sop 62 pitch 0.80 mm · 2020. 7. 2. · sop 62 -pitch 0.80 mm general description key features pin...
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3D PLUS reserves the right to cancel or change specifications without notice.
3DSD4G16VS8483
The 3D SD4G16VS8483 is a high-speed highly inte-
grated Synchronous Dynamic Random Access Memory
containing 4.294.967.296 bits.
It is organized as eight banks of 512Mbit.
Each bank has a 16-bit interface and is selected with
specific #CS. All other signals are common to the eight
512Mbit SDRAM memories.
Each memory in the bank is organized as 32Mx16-bit.
It is particularity well suited for use in high reliability,
high performance and high density system applications,
such as solid state mass recorder, server or work-
station.
The 3D SD4G16VS8483 is packaged in a 62 pin SOP.
Stack of eight 512Mbit SDRam.
Organized as 256Mx16-bit.
Single +3.3V power supply.
Fully synchronous; all signals registered on positive
edge of system clock.
Internal pipelined operation; column address can be
changed every clock cycle.
Programmable burst length; 1, 2, 4, 8 or full page.
Auto precharge includes concurrent auto
precharge, and auto refresh modes.
Self refresh modes.
LVTTL-compatible inputs and outputs
Available Temperature Range:
0°C to 70°C
-40°C to+85°C
Available with screening option for high reliability
application (Space, etc…)
SOP 62 - Pitch 0.80 mm
GENERAL DESCRIPTION
KEY FEATURES
PIN ASSIGNMENT (top view)
FUNCTIONAL BLOCK DIAGRAM
3DFP-0483 REV 3 — February 2020
All other signals are common to the eight memories.
1 #CS4 17 LDQM 33 #CS5 49 VDDQ
2 #CS3 18 #WE 34 VSS 50 DQ9
3 VDD 19 #CAS 35 A4 51 DQ10
4 DQ0 20 #RAS 36 A5 52 VSSQ
5 VDDQ 21 #CS0 37 A6 53 DQ11
6 DQ1 22 BA0 38 A7 54 DQ12
7 DQ2 23 BA1 39 A8 55 VDDQ
8 VSSQ 24 A10 40 A9 56 DQ13
9 DQ3 25 A0 41 A11 57 DQ14
10 DQ4 26 A1 42 A12 58 VSSQ
11 VDDQ 27 A2 43 CKE 59 DQ15
12 DQ5 28 A3 44 CLK 60 VSS
13 DQ6 29 VDD 45 UDQM 61 NC
14 VSSQ 30 #CS1 46 #CS7 62 NC
15 DQ7 31 #CS2 47 VSS 63
16 VDD 32 #CS6 48 DQ8 64
MEMORY MODULE
3Gbit SDRAM
Organized as 128Mx32, based on 128Mx4
SDRAM
3D PLUS reserves the right to cancel or change specifications without notice.
DC operating conditions and characteristics
PARAMETER SYMBOL MIN MAX UNIT
Supply voltage VDD 3.0 3.6 V
Input logic high voltage VIH 2.0 VDD +0.3 V
Input logic low voltage VIL -0.3 0.8
Output logic high voltage VOH 2.4 - V
Output logic low voltage VOL - 0.4 V
PARAMETER SYMBOL VALUE UNIT
Voltage on any pin relative to VSS VIN, VOUT -1.0 to
VDD +0.5 V
Storage temperature TSTG -65 ~ +150 °C
Power dissipation PD 2 W
Short circuit current ICS 50 mA
DC Characteristics
Absolute maximum ratings
PARAMETER SYMBOL VALUE UNIT
Operating Current (one bank active) IDD1 385 mA
ICC2P 32 mA Standby Current power down mode
ICC3P 251 mA Active
HEADQUARTERS (FRANCE) TECHNICAL CENTER (USA) DISTRIBUTOR
408 rue Hélène Boucher - ZI 78530 Buc
Tel: +33 (0)1 30 83 26 50 E-mail: [email protected]
www.3d-plus.com
151 Callan Avenue - Suite #310 San Leandro, CA 94577
Tel: (510) 824-5591 E-mail: [email protected]
3DFP-0483 REV 3 — February 2020
MODULE MARKING
MECHANICAL DRAWING
3DSD4G16VS8483 X X
Temperature Range
C = (0°C to +70°C) I = (-40°C to +85°C) S = Specific (-40°C to +105°C)
Quality Level
N = Commercial Grade B = Industrial Grade S = Space Grade
3D PLUS SALES OFFICES
Dimensions (mm)
MIN MAX
A 11.80 12.50
A2 10.70 11.10
D 27.00 27.40
E 13.40 13.80
E1 10.85 11.05
b 0.35
e 0.80
Max. weight: 7.80 g
MEMORY MODULE
3Gbit SDRAM
Organized as 128Mx24, based on 128Mx4
SDRAM