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1 14-10- 2015 By : Krishna Gehlot

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Page 1: Snapdragon Processor

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14-10-2015By : Krishna Gehlot

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Outline Introduction Snapdragon devices Snapdragon devices comparison SNAPDRAGON 820(UPCOMMING) Block Diagram Components of SNAPDRAGON 820 References

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Introduction Snapdragon SoC is a powerful smart

processor. The Snapdragon CPU, dubbed from

Scorpion First on 28nm process technology[Latest

is 14nm] First Fully Integrated 3G/4G Uses ARM instruction set Superior CPU performance [in modem,

graphics, power efficiency performance]

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Snapdragon devices1. Snapdragon S12. Snapdragon S23. Snapdragon S34. Snapdragon S45. Snapdragon 200

series6. Snapdragon 400

series7. Snapdragon 600

series8. Snapdragon 800

series

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Snapdragon S1Semiconductor Technology 65 nm/45 nm

CPU instruction set ARMv6/ARMv7CPU Speed From 528 MHz, Up to 1 GHz

CPU ARM11,Cortex-A5 and ScorpionCPU Cache Type L2

CPU Cache Max 256 KBGPU Adreno 200

GPU Support 2D supportRAM Technology 200 MHz LPDDR1

RAM Speed 200 MHzBluetooth -

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Snapdragon S2Semiconductor Technology 65 nm/45 nm

CPU instruction set ARMv6/ARMv7CPU Speed From 528 MHz, Up to 1 GHz

CPU ARM11,Cortex-A5 and ScorpionCPU Cache Type L2

CPU Cache Max 256 KBGPU Adreno 200

GPU Support 2D supportRAM Technology 200 MHz LPDDR1

RAM Speed 200 MHzBluetooth -

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Snapdragon S3Semiconductor Technology 45 nm

CPU instruction set ARMv7CPU Speed Up to 1.7 GHz

CPU Dual-core ScorpionCPU Cache Type L2

CPU Cache L2 512 KBGPU Adreno 220

GPU Support 2D support

RAM Technology Single-channel 500 MHz/333 MHz LPDDR2

RAM Speed 200 MHzBluetooth -

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Snapdragon S4Semiconductor Technology 45 nm/28 nm LP

CPU instruction set ARMv7CPU Speed Up to 1.7 GHz

CPU Dual-core Krait/quad-core KraitCPU Cache Type L0, L1, L2

CPU Cache Upto 2MBGPU Quad-core Adreno 320

GPU Support FHD/1080p and FWVGA/720pRAM Technology Dual-channel 500 MHz LPDDR2

RAM Speed 200 MHzBluetooth Bluetooth 4.0

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Snapdragon 200 SeriesSemiconductor Technology 45 nm LP/28 nm LP

CPU instruction set ARMv7CPU Speed Quad-core Up to 1.4 GHz

CPU Quad-core Cortex-A7CPU Cache Type L0,L1,L2

CPU Cache Up to 2 MBGPU Adreno 304

GPU Support WXGA/720pRAM Technology LPDDR2/LPDDR3 533 MHz

Bluetooth Bluetooth 4.1WiFi -

Other

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Snapdragon 400 SeriesSemiconductor Technology 28 nm LP

CPU instruction set ARMv8CPU Speed Up to 1.7 GHz Octa-core

CPU Octa-core Cortex-A53CPU Cache Type L1,L2

CPU Cache Up to 2 MBGPU Adreno 405

GPU Support Up to FHD 1080pRAM Technology LPDDR3 933 MHz

Bluetooth Bluetooth 4.1

WiFi Multi-User MIMO (MU-MIMO) WiFi

Other GPS

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Snapdragon 600 SeriesSemiconductor Technology 28 nm LP

CPU instruction set ARMv8CPU Speed Up to 1.7 GHz Quad-core

CPU Dual-core+Quad-core Cortex-A53

CPU Cache Type L0,L1,L2CPU Cache Up to 2 MB

GPU Adreno 510 GPU Support Quad HD2560x1600

RAM Technology Dual-channel LPDDR3 933 MHzBluetooth Bluetooth Smart v4.1

WiFi VIVE 1-stream 802.11ac WiFiOther GPS

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Snapdragon 800 SeriesSemiconductor Technology 14 nm FinFET

CPU instruction set ARMv7/ARMv8-A

CPU Speed 2.0 + 1.55 GHzQuad-core

CPU 4+4 cores Hydra and CortexCPU Cache Type L2

CPU Cache Up to 2 MBGPU Adreno 530

GPU Support 4K UHD video upscaleRAM Technology LPDDR4 1866 MHz

Bluetooth Native Bluetooth 4.1 supportWiFi 802.11ac (2.4 and 5 GHz) WiFi

OtherNative 4K Support, HDMI 2.0,USB 2.0 and 3.0,64-bit

Architecture

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Technology Snapdragon S1 Snapdragon S2 Snapdragon S3 Snapdragon S4Semiconductor

Technology 65 nm/45 nm 45 nm 45 nm 45 nm/28 nm LP

CPU instruction set ARMv6/ARMv7 ARMv7 ARMv7 ARMv7

CPU Speed From 528 MHz, Up to 1 GHz

From 800 MHz, Up to 1.5 GHz Up to 1.7 GHz Up to 1.7 GHz

CPUARM11,Cortex-

A5 and Scorpion

Scorpion Dual-core Scorpion

Dual-core Krait/quad-core

KraitCPU Cache Type L2 L2 L2 L0,L1,L2

CPU Cache Max 256 KB Min 256 KB Max. 384 KB 512 KB Up to 2 MB

GPU Adreno 200 Adreno 205 Adreno 220 Quad-core Adreno 320

GPU Support 2D support 2D support 2D support FHD/1080p and FWVGA/720p

RAM Technology 200 MHz LPDDR1

333 MHz Dual-channel LPDDR2

Single-channel 500 MHz/333 M

Hz LPDDR2

Dual-channel 500 MHz LPDDR2

Bluetooth - - - Bluetooth 4.0WiFi - - - -

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Technology Snapdragon 200 Series

Snapdragon 400 Series

Snapdragon 600 Series Snapdragon 800 Series

Semiconductor Technology

45 nm LP/28 nm LP 28 nm LP 28 nm LP 14 nm FinFET

CPU instruction set ARMv7 ARMv8 ARMv8 ARMv7/ARMv8-A

CPU Speed Quad-core Up to 1.4 GHz

Up to 1.7 GHz Octa-core

Up to 1.7 GHz Quad-core

2.0 + 1.55 GHzQuad-core

CPU Quad-core Cortex-A7

Octa-core Cortex-A53

Dual-core+Quad-core Cortex-A53

4+4 cores Hydra and Cortex

CPU Cache Type L0,L1,L2 L1,L2 L0,L1,L2 L2CPU Cache Up to 2 MB Up to 2 MB Up to 2 MB Up to 2 MB

GPU Adreno 304 Adreno 405 Adreno 510 Adreno 530

GPU Support WXGA/720p Up to FHD 1080p Quad HD2560x1600 4K UHD video upscale

RAM TechnologyLPDDR2/

LPDDR3 533 MHz

LPDDR3 933 MHz Dual-channel LPDDR3 933 MHz LPDDR4 1866 MHz

Bluetooth Bluetooth 4.1 Bluetooth 4.1 Bluetooth Smart v4.1

Native Bluetooth 4.1 support

WiFi - Multi-User MIMO (MU-MIMO) WiFi

VIVE 1-stream 802.11ac WiFi

802.11ac (2.4 and 5 GHz) WiFi

Other GPS GPSNative 4K Support,

HDMI 2.0,USB 2.0 and 3.0,64-bit Architecture

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4G LTE With X12 LTECamera Up to 55 MP Dual ISP & 4K supportDisplay with 4K Ultra HDGPS Qualcomm IZat™ Gen8CCPU Quad-core ARM Cortex A57 at up to 2 GHz and quad-core A53 with 64-bit supportGPU Adreno 530 GPUDSP Hexagon™ V56 DSP (up to 800MHz)

SNAPDRAGON 820(UPCOMMING)

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Block Diagram

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CONNECTIVITY 4G LTE AND WIFI

Latest Technology : LTE and Wi-Fi with X12 LTE modem

Fastest: Built in 4G+ LTE connectivity Speedy : with Downlink Cat 12 it speeds up to 603.0

Mbit/s and with Uplink Cat 13 it speeds up to 391.6 Mbit/s

Advance : 4G+ connectivity, enabled by LTE Advanced Carrier Aggregation

MIMO : Qualcomm VIVE 2-stream 802.11n/ac with MU-MIMO

Efficient : 4th gen power efficient LTE multimode transceiver

Multiband : Tri-Band Wi-Fi(2.4GHz,5GHz & 60GHz)

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X12 LTE modem

LTE-Unlicensed (LTE-U):  increasing mobile network capacity and user throughput by aggregating LTE in licensed and unlicensed bands

LTE and Wi-Fi Link Aggregation (LWA) : LWA is another method of aggregating licensed and unlicensed spectrum. It is designed to allow mobile operators to utilize their Wi-Fi infrastructure to augment licensed LTE network capacity with unlicensed spectrum capacity.

Next-generation Wi-Fi calling : The X12 LTE modem supports next-generation HD Voice over LTE (VoLTE) and Video over LTE (ViLTE) calling services using the IP Multimedia Subsystem, with support for call continuity between LTE and Wi-Fi. Making use of the.

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X12 LTE modem

RF front end innovations : a. Advanced Closed Loop Antenna Tunerb. Qualcomm RF360™ front end solution with CAc. Wi-Fi/LTE antenna sharing

Antenna sharing : The X12 supports several antenna sharing schemes between LTE and Wi-Fi, designed to make it easier for manufacturers to design devices with advanced technologies like LTE-U, 4x4 LTE MIMO, and 2-stream Wi-Fi, with attractive form factors and minimal performance impact on either technology.

Call Continuity across Wi-Fi, LTE, 3G, and 2G

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X12 LTE modem

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Kryo CPU : Kryo is tightly integrated with the Adreno 530 GPU and Hexagon 680 DSP and is designed for high-performance mobile computing along with the latest in multimedia and connectivity

Custom cores : Kryo is being manufactured on the latest 14nm FinFET technology and is designed to reach speeds up to 2.2 GHz

Symphony System Manager : Symphony is designed to manage the entire system-on-chip in different configurations so that the most efficient and effective  combination of processors and specialized cores are chosen to get the job done as quickly as possible, with the least amount of power

CPU

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Heterogeneous Computing : With heterogeneous computing,CPU support the efficient use of these diverse engines, individually and together, for dynamic workloads and demanding requirements for new user experiences, all while maximizing battery life and thermal efficiency

64 bits of better processing :  integrate 64-bit CPUs which enabled processors with features like 4K display and deliver up to 30 percent faster performance

CPU

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CPU

L0 CacheL1

instructionCache

L1 DateCache

CPU Core

L0 CacheL1

instructionCache

L1 DateCache

CPU Core

Bi-Directional Bus

Uncore L3 Cache

Shared L2 Cache

Memory Controller

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Biologically Inspired Learning Enable Devices To See and Perceive the World as

Humans Do Creation and definition of an Neural Processing Unit

Neural Processing Units

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Qualcomm Spectra camera ISP : Dual ISP is designed to provide superior camera image quality and experiences. Qualcomm Spectra supports the latest 14-bit sensors for a wider range of colors and more natural skin tones.

computational photography :  the hybrid autofocus framework and multi-sensor fusion algorithms that support next generation computational photography

4K Support :4K capture and playback with H.264 (AVC),4K Ultra HD on-device display with 4K Ultra HD output to HDTV.

Integrated Dolby audio : It supports 7.1 advance surround also makes dialogue crisper, even with heavy explosion or loud effects in the background. 

Snapdragon Voice Activation : The least amount of power possible to listen and be “woken up” only by a specific word spoken by the voice of the device owner

CAMERA & MULTIMEDIA SYSTEM

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Hexagon 680 DSP : Snapdragon processors use the DSP for offloading tasks that can be done faster and/or consume less power than the CPU .

Real-time Sound : Audio content can be delivered with real-time sound processing and streaming for, audio without delay or distortion, and background noise removal

Improved recognition : It allows text recognition, object recognition, image enhancement, and facial recognition within images, all while saving battery life.

Multimedia Functions : It supports HVX (LightWave 3D Hypervoxel) Extension and utilizes heterogeneous computing to support always-on tasks, like audio and display

HEXAGON DSP

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HEXAGON DSP DSP Extensions for Advance Imaging and Computer Vision mW substantially better CPU

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Qualcomm IZat Gen8C : Shows location services also show who and what are around you, whether you’re indoors or out.

Augmented Positioning : Ubiquitous Wi-Fi and cellular networks ensure accurate positioning.

GNSS Chipsets : Using GPS, GLONASS, and BeiDou satellites, IZat location technologies pinpoint your position anywhere in the world, even in challenging urban environments. 

Cloud-Based Assistance : IZat location technologies use a network of cloud-based assistance servers that provide industry-leading location performance for any mobile device, on any network, in any environment. s

GPS & LOCATION

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Qualcomm Adreno GPU : Adreno 530 does lane detection as well as 2D and 3D map navigation work quickly and smoothly

Next-generation visual processing technologie : Qualcomm Adreno GPU and Qualcomm Spectra camera ISP (image signal processor) to bring significant performance, power efficiency, and user experience

Fastest : 40% improvement to graphics performance and compute capabilities. Video support Up to 4K HEVC at 60fps over HDMI 2.0 . Support for 64-bit virtual addressing, allowing for shared virtual memory. flexible hybrid autofocus framework and multi-sensor fusion algorithms

Efficient : Up to 40 percent lower power consumption

GPU

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GPU 4XX vs. 5XX Series

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GPU 4XX vs. 5XX Series

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Ease of authentication: helps address the inherent limitations of passwords and pin codes

Enhanced security: Qualcomm Technologies’ FIDO implementation is based on Qualcomm SecureMSM technology

Ease of implementation: contributes to lower development cost for OEMs

Versatility: new types of biometric sensors, like iris scanning, can be used

Adaptability: able to grow as mobile biometrics needs grow Reliability: carriers like DOCOMO can confidently base their

services on Qualcomm Technologies’ platform

3D fingerprint technology

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USB 3.0/2.0 supported Inbuilt Bluetooth 4.1 Near field communication (NFC) supported Qualcomm Quick Charge 2.0 technology supports Parallel

Charging Dual-channel 64-bit LPDDR4 RAM with speeds up to

1688MHz Process Technology 14 nm FinFET Sensors: 3D accelerometers, 3-axis gyro, compass,

ambient light, proximity, temperature & pressure, humidity, medical, chemical, ultrasound pen and gestures, finger print reader, etc

OTHERS

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Smaller in size Thermal and power efficient Fastest CPU performance Latest GPU performance Best-in-class energy

efficiency for long lasting battery life

Rich multimedia and connectivity

PROS

High cost processors Assembling not possible Heavy weight

CONS

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PROS & CONS

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