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© 2011 QUALCOMM Incorporated. All rights reserved. 1

Snapdragon S4 System on Chip

Analyst Webinar 10/19/2011


New Snapdragon Brand and Roadmap

Snapdragon System 1

Processors

For Mass Market

Smart Phones

S1 Class includes: 65 nm Up to 1GHz CPU Up to Adreno

200 GPU Up to 3G HSPA

Snapdragon System 2

Processors

For High Performance Smart Phones & Tablets

S2 Class includes: 45 nm Up to 1.4GHz CPU Adreno 205 GPU 3G HSPA+ 1024x768 display 720p/Dolby 5.1 Stereoscopic 3D

Snapdragon System 3

Processors

For Multi-tasking & Advanced

Gaming

S3 Class includes: 45 nm Up to 1.5GHz

Dual-CPUs Adreno 220 GPU 3G HSPA+ 1440x900 display 1080p HD/Dolby 5.1 Stereoscopic 3D

Features Overview


New Snapdragon Brand and Roadmap

Snapdragon System 1

Processors

For Mass Market

Smart Phones

S1 Class includes: 65 nm Up to 1GHz CPU Up to Adreno

200 GPU Up to 3G HSPA

Snapdragon System 2

Processors

For High Performance Smart Phones & Tablets

S2 Class includes: 45 nm Up to 1.4GHz CPU Adreno 205 GPU 3G HSPA+ 1024x768 display 720p/Dolby 5.1 Stereoscopic 3D

Snapdragon System 3

Processors

For Multi-tasking & Advanced

Gaming

S3 Class includes: 45 nm Up to 1.5GHz

Dual-CPUs Adreno 220 GPU 3G HSPA+ 1440x900 display 1080p HD/Dolby 5.1 Stereoscopic 3D

Snapdragon System 4

Processors

Next Generation

Devices

S4 Class includes: 28nm Up to 2.5GHz

next gen CPU single/dual/quad

Adreno next gen GPU dual/quad

3G/LTE multimode

Features Overview


• MSM 8960 features Qualcomm second generation “Krait” CPU

• Krait outperforms current ARM CPUs on a core-to-core basis.

• Uses ARM instruction set, software and eco-system

Best in Class Processor

• Provides performance headroom for new generation devices • First to market with this class of performance and power

efficiency First to Market

• Krait features innovative power saving techniques like aSMP and custom circuit designs

• Independent Voltage and Frequency control

• Efficient frequency and voltage scaling

Best in Energy Efficiency

• Krait CPU is designed in the latest 28nm process technology

• Process scaling provides for better performance and power

Next generation Process Technology

MSM8960 CPU Key features and advantages


Krait: First Mobile Processor in 28nm

More performance

Lower power

Lower manufacturing costs

More room for single chip SoC integration

First fully integrated LTE world/multimode modem… Plus latest high performance CPU/GPU/DSP/video…

…all on a single chip!

Qualcomm process technology leadership enables:

MSM

8960

S3 45nm

S4 28nm


ARM1136528MHz

7x00

ARM1136600MHz

7x27

Scorpion1GHz8x50

Scorpion1GHz8x55

Scorpion-MP2x1.2GHz

8660

Krait-MP2x1.7GHz

8960

Krait-MP4x1.7GHz

8064

Krait Performance Roadmap

QCOM Flagship Processors Over Time

New high performance CPU based on the ARMv7-A ISA

Market leading performance and power efficiency

First ARM CPU in 28nm

>50% performance improvement over other ARM-based offerings in the mobile CPU market

Perf

orm

ance in A

ggre

gate

DM

IPS


Asynchronous CPU Power Savings Proven in Market

Synchronous Asynchronous

Po

we

r

CPU 1File Transfer

CPU 0Electopia Game

1512MHz 1512MHz

1512MHz

384MHz

25% Power

Reduction

Tested on 8660 FLUID

Measured at CPU power rail

Krait or Scorpion Cluster

CPU CPU

Shared L2

Clock 2

Clock 3

Clock 1

Voltage 3

Voltage 2

Voltage 1

25-40% power reduction depending on workload

Other ARM solutions are on/off per CPU

QCOM’s unique ability to run each CPU at the appropriate frequency & voltage increases power efficiency


Navigation User Interfaces Web Browsers Games

Mobile Apps that Benefit from Graphics Acceleration

GT Racing © 2010 Gameloft. All Rights Reserved. Gameloft and the Gameloft logo are trademarks of Gameloft in the US and/or other countries. All manufacturers, cars, names, brands and associated imagery featured in GT Racing: Motor Academy mobile game are trademarks and/or copyrighted materials of their respective owners

The Ball ©2010 Teotl Studios. All Rights Reserved. Unreal Technology and the Epic Games logos are registered trademarks of Epic Game Inc. in the USA and other countries. All rights reserved. .


Adreno GPU Architecture Advantage Similar Shader Architecture as XBOX 360 console

Adreno GPU shader elements adjust dynamically

Maximizes processing power and application performance

Frame 1

Pixels

Triangles

Ma

x P

roc

es

sin

g P

ow

er

Frame X

Pixels

Triangles

ADRENO Auto-Balancing Unified Shader (ALUs shared)

Frame 1

Ma

x P

ixe

l P

roc

es

sin

g

Po

wer

Frame X

Pixels

Pixels

Triangles

Unusable Cycles

Independent Vertex & Fragment Shader (ALUs not shared)

Unusable Cycles

Triangles

Ma

x V

ert

ex

P

roc

es

sin

g

Po

wer

Other GPU Architectures Adreno


Enhancements in the Adreno 225 GPU

50% faster than Adreno 220

More features, primarily to support DirectX 9.3 (Shader Model 3):

Shaders

Increased the sizes of various memories used by shaders to be able to store more instructions, etc.

Textures

sRGB Texture Support

Render Targets

Support of Multiple Render Targets (4 simultaneous MRTs)

Rasterization & Misc.

Support of up to 6 User Clip Planes

Improvements to BLTs (greater DRAM efficiency)

Instancing Support

More efficient interrupts


Adreno Performance Roadmap


Modem Evolution and Adoption Trends

Future - Projection

18-20 years from first launch of new generation to peak device volume

Each generation produces significantly higher volume than previous

“4G” - LTE

Launch Peak Volume

3G - WCDMA

Launch Peak Volume

2G - GSM

Launch Peak Volume

1G - AMPS

Launch Peak Volume (x)

'28 '24 '25 '26 '27 '09 '10 '11 '12 '13 '22 '21 '20 '19 '18 '83 '14 '15 '16 '84 '85 '86 '87 '88 '07 '08 '17 '23 '01 '02 '03 '04 '05 '06 '95 '96 '97 '98 '99 '00 '89 '90 '91 '92 '93 '94

8 years

10 years

9 years

19 years

18 years

19 years

18 years

1-2G: Voice drives modem evolution

3-4G: Data drives modem evolution


Modem Performance Roadmap Peak Downlink User Data Rates

0

10

20

30

40

50

60

70

80

90

100

2005 2008 2011

TD-SCDMA

CDMA

WCDMA

LTE

Mb

ps

MSM

8960

Integrated single-chip

multimode

(includes QB GERAN)

© 2011 QUALCOMM Incorporated. All rights reserved. 18 18

Next Generation Integrated LTE/3G Multimode

LTE FDD (100 Mbps DL / 50 Mbps UL)

LTE TDD (68 Mbps DL / 17 Mbps UL)*

DC-HSPA+ (42 Mbps UL / 11 Mbps DL)

DO Rev. B (14.7 Mbps DL / 5.4 Mbps UL)

GSM/GPRS/EDGE

1X Advanced

TD-SCDMA

LTE Voice CS Fallback and SVLTE

VoLTE, SR-VCC

Integrated

Connectivity Bluetooth, GPS, GNSS, WLAN

MDM

9x15

MSM

8960

*Data rates depend on TDD partitioning.

Supports over 40 LTE bands for true Worldwide Coverage

eMBMS Data Continuity Reselection, Redirection, PS

Handover, IP continuity, QoS

Multimode Mobility LTE FDD/TDD, UMTS, CDMA,

TD-SCDMA, GERAN

© 2011 QUALCOMM Incorporated. All rights reserved. 19 19

Q-ICE™, QLIC, gRICE: Advanced Receivers Increase Capacity, Coverage, and User Experience

Higher Capacity Data throughput or voice capacity

Enhanced User Experience Higher user data rates, improved voice quality

Advanced Receivers

Extended Coverage

DEVICE Receive Diversity | Equalizer |

Interference Cancellation | etc.

BASE STATION Receive Diversity |

Interference Cancellation | etc.


HexagonTM Digital Signal Processors

Arnd Bergmann, Linux Maintainer, New Architecture Ports

“The (Qualcomm Hexagon) is quite capable, with support for symmetric multiprocessing, a memory

management unit and even a hypervisor.


Superior DSP Performance

Optimal mix of DSP and CPU functionality Adding control flow and scalar math to classic DSP functionality

Compiler-friendly ISA for robust tools (efficient C/C++ code)

Efficient offloading of entire tasks from CPU and GPU

Lower power consumption, higher quality of service for tasks such as:

Audio playback

Audio effects

Noise cancellation

HD voice

Video functions

2D to 3D auto-convert

Augmented reality processing

Robust Capability + Superior Power Efficiency


Hexagon v3 (measured): Performance & Power

SPECint tests measured on Linux on Hexagon v3.

(One through six concurrent threads active)

To obtain multiprocessor data, each test is run as a single thread

Followed by another test of two copies run concurrently

Repeated again for each successive number of threads until a final test with six copies run concurrently

0

20

40

60

80

100

120

140

160

1 2 3 4 5 6

Pow

er (m

W)

Number of Active Threads

164.gzip176.gcc181.mcf186.crafty197.parser253.perlbmk254.gap256.bzip2300.twolf


2006 2007 2008 2009 2010 2011 2012

Incre

asin

g P

ow

er

Effic

iency

Increasing Performance

H1

H2

H3

H4

3 DMIPs/mW

5 DMIPs/mW

10 DMIPs/mW

500Mhz

16K/256K

20 DMIPs/mW

Snapdragon S4

65nm

45nm

28LP

Legend

Hexagon DSP Evolution & Roadmap*


©2011 Qualcomm Incorporated. All rights reserved. Qualcomm is registered trademark of Qualcomm

Incorporated. All the trademarks or brands in this document are registered by their respective owner.

QUALCOMM Incorporated, 5775 Morehouse Drive, San Diego, CA 92121-1714

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