Interview—

Debasish Choudhury met Avian Ho, Marketing Director of ASM Pacific Technology Ltd during his visit to SEMICON Singapore 2014 show in April 2014. ASM PT was the largest exhibitor on the show floor, and showcased the best of the company’s innovations and new offerings, including its new machines in Southeast Asia’s largest annual gathering for the semiconductor manufacturing industry.

Interview

Avian Ho, ASM Pacific Technology Ltd


Title

& finish handler, and AD9212 automatic flip chip bonding system with dual bond heads system.

In semiconductor packaging, is the tran-sition from silver (Ag) to copper (Cu) wire bonding now complete?

Copper (Cu) wire will be mainstream, with silver (Ag) wire used for memory applica-tions in general and gold (Au), being the most expensive, and will be used for spe-cial applications.

How does it benefit the semiconductor industry at large?

It brings down the cost of assembly/pack-aging significantly in the order of over 10 times over gold (Au) wire bonding.

Please give us a “birds-eye view” of the Southeast Asian semiconductor market. What are the new emerging manufactur-ing hubs in the region?

Southeast Asia is one of the regions with the highest growth rate for capacity in the microelectronics industry, with its microelectronics manufacturing market accounting for more than 27 percent of the world’s assembly, packaging, and test production ( by Gartner). In particular, SEA will be most suited for high end or advanced semiconductor packaging. It has the experiences that were built on in the last two to three decades. In addition to this, high end testing for semiconduc-tor will also fit nicely, as well as IC solution design.

While Singapore remains the hub of microelectronics industry in the region, Malaysia, Philippines and Thailand repre-sent significant shares of global square footage. The Southeast Asia region as a

whole is growing rapidly as it consistently adapts itself to the changing dynamics of the microelectronics industry.

How do you rate Vietnam as a semicon manufacturing hub?

We believe that Vietnam is soon to become Southeast Asia’s next big center for elec-tronics manufacturing hub as there is a growing wave of high-tech investors expanding in Vietnam. It has the poten-tial to grow and may be niche like the Philippines and Malaysia in the past. Also, Vietnam’s economy is one of the fastest growing economies, where it is focused on being market-oriented along with liberal-ized government laws. The semiconduc-tor consumption in Vietnam is continu-ously on the rise where the semiconductor industry in Vietnam is booming, and it is expected that many international partici-pants will set their operations in Vietnam in the near future, becoming the next

manufacturing hub and a major economic force to reckon with.

How do you assess the future of the elec-tronics industry in general in the SE Asia region?

The future will be great as long as higher value-add products are offered or built in this part of the world. The electronics industry in Southeast Asia places increas-ingly greater emphasis on the key trends and technologies in semiconductor design and manufacturing. The focus is now on serving the needs of expanding applica-tions markets in mobile devices and other connected IoT technologies, which will, in turn, lead to the development of special-ized technologies and processes. As such, this trend will contribute in the overall

advancement of the electronics industry in the SEAsia region in the foreseeable future.

Earlier this year, Indian government approved two fab investments totaling close to US$ 9 billion, whereas Singapore houses over a dozen Fab units. Do you think India is finally geared for the fab leap?

Yes. It is always a good case. India is one of the world’s rapidly growing countries with big potential and various resources for the electronics manufacturing indus-try. This can be seen by the increasingly high demand for electronics goods, espe-cially automotive and telecommuni-cation devices, over the last few years. Furthermore, the Indian Government has implemented policies to boost the coun-try’s manufacturing capability and pro-mote the production of electronics goods locally. The 2 Fab investments can be the start of semicon manufacturing in India. When the rest of the supply chain follows suit, the fab leap will take off.

I am aware that ASM PT places great value on research and development. The company spends roughly ten percent of sales on R&D. Will you conduct these activities together with ASM Assembly Systems, ASM ALSI in the future too?

Every year, we try our best to make sure at least 10% of sales are invested into R&D so that we continuously develop and innovate in our solutions and technologies.

What are the goals for ASM Pacific Technology this year and over the medium term?

This year, one of our main focuses is on leading the market players and serving our customers in order to provide the best in cost solutions. Also, it will be a significant and exciting milestone for us with new product launches and customer events.

I want to thank you for talking to us today. Best of Luck, Avian!

—Debasish Choudhury

Interview


SEMICON Singapore loses its sheen, moving to Malaysia in 2015

According to Gartner, the Southeast Asia microelectronics manufac-turing market accounts for more

than 27 percent of the world’s assembly, packaging, and test production, and Malaysia alone represents over 10 percent of the global square footage, followed closely by the Philippines, Thailand and Singapore. According to the SEMI World Fab Forecast, Southeast Asia is among the top four regions in terms of growth rate for capacity. In 2014, approximately $800 million of front end Fab spending will occur in Southeast Asia.

In the backdrop of this projected investment in the region, SEMICON Singapore, Southeast Asia’s largest annual gathering for the semiconductor manu-facturing industry for the last 20 years, opened its doors for the 2014 edition on 23 April at the Marina Bay Sands Expo & Convention Centre. The principal focus of the show, as always, was semiconductor design and manufacturing. But, this year, the added emphasis was on serving the needs of expanding applications markets in areas including mobile devices and other connected “Internet of Things” (IoT) tech-nologies, many of which require develop-ment of specialized materials, packaging, and test technologies, as well as new archi-tectures and processes — technologies addressed by a growing number of compa-nies located across Southeast Asia.

During his opening address, KC Ang, Sr. VP and GM for GLOBALFOUNDRIES Singapore said, “The global semiconductor industry is growing at a CAGR of 9% annually. This is largely due to the perva-sive and explosive growth of mobility and Internet of Things trend. Today, we see more and more mobile and connected devices to the Internet of Things (IoT). Gartner forecasts that by 2020, 50 billion connected devices will be in use. That works out to be about 7 devices for every person in the world. This trend not only presents growth opportunities, but it also creates a revolution in our industry. We need to be able to address the technological chal-

lenges through innovation and change the way we engage customers and ecosystem partners.” He also added, “Singapore has 14 semiconductor wafer fabrication plants, 20 assembly and test operations factories and 40 IC design centers. According to official data, our segment remains an important and key economic growth indicator for this country, as it contributes to more than 50% of the total electronics output for Singapore.” He also talked about three major initiatives in driving Singapore’s semiconductor industry. “Firstly, Singapore needs to sustain the growth while staying competitive. Secondly, Singapore needs to attract talents and develop leaders, and thirdly, Singapore needs to continue to promote collaborations and going regional.”

The three-day show had exhibi-tors from across the globe showcasing the latest processes, materials, tools and technologies used in the manufacture of today’s most advanced electronic products. The lead exhibits at the show were ASM Pacific Technology, Chroma ATE, DISCO Hi-Tec (Singapore), Yaskawa Electric, Mechatrolink, Tokyo Electron,

Ueno Seiki and USL Technology to name a few. Also, two focussed country pavil-ions—‘Singapore Pavilion’ by Singapore Manufacturers Federation (SMF) and ‘Malaysia Pavilion’ by Malaysian Investment Development Authority (MIDA) were on the show floor.

Aligning with this year’s theme “Internet of Things,” a SMART Pavilion was set up on the show floor to showcase the future of SMART Living, where visitors were able to witness and experience the magic of semiconductor technologies and how they are going to change and enhance our everyday lives in the future through SMART home automation, driverless cars, and many more.

SEMICON Singapore also had a host of special programmes and forums to highlight the industry’s major tech-nology trends and investment and expan-sion opportunities in semicon manufac-turing. These included a forum on market trends analysis, fabless/IDM technology challenges, LED technology and MEMS technology forums, etc. Alongside these programs, ASM Group organised a

SEMICON Singapore loses its sheen, moving to Malaysia in 2015Debasish Choudhury


SEMICON Singapore loses its sheen, moving to Malaysia in 2015

seminar on “Advanced Packaging on the Impact of Future Semiconductor” on 23 April. Speaking on the occasion, Sylvester Demmel, Product Manager, ASM AS Germany said, “In today’s manufacturing process, wafer level packaging (WLP) is especially very important. since it signifi-cantly reduces the size, as well as the thickness, of the packages. This helps in manufacturing mobile devices, such as smart phones, tablet PCs, laptops, and also for the growing market of wearable devices. At the same time WLP allows for lower energy consumption, especially for high frequency applications, which allows for longer lasting batteries in the mobile applications. Last but not least, WLP leads to better performance and better design flexibility.”

It was heartening to learn that Singapore’s semiconductor industry

employs approximately 42,000 people and is one of the most advanced hubs in the region. It contributes over 5% of the nation’s GDP and 37% of all R&D spending by the manufacturing industry. A dazzling high-tech industry is not sustain-able without an equally strong and talented workforce of engineers and technolo-gists. The Singapore government through its agencies—i) Singapore Workforce Development Agency (WDA) and ii) e2i (Employment and Employability Institute)—are trying to address this niche sector to maintain Singapore’s competitive edge over other Southeast Asian nations. SEMI also continued its commitment to cultivate the best talent in Southeast Asia for its member companies and industry by presenting SEMICON University Program and the Job Fair for the second consecutive year. Plus, this year, a new online job portal

was launched to help companies connect with the best available talents in the region.

In spite of SEMI’s best efforts, the SEMICON Singapore show has been shrinking every year. Finally, seeing the changing dynamics of the microelec-tronics industry in Southeast Asia, SEMI announced that its SEMICON show would now rotate between Singapore and other locations within Southeast Asia. The expanded event—named SEMICON Southeast Asia—will have its inaugural show in Penang, Malaysia in 2015. We are also looking forward to attending the new show next year.

Title


SIPLACE SX - #1 in Flexibility

With gantry modularity, SIPLACE SX easily answers the challenge of demand fluctuations which is common challenges in EMS. The gantry modularity allows users to quickly response to fluctuate pro-duction volume in a short notice. Moreover, SIPLACE SX gains additional flexibility from SIPLACE MultiStar CPP (Collect & Pick & Place) head which combines the different placement mode in a single unit. With this mode, operators no longer have to change the placement heads of configu-ration, and the head selects the appropriate placement mode automatically during pro-duction. SIPLACE SX can also be equipped with the flexible tray feeder, Waffle Pack Changer (WPC6). It comes with a Non-Stop Module which allows tray replenishment without stopping the WPC6. Therefore, machine placement process remains unin-terrupted. www.siplace.com

Autotronik LD812V4 LED pick and place machine specifically designed for LED assembly

Unlike standard pick & place machines that have been adapted to LED assembly, the LD812V4 is purpose built for assem-bling LED boards. LD812V4 places LED

components from 0201 to 8mm x 8mm, including both standard and irregularly shaped LEDs. Bottom vision is available to expand the component range to 20mm x 20mm. Each of the four placement heads of LD812V4 features positive air pressure to release ‘sticky’ LED components. Non-Stick, Teflon coated nozzles and custom nozzles are available. Domed LEDs can be safely placed using placement nozzles designed not to come in contact with the optical lens during pick & place, protecting the component. www.autotronik-smt.com

We Care—A Living Philosophy at ZESTRON Whether evaluating, optimizing, or moni-toring your cleaning processes, ZESTRON’S team of process engineers is available to support you at any time. ZESTRON’s pro-cess engineers offer extensive and com-prehensive support, especially when you are looking for a new cleaning process. In addition to the personal care you receive as a matter of course, ZESTRON’s Technical Centre is available to you with its wide range of cleaning equipment from leading manufacturers to conduct free of charge cleaning trials with your assemblies or stencils.

If you are looking for a new cleaning process, want to improve your existing one, or simply want to find out more about process monitoring, please do not hesitate to contact ZESTRON’s official Indian Sales Partner Mectronics Marketing Services. www.mectronics.in

Speedline launches space-saving MPM® Momentum® BTB (back to back) printers

SMT electronics assemblers can nearly double their stencil printing throughput

without doubling their machine footprint with the new MPM Momentum BTB (Back to Back) printer. The MPM Momentum BTB is a space-saving 200 mm shorter than the standard Momentum with an over-all length of 2.8 m for the two machines. Configured for Back-to-Back (BTB) pro-cessing, e.g., two individual printers posi-tioned back to back in a manufacturing line, it enables dual lane processing with the combined output of two machines, con-serving floor space and creating a shorter manufacturing line length.www.speedlinetech.com

MYDATA releases new MY600 Jet Printer

The next-generation MY600 Jet Printer now enables SMT producers to achieve optimal solder joints on complex boards with a 50% increase in throughput, compared to earlier jet printer generations. Having pioneered jet printing of solder paste for electronics manufacturing, MYDATA is now intro-ducing a further innovation to boost speed and quality. Called the MY600 Jet Printer, the new platform allows SMT producers to achieve high-precision solder joints at speeds of more than one million dots per hour. Increasingly, the jet printing of solder paste onto PCBs is being used at all levels of the industry to cope with complex broad-band and mixed technology boards, among other factors. www.mydata.com

Juki releases new RS-600 six zone reflow oven Juki Automation Systems (JAS), Inc., announced the release of its new RS-600 Six Zone Air and Nitrogen Reflow Ovens.

New productsNew products


New prodcuts

The new model will greatly assist Juki in promoting its “Total Line Solutions” sales strategy into LED and OEM accounts. The RS-600 reflow ovens offer the same fea-ture set as the larger 8- and 10-zone ovens, such as; a top and bottom Independent Air Velocity Controlling System that allows for flexible processing control to easily handle complicated lead-free soldering require-ments, a four way air recycling system in each zone, and an efficient power design and air management system.www.jukiamericas.com

Alpha launches SnCX Plus ™ 07 wave solder and rework lead-free alloy

New ALPHA® SnCX Plus™ 07 is a lead-free, silver-free alloy developed by Alpha, con-sisting of tin, copper and several unique additives designed to enhance alloy perfor-mance. It is engineered to be a cost effective alternative to other lead-free, silver-bearing alloys in terms of overall performance and reliability on standard complexity single and dual sided electronic assemblies. It can be used as a replacement for SnPb, SAC and other lead-free, silver-free alloys in wave, selective soldering, lead tinning and rework processes. alpha.alent.com

Nordson EFD offers new manual, pneumatic, and cordless guns for dispensing two-component adhesive materialsNordson introduces a new line of manual, pneumatic, and cordless guns for dispens-ing two-component adhesives. The guns make dispensing even the thickest mate-rials easier and less cumbersome. A 26:1 thrust ratio enables a lighter touch to dis-pense more material with each trigger pull. The dispensing guns are ergonomic, lightweight, and easy to load with a unique secured snap feature. They dispense two-component materials for applications such as injection into cracks, concrete anchor-ing, fixturing, windshield installation/replacement, and bumper repair in markets such as construction, automotive aftermar-ket, and aerospace. www.nordsonefd.com

Pantera X-plus–Essemtec’s proven pick-and-place system for small batches

With more than 1500 installations world-wide, the Pantera X pick-and-place system from Essemtec offers new benefits for highly flexible small batch assembly. The field-proven machine was further devel-oped and supplemented in order to better cover the ever-increasing demands for future component accuracy and diversity. The enhanced X-vision system includes further improved image processing for small chip components and complements the existing on-the-fly laser centering fea-ture. The combination of fast laser center-ing and high-precision image processing now allows customers to achieve the best possible placement results in this machine segment. www.essemtec.com

KIC discontinues SlimKIC 2000 and KIC Explorer profilersKIC has announced that effective immedi-ately the SlimKIC 2000 and KIC Explorer lines of profilers are no longer available for sale. The profilers have been extremely popular in the electronics assembly and semiconductor markets for the past sev-eral years. However, as new and improved technologies have been developed and implemented in KIC’s more advanced X5 profiler, the time has come to move on to a new generation of profile setters. kicthermal.com

ACE debuts new dual pot in-line selective soldering systemACE Production Technologies, Inc. is pleased to debut its new dual pot in-line selective soldering system that substan-

tially increases the throughput of the selective soldering process. The new KISS-103ILDP dual pot in-line selective solder-ing system significantly reduces the overall process time by concurrently soldering two different printed circuit boards utiliz-ing two separate solder pots, each equipped with their own independent X-Y-Z axis positioning system. www.ace-protech.com

Mentor Graphics design and verification tools certified for TSMC 16nm FinFET productionMentor Graphics Corp. announced that its IC design to silicon solution has achieved certification for TSMC’s Design Rule Manual (DRM) and SPICE model ver-sion 1.0 for its 16nm FinFET process. The certification includes tools in the Calibre® physical verification and design-for-man-ufacturing (DFM) platform, as well as the Olympus-SoC™ place and route system, the Pyxis™ custom IC design platform, and Eldo® SPICE simulator. Mentor also suc-cessfully demonstrated a complete 16nm FinFET digital flow using the Olympus-SoC and Calibre products and the ARM® Cortex®-A15 MPCore processor as the validation vehicle. www.mentor.com

Seika Machinery now offers UNITECH UC-250M-CV PCB board cleanerSeika Machinery, Inc., now distrib-utes the UNITECH UC-250M-CV PCB Board Cleaner. The new UC-250M-CV takes all the features of the UC-250M and adds a dual clean-ing feature using a combination of a brush roller with the silicone/adhesive cleaning rollers. The combination dual dust removal system ensures better results than a single brush or adhesive roller system. Like the UC-250M, the UC-250M-CV has the ability to clean the top surface of PCBs, even chip compo-nents attached on the bottom side. www.seikausa.com

SUSS MicroTec launches the new Mask Aligner MA12SUSS MicroTec has launched the Mask Aligner MA12. This semi-automated tool


New prodcuts

is designed for industrial research and production of wafers up to 300 mm and 300x300 mm square substrates. It repre-sents the latest mask aligner technology in terms of accuracy, optical performance and versatility. The operator assisted MA12 offers highest process flexibility includ-ing submicron alignment and features the MO Exposure Optics of SUSS MicroTec, a unique illumination optics, adjustable to meet various exposure requirements.www.suss.com

Indium10.1 Pb-free solder paste provides lowest voiding levels for large ground planes

Indium Corporation’s Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of void-ing for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of Indium10.1 promote indus-try-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations. www.indium.com

Engineered Material Systems Debuts DF-4017 Hydrophobic Dry Film Negative Photoresist

Engineered Material Systems, Inc., intro-duces the DF-4017 Dry Film Negative Photoresist for use in micro-electrome-chanical systems (MEMS). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers. DF-4017 film was developed to produce extremely hydrophobic (>90° con-tact angle) film surfaces. The cured chem-istry can withstand harsh environments

including resistance to extreme mois-ture conditions and corrosive chemicals. www.emsadhesives.com

Techspray introduces Fine-L-Kote high viscosity AR conformal coating

Techspray expands their conformal coating offering with Fine-L-Kote High Viscosity AR. This new product is now a part of Techspray’s Fine-L-Kote line. Fine-L-Kote High Viscosity AR (part #2151) is an inno-vative acrylic conformal coating that gives PCB assemblers a wider process window and greater flexibility in their coating operation. High viscosity allows operators to use as-is for dipping, or to thin down for spray systems. Either 2105 or 2110 Techspray Conformal Coating Thinners are able available to reduce the viscosity to fit ideal process parameters.www.techspray.com

Aqueous Technologies introduces the industry’s newest defluxing system

Aqueous Technologies is pleased to intro-duce the newest model in the Trident family of fully automatic cleaning/deflux-ing systems—Trident ZDO. Trident ZDO is completely zero discharge, automatically washes, rinses, verifies cleanliness, and fully dries assemblies within a single compact

machine. With Trident ZDO, there is no need to purchase separate water recycling systems as both the wash-solution recy-cling system and the rinse-water recy-cler are already built into the machine. www.aqueoustech.com

Count On Tools offers ASM Siplace discontinued 702/902 nozzlesCount On Tools Inc. (COT) offers the discon-tinued 702/902 nozzle for ASM Siplace equipment. ASM phased out the 702/902 nozzles in January 2013 with the 706/906 being offered as a direct replacement. Due to higher customer demand, COT con-tinued production of the 702/902 nozzles in anticipation of custom-ers still seeking to use the 702/902 nozzle geometry for 0201 (0.6 x 0.3 mm) and 0402 (1.0 x 0.5 mm) components in their pick-and-place equipment. www.cotinc.com

GOEPEL electronic extends IEEE1445 Interface for connection to board level simulationGOEPEL electronic’s special tool series for the test of complex circuitry functions within the frame of the Boundary Scan software platform SYSTEM CASCON™ now enable direct coupling of SYSTEM CASCON to CAE environments. Concurrently, the import of DTIF vectors and timing sets provides opportunities to execute deterministic dynamic functional tests on board level and combine them with other procedures such as Boundary Scan (IEEE 1149.x) or in-system programming. www.goepel.com

Optically clear UV curable system offers high bond strength and fast curesSpecially formulated to optimize bond strength, Master Bond UV15-42C is a UV curable system for bonding, sealing and coating applications. This smooth paste can be applied vertically without sagging. As an optically clear compound, it is often used in the fiber-optic, optical, electronic, aero-space and specialty OEM industries.www.masterbond.com


IESA congratulates new government; envisions partnering to drive Development and Growth through ESDMIndia Electronics and Semiconductor Association (IESA) welcomes the forth-coming government and extends its full support to their vision of Development, Growth and e-Governance, making India a manufacturing and innovation centre for domestic and global players in the electron-ics industry.

“We envisage encouragement to the industry and focus on building fab units and electronic manufacturing clusters with an investment potential of over 75,000 crores in short term and cumulatively employing 2.8 crore people by building local eco system within the next 10 years”, said Mr. Ashok Chandak, Chairman, IESA.

The National Policy on Electronics was the first step in the right direction. Moving forward, it has to be strengthened with, inter alia, setting up of Electronic Commission and implementation of policy measures to enable the country attain global competi-tiveness. Additionally, certain areas which need further encouragement include promoting global scale manufacturing for hardware systems, inviting global compo-nent suppliers to set shops in the country and creating Electronic Development Fund (EDF) to promote innovation.

Mr. M.N. Vidyashankar , President, IESA added , “IESA envisions working with the forthcoming government to enable India reclaim its global leadership position in science and technology and attract investments in the private sector. R&D needs a boost to make way for more patents and products made in India. Additionally, declaring electronics as a priority sector, addressing the disabilities ranging from 7-26%, strengthening fabless product ecosystem and encouraging for domesti-cally manufactured electronic products are important initiatives the industry is looking forward to.”

SMTA-IC hosts May quarterly Chapter meeting & technical seminar in ChennaiSMTA-India Chapter’s Quarterly meet-ing & technical seminar would be held on Friday, May 30th 2014 at Sathyam Grand Resorts, Sriperumbudur (Opp. Nokia Factory) near Chennai.

Apart from the Chapter meeting which would be attended by the office-bearers; there is a day-long technical seminar as well. Rajeev Kulkarni, President SMTA India Chapter would talk about “SMTA: Your Best Investment” which would be followed by 3 technical presentations. First by Krishnaraj Kapadia, Rogers Corporation on “Material Selection Criterion for Power Amps, Antennas and other RFcomponents for Base Stations and other Telecom Applications”; Liyakathali Koorithodi, Indium Corporation—“PCB Surface Finishes – Implication on SMT Yield”; and Sakthivel Padmanapan, Asahitec Stencils—“Workshop on SMT Stencils”. The concluding presentation by Amba Prasad & Ankan Mitra, SMTA India Chapter Officer—“Curtain Raiser 2—Top 10 DFM TQ’s—are they Show Stoppers?”. The program would end with honoring the India Chapter officers by the President.

If you are interested to attend SMTA-IC program, please contact: Ankan Mitra (T: 09620075752, [email protected]) or Sudarshan (T: 09900411299, [email protected]).

ELCINA to host 5th Strategic Electronics Summit (SES) in Bangalore ELCINA announces the 5th edition of its flagship event Strategic Electronics Summit – Defence & Aerospace 2014 to be held during 30-31 July, 2013 at Bangalore International Exhibition Centre (BIEC), Bangalore. The Strategic Electronics sector presents an unprecedented opportunity as well as challenge for India. Realising this, the idea of SES was mooted by ELCINA in 2009. Government initiatives such as Defence Offsets and Defence Procurement Policy have opened a host of opportuni-ties which the domestic industry must seize. SES is credited with being India’s first

Defence & Aerospace Electronics Event which captured the opportunity created by DOFA & DPP.

Earlier editions of SES witnessed immense interest and keen participation by the industry recognizing the business pros-pects that the defence sector offers. The objective of SES is to bring this opportunity to all industry players who are keen to gain from and contribute to the growth of the Strategic Electronics industry in India and enable greater domestic value addition and indigenization.

The event will consist of a Conference, a Mini Exhibition and Buyer Seller Meet for facilitating sourcing opportunities from domestic manufacturers and vendors. This year the event will be of two days and expecting much more participation compared to previous editions. For partici-pation and sponsorship opportunities, please write to [email protected] or visit www.elcina.com

SEMICON Southeast Asia to be launched in 2015SEMI announced the expanded scope of its industry-leading SEMICON regional exposition which will now rotate between Singapore and other locations within Southeast Asia. Building on the twenty-year history of SEMICON Singapore, the expanded event—branded SEMICON Southeast Asia—will have its inaugural event in Penang, Malaysia in 2015.

The new SEMICON Southeast Asia will continue to focus on the key trends and technologies in semiconductor design and manufacturing, adding emphasis in serving the needs of expanding applications markets in areas including mobile devices and other connected “Internet of Things” (IoT) technologies, many of which require development of specialized materials, packaging, and test technologies, as well as new architectures and processes—tech-nologies addressed by a growing number of companies located across Southeast Asia. SEMI will continue to maintain its regional headquarters in Singapore.

Association & institutes news

Association & institutes news


International diary

International Diary10-12 June 2014NEPCON MalaysiaPenang, Malaysianepcon.com.my

19-22 June 2014NEPCON ThailandBangkok, Thailandnepconthailand.com

30 June-4 July 2014IEEE SECONSingaporeieee-secon.org

23-25 September 2014productronica India & electronica IndiaBangalore, Indiaproductronicaindia.com

6-9 October 2014TaitronicsTaipei, Taiwanwww.taitronics.tw

13-16 October 2014electronicAsiaHong Kongelectronicasia.com

14-17 October 2014Korea Electronics ShowSeoul, Koreakes.org

11-14 November 2014electronicaMunich, Germanyelectronica.de

3-5 December 2014International PCB & Electronics FairShenzhen, Chinahkpca-ipc-show.org

3-5 December 2014SEMICON JapanMakuhari, Japansemiconjapan.org

14-16 January 2015INTERNEPCON JAPAN Tokyo, Japannepcon.jp/en/

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Go Further

2014 Global Technology Awards

For complete rules & to enter, visit awards.globalsmt.netDeadline for entries: July 11, 2014

• Adhesives/Coatings/Encapsulants• Assembly Tools• Bonding Equipment• Cleaning Equipment• Cleaning Materials• Tier 1 Contract Svs ( >$100M)• Tier 2 Contract Svs ($50-100M)• Tier 3 Contract Svs ($25-50M)• Tier 4 Contract Svs (<$25M)• Dispensing Equipment• Flux• Hand Soldering

• Inspection—AOI Systems• Inspection—SPI Systems• Inspection—X-Ray Systems• LED Production Equipment• Placement Equipment—Low to

Medium Volume• Placement Equipment—High Volume• Printing Equipment• Programming• Rework & Repair• Software—Process Control• Software—Production

• Solder—Bar and Cored Wire• Solder Paste• Soldering Equipment—Reflow• Soldering Equipment—Selective• Soldering Equipment—Wave• Soldering Equipment—Other• Stencils• Storage Systems• Test Equipment• Test Services

Plus:• Best Product—Asia• Best Product—Europe• Best Product—North America• Best Distributor—Asia• Best Distributor—Europe• Best Distributor—North America• Best Environmentally Friendly

Product

GET RECOGNITION FOR THE THINGS YOUR COMPANY DOES BEST

The Global Technology Awards have been recognizing the very best new innovations in the printed circuit assembly and packaging industries since 2005. Each year, the field of entries is scored by an independent, international panel of judges on six different criteria—innovation, speed/throughput improvements, quality contribution, cost benefits, environmental consideration, ease of use/implementation, and maintanability/repairabil-ity—to determine the best new technologies and services introduced in the previous year.

Entries for the 10th annual Global Technology Awards are invited from equipment, materials and EMS companies of all sizes. The deadline is July 11, 2014. All products and services introduced between August 1, 2013 and July 31, 2014 are eligible. This year’s ceremony will take place Sep-tember 30 at SMTA International in Chicago, Illinois. For more information, visit awards.globalsmt.net.

www.globalsmt.net

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